Test and Measurement Probe Couplers

By designing a probe coupler for testing and measurement, using directional coupling technology to capture signals on circuit board traces covered by solder resist layer, solving the problem of difficulty in capturing high-speed signals in the prior art, achieving non-destructiveness Signal capture.

CN109870596BActive Publication Date: 2025-02-14TEKTRONIX INC
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Patent Information

Application Number
CN201811455368.1
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Priority Date
2018-10-16
Filing Date
2018-11-30
Publication Date
2025-02-14
Estimated Expiration
2038-11-30

AI Technical Summary

Technical Problem

The prior art is difficult to capture high-speed signals on circuit board traces covered by solder resist layer without breaking the signal path.

Method used

A test and measurement probe coupler is designed, which includes a matrix, a signal tap conductor and a ground tap conductor through a directional coupling of these conductors to capture signals on target traces in the DUT without physical contact. .

Benefits of technology

It is possible to capture high-speed signals in the DUT without breaking the signal path and to safely remove the probe coupler from the DUT to avoid damage.

✦ Generated by Eureka AI based on patent content.

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Abstract

A test and measurement probe coupler may include a substrate, a first signal tap conductor, a first signal contact, a first ground tap conductor, and a first ground contact. The first signal tap conductor may extend a first length along the substrate. The first signal contact may be electrically coupled to the first signal tap conductor, and the first ground tap conductor may extend a second length along the substrate. The first ground tap conductor may be substantially parallel to the first signal tap conductor. The first ground tap conductor may be disposed in a first lateral direction away from the first signal tap conductor, and the first ground contact may be electrically coupled to the first ground tap conductor.
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Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This patent application claims the benefit of Provisional Application No. 62 / 593,859, filed December 1, 2017, which is incorporated by reference into this patent application. Technical Field

[0003] The present disclosure relates to test and measurement systems, and more particularly to probes for use in test and measurement systems. Background Art

[0004] Users of test and measurement instruments, such as oscilloscopes, typically use probes to connect a device under test (DUT), such as a circuit board, to the inputs of the test and measurement instrument to display and perform measurements of electrical signals present in the DUT. Typically, the user establishes an electrical connection between the probe and a test point on the DUT by achieving physical contact between the conductive tip of the probe and a conductive test point (e.g., a gold-plated pad, or a plated through-hole in a circuit board). However, other times there is a need to probe a signal traveling through a portion of the DUT that has no accessible conductive test points, such as a circuit board trace covered by a solder mask.

[0005] Embodiments of the disclosed systems and methods address deficiencies in the prior art. Summary of the invention

[0006] According to a first aspect of the present invention, a test and measurement probe coupler is disclosed, comprising:

[0007] Matrix;

[0008] a first signal tap conductor extending a first length along a surface of a first side of the substrate;

[0009] a first signal contact disposed on the substrate and electrically coupled to the first signal tap conductor;

[0010] a first ground tap conductor extending a second length along a surface of a first side of the substrate, the first ground tap conductor being generally parallel to the first signal tap conductor and disposed in a first lateral direction away from the first signal tap conductor; and

[0011] a first ground contact disposed on the substrate and electrically coupled to the first ground tap conductor;

[0012] The probe coupler is configured to form one half of a directional coupler when the probe coupler is placed near a portion of a target trace on a device under test, the first ground tap conductor not contacting the target trace forming the other half of the directional coupler.

[0013] According to a second aspect of the present invention, a method of using a test and measurement probe coupler is disclosed, the method comprising:

[0014] The probe coupler is positioned to contact a device under test (DUT), the probe coupler comprising:

[0015] a substrate having a first side and a second side opposite the first side;

[0016] a first signal tap conductor extending a first length along a surface of a first side of the substrate;

[0017] a first signal contact disposed on a second side of the substrate and electrically coupled to the first signal tap conductor;

[0018] a first ground tap conductor extending a second length along a surface of a first side of the substrate, the first ground tap conductor being generally parallel to the first signal tap conductor and disposed in a first lateral direction away from the first signal tap conductor; and

[0019] a first ground contact disposed on a second side of the substrate and electrically coupled to the first ground tap conductor;

[0020] aligning the first signal tap conductor of the probe coupler substantially parallel to a portion of a target trace of the DUT, wherein the first signal tap conductor does not contact the target trace of the DUT; and

[0021] An electrical signal from the first signal tap conductor is captured by a test and measurement system. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 is an isometric view showing a portion of a top side or probe side of a test and measurement probe coupler according to an embodiment.

[0023] Figure 2 It is shown Figure 1 An isometric view of a portion of the bottom side or DUT side of the probe coupler.

[0024] Figure 3 is shown on the target trace of an exemplary simplified DUT Figure 1 Axonometric view of the probe coupler.

[0025] Figure 4 It shows that Figure 3 Example of coupling between a DUT and a probe coupler arranged as such.

[0026] Figure 5 is an isometric view showing a portion of a bottom side or a DUT side of a test and measurement probe coupler according to an embodiment.

[0027] Figure 6 is shown on a pair of target traces of an exemplary simplified DUT Figure 4 Axonometric view of the probe coupler.

[0028] Figure 7 is an isometric view showing a portion of a top side or probe side of a test and measurement probe coupler according to an embodiment.

[0029] Figure 8 is along Figure 7 A cross-sectional view taken along the line shown in .

[0030] Fig. 9 An exemplary test and measurement probe coupler connected to an exemplary test and measurement system is shown.

[0031] Fig.10 An exemplary method of using a test and measurement probe coupler according to an embodiment is shown. DETAILED DESCRIPTION

[0032] As described herein, embodiments of the disclosed technology enable the capture (e.g., by probing) of high-speed signals traveling along structures such as printed circuit boards (PCBs) or hybrid integrated circuits in a device under test (DUT) without physically contacting or disrupting the signal path. To do so, embodiments of the disclosed technology include a probe coupler that can be used as one half of a directional coupler, the other half being a target trace in the DUT. While some conventional systems utilize directional couplers to determine the voltage and current of a signal propagating in a transmission channel, these systems require the disruption of the signal path to insert the coupler, or to build the coupler into the channel of the DUT. In addition, embodiments of the disclosed technology include methods for correlating or calibrating a signal in a target trace of the DUT to a signal in the probe coupler.

[0033] Figure 1 is an isometric view showing a portion of a top side or probe side of a test and measurement probe coupler according to an embodiment. Figure 2 It is shown Figure 1 An isometric view of the bottom side or DUT side of the probe coupler. Figure 1 and Figure 2As shown in FIG, probe coupler 100 may include substrate 101, first signal tap conductor 102, first signal contact 103, first ground tap conductor 104, first ground contact 105, second ground tap conductor 106, and second ground contact 107. Probe coupler 100 is configured to be placed over a trace of a DUT to be tested, as will be described below.

[0034] The substrate 101 may have a first side 108 and a second side 109 opposite the first side 108. The first side 108 may be a bottom side or a DUT side, and the second side 109 may be a top side or a probe side. The substrate 101 may be, for example, substantially planar. The substrate 101 may include, for example, a thick film structure of ceramic. As used in the present disclosure, "substantially planar" means substantially or primarily planar, without requiring perfect planarization.

[0035] The first signal tap conductor 102 extends a first length 110 along the substrate 101 (e.g., along the first side 108 of the substrate 101). As shown, the first length 110 can be the length of the substrate 101 along the direction of the first signal tap conductor 102. The first signal tap conductor 102 can be coated with an insulating film, or coated with a partially conductive film. The first signal tap conductor 102 is configured to couple to a signal of interest in the DUT, such as a target trace 122 (see FIG. 1 ) of the PCB 128. Figure 3 ) The first signal contact 103 may be on the second side 109 of the substrate 101 and electrically coupled to the first signal tap conductor 102. The first signal contact 103 may include a signal contact plate, such as Figure 1 As shown in FIG. 1 , however, other configurations may also be used for the first signal contact 103 .

[0036] In an embodiment, the first signal tap conductor 102 may extend around an edge of the substrate 101 to form a conductive end cap 111 to physically connect to the first signal contact 103. In an embodiment, the first signal tap conductor 102 may extend around a second edge of the substrate 101 (the second edge is opposite to the first edge) to form another conductive end cap 111 to physically connect to another first signal contact 103, such as Figure 1 In the embodiment, the through hole 112 (see Figure 7 , Figure 8 ) can extend through the substrate 101 and electrically connect the first signal tap conductor 102 to the first signal contact 103.

[0037] The first ground tap conductor 104 extends a second length 113 along the substrate 101 (e.g., along the first side 108 of the substrate 101). As shown, the second length 113 can be the length of the substrate 101 along the direction of the first ground tap conductor 104. The first ground tap conductor 104 can be generally parallel to the first signal tap conductor 102 and disposed along a first lateral direction 114 away from the first signal tap conductor 102. As used in this disclosure, "generally parallel" means generally or predominantly equidistant at all points, without requiring perfect parallelism. Figure 2 An example of such a configuration is shown in FIG. The first ground contact 105 may be on the second side 109 of the substrate 101 and electrically coupled to the first ground tap conductor 104. The first ground tap conductor 104 is configured to be coupled to a ground of the DUT, such as a ground plane 115 of a PCB 128 (see FIG. Figure 3 ). The first ground contact 105 may be or include a ground contact plate, such as Figure 1 , but other configurations may also be used for the first ground contact 105 .

[0038] In an embodiment, the first ground tap conductor 104 may extend around an edge of the substrate 101 to form a conductive end cap 116 to physically connect to the first ground contact 105. In an embodiment, the first ground tap conductor 104 may extend around a second edge of the substrate 101 (the second edge is opposite to the first edge) to form another conductive end cap 116 to physically connect to another first ground contact 105, such as Figure 1 In the embodiment, the through hole 112 (see Figure 7 , Figure 8 ) may extend through the substrate 101 and electrically connect the first ground tap conductor 104 to the first ground contact 105 .

[0039] The second ground tap conductor 106 extends a third length 117 along the substrate 101 (e.g., along the first side 108 of the substrate 101). As shown, the third length 117 can be the length of the substrate 101 along the direction of the second ground tap conductor 106. The second ground tap conductor 106 can be disposed generally parallel to the first signal tap conductor 102 and along a second lateral direction 118 away from the first signal tap conductor 102. The second lateral direction 118 of the first signal tap conductor 102 is opposite to the first lateral direction 114 of the first signal tap conductor 102. Figure 2 An example of such a construction is shown in FIG. Figure 2 As shown in FIG. 1 , the first lateral direction 114 may be toward the left side of the first signal tap conductor 102, and the second lateral direction 118 may be toward the right side of the first signal tap conductor 102. “Left side” and “right side” are used for convenience and with reference to Figure 2However, the disclosed technology can have a variety of orientations in actual use.

[0040] The second ground contact 107 can be on the second side 109 of the substrate 101 and electrically coupled to the second ground tap conductor 106. The second ground contact 107 is configured to couple the ground of the probe coupler 100 to the ground of the DUT, such as the ground plane 115 of the PCB (see Figure 3 ). The second ground contact 107 may include a ground contact plate, such as Figure 1 As shown in FIG. 1 , however, other configurations may be used for the second ground contact 107 .

[0041] In an embodiment, the second ground tap conductor 106 can extend around the edge of the substrate 101 to form a conductive end cap 119 to physically connect to the second ground contact 107. In an embodiment, the second ground tap conductor 106 can extend around a second edge of the substrate 101 (the second edge is opposite to the first edge) to form another conductive end cap 119 to physically connect to another second ground contact 107, such as Figure 1 In the embodiment, the through hole 112 (see Figure 7 , Figure 8 ) may extend through the substrate 101 and electrically connect the second ground tap conductor 106 to the second ground contact 107.

[0042] In an embodiment, the substrate 101 may include a channel 120, for example, in the first side 108 of the substrate 101. Figure 2 An example is shown in . Thus, a first length 110 of the first signal tap conductor 102 may be within the channel 120. The depth of the channel 120 along the -z direction 121 (perpendicular to the first side 108 of the substrate 101) may be greater than the thickness of the first signal tap conductor 102 along the -z direction 121. Thus, the first signal tap conductor 102 may be recessed below the surface of the first side 108 of the substrate 101. When the first signal tap conductor 102 is recessed below the surface of the first side 108 of the substrate 101, the recess may be deep enough to accommodate the target trace 122 of the DUT, such as Figure 3 In other embodiments, rather than positioning the first signal tap conductor 102 within the channel 102, the target trace 122 of the DUT may be accommodated below the first signal tap conductor 102 by increasing the thickness of the first ground tap conductor 104 and / or the second ground tap conductor 106 and / or increasing the thickness of a portion of the substrate (on which the first and second ground tap conductors 104, 106 are disposed) to be greater than the thickness of the target trace 122.

[0043] Figure 3is shown on the target trace 122 of a simplified DUT 128 Figure 1 1 is an isometric view of the probe coupler 100. As shown, the target trace 122 can be an 8 mil wide trace that is located 5 mils above the ground plane 115 of the DUT 128, but other configurations can also be used. For example, the ground plane 115 can include multiple ground planes that are arranged parallel and coplanar with the target trace 122. The target trace 122 can also be covered with a film or solder mask 123, such as a polyamide solder mask. As mentioned above, the DUT 128 can be or include a PCB or a hybrid integrated circuit.

[0044] Figure 4 It shows that Figure 3 An example of coupling between a DUT 128 and a probe coupler 100 arranged as such. Curve 130 labeled “dB(St(Trace_T1, Trace_T2))” is the insertion loss of the trace after the probe coupler 100 is placed on the DUT or PCB 128. Curve 131 labeled “dB(St(Signal Pad_T1, Trace_T2))” is the energy coupled between trace port 2 and probe signal pad port 1. Curve 132 labeled “dB(St(Signal Pad_T1, Trace_T1))” is the energy coupled between trace port 1 and probe signal pad port 1.

[0045] Figure 5 is an isometric view showing a portion of a bottom side or DUT side of a test and measurement probe coupler according to an embodiment. Figure 6 is shown on a pair of target traces 122, 129 of a simplified DUT 128 Figure 5 In addition to what is mentioned here, Figure 5 and Figure 6 The probe coupler 500 with Figure 1 and Figure 2 Thus, the probe coupler 500 may include a substrate 101, a first signal tap conductor 102, a first signal contact 103, a first ground tap conductor 104, a first ground contact 105, a second ground tap conductor 106, and a second ground contact 107. Each of these components is similar to the components described above with respect to Figure 1 and Figure 2 The description is the same. Figure 5 and Figure 6 As described above, the probe coupler 500 may further include a second signal tap conductor 124 and a second signal contact 125 .

[0046] The second signal tap conductor 124 extends a fourth length 126 along the substrate 101 (e.g., along the first side 108 of the substrate 101). As shown, the fourth length 126 can be the length of the substrate 101 along the direction of the second signal tap conductor 124. The second signal tap conductor 124 can be substantially parallel to the first signal tap conductor 102 and can be between the first signal tap conductor 102 and the first ground tap conductor 104. The second signal tap conductor 124 can be coated with an insulating or partially conductive film. The second signal tap conductor 124 can be configured to couple to a second signal of interest in the DUT, such as a signal carried by a second target trace 129 of the PCB 128. Alternatively, the first signal tap conductor 102 and the second signal tap conductor 124 can be configured together to couple to a differential signal of interest that can be carried by the target traces 122 and 129 together. The second signal contact 125 can be on the second side 109 of the substrate 101 and electrically coupled to the second signal tap conductor 124. The second signal contact 125 may include a signal contact pad such as Figure 6 As shown in , however, other configurations may be used for the second signal contact 125 .

[0047] In an embodiment, the second signal tap conductor 124 can extend around the edge of the substrate 101 to form a conductive end cap 127 to physically connect to the second signal contact 125. In an embodiment, the second signal tap conductor 124 can extend around a second edge of the substrate 101 (the second edge is opposite to the first edge) to form another conductive end cap 127 to physically connect to another second signal contact 125, such as Figure 6 In the embodiment, the through hole 112 (see Figure 7 , Figure 8 ) can extend through the substrate 101 and electrically connect the second signal tap conductor 124 to the second signal contact 125.

[0048] therefore, Figure 5 and Figure 6 The probe coupler 500 can be used to make differential measurements or to measure multiple traces on a DUT. Since the target trace 122 is broadside coupled to its corresponding signal tap conductor ( Figure 5 , Figure 6 In the example of the first signal tap conductor 102, this pair is dominant in terms of coupling. In other words, the signal from this pair (the first signal tap conductor 102 and the target trace 122) is stronger than the signal between the second signal tap conductor 124 and the second target trace 129. The other opposing trace ( Figure 6 The crosstalk coupling of the target trace 129 in the example of FIG. 1 is taken into account and removed from the measurement results (assuming symmetry) using, for example, MIMO (multiple-input and multiple-output) correction factors. Figure 5 and Figure 6 The exemplary probe coupler 500 shown in is configured to couple to a target trace of a DUT in a ground-signal-signal-ground (GSSG) configuration, but other embodiments may be configured to couple to a target trace in a signal-ground-ground-signal (SGGS) configuration, a ground-signal-ground-signal-ground (GSGSG) configuration, or other configurations.

[0049] Figure 7 is an isometric view showing a portion of a top side or probe side of a test and measurement probe coupler according to an embodiment. Figure 8 is along Figure 7 The cross-sectional view is taken along the line shown in FIG. Figures 1 to 3 The probe coupler 100 is described, Figure 7 and Figure 8 This discussion also applies to Figure 5 , Figure 6 In particular, in addition to or in place of Figures 1 to 6 104, the substrate 101 may include one or more through holes 112. The through holes 112 may extend through the substrate 101 and electrically couple one or more of the first signal tap conductor 102, the first ground tap conductor 104, and the second ground tap conductor 106 to the corresponding first signal contact 103, the first ground contact 105, and the second ground contact 107.

[0050] Although Figure 7 and Figure 8 An embodiment having a signal tap conductor is described, in which Figure 5 and Figure 6 The embodiments set forth in with additional signal tap conductors such as the second signal tap conductor 124 may likewise have one or more vias 112 extending through the substrate 101 and electrically coupling the second signal tap conductor 124 to the second signal contact 125 .

[0051] In an embodiment, Figures 1 to 3 The probe coupler 100 and Figure 5 , Figure 6 The probe coupler 500 may be configured to be contacted (or probed) by a probe device or may be part of the probe device itself.

[0052] Fig. 9 1 shows an exemplary probe coupler 100 connected to an exemplary test and measurement instrument 133. The probe coupler 100 is described from the end of the probe coupler 100. Fig. 9As shown, the probe coupler 100 can be coupled to the DUT 128 by, for example, a magnetic clamp 134. The probe coupler 100 can also be coupled to a test and measurement instrument 133 by, for example, a connector 135 and a cable 136. Although Fig. 9 Describes Figures 1 to 3 The probe coupler 100, Figure 5 , Figure 6 The probe coupler 500 may likewise be connected to the test and measurement instrument 133 .

[0053] Fig.10 A method of using the test and measurement probe coupler 100, 500 according to an embodiment is shown. Fig.10 As shown in , a method 1000 of using a probe coupler 100, 500 may include: positioning (1001) the probe coupler 100, 500 in contact with a device under test (DUT); aligning (1002) a first signal tap conductor 102 of the probe coupler 100, 500 substantially parallel to a target trace 122 of the DUT; capturing (1003) an electrical signal from the first signal tap conductor 102 by a test and measurement system; and analyzing (1005) the electrical signal from the first signal tap conductor 102 by the test and measurement system to infer an electrical property of the electrical signal in the target trace 122 of the DUT. The electrical property may be, for example, one or more of a voltage, a current, a frequency, or an energy of the electrical signal.

[0054] When the first signal tap conductor 102 is aligned substantially parallel to the target trace 122, the first signal tap conductor 102 may not contact the target trace 122. This is because, for example, the target trace 122 may be coated with a solder resist layer 123 or a similar coating, or there may be a gap between the target trace 122 and the first signal tap conductor 102.

[0055] The operation of capturing (1003) the electrical signal from the first signal tap conductor 102 may include causing the test and measurement probe to contact one or more contacts of the probe coupler 100, 500. The contacts may be, for example, those described above with respect to Figures 1 to 7 The first signal contact 103 , the second signal contact 125 , the first ground contact 105 , and the second ground contact 107 are discussed.

[0056] The method may also include removing (1006) the probe coupler 100, 500 from the DUT after capturing (1003) the electrical signal from the first signal tap conductor 102. That is, the probe coupler 100, 500 may be removed from the DUT without damaging the DUT, rendering the DUT inoperable, or leaving portions of the probe coupler 100, 500 on the DUT.

[0057] The method may also include calibrating (1004) the electrical signal from the first signal tap conductor 102 to the electrical properties of the electrical signal in the target trace 122 of the DUT. The calibration (1004) may be accomplished, for example, using one or more of the following techniques:

[0058] (a) Electromagnetic simulation of the DUT-probe pair: The probe coupler and the target trace of the DUT are simulated using knowledge of the material properties and a 3D or 2.5D electromagnetic field solver.

[0059] (b) Local measurements of the DUT-probe pair: Coupling is inferred through time or frequency domain measurements of the through and reflected paths of the probe coupler, both with and without the probe coupler mounted on the DUT. Since the circuit is linear, reflection measurement techniques can be used to determine the energy propagating along the trace versus the energy coupled into the DUT trace, and positional / relative impedance measurement techniques can establish the self- and mutual capacitances and self- and mutual inductances of the coupler segments. Boundary conditions on the dimensions and materials of the coupler can be used to solve the problem analytically.

[0060] (c) Measurement transfer to DUT-probe pair: Use a calibration device that is identical in material and size to the DUT. Apply the test signal to the calibration circuit board, and the instrument measures the result and applies the correction factor to the measurement result. Then, the probe is transferred to the DUT and the measurement is repeated.

[0061] Other calibration techniques may also be used. Additionally, it is not necessary to perform the calibration every time after capturing the electrical signal in operation 1003. Fig.10 Instead, operation 1004 may be performed once or periodically during a series of signal acquisitions.

[0062] The operation of analyzing (1005) the electrical signal may include correlating the electrical signal from the first signal tap conductor 102 to the electrical properties of the electrical signal in the target trace 122 of the DUT. This correlation may be accomplished, for example, using the calibration techniques discussed above.

[0063] Reference Figures 1 to 3 , the probe coupler 100, 500 of the method 1000 may include a substrate 101 having a first side 108 and a second side 109 opposite the first side 108, a first signal tap conductor 102 extending a first length 110 along the first side 108 of the substrate 101, and a first ground tap conductor 104 extending a second length 113 along the first side 108 of the substrate 101, the first ground tap conductor 104 being generally parallel to the first signal tap conductor 102 and disposed along a first lateral direction 114 away from the first signal tap conductor 102. Each of these components may be as described above.

[0064] The probe coupler 100, 500 of method 1000 may also include a second ground tap conductor 106 extending a third length 117 along the first side 108 of the substrate 101, the second ground tap conductor 106 being generally parallel to the first signal tap conductor 102 and disposed along a second lateral direction 118 away from the first signal tap conductor 102, the second lateral direction 118 of the first signal tap conductor 102 being opposite to the first lateral direction 114 of the first signal tap conductor 102. Each of these components may be as described above.

[0065] The probe coupler 500 of method 1000 may also include a second signal tap conductor 124 extending a fourth length 126 along the first side 108 of the substrate 101, the second signal tap conductor 124 being substantially parallel to the first signal tap conductor 102 and between the first signal tap conductor 102 and the first ground tap conductor 104. Each of these components may be as described above. In such an embodiment, method 1000 may also include: aligning the second signal tap conductor 124 of the probe coupler 500 substantially parallel to the second target trace 122 of the DUT; capturing an electrical signal from the second signal tap conductor 124 by a test and measurement system; and analyzing the electrical signal from the second signal tap conductor 124 by a test and measurement system to infer the electrical properties of the electrical signal in the second target trace 122 of the DUT. As explained above for the first signal tap conductor 102, the second signal tap conductor 124 may not contact the second target trace 122.

[0066] As mentioned above, each of the first signal tap conductor 102 and the second signal tap conductor 124 can be coated with an insulating or partially conductive film. For example, if the user desires to pick up low frequencies of the electrical signal in the target trace 122 of the DUT, the film can be made moderately conductive so that the film passes the direct current (DC) and low frequency (LF) components of the electrical signal to provide a DC / LF signal path. Alternatively, a second (separate) signal path can be used to pick up low frequencies.

[0067] Thus, by providing a probe coupler that can be used as half of a directional coupler, embodiments of the disclosed technology enable the capture of signals from a printed circuit board (PCB), a hybrid integrated circuit, or a similar structure without physically contacting or disrupting the signal path. The target trace in the DUT is functionally the other half. In this way, embodiments of the disclosed technology can be added to the DUT to capture a desired signal and then removed from the DUT without damaging the DUT or leaving portions of the probe coupler on the DUT. The probe coupler can then be easily applied to another target trace on the DUT to detect another signal.

[0068] Example

[0069] Illustrative examples of the disclosed technology are provided below. Embodiments of the technology may include one or more of the examples described below, and any combination.

[0070] Example 1 includes a test and measurement probe coupler comprising: a substrate; a first signal tap conductor extending a first length along the substrate; a first signal contact electrically coupled to the first signal tap conductor; a first ground tap conductor extending a second length along the substrate, the first ground tap conductor being substantially parallel to the first signal tap conductor and disposed along a first lateral direction away from the first signal tap conductor; and a first ground contact electrically coupled to the first ground tap conductor.

[0071] Example 2 includes the probe coupler of Example 1, wherein the substrate includes a channel having a first signal tap conductor of a first length within the channel.

[0072] Example 3 includes the probe coupler of any of Examples 1 or 2, wherein the first signal tap conductor extends around an edge of the substrate to physically connect to the first signal contact.

[0073] Example 4 includes the probe coupler of any of Examples 1 to 3, further comprising a through-hole extending through the substrate and electrically coupling the first signal tap conductor to the first signal contact.

[0074] Example 5 includes the probe coupler of any of Examples 1 to 4, wherein the first ground tap conductor extends around an edge of the substrate to physically connect to the first ground contact.

[0075] Example 6 includes the probe coupler of any of Examples 1 to 5, further comprising a through-hole extending through the substrate and electrically coupling the first ground tap conductor to the first ground contact.

[0076] Example 7 includes the probe coupler of any of Examples 1 to 6, further comprising: a second ground tap conductor extending a third length along the substrate, the second ground tap conductor being substantially parallel to the first signal tap conductor, and the second ground tap conductor being disposed along a second lateral direction away from the first signal tap conductor, the second lateral direction of the first signal tap conductor being opposite to the first lateral direction of the first signal tap conductor; and a second ground contact electrically connected to the second ground tap conductor.

[0077] Example 8 includes the probe coupler of Example 7, wherein the second ground tap conductor extends around an edge of the substrate to physically connect to the second ground contact.

[0078] Example 9 includes the probe coupler of any of Examples 7 or 8, further comprising a through hole extending through the substrate and electrically coupling the second ground tap conductor to the second ground contact.

[0079] Example 10 includes the probe coupler of any of Examples 1 to 9, further comprising: a second signal tap conductor extending a fourth length along the substrate, the second signal tap conductor being substantially parallel to the first signal tap conductor and between the first signal tap conductor and the first ground tap conductor; and a second signal contact electrically connected to the second signal tap conductor.

[0080] Example 11 includes the probe coupler of Example 10, wherein the second signal tap conductor extends around an edge of the substrate to physically connect to the second signal contact.

[0081] Example 12 includes the probe coupler of any of Examples 10 or 11, further comprising a through-hole extending through the substrate and electrically coupling the second signal tap conductor to the second signal contact.

[0082] Example 13 includes the probe coupler of any of Examples 10 to 12, further comprising: a second ground tap conductor extending a third length along the substrate, the second ground tap conductor being substantially parallel to the first signal tap conductor, and the second ground tap conductor being disposed along a second lateral direction away from the first signal tap conductor, the second lateral direction of the first signal tap conductor being opposite to the first lateral direction of the first signal tap conductor; and a second ground contact electrically connected to the second ground tap conductor.

[0083] Example 14 includes a method of using a test and measurement probe coupler, the method comprising: positioning the probe coupler in contact with a device under test (DUT), the probe coupler comprising a substrate, a first signal tap conductor extending a first length along the substrate, and a first ground tap conductor extending a second length along the substrate, the first ground tap conductor being substantially parallel to the first signal tap conductor and disposed in a first lateral direction away from the first signal tap conductor; aligning the first signal tap conductor of the probe coupler substantially parallel to a portion of a target trace of the DUT; and capturing an electrical signal from the first signal tap conductor by a test and measurement system.

[0084] Example 15 includes the method of Example 14, wherein capturing the electrical signal from the first signal tap conductor includes contacting a test and measurement probe with a contact of a probe coupler.

[0085] Example 16 includes the method of any of Examples 14 or 15, wherein the first signal tap conductor does not contact a target trace of the DUT.

[0086] Example 17 includes the method of any of Examples 14 to 16, further comprising: analyzing, by a test and measurement system, the electrical signal from the first signal tap conductor to infer electrical properties of the electrical signal in the target trace of the DUT.

[0087] Example 18 includes the method of Example 17, wherein analyzing the electrical signal includes correlating the electrical signal from the first signal tap conductor to an electrical property of the electrical signal in a target trace of the DUT.

[0088] Example 19 includes the method of any of Examples 14 to 18, wherein the first signal tap conductor is covered with a partially conductive film that contacts the target trace of the DUT and provides a low frequency signal path for the electrical signal in the target trace of the DUT.

[0089] Example 20 includes the method of any of Examples 14 to 19, in which the probe coupler also includes a second signal tap conductor extending a fourth length along the substrate, the second signal tap conductor being substantially parallel to the first signal tap conductor and between the first signal tap conductor and the first ground tap conductor, the method further comprising: aligning the second signal tap conductor of the probe coupler to be substantially parallel to a portion of a second target trace of the DUT, the second signal tap conductor not contacting the second target trace; capturing an electrical signal from the second signal tap conductor by a test and measurement system; and analyzing the electrical signal from the second signal tap conductor by the test and measurement system to infer electrical properties of the electrical signal in the second target trace of the DUT.

[0090] Aspects of the present disclosure may be operated on specially created hardware, on firmware, on a digital signal processor, or on a specially programmed general-purpose computer including a processor that operates according to programming instructions. The terms "controller" or "processor" used herein are intended to include microprocessors, microcomputers, application-specific integrated circuits (ASICs), and dedicated hardware controllers. One or more aspects of the present disclosure may be embodied in computer-usable data and computer-executable instructions executed by one or more computers (including monitoring modules) or other devices, such as in one or more program modules. Typically, program modules include routines, programs, objects, components, data structures, etc. that perform specific tasks or implement specific abstract data types when executed by a processor in a computer or other device. Computer-executable instructions may be stored on non-transitory computer-readable media such as hard disks, optical disks, removable storage media, solid-state memory, random access memory (RAM), etc. As will be understood by those skilled in the art, the functionality of program modules may be combined or distributed as needed in multiple aspects. In addition, the functionality may be embodied in firmware or hardware such as integrated circuits, field programmable gate arrays (FPGAs), etc., in whole or in part. Certain data structures may be used to more efficiently implement one or more aspects of the present disclosure, and such data structures are contemplated to be within the scope of the computer-executable instructions and computer-usable data described herein.

[0091] In some cases, the disclosed aspects may be implemented in hardware, firmware, software, or any combination thereof. The disclosed aspects may also be implemented as instructions loaded by one or more or non-transitory computer-readable media or stored on one or more or non-transitory computer-readable media, which may be read and executed by one or more processors. Such instructions may be referred to as computer program products. As discussed herein, computer-readable media means any medium that can be accessed by a computing device. By way of example and without limitation, computer-readable media may include computer storage media and communication media.

[0092] Computer storage media means any medium that can be used to store computer-readable information. By way of example and not limitation, computer storage media may include random access memory (RAM), read-only memory (ROM), electrically erasable programmable read-only memory (EEPROM), flash memory or other storage technology, compact disk read-only memory (CD-ROM), digital video disk (DVD), or other optical disk storage, magnetic cassettes, magnetic tape, magnetic disk storage or other magnetic storage devices, and any other volatile and nonvolatile, removable or non-removable media implemented in any technology. Computer storage media does not include the signal itself and the transmission of the signal in ephemeral form.

[0093] Communication media refers to any medium that can be used for communication of computer-readable information. By way of example and not limitation, communication media may include coaxial cables, fiber optic cables, air, or any other medium suitable for communication of electrical, optical, radio frequency (RF), infrared, acoustic, or other types of signals.

[0094] The foregoing variations of the disclosed subject matter have many advantages that are described or apparent to those skilled in the art. Even so, not all of these advantages or features are required in all variations of the disclosed apparatus, system or method.

[0095] In addition, this written description refers to specific features. It is to be understood that the disclosure in this specification includes all possible combinations of these specific features. For example, where a specific feature is disclosed in the context of a particular aspect or embodiment, the feature may also be used in the context of other aspects or embodiments to the extent possible.

[0096] Furthermore, when reference is made in this application to a method having two or more defined steps or operations, the defined steps or operations may be performed in any order or simultaneously, unless the context excludes such possibility.

[0097] In addition, the term "comprising" and its grammatical equivalents are used in this application to mean that other components, features, steps, processes, operations, etc. may optionally exist. For example, an article that "comprising" or "which includes" components A, B, and C may include only components A, B, and C, or the article may include components A, B, and C and one or more other components.

[0098] Also, directions such as "left," "right," "top," and "bottom" are used for convenience and with reference to the views provided in the figures. However, the disclosed technology may have multiple orientations in actual use. Thus, features on the top or bottom in the figures may not have the same orientation or direction in actual use.

[0099] Although specific embodiments have been illustrated and described for purposes of illustration, it will be appreciated that various modifications may be made without departing from the spirit and scope of the present disclosure. Accordingly, the present invention should not be limited, except as defined by the appended claims.

Claims

1. A test and measurement probe coupler, comprising: Matrix; a first signal tap conductor extending a first length along a surface of a first side of the substrate; a first signal contact disposed on the substrate and electrically coupled to the first signal tap conductor; a first ground tap conductor extending a second length along a surface of a first side of the substrate, the first ground tap conductor being substantially parallel to the first signal tap conductor and disposed in a first lateral direction away from the first signal tap conductor; as well as a first ground contact disposed on the substrate and electrically coupled to the first ground tap conductor; The probe coupler is configured to form one half of a directional coupler when the probe coupler is placed near a portion of a target trace on a device under test, the first ground tap conductor not contacting the target trace forming the other half of the directional coupler. 2 . The probe coupler of claim 1 , wherein the substrate comprises a channel, the first signal tap conductor of the first length being located within the channel. 3 . The probe coupler of claim 1 , wherein the first signal tap conductor extends around an edge of the substrate to be physically connected to the first signal contact. 4 . The probe coupler of claim 1 , further comprising a via extending through the substrate and electrically coupling the first signal tap conductor to the first signal contact. 5 . The probe coupler of claim 1 , wherein the first ground tap conductor extends around an edge of the substrate to be physically connected to the first ground contact.

6. The probe coupler of claim 1, further comprising a through-hole extending through the substrate and electrically coupling the first ground tap conductor to the first ground contact.

7. The probe coupler according to claim 1, further comprising: a second ground tap conductor extending a third length along the substrate, the second ground tap conductor being generally parallel to the first signal tap conductor and disposed in a second lateral direction away from the first signal tap conductor, the second lateral direction of the first signal tap conductor being opposite to the first lateral direction of the first signal tap conductor; as well as A second ground contact is electrically coupled to the second ground tap conductor.

8. The probe coupler of claim 7, wherein the second ground tap conductor extends around an edge of the substrate to be physically connected to the second ground contact.

9. The probe coupler of claim 7, further comprising a through-hole extending through the substrate and electrically coupling the second ground tap conductor to the second ground contact.

10. The probe coupler according to claim 1, further comprising: a second signal tap conductor extending a fourth length along the substrate, the second signal tap conductor being generally parallel to the first signal tap conductor and between the first signal tap conductor and the first ground tap conductor; as well as A second signal contact is electrically coupled to the second signal tap conductor. 11 . The probe coupler of claim 10 , wherein the second signal tap conductor extends around an edge of the substrate to be physically connected to the second signal contact.

12. The probe coupler of claim 10, further comprising a via extending through the substrate and electrically coupling the second signal tap conductor to the second signal contact.

13. The probe coupler according to claim 10, further comprising: a second ground tap conductor extending a third length along the substrate, the second ground tap conductor being generally parallel to the first signal tap conductor and disposed in a second lateral direction away from the first signal tap conductor, the second lateral direction of the first signal tap conductor being opposite to the first lateral direction of the first signal tap conductor; as well as A second ground contact is electrically coupled to the second ground tap conductor.

14. A method of using a test and measurement probe coupler, the method comprising: The probe coupler is positioned to contact a device under test (DUT), the probe coupler comprising: a substrate having a first side and a second side opposite the first side; a first signal tap conductor extending a first length along a surface of a first side of the substrate; a first signal contact disposed on a second side of the substrate and electrically coupled to the first signal tap conductor; a first ground tap conductor extending a second length along a surface of a first side of the substrate, the first ground tap conductor being generally parallel to the first signal tap conductor and disposed in a first lateral direction away from the first signal tap conductor; and a first ground contact disposed on a second side of the substrate and electrically coupled to the first ground tap conductor; aligning the first signal tap conductor of the probe coupler substantially parallel to a portion of a target trace of the DUT, wherein the first signal tap conductor does not contact the target trace of the DUT; and An electrical signal from the first signal tap conductor is captured by a test and measurement system.

15. The method according to claim 14, wherein capturing the electrical signal from the first signal tap conductor comprises: A test and measurement probe is brought into contact with the contacts of the probe coupler.

16. The method according to claim 14, further comprising: The electrical signal from the first signal tap conductor is analyzed by the test and measurement system to infer electrical properties of the electrical signal of the target trace of the DUT.

17. The method according to claim 16, wherein analyzing the electrical signal comprises: The electrical signal from the first signal tap conductor is correlated to the electrical property of the electrical signal in the target trace of the DUT.

18. The method of claim 14, wherein the first signal tap conductor is covered with a partially conductive film that contacts the target trace of the DUT and provides a low frequency signal path for the electrical signal in the target trace of the DUT.

19. The method of claim 14, wherein the probe coupler further comprises a second signal tap conductor extending a fourth length along the substrate, the second signal tap conductor being substantially parallel to the first signal tap conductor and between the first signal tap conductor and the first ground tap conductor, the method further comprising: aligning the second signal tap conductor of the probe coupler substantially parallel to a portion of a second target trace of the DUT, the second signal tap conductor not contacting the second target trace; capturing an electrical signal from the second signal tap conductor by a test and measurement system; as well as The electrical signal from the second signal tap conductor is analyzed by the test and measurement system to infer electrical properties of the electrical signal in the second target trace of the DUT.

Citation Information

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