Circuit board assembly and camera module and manufacturing method thereof and electronic device with camera module

Abstract

The present application provides a circuit board assembly and a camera module and a manufacturing method thereof and an electronic device with the camera module, wherein the circuit board assembly comprises at least one electronic component, a substrate and a molding unit, at least one of the electronic components is conductively connected to the substrate at the back surface of the substrate, the molding unit comprises a back surface molding part and a molding base, wherein the back surface molding part is integrally combined with at least a part of the area of the back surface of the substrate, and the molding base is integrally combined with the front surface of the substrate, wherein the front surface of the substrate can not need to reserve a position for conductively connecting the electronic component, so as to reduce the length and width size of the camera module, thereby reducing the volume of the camera module.

Description

Technical Field

[0001] This invention relates to the field of optical imaging, and in particular to a circuit board assembly and a camera module, a method for manufacturing the same, and an electronic device with the camera module. Background Technology

[0002] Currently, electronic devices are increasingly moving towards intelligence and thinness, which places more stringent demands on the size and imaging quality of camera modules, which are a standard feature of electronic products.

[0003] On the one hand, to meet the trend of intelligent development in electronic products, it is necessary to configure more intelligent modules or mechanisms, such as sensors, and improve the imaging quality of camera modules. Understandably, due to the trend towards thinner and lighter electronic products, configuring more intelligent modules or mechanisms requires reducing the size of other modules or mechanisms. Since camera modules are relatively large and occupy a significant amount of internal space in electronic devices, it is necessary to consider how to reduce the size of camera modules to allow for more intelligent modules or mechanisms to be configured in electronic products.

[0004] On the other hand, to meet the trend of intelligent development in electronic products, camera modules need to be equipped with photosensitive elements with larger photosensitive areas and larger and more numerous passive electronic components. This undoubtedly increases the size of the camera module, thus hindering the thinning and lightening of electronic products. Currently, the photosensitive chip and passive electronic components of camera modules are all mounted on the same side of the circuit board. This arrangement of the photosensitive chip, passive electronic components, and circuit board means that the passive electronic components can only be arranged along the outer periphery of the photosensitive chip, and a safe distance must be reserved between adjacent passive electronic components to prevent mutual interference and adverse effects on the image quality of the camera module. This results in the inability to effectively reduce the length and width of the camera module. Those skilled in the art will understand that, due to increasingly higher requirements for the image quality of camera modules, the number of passive electronic components configured in camera modules is also increasing. These passive electronic components are arranged around the photosensitive chip on the same side of the photosensitive chip in a spaced-apart manner, which will further increase the length and width of the camera module. Therefore, the development trend of camera modules has prevented electronic devices from developing in tandem with the trends of intelligence and thinness. In other words, the current development trend of camera modules results in two consequences: the increasing intelligence of electronic devices requires camera modules to provide good image quality, which increases the size of the camera modules, hindering the thinness and lightness of electronic devices; conversely, the trend towards thinness and lightness requires reducing the size of the camera modules, which reduces the image quality of the camera modules, thus hindering the intelligence of electronic devices. Therefore, how to reduce the size of camera modules while maintaining image quality is a pressing technical problem that needs to be solved. Summary of the Invention

[0005] One object of the present invention is to provide a circuit board assembly and a camera module, a method of manufacturing the same, and an electronic device with the camera module, wherein the size of the camera module can be effectively reduced so that the camera module is particularly suitable for use in electronic devices that pursue thinness and lightness.

[0006] One object of the present invention is to provide a circuit board assembly and a camera module, a method for manufacturing the same, and an electronic device with the camera module, wherein the length and width dimensions of the camera module can be effectively reduced, so that when the camera module is applied to an electronic device that pursues thinness and lightness, the camera module can occupy less internal space of the electronic device, so that the internal space of the electronic device can be configured with more and larger intelligent components, thereby facilitating the further development of electronic devices towards intelligence.

[0007] One object of the present invention is to provide a circuit board assembly and a camera module, a method for manufacturing the same, and an electronic device with the camera module, wherein the camera module provides a substrate and at least one electronic component, the electronic component being located on the back side of the substrate, thereby eliminating the need to reserve much space on the front side of the substrate for connecting the electronic component, or even any space for connecting the electronic component, thereby reducing the length and width dimensions of the camera module.

[0008] One object of the present invention is to provide a circuit board assembly and a camera module, a method for manufacturing the same, and an electronic device with the camera module. Compared with the conventional camera module in which electronic components are arranged along the circumferential direction of the photosensitive chip, the camera module of the present invention has the photosensitive chip and the electronic components corresponding to each other in the height direction. For example, from a top view, the photosensitive chip and the electronic components can overlap each other. In this way, the length and width of the camera module can be effectively reduced.

[0009] One object of the present invention is to provide a circuit board assembly and a camera module, a method for manufacturing the same, and an electronic device having the camera module, wherein the camera module provides a molding unit, the molding unit including a back molding portion integrally bonded to the back side of the substrate, wherein the back molding portion is capable of embedding the electronic components, thereby preventing the surface of the electronic components from being oxidized by isolating the surface of the electronic components from the external environment, thereby ensuring good electrical properties of the electronic components.

[0010] One object of the present invention is to provide a circuit board assembly and a camera module, a method for manufacturing the same, and an electronic device with the camera module, wherein the back molding portion can isolate adjacent electronic components by embedding the electronic components, thereby avoiding adverse phenomena of mutual interference between adjacent electronic components.

[0011] One object of the present invention is to provide a circuit board assembly and a camera module, a method for manufacturing the same, and an electronic device with the camera module, wherein the back molding portion can prevent mutual interference between adjacent electronic components, thereby allowing a greater number and larger size of the electronic components to be connected on a limited area on the back side of the substrate, which is beneficial to improving the performance of the camera module.

[0012] One object of the present invention is to provide a circuit board assembly and a camera module, a method for manufacturing the same, and an electronic device having the camera module, wherein the back molding portion can reinforce the strength of the substrate and ensure the flatness of the substrate, thereby ensuring the flatness of the photosensitive chip mounted on the mounting area of ​​the substrate.

[0013] One object of the present invention is to provide a circuit board assembly and a camera module, a method for manufacturing the same, and an electronic device with the camera module, wherein the back molding portion can reinforce the strength of the substrate and ensure the flatness of the substrate, so that the substrate can be made of a thinner material to further reduce the height of the camera module.

[0014] One object of the present invention is to provide a circuit board assembly and a camera module, a method for manufacturing the same, and an electronic device having the camera module, wherein the back molding portion has good inertness, so that when the heat generated by the photosensitive chip is conducted to the back molding portion, the back molding portion will not deform, and the substrate will not deform, thereby further ensuring the flatness of the photosensitive chip and ensuring the good electrical properties of the substrate.

[0015] One object of the present invention is to provide a circuit board assembly and a camera module, a method for manufacturing the same, and an electronic device with the camera module, wherein the back molding portion has good heat dissipation capability to quickly radiate the heat generated by the photosensitive chip to the outside of the camera module, thereby ensuring the reliability of the camera module when it is used.

[0016] One object of the present invention is to provide a circuit board assembly and a camera module, a method for manufacturing the same, and an electronic device with the camera module, wherein during the assembly of the camera module into the electronic device, there is no need to worry about the electronic components being scratched by collisions with the assembly parts of the electronic device, or the electronic components being detached from the substrate, so as to ensure the reliability of the camera module during assembly.

[0017] One object of the present invention is to provide a circuit board assembly and a camera module, a method of manufacturing the same, and an electronic device having the camera module, wherein the back molding portion embeds the electronic components after being bonded to the back of the substrate of the substrate, so that when the camera module is accidentally vibrated, the electronic components prevent the back molding portion from falling off the back of the substrate of the substrate.

[0018] One object of the present invention is to provide a circuit board assembly and a camera module, a method for manufacturing the same, and an electronic device having the camera module, wherein the molding unit includes a molding base, wherein the molding base is integrally bonded to the front side of the substrate, thereby eliminating the need for a connecting medium such as adhesive between the substrate and the molding base. This not only reduces the height of the camera module but also eliminates concerns about adhesive or other connecting media contaminating the photosensitive chip.

[0019] One object of the present invention is to provide a circuit board assembly and a camera module, a method of manufacturing the same, and an electronic device having the camera module, wherein the molded base embeds at least a portion of the non-photosensitive area of ​​the photosensitive chip, so that the molded base, the photosensitive chip, and the substrate are integrally combined.

[0020] One object of the present invention is to provide a circuit board assembly and a camera module, a method of manufacturing the same, and an electronic device with the camera module, wherein the molded base embeds the non-photosensitive area of ​​the photosensitive chip, thereby eliminating the need for a safety space between the molded base and the photosensitive chip, and further reducing the length and width dimensions of the camera module.

[0021] One object of the present invention is to provide a circuit board assembly and a camera module, a method for manufacturing the same, and an electronic device with the camera module, wherein the molded base integrally embeds a connection line used to conductively connect the substrate and the photosensitive chip, thereby ensuring good electrical properties of the connection line.

[0022] One object of the present invention is to provide a circuit board assembly and a camera module, a method of manufacturing the same, and an electronic device with the camera module, wherein the cross-sectional shape of the optical lens is non-circular to reduce the unnecessary volume of the optical lens, thereby further reducing the length and width dimensions of the camera module.

[0023] According to one aspect of the present invention, a camera module is provided, comprising:

[0024] At least one optical lens;

[0025] At least one photosensitive chip;

[0026] At least one circuit board, wherein the circuit board includes a substrate and at least one electronic component, the photosensitive chip being conductively connected to the substrate, wherein the substrate has a front side and a back side, and at least one of the electronic components being conductively connected to the substrate on the back side; and

[0027] A molding unit, wherein the molding unit includes a back molding portion and a molding base, wherein when the back molding portion is integrally bonded to at least a portion of the back side of the substrate, the molding base is simultaneously integrally bonded to the front side of the substrate, wherein the molding base has at least one light window, the photosensitive area of ​​the photosensitive chip corresponds to the light window of the molding base, wherein the optical lens is disposed in the photosensitive path of the photosensitive chip, and the light window of the molding base forms a light path between the optical lens and the photosensitive chip.

[0028] According to one embodiment of the present invention, the molding base embeds the non-photosensitive area of ​​the photosensitive chip, so that the molding base, the photosensitive chip, the substrate and the back molding portion are integrally combined.

[0029] According to one embodiment of the present invention, the camera module further includes at least one set of connecting lines, wherein the photosensitive chip is mounted on the front side of the substrate, and the two ends of the connecting lines are respectively connected to the substrate connector of the substrate and the chip connector of the photosensitive chip, so as to conductively connect the photosensitive chip and the substrate through the connecting lines.

[0030] According to one embodiment of the present invention, the camera module further includes at least one frame-shaped support element, wherein the support element is disposed in a non-photosensitive area of ​​the photosensitive chip, or the support element is formed in a non-photosensitive area of ​​the photosensitive chip, and the molded base embeds at least a portion of the support element.

[0031] According to one embodiment of the present invention, the back molding portion embeds at least a portion of at least one of the electronic components.

[0032] According to one embodiment of the present invention, the back molding portion forms at least one assembly space.

[0033] According to one embodiment of the present invention, at least one of the electronic components is accommodated in the assembly space of the back molding portion.

[0034] According to one embodiment of the present invention, the height dimension of the back molded portion is denoted by parameter H, and the height dimension of the electronic component protruding from the back of the substrate is denoted by parameter h, wherein the value of parameter H is greater than or equal to the value of parameter h.

[0035] According to one embodiment of the present invention, at least one of the electronic components is electrically connected to the front side of the substrate.

[0036] According to one embodiment of the present invention, the molded base embeds at least a portion of at least one of the electronic components located on the front side of the substrate of the substrate.

[0037] According to one embodiment of the present invention, the back molding portion isolates the electronic components and the photosensitive chip located on the front side of the substrate.

[0038] According to an embodiment of the present invention, the shape of the back molding part is in the shape of a "square"; or the shape of the back molding part is in the shape of a "Π"; or the shape of the back molding part is in the shape of a "Γ"; or the shape of the back molding part is in the shape of an "I"; or the shape of the back molding part is in the shape of a "II"; or the shape of the back molding part is in the shape of a "III"; or the shape of the back molding part is in the shape of an "X"; or the shape of the back molding part is in the shape of an "L"; or the shape of the back molding part is in the shape of a "C"; or the shape of the back molding part is in the shape of a "square character"; or the shape of the back molding part is in the shape of a "grid character"; or the shape of the back molding part is in the shape of a "square"; or the shape of the back molding part is in the shape of a "rectangle"; or the shape of the back molding part is in the shape of a "trapezoid"; or the shape of the back molding part is in the shape of a "circle"; or the shape of the back molding part is in the shape of an "ellipse".

[0039] According to an embodiment of the present invention, the number of the back molding parts is at least one, wherein the back molding part is integrally formed at at least one corner of the substrate, or the back molding part is integrally combined with at least one side of the substrate, or the back molding part is integrally combined with the middle of the substrate.

[0040] According to an embodiment of the present invention, the number of the back molding parts is at least two, wherein at least one of the back molding parts is integrally formed at at least one corner of the substrate, and the other back molding parts are integrally combined with at least one side of the substrate; or at least one of the back molding parts is integrally formed at at least one corner of the substrate, and the other back molding parts are integrally combined with the middle of the substrate; or at least one of the back molding parts is integrally combined with at least one side of the substrate, and the other back molding parts are integrally combined with the middle of the substrate.

[0041] According to an embodiment of the present invention, at least one of the assembly spaces of the back molding part corresponds to the non - photosensitive area and / or the photosensitive area of the photosensitive chip.

[0042] According to an embodiment of the present invention, the substrate has at least one molding space, and at least one of the molding spaces is implemented as a through - hole to connect the front side and the back side of the substrate, wherein the molding base and the back molding part are connected to each other through the molding space.

[0043] According to an embodiment of the present invention, the circuit board includes at least one connecting board, wherein the module connection side of the connecting board is connected to the substrate on the front side of the substrate.

[0044] According to one embodiment of the present invention, the molded base embeds the module connection side of the connecting plate.

