Collapsible faraday enclosure system and methods of deploying and manufacturing same
The collapsible Faraday enclosure system addresses the limitations of existing Faraday cages by providing a user-repairable and portable solution with device operability, enhancing efficiency and reducing costs in digital forensics investigations.
Patent Information
- Application Number
- PCT/US2025/045987
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2024-09-11
- Filing Date
- 2025-09-11
- Publication Date
- 2026-03-19
AI Technical Summary
Existing Faraday cages are either too heavy and bulky for field use or lack user-repairability and device operability, leading to high costs and inefficiencies in digital forensics investigations.
A collapsible Faraday enclosure system that is user-repairable, portable, and allows full mobile device operability, featuring a Faraday shell, application interface plate, panel stiffener subsystem, and RF-shielding window, enabling easy assembly and disassembly for transport and component replacement.
Enables efficient and cost-effective digital forensics investigations by allowing investigators to continue operations despite component failures, reducing downtime and transportation challenges.
Smart Images

Figure US2025045987_19032026_PF_FP_ABST
Abstract
Description
COLLAPSIBLE FARADAY ENCLOSURE SYSTEM AND METHODS OF DEPLOYING AND MANUFACTURING SAMERELATED APPLICATIONS
[0001] This application claims the benefit of U.S. Provisional Application No. 63 / 693,638 filed September 11, 2024, the content of which is incorporated by this reference in its entirety for all purposes as if fully set forth herein.TECHNICAL FIELD
[0002] The present disclosure relates generally to the field of electromagnetic shielded enclosures.BACKGROUND
[0003] Faraday cages serve critical roles in various applications, including wireless device testing, data security, and digital forensics investigations. Despite the numerous Faraday cage and analysis enclosure products available, they often exhibit a homogeneity in features, derived from existing designs. Existing products may not be field-repairable, portable, and device-operable in one single enclosure, a set of features that has become desirable for some digital forensics investigators and operators.
[0004] User-Repairable enclosures (those that may allow replacement of components like gloves, filters, gaskets, transparent RF windows, and others), such as desktop hard-sided RF metal boxes, may be too heavy and bulky to transport and use outside of an office or lab. At the same time, portable enclosures (those that may be lightweight and fold / unfold for portability and use outside of a lab) may not be user-repairable, but instead combined permanently together with gloves, filters, fabric shell, and other components in one single manufacturer assembly. These portable enclosures with permanently combined components may be expensive and may become entirely useless upon failure of any one individual component, an occurrence that is sure to happen over the life of the product. When a singlecomponent in this type of enclosure fails, the user no longer enjoys the capability of the product and may be forced to either trash the enclosure or send it back to the manufacturer for repair, both of which may be expensive and time-consuming options. Finally, other more affordable enclosures in the market may not offer device operability by way of hand / glove access to manipulate device screens, a feature that may be desired to properly conduct digital forensics investigations.
[0005] What is needed in the market is an RF shielded enclosure that is user-repairable, portable, and allows for full mobile device operability. Digital forensics investigators, as well as other various users, desire a lightweight product that can be folded down for efficient transport, expanded easily when required for use, fully operable with hand manipulation of mobile devices inside of the enclosure, and easily user-repairable when any given component may fail. An RF enclosure that embodies all of these characteristics may allow digital forensics investigators to save significant time and money, and to continue conducting vital investigations despite setbacks such as component failure in the field.SUMMARY
[0006] Exemplary implementations of a collapsible Faraday enclosure system, methods for deploying the system, and methods for manufacturing the system in accordance with the present disclosure address deficiencies of the conventional art.BRIEF DESCRIPTION OF THE DRAWINGS
[0007] Further advantages of the present invention may become apparent to those skilled in the art with the benefit of the following detailed description of the preferred implementations and upon reference to the accompanying drawings in which:
[0008] FIG. 1 is a perspective view of one example collapsible Faraday enclosure system shown in a deployed configuration;
[0009] FIG. 2 is a perspective view of the collapsible Faraday enclosure system of FIG.1 shown in a collapsed configuration;
[0010] FIG. 3 is a perspective view of an example Faraday shell having an RF-shielding window in window mounted engagement therewith;
[0011] FIG. 4 is a perspective view of an example Faraday shell with the rear section having an access mouth portion;
[0012] FIG. 5 is a further perspective view of a Faraday shell of FIG. 4;
[0013] FIG. 6 is a perspective view of a Faraday shell showing a modular jig assembly supporting the internal compartment in a volumetrically expanded configuration for an application interface plate to be fastened to the application section;
[0014] FIG. 7 is a perspective view of an interior compartment of a Faraday shell, showing the application section clampingly disposed between the application interface plate and an inner clamp bracket;
[0015] FIG. 8 is a perspective view similar to FIG. 7, but wherein a panel stiffener subsystem is shown supporting the interior compartment in a volumetrically expanded configuration;
[0016] FIGS. 9A-12B show a series of steps for mounting a first transparent shielding panel in first panel mounted engagement with a first shielding layer;
[0017] FIGS. 13A-16B show a series of steps for mounting a second transparent shielding panel in second panel mounted engagement with a second shielding layer;
[0018] FIGS. 17A-18B show a series of steps for securing the first shielding layer in port aligning engagement with second shielding layer;
[0019] FIG. 19A is a perspective view of an example first access mouth flap showing a step of affixing a magnetically receptive strip thereto by way of single-sided conductive tape;
[0020] FIG. 19B is a cross-sectional view taken along lines 19B-19B in FIG. 19A;
[0021] FIG. 20A is a perspective view of an example second access mouth flap showing a step of affixing a plurality of flap magnets thereto by way of single-sided conductive tape;
[0022] FIG. 20B is a cross-sectional view taken along lines 20B-20B in FIG. 20A;
[0023] FIG. 21 A is a perspective view of the first access mouth flap of FIG. 19A and the second access mouth flap of FIG. 20A, showing the step of taping the respective first and second lateral end portions together;
[0024] FIG. 21B is a cross-sectional view taken along lines 21B-21B in FIG. 21A, showing the access mouth flaps in flap magnetic engagement with one another defining a mouth closure junction therebetween;
[0025] FIG. 21C is a cross-sectional view similar to FIG. 2 IB, but wherein the first and second access mouth flaps are shown pulled apart;
[0026] FIG. 22 is a perspective view showing an example RF-shielding filter fasteningly engaged with an example filter mount adaptor;
[0027] FIG. 23 is a perspective view of the RF-shielding filter of FIG. 22 in filter mounted engagement with a corresponding device mount portion by way of the filter mount adaptor;
[0028] FIG. 24 is a partial perspective view of the application interface plate of FIG. 23, showing an electrical receptacle of the RF-shielding filter accessible from an ambient environment;
[0029] FIG. 25 is a perspective view of a Faraday shell and a panel stiffener subsystem, showing the step of inserting the panel stiffener subsystem through an access mouth port;
[0030] FIG. 26 is a perspective view of the interior compartment of FIG. 25, wherein the second lateral stiffener element has been fully inserted and unfolded;
[0031] FIG. 27 is a perspective view similar to FIG. 26, but wherein the first lateral stiffener element has also been fully inserted, and the lateral stiffener elements are shown in a precursor configuration prior to being placed in lateral linking engagement with one another;
[0032] FIG. 28 is a perspective view of a pair of lateral stiffener elements shown in a precursor configuration prior to being placed in lateral linking engagement with one another by way of mutual magnetic engagement;
[0033] FIG. 29A is a perspective view of a further implementation of panel stiffener subsystem in a deployed configuration, the subsystem having an upper bracing element;
[0034] FIG. 29B is a diagrammatic cross-sectional view taken along lines 29B-29B in FIG. 29A, but wherein the upper bracing element is shown in panel supporting engagement with an upper panel, and the first bracing arm and the second bracing arm shown magnetically engaged in arm linking engagement with one another;
[0035] FIG. 29C is a diagrammatic cross-sectional view similar to FIG. 29B, but wherein the first bracing arm and the second bracing arm are shown disconnected from one another;
[0036] FIG. 29D is a cross-sectional view similar to FIG. 29C, but wherein the lower linking portions are shown disconnected from the lateral linking engagement;
[0037] FIG. 29E is a cross-sectional view similar to FIG. 29D, but wherein the lateral stiffener elements have been folded, thereby moving the panel stiffener subsystem to the folded configuration;
[0038] FIG. 30 is a perspective view of a modular jig assembly in a jig deconstructed configuration;
[0039] FIG. 31 is a perspective view of the modular jig assembly of FIG. 30 in a jig support configuration;
[0040] FIG. 32 is a partial cross-sectional view taken along lines 32-32 in FIG. 1, showing the application section clampingly disposed between the application interface plate and an inner clamp bracket;
[0041] FIG. 33 is a partial cross-sectional view similar to FIG. 32, but wherein a further implementation of the system is shown having an outer clamp bracket disposed between the application section and the application interface plate;
[0042] FIG. 34 is a cross-sectional view similar to FIG. 19B, but wherein a further implementation of the first access mouth flap is shown, showing the step of peeling prior to pressing;
[0043] FIG. 35 is a cross-sectional view similar to FIG. 34, but wherein the outer peel layer has been peeled off and the adhesive backing has been pressed against the first magnetic interface portion;
[0044] FIG. 36 is a cross-sectional view similar to FIG. 20B, but wherein a further implementation of the second access mouth flap is shown, showing the step of peeling prior to pressing;
[0045] FIG. 37 is a cross-sectional view similar to FIG. 36, but wherein the outer peel layers have been peeled off and the adhesive backings have been pressed against the second magnetic interface portion;
[0046] FIG. 38 is a cross-sectional view of the first access mouth flap of FIG. 35 and the second access mouth flap of FIG. 37 in magnetic flap engagement with one another defining a mouth closure junction therebetween;
[0047] FIG. 39 is a cross-sectional view similar to FIG. 38, but wherein the first and second access mouth flaps are shown pulled apart;
[0048] FIG. 40 is a diagrammatic cross-sectional view of a collapsible Faraday enclosure system showing an access mouth portion in the mouth open configuration;
[0049] FIG. 41 is a diagrammatic cross-sectional view similar to FIG. 40, but wherein the access mouth portion is in the mouth closed configuration and the system is electromagnetically sealed, RF signals being shown shielded from passing between an ambient environment and the interior compartment by way of a mouth closure junction, a window interface junction, a first window junction, and a second window junction;
[0050] FIG. 42 is a flow diagram showing a plurality of steps for a method of deploying a collapsible Faraday enclosure system;
[0051] FIG. 43 is a flow diagram showing a plurality of steps for a method of manufacturing a collapsible Faraday enclosure system;
[0052] FIG. 44 is a flow diagram showing a plurality of steps for integrating a RF- shielding window into a Faraday shell; and
[0053] FIG. 45 is a flow diagram showing a plurality of steps for constructing a pair of access mouth flaps.DETAILED DESCRIPTION OF PREFERRED EMBODIMENTS
[0054] Referring now to the drawings, like reference numerals designate identical or corresponding features throughout the several views.
