CONDENSATION DEVICE, FLUID PASTE RECOVERY DEVICE, SOLDERING DEVICE, WATER VAPOR REMOVAL METHOD, FLUID PASTE RECOVERY METHOD, AND SOLDERING PROCESSING METHOD

MX434453BActive Publication Date: 2026-05-19SENJU METAL IND CO LTD
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Patent Information

Application Number
MX2021012192
Authority / Receiving Office
MX · MX
Patent Type
Patents
Current Assignee / Owner
Priority Date
2019-04-05
Filing Date
2021-10-04
Publication Date
2026-05-19
Estimated Expiration
2040-03-06

AI Technical Summary

Technical Problem

Existing flux recovery devices struggle to efficiently remove water vapor without increasing the size of the condensing means, limiting the amount of gas that can be treated per unit time.

Method used

A condensing device comprising outdoor and indoor cooling units, heat absorbing members, and fins to increase the surface area for cooling, allowing for the removal of a larger amount of water vapor without increasing the device's size.

Benefits of technology

The solution enables the removal of a greater volume of water vapor efficiently, maintaining a compact device size by enhancing cooling capacity through increased surface area and convection within the condensing system.

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Abstract

A condensation device is provided that is capable of removing water vapor from a larger quantity of gas without increasing the size of the related art; a condensation device 700 according to the present invention includes an external cooling unit 720 including one or two or more inner tubes 722, an external tube 724 located outside the one or two or more inner tubes 722, and a first flow path 726 through which a first cooling medium passes between the one or two or more inner tubes 722 and the external tube 724.
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Description