[0045] According to one embodiment of the present invention, the circuit board includes at least one connecting plate, wherein the module connecting side of the connecting plate is connected to the substrate on the back side of the substrate.

[0046] According to one embodiment of the present invention, the back molding portion encloses the module connection side of the connecting plate.

[0047] According to one embodiment of the present invention, the camera module further includes at least one filter element, wherein the filter element is mounted on the photosensitive chip such that the filter element is held between the optical lens and the photosensitive chip, and the molding base embeds the outer edge of the filter element.

[0048] According to one embodiment of the present invention, the camera module further includes at least one filter element, wherein the filter element is mounted on the top surface of the molded base so that the filter element is held between the optical lens and the photosensitive chip.

[0049] According to one embodiment of the present invention, the camera module further includes at least one filter element and a frame-shaped bracket, wherein the filter element is mounted on the bracket, and the bracket is mounted on the top surface of the molded base so that the filter element is held between the optical lens and the photosensitive chip.

[0050] According to one embodiment of the present invention, the camera module further includes at least one filter element, wherein the filter element is mounted on the optical lens so that the filter element is held between the optical lens and the photosensitive chip.

[0051] According to one embodiment of the present invention, the camera module further includes at least one driver, wherein the optical lens is drivably disposed on the driver, the driver being mounted on the top surface of the molding base to hold the optical lens in the photosensitive path of the photosensitive chip by means of the driver.

[0052] According to one embodiment of the present invention, the camera module further includes at least one lens barrel, wherein the optical lens is disposed in the lens barrel, wherein the lens barrel is attached to the top surface of the molding base, or the lens barrel extends integrally to the molding base, so that the optical lens is held in the photosensitive path of the photosensitive chip by means of the lens barrel.

[0053] According to one embodiment of the present invention, the optical lens is circular when viewed from above; or elliptical when viewed from above; or square when viewed from above.

[0054] According to one embodiment of the present invention, the optical lens has a planar side and an arcuate side, wherein the two sides of the planar side are respectively connected to the two sides of the arcuate side.

[0055] According to one embodiment of the present invention, the optical lens has two planar sides and one arcuate side, wherein one side of any one of the planar sides is connected to a side of the arcuate side, and the other side is connected to a side of the other planar side.

[0056] According to one embodiment of the present invention, the optical lens has two planar sides and two arcuate sides, wherein the two planar sides are symmetrical to each other, and the two arcuate sides are symmetrical to each other, wherein a side portion of any one of the planar sides is connected to a side portion of each of the two arcuate sides respectively.

[0057] According to one embodiment of the present invention, the optical lens has four planar sides and four arcuate sides, wherein every two planar sides are symmetrical to each other, every two arcuate sides are symmetrical to each other, and any one side of the planar side is connected to the side of each of the two arcuate sides respectively.

[0058] According to another aspect of the invention, the invention provides an electronic device comprising:

[0059] One device body; and

[0060] At least one camera module, wherein the camera module is disposed on the device body, and wherein the camera module further comprises:

[0061] At least one optical lens;

[0062] At least one photosensitive chip;

[0063] At least one circuit board, wherein the circuit board includes a substrate and at least one electronic component, the photosensitive chip being conductively connected to the substrate, wherein the substrate has a front side and a back side, and at least one of the electronic components being conductively connected to the substrate on the back side; and

[0064] A molding unit, wherein the molding unit includes a back molding portion and a molding base, wherein when the back molding portion is integrally bonded to at least a portion of the back side of the substrate, the molding base is simultaneously integrally bonded to the front side of the substrate, wherein the molding base has at least one light window, the photosensitive area of ​​the photosensitive chip corresponds to the light window of the molding base, wherein the optical lens is disposed in the photosensitive path of the photosensitive chip, and the light window of the molding base forms a light path between the optical lens and the photosensitive chip.

[0065] According to another aspect of the invention, the invention further provides a circuit board assembly comprising:

[0066] At least one electronic component;

[0067] A substrate, wherein the substrate has a front side and a back side, and at least one of the electronic components is electrically connected to the substrate via the back side; and

[0068] A molding unit, wherein the molding unit includes a back molding portion and a molding base, wherein when the back molding portion is integrally bonded to at least a portion of the back side of the substrate, the molding base is integrally bonded to the front side of the substrate.

[0069] According to one embodiment of the present invention, the circuit board assembly further includes at least one photosensitive chip, wherein the molding base has at least one light window, the photosensitive chip is mounted on the front side of the substrate through the light window of the molding base, and the photosensitive chip is conductively connected to the substrate, and the light-sensitive area of ​​the photosensitive chip corresponds to the light window of the molding base.

[0070] According to one embodiment of the present invention, the circuit board assembly further includes at least one photosensitive chip, wherein the photosensitive chip is mounted on the front side of the substrate and is conductively connected to the substrate, wherein the molding base has at least one light window, wherein the molding base embeds a non-photosensitive area of ​​the photosensitive chip, and the photosensitive area of ​​the photosensitive chip corresponds to the light window of the molding base.

[0071] According to one embodiment of the present invention, the circuit board assembly further includes a frame-shaped support element, wherein the support element is disposed in a non-photosensitive area of ​​the photosensitive chip, or the support element is formed in a non-photosensitive area of ​​the photosensitive chip, and the molding base embeds at least a portion of the support element.

[0072] According to an embodiment of the present invention, the back molding portion encapsulates at least a part of at least one of the electronic components.

[0073] According to an embodiment of the present invention, the back molding portion forms at least one assembly space.

[0074] According to an embodiment of the present invention, at least one of the electronic components is accommodated in the assembly space of the back molding portion.

[0075] According to an embodiment of the present invention, let the height dimension of the back molding portion be parameter H, and let the height dimension of the electronic component protruding from the back surface of the substrate be parameter h, where the value of parameter H is greater than or equal to the value of parameter h.

[0076] According to an embodiment of the present invention, the front surface of the substrate is conductively connected to at least one of the electronic components.

[0077] According to an embodiment of the present invention, the molding base encapsulates at least a part of at least one of the electronic components located on the front surface of the substrate.

[0078] According to an embodiment of the present invention, the back molding portion isolates the electronic components located on the front surface of the substrate and the photosensitive chip.

[0079] According to an embodiment of the present invention, the shape of the back molding portion is in the shape of "口" (square in Chinese); or the shape of the back molding portion is in the shape of "Π"; or the shape of the back molding portion is in the shape of "Γ"; or the shape of the back molding portion is in the shape of "I"; or the shape of the back molding portion is in the shape of "II"; or the shape of the back molding portion is in the shape of "III"; or the shape of the back molding portion is in the shape of "X"; or the shape of the back molding portion is in the shape of "L"; or the shape of the back molding portion is in the shape of "C"; or the shape of the back molding portion is in the shape of "日" (square in Chinese); or the shape of the back molding portion is in the shape of "井" (grid in Chinese); or the shape of the back molding portion is in the shape of "田" (square in Chinese); or the shape of the back molding portion is in a grid shape; or the shape of the back molding portion is square; or the shape of the back molding portion is rectangular; or the shape of the back molding portion is trapezoidal; or the shape of the back molding portion is circular; or the shape of the back molding portion is oval.

[0080] According to an embodiment of the present invention, the number of the back molding portions is at least one, where the back molding portion is integrally formed at at least one corner of the substrate, or the back molding portion is integrally combined with at least one side portion of the substrate, or the back molding portion is integrally combined with the middle portion of the substrate.

[0081] According to one embodiment of the present invention, the number of back molded portions is at least two, wherein at least one back molded portion is integrally formed at at least one corner of the substrate, and the other back molded portion is integrally attached to at least one side of the substrate; or at least one back molded portion is integrally formed at at least one corner of the substrate, and the other back molded portion is integrally attached to the middle of the substrate; or at least one back molded portion is integrally attached to at least one side of the substrate, and the other back molded portion is integrally attached to the middle of the substrate.

[0082] According to one embodiment of the present invention, at least one of the assembly spaces of the back molding portion corresponds to the non-photosensitive area and / or photosensitive area of ​​the photosensitive chip.

[0083] According to one embodiment of the present invention, the substrate has at least one molding space, at least one of the molding spaces being configured as a through hole to connect the front side and the back side of the substrate, wherein the molding base and the back molding portion are interconnected through the molding space.

[0084] According to one embodiment of the present invention, the circuit board includes at least one connecting plate, wherein the module connecting side of the connecting plate is connected to the substrate on the front side of the substrate.

[0085] According to one embodiment of the present invention, the circuit board includes at least one connecting plate, wherein the module connecting side of the connecting plate is connected to the substrate on the back side of the substrate.

[0086] According to one embodiment of the present invention, the molded base embeds the module connection side of the connecting plate.

[0087] According to one embodiment of the present invention, the back molding portion encloses the module connection side of the connecting plate.

[0088] According to another aspect of the present invention, the present invention further provides a method for manufacturing a camera module, wherein the manufacturing method includes the following steps:

[0089] (a) At least one electronic component is electrically connected to the back side of a substrate.

[0090] (b) A back molded portion integrally bonded to the substrate is formed on the back side of the substrate and a molded base integrally bonded to the substrate is formed on the front side of the substrate, wherein the molded base has at least one light window.

[0091] (c) Aligning the photosensitive area of ​​a photosensitive chip conductively connected to the substrate with the light window of the molding base; and

[0092] (d) An optical lens is held in the light-sensing path of the photosensitive chip to obtain the camera module.

[0093] According to one embodiment of the present invention, in step (a), at least one of the electronic components is electrically connected to the front side of the substrate of the substrate.

[0094] According to one embodiment of the present invention, step (c) further includes the following steps:

[0095] (c.1) The photosensitive chip is mounted onto the front side of the substrate through the light window of the molded base; and

[0096] (c.2) A connecting line is formed between the chip connector of the photosensitive chip and the substrate connector of the substrate to electrically connect the photosensitive chip and the substrate.

[0097] According to an embodiment of the present invention, in the above method, the photosensitive chip is first mounted on the front side of the substrate and the photosensitive chip is conductively connected to the substrate. Then, a molding base integrally bonded to the substrate is formed on the front side of the substrate, so that the molding base encloses the non-photosensitive area of ​​the photosensitive chip and the photosensitive area of ​​the photosensitive chip corresponds to the light window of the molding base.

[0098] According to an embodiment of the present invention, in the above method, after the photosensitive chip is electrically connected to the substrate, a frame-shaped support element is disposed in the non-photosensitive area of ​​the photosensitive chip, or the frame-shaped support element is formed in the non-photosensitive area of ​​the photosensitive chip, and then the molding base integrally bonded to the substrate is formed on the front side of the substrate, thereby embedding at least a portion of the support element in the molding base.

[0099] According to one embodiment of the present invention, in step (b), the back molding portion is used to embed at least a portion of at least one of the electronic components.

[0100] According to one embodiment of the present invention, in step (b), the molded base is used to embed at least a portion of at least one of the electronic components.

[0101] According to one embodiment of the present invention, in step (b), the back molding portion is formed to form at least one assembly space.

[0102] According to one embodiment of the present invention, the electronic components are housed in the assembly space.

[0103] According to one embodiment of the present invention, the assembly space corresponds to the non-photosensitive area and / or photosensitive area of ​​the photosensitive chip.

[0104] According to one embodiment of the present invention, step (b) further includes the following steps:

[0105] (b.1) The substrate is placed into a molding die;

[0106] (b.2) Perform a mold closing process on the molding die to form a first molding space between an upper mold of the molding die and the front side of the substrate of the substrate, and a second molding space between a lower mold of the molding die and the back side of the substrate of the substrate, and the first molding space and the second molding space are interconnected.

[0107] (b.3) Adding a fluid medium to at least one of the first molding space and the second molding space, such that the fluid medium fills the first molding space and the second molding space, and solidifies within the first molding space and the second molding space; and

[0108] (b.4) After performing a draft process on the molding die, a molding base integrally bonded to the front side of the substrate and a back molding portion integrally bonded to the back side of the substrate are formed on the back side of the substrate.

[0109] According to one embodiment of the present invention, in step (b.1), a panel unit formed by a plurality of the substrates is placed into the molding die, thereby step (b.4) further includes the following steps:

[0110] (b.4.1) Demolding the molding die to form a semi-finished circuit board assembly, wherein the circuit board assembly includes the substrate and the molding base and the back molding portion integrally bonded to the substrate; and

[0111] (b.4.2) Divide the semi-finished circuit board assembly to obtain the circuit board assembly.

[0112] According to one embodiment of the present invention, in step (b.2), a plurality of first molding spaces and a first connecting channel connecting adjacent first molding spaces are formed between the upper mold and the front side of the substrate of the substrate, and a plurality of second molding spaces and a second connecting channel connecting adjacent second molding spaces are formed between the lower mold and the back side of the substrate of the substrate, wherein at least one first molding space and at least one second molding space are interconnected, so that in step (b.3), the fluid medium fills all the first molding spaces and the second molding spaces. Attached Figure Description

[0113] Figure 1 This is a cross-sectional schematic diagram of one of the manufacturing steps of a camera module according to a preferred embodiment of the present invention.

[0114] Figure 2 This is a cross-sectional schematic diagram of the second manufacturing step of the camera module according to the above-described preferred embodiment of the present invention.

[0115] Figure 3A and Figure 3B This is a cross-sectional schematic diagram of the third manufacturing step of the camera module according to the above-described preferred embodiment of the present invention.

[0116] Figure 4 This is a cross-sectional schematic diagram of the fourth manufacturing step of the camera module according to the above-described preferred embodiment of the present invention.

[0117] Figure 5 This is a cross-sectional schematic diagram of the fifth manufacturing step of the camera module according to the above-described preferred embodiment of the present invention.

[0118] Figure 6 This is a cross-sectional schematic diagram of the sixth manufacturing step of the camera module according to the above-described preferred embodiment of the present invention.

[0119] Figure 7 This is a cross-sectional schematic diagram of the seventh manufacturing step of the camera module according to the above-described preferred embodiment of the present invention.

[0120] Figure 8A and Figure 8B This is a cross-sectional schematic diagram of the eighth manufacturing step of the camera module according to the above-described preferred embodiment of the present invention.

[0121] Figure 9 A cross-sectional view of step nine of the manufacturing process of the camera module according to the preferred embodiment of the present invention.

