Laser cutting apparatus, laser cutting method, and method for manufacturing a display

Abstract

To provide a laser cutting device which achieves high productivity, and to provide a laser cutting method and a display manufacturing method.SOLUTION: A laser cutting device 1 according to an embodiment includes: a stage 20 which has a groove formed along a cutting line of a workpiece W and suctions and holds the workpiece W; an optical system 30 which guides a laser beam for cutting the workpiece W to the workpiece W; a drive mechanism which moves the optical system 30 along a cutting line; and exhaust means 222 which exhausts a gas through the groove 221.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present invention relates to a laser cutting apparatus, a laser cutting method, and a method for manufacturing a display.

Background Art

[0002] Patent Document 1 discloses a laser cutting apparatus. The laser cutting apparatus of Patent Document 1 includes an ultraviolet laser oscillator and an infrared laser oscillator. An infrared laser and an ultraviolet laser are irradiated onto a glass substrate placed on a stage. The relative positions of the infrared laser and the ultraviolet laser with respect to the substrate are moved.

Prior Art Document

Patent Document

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] In such a laser cutting apparatus, there is a problem that soot is generated during cutting. For example, the material cut by the laser becomes soot and adheres to the substrate (workpiece). When soot adheres to the substrate, there is a possibility that device defects may occur. Therefore, a cleaning process or the like becomes necessary.

[0005] Other problems and novel features will become apparent from the description of this specification and the accompanying drawings.

Means for Solving the Problems

[0006] According to one embodiment, the laser cutting apparatus has a groove formed along a cutting line of a workpiece, a stage for sucking and holding the workpiece, an optical system for guiding laser light for cutting the workpiece to the workpiece, and a drive mechanism for moving the optical system along the cutting line. Note: There seems to be a small error in the original text where the "

発明の概要

Summary of the Invention

Summary of the Invention

[0007] According to one embodiment, the laser cutting apparatus comprises a stage for adsorbing and holding a workpiece, an optical system for guiding laser light for cutting the workpiece to the workpiece, a drive mechanism for moving the optical system along the cutting line, and a suction unit provided in the optical system for sucking gas from the space above the workpiece.

[0008] According to one embodiment, the laser cutting method is a laser cutting method for cutting a workpiece using a laser cutting device, wherein the laser cutting device comprises a stage having a groove formed along the cutting line of the workpiece and adsorbing and holding the workpiece, and an optical system for guiding laser light for cutting the workpiece to the workpiece, and the laser cutting method comprises the steps of moving the optical system along the cutting line, and exhausting gas through the groove during irradiation of the laser light.

[0009] According to one embodiment, the laser cutting method is a laser cutting method for cutting a workpiece using a laser cutting device, wherein the laser cutting device comprises a stage for adsorbing and holding the workpiece, and an optical system for guiding laser light for cutting the workpiece to the workpiece, and the laser cutting method comprises the steps of moving the optical system along the cutting line, and the steps of using a suction unit provided in the optical system to suck up gas in the space above the workpiece while the laser light is irradiated.

[0010] According to one embodiment, the manufacturing method is a method for manufacturing a display, in which a workpiece to be a display panel is cut with a laser cutting device, wherein the laser cutting device comprises a stage having a groove formed along the cutting line of the workpiece and adsorbing and holding the workpiece, and an optical system that guides laser light for cutting the workpiece to the workpiece, and the method for manufacturing the display comprises the steps of moving the optical system along the cutting line, and exhausting gas through the groove while the laser light is irradiated.

[0011] According to one embodiment, the manufacturing method is a method for manufacturing a display, in which a workpiece to be a display panel is cut with a laser cutting device, wherein the laser cutting device comprises a stage for adsorbing and holding the workpiece, and an optical system for guiding laser light for cutting the workpiece to the workpiece, and the method for manufacturing the display comprises the steps of moving the optical system along the cutting line, and the step of using a suction unit provided in the optical system to suck up gas in the space above the workpiece while the laser light is irradiated. [Effects of the Invention]

[0012] According to the above embodiment, it is possible to provide a highly productive laser cutting apparatus, a laser cutting method, and a method for manufacturing a display. [Brief explanation of the drawing]

[0013] [Figure 1] This is a schematic perspective view showing a laser cutting apparatus according to an embodiment. [Figure 2] This is a schematic top view showing a laser cutting apparatus according to an embodiment. [Figure 3] This is a schematic side view showing a laser cutting apparatus according to an embodiment. [Figure 4] This is a schematic side view showing a laser cutting apparatus according to an embodiment. [Figure 5] This is a schematic diagram showing the configuration of the stage of the laser cutting apparatus according to Embodiment 1. [Figure 6] This is a perspective view showing the internal structure of the stage. [Figure 7] This is a schematic top view showing the configuration of the stage of the laser cutting apparatus according to Embodiment 2. [Figure 8] This is a perspective view showing part of the stage configuration. [Figure 9] This is a schematic diagram showing the optical system used in the laser cutting apparatus according to Embodiment 3. [Figure 10] This is a top view showing the suction unit. [Figure 11]It is a side cross-sectional view showing the attracting unit. [Figure 12] It is a schematic diagram showing an optical system used in the laser cutting apparatus according to Embodiment 4.

Embodiments for Carrying Out the Invention

[0014] The laser irradiation apparatus according to the present embodiment is a film laser cutting apparatus (FLC apparatus) that cuts a film of a flexible display. Specifically, in a state where a flexible film is adsorbed and held by an adsorption stage, laser light is irradiated onto the flexible film. Then, the film can be cut by moving the relative position of the laser light with respect to the flexible film.

[0015] Therefore, in the present embodiment, a flexible film (also simply referred to as a film) is used as the workpiece. The laser cutting apparatus cuts the workpiece according to the panel size of the display. Then, one or more display panels are cut out from one workpiece. That is, the workpiece is a multi-sided mother substrate. Hereinafter, the laser cutting apparatus, the laser cutting method, and the display manufacturing method according to the present embodiment will be described with reference to the drawings.

[0016] Embodiment 1. Using FIGS. 1 to 4, the configuration of the laser cutting apparatus according to the present embodiment will be described. FIG. 1 is a perspective view schematically showing the configuration of the laser cutting apparatus 1. FIG. 2 is a top view schematically showing the configuration of the laser cutting apparatus 1. FIG. 3 is a YZ plane view schematically showing the configuration of the laser cutting apparatus 1. FIG. 4 is an XZ plane view schematically showing the configuration of the laser cutting apparatus 1.

