Electronic device for outputting at least one control signal

Abstract

According to an embodiment, an electronic device may comprise: a control circuit including a plurality of mobile industry processor interface (MIPI) circuits; a plurality of driving circuits connected to the plurality of MIPI circuits; and a selection circuit connected to a plurality of control paths between the plurality of MIPI circuits and the plurality of driving circuits. The selection circuit may be configured to, while control signals are respectively provided to the plurality of driving circuits, output at least one of the plurality of control signals provided to the plurality of driving circuits.

Description

Electronic device for outputting at least one control signal

[0001] The following descriptions relate to an electronic device for outputting at least one control signal.

[0002] The electronic device may include at least one radio frequency frontend (RFFE) module. At least one RFFE may be controlled based on MIPI (mobile industry processor interface). MIPI refers to an interface between a processor and peripheral devices to enhance reusability and compatibility in mobile and Internet of Things devices. At least one RFFE may be controlled by a MIPI signal. The MIPI signal may be provided by the processor of the electronic device or by an RF (radio frequency) transceiver.

[0003] The information described above may be provided as related art for the purpose of aiding understanding of the present disclosure. No claim or determination is made as to whether any of the foregoing may be applied as prior art related to the present disclosure.

[0004] According to one embodiment, an electronic device may include a control circuit comprising a plurality of MIPI (mobile industry processor interface) circuits, a plurality of driving circuits connected to the plurality of MIPI circuits, and a selection circuit connected to a plurality of control paths between the plurality of MIPI circuits and the plurality of driving circuits. The selection circuit may be configured to output at least one control signal among a plurality of control signals provided to the plurality of driving circuits while a control signal is provided to each of the plurality of driving circuits.

[0005] FIG. 1 is a block diagram of an electronic device in a network environment according to various embodiments.

[0006] FIG. 2 illustrates an example of an electronic device according to one embodiment.

[0007] FIG. 3 illustrates an example of an RFFE module according to one embodiment.

[0008] FIG. 4 illustrates an example of an electronic device according to one embodiment.

[0009] FIG. 5a illustrates an example of an electronic device according to one embodiment.

[0010] FIG. 5b illustrates an example of an electronic device according to one embodiment.

[0011] FIG. 6a illustrates an example of a selection circuit according to one embodiment.

[0012] FIG. 6b illustrates an example of a selection circuit according to one embodiment.

[0013] FIG. 7 illustrates an example of an electronic device according to one embodiment.

[0014] Hereinafter, embodiments of the present disclosure are described in detail with reference to the drawings so that those skilled in the art can easily practice them. However, the present disclosure may be embodied in various different forms and is not limited to the embodiments described herein. In relation to the description of the drawings, the same or similar reference numerals may be used for identical or similar components. Furthermore, in the drawings and related descriptions, descriptions of well-known functions and configurations may be omitted for clarity and brevity.

[0015] In the various embodiments of the present disclosure described below, a hardware-based approach is described as an example. However, since the various embodiments of the present disclosure include techniques using both hardware and software, the various embodiments of the present disclosure do not exclude a software-based approach.

[0016] Terms referring to components of electronic devices used in the following description (e.g., communication module, wireless communication module, substrate, PCB (printed circuit board), FPCB (flexible PCB), module, antenna, antenna element, circuit, processor, chip, component, device), terms referring to RF-related components (FEM (front end module), PAM (power amplifier module), FEMid (FEM including duplexer), PAMid (power amplifier module including duplexer), LPAMid (Low noise amplifier PAM including duplexer), RFFE (radio frequency front end)), RFIC (radio frequency integrated circuit)), terms referring to the shape of components (e.g., structure, support, contact, protrusion), terms referring to connections between structures (e.g., connection, contact, support, contact structure, conductive member, assembly), and terms referring to circuits (e.g., PCB, FPCB, signal line, feeding line, data line, RF signal line, antenna line, signal path, RF path, RF module, RF Circuits, splitters, dividers, couplers, combiners, etc. are examples provided for convenience of explanation. Accordingly, the present disclosure is not limited to the terms described below, and other terms having equivalent technical meanings may be used. Furthermore, terms such as '...part', '...device', '...object', '...body' used below may refer to at least one structural shape or a unit that performs a function.

[0017] Additionally, in this disclosure, expressions of "greater than" or "less than" may be used to determine whether a specific condition is satisfied or fulfilled; however, this is merely for the purpose of expressing an example and does not exclude descriptions of "greater than" or "less than." Conditions described as "greater than" may be replaced with "greater than," conditions described as "less than" may be replaced with "less than," and conditions described as "greater than and less than" may be replaced with "greater than and less than." Furthermore, "A" to "B" below refer to at least one of elements from A (including A) to B (including B). Below, "C" and / or "D" refers to including at least one of "C" or "D," i.e., {"C", "D", "C" and "D"}.

[0018] FIG. 1 is a block diagram of an electronic device in a network environment according to various embodiments.

[0019] Referring to FIG. 1, in a network environment (100), an electronic device (101) may communicate with an electronic device (102) through a first network (198) (e.g., a short-range wireless communication network) or with at least one of an electronic device (104) or a server (108) through a second network (199) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (101) may communicate with the electronic device (104) through a server (108). According to one embodiment, the electronic device (101) may include a processor (120), memory (130), input module (150), sound output module (155), display module (160), audio module (170), sensor module (176), interface (177), connection terminal (178), haptic module (179), camera module (180), power management module (188), battery (189), communication module (190), subscriber identification module (196), or antenna module (197). In some embodiments, at least one of these components (e.g., connection terminal (178)) may be omitted from the electronic device (101), or one or more other components may be added. In some embodiments, some of these components (e.g., sensor module (176), camera module (180), or antenna module (197)) may be integrated into a single component (e.g., display module (160)).

[0020] The processor (120) can control at least one other component (e.g., hardware or software component) of the electronic device (101) connected to the processor (120) by executing software (e.g., program (140)), and can perform various data processing or operations. According to one embodiment, as at least part of the data processing or operations, the processor (120) can store commands or data received from other components (e.g., sensor module (176) or communication module (190)) in volatile memory (132), process the commands or data stored in volatile memory (132), and store the resulting data in non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., central processing unit or application processor) or an auxiliary processor (123) that can operate independently or together with it (e.g., graphics processing unit, neural processing unit (NPU), image signal processor, sensor hub processor, or communication processor). For example, if the electronic device (101) includes a main processor (121) and an auxiliary processor (123), the auxiliary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a designated function. The auxiliary processor (123) may be implemented separately from the main processor (121) or as part thereof.

[0021] The auxiliary processor (123) may control at least some of the functions or states associated with at least one component of the electronic device (101) (e.g., display module (160), sensor module (176), or communication module (190)) on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. According to one embodiment, the auxiliary processor (123) (e.g., image signal processor or communication processor) may be implemented as part of another functionally related component (e.g., camera module (180) or communication module (190)). According to one embodiment, the auxiliary processor (123) (e.g., neural network processing unit) may include a hardware structure specialized for processing an artificial intelligence model. The artificial intelligence model may be generated through machine learning. Such learning may be performed, for example, on the electronic device (101) itself where the artificial intelligence model is executed, or through a separate server (e.g., server (108)). The learning algorithm may include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model may include a plurality of artificial neural network layers.An artificial neural network may be a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to the hardware structure, the artificial intelligence model may include a software structure, either additionally or substantially.