CONDENSATION DEVICE, FLUID PASTE RECOVERY DEVICE, SOLDERING DEVICE, WATER VAPOR REMOVAL METHOD, FLUID PASTE RECOVERY METHOD, AND PROCESSING METHOD OF SOLDERING TECHNICAL FIELD The present invention relates to a condensation device, a flux recovery device, a soldering device, a water vapor removal method, a flux recovery method, and a soldering processing method. BACKGROUND OF THE INVENTION In the process of soldering an electronic component to a circuit board, a soldering device such as a reflow oven or a soldering iron is used. During soldering, flux is applied to the solder joint on the circuit board. The flux removes an oxide film from the metal surface to be soldered and prevents re-oxidation during the heat treatment process. Flux is primarily obtained by dissolving a solid component such as rosin, a thixotropic agent, or an activator in a solvent.In the case of applying flux paste to the circuit board, for example, in the case of using a reflow oven, the solder paste obtained by mixing and blending the flux paste and solder powder is used, and in the case of using a jet soldering device, the flux paste is applied directly to the board with a flux paste distributor. When flux is applied as solder paste or with a flux dispenser, the solvent in one component of the flux vaporizes to form flux vapor in a preheating unit before soldering. In the main heating unit where soldering takes place, a solid component, such as rosin, in the flux vaporizes to form flux vapor that floats in the device. When this flux vapor comes into contact with a part that has a comparatively low temperature in the device, for example, a chain conveyor carrying the circuit board, the vapors cool and condense. As the temperature drops further, a sticky solid forms. This solid adheres to and deposits on each part in the soldering device, potentially causing defects.For example, if a large amount of solid adheres to the chain conveyor, the circuit board may not leave the conveyor and may become caught on a sprocket, damaging it. Furthermore, when the solid adheres to the circuit board being conveyed, it can stain it. Therefore, a flux recovery device is used to separate and remove the flux paste component from the gaseous mixture in the soldering station's atmosphere or an inert atmosphere of nitrogen or similar gases. Here, an example of the flux paste recovery device is described in Patent Literature 1. The flux paste recovery device described in PTL1 includes a first water spray unit that sprays water onto the gas mixture, and a separation unit that separates the flux paste component from the gas mixture. The separation unit also comprises an inlet portion that introduces the gas mixture into an upper portion, a flux paste component separating into a tubular body that includes an upper opening and a lower conical portion, and a cap attached to the opening in the tubular body. Furthermore, the cap includes a disc-shaped main body, and a cylindrical discharge portion of a predetermined length is provided to penetrate the main body. According to this flux recovery device, when the gas mixture is drawn into the inlet section tangentially from the tubular body, it mixes with water to form a swirling flow. The flux contained within the gas mixture is then cooled by water supplied to the separation unit. Consequently, most of the flux begins to liquefy and solidify, and the flux is coated with the sprayed water. In other words, the flux mixes with water and is removed as flux-containing water from the gas mixture. The gas from which the flux is removed is then drawn out of the cylindrical section. Therefore, this flux recovery device can separate the flux from the gas mixture. Furthermore, water is used to separate the flux paste, and the gas from which the flux paste is removed contains a significant amount of water vapor. When water vapor is generated in a separation process and flows into a soldering processing unit, it condenses and forms water droplets in a low-temperature area of ​​the unit. When these water droplets adhere to the inside of the unit, rust forms. Similarly, when water droplets adhere to the circuit board, the circuit board absorbs moisture. The moisture-absorbing circuit board heats up during the soldering process, causing the absorbed moisture to evaporate. This evaporation can lead to a phenomenon where the solder disperses in a soldered area.When solder dispersion occurs, it creates a solder joint defect where the dispersed solder causes an electrical short circuit across the terminals, known as a solder bridge. Additionally, moisture-absorbing circuit boards can contribute to deterioration of the soldered area due to changes over time, or migration. Water vapor entering the furnace can cause defects related to the circuit board's reliability. Furthermore, it can reduce the amount of water available for reuse. To address this issue, this flux recovery device also includes condensation means to remove water vapor from the gas from which the flux is extracted. In PTL 1, the condensation means are described as water-cooled coil-type condensation means and air-cooled multi-tube condensation means. A water-cooled coil-type condenser consists of a box-type body and comprises a coiled pipe with satisfactory thermal conductivity inside the box. In this type of condenser, a liquid such as water flows within the coiled pipe to cool its surface. Consequently, when a gas containing water vapor passes through the inside of the box-type condenser, the gas is cooled and condenses as it travels along the coiled pipe. Through condensation, the water vapor is then removed from the gas. Also, air-cooled multi-tube condensing media consist of a box body and include a tube bundle containing one or more tubes inside the box body. Cool air then flows through the inside of the tubes in the bundle to cool their surfaces. Consequently, when water vapor-containing gas passes through the inside of the box body of this condensing media, the gas is cooled and condenses within the tube bundle. Through condensation, the water vapor is then removed from the gas. Therefore, in the flux recovery device described in PTL 1, dry gas can be generated from the water vapor-containing gas using water-cooled coil-type condensation media or air-cooled multi-tube condensation media. Consequently, this flux recovery device can collect the flux paste from the gas mixture containing the flux paste component generated in the welding processing unit and supply the dry gas back to the welding processing unit. List of references Patent literature PTL 1: Japanese Patent No. 5761467 BRIEF DESCRIPTION OF THE INVENTION Technical problem As described earlier, a flux paste recovery device described in PTL 1 comprises condensation means for removing water vapor from the water vapor-containing gas generated during flux paste recovery. The amount of water vapor-containing gas that can be treated with the condensation means is related to the amount of the gas mixture that can be treated with the flux paste recovery device and is therefore important. However, in the two condensation systems described earlier, the water vapor-containing gas is primarily cooled by a coiled pipe or tube bundle inside a housing. Consequently, to increase the amount of water vapor-containing gas that can be processed per unit of time by the condensation system, it is necessary to increase the length of the coiled pipe or the number of tubes in the tube bundle. In this case, there is concern that the condensation system itself would increase in size, and that the flux recovery device or soldering device incorporating this condensation system would also increase in size. Therefore, in view of the problems described above, an objective of the present invention is to provide a condensation device, a flux paste recovery device, a soldering device, a water vapor removal method, a flux paste recovery method, and a solder processing method that are capable of removing water vapor from a larger quantity of gas without making a larger size than in the related art. Solution to the problem Aspect 1 A condensing device according to Aspect 1 comprises an outdoor cooling unit that includes one or two or more inner tubes, an outdoor tube located outside the one or two or more inner tubes, and a first flow path through which a first cooling medium passes between the one or two or more inner tubes and the outdoor tube. In the condensation device according to Aspect 1, where the water vapor-containing gas is distributed into the inner tube of the outdoor cooling unit, the water vapor-containing gas comes into contact with the inner tube of the outdoor cooling unit. Consequently, the water vapor-containing gas is cooled by the inner tube of