Display module and display device

Abstract

The present invention relates to the field of liquid crystal display technology, and proposes a display module, which includes a cover plate, a grounding lead, a shielding layer and a grounding conductor; the grounding lead is electrically connected to a grounding terminal; the shielding layer is located on a side of the cover plate facing the grounding lead; the grounding conductor is arranged between the shielding layer and the grounding lead, and the shielding layer is electrically connected to the grounding lead. The display module can shield radio frequency radiation interference, and has high production efficiency and good shielding effect.

Description

Technical Field

[0001] The present invention relates to the field of display technology, and in particular to a display module and a display device having the display module. Background Art

[0002] In the design of display devices, user experience is the key factor in the success or failure of the design. Especially in mobile phone design, narrow frame, thin and full screen design is one of the development trends in the mobile phone design industry. Full screen has brought a wave of innovation in mobile phones and mobile phone components. However, full screen makes the distance between the display screen driver integrated circuit and the mobile phone antenna very close, which brings about the strengthening of radio frequency radiation interference. Therefore, full screen mobile phones have higher and higher requirements for the shielding of radio frequency radiation of the display screen.

[0003] Therefore, it is necessary to study a display module and a display device having the display module.

[0004] The above information disclosed in this Background section is only for enhancement of understanding of the background of the invention and therefore it may contain information that does not constitute the prior art that is already known to a person of ordinary skill in the art. Summary of the invention

[0005] The purpose of the present invention is to overcome the disadvantage of the prior art that the radio frequency radiation interference is large, and to provide a display module with small radio frequency radiation interference and a display device having the display module

[0006] Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.

[0007] According to one aspect of the present disclosure, there is provided a display module, comprising:

[0008] Cover plate;

[0009] A ground lead, electrically connected to the ground terminal;

[0010] A shielding layer, located on a side of the cover plate facing the grounding lead;

[0011] The grounding conductor is disposed between the shielding layer and the grounding lead and electrically connects the shielding layer to the grounding lead.

[0012] In an exemplary embodiment of the present disclosure, a grounding window area is provided on a side of the grounding lead facing the cover plate, and the grounding conductor is electrically connected to the grounding lead through the grounding window area.

[0013] In an exemplary embodiment of the present disclosure, the display module further includes:

[0014] Display integrated circuits;

[0015] A backlight integrated circuit is electrically connected to the display integrated circuit, and the ground lead is located on the backlight integrated circuit and is electrically connected to the ground terminal through the display integrated circuit.

[0016] In an exemplary embodiment of the present disclosure, the display module further includes a backlight module and a display integrated circuit, and the display integrated circuit includes:

[0017] The circuit body is arranged on a side of the backlight module away from the cover plate;

[0018] A first bending portion connected to the circuit body;

[0019] The second bending portion is connected to the first bending portion and is located on a side of the backlight module facing the cover plate. The grounding lead is located on the display integrated circuit, and the grounding window area is located on the second bending portion.

[0020] In an exemplary embodiment of the present disclosure, the display module further includes:

[0021] The insulating layer is arranged between the shielded component and the shielding layer, and the orthographic projection of the insulating layer on the cover plate covers the orthographic projection of the shielded component on the cover plate.

[0022] In an exemplary embodiment of the present disclosure, the shielded component includes the second bending portion and / or a driving integrated circuit.

[0023] In an exemplary embodiment of the present disclosure, the grounding conductor is an elastic conductor.

[0024] In an exemplary embodiment of the present disclosure, the elastic conductor protrudes from the backlight module.

[0025] In an exemplary embodiment of the present disclosure, the elastic conductor is conductive foam.

[0026] According to one aspect of the present disclosure, there is provided a display device, comprising:

[0027] A display module as described in any one of the above items.