[0055] With reference to the several drawings, implementations of a collapsible Faraday enclosure system are shown generally at 100. The collapsible Faraday enclosure system 100 may also be referred to herein as the system 100. Implementations of a method of deploying a collapsible Faraday enclosure system are shown generally at 300. The method of deploying a collapsible Faraday enclosure system may also be referred to herein as the method of deploying 300. Implementations of a method of manufacturing a collapsible Faradayenclosure system are shown generally at 400. The method of manufacturing a collapsible Faraday enclosure system may also be referred to herein as the method of manufacturing 400.
[0056] Anywhere a letter is used in conjunction with a reference number in the present specification and drawings, it is intended to identify a specific instance of the general case. For example, a lateral stiffener element is shown generally at 108 and specific instances of the lateral stiffener element 108 may be denoted at 108a- 108b. In certain implementations of the system 100, the method of deploying 300, and the method of manufacturing 400, each of these instances may be structurally identical to one another while in other implementations the feature sets may differ from one another.
[0057] In the present specification, unless the particular nature of a fastener is described or claimed, the term fastener may be used to denote fastening by way of adhesion, a rivet, a bolt, a screw, a nail, a nut, some combination thereof, or the like.
[0058] Referring to FIGS. 1-2, a collapsible Faraday enclosure system 100 may be convertible between a collapsed configuration and a deployed configuration.
[0059] Referring to FIG. 6, the system 100 may comprise a Faraday shell 102 that defines an interior compartment 110. In some implementations of the system 100, the Faraday shell 102 may be constructed from a single panel that is sewn, heat sealed, or otherwise joined together to form the Faraday shell 102. In other implementations of the system 100, the Faraday shell 102 may be formed from two or more panels joined at their edges. The Faraday shell 102 may be made of polyester, copper, nickel, or other conductive textiles. The Faraday shell 102 may instead use metal sheets, wood, carbon fiber, plastic, foam, or fabric with conductive outer layers. Panels may be joined by sewing, adhesives, heat sealing, ultrasonic welding, snaps, or magnets.
[0060] The system 100 may further comprise an application interface plate 104. The application interface plate 104 may facilitate mounting one or more application devices 130 to the Faraday shell 102. For example, the application interface plate 104 may permit attachment of RF-shielding gloves 130a, RF-shielding filters 130b, an RF-shielding window 130c, an adapter plate, a solid plate, a thermometer, a cable interface, a light, a tray, a phone holder, oranother suitable attachment such as a camera, viewing screen, tablet, or mobile phone. The application interface plate 104 may be constructed from alodine-coated aluminum, silver, copper, gold, zinc, nickel, brass, bronze, iron, platinum, lead, stainless steel, or another conductive solid material. In some implementations of the system 100, the plate may instead be made from non-conductive material with a conductive outer shell or coating.
[0061] Referring to FIG. 8, the system 100 may further comprise a panel stiffener subsystem 106. The panel stiffener subsystem 106 may be movable between an extended configuration and a folded configuration (see, for example, FIGS. 29B and 29E). The panel stiffener subsystem 106 may include a pair of lateral stiffener elements 108. The lateral stiffener elements 108 may unfold into an “L,” “U,” “W,” “M,” or other shapes.
[0062] In certain implementations of the system 100, when the system 100 is in the deployed configuration, the panel stiffener subsystem 106 may be in the extended configuration, and the interior compartment 110 may be supported in a volumetrically expanded configuration by way of the panel stiffener subsystem 106.
[0063] In particular implementations of the system 100, when the system 100 is in the collapsed configuration, the panel stiffener subsystem 106 may be in the folded configuration (see, for example, FIG. 29E), and the interior compartment 110 may be in a volumetrically contracted configuration (see, for example, FIG. 2). The volumetrically contracted configuration may reduce the overall size of the system 100 for storage or transport. In some implementations of the system 100, the panel stiffener subsystem 106 may be stored within the interior compartment 110 while the system 100 is in the collapsed configuration. In other implementations of the system 100, the panel stiffener subsystem 106 may be stored outboard of the interior compartment 110 when the system 100 is in the collapsed configuration.
[0064] Referring to FIGS. 29B-29C, in certain implementations of the system 100, when the panel stiffener subsystem 106 is in the extended configuration, the pair of lateral stiffener elements 108 may be in lateral linking engagement with one another. This lateral linking engagement may improve rigidity and prevent the system 100 from buckling.
[0065] Referring to FIG. 28, in certain implementations of the system 100, each lateral stiffener element 108 may include a horizontal stiffener plate 114 and a vertical stiffener plate 116. The horizontal stiffener plate 114 and the vertical stiffener plate 116 may be hingedly associated with one another by way of a stiffener plate hinge element 118. The lateral stiffener elements 108 may be fabricated from carbon fiber, plastic, metal, wood, cardboard, fiberglass, or other materials, and may use stiffener plate hinge elements 118 such as 90° hinges, Kevlar hinges, piano hinges, self-opening hinges, or flexible joints such as tape or adhesive seams. This hinged association may allow the lateral stiffener elements 108 to fold flat when not in use.
[0066] In particular implementations of the system 100, each lateral stiffener element 108 may include a lower linking portion 120. The lateral linking engagement may be by way of mutual magnetic engagement between the lower linking portions 120. The magnetic connection may allow quick alignment and stabilization of the stiffener elements 108 without mechanical fasteners. Other implementations of the system 100 may include mechanical mutual engagement, such as, for example, snaps, clips, ridges and grooves, some combination thereof, or the like between the lower linking portions 120. Some implementations of the system 100 may include a combination of both mechanical and magnetic engagement between the lateral stiffener elements 108.
[0067] In certain implementations of the system 100, the horizontal stiffener plate 114 of a first lateral stiffener element 108a may include a first upper face 122a and a first lower face 124a disposed oppositely of one another. The horizontal stiffener plate 114 of a second lateral stiffener element 108b may include a second upper face 122b and a second lower face 124b disposed oppositely of one another. The lower linking portion 120 of the first lateral stiffener element 108a may include one or more first linking magnets 126 in adhesive communication with the first lower face 124a. The lower linking portion 120 of the second lateral stiffener element 108b may include one or more second linking magnets 128 in adhesive communication with the second upper face 122b. The mutual magnetic engagement may be between the one or more first linking magnets 126 and the one or more second linking magnets 128. This face-to-face magnet placement may facilitate a strong and repeatable linking force when the system 100 is deployed.
[0068] Referring to FIGS. 1 and 7-8, in particular implementations of the system 100, the Faraday shell 102 may include a pair of lateral panels 138 disposed oppositely of one another, a rear section 146 and an application section 144 disposed oppositely of one another, and a lower panel 142 and an upper panel 140 disposed oppositely of one another. When the system 100 is in the deployed configuration, the lateral stiffener elements 108 may each be in laterally stiffening engagement with a respective lateral panel 138.
[0069] Referring to FIGS. 29A-29E, in certain implementations of the system 100, the panel stiffener subsystem 106 may include an upper bracing element 132 having a pair of oppositely disposed bracing ends 134 and an upper panel support section 136. The upper panel support section 136 may span between the bracing ends 134, with each bracing end 134 affixed to a respective lateral stiffener element 108. Each bracing end 134 may be, for example, hingedly affixed to the respective lateral stiffener element 108. When the system 100 is in the deployed configuration, the upper panel support section 136 may be in panel supporting engagement with the upper panel 140. The upper panel support section 136 may serve as a lid support, sensor mount, or lighting bracket. The upper bracing element 132 may create a outward force that helps prevent the lateral stiffener elements 108 from folding in on themselves when, for example, the system 100 is in the deployed configuration.
[0070] In particular implementations of the system 100, the upper panel support section 136 may be comprised of a first bracing arm 148 and a second bracing arm 150. When the system 100 is in the deployed configuration, the first bracing arm 148 and the second bracing arm 150 may be in arm linking engagement with one another. When the system 100 is in the collapsed configuration, the first bracing arm 148 and the second bracing arm 150 may be disconnected from one another. This linkage may provide rigidity in the deployed state while allowing compact folding in the collapsed state (see, for example, FIG. 29E).
[0071] In certain implementations of the system 100, the arm linking engagement may be by way of the first bracing arm 148 and the second bracing arm 150 being magnetically engaged with one another.
[0072] Referring to FIG. 3, in particular implementations of the system 100, an RF- shielding window 130c may be in window mounted engagement with the Faraday shell 102.The RF-shielding window 130c may be constructed from two layers of nickel and copper impregnated fabric arranged perpendicularly, or from copper fabric, nickel fabric, gold fabric, silver fabric, glass, conductive glass, carbon nanotubes, or other conductive transparent materials. This window mounted engagement may permit external observation of the interior compartment 110 while maintaining RF shielding integrity of the Faraday shell 102 (see, for example, FIG. 41).
[0073] Referring to FIGS. 17A and 18 A, in certain implementations of the system 100, the RF-shielding window 130c may include a first transparent shielding panel 152 and a second transparent shielding panel 154. The transparent shielding panels (152, 154) may allow visible light transmission while blocking RF signals 206.