[0022] The memory (130) can store various data used by at least one component of the electronic device (101) (e.g., processor (120) or sensor module (176)). The data may include, for example, input data or output data for software (e.g., program (140)) and related commands. The memory (130) may include volatile memory (132) or non-volatile memory (134).

[0023] The program (140) may be stored as software in memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0024] The input module (150) can receive commands or data to be used for a component of the electronic device (101) (e.g., processor (120)) from outside the electronic device (101) (e.g., user). The input module (150) may include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0025] The sound output module (155) can output a sound signal to the outside of the electronic device (101). The sound output module (155) may include, for example, a speaker or a receiver. The speaker may be used for general purposes, such as multimedia playback or recording playback. The receiver may be used to receive incoming calls. According to one embodiment, the receiver may be implemented separately from the speaker or as part thereof.

[0026] The display module (160) can visually provide information to an external (e.g., user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling said device. According to one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of the force generated by said touch.

[0027] The audio module (170) can convert sound into an electrical signal or, conversely, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150) or output sound through the sound output module (155) or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphones) connected directly or wirelessly to the electronic device (101).

[0028] The sensor module (176) can detect the operating state of the electronic device (101) (e.g., power or temperature) or the external environmental state (e.g., user state) and generate an electrical signal or data value corresponding to the detected state. According to one embodiment, the sensor module (176) may include, for example, a gesture sensor, a gyroscope sensor, a barometric pressure sensor, a magnetic sensor, an accelerometer sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biosensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0029] The interface (177) may support one or more specified protocols that can be used for the electronic device (101) to be connected directly or wirelessly to an external electronic device (e.g., electronic device (102)). According to one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0030] The connection terminal (178) may include a connector through which the electronic device (101) can be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0031] The haptic module (179) can convert an electrical signal into a mechanical stimulus (e.g., vibration or movement) or an electrical stimulus that the user can perceive through tactile or kinesthetic senses. According to one embodiment, the haptic module (179) may include, for example, a motor, a piezoelectric element, or an electric stimulation device.

[0032] The camera module (180) can capture still images and video. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0033] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented, for example, as at least part of a power management integrated circuit (PMIC).

[0034] The battery (189) can supply power to at least one component of the electronic device (101). According to one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0035] The communication module (190) can support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between an electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may include one or more communication processors that operate independently of the processor (120) (e.g., application processor) and support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., cellular communication module, short-range wireless communication module, or GNSS (global navigation satellite system) communication module) or a wired communication module (194) (e.g., LAN (local area network) communication module, or power line communication module). The corresponding communication module among these communication modules can communicate with an external electronic device (104) through a first network (198) (e.g., a short-range communication network such as Bluetooth, WiFi (wireless fidelity) direct, or IrDA (infrared data association)) or a second network (199) (e.g., a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN). These various types of communication modules may be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can identify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) using subscriber information (e.g., International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module (196).

[0036] The wireless communication module (192) can support 5G networks and next-generation communication technologies following 4G networks, for example, new radio access technology. NR access technology can support high-speed transmission of high-capacity data (enhanced mobile broadband (eMBB)), minimization of terminal power and connection of multiple terminals (massive machine type communications (mMTC)), or high reliability and low latency (ultra-reliable and low-latency communications (URLLC)). The wireless communication module (192) can support a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate, for example. The wireless communication module (192) can support various technologies for securing performance in the high-frequency band, such as beamforming, massive MIMO (multiple-input and multiple-output), full-dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large-scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), external electronic device (e.g., electronic device (104)), or network system (e.g., second network (199)). According to one embodiment, the wireless communication module (192) can support a Peak data rate (e.g., 20 Gbps or more) for realizing eMBB, loss coverage (e.g., 164 dB or less) for realizing mMTC, or U-plane latency (e.g., downlink (DL) and uplink (UL) each 0.5 ms or less, or round trip 1 ms or less) for realizing URLLC.

[0037] An antenna module (197) can transmit a signal or power to or from an external source (e.g., an external electronic device). According to one embodiment, the antenna module (197) may include an antenna comprising a radiator made of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). According to one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as a first network (198) or a second network (199), may be selected from the plurality of antennas, for example, by a communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device through the selected at least one antenna. According to some embodiments, in addition to the radiator, other components (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as part of the antenna module (197).

[0038] According to various embodiments, the antenna module (197) may form a mmWave antenna module. According to one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent to a first surface (e.g., bottom surface) of the printed circuit board and capable of supporting a specified high frequency band (e.g., mmWave band), and a plurality of antennas (e.g., array antennas) disposed on or adjacent to a second surface (e.g., top surface or side surface) of the printed circuit board and capable of transmitting or receiving a signal of the specified high frequency band.

[0039] At least some of the above components can be connected to each other via a communication method between peripheral devices (e.g., bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)) and exchange signals (e.g., commands or data) with each other.

[0040] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) through a server (108) connected to a second network (199). Each of the external electronic devices (102, or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations performed on the electronic device (101) may be performed on one or more of the external electronic devices (102, 104, or 108). For example, if the electronic device (101) needs to perform a function or service automatically or in response to a request from a user or another device, the electronic device (101) may request one or more external electronic devices to perform at least part of the function or service instead of performing the function or service itself or additionally. One or more external electronic devices that receive the above request may execute at least part of the requested function or service, or additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may provide the result as is or additionally processed as at least part of the response to the request. For this purpose, for example, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used. The electronic device (101) may provide ultra-low latency services using, for example, distributed computing or mobile edge computing. In another embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server using machine learning and / or neural networks. According to one embodiment, the external electronic device (104) or the server (108) may be included within the second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0041] According to one embodiment, an electronic device (e.g., the electronic device (101) of FIG. 1) may include a plurality of MIPI circuits and a plurality of driving circuits. Each of the plurality of driving circuits may be controlled by a control signal (or MIPI signal) provided through the MIPI circuit. The electronic device may control the plurality of driving circuits using the plurality of control signals provided through the plurality of MIPI circuits. The electronic device may include a selection circuit for outputting at least one control signal among the plurality of control signals. In the specification below, a specific example of an electronic device including a selection circuit for outputting at least one control signal among the plurality of control signals will be described.

[0042] FIG. 2 illustrates an example of an electronic device according to one embodiment.

[0043] FIG. 3 illustrates an example of an RFFE module according to one embodiment.

[0044] Referring to FIG. 2, the electronic device (250) may include a processor (200), an RF transceiver (210), a plurality of modulators (240), and / or a plurality of RFFE modules (230). For example, the electronic device (250) may include a plurality of RFFEs (230) to support a combination of various frequency bands, CA (carrier aggregation), and / or ENDC (evolved universal terrestrial radio access new radio dual connectivity).

[0045] According to one embodiment, the processor (200) may be coupled (or connected) to the RF transceiver (210). The processor (200) may control the RF transceiver (210). The processor (200) may provide (or transmit) a signal to the RF transceiver (210) to control the RF transceiver (210). The processor (200) may receive data regarding a signal obtained from the RF transceiver (210) from the RF transceiver (210). For example, the processor (200) may correspond to the processor (120) (or communication processor) of FIG. 1.