[0028] It can be seen from the above technical solution that the present invention has at least one of the following advantages and positive effects:

[0029] The display module of the present invention provides electromagnetic shielding for electronic devices such as driver integrated circuits through a shielding layer, connects the shielding layer to a grounding lead through a grounding conductor, and connects the grounding lead to a grounding terminal to ground the shielding layer. On the one hand, the shielding layer is arranged on the cover plate, and the shielding layer and the cover plate can be produced in an integrated manner, thereby improving production efficiency; compared with attaching the shielding layer to the driver integrated circuit, the shielding layer is not limited by the size and structure of the driver integrated circuit, and the area of ​​the shielding layer can also be designed to be larger, thereby achieving a better shielding effect; and there is no need to design a special shielding layer for the driver integrated circuit, thereby reducing the design workflow. On the other hand, by providing electromagnetic shielding for electronic devices such as driver ICs through a shielding layer, radio frequency radiation interference between electronic devices such as driver ICs and antennas can be avoided. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] The above and other features and advantages of the present invention will become more apparent by describing in detail exemplary embodiments thereof with reference to the attached drawings.

[0031] Figure 1 is a schematic diagram of a three-dimensional structure of an embodiment of a display module of the present invention;

[0032] Figure 2 yes Figure 1 A schematic diagram of the three-dimensional structure of the back side of the display module;

[0033] Figure 3 yes Figure 1 A schematic diagram of the structure of the backlight integrated circuit in FIG.

[0034] Figure 4 yes Figure 1 Schematic diagram of the structure of the cover plate.

[0035] The main components in the figure are described as follows:

[0036] 1. Cover plate;

[0037] 2. Display integrated circuit; 21. Circuit body; 22. First bending portion; 23. Second bending portion; 24. Ground terminal;

[0038] 3. Grounding lead; 31. Grounding window area;

[0039] 4. Ground conductor; 5. Shielding layer; 6. Backlight module; 61. Rubber frame; 7. Backlight integrated circuit; 8. Insulation layer; 9. Display area. DETAILED DESCRIPTION

[0040] Example embodiments will now be described more fully with reference to the accompanying drawings. However, example embodiments can be implemented in a variety of forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided so that the present invention will be comprehensive and complete and fully convey the concepts of the example embodiments to those skilled in the art. The same reference numerals in the figures represent the same or similar structures, and thus their detailed description will be omitted.

[0041] The present invention first provides a display module, which may include a cover plate, a grounding lead, a shielding layer, a grounding conductor, etc. The grounding lead is electrically connected to a grounding terminal; the shielding layer is located on a side of the cover plate facing the grounding lead; the grounding conductor is arranged between the shielding layer and the grounding lead, and electrically connects the shielding layer to the grounding lead.

[0042] Reference Figure 1 as well as Figure 2 The structure diagram of an embodiment of the display module of the present invention is shown. The display module may include a cover plate 1, a display integrated circuit 2, a grounding lead 3, a grounding conductor 4, a shielding layer 5, etc. The display integrated circuit 2 has a grounding terminal, and the display integrated circuit 2 is arranged on one side of the cover plate 1; the grounding lead 3 is connected to the grounding terminal 24; the grounding conductor 4 is electrically connected to the grounding lead 3; the shielding layer 5 is arranged on a side of the cover plate 1 close to the display integrated circuit 2, and is electrically connected to the grounding conductor 4, and the shielding layer 5 is located between the cover plate 1 and the display integrated circuit 2, so as to provide electromagnetic shielding for electronic devices such as the display integrated circuit 2.

[0043] It should be noted that in this disclosure, Figure 1 As shown, the grounding lead 3 is arranged in the backlight integrated circuit, which may be one or several wirings in the backlight integrated circuit. However, the present disclosure is not limited thereto, and the grounding lead 3 may also be arranged accordingly according to actual needs.

[0044] In this example embodiment, the display module may be a liquid crystal display module. Of course, those skilled in the art will appreciate that the display module may also be a light emitting diode display module, an organic light emitting diode display module, a micro organic light emitting diode display module, and the like.

[0045] In this exemplary embodiment, the ground conductor 4 can be an elastic conductor, or a non-elastic conductor with a suitable size, as long as the shielding layer can be in good contact with the ground lead. The elastic conductor can be a conductive foam, or a conductive rubber or other conductive material that can be compressed.

[0046] In this exemplary embodiment, the grounding lead 3 may be a copper lead, and a grounding window area 31 may be provided on the grounding lead 3, that is, an area is provided on the grounding lead 3, and the copper lead in this area is exposed. The grounding window area 31 is provided on the side of the grounding lead 3 facing the cover plate 1. The elastic conductor may be bonded to the grounding window area 31 through a conductive adhesive layer, so that the elastic conductor is fixed to the grounding lead 3 and can conduct electricity with the grounding lead 3.

[0047] In this example embodiment, the shielding layer 5 can be directly bonded to the cover plate 1, and the shielding layer 5 is set to a rectangular shape. The length direction of the shielding layer 5 is consistent with the width direction of the cover plate 1, and the width direction of the shielding layer 5 is consistent with the length direction of the cover plate 1. The length of the shielding layer 5 is less than the width of the cover plate 1, and the spacing between the two sides is basically the same, about 1mm. It should be understood by those skilled in the art that the shielding layer is rectangular in this example embodiment, but the present disclosure is not limited thereto. In other embodiments, the shielding layer can have other shapes according to actual needs or design requirements. The shielding layer 5 can be a copper foil, which is a conductor. The elastic conductor and the shielding layer 5 can be bonded together, and the shielding layer 5 is grounded through the elastic conductor and the grounding lead 3, thereby playing a role in shielding radio frequency radiation. After the display module is assembled, the elastic conductor can be compressed, so that the elastic conductor and the shielding layer 5 are more closely bonded, and there will be no problems such as unreal crimping. Of course, it can be understood by those skilled in the art that the elastic conductor can be bonded to the shielding layer 5 by conductive glue, and the connection between the elastic conductor and the grounding window area 31 is a fit, and the elastic conductor is installed and compressed to make the elastic conductor fit closely with the grounding window area 31.

[0048] In this example implementation, the display module may further include a backlight module 6 and a backlight integrated circuit 7, etc. The backlight module 6 may include a first side surface and a second side surface that are arranged opposite to each other, and the backlight module 6 may correspond to the display area 9. The display integrated circuit 2 may be arranged on the first side surface, the backlight integrated circuit 7 may be arranged on the second side surface, and the cover plate 1 may be arranged on a side of the backlight module 6 close to the second side surface, that is, the backlight integrated circuit 7 is arranged between the backlight module 6 and the cover plate 1.

[0049] Reference Figure 3The schematic diagram of the structure of the backlight integrated circuit 7 is shown; in this exemplary embodiment, the ground lead 3 can be connected to the backlight integrated circuit 7, specifically, the ground lead 3 is led out from the backlight integrated circuit 7, that is, one end is connected to the backlight integrated circuit 7; the other end is connected to the display integrated circuit 2. In other words, the ground lead 3 is connected between the backlight integrated circuit 7 and the display integrated circuit 2, and the backlight integrated circuit 7 can be grounded through the ground lead 3. However, since the display integrated circuit 2 is arranged on the first side surface and the backlight integrated circuit 7 is arranged on the second side surface, the ground lead 3 is arranged in a substantially "U"-shaped bend to connect the display integrated circuit 2 and the backlight integrated circuit 7. The backlight integrated circuit 7 and the shielding layer 5 can be connected to the ground terminal 24 of the display integrated circuit 2 through one ground lead 3, and the structure is relatively simple.

[0050] In addition, in another exemplary embodiment of the present invention, the ground lead may be located on the display integrated circuit 2. Specifically, the display module may also include a backlight module and a display integrated circuit, and the display integrated circuit 2 may include a circuit body 21, a first bending portion 22, and a second bending portion 23, etc.; the circuit body 21 is arranged on the side of the backlight module away from the cover plate; the first bending portion 22 is connected to the circuit body 21 and may be arranged substantially vertically to the circuit body 21; the second bending portion 23 is connected to the first bending portion 22 and is arranged on the side of the backlight module facing the cover plate, and the second bending portion 23 is arranged substantially parallel to the circuit body 21. The second bending portion 23 may form a ground lead, and the grounding window area is located on the side of the second bending portion facing the shielding layer 5.

