Laser drilling method and device

Abstract

The present invention provides a laser drilling method and device, wherein the laser drilling method includes at least the following steps: emitting a laser beam in a direction perpendicular to a workpiece to be processed; dividing the laser beam into a plurality of split beams, and each split beam extends horizontally toward the periphery of the workpiece to be processed; reflecting and focusing each split beam in a direction perpendicular to the workpiece to be processed to form a plurality of laser points on the workpiece to be processed; driving each laser point to rotate in a circle around the laser beam to form a plurality of concentric circle scanning lines on the workpiece to be processed, thereby achieving drilling of the workpiece to be processed. The present invention only requires one high-speed circular rotation to achieve simultaneous completion of multiple concentric circle scanning and drilling on the workpiece to be processed, breaking through the speed limit of laser drilling in the prior art, greatly improving the efficiency of laser drilling, and at the same time being able to achieve the task of completing rapid laser drilling, greatly improving production efficiency.

Description

Technical Field

[0001] The present invention relates to the technical field of laser drilling, and in particular to a laser drilling method and device. Background Art

[0002] Laser drilling technology is generally divided into high-energy direct drilling and scan line cutting drilling. Among them, high-energy direct drilling is generally suitable for tiny holes, while scan line cutting drilling can process relatively large holes.

[0003] Chinese patent CN205733461U discloses a laser splitting solution, which is mainly used for laser direct perforation and can realize the simultaneous processing of multiple tiny holes. However, its actual light path distribution idea and the problem it solves cannot meet the processing requirements of different apertures and edge cutting width requirements.

[0004] Compared with the laser process of larger holes, two-dimensional galvanometer is currently used as the basic scanning device in many cases. The movement on the two-dimensional plane is realized by two swinging lenses, thereby realizing circular motion. Although it can realize circular motion through interpolation operation, its motion efficiency is not high; at the same time, because the galvanometer is a linear motion, the circumference is realized by fitting short lines, so its circumference processing accuracy cannot meet the requirements of high-precision laser drilling.

[0005] Chinese patent CN101670492A discloses a solution for LED three-beam laser scribing, in which an optical element that can be directly divided into three beams of light is used to divide the light beam into three beams on the same plane, and the cutting and scribing requirements of a certain width are achieved by controlling the angle between the plane of the three beams of light and the direction of movement. Although this solution can also achieve laser drilling, the light splitting technology of this solution is different and has great limitations. The number and spacing of its light splitting paths are limited to the design of the optical element structure, and it can only separate a limited number of light paths, which cannot meet the requirements of laser drilling processes for different workpieces. At the same time, if the two-dimensional working platform used in this solution is used for high-speed drilling operations, its processing efficiency and processing quality are very unsatisfactory.

[0006] In many cases in practice, in order to accurately control the hole size, the accuracy of the hole edge and to easily remove residual materials, it is necessary to cut a small width, that is, multiple parallel circular motions are required; especially when processing brittle materials, a width must be cut at the edge of the hole, and the cutting width needs to be adjusted according to the thickness of the workpiece. At the same time, in many cases, multiple repeated scans are required on the same circumference.

[0007] The existing technologies all have the above-mentioned disadvantages, such as low processing efficiency and low precision. Summary of the invention

[0008] In view of the above-mentioned shortcomings of the prior art, the purpose of the present invention is to provide a laser drilling method and device to solve the problems of low efficiency, low circumferential accuracy, and difficulty in adjusting the cutting width of the laser drilling technology in the prior art.

[0009] To achieve the above-mentioned object and other related objects, the present invention provides a laser drilling method, wherein the laser drilling method at least comprises the following steps:

[0010] A laser beam is emitted in a direction perpendicular to the workpiece to be processed;

[0011] Splitting the laser beam into a plurality of split beams, and each split beam extends horizontally toward the periphery of the workpiece to be processed;

[0012] Reflecting and focusing each split beam in a direction perpendicular to the workpiece to be processed to form a plurality of laser spots on the workpiece to be processed;

[0013] Each laser point is driven to rotate in a circle around the laser beam to form a plurality of concentric circle scanning lines on the workpiece to be processed, thereby achieving drilling of the workpiece to be processed.