the outdoor cooling unit. Therefore, this condensation device can condense water vapor and remove water vapor from the water vapor-containing gas. Particularly, where the condensation device according to Aspect 1 comprises multiple inner tubes, the device can cool the water vapor-containing gas more rapidly and remove water vapor from a large quantity of gas without increasing the size of the related art. Aspect 2 In a condensing device according to Aspect 2, the condensing device according to Aspect 1 further comprises a heat absorption member that is located inside at least one inner tube in one or two or more inner tubes, and that comes into contact with the outdoor cooling unit. In the condensing device according to Aspect 2, the water vapor-containing gas is cooled by the outdoor cooling unit and the heat absorption member. Consequently, in the condensing device according to Aspect 2, the surface area of ​​the part cooling the water vapor-containing gas is increased compared to the condensing means of PTL 1. Therefore, this condensing device can remove water vapor from a larger quantity of gas without increasing its size compared to the related art, due to the increased contact area with the gas. Aspect 3 In a condensing device according to Aspect 3, the condensing device according to Aspect 1 or Aspect 2 further comprises an inner cooling unit located inside one or two or more inner tubes and including a second flow path through which a second cooling medium passes. In the condensing device according to Aspect 3, the water vapor-containing gas is cooled by the inner tube of the outdoor cooling unit and the indoor cooling unit. Consequently, in the condensing device according to Aspect 3, the surface area of ​​the part cooling the water vapor-containing gas is increased compared to the condensing means of PTL 1. Therefore, this condensing device can remove water vapor from a larger quantity of gas without increasing its size compared to the related art, due to the increased contact area with the gas. Aspect 4 In a condensing device according to Aspect 4, the condensing device according to Aspect 3 further comprises a heat absorption member that is located inside one or two or more inner tubes and outside the indoor cooling unit, and that comes into contact with the indoor cooling unit. In the condensing device according to Aspect 4, the water vapor-containing gas is cooled by the inner tube of the outdoor cooling unit, the indoor cooling unit, and the heat absorption member. That is, in this condensing device, the surface area of ​​the part cooling the water vapor-containing gas is increased more than in the condensing device according to Aspect 3. Therefore, this condensing device can cool the water vapor-containing gas more quickly due to the increased contact area with the gas. Aspect 5 According to a condensation device of Aspect 5, in the condensation device according to Aspect 4, the heat absorption member includes a plurality of fins. In the condensing device according to Aspect 5, with a plurality of fins, the contact area of ​​each fin in contact with the water vapor-containing gas can be increased compared to a single fin. That is, this condensing device can cool the water vapor-containing gas more rapidly due to the increased contact area. Aspect 6 According to a condensation device of Aspect 6, in the condensation device according to Aspect 4 or Aspect 5, the indoor cooling unit has a straight tube shape, the inner tube of the outdoor cooling unit extends in an axial direction of the straight tube shape of the indoor cooling unit, and the heat absorption member includes a first fin that has a thin plate shape that extends in a direction that intersects the axis. In the flowing gas, the gas flowing near the inner tube of the outdoor cooling unit, the indoor cooling unit, and the heat absorption member cools more than the gas flowing farther from the inner tube of the outdoor cooling unit, the indoor cooling unit, and the heat absorption member. Consequently, in a case where the gas containing water vapor does not provide convection within the inner tube of the outdoor cooling unit, a temperature difference can develop in the discharged gas depending on the position through which the water vapor flows. In this case, there is concern that uncooled gas, still containing a significant amount of water vapor, will pass through the condensing device. However, according to the condensation device in Aspect 6, the first fin is arranged extending in a direction that intersects the axis. That is, the first fin is oriented to block the flow of the gas containing water vapor. Consequently, when the gas containing water vapor encounters the first fin, gas convection occurs inside the inner tube of the outdoor cooling unit. Therefore, this condensation device can uniformly cool the gas containing water vapor. In other words, this condensation device can inhibit the passage of gas still containing a high concentration of water vapor through the condensation device. Aspect 7 According to a condensation device of Aspect 7, in the condensation device according to Aspect 6, the first fin has a shape in which an arc-shaped cut is formed in a thin disc shape, the heat-absorbing member further comprises a second fin having the same shape as the first fin, arranged adjacent to the first fin via a gap, and located on a downstream side of the first fin, and an extension direction of a chord forming the arc shape of the cut in the first fin is different from an extension direction of a chord forming an arc shape of a cut in the second fin. In a case where two fins of the same shape are arranged parallel to each other across a gap, and gas is blown from a direction facing one of the fin's plates, the air is difficult to flow between the two fins, and the gas between them may remain trapped. Consequently, in the case where the two fins are arranged parallel to each other in the condensation device, the gas that remains between the two fins cools down; gas in other positions is difficult to cool. However, according to the condensation device of Aspect 7, arc-shaped cuts are formed in the first and second fins, respectively, and the direction of extension of the chord forming the arc shape of the first fin is different from the direction of extension of the chord forming the arc shape of the second fin.Therefore, in a case where the gas passing through a portion of the first fin where the cut is formed flows directly forward, at least some of this gas collides with the second fin. This causes gas convection between the first and second fins. That is, the gas's residence time between the first and second fins is inhibited. Therefore, this condensation device can achieve a uniform gas temperature in the vicinity of the first and second fins. Aspect 8 A flux paste recovery device according to Aspect 8 is a flux paste recovery device that recovers flux paste from a gaseous mixture containing a flux paste component, and comprises a separation unit that separates the flux paste from the gaseous mixture by using water, and discharges gas containing water vapor and water containing flux paste, and the condensation device according to any of Aspects 1 to 7 that removes water vapor from the gas discharged from the separation unit. Since the flux recovery device according to Aspect 8 comprises the condensation device according to any of Aspects 1 to 7, this condensation device can remove water vapor from a larger quantity of gas without increasing its size compared to the related art in the same manner as in Aspect 1. Consequently, this flux recovery device can remove water vapor from a larger quantity of gas without increasing its size compared to the related art, due to an increase in the amount of gas to be treated by the condensation device. Aspect 9 In a flux paste recovery device according to Aspect 9, the flux paste recovery device according to Aspect 8 further comprises a purification device to which flux paste-containing water discharged from the separation unit is supplied, and which separates the flux paste from the flux paste-containing water and recovers the flux paste, and a pipe supplying water separated from the flux paste and purified in the purification device from the purification device to the condensation device, and at least one of the first cooling medium and the second cooling medium is water supplied from the purification device. The flux recovery device, in accordance with Aspect 9, uses purified water in the purification device as at least one of the first and second cooling media. Therefore, the flux recovery device does not need to include any other installation to supply a cooling medium for use in the first and second cooling