[0122] Figure 10 This is a schematic diagram of the internal structure of the camera module according to the above-described preferred embodiment of the present invention after being cut open along the middle position.

[0123] Figure 11A This is a perspective view of the camera module according to the above-described preferred embodiment of the present invention.

[0124] Figure 11B This is a perspective view of the camera module according to the preferred embodiment of the present invention from another angle.

[0125] Figure 12 This is a perspective view of the application state of the camera module according to the above-described preferred embodiment of the present invention.

[0126] Figure 13 This is a perspective view of a modified embodiment of the camera module according to the above-described preferred embodiment of the present invention.

[0127] Figure 14 This is a perspective view of another modified embodiment of the camera module according to the above-described preferred embodiment of the present invention.

[0128] Figure 15 This is a perspective view of another modified embodiment of the camera module according to the above-described preferred embodiment of the present invention.

[0129] Figure 16 This is a perspective view of another modified embodiment of the camera module according to the above-described preferred embodiment of the present invention.

[0130] Figure 17 This is a perspective view of another modified embodiment of the camera module according to the above-described preferred embodiment of the present invention.

[0131] Figure 18 This is a perspective view of another modified embodiment of the camera module according to the above-described preferred embodiment of the present invention.

[0132] Figure 19 This is a perspective view of another modified embodiment of the camera module according to the above-described preferred embodiment of the present invention.

[0133] Figure 20 This is a perspective view of another modified embodiment of the camera module according to the above-described preferred embodiment of the present invention.

[0134] Figure 21 This is a perspective view of another modified embodiment of the camera module according to the above-described preferred embodiment of the present invention.

[0135] Figure 22A This is a cross-sectional schematic diagram of another modified embodiment of the camera module according to the above-described preferred embodiment of the present invention.

[0136] Figure 22BThis is a cross-sectional schematic diagram of another modified embodiment of the camera module according to the above-described preferred embodiment of the present invention.

[0137] Figure 23 This is a cross-sectional schematic diagram of another modified embodiment of the camera module according to the above-described preferred embodiment of the present invention.

[0138] Figure 24 This is a cross-sectional schematic diagram of another modified embodiment of the camera module according to the above-described preferred embodiment of the present invention.

[0139] Figure 25 This is a cross-sectional schematic diagram of another modified embodiment of the camera module according to the above-described preferred embodiment of the present invention.

[0140] Figure 26 This is a cross-sectional schematic diagram of another modified embodiment of the camera module according to the above-described preferred embodiment of the present invention.

[0141] Figure 27 This is a cross-sectional schematic diagram of another modified embodiment of the camera module according to the above-described preferred embodiment of the present invention.

[0142] Figure 28 This is a cross-sectional schematic diagram of another modified embodiment of the camera module according to the above-described preferred embodiment of the present invention.

[0143] Figure 29 This is a cross-sectional schematic diagram of another modified embodiment of the camera module according to the above-described preferred embodiment of the present invention.

[0144] Figure 30 This is a cross-sectional schematic diagram of another modified embodiment of the camera module according to the above-described preferred embodiment of the present invention.

[0145] Figure 31 This is a cross-sectional schematic diagram of another modified embodiment of the camera module according to the above-described preferred embodiment of the present invention.

[0146] Figure 32 This is a top view schematic diagram of an embodiment of an optical lens of the camera module according to the above-described preferred embodiment of the present invention.

[0147] Figure 33 This is a top view schematic diagram of a modified embodiment of the optical lens of the camera module according to the above-described preferred embodiment of the present invention.

[0148] Figure 34 This is a top view schematic diagram of another modified embodiment of the optical lens of the camera module according to the above-described preferred embodiment of the present invention.

[0149] Figure 35 This is a top view schematic diagram of another modified embodiment of the optical lens of the camera module according to the above-described preferred embodiment of the present invention.

[0150] Figure 36 This is a top view schematic diagram of another modified embodiment of the optical lens of the camera module according to the above-described preferred embodiment of the present invention.

[0151] Figure 37 This is a top view schematic diagram of another modified embodiment of the optical lens of the camera module according to the above-described preferred embodiment of the present invention.

[0152] Figure 38 This is a top view schematic diagram of another modified embodiment of the optical lens of the camera module according to the above-described preferred embodiment of the present invention.

[0153] Figure 39 This is a top view schematic diagram of another modified embodiment of the optical lens of the camera module according to the above-described preferred embodiment of the present invention. Detailed Implementation

[0154] The following description is intended to disclose the present invention and enable those skilled in the art to implement it. The preferred embodiments described below are merely examples, and other obvious variations will occur to those skilled in the art. The basic principles of the invention defined in the following description can be applied to other embodiments, modifications, improvements, equivalents, and other technical solutions that do not depart from the spirit and scope of the invention.

[0155] Those skilled in the art should understand that, in the disclosure of this invention, the terms "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, the above terms should not be construed as limiting this invention.

[0156] It is understood that the term "a" should be understood as "at least one" or "one or more", that is, in one embodiment, the number of an element can be one, while in another embodiment, the number of the element can be multiple, and the term "a" should not be understood as a limitation on the number.

[0157] Refer to the accompanying drawings of the specification of this invention. Figures 1 to 12A camera module 100 according to a preferred embodiment of the present invention and its application are described below, wherein at least one of the camera modules 100 can be mounted on a device body 200 so that the camera module 100 and the device body 200 can form an electronic device. (Refer to the attached drawing.) Figure 12 .

[0158] In other words, the electronic device includes the device body 200 and at least one camera module 100 disposed on the device body 200, wherein the camera module 100 can be used to acquire images (e.g., videos or pictures).

[0159] It is worth mentioning that, although in the appendix Figure 12 In the example of the electronic device shown, the camera module 100 is disposed on the back side of the device body 200 (the side facing away from the display screen of the device body 200). It is understood that the camera module 100 may also be disposed on the front side of the device body 200 (the side where the display screen of the device body 200 is located), or at least one camera module 100 may be disposed on the back side of the device body 200 and at least one camera module 100 may be disposed on the back side of the device body 200, that is, at least one camera module 100 may be provided on both the back and front sides of the device body 200. Nevertheless, those skilled in the art will understand that in other examples of the electronic device, it is also possible to dispose of one or more camera modules 100 on the side of the device body 200.

[0160] In addition, although in the appendix Figure 12 The device body 200 of the electronic device shown is a smartphone, but in other examples, the device body 200 may also be implemented as, but is not limited to, a tablet computer, e-reader, MP3 / 4 / 5 player, personal digital assistant, camera, television, washing machine, refrigerator, or any electronic product that can be configured with the camera module 100.

[0161] Appendix Figure 10 A schematic diagram of the internal structure of the camera module 100 after it has been cut open along its central position is shown. Figure 11A and Figure 11B The camera module 100 is shown in three-dimensional form from different perspectives. Specifically, the camera module 100 includes at least one optical lens 10, at least one photosensitive chip 20, and a circuit board 30, wherein the photosensitive chip 20 is electrically connected to the circuit board 30, and the optical lens 10 is held in the light-sensing path of the photosensitive chip 20.

[0162] Light reflected from an object enters the camera module 100 through the optical lens 10, and is then received and photoelectrically converted by the photosensitive chip 20 to form an image. The electrical signal related to the object's image obtained by the photosensitive chip 20 can be transmitted by the circuit board 30. For example, the circuit board 30 can transmit the electrical signal related to the object's image to the device body 200 connected to the circuit board 30. In other words, the circuit board 30 can be electrically connected to the device body 200 to assemble the camera module 100 into the device body 200 to form the electronic device.

[0163] Further, see Appendix Figure 10 The circuit board 30 includes a substrate 31 and at least one electronic component 32, wherein each of the electronic components 32 is electrically connected to the substrate 31.

[0164] Specifically, the substrate 31 has a front side 311 and a back side 312. Typically, the substrate 31 is plate-shaped, and the front side 311 and the back side 312 of the substrate 31 are parallel to each other, so that the distance between the front side 311 and the back side 312 of the substrate 31 can be used to define the thickness of the substrate 31.

[0165] Nevertheless, those skilled in the art will understand that in other examples of the camera module 100 of the present invention, at least one of the front side 311 and the back side 312 of the substrate 31 may be provided with a protrusion structure or a groove, and the camera module 100 of the present invention is not limited in this respect.

[0166] It is worth mentioning that the type of substrate 31 in the camera module 100 of the present invention is not limited. For example, the substrate 31 can be selected from, but is not limited to, rigid board, flexible board, rigid-flex board, ceramic board, etc.

[0167] Furthermore, at least one of the electronic components 32 is electrically connected to the substrate 31 on the back side 312 of the substrate 31. Preferably, in this specific example of the camera module 100 of the present invention, all the electronic components 40 can be electrically connected to the substrate 31 on the back side 312 of the substrate 31. In this way, it is not necessary to reserve a position on the front side 311 of the substrate 312 for conducting the electronic components 32, thereby helping to reduce the length and width dimensions of the camera module 100.

[0168] It is worth mentioning that the type of electronic component 32 is not limited in the camera module 100 of the present invention. For example, the electronic component 32 can be implemented as, but is not limited to, a processor, a relay, a memory, a driver, a resistor, a capacitor, etc.

[0169] In a specific example of the camera module 100 of the present invention, the electronic component 32 can be electrically connected to the substrate 31 by being mounted on the back surface 312 of the substrate 31.

[0170] In another specific example of the camera module 100 of the present invention, the electronic component 32 may also be partially embedded in the back surface 312 of the substrate 31, and the electronic component 32 may be electrically connected to the substrate 31. That is, a portion of the electronic component 32 is exposed on the back surface 312 of the substrate 31. In this way, the height of the camera module 100 can be further reduced. Optionally, the electronic component 32 may also be completely embedded inside the substrate 31.

[0171] Additionally, the circuit board 30 may also include a connecting plate 33, wherein the connecting plate 33 has a module connection side 331 and a device connection side 332. The module connection side 331 of the connecting plate 33 is connected to the substrate 31. For example, the module connection side 331 of the connecting plate 33 may be connected to the front side 311 of the substrate 31, or the module connection side 331 of the connecting plate 33 may be connected to the back side 312 of the substrate 31. The connection method between the module connection side 331 of the connecting plate 33 and the substrate 31 is not limited. For example, the module connection side 331 of the connecting plate 33 and the substrate 31 may be connected by, but is not limited to, conductive adhesive.

[0172] Nevertheless, those skilled in the art will understand that it is possible to connect the module connection side 331 of the substrate 33 to the side of the substrate 31, or to integrally form the module connection side 331 of the substrate 33 with the substrate 31. The device connection side 332 of the connection plate 33 can be connected to the device body 200; for example, the device connection side 332 of the connection plate 33 can be provided with or formed with a connector for connection to the device body 200.

[0173] Normally, the connecting plate 33 is deformable, so the connecting plate 33 can buffer the displacement of the camera module 100 caused by vibration during the use of the electronic device by deformation, thereby ensuring the reliability of the electronic device when it is used.

[0174] The photosensitive chip 20 is mounted on the front side 311 of the substrate 31, and the photosensitive chip 20 is electrically connected to the substrate 31.

[0175] Specifically, the substrate 31 has at least one mounting region 313 and at least one bonding region 314, wherein both the mounting region 313 and the bonding region 314 are formed on the front side 311 of the substrate 31. Typically, the mounting region 313 of the substrate 31 is located in the center, and the bonding region 314 surrounds the mounting region 313, for example, on the... Figure 10 In this specific example of the camera module 100 shown, the mounting area 313 of the substrate 31 is located in the center of the front surface 311 of the substrate 31, and the bonding area 314 of the substrate 31 is located outside the front surface 311 of the substrate 31, and the bonding area 314 surrounds the mounting area 313. The photosensitive chip 20 is mounted on the mounting area 313 of the substrate 31.

[0176] Those skilled in the art will understand that, compared to the traditional method of arranging electronic components around the perimeter of a photosensitive chip, in the height direction of the camera module 100 of the present invention, the photosensitive chip 20 and at least one of the electronic components 32 can correspond to each other. That is, when viewed from a top view, at least a portion of the photosensitive chip 20 and at least one of the electronic components 32 can overlap. In this way, the bonding area 314 of the substrate 31 does not need to be reserved for mounting the electronic components 32, thereby further reducing the area of ​​the bonding area 314 of the substrate 31. In other words, the mounting area 313 of the substrate 31 can occupy a larger proportion of the front surface 311 of the substrate 31. In this way, the length and width dimensions of the camera module 100 can be further reduced. Nevertheless, those skilled in the art will understand that in other examples of the camera module 100 of the present invention, the photosensitive chip 20 and the electronic component 32 located on opposite sides of the substrate 31 may not overlap when viewed from a top view of the camera module 100. Furthermore, in other examples of the camera module 100 of the present invention, at least one of the electronic components 32 may be provided on both the front side 311 and the back side 312 of the substrate 31.

[0177] Furthermore, the manner in which the photosensitive chip 20 and the substrate 31 are connected is not limited in the camera module 100 of the present invention. For example, the photosensitive chip 20 has at least one chip connector 21, and the substrate 31 has at least one substrate connector 315. In one example of the camera module 100 of the present invention, the chip connector 21 of the photosensitive chip 20 and the substrate connector 315 of the substrate 31 can be directly connected, for example, when the photosensitive chip 20 is mounted on the mounting area 313 of the substrate 31, the chip connector 21 of the photosensitive chip 20 and the substrate connector 315 of the substrate 31 are directly connected. In another example of the camera module 100 of the present invention, the chip connector 21 of the photosensitive chip 20 and the substrate connector 315 of the substrate 31 can be connected by a set of connecting lines 1000.

[0178] Specifically, after the photosensitive chip 20 is mounted on the mounting area 313 of the substrate 31, the connecting line 1000 can be formed between the chip connector 21 of the photosensitive chip 20 and the substrate connector 315 of the substrate 31 by wire bonding process, so as to electrically connect the photosensitive chip 20 and the substrate 31 by the connecting line 1000.

[0179] It is worth noting that the bonding direction of the connecting line 1000 is not limited in the camera module 100 of the present invention. For example, the bonding direction of the connecting line 1000 can be from the photosensitive chip 20 to the substrate 31, or from the substrate 31 to the photosensitive chip 20. Nevertheless, those skilled in the art will understand that the connecting line 1000 can also be formed in other ways. In addition, the material type of the connecting line 1000 is not limited in the camera module 100 of the present invention. For example, the connecting line 1000 can be gold wire, silver wire, aluminum wire, or copper wire.

[0180] It is also worth mentioning that the shape and arrangement of the chip connector 21 of the photosensitive chip 20 and the shape and arrangement of the substrate connector 315 of the substrate 31 are not limited in the camera module 100 of the present invention. For example, the chip connector 21 of the photosensitive chip 20 can be disc-shaped, spherical, etc., and the chip connector 21 of the photosensitive chip 20 is usually arranged in the non-photosensitive area of ​​the photosensitive chip 20. Correspondingly, the substrate connector 315 of the substrate 31 can be disc-shaped, spherical, etc., and the substrate connector 315 of the substrate 31 is usually arranged in the bonding area 314 of the substrate 31. Preferably, after the photosensitive chip 20 is mounted on the mounting area 313 of the substrate 31, the chip connector 21 of the photosensitive chip 20 and the substrate connector 315 of the substrate 31 correspond to each other, so as to form the connection line 1000 for conducting the photosensitive chip 20 and the substrate 31 through the wire bonding process between the chip connector 21 of the photosensitive chip 20 and the substrate connector 315 of the substrate 31.

[0181] In one embodiment of the camera module 100 of the present invention, the substrate 31, the electronic components 32, the connecting plate 33, the connecting line 1000, and the photosensitive chip 20 form a circuit board assembly 2000. That is, according to another aspect of the present invention, the present invention further provides the circuit board assembly 2000, wherein the circuit board assembly 2000 includes the substrate 31, the electronic components 32, the connecting plate 33, the connecting line 1000, and the photosensitive chip 20, wherein the photosensitive chip 20 is electrically connected to the substrate 31 via the connecting line 20, and the electronic components 32 and the connecting plate 33 are respectively electrically connected to the substrate 31.

[0182] Continue to refer to the appendix Figures 10 to 11B The camera module 100 further includes a molding unit 40, wherein the molding unit 40 is integrally combined with the photosensitive chip 20 and the circuit board 30 to form the circuit board assembly 2000 of the present invention. That is, the circuit board assembly 2000 of the present invention further includes the molding unit 40.

[0183] Specifically, the molding unit 40 includes a back molding portion 41, wherein the back molding portion 41 is integrally bonded to the substrate 31 on the back surface 312 of the substrate 31. The back molding portion 41 can reinforce the strength of the substrate 31 and ensure the flatness of the substrate 31, thereby keeping the photosensitive chip 20 mounted on the mounting area 313 of the substrate 31 flat, so as to improve the imaging quality of the camera module 100.

[0184] The back molding portion 41 has good inertia. When the camera module 100 is used, the heat generated by the photosensitive chip 20 is conducted to the back molding portion 41 without deformation. In this way, the flatness of the substrate 31 and the flatness of the photosensitive chip 20 mounted on the mounting area 313 of the substrate 31 are not affected by the heat generated by the photosensitive chip 20, thus helping to ensure the flatness of the photosensitive chip 20. In addition, the back molding portion 41 can be formed of a material with good thermal conductivity, so that the back molding portion 41 has good heat dissipation. When the heat generated by the photosensitive chip 20 is conducted to the back molding portion 41, the back molding portion 41 can radiate the heat generated by the photosensitive chip 20 to the external environment of the camera module 100 in a timely manner, so as to ensure the reliability of the camera module 100 during long-term use.

[0185] Preferably, the back molded portion 41 can be integrally bonded to the substrate 31 on the back surface 312 of the substrate 31 by a molding process.

[0186] In one example of the camera module 100 of the present invention, the height of the back molding portion 41 is higher than the height of the electronic component 32, or the height of the back molding portion 41 is the same as the height of the electronic component 32. For example, the distance between the free side 4111 of the back molding portion 41 and the surface of the back surface 312 of the substrate 31 is greater than or equal to the height between the free side 4111 of the electronic component 32 and the surface of the back surface 312 of the substrate 31. It is worth noting that, as defined in the present invention, the free side 4111 of the back molding portion 41 is opposite to the mating side 4112 of the back molding portion 41. The mating side 4112 of the back molding portion 41 is integrally joined to at least a portion of the back surface 312 of the substrate 31. (Refer to the attached diagram.) Figure 10 .

[0187] Further reference attached Figure 10 Let the height of the back molded portion 41 be parameter H, that is, let the distance between the mating side 4112 and the free side 4111 of the back molded portion 41 be parameter H, and let the height of the electronic component 32 protruding from the back surface 312 of the substrate 31 be parameter h, where the value of parameter H is greater than or equal to the value of parameter h. In this way, when assembling the camera module 100, other assembly components can be prevented from touching the electronic component 32, thereby ensuring the reliability of the camera module 100.

[0188] In another example of the camera module 100 of the present invention, the back molding portion 41 embeds at least a portion of the surface of at least one of the electronic components 32. Preferably, the back molding portion 41 embeds all the surfaces of at least one of the electronic components 32. More preferably, the back molding portion 41 embeds all the surfaces of all the electronic components 32.

[0189] It is worth mentioning that the back molding portion 41 can isolate the surface of the electronic component 32 from the external environment by embedding the electronic component 32, thereby ensuring the good electrical properties of the electronic component 32 by preventing the surface of the electronic component 32 from being oxidized.

[0190] Furthermore, by embedding the electronic components 32, the back molding portion 41 can isolate adjacent electronic components 32, thereby ensuring the imaging quality of the camera module 100 by avoiding mutual interference between adjacent electronic components 32. Moreover, since the back molding portion 41 can isolate adjacent electronic components 32, and no safety distance needs to be reserved between the back molding portion 41 and the electronic components 32, a greater number and larger size of electronic components 32 can be connected on the limited area of ​​the back surface 312 of the substrate 31. For example, a greater number and larger size of electronic components 32 can be mounted on the limited area of ​​the back surface 312 of the substrate 31. In this way, the performance of the camera module 100 can be further improved.

[0191] Those skilled in the art will understand that the photosensitive chip 20 mounted on the mounting area 313 of the substrate 31 and the electronic component 32 mounted on the back surface 312 of the substrate 31 are respectively located on both sides of the substrate 31. This prevents contaminants, such as solder powder, from falling off the surface of the electronic component 32 or from the connection point between the electronic component 32 and the substrate 31 from contaminating the photosensitive area of ​​the photosensitive chip 20. This ensures the product yield of the camera module 100. Preferably, the electronic component 32 is integrally embedded in the back molding portion 41 of the back surface 312 of the substrate 31. This prevents contaminants from forming on the surface of the electronic component 32 and from forming at the connection point between the electronic component 32 and the substrate 31.

[0192] In addition, after the back molding portion 41 embeds the electronic component 32 located on the back surface 312 of the substrate 31, the electronic component 32 can also prevent the back molding portion 41 from falling off the back surface 312 of the substrate 31, so as to ensure the reliability of the camera module 100.

[0193] Reference Appendix Figure 10 and Figure 11B The back molding portion 41 has at least one assembly space 410, wherein the molded connection side 331 of the connecting plate 33, after being connected to the substrate 31's substrate back surface 312, can be accommodated in the assembly space 410 of the back molding portion 41. In this way, the molded connection side 331 of the connecting plate 33 can be prevented from protruding, thus ensuring the reliability of the connection position between the module connection side 331 of the connecting plate 33 and the substrate back surface 312 of the substrate 31. Nevertheless, those skilled in the art will understand that in other embodiments of the camera module 100 of the present invention, the back molding portion 41 may also enclose the connection position between the module connection side 331 of the connecting plate 33 and the substrate 31 to prevent the module connection side 331 of the connecting plate 33 from detaching from the substrate back surface 312 of the substrate 31, thereby ensuring the reliability of the camera module 100.

[0194] In other feasible examples of the camera module 100, the electronic components 32 not embedded in the back molding portion 41 can also be accommodated in the assembly space 410 of the back molding portion 41. In this way, when moving or assembling the camera module 100, the electronic components 32 can be prevented from being touched, thereby preventing damage to the surface of the electronic components 32 or the conductive connection between the electronic components 32 and the substrate 31, further ensuring the reliability of the camera module 100. Optionally, a portion of the surface of the electronic components 32 can be exposed in the assembly space 410 of the back molding portion 41.

[0195] In addition, when the camera module 100 is assembled to the electronic device, the protruding assembly component of the device body 200 can also be accommodated in the assembly space 410 of the back molding portion 41. In this way, the internal space of the device body 200 can be effectively utilized, which is conducive to the thinning and miniaturization of the electronic device.

[0196] Continue to refer to the appendix Figures 10 to 11BThe molding unit 40 further includes a molding base 42, wherein the molding base 42 has at least one light window 420, wherein the molding base 42 is integrally bonded to at least a portion of the bonding region 314 of the substrate 31 and at least a portion of the non-photosensitive region of the photosensitive chip 20, so that the substrate 31, the photosensitive chip 20 and the molding base 42 are integrally bonded, and the photosensitive region of the photosensitive chip 20 corresponds to the light window 420 of the molding base 42. Thus, the light window 420 of the molding base 42 can provide a light path for the optical lens 10 and the photosensitive chip 20. That is, light reflected by an object, after entering the interior of the camera module 100 from the optical lens 10, can pass through the light window 420 and be received by the photosensitive chip 20.

[0197] Those skilled in the art will understand that the molded base 42 forms part of the circuit board assembly 2000.

[0198] In a specific example of the camera module 100 of the present invention, the back molding portion 41 and the molding base 42 are simultaneously and integrally bonded to the back surface 312 and the front surface 311 of the substrate 31, respectively. That is, in the same molding process, the back molding portion 41 is integrally bonded to the back surface 312 of the substrate 31, and the molding base 42 is integrally bonded to the front surface 311 of the substrate 31. Nevertheless, in other examples of the camera module 100, the circuit board assembly 2000 of the present invention can also be formed using different molding processes.

[0199] The molding base 42 of the molding unit 40 of the present invention is integrally bonded to the front surface 311 of the substrate 31 of the substrate 31 through a molding process. In this way, no connecting medium such as glue is required between the molding base 42 and the front surface 311 of the substrate 31. In this way, not only can the manufacturing process of the camera module 100 be reduced, but the height of the camera module 100 can also be reduced. More importantly, during the manufacturing process of the camera module 100, there is no need to worry about glue or other connecting mediums contaminating the photosensitive area of ​​the photosensitive chip 20, so as to ensure the product yield of the camera module 100.

[0200] In this invention, the molding base 42 of the molding unit 40 is integrally integrated with the non-photosensitive area of ​​the photosensitive chip 20, so that no safety distance needs to be reserved between the module base 42 and the photosensitive chip 20. In this way, the length and width of the camera module 100 can be further reduced, so that the camera module 100 is particularly suitable for use in electronic devices that pursue thinness and lightness.

[0201] It is understood that the molding base 42 of the molding unit 40 of the present invention embeds the connecting wire 1000, thereby isolating the surface of the connecting wire 1000 from the external environment to prevent the surface of the connecting wire 1000 from being oxidized and to ensure the good electrical properties of the connecting wire 1000.

[0202] Continue to refer to the appendix Figure 10 The camera module 100 includes at least one filter element 50, wherein the filter element 50 is held between the optical lens 10 and the photosensitive chip 20, so that light entering the interior of the camera module 100 from the optical lens 10 passes through the filter element 50 before being received by the photosensitive chip 20. In this way, the imaging quality of the camera module 100 can be guaranteed.

[0203] Specifically, the filter element 50 can filter stray light from the light entering the camera module 100 from the optical lens 10, thereby improving the imaging quality of the camera module 100. It is worth noting that the type of filter element 50 is not limited in the camera module 100 of the present invention; for example, the filter element 50 can be, but is not limited to, an infrared cut-off filter element, a visible spectrum filter element, etc.

[0204] Preferably, the filter element 50 can be attached to the top surface of the molding base 42 so that the filter element 50 is held between the optical lens 10 and the photosensitive chip 20.

[0205] Reference Appendix Figures 10 to 11B The camera module 100 includes at least one driver 60, wherein the optical lens 10 is drivably disposed on the driver 60, which is mounted on the top surface of the molding base 42 to hold the optical lens 10 in the light-sensing path of the photosensitive chip 20. The driver 60 can drive the optical lens 10 to move relative to the photosensitive chip 20 along the light-sensing path, thereby enabling the camera module 100 to achieve automatic zoom and automatic focus by adjusting the relative position of the optical lens 10 and the photosensitive chip 20.

[0206] It is worth mentioning that the type of the driver 60 is not limited in the camera module 100 of the present invention, as long as it can drive the optical lens 10 to make relative movement with respect to the photosensitive chip 20 along the photosensitive path of the photosensitive chip 20. For example, the driver 60 can be implemented as, but is not limited to, a voice coil motor in a specific example of the present invention.

[0207] Further, the driver 60 has at least one drive pin 61, wherein the drive pin 61 is electrically connected to the substrate 31. Preferably, the molding base 42 has at least one pin slot 421, wherein the pin slot 421 of the molding base 42 extends from the top surface of the molding base 42 to the front surface 311 of the substrate 31, so that when the driver 60 is mounted on the top surface of the molding base 42, the drive pin 61 of the driver 60 can extend from the top surface of the molding base 42 to the front surface 311 of the substrate 31 within the pin slot 421, and the drive pin 61 of the driver 60 can be electrically connected to the substrate 31.

[0208] Preferably, the pin slot 421 extends along the outer surface of the molding base 42 from the surface of the molding base 42 to the front surface 311 of the substrate 31, thereby facilitating the electrical connection of the drive pin 61 of the driver 60 to the substrate 31 after the driver 60 is mounted on the top surface of the molding base 42. It is understood that the drive pin 61 of the driver 60, housed in the pin slot 421 of the molding base 42, does not protrude from the outer surface of the molding base 42. This not only ensures the aesthetics of the camera module 100 but also prevents the camera module 100 from touching the drive pin 61 of the driver 60 during assembly with the device body 200, thus ensuring the reliability and product yield of the camera module 100.

[0209] Furthermore, the top surface of the molding base 42 has at least one inner surface 422 and at least one outer surface 423, wherein the driver 60 is attached to the outer surface 423 of the molding base 42 to hold the optical lens 10 in the photosensitive path of the photosensitive chip 20, wherein the filter element 50 is attached to the inner surface 422 of the molding base 42 to hold the filter element 50 between the optical lens 10 and the photosensitive chip 20.

[0210] In some examples of the camera module 100 of the present invention, the plane containing the inner surface 422 of the molded base 42 is flush with the plane containing the outer surface 423. In other examples of the camera module 100 of the present invention, the planes containing the inner surface 422 of the molded base 42 and the outer surface 423 have a height difference, for example, in the attached... Figure 10In this specific example of the camera module 100 shown, the plane containing the inner surface 422 of the molding base 42 is lower than the plane containing the outer surface 423, thereby forming at least one mounting groove 424 in the molding base 42, and the mounting groove 424 of the molding base 42 communicates with the light window 420, wherein the filter element 50 mounted on the inner surface 422 of the molding base 42 is accommodated in the mounting groove 424, thereby further reducing the height dimension of the camera module 100.

[0211] Refer to the accompanying drawings of the specification of this invention. Figures 1 to 9 The manufacturing process of the camera module 100 is described below.

[0212] In the appendix Figure 1 In the illustrated stage, the electronic component 32 is electrically connected to the substrate 31 on the back surface 312 of the substrate 31, wherein two or more substrates 31 are arranged to form a panel unit 3000. It is worth mentioning that the arrangement of the plurality of substrates 31 forming the panel unit 3000 is not limited in the camera module 100 of the present invention.

[0213] For example, in this specific example of the camera module 100 of the present invention, after the substrate 31 is provided or manufactured, all the electronic components 32 can be electrically connected to the substrate 31 on the back surface 312 of the substrate 31 by means of mounting. Those skilled in the art will understand that in other examples of the camera module 100 of the present invention, only a portion of the electronic components 32 may be electrically connected to the back surface 312 of the substrate 31 and the substrate 31. The present invention is further detailed in the appendix. Figures 1 to 9 The examples shown do not limit the content and scope of the camera module 100 of the present invention.

[0214] Furthermore, the position of the electronic components 32 mounted on the back surface 312 of the substrate 31 is not limited and can be adjusted according to the specific application needs of the camera module 100. In some examples of the camera module 100 of the present invention, multiple electronic components 32 can be arranged in the entire area of ​​the back surface 312 of the substrate 31. In other specific examples of the camera module 100 of the present invention, multiple electronic components 32 can also be arranged in a specific area of ​​the back surface 312 of the substrate 31, such as a corner, a side, or both sides.

[0215] In the appendix Figure 2In the illustrated stage, the photosensitive chip 20 is mounted on the mounting area 312 of the substrate 31, and a connecting line 1000 is formed between the chip connector 21 of the photosensitive chip 20 and the substrate connector 315 of the substrate 31 through a wire bonding process, thereby providing a conductive connection between the photosensitive chip 20 and the substrate 31. For example, the photosensitive chip 20 can be mounted on the mounting area 313 of the substrate 31 using surface mounting technology (SMT), with the chip connector 21 of the photosensitive chip 20 and the substrate connector 315 of the substrate 31 corresponding to each other, and then the connecting line 1000 is formed between the chip connector 21 of the photosensitive chip 20 and the substrate connector 315 of the substrate 31 through a wire bonding process. It is worth mentioning that the bonding direction of the connecting line 1000 is not limited. For example, the bonding direction of the connecting line 1000 can be from the photosensitive chip 20 to the substrate 31, or from the substrate 31 to the photosensitive chip 20, which can be selected as needed.

[0216] Additionally, it is worth mentioning that, although in the appendix Figures 2 to 10 The diagram shows that the photosensitive chip 20 and the substrate 31 are connected by forming the connecting line 1000 between the chip connector 21 of the photosensitive chip 20 and the substrate connector 315 of the substrate 31. In other examples of the camera module 100 of the present invention, the photosensitive chip 20 and the substrate 31 can also be connected in other ways. For example, when mounting the photosensitive chip 20 to the mounting area 313 of the substrate 31, the chip connector 21 of the photosensitive chip 20 and the substrate connector 315 of the substrate 31 can be directly connected.

[0217] In the appendix Figure 3A and Figure 3B In the stage shown, the panel unit 3000 is placed into a molding die 300 to perform a molding process by means of the molding die 300.

[0218] Specifically, the molding die 300 includes an upper die 301 and a lower die 302, wherein at least one of the upper die 301 and the lower die 302 is operable to enable the molding die 300 to perform mold closing and mold release operations. For example, in one example, after the panel unit 3000 is placed in the lower die 302 and the molding die 300 is closed, at least a first molding space 303a is formed between the upper die 301 and the front surface 311 of the substrate 31, and at least a second molding space 303b is formed between the lower die 302 and the back surface 312 of the substrate 31.

[0219] In one example of the invention, at least one first molding space 303a and at least one second molding space 303b are interconnected to allow a fluid medium 400 to subsequently fill the first molding space 303a and the second molding space 303b, thereby simultaneously forming the molding base 42 integrally bonded to the front side 311 of the substrate 31 and the back molding portion 41 integrally bonded to the back side 312 of the substrate 31.

[0220] Preferably, when the number of first molding spaces 303a exceeds two, at least one first connecting channel 304a can be formed between the upper mold 301 and the front surface 311 of the substrate 31 to connect adjacent first molding spaces 303a. Correspondingly, when the number of second molding spaces 303b exceeds two, at least one second connecting channel 304b can be formed between the lower mold 302 and the back surface 312 of the substrate 31 to connect adjacent second molding spaces 303b.

[0221] Continue to refer to the appendix Figure 3A and Figure 3B The upper mold 301 further includes an upper forming guide portion 3011 and at least one light window forming portion 3012 and has at least one upper forming guide groove 3013, wherein the light window forming portion 3012 extends integrally from the upper forming guide portion 3011 to form the upper forming guide groove 3013 between the light window forming portion 3012 and the upper forming guide portion 3011, or to form the upper forming guide groove 3013 between adjacent light window forming portions 3012.

[0222] Furthermore, the upper molding guide 3011 has a first upper pressure part 30111, so that after the molding die 300 is subjected to the mold closing process, the first upper pressure part 30111 of the upper molding guide 3011 can apply pressure to the front surface 311 of the substrate 31.

[0223] The light window forming part 3012 has a second upper pressure part 30121, which can be annular. For example, in the attached Figure 3A and Figure 3B In this example of the molded die 300 shown, the light window forming part 3012 can form a second upper pressure part 30121 around its perimeter by forming a safety space 30122 through inward concavity. Thus, when the molded die 300 is subjected to a mold closing process, the second upper pressure part 30121 of the light window forming part 3012 can apply pressure to the non-photosensitive area of ​​the photosensitive chip 20 and make the photosensitive area of ​​the photosensitive chip 20 correspond to the safety space 30122 of the light window forming part 3012, so as to avoid the upper die 301 scratching the photosensitive area of ​​the photosensitive chip 20.

[0224] It is understood that during the mold closing operation of the molding die 300, the first molding space 303a is located at the position corresponding to the upper molding guide groove 3013 of the upper die 301. Furthermore, the second upper pressure portion 30121 of the light window molding portion 3012 of the upper die 301 surrounds the photosensitive area by applying pressure to the non-photosensitive area of ​​the photosensitive chip 20, thereby preventing the fluid medium 400 added to the first molding space 303a from entering the photosensitive area of ​​the photosensitive chip 20 during the molding process, thus avoiding contamination of the photosensitive area of ​​the photosensitive chip 20 during the molding process.

[0225] Continue to refer to the appendix Figure 3A and Figure 3B The lower mold 302 further includes a lower molding guide portion 3021 and at least one support portion 3022 and has at least one lower molding guide groove 3023, wherein the support portion 3022 extends integrally to the lower molding guide portion 3021 to form the lower molding guide groove 3023 between the support portion 3022 and the lower molding guide portion 3021, or to form the lower molding guide groove 3023 between adjacent support portions 3022.

[0226] When the molding die 300 is closed, a second molding space 303b is formed at a position corresponding to the lower molding guide groove 3023 of the lower die 302. Furthermore, the lower molding guide portion 3021 of the lower die 302 can apply pressure to the back surface 312 of the substrate 31, and the support portion 3022 of the lower die 302 can also apply pressure to the back surface 312 of the substrate 31.

[0227] Preferably, the height of the support portion 3022 of the lower mold 302 is greater than the height of the electronic component 32 protruding from the back surface 312 of the substrate 31. In this way, when the lower mold 302 applies pressure to the back surface 312 of the substrate 31, a safe distance is maintained between the surface of the electronic component 32 and the inner surface of the lower mold 302. This protects the surface of the electronic component 32 from scratches by preventing it from contacting the inner surface of the lower mold 302. Furthermore, by maintaining a safe distance between the surface of the electronic component 32 and the inner surface of the lower mold 302, the electronic component 32 can be subsequently embedded in the back molded portion 41, which is integrally bonded to the back surface 312 of the substrate 31.

[0228] Furthermore, the molding die 300 further includes at least one film layer 305. For example, in this specific example of the invention, the number of film layers 305 can be implemented as two, with one film layer 305 overlappingly disposed on the inner surface of the upper die 301 and the other film layer 305 overlappingly disposed on the inner surface of the lower die 302. For example, the film layers 305 can be overlappingly disposed on the inner surface of the upper die 301 by attaching the film layers 305 to the inner surface of the upper die 301, and the film layers 305 can be overlappingly disposed on the inner surface of the lower die 302 by attaching the film layers 305 to the inner surface of the lower die 302.

[0229] Those skilled in the art will understand that when the molding die 300 is closed, the film layer 305 is held between the second upper pressure portion 30121 of the light window forming part 3012 and the non-photosensitive area of ​​the photosensitive chip 20, so that the film layer 305, when under pressure, deforms to prevent gaps from forming between the second upper pressure portion 30121 of the light window forming part 3012 and the non-photosensitive area of ​​the photosensitive chip 20. Therefore, in subsequent molding processes, the fluid medium 400 is prevented from entering the safety space 30122 from between the second upper pressure portion 30121 of the light window forming part 30122 and the non-photosensitive area of ​​the photosensitive chip 20, thereby preventing contamination of the photosensitive area of ​​the photosensitive chip 20 held in the safety space 30122 and avoiding the occurrence of "flash" defects, thus ensuring the product yield of the camera module 100.

[0230] It is understood that the film layer 305 can isolate the second upper pressure part 30121 of the light window forming part 3012 and the photosensitive chip 20. Thus, when the forming mold 300 is closed, on the one hand, the film layer 305 can absorb the impact force generated by the forming mold 300 when it is closed by deforming to prevent the impact force from directly acting on the photosensitive chip 20. On the other hand, the film layer 305 can also isolate the second upper pressure part 30121 of the light window forming part 3012 and the photosensitive chip 20 to prevent the photosensitive chip 20 from being scratched.

[0231] In addition, after the molding process is completed, the film layer 305 can isolate the inner surface of the upper mold 301 and the molding base 42, as well as the inner surface of the lower mold 302 and the back molding part 41, so as to facilitate the demolding operation of the molding mold 300, and in this process, prevent the molding base 42 and the back molding part 41 from being damaged.

[0232] After the molding die 300 is closed, the first upper pressure portion 30111 of the upper molding guide portion 3011 of the upper die 301 can also apply pressure to the front surface 311 of the substrate 31. The film layer 305, which is held between the first upper pressure portion 30111 of the upper molding guide portion 3011 and the front surface 311 of the substrate 31, can absorb the impact force generated when the molding die 300 is closed to prevent the impact force from acting directly on the substrate 31. On the other hand, the film layer 305 can also isolate the first upper pressure portion 30111 of the upper molding guide portion 3011 and the front surface 311 of the substrate 31 to prevent the front surface 311 of the substrate 31 from being scratched and to ensure the good electrical properties of the substrate 31. In addition, the film layer 305 can also prevent gaps from forming between the first upper pressure portion 30111 of the upper molding guide portion 3011 and the front surface 311 of the substrate 31 by generating deformation.

[0233] It is understood that a portion of the non-photosensitive area of ​​the photosensitive chip 20, at least a portion of the bonding area 314 of the connecting line 1000 and the substrate 31 are held in the first molding space 303a.

[0234] After the molding die 300 is closed, the lower molding guide 3021 and the support 3022 of the lower die 302 are respectively pressed at different positions on the back surface 312 of the substrate 31. The film layer 305 held between the lower molding guide 3021 and the back surface 312 of the substrate 31, and the film layer 305 held between the support 3022 and the back surface 312 of the substrate 31, can absorb the impact force generated when the molding die 300 is closed to prevent the impact force from acting directly on the back surface 312 of the substrate 31. On the other hand, the film layer 305 can also isolate the lower molding guide 3021 and the back surface 312 of the substrate 31, and isolate the support 3022 and the back surface 312 of the substrate 31, to prevent the back surface 312 of the substrate 31 from being scratched and to ensure the good electrical properties of the substrate 312. In addition, the film layer 305 can also prevent gaps from forming between the lower molding guide 3021 and the substrate back surface 312 of the substrate 31 by generating deformation, and prevent gaps from forming between the support 3022 and the substrate back surface 312 of the substrate 31.

[0235] Optionally, after the molding die 300 is closed, the first upper pressing part 30111 of the upper molding guide part 3011 of the upper die 301 can also be directly pressed together with at least a portion of the lower molding guide part 3012 of the lower die 302, so that at least one first molding space 303a and at least one second molding space 303b are connected.

[0236] Preferably, after the molding die 300 is closed, the positions of the second upper pressure part 30121 of the light window forming part 3012 of the upper die 301 and the support part 3022 of the lower die 302 correspond to each other, thereby preventing the photosensitive chip 20 and the substrate 31 from being deformed by uneven forces. For example, in this example of the present invention, when the second upper pressure portion 30121 of the light window forming portion 3012 of the upper mold 301 applies pressure to the non-photosensitive area of ​​the photosensitive chip 20, causing the photosensitive chip 20 and the substrate 31 to deform downward, the support portion 3022 of the lower mold 302 supports the substrate 31 upward by applying pressure to the position of the substrate 31 corresponding to the non-photosensitive area of ​​the photosensitive chip 20, so as to prevent the photosensitive chip 20 and the substrate 31 from deforming downward. In this way, the flatness of the substrate 31 and the photosensitive chip 20 can be guaranteed, so as to further guarantee the product yield of the camera module 100.

[0237] In the appendix Figure 4 and Figure 5 In this stage, the fluid medium 400 is added to at least one first molding space 303a, or to at least one second molding space 303b, or to both at least one first molding space 303a and at least one second molding space 303b. Since adjacent first molding spaces 303a are connected through the first connecting channel 304a and adjacent second molding spaces 303b are connected through the second connecting channel 304b, the fluid medium 400 will fill all the first molding spaces 303a and all the second molding spaces 303b.

[0238] It is worth mentioning that the fluid medium 400 can be a liquid, a solid, or a mixture of liquid and solid, etc., to enable the fluid medium 400 to flow. Furthermore, the fluid medium 400 can be implemented as, but is not limited to, a thermosetting material. Of course, those skilled in the art will understand that, in other possible examples, the fluid medium 400 may also be implemented as a photocurable material or a self-curing material.

[0239] After the fluid medium 400 fills the first molding space 303a and the second molding space 303b, the fluid medium 400 can be solidified in the first molding space 303a and the second molding space 303b by heating, and a demolding operation can be performed on the molding mold 300. (Refer to the attached document.) Figure 6 In the stages shown, the fluid medium 400 solidified in the first molding space 303a forms an integrally bonded molding base 42 on the front side 311 of the substrate 31, and the light window 420 of the molding base 42 is formed at a position corresponding to the light window forming portion 3012 of the upper mold 301. The photosensitive area of ​​the photosensitive chip 20 corresponds to the light window 420 of the molding base 42. The fluid medium 400 solidified in the second molding space 303b forms an integrally bonded back molding portion 41 on the back side 312 of the substrate 31, and the back molding portion 41 embeds the electronic component 32. The assembly space 410 of the back molding portion 41 is formed at a position corresponding to the support portion 3022 of the lower mold 302.

[0240] In the appendix Figure 7 In this stage shown, after a draft operation is performed on the molding die 300, a semi-finished product of the circuit board assembly 2000 can be formed. Then, in the attached... Figure 8A and Figure 8BAs shown in the stage, the semi-finished circuit board assembly 2000 can be divided to form the circuit board assembly 2000. It is worth mentioning that the method of dividing the semi-finished circuit board assembly 2000 is not limited in the camera module 100 of the present invention. For example, the semi-finished circuit board assembly 2000 can be divided by cutting to form the circuit board assembly 2000, or it can be divided by etching to form the circuit board assembly 2000.

[0241] In addition, in the appendix Figure 8A In the example shown, when dividing the semi-finished circuit board assembly 2000, the dividing direction can be from the molding base 42 to the back molding portion 41. (See attached...) Figure 8B In the example shown, when dividing the semi-finished circuit board assembly 2000, the dividing direction can also be from the back molding portion 41 to the molding base 42.

[0242] In the appendix Figure 9 In this stage shown, the filter element 50 can be sequentially attached to the inner surface 422 of the molding base 42, and the driver 60, to which the optical lens 10 is assembled, can be attached to the outer surface 423 of the molding base 42 to form an attachment. Figures 10 to 11B The camera module 100 shown is shown.

[0243] According to another aspect of the present invention, the present invention further provides a method for manufacturing a camera module 100, wherein the manufacturing method includes the following steps:

[0244] (a) At least one electronic component 32 is electrically connected to the back side 312 of a substrate 31;

[0245] (b) At the same time, a back molded portion 41 integrally bonded to the substrate 31 is formed on the back side 312 of the substrate 31 and a molded base 42 integrally bonded to the substrate 31 is formed on the front side 311 of the substrate 31, wherein the molded base 42 has at least one light window 420.

[0246] (c) Aligning the photosensitive area of ​​a photosensitive chip 20, which is conductively connected to the substrate 31, with the light window 420 of the molding base 42; and

[0247] (d) An optical lens 10 is held in the light-sensing path of the photosensitive chip 20 to obtain the camera module 100.

[0248] It is worth mentioning that in the step (a), at least one of the electronic components 32 can also be conductively connected to the front side 311 of the substrate 31. That is to say, in some examples of the imaging module 100 of the present invention, the electronic components 32 can be conductively connected only to the back side 312 of the substrate 31, while in other examples of the imaging module 100 of the present invention, not only the electronic components 32 are conductively connected to the back side 312 of the substrate 31, but also the electronic components 32 can be conductively connected to the front side 311 of the substrate 31. That is, at least one of the electronic components 32 is conductively connected to both the front side 311 and the back side 312 of the substrate 31.

[0249] In addition, the step (c) can also be performed before the step (b), so as to first conductively connect the photosensitive chip 20 to the substrate 31, and then simultaneously form the back molding portion 41 integrally combined with the back side 312 of the substrate 31 and the molding base 42 integrally combined with the front side 311 of the substrate 31 on the substrate 31, and make the photosensitive area of the photosensitive chip 20 correspond to the light window 420 of the molding base 42. Preferably, the molding base 42 can further embed the non-photosensitive area of the photosensitive chip 20. It can be understood that the photosensitive area and at least a part of the non-photosensitive area of the photosensitive chip 20 correspond to the light window 420 of the molding base 42.

[0250] Attached Figure 13 shows a modified embodiment of the imaging module 100, in which the back molding portion 41 of the molding unit 40 can be integrally combined with the entire area of the back side 312 of the substrate 31. That is to say, the back molding portion 41 may not be provided with or form the assembly space 410.

[0251] Attached Figure 14 shows another modified embodiment of the imaging module 100, in which the back molding portion 41 of the molding unit 40 is integrally combined with at least one side portion of the back side 312 of the substrate 31. That is to say, the back molding portion 41 may not be combined with the middle portion of the back side 312 of the substrate 31. For example, in the specific example of the imaging module 100 shown in the attached Figure 14 shows, the back molding portion 41 can be integrally combined with the four side portions of the back side 312 of the substrate 31, so that the back molding portion 41 is in a "square" shape. And in the attached Figure 15In another modified embodiment of the camera module 100 shown, the back molding portion 41 can be integrally integrated with three sides of the back surface 312 of the substrate 31, so that the back molding portion 41 is in the shape of a "Π" or a "C". And in the attached... Figure 16 In another modified embodiment of the camera module 100 shown, the back molding portion 41 can be integrally coupled to two sides of the back surface 312 of the substrate 31, so that the back molding portion 41 is in the shape of a "Γ" or an "L". And in the attached... Figure 17 In another modified embodiment of the camera module 100 shown, the number of the back molding portions 41 may be two, and each back molding portion 41 is integrally coupled to one side of the back surface 312 of the substrate 31, wherein the two back molding portions 41 are symmetrical to each other, or the two back molding portions 41 are parallel to each other. For example, the two back molding portions 41 may be in an "II" shape. And in the appendix... Figure 18 In another variant of the camera module 100 shown, the back molding portion 41 may also be integrally attached to only one side of the back surface 312 of the substrate 31. For example, the back molding portion 41 may be in the shape of an "I".

[0252] It is worth mentioning that those skilled in the art will understand that the back molding portion 41 may also be in other shapes, such as an "X" shape or a "well" shape.

[0253] Appendix Figure 19 Another modified embodiment of the camera module 100 is shown, wherein the back molding portion 41 of the molding unit 40 is integrally bonded to the middle of the back surface 312 of the substrate 31. In this case, the back molding portion 41 and the photosensitive chip 20 are correspondingly held on both sides of the substrate 31. On the one hand, the back molding portion 41 can reinforce the strength of the portion of the substrate 31 in the mounting area 313 to ensure the flatness of the photosensitive chip 20 mounted in the mounting area 313 of the substrate 31. On the other hand, it can radiate the heat generated by the photosensitive chip 20 to the external environment to help dissipate heat.

[0254] It is worth mentioning that the shape of the back molding portion 41 is not limited in the camera module 100 of the present invention. For example, the back molding portion 41 can be square, rectangular, trapezoidal, circular, elliptical and other irregular shapes.

[0255] Appendix Figure 20Another variant embodiment of the imaging module 100 is shown, in which the back molding portion 41 of the molding unit 40 may be provided with or formed with a plurality of the assembly spaces 410, so that the back molding portion 41 is in a grid shape, or the back molding portion 41 is in a "field" shape, or the back molding portion 41 is in a "well" shape.

[0256] Attached Figure 21 Another variant embodiment of the imaging module 100 is shown, in which the number of the back molding portions 41 of the molding unit 40 may also be implemented as four, and each of the back molding portions 41 is integrally combined with four corners of the back surface 312 of the substrate 31 respectively. Nevertheless, it is also possible that each of the back molding portions 41 is integrally combined with the middle parts of the four sides of the back surface 312 of the substrate 31 respectively. In addition, those skilled in the art can understand that the number of the back molding portions 41 may also be implemented as more or less, and the imaging module 100 of the present invention is not limited in this regard.

[0257] It is worth mentioning that those skilled in the art can understand that the back molding portion 41 of the molding unit 40 may also have any other possible shapes, and the present invention will not give examples one by one in the following description.

[0258] Attached Figure 22A Another variant embodiment of the imaging module 100 is shown, the back surface 312 of the substrate 31 is conductively connected to at least one of the electronic components 32. For example, the electronic component 32 may be mounted on the back surface 312 of the substrate 31 by but not limited to a mounting method, so that the electronic component 32 is conductively connected to the substrate 31 on the back surface 312 of the substrate 31. The front surface 311 of the substrate 31 may also be conductively connected to at least one of the electronic components 32. For example, the electronic component 32 may also be mounted on the front surface 311 of the substrate 31 by but not limited to a mounting method, so that the electronic component 32 is conductively connected to the substrate 31 on the front surface 311 of the substrate 31.

[0259] Attached Figure 22B Another variant embodiment of the imaging module 100 is shown, the substrate 31 has at least one molding space 316, wherein the molding space 316 is provided in the bonding area 314 of the substrate 31, and a part of at least one of the back molding portion 41 and the molding base 42 is formed in the molding space 316 of the substrate 31.

[0260] Preferably, at least one of the molding spaces 316 is implemented as a perforation, that is, the molding space 316 can connect the front side 311 and the back side 312 of the substrate 31, so that in the molding process, the fluid medium 400 can pass through the molding space 316 implemented as a perforation to simultaneously form the molding base 42 integrally bonded to the substrate 31 on the front side 311 of the substrate 31, and the back molding portion 41 integrally bonded to the substrate 31 on the back side 312 of the substrate 31.

[0261] Appendix Figure 23 Another modified embodiment of the camera module 100 is shown, wherein the circuit board assembly 2000 further includes at least one frame-shaped support element 70, wherein, prior to the molding process, the support element 70 is disposed in or formed in a non-photosensitive area of ​​the photosensitive chip 20, such that the support element 70 protrudes from the photosensitive chip 20, thereby, during the molding process, when the molding die 300 is closed, the second upper pressure portion 30 of the light window forming portion 3012 of the upper mold 301 of the molding die 300... 122 directly applies pressure to the support element 70. This allows the support element 70 to absorb the impact force generated when the molding die 300 is closed, preventing this impact force from acting on the photosensitive chip 20. Furthermore, the support element 70 can prevent gaps from forming between the second upper pressure portion 30122 of the light window forming portion 3012 and the non-photosensitive area of ​​the photosensitive chip 20 by deforming. This prevents the fluid medium 400 from contaminating the photosensitive area of ​​the photosensitive chip 20 and avoids the occurrence of "flash" defects, thus ensuring the product yield of the camera module 100. After the molding process is completed, the molding base 42 embeds at least a portion of the support element 70.

[0262] Appendix Figure 24 Another modified embodiment of the camera module 100 is shown, wherein the molding base 42 of the molding unit 40 may not enclose the non-photosensitive area of ​​the photosensitive chip 20. Specifically, in this specific example of the camera module 100, the molding base 42 of the molding unit 40 is integrally bonded to at least a portion of the bonding area 314 of the substrate 31. The photosensitive chip 20 may be mounted on the mounting area 313 of the substrate 31 before the molding base 42 is formed, or the photosensitive chip 20 may be mounted on the mounting area 313 of the substrate 31 through the light window 420 of the molding base 42 after the molding base 42 is formed.

[0263] Appendix Figure 25 Another modified embodiment of the camera module 100 is shown. Before the molding process, the filter element 50 can be stacked on the photosensitive chip 20. After the molding process is completed, the molding base 42 can embed the outer edge of the filter element 50, thereby making the molding base 42, the substrate 31, the photosensitive chip 20, the filter element 50, and the back molding portion 41 integrally combined. Preferably, a frame-shaped buffer portion 1 is provided between the filter element 50 and the photosensitive chip 20 to isolate the filter element 50 and the photosensitive chip 20, thereby avoiding direct contact between the filter element 50 and the photosensitive chip 20. For example, a substance such as, but not limited to, resin or glue can be applied to at least a portion of the non-photosensitive area of ​​the photosensitive chip 20 before the filter element 50 is overlapped onto the photosensitive chip 20. The resin or glue applied to at least a portion of the non-photosensitive area of ​​the photosensitive chip 20 forms a buffer portion 1 that is held between the filter element 50 and the photosensitive chip 20. It is understood that it is also possible to first form the buffer portion 1 on the filter element 50 before overlapping the filter element 50 onto the photosensitive chip 20. Preferably, the buffer portion 1 is elastic.

[0264] Appendix Figure 26 Another modified embodiment of the camera module 100 is shown, wherein the filter element 50 is mounted on the optical lens 10, thereby holding the filter element 50 between the optical lens 10 and the photosensitive chip 20.

