A heating module

Abstract

The invention discloses a heating module, comprising: a coil disk (1), a coil support (2), an electric control mainboard (4), a fan (5) and an air duct wall structure, wherein the coil disk (1) is sleeved inside the coil support (2), the fan (5) is arranged below the bottom of the coil support (2), and the projection of the center thereof is located within the projection of the coil disk (1), the electric control mainboard (4) comprises a circuit board (41) and a radiator (42), the radiator (42) is horizontally arranged on the side of the fan (5), the circuit board (41) is vertically arranged on the upper part of the radiator (42), and the air duct wall structure is used to guide the airflow from the side of the fan (5) to the direction of the radiator (42) and the circuit board (41). The invention can be integrated into a standard module with a very small size, is easy to install, has a high degree of commonality, has a low comprehensive cost, and significantly shortens the development cycle of the whole machine, and can be applied to cooker products such as IH rice cookers and pressure cookers.

Description

Technical Field

[0001] The present invention relates to the field of IH heating, and in particular to a compact IH heating module capable of achieving low-cost and rapid heat dissipation. Background Art

[0002] Electromagnetic induction heating appliances usually include an upper cover, a base, a coil disk and a coil bracket, an electronic control mainboard, a radiator, an inner pot and other parts. Among them, the power devices (such as IGBT) on the electronic control mainboard (usually in the form of a PCB) will generate a lot of heat when working. In addition to power components, other electronic components on the mainboard will also generate a certain amount of heat. In addition, the electromagnetic induction heating module uses the alternating magnetic field generated by the inductor coil disk to generate eddy currents in the magnetic conductive object placed in the magnetic field, thereby generating heat. Therefore, when the electromagnetic induction heating module is working, the energized inductor coil disk will also generate a lot of heat. If this heat cannot be discharged out of the electromagnetic induction heating module in a timely and effective manner, it will cause the temperature in the equipment to be too high, thereby affecting the normal operation of the equipment components and even damaging the components. In the prior art, a wind trough type radiator is usually installed on the electronic control mainboard, and a fan facing the radiator is set to achieve heat dissipation of the electronic control mainboard, and the airflow generated by the fan is used to take away part of the heat generated by the coil disk. However, existing designs usually have problems such as poor heat dissipation effect, poor structural integrity, and large volume.

[0003] For example, in an electromagnetic heating rice cooker disclosed in CN104223930B, a fan is arranged on the side of the coil disk, and the tangential airflow is guided to the bottom of the coil disk by the air duct wall, and the axial airflow is blown upward to the electronic control mainboard and the radiator. The disadvantage of this arrangement is that the airflow blowing through the radiator becomes an airflow with a large amount of heat, and the airflow inevitably blows through the surface of the electronic control mainboard again, affecting the heat dissipation efficiency of other parts of the electronic control mainboard, and because the position of the fan is far away from the bottom of the coil disk, the airflow blown out from the side has insufficient air volume and air pressure when it reaches the bottom of the coil disk, and cannot dissipate heat efficiently. In addition, although the heat dissipation component is designed as a whole with the radiator and the circuit board, it is still a stacked layout with the fan at the bottom and the circuit board at the top, and the flow channel design does not take into account all the heating components; at the same time, it causes its size to be larger in the vertical direction, and because the position of the fan is outside the projection of the coil disk, and the space at the bottom and side of the rice cooker is not fully utilized, the volume of the entire heat dissipation component and the electronic control mainboard is too large, and the structure is not compact enough.

[0004] CN104042119B discloses an IH rice cooker main control module and a mainboard bracket, wherein the airflow blown out from the side air outlet notch 17 passes through the radiator 21, and the air duct and the baffle plate are arranged to prevent the heated airflow from blowing toward other components of the electronic control mainboard. However, since the fan is still arranged on the side of the coil disk and part of the airflow is diverted from the side notch 17, the side airflow blown out has a poor heat dissipation effect on the side of the coil disk away from the fan, and due to the arrangement of the upper baffle plate, no airflow is blown directly toward other components of the electronic control mainboard, causing these components to still not dissipate heat smoothly. Moreover, due to the excessive number of vertically intersecting air duct walls inside, part of the axially upward airflow must undergo multiple collisions before it can be blown out, which also causes a loss of wind pressure. In actual design, it is likely to force designers to use larger-sized fans, increasing costs and noise. In addition, although the heat dissipation component is designed as an integrated whole with the radiator and the circuit board, the overall layout is still a stacked layout with the fan at the bottom and the circuit board at the top, and the flow channel design does not take into account all the heat-generating components; at the same time, it causes its size to be larger in the vertical direction, and because the motor is located outside, the space at the bottom and sides of the rice cooker is not fully utilized, and a part of the space is wasted, causing the entire rice cooker to be larger in size and less compact in structure.

