Silver powder, method for manufacturing silver powder, silver powder manufacturing apparatus, and resin-curing conductive paste

Silver powder with controlled particle size and shrinkage properties, produced using a specific method, addresses the issues of high resistivity and printability in low-temperature firing, improving conductive paste performance for solar cell electrodes.

JP7876020B2Active Publication Date: 2026-06-18DOWA ELECTRONICS MATERIALS CO LTD
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Patent Information

Application Number
JP2025029271
Authority / Receiving Office
JP · JP
Patent Type
Patents
Current Assignee / Owner
Priority Date
2023-10-27
Filing Date
2025-02-26
Publication Date
2026-06-18
Estimated Expiration
2044-10-24

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Abstract

To provide a silver powder capable of imparting excellent volume resistivity and fine line printability to a conductive paste.SOLUTION: The present invention relates to a silver powder having a volume-based cumulative 50% diameter D50 of 0.1-1.0 μm as measured by laser diffraction, a ratio of D50 to BET diameter DBET of 1.3 or less, and a shrinkage rate of at least 1% at 200°C as measured by thermomechanical analysis.SELECTED DRAWING: Figure 5
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Citation Information

Patent Citations

  • Method for producing silver microparticle, silver microparticle produced by the method for producing silver microparticle, and conductive paste containing the silver microparticle

    JP2013159805A

  • Silver powder and production method thereof

    JP2015045064A

  • Silver powder and production method thereof

    JP2015045067A

  • Silver powder and conductive resin composition

    JP2023152678A

  • Mixed silver powder and conductive paste comprising same

    US20220055941A1