media, in addition to the purification device. Aspect 10 In a flux paste recovery device according to Aspect 10, the flux paste recovery device according to Aspect 9 further comprises a pump that supplies purified water in the purification device to the separation unit, a cooling unit that cools the purified water in the purification device, and a blower that blows, from the condensation device, the gas from which water vapor is removed in the condensation device. The flux paste recovery device, in accordance with Aspect 10, can use the purified water from the purification device as water for use by the separation unit to separate the flux paste from a gaseous mixture. Additionally, the cooling unit can cool water for use in the flux paste separation, as well as water for use in the first and second cooling media. Aspect 11 In a flux paste recovery device according to Aspect 11, the flux paste recovery device according to any of Aspects 8 to 10 comprises a plurality of interconnected condensation devices. Since the flux paste recovery device according to Aspect 11 comprises a plurality of interconnected condensation devices, water vapor can be removed from a greater quantity of gas compared to a case where the flux paste recovery device comprises a condensation device. Aspect 12 A welding device according to Aspect 12 comprises a welding processing unit, and the flux paste recovery device according to any of Aspects 8 to 11 that recovers flux paste from a gaseous mixture containing flux paste generated in the welding processing unit. Since the soldering device according to Aspect 12 comprises the flux paste recovery device according to any of Aspects 8 to 11, the flux paste recovery device provided in the soldering device can remove water vapor from a larger quantity of gas without increasing the size of the related art, in the same manner as in Aspect 8. Consequently, this soldering device can remove water vapor from a larger quantity of gas without increasing the size of the related art. Aspect 13 A method of removing water vapor in accordance with Aspect 13 comprises the steps of allowing a first cooling medium to pass through a first flow path between one or two or more inner tubes and an outer tube in an outdoor cooling unit, including the one or two or more inner tubes and the outer tube located outside the one or two or more inner tubes, and allowing, on the insides of the one or two or more inner tubes, the condensation of water vapor contained in the gas flowing through the insides of the one or two or more inner tubes, to remove the water vapor contained in the gas. According to the water vapor removal method described in Aspect 13, the gas containing water vapor comes into contact with the inner tube of the outdoor cooling unit, allowing the inner tube to cool the gas. Therefore, this method of water vapor removal is capable of condensing the water vapor and removing it from the gas. In particular, when the outdoor cooling unit according to Aspect 13 comprises multiple inner tubes, the water vapor can be cooled more rapidly, and a greater quantity of water vapor can be removed from the gas without increasing the size of the related art. Aspect 14 In a method of removing water vapor according to Aspect 14, the method according to Aspect 13 further comprises the steps of allowing a second cooling medium to pass through a second flow path included in an inner cooling unit located inside one or two or more inner tubes, and cooling, by a heat absorption member, the gas flowing through an interior of the inner tube, the heat absorption member being located inside one or two or more inner tubes of the outer cooling unit and outside the inner cooling unit, the heat absorption member coming into contact with at least one of the outer cooling unit and the inner cooling unit. According to the water vapor removal method described in Aspect 14, each of the inner tubes of the outdoor cooling unit, the indoor cooling unit, and the heat absorption member can cool the water vapor-containing gas. That is, in this water vapor removal method, the surface area of ​​the portion cooling the water vapor-containing gas is greater than in the water vapor removal method described in Aspect 13. Therefore, this condensing device can cool the water vapor-containing gas more quickly due to the increased contact area. Aspect 15 A flux paste recovery method in accordance with Aspect 15 comprises the steps of separating the flux paste from a gaseous mixture containing the flux paste by using water, and generating gas containing water vapor and water containing flux paste, separating the flux paste from the water containing flux paste, and recovering the flux paste, and removing water vapor from the generated gas containing water vapor by the water vapor removal method in accordance with Aspect 13 or Aspect 14. The flux paste recovery method according to Aspect 15 further comprises the steps of removing water vapor by the water vapor removal method according to Aspect 13. Consequently, water vapor can be removed from a greater quantity of gas without increasing the size of a device for use in the flux paste recovery method according to Aspect 15 than in the related art. Aspect 16 A welding processing method according to Aspect 16 comprises the steps of performing welding processing in a welding processing unit, recovering flux paste from a gaseous mixture containing flux paste i.e., generated by welding processing, by the flux paste recovery method according to Aspect 15, and supplying, to the welding processing unit, gas from which water vapor is removed, the gas being generated by the flux paste recovery method. The welding processing method according to Aspect 16 further comprises the steps of recovering the flux paste by the flux paste recovery method according to Aspect 15. Consequently, water vapor can be removed from a greater quantity of gas without increasing the size of a device for use in the welding processing method according to Aspect 16 compared to the related art. Advantageous effects of the invention According to the present invention, water vapor can be removed from a larger quantity of gas without increasing its size compared to the related art. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a structural diagram of a welding device comprising a condensation device according to a first embodiment of the present invention. Fig. 2 is a front view showing a configuration of the condensation device shown in Fig. 1. Fig. 3 is a plan view of the condensation device shown in Fig. 2. Fig. 4 is a cross-sectional view of the condensation device taken along line AOB shown in Fig. 3. Fig. 5 is a cross-sectional view of the condensation device taken along the CC line shown in Fig. 2. Fig. 6 is a cross-sectional view of the condensation device taken along the DD line shown in Fig. 2. Fig. 7 is a structural diagram of a condensation device according to a second embodiment of the present invention. Fig. 8 is a cross-sectional view of the condensation device taken along the EE line shown in Fig. 7. DETAILED DESCRIPTION OF THE INVENTION Hereafter, the descriptions of the embodiments of the present invention will be made with reference to the drawings. In the drawings described below, the same component or a corresponding component will be denoted by the same reference symbol, and its description will not be repeated. First Modality Full Setup Figure 1 is a structural diagram of a soldering device comprising a condensation device according to a first embodiment of the present invention. With reference to Figure 1, a soldering device 100 comprises a soldering processing unit 120 and a flux recovery device 200. The soldering device 100 is a device that solders an electronic component to a circuit board, for example. iviA / a / zuzi / ui zi az From now on, the respective constituent components of the welding device 100 will be described separately. The soldering processing unit 120 performs a soldering-related procedure, such as soldering an electronic component to a circuit board or preheating the circuit board. In the soldering processing unit 120, the circuit board to which the flux is applied is used to ensure even soldering. Consequently, during the soldering or circuit board preheating process, the flux vaporizes and floats inside the soldering processing unit 120. In other words, the interior of the soldering processing unit 120 is filled with a gaseous mixture containing a flux component.Note that in the present description, the gaseous mixture is the gas in which the gaseous flux paste generated during the welding process is mixed with the gas that comes out from the beginning in the welding processing unit 120. The flux paste recovery device 200 is a device that recovers flux paste from the gas mixture containing the flux paste component. The flux paste recovery device 200 is connected to the welding processing unit 120. The flux paste recovery device 200 then recovers the flux paste from the gas mixture inside the welding processing unit 120 and supplies the welding processing unit 120 with the gas from which the flux paste is recovered. The flux paste recovery device 200 comprises, as an example, a separation unit 400, a purification device 600, a pump 220, a water supply tank 280, a cooling unit 300, three condensation devices 700a, 700b, and 700c, a blower 340, and a pipe 360. Note that in Fig.1. To simplify the drawing, the pipe through which the liquid is distributed is shown as a dotted line, and the pipe through which the gas is distributed is shown as a dashed line. Separation unit 400 connects fluid to welding processing unit 120 and can draw gas mixture from welding processing unit 120. Separation unit 400 also separates flux paste from the drawn gas mixture using a known method. More specifically, separation unit 400 mixes water with the gas mixture. Consequently, the flux paste contained in the gas mixture is cooled by the water. The cooled flux paste either liquefies or solidifies. Therefore, the flux paste contained in the gas mixture is separated and removed from the gas mixture. The liquefied or solidified flux paste is then coated with the water used in the flux paste separation process and discharged from separation unit 400. Condensing device 700a, condensing device 700b, and condensing device 700c have the same configuration as an example. Condensing device 700a communicates fluid with separation unit 400, condensing device 700b communicates fluid with condensing device 700a, and condensing device 700c communicates fluid with condensing device 700b. That is, three condensing devices, 700a, 700b, and 700c, are interconnected. When the gas from which the flux paste is removed in the separation unit 400 is supplied to the condensing device 700a, the gas from which the flux paste is removed passes through the three condensing devices 700a, 700b, and 700c in order, and is discharged from the condensing device 700c.The 700c condensing device communicates fluid with the 340 blower, and the gas discharged from the 700c condensing device is supplied to the 340 blower. The separation unit 400 separates flux paste from the gas mixture using water, as previously described. Consequently, the gas from which the flux paste is removed in the separation unit 400 contains a high concentration of water vapor. The condensation devices 700a, 700b, and 700c serve to remove water vapor from the gas containing water vapor. These three condensation devices are arranged to extend in the direction of gravity, as an example. For instance, an L-axis of an internal cooling unit 740, described later, extends in the direction of gravity (see Fig. 4). The detailed configurations of the condensation devices 700a, 700b, and 700c will be described later. The 340 blower has a function of sucking, from the 700c condensation device, the gas from which water vapor is removed, and blowing, to the 120 welding processing unit, the gas from which water vapor is removed. The purification device 600 communicates with the separation unit 400. Consequently, the water containing flux paste discharged from the separation unit 400 is supplied to the purification device 600. The purification device 600 also includes a purification tank 620 and an ozone generator 640, for example. The purification device 600 stores the supplied water containing flux paste in the purification tank 620. Additionally, the ozone generator 640 supplies ozone bubbles to the purification tank 620. Consequently, the purification device 600 decomposes the flux paste using ozone. Afterward, the purification device 600 passes the water containing the decomposed flux paste through a filter.Therefore, the decomposition is adsorbed onto the filter, and then the 600 purification device can separate the melting paste from the water containing melting paste, to purify the water. Furthermore, the purification device 600 communicates fluid with the separation unit 400 through pump 220. Consequently, pump 220 can supply purified water to the separation unit 400 in the purification device 600. Pipe 360 ​​connects purification device 600 to the three condensation devices 700a, 700b, and 700c. Consequently, pipe 360 ​​can supply purified water by separating the flux paste in purification device 600 from purification device 600 to condensation devices 700a, 700b, and 700c. Cooling unit 300 is connected to purification device 600. Cooling unit 300 cools the purified water in purification device 600 and returns the water to the device. Consequently, the temperature of the purified water stored in purification device 600 is approximately 5 degrees Celsius, as an example. The water that comes shortly after it is circulated is supplied from the water supply tank 280 to the purification tank 620. Condensing Device A more detailed description of the condensing device configurations 700a, 700b, and 700c will now be given with reference to Figures 2 through 6. Since condensing devices 700a, 700b, and 700c have the same configuration, they are represented and described as condensing device 700. Figure 2 is a front view showing the condensing device 700 configuration shown in Figure 1. Figure 3 is a plan view of the condensing device 700 shown in Figure 2. Figure 4 is a cross-sectional view of the condensing device 700 taken along line AOB shown in Figure 3. Figure 5 is a cross-sectional view of the condensing device 700 taken along line CC shown in Figure 6. Fig. 2. In addition, Fig.Figure 6 is a cross-sectional view of the 700 condensing device taken along line DD shown in Figure 2. With reference to Fig. 2, the condensing device 700 includes an outdoor cooling unit 720, an indoor cooling unit 740, a heat absorption member 760, a gas inlet 702, and a gas outlet 704. The condensing device 700 has a tubular shape, as shown in Fig. 2 and Fig. 3. With reference to Fig. 4, the outdoor cooling unit 720 includes an inner tube 722, an outer tube 724 located outside the inner tube 722, a first flow path 726 through which a first cooling medium passes between the inner tube 722 and the outer tube 724, a first cooling medium inlet 728, and a first cooling medium outlet 730. As an example, the first cooling medium inlet 728 is located below the first cooling medium outlet 730 in the direction of gravity. Furthermore, the water supplied from the purification device 600 is supplied from the inlet of the first cooling medium 728 to the first flow path 726, and is discharged from the outlet of the first cooling medium 730. Afterwards, the discharged water is returned to the purification device 600.Therefore, the water supplied from the purification device 600 is for use as the primary cooling medium. Also, the inner tube 722 of the outdoor cooling unit 720 extends along the L-axis as an example. The indoor cooling unit 740 is located inside the inner tube 722 of the outdoor cooling unit 720 and includes a second flow path 742 through which a second cooling medium passes, a second cooling medium inlet 744, and a second cooling medium outlet 746. The indoor cooling unit 740 is, for example, a straight tube shape around axis L as a central axis. Furthermore, for example, the second cooling medium inlet 744 is located below the second cooling medium outlet 746 in the direction of gravity. Additionally, water supplied from the purification device 600 is supplied from the second cooling medium inlet 744 to the second flow path 742 and discharged from the second cooling medium outlet 746. The discharged water is then returned to the purification device 600.Therefore, the water supplied from the 600 purification device is used as the second cooling medium. The heat absorption member 760 is located inside the inner tube 722 of the outdoor cooling unit 720 and outside the indoor cooling unit 740, and is in contact with the indoor cooling unit 740. The heat absorption member 760 includes a first fin 762 and a second fin 768, as an example. The first fin 762 has a thin plate shape extending in a direction that intersects the L-axis of the indoor cooling unit 740. The first fin 762 also has a shape in which two symmetrical arc-shaped cuts 766 are formed around a center in a thin disk shape 764 (see Fig. 5). An outer shape of the thin disk shape 764 of the first fin 762 has a value greater than a value obtained by multiplying a value of the inner tube 722 of the outdoor cooling unit 720 by 0.9, as an example.Furthermore, two chords 767a and 767b, each forming an arc shape 766 