[0074] In particular implementations of the collapsible Faraday enclosure system 100, the upper panel 140 may include a first shielding layer 156 having a first window port 160 extending therethrough, with a first interface portion 164 being defined peripherally about the first window port 160 (see, for example, FIGS 10A-10B). The upper panel 140 may further include a second shielding layer 158 having a second window port 162 extending therethrough, with a second interface portion 166 being defined peripherally about the second window port 162 (see, for example, FIGS. 14A-14B). The first transparent shielding panel 152 may be in first panel mounted engagement with the first shielding layer 156 along the first interface portion 164 (see, for example, FIGS. 12A-12B). The second transparent shielding panel 154 may be in second panel mounted engagement with the second shielding layer 158 along the second interface portion 166 (see, for example, FIGS. 16A-16B). The first shielding layer 156 may be in port aligning engagement with the second shielding layer 158 (see, for example, FIGS. 18A-18B). This layered arrangement may enhance shielding performance by creating redundant barriers at the window interface junction 204.
[0075] Referring to FIGS. 9A-18B, in certain implementations of the collapsible Faraday enclosure system 100, the first panel mounted engagement, the second panel mounted engagement, and the port aligning engagement may each be secured by way of conductive tape 168. The conductive tape 168 may electrically bond adjacent layers while maintaining flexibility for user repair or replacement of the RF-shielding window 130c.
[0076] Referring to FIGS. 7 and 32-33, in certain implementations of the collapsible Faraday enclosure system 100, the application section 144 may be clampingly disposed between the application interface plate 104 and an inner clamp bracket 170.
[0077] Referring to FIG. 33, in particular implementations of the collapsible Faraday enclosure system 100, the system 100 may further comprise an outer clamp bracket 172. The clamping may be by way of the inner clamp bracket 170 being fastened to the outer clamp bracket 172, with the application section 144 disposed between the inner clamp bracket 170 and the outer clamp bracket 172. The application interface plate 104 may be fastened to the outer clamp bracket 172.
[0078] Referring to FIGS. 1 and 7, in certain implementations of the collapsible Faraday enclosure system 100, the application interface plate 104 may include a plurality of device mount portions 174. A first application device 130 may be an RF-shielding glove 130a, with the application interface plate 104 having a corresponding device mount portion 174 configured to be placed in glove mounted engagement with the RF-shielding glove 130a. A second application device 130 may be an RF-shielding filter 130b, with the application interface plate 104 having a corresponding device mount portion 174 configured to be placed in filter mounted engagement with the RF-shielding filter 130b. In some implementations of the system 100, the RF-shielding glove 130a may be constructed of one or more layers of flexible shielded fabric that allow stretch in multiple directions. Alternatives may include rectangular pockets, tubes, socks, or stylus-based manipulators extending through the enclosure. The application devices 130 may be replaceable by a user by way of the respective device mount portions 174.
[0079] Referring to FIGS. 22-24, particular implementations of the system 100 may comprise a filter mount adaptor 176. A device mount portion 174 may include a filter port 180 extending through the application interface plate 104 and a plurality of filter mount apertures 184 disposed peripherally about the filter port 180. In the filter mounted engagement, the RF- shielding filter 130b may be fasteningly engaged with the filter mount adaptor 176. The filter mount adaptor 176 may be fasteningly engaged with the respective device mount portion 174 by way of the filter mount apertures 184. An electrical receptacle 182 of the RF-shielding filter130b may be accessible from an ambient environment 112 through the filter port 180. This adaptor-based connection may enable quick filter replacement.
[0080] Referring to FIGS. 4 and 40-41, in certain implementations of the collapsible Faraday enclosure system 100, the rear section 146 may include an access mouth portion 192 defined by a pair of access mouth flaps 194. The access mouth portion 192 may be moveable between a mouth open configuration and a mouth closed configuration. When the access mouth portion 192 is in the mouth open configuration, an access mouth port 196 may be defined between the access mouth flaps 194, and the interior compartment 110 may be accessible from an ambient environment 112 through the access mouth port 196. This opening may allow users to insert or remove devices without disassembling the system 100.
[0081] Referring to FIGS. 21B, 38, and 41, in particular implementations of the collapsible Faraday enclosure system 100, the access mouth portion 192 may be configured to be secured in the mouth closed configuration by way of flap magnetic engagement between the access mouth flaps 194. The flap magnetic engagement may define a mouth closure junction 198 between the access mouth flaps 194 and may be configured to shield RF signals 206 from passing through the mouth closure junction 198 between the ambient environment 112 and the interior compartment 110. In some implementations of the system 100, the access mouth portion 192 may include multiple magnetic strips, magnet-receiving strips, or other closure means such as zippers, snaps, latches, Velcro, adhesives, or welds. The magnetic strips may be covered with conductive adhesive tape, conductive fabric, conductive coating, or may not be covered at all.
[0082] Now referring to FIG. 42, a method of deploying a collapsible Faraday enclosure system 300 may include a plurality of steps represented, for example, by blocks 305- 340. With further reference to FIG. 2, the method of deploying 300 may comprise, at block 305, providing the collapsible Faraday enclosure system 100 in a collapsed configuration.
[0083] With further reference to FIGS. 1, 6, 7-8, and 29E, the collapsible Faraday enclosure system 100 may include a Faraday shell 102 defining an interior compartment 110, an application interface plate 104 configured to facilitate mounting one or more application devices 130 to the Faraday shell 102, and a panel stiffener subsystem 106. The panel stiffenersubsystem 106 may be movable between an extended configuration and a folded configuration, and may include a pair of lateral stiffener elements 108. The Faraday shell 102, application interface plate 104, and panel stiffener subsystem 106 may be as described in connection with the collapsible Faraday enclosure system 100 above.
[0084] In certain implementations of the method of deploying 300, when the collapsible Faraday enclosure system 100 is in the collapsed configuration, the panel stiffener subsystem 106 may be in the folded configuration, and the interior compartment 110 may be in a volumetrically contracted configuration.
[0085] At block 315, with further reference to FIGS. 8 and 29B-29E, the method of deploying 300 may further comprise moving the panel stiffener subsystem 106 into the extended configuration, thereby supporting the interior compartment 110 in a volumetrically expanded configuration.
[0086] In particular implementations of the method of deploying 300, when the panel stiffener subsystem 106 is in the extended configuration, the lateral stiffener elements 108 may be in lateral linking engagement with one another.
[0087] In certain implementations of the method of deploying 300, with further reference to FIGS. 26-27, moving the panel stiffener subsystem 106 into the extended configuration may be by way of, at block 320, unfolding the lateral stiffener elements 108 and, at block 325, placing the pair of lateral stiffener elements 108 into lateral linking engagement with one another. The lateral stiffener elements 108 may be as described in connection with the collapsible Faraday enclosure system 100.
[0088] In particular implementations of the method of deploying 300, each lateral stiffener element 108 may include a lower linking portion 120. The lateral linking engagement may be by way of mutual magnetic engagement between the lower linking portions 120.
[0089] In certain implementations of the method of deploying 300, with further reference to FIG. 25, the method may further comprise, prior to the step of moving, at block 310, inserting the panel stiffener subsystem 106 from an ambient environment 112 into theinterior compartment 110. This insertion step may allow the panel stiffener subsystem 106 to be transported separately from the Faraday shell 102 and then deployed inside when needed.
[0090] In particular implementations of the method of deploying 300, with further reference to FIGS. 25 and 40-41, the Faraday shell 102 may include an access mouth portion 192 defined by a pair of access mouth flaps 194. The access mouth portion 192 may be moveable between a mouth open configuration and a mouth closed configuration. When the access mouth portion 192 is in the mouth open configuration, an access mouth port 196 may be defined between the access mouth flaps 194. The step of inserting the panel stiffener subsystem 106 may be carried out through the access mouth port 196. This arrangement may allow the panel stiffener subsystem 106 to be positioned into the interior compartment 110 without requiring disassembly of the Faraday shell 102.
[0091] In certain implementations of the method of deploying 300, with further reference to FIGS. 29A-29E, the panel stiffener subsystem 106 may include an upper bracing element 132 having a pair of oppositely disposed bracing ends 134 and an upper panel support section 136. The upper panel support section 136 may span between the bracing ends 134, with each bracing end 134 affixed to a respective lateral stiffener element 108. The method of deploying 300 may further comprise, at block 330, positioning the upper panel support section 136 into panel supporting engagement with an upper panel 140 of the Faraday shell 102.
[0092] In particular implementations of the method of deploying 300, the upper panel support section 136 may be comprised of a first bracing arm 148 and a second bracing arm 150. The step of positioning may include, at block 335, placing the first bracing arm 148 and the second bracing arm 150 into arm linking engagement with one another.
[0093] In certain implementations of the method of deploying 300, the arm linking engagement may be by way of the first bracing arm 148 and the second bracing arm 150 being magnetically engaged with one another.
[0094] In particular implementations of the method of deploying 300, when the system 100 is in the collapsed configuration, the application interface plate 104 may be disconnected from the Faraday shell 102. With further reference to FIGS. 2, 6, 32, and 33, the method ofdeploying 300 may further comprise, at block 340, fastening the application interface plate 104 to the Faraday shell 102. One or more fastener elements may be used for fastening the application interface plate 104 to the Faraday shell 102, being a screw, rivet, zip tie, magnet, clip, interlocking tab, adhesive, welding joint, hook-and-lock mechanism, or another type of fastening hardware. In some embodiments, attachment may be achieved without through- penetration of fabric by way of magnetic compression or clamp-style assemblies. This step may allow the application interface plate 104 to be stored separately during transport and then reattached during deployment.
[0095] Referring to FIGS. 43-35, a method of manufacturing a collapsible Faraday enclosure system 400 may include a plurality of steps represented, for example, by blocks 400- 450. With further reference to FIGS. 1-2 and 6, a method of manufacturing 400 may comprise, at block 415, forming a Faraday shell 102 that defines an interior compartment 110.
[0096] The method of manufacturing 400 may further comprise, at block 420, fastening an application interface plate 104 to the Faraday shell 102. The application interface plate 104 may be configured to facilitate mounting one or more application devices 130 to the Faraday shell 102. One or more fastener elements may be used for fastening the application interface plate 104 to the Faraday shell 102, being a screw, rivet, zip tie, magnet, clip, interlocking tab, adhesive, welding joint, hook-and-lock mechanism, or another type of fastening hardware. In some implementations, attachment may be achieved without through-penetration of fabric by way of magnetic compression or clamp-style assemblies.
