Combined Construct

Abstract

The present invention relates to a bonded structure comprising: a first substrate having a conductive or non-conductive surface; a first curable adhesive layer or a first electrochemically peelable curable adhesive layer; a conductive foil; a second electrochemically peelable curable adhesive layer which may be the same as or different from the first electrochemically peelable curable adhesive layer; and a second substrate having a conductive surface, wherein the first curable adhesive layer is disposed between the first substrate and the conductive foil, and the second curable adhesive layer is disposed between the second substrate and the conductive foil. The bonded structure is peelable by applying a voltage across the surface of a selected substrate.

Claims

1. A first substrate having a conductive surface or a non-conductive surface; A first curing adhesive layer or a first electrochemically peelable curing adhesive layer; conductive foil; A second electrochemically peelable adhesive layer, which may be the same as or different from the first electrochemically peelable adhesive layer; and A second substrate having a conductive surface; A binding structure having, A bonding structure in which a first curing adhesive layer is placed between a first substrate and a conductive foil, and a second curing adhesive layer is placed between a second substrate and a conductive foil.

2. The bonding structure according to claim 1, wherein the first curing adhesive, if present, is selected from the group consisting of one-component epoxy adhesives, two-component epoxy adhesives, epoxy tape adhesives, one-component acrylate adhesives, two-component acrylate adhesives, pressure-sensitive adhesives, polyurethane adhesives, and epoxy-acrylate hybrid adhesives.

3. The bonding structure according to claim 1 or 2, wherein the first electrochemically peelable curing adhesive (if present) and the second electrochemically peelable curing adhesive are independently selected from the group consisting of electrochemically peelable one-component epoxy adhesives, electrochemically peelable two-component epoxy adhesives, electrochemically peelable epoxy tape adhesives, electrochemically peelable one-component acrylate adhesives, electrochemically peelable two-component acrylate adhesives, electrochemically peelable pressure-sensitive adhesives, and electrochemically peelable epoxy-acrylate hybrid adhesives.

4. The bonding structure according to claim 3, wherein the first electrochemically peelable curing adhesive and the second electrochemically peelable curing adhesive comprise a resin and an electrolyte.

5. The bonding structure according to claim 4, wherein the resin is selected from the group consisting of epoxy resins, acrylate resins, and combinations thereof.

6. The electrolytes are 1-methylimidazolium bis(trifluoromethylsulfonyl)imide; 3-methylimidazolium bis(trifluoromethylsulfonyl)imide; 1-ethyl-3-methylimidazolium bis(trifluoromethylsulfonyl)imide; 1-propyl-3-methylimidazolium bis(trifluoromethylsulfonyl)imide; 1-butyl-3-methylimidazolium bis(trifluoromethylsulfonyl)imide; 1-butyl-2,3-dimethylimidazolium bis(trifluoromethylsulfonyl)imide; 1-hexyl-3-methylimidazolium bis(trifluoromethylsulfonyl)imide; 1-octyl-3-methylimidazolium bis(trifluoromethylsulfonyl)imide; 1-methyl-3-octylimidazolium bis(trifluoromethylsulfonyl)imide; 1-decyl-3-methyl The bonded structure according to claim 4, selected from the group consisting of imidazolium bis(trifluoromethylsulfonyl)imide; 1-dodecyl-3-methylimidazolium bis(trifluoromethylsulfonyl)imide; tetraethylphosphonium bis(trifluoromethylsulfonyl)imide; tetrabutylphosphonium bis(trifluoromethylsulfonyl)imide; tridecyl(tetradecyl)phosphonium bis(trifluoromethylsulfonyl)imide; trihexyltetradecylphosphonium bis(trifluoromethylsulfonyl)amide; 1-butyl-3-methylimidazolium bis(fluorosulfonyl)imide; 1-butyl-3-methylimidazolium bis(trifluoromethylsulfonyl)imide; 1-dodecyl-3-methylimidazolium bis(trifluoromethylsulfonyl)imide; and combinations thereof.

7. The bonding structure according to claim 1, wherein the conductive foil is selected from the group consisting of aluminum foil and copper foil.

8. i) Second substrate and conductive foil, or A first substrate having a conductive surface and a conductive foil, or conductive foil, or First substrate and second substrate having conductive surfaces A step of applying a voltage across the surface to form an anode interface and a cathode interface; and ii) The process of peeling off that surface A method for peeling off a bonded structure according to claim 1, including the method described in claim 1.

9. The method according to claim 8, wherein the voltage applied in step i) is 0.5-100V, and preferably applied for 1 second to 60 minutes.

Images