of the first fin 762, extend in the same direction because two cuts 766 are formed symmetrically around the center. On the other hand, the second fin 768 is arranged adjacent to the first fin 762 across a gap and is located downstream of the first fin 762 (see Fig. 4). Moreover, the second fin 768 has the same shape as the first fin 762 (see Fig. 6). That is, the second fin 768 has a shape in which two arc-shaped cuts 772 are formed symmetrically around a center in a thin-disc shape 770. Furthermore, in the condensation device 700, as an example, the extension direction of a chord 767 of the first fin 762 differs from the extension direction of a chord 774 that forms an arc shape of each cut 772 of the second fin 768 (see Fig. 2, Fig. 5, and Fig. 6). In more detail, the extension direction of chord 767 differs from the extension direction of chord 774 by 90 degrees. Furthermore, the heat-absorbing member 760 includes a plurality of fins 780 as an example (see Fig. 4). Each of the first fin 762 and the second fin 768 is an example of the fins 780. Moreover, the first fin 762 is located on a more upstream side between the fins 780. Furthermore, all the fins 780 included in the heat-absorbing member 760 have the same shape as an example. That is, each fin 780 has a shape in which two symmetrical arc-shaped cuts are formed around the center in the form of a thin disc. Furthermore, the extension direction of a chord forming the cut of fin 780 at an odd-numbered position counted from an upstream side is equal to the extension direction of chord 767 of the first fin 762. That is, all fins 780 at odd-numbered positions counted from the upstream side face in the same direction.On the other hand, the extension direction of a chord forming a cut in fin 780 at an even-numbered position counting from the upstream side is equal to the extension direction of chord 774 of the second fin 768. That is, all fins 780 at even-numbered positions counting from the upstream side face the same direction. Furthermore, fin 780 is formed from aluminum, copper, iron, another metal with high thermal conductivity, or similar materials, as an example. Also, in the present description, in a case where gas flowing through a first point flows through a second point after flowing through the first point, the first point is defined on an upstream side of the second point, and the second point is defined on a downstream side of the first point. Through gas inlet 702, the gas containing water vapor is introduced into the inner tube 722 of the outdoor cooling unit 720. Through gas outlet 704, the gas from which water vapor is removed is discharged from the inner tube 722 of the outdoor cooling unit 720. Gas inlet 702 is located above gas outlet 704 in the direction of gravity as an example, and gas inlet 702 can be located below gas outlet 704 in the direction of gravity. Operation The following will describe the operation of the welding device 100. First, the soldering device 100 performs the soldering process in the soldering processing unit 120 (see Fig. 1). In this case, since the circuit board to which the flux paste is applied is used, the flux paste is vaporized, and the interior of the soldering processing unit 120 is filled with the gaseous mixture containing the flux paste component. Next, the separation unit 400 draws the gas mixture from the welding processing unit 120. The separation unit 400 then separates the flux paste from the flux-containing gas mixture using water, generating water vapor and flux-containing water. The flux-containing water is then conveyed from the separation unit 400 to the purification device 600, where it separates and recovers the flux paste. Meanwhile, the water vapor-containing gas is conveyed to the condensation device 700a and enters the inner tube 722 of the outer cooling unit 720 through the gas inlet 702 (see Fig. 4). At this point, in the condensing device 700a, the water, which is the primary cooling medium, passes through the first flow path 726 of the outdoor cooling unit 720, and the water, which is the secondary cooling medium, passes through the second flow path 742 of the indoor cooling unit 740. Consequently, the surface temperatures of the outdoor cooling unit 720 and the indoor cooling unit 740 drop to temperatures at which water can condense from the water vapor-containing gas. Also, the heat absorption member 760 comes into contact with the indoor cooling unit 740, and its surface temperature also drops to a temperature at which water can condense from the water vapor-containing gas.Therefore, the outdoor cooling unit 720, the indoor cooling unit 740, and the heat absorption member 760 can cool the gas flowing through the inside of the inner tube 722 of the outdoor cooling unit 720. The water vapor contained in the gas then condenses inside the inner tube 722. Consequently, the water vapor contained in the gas is removed. Next, the gas from which water vapor is removed in condensing device 700a passes through condensing device 700b and condensing device 700c. At this point, the gas from which water vapor is removed in condensing device 700a also contains the water vapor removed by condensing device 700b and condensing device 700c, just as it did when passing through condensing device 700a. The gas from which water vapor is removed, after passing through condensing device 700c, is then drawn into blower 340. Blower 340 then blows the gas from which water vapor is removed to welding processing unit 120. Operations and Effects The following description will be made regarding the operations and effects of the condensation device 700, the soldering device 100 and the flux paste recovery device 200 in accordance with the present modality. First Effect In the condensing device 700, as previously described, the gas flowing through the inside of the inner tube 722 of the outdoor cooling unit 720 can be cooled by the outdoor cooling unit 720, the indoor cooling unit 740, and the heat absorption member 760. Consequently, in the condensing device 700, the surface area of ​​the portion cooling the water vapor-containing gas is increased compared to a condensing device described in PTL 1. Therefore, in a case where the condensing device 700 removes water vapor from the gas at the same flow rate as in the condensing device described in PTL 1, the device can be made smaller than that of the condensing device described in PTL 1.Also, in a case where the 700 condensing device is the same size as in the condensing device described in PTL 1, water vapor can be removed from a larger quantity of gas. Second Effect In the condensing device 700, the heat-absorbing member 760 includes a plurality of fins 780. Consequently, the condensing device 700 can increase the contact area of ​​the heat-absorbing member 760 more than with a single fin 780. Therefore, the condensing device 700 can cool the water vapor-containing gas more quickly due to the increased contact area. Third Effect The gas flowing in the vicinity of the inner tube 722 of the outdoor cooling unit 720, the indoor cooling unit 740, and the heat absorption member 760 is cooler than the gas flowing through a position further away from the inner tube 722 of the outdoor cooling unit 720, the indoor cooling unit 740, and the heat absorption member 760. Consequently, assuming that no convection of the water vapor-containing gas occurs inside the inner tube 722 of the outdoor cooling unit 720, a temperature difference may develop in the discharged gas depending on the position through which the water vapor-containing gas flows. In this case, there is concern that uncooled gas, still containing a significant amount of water vapor, may pass through the condensing device 700. However, in the condensing device 700, the first fin 762 is arranged to extend in the direction that intersects the L-axis of the indoor cooling unit 740. That is, the first fin 762 is oriented to block the flow of the water vapor-containing gas. Consequently, when the water vapor-containing gas collides with the first fin 762, gas convection occurs inside the inner tube 722 of the outdoor cooling unit 720. Therefore, the condensing device 700 can uniformly cool the water vapor-containing gas. In other words, the condensing device 700 can inhibit the passage of gas that still contains a high concentration of water vapor through the condensing device 700. Fourth Effect In the condensation device 700, it is assumed that the first fin 762 and the second fin 768 are arranged such that the chord extension direction 767 of the first fin 762 is equal to the chord extension direction 774 of the second fin 768. In this case, when gas passes through a portion of the first fin 762 where the notch 766 is formed, it flows directly forward, while gas passes through a portion of the second fin 768 where the notch 772 is formed. Consequently, it is difficult for air to flow between the first fin 762 and the second fin 768, and gas may remain trapped between them. Therefore, since only this gas remains between the first fin 762 and the second fin 768, it is cooled; gas in other positions may be difficult to cool. However, according to the condensation device 700, the extension direction of chord 767 of the first fin 762 differs from the extension direction of chord 774 of the second fin 768 (see Fig. 2, Fig. 5, and Fig. 6). Therefore, in a case where gas passing through a portion of the first fin 762 where the cut 766 is formed flows directly forward, this gas collides with the second fin 768. This causes gas convection between the first fin 762 and the second fin 768. That is, gas retention between the first fin 762 and the second fin 768 is inhibited. Thus, the condensation device 700 can create a uniform gas temperature in the vicinity of the first fin 762 and the second fin 768. Modifications The following will describe the modifications to the condensation device 700 and the flux paste recovery device 200 in accordance with this modality. First Amendment In the condensing device 700, the heat absorption member 760 is in contact with the indoor cooling unit 740. However, the heat absorption member 760 can be in contact with at least one of the outdoor cooling unit 720 and the indoor cooling unit 740. This is because the heat absorption member 760 can cool the gas passing through the inner tube 722 of the outdoor cooling unit 720, while the heat absorption member 760 can be cooled by either the outdoor cooling unit 720 or the indoor cooling unit 740. Second Amendment Also, in the condensing device 700, the indoor cooling unit 740 is in the form of a straight tube. However, the indoor cooling unit 740 can have a shape such as a sphere or a cube. This is because the indoor cooling unit 740 can cool the gas passing through the inner tube 722 of the outdoor cooling unit 720, and the heat absorption member 760, regardless of the shape of the indoor cooling unit 740. Third Amendment Furthermore, in the condensing device 700, the heat absorption member 760 includes a plurality of fins 780, but the heat absorption member 760 may include only one fin 780. Alternatively, the heat absorption member 760 may include the fin 780 in which one, three, or more arc-shaped cuts are formed into a thin disc shape, or it may comprise the fin 780 having any other shape. This is because the heat absorption member 760 can cool the passing gas, whereas the included fins 780 can come into contact with the gas passing through the inner tube 722 of the outdoor cooling unit 720, regardless of the shape or number of fins. Fourth Amendment The water supplied from the purification device 600 is used as both the primary and secondary cooling medium. However, in the condensing device 700, any low-temperature liquid can be used as either the primary or secondary cooling medium, as long as the gas passing through the inner tube 722 of the outdoor cooling unit 720 is cooled and condensation can occur inside the inner tube 722. Second Modality Condensing Device Figure 7 is a structural diagram of a condensation device according to a second embodiment of the present invention. Figure 8 is a cross-sectional view of the condensation device taken along line EE shown in Figure 7. With reference to Fig. 7, a condensing device 800 includes an external cooling unit 820, a gas inlet 802, a gas outlet 804, a distribution chamber 806, and a confluence chamber 808. The condensing device 800 has a tubular shape, as shown in Fig. 7 and Fig. 8. Furthermore, the condensing device 700 according to the first embodiment is replaced by the condensing device 800 according to the present embodiment, for use in the flux paste recovery device 200 and the soldering device 100. ινΐΛ / a / zuzi / ui zi az With reference to Fig. 7, the external cooling unit 820 includes a plurality of inner tubes 822, an outer tube 824 located outside the inner tubes 822, a first flow path 826 through which a first cooling medium passes between the inner tube 822 and the outer tube 824, a first cooling medium inlet 828, and a first cooling medium outlet 830. For example, the first cooling medium inlet 828 is located below the first cooling medium outlet 830 in the direction of gravity. Furthermore, water supplied from a purification device 600 is supplied from the first cooling medium inlet 828 to the first flow path 826 and discharged from the first cooling medium outlet 830. The discharged water is then returned to the purification device 600.Therefore, the water supplied from the 600 purification device is for use as the primary cooling medium. Gas inlet 802 communicates fluid with respective inlets of the inner tube 810 through the distribution chamber 806. Consequently, the gas containing water vapor that is supplied to gas inlet 802 branches in the distribution chamber 806, and is supplied to the respective inner tubes 822 through the respective inlets of the inner tube 810. Gas outlet 804 connects fluid to respective outlets of the inner tube 812 through the confluence chamber 808. Consequently, the gases from which water vapor is removed and which are discharged from the respective gas outlets 804 are joined in the confluence chamber 808, and are discharged from gas outlet 804. Operations and Effects The following description will be made regarding the operations and effects of the 800 condensation device in accordance with the present modality. First Effect The condensing device 800 can cool gas flowing through the interiors of a plurality of inner tubes 822 by the outdoor cooling unit 820. In particular, the condensing device 800 includes the plurality of inner tubes 822, and can therefore cool gas containing water vapor more rapidly than in a case where the device includes only one inner tube 822. Modifications The following description will be made regarding the modifications to the 800 condensing device in accordance with the present modality. First Amendment The condensing device 800 comprises a plurality of inner tubes 822. However, the condensing device 800 may comprise one inner tube 822 instead of a plurality of inner tubes 822. This is because, in this case as well, the condensing device 800 can cool the gas flowing through the inner tube 822 by means of an inner tube 822 of the external cooling unit 820. That is, when the condensing device 800 comprises one, two, or more inner tubes 822, water vapor can be removed from the gas. Second Amendment The condensing device 800 may comprise an indoor cooling unit located inside at least one of a plurality of indoor tubes 822, as in the condensing device 700 of the first embodiment. This is because, in this case, the condensing device 800 can cool the gas flowing through the inside of an indoor tube 822 by the outdoor cooling unit 820 and the indoor cooling unit. Third Amendment The condensing device 800 may comprise, within at least one of the plurality of inner tubes 822, a heat absorption member that comes into contact with the inner tube 822. This is because, in this case, the condensing device 800 can cool the gas flowing through the inner tube 822 by the outer cooling unit 820 and the heat absorption member. The embodiments of the present invention and the respective modifications according to those embodiments have been described above, and it goes without saying that the respective examples have been described above to facilitate understanding of the present invention and are not intended to restrict it. The present invention may be appropriately changed and modified without departing from its scope, and the present invention includes equivalents to the invention. Also, within a range in which at least some of the problems described above can be resolved or in which at least some of the effects are exhibited, any arbitrary combination or omission of the respective constituent components described in the claims and the description is possible. List of reference signs 100: welding device 120: welding processing unit 200: flux paste recovery device 220: bomb 280: water supply tank 300: cooling unit 340: blower 360: pipe 400: separation unit 600: purification device 620: purification tank 640: ozone generator 700, 700a, 700b, 700c and 800: condensing device 702 and 802: gas inlet 704 and 804: gas outlet 806: distribution chamber 808: confluence chamber 720 and 820: outdoor cooling unit 722 and 822: inner tube 724 and 824: outer tube 726 and 826: first flow path 740: indoor cooling unit 742: second flow path 760: heat absorption member 762: first fin 768: second fin

