Spinner table and second frame unit support member
The spinner table design accommodates both 8-inch and 12-inch workpieces using a first and second frame unit with a detachable support member, simplifying the process of switching between sizes and reducing operational complexity.
Patent Information
- Application Number
- JP2022180591
- Authority / Receiving Office
- JP · JP
- Patent Type
- Patents
- Current Assignee / Owner
- Filing Date
- 2022-11-10
- Publication Date
- 2026-07-02
- Estimated Expiration
- 2042-11-10
AI Technical Summary
Current cleaning methods require changing the spinner table for each different size of the workpiece, making the process cumbersome and complex.
A spinner table design that can accommodate both 8-inch and 12-inch workpieces by using a first frame unit with a first ring frame and a second frame unit with a larger ring frame, supported by a detachable second frame unit support member, which includes a disc-shaped base and pendulum clamps, allowing for easy switching between sizes without replacing the spinner table.
Reduces the complexity of operations required to accommodate different workpiece sizes by enabling the spinner table to handle both 8-inch and 12-inch wafers without needing to change the spinner table.
Smart Images

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Abstract
Citation Information
Patent Citations
Cutter
JP2003229382A
Spinner cleaning device and dicing device
JP2006128359A
Wafer cleaning device
JP2009188296A
Substrate processing apparatus
JP2013069773A
Method for processing wafer
JP2015213955A