[0014] Preferably, when forming each laser point, the straight-line distance from each laser point to the center of the workpiece to be processed is adjusted by adjusting the position and angle at which each split beam is reflected and focused, so as to meet the circular diameter of the hole required for the workpiece to be processed and the spacing between several concentric circle scanning lines.

[0015] Preferably, the straight-line distances from each laser point to the center of the workpiece to be processed are completely the same, partially the same, or completely different.

[0016] Preferably, when the laser beam is divided into a plurality of split beams, it is achieved by arranging a plurality of splitters around the laser beam on a plurality of planes perpendicular to the laser beam, wherein the splitters are distributed around the laser beam at uniform or non-uniform angles.

[0017] Preferably, the transmittance of the beam splitter is adjusted according to the number of the split beams and the energy requirements of each concentric circle scanning line.

[0018] Preferably, the number of the split beams is set according to the width requirement of the cutting line of the actual laser drilling process and the number requirement of each concentric circle scanning line.

[0019] Preferably, the spacing between the concentric circle scanning lines is greater than or equal to zero.

[0020] In order to achieve the above-mentioned object and other related objects, the present invention provides a laser drilling device, wherein the laser drilling device at least comprises:

[0021] A laser emission module, used for emitting a laser beam in a direction perpendicular to a workpiece to be processed;

[0022] A light splitting module, connected to the laser emitting module, for receiving the laser beam and splitting the received laser beam into a plurality of light splitting beams, and each light splitting beam extends horizontally toward the four sides of the workpiece to be processed;

[0023] A reflection and focusing module, connected to the light splitting module, for receiving each light splitting beam, and reflecting and focusing each light splitting beam in a direction perpendicular to the workpiece to be processed, so as to form a plurality of laser spots on the workpiece to be processed;

[0024] The driving module is respectively connected to the light splitting module and the reflecting and focusing module, and is used to drive each laser point to rotate in a circle around the laser beam to form a plurality of concentric circle scanning lines on the workpiece to be processed, thereby achieving drilling of the workpiece to be processed.

[0025] Preferably, the laser emission module at least comprises: a laser, and a beam expander connected to the laser.

[0026] Preferably, the beam splitter module at least comprises: a plurality of beam splitters arranged around the laser beam on a plurality of planes perpendicular to the laser beam, wherein the beam splitters are distributed around the laser beam at uniform or non-uniform angles.

[0027] Preferably, the reflection and focusing module at least comprises: a plurality of reflection mirrors arranged in one-to-one correspondence with each split light beam, and a plurality of focusing mirrors arranged in one-to-one correspondence with each reflection mirror.

[0028] Preferably, the reflection and focusing module adjusts the straight-line distance from each laser point to the center of the workpiece to be processed by adjusting the position and angle of each reflection mirror and each focusing mirror respectively, so as to meet the circle diameter required for drilling the workpiece to be processed and the spacing between several concentric circle scanning lines.

[0029] Preferably, the straight-line distances from each laser point to the center of the workpiece to be processed are completely the same, partially the same, or completely different.

[0030] Preferably, the driving module at least includes: a driving motor.

[0031] Preferably, the spacing between the concentric circle scanning lines is greater than or equal to zero.

[0032] Preferably, the laser drilling device further comprises: a movable platform for placing the workpiece to be processed and adjusting the distance between the workpiece to be processed and each laser point.

[0033] As described above, the laser drilling method and device of the present invention have the following beneficial effects: the present invention forms a plurality of laser points on the workpiece to be processed by dividing the laser beam into a plurality of split beams and performing reflection and focusing, and then drives each laser point to rotate in a circle around the laser beam, and only requires one high-speed circular rotation to realize the simultaneous completion of multiple concentric circle scanning and drilling on the workpiece to be processed, breaking through the speed limit of laser drilling in the prior art and greatly improving the efficiency of laser drilling. At the same time, in the case of only one laser beam, the present invention adjusts the straight-line distance from each laser point to the center of the workpiece to be processed by adjusting the position and angle of reflection and focusing of each split beam, thereby realizing the adjustment of different circle diameters of laser drilling, the spacing between each concentric circle scanning line, and the cutting width of the hole edge, etc., and can realize the completion of rapid laser drilling tasks, greatly improving production efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] Figure 1 It is a schematic flow chart of the laser drilling method according to the first embodiment of the present invention.

[0035] Figure 2 It is a schematic block diagram of the structure of a laser drilling device according to a second embodiment of the present invention.

[0036] Figure 3 It is a schematic structural diagram of a laser drilling device according to a third embodiment of the present invention.

[0037] Component number description

[0038] 10 Laser emission module

[0039] 11 Laser

[0040] 12 Beam Expander

[0041] 13 Laser Beam

[0042] 20 Splitter Module

[0043] 21. First beam splitter

[0044] 22 Second beam splitter

[0045] 23 Third beam splitter

[0046] 24 Fourth beam splitter

[0047] 30 Reflection and Focusing Modules

[0048] 31 First Reflector

[0049] 32 Second reflector

[0050] 33 Third reflector

[0051] 34 Fourth Reflector

[0052] 35 First focusing lens

[0053] 36 Second focusing lens

[0054] 37 Third focusing lens

[0055] 38 Fourth focusing lens

[0056] 40 Driver Module

[0057] 50 Workpieces to be processed

[0058] 51 First scan line

[0059] 52 Second scan line

[0060] 53 Third scan line

[0061] 54 Fourth scan line

[0062] 60 Activity Platform

[0063] Steps S1 to S4 DETAILED DESCRIPTION

[0064] The following describes the embodiments of the present invention through specific examples, and those skilled in the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification. The present invention can also be implemented or applied through other different specific embodiments, and the details in this specification can also be modified or changed in various ways based on different viewpoints and applications without departing from the spirit of the present invention.

[0065] See also Figure 1 The first embodiment of the present invention relates to a laser drilling method. It should be noted that the illustrations provided in this embodiment are only schematic illustrations of the basic concept of the present invention. The illustrations only show the components related to the present invention rather than the number, shape and size of the components in actual implementation. The type, quantity and proportion of each component in actual implementation may be changed arbitrarily, and the component layout may also be more complicated.

[0066] like Figure 1 As shown, the laser drilling method of this embodiment includes at least the following steps:

[0067] Step S1, emitting a laser beam in a direction perpendicular to a workpiece to be processed.

[0068] Step S2, splitting the laser beam into a plurality of split beams, and each split beam extends horizontally toward the periphery of the workpiece to be processed.

[0069] Step S3, reflecting and focusing each split light beam in a direction perpendicular to the workpiece to be processed, so as to form a plurality of laser spots on the workpiece to be processed.

[0070] Step S4, driving each laser point to rotate in a circle around the laser beam to form a plurality of concentric circle scanning lines on the workpiece to be processed, thereby achieving drilling of the workpiece to be processed.

[0071] Among them, in step S3, when each laser point is formed, the straight-line distance from each laser point to the center of the workpiece to be processed is adjusted by adjusting the position and angle at which each split light beam is reflected and focused, so as to meet the circular diameter of the hole required for the workpiece to be processed and the spacing between several concentric circle scanning lines.

[0072] In this embodiment, the spacing between the concentric scanning lines required for punching holes in the workpiece to be processed may be greater than zero or equal to zero. Furthermore, the spacing between two adjacent concentric scanning lines may be equal or unequal.

[0073] In addition, in this embodiment, the straight-line distances from each laser point to the center of the workpiece to be processed are completely the same, partially the same, or completely different. Therefore, the diameters of two adjacent concentric circle scanning lines obtained by the circumferential rotation of two adjacent laser points can be completely the same, partially the same, or completely different.

[0074] In addition, in this embodiment, when the laser beam is divided into a plurality of split beams, it is achieved by arranging a plurality of splitters around the laser beam on a plurality of planes perpendicular to the laser beam, wherein each splitter is distributed around the laser beam at a uniform or non-uniform angle. The transmittance of the splitter is adjusted according to the number of split beams and the energy requirements of each concentric circle scanning line. Of course, in other embodiments, other methods can also be used to split the laser beam, which is not limited to this embodiment.

[0075] In addition, in this embodiment, when each split light beam is reflected and focused in a direction perpendicular to the workpiece to be processed, a corresponding reflector is set on the optical path of each split light beam, and a corresponding focusing mirror is set on the optical path of the split light beam after being reflected by the reflector, and the position and angle of the reflector and the focusing mirror are adjusted to meet different circle diameters and realize the distance distribution between a plurality of concentric circle scanning lines. Of course, in other embodiments, other methods can also be used to reflect and focus each split light beam, which is not limited to this embodiment.

[0076] In addition, in this embodiment, the number of split beams is set according to the actual laser drilling process cutting line width requirements and the number of concentric circle scanning lines. It is worth mentioning that the minimum number of split beams can be 1 beam. When multiple scanning lines are not required, the optical paths of other split beams can be closed and only 1 split beam can be used; the maximum number of split beams is set according to the number of concentric circle scanning lines required by the laser drilling process; depending on the characteristics of the material to be cut, such as hardness, thickness, etc., a wider cutting width is sometimes required. In this case, a wider cutting requirement can be achieved by distributing more laser points (i.e., split beams) on the circumference.

[0077] In addition, in the present embodiment, the energy of the laser beam is equally divided by each split beam, that is, the energy of the laser beam is equal to the product of the energy of each split beam and the number of split beams. Taking the number of split beams as four as an example, each split beam can convert 25% of the laser beam energy. Of course, in other embodiments, the energy of the laser beam can be distributed to each split beam path according to process requirements, that is, the energy of the laser beam may not be equally divided in each split beam path, that is, the laser beam energy that can be converted by each split beam may be different, or may be partially the same, for example, the energy used by the middle line is higher than that of the edge line or vice versa, and is not limited to the distribution method in which the energy of the laser beam is equally divided by each split beam in the present embodiment.

[0078] The laser drilling method of this embodiment forms a plurality of laser points on the workpiece to be processed by dividing the laser beam into a plurality of split beams and reflecting and focusing the beams. The laser points are then driven to rotate in a circle around the laser beam. Only one high-speed circular rotation is required to simultaneously complete scanning and drilling of multiple concentric circles on the workpiece to be processed, thus breaking through the speed limitation of laser drilling in the prior art and greatly improving the efficiency of laser drilling.

[0079] Furthermore, the laser drilling method of this embodiment, when there is only one laser beam, adjusts the straight-line distance from each laser point to the center of the workpiece to be processed by adjusting the position and angle at which each split beam is reflected and focused, thereby achieving adjustment of different circle diameters of laser drilling, the spacing between concentric circle scanning lines, and the cutting width of the hole edge, etc., which can achieve the task of rapid laser drilling and greatly improve production efficiency.

[0080] The step division of the above methods is only for the purpose of clear description. When implemented, they can be combined into one step or some steps can be split and decomposed into multiple steps. As long as they contain the same logical relationship, they are all within the scope of protection of this patent; adding insignificant modifications to the algorithm or process or introducing insignificant designs without changing the core design of the algorithm and process are all within the scope of protection of this patent.

[0081] See also Figure 2 and Figure 3 The second embodiment of the present invention relates to a laser drilling device, which at least comprises:

[0082] The laser emitting module 10 is used to emit a laser beam 13 in a direction perpendicular to the workpiece 50 to be processed;

[0083] The light splitting module 20 is connected to the laser emitting module 10, and is used to receive the laser beam 13, and split the received laser beam 13 into a plurality of light splitting beams, and each light splitting beam extends horizontally toward the periphery of the workpiece 50 to be processed;

[0084] The reflection and focusing module 30 is connected to the light splitting module 20, and is used to receive each light splitting beam, and reflect and focus each light splitting beam in a direction perpendicular to the workpiece 50 to be processed, so as to form a plurality of laser spots on the workpiece 50 to be processed;

[0085] The driving module 40 is respectively connected to the light splitting module 20 and the reflecting and focusing module 30, and is used to drive each laser point to rotate in a circle around the laser beam 13 to form a plurality of concentric circle scanning lines on the workpiece 50 to be processed, thereby achieving drilling of the workpiece 50 to be processed.

