Polymer sag resistance evaluation method and apparatus, storage medium, and processor

By establishing a three-dimensional model and simulating the temperature field and shear rate distribution, combined with viscosity and storage modulus data, the accuracy problem of traditional polymer melt sag performance testing under static conditions is solved, enabling accurate evaluation under dynamic conditions and supporting polymer formulation and process optimization.

WO2026108465A1PCT designated stage Publication Date: 2026-05-28PETROCHINA SHANGHAI ADVANCED MATERIALS RESEARCH INSTITUTE CO LTD +1
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Patent Information

Authority / Receiving Office
WO · WO
Patent Type
Applications
Current Assignee / Owner
PETROCHINA SHANGHAI ADVANCED MATERIALS RESEARCH INSTITUTE CO LTD
Filing Date
2025-10-14
Publication Date
2026-05-28

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Abstract

The present application relates to the field of polymer processing, and discloses a polymer sag resistance evaluation method and apparatus, a storage medium, and a processor. The method comprises: simulating an extrusion molding process of a polymer to obtain temperature field distribution and shear rate distribution of the polymer in the extrusion molding process; determining viscosity data of the polymer under the temperature field distribution and the shear rate distribution, and determining storage modulus data of the polymer under the temperature field distribution; and on the basis of the viscosity data and the storage modulus data, evaluating the sag resistance of the polymer. In the present solution, the viscosity and storage modulus which have a stronger correlation with the sag resistance of the polymer are used as physical parameters for evaluating the sag resistance of the polymer, and testing is performed under actual extrusion conditions, so that the performance of the polymer in a real processing environment can be reflected, and the sag resistance of the polymer in an actual extrusion process can be more accurately evaluated.
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Citation Information

Patent Citations

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