Photosensitive resin composition
A photosensitive resin composition with specific components addresses the challenges of adhesion and transmission loss in optical waveguides, enabling high-speed communication through improved core formation and reduced signal attenuation.
Patent Information
- Application Number
- JP2022175883
- Authority / Receiving Office
- JP · JP
- Patent Type
- Patents
- Current Assignee / Owner
- Filing Date
- 2022-11-01
- Publication Date
- 2026-06-19
- Estimated Expiration
- Not applicable · inactive patent
AI Technical Summary
Existing optical waveguides face challenges in achieving excellent plating adhesion, core formation properties, and low transmission loss, particularly in the context of silicon photonics where fine optical waveguides are required for high-speed communication.
A photosensitive resin composition comprising epoxy resin, a resin with a carboxyl group and ethylenic double bond, a photopolymerization initiator, and a non-developable polymer with a solubility parameter (SP value) of 9 (cal/cm³) 1/2 to 13 (cal/cm³) 1/2, which enables the formation of optical waveguides with improved adhesion and reduced transmission loss.
The composition allows for the manufacturing of optical waveguides with excellent plating adhesion, core formation properties, and low optical transmission loss, suitable for high-speed communication applications.
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Abstract
Citation Information
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