[0005] CN107684342A discloses an electric pressure cooker, whose fan is installed under the coil disk, but because its axial upward airflow must also take into account the heat dissipation of the electronic control mainboard, its fan is not placed near the center of the bottom of the coil disk but near the edge, half of which is located under the coil disk and half of which is located under the electronic control mainboard. This is actually still a traditional up-and-down stacking structure, and the radiator is still arranged above the fan, without making any use of the idle space in the pot; at the same time, the tangential airflow of the fan is not well utilized, and all the airflow is still blown upward at once. The airflow flowing through the radiator is blown to the components on the circuit board under the action of the baffle 630. Various airflows are intertwined, which is equivalent to secondary heating of the components, and the heat dissipation efficiency is low; in addition, since the electric pressure cooker uses an electromagnetic heating chassis, the chassis is basically laid flat under the inner pot, and there is no need to guide the airflow to the inner pot side farther away, so the requirements for the wind pressure and air volume of the heat dissipation airflow are not very high, so the diversion is not fully considered during the design. The effect is that only a simple baffle is used to control the airflow, which can not only fail to achieve precise control, but also cause wind pressure loss due to its refraction, and finally cause the airflow to be chaotic, discrete and interfere with each other. Under this design, if the heat sink heats up violently, the temperature, wind pressure and air volume of the heat dissipation airflow refracted to the circuit board will be insufficient. If it is applied to the actual design of electromagnetic induction appliances, it is likely to force designers to adopt larger fans, resulting in increased size, increased noise and increased costs. In addition, the fan is arranged on the bottom plate, and the power board is arranged on the inside of the shell, without forming an integrated design, resulting in a loose structure, occupying the space of other structures, and inconvenient assembly, maintenance and disassembly.

[0006] CN207492536U discloses an electric rice cooker, in which a fan is arranged below the coil disk and the electronic control mainboard, a part of the axial airflow blows to the coil disk, and a part of the airflow blows to the radiator. However, due to the unreasonable layout, the volume is too large, the fan is too far away from the coil disk, and an additional wind shield is required around the coil disk to achieve orderly flow of airflow. In addition, the air duct design is unreasonable, and the airflow guidance blowing to the coil disk is not accurate, which will inevitably cause uneven heat dissipation between various parts; the airflow is not guided to flow to other components of the electronic control mainboard, causing these components to only dissipate heat naturally; the hot air blown out of the radiator is not directly discharged from the shell, but is still circulating in the shell, and most of it is blown to other components of the electronic control mainboard, causing secondary heating, resulting in a serious decrease in heat dissipation efficiency. In addition, although the heat dissipation component is designed as an integrated whole with the radiator and the circuit board, the overall layout is still a stacked layout with the fan at the bottom and the circuit board at the top. There is almost no precise guidance of the airflow, and the flow channel design does not take into account all the heat-generating components. At the same time, it causes its vertical size to be larger, and because the position of the fan is mostly outside the projection of the coil disk, and the space at the bottom and sides of the rice cooker is not fully utilized, the vertical height of the entire heat dissipation component and the electronic control mainboard is too large, and the structure is not compact enough.

[0007] CN204617952U and CN207444813U both disclose an electric rice cooker, and the structure thereof is very similar. Although the heat dissipation assembly is designed as one with the radiator and the circuit board, the overall structure is still a stacking layout with the fan at the bottom and the circuit board at the top, and since the position of the fan is mostly outside the projection of the coil disk, the space at the bottom and the side of the electric rice cooker is not fully utilized, resulting in the entire heat dissipation assembly and the electric control mainboard structure being not compact enough. Although the radiator is arranged on the side of the fan, since the fan is still arranged on the side of the coil disk and a part of the airflow is diverted from the side notch, the side airflow blown out by the fan has a poor heat dissipation effect on the side of the coil disk away from the fan, and since the upper baffle blocks all axial airflows, there is almost no airflow blowing to the upper part of the coil disk, which has a poor heat dissipation effect on the coil at the upper part of the side of the electromagnetically heated electric rice cooker, and the airflow is not accurately guided at the same time, so that there is no airflow blowing directly to other components of the electric control mainboard, resulting in the heat dissipation of these components still being poor.

[0008] In summary, the market is in urgent need of providing a heating module with good heat dissipation effect, low construction cost, compact size, and can be used as a general component. Summary of the invention

[0009] The technical problem to be solved by the present invention is to provide a heating module in view of the above-mentioned defects of the prior art.

