Copper alloy materials, resistors and resistors
A copper alloy with controlled Mn, Ni, and Al content, combined with a manufacturing process, addresses the challenges of TCR, solderability, and flowability, resulting in stable resistors with reduced resistance fluctuations and improved casting quality.
JP2026116282APending Publication Date: 2026-07-09KOBE STEEL LTD
Patent Information
- Application Number
- JP2026041344
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2024-12-27
- Filing Date
- 2026-03-13
- Publication Date
- 2026-07-09
Smart Images
Figure 2026116282000001_ABST
Abstract
The present invention provides a copper alloy material that suppresses fluctuations in the temperature coefficient of resistance (TCR) and exhibits good solder wettability and molten alloy flowability, a resistor containing the copper alloy material, and a resistor equipped with the resistor. [Solution] A copper alloy material for resistance, comprising Mn: 10.0% by mass or more and 14.0% by mass or less, Ni: 1.0% by mass or more and 4.0% by mass or less, and Al: 0.3% by mass or more and less than 1.0% by mass, with the remainder being Cu and unavoidable impurities.
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Citation Information
Patent Citations
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