Hermetically sealed glass package
The hermetically sealed package with a barrier layer and laser bonding lines addresses permeability issues, enhancing durability and compatibility for long-lasting applications while maintaining transparency and biocompatibility.
AU2021223713B2Pending Publication Date: 2026-07-09SCHOTT AG
Patent Information
- Authority / Receiving Office
- AU · AU
- Patent Type
- Applications
- Current Assignee / Owner
- SCHOTT AG
- Filing Date
- 2021-02-19
- Publication Date
- 2026-07-09
Smart Images
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Abstract
The invention relates to an enclosure for encapsulating a functional region from the surrounding area, wherein the enclosure comprises a base substrate and a cover substrate, and the base substrate together with the cover substrate forms at least one part of the enclosure or the enclosure. The invention additionally relates to the at least one functional region arranged in the enclosure and to a locking device for reducing permeation between the enclosure and the functional region. The enclosure can have at least one laser bonding line, and the substrates of the enclosure can be joined together in a hermetically sealed manner by means of the at least one laser bonding line. The laser bonding line has a height (HL) perpendicular to the connection plane thereof.
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Citation Information
Patent Citations
Micromechanical component with a cavity and manufacturing method for such a component
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Electrical component, especially micromechanical silicon chip, has layer transparency enabling welding with laser beam with power density in joining plane increased to melt layers by absorption
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Methods and apparatus to improve FRIT-sealed glass package
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