[0086] In this embodiment, if Figure 3 As shown, the laser emitting module 10 at least comprises: a laser 11 and a beam expander 12 connected to the laser 11. The laser 11 is used to emit an initial laser, and the beam expander 12 is used to expand the initial laser to form a laser beam 13.

[0087] In this embodiment, the beam splitter module 20 at least includes: a plurality of beam splitters arranged around the laser beam 13 on a plurality of planes perpendicular to the laser beam 13, wherein the beam splitters are distributed around the laser beam 13 at uniform or non-uniform angles. Figure 3 For example, the beam splitter module 20 includes: a first beam splitter 21, a second beam splitter 22, a third beam splitter 23 and a fourth beam splitter 24, which are arranged around the laser beam 13 on four planes perpendicular to the laser beam 13 with uniform angle distribution.

[0088] In this embodiment, the reflection and focusing module 30 at least includes: a plurality of reflectors corresponding to each split beam, and a plurality of focusing mirrors corresponding to each reflector. It should be noted that each reflector is correspondingly arranged on the optical path of each split beam, and is used to reflect each split beam in a direction perpendicular to the workpiece 50 to be processed, and the focusing mirror is correspondingly arranged on the optical path of each split beam after being reflected by each reflector, and is used to focus each split beam after being reflected. Figure 3For example, the reflection and focusing module 30 includes: a first reflecting mirror 31 corresponding to the split beam separated by the first beam splitter 21, a second reflecting mirror 32 corresponding to the split beam separated by the second beam splitter 22, a third reflecting mirror 33 corresponding to the split beam separated by the third beam splitter 23, and a fourth reflecting mirror 34 corresponding to the split beam separated by the fourth beam splitter 24, and also includes: a first focusing mirror 35 corresponding to the optical path of the split beam after being reflected by the first reflecting mirror 31, a second focusing mirror 36 corresponding to the optical path of the split beam after being reflected by the second reflecting mirror 32, a third focusing mirror 37 corresponding to the optical path of the split beam after being reflected by the third reflecting mirror 33, and a fourth focusing mirror 38 corresponding to the optical path of the split beam after being reflected by the fourth reflecting mirror 34; each split beam forms four laser spots on the workpiece 50 to be processed after being reflected by each reflecting mirror and focused by each focusing mirror.

[0089] Moreover, in this embodiment, the reflection and focusing module 30 adjusts the straight-line distance from each laser point to the center of the workpiece 50 to be processed by adjusting the position and angle of each reflection mirror and each focusing mirror respectively, so as to meet the circle diameter of the hole required for the workpiece 50 to be processed and the spacing of several concentric circle scanning lines.

[0090] In addition, in the present embodiment, the straight-line distances from each laser point to the center of the workpiece 50 to be processed are completely the same, partially the same, or completely different.

[0091] In this embodiment, the driving module 40 at least includes: a driving motor. Figure 3 For example, a driving motor (not shown) drives four laser points to rotate in a circle around the laser beam 13 by controlling the rotation of four beam splitters, four reflectors and four focusing mirrors, thereby forming four concentric scanning lines on the workpiece 50 to be processed, namely a first scanning line 51, a second scanning line 52, a third scanning line 53 and a fourth scanning line 54.

[0092] In addition, in this embodiment, the spacing between the concentric circle scanning lines is greater than or equal to zero. It should be noted that the spacing between the concentric circle scanning lines can be zero. When repeated scanning on the same circumference is required, the position and angle of the reflector can be adjusted to overlap all the concentric circle scanning lines.

[0093] In addition, the laser drilling device of this embodiment further includes: a movable platform 60, which is used to place the workpiece 50 to be processed and adjust the distance between the workpiece 50 to be processed and each laser point. Figure 3For example, the movable platform 60 is set at the bottom, and the workpiece 50 to be processed is lifted and lowered by lifting the movable platform 60. When laser drilling is performed on thicker materials, the workpiece 50 to be processed is moved up and down by the movable platform 60, and the distance between the workpiece 50 to be processed and each laser point is changed, so that multi-level laser drilling can be achieved, thereby achieving laser drilling and cutting of thick materials. When laser drilling is performed on brittle transparent materials, the laser drilling operation can be started through the material on the lower surface of the material, and the through-hole operation can be achieved through the relative movement of the movable platform 60, which is conducive to the removal of cutting residues and improves the drilling quality.

