Display device

Abstract

A display device is provided. The display device includes: a substrate; a driving thin film transistor disposed above the substrate; a pixel electrode electrically connected to the driving thin film transistor; a pixel defining layer including an opening overlapping the pixel electrode; an intermediate layer overlapping a portion of the pixel electrode exposed through the opening, the intermediate layer including an emission layer; a counter electrode disposed on the intermediate layer; an organic control layer disposed on the counter electrode, the organic control layer having hydrophilicity; an organic encapsulation layer disposed on the organic control layer; and at least one inorganic encapsulation layer overlapping the organic encapsulation layer.

Description

[0001] This application claims the benefit of Korean Patent Application No. 10-2017-0184805 filed on December 29, 2017, in the Korean Intellectual Property Office, the disclosure of which is incorporated herein in its entirety by reference. Technical Field

[0002] One or more embodiments relate to a display device and a method of manufacturing the display device. Background Art

[0003] In the visualization development of display devices that display electrical signals, various display devices are introduced into the market that provide desired characteristics such as thinness, lightness, low power consumption, etc. Recently, foldable or rollable flexible display devices are being studied and developed, and further, stretchable display devices that can be changed into various forms are being actively studied and developed. Summary of the invention

[0004] One or more embodiments include a display device and a method of manufacturing the display device, wherein the display device includes a thin encapsulation layer that is not damaged even when the shape of the display device changes. However, it should be understood that the embodiments described herein should be considered only in a descriptive sense and not for limiting the present disclosure.

[0005] Additional aspects will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the presented embodiments.

[0006] According to one or more embodiments, a display device includes: a substrate; a driving thin film transistor disposed above the substrate; a pixel electrode electrically connected to the driving thin film transistor; a pixel defining layer including an opening overlapping the pixel electrode; an intermediate layer overlapping a portion of the pixel electrode exposed through the opening, the intermediate layer including an emission layer; a counter electrode disposed on the intermediate layer; an organic control layer disposed on the counter electrode, the organic control layer having hydrophilicity; an organic encapsulation layer disposed on the organic control layer; and at least one inorganic encapsulation layer overlapping the organic encapsulation layer.

[0007] The at least one inorganic encapsulation layer may include: a first inorganic encapsulation layer disposed between the counter electrode and the organic control layer; and a second inorganic encapsulation layer disposed on the organic encapsulation layer such that the organic encapsulation layer is disposed between the first inorganic encapsulation layer and the second inorganic encapsulation layer.

[0008] The first inorganic encapsulating layer may contact the second inorganic encapsulating layer in a region adjacent to an end portion of the organic encapsulating layer.

[0009] The display device may also include: an adjacent pixel electrode adjacent to the pixel electrode; an adjacent intermediate layer arranged on the adjacent pixel electrode, the adjacent intermediate layer including an adjacent emission layer, the adjacent emission layer being configured to emit light of a color different from the color of light emitted from the emission layer of the intermediate layer; and an adjacent counter electrode arranged on the adjacent intermediate layer.

[0010] The display device may also include: an adjacent organic control layer, which is arranged on the adjacent counter electrode, and the adjacent organic control layer is hydrophilic; an adjacent organic encapsulation layer, which directly contacts the adjacent organic control layer; and at least one adjacent inorganic encapsulation layer, which is stacked with the adjacent organic encapsulation layer, wherein the adjacent organic control layer and the organic control layer can be separated from each other, and the adjacent organic encapsulation layer and the organic encapsulation layer can be separated from each other.

[0011] The adjacent counter electrodes and counter electrodes may be connected as one.

[0012] The adjacent counter electrodes and counter electrodes may be spaced apart from each other.

[0013] The at least one adjacent inorganic encapsulation layer and the at least one inorganic encapsulation layer may be connected as one body.

[0014] The at least one adjacent inorganic encapsulating layer and the at least one inorganic encapsulating layer may be spaced apart from each other.

[0015] According to one or more embodiments, a display device includes: a substrate; a plurality of unit displays arranged above the substrate, each unit display including a pixel electrode, an intermediate layer and a counter electrode arranged in sequence, the intermediate layer including an emission layer; an organic control layer overlapping each of the plurality of unit displays, the organic control layer having hydrophilicity; an organic encapsulation layer directly contacting the organic control layer; and at least one inorganic encapsulation layer overlapping the organic encapsulation layer.

[0016] The at least one inorganic encapsulation layer may include: a first inorganic encapsulation layer disposed between each of the plurality of unit displays and the organic control layer; and a second inorganic encapsulation layer disposed on the organic encapsulation layer such that the organic encapsulation layer is disposed between the second inorganic encapsulation layer and the first inorganic encapsulation layer.

[0017] The organic encapsulation layer may include a plurality of sub-organic encapsulation layers respectively corresponding to the plurality of unit displays.

[0018] According to one or more embodiments, a method for manufacturing a display device includes: forming a thin film transistor and a pixel electrode electrically connected to the thin film transistor over a substrate; forming a pixel defining layer, the pixel defining layer including an opening exposing the pixel electrode; forming an intermediate layer including an emission layer, the intermediate layer overlapping the portion of the pixel electrode exposed by the opening; forming a counter electrode on the intermediate layer; forming an organic control layer on the counter electrode, the organic control layer including a first region having hydrophilicity; forming an organic encapsulation layer on the first region; and forming at least one inorganic encapsulation layer overlapping the organic encapsulation layer.

[0019] The formation of the organic control layer may include: forming an organic material layer having light-adjustable wettability; forming the organic control layer by irradiating a portion of the organic material layer with preset light, the organic control layer including a first region having hydrophilicity and a second region having hydrophobicity.

[0020] The method may further include removing the second region.

[0021] The organic material layer may include an organic material including at least one of azobenzenes, spiropyranamines, 7-[(trifluoromethylphenylazo)phenoxy]valeric acids, cinnamic esters, trimethylsilyl trifluoromethanesulfonate, polyaryl sulfones, diarylethenes, diethylcyclopentenes, coumarins, and o-nitrobenzyl (ONB) esters.

[0022] The width of the first region may be greater than the width of the opening.

[0023] The method of forming at least one inorganic encapsulation layer may include: forming a first inorganic encapsulation layer disposed between the counter electrode and the organic control layer; forming a second inorganic encapsulation layer on the organic encapsulation layer so that the organic encapsulation layer is disposed between the first inorganic encapsulation layer and the second inorganic encapsulation layer.

[0024] The method may further include etching the at least one inorganic encapsulation layer so that the at least one inorganic encapsulation layer has an island shape. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] These and / or other aspects will become clear and easier to understand through the following description of the embodiments in conjunction with the accompanying drawings, in which:

[0026] Figures 1A to 1H is a cross-sectional view of a process of a method for manufacturing a display device according to an embodiment;

[0027] Figure 2A and Figure 2B are cross-sectional views of some processes of a method for manufacturing a display device according to another embodiment;

[0028] Figure 3A and Figure 3Bare cross-sectional views of some processes of a method for manufacturing a display device according to another embodiment;

[0029] Figure 4 is a plan view of a display device according to an embodiment;

[0030] Figure 5 According to the embodiment Figure 4 A cross-sectional view of the display device taken along line IV-IV';

[0031] Figure 6 According to another embodiment, Figure 4 A cross-sectional view of the display device taken along line IV-IV';

[0032] Figure 7 is a plan view of a display device according to another embodiment;

[0033] Figure 8 It is shown Figure 7 A plan view showing that the shape of the device has been changed;

[0034] Fig. 9 According to the embodiment Figure 7 A cross-sectional view of the display device taken along line VIIa-VIIa';

[0035] Fig.10 According to another embodiment, Figure 7 A cross-sectional view of the display device taken along line VIIa-VIIa';

[0036] Fig.11 According to the embodiment Figure 7 A cross-sectional view of the display device taken along line VIIb-VIIb';

[0037] Fig.12 According to another embodiment, Figure 7 A cross-sectional view of the display device taken along line VIIb-VIIb';

[0038] Fig.13 According to the embodiment Figure 7 A cross-sectional view of the display device taken along line VIIb-VIIb';

[0039] Fig.14 According to the embodiment Figure 7 A cross-sectional view of the display device taken along line VIIb-VIIb'; and

[0040] Fig.15 is a plan view of wiring in the display device according to the embodiment. DETAILED DESCRIPTION

[0041] Since the present disclosure allows various changes and many embodiments, example embodiments will be shown in the drawings and described in detail in the written description. When referring to the embodiments described with reference to the drawings, the effects and characteristics of the present disclosure and the methods for achieving these effects and characteristics will be apparent. However, the present disclosure can be implemented in many different forms and should not be construed as being limited to the example embodiments set forth herein.

[0042] Hereinafter, the present disclosure will be described more fully with reference to the accompanying drawings, in which exemplary embodiments of the present disclosure are shown. When describing with reference to the accompanying drawings, the same reference numerals in the drawings represent the same or corresponding elements, and repeated descriptions thereof will be omitted.

[0043] It will be understood that although the terms "first", "second", etc. may be used herein to describe various components, these components should not be limited by these terms. These components are only used to distinguish one component from another.

[0044] As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise.

[0045] It will also be understood that the terms "comprises / includes" and variations thereof used herein specify the presence of stated features or components, but do not preclude the presence or addition of one or more other features or components.

[0046] It will be understood that when a layer, region or component is referred to as being “formed on” another layer, region or component, the layer, region or component may be directly or indirectly formed on the other layer, region or component. That is, for example, intervening layers, regions or components may be present.

[0047] For the convenience of explanation, the size of the elements in the drawings may be exaggerated. In other words, since the size and thickness of the components in the drawings are arbitrarily shown for the convenience of explanation, the following embodiments are not limited thereto.

[0048] When some embodiments may be implemented differently, the specific process order may be performed differently from the described order. For example, two processes described successively may be performed substantially simultaneously or in the reverse order of the described order.

[0049] It will be understood that when a layer, region, or component is referred to as being “connected” to another layer, region, or component, the layer, region, or component may be “directly connected” to the other layer, region, or component, or may be “indirectly connected” to the other layer, region, or component, with the other layers, regions, or components interposed therebetween. For example, it will be understood that when a layer, region, or component is referred to as being “connected or electrically connected” to another layer, region, or component, the layer, region, or component may be “directly connected or electrically connected” to the other layer, region, or component, or may be “indirectly connected or electrically connected” to the other layer, region, or component, with the other layers, regions, or components interposed therebetween.

[0050] In the following examples, the x-axis, y-axis, and z-axis are not limited to the three axes of the rectangular coordinate system and can be interpreted in a broader sense. For example, the x-axis, y-axis, and z-axis can be perpendicular to each other, or can represent different directions that are not perpendicular to each other.

[0051] The embodiment can easily control the flow of a monomer used during a process of forming an organic encapsulation layer, seal unit displays individually and / or independently, and effectively disperse stress occurring when the shape of the display device changes, etc. The above effects are provided as examples, and the effects according to the embodiment are described in detail through the following description.

[0052] The display device according to the embodiment is a device that displays an image. Although an organic light-emitting display device is described as an example for the convenience of description, the display device according to the embodiment is not limited thereto. For example, the display device may be an inorganic light-emitting display.

[0053] In the display device according to the embodiment, the unit encapsulation portion is a stack including an organic control layer, an organic encapsulation layer and at least one inorganic layer. The unit encapsulation portion may be defined by the organic encapsulation layer, or by the organic control layer and the organic encapsulation layer. The display device includes an organic encapsulation layer, and the organic encapsulation layer is patterned so that the organic encapsulation layers are separated from each other. One unit encapsulation portion may be understood as corresponding to one organic encapsulation layer. The organic control layer is disposed below each organic encapsulation layer in the organic encapsulation layer. Like the organic encapsulation layer, the organic control layer may be disposed above the display device so that the organic control layers are separated from each other.

[0054] Figures 1A to 1H is a cross-sectional view of a process of a method for manufacturing a display device according to an embodiment. Although for ease of description, Figures 1A to 1H One unit display PU is shown, but the display device according to the embodiment is a display device including a plurality of unit display PUs, and the following reference is equally performed on the plurality of unit display PUs. Figures 1A to 1H Describe the process.

[0055] Reference Figure 1A, a unit display PU is formed over the substrate 100. The unit display PU may include a display element 200 configured to emit red light, green light, blue light, or white light. The display element 200 may be an organic light emitting diode including a pixel electrode 210, an opposing electrode 230, and an intermediate layer 220 disposed between the pixel electrode 210 and the opposing electrode 230. Figure 1A It is shown that one display element 200 corresponds to one unit display PU.

[0056] The substrate 100 may include various materials such as plastic materials including polyethylene terephthalate (PET), polyethylene naphthalate (PEN), and polyimide (PI). A buffer layer 101 configured to prevent impurities from penetrating into a semiconductor layer of a thin film transistor TFT, a gate insulating layer 103 configured to insulate the semiconductor layer from a gate electrode of the thin film transistor TFT, an interlayer insulating layer 105 configured to insulate a source electrode / drain electrode from a gate electrode of the thin film transistor TFT, an organic insulating layer 107 covering the thin film transistor TFT, or other elements may be formed on the substrate 100, the organic insulating layer 107 being a planarization layer having a substantially flat top surface.

[0057] A pixel electrode 210 is formed on the organic insulating layer 107. The pixel electrode 210 is electrically connected to the thin film transistor TFT through a contact hole in the organic insulating layer 107.

[0058] The pixel electrode 210 may be a reflective electrode. In an embodiment, the pixel electrode 210 may include a reflective layer and a light-transmitting electrode layer on the reflective layer, wherein the reflective layer includes at least one of Ag, Mg, Al, Pt, Pd, Au, Ni, Nd, Ir, Cr and compounds thereof. The light-transmitting electrode layer may include indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), indium oxide (In 2 O 3 ), at least one of indium gallium oxide (IGO) and aluminum zinc oxide (AZO). For example, the pixel electrode 210 may include a multilayer of ITO / Ag / ITO.

[0059] A pixel defining layer 240 is formed on the pixel electrode 210. The pixel defining layer 240 may include at least one organic insulating material such as PI, polyimide, acrylic resin, benzocyclobutene, or phenol resin, and may be formed based on spin coating, etc. The pixel defining layer 240 includes an opening 240OP exposing a predefined area of ​​the pixel electrode 210 and a bank 240B disposed between adjacent organic light emitting diodes.

[0060] The intermediate layer 220 is formed on a portion of the pixel electrode 210 exposed by the opening 240OP of the pixel defining layer 240. The intermediate layer 220 includes an emission layer, such as an organic emission layer, which emits red light, green light, blue light, or white light. In addition to the emission layer, the intermediate layer 220 may further include at least one functional layer such as a hole transport layer (HTL), a hole injection layer (HIL), an electron transport layer (ETL), or an electron injection layer (EIL).

[0061] The counter electrode 230 may be a light-transmitting electrode. For example, the counter electrode 230 may include a metal thin layer having a small work function and including at least one of Li, Ca, LiF / Ca, LiF / Al, Al, Ag, Mg, and compounds thereof, or may include a metal such as ITO, IZO, ZnO, or In 2 O 3 For example, the counter electrode 230 may include an alloy of Ag and Mg.

[0062] Reference Figure 1B , a first inorganic encapsulation layer 310 is formed on the display element 200. The first inorganic encapsulation layer 310 may include at least one of silicon nitride, aluminum nitride, zirconium nitride, titanium nitride, hafnium nitride, tantalum nitride, silicon oxide, aluminum oxide, titanium oxide, tin oxide, cerium oxide, and silicon oxynitride (SiON). The first inorganic encapsulation layer 310 may be formed to completely cover the display element 200 based on chemical vapor deposition (CVD).

[0063] A process of forming a capping layer and / or a LiF layer may be further performed before forming the first inorganic encapsulating layer 310. The capping layer and / or the LiF layer may protect the display element 200 from plasma or the like occurring when the first inorganic encapsulating layer 310 is formed.

[0064] Reference Figure 1C , an organic material layer 320A having light-adjustable wettability is formed on the first inorganic encapsulation layer 310. The organic material layer 320A may include an organic material including at least one of azobenzenes, spiropyranamines, 7-[(trifluoromethylphenylazo)phenoxy]valeric acids, cinnamates, trimethylsilyl trifluoromethanesulfonates, polyarylsulfones, diarylethenes, diethylcyclopentenes, coumarins, and ortho-nitrobenzyl (ONB) esters. The organic material layer 320A may be formed based on CVD.

[0065] Reference Figure 1C and Figure 1D , a preset light is irradiated onto a portion of the organic material layer 320A. For the light, ultraviolet (UV) rays, light in a visible band, etc. may be selected according to an organic material included in the organic material layer 320A.

[0066] In an embodiment, a mask 400 including a light-transmitting portion 410 and a light-blocking portion 420 is disposed above a hydrophobic organic material layer 320A, and when light is irradiated onto a partial region of the organic material layer 320A through the light-transmitting portion 410, the partial region irradiated with light can become a hydrophilic region. Hereinafter, a layer including a hydrophobic region and a hydrophilic region is referred to as an organic control layer 320B. Figure 1D It is shown that the first region 321 of the organic control layer 320B overlapping the display element 200 is hydrophilic, and the second region 322 not overlapping the display element 200 is hydrophobic. The first region 321 may have a width greater than the width OW of the opening 240OP of the pixel defining layer 240 (or the width of the portion of the pixel electrode 210 exposed by the pixel defining layer 240).

[0067] According to reference Figure 1C and Figure 1D In the described embodiment, although the first region 321 of the organic control layer 320B is changed into a hydrophilic region by forming an organic material layer 320A having hydrophobicity and irradiating light thereon, the present disclosure is not limited thereto. In another embodiment, a partial region of the organic material layer (for example, a region not overlapping the display element 200) may be changed into a hydrophobic region by forming an organic material layer having hydrophilicity on the first inorganic encapsulation layer 310 and irradiating light onto a partial region of the organic material layer using another mask. In this case, the position of the light-transmitting portion and the position of the light-blocking portion of the other mask may correspond to Figure 1D 4. The positions of the light blocking portions 420 and the light transmitting portions 410 of the mask 400 are shown in FIG.

[0068] Reference Figure 1E , an organic encapsulation layer 330 is formed on an organic control layer 320B including a first region 321 having hydrophilicity and a second region 322 having hydrophobicity. The organic encapsulation layer 330 may be formed by coating a monomer using a method such as inkjet and curing the monomer using heat or light. Since the monomer before curing easily moves in the first region 321 but not in the second region 322, the monomer does not move to the second region 322. Therefore, the organic encapsulation layer 330 may be disposed in the first region 321 while contacting the first region 321 of the organic control layer 320B. That is, the organic control layer 320B including the first region 321 and the second region 322 having different properties from each other serves as a layer configured to control the flow of the monomer.

[0069] The organic encapsulating layer 330 may include polymethyl methacrylate (PMMA), polycarbonate (PC), polystyrene (PS), acrylic resin, epoxy resin, PI, and polyethylene.

[0070] Reference Figure 1E and Figure 1F, the second region 322 of the organic control layer 320B is removed. The penetration of external foreign matter or moisture through the interface between the second region 322 and the layer adjacent to the second region 322 can be prevented, and the second region 322 can be prevented from floating by removing the second region 322. Figure 1F The organic control layer 320B including only the first region 321 and the second region 322 is removed is shown. Figure 1F ) is distinguished from the organic control layer 320B before removing the second region 322, and the organic control layer 320B after the process of removing the second region 322 is described as an organic control layer “321”.

[0071] Reference Figure 1G , a second inorganic encapsulation layer 340 is formed on the organic encapsulation layer 330. The second inorganic encapsulation layer 340 may include at least one of silicon nitride, aluminum nitride, zirconium nitride, titanium nitride, hafnium nitride, tantalum nitride, silicon oxide, aluminum oxide, titanium oxide, tin oxide, cerium oxide, and silicon oxynitride (SiON). The second inorganic encapsulation layer 340 may be formed based on CVD.

[0072] The second inorganic encapsulation layer 340 may contact the organic encapsulation layer 330 and the first inorganic encapsulation layer 310. For example, the second inorganic encapsulation layer 340 may contact the first inorganic encapsulation layer 310 on the bank 240B of the pixel defining layer 240. The first inorganic encapsulation layer 310 and the second inorganic encapsulation layer 340 may prevent moisture, such as humidity (H 2 O) or oxygen (O 2 ) of foreign matter.

[0073] The stacked body including the first inorganic encapsulation layer 310, the organic control layer 321, the organic encapsulation layer 330, and the second inorganic encapsulation layer 340 may correspond to a unit encapsulation portion 300 configured to seal with a unit display PU (see Figure 1A ) corresponding to the display element 200.

[0074] Reference Figure 1H , the first inorganic encapsulation layer 310 and the second inorganic encapsulation layer 340 may be patterned to form a patterned first inorganic encapsulation layer 310' and a second inorganic encapsulation layer 340'. For example, the patterning process may include an etching process such as dry etching. Patterning may be performed to remove an area that does not overlap the display element 200, for example, to remove a portion adjacent to an outer edge of the display element 200. The unit encapsulation portion 300' including the patterned first inorganic encapsulation layer 310' and the second inorganic encapsulation layer 340' may have an island shape corresponding to the display element 200 and overlapping the display element 200. The width of the first inorganic encapsulation layer 310' and the second inorganic encapsulation layer 340' is greater than the width of the display element 200.

[0075] Although the above embodiments have been referred to Figure 1H The operation of patterning the first inorganic encapsulation layer 310 and the second inorganic encapsulation layer 340 to form the patterned first inorganic encapsulation layer 310' and the second inorganic encapsulation layer 340' is described, but the present disclosure is not limited thereto. A method of manufacturing a display device according to another embodiment may include referring to Figures 1A to 1G That is, by referring to Figure 1G The unit package portion 300 is described to seal Figure 1A The units shown in the display PU, or by referring to Figure 1H The unit package portion 300' is described to seal Figure 1A The units shown in the display are PU.

[0076] In the case where the counter electrode 230 of the display element 200 is patterned to correspond to the unit display PU, as in Figures 1A to 1G or Figures 1A to 1H In the embodiment of the present invention, the counter electrode 230 may receive a preset voltage through a voltage line (not shown) electrically connected to the counter electrode 230. However, the embodiment is not limited thereto. The counter electrode 230 may be formed as a whole to be connected to the following reference Figure 2A and Figure 2B The multiple display elements described correspond to each other.

[0077] Figure 2A and Figure 2B are cross-sectional views showing some processes of a method for manufacturing a display device according to another embodiment.

[0078] Reference Figure 2A , a unit display PU is formed on the substrate 100. Figure 1A As described, one display element may correspond to one unit display PU. Figure 2A It shows: a unit display PU including a display element 200R, wherein the display element 200R includes an intermediate layer 220R configured to emit red light; a unit display PU including a display element 200G, wherein the display element 200G includes an intermediate layer 220G configured to emit green light; and a unit display PU including a display element 200B, wherein the display element 200B includes an intermediate layer 220B configured to emit blue light.

[0079] Each of the display elements 200R, 200G, and 200B may be formed by the following process. After forming the pixel electrodes 210 each having an island shape, a pixel defining layer 240 including an opening 240OP and a bank 240B is formed, and each of the intermediate layers 220R, 220G, and 220B is formed. The pixel electrode 210 may be patterned at the same time during the same process, and the intermediate layers 220R, 220G, and 220B may be formed separately during the respective processes. Thereafter, a counter electrode 230 is formed. The counter electrode 230 may be formed as one body to correspond to the display elements 200R, 200G, and 200B.

[0080] After forming the display elements 200R, 200G, and 200B, a first inorganic encapsulation layer 310 is formed. The first inorganic encapsulation layer 310 may be formed as one body to correspond to the display elements 200R, 200G, and 200B. The material and process of the first inorganic encapsulation layer 310 are similar to those of the reference Figure 1B The materials and processes of the first inorganic encapsulation layer 310 are the same as described.

[0081] Thereafter, an organic material layer having light-adjustable wettability is formed, and an organic control layer 320B including a first region 321 having hydrophilicity and a second region 322 having hydrophobicity is formed by irradiating a preset light (e.g., UV) using a mask 400. The light-transmitting portions 410 of the mask 400 may correspond to the red display element 200R, the green display element 200G, and the blue display element 200B, respectively. The process of adjusting the hydrophobicity and hydrophilicity of the organic control layer 320B by using light is similar to that of the reference Figure 1C and Figure 1D The process described is the same.

[0082] Thereafter, the organic control layer 320B is formed by controlling the flow of the monomer using the first region 321 and the second region 322. Figure 2B The organic encapsulation layer 330 shown in FIG. The organic encapsulation layer 330 may be formed in an island shape corresponding to each of the unit display PUs. After forming the organic encapsulation layer 330, the second region 322 (see FIG. 3 ) is removed. Figure 2A ). The process of forming the organic encapsulation layer 330 and removing the second region 322 is similar to that of the reference Figure 1E and Figure 1F The process described is the same.

[0083] Next, a second inorganic encapsulation layer 340 is formed on the organic encapsulation layer 330. The second inorganic encapsulation layer 340 may be formed as one body to correspond to a plurality of unit display PUs. The material and process of the second inorganic encapsulation layer 340 are similar to those of the reference Figure 1G The materials and processes of the second inorganic encapsulation layer 340 are the same as described.

[0084] Except that the counter electrode 230 is formed as one body to cover the plurality of display elements 200R, 200G and 200B, referring to Figure 2A and Figure 2B The process described is essentially the same as that described in reference Figures 1A to 1G The process of the described embodiments is the same.

[0085] A stack including a first inorganic encapsulation layer 310, an organic control layer 321, an organic encapsulation layer 330 and a second inorganic encapsulation layer 340 and respectively overlapping the display elements 200R, 200G and 200B of the unit display PU is a unit encapsulation portion 300R, 300G and 300B, and can seal the display elements 200R, 200G and 200B respectively.

[0086] Although the reference Figures 1A to 2B The embodiment has described the case where one display element 200, 200R, 200G or 200B corresponds to one unit display PU, but the present disclosure is not limited thereto. In another embodiment, as shown below with reference to Figure 3A and Figure 3B As described, one unit display PU may include a plurality of display elements 200R, 200G, and 200B configured to emit red, green, and blue light, respectively. For example, display elements 200R, 200G, and 200B emitting red, green, and blue light, respectively, may constitute one unit display PU.

[0087] Figure 3A and Figure 3B are cross-sectional views showing some processes of a method for manufacturing a display device according to another embodiment.

[0088] Figure 3A The figure shows that one unit display PU includes a display element 200R configured to emit red light, a display element 200G configured to emit green light, and a display element 200B configured to emit blue light. The process of forming the display elements 200R, 200G, and 200B and the process of forming the first inorganic encapsulation layer 310 on the display elements 200R, 200G, and 200B are similar to those of the reference 1. Figure 2A The process described is the same.

[0089] Thereafter, an organic material layer having light-adjustable wettability is formed on the first inorganic encapsulation layer 310, and an organic control layer 320B including a first region 321 having hydrophilicity and a second region 322 having hydrophobicity is formed by irradiating a preset light (e.g., UV) using a mask 400'. The light-transmitting portion 410' of the mask 400' can be compared to the reference Figure 2AThe light-transmitting portion 410 of the mask 400 is described to be large so that the light-transmitting portion 410' corresponds to the red display element 200R, the green display element 200G, and the blue display element 200B. The first region 321 having hydrophilicity may be formed as a whole to cover all of the red display element 200R, the green display element 200G, and the blue display element 200B. The process of adjusting the hydrophilicity and hydrophobicity of the organic control layer 320B using light is similar to that of the reference Figure 1C and Figure 1D The process described is the same.

[0090] Thereafter, the organic control layer 320B is formed by controlling the flow of the monomer using the first region 321 and the second region 322. Figure 3B The organic encapsulation layer 330 shown in FIG. is formed directly above the first region 321 to cover all of the red display element 200R, the green display element 200G, and the blue display element 200B. After the organic encapsulation layer 330 is formed, the second region 322 (see FIG. 3 ) is removed. Figure 3A ). The process of forming the organic encapsulation layer 330 and removing the second region 322 is similar to that of the reference Figure 1E and Figure 1F The process described is the same.

[0091] Next, a second inorganic encapsulation layer 340 is formed on the organic encapsulation layer 330. The second inorganic encapsulation layer 340 is formed as a whole to cover all of the red display element 200R, the green display element 200G, and the blue display element 200B. The material and process of the second inorganic encapsulation layer 340 are the same as those of the reference Figure 1G The materials and processes of the second inorganic encapsulation layer 340 are the same as described.

[0092] A stack including the first inorganic encapsulation layer 310 , the organic control layer 321 , the organic encapsulation layer 330 , and the second inorganic encapsulation layer 340 and overlapping the display elements 200R, 200G, and 200B of the unit display PU is a unit encapsulation portion 300U and may seal the display elements 200R, 200G, and 200B.

[0093] although Figure 3A and Figure 3B It is shown that each unit display PU includes a red display element 200R, a green display element 200G, and a blue display element 200B, but the present disclosure is not limited thereto. In another embodiment, each unit display PU may include a red display element, a green display element, a blue display element, and a white display element.

[0094] Figure 4 is a plan view of a display device according to an embodiment, Figure 5 According to the embodiment Figure 4A cross-sectional view of the display device taken along line IV-IV'.

[0095] Reference Figure 4 and Figure 5 , the display device 10 may include a substrate 100, a unit display PU located above the substrate 100, and unit encapsulation parts EU configured to respectively seal the unit display PUs. Since the size of each of the unit encapsulation parts EU is larger than the size of each of the unit display PUs, each unit encapsulation part EU may seal each unit display PU while covering each unit display PU.

[0096] The substrate 100 may include a flexible material that may be warpable, bendable, foldable, rollable, or stretchable. The substrate 100 may include various materials such as a metallic material or an organic material including a polymer such as PET, PEN, and PI.

[0097] In an embodiment, Figure 5 As shown in FIG. 1 , the substrate 100 may include a plurality of layers including a first barrier layer 100a, a first base layer 100b, a second barrier layer 100c, and a second base layer 100d sequentially stacked. In this case, the first barrier layer 100a may be most adjacent to the thin film transistor TFT formed over the substrate 100.

[0098] The first barrier layer 100a and the second barrier layer 100c may include an inorganic material. For example, the first barrier layer 100a and the second barrier layer 100c may include at least one of silicon nitride, aluminum nitride, zirconium nitride, titanium nitride, hafnium nitride, tantalum nitride, silicon oxide, aluminum oxide, titanium oxide, tin oxide, cerium oxide, and silicon oxynitride (SiON).

[0099] The first base layer 100b and the second base layer 100d may include an organic material. For example, the first base layer 100b and the second base layer 100d may include at least one of PI, PMMA, PC, PS, acrylic resin, epoxy resin, and polyethylene.

[0100] In an embodiment, each unit display PU may include a display element configured to emit light of a first color. The first color may be one of red, green, blue, and white. Figure 5 Describe, Figure 5 A cross-sectional view of a display device corresponding to the red display element 200R and the green display element 200G is shown.

[0101] The red display element 200R and the green display element 200G include a pixel electrode 210 , an opposing electrode 230 , and intermediate layers 220R and 220G disposed between the pixel electrode 210 and the opposing electrode 230 , each of which includes an organic emission layer.

[0102] The display element 200 is electrically connected to the thin film transistor TFT. The thin film transistor TFT may be a driving thin film transistor TFT, and may include a semiconductor layer Act, a source electrode S and a drain electrode D, and a gate electrode G overlapping a channel region of the semiconductor layer Act. The buffer layer 101 is disposed between the substrate 100 and the semiconductor layer Act. The gate insulating layer 103 is disposed between the semiconductor layer Act and the gate electrode G. The interlayer insulating layer 105 is disposed between the gate electrode G and the source electrode S and the drain electrode D. The buffer layer 101, the gate insulating layer 103, and the interlayer insulating layer 105 may be an inorganic insulating layer. For example, the buffer layer 101, the gate insulating layer 103, and the interlayer insulating layer 105 may include a single layer or multiple layers containing silicon nitride, silicon oxide, and / or silicon oxynitride.

[0103] although Figure 5 The thin film transistor TFT is shown to be a top gate thin film transistor, but the present disclosure is not limited thereto. In another embodiment, the thin film transistor TFT may be a bottom gate thin film transistor in which a gate electrode is disposed below the semiconductor layer.

[0104] The thin film transistor TFT may be covered by an organic insulating layer 107 as a planarization layer and electrically connected to the display elements 200R and 200G through the contact holes of the organic insulating layer 107. The organic insulating layer 107 may be constructed as a single layer or multiple layers including an organic material. The organic material may include at least one of a general polymer such as polymethyl methacrylate (PMMA) or polystyrene (PS), a polymer derivative having a phenolic group, an acrylic polymer, an imide polymer, an aryl ether polymer, an amide polymer, a fluorine polymer, a paraxylene polymer, a vinyl alcohol polymer, and a mixture thereof.

[0105] Each unit encapsulation part EU includes a stacked body including a first inorganic encapsulation layer 310, an organic control layer 321, an organic encapsulation layer 330, and a second inorganic encapsulation layer 340. The materials of these layers are the same as those described above. The organic control layer 321 and the organic encapsulation layer 330 of each unit encapsulation part EU may be arranged in an island shape corresponding to the unit display PU covered by each unit encapsulation part EU, but the first inorganic encapsulation layer 310 and the second inorganic encapsulation layer 340 may be connected to other first inorganic encapsulation layers 310 and second inorganic encapsulation layers 340 of adjacent unit encapsulation parts EU as a whole. For example, Figure 5As shown in , the organic control layer 321 and the organic encapsulation layer 330 of each unit encapsulation part EU may be arranged in an island shape corresponding to one display element 200R or 200G of each unit display PU. That is, in the partition area BA between adjacent unit display PUs, the organic control layer 321 and the organic encapsulation layer 330 are separated from the adjacent organic control layer 321 and the organic encapsulation layer 330, respectively, but each of the first inorganic encapsulation layer 310 and the second inorganic encapsulation layer 340 may be connected as a whole in the partition area BA to cover the adjacent display elements 200R and 200G.

[0106] The level of the organic control layer 321 of each unit encapsulation portion EU (i.e., the vertical distance from the substrate 100 to the top surface of the organic control layer 321) may be variously changed for each region according to the elements disposed below the organic control layer 321. In contrast, the level of the organic encapsulation layer 330 (i.e., the vertical distance from the substrate 100 to the top surface of the organic encapsulation layer 330) may be relatively constant regardless of the elements below the organic encapsulation layer 330, i.e., regardless of the region.

[0107] For example, the level of the region of the organic control layer 321 corresponding to the opening 240OP of the pixel defining layer 240 is lower than the level of the region of the organic control layer 321 corresponding to the bank 240B of the pixel defining layer 240, that is, the level of the region of the organic control layer 321 corresponding to the opening 240OP of the pixel defining layer 240 and the level of the region of the organic control layer 321 corresponding to the bank 240B of the pixel defining layer 240 are different. In contrast, the level of the region of the organic encapsulation layer 330 corresponding to the opening 240OP of the pixel defining layer 240 and the level of the region of the organic encapsulation layer 330 corresponding to the bank 240B of the pixel defining layer 240 may have relatively constant values, so the top surface of the region of the organic encapsulation layer 330 corresponding to the opening 240OP of the pixel defining layer 240 and the top surface of the region of the organic encapsulation layer 330 corresponding to the inclined surface of the bank 240B adjacent to the opening 240OP of the pixel defining layer 240 may have relatively flat surfaces. Here, relatively constant values ​​may mean that the difference thereof is less than 10% of the maximum value.

[0108] although Figure 5 The case where each unit display PU is a sub-pixel (ie, each unit display PU includes one display element 200) is shown, but the present disclosure is not limited thereto. Figure 6 As described, each unit display PU may correspond to a group of sub-pixels, wherein each sub-pixel emits light of a different color.

[0109] Figure 6 According to another embodiment, Figure 4 A cross-sectional view of the display device taken along line IV-IV'.

[0110] Reference Figure 6 , each unit display PU may include display elements 200R, 200G, and 200B configured to emit red light, green light, and blue light, respectively. Figure 6 It is illustrated that the unit display PU includes three display elements, but according to another embodiment, the unit display PU may include four display elements configured to emit red light, green light, blue light, and white light.

[0111] Each unit encapsulation part EU includes a first inorganic encapsulation layer 310, an organic control layer 321, an organic encapsulation layer 330, and a second inorganic encapsulation layer 340. The materials of these layers are the same as those described above. The organic control layer 321 and the organic encapsulation layer 330 of each unit encapsulation part EU may be arranged in an island shape corresponding to the unit display PU covered by each unit encapsulation part EU, but the first inorganic encapsulation layer 310 and the second inorganic encapsulation layer 340 may be connected to other first inorganic encapsulation layers 310 and second inorganic encapsulation layers 340 of adjacent unit encapsulation parts EU as a whole. For example, Figure 6 As shown in , the organic control layer 321 and the organic encapsulation layer 330 of each unit encapsulation part EU may be arranged in an island shape corresponding to the display elements 200R, 200G, and 200B of each unit display PU. That is, in the partition area BA between adjacent unit display PUs, the organic control layer 321 and the organic encapsulation layer 330 are separated from the adjacent organic control layer 321 and the organic encapsulation layer 330, respectively, but each of the first inorganic encapsulation layer 310 and the second inorganic encapsulation layer 340 may be connected as a whole in the partition area BA to cover the adjacent display element 200.

[0112] like Figure 5 and Figure 6 As shown in FIG. 1 , the first inorganic encapsulation layer 310 and the second inorganic encapsulation layer 340 of each unit encapsulation portion EU may contact each other over the bank 240B between adjacent unit display PUs.

[0113] Figure 7 is a plan view of a display device 20 according to another embodiment, Figure 8 It is shown Figure 7 The shape of the display device 20 has been changed in the plan view, Fig. 9 According to the embodiment Figure 7 A cross-sectional view of the display device 20 taken along line VIIa-VIIa′, Fig.10 According to another embodiment, Figure 7 A cross-sectional view of the display device 20 taken along line VIIa-VIIa′.

[0114] Reference Figure 7The display device 20 may include a substrate 100, a unit display PU located above the substrate 100, and a unit encapsulation part EU respectively sealing the unit display PU. The size of each unit encapsulation part EU is larger than the size of each unit display PU, so each unit encapsulation part EU can seal each unit display PU while covering each unit display PU.

[0115] The substrate 100 may include a plurality of islands 1101 , a plurality of connection portions 1102 connecting the plurality of islands 1101 , and a plurality of communication portions (hereinafter, through holes) V passing through the substrate 100 , the plurality of through holes V being located between the plurality of connection portions 1102 .

[0116] The islands 1101 may be spaced apart from each other. For example, the islands 1101 may be repeatedly arranged in the X direction (first direction) and the Y direction (second direction) to construct a planar grid pattern. For example, the X direction (the first direction) and the Y direction (the second direction) may be directions that intersect each other to form a right angle, an obtuse angle, or an acute angle.

[0117] The connection portion 1102 may connect the islands 1101. Specifically, four connection portions 1102 may be connected to each of the islands 1101. The four connection portions 1102 connected to one island 1101 may extend in different directions, respectively, and may be respectively connected to four other islands 1101 adjacent to the one island 1101. The island 1101 and the connection portion 1102 may include the same material and may be formed as one body.

[0118] The through hole V passes through the substrate 100 in the thickness direction of the substrate 100. Figure 7 When viewed from a plane of , the through hole V may be defined as a region surrounded by a closed curve CL. The through hole V may reduce the weight of the substrate 100 and improve the flexibility of the substrate 100. In addition, since the shape of the through hole V changes when warping, bending, curling, etc. occurs in the substrate 100, the through hole V may prevent abnormal deformation of the substrate 100 and improve the durability of the substrate 100 by effectively reducing stress occurring when the substrate 100 is deformed. The through hole V may be adjacent to four adjacent islands 1101.

[0119] The through hole V may be formed by removing a selected portion of the substrate 100 based on a method such as etching. In another embodiment, the substrate 100 may be formed to include the through hole V while manufacturing the substrate 100. In another embodiment, after forming a plurality of unit display PUs on the substrate 100, the through hole V may be formed by patterning the substrate 100. The through hole V may be formed in the substrate 100 in various ways, and the method of forming the through hole V may not be limited to the examples described herein.

[0120] The unit display PU and the unit encapsulation part EU sealing the unit display PU are arranged on the island 1101 of the substrate 100 having the above structure. The island 1101 of the substrate 100, the unit display PU and the unit encapsulation part EU constitute a unit pattern U, and can be as shown. Figure 7 That is, the display device 20 can be understood as a unit pattern U repeatedly arranged in the X direction and the Y direction, and the unit patterns U are combined with each other. For example, adjacent unit patterns U can be arranged so that the adjacent unit patterns U are symmetrical with respect to the axis along the X direction and / or the Y direction.

[0121] The angle θ formed by the extension direction of the connection portion 1102 and one side of the island 1101 connected to the connection portion 1102 may be an acute angle. Therefore, since the island 1101 and the unit display PU located on the island 1101 are densely arranged, the length of the connection portion 1102 can be minimized and the elongation characteristics of the substrate 100 can be improved. For example, Figure 8 As shown in , when the display device 20 is extended in the X direction or the Y direction, the angle formed by one side of the connecting portion 1102 and one side of the island 1101 can be increased (θ'>θ), so the area of ​​the through hole V can be increased and the distance between adjacent unit display PUs can be changed.

[0122] The unit display PUs are respectively arranged on the islands 1101 and are respectively covered by the unit encapsulation units EU. The size of each unit encapsulation unit EU is larger than the size of each unit display PU, and thus the unit encapsulation unit EU covers the unit display PU. Figure 7 A separation area BA is shown as a region between adjacent unit display PUs. The separation area BA may correspond to the connection portion 1102 and the edge OS of the island 1101.

[0123] The unit display PU includes at least one display element. In an embodiment, Fig. 9 As shown in , the unit display PU includes a display element 200. The display element 200 includes a pixel electrode 210, an intermediate layer 220 including an emission layer, and a counter electrode 230, and the emission layer emits light of a first color. The display element 200 is electrically connected to a thin film transistor TFT. The first color may be one of red, green, blue, and white. In this case, Fig. 9 The unit display PU corresponds to a sub-pixel configured to emit light of the first color. Fig.10 As shown in , the unit display PU includes display elements 200R, 200G, and 200B configured to emit light of different colors. Fig.10 It is shown that one unit display PU includes display elements 200R, 200G, and 200B configured to emit red light, green light, and blue light, respectively. In this case, the unit display PU corresponds to one unit pixel. Fig.10 The unit display PU is shown to include a red display element 200R, a green display element 200G, and a blue display element 200B, but the present disclosure is not limited thereto. In another embodiment, the unit display PU may include four display elements configured to emit red, green, blue, and white light, respectively.

[0124] Unit package part EU protection Fig. 9 and Fig.10 The unit display PU shown in FIG. The unit encapsulation portion EU includes at least one inorganic encapsulation layer and at least one organic encapsulation layer. For example, the unit encapsulation portion EU may include a first inorganic encapsulation layer 310, a second inorganic encapsulation layer 340, an organic encapsulation layer 330 disposed between the first inorganic encapsulation layer 310 and the second inorganic encapsulation layer 340, and an organic control layer 321 disposed directly below the organic encapsulation layer 330. Since the materials of the first inorganic encapsulation layer 310, the organic control layer 321, the organic encapsulation layer 330, and the second inorganic encapsulation layer 340 are the same as those described above, their repeated description is omitted.

[0125] Can make reference Fig. 9 and Fig.10 The insulating layer (e.g., organic insulating layer 107) respectively located under the display elements 200, 200R, 200G, and 200B of the unit display PU is described as being patterned. During the process of forming the organic insulating layer 107 or a subsequent process, a portion 107O (referred to as a connecting portion) of the organic insulating layer 107 may be removed. The inorganic insulating layer (e.g., interlayer insulating layer 105) under the organic insulating layer 107 may be exposed through the connecting portion 107O of the organic insulating layer 107. When viewed in a plan view, the connecting portion 107O of the organic insulating layer 107 may have the same Figure 7 The shape of the contour of the connecting portion V described above is similar to that of the connecting portion V. In other words, the organic insulating layer 107 can be understood as an island 1101 (see FIG. 1 ) provided on the substrate 100. Figure 7 )superior.

[0126] The organic control layer 321 and the organic encapsulation layer 330 of the unit encapsulation unit EU may be disposed above the organic insulating layer 107 to correspond to each unit display PU. The first inorganic encapsulation layer 310 and the second inorganic encapsulation layer 340 may directly contact the inorganic insulating layer (e.g., the interlayer insulating layer 105) through the connecting portion 107O of the organic insulating layer 107. For example, the first inorganic encapsulation layer 310 and the second inorganic encapsulation layer 340 and the interlayer insulating layer 105 may contact each other.

[0127] Reference Figure 7 , Fig. 9 and Fig.10Each of the described unit encapsulation parts EU overlaps each of the unit display PUs to cover each of the unit display PUs. As described below, in the partition area BA between adjacent unit display PUs, the first inorganic encapsulation layer 310 and the second inorganic encapsulation layer 340 of the unit encapsulation part EU may be connected to or separated from each other.

[0128] Fig.11 According to the embodiment Figure 7 A cross-sectional view of the display device taken along line VIIb-VIIb', Fig.12 According to another embodiment, Figure 7 A cross-sectional view of the display device taken along line VIIb-VIIb'.

[0129] Reference Fig.11 and Fig.12 , the organic control layer 321 and the organic encapsulation layer 330 of the adjacent unit encapsulation parts EU are arranged in island shapes corresponding to the unit display PUs, respectively. The first inorganic encapsulation layer 310 and the second inorganic encapsulation layer 340 of the adjacent unit encapsulation parts EU may be connected to each other (see Fig.11 ), or separated and separated from each other in the separation area BA (see Fig.12 In the partition area BA, the first inorganic encapsulating layer 310 may contact the interlayer insulating layer 105 as the inorganic insulating layer through the connecting portion 107O of the organic insulating layer 107 .

[0130] Fig.13 According to the embodiment Figure 7 A cross-sectional view of the display device taken along line VIIb-VIIb', Fig.14 According to the embodiment Figure 7 A cross-sectional view of the display device taken along line VIIb-VIIb'.

[0131] Reference Fig.13 and Fig.14 , the organic control layer 321 and the organic encapsulation layer 330 of the adjacent unit encapsulation parts EU are arranged in island shapes corresponding to the unit display PUs, respectively. The first inorganic encapsulation layer 310 and the second inorganic encapsulation layer 340 of the adjacent unit encapsulation parts EU may be connected to each other (see Fig.13 ), or separated and separated from each other in the separation area BA (see Fig.14 ). In addition, in the separation area BA, the first inorganic encapsulating layer 310 may contact the interlayer insulating layer 105 as the inorganic insulating layer through the connecting portion 107O of the organic insulating layer 107 as described above.

[0132] like Fig.13 and Fig.14As shown in , a dam 250 may be further provided on the organic insulating layer 107. The dam 250 may surround the organic control layer 321 and the organic encapsulation layer 330 outside the organic control layer 321. During the process of forming the organic encapsulation layer 330, the monomer may be fundamentally (primarily) controlled by the organic control layer 321, and the monomer may be secondarily (auxiliarily) controlled by the dam 250. The dam 250 may include the same material as, for example, the material of the pixel defining layer.

[0133] Fig.12 and Fig.14 It is shown that a stack of the first inorganic encapsulation layer 310 and the second inorganic encapsulation layer 340 of the unit encapsulation portion EU is separated and spaced apart from each other in the separation area BA, and contacts the interlayer insulating layer 105, which is an inorganic insulating layer located below the first inorganic encapsulation layer 310. In another embodiment, while the first inorganic encapsulation layer 310 and the second inorganic encapsulation layer 340 are patterned, an inorganic insulating layer such as at least one of the interlayer insulating layer 105, the gate insulating layer 103, and the buffer layer 101 may be patterned at the same time.

[0134] Fig.15 is a plan view of wiring in the display device according to the embodiment.

[0135] Reference Fig.15 , wiring such as a first voltage line V1, a second voltage line V2, at least one data line DL, and at least one scan line SL may be formed over the substrate 100. The first voltage line V1, the second voltage line V2, at least one data line DL, and at least one scan line SL extend to pass through the island 1101. For example, the first voltage line V1, the second voltage line V2, and at least one data line DL may extend in the X-axis direction and bend along the shape of the island 1101 and the shape of the connection portion 1102 disposed between the islands 1101 along the X-direction. At least one scan line SL may extend in the Y-direction and bend along the shape of the island 1101 and the shape of the connection portion 1102 disposed between the islands 1101 along the Y-direction.

[0136] Reference Figure 4 and Figure 6 The depicted unit shows that the counter electrodes 230 of the PU have a structure connected to each other as one body. Figure 7 and Fig.14 The counter electrode 230 of the described unit display PU is patterned per unit display PU and thus may be spaced apart from the counter electrode 230 of an adjacent unit display PU and may receive a voltage from a second voltage line V2 described below.

[0137] For example, Figures 7 to 14The unit display PU shown in FIG. 1 includes a thin film transistor TFT and display elements 200, 200R, 200G, and 200B electrically connected to the thin film transistor TFT. The thin film transistor TFT of each unit display PU may be electrically connected to a first voltage line V1, a data line DL, and a scan line SL. Since the counter electrode 230 is provided in an island shape corresponding to each unit display PU, the counter electrode 230 may receive a predetermined voltage through a second voltage line V2.

[0138] According to an embodiment of the present disclosure, since at least one inorganic layer and at least one organic layer of the thin encapsulation layer are all formed above the display device, the flexibility of the display device is reduced, and the inorganic layer and the organic layer are damaged when the shape of the display device changes. It should be understood that the scope of the present disclosure is not limited by such effects.

[0139] Although the present disclosure has been described with reference to the embodiments shown in the drawings, this is provided by way of example only and those skilled in the art will appreciate that various changes in form and details and their equivalents may be made therein without departing from the spirit and scope of the present disclosure as defined by the claims.

Claims

1. A display device, comprising: substrate; A driving thin film transistor is disposed on the substrate; A pixel electrode electrically connected to the driving thin film transistor; a pixel defining layer, comprising an opening overlapping the pixel electrode, wherein the opening is defined by a sidewall of the pixel defining layer; an intermediate layer overlapping the portion of the pixel electrode exposed by the opening, the intermediate layer comprising an emission layer; a counter electrode, disposed on the intermediate layer; An organic control layer, disposed on the counter electrode, the organic control layer being disposed in the opening and on the side wall of the pixel defining layer, the organic control layer being hydrophilic; an organic encapsulation layer, disposed on the organic control layer, wherein the organic control layer is disposed between the counter electrode and the organic encapsulation layer; and at least one inorganic encapsulation layer is stacked with the organic encapsulation layer, the at least one inorganic encapsulation layer comprising: a first inorganic encapsulation layer disposed between the counter electrode and the organic control layer; and a second inorganic encapsulation layer disposed on the organic encapsulation layer, such that the organic encapsulation layer is disposed between the first inorganic encapsulation layer and the second inorganic encapsulation layer, wherein the first inorganic encapsulation layer contacts the second inorganic encapsulation layer on the pixel defining layer, and The organic control layer is formed by irradiating a preset light onto an organic material layer having light-adjustable wettability.

2. The display device according to claim 1, further comprising: an adjacent pixel electrode, adjacent to the pixel electrode; an adjacent intermediate layer disposed on the adjacent pixel electrode, the adjacent intermediate layer comprising an adjacent emission layer configured to emit light of a color different from a color of light emitted from the emission layer of the intermediate layer; and The adjacent counter electrodes are arranged on the adjacent intermediate layers.

3. The display device according to claim 2, further comprising: An adjacent organic control layer is disposed on the adjacent counter electrode, and the adjacent organic control layer is hydrophilic; an adjacent organic encapsulation layer directly contacting the adjacent organic control layer; as well as at least one adjacent inorganic encapsulation layer, stacked with the adjacent organic encapsulation layer, Wherein, the adjacent organic control layers are separated from each other, and the adjacent organic encapsulation layers are separated from each other.

4. The display device according to claim 2, wherein: The adjacent counter electrodes and the counter electrode are connected as a whole.

5. The display device according to claim 2, wherein: The adjacent counter electrodes and the counter electrode are spaced apart from each other.

6. The display device according to claim 3, wherein: The at least one adjacent inorganic encapsulation layer and the at least one inorganic encapsulation layer are connected as one body.

7. The display device according to claim 3, wherein: The at least one adjacent inorganic encapsulation layer and the at least one inorganic encapsulation layer are spaced apart from each other.

8. A display device, comprising: substrate; A plurality of unit displays are arranged above the substrate, each unit display comprising a pixel electrode, an intermediate layer and a counter electrode stacked in sequence, the intermediate layer comprising an emission layer; A pixel definition layer between adjacent unit displays; an organic control layer, stacked with each of the plurality of unit displays, the organic control layer having hydrophilicity; an organic encapsulation layer, directly contacting the organic control layer; as well as at least one inorganic encapsulation layer stacked with the organic encapsulation layer, the at least one inorganic encapsulation layer comprising: a first inorganic encapsulation layer disposed between each of the plurality of unit displays and the organic control layer; and a second inorganic encapsulation layer disposed on the organic encapsulation layer such that the organic encapsulation layer is disposed between the second inorganic encapsulation layer and the first inorganic encapsulation layer, wherein the first inorganic encapsulation layer contacts the second inorganic encapsulation layer on the pixel defining layer, and The organic control layer is formed by irradiating a preset light onto an organic material layer having light-adjustable wettability.

9. The display device according to claim 8, wherein: The organic encapsulation layer includes a plurality of sub-organic encapsulation layers respectively corresponding to the plurality of unit displays.

10. The display device according to claim 1 or 8, wherein: The organic material layer includes an organic material, and the organic material includes at least one of azobenzenes, spiropyranamines, 7-[(trifluoromethylphenylazo)phenoxy]valeric acids, cinnamic esters, trimethylsilyl trifluoromethanesulfonate, polyaryl sulfones, diarylethenes, diethylcyclopentenes, coumarins and o-nitrobenzyl esters.

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