[0097] With further reference to FIGS. 29B and 29E, the method of manufacturing 400 may further comprise, at block 425, assembling a panel stiffener subsystem 106 that is movable between an extended configuration and a folded configuration. The panel stiffener subsystem 106 may include a pair of lateral stiffener elements 108. The panel stiffener subsystem 106 may be as described in connection with the collapsible Faraday enclosure system 100.
[0098] With further reference to FIG. 8, in certain implementations of the method of manufacturing 400, when the system 100 is in the deployed configuration, the panel stiffener subsystem 106 may be in the extended configuration, and the interior compartment 110 maybe supported in a volumetrically expanded configuration by way of the panel stiffener subsystem 106.
[0099] In particular implementations of the method of manufacturing 400, when the system 100 is in the collapsed configuration, the panel stiffener subsystem 106 may be in the folded configuration (see, for example, FIG. 29E), and the interior compartment 110 may be in a volumetrically contracted configuration (see, for example, FIG. 2).
[0100] In certain implementations of the method of manufacturing 400, when the panel stiffener subsystem 106 is in the extended configuration, the lateral stiffener elements 108 may be in lateral linking engagement with one another (see, for example, FIGS. 29A-29B).
[0101] With further reference to FIG. 3, certain implementations of the method of manufacturing 400 may comprise, at block 430, integrating an RF-shielding window 130c into the Faraday shell 102.
[0102] In particular implementations of the method of manufacturing 400, the step of integrating may include, at block 431, cutting a first window port 160 out of a first shielding layer 156 (see, for example, FIGS. 9A-9B) and a second window port 162 out of a second shielding layer 158 (see, for example, FIGS. 13A-13B). A first interface portion 164 may be defined peripherally about the first window port 160 (see, for example, FIGS. 10A-10B), and a second interface portion 166 may be defined peripherally about the second window port 162 (see, for example, FIGS. 14A-14B). The first shielding layer 156 and the second shielding layer 158 may together define an upper panel 140 of the Faraday shell 102 (see, for example, FIGS. 40-41). The step of integrating may further include, at block 432, mounting a first transparent shielding panel 152 in first panel mounted engagement with the first shielding layer 156 along the first interface portion 164 (see, for example, FIGS. 11A-12B), at block 433, mounting a second transparent shielding panel 154 in second panel mounted engagement with the second shielding layer 158 along the second interface portion 166 (see, for example, FIGS. 15A-16B), and, at block 434, securing the first shielding layer 156 in port aligning engagement with the second shielding layer 158 (see, for example, FIGS. 17A-18B).
[0103] In certain implementations of the method of manufacturing 400, the port aligning engagement may define a window interface junction 204 between the first interface portion 164 and the second interface portion 166 (see, for example, FIG. 18B). The port aligning engagement may be configured to shield RF signals 206 from passing through the window interface junction 204 between the interior compartment 110 and an ambient environment 112 (see, for example FIG. 41).
[0104] With further reference to FIGS. 9A-18B, in particular implementations of the method of manufacturing 400, the first panel mounted engagement, the second panel mounted engagement, and the port aligning engagement may each be secured by way of conductive tape 168.
[0105] With further reference to FIGS. 12A-12B and 18A-18B, in certain implementations of the method of manufacturing 400, the conductive tape 168 securing the first panel mounted engagement and the port aligning engagement may include one or more lengths of double-sided conductive tape 168b.
[0106] In particular implementations of the method of manufacturing 400, with further reference to FIG. 12B, the first transparent shielding panel 152 may include a first panel inboard surface 208 and a first panel outboard surface 210 disposed oppositely of one another. The first shielding layer 156 may include a first layer inboard surface 216 and a first layer outboard surface 218 disposed oppositely of one another. With further reference to FIG. 16B, the second shielding layer 158 may include a second layer inboard surface 220 and a second layer outboard surface 222 disposed oppositely of one another. The one or more lengths of double-sided conductive tape 168b may each be in adhesive communication with the first layer outboard surface 218 along the first interface portion 164 (see, for example, FIG. 12B), a peripheral portion 153 of the first panel inboard surface 208 (see, for example, FIG. 12B), and the second layer inboard surface 220 along the second interface portion 166 (see, for example, FIG. 18B).
[0107] With further reference to FIGS. 12B and 41, in certain implementations of the method of manufacturing 400, the first panel mounted engagement may define a first window junction 224 between the peripheral portion 153 of the first panel inboard surface 208 and thefirst layer outboard surface 218 along the first interface portion 164. The first panel mounted engagement may further be configured to shield RF signals 206 from passing through the first window junction 224 between the ambient environment 112 and the interior compartment 110.
[0108] With further reference to FIGS. 16A-16B, in particular implementations of the method of manufacturing 400, the conductive tape 168 securing the second panel mounted engagement may include one or more lengths of single-sided conductive tape 168a.
[0109] With further reference to FIG. 16B, in certain implementations of the method of manufacturing 400, the second transparent shielding panel 154 may include a second panel inboard surface 212 and a second panel outboard surface 214 disposed oppositely of one another. The one or more lengths of single-sided conductive tape 168a may each be adhered to the second layer outboard surface 222 along the second interface portion 166 and to a peripheral portion 155 of the second panel outboard surface 214.
[0110] With further reference to FIGS. 16B and FIG. 41, in particular implementations of the method of manufacturing 400, the second panel mounted engagement may define a second window junction 226 between the peripheral portion 155 of the second panel outboard surface 214 and the second layer outboard surface 222 along the second interface portion 166. The second panel mounted engagement may further be configured to prevent RF signals 206 from passing through the second window junction 226 between the ambient environment 112 and the interior compartment 110.[OHl] With further reference to FIGS. 19A-21C, certain implementations of the method of manufacturing 400 may comprise, at block 435 constructing a pair of access mouth flaps 194. With further reference to FIG. 4, the method of manufacturing 400 may comprise, at block 440, attaching the access mouth flaps 194 to the Faraday shell 102, thereby defining an access mouth portion 192. With further reference to FIGS. 40-41, the access mouth portion 192 may be moveable between a mouth open configuration and a mouth closed configuration. When the access mouth portion 192 is in the mouth open configuration, an access mouth port 196 may be defined between the access mouth flaps 194, and the interior compartment 110 may be accessible from an ambient environment 112 through the access mouth port 196.
[0112] With further reference to FIGS. 21B, 38, and 41, in particular implementations of the method of manufacturing 400, the access mouth portion 192 may be configured to be secured in the mouth closed configuration by way of flap magnetic engagement between the access mouth flaps 194. The flap magnetic engagement may define a mouth closure junction 198 between the access mouth flaps 194. The flap magnetic engagement may further be configured to shield RF signals 206 from passing through the mouth closure junction 198 between the ambient environment 112 and the interior compartment 110.
[0113] With further reference to FIGS. 19A-21C, in certain implementations of the method of manufacturing 400, a first access mouth flap 194a may include a pair of first lateral end portions 228 and a first magnetic interface portion 232, the first lateral end portions 228 being disposed oppositely of one another with the first magnetic interface portion 232 extending therebetween. A second access mouth flap 194b may include a pair of second lateral end portions 230 and a second magnetic interface portion 234, the second lateral end portions 230 being disposed oppositely of one another with the second magnetic interface portion 234 extending therebetween. The step of constructing may include, at block 436, affixing a magnetically receptive strip 236 to the first access mouth flap 194a along the first magnetic interface portion 232. The step of constructing may include, at block 437, affixing a plurality of flap magnets 238 to the second access mouth flap 194b along the second magnetic interface portion 234. The step of constructing may include, at block 438, taping the respective first lateral end portions 228 to the respective second lateral end portions 230 with conductive tape 168.
[0114] In particular implementations of the method of manufacturing 400, both steps of affixing may be by way of single-sided conductive tape 168a.
[0115] With further reference to FIGS. 34-39, in certain implementations of the method of manufacturing 400, the magnetically receptive strip 236 and the plurality of flap magnets 238 may each include an adhesive backing 240. The step of affixing, for the magnetically receptive strip 236, may include, at block 436a, peeling an outer peel layer 242 off the respective adhesive backing 240 and, at block 436b, pressing the respective adhesive backing 240 against the first magnetic interface portion 232. The step of affixing, for each of the plurality of flap magnets 238, may include, at block 437a, peeling an outer peel layer 242 offthe respective adhesive backing 240 and, at block 437b, pressing the respective adhesive backing 240 against the second magnetic interface portion 234. In such implementations of the method of manufacturing 400, the magnetically receptive strip 236 may be disposed between a first flap primary layer 243 and a first flap secondary layer 244, and the plurality of flap magnets 238 may be disposed between a second flap primary layer 246 and a second flap secondary layer 248.
[0116] With further reference to FIGS. 30-31, particular implementations of the method of manufacturing 400 may comprise, at block 405, providing a modular jig subassembly 250 moveable between a jig support configuration and a jig deconstructed configuration. The modular jig subassembly 250 may include a plurality of modular jig elements 252. With further reference to FIGS. 3 and 6, the method of manufacturing 400 may further comprise, at block 410, constructing the modular jig subassembly 250 to the jig support configuration inside of the interior compartment 110, whereby, during the step of fastening, the interior compartment 110 may be supported in the volumetrically expanded configuration. In some implementations of the method of manufacturing 400, the modular jig subassembly 250 may act as a supporting structure to the Faraday shell 102 during various stages of manufacturing.
[0117] Certain implementations of the method of manufacturing 400 may comprise, after the step of fastening, at block 445, deconstructing the modular jig subassembly 250 to the jig deconstructed configuration and, at block 450, removing each of the modular jig elements 252 from the interior compartment 110 by way of the access mouth port 196 of the Faraday shell 102.
[0118] The following description illustrates aspects of particular non-limiting implementations of the system 100, the method of deploying 300, and the method of manufacturing 400.
[0119] Certain Objectives of the Collapsable Faraday Enclosure System
[0120] Certain implementations of the system and methods disclosed herein address deficiencies in the conventional art by incorporating replaceable components, ensuring the enclosure may remain functional even if one part fails. This lightweight, modular, andcollapsible Faraday enclosure system may be designed specifically for digital forensic investigators who may need to access and extract data from mobile devices while preventing radio frequency (RF) signals or electromagnetic interference (EMI) from interfering. The enclosure may be collapsible and portable for use in field operations.