[0046] According to one embodiment, the RF transceiver (210) may include a plurality of MIPI circuits (220). The plurality of MIPI circuits (220) may include MIPI circuits (220-1) to MIPI circuits (220-n). Each of the plurality of MIPI circuits (220) may be connected to at least one RFFE module (e.g., RFFE module (230-1) to RFFE module (230-m)). A MIPI circuit (e.g., MIPI circuit (220-1)) may be connected to at least one RFFE module. For example, a MIPI circuit (220-1) may be connected to an RFFE module (230-1). A MIPI circuit (220-2) may be connected to an RFFE module (230-2). A MIPI circuit (220-n) can be connected to an RFFE module (230-(m-1)) and an RFFE module (230-m). For example, a plurality of MIPI circuits (220) (or RF transceivers (210)) can be referred to as MIPI master devices. A plurality of RFFE modules (230) and a plurality of modulators (240) can be referred to as MIPI slave devices.

[0047] For example, a MIPI circuit (e.g., MIPI circuit (220-1) to MIPI circuit (220-n)) may be connected to at least one RFFE module (e.g., RFFE module (230-1) to RFFE module (230-m)) through a control path. In one example, the control path may be referred to as a data path or a data line. For example, a MIPI circuit (e.g., MIPI circuit (220-1) to MIPI circuit (220-n)) may be connected to at least one RFFE module (e.g., RFFE module (230-1) to RFFE module (230-m)) through a clock path (clk path). In one example, the clock path may be referred to as a clock line. In FIG. 2, the control path is shown as a solid line, and the clock path is shown as a dotted line.

[0048] For example, a MIPI circuit can provide (or transmit) a control signal (or MIPI signal) to an RFFE module through a control path. The RFFE module can be controlled by the control signal. A MIPI circuit can provide (or transmit) a clock signal to an RFFE module through a clock path. The RFFE module can perform synchronization for the control signal based on the clock signal. The RFFE module can identify the time when the control signal was acquired (or received) based on the clock signal.

[0049] For example, a MIPI circuit (220-1) can transmit a control signal to an RFFE module (230-1) to control an RFFE module (230-1). A MIPI circuit (220-2) can transmit a control signal to an RFFE module (230-2) to control an RFFE module (230-2). A MIPI circuit (220-n) can transmit a control signal to an RFFE module (230-(m-1)) and an RFFE module (230-m) to control an RFFE module (230-(m-1)) and an RFFE module (230-m). An RFFE module (230-(m-1)) and an RFFE module (230-m) can receive the same control signal from the MIPI circuit (220-n).

[0050] According to one embodiment, a plurality of MIPI circuits (220) may be connected to a plurality of modulators (240). The plurality of modulators (240) may include a modulator (240-1) and a modulator (240-2). Each of the plurality of modulators (240) may be configured to provide power (or supply voltage) to a plurality of RFFE modules (230). For example, each of the plurality of RFFE modules (230) may include a power amplifier. The plurality of modulators (240) may provide power (or supply voltage) to a plurality of RFFE modules (230). For example, at least some and / or all of the plurality of modulators (240) may be referred to as a power management integrated circuit (PMIC).

[0051] For example, the MIPI circuit (220-1) may be connected to the modulator (240-1) via a clock path. The MIPI circuit (220-1) may provide (or transmit) a clock signal to the modulator (240-1). The MIPI circuit (220-2) may be connected to the modulator (240-2) via a clock path. The MIPI circuit (220-2) may provide (or transmit) a clock signal to the modulator (240-2). The electronic device (250) illustrated in FIG. 2 is shown to include two modulators, but is not limited thereto. For example, the electronic device (300) may include one modulator. For example, the electronic device (250) may include three or more modulators.

[0052] Although not illustrated, the processor (200) may transmit an RF signal using an RF transceiver (210). The RF transceiver (210) may provide (or transmit) data (or RF input) for an RF signal to at least some or all of the plurality of RFFE modules (230). Although not illustrated, the RF transceiver (210) may provide data for an RF signal to at least some or all of the plurality of RFFE modules (230) using a path distinct from the control path and the clock path. At least some or all of the plurality of RFFE modules (230) that have received data for an RF signal may provide an RF output to transmit an RF signal using an antenna.

[0053] In FIG. 2, an example is shown in which a plurality of MIPI circuits (220) are included in an RF transceiver (210), but is not limited thereto. A plurality of MIPI circuits (220) may also be included in a processor (200) (or a modem, a communication processor (CP)).

[0054] Referring to FIG. 3, the RFFE module (300) may be an example of the RFFE module (230-1) to RFFE module (230-m) of FIG. 2. The RFFE module (300) may include a controller (320), a power amplifier (330), and / or a switching circuit (340). The RFFE module (300) may be configured to provide an RF output (304) based on an RF input (302). The controller (320) may be configured to control the power amplifier (330) and / or the switching circuit (340). The power amplifier (330) may be configured to amplify the RF input (302) using a supply voltage (303). The supply voltage (303) may be provided through a modulator (e.g., modulators (240-1, 240-2) of FIG. 2). The controller (320) can control the RF output (304) using the switching circuit (340).

[0055] For example, the RFFE module (300) can receive a MIPI signal (301) through the controller (320). For example, the MIPI signal (301) may include a control signal and / or a clock signal as described in FIG. 2. For example, the MIPI signal (301) may be an example of a control signal and a clock signal as described in FIG. 2.

[0056] For example, the controller (320) can control the power amplifier (330) and / or the switching circuit (340) based on the MIPI signal (301). For example, the controller (320) can enable or disable the power amplifier (330) and / or the switching circuit (340).

[0057] According to one embodiment, the MIPI signal (301) may be provided through a processor (200) or an RF transceiver (210). The MIPI signal (301) may be configured based on a sequence. If an anomaly occurs in the sequence configuring the MIPI signal (301), damage may occur to the RFFE module (300). For example, the controller (320) may disable the power amplifier (330) and the switching circuit (340). Due to an anomaly in the MIPI signal (301), the controller (320) may disable the switching circuit (340) first, and then disable the power amplifier (330). If the switching circuit (340) is disabled before the power amplifier (330), the output signal of the power amplifier (330) may be reflected back to the power amplifier (330). Accordingly, the power amplifier (330) may be burned out.

[0058] Referring again to FIG. 2, control signals and clock signals may be used to identify malfunctions of RFFE modules (e.g., RFFE module (230-1) to RFFE module (230-m)). For example, a measuring device (e.g., an oscilloscope) may be used to simultaneously check the input / output and MIPI signals (e.g., control signals and / or clock signals) of RFFE modules (e.g., RFFE module (230-1) to RFFE module (230-m)). To identify the input / output and MIPI signals (e.g., control signals and / or clock signals) of RFFE modules (e.g., RFFE module (230-1) to RFFE module (230-m)) through the measuring device, wiring connections on the control path and clock path may be required. Soldering on a printed circuit board (PCB) is required for wiring connections. Due to the soldering process on the PCB, PCB damage may occur, and a long working time may be required for wiring connections. In addition, the reliability of the measurement is reduced due to the soldering process on the PCB, and if the wiring connection is not performed correctly, interference from other signals may occur. Furthermore, since connections on the control path and clock path are required for each of the multiple RFFE modules (230), the input channels of the measurement equipment must be sufficient.

