An anti-reverse device for LED chip die bonding and its usage method

Abstract

An anti-reverse device for LED chip die bonding and its usage method, which relates to the technical field of LED packaging; it includes an LED die bonding seat, an LED blue film expansion ring, an image sensor, a relay, a CCD photosensitive lens, a host processor, and a display device; an LED blue film expansion ring is arranged on the LED die bonding seat, and an image sensor is arranged at the bottom edge inside the LED die bonding seat; both ends of the relay are respectively connected to the image sensor and the CCD photosensitive lens; the host processor is respectively connected to the CCD photosensitive lens and the display device. The beneficial effects produced by the present invention are as follows: It realizes that the direction of the chip electrode is consistent with the direction required for die bonding of the bracket, avoids the risk of reverse die bonding, and at the same time solves the trouble of manual debugging of the chip expansion ring placed manually, improving the operation efficiency.

Description

Technical Field

[0001] The present invention relates to the technical field of LED packaging, and particularly relates to a device for preventing reverse placement of LED chips during die bonding and a method for using the same. Background Art

[0002] As is well known, the first step in LED packaging is die bonding, that is, the LED chips are mounted on the silver-plated functional area of the LED bracket cup through an LED die bonder. The die bonding process is the front end of the wire bonding process and is crucial. Since LED chips have positive and negative poles, and the LED bracket also has corresponding positive and negative pole die bonding areas, the placement position of the LED chips in the bracket cup is restricted by the positive and negative poles. For example, when only one chip is die bonded on the LED bracket, the positive pad direction of the LED chip should face the positive pole die bonding area of the LED bracket, and the negative pad direction of the LED chip should face the negative pole die bonding area of the LED bracket, which facilitates the smooth operation of wire bonding. If the positive and negative poles of the chip are reversed, normal wire bonding cannot be carried out according to the normal wire bonding mode. If the reverse polarity wire bonding mode is used, the LED lamp beads will have reverse polarity, which will cause unnecessary trouble to the products of the client.

[0003] Secondly, when the LