Display panel and manufacturing method thereof, and display device

Abstract

The present invention discloses a display panel and a manufacturing method thereof, and a display device, belonging to the field of display technology. The display panel includes an array substrate and a packaging cover plate that are arranged opposite to each other, wherein at least one target substrate exists in the array substrate and the packaging cover plate, wherein the target substrate has a display area and a non-display area, and a support structure is arranged in the non-display area, wherein a side of the support structure away from the display area is coplanar with a side surface of the array substrate or the packaging cover plate, wherein the support structure is obtained by a cutting support structure in the display motherboard when the display motherboard is cut along a cutting line to form a display panel, and since the orthographic projection of the cutting support structure on the target substrate covers the area where the cutting line is located, when the display motherboard is cut, the cutting is performed along the cutting support structure, thereby avoiding the problem of uneven force on the display motherboard caused by cutting to other areas, thereby ensuring the appearance and quality of the display panel.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a display panel and a manufacturing method thereof, and a display device. Background Art

[0002] With the development of display technology, display panels formed by organic light emitting diodes (OLED) have been widely used due to their characteristics of autonomous luminescence, fast response and wide viewing angle. Since the organic light-emitting materials used in OLED display panels are easily affected by water or oxygen and produce oxidation reactions, the display panels need to be packaged when manufacturing them.

[0003] In the related art, in order to achieve a narrow frame, cutting with glue is an effective technical means. Therefore, when manufacturing a display panel, it is necessary to first apply glass glue to the support area of ​​the display motherboard, and then irradiate the glass glue with a laser to solidify the glass glue. However, since the glass glue in the related art does not completely cover the cutting line area, when cutting the support area, the area not coated with glass glue may be cut, resulting in the surface layer of the cut section being the display substrate and the inner layer being glass glue or vacuum during the cutting process. The change in the cutting interface causes uneven force on the display motherboard, and the cut display panel will be damaged. Summary of the invention

[0004] The present invention provides a display panel and a manufacturing method thereof, and a display device, which can solve the problem in the related art that the display motherboard is subjected to uneven force during the cutting process because the glass glue may not completely cover the cutting line area, and the display panel obtained by cutting may be damaged. The technical solution is as follows:

[0005] In a first aspect, a display panel is provided, the display panel comprising: an array substrate and a packaging cover plate arranged opposite to each other;

[0006] There is at least one target substrate in the array substrate and the package cover plate, the target substrate has a display area and a non-display area surrounding the display area, and a support structure is arranged in the non-display area;

[0007] A packaging glue for packaging the array substrate and the packaging cover plate is disposed on a side of the support structure close to the display area, and a side of the support structure away from the display area is coplanar with a side surface of the array substrate or the packaging cover plate;

[0008] The support structure is obtained from the cutting support structure in the display motherboard when the display motherboard is cut along a cutting line to form the display panel, and the orthographic projection of the cutting support structure on the target substrate covers the area where the cutting line is located.

[0009] Optionally, the support structure is a square ring structure surrounded by two first strip structures extending along a first direction and two second strip structures extending along a second direction, and the first direction is not parallel to the second direction;

[0010] A packaging glue is disposed on one side of each strip structure close to the display area.

[0011] Optionally, the target substrate is an array substrate, and on the array substrate, a side of one of the two first strip structures away from the display area is a binding area for arranging a driving chip;

[0012] The support structure further includes: a third strip structure extending along the first direction;

[0013] The third strip structure is located at a side of the binding area away from the display area, and the binding area is located in an area surrounded by the third strip structure, one of the first strip structures, and two of the second strip structures;

[0014] Wherein, no packaging glue is provided in the binding area.

[0015] Optionally, the target substrate is the array substrate;

[0016] The support structure is arranged on the same layer as a pixel definition layer or a support layer in the array substrate.

[0017] In a second aspect, a method for manufacturing a display panel is provided, the method comprising:

[0018] Obtaining a first motherboard for forming an array substrate and a second motherboard for forming a package cover board, wherein there is at least one target motherboard among the first motherboard and the second motherboard, and each motherboard has a plurality of display areas and a non-display area surrounding each display area;

[0019] forming a cutting support structure in a non-display area around each display area on the target motherboard, wherein the orthographic projection of the cutting support structure on the target motherboard covers the area where the cutting line is located;

[0020] forming a packaging glue on a side of the cutting support structure away from the target motherboard;

[0021] Placing the first motherboard and the second motherboard opposite to each other and squeezing the packaging glue;

[0022] The first motherboard and the second motherboard are cut along the cutting lines to obtain a plurality of display panels.

[0023] Optionally, forming a cutting support structure in a non-display area around each display area on the target motherboard includes:

[0024] Forming a plurality of first strip-shaped support structures extending along a first direction and a plurality of second strip-shaped support structures extending along a second direction in a non-display area of ​​the target motherboard, wherein the first direction is not parallel to the second direction;

[0025] Wherein, each of the display areas is located in an area enclosed by two adjacent first strip-shaped support structures and two adjacent second strip-shaped support structures;

[0026] The step of forming a packaging adhesive on a side of the cutting support structure away from the target motherboard comprises:

[0027] A packaging glue is formed on a side of each of the second strip-shaped supporting structures away from the target motherboard.

[0028] Optionally, the target motherboard is a first motherboard for forming an array substrate, and on the first motherboard, a side of each of the first strip-shaped supporting structures away from the display area has a binding area for forming a driving chip;

[0029] The step of forming a packaging glue on a side of each cutting support structure away from the target motherboard comprises:

[0030] Forming packaging glue on a side of the target support segment of each of the second strip-shaped support structures away from the first motherboard, and forming packaging glue on a side of each of the first strip-shaped support structures close to the display area;

[0031] The target support segment of the second strip-shaped support structure is a support segment in the second strip-shaped support structure used to enclose the display area.

[0032] Optionally, the target motherboard is the first motherboard, and the forming of the cutting support structure in the non-display area around each display area on the target motherboard includes:

[0033] When a pixel definition layer or a support layer is formed on the first mother substrate, the cutting support structure is formed.

[0034] Optionally, the width of the cutting support structure is greater than the width of the fluctuation area of ​​the cutting wheel used for cutting the target motherboard;

[0035] Wherein, the width direction of the cutting support structure and the width direction of the cutting wheel fluctuation area are both perpendicular to the extension direction of the cutting line.

[0036] In a third aspect, a display device is provided, comprising: the display panel as described in the first aspect.

[0037] The beneficial effects brought by the technical solution provided by the present invention are:

[0038] In summary, the embodiment of the present invention provides a display panel and a manufacturing method thereof, and a display device. The display panel includes an array substrate and a packaging cover plate that are arranged relatively to each other, wherein at least one target substrate exists in the array substrate and the packaging cover plate, and the target substrate has a display area and a non-display area. A support structure is arranged in the non-display area, and the side of the support structure away from the display area is coplanar with a side surface of the array substrate or the packaging cover plate, and the support structure is obtained by the cutting support structure in the display mother board when the display mother board is cut along the cutting line to form the display panel. Since the orthographic projection of the cutting support structure on the target substrate covers the area where the cutting line is located, when the display mother board is cut, it can be ensured that the cutting knife is cut along the cutting support structure, thereby avoiding the problem of uneven force on the display mother board caused by the cutting knife cutting other areas, thereby ensuring the appearance and quality of the display panel. BRIEF DESCRIPTION OF THE DRAWINGS

[0039] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0040] Figure 1A is a schematic structural diagram of a display panel provided by an embodiment of the present invention;

[0041] Figure 1B is a top view of a target substrate provided by an embodiment of the present invention;

[0042] Figure 2A is a top view of another target substrate provided by an embodiment of the present invention;

[0043] Figure 2B is a schematic structural diagram of another display panel provided by an embodiment of the present invention;

[0044] Figure 2C is a top view of another target substrate provided by an embodiment of the present invention;

[0045] Figure 3A is a structural schematic diagram of another display panel provided by an embodiment of the present invention;

[0046] Figure 3B is a top view of an array substrate provided by an embodiment of the present invention;

[0047] Figure 4A is a structural schematic diagram of another display panel provided by an embodiment of the present invention;

[0048] Figure 4B is a top view of another array substrate provided by an embodiment of the present invention;

[0049] Figure 5 is a flow chart of a method for manufacturing a display panel provided by an embodiment of the present invention;

[0050] Figure 6 is a schematic structural diagram of a target motherboard provided by an embodiment of the present invention;

[0051] Figure 7 is a top view of a target motherboard provided by an embodiment of the present invention;

[0052] Figure 8 is a cross-sectional view of a target motherboard provided by an embodiment of the present invention;

[0053] Fig. 9 It is a cross-sectional view of another target motherboard provided by an embodiment of the present invention. DETAILED DESCRIPTION

[0054] In order to make the objectives, technical solutions and advantages of the present invention more clear, the embodiments of the present invention will be further described in detail below with reference to the accompanying drawings.

[0055] Figure 1A is a schematic diagram of the structure of a display panel provided by an embodiment of the present invention, such as Figure 1A As shown, the display panel may include: an array substrate 01 and a packaging cover plate 02 which are arranged opposite to each other.

[0056] There is at least one target substrate in the array substrate 01 and the package cover plate 02, for example Figure 1A The target substrate in the embodiment may be the array substrate 01. The target substrate has a display area T1 and a non-display area T2 surrounding the display area T1, and a support structure 11 may be provided in the non-display area T2. A packaging glue 12 for packaging the array substrate 01 and the packaging cover plate 02 is provided on a side of the support structure 11 close to the display area T1, and a side of the support structure 11 away from the display area T1 is coplanar with a side surface of the array substrate 01 or the packaging cover plate 02.

[0057] Figure 1B is a top view of a target substrate provided by an embodiment of the present invention, combined with Figure 1BIt can be seen that each of the array substrate 01 and the package cover plate 02 can be a cuboid, each of which can include two bottom surfaces and four side surfaces, and the support structure 11 can be arranged on a bottom surface of the target substrate. Correspondingly, the side of the support structure 11 away from the display area can also include four side surfaces, each of which can be coplanar with a side surface of the array substrate 01 or the package cover plate 02.

[0058] It should be noted that, in the embodiment of the present invention, the display panel is obtained by cutting the display motherboard along the cutting line with a cutting knife. The display motherboard may include a first motherboard for forming an array substrate and a second motherboard for forming a package cover. Accordingly, a cutting support structure may be provided on the motherboard used to form the target substrate among the first motherboard and the second motherboard. The orthographic projection of the cutting support structure on the target substrate may cover at least part of the area where the cutting line is located. After the display motherboard is cut along the cutting line, the cutting support structure in the display motherboard can be cut into the support structure 11 in the display panel, and combined with Figure 1B The support structure 11 coincides with the outer contour line of the positive projection of the array substrate 01 or the package cover plate 02 on the first plane, wherein the first plane may be a plane parallel to any bottom surface of the array substrate 01 or the package cover plate 02 .

[0059] Since the orthographic projection of the cutting support structure on the target substrate can cover the area where the cutting line is located, when cutting the display motherboard, it can be ensured that the cutting knife cuts along the cutting support structure, avoiding the problem of uneven force on the display motherboard caused by the cutting knife cutting other areas, thereby ensuring the appearance and quality of the display panel.

[0060] In summary, the display panel provided by the embodiment of the present invention includes an array substrate and a packaging cover plate that are arranged relatively to each other, wherein there is at least one target substrate in the array substrate and the packaging cover plate, wherein the target substrate has a display area and a non-display area, wherein a support structure is arranged in the non-display area, wherein a side of the support structure away from the display area is coplanar with a side surface of the array substrate or the packaging cover plate, and wherein the support structure is obtained from a cutting support structure in the display motherboard when the display motherboard is cut along a cutting line to form a display panel. Since the orthographic projection of the cutting support structure on the target substrate covers the area where the cutting line is located, when the display motherboard is cut, it can be ensured that the cutting knife is cut along the cutting support structure, thereby avoiding the problem of uneven force on the display motherboard caused by the cutting knife cutting other areas, thereby ensuring the appearance and quality of the display panel.

[0061] In the embodiment of the present invention, Figure 1AAs shown, the target substrate may be an array substrate 01, and a display device ( Figure 1A or the target substrate may also be a packaging cover plate 02; or the target substrate may also include an array substrate 01 and a packaging cover plate 02, that is, the array substrate 01 and the packaging cover plate 02 may both be provided with a support structure.

[0062] In the embodiment of the present invention, Figure 1B As shown, the support structure 11 may be an annular structure, for example, a square ring structure or a circular ring structure.

[0063] Figure 2A is a top view of another target substrate provided by an embodiment of the present invention, such as Figure 2A As shown, the support structure 11 may be a square ring structure formed by two first strip structures 111 extending along a first direction X and two second strip structures 112 extending along a second direction Y. The first direction X is not parallel to the second direction Y. For example, Figure 2A It can be seen that the first direction X and the second direction Y may be perpendicular. Figure 1B and Figure 2A It can be seen that a packaging glue 12 may be provided on one side of each strip structure close to the display area.

[0064] Figure 2B FIG. 1 is a schematic diagram of another display panel structure provided by an embodiment of the present invention. In an embodiment of the present invention, the area on the target substrate where the encapsulation glue 12 is disposed may be referred to as an encapsulation area T3. Figure 2B As shown in FIG. 1 , on the array substrate 01, the side of the packaging area T3 away from the display area T1 also has a binding area M for arranging the driver chip. In practical applications, after the display motherboard is cut, the portion of the packaging cover plate 02 located above the binding area M needs to be cut off. Therefore, in an optional implementation of the embodiment of the present invention, when the target substrate is the packaging cover plate 02, the top view of the packaging cover plate 02 can be as shown in FIG. Figure 2A As shown, the cross-sectional view of the display panel can be as shown Figure 2B As shown, reference Figure 2A and Figure 2B The side of each second strip structure 112 close to the display area may be in contact with the packaging glue 12 , and the side of each first strip structure 111 close to the display area may not be in contact with the packaging glue 12 .

[0065] In another optional implementation of the embodiment of the present invention, when the target substrate is an array substrate 01, the top view of the array substrate 01 can be as follows: Figure 2C Reference Figure 2C, one side of the two first strip structures 111 away from the display area is the binding area M. In addition, a portion of each second strip structure 112 is used to enclose the display area, and the other portion is located on one side of the binding area M. At this time, the side of each second strip structure 112 close to the display area can be in contact with the packaging glue 12, and the side of each first strip structure 111 close to the display area can be in contact with the packaging glue 12, or may not be in contact with the packaging glue 12. In addition, no packaging glue is set in the binding area M.

[0066] Figure 3A is a structural schematic diagram of another display panel provided by an embodiment of the present invention, Figure 3B is a top view of an array substrate provided by an embodiment of the present invention. In another optional implementation of the embodiment of the present invention, when the target substrate is an array substrate 01, Figure 3A and Figure 3B It can be seen that the display area T1 and the binding area M of the array substrate 01 can also be located within the orthographic projection of the support structure 11 on the array substrate 01, that is, the area surrounded by the support structure 11 can include the display area T1 and the binding area M. At this time, the side of each second strip structure 112 close to the display area can be in contact with the packaging glue 12, and the side of one of the two first strip structures 111 close to the display area is the binding area M for setting the driver chip, so the side of the first strip structure 111 close to the display area does not contact with the packaging glue 12; Figure 3B As shown, the side of another first strip structure 111 close to the display area may be in contact with the packaging glue 12, or the first strip structure 111 may not be in contact with the packaging glue 12, which is not limited in the embodiment of the present invention.

[0067] Figure 4A is a schematic diagram of the structure of another display panel provided by an embodiment of the present invention, Figure 4B is a top view of another array substrate provided by an embodiment of the present invention. In another optional implementation of the embodiment of the present invention, when the target substrate is an array substrate 01, Figure 2B and Figure 2C Based on the structure shown, Figure 4A and Figure 4B As shown, the support structure 11 may also include a third strip structure 113 extending along the first direction X, the third strip structure 113 is located on the side of the binding area M away from the display area T1, and the binding area M is located in the area enclosed by the third strip structure 113, a first strip structure 111 and two second strip structures 112.

[0068] That is, if Figure 4BAs shown, the two first strip structures 111 extending along the first direction X and the two second strip structures 112 extending along the second direction Y can form a first square ring F1, and the first strip structure 111 extending along the first direction X, the two second strip structures 112 extending along the second direction Y and the third strip structure 113 extending along the first direction X can form a second square ring F2. The display area T1 of the array substrate 01 can be located within the orthographic projection of the first square ring F1 on the array substrate 01, and the binding area M on the array substrate 01 can be located within the orthographic projection of the second square ring F2 on the array substrate 01.

[0069] In the embodiment of the present invention, reference Figure 4A and Figure 4B , the side of the first square ring F1 close to the display area T1 may be provided with packaging glue 12, and the side of the second square ring F2 close to the binding area M may not be provided with packaging glue 12, that is, packaging glue 12 is not provided in the binding area M. In addition, in order to prevent the part of the packaging cover plate 02 located above the binding area M from contacting with the packaging glue 12, during the process of manufacturing the display panel, when applying the packaging glue 12, for the first strip structure 111 located between the display area and the binding area M, the side of the first strip structure 111 close to the display area may not contact with the packaging glue 12, so that the packaging glue 12 will not flow into the binding area M after being squeezed, thereby reducing the probability of the packaging glue 12 contacting with the part of the packaging cover plate 02 above the binding area M, and improving the efficiency of cutting off the part of the cover plate above the binding area M.

[0070] In the embodiment of the present invention, Figure 1A As shown, when the target substrate is an array substrate 01, the support structure 11 can be provided at the same layer as the pixel definition layer or the support layer in the array substrate 01, which can simplify the manufacturing process.

[0071] It should be noted that, in the embodiment of the present invention, the support structure 11 can be made of resin material, and the packaging glue 12 can be glass glue. Figure 1B and Figure 2A It can be seen that the orthographic projection of the packaging glue 12 on the target substrate may also be annular, that is, the orthographic projection of the packaging glue 12 on the target substrate has the same shape as the orthographic projection of the support structure 11 on the target substrate.

[0072] In practical applications, when the encapsulation glue 12 is coated on the target substrate, the corner of the orthographic projection of the encapsulation glue 12 on the target substrate is generally an arc corner. Therefore, in order to make the shape of the support structure 11 match the shape of the encapsulation glue 12, the reference Figure 2A and Figure 3B, each corner of the support structure 11 can be a curved corner.

[0073] In summary, the display panel provided by the embodiment of the present invention includes an array substrate and a packaging cover plate that are arranged relatively to each other, wherein there is at least one target substrate in the array substrate and the packaging cover plate, wherein the target substrate has a display area and a non-display area, wherein a support structure is arranged in the non-display area, wherein a side of the support structure away from the display area is coplanar with a side surface of the array substrate or the packaging cover plate, and wherein the support structure is obtained from a cutting support structure in the display motherboard when the display motherboard is cut along a cutting line to form a display panel. Since the orthographic projection of the cutting support structure on the target substrate covers the area where the cutting line is located, when the display motherboard is cut, it can be ensured that the cutting knife is cut along the cutting support structure, thereby avoiding the problem of uneven force on the display motherboard caused by the cutting knife cutting other areas, thereby ensuring the appearance and quality of the display panel.

[0074] Figure 5 is a flow chart of a method for manufacturing a display panel provided by an embodiment of the present invention, such as Figure 5 As shown, the method may include:

[0075] Step 501: Obtain a first motherboard for forming an array substrate and a second motherboard for forming a package cover board.

[0076] Among them, there is at least one target motherboard in the first motherboard and the second motherboard, such as Figure 6 As shown, each motherboard may have a plurality of display areas T1 and a non-display area T2 surrounding each display area T1.

[0077] Step 502: forming a cutting support structure in a non-display area around each display area on the target motherboard.

[0078] In the embodiment of the present invention, the orthographic projection of the cutting support structure on the target mother substrate covers the area where the cutting line is located.

[0079] Figure 7 is a schematic diagram of the structure of a target motherboard provided by an embodiment of the present invention, such as Figure 7 As shown, a single patterning process can be used to form a cutting support structure 10 in a non-display area around each display area on the target motherboard. In addition, the cutting support structure 10 can be made of a resin material.

[0080] The one-time patterning process may include a series of processes such as curing, exposure and development. The specific implementation method may refer to relevant principles, and the embodiments of the present invention will not be described in detail.

[0081] refer to Figure 7It can be seen that the orthographic projection of the cutting support structure 10 on the target motherboard covers the cutting line L1 extending along the first direction X and the cutting line L2 extending along the second direction Y. Therefore, it can be ensured that when the display motherboard is cut, the cutting knife cuts the display motherboard along the cutting support structure 10, avoiding the problem of uneven force on the display motherboard caused by cutting other areas, thereby ensuring the appearance and quality of the display panel.

[0082] Step 503: forming packaging glue on a side of the cutting support structure away from the target motherboard.

[0083] In an embodiment of the present invention, the packaging glue can be coated on the side of the cutting support structure away from the target motherboard by screen printing, wherein the packaging glue can be glass glue.

[0084] For example, Figure 7 As shown, the encapsulation glue can be applied to a side of the cutting support structure 10 extending along the first direction X close to the display area, and the encapsulation glue can be applied to a side of the cutting support structure 10 extending along the second direction Y away from the target motherboard.

[0085] Step 504: Place the first motherboard and the second motherboard opposite to each other and squeeze the packaging glue.

[0086] In the embodiment of the present invention, when the encapsulation glue is squeezed, the encapsulation glue 12 formed on the side of the cutting support structure extending along the first direction X close to the display area will flow to the side close to the cutting support structure 10 after being squeezed, so as to contact the cutting support structure 10 extending along the first direction X. After the encapsulation glue 12 formed on the side of the cutting support structure extending along the second direction Y away from the target motherboard is squeezed, it will be separated into left and right parts by the cutting support structure 10 extending along the second direction Y, that is, the encapsulation glue 12 will be squeezed to both sides of the cutting support structure 10 extending along the second direction Y. Afterwards, the encapsulation glue 12 can be irradiated with a laser to solidify the encapsulation glue 12, thereby completing the encapsulation of the display motherboard.

[0087] There may be a small amount of packaging glue remaining on the surface of the support structure of the formed display panel, but the packaging glue will not affect the display panel.

[0088] Step 505: Cut the first motherboard and the second motherboard along the cutting line to obtain a plurality of display panels.

[0089] In the embodiment of the present invention, a cutting knife may be used to cut the first motherboard and the second motherboard along a cutting line, thereby obtaining a plurality of display panels.

[0090] For example, Figure 8 yes Figure 7A cross-sectional view of the target motherboard in the H1 direction is shown. Fig. 9 yes Figure 7 The cross section of the target motherboard in the H2 direction is shown. Figure 8 and Fig. 9 It can be seen that the orthographic projection of the cutting support structure 10 on the target motherboard can cover the area where the cutting lines L1 and L2 are located. Therefore, when cutting the first motherboard M1 and the second motherboard M2, it can be ensured that the cutting knife is cut along the cutting support structure 10, avoiding the problem of uneven force on the display motherboard due to cutting other areas, thereby ensuring the appearance and quality of the display panel.

[0091] It should be noted that, after the encapsulation glue on the side of the cutting support structure 10 extending along the first direction X close to the display area is squeezed, the encapsulation glue 12 may or may not contact the cutting support structure 10. Therefore, optionally, Fig. 9 As shown, after the first motherboard M1 and the second motherboard M2 are cut along the first direction X, there may be a gap between the cutting support structure 10 and the packaging glue 12. After the packaging glue on the side of the cutting support structure 10 extending along the second direction Y close to the display area is squeezed, as shown in FIG. Figure 8 As shown, the packaging glue 12 and the supporting structure 10 are in direct contact.

[0092] To summarize, in the manufacturing method of the display panel provided in the embodiment of the present invention, since a cutting support structure is formed in the non-display area of ​​the target motherboard, and the orthographic projection of the cutting support structure on the target motherboard covers the area where the cutting line is located, when the display motherboard is cut, it can be ensured that the cutting knife always cuts along the cutting support structure, thereby avoiding the problem of uneven force on the display motherboard caused by the cutting knife cutting other areas, thereby ensuring the appearance and quality of the display panel.

[0093] In an optional implementation of the embodiment of the present invention, the process of forming the cutting support structure shown in the above step 502 may specifically include:

[0094] A plurality of first strip-shaped support structures 101 extending along a first direction X and a plurality of second strip-shaped support structures 102 extending along a second direction Y are formed in the non-display area of ​​the target motherboard, and the first direction X is not parallel to the second direction Y. Figure 7 , the first direction X is perpendicular to the second direction Y.

[0095] Each display area of ​​the target motherboard may be located in an area surrounded by two adjacent first strip-shaped support structures 101 and two adjacent second strip-shaped support structures 102 .

[0096] Accordingly, in the above step 503 , the packaging glue 12 can be coated on the side of the second strip-shaped support structure 102 away from the target motherboard, and the packaging glue 12 can be coated on the side of the first strip-shaped support structure 101 close to the display area.

[0097] Further, when the target motherboard is a first motherboard for forming an array substrate, as Figure 7 As shown, on the first motherboard, each first strip support structure 101 has a binding area M for forming a driver chip on a side away from the display area. The binding area M is located in the area enclosed by the two adjacent first strip support structures 101 and the two adjacent second strip support structures 102.

[0098] In practical applications, after the display motherboard is cut along the cutting lines L1 and L2, it is also necessary to remove the portion of the package cover plate 02 located above the binding area M. Therefore, in order to improve the efficiency of the removal, in the above step 503, reference Figure 7 , a packaging glue 12 can be formed on a side of the target support segment of each second strip-shaped support structure 102 away from the first motherboard, and a packaging glue 12 can be formed on a side of the first strip-shaped support structure 101 close to the display area.

[0099] It should be noted that, in the embodiments of the present invention, reference Figure 7 It can be seen that a portion of the second strip support structure 102 can be used to enclose the display area, and another portion of the second strip support structure 102 can be used to enclose the binding area M. The target support segment of the second strip support structure 102 refers to the support segment of the second strip support structure 102 used to enclose the display area.

[0100] In order to prevent the partial packaging cover plate 02 located above the binding area M from contacting the packaging glue 12, when the packaging glue 12 is applied on the side of the first strip support structure 101 close to the display area, for the first strip support structure 101 located between the display area and the binding area M, the packaging glue 12 can be applied on the side of the first strip support structure 101 away from the binding area M, and the packaging glue 12 is prevented from contacting the first strip support structure 101, so that when the packaging glue 12 is squeezed, it will not flow into the binding area M, thereby reducing the probability of the packaging glue 12 contacting the partial packaging cover plate 02 above the binding area M, thereby improving the efficiency of cutting off the partial cover plate above the binding area M.

[0101] In an embodiment of the present invention, the target motherboard can be a first motherboard for forming an array substrate. In this case, a pixel definition layer or a support layer can be formed on the first motherboard while a cutting support structure can be formed on the first motherboard using the same mask process, thereby simplifying the manufacturing process of the display panel.

[0102] It should be noted that, combined with Figure 7 The width d of the cutting support structure 10 may be greater than the width of a cutting knife used to cut the display motherboard. The width of the cutting knife refers to the width of the blade wheel fluctuation area when the cutting knife cuts the display motherboard.

[0103] The width direction of the cutting support structure 10 and the width direction of the cutting wheel fluctuation area are both perpendicular to the extension direction of the cutting line. Figure 7 The width direction of the cutting support structure 10 is parallel to the surface of the target substrate. For the first strip support structure 101 extending along the first direction X in the cutting support structure 10, its width direction is perpendicular to the first direction X; for the second strip support structure 102 extending along the second direction Y in the cutting support structure 10, its width direction is perpendicular to the second direction Y.

[0104] Optionally, in the embodiment of the present invention, the width d of the cutting support structure 10 may be 100 micrometers.

[0105] In the embodiment of the present invention, the width d of the cutting support structure 10 can be adaptively adjusted to adjust the cutting accuracy when cutting the display motherboard according to the width of the cutting wheel fluctuation area, thereby avoiding the problem of uneven force on the display motherboard caused by cutting other areas when the width d of the cutting support structure 10 is small, thereby ensuring the appearance and quality of the display panel.

[0106] To summarize, in the manufacturing method of the display panel provided in the embodiment of the present invention, since a cutting support structure is formed in the non-display area of ​​the target motherboard, and the orthographic projection of the cutting support structure on the target motherboard covers the area where the cutting line is located, when the display motherboard is cut, it can be ensured that the cutting knife always cuts along the cutting support structure, thereby avoiding the problem of uneven force on the display motherboard caused by the cutting knife cutting other areas, thereby ensuring the appearance and quality of the display panel.

[0107] In addition, an embodiment of the present invention further provides a display device, which may include: Figures 1A to 4B The display panel shown. The display device can be: a liquid crystal panel, electronic paper, an OLED panel, an AMOLED panel, a mobile phone, a tablet computer, a television, a monitor, a notebook computer, a digital photo frame, a navigator, or any other product or component with a display function.

[0108] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. A display panel, characterized in that: The display panel comprises: an array substrate and a packaging cover plate which are arranged opposite to each other; There is at least one target substrate in the array substrate and the package cover plate, the target substrate has a display area and a non-display area surrounding the display area, and a support structure is arranged in the non-display area; A packaging glue for packaging the array substrate and the packaging cover plate is disposed on a side of the support structure close to the display area, the shape of the packaging glue matches the shape of the support structure, and a side of the support structure away from the display area is coplanar with a side surface of the array substrate or the packaging cover plate; The support structure is obtained from the cutting support structure in the display motherboard when the display motherboard is cut along a cutting line to form the display panel, and the orthographic projection of the cutting support structure on the target substrate covers the area where the cutting line is located.

2. The display panel according to claim 1, characterized in that: The support structure is a square ring structure formed by two first strip structures extending along a first direction and two second strip structures extending along a second direction, wherein the first direction is not parallel to the second direction; A packaging glue is disposed on one side of each strip structure close to the display area.

3. The display panel according to claim 2, characterized in that: The target substrate is an array substrate, and on the array substrate, a side of one of the two first strip structures away from the display area is a binding area for arranging a driving chip; The support structure further includes: a third strip structure extending along the first direction; The third strip structure is located at a side of the binding area away from the display area, and the binding area is located in an area surrounded by the third strip structure, one of the first strip structures, and two of the second strip structures; Wherein, no packaging glue is provided in the binding area.

4. The display panel according to any one of claims 1 to 3, characterized in that: The target substrate is the array substrate; The support structure is arranged on the same layer as a pixel definition layer or a support layer in the array substrate.

5. A method for manufacturing a display panel, characterized in that: The method comprises: Obtaining a first motherboard for forming an array substrate and a second motherboard for forming a package cover board, wherein there is at least one target motherboard among the first motherboard and the second motherboard, and each motherboard has a plurality of display areas and a non-display area surrounding each display area; forming a cutting support structure in a non-display area around each display area on the target motherboard, wherein the orthographic projection of the cutting support structure on the target motherboard covers the area where the cutting line is located; forming a packaging glue on a side of the cutting support structure away from the target motherboard; Placing the first motherboard and the second motherboard opposite to each other and squeezing the packaging glue; The first motherboard and the second motherboard are cut along the cutting lines to obtain a plurality of display panels.

6. The manufacturing method according to claim 5, characterized in that: The forming of a cutting support structure in a non-display area around each display area on the target motherboard comprises: Forming a plurality of first strip-shaped support structures extending along a first direction and a plurality of second strip-shaped support structures extending along a second direction in a non-display area of ​​the target motherboard, wherein the first direction is not parallel to the second direction; Wherein, each of the display areas is located in an area enclosed by two adjacent first strip-shaped support structures and two adjacent second strip-shaped support structures; The step of forming a packaging adhesive on a side of the cutting support structure away from the target motherboard comprises: A packaging glue is formed on a side of each of the second strip-shaped supporting structures away from the target motherboard.

7. The manufacturing method according to claim 6, characterized in that: The target motherboard is a first motherboard for forming an array substrate, and on the first motherboard, a side of each of the first strip-shaped support structures away from the display area has a binding area for forming a driving chip; The step of forming a packaging glue on a side of each cutting support structure away from the target motherboard comprises: Forming packaging glue on a side of the target support segment of each of the second strip-shaped support structures away from the first motherboard, and forming packaging glue on a side of each of the first strip-shaped support structures close to the display area; The target support segment of the second strip-shaped support structure is a support segment in the second strip-shaped support structure used to enclose the display area.

8. The manufacturing method according to claim 5, characterized in that: The target motherboard is the first motherboard, and the cutting support structure is formed in the non-display area around each display area on the target motherboard, including: When a pixel definition layer or a support layer is formed on the first mother substrate, the cutting support structure is formed.

9. The manufacturing method according to any one of claims 5 to 8, characterized in that: The width of the cutting support structure is greater than the width of a cutting blade used to cut the target mother board; Wherein, the width direction of the cutting support structure and the width direction of the cutting knife are both perpendicular to the extending direction of the cutting line.

10. A display device, characterized in that: The display device comprises: a display panel as claimed in any one of claims 1 to 4.

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