[0094] The laser drilling device of this embodiment divides the laser beam into several split beams through the splitting module and reflects and focuses each split beam through the reflecting and focusing module, thereby forming several laser points on the workpiece to be processed, and then drives each laser point to rotate in a circle around the laser beam through the driving module. Only one high-speed circular rotation is required to simultaneously complete the scanning and drilling of multiple concentric circles on the workpiece to be processed, which breaks through the speed limitation of laser drilling in the prior art and greatly improves the efficiency of laser drilling.

[0095] Furthermore, the laser drilling device of this embodiment, when there is only one laser beam, adjusts the position and angle of reflection and focusing of each split light beam through the reflection and focusing module, so as to adjust the straight-line distance from each laser point to the center of the workpiece to be processed, thereby realizing the adjustment of different circle diameters of laser drilling, the spacing between each concentric circle scanning line and the cutting width of the hole edge, etc., which can complete the task of rapid laser drilling and greatly improve production efficiency.

[0096] It is not difficult to find that this embodiment is a device embodiment corresponding to the first embodiment, and this embodiment can be implemented in conjunction with the first embodiment. The relevant technical details mentioned in the first embodiment are still valid in this embodiment, and in order to reduce repetition, they are not repeated here. Accordingly, the relevant technical details mentioned in this embodiment can also be applied in the first embodiment.

[0097] It is worth mentioning that all modules involved in this embodiment are logic modules. In practical applications, a logic unit can be a physical unit, a part of a physical unit, or a combination of multiple physical units. In addition, in order to highlight the innovative part of the present invention, this embodiment does not introduce units that are not closely related to solving the technical problem proposed by the present invention, but this does not mean that there are no other units in this embodiment.

[0098] In summary, the laser drilling method and device of the present invention have the following beneficial effects: the present invention forms a plurality of laser points on the workpiece to be processed by dividing the laser beam into a plurality of split beams and performing reflection and focusing, and then drives each laser point to rotate in a circle around the laser beam. Only one high-speed circular rotation is required to realize the simultaneous completion of multiple concentric circle scanning and drilling on the workpiece to be processed, breaking through the speed limit of laser drilling in the prior art and greatly improving the efficiency of laser drilling. At the same time, in the case of only one laser beam, the present invention adjusts the straight-line distance from each laser point to the center of the workpiece to be processed by adjusting the position and angle of reflection and focusing of each split beam, thereby realizing the adjustment of different circle diameters of laser drilling, the spacing between each concentric circle scanning line, and the cutting width of the hole edge, etc., which can realize the completion of the task of rapid laser drilling and greatly improve the production efficiency. Therefore, the present invention effectively overcomes the various shortcomings of the prior art and has a high industrial utilization value.

[0099] The above embodiments are merely illustrative of the principles and effects of the present invention, and are not intended to limit the present invention. Anyone familiar with the technology may modify or change the above embodiments without violating the spirit and scope of the present invention. Therefore, all equivalent modifications or changes made by a person of ordinary skill in the art without departing from the spirit and technical ideas disclosed by the present invention shall still be covered by the claims of the present invention.

