A module for an electric circuit

Abstract

A goal of the current disclosure is to provide a module for electric circuitry having lower parasitic inductance. This is achieved because in an example, the module for an electric circuit comprises a substrate comprising electric circuitry containing a Direct Current, DC, pad and an Alternating Current, AC, pad. In particular, a first group of semiconductor dies is mounted on the AC pad, whereas a second group of semiconductor dies is mounted on the DC pad. Furthermore, the module comprises a first DC terminal electrically connected to the first group of semiconductor dies, a second DC terminal being electrically isolated from the first DC terminal, and at least electrically connected to the DC pad of the electric circuitry, and an Alternating Current, AC, terminal at least connected to the AC pad of the electric circuitry. Also, the module comprises first connecting means for electrically connecting the first group of semiconductor dies to the AC pad, second connecting means for electrically connecting the second group of semiconductor dies to the DC pad, and third connecting means for electrically connecting the second group of semiconductor dies to the AC pad.