Enclosure for electronic equipment and method for manufacturing an electronic equipment enclosure
Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Patents
- Current Assignee / Owner
- ANRITSU CORP
- Filing Date
- 2023-07-13
- Publication Date
- 2026-06-11
AI Technical Summary
【0021】 請求項1に記載された電子機器用筐体によれば、組立台などの組立平面上に底面フレームを載置し、この底面フレームに対し、突起部材と長孔の組み合わせによる作業性のよい構造で正面パネルを連結し、さらに組み立てた底面フレームと正面パネルに巻胴を被せて固定することにより、容易に電子機器用筐体を製造することができる。すなわち、従来のように組み立て途中で、組み立てた部品を移動させる必要がなく、組立平面上で各部品を順次積み重ねるように効率よく組み立てていくことができ、しかも突起部材と長孔による連結構造により、底面フレームと正面パネルの隙間の寸法を、所期の値となるように設定できるため、少なくとも底面フレームと正面パネルの間にシールド部材を設けた場合のシールド性能が安定化する。
Smart Images

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Figure 0007872942000003
Abstract
Claims
1. The bottom frame (3) on which the electronic components are mounted, The front panel (4) connected to the front side of the bottom frame, A winding drum (8) that covers the bottom frame and the front panel and is connected to the bottom frame and the front panel, It is equipped with, The connecting portion between the bottom frame and the front panel is provided with a projection member (16) having a height that maintains a constant gap between the bottom frame and the front panel, and an elongated hole (21) into which the projection member is inserted, and the bottom frame and the front panel are brought into the normal assembled state by inserting the projection member into the elongated hole and moving the projection member and the elongated hole relative to each other.
2. The projection member (16) comprises a base (17) with a large outer diameter, a head (18) with a small outer diameter, and a rod portion (19) with a small outer diameter connecting the base and the head. The elongated hole (21) has a width that allows the head to be inserted through it. The electronic device housing (2) according to claim 1, characterized in that the distance between the bottom frame (3) and the front panel (4) is defined by the length of the base of the projection member, by inserting the head of the projection member into the elongated hole, moving the projection member and the elongated hole relative to each other along the longitudinal direction of the elongated hole, and engaging the end of the elongated hole with the rod portion of the projection member.
3. The electronic device housing (2) according to claim 2, characterized in that a first shielding material (15) is provided in the gap between the bottom frame (3) and the front panel (4) to shield the space between the bottom frame and the front panel.
4. The electronic device housing (2) according to claim 3, characterized in that a second shielding material (22) is provided between the front panel (4) and the winding drum (8) to shield the space between the front panel and the winding drum.
5. On the rear side of the front panel (4), a flange (20) protruding in the rearward direction is provided along the outer shape of the front panel. The first shielding material (15) is sandwiched between the outer surface of the flange and the inner surface of the bottom frame (3) facing the outer surface of the flange. The electronic equipment housing (2) according to claim 4, characterized in that the second shielding material (22) is sandwiched between the outer surface of the flange and the inner surface of the winding drum (8) facing the flange.
6. The flange (20) has a spacer member (25) of a predetermined height provided on its outer surface, and a fixing member (29) that fixes the winding drum (8) to the spacer member. The electronic device housing (2) according to claim 5, characterized in that the second shielding material (22) arranged on the outer surface of the flange is sandwiched between the winding drum, which is fixed to the spacer member by the fixing member, and the flange.
7. A method for manufacturing an electronic device housing (2) comprising a bottom frame (3) on which electronic components are mounted, a front panel (4) connected to the front side of the bottom frame, and a winding drum (8) covering the bottom frame and the front panel and connected to the bottom frame and the front panel, The bottom frame is placed on the assembly plane, A first shielding material (15) is provided along the front edge of the bottom frame. A second shielding material (22) is provided on the upper edge, right edge, and left edge of the front panel. At the connection portion between the bottom frame and the front panel, a projection member (16) provided on one of the bottom frame and the front panel is inserted into an elongated hole (21) provided on the other of the bottom frame and the front panel, and by moving the projection member and the elongated hole relative to each other, the bottom frame and the front panel are positioned in a normal assembled state with a predetermined gap between them. A method for manufacturing an electronic device housing (2), characterized by placing the winding drum over the bottom frame and the front panel, and connecting the bottom frame and the front panel to the winding drum.