[0265] Appendix Figure 27 Another modified embodiment of the camera module 100 is shown, further comprising at least one frame-shaped bracket 80, wherein the filter element 50 can be first mounted to the bracket 80, and then the bracket 80 can be mounted to the top surface of the molding base 42. For example, the bracket 80 can be mounted to the inner surface 422 of the molding base 42, so that the bracket 80 is received in the mounting groove 424, thereby holding the filter element 50 in the optical lens 10 and the photosensitive chip 20 bracket. In this manner, the size of the filter element 50 can be reduced, thereby reducing the manufacturing cost of the camera module 100.

[0266] Appendix Figure 28Another modified embodiment of the camera module 100 is shown, wherein the camera module 100 further includes at least one lens barrel 90, wherein the optical lens 10 is assembled to the lens barrel 90, and the lens barrel 90 can be mounted to the molding base 42, thereby holding the optical lens 10 in the light-sensing path of the photosensitive chip 20. That is, the camera module 100 can be a fixed-focus camera module.

[0267] In the appendix Figure 29 In another variant of the camera module 100 shown, the lens barrel 90 may also extend integrally from the molding base 42, that is, the molding base 42 and the lens barrel 90 may be integrally formed by a molding process.

[0268] In the appendix Figure 30 In another variant of the camera module 100 shown, the optical lens 10 may also be directly mounted on the top surface of the molding base 42 so that the optical lens 10 is held in the light-sensing path of the photosensitive chip 20.

[0269] In the appendix Figure 31 In another modified embodiment of the camera module 100 shown, after the optical lens 10 is directly attached to the top surface of the molding base 42, the lens barrel 90 can also be attached to the top surface of the molding base 42 so that the lens barrel 90 surrounds the outside of the optical lens 10, thereby protecting the optical lens 10 from collisions and further ensuring the reliability of the camera module 100.

[0270] Appendix Figure 32 The diagram shows a top view of one embodiment of the optical lens 10 of the camera module 100, wherein the top view shape of the optical lens 10 is circular. Specifically, the optical lens 10 has a first lens side 11, a second lens side 12, a third lens side 13, a fourth lens side 14, a fifth lens side 15, a sixth lens side 16, a seventh lens side 17, and an eighth lens side 18, wherein... Figure 32In this example of the optical lens 10 shown, the first lens side 11, the second lens side 12, the third lens side 13, the fourth lens side 14, the fifth lens side 15, the sixth lens side 16, the seventh lens side 17, and the eighth lens side 18 are all curved surfaces, and they are connected end to end to form a circle. Furthermore, the optical lens 10 forms a curved side 102 at corresponding positions on the first lens side 11 and the second lens side 12, the third lens side 13 and the fourth lens side 14, the fifth lens side 15 and the sixth lens side 16, and the seventh lens side 17 and the eighth lens side 18. That is, the optical lens 10 has four curved sides 102.

[0271] Appendix Figure 33 The diagram shows a top view of a modified embodiment of the optical lens 10 of the camera module 100, wherein the first lens side 11, the second lens side 12, the third lens side 13, the fourth lens side 14, the fifth lens side 15, the sixth lens side 16, the seventh lens side 17, and the eighth lens side 18 are all curved surfaces, connected end-to-end to form an ellipse. Furthermore, the optical lens 10 forms a curved side 102 at corresponding positions on the first lens side 11 and the second lens side 12, the third lens side 13 and the fourth lens side 14, the fifth lens side 15 and the sixth lens side 16, and the seventh lens side 17 and the eighth lens side 18. In other words, the optical lens 10 has four curved sides 102.

[0272] Appendix Figure 34 The diagram shows a top view of a modified embodiment of the optical lens 10 of the camera module 100. The first lens side 11 and the second lens side 12 are both planar surfaces, and the plane containing the first lens side 11 and the plane containing the second lens side 12 are the same plane, so that the optical lens 10 forms a planar side 101 at the corresponding positions of the first lens side 11 and the second lens side 12. The third lens side 13, the fourth lens side 14, the fifth lens side 15, the sixth lens side 16, the seventh lens side 17, and the eighth lens side 18 are all curved surfaces, so that the optical lens 10 forms the curved surface side 102 at the corresponding positions of the third lens side 13, the fourth lens side 14, the fifth lens side 15, the sixth lens side 16, the seventh lens side 17, and the eighth lens side 18. In other words, the optical lens 10 has one planar side 101 and three curved surface sides 102.

[0273] Appendix Figure 35 The diagram shows a top view of another modified embodiment of the optical lens 10 of the camera module 100, wherein the first lens side 11 and the second lens side 12 are both planes, and the plane containing the first lens side 11 and the plane containing the second lens side 12 are the same plane, so that the optical lens 10 forms the plane side 101 at the corresponding positions of the first lens side 11 and the second lens side 12; wherein the fifth lens side 15 and the sixth lens side 16 are both planes, and the plane containing the fifth lens side 15 and the plane containing the sixth lens side 16 are the same plane, so that the optical lens 10 forms the plane side 101 at the corresponding positions of the fifth lens side 15 and the sixth lens side 16; wherein the third lens side 13 and the fourth lens side 14, as well as the seventh lens side 17 and the eighth lens side 18, are all curved surfaces, so that the optical lens 10 forms the curved side 102 at the corresponding positions of the third lens side 13 and the fourth lens side 14, and forms the curved side 102 at the corresponding positions of the seventh lens side 17 and the eighth lens side 18. That is, the optical lens 10 has two planar sides 101 and two curved sides 102, and the two planar sides 101 and the two curved sides 102 of the optical lens 10 are symmetrical to each other.

[0274] Appendix Figure 36The diagram shows a top view of another modified embodiment of the optical lens 10 of the camera module 100, wherein the first lens side 11, the second lens side 12, the third lens side 13, and the fourth lens side 14 are all planes, and the plane containing the first lens side 11 and the second lens side 12 are the same plane, and the plane containing the third lens side 13 and the fourth lens side 14 are the same plane, so that the optical lens 10 forms the plane side 101 at the corresponding positions of the first lens side 11 and the second lens side 12, and at the corresponding positions of the third lens side 13 and the fourth lens side 14, respectively, and the second lens side 12 and the third lens side 13 are perpendicular to each other, wherein the fifth lens side 15, the sixth lens side 16, the seventh lens side 17, and the eighth lens side 18 are all curved surfaces, so that the optical lens 10 forms the curved surface side 102 at the corresponding positions of the third lens side 13 and the fourth lens side 14, and at the corresponding positions of the seventh lens side 17 and the eighth lens side 18. That is, the optical lens 10 has two planar sides 101 and two curved sides 102, and the two planar sides 101 are adjacent to each other and the two curved sides 102 are adjacent to each other.

[0275] Appendix Figure 37The diagram shows a top view of another modified embodiment of the optical lens 10 of the camera module 100, wherein the first lens side 11, the second lens side 12, the third lens side 13, the fourth lens side 14, the fifth lens side 15, and the sixth lens side 16 are all planes, and the plane containing the first lens side 11 and the second lens side 12 are the same plane, the plane containing the third lens side 13 and the fourth lens side 14 are the same plane, and the plane containing the fifth lens side 15 and the sixth lens side 16 are the same plane. The second lens side 11 is perpendicular to the third lens side 13, and the fourth lens side 14 is perpendicular to the fifth lens side 15. Thus, the optical lens 10 forms planar sides 101 at the positions corresponding to the first lens side 11 and the second lens side 12, the third lens side 13 and the fourth lens side 14, and the fifth lens side 15 and the sixth lens side 16, respectively. The seventh lens side 17 and the eighth lens side 18 are curved surfaces, thus the optical lens 10 forms curved sides 102 at the positions corresponding to the seventh lens side 17 and the eighth lens side 18. In other words, the optical lens 10 has three planar sides 101 and one curved side 102.

[0276] Appendix Figure 38The diagram shows a top view of another modified embodiment of the optical lens 10 of the camera module 100, wherein the first lens side 11, the second lens side 12, the third lens side 13, the fourth lens side 14, the fifth lens side 15, the sixth lens side 16, the seventh lens side 17, and the eighth lens side 18 are all planes, and the plane containing the first lens side 11 and the second lens side 12 are the same plane, the plane containing the third lens side 13 and the fourth lens side 14 are the same plane, the plane containing the fifth lens side 15 and the sixth lens side 16 are the same plane, and the seventh lens side 18 is... The plane containing surface 17 and the plane containing the eighth lens side 18 are the same plane. The second lens side 11 is perpendicular to the third lens side 13, the fourth lens side 14 is perpendicular to the fifth lens side 15, the sixth lens side 16 is perpendicular to the seventh lens side 17, and the eighth lens side 18 is perpendicular to the first lens side 11. Thus, the optical lens 10 forms planar sides 101 at the positions corresponding to the first lens side 11 and the second lens side 12, the third lens side 13 and the fourth lens side 14, the fifth lens side 15 and the sixth lens side 16, and the seventh lens side 17 and the eighth lens side 18, respectively. In other words, the optical lens 10 has four planar sides 101.

[0277] Appendix Figure 39The diagram shows a top view of another modified embodiment of the optical lens 10 of the camera module 100, wherein the first lens side 11, the third lens side 13, the fifth lens side 15, and the seventh lens side 17 are all planar, such that the optical lens 10 forms the planar side 101 at the corresponding positions of the first lens side 11, the third lens side 13, the fifth lens side 15, and the seventh lens side 17, respectively, and the first lens side 11 and the fifth lens side 15 are symmetrical to each other, the third lens side 13 and the seventh lens side 17 are symmetrical to each other, wherein the second lens side 12, the fourth lens side 14, the sixth lens side 16, and the eighth lens side 18 are all curved surfaces, such that the optical lens 10 forms the curved surface side 102 at the corresponding positions of the second lens side 12, the fourth lens side 14, the sixth lens side 16, and the eighth lens side 18, respectively, and the second lens side 12 and the sixth lens side 16 are symmetrical to each other, the fourth lens side 14 and the eighth lens side 18 are symmetrical to each other. That is, the optical lens 10 has four planar sides 101 and four curved sides 102, and each planar side 101 and each curved side 102 is spaced apart from each other. In other words, there is one curved side 102 between adjacent planar sides 101 and one planar side 101 between adjacent curved sides 102.

[0278] It will be understood by those skilled in the art that the above embodiments are merely examples, and features of different embodiments can be combined with each other to obtain implementation methods that are readily conceivable according to the content disclosed in the present invention but are not explicitly shown in the accompanying drawings.

[0279] Those skilled in the art should understand that the embodiments of the present invention described above and shown in the accompanying drawings are merely examples and do not limit the present invention. The objectives of the present invention have been fully and effectively achieved. The functions and structural principles of the present invention have been demonstrated and explained in the embodiments, and any variations or modifications may be made to the implementation of the present invention without departing from the stated principles.

Claims

1. A camera module, characterized in that, include: At least one optical lens; At least one photosensitive chip; At least one circuit board, wherein the circuit board includes a substrate and at least one electronic component, the photosensitive chip is electrically connected to the substrate, wherein the substrate has a front side and a back side, and at least one electronic component is electrically connected to the substrate on the back side. A molding unit, wherein the molding unit includes a back molding portion and a molding base, wherein when the back molding portion is integrally bonded to at least a portion of the back side of the substrate, the molding base is simultaneously integrally bonded to the front side of the substrate, wherein the molding base has at least one light window, the photosensitive area of ​​the photosensitive chip corresponds to the light window of the molding base, wherein the optical lens is disposed in the photosensitive path of the photosensitive chip, and the light window of the molding base forms a light path between the optical lens and the photosensitive chip; as well as At least one frame-shaped support element, wherein the support element is disposed in or formed in a non-photosensitive area of ​​the photosensitive chip before the molding process, and the support element protrudes from the photosensitive chip.

2. The camera module according to claim 1, wherein the molding base embeds the non-photosensitive area of ​​the photosensitive chip, so that the molding base, the photosensitive chip, the substrate and the back molding portion are integrally combined.

3. The camera module according to claim 2, further comprising at least one set of connecting lines, wherein the photosensitive chip is mounted on the front side of the substrate, and the two ends of the connecting lines are respectively connected to the substrate connector of the substrate and the chip connector of the photosensitive chip, so as to conductively connect the photosensitive chip and the substrate through the connecting lines.

4. The camera module according to claim 2, wherein after the molding process is completed, the molding base embeds at least a portion of the support element.

5. The camera module according to any one of claims 1 to 4, wherein the rear molded portion embeds at least a portion of at least one of the electronic components.

6. The camera module according to any one of claims 1 to 4, wherein the rear molding portion forms at least one assembly space.

7. The camera module according to claim 6, wherein at least one of the electronic components is housed in the assembly space of the rear molding portion.

8. The camera module according to claim 7, wherein the height dimension of the back molded portion is parameter H, and the height dimension of the electronic component protruding from the back of the substrate is parameter h, wherein the value of parameter H is greater than or equal to the value of parameter h.

9. The camera module according to any one of claims 1 to 8, wherein at least one of the electronic components is conductively connected to the front side of the substrate.

10. The camera module of claim 9, wherein the molded base embeds at least a portion of at least one of the electronic components located on the front side of the substrate.

11. The imaging module according to claim 9, wherein the back molding portion isolates the electronic components on the front side of the substrate and the photosensitive chip.

12. The imaging module according to any one of claims 1 to 11, wherein the shape of the back molding portion is in the shape of a "square"; or the shape of the back molding portion is in the shape of a "Π"; or the shape of the back molding portion is in the shape of a "Γ"; or the shape of the back molding portion is in the shape of an "I"; or the shape of the back molding portion is in the shape of a "II"; or the shape of the back molding portion is in the shape of a "III"; or the shape of the back molding portion is in the shape of an "X"; or the shape of the back molding portion is in the shape of an "L"; or the shape of the back molding portion is in the shape of a "C"; or the shape of the back molding portion is in the shape of a "square character"; or the shape of the back molding portion is in the shape of a "grid character"; or the shape of the back molding portion is in the shape of a "square"; or the shape of the back molding portion is in the shape of a "rectangle"; or the shape of the back molding portion is in the shape of a "trapezoid"; or the shape of the back molding portion is in the shape of a "circle"; or the shape of the back molding portion is in the shape of an "ellipse".

13. The imaging module according to any one of claims 1 to 11, wherein the number of the back molding portions is at least one, and the back molding portion is integrally formed at at least one corner of the substrate, or the back molding portion is integrally combined with at least one side portion of the substrate, or the back molding portion is integrally combined with the middle portion of the substrate.