[0059] In the specification below, specific examples of electronic devices including a selection circuit for acquiring at least one control signal (and / or at least one clock signal) among a plurality of control signals (and / or a plurality of clock signals) may be described.

[0060] FIG. 4 illustrates an example of an electronic device according to one embodiment.

[0061] Referring to FIG. 4, the electronic device (400) may include a processor (401), a control circuit (410), a plurality of driving circuits (430), and / or a selection circuit (450). Although not illustrated, the electronic device (400) may further include memory. For example, within the memory of the electronic device (400), one or more instructions (or commands) representing operations and / or operations to be performed on data by the processor (401) of the electronic device (400) may be stored. A set of one or more instructions may be referred to as firmware, an operating system, a process, a routine, a sub-routine, and / or an application. For example, the electronic device (400) and / or the processor (401) may perform at least one of the operations according to the embodiments described below when a set of a plurality of instructions distributed in the form of an operating system, firmware, a driver, and / or an application is executed. In the following, the statement that an application is installed within an electronic device (400) may mean that one or more instructions provided in the form of an application are stored in memory, and that said one or more applications are stored in an executable format (e.g., a file having an extension specified by the operating system of the electronic device (400)) by the processor (401). For example, an application may include a program and / or library related to a service provided to a user.

[0062] For example, the processor (401) may be configured to control the control circuit (410) and / or the selection circuit (450). The processor (401) may transmit a first signal to the control circuit (410) for controlling the operation of a plurality of MIPI circuits (420) included in the control circuit (410). The processor (401) may correspond to the processor (200) of FIG. 2.

[0063] For example, the control circuit (410) may include a plurality of MIPI circuits (420). Based on a signal received from the processor (401), the control circuit (410) may provide (or transmit) a plurality of control signals to a plurality of control circuits (430) through the plurality of MIPI circuits (420). The plurality of MIPI circuits (420) may include MIPI circuits (420-1) to MIPI circuits (420-n). According to an embodiment, the control circuit (410) may perform at least some or all of the functions of the processor (401).

[0064] For example, a plurality of driving circuits (430) may include driving circuits (430-1) to driving circuits (430-m). A plurality of driving circuits (430) may be connected to a plurality of MIPI circuits (420). Each of the plurality of driving circuits (430) may be connected to a MIPI circuit.

[0065] According to one embodiment, a plurality of driving circuits (430) and a plurality of MIPI circuits (420) may be connected one-to-one. When a plurality of driving circuits (430) and a plurality of MIPI circuits (420) are connected one-to-one, the value of m may correspond to the value of n. According to one embodiment, each of the plurality of MIPI circuits (420) may be connected to one or more driving circuits. For example, one MIPI circuit may be connected to two or more driving circuits. As an example, although not illustrated, a MIPI circuit (420-n) may be connected to a driving circuit (430-m) and a driving circuit (430-(m-1)). According to one embodiment, each of at least one of the plurality of MIPI circuits (420) is connected to one or more driving circuits, and each of the remaining MIPI circuits among the plurality of MIPI circuits (420) may be connected to one driving circuit.

[0066] According to one embodiment, a plurality of MIPI circuits (420) may be connected to a plurality of driving circuits (430) through a plurality of control paths (480) and / or a plurality of clock paths (490). For example, a MIPI circuit (420-1) may be connected to a driving circuit (430-1) through a control path (480-1) and a clock path (490-1). A MIPI circuit (420-2) may be connected to a driving circuit (430-2) through a control path (480-2) and a clock path (490-2). A MIPI circuit (420-n) may be connected to a driving circuit (430-m) through a control path (480-n) and a clock path (490-n).

[0067] For example, each of the plurality of control paths (480) may be configured to transmit a control signal. Each of the plurality of clock paths (490) may be configured to transmit a clock signal. For example, the MIPI circuit (420-1) may transmit a control signal to the driving circuit (430-1) via the control path (480-1). The MIPI circuit (420-1) may transmit a clock signal to the driving circuit (430-1) via the clock path (490-1). According to an embodiment, the control signal and / or clock signal may be referred to as a MIPI signal.

[0068] According to one embodiment, a selection circuit (450) may be connected to a plurality of control paths (480). A plurality of resistance circuits (470) may be disposed between the selection circuit (450) and the plurality of control paths (480). For example, a resistance circuit (470-1) may be disposed between the selection circuit (450) and control path (480-1). A resistance circuit (470-2) may be disposed between the selection circuit (450) and control path (480-2). A resistance circuit (470-n) may be disposed between the selection circuit (450) and control path (480-n). For example, each of the plurality of resistance circuits (470) may have a resistance value greater than a reference resistance value (or impedance). For example, the plurality of resistance circuits (470) may be disposed to reduce loss and / or interference to the control signal.

[0069] According to one embodiment, a selection circuit (450) may be connected to a plurality of clock paths (490). A plurality of resistance circuits (460) may be placed between the selection circuit (450) and the plurality of clock paths (490). For example, a resistance circuit (460-1) may be placed between the selection circuit (450) and a clock path (490-1). A resistance circuit (460-2) may be placed between the selection circuit (450) and a clock path (490-2). A resistance circuit (460-n) may be placed between the selection circuit (450) and a clock path (490-n). For example, each of the plurality of resistance circuits (460) may have a resistance value greater than a reference resistance value (or impedance). For example, the plurality of resistance circuits (460) may be placed to reduce loss and / or interference to the clock signal.

[0070] According to one embodiment, the selection circuit (450) may be connected in parallel with each of the plurality of driving circuits (430). For example, the selection circuit (450) may be configured to acquire a control signal and a clock signal provided to the driving circuit (430-1). The selection circuit (450) may be configured to acquire a control signal and a clock signal provided to the driving circuit (430-2). The selection circuit (450) may be configured to acquire a control signal and a clock signal provided to the driving circuit (430-m).

[0071] According to one embodiment, the selection circuit (450) may be configured to output at least one control signal among a plurality of control signals provided to a plurality of driving circuits (430) while a control signal is provided to each of a plurality of driving circuits (430). For example, the selection circuit (450) may acquire a plurality of control signals through a plurality of control paths (480). The processor (401) may transmit (or provide) a second signal to the selection circuit (450) to output at least one control signal among a plurality of control signals through the selection circuit (450). The second signal may indicate at least one control signal among a plurality of control signals. The selection circuit (450) may output at least one control signal indicated by the second signal among a plurality of control signals.

[0072] According to one embodiment, the selection circuit (450) may include a multiplexer (MUX). For example, since the multiplexer is a passive circuit that does not generate additional delay, it can output MIPI signals (e.g., control signals and clock signals) provided through the MIPI circuit. For example, the timing at which the MIPI signal is output through the selection circuit (450) may correspond to the timing at which the MIPI signal is provided to the driving circuit.