Claims

1. A condensation device comprising: an external cooling unit including two or more inner tubes, an external tube located outside the two or more inner tubes, and a first flow path through which a first cooling medium passes between the two or more inner tubes and the external tube, wherein the two or more inner tubes are in the form of a cylinder.

2. The condensation device according to claim 1, further characterized in that the outer tube has the shape of a cylinder.

3. The condensation device according to claim 1 or 2, further characterized in that the outdoor cooling unit includes a first cooling medium inlet and a first cooling medium outlet, the first cooling medium inlet being located below the first cooling medium outlet in a direction of gravity, and the first cooling medium being configured to be supplied from the first cooling medium inlet to the first flow path and discharged from the first cooling medium outlet. 4 - The condensation device according to any of claims 1 to 3, further characterized in that it additionally comprises: a heat absorption member located inside at least one inner tube in the two or more inner tubes, and which comes into contact with the outdoor cooling unit.

5. The condensation device according to any of claims 1 to 4, further characterized in that it additionally comprises: an inner cooling unit located inside the two or more inner tubes and including a second flow path through which a second cooling medium passes.

6. The condensation device according to claim 5, further characterized in that it additionally comprises: a heat absorption member located inside two or more inner tubes and outside the inner cooling unit, and which comes into contact with the inner cooling unit.

7. The condensation device according to claim 6, further characterized in that the heat absorption member includes a plurality of fins.

8. The condensation device according to claim 6 or 7, further characterized in that the inner cooling unit has a straight tube shape, the inner tube of the outer cooling unit extends in an axial direction from the straight tube shape of the inner cooling unit, and the heat absorption member includes a first fin having a thin plate shape extending in a direction that intersects the axis.

9. The condensation device according to claim 8, further characterized in that the first fin has a shape in which an arc-shaped cut is formed in a thin disc shape, the heat-absorbing member further comprises a second fin having the same shape as the first fin, arranged adjacent to the first fin across a space, and located on a downstream side of the first fin, and an extension direction of a chord forming the arc shape of the cut in the first fin is different from an extension direction of a chord forming an arc shape of a cut in the second fin.

10. A flux paste recovery device that recovers flux paste from a gaseous mixture containing a flux paste component, the flux paste recovery device comprising: a separation unit that separates flux paste from the gaseous mixture by using water, and discharges gas containing water vapor and water containing flux paste, and the condensation device according to any of claims 1 to 9, which removes water vapor from the gas discharged from the separation unit.

11. The flux paste recovery device according to claim 10, further characterized in that it additionally comprises: a purification device to which the flux paste-containing water discharged from the separation unit is supplied, and which separates flux paste from the flux paste-containing water and recovers the flux paste, and a pipe that supplies water separated from the flux paste and purified in the purification device from the purification device to the condensation device. 12 - The flux paste recovery device according to claim 11, subordinate to claim 5, further characterized in that at least one of the first cooling medium and the second cooling medium is water supplied from the purification device.

13. The flux recovery device according to claim 11 or 12, further characterized in that it comprises: a pump that supplies the purified water in the purification device to the separation unit, a cooling unit that cools the purified water in the purification device, and a blower that blows, from the condensation device, the gas from which water vapor is removed in the condensation device.

14. The fluxing paste recovery device according to any of claims 10 to 13, further characterized in that it comprises: a plurality of interconnected condensation devices. 15.- A welding device comprising: a welding processing unit, and the flux paste recovery device of any of claims 10 to 14 that recovers flux paste from a gaseous mixture containing flux paste generated in the welding processing unit.

16. A method of removing water vapor comprising the steps of: allowing a first cooling medium to pass through a first flow path between two or more inner tubes and an outer tube in an outdoor cooling unit including the two or more inner tubes and the outer tube located outside the two or more inner tubes, and allowing, on the insides of the two or more inner tubes, condensation of the water vapor contained in the gas flowing through the insides of the two or more inner tubes, to remove the water vapor contained in the gas, wherein the two or more inner tubes are in the form of a cylinder.

17. The method of removing water vapor according to claim 16, further characterized in that the outer tube has the shape of a cylinder.

18. The method of removing water vapor according to claim 16 or 17, further characterized in that the outdoor cooling unit includes an inlet of the first cooling medium, and an outlet of the first cooling medium, and the inlet of the first cooling medium is located below the outlet of the first cooling medium in a direction of gravity, the method further comprising the steps of: supplying the first cooling medium from the inlet of the first cooling medium to the first flow path, and discharging the first cooling medium from the first outlet of the first cooling medium.

19. The method of removing water vapor according to any of claims 16 to 18, further characterized in that it comprises the steps of: allowing a second cooling medium to pass through a second flow path included in an inner cooling unit located inside the two or more inner tubes, and cooling, by a heat absorption member, gas flowing through an interior of the inner tube, the heat absorption member being located inside the two or more inner tubes of the outer cooling unit and outside the inner cooling unit, the heat absorption member coming into contact with at least one of the outer cooling unit and the inner cooling unit.

20. A method for recovering flux paste comprising the steps of: separating the flux paste from a gaseous mixture containing flux paste by using water, and generating gas containing water vapor and water containing flux paste, separating the flux paste from the water containing flux paste, and recovering the flux paste, and removing water vapor from the generated gas containing water vapor by the water vapor removal method of any of claims 16 to 19.

21. A welding processing method comprising the steps of: performing welding processing in a welding processing unit, recovering flux paste from a gaseous mixture containing flux paste that is generated by welding processing, by the flux paste recovery method of claim 20, and supplying, to the welding processing unit, the gas from which water vapor is removed, the gas being generated by the flux paste recovery method.

22. A condensation device comprising: an outdoor cooling unit including one or two or more inner tubes, an outdoor tube located outside the one or two or more inner tubes, and a first flow path through which a first cooling medium passes between the one or two or more inner tubes and the outdoor tube, and an indoor cooling unit located inside the one or two or more inner tubes and including a second flow path through which a second cooling medium passes.

23. A method for removing water vapor comprising the steps of: allowing a first cooling medium to pass through a first flow path between one or two or more inner tubes and an outer tube in an outdoor cooling unit including the one or two or more inner tubes and the outer tube located outside the one or two or more inner tubes, allowing, in the interiors of the one or two or more inner tubes, the condensation of water vapor contained in the gas flowing through the interiors of the one or two or more inner tubes, to remove water vapor contained in the gas, and allowing a second cooling medium to pass through a second flow path included in an indoor cooling unit located inside the one or two or more inner tubes.