[0051] Reference Figure 4 The structural schematic diagram of the cover plate 1 shown in the figure; since the second bending portion 23 of the display integrated circuit 2 is arranged on the second side of the backlight module 6, the cover plate 1 is arranged on the side of the backlight module 6 close to the second side, and the shielding layer 5 is arranged on the side of the cover plate 1 close to the display integrated circuit 2, after the display module is installed, the second bending portion 23 may contact the shielding layer 5. The shielding layer 5 is also conductive, which will make the shielding layer 5 and the display integrated circuit 2 conductive. Therefore, an insulating layer 8 can be arranged between the second bending portion 23 and the shielding layer 5, and the area of ​​the insulating layer 8 can be larger than the area where the shielding layer 5 contacts the display integrated circuit 2. In addition, it can be understood by those skilled in the art that the insulating layer 8 is arranged on the shielding layer, which can not only be used to insulate the second bending portion 23 from the shielding layer, but also to insulate the shielded component from each other, as long as the orthographic projection of the insulating layer 8 on the cover plate covers the orthographic projection of the shielded component on the cover plate. The shielded component can be a backlight integrated circuit 7, a driver integrated circuit, etc.

[0052] The elastic conductor protrudes from the backlight module. In this exemplary embodiment, the height of the elastic conductor is higher than the height of the plastic frame 61 around the backlight module 6. Because after the display module is installed, the elastic conductor needs to be in a compressed state, so the elastic conductor needs to be in the most protruding position to be compressed. Generally speaking, the plastic frame 61 around the backlight module 6 is in the most protruding position. As long as the height of the elastic conductor is higher than the height of the plastic frame 61 around the backlight module 6, the elastic conductor will be in the most protruding position and will be compressed after installation. In addition, in the case where the plastic frame 61 is not provided, the elastic conductor can be in the most protruding position.

[0053] In this exemplary embodiment, the cover plate 1 is a touch cover plate. Of course, in other exemplary embodiments of the present invention, the cover plate 1 may not be a touch cover plate, but may be just an ordinary glass cover plate.

[0054] The above display module is described below through a specific embodiment.

[0055] Reference Figure 1 As shown, in this embodiment, the display module includes a cover plate 1 and a backlight module 6 which are arranged in sequence from bottom to top, and the cover plate 1 is a touch cover plate. A display integrated circuit 2 is arranged on the backlight module 6, and the display integrated circuit 2 is a main FPC (flexible circuit board), and the main FPC is bent to the lower surface of the backlight module 6 to form a second bending portion 23. A shielding layer 5 is arranged on the cover plate 1, and an insulating layer 8 is arranged on the shielding layer 5. The insulating layer 8 can insulate the second bending portion 23 of the main FPC, the backlight integrated circuit 7 and other electronic devices from the shielding layer 5. A backlight integrated circuit 7 is also arranged between the cover plate 1 and the backlight module 6, and a grounding lead 3 is connected to the backlight integrated circuit 7, and the grounding lead 3 is bent to the upper surface of the backlight module 6 and connected to the grounding end of the main FPC. A grounding window area is arranged on the lower surface of the grounding lead 3, and a conductive foam is bonded to the grounding window area, and the conductive foam is connected to the shielding layer 5 to ground the shielding layer 5. The shielding layer 5 can provide electromagnetic shielding for electronic devices such as the main FPC and the backlight integrated circuit 7. Figure 1 The “upper” and “lower” in the text shall prevail.

[0056] Furthermore, the present invention also provides a display device, which includes the above-mentioned display module. The specific structure of the display module has been described in detail above, and will not be repeated here.

[0057] The display module of the present invention provides electromagnetic shielding for electronic devices such as driver integrated circuits through the shielding layer 5, connects the shielding layer 5 to the grounding lead 3 through an elastic conductor, and the grounding lead 3 is connected to the grounding terminal 24 of the display integrated circuit 2 to ground the shielding layer 5. On the one hand, the display integrated circuit 2 is shielded by the shielding layer 5, so that the radio frequency radiation interference between the display integrated circuit 2 and the antenna can be avoided. On the other hand, the shielding layer 5 is arranged on the cover plate 1, and the shielding layer 5 and the cover plate 1 can be produced in an integrated manner, so that the production efficiency is improved; compared with attaching the shielding layer to the driver integrated circuit, the shielding layer 5 is not limited by the size and structure of the driver integrated circuit, and the area of ​​the shielding layer 5 can also be designed to be larger, so as to achieve a better shielding effect; and there is no need to design a special shielding layer for the driver integrated circuit, so as to reduce the design workflow. On the other hand, the elastic conductor is elastic, and after the display module is installed, the elastic conductor is compressed, and the shielding layer 5 and the grounding lead 3 are connected by the elastic conductor, so that good contact can be ensured.

[0058] The features, structures or characteristics described above may be combined in one or more embodiments in any suitable manner, and if possible, the features discussed in each embodiment are interchangeable. In the above description, many specific details are provided to provide a full understanding of the embodiments of the present invention. However, those skilled in the art will appreciate that the technical solution of the present invention may be practiced without one or more of the specific details, or other methods, components, materials, etc. may be adopted. In other cases, known structures, materials or operations are not shown or described in detail to avoid blurring various aspects of the present invention.

[0059] The terms "about" and "approximately" used in this specification generally mean within 20%, preferably within 10%, and more preferably within 5% of a given value or range. The numbers given here are approximate numbers, which means that in the absence of specific instructions, the meanings of "about", "approximately", "roughly" and "approximately" can still be implied.

[0060] Although relative terms such as "upper" and "lower" are used in this specification to describe the relative relationship of one component of the illustration to another component, these terms are used in this specification only for convenience, such as according to the orientation of the examples described in the drawings. It is understood that if the device of the illustration is turned upside down, the component described as "upper" will become the component "lower". When a structure is "on" other structures, it may mean that the structure is formed integrally on the other structure, or that the structure is "directly" disposed on the other structure, or that the structure is "indirectly" disposed on the other structure through another structure.

[0061] In this specification, the terms "a", "an", "the" and "said" are used to indicate the presence of one or more elements / components / etc.; the terms "comprising", "including" and "having" are used to express an open-ended inclusion and mean that there may be additional elements / components / etc. in addition to the listed elements / components / etc.; the terms "first", "second" and "third" etc. are used only as labels and are not intended to limit the quantity of their objects.

[0062] It should be understood that the present invention is not limited in its application to the detailed structure and arrangement of the components proposed in this specification. The present invention can have other embodiments and can be implemented and executed in a variety of ways. The aforementioned variations and modifications fall within the scope of the present invention. It should be understood that the present invention disclosed and defined in this specification extends to all alternative combinations of two or more individual features mentioned or evident in the text and / or the drawings. All these different combinations constitute multiple alternative aspects of the present invention. The embodiments described in this specification illustrate the best mode known for implementing the present invention and will enable those skilled in the art to utilize the present invention.

Claims

1. A display module, characterized in that: include: Cover plate; A display integrated circuit, wherein the display integrated circuit has a ground terminal and is located on one side of the cover plate; A ground lead, electrically connected to the ground terminal; A shielding layer, located on a side of the cover plate facing the grounding lead and between the cover plate and the display integrated circuit; The grounding conductor is disposed between the shielding layer and the grounding lead and electrically connects the shielding layer to the grounding lead.

2. The display module according to claim 1, characterized in that: A grounding window area is provided on one side of the grounding lead facing the cover plate, and the grounding conductor is electrically connected to the grounding lead through the grounding window area.

3. The display module according to claim 2, characterized in that: The display module also includes: A backlight integrated circuit is electrically connected to the display integrated circuit, and the ground lead is located on the backlight integrated circuit and is electrically connected to the ground terminal through the display integrated circuit.

4. The display module according to claim 2, characterized in that: The display module further includes a backlight module and a display integrated circuit, and the display integrated circuit includes: The circuit body is arranged on a side of the backlight module away from the cover plate; A first bending portion connected to the circuit body; The second bending portion is connected to the first bending portion and is located on a side of the backlight module facing the cover plate. The grounding lead is located on the display integrated circuit, and the grounding window area is located on the second bending portion.

5. The display module according to claim 4, characterized in that: The display module also includes: The insulating layer is arranged between the shielded component and the shielding layer, and the orthographic projection of the insulating layer on the cover plate covers the orthographic projection of the shielded component on the cover plate.

6. The display module according to claim 5, characterized in that: The shielded component includes the second bent portion and / or a driving integrated circuit.

7. The display module according to claim 1, characterized in that: The grounding conductor is an elastic conductor.

8. The display module according to claim 7, characterized in that: The elastic conductor protrudes from the backlight module.

9. The display module according to claim 7, characterized in that: The elastic conductor is conductive foam.

10. A display device, characterized in that: include: The display module according to any one of claims 1 to 9.

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