[0073] For example, the selection circuit (450) may include a plurality of input ports. The selection circuit (450) may acquire (or receive) a plurality of control signals from a plurality of control paths (480) through at least some of the plurality of input ports. The selection circuit (450) may acquire (or receive) a plurality of clock signals from a plurality of clock paths (490) through the remaining portion of the plurality of input ports. For example, the selection circuit (450) may include a plurality of output ports. The selection circuit (450) may output at least one control signal among a plurality of control signals using at least some of the plurality of output ports. The selection circuit (450) may output at least one clock signal among a plurality of clock signals using the remaining portion of the plurality of output ports.

[0074] For example, the selection circuit (450) can output at least one control signal among the plurality of control signals provided to the driving circuits while a control signal is provided to each of the plurality of driving circuits (430). For example, the selection circuit (450) can acquire the control signal provided to each of the plurality of driving circuits (430) while a control signal is provided to each of the plurality of driving circuits (430). The selection circuit (450) can output at least one control signal among the plurality of control signals.

[0075] For example, the selection circuit (450) can output at least one clock signal among the plurality of clock signals provided to the driving circuits while a clock signal is provided to each of the plurality of driving circuits (430). For example, the selection circuit (450) can acquire the clock signal provided to each of the plurality of driving circuits (430) while a clock signal is provided to each of the plurality of driving circuits (430). The selection circuit (450) can output at least one clock signal among the plurality of control signals.

[0076] According to one embodiment, the control path and the clock path may be referred to as MIPI channels. For example, the MIPI circuit (420-1) and the driving circuit (430-1) may be connected via a first MIPI channel. The MIPI circuit (420-2) and the driving circuit (430-2) may be connected via a second MIPI channel. The selection circuit (450) may select at least one of a plurality of MIPI channels and output a MIPI signal provided (or applied) through the selected at least one MIPI channel.

[0077] According to one embodiment, the measuring equipment may be connected to a plurality of output ports of the selection circuit (450). The measuring equipment may be connected to the antenna output terminals of a plurality of driving circuits (430). Thus, the input / output and MIPI signals (e.g., control signals and / or clock signals) of the plurality of driving circuits (430) can be identified through the connection between the measuring equipment and the plurality of output ports of the selection circuit (450) without wiring connections on the control path and clock path.

[0078] Below, a specific example of the aforementioned electronic device (400) will be described.

[0079] FIG. 5a illustrates an example of an electronic device according to one embodiment.

[0080] FIG. 5b illustrates an example of an electronic device according to one embodiment.

[0081] Referring to FIGS. 5a and 5b, the electronic device (500) may correspond to the electronic device (400) of FIG. 4. The electronic device (500) may include a processor (501), an RF transceiver (510), a plurality of RFFE modules (530), a plurality of modulators (540), and a selection circuit (550). For example, the processor (501) may correspond to the processor (401) of FIG. 4. The RF transceiver (510) may be an example of the control circuit (410) of FIG. 4. Each of the plurality of RFFE modules (530) and the plurality of modulators (540) may be an example of the driving circuit of FIG. 4 (e.g., driving circuit (430-1) to driving circuit (430-m)). The selection circuit (550) may be an example of the selection circuit (450) of FIG. 4. FIG. 5a may illustrate an example in which the selection circuit (550) is not included in the RF transceiver (510). FIG. 5b may illustrate an example in which the selection circuit (550) is included in the RF transceiver (510).

[0082] According to one embodiment, the processor (501) may be configured to control the RF transceiver (510) and / or the selection circuit (550). The processor (501) may provide (or transmit) a first signal to the RF transceiver (510) to control the RF transceiver (510). The processor (501) may provide the first signal to the RF transceiver (510) to control the operation of a plurality of RFFE modules (530). The processor (501) may provide (or transmit) a second signal to the selection circuit (550) to control the selection circuit (550). The processor (501) may provide (or transmit) the second signal to the selection circuit (550) to indicate a control signal (or clock signal) output through the selection circuit (550).

[0083] According to one embodiment, the RF transceiver (510) may include a plurality of MIPI circuits (520). The plurality of MIPI circuits (520) may include MIPI circuits (520-1) to MIPI circuits (520-n). The plurality of MIPI circuits (520) may be connected to a plurality of RFFE modules (530-1). For example, at least one MIPI circuit (e.g., MIPI circuit (520-n)) among the plurality of MIPI circuits (520) may be connected to one or more RFFE modules. For example, the MIPI circuit (520-n) may be connected to two RFFE modules (e.g., RFFE module (530-(m-1)) and RFFE module (530-m)). Among the multiple MIPI circuits (520), the remaining MIPI circuits (e.g., MIPI circuit (520-1) or MIPI circuit (520-2)) can be connected to one RFFE module.

[0084] According to one embodiment, each of the plurality of MIPI circuits (520) may be connected to an RFFE module via a control path and / or a clock path. For example, a MIPI circuit (520-1) may be connected to an RFFE module (530-1) via a control path (580-1). A MIPI circuit (520-1) may be connected to an RFFE module (530-1) via a clock path (590-1). For example, a MIPI circuit (520-2) may be connected to an RFFE module (530-2) via a control path (580-2). A MIPI circuit (520-2) may be connected to an RFFE module (530-2) via a clock path (590-2). For example, a single MIPI circuit may be connected to two or more RFFE modules via a single control path and / or a clock path. For example, the MIPI circuit (520-n) can be connected to the RFFE module (530-(m-1)) and the RFFE module (530-m) through the control path (580-n) and / or clock path (590-n).

[0085] According to one embodiment, at least one of a plurality of MIPI circuits (520) may be connected to a plurality of modulators (540). For example, a MIPI circuit (520-1) may be connected to a modulator (540-1) via a clock path (590-1). A MIPI circuit (520-1) may be connected to a modulator (540-1) and an RFFE module (530-1) via a clock path (590-1). A modulator (540-1) and an RFFE module (530-1) may be connected to a clock path (590-1). A clock signal may be provided to the modulator (540-1) and the RFFE module (530-1) simultaneously. For example, a MIPI circuit (520-2) may be connected to a modulator (540-2) via a clock path (590-2). The MIPI circuit (520-2) can be connected to the modulator (540-2) and the RFFE module (530-2) through the clock path (590-2). The modulator (540-2) and the RFFE module (530-2) can be connected to the clock path (590-2). A clock signal can be provided to the modulator (540-2) and the RFFE module (530-2) simultaneously. In FIG. 5a, an example is shown in which the electronic device (500) includes two modulators, but is not limited thereto. The electronic device (500) may include at least one modulator.

[0086] According to one embodiment, a plurality of control paths (580) may be connected to a selection circuit (550). A plurality of resistance circuits (570) may be disposed between the plurality of control paths (580) and the selection circuit (550). For example, a control path (580-1) may be connected to the selection circuit (550). A resistance circuit (570-1) may be disposed between the control path (580-1) and the selection circuit (550). For example, a control path (580-2) may be connected to the selection circuit (550). A resistance circuit (570-2) may be disposed between the control path (580-2) and the selection circuit (550). For example, a control path (580-n) may be connected to the selection circuit (550). A resistance circuit (570-n) may be disposed between the control path (580-n) and the selection circuit (550). For example, a plurality of resistor circuits (570) may be an example of a plurality of resistor circuits (470) of FIG. 4.