[0010] The technical solution adopted by the present invention to solve its technical problems is: constructing a heating module, including: a coil disk, a coil bracket, an electronic control main board, a fan and an air duct wall structure, the coil disk is sleeved inside the coil bracket, the fan is arranged below the bottom of the coil bracket, and the projection of the center is located within the projection of the coil disk, the electronic control main board includes a circuit board and a radiator, the radiator is horizontally arranged on the side of the fan, the circuit board is vertically arranged on the upper part of the radiator, and the air duct wall structure is used to guide the airflow from the side of the fan to the direction of the electronic control main board.

[0011] Preferably, the coil support is a main assembly component.

[0012] Preferably, the projection of the fan is located within the projection of the coil disk.

[0013] Preferably, the projection of the heat sink is at least partially located within the projection of the coil disk.

[0014] Preferably, the projection of the circuit board does not intersect with the projection of the coil disk.

[0015] Preferably, the coil bracket covers the outside of the coil disk, and a notch is provided at the bottom thereof, and the airflow blown out from the top of the fan enters the gap between the coil bracket and the coil disk through the notch and is discharged outside the module.

[0016] Preferably, the fan mounting structure is arranged below the bottom of the coil support and close to the center.

[0017] Preferably, the electronic control mainboard is L-shaped, and the port of the radiator air duct faces the side of the fan.

[0018] Preferably, part of the airflow blown out from the side of the fan is blown toward the wind slot of the radiator; and part of the airflow is blown toward the circuit board through the gap between the top of the radiator and the outer surface of the coil bracket.

[0019] Preferably, the air duct wall structure also includes a portion for guiding the airflow passing through the gap between the top of the heat sink and the outer surface of the coil support to blow toward the components on the circuit board and discharge the module from the middle or upper part of the air duct wall structure.

[0020] Preferably, the air duct wall structure comprises:

[0021] The first air duct wall is arc-shaped and surrounds one side of the fan;

[0022] Two second air duct walls, each of which extends in a direction gradually away from the opposite second air duct wall and toward the electronic control main board;

[0023] The two fifth air duct walls correspond to the two second air duct walls one by one. Each fifth air duct wall starts from a position close to the head end of the corresponding second air duct wall and extends in a direction gradually approaching the opposite fifth air duct wall and toward the electronic control mainboard.

[0024] Preferably, the air duct wall structure comprises:

[0025] Two third air duct walls, starting from the rear ends of the two second air duct walls, extending outward in a direction away from the second air duct walls and then extending upward along the outer side of the coil support to a position close to the top of the coil support;

[0026] The fourth air duct wall is located near the top of the coil support and is connected to the extended ends of the two third air duct walls.

[0027] Preferably, the circuit board is arranged on the upper part of the heat sink at an angle less than 30° relative to the vertical direction.

[0028] Preferably, the radiator is arranged on the side of the fan at an angle less than 30° relative to the horizontal direction.

[0029] The implementation of the heating module of the present invention has the following beneficial effects: (1) The fan is arranged below the coil disk, which makes the most of the space below and provides other components with the opportunity to use the space below the side; the fan is close to the coil disk and there is basically no shielding above, which can dissipate heat for the entire coil disk. (2) The radiator is arranged on the side of the fan, which effectively utilizes the tangential airflow and side space of the fan. (3) The circuit board is arranged vertically to make full use of the space, and at the same time, most of its components can be kept away from the bottom and bottom edge areas of the coil disk where the electromagnetic interference is the strongest, which is beneficial to protecting the components. (4) A part of the tangential airflow blows through the gap to other parts of the electronic control mainboard. Several airflows are accurately guided without interfering with each other, which improves the heat dissipation efficiency, effectively utilizes all the air volume, and forms a positive wind pressure around the electronic control mainboard to prevent hot air from flowing back to this area. (5) The heating module uses the coil bracket as the main assembly part, and integrates the coil disk, electronic control main board, fan, temperature measurement component, air flow duct and other components into a very small standard module. It is easy to install, has a high degree of commonality, and low overall cost. The development cycle of the whole machine is significantly shortened, and it can be applied to IH rice cookers, pressure cookers and other cooker products. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art are briefly introduced below. Obviously, the drawings in the following description are only embodiments of the present invention. For those of ordinary skill in the art, other drawings can be obtained based on the provided drawings without creative work:

[0031] Figure 1 It is a schematic diagram of the three-dimensional structure of a heating module provided by a specific embodiment of the present invention;

[0032] Figure 2 It is a schematic diagram of the structure of the coil support;

[0033] Figure 3 It is a schematic diagram of the air duct; DETAILED DESCRIPTION

[0034] In order to facilitate understanding of the present invention, the present invention will be described more fully below with reference to the relevant drawings. Typical embodiments of the present invention are given in the drawings. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present invention more thorough and comprehensive.

[0035] It should be noted that when an element is referred to as being "fixed to" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only.

[0036] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art of the present invention. The terms used in the specification of the present invention herein are only for the purpose of describing specific embodiments and are not intended to limit the present invention.

[0037] Terms including ordinal numbers such as "first" and "second" used in this specification may be used to describe various components, but these components are not limited by these terms. The purpose of using these terms is only to distinguish one component from other components. For example, without departing from the scope of the present invention, the first component may be named as the second component, and similarly, the second component may also be named as the first component.

[0038] The general idea of ​​the present invention is to construct a heating module, including: a coil disk, a coil bracket, an electronic control mainboard, a fan and an air duct wall structure, wherein the coil bracket is a main assembly part, and the coil disk, the electronic control mainboard, the fan and the air duct wall structure are respectively installed on the corresponding structures outside and inside the coil bracket, making full use of the idle space below and below the side of the coil bracket, thereby achieving the purpose of compact structure and ensuring good heat dissipation.

[0039] In order to better understand the above-mentioned technical scheme, the above-mentioned technical scheme will be described in detail below in conjunction with the accompanying drawings and specific implementation methods. It should be understood that the embodiments of the present invention and the specific features in the embodiments are detailed descriptions of the technical scheme of the present application, rather than limitations on the technical scheme of the present application. In the absence of conflict, the embodiments of the present invention and the technical features in the embodiments can be combined with each other.

[0040] refer to Figure 1-3 A heating module comprises: a coil disk 1, a coil support 2, an electronic control main board 4, a fan 5 and an air duct wall structure, wherein the coil disk 1 is sleeved inside the coil support 2, the fan 5 is arranged below the bottom of the coil support 2, and the projection of the center thereof is located within the projection of the coil disk 1, the electronic control main board 4 comprises a circuit board 41 and a radiator 42, the radiator 42 is horizontally arranged on the side of the fan 5, the circuit board 41 is vertically arranged on the upper part of the radiator 42, and the air duct wall structure is used to guide the airflow from the side of the fan 5 to the direction of the electronic control main board 4.

[0041] The coil support 2 is a main assembly part. The projection of the fan 5 is located within the projection of the coil disk 1. The projection of the heat sink 42 is at least partially located within the projection of the coil disk 1. The projection of the circuit board 41 does not intersect with the projection of the coil disk 1.

[0042] The projection referred to herein refers to the projection along the depth or height direction of the coil support 2 , that is, the projection parallel to the plane where the bottom of the coil support 2 is located.

[0043] The coil support 2 roughly covers the outside of the coil disk 1, and a notch 21 is provided at the bottom thereof. The airflow blown out from the top of the fan 5 enters the gap between the coil support 2 and the coil disk 1 through the notch 21 and is discharged outside the module.

[0044] The fan mounting structure 25 is arranged at a central position below the bottom of the coil support 2 .

[0045] The electronic control main board 4 is substantially L-shaped, and the port of the air slot of the radiator 42 faces the side of the fan 5 .

[0046] A portion of the airflow blown out from the side of the fan 5 is blown toward the air slot of the radiator 42 ; and a portion of the airflow is blown toward the circuit board 41 through the gap between the top of the radiator 42 and the outer surface of the coil support 2 .

[0047] The air duct wall structure also includes a bracket air duct wall 23, which is used to guide the air flow through the gap between the top of the heat sink 42 and the outer surface of the coil bracket 2 to blow toward the components on the circuit board 41 and discharge the module from the middle or upper part of the bracket air duct wall 23.

[0048] The circuit board 41 may also be disposed on the upper portion of the heat sink 42 at an angle less than 30° relative to the vertical direction. The heat sink 42 may also be disposed on the side of the fan 5 at an angle less than 30° relative to the horizontal direction.

[0049] The arrangement of the coil support 2, fan 5, circuit board 41, radiator 42 and air duct wall is obviously different from the traditional up-and-down stacking arrangement, avoiding the problem that the axial upward airflow must complete the heat dissipation of both the coil disk 1 and the electronic control mainboard 4, greatly reducing the volume and assembly difficulty. The airflow is creatively and accurately controlled in a very compact structural space, and the airflow of the fan 5 is divided into three parts. The two tangential airflows are used for the heat dissipation of the circuit board 41 and the radiator 42 in the electronic control mainboard 4, and the axial airflow is used for the heat dissipation of the coil disk 1 (including the disk body, coil, magnetic strip, etc.), so that the three airflows have their own flow channels, can work independently, and do not interfere with each other, reducing the turbulence inside the shell, and also reducing energy loss. Multiple airflows flow through all the heat-generating components in the shell, basically filling up each space, and their outlets do not overlap, so that there is no so-called airflow "stagnation zone" in the heating module or even the entire shell, so that all the airflows in the space flow, and do not interfere with each other, each performing its own function and cooperating properly.