[0017] In the figures shown below, for simplicity of explanation, an XYZ three-dimensional orthogonal coordinate system is shown as appropriate. The Z direction is the vertical up and down direction and is the direction orthogonal to the main surface of the workpiece W. The X direction and the Y direction are directions parallel to the side edges of the rectangular workpiece W in a top view. It is assumed that the cutting line of the workpiece W is in a direction parallel to the X direction or the Y direction.

[0018] The laser cutting apparatus 1 comprises a stand 10, a stage 20, an optical system 30, an optical system 31, a gantry stage 40, and a gantry stage 41. The stand 10 is a table that holds the stage 20 and the other components. The stage 20 is fixed on top of the stand 10.

[0019] Stage 20 is an adsorption stage that adsorbs and holds the workpiece W. In other words, Stage 20 is a chuck stage for vacuum chucking. The top surface of Stage 20 is the adsorption surface. The adsorption surface is a plane parallel to the XY plane. For example, Stage 20 is connected to an exhaust means such as a vacuum pump (not shown). By drawing gas from the adsorption surface of Stage 20, Stage 20 can adsorb and hold the workpiece W. With the workpiece W placed on Stage 20, Stage 20 adsorbs the workpiece W. This prevents wrinkles and warping of the film.

[0020] Specifically, stage 20 has a porous structure. For example, stage 20 is made of a ceramic material such as porous alumina or porous SiC. By forming stage 20 with a porous material, the workpiece W can be reliably adsorbed and held. Stage 20 may also be made of a metal material such as aluminum or stainless steel. In other words, stage 20 may be a metal stage with multiple suction ports formed by metal processing. Furthermore, grooves may be provided in the stage 20 at the cutting lines. This helps to suppress damage to stage 20 caused by laser irradiation. The detailed configuration of stage 20 will be described later.

[0021] Furthermore, a measuring instrument 15 is provided on the upper surface of the frame 10. The measuring instrument 15 has a camera or the like for imaging the workpiece W. In a top view, the measuring instrument 15 is positioned near the corner of the rectangular stage 20. The measuring instrument 15 images the workpiece W on the stage 20. The workpiece W may be aligned based on the image of the workpiece W captured.

[0022] Furthermore, optical systems 30 and 31 for irradiating the workpiece W with laser light are provided on the frame 10. Optical systems 30 and 31 are provided so as to be movable in the X and Y directions. By moving optical systems 30 and 31 in the X and Y directions, laser light can be irradiated to any position on the workpiece W. Specifically, by moving optical systems 30 and 31 along the cutting line, laser light is irradiated along the cutting line. The cutting line is preset according to the panel size and number of panels on the workpiece W.

[0023] Optical systems 30 and 31 are positioned above stage 20. Optical systems 30 and 31 irradiate the workpiece W with laser light from above. Optical systems 30 and 31 are supported by gantry stages 40 and 41, respectively. Therefore, optical systems 30 and 31 move in the XY directions, respectively. The XY drive of optical systems 30 and 31 by gantry stages 40 and 41 will be described below.

[0024] An X-guide groove 11 is provided on the upper surface of the support frame 10. The X-guide groove 11 is formed parallel to the X direction. As shown in Figure 2, X-guide grooves 11 are formed on both sides of the stage 20 in the Y direction. In other words, the support frame 10 has an X-guide groove 11 located on the +Y side of the stage 20 and an X-guide groove 11 located on the -Y side.

[0025] The frame 10 having the X-guide groove 11 serves as an X-guide mechanism that holds the gantry stages 40 and 41 so that they can move in the X direction. The X-guide groove 11 may be formed directly on the frame 10, or it may be formed separately from the frame 10. For example, a guide rail attached to the frame 10 may serve as the X-guide mechanism.

[0026] In this way, the gantry stage 40 and gantry stage 41 move on the frame 10, guided by the X-guide groove 11. The X-guide groove 11 is common to both the gantry stage 40 and gantry stage 41. The gantry stage 41 has the same configuration as the gantry stage 40. The gantry stage 40 and gantry stage 41 are spaced apart in the X direction. Specifically, the gantry stage 41 is positioned on the -Y side of the gantry stage 40.

[0027] The gantry stages 40 and 41 move along the X-guide groove 11. Specifically, the gantry stage 40 includes an X-drive mechanism 401 and a gantry shaft 402. The X-drive mechanism 401 supports the gantry shaft 402 so that it can move in the X direction. In the Y direction, the X-drive mechanism 401 is located at both ends of the gantry shaft 402. The X-drive mechanism 401 has actuators for moving the gantry shaft 402 in the X direction. For example, the motor of the X-drive mechanism 401 moves the gantry shaft 402 in the X direction.

[0028] The gantry axis 402 extends along the Y direction. Specifically, in the Y direction, one end of the gantry axis 402 is positioned +Y side of the stage 20, and the other end is positioned -Y side of the stage 20. A space higher than the stage 20 is formed directly below the gantry axis 402. The gantry axis 402 moves along the X direction above the stage 20. In other words, the gantry axis 402 moves above the stage 20.

[0029] A Y-guide groove 403 is formed on the gantry shaft 402. The Y-guide groove 403 is formed parallel to the Y direction. The gantry shaft 402 holds the optical system 30 via the Y-guide groove 403. Therefore, the gantry shaft 402 holds the optical system 30 so that it can move in the Y direction. The Y-drive mechanism 303 drives the optical system 30, causing it to move along the Y-guide groove 403. The gantry shaft 402 having the Y-guide groove 403 becomes a Y-guide mechanism that guides the optical system 30 in the Y direction.

[0030] Therefore, the optical system 30 moves in the X and Y directions. In other words, the optical system 30 moves in the space above the workpiece W. This makes it possible to irradiate any position on the workpiece W with laser light.

[0031] The gantry stage 41 moves independently of the gantry stage 40. The gantry stage 41 has the same configuration as the gantry stage 40. Specifically, the gantry stage 41 includes an X drive mechanism 411 and a gantry shaft 412. The X drive mechanism 411 supports the gantry shaft 412 so that it can move in the X direction. In the Y direction, the X drive mechanism 411 is located at both ends of the gantry shaft 412. The X drive mechanism 411 has actuators for moving the gantry shaft 412 in the X direction. For example, the motor of the X drive mechanism 411 moves the gantry shaft 412 in the X direction.