[0087] According to one embodiment, a plurality of clock paths (590) may be connected to a selection circuit (550). A plurality of resistance circuits (560) may be disposed between the plurality of clock paths (590) and the selection circuit (550). For example, a clock path (590-1) may be connected to the selection circuit (550). A resistance circuit (560-1) may be disposed between the clock path (590-1) and the selection circuit (550). For example, a clock path (590-2) may be connected to the selection circuit (550). A resistance circuit (560-2) may be disposed between the clock path (590-2) and the selection circuit (550). For example, a clock path (590-n) may be connected to the selection circuit (550). A resistance circuit (560-n) may be disposed between the clock path (590-n) and the selection circuit (550). For example, a plurality of resistor circuits (560) may be an example of a plurality of resistor circuits (460) of FIG. 4.

[0088] According to one embodiment, the selection circuit (550) may include a plurality of input ports and a plurality of output ports. For example, the plurality of input ports may include input ports (555-1) to input ports (555-n). The plurality of input ports may include input ports (556-1) to input ports (556-n). The plurality of input ports may include an input port (553). For example, the plurality of output ports may include an output port (551) and an output port (552).

[0089] Input ports (555-1) through (555-n) may be used for connection with a plurality of control paths (580). Input ports (556-1) through (556-n) may be used for connection with a plurality of clock paths (590). Input port (553) may be used for connection with a processor (501).

[0090] The output port (551) can be used to output one of a plurality of control signals. The output port (552) can be used to output one of a plurality of clock signals.

[0091] Referring to FIG. 5a, the selection circuit (550) can be distinguished from the RF transceiver (510). The selection circuit (550) can be placed outside the RF transceiver (510).

[0092] Referring to FIG. 5b, the selection circuit (550) may be placed within the RF transceiver (510). The selection circuit (550) may include a multiplexer. The multiplexer may have a small chip area and / or power consumption, so it may be placed within the RF transceiver (510).

[0093] According to one embodiment, while multiple control signals are provided from multiple MIPI circuits (520) to multiple RFFE modules (530), the selection circuit (550) can output one of the multiple control signals through the output port (551). While multiple clock signals are provided from multiple MIPI circuits (520) to multiple RFFE modules (530), the selection circuit (550) can output one of the multiple clock signals through the output port (552).

[0094] For example, the processor (501) may provide (or transmit) a second signal to the selection circuit (550) to indicate one of a plurality of control signals (or a plurality of clock signals) through the input port (553). The selection circuit (550) may output one of the plurality of control signals (or a plurality of clock signals) based on the second signal. According to an embodiment, the second signal may indicate one of a plurality of MIPI circuits (520). The selection circuit (550) may output a MIPI signal (e.g., a control signal and a clock signal) provided from one of the plurality of MIPI circuits (520) based on the second signal.

[0095] According to one embodiment, the measuring equipment may be connected to the output port (551) and output port (552) of the selection circuit (550). The measuring equipment may be connected to the antenna output terminals of the plurality of RFFE modules (530). Thus, the input / output and MIPI signals (e.g., control signals and / or clock signals) of the plurality of RFFE modules (530) can be identified through the connection between the measuring equipment and the plurality of output ports of the selection circuit (450) without wiring connections on the control path and clock path.

[0096] In FIGS. 6a and 6b below, specific examples of selection circuits will be described.

[0097] FIG. 6a illustrates an example of a selection circuit according to one embodiment.

[0098] FIG. 6b illustrates an example of a selection circuit according to one embodiment.

[0099] Referring to FIGS. 6a and 6b, the selection circuit (550) may include a plurality of input ports and a plurality of output ports. For example, the plurality of input ports may include input ports (555-1) to input ports (555-n). The plurality of input ports may include input ports (556-1) to input ports (556-n). The plurality of input ports may include an input port (553). For example, the plurality of output ports may include an output port (551) and an output port (552).

[0100] For example, input ports (555-1) to (555-n) may be used to acquire a plurality of clock signals. Input ports (556-1) to (556-n) may be used to acquire a plurality of control signals. The selection circuit (550) may acquire a plurality of control signals through input ports (556-1) to (556-n) while a plurality of control signals are provided to RFFE modules (530). The selection circuit (550) may acquire a plurality of clock signals through input ports (555-1) to (555-n) while a plurality of clock signals are provided to RFFE modules (530). However, it is not limited thereto. According to an embodiment, a plurality of input ports (555) may be used to acquire a plurality of control signals. A plurality of input ports (556) may be used to acquire a plurality of clock signals.

[0101] Referring to FIG. 6a, the output port (551) can be used to output one of a plurality of control signals. The output port (552) can be used to output one of a plurality of clock signals.

[0102] For example, the input port (553) may be used for connection with the processor (501). The selection circuit (550) may receive a second signal to indicate a control signal and a clock signal output from the processor (501) through the output port (551) and the output port (552). For example, if n is 8, the second signal may be configured based on 3 bits. The second signal configured with 3 bits may indicate the control signal to be output. For example, the control signal (or clock signal) output through the selection circuit (550) according to the second signal configured with 3 bits may be configured as shown in the table below.

[0103] SELOutput000RFFE Channel 1001RFFE Channel 2010RFFE Channel 3011RFFE Channel 4100RFFE Channel 5101RFFE Channel 6110RFFE Channel 7111RFFE Channel 8

[0104] Referring to Table 1, SEL is an example of a second signal composed of 3 bits. Output is an RFFE channel (or RFFE module) indicated by the second signal. For example, an RFFE channel (or RFFE module) indicated by a 3-bit value can be determined. As an example, 8 RFFE channels from 8 MIPI circuits can be configured. The selector circuit (550) can determine the RFFE channel indicated by the 3-bit value as the RFFE channel to be output.

[0105] According to one embodiment, the selection circuit (550) can determine a MIPI signal (e.g., a control signal and a clock signal) based on a second signal and output the determined MIPI signal. For example, if the second signal instructs the selection circuit (550) to output a MIPI signal provided to the RFFE module (530-2), the selection circuit (550) can output a control signal provided to the RFFE module (530-2) through the output port (551) and output a clock signal provided to the RFFE module (530-2) through the output port (552).

[0106] Referring to FIG. 6b, the selection circuit (550) may output two MIPI signals. For example, the multiple output ports of the selection circuit (550) may include an output port (551-1), an output port (551-2), an output port (552-1), and an output port (552-2). The selection circuit (550) may identify two MIPI signals to be output through the multiple output ports based on a second signal received through the input port (553). For example, the selection circuit (550) may output a control signal for the first MIPI signal through the output port (551-1) and output a clock signal for the first MIPI signal through the output port (552-2). The selection circuit (550) can output a control signal for the second MIPI signal through the output port (551-2) and output a clock signal for the second MIPI signal through the output port (552-2).

[0107] In FIG. 6b, an example is shown in which two MIPI signals are output through the selection circuit (550), but is not limited thereto. Depending on the embodiment, the selection circuit (550) may output three or more MIPI signals.

[0108] FIG. 7 illustrates an example of an electronic device according to one embodiment.

[0109] Referring to FIG. 7, the electronic device (500) may correspond to the electronic device (400) of FIG. 4. The electronic device (500) may include a processor (501), an RF transceiver (510), a plurality of RFFE modules (530), and a plurality of RF couplers (710). Although not illustrated, as in FIG. 5a and FIG. 5b, the electronic device (500) may include a plurality of modulators. For example, the processor (501) may correspond to the processor (401) of FIG. 4. The RF transceiver (510) may be an example of the control circuit (410) of FIG. 4. Each of the plurality of RFFE modules (530) may be an example of the driving circuit (e.g., driving circuit (430-1) to driving circuit (430-m)) of FIG. 4. The selection circuit (550) may be an example of the selection circuit (450) of FIG. 4.

[0110] According to one embodiment, the RF transceiver (510) of the electronic device (500) may include an MCU (730). The MCU (730) may be configured to receive at least one control signal and / or at least one clock signal from a selection circuit (550). The MCU (730) may be configured to acquire a plurality of feedback signals regarding a plurality of output signals output from a plurality of RFFE modules (530).

[0111] According to one embodiment, the output port (551) of the selection circuit (550) may be connected to the input port (735) of the MCU (730). The output port (552) of the selection circuit (550) may be connected to the input port (736) of the MCU (730). For example, one of a plurality of control signals may be output through the output port (551) of the selection circuit (550). One of a plurality of control signals may be received through the input port (735) of the MCU (730). For example, one of a plurality of clock signals may be output through the output port (552) of the selection circuit (550). One of a plurality of clock signals may be received through the input port (736) of the MCU (730).

[0112] According to one embodiment, the electronic device (500) may include a plurality of RF coupler circuits (710). For example, the plurality of RF coupler circuits (710) may be configured to acquire a plurality of feedback signals (701) regarding a plurality of RF signals (or a plurality of output signals, a plurality of input signals) regarding a plurality of RFFE modules (530).

[0113] For example, an RF coupler (710-1) may be connected to the output terminal of an RFFE module (530-1). The RF coupler (710-1) may be configured to provide a feedback signal (701-1) regarding the RF signal of the RFFE module (530-1) to the MCU (730). For example, an RF coupler (710-2) may be connected to the output terminal of an RFFE module (530-2). The RF coupler (710-2) may be configured to provide a feedback signal (701-2) regarding the RF signal of the RFFE module (530-2) to the MCU (730). For example, an RF coupler (710-m) may be connected to the output terminal of an RFFE module (530-m). The RF coupler (710-m) can be configured to provide a feedback signal (701-m) regarding the RF signal of the RFFE module (530-m) to the MCU (730).

[0114] According to one embodiment, a plurality of feedback signals (701) may be provided to the MCU (730) through a plurality of power amplifiers (720). For example, a feedback signal (701-1) may be amplified through a power amplifier (720-1) and then provided to an input port (731-1) of the MCU (730). A feedback signal (701-2) may be amplified through a power amplifier (720-2) and then provided to an input port (731-2) of the MCU (730). A feedback signal (701-m) may be amplified through a power amplifier (720-m) and then provided to an input port (731-m) of the MCU (730).

[0115] According to one embodiment, the MCU (730) can output a control signal using an output port (732). The MCU (730) can output a feedback signal corresponding to the control signal using an output port (733). The MCU (730) can provide the control signal and the feedback signal to the processor (501). For example, the MCU (730) can perform time synchronization for the control signal and the feedback signal. Based on performing time synchronization, the MCU (730) can provide the control signal and the feedback signal to the processor (501).

[0116] For example, while multiple RF signals are output through multiple RFFE modules (530), the MCU (730) can acquire a control signal (or clock signal) from a selection circuit (550) and acquire multiple feedback signals from multiple RF coupler circuits (710). The MCU (730) can perform high-speed clock operation capable of measuring timing in real time and sequencing operation capable of adjusting timing on the time axis. Thus, the MCU (730) can perform the function of a measurement device. By providing the control signal and the feedback signal to the processor (501), the processor (501) can identify the control signal and the feedback signal (or RF signal) corresponding to the control signal. For example, the MCU (730) can provide data (e.g., a digital signal) for the feedback signal to the processor (501).

[0117] According to one embodiment, the processor (501) may receive at least one control signal among a plurality of control signals from the MCU (730). The processor (501) may receive at least one feedback signal among a plurality of feedback signals from the MCU (730). Based on at least one control signal and / or at least one feedback signal, the processor (501) may identify a malfunction of at least one of the RF transceiver (510) (or a plurality of MIPI circuits (520)) and / or a plurality of RFFE modules (530).

[0118] According to one embodiment, an electronic device (e.g., electronic device (400), electronic device (500)) may include a control circuit comprising a plurality of MIPI (mobile industry processor interface) circuits, a plurality of driving circuits connected to the plurality of MIPI circuits, and a selection circuit connected to a plurality of control paths between the plurality of MIPI circuits and the plurality of driving circuits. The selection circuit may be configured to output at least one control signal among a plurality of control signals provided to the plurality of driving circuits while a control signal is provided to each of the plurality of driving circuits.

[0119] For example, the electronic device may include at least one processor comprising a processing circuit. The at least one processor may be configured to transmit a first signal to the control circuit to control the operation of the plurality of driving circuits.

[0120] For example, the at least one processor may be configured to transmit a second signal to the selection circuit in order to output at least one of the plurality of control signals through the selection circuit.

[0121] The second signal above may indicate at least one control signal among the plurality of control signals.

[0122] For example, each of at least one of the plurality of MIPI circuits can be connected to one or more driving circuits.

[0123] For example, each of the remaining MIPI circuits among the plurality of MIPI circuits above can be connected to a driving circuit.

[0124] For example, among the at least one MIPI circuit, the first MIPI circuit may be connected to the first driving circuit and the second driving circuit. The first control signal transmitted from the first MIPI circuit may be provided to both the first driving circuit and the second driving circuit.

[0125] For example, the plurality of MIPI circuits may be connected to a plurality of driving circuits through a plurality of clock paths distinct from the plurality of control paths. The selection circuit may be connected to the plurality of clock paths.

[0126] For example, the selection circuit may be configured to output at least one control signal among the plurality of control signals provided to the plurality of driving circuits and at least one clock signal among the plurality of clock signals provided to the plurality of driving circuits while a control signal and a clock signal are provided to the corresponding driving circuit among the plurality of driving circuits from each of the plurality of MIPI circuits.

[0127] For example, the selection circuit may include at least one first port for outputting at least one control signal among the plurality of control signals and at least one second port for outputting at least one clock signal among the plurality of clock signals.

[0128] For example, the at least one control signal may be provided to at least one driving circuit. The at least one clock signal may be provided to the at least one driving circuit.

[0129] For example, each of at least one of the plurality of clock paths can be connected to a modulator.

[0130] For example, at least one modulator connected to at least one clock path among the plurality of clock paths may be configured to provide power to the plurality of driving circuits.

[0131] For example, the electronic device may include a resistor circuit having an impedance greater than a reference impedance between each of the plurality of clock paths and the selection circuit.

[0132] For example, the electronic device may include a resistor circuit having an impedance greater than the reference impedance between each of the plurality of clock paths and the selection circuit.

[0133] For example, the control circuit may include a microcontroller unit (MCU). The MCU may be configured to receive at least one control signal from the selection circuit and to acquire a plurality of feedback signals regarding a plurality of output signals output from the plurality of driving circuits.