[0050] The fan 5 is arranged at a position close to the center below the coil disk 1, and the space at the bottom of the coil disk 1 can be fully utilized. Because the air inlet of the heat dissipation fan is mostly arranged on the bottom surface of the shell, and the fan height can be controlled to be relatively small, it is placed below the coil disk 1, which will not significantly increase the thickness of the rice cooker, and at the same time, the width of the side of the shell is significantly reduced, which can also be said to increase the space for arranging other components. Secondly, this arrangement makes the axial air outlet of the fan 5 very close to the coil disk 1, which can reduce the loss of wind pressure as much as possible, so that the airflow can flow better along the gap on the outer surface of the coil disk 1, and better dissipate heat for the entire coil disk 1. When the coil support 2 is a closed type that basically covers the coil disk 1, this arrangement can also play its advantages. The axial airflow almost does not need any extra parts to guide it, and can be directly blown into the gap between the coil disk 1 and the coil support 2 through the notch 21, and quickly flows to various parts of the coil disk 1 along the actual air duct composed of magnetic strips, coils, strip-shaped tendons, etc., and finally discharged from the heating module through the air outlet on the upper part of the coil disk 1.

[0051] The radiator 42 is arranged on the side of the fan 5, which effectively utilizes the tangential airflow of the fan 5, and the hot air blown out from the radiator 42 is directly discharged from the housing, and will not blow to other circuit board 41 components, nor will it interfere with other heat dissipation airflows, thereby ensuring the continuity and effectiveness of heat dissipation. In addition, under normal circumstances, the air guide groove of the radiator 42 will face the side of the fan 5 away from the center of the coil support 2, and the port of the radiator 42 air groove is basically flush with the side or lateral air outlet of the fan 5 in height, and the distance is very close, so that the tangential airflow of the fan 5 will directly enter the radiator 42 air groove with a large wind pressure and air volume, thereby improving the heat dissipation efficiency. Of course, the preferred method is that the thickness of the motor is basically the same as the thickness of the radiator, the heat dissipation fins are arranged vertically, and the extension direction is consistent with the airflow direction. In this way, when guiding the lateral airflow, the airflow will enter the heat dissipation fins of the radiator air groove more evenly. In addition, a base plate can be set under the heat dissipation fins, so that the flow of the airflow will be more directional. When the radiator's air slot direction is inconsistent with the air flow direction, additional guide components are required to send the air flow in the same direction as the air slot. In some special cases, such as when there are special requirements for the direction of the hot air flow, this method can be used. Figure 3 It can also be clearly seen that at least a portion of the radiator 42 is within the vertical projection range of the coil disk 1, that is, a considerable portion of the volume of the radiator 42 is within the space at the lower side of the coil disk 1, so that this part of the extra space can be fully utilized, which is particularly beneficial for products such as rice cookers and electric pressure cookers. In addition, since the radiator 42 is placed horizontally, its upper cover separates the hot air from other components of the electronic control motherboard 4, and also plays a role in guiding the tangential airflow passing through the gap to other components, which is equivalent to using the radiator 42 to additionally realize the role of the bottom wall of the air duct, further saving space and improving the airflow path. Of course, the so-called horizontal setting is not absolute, and should be understood as being roughly horizontal, such as being within an inclination of 5°, which is within the allowable range. As long as the space around the coil support can be fully utilized, the radiator 42 can also be set on the side of the fan 5 at an angle less than 30° relative to the horizontal direction.

[0052] The circuit board 41 is arranged vertically, preferably with the short side at the bottom and the long side at the side, but the purpose of the present invention can also be achieved with the long side at the bottom. With the short side at the bottom, most of its components can be kept away from the bottom and bottom edge areas of the coil disk 1 where the electromagnetic interference is the strongest, which is beneficial to protecting the components. For products such as rice cookers and electric pressure cookers, the circuit board 41 is arranged vertically to make full use of the depth of the pot body and save space to the maximum extent. For the present invention, the circuit board 41 is erected on the radiator 42, and the most preferred position is the end of the radiator 42 away from the fan 5. In this way, an L-shaped structure is formed. Of course, this is only a rough L shape, as shown in the attached figure. Figure 3As shown. The L-shape is used here to describe the side shape of the electronic control main board 4 in order to clearly and simply describe the positional relationship between the circuit board and the radiator. It does not limit the electronic control main board 4 to be an L-shape when viewed from the side. In fact, this is impossible because the thickness of the radiator 42 is different from that of the circuit board 41, and various components are also arranged on the circuit board 41. The two sides of the L-shaped structure can also be allowed to have a certain degree of inclination, because in special cases, the radiator and the circuit board will be arranged at an angle, and the L-shape formed at this time will not be a standard L-shape; in addition, if the circuit board 41 is not arranged close to the edge of the radiator 42, such as being arranged a little away from the left edge, the entire electronic control main board 4 will not look like a standard L-shape. However, these settings can be roughly regarded as an L-shape, and all of them can achieve the purpose of the present invention. The tangential airflow blown out from the fan 5, in addition to most of it flowing to the radiator 42, a part of the tangential airflow blows from the bottom to the top through the gap between the end of the fan 5 and the outer wall of the coil support 2 near the radiator 42 to the other parts of the electric control main board 4. Although the heat of this part of the components is not very intense, the new airflow channel is formed, the heat dissipation is more uniform, the heat dissipation efficiency is improved, and all possible air ducts are effectively utilized, so that the airflow in the shell flows fully, and a positive wind pressure is formed around the electric control main board 4, filling the space behind the circuit board, and preventing the hot air generated by other heat dissipation components from flowing back to the area of ​​the circuit board. Of course, the electric control main board 4 can also be set at other positions on the upper part of the radiator 42, and even the surface where the components of the circuit board 41 are located can not face the fan 5. Although these non-preferred arrangements are better than the arrangements of the prior art, they can achieve the purpose of saving space and cost of this patent. However, in terms of heat dissipation efficiency and space utilization, compared with the preferred method, they will be weakened, and some arrangements will even increase the shell space occupied by the said part. Of course, the so-called vertical setting is not absolute, and should be understood as being approximately vertical. For example, an inclination within 5° is within the allowable range. As long as the space around the coil holder can be fully utilized, the circuit board 41 can also be set on the upper part of the radiator 42 at an angle less than 30° relative to the vertical direction. For example, when there is sufficient space on the lower side of the coil holder 2, it is possible to consider setting the circuit board 41 obliquely on the upper part of the radiator 42, with one end extending into the lower side of the coil holder 2 and the other end being set as far as possible within the range of the radiator. In this way, the height occupied by the circuit board can be further reduced, making the structure compact. At the same time, the heat dissipation airflow can still blow over the surface of the components on the circuit board.

[0053] In the heating module, the coil support 2 can be used as the main assembly part, that is, the coil disk 1, the electronic control main board 4, the fan 5, the temperature measuring component 6, the air duct wall and other components can be assembled with the coil support 2 as the reference, and these components can make full use of the space around, below and directly below the coil support 2, so that the originally scattered components are concentrated near the coil support 2 and integrated into a standard module with a very small size. Each component can find a mounting structure corresponding to itself on the coil support 2, and each component can be directly plugged into the coil support 2 during production. Therefore, the heating module of the present invention is very simple to install, the position accuracy between the various components is very high, and it is very convenient to repair and replace related components. In addition, the compact structure can also make the module highly versatile and low in comprehensive cost. It can be used as a universal component or module for various types or models of electric rice cookers, electric pressure cookers and electric rice cookers with induction coil heating of arc-shaped inner pots. Designers only need to complete some additional functions, as well as the appearance, shell and panel design of the product to develop new products, and the whole machine development cycle is significantly shortened and the cost is significantly reduced.

[0054] refer to Figure 1-2 The coil disk 1 in the present invention is in the shape of a container that is concave downward. Figure 1 In this embodiment, the coil disk 1 is roughly bowl-shaped. In a preferred embodiment, the coil support 2 is wrapped outside the coil disk 1, and the shape of the coil support 2 matches the coil disk 1. In this case, a basically closed space containing the coil 3 is formed between the coil disk 1 and the coil support 2. This design uses the existing coil disk 1 and coil support 2 to form a number of air ducts surrounding the coil, which is conducive to guiding the axial airflow blown upward by the fan 5 to quickly pass through and flow out of the module, and prevent the heat of the coil disk 1 from diffusing to the area where the heat dissipation is not smooth. Of course, the coil support 2 can also be a non-enclosed structure. In this case, the coil support 2 does not cover all areas of the coil disk 1, but only retains a support bracket and a magnetic strip support that are sufficient to support the coil disk 1. In this case, although the weight and production cost are reduced, and the main purpose of the present invention can also be achieved, the control of the module volume is better, but the heat dissipation effect is inevitably reduced, and the control of the airflow is also seriously reduced.

[0055] refer to Figure 2 A fan mounting structure 25 is arranged at the center of the outer bottom of the coil support 2. The fan mounting structure 25 mainly comprises two fan fixing ears.

[0056] In order to guide the wind blown by the fan 5 to the electronic control mainboard 4 and discharge the heat, the present invention sets a duct wall structure on the side and bottom of the coil support 2. Of course, in different embodiments, the fan duct wall structure can also be set on the fan.

[0057] The duct wall structure includes a fan duct wall 22 and a bracket duct wall 23. The fan duct wall 22 is used to guide the lateral airflow generated by the fan 5 to the direction of the radiator 42 and the circuit board 41; the bracket duct wall 23 is used to guide the airflow passing through the gap between the top of the radiator 42 and the outer surface of the coil bracket 2 to blow to the components on the circuit board 41, and discharge the module from the upper part of the bracket duct wall 23 (above the circuit board). In theory, the duct wall structure can include the fan duct wall 22 alone, and this design can also basically achieve the purpose of the invention of the present invention. However, since there is no duct wall set between the circuit board 41 and the outer shell of the coil bracket 2, the airflow passing through the gap between the top of the radiator 42 and the outer surface of the coil bracket 2 can only be roughly blown in the direction of the circuit board, and the airflow blowing to the circuit board will also be scattered around the circuit board due to the lack of good duct guidance, which sometimes causes the shell temperature to rise and the heat dissipation efficiency is affected.

[0058] Specifically, the fan duct wall 22 of this embodiment includes:

[0059] The first air duct wall 201 has two ends respectively connected to two ends of the fan mounting structure 25 away from the electric control main board 4, and surrounds one side of the fan 5. Preferably, the first air duct wall 201 is arc-shaped.

[0060] Two second air duct walls 202, the head ends of the two second air duct walls 202 are respectively connected to the two ends of the fan mounting structure 25 close to the electric control main board 4, and each second air duct wall 202 extends in a direction gradually away from the opposite second air duct wall 202 and toward the electric control main board 4. Preferably, the two second air duct walls 202 are tangent to the first air duct wall 201 and extend in the direction of the electric control main board 4 in a fan shape.

[0061] The two fifth air duct walls 205 correspond to the two second air duct walls 202 one by one. Each fifth air duct wall 205 starts from a position close to the head end of the corresponding second air duct wall 202 and extends in a direction gradually approaching the opposite fifth air duct wall 205 and toward the electronic control mainboard 4.

[0062] Of course, the fan air duct wall 22 may also include a sixth air duct wall (not shown) for guiding part of the axial airflow to the tangential direction.

[0063] The bracket air duct wall 23 includes:

[0064] The two third air duct walls 203 start from the tail ends of the two second air duct walls 202, extend outward in a direction away from the second air duct walls 202, and then extend upward along the outer side of the coil support 2 to a position close to the top of the coil support 2. Preferably, the two third air duct walls 203 are arranged substantially parallel to the symmetric planes of the two fan fixing ears of the fan mounting structure 25.

[0065] The fourth air duct wall 204 is located near the top of the coil support 2 and is connected to the extended ends of the two third air duct walls 203 ; wherein the electronic control main board 4 is fixed in the air duct cavity formed by the two third air duct walls 203 and the fourth air duct wall 204 .

[0066] Of course, when the coil support 2 is in a non-enclosed form, the support air duct wall 23 may also include a seventh air duct wall (not shown) for shielding a portion of the outer surface of the coil support 2, and the seventh air duct wall may effectively separate the airflows blowing toward the coil support 2 and the circuit board 41 to avoid mutual interference. However, the effect of this separation is not as good as that of the enclosed coil support.

[0067] In addition, in other embodiments, the air duct wall structure can also be designed as an integrated structure, or a nearly integrated structure. In fact, the air duct wall structure can be any known airflow guiding structure, as long as it can complete the function of guiding the airflow to the electronic control mainboard.

[0068] Combination Figure 3 The air duct paths that the airflow in this embodiment passes through are mainly the following three types:

[0069] Air duct 1: The airflow enters from the bottom of the fan 5 and blows out from the side. The airflow blown out from the side is gathered by the fifth air duct wall 205 to form wind pressure. A part of the airflow blows toward the radiator 42, passes through the rack surface of the radiator 42, and takes the heat out of the module. Figure 3 As shown in F1.

[0070] Air duct 2: The airflow enters from the bottom of the fan 5 and blows out from the side. The airflow blown out from the side of the fan 5 is gathered by the second air duct wall 202 and the fifth air duct wall 205 to form wind pressure. A part of the airflow blows toward the circuit board 41 through the gap between the top of the radiator 42 and the outer surface of the coil support 2, and then passes through the components on the circuit board 41 and the fence groove on the fourth air duct wall 204 from bottom to top and is discharged to the outside of the module. Figure 3 As shown in F2.

