Polyamide molding materials and multilayer structures
By using a mixture of semi-crystalline polyamide, amorphous polyamide, polyolefin and vinyl aromatic block copolymer in a specific ratio, a polyamide molding material is formed, which solves the problem of insufficient chemical and thermal stability of multilayer structures under harsh environments and achieves high chemical and mechanical stability at high temperatures.
Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- EMS CHEM AG
- Filing Date
- 2025-12-10
- Publication Date
- 2026-06-25
AI Technical Summary
Existing multilayer structural materials exhibit insufficient chemical and thermal stability in harsh chemical and thermal environments, failing to meet the chemical and heat resistance requirements of environments such as automotive engine oil, brake fluid, automatic transmission fluid, coolant, AdBlue, gasoline, diesel, and ethanol, and also exhibiting insufficient mechanical stability at high temperatures.
Polyamide molding materials, formed by mixing semi-crystalline polyamide, amorphous polyamide, polyolefin and/or vinyl aromatic block copolymer in a specific ratio, are used to manufacture the outer protective layer of metal conductors, avoiding the use of adhesive promoting layers and ensuring that the material maintains high chemical and mechanical stability at high temperatures.
It achieves high chemical, thermal and mechanical stability below 180°C, maintains a volume resistivity of at least 1.0E+10Ω·m, and remains stable after being stored at 180°C for 3000 hours.
Smart Images
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