[0032] The gantry axis 412 extends along the Y direction. Specifically, in the Y direction, one end of the gantry axis 412 is positioned +Y side of the stage 20, and the other end is positioned -Y side of the stage 20. A space higher than the stage 20 is formed directly below the gantry axis 412. The gantry axis 412 moves along the X direction above the stage 20. In other words, the gantry axis 412 moves above the stage 20.

[0033] A Y-guide groove 413 is formed on the gantry shaft 412. The Y-guide groove 413 is formed parallel to the Y direction. The gantry shaft 412 holds the optical system 31 via the Y-guide groove 413. Therefore, the gantry shaft 412 holds the optical system 31 so that it can move in the Y direction. The Y-drive mechanism 313 drives the optical system 31, causing it to move along the Y-guide groove 413. The gantry shaft 412 having the Y-guide groove 413 becomes a Y-guide mechanism that guides the optical system 31 in the Y direction.

[0034] Therefore, the optical system 31 moves in the X and Y directions. In other words, the optical system 31 moves in the space above the workpiece W. This makes it possible to irradiate any position on the workpiece W with laser light.

[0035] Next, the configuration of the optical system 30 will be described with reference to Figures 2 and 4. The optical system 30 includes a laser light source 304, a mirror 305, and a lens 306. The laser light source 304 is located above the gantry axis 402. The laser light source 304 generates laser light L1. Here, the laser light L1 from the laser light source 304 travels along the X direction. That is, the optical axis of the laser light source 304 is parallel to the X direction.

[0036] Laser light L1 from the laser light source 304 is incident on the mirror 305. The mirror 305 is positioned on the -X side of the laser light source 304 and the gantry axis 402. The mirror 305 reflects the laser light L1 downwards. The mirror 305 is positioned at a 45° angle with respect to the X axis. The laser light L1 reflected by the mirror 305 travels in the -Z direction. The laser light L1 reflected by the mirror 305 is incident on the lens 306. The lens 306 focuses the laser light onto the workpiece W. In other words, the lens 306 focuses the laser light L1 so that a focused spot is formed on the workpiece W.

[0037] In this way, the optical system 30 can guide the laser beam L1 to the workpiece W. The laser beam L1 is irradiated onto the workpiece W from above. The laser light source 304, mirror 305, and lens 306 are fixed to a housing or the like. Therefore, the laser light source 304, mirror 305, and lens 306 move together in the X and Y directions.

[0038] When cutting a workpiece W along the X direction, the X-drive mechanism 401 drives the gantry stage 40 in the X direction. This causes the optical system 30 on the gantry stage 40 to move in the X direction. Therefore, the laser irradiation position on the workpiece W moves in the X direction.

[0039] When cutting a workpiece W along the Y direction, the Y-drive mechanism 303 drives the optical system 30 in the Y direction. This causes the optical system 30 to move in the Y direction. Therefore, the laser irradiation position on the workpiece W moves in the Y direction. In this way, it becomes possible to cut the workpiece W along a cutting line in either the X or Y direction.

[0040] The configuration of the optical system 31 is the same as that of the optical system 30. The optical system 31 moves in the Y direction by the Y drive mechanism 313. That is, the optical system 31 moves along the Y guide groove 413 on the gantry stage 41. Furthermore, the X drive mechanism 411 moves the gantry axis 412 in the X direction. As a result, the optical system 31 moves in both the X and Y directions.

[0041] The optical system 31 includes a laser light source 314, a mirror 315, and a lens 316. Laser light L2 from the laser light source 314 is guided to the workpiece W by the mirror 315 and lens 316. By moving the optical system 31 above the workpiece W in the X and Y directions, the laser light L2 can be irradiated to any position on the workpiece W.

[0042] When cutting a workpiece W along the X direction, the X-drive mechanism 411 drives the gantry stage 41 in the X direction. As a result, the optical system 31 on the gantry stage 41 moves in the X direction. Therefore, the laser irradiation position on the workpiece W moves in the X direction.

[0043] When cutting a workpiece W along the Y direction, the Y drive mechanism 313 drives the optical system 31 in the Y direction. This causes the optical system 31 to move in the Y direction. Therefore, the laser irradiation position on the workpiece W moves in the Y direction. In this way, it becomes possible to cut the workpiece W along a cutting line in either the X or Y direction.

[0044] In the above explanation, the laser light sources 304 and 314 were mounted in the optical systems 30 and 31, but the laser light sources 304 and 314 do not necessarily have to be mounted in the optical systems 30 and 31. In other words, the laser light sources 304 and 314 may be mounted outside the optical systems 30 and 31. In this case, the laser beams L1 and L2 can be guided into the optical systems 30 and 31 using optical fibers or the like. Therefore, the optical systems 30 and 31 only need to be equipped with optical elements for guiding the laser beam to the workpiece W. For example, the optical systems 30 and 31 may be equipped with lenses 306 and 316, mirrors 305 and 315, etc.

[0045] The stage configuration will be explained using Figure 5. Figure 5 is a schematic cross-sectional view showing the configuration of Stage 20.

[0046] Stage 20 has an adsorption plate 201. As described above, the adsorption plate 201 is made of a porous material or a metallic material. A groove 221 is formed on the adsorption surface of the adsorption plate 201. The groove 221 is formed according to the cutting layout of the workpiece W. That is, the groove 221 is formed along the cutting line of the workpiece W. The groove 221 is formed directly below the cutting location of the workpiece W. Laser light is irradiated onto the workpiece W directly above the groove 221. In this way, damage to Stage 20 can be suppressed.

[0047] For example, the laser beam L1 from the optical system 30 reaches the stage 20. The lens 306 forms a focal point for the laser beam L1 on the workpiece W. In other words, the lens 306 focuses the laser beam onto the workpiece W. By forming a groove 221 on the upper surface of the stage 20, the laser beam is irradiated onto the stage 20 in a spread-out state. The irradiation position of the laser beam on the stage 20 can be shifted in the Z direction from the focal point of the laser beam. In this way, the laser intensity per unit area on the stage 20 can be reduced. Therefore, damage to the stage 20 can be suppressed.