14. The imaging module according to any one of claims 1 to 11, wherein the number of the back molding portions is at least two, at least one of the back molding portions is integrally formed at at least one corner of the substrate, and the other back molding portion is integrally combined with at least one side portion of the substrate; or at least one of the back molding portions is integrally formed at at least one corner of the substrate, and the other back molding portion is integrally combined with the middle portion of the substrate; or at least one of the back molding portions is integrally combined with at least one side portion of the substrate, and the other back molding portion is integrally combined with the middle portion of the substrate.

15. The imaging module according to claim 6, wherein at least one of the assembly spaces of the back molding portion corresponds to the non-photosensitive area and / or the photosensitive area of the photosensitive chip.

16. The imaging module according to any one of claims 1 to 15, wherein the substrate has at least one molding space, and at least one of the molding spaces is implemented as a through hole to communicate the front side and the back side of the substrate, and the molding base and the back molding portion are connected to each other through the molding space.

17. The imaging module according to any one of claims 1 to 16, wherein the circuit board includes at least one connecting plate, and the module connecting side of the connecting plate is connected to the substrate on the front side of the substrate.

18. The camera module according to claim 17, wherein the molded base encloses the module connection side of the connecting plate.

19. The camera module according to any one of claims 1 to 16, wherein the circuit board includes at least one connecting plate, wherein the module connecting side of the connecting plate is connected to the substrate on the back side of the substrate.

20. The camera module according to claim 19, wherein the rear molding portion encloses the module connection side of the connecting plate.

21. The camera module according to any one of claims 1 to 20, further comprising at least one filter element, wherein the filter element is mounted on the photosensitive chip such that the filter element is held between the optical lens and the photosensitive chip, and the molding base embeds the outer edge of the filter element.

22. The camera module according to any one of claims 1 to 20, further comprising at least one filter element, wherein the filter element is mounted on the top surface of the molded base such that the filter element is held between the optical lens and the photosensitive chip.

23. The camera module according to any one of claims 1 to 20, further comprising at least one filter element and a frame-shaped bracket, wherein the filter element is mounted on the bracket, and the bracket is mounted on the top surface of the molded base so that the filter element is held between the optical lens and the photosensitive chip.

24. The camera module according to any one of claims 1 to 20, further comprising at least one filter element, wherein the filter element is mounted on the optical lens such that the filter element is held between the optical lens and the photosensitive chip.

25. The camera module according to any one of claims 1 to 20, further comprising at least one driver, wherein the optical lens is drivably disposed on the driver, the driver being mounted on the top surface of the molding base to hold the optical lens in the photosensitive path of the photosensitive chip by means of the driver.

26. The camera module of claim 23, further comprising at least one driver, wherein the optical lens is drivably disposed on the driver, the driver being mounted on the top surface of the molding base to hold the optical lens in the photosensitive path of the photosensitive chip by means of the driver.

27. The camera module according to any one of claims 1 to 20, further comprising at least one lens barrel, wherein the optical lens is disposed in the lens barrel, wherein the lens barrel is attached to the top surface of the molding base, or the lens barrel extends integrally into the molding base, so that the optical lens is held in the photosensitive path of the photosensitive chip by means of the lens barrel.

28. The camera module of claim 23, further comprising at least one lens barrel, wherein the optical lens is disposed in the lens barrel, wherein the lens barrel is attached to the top surface of the molding base, or the lens barrel extends integrally into the molding base, so that the optical lens is held in the photosensitive path of the photosensitive chip by means of the lens barrel.

29. The camera module according to any one of claims 1 to 28, wherein the optical lens is circular in top view; or the optical lens is elliptical in top view; or the optical lens is square in top view.

30. The camera module according to any one of claims 1 to 28, wherein the optical lens has a planar side and an arcuate side, wherein the two sides of the planar side are respectively connected to the two sides of the arcuate side.

31. The camera module according to any one of claims 1 to 28, wherein the optical lens has two planar sides and one arcuate side, wherein one side of any one of the planar sides is connected to a side of the arcuate side, and the other side is connected to a side of the other planar side.

32. The camera module according to any one of claims 1 to 28, wherein the optical lens has two planar sides and two arcuate sides, wherein the two planar sides are symmetrical to each other, the two arcuate sides are symmetrical to each other, and wherein a side portion of any one of the planar sides is connected to a side portion of each of the two arcuate sides.

33. The camera module according to any one of claims 1 to 28, wherein the optical lens has four planar sides and four arcuate sides, wherein every two planar sides are symmetrical to each other, every two arcuate sides are symmetrical to each other, and a side portion of any one planar side is connected to a side portion of two arcuate sides respectively.

34. An electronic device, characterized in that, include: One piece of equipment; and At least one of the camera modules according to any one of claims 1 to 33, wherein the camera module is disposed on the device body.

35. A circuit board assembly, characterized in that, include: At least one electronic component; A substrate, wherein the substrate has a front side and a back side, and at least one of the electronic components is electrically connected to the substrate on the back side. A molding unit, wherein the molding unit includes a back molding portion and a molding base, wherein when the back molding portion is integrally bonded to at least a portion of the back side of the substrate, the molding base is integrally bonded to the front side of the substrate. as well as At least one frame-shaped support element, wherein the support element is disposed in or formed in a non-photosensitive area of ​​the photosensitive chip before the molding process, and the support element protrudes from the photosensitive chip.

36. The circuit board assembly of claim 35, further comprising at least one photosensitive chip, wherein the molding base has at least one light window, the photosensitive chip is mounted on the front side of the substrate through the light window of the molding base, and the photosensitive chip is conductively connected to the substrate, and the light window of the molding base corresponds to the photosensitive area of ​​the photosensitive chip.

37. The circuit board assembly according to claim 35, further comprising at least one photosensitive chip, wherein the photosensitive chip is mounted on the front side of the substrate, and the photosensitive chip is conductively connected to the substrate, wherein the molding base has at least one light window, wherein the molding base embeds the non-photosensitive area of the photosensitive chip, and the photosensitive area of the photosensitive chip corresponds to the light window of the molding base.

38. The circuit board assembly according to claim 37, wherein after the molding process is completed, the molding base embeds at least a part of the supporting element.

39. The circuit board assembly according to any one of claims 35 to 38, wherein the back molding part embeds at least a part of at least one of the electronic components.

40. The circuit board assembly according to any one of claims 35 to 38, wherein the back molding part forms at least one assembly space.

41. The circuit board assembly according to claim 40, wherein at least one of the electronic components is accommodated in the assembly space of the back molding part.

42. The circuit board assembly according to claim 41, wherein the height dimension of the back molding part is set as parameter H, and the height dimension of the electronic component protruding from the back side of the substrate is set as parameter h, wherein the value of parameter H is greater than or equal to the value of parameter h.

43. The circuit board assembly according to any one of claims 35 to 42, wherein the front side of the substrate is conductively connected to at least one of the electronic components.

44. The circuit board assembly according to claim 43, wherein the molding base embeds at least a part of at least one of the electronic components located on the front side of the substrate.

45. The circuit board assembly according to claim 43, wherein the back molding part isolates the electronic components and the photosensitive chip located on the front side of the substrate.

46. The circuit board assembly according to any one of claims 35 to 45, wherein the shape of the back molding part is in the shape of "口" (square); or the shape of the back molding part is in the shape of "Π" (inverted U); or the shape of the back molding part is in the shape of "Γ" (L-shaped with a horizontal bar at the bottom); or the shape of the back molding part is in the shape of "I" (vertical bar); or the shape of the back molding part is in the shape of "II" (two vertical bars); or the shape of the back molding part is in the shape of "III" (three vertical bars); or the shape of the back molding part is in the shape of "X" (cross); or the shape of the back molding part is in the shape of "L" (L-shaped); or the shape of the back molding part is in the shape of "C" (C-shaped); or the shape of the back molding part is in the shape of "日" (square with a horizontal bar in the middle); or the shape of the back molding part is in the shape of "井" (grid with a cross in the middle); or the shape of the back molding part is in the shape of "田" (square with a cross in the middle); or the shape of the back molding part is in a grid shape; or the shape of the back molding part is square; or the shape of the back molding part is rectangular; or the shape of the back molding part is trapezoidal; or the shape of the back molding part is circular; or the shape of the back molding part is oval.

47. The circuit board assembly according to any one of claims 35 to 45, wherein the number of the back molding portions is at least one, wherein the back molding portion is integrally formed at at least one corner of the substrate, or the back molding portion is integrally coupled to at least one side of the substrate, or the back molding portion is integrally coupled to the middle of the substrate.

48. The circuit board assembly according to any one of claims 35 to 45, wherein the number of the back molding portions is at least two, wherein at least one of the back molding portions is integrally formed at at least one corner of the substrate, and the other back molding portion is integrally coupled to at least one side of the substrate; or at least one of the back molding portions is integrally formed at at least one corner of the substrate, and the other back molding portion is integrally coupled to the middle of the substrate; or at least one back molding portion is integrally coupled to at least one side of the substrate, and the other back molding portion is integrally coupled to the middle of the substrate.

49. The circuit board assembly of claim 41, wherein at least one of the mounting spaces of the back molding portion corresponds to a non-photosensitive area of ​​the photosensitive chip.

50. The circuit board assembly according to any one of claims 35 to 49, wherein the substrate has at least one molding space, at least one of the molding spaces being configured as a through-hole to connect the front side of the substrate and the back side of the substrate, wherein the molding base and the back molding portion are interconnected through the molding space.

51. The circuit board assembly according to any one of claims 35 to 50, wherein the circuit board includes at least one connecting plate, wherein the module connecting side of the connecting plate is connected to the substrate on the front side of the substrate.

52. The circuit board assembly according to any one of claims 35 to 50, wherein the circuit board includes at least one connecting plate, wherein the module connecting side of the connecting plate is connected to the substrate on the back side of the substrate.

53. The circuit board assembly of claim 51, wherein the molded base encloses the module connection side of the connecting plate.

54. The circuit board assembly of claim 52, wherein the back molding portion encloses the module connection side of the connecting plate.

55. A method for manufacturing a camera module, characterized in that, The manufacturing method includes the following steps: (a) At least one electronic component is electrically connected to the back side of a substrate. (x) At least one frame-shaped support element is disposed or formed in the non-photosensitive area of ​​the photosensitive chip, and the support element protrudes from the photosensitive chip; (b) A back molded portion integrally bonded to the substrate is formed on the back side of the substrate and a molded base integrally bonded to the substrate is formed on the front side of the substrate, wherein the molded base has at least one light window. (c) Aligning the photosensitive area of ​​a photosensitive chip conductively connected to the substrate with the light window of the molding base; and (d) An optical lens is held in the light-sensing path of the photosensitive chip to obtain the camera module.

56. The manufacturing method according to claim 55, wherein in step (a), at least one of the electronic components is conductively connected to the front side of the substrate of the substrate.

57. The manufacturing method according to claim 55 or 56, wherein step (c) further comprises the following step: (c.1) The photosensitive chip is mounted onto the front side of the substrate through the light window of the molded base; and (c.2) A connecting line is formed between the chip connector of the photosensitive chip and the substrate connector of the substrate to electrically connect the photosensitive chip and the substrate.

58. The manufacturing method according to claim 55 or 56, wherein in the above method, the photosensitive chip is first mounted on the front side of the substrate of the substrate and the photosensitive chip is conductively connected to the substrate, and then the molding base integrally bonded to the substrate is formed on the front side of the substrate of the substrate, such that the molding base encloses the non-photosensitive area of ​​the photosensitive chip and the photosensitive area of ​​the photosensitive chip corresponds to the light window of the molding base.

59. The manufacturing method according to claim 58, wherein in the above method, the molded base is used to embed at least a portion of the support element.

60. The manufacturing method according to claim 55 or 56, wherein in step (b), the back molding portion is used to embed at least a portion of at least one of the electronic components.

61. The manufacturing method according to claim 55 or 56, wherein in step (b), the molded base is used to embed at least a portion of at least one of the electronic components.

62. The manufacturing method according to claim 60, wherein in step (b), the molding base is used to embed at least a portion of at least one of the electronic components.

63. In the manufacturing method according to claim 55 or 56, wherein in step (b), the back molding portion is formed to form at least one assembly space.

64. The manufacturing method of claim 63, wherein the electronic components are housed in the assembly space.

65. The manufacturing method according to claim 63, wherein the assembly space corresponds to the non-photosensitive area and / or photosensitive area of ​​the photosensitive chip.

66. The manufacturing method according to any one of claims 55 to 65, wherein step (b) further comprises the following step: (b.1) The substrate is placed into a molding die; (b.2) Perform a mold closing process on the molding die to form a first molding space between an upper mold of the molding die and the front side of the substrate of the substrate, and a second molding space between a lower mold of the molding die and the back side of the substrate of the substrate, and the first molding space and the second molding space are interconnected. (b.3) Adding a fluid medium to at least one of the first molding space and the second molding space, such that the fluid medium fills the first molding space and the second molding space, and solidifies within the first molding space and the second molding space; and (b.4) After performing a draft process on the molding die, a molding base integrally bonded to the front side of the substrate and a back molding portion integrally bonded to the back side of the substrate are formed on the back side of the substrate.

67. The manufacturing method according to claim 66, wherein in step (b.1), a panel unit formed by a plurality of the substrates is placed into the molding die, and step (b.4) further includes the following steps: (b.4.1) Demolding the molding die to form a semi-finished circuit board assembly, wherein the circuit board assembly includes the substrate and the molding base and the back molding portion integrally bonded to the substrate; and (b.4.2) Divide the semi-finished circuit board assembly to obtain the circuit board assembly.

68. The manufacturing method according to claim 67, wherein in step (b.2), a plurality of first molding spaces and a first communicating channel connecting adjacent first molding spaces are formed between the upper mold and the front side of the substrate of the substrate, and a plurality of second molding spaces and a second communicating channel connecting adjacent second molding spaces are formed between the lower mold and the back side of the substrate of the substrate, wherein at least one first molding space and at least one second molding space are interconnected, so that in step (b.3), the fluid medium fills all the first molding spaces and the second molding spaces.

Images