[0121] Elements Certain Embodiments
[0122] The enclosure may include a conductive rigid plate for mounting shielded gloves, an RF filter, and a flexible shielded fabric enclosure. A conductive backing plate may hold the flexible shielded fabric enclosure in place. Shielded gloves may be mounted to the conductive rigid plate. A flexible shielded fabric enclosure may be mounted to the conductive rigid plate. An RF filter plate may allow for mounting of an RF filter, which may be a metal cube with one side open. A carbon structure plate may provide additional support. A transparent window may be incorporated. An RF MagLink enclosure may be included. The design may be collapsible.
[0123] Description of Certain Implementations of the System and Methods
[0124] The conductive rigid plate for mounting shielded gloves, an RF filter, and a flexible shielded fabric enclosure may, in some embodiments, be constructed from alodine- coated aluminum. It may include two larger holes in the center area designed to place hands through. Attached to these holes there may be a flange that may allow for attachment of shielded gloves. A hole may exist between and below the glove holes, which may be used to mount an RF filter. This hole may have a perimeter with smaller holes that may allow a filter plate to attach to. The outer perimeter of the conductive rigid plate may include a series of through holes.
[0125] In alternative embodiments, the conductive rigid plate may be constructed from silver, copper, gold, zinc, nickel, brass, bronze, iron, platinum, lead, stainless steel, or any conductive solid material. It may also be constructed from non-conductive material and may include a conductive outer shell or other conductive enhancements. It may include one, three, four, five, or any number of holes on the plate that may or may not allow the user to place hands through. Attached to these holes there may be adapter plates, filters, transparentwindows, solid plates, thermometers, cables, or any other attachment. These holes may have a perimeter with holes that may or may not be threaded, to allow a filter plate, adapter plate, or any other attachment to connect to the conductive rigid plate. In alternative embodiments, the conductive rigid plate may not include holes on its outer perimeter, but instead may include other forms of attachment such as magnets, clips, indentations, adhesive, ridges, or heat sealing. The holes may not be aligned around the perimeter but may instead be located on the edges, may be spaced unevenly, or may not exist at all.
[0126] The connection of the conductive rigid plate to the flexible shielded fabric enclosure may, in some embodiments, utilize a three-layer construction consisting of a first conductive backing plate with threaded stainless steel inserts, a second conductive backing plate with matching through holes, and the flexible shielded fabric enclosure positioned between them. Every other hole on the second backing plate may be countersunk to allow flathead screws to sit flush with the outer surface. Flat-head screws may pass through the countersunk backing plate, then through the flexible shielded fabric, and into the threaded backing plate, securing the enclosure fabric in a conductive sandwich. The conductive rigid plate may then be mounted to the exterior face of the countersunk plate using additional hardware that passes through the same assembly. This construction may allow for nondestructive removal and easy replacement of either the flexible enclosure or rigid front plate, supporting modularity, portability, and serviceability.
[0127] In alternative embodiments, the first and second conductive backing plates may be fabricated from various materials including stainless steel, copper, plastic, carbon fiber, or composites, and may or may not include conductive coatings or surface treatments. The countersunk pattern may vary, and flushness may be achieved using recessed bosses or alternate fastener geometries such as low-profile heads or shoulder bolts. Instead of screws, other fastening methods may include rivets, magnets, clips, interlocking tabs, adhesives, welding, or hook-and-lock mechanisms. The attachment may also be achieved without through-penetration of the fabric via magnetic compression or clamp-style assemblies. A compressible gasket layer may be added between layers to improve shielding continuity or environmental sealing. In some embodiments, the rigid plate may attach only to the outer plate, without passing through to the rear threaded plate.
[0128] The connection of the conductive rigid plate to the RF filter plate may, in some embodiments, involve an RF filter plate constructed of alodine-coated aluminum. The RF filter plate may include a perimeter of holes with threaded stainless steel inserts and a hole in the middle that may allow for mounting of an RF filter. The conductive rigid plate may include a corresponding set of through holes that match the perimeter of the RF filter plate outer perimeter holes, and may allow it to connect to the conductive rigid plate by way of a screw passing through the conductive rigid plate and into the RF filter plate. This connection may allow both components to join conductively and may provide for a method of connecting an RF filter to the apparatus.
[0129] In alternative embodiments, the RF filter plate may not be required, or it may be fabricated from stainless steel, silver, copper, gold, zinc, nickel, brass, bronze, iron, platinum, lead, untreated aluminum, or any other conductive material. The RF filter plate may include other forms of attachment such as magnets, clips, indentations, adhesive, ridges, or heat sealing. The holes may not be aligned around the perimeter but may instead be located on the edges, may be spaced unevenly, or may not exist at all. Stainless steel pressed inserts may not exist, and the plate may include threads, or other methods of securement may exist such as nuts, washers, or others. Screws may or may not be necessary if other methods of securement are used, and other fasteners such as rivets, zip ties, magnets, or others, whether metal or other material, may be employed. The fasteners may or may not be positioned through the layers, but may instead be positioned in a non-through configuration such as magnets.
[0130] The connection of the conductive rigid plate to the shielded gloves may, in some embodiments, include two holes towards the middle area that may allow hands and arms to pass through them. These holes may include a flange that protrudes forward, allowing for mounting of shielded gloves and conductively joining the conductive rigid plate to the shielded gloves.
[0131] In alternative embodiments, the conductive rigid plate may include any number of holes that may or may not allow hands and arms to pass through them. These holes may not include a flange that protrudes forward for mounting shielded gloves. Instead, the shielded gloves may be attached with adhesive, magnets, or any other attachment method. In embodiments that may include a flange that protrudes forward, the shielded gloves may beattached with magnets, adhesive, zip ties, clamps, screws, nails, string, rope, heat sealing, or any attachment method used to join two components together.
[0132] Conductive Backing Plate
[0133] The conductive backing plate assembly may, in some embodiments, consist of two separate conductive plates. The first plate may include threaded stainless steel inserts, and the second may include through-holes, with every other hole countersunk to accommodate flathead screws. These plates may be used to sandwich the flexible shielded fabric enclosure between them, with the countersunk hardware allowing the outer surface to remain flat. This flat surface may enable direct mounting of the conductive rigid plate on top, using additional fasteners that may join the full enclosure structure while maintaining flush contact for shielding and mechanical purposes. This dual-plate configuration may support both RF sealing performance and field-serviceable modularity.
[0134] In alternative embodiments, the backing plate pair may be manufactured as one integrated part, or may use other interlocking methods such as snap-fit features, dovetail rails, or slide clamps. The use of pressed-in inserts may be omitted in favor of embedded threads, nuts, or captive hardware. Fastener types may include machine screws, captive panel fasteners, quick-release latches, zip ties, or magnetic snap studs. The plates may include alignment features such as dowel pins or slotted tabs to ease assembly. In some versions, the two plates may be bonded together semi-permanently, with only the rigid front plate intended for frequent removal. The structure may also incorporate EMI gaskets, pressure pads, or shielding foam for additional performance.
[0135] Shielded Gloves
[0136] Two shielded gloves may connect to the conductive rigid plate, sliding over and securing to the circular flanges protruding outward from each of the holes. The gloves may be secured to the flanges with a pipe clamp seated over the perimeter of the gloves that may tighten and conductively couple the gloves to the rigid front plate. The shielded gloves may be made of multiple layers of flexible shielded fabric that may allow a four-way stretch to facilitate hand manipulation and movement inside of the gloves.
[0137] In alternative embodiments, there may not be gloves with fingers but instead another shape such as a rectangular pocket, a tube, a sock, a protrusion, or any other shape or non-identifiable shape. The gloves may not be secured to the flanges but instead may be secured to another element of the enclosure system, may exist as part of the flexible shielded fabric enclosure, or may not exist at all. The gloves may be replaced by another method of manipulation of devices inside of the enclosure, such as a stylus that may protrude from inside to outside, or there may be no method of manipulation at all. The shielded gloves may not be made of two layers of fabric but may instead be made of one layer, three layers, or any other number of layers. The configuration may not exist in layers at all. The gloves may not be a four- way stretch but instead a two-way stretch, or they may not stretch at all.
[0138] Flexible Shielded Fabric Enclosure
[0139] The flexible shielded fabric enclosure may, in some embodiments, be constructed from two double-layer panels of conductive metallic fabric made of polyester, copper, and nickel. The two double-layer panels may be joined together using conductive adhesive tape on the top and bottom of every connection point, creating two layers of tape on every seam. The large opening of the flexible shielded fabric enclosure may have perforated holes along the perimeter so it may be sandwiched between the conductive rigid plate and conductive backing plate. On the opposite side of the flexible shielded fabric enclosure, it may have a magnetic enclosure.
[0140] In alternative embodiments, the flexible shielded fabric enclosure may be constructed from one, three, four, five, or any number of panels that may be one, three, four, five, or any number of layers thick. It may not be constructed using metallic fabric, but instead may be constructed using metal sheets or any conductive material. It may also be constructed using non-conductive material such as wood, carbon fiber, plastic, foam, or fabric, and may include a conductive outer layer. The panels may be joined together by sewing, adhesive, heat sealing, snaps and buttons, magnets, ultrasonic welding, or any other attachment method that may or may not maintain conductivity.
[0141] In alternative embodiments, the large opening of the flexible shielded fabric enclosure may not include holes, but instead may include other forms of attachment such asmagnets, clips, indentations, adhesive, ridges, or heat sealing. The holes may not be aligned around the perimeter but may instead be located on the edges, may be spaced unevenly, or may not exist at all. Stainless steel pressed inserts may exist, and the fabric may include threads, nuts, washers, or other methods of securement. Screws may or may not be necessary if other methods of securement are used, and other fasteners such as rivets, zip ties, or magnets, whether metal or other material, may be employed. The fasteners may or may not be positioned through the layers, but may instead be positioned in a non-through configuration such as magnets.
[0142] In further variations, the flexible shielded fabric enclosure may not require the use of a conductive rigid plate or conductive backing plate, but instead may include another panel constructed from the same material as the other panels with any number of holes that may allow an adapter plate, filter, or other attachment to connect. The panel may also have holes large enough for hands and arms to pass through. The opposite side of the flexible shielded fabric enclosure may not have a magnetic enclosure, but instead may use clamps, clips, magnets, adhesive, screws, nuts, washers, snaps and buttons, Velcro, heat sealing, sewing, ultrasonic welding, or any other method to keep the enclosure closed.
[0143] RF Filter Plate
[0144] The RF filter plate may, in some embodiments, be constructed from alodine- coated aluminum. It may be in the shape of a cube with one open side, and a flange attached to the perimeter of that open side. The plate may allow for a filter to be attached to any side of the open cube to align the filter against the conductive rigid plate, allowing the total form factor to be smaller for portability. It may include holes around the perimeter of the flange to allow the RF filter plate to conductively attach to the rigid front plate.
[0145] In alternative embodiments, the RF filter plate may not be constructed from alodine-coated aluminum, but instead may be constructed using copper, aluminum, gold, silver, iron, steel, brass, nickel, or any other conductive metal or material. The RF filter plate connection to an additional accessory may be oriented in any direction in relation to the conductive rigid plate. The connection may be permanent or non-permanent and may use adhesive, tape, screws, welding, nuts, washers, pressed threads, or any other method of attachment. The RF filter plate may not be conductive or may not contribute to the overallconductivity of the enclosure. In alternative embodiments, the RF filter plate may not be necessary and may be replaced with an adapter plate, filter, light, cable, hand hole, tray, phone holder, solid plate, or any other attachment, or it may not exist at all.
[0146] Carbon Structure Plate
[0147] The carbon structure may, in some embodiments, be constructed using four sheets of 2 mm thick carbon fiber. The structure may use 90° hinges to secure two panels together, creating two pieces that may open like books and may create an “L” shape when opened. The bottom of each “L” shape may have a magnetic strip or magnetic receiver. The two “L” shaped pieces may connect at the bottom via magnets and may create a “U” shaped structure when fully assembled. The carbon structure may be quickly disassembled and may fold into smaller pieces. To insert the carbon structure, the user may put one of the two carbon pieces into the bag, then connect the two pieces together via magnet and magnet receiver, and then open the two connected pieces to create a supportive structure for the flexible shielded fabric enclosure.
[0148] In some embodiments, the carbon structure may also include an additional upper support section that may reinforce the top corners of the enclosure. This top bracing element may be constructed in the same form as the previously described carbon panels and may utilize similar connection methods such as hinges and magnets. When assembled, this third component may interlock with the existing “U” shaped frame to improve rigidity, maintain volume definition, and enhance the effectiveness of the RF seal at the enclosure opening. The additional carbon structure may be collapsible and removable in the same manner as the main carbon panels, allowing the entire frame system to break down flat for transport.
[0149] In alternative embodiments, the carbon structure may not be constructed with carbon fiber, but instead may be constructed using plastic, metal, wood, cardboard, fiberglass, or any other material. The carbon fiber or alternative material sheets may not be 2 mm thick, but instead may be 0.5 mm, 1 mm, 3 mm, 4 mm, or any thickness. There may not be two panels, but instead one, three, four, five, or any number of panels. The carbon structure may not exist as a separate structure, but instead may be built into the sides or parts of the enclosure, or it may not exist at all. The structure may or may not be conductive.
[0150] The carbon structure may not utilize 90° hinges, but instead may use Kevlar hinges, piano hinges, self-opening hinges, tape, adhesive, braces, struts, or any other attachment method that may open more or less than 90°. The hinges or alternative attachments may create one, three, four, five, six, or any number of “W,” “I,” “M,” “U,” “T,” or other shaped pieces. The “L” shaped pieces or alternatively shaped pieces may not be attached by magnets, but instead may be attached by tape, adhesive, ridges, hinges, clips, or any other form of attachment. When assembled, the pieces may create a “W,” “I,” “M,” “X,” or any other shape when attached to each other, or they may not need to be attached.
[0151] In alternative embodiments, the upper bracing section may be fabricated from a different material such as plastic, fiberglass, aluminum, or wood, and may be integrated or detachable. It may be connected using corner brackets, friction joints, telescoping rods, or pivoting arms. The shape of the upper brace may vary and may include rectangular, triangular, or arched profiles. In some configurations, this piece may serve a dual function as a lid support, sensor mount, or lighting fixture bracket. The bracing section may fold independently or remain fixed to one of the carbon side panels. Additional variations may include elastic tension straps or Velcro bands used to maintain the upright posture of the structure instead of rigid elements.
[0152] Replaceable RF Blocking Transparent WindowThe transparent RF blocking window may, in some embodiments, be constructed using two layers of nickel and copper impregnated fabric panels. The two panels may be arranged perpendicularly on top of one another to promote transparency and blocking efficiency. The transparent RF blocking window may be attached to the flexible shielded fabric enclosure using double-sided conductive adhesive tape and single-sided conductive adhesive tape.
[0153] In alternative embodiments, the transparent RF blocking window may not be constructed using two panels, but instead using one, three, four, five, or any number of panels. The panels may not be constructed of nickel and copper impregnated fabric, but instead may be constructed of copper fabric, nickel fabric, gold fabric, silver fabric, iron fabric, steel fabric, brass fabric, glass, copper-infused glass, nickel-infused glass, gold-infused glass, silver-infused glass, iron-infused glass, steel-infused glass, brass-infused glass, carbon nanotubes, or any other conductive fabric, glass, or material. The transparent RF blocking window may beattached to the flexible shielded fabric enclosure by sewing, adhesives, heat sealing, or any other attachment method.
[0154] In alternative embodiments, there may not be a need for a transparent window, and it may be replaced by a camera, viewing screen, tablet, phone, or other device, or it may not exist at all.
[0155] Collapsible Design
[0156] The carbon structure may, in some embodiments, separate into two pieces and may fold into a smaller form factor. The flexible shielded fabric enclosure may be flexible and may be able to be folded into a smaller form factor. The shielded gloves may also be flexible and may be able to fold into a smaller form factor.
[0157] In alternative embodiments, the carbon structure may not separate into two separate pieces, but instead may be one, three, four, or five pieces. The flexible shielded fabric enclosure may be disassembled, cut, vacuum sealed, shrunken, or may use any other method to make the flexible shielded fabric enclosure smaller. The shielded gloves may be disassembled, cut, vacuum sealed, shrunken, or may use any other method to make them smaller.
[0158] RF MagLink Enclosure
[0159] The mouth opening of the enclosure may, in some embodiments, be constructed using conductive fabric, magnets, magnet-receiving material, and conductive tape. The mouth may have two parts, an upper part and a lower part, that may connect magnetically. The upper part may include three separate magnetic strips aligned in parallel and spaced apart slightly. These magnetic strips may be attached to the fabric of the flexible fabric enclosure and may be covered completely with conductive adhesive tape. The lower part of the mouth may include one strip of magnet-receiving material, which may also be completely covered with conductive tape. When the upper part makes contact with the lower part, a magnetic bond may occur that may close the mouth and may press the conductive adhesive covering both the upper and lower part together. This connection may generate a conductively tight seal that may block radiofrequency signals from entering inside of the enclosure. The three magnetic strips may offer redundancy of shielding, allowing one magnetic strip to be perfectly held against the magnetreceiving material in the lower part in the event that another magnetic strip may not be perfectly held. This three-strip combination may offer the correct amount of redundancy to achieve complete RF isolation in nearly all circumstances, accommodating for imperfections of material, human error, and other factors.
[0160] In alternative embodiments, the opening of the enclosure may not be a mouth, but instead may be a vestibule, door, hatch, port, slot, lid, flap, gate, valve, panel, seam, trapdoor, window, grill, chute, breather, or any other type of opening. The opening may not have upper and lower parts, but instead may include multiple upper and lower portions, or may be arranged side by side, front to back, or in any other orientation. The enclosure may be constructed using metal, plastic, wood, glass, ceramic, composite materials, rubber, foam, paper, cardboard, mesh, silicone, concrete, or any other material. The opening may also use snaps and buttons, zippers, hooks and eyes, latch and hook, clips, twist locks, buckles, drawstrings, press studs, cam locks, elastic bands, screw closures, Velcro, adhesives, welding, heat sealing, or any other attachment method.
[0161] The upper part of the enclosure may not include three separate magnetic strips, but instead may include one, two, four, five, six, or any number of magnetic strips. These strips may not be aligned in parallel, but may instead be aligned perpendicularly, diagonally, on top of one another, or in any other arrangement. The strips may not be spaced slightly apart, but instead may be spaced far apart, not spaced at all, or spaced in any variation. The upper part may instead include magnet-receivers, snaps and buttons, zippers, hooks and eyes, latch and hook, clips, twist locks, buckles, drawstrings, press studs, cam locks, elastic bands, screw closures, Velcro, adhesives, welding, or heat sealing. The magnetic strips may not be covered completely with conductive adhesive tape, but instead may be partially covered, not covered at all, or covered with conductive fabric, metal, conductive paint, conductive coating, conductive rubber, conductive silicone, conductive gaskets, metal mesh, conductive adhesive, carbon fiber, conductive plastics, conductive foam, or any other conductive material. The covering may also not be conductive.
[0162] The lower part of the mouth of the enclosure may not include one strip of magnet-receiving material, but instead may include two, three, four, five, six, or any number of magnetic-receiving strips. The magnet-receiving material may not be completely covered with conductive tape, but instead may be partially covered, not covered at all, or covered with conductive fabric, metal, conductive paint, conductive coating, conductive rubber, conductive silicone, conductive gaskets, metal mesh, conductive adhesive, carbon fiber, conductive plastics, conductive foam, or any other conductive material. When the upper part of the enclosure makes contact with the lower part, there may not be a magnetic bond that occurs, but instead an adhesive bond, Velcro bond, mechanical bond, weld, snap, thread, friction, thermal bond, or any other type of bond that may join two or more surfaces together. This connection may not generate a conductively tight seal and may not block radio frequency signals from entering the inside of the enclosure. The enclosure may not offer redundancy of shielding and may instead rely on one connection point.
[0163] Conclusion
[0164] The inventive system and methods described herein represent an advancement in analysis enclosure design by addressing challenges in usability and manufacturing. By incorporating features such as replaceable conductive gloves, a transparent window, a replaceable shell, a replaceable conductive glove plate, a foldable carbon fiber support structure, and a dual-sided USB filter, the design may offer a more reliable and user-friendly solution for forensic investigators and may establish a new standard in the industry.
[0165] To one skilled in the art, it may be known that manufacturing shielded enclosures can be tedious and subject to error, due to the requirement that all components may work together as a system to effectively shield RF signals and electromagnetic interference. One broken link in the chain may affect the performance of the entire enclosure. It may therefore be important to separate the functions of the enclosure from one another to allow for a lower shielding failure rate due to manufacturer error or user wear and tear. The inventive expedients disclosed herein may offer an improved manufacturing technique that may prolong the lifespan and capabilities of a portable mobile device analysis enclosure.
[0166] The following listing matches certain terminology used within this disclosure with corresponding reference numbers used in the non-limiting implementations illustrated in the several figures.100 collapsible Faraday enclosure system102 Faraday shell104 application interface plate106 panel stiffener subsystem108 lateral stiffener element (of panel stiffener subsystem)108a first lateral stiffener element108b second lateral stiffener element110 interior compartment (of F araday shell)112 ambient environment114 horizontal stiffener plate (of lateral stiffener element)116 vertical stiffener plate (of lateral stiffener element)118 stiffener plate hinge element120 lower linking portion (of lateral stiffener element)122 upper face (of horizontal stiffener plate)122a first upper face (of first horizontal stiffener plate)122b second upper face (of second horizontal stiffener plate)124 lower face (of horizontal stiffener plate)124a first lower face (of first horizontal stiffener plate)124b second lower face (of second horizontal stiffener plate)126 first linking magnet128 second linking magnet130 application device (e.g., RF-shielding glove, RF-shielding filter, etc.)130a RF-shielding glove130b RF-shielding filter130c RF-shielding window132 upper bracing element (of panel stiffener subsystem)133 bracing hinge element134 bracing end (of upper bracing element)136 upper panel support section (of panel stiffener subsystem)lateral panel (of Faraday shell) upper panel (of Faraday shell) lower panel (of Faraday shell) application section (of Faraday shell) rear section (of Faraday shell) first bracing arm (of upper panel support section) second bracing arm (of upper panel support section) first transparent shielding panel peripheral portion (of first transparent shielding panel) second transparent shielding panel peripheral portion (of second transparent shielding panel) first shielding layer (of upper panel) second shielding layer (of upper panel) first window port second window port first interface portion (of first shielding layer) second interface portion (of second shielding layer) conductive tape a single-sided conductive tape b double-sided conductive tape inner clamp bracket outer clamp bracket device mount portion (of application interface plate) filter mount adaptor filter adaptor flange filter port electrical receptacle (of RF-shielding fiter) a inboard electrical receptacle b outboard electrical receptacle filter mount aperture adaptor mount fastener filter mount fastener adaptor threaded insertaccess mouth portion (of Faraday shell) access mouth flap a first access mouth flap b second access mouth flap access mouth port mouth closure junction plate mount aperture (of application interface plate cutting tool window interface junctionRF signal first panel inboard surface first panel outboard surface second panel inboard surface second panel outboard surface first layer inboard surface first layer outboard surface second layer inboard surface second layer outboard surface first window junction second window junction' first lateral end portion (of first access mouth flap) second lateral end portion (of second access mouth flap) first magnetic interface portion (of first access mouth flap) second magnetic interface portion (of second access mouth flap) magnetically receptive strip flap magnet adhesive backing outer peel layer first flap primary layer first flap secondary layer second flap primary layer second flap secondary layer modular jig subassembly252 modular jig element252a front jig panel252b side jig panel252c rear jig panel254 fastener relief256 jig access port258 application plate fastener260 cylindrical mount flange262 first plate fastener264 second plate fastener266 clamp fastener300 steps for a method of deploying a collapsible Faraday enclosure system305 providing a collapsible Faraday enclosure system in a collapsed configuration310 inserting the panel stiffener subsystem from an ambient environment into the interior compartment315 moving the panel stiffener subsystem into the extended configuration, thereby supporting the interior compartment in a volumetrically expanded configuration320 unfolding the lateral stiffener elements325 placing the pair of lateral stiffener elements into the lateral linking engagement with one another330 positioning the upper panel support section into panel supporting engagement with an upper panel of the Faraday shell335 placing the first bracing arm and the second bracing arm into arm linking engagement with one another340 fastening the application interface plate to the Faraday shell400 steps for a method of manufacturing a collapsible Faraday enclosure system405 providing a modular jig subassembly410 constructing the modular jig subassembly to the jig support configuration415 forming a Faraday shell defining an interior compartment420 fastening an application interface plate to the Faraday shell425 assembling a panel stiffener subsystem430 integrating a RF-shielding window into the Faraday shell431 cutting a first window port out of a first shielding layer and a second window port out of a second shielding layer432 mounting a first transparent shielding panel in first panel mounted engagement with the first shielding layer along the first interface portion433 mounting a second transparent shielding panel in second panel mounted engagement with the second shielding layer along the second interface portion434 securing the first shielding layer in port aligning engagement with the second shielding layer435 constructing a pair of access mouth flaps436 affixing a magnetically receptive strip to the first access mouth flap along the first magnetic interface portion436a peeling an outer peel layer off the respective said adhesive backing436b pressing the respective said adhesive backing against the first magnetic interface portion437 affixing a plurality of flap magnets to the second access mouth flap along the second magnetic interface portion437a peeling an outer peel layer off the respective said adhesive backing437b pressing the respective said adhesive backing against the second magnetic interface portion438 taping the respective said first lateral end portions to the respective said second lateral end portions with conductive tape440 attaching the access mouth flaps to the Faraday shell thereby defining an access mouth portion445 deconstructing the modular jig subassembly to the jig deconstructed configuration 450 removing each of the modular jig elements from the interior compartment by way of a mouth access port
[0167] While implementations of the invention have been illustrated and described, it is not intended that these implementations illustrate and describe all possible forms of the invention. Rather, the words used in the specification are words of description rather than limitation, and it is understood that various changes may be made without departing from the spirit and scope of the invention.
Claims
What is claimed is:
1. A collapsible Faraday enclosure system convertible between a collapsed configuration and a deployed configuration, the system comprising: a Faraday shell defining an interior compartment; an application interface plate configured to facilitate mounting one or more application devices to the Faraday shell; a panel stiffener subsystem moveable between an extended configuration and a folded configuration, the panel stiffener subsystem including a pair of lateral stiffener elements; wherein(a) when the system is in the deployed configuration,(i) the panel stiffener subsystem is in the extended configuration; and(ii) the interior compartment is supported in a volumetrically expanded configuration by way of the panel stiffener subsystem;(b) when the system is in the collapsed configuration,(i) the panel stiffener subsystem is in the folded configuration; and(ii) the interior compartment is in a volumetrically contracted configuration; and(c) when the panel stiffener subsystem is in the extended configuration, the pair of lateral stiffener elements are in lateral linking engagement with one another.
2. The system of claim 1, wherein each said lateral stiffener element includes a horizontal stiffener plate and a vertical stiffener plate, the horizontal stiffener plate and the vertical stiffener plate being hingedly associated with one another.
3. The system of claim 2, wherein each said lateral stiffener element includes a lower linking portion; and the lateral linking engagement is by way of mutual magnetic engagement between the lower linking portions.
4. The system of claim 3, wherein the horizontal stiffener plate of a first said lateral stiffener element includes a first upper face and a first lower face disposed oppositely of one another; the horizontal stiffener plate of a second said lateral stiffener element includes a second upper face and a second lower face disposed oppositely of one another; the lateral linking portion of the first said lateral stiffener element includes one or more first linking magnets in adhesive communication with the first lower face; the lateral linking portion of the second said lateral stiffener element includes one or more second linking magnets in adhesive communication with the second upper face; and the mutual magnetic engagement is between the one or more first linking magnets and the one or more second linking magnets.
5. The system of claim 1, wherein the Faraday shell includes a pair of lateral panels disposed oppositely of one another; a rear section and an application section disposed oppositely of one another; and a lower panel and an upper panel disposed oppositely of one another; and when the system is in the deployed configuration, the lateral stiffener elements are each in laterally stiffening engagement with a respective said lateral panel.
6. The system of claim 5, wherein the panel stiffener subsystem includes an upper bracing element having a pair of oppositely disposed bracing ends and an upper panel support section, the upper panel support section spanning between the bracing ends, each said bracing end being affixed to a respective said lateral stiffener element; and when the system is in the deployed configuration, the upper panel support section is in panel supporting engagement with the upper panel.
7. The system of claim 6, wherein the upper panel support section is comprised of a first bracing arm and a second bracing arm; when the system is in the deployed configuration, the first bracing arm and the second bracing arm are in arm linking engagement with one another; and when the system is in the collapsed configuration, the first bracing arm and the second bracing arm are disconnected from one another.
8. The system of claim 7, wherein the arm linking engagement is by way of the first bracing arm and the second bracing arm being magnetically engaged with one another.
9. The system of claim 5, wherein an RF-shielding window is in window mounted engagement with the Faraday shell.
10. The system of claim 9, wherein the RF-shielding window includes a first transparent shielding panel and a second transparent shielding panel.
11. The system of claim 10, wherein the upper panel includes a first shielding layer having a first window port extending therethrough, a first interface portion being defined peripherally about the first window port; and a second shielding layer having a second window port extending therethrough, a second interface portion being defined peripherally about the second window port; the first transparent shielding panel is in first panel mounted engagement with the first shielding layer along the first interface portion; the second transparent shielding panel is in second panel mounted engagement with the second shielding layer along the second interface portion; and the first shielding layer is in port aligning engagement with the second shielding layer.
12. The system of claim 11, wherein the first panel mounted engagement, the second panel mounted engagement, and the port aligning engagement are each secured by way of conductive tape.
13. The system of claim 5, wherein the application section is configured to be clampingly disposed between the application interface plate and an inner clamp bracket.
14. The system of claim 13, comprising an outer clamp bracket, wherein the clamping is by way of the inner clamp bracket being fastened to the outer clamp bracket; and the application section being disposed between the inner clamp bracket and the outer clamp bracket; and the application interface plate is fastened to the outer clamp bracket.
15. The system of claim 13, wherein the application interface plate includes a plurality of device mount portions; a first said application device is a RF-shielding glove, the application interface plate having a corresponding said device mount portion configured to be placed in glove mounted engagement with the RF-shielding glove; and a second said application device is a RF-shielding filter, the application interface plate having a corresponding said device mount portion configured to be placed in filter mounted engagement with the RF-shielding filter.
16. The system of claim 15, comprising a filter mount adaptor, wherein a said device mount portion includes a filter port extending through the application interface plate; and a plurality of filter mount apertures disposed peripherally about the filter port; and in the filter mounted engagement, the RF-shielding filter is fasteningly engaged with the filter mount adaptor; the filter mount adaptor is fasteningly engaged with the respective said device mount portion by way of the filter mount apertures; and an electrical receptacle of the RF-shielding filter is accessible from an ambient environment through the filter port.
17. The system of claim 5, wherein(a) the rear section includes an access mouth portion defined by a pair of access mouth flaps, the access mouth portion being moveable between a mouth open and a mouth closed configuration; and(b) when the access mouth portion is in the mouth open configuration(i) an access mouth port is defined between the access mouth flaps; and(ii) the interior compartment is accessible from an ambient environment through the access port.
18. The system of claim 17, wherein the access mouth portion is configured to be secured in the mouth closed configuration by way of flap magnetic engagement between the access mouth flaps, the flap magnetic engagement(a) defining a mouth closure junction between the access mouth flaps; and(b) being configured to shield RF signals from passing through the mouth closure junction between the ambient environment and the interior compartment.
19. A method of deploying a collapsible Faraday enclosure system, the method comprising: providing a collapsible Faraday enclosure system in a collapsed configuration, the system including(a) a Faraday shell defining an interior compartment;(b) an application interface plate configured to facilitate mounting one or more application devices to the Faraday shell; and(c) a panel stiffener subsystem moveable between an extended configuration and a folded configuration, the panel stiffener subsystem including a pair of lateral stiffener elements; wherein, in the collapsed configuration,(a) the panel stiffener subsystem is in the folded configuration; and(b) the interior compartment is in a volumetrically contracted configuration; and moving the panel stiffener subsystem into the extended configuration, thereby supporting the interior compartment in a volumetrically expanded configuration;wherein, when the panel stiffener subsystem is in the extended configuration, the lateral stiffener elements are in lateral linking engagement with one another.
20. The method of claim 19, wherein the panel stiffener subsystem is moved to the extended configuration by way of unfolding the lateral stiffener elements; and placing the pair of lateral stiffener elements into the lateral linking engagement with one another.
21. The method of claim 20, wherein each said lateral stiffener element includes a lower linking portion; and the lateral linking engagement is by way of mutual magnetic engagement between the lower linking portions.
22. The method of claim 19, comprising, prior to the step of moving, inserting the panel stiffener subsystem from an ambient environment into the interior compartment.
23. The method of claim 22, wherein the Faraday shell includes an access mouth portion defined by a pair of access mouth flaps, the access mouth portion being moveable between a mouth open configuration and a mouth closed configuration; when the access mouth portion is in the mouth open configuration, an access mouth port is defined between the access mouth flaps; and the insertion is through the access mouth port.
24. The method of claim 19, wherein the panel stiffener subsystem includes an upper bracing element having a pair of oppositely disposed bracing ends and an upper panel support section, the upper panel support section spanning between the bracing ends, each said bracing end being affixed to a respective said lateral stiffener element; and the method includes positioning the upper panel support section into panel supporting engagement with an upper panel of the Faraday shell.
25. The method of claim 24, wherein the upper panel support section is comprised of a first bracing arm and a second bracing arm; and the step of positioning includes placing the first bracing arm and the second bracing arm into arm linking engagement with one another.
26. The method of claim 25, wherein the arm linking engagement is by way of the first bracing arm and the second bracing arm being magnetically engaged with one another.
27. The method of claim 19, wherein in the collapsed configuration, the application interface plate is disconnected from the Faraday shell; and the method comprises fastening the application interface plate to the Faraday shell.
28. A method of manufacturing a collapsible Faraday enclosure system convertible between a collapsed configuration and a deployed configuration, the method comprising forming a Faraday shell defining an interior compartment; fastening an application interface plate to the Faraday shell, the application interface plate being configured to facilitate mounting one or more application devices to the Faraday shell; assembling a panel stiffener subsystem moveable between an extended configuration and a folded configuration, the panel stiffener subsystem including a pair of lateral stiffener elements; wherein(a) when the system is in the deployed configuration,(i) the panel stiffener subsystem is in the extended configuration; and(ii) the interior compartment is supported in a volumetrically expanded configuration by way of the panel stiffener subsystem;(b) when the system is in the collapsed configuration,(i) the panel stiffener subsystem is in the folded configuration; and(ii) the interior compartment is in a volumetrically contracted configuration; and(c) when the panel stiffener subsystem is in the extended configuration, the lateral stiffener elements are in lateral linking engagement with one another.
29. The method of claim 28, comprising integrating a RF-shielding window into the Faraday shell.
30. The method of claim 29, wherein the step of integrating includes cutting a first window port out of a first shielding layer and a second window port out of a second shielding layer, a first interface portion being defined peripherally about the first window port and a second interface portion being defined peripherally about the second window port, the first shielding layer and the second shielding layer defining an upper panel of the Faraday shell; mounting a first transparent shielding panel in first panel mounted engagement with the first shielding layer along the first interface portion; mounting a second transparent shielding panel in second panel mounted engagement with the second shielding layer along the second interface portion; and securing the first shielding layer in port aligning engagement with the second shielding layer.
31. The method of claim 30, wherein the port aligning engagement(a) defines a window interface junction between the first interface portion and the second interface portion; and(b) is configured to shield RF signals from passing through the window interface junction between the interior compartment and an ambient environment.
32. The method of claim 30, wherein the first panel mounted engagement, the second panel mounted engagement, and the port aligning engagement are each secured by way of conductive tape.
33. The method of claim 32, wherein the conductive tape securing the first panel mounted engagement and the port aligning engagement includes one or more lengths of double-sided said conductive tape.
34. The method of claim 33, wherein the first transparent shielding panel includes a first panel inboard surface and a first panel outboard surface disposed oppositely of one another; the first shielding layer includes a first layer inboard surface and a first layer outboard surface disposed oppositely of one another; the second shielding layer includes a second layer inboard surface and a second layer outboard surface disposed oppositely of one another; and the one or more lengths of double-sided said conductive tape are each in adhesive communication with(a) the first layer outboard surface along the first interface portion;(b) a peripheral portion of the first panel inboard surface; and(c) the second layer inboard surface along the second interface portion.
35. The method of claim 34, wherein the first panel mounted engagement(a) defines a first window junction between the peripheral portion of the first panel inboard surface and the first layer outboard surface along the first interface portion; and(b) is configured to shield RF signals from passing through the first window junction between an ambient environment and the interior compartment.
36. The method of claim 34, wherein the conductive tape securing the second panel mounted engagement includes one or more lengths of single-sided said conductive tape.
37. The method of claim 36, wherein the second transparent shielding panel includes a second panel inboard surface and a second panel outboard surface disposed oppositely of one another; and the one or more lengths of single-sided said conductive tape are each adhered to(a) the second layer outboard surface along the second interface portion; and(b) a peripheral portion of the second panel outboard surface.
38. The method of claim 37, wherein the second panel mounted engagement(a) defines a second window junction between the peripheral portion of the second panel outboard surface and the second layer outboard surface along the second interface portion; and(b) is configured to prevent RF signals from passing through the second window junction between an ambient environment and the interior compartment.
39. The method of claim 28, comprising constructing a pair of access mouth flaps; and attaching the access mouth flaps to the Faraday shell thereby defining an access mouth portion, wherein(a) the access mouth portion is moveable between a mouth open configuration and a mouth closed configuration; and(b) when the access mouth portion is in the mouth open configuration(i) an access mouth port is defined between the access mouth flaps; and(ii) the interior compartment is accessible from an ambient environment through the access mouth port.
40. The method of claim 39, wherein the access mouth portion is configured to be secured in the mouth closed configuration by way of flap magnetic engagement between the access mouth flaps, the flap magnetic engagement(a) defining a mouth closure junction between the access mouth flaps; and(b) being configured to shield RF signals from passing through the mouth closure junction between the ambient environment and the interior compartment.
41. The method of claim 40, wherein a first said access mouth flap includes a pair of first lateral end portions and a first magnetic interface portion, the first lateral end portions being disposed oppositely of one another with the first magnetic interface portion extending therebetween; a second said access mouth flap includes a pair of second lateral end portions and a second magnetic interface portion, the second lateral end portions being disposed oppositely of one another with the second magnetic interface portion extending therebetween; the step of constructing includes affixing a magnetically receptive strip to the first access mouth flap along the first magnetic interface portion;affixing a plurality of flap magnets to the second access mouth flap along the second magnetic interface portion; and taping the respective said first lateral end portions to the respective said second lateral end portions with conductive tape.
42. The method of claim 41, wherein both steps of affixing are by way of single-sided conductive tape.
43. The method of claim 41, wherein the magnetically receptive strip and the plurality of flap magnets each includes an adhesive backing; and the step of affixing, for the magnetically receptive strip, includes peeling an outer peel layer off the respective said adhesive backing; and pressing the respective said adhesive backing against the first magnetic interface portion; the step of affixing, for each of the plurality of flap magnets, includes peeling an outer peel layer off the respective said adhesive backing; and pressing the respective said adhesive backing against the second magnetic interface portion.
44. The method of claim 28, comprising providing a modular jig subassembly moveable between a jig support configuration and a jig deconstructed configuration, the modular jig subassembly including a plurality of modular jig elements; and constructing the modular jig subassembly to the jig support configuration inside of the interior compartment, whereby, during the step of fastening, the interior compartment is supported in the volumetrically expanded configuration.
45. The method of claim 44, comprising, after the step of fastening, deconstructing the modular jig subassembly to the jig deconstructed configuration; and removing each of the modular jig elements from the interior compartment by way of an access mouth port of the Faraday shell.
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