[0071] Air duct 3: The airflow enters from the bottom of the fan 5 and is blown out from the top. The airflow blown out from the top of the fan 5 is discharged to the outside of the module through the gap 21 at the bottom of the coil support 2 and the gap between the inner surface of the coil support 2 and the outer surface of the coil disk 1. Figure 3 As shown in F3.

[0072] In summary, the core of implementing the heating module of the present invention lies in the control of the module volume and the precise control of the heat dissipation airflow direction. It has the following beneficial effects: the heating module of the present invention uses the coil bracket as the main assembly part, and integrates the coil disk, the electronic control mainboard, the fan, the temperature measurement component, and the airflow duct into a very small standard module, which is easy to install, highly versatile, and low in comprehensive cost. The development cycle of the whole machine is significantly shortened, and the heat dissipation effect is good. It can be applied to IH rice cookers, pressure cookers and other cooker products.

[0073] The embodiments of the present invention are described above in conjunction with the accompanying drawings, but the present invention is not limited to the above-mentioned specific implementation methods. The above-mentioned specific implementation methods are merely illustrative and not restrictive. Under the enlightenment of the present invention, ordinary technicians in this field can also make many forms without departing from the scope of protection of the purpose of the present invention and the claims, which all fall within the protection of the present invention.

Claims

1. A heating module, characterized in that: include: A coil disk (1), a coil support (2) covering the outside of the coil disk (1), an electric control mainboard (4), a fan (5) and an air duct wall structure, wherein the coil disk (1) is sleeved inside the coil support (2), and the heating module is a module that uses the coil support (2) as a main assembly component, and integrates the coil disk (1), the electric control mainboard (4), the fan (5) and the air duct into a standard module of very small size; the fan (5) is arranged below the bottom of the coil support (2), and the projection of the center of the fan (5) is located within the projection of the coil disk (1), and the projection refers to the depth along the coil support (2). The projection is also parallel to the projection of the plane where the bottom of the coil support (2) is located, the electric control mainboard (4) comprises a circuit board (41) and a heat sink (42), the heat sink (42) is horizontally arranged on the side of the fan (5), the port of the air slot of the heat sink (42) is directly facing the side of the fan (5), the circuit board (41) is parallel to the axial direction of the coil support (2), the circuit board (41) is vertically arranged on the upper part of the heat sink (42) and the two form an L shape, and the air duct wall structure is used to guide the airflow from the side of the fan (5) to the direction of the electric control mainboard (4); A notch (21) is provided at the bottom of the coil support (2); the axial airflow blown out from the top of the fan (5) enters the gap between the coil support (2) and the coil disk (1) through the notch (21) and is discharged outside the module to dissipate heat from the coil disk; a portion of the tangential airflow blown out from the side of the fan (5) is blown toward the air slot of the radiator (42) to dissipate heat from the radiator (42); a portion of the tangential airflow is blown toward the circuit board (41) through the gap between the top of the radiator (42) and the outer surface of the coil support (2) to dissipate heat from the circuit board (41); Wherein, the air duct wall structure further includes: The first air duct wall (201) is arc-shaped and surrounds one side of the fan (5); Two second air duct walls (202), each second air duct wall (202) extending in a direction gradually away from the opposite second air duct wall (202) and towards the electric control main board (4); Two third air duct walls (203), starting from the rear ends of the two second air duct walls (202), extending outwards in a direction away from the second air duct walls (202), and then extending upwards along the outer side of the coil support (2) to a position close to the top of the coil support (2); The fourth air duct wall (204) is located near the top of the coil support (2) and is connected to the extended ends of the two third air duct walls (203); Two fifth air duct walls (205) correspond one to one with the two second air duct walls (202), and each fifth air duct wall (205) starts from a position close to the head end of the corresponding second air duct wall (202) and extends in a direction gradually approaching the opposite fifth air duct wall (205) and towards the electric control main board (4); A support air duct wall (23) is used to guide the airflow passing through the gap between the top of the heat sink (42) and the outer surface of the coil support (2) to blow toward the components on the circuit board (41) and discharge the module from the middle or upper part of the air duct wall structure; The projection of the fan (5) is located within the projection of the coil disk (1), the projection of the heat sink (42) is at least partially located within the projection of the coil disk (1), and the projection of the circuit board (41) does not intersect with the projection of the coil disk (1).

2. The heating module according to claim 1, characterized in that: The fan mounting structure (25) is arranged at a position below the bottom of the coil support (2) and close to the center.

3. The heating module according to claim 1, characterized in that: The circuit board (41) is arranged on the upper part of the heat sink (42) at an angle less than 30° relative to the vertical direction.

4. The heating module according to claim 1, characterized in that: The radiator (42) is arranged on the side of the fan (5) at an angle less than 30° relative to the horizontal direction.

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