[0134] For example, the electronic device may include an RF (radio frequency) coupler circuit for acquiring the plurality of feedback signals.

[0135] For example, the MCU may be configured to output data for at least one feedback signal among the plurality of feedback signals and at least one control signal.

[0136] For example, the electronic device may include at least one processor comprising a processing circuit. The at least one processor may be configured to receive the data for the at least one feedback signal and the at least one control signal from the MCU.

[0137] For example, the at least one processor may be configured to identify a malfunction of at least one of the control circuit and the plurality of driving circuits based on the data regarding the at least one feedback signal and the at least one control signal from the MCU.

[0138] For example, each of the multiple driving circuits can operate as an RFFE (radio frequency frontend).

[0139] According to the embodiments described above, MIPI malfunctions can be identified through MIPI signals provided to the RFFE module and signals output from the RFFE module. Timing or commands regarding the malfunction can be changed by modifying the code of the modem software. According to the embodiments described above, MIPI signals (e.g., control signals or clock signals) transmitted through the MIPI channel can be identified without additional soldering work on the MIPI channel. If the RF components are wrapped in a shield can for shielding, the MIPI signals can be identified without removing the shield can.

[0140] The electronic device according to the embodiments disclosed in this document may be of various forms. The electronic device may include, for example, a portable communication device (e.g., a smartphone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a consumer electronics device. The electronic device according to the embodiments of this document is not limited to the aforementioned devices.

[0141] The embodiments of this document and the terms used therein are not intended to limit the technical features described in this document to specific embodiments, and should be understood to include various modifications, equivalents, or substitutions of said embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of said items unless the relevant context clearly indicates otherwise. In this document, each of phrases such as "A or B," "at least one of A and B," "at least one of A or B," "A, B or C," "at least one of A, B and C," and "at least one of A, B, or C" may include any one of the items listed together in the corresponding phrase, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used simply to distinguish a component from another component and do not limit the components in any other aspect (e.g., importance or order). Where any component (e.g., the first) is referred to as "coupled" or "connected" to another component (e.g., the second), with or without the terms "functionally" or "communicationally," it means that said component may be connected to said other component directly (e.g., via a wire), wirelessly, or through a third component.

[0142] In one embodiment of this document, the term “module” used may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit, for example. A module may be a component formed integrally, or a minimum unit of said component or a part thereof that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0143] One embodiment of the present document may be implemented as software (e.g., program (140)) comprising one or more instructions stored in a storage medium (e.g., internal memory (136) or external memory (138)) readable by a machine (e.g., electronic device (101)). For example, a processor (e.g., processor (120)) of the machine (e.g., electronic device (101)) may call at least one of the one or more instructions stored in the storage medium and execute it. This enables the machine to be operated to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code that can be executed by an interpreter. The storage medium readable by the machine may be provided in the form of a non-transitory storage medium. Here, 'non-temporary' simply means that the storage medium is a tangible device and does not contain a signal (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently and cases where it is stored temporarily.

[0144] According to one embodiment, the method according to the embodiments disclosed herein may be provided by being included in a computer program product. The computer program product may be traded between a seller and a buyer as a product. The computer program product may be distributed in the form of a device-readable storage medium (e.g., CD-ROM (compact disc read-only memory)), or distributed online (e.g., download or upload) through an application store (e.g., Play Store™) or directly between two user devices (e.g., smartphones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily created on a device-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or a relay server.

[0145] According to one embodiment, each component (e.g., module or program) of the components described above may include a singular or multiple entities, and some of the multiple entities may be separated and placed in other components. According to one embodiment, one or more of the components or operations among the aforementioned components may be omitted, or one or more other components or operations may be added. Generally or additionally, multiple components (e.g., module or program) may be integrated into a single component. In this case, the integrated component may perform one or more functions of each of the multiple components in the same or similar manner as those performed by the corresponding component among the multiple components prior to integration. According to one embodiment, operations performed by the module, program, or other components may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

Claims

1. In an electronic device, A control circuit including a plurality of MIPI (mobile industry processor interface) circuits; A plurality of driving circuits connected to the plurality of MIPI circuits above; and It includes a selection circuit connected to a plurality of control paths between the plurality of MIPI circuits and the plurality of driving circuits, and The above selection circuit is, While a control signal is provided to each of the plurality of driving circuits, configured to output at least one control signal among the plurality of control signals provided to the plurality of driving circuits, Electronic device.

2. In claim 1, the electronic device is, It further includes at least one processor including a processing circuit, and The above-mentioned at least one processor is, Configured to transmit a first signal to the control circuit in order to control the operation of the plurality of driving circuits above, Electronic device.

3. In claim 2, the at least one processor is, To output at least one control signal among the plurality of control signals through the selection circuit, the selection circuit is configured to transmit a second signal to the selection circuit, and The above second signal is, Indicating at least one control signal among the plurality of control signals, Electronic device.

4. In claim 1, each of at least one MIPI circuit among the plurality of MIPI circuits is, connected to one or more driving circuits, Electronic device.

5. In claim 4, each of the remaining MIPI circuits among the plurality of MIPI circuits is, Connected to a single driving circuit, Electronic device.

6. In claim 4, the first MIPI circuit among the at least one MIPI circuit is, Connected to the first driving circuit and the second driving circuit, The first control signal transmitted from the first MIPI circuit is, Provided to both the first driving circuit and the second driving circuit, Electronic device.

7. In claim 1, the plurality of MIPI circuits are, Connected to a plurality of driving circuits through a plurality of clock paths distinct from the above plurality of control paths, and The above selection circuit is, Connected to the above plurality of clock paths, Electronic device.

8. In claim 7, the selection circuit is, While a control signal and a clock signal are provided from each of the plurality of MIPI circuits to the corresponding driving circuit among the plurality of driving circuits, the control signal is configured to output at least one control signal among the plurality of control signals provided to the plurality of driving circuits and at least one clock signal among the plurality of clock signals provided to the plurality of driving circuits. Electronic device.

9. In claim 8, the selection circuit is, A plurality of control signals including at least one first port for outputting at least one control signal among the plurality of control signals and at least one second port for outputting at least one clock signal among the plurality of clock signals. Electronic device.

10. In claim 9, the at least one control signal is, Provided to at least one driving circuit, and The above at least one clock signal is, provided to the above at least one driving circuit, Electronic device.

11. In claim 7, each of at least one clock path among the plurality of clock paths is, Connected to the modulator, Electronic device.

12. In claim 11, at least one modulator connected to at least one clock path among the plurality of clock paths is, Configured to provide power to the plurality of driving circuits above, Electronic device.

13. In claim 7, the electronic device is, A resistor circuit having an impedance greater than the reference impedance between each of the plurality of control paths and the selection circuit, Electronic device.

14. In claim 7, the electronic device is, A resistor circuit having an impedance greater than the reference impedance between each of the plurality of clock paths and the selection circuit, Electronic device.

15. In claim 1, the control circuit is, It further includes an MCU (micro controller unit), The above MCU is, Receives at least one control signal from the above selection circuit, and A plurality of feedback signals regarding a plurality of output signals output from the plurality of driving circuits, configured to acquire a plurality of feedback signals. Electronic device.

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