Claims

1. A laser drilling method, characterized in that: The laser drilling method comprises at least the following steps: A laser beam is emitted in a direction perpendicular to the workpiece to be processed; Splitting the laser beam into a plurality of split beams, and each split beam extends horizontally toward the periphery of the workpiece to be processed; Reflecting and focusing each split light beam in a direction perpendicular to the workpiece to be processed to form a plurality of laser spots on the workpiece to be processed; when forming each laser spot, adjusting the position and angle at which each split light beam is reflected and focused to adjust the linear distance from each laser spot to the center of the workpiece to be processed to meet the circle diameter required for drilling the workpiece to be processed and the spacing between a plurality of concentric circle scanning lines; Driving each laser point to rotate in a circle around the laser beam to form a plurality of concentric circle scanning lines on the workpiece to be processed, thereby achieving drilling of the workpiece to be processed; Among them, the laser beam is provided by a laser emitting module; the spectrometer module is connected to the laser emitting module, and divides the received laser beam into several spectrometer beams; the reflection and focusing module is connected to the spectrometer module for receiving each spectrometer beam, and reflecting and focusing each spectrometer beam in a direction perpendicular to the workpiece to be processed; the driving module is respectively connected to the spectrometer module and the reflection and focusing module, and is used to drive each laser point to rotate in a circle around the laser beam by controlling the rotation of the spectrometer module and the reflection and focusing module.

2. The laser drilling method according to claim 1, characterized in that: The straight-line distances from each laser point to the center of the workpiece to be processed are completely the same, partially the same, or completely different.

3. The laser drilling method according to claim 1, characterized in that: When the laser beam is divided into several split beams, it is achieved by arranging several splitters around the laser beam on several planes perpendicular to the laser beam, wherein the splitters are distributed around the laser beam at uniform or non-uniform angles.

4. The laser drilling method according to claim 3, characterized in that: The transmittance of the beam splitter is adjusted according to the number of the split beams and the energy requirements of each concentric circle scanning line.

5. The laser drilling method according to any one of claims 1 to 4, characterized in that: The number of the split beams is set according to the width requirement of the cutting line of the actual laser drilling process and the number requirement of each concentric circle scanning line.

6. The laser drilling method according to any one of claims 1 to 4, characterized in that: The spacing between the concentric circle scanning lines is greater than or equal to zero.

7. A laser drilling device, characterized in that: The laser drilling device at least comprises: A laser emission module, used for emitting a laser beam in a direction perpendicular to a workpiece to be processed; A light splitting module, connected to the laser emitting module, for receiving the laser beam and splitting the received laser beam into a plurality of light splitting beams, and each light splitting beam extends horizontally toward the four sides of the workpiece to be processed; A reflection and focusing module, connected to the light splitting module, is used to receive each split light beam, and reflect and focus each split light beam in a direction perpendicular to the workpiece to be processed, so as to form a plurality of laser points on the workpiece to be processed; the reflection and focusing module adjusts the straight-line distance from each laser point to the center of the workpiece to be processed by adjusting the position and angle of each reflector and each focusing mirror respectively, so as to meet the circle diameter of the hole to be punched in the workpiece to be processed and the spacing between a plurality of concentric circle scanning lines; The driving module is respectively connected to the light splitting module and the reflecting and focusing module, and is used to drive each laser point to rotate in a circle around the laser beam by controlling the rotation of the light splitting module and the reflecting and focusing module, so as to form a plurality of concentric circle scanning lines on the workpiece to be processed, thereby realizing the drilling of the workpiece to be processed.

8. The laser drilling device according to claim 7, characterized in that: The laser emission module at least includes: a laser and a beam expander connected to the laser.

9. The laser drilling device according to claim 7, characterized in that: The beam splitter module at least comprises: a plurality of beam splitters arranged around the laser beam on a plurality of planes perpendicular to the laser beam, wherein the beam splitters are distributed around the laser beam at uniform or non-uniform angles.

10. The laser drilling device according to claim 7, characterized in that: The reflection and focusing module at least comprises: a plurality of reflection mirrors arranged in one-to-one correspondence with each split light beam, and a plurality of focusing mirrors arranged in one-to-one correspondence with each reflection mirror.

11. The laser drilling device according to claim 7, characterized in that: The straight-line distances from each laser point to the center of the workpiece to be processed are completely the same, partially the same, or completely different.

12. The laser drilling device according to claim 7, characterized in that: The driving module at least includes: a driving motor.

13. The laser drilling device according to any one of claims 7 to 12, characterized in that: The spacing between the concentric circle scanning lines is greater than or equal to zero.

14. The laser drilling device according to any one of claims 7 to 12, characterized in that: The laser drilling device also includes: a movable platform for placing the workpiece to be processed and adjusting the distance between the workpiece to be processed and each laser point.

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