[0048] The groove 221 is connected to the exhaust means 222 via the piping 203. The exhaust means 222 is an exhaust pump or the like. Therefore, the exhaust means 222 can exhaust gas from the space above the workpiece W through the groove 221. In other words, as the workpiece W is cut, the space above the workpiece W and the groove 221 are connected through the cut. Soot 235 generated from the workpiece W by laser irradiation is sucked in through the groove 221. In this way, it is possible to prevent soot 235 from adhering to the workpiece W. Since contamination of the workpiece W can be prevented, productivity can be improved.

[0049] Furthermore, a dust collection filter 227 may be provided in the middle of the piping 203. Note that the exhaust means 222 and piping 203 can be separate systems from the adsorption exhaust system 228 for adsorbing and holding the workpiece W. In other words, an adsorption exhaust system 228 for adsorbing and holding the workpiece W and an exhaust system 229 for sucking up soot 235 can be provided, respectively.

[0050] An example of the specific configuration of Stage 20 will be explained using Figure 6. Figure 6 is a schematic perspective view showing an example of the internal configuration of Stage 20.

[0051] Stage 20 comprises an adsorption plate 201, a groove block 202, and an outer frame 211. The adsorption plate 201 is formed of, for example, a porous material. The adsorption plate 201 is fixed to the support frame 10.

[0052] The outer frame 211 is provided on the peripheral edge of the suction plate 201. For example, the outer frame 211 is formed in a rectangular frame shape so as to surround the suction plate 201 and the groove block 202. The outer frame 211 is made of a metal material such as aluminum.

[0053] A groove block 202 is formed inside the outer frame 211. The groove block 202 is positioned between the outer frame 211 and the suction plate 201. The groove block 202 is fixed between the outer frame 211 and the suction plate 201. The groove block 202 is formed from a metal material such as aluminum.

[0054] A groove 221 is formed on the upper surface of the groove block 202. As described above, the groove 221 is formed at a position relative to the cutting line. That is, the laser beam is irradiated onto the workpiece W directly above the groove 221. In Figure 6, the groove 221 is formed along the Y direction so as to be parallel to the cutting line.

[0055] A through-hole 204 is formed in the suction plate 201. The through-hole 204 penetrates the suction plate 201 in the Z direction. In other words, the through-hole 204 connects from the bottom surface of the suction plate 201 to the groove. A pipe 203 is connected to the through-hole 204. Specifically, the pipe 203 and the through-hole 204 are connected by a joint 208 provided on the bottom surface of the suction plate 201. The through-hole 204 communicates with the groove 221. In other words, the pipe 203 is connected to the groove 221 via the through-hole 204.

[0056] A through-hole 205 is formed in the outer frame 211. The through-hole 205 penetrates the outer frame 211 in the X direction. In other words, the through-hole 205 is connected to the groove 221 from the side of the suction plate 201. A pipe 203 is connected to the through-hole 205. Specifically, the pipe 203 and the through-hole 205 are connected by a joint 209 provided on the outer peripheral side of the outer frame. The through-hole 205 communicates with the groove 221. In other words, the pipe 203 is connected to the groove 221 via the through-hole 205.

[0057] The piping 203 is connected to the exhaust means 222 shown in Figure 5. Therefore, the exhaust means 222 can suck up the soot generated by the laser irradiation from the groove 221. In this way, soot can be discharged from the groove 221 formed directly below the cutting line. Thus, contamination of the workpiece W by soot can be prevented.

[0058] In the above description, two through holes 204 and 205 are connected to the groove 221, but only one of them may be connected. For example, for a cutting line that is far from the peripheral edge of the workpiece W, it may be connected only to the through hole 204 in the Z direction. Also, although the groove block 202 that forms the groove 221 and the suction plate 201 are shown as separate parts, the groove 221 may be formed on the upper surface of the suction plate 201.

[0059] Furthermore, in this embodiment, a laser beam is irradiated onto the workpiece W, which is held by adsorption on the stage 20. By using the stage 20 as an adsorption stage, the film, which is the workpiece W, can be held in a flat state. For example, warping or wrinkling of the workpiece W can be prevented. The focal position of the laser beam can be aligned with the workpiece W. Therefore, the workpiece W can be cut appropriately.

[0060] Furthermore, the optical systems 30 and 31 are moved without moving the stage 20. In other words, the optical systems 30 and 31, which are smaller and lighter than the stage 20, are moved. Therefore, the drive mechanism and other components can be miniaturized. In addition, because the optical systems 30 and 31 can be moved at high speed, a high-speed process becomes possible.

[0061] Furthermore, since the stage 20 is fixed, the footprint of the laser cutting device 1 can be reduced. In other words, the laser irradiation position on the workpiece W is changed by moving the optical systems 30 and 31. This eliminates the need to move the large workpiece W, thus reducing the footprint of the laser cutting device 1.

[0062] Furthermore, the laser cutting device 1 is equipped with two gantry stages 40 and 41. Optical systems 30 and 31 are attached to gantry stage 40 and gantry stage 41, respectively. In this way, the workpiece W can be cut efficiently. For example, laser light can be irradiated to two or more locations on the workpiece W simultaneously. Therefore, the cycle time of the cutting process can be shortened. Of course, the number of gantry stages held on the frame 10 may be one or three or more.

[0063] Furthermore, in this embodiment, two optical systems 30 are provided in one gantry stage 40. Similarly, two optical systems 31 are provided in one gantry stage 41. This allows for efficient cutting of the workpiece W. For example, laser light can be irradiated simultaneously at two or more locations on the workpiece W. Therefore, the cycle time of the cutting process can be shortened. Of course, the number of optical systems 30 and 31 held in one gantry stage 40 or 41 may be one or three or more.

[0064] Furthermore, optical systems 30 and 31 may be equipped with optical scanners for scanning the laser beam. For example, mirrors 305 and 315 can be replaced with galvanometer mirrors. The galvanometer mirrors can be configured as two-axis optical scanners capable of scanning in the X and Y directions. The optical scanner scans the laser beam along the cutting line. In other words, as optical systems 30 and 31 move, the optical scanner scans the laser beam back and forth. In this way, the irradiation position of the laser beam can be changed at high speed. Therefore, the amount of soot generated by laser irradiation can be reduced.

[0065] Furthermore, the gantry stage 40 or gantry stage 41 may be equipped with a camera for alignment. Alignment marks are pre-formed near the cutting line on the workpiece W. For example, the alignment marks and the cutting line are formed so that they are included within the camera's field of view. The camera provided in the optical system 30 captures images of the alignment marks on the workpiece W. Then, the optical system 30 moves based on the captured XY position. In this way, the accuracy of the cutting position can be improved.

[0066] The laser cutting apparatus 1 may use laser light sources of different wavelengths. The laser cutting apparatus 1 can switch laser wavelengths depending on the process. In other words, the laser cutting apparatus 1 irradiates laser light of different wavelengths depending on the laser cutting process.

[0067] Of the two laser light sources 304 and the two laser light sources 314, one or more are infrared laser light sources such as CO2 lasers, and the others are ultraviolet laser light sources. For example, laser light L1 can be an infrared laser and laser light L2 can be an ultraviolet laser. In this way, laser light of an appropriate wavelength can be irradiated according to the cutting process. For example, the laser wavelength can be switched depending on the configuration of the laminated films on the film at the cutting site.

[0068] For example, short circuits between terminals can be prevented by using an ultraviolet laser to cut the mounting terminal area. For parts other than the mounting terminal area, an infrared laser can be used for the cutting process.

[0069] The laser cutting method using the laser cutting apparatus according to this embodiment includes the steps of moving the optical system along the cutting line and exhausting gas through the groove during laser irradiation. In this way, soot 235 generated by laser irradiation can be sucked up. Therefore, by exhausting gas through the groove with the exhaust means during laser irradiation, contamination of the workpiece W due to the adhesion of soot 235 can be prevented.

[0070] Embodiment 2. In Embodiment 2, the configuration of the stage 20 differs from that of Embodiment 1. The configurations other than the stage 20 can be the same as those in Embodiment 1. As described above, a groove is formed directly below the cutting line of the workpiece W in the stage 20. Here, the cutting line may be formed near the outer edge of the workpiece W. In such cases, in this embodiment, the suction member that adsorbs the peripheral portion and the suction member that adsorbs the central portion are made of different materials. The configuration of this embodiment will be explained with reference to Figure 7.

[0071] Figure 7 is a schematic top view of the stage 20. Figure 7 schematically shows the groove 221 of the stage 20. For the sake of simplicity, it is assumed here that one display panel is cut from one workpiece W. Therefore, the groove 221 is formed in the shape of a rectangular frame surrounding one display panel.

[0072] Here, in stage 20, the area inside the groove 221 is defined as the panel area 240, which will be the display panel. The panel area 240 is the device area, which will be the display device. The areas outside the panel area 240 are defined as the remaining frame areas 241 to 244. The remaining frame areas 241 to 244 are arranged in a rectangular frame shape so as to surround the panel area 240.

[0073] Specifically, the remaining frame area 241 is a rectangular area located on the +Y side of the panel area 240. The remaining frame area 243 is a rectangular area located on the -Y side of the panel area 240. The remaining frame area 242 is a rectangular area located on the +X side of the panel area 240. The remaining frame area 244 is a rectangular area located on the -X side of the panel area 240. In workpiece W, the areas corresponding to the remaining frame areas 241 to 244 are areas that are not used as display panels.

[0074] In this view from above, each of the remaining frame areas 241 to 244 is smaller than the panel area 240. In other words, each of the remaining frame areas 241 to 244 has a smaller area than the panel area 240. Furthermore, remaining frame areas 241, 242, and 243 have an extremely elongated shape. The width in the Y direction of remaining frame areas 241 and 243 is extremely small. Also, the width in the X direction of remaining frame area 242 is extremely small. In other words, because the groove 221 is formed in a layout corresponding to the cutting line, some of the remaining frame areas may become narrow, strip-shaped regions.

[0075] In this case, if the narrow remaining frame regions 241, 242, and 243 are formed from porous material, there is a risk that sufficient adsorption performance cannot be obtained. In other words, there are limitations to miniaturizing the remaining frame region because there are constraints on creating a small porous material.

[0076] Therefore, in this embodiment, the remaining frame regions 241, 242, and 243 are formed from a metal material. On the other hand, the panel region 240 and the wide remaining frame region 244 are formed from a porous material. Since the remaining frame regions 241, 242, and 243 are formed from a metal material with numerous adsorption holes, a decrease in adsorption performance can be suppressed. The workpiece W can be reliably adsorbed. For example, the central part of the stage 20 is formed from a porous material, and the peripheral part is formed from a metal material. In this way, the workpiece W can be reliably adsorbed all the way to its edges. Therefore, the workpiece W can be held flat, and the cutting process can be carried out appropriately.

[0077] An example of the detailed configuration of Stage 20 will be explained using Figure 8. Figure 8 is a perspective view showing the configuration around the corners of Stage 20.

[0078] Stage 20 comprises an outer frame 211, a porous adsorption section 212, and a metal adsorption section 213. The outer frame 211 forms the peripheral portion of Stage 20. Specifically, the outer frame 211 is formed in the shape of a rectangular frame. The porous adsorption section 212 is located in the central portion of Stage 20. The porous adsorption section 212 corresponds to the panel area 240 in Figure 7. The porous adsorption section 212 is located directly below the panel area 240.

[0079] A metal adsorption section 213 is positioned between the porous adsorption section 212 and the outer frame 211. Here, a metal adsorption section 213 formed along the X direction and a metal adsorption section 213 formed along the Y direction are provided as separate parts. In other words, a narrow metal adsorption section 213 with the X direction as its longitudinal direction and a metal adsorption section 213 with the Y direction as its longitudinal direction are provided.

[0080] The metal adsorption portion 213 is a metal plate with a plurality of adsorption holes 234 formed therein. The metal adsorption portion 213 has a plurality of adsorption holes 234. The adsorption holes 234 penetrate the metal adsorption portion 213 in the Z direction. The adsorption holes 234 are formed by metalworking. It is connected to an exhaust pump or the like. The metal adsorption portion 213 is positioned directly below the remaining frame areas 241, 242, etc.

[0081] In the metal adsorption portion 213 with the X direction as its longitudinal direction, multiple adsorption holes 234 are arranged in the X direction. In the metal adsorption portion 213 with the Y direction as its longitudinal direction, multiple adsorption holes 234 are arranged in the Y direction. Note that in Figure 8, the adsorption holes 234 are arranged in a single row in either the X or Y direction, but they may be arranged in two or more rows.

[0082] Furthermore, a groove 221 is formed between the porous adsorption section 212 and the metal adsorption section 213. As described above, the groove 221 is positioned directly below the laser irradiation position. Also, as explained in Embodiment 1, soot may be sucked out from the groove 221, but in this embodiment, soot does not need to be sucked out. The exhaust systems for the metal adsorption section 213 and the porous adsorption section 212 may be common or independent.

[0083] In this way, the workpiece W is cut to various sizes according to the panel layout. In areas with narrow remaining frame regions, the metal adsorption section 213 can be used. For wider remaining frame regions and panel regions, the porous adsorption section 212 is used. Because the stage 20 has adsorption sections of different materials, it can adsorb the workpiece appropriately. Therefore, the workpiece W can be held more flat, and the cutting process can be carried out properly. Thus, productivity can be improved.

[0084] Furthermore, the position of the cutting line changes depending on the panel layout of the workpiece W. Therefore, when cutting workpiece W with a different layout, the stage 20 should be replaced. In other words, a porous adsorption section 212 and a metal adsorption section 213 should be prepared according to the layout.

[0085] Embodiment 3. As described above, the material of the workpiece W turns into soot when laser cutting is performed. Therefore, in this embodiment, the optical systems 30 and 31 are provided with a configuration for sucking up the soot. Figure 9 is a schematic diagram showing the laser cutting apparatus 1 according to this embodiment. As shown in Figure 9, the optical system 30 is equipped with a suction unit 90. The optical system 31 is also equipped with a similar suction unit 90, but since the suction unit of the optical system 31 is the same as the suction unit 90 of the optical system 30, its description is omitted. In addition, some parts of the optical system 30 and the gantry stages 40 and 41 are also omitted from the illustration.

[0086] A suction unit 90 is provided on the workpiece W side of the optical system 30. The suction unit 90 is positioned to face the workpiece W. The suction unit 90 moves in the XY direction together with the optical system 30. For example, the suction unit 90 is fixed to the housing of the optical system 30.

[0087] The suction unit 90 includes a holder 93 and a window 91. The holder 93 is held by the window 91. The window 91 is provided to protect the optical elements in the optical system 30. In other words, the window 91 is provided to prevent soot 235 generated by laser irradiation from adhering to the optical elements in the optical system 30. For example, the window 91 is positioned between the lens 306 and the workpiece W. Therefore, it is possible to prevent soot 235 from adhering to the lens 306, etc. The window 91 transmits laser light. Specifically, the window 91 is made of transparent glass or resin. The laser light that has passed through the window 91 is irradiated onto the workpiece W.

[0088] The holder 93 holds the window 91. Furthermore, the holder 93 is provided with a suction space 911 and a discharge space 912. The discharge space 912 ejects gas toward the workpiece W. The discharge space 912 is the space directly below the window 91. In other words, the laser beam L1 is irradiated onto the workpiece W through the discharge space 912. The discharge space 912 is connected to a gas supply means 915 via, for example, a discharge pipe 917. The gas supply means 915 is a gas cylinder or the like. Dry gas such as air or nitrogen is ejected from the discharge space 912.

[0089] The suction space 911 is the space outside the discharge space 912. The suction space 911 draws in gas from above the workpiece W. Therefore, soot 235 floating above the workpiece W is drawn in from the suction space 911. This prevents the soot 235 from adhering to the workpiece W. The suction space 911 is connected to the suction pipe 916. The suction pipe 916 is connected to the suction means 932, for example, via a dust collection filter 931. The suction means 932 is an exhaust pump or the like, which draws in gas. The suction means 932 also draws in gas that is ejected from the discharge space 912.

[0090] By sucking up the soot 235 in this way, the adhesion of soot 235 can be prevented. Furthermore, the groove 221 is positioned directly below the laser irradiation area. Therefore, soot 235 generated along with laser irradiation can be efficiently sucked up.

[0091] In Figure 9, gas is not exhausted from the groove 221 of the stage 20, but as in Embodiment 1, gas may be exhausted from the groove 221. This can more effectively prevent soot buildup.

[0092] The configuration of the suction unit 90 will be explained using Figures 10 and 11. Figure 10 is an XZ cross-sectional view showing the configuration of the suction unit 90. Figure 11 is a top view showing the configuration of the suction unit 90.

[0093] The suction unit 90 comprises a base holder 92, an intermediate holder 97, and a window holder 94. The base holder 92, intermediate holder 97, and window holder 94 correspond to the holder 93 shown in Figure 9. The window holder 94 holds the window 91. As described above, the laser light passes through the window 91 and is irradiated onto the workpiece W.

[0094] The window holder 94 is fixed to the intermediate holder 97. The intermediate holder 97 is fixed to the base holder 92. In other words, the intermediate holder 97 is positioned between the window holder 94 and the base holder 92. The window holder 94 is positioned above the intermediate holder 97. The base holder 92 is positioned below the intermediate holder 97. The base holder 92 is positioned facing the workpiece W.

[0095] The intermediate holder 97 is hollow, and the hollow portion becomes the ejection space 912. A joint 96 is provided on the outer peripheral side of the intermediate holder 97. The joint 96 is connected to the ejection pipe 917. Therefore, as shown in Figure 9, the ejection space 912 is connected to the gas supply means 915, etc., via the ejection pipe 917. This allows gas to be ejected from the ejection space 912. The ejection pipe 917 is designed to follow the movement of the optical system 30.

[0096] The base holder 92 is hollow, and the hollow portion becomes the ejection space 912. The ejection space 912 is circular in top view and is located directly below the window 91. Therefore, the laser beam from the window 91 passes through the ejection space 912 and is irradiated onto the workpiece W.

[0097] Furthermore, a suction space 911 is provided around the ejection space 912. In a top view, the suction space 911 is formed to surround the ejection space 912. In other words, in a top view, the suction space 911 is an annular space.

[0098] A joint 95 is provided on the outer peripheral side of the base holder 92. The joint 95 is connected to the suction pipe 916. As shown in Figure 9, the suction space 911 is connected to the suction means 932 via the suction pipe 916. The suction means 932 can suck up gas from the suction space 911, thereby sucking up the soot 235. This prevents the soot 235 from adhering to the workpiece W even if the material of the workpiece W is turned into soot 235 by laser irradiation. Therefore, contamination of the workpiece W can be suppressed, and productivity can be improved. The suction pipe 916 is designed to follow the movement of the optical system 30.

[0099] The laser cutting apparatus according to Embodiment 3 comprises a stage for adsorbing and holding a workpiece, an optical system for guiding laser light for cutting the workpiece to the workpiece, and a suction unit provided in the optical system for sucking gas from the space above the workpiece.

[0100] The laser cutting method using the laser cutting apparatus according to Embodiment 3 comprises the steps of moving the optical system 30 along the cutting line of the workpiece, and sucking gas from the space above the workpiece using a suction unit 90 provided in the optical system 30 while irradiating with laser light.

[0101] Embodiment 4. The laser cutting apparatus according to this embodiment will be described with reference to Figure 12. Figure 12 is a schematic diagram showing the configuration of the laser cutting apparatus 1. In this embodiment, the laser cutting apparatus 1 is equipped with a cover 951 and an exhaust means 952. In other words, the cover 951 and the exhaust means 952 are added to the configuration of Embodiment 3. Note that in Figure 12, the optical system 30 is omitted and the suction unit 90 is simplified.

[0102] The cover 951 encloses the entire apparatus. For example, the cover 951 is provided so as to surround the stage 20, the optical system 30, and the drive system for driving the optical system. The cover 951 is provided with an exhaust port 953. The exhaust port 953 is provided to create negative pressure in the internal space 954 inside the cover 951.

[0103] In Figure 12, the exhaust port 953 is located on the side of the cover 951, but the location of the exhaust port 953 is not particularly limited. An exhaust pipe 955 is attached to the exhaust port 953. The exhaust pipe 955 is connected to the exhaust means 952 via a dust collection filter 956.

[0104] The internal space 954 of the cover 951 is connected to the exhaust means 952 via the exhaust pipe 955. The exhaust means 952 exhausts the internal space 954 through the exhaust pipe 955. As a result, the internal space 954 becomes a negative pressure lower than atmospheric pressure. A dust collection filter 956 is also provided in the middle of the exhaust pipe 955.

[0105] The exhaust means 952 can discharge any soot 235 that could not be sucked up by the suction unit 90. This allows the soot 235 to be discharged to the outside of the internal space 954. This prevents the soot 235 from adhering to the workpiece W. Therefore, contamination of the workpiece W can be suppressed, and productivity can be improved.

[0106] The laser cutting method using the laser cutting apparatus described in Embodiments 1 to 4 is applicable to the manufacturing method of a display. In other words, the laser cutting method can be used in the cutting process in the manufacturing method of a display. Specifically, a film or substrate that will become a display panel can be used as the workpiece W. That is, the laser cutting apparatus 1 cuts the workpiece W that will become a display panel. As a result, a display panel of a predetermined size is cut out from the workpiece W. In other words, the workpiece W can be divided into multiple display panels. By applying the above laser cutting method to the manufacturing method of a flexible display, productivity can be improved. Of course, the workpiece W is not limited to a flexible film, but may also be a glass substrate or the like.

[0107] The laser cutting device described above is suitable for cutting glass substrates of the 8th generation and above. Here, the substrate size for the 8th generation is 2160mm x 2460mm. The laser cutting device can efficiently cut glass substrates of 2160mm x 2460mm or larger. For reference, the substrate size for the 6th generation is 1500mm x 1850mm. The substrate size for the 8.5th generation is 2250mm x 2500mm. The 10th generation is 2950mm x 3400mm. The laser cutting device can be applied to cutting glass substrates of sizes larger than those listed above.

[0108] The laser cutting apparatus according to this embodiment includes a fixed stage for adsorbing and holding a glass substrate of the 8th generation or higher, an optical system for guiding laser light for cutting the glass substrate to the glass substrate, a guide mechanism for movably holding the optical system, and a drive mechanism for moving the optical system along the guide mechanism.

[0109] The surface area of ​​glass substrates is increasing with each generation. Especially when handling large substrates of the 8th generation and above, a configuration that moves the suction stage results in a significant increase in the size of the equipment and the required installation area. In contrast, as in this embodiment, a fixed suction stage configuration can suppress this increase in installation area.

[0110] Some or all of Embodiments 1 to 4 can be used in combination as appropriate.

[0111] It should be noted that the present invention is not limited to the embodiments described above, and can be modified as appropriate without departing from the spirit of the invention. [Explanation of Symbols]

[0112] 1. Laser cutting device 10 mounting bases 11 X-guide grooves 15 Measuring instruments 20 stages 201 Suction Plate 202 Groove Block 203 Piping 204 Through hole 205 Through hole 208 Fittings 209 Fittings 211 Outer frame 221 Groove 222 Exhaust means 227 Dust collection filter 234 suction holes 235 Soot 240 panel area 241 Remaining frame area 242 Remaining space area 243 Remaining frame area 244 Remaining space area 30 Optical system 303 Y drive mechanism 304 Laser light source 305 Mirror 306 Lens 31 Optical system 313 Y drive mechanism 314 Laser light source 315 Mirror 316 Lens 40 Gantry Stages 401 X drive mechanism 402 Gantry axis 403 Y-guide groove 41 Gantry Stage 411 X drive mechanism 412 Gantry axis 413 Y-guide groove 90 Suction Unit 91 Window 92 Base holder 93 Holder 94 Window Holder 95 Joints 96 Joints 97 Intermediate holder 911 Suction space 912 Ejection space 951 Cover 953 Exhaust port

Claims

1. A stage having grooves formed along the cutting line of a workpiece which is a flexible film, and which adsorbs and holds the workpiece, An optical system for guiding a laser beam to cut the workpiece to the workpiece, A drive mechanism for moving the optical system along the cutting line, When the groove communicates with the space above the workpiece through the cut portion of the workpiece, an exhaust means for exhausting gas from the space above the workpiece through the groove, A suction unit is provided below the optical system so as to move together with the optical system by the drive mechanism, and is used to suck gas from the space above the workpiece. The suction unit has a window through which the laser light passes, A holder for holding the aforementioned window, The holder is provided with an ejection space located below the window for ejecting the gas onto the workpiece. The holder is provided with a suction space located outside the ejection space and for drawing in gas from the space above the workpiece. The laser light is irradiated onto the workpiece through the ejection space, In the aforementioned stage, a groove is formed between the device region that becomes a device in the workpiece and a plurality of remaining frame regions outside the device region. The aforementioned stage, A porous adsorption section is positioned directly below the device region and directly below the wider remaining frame region among the multiple remaining frame regions. A laser cutting apparatus comprising a metal adsorption part having multiple adsorption holes, positioned directly below the narrow remaining frame area of ​​the plurality of remaining frame areas.

2. In a top view, the workpiece is arranged in a rectangular shape. The drive mechanism moves the optical system in a first direction parallel to one end of the workpiece and in a second direction perpendicular to the first direction. The laser cutting apparatus according to claim 1, wherein the workpiece is cut by a first cutting line provided along a first direction and a second cutting line provided along a second direction.

3. The laser cutting apparatus according to claim 2, wherein the optical system is provided with an optical scanner for scanning the laser light in the first and second directions.

4. The optical system includes a first optical system that irradiates the workpiece with a laser light source of a first wavelength, and a second optical system that irradiates the workpiece with a laser light source of a second wavelength different from the first wavelength. The laser cutting apparatus according to any one of claims 1 to 3, wherein the wavelength of the laser light irradiated onto the workpiece is selected according to the film formed on the workpiece.

5. A cover is provided so as to surround the stage and the optical system, A laser cutting apparatus according to any one of claims 1 to 4, further comprising an exhaust port provided in the cover for creating a negative pressure in the internal space within the cover.

6. A laser cutting method for cutting a workpiece that is a flexible film using a laser cutting device, The aforementioned laser cutting apparatus, A stage having a groove formed along the cutting line of the workpiece, which holds the workpiece by suction, The system comprises an optical system that guides a laser beam for cutting the workpiece onto the workpiece, The aforementioned laser cutting method is A step of moving the optical system along the cutting line, The procedure includes the steps of exhausting gas through the groove during the irradiation of the laser beam, and a suction unit provided below the optical system sucking gas from the space above the workpiece, The suction unit has a window through which the laser light passes, A holder for holding the aforementioned window, The holder is provided with an ejection space located below the window for ejecting the gas onto the workpiece. The holder is provided with a suction space located outside the ejection space and for drawing in gas from the space above the workpiece. The laser light is irradiated onto the workpiece through the ejection space, In the aforementioned stage, a groove is formed between the device region that becomes a device in the workpiece and a plurality of remaining frame regions outside the device region. The aforementioned stage, A porous adsorption section is positioned directly below the device region and directly below the wider remaining frame region among the multiple remaining frame regions. A laser cutting method comprising a metal adsorption part having multiple adsorption holes, positioned directly below the narrow remaining frame region of the plurality of remaining frame regions.

7. In a top view, the workpiece is arranged in a rectangular shape. The drive mechanism moves the optical system in a first direction parallel to one end of the workpiece, and in a second direction perpendicular to the first direction. The laser cutting method according to claim 6, wherein the workpiece is cut by a first cutting line provided along a first direction and a second cutting line provided along a second direction.

8. The laser cutting method according to claim 7, wherein the optical system is provided with an optical scanner for scanning the laser light in the first and second directions.

9. The optical system includes a first optical system that irradiates the workpiece with a laser light source of a first wavelength, and a second optical system that irradiates the workpiece with a laser light source of a second wavelength different from the first wavelength. The laser cutting method according to any one of claims 6 to 8, wherein the wavelength of the laser light irradiated onto the workpiece is selected according to the film formed on the workpiece.

10. The aforementioned laser cutting apparatus A cover is provided so as to surround the stage and the optical system, A laser cutting method according to any one of claims 6 to 9, further comprising an exhaust port provided in the cover for creating a negative pressure in the internal space within the cover.

11. A method for manufacturing a display, comprising cutting a workpiece which is a flexible film that will serve as a display panel using a laser cutting device, The aforementioned laser cutting apparatus, A stage having a groove formed along the cutting line of the workpiece, which holds the workpiece by suction, An optical system for guiding a laser beam to cut the workpiece to the workpiece, The system includes an exhaust means for exhausting gas from the space above the workpiece through the groove when the groove communicates with the space above the workpiece through the cut portion of the workpiece. The method for manufacturing the aforementioned display is: A step of moving the optical system along the cutting line, The procedure includes the steps of exhausting gas through the groove during the irradiation of the laser beam, and a suction unit provided below the optical system sucking gas from the space above the workpiece, The suction unit has a window through which the laser light passes, A holder for holding the aforementioned window, The holder is provided with an ejection space located below the window for ejecting the gas onto the workpiece. The holder is provided with a suction space located outside the ejection space and for drawing in gas from the space above the workpiece. The laser light is irradiated onto the workpiece through the ejection space, In the aforementioned stage, a groove is formed between the device region that becomes a device in the workpiece and a plurality of remaining frame regions outside the device region. The aforementioned stage, A porous adsorption section is positioned directly below the device region and directly below the wider remaining frame region among the multiple remaining frame regions. A method for manufacturing a display, comprising a metal adsorption portion having multiple adsorption holes, which is positioned directly below the narrow remaining frame region of the plurality of remaining frame regions.

12. In a top view, the workpiece is arranged in a rectangular shape. The drive mechanism moves the optical system in a first direction parallel to one end of the workpiece and in a second direction perpendicular to the first direction. The method for manufacturing a display according to claim 11, wherein the workpiece is cut along a first cutting line provided along a first direction and a second cutting line provided along a second direction.

13. The method for manufacturing a display according to claim 12, wherein the optical system is provided with an optical scanner for scanning the laser light in the first direction and the second direction.

14. The optical system includes a first optical system that irradiates the workpiece with a laser light source of a first wavelength, and a second optical system that irradiates the workpiece with a laser light source of a second wavelength different from the first wavelength. A method for manufacturing a display according to any one of claims 11 to 13, wherein the wavelength of laser light irradiated onto the workpiece is selected according to the film formed on the workpiece.

15. The aforementioned laser cutting apparatus A cover is provided so as to surround the stage and the optical system, A method for manufacturing a display according to any one of claims 11 to 14, further comprising: an exhaust port provided in the cover for creating a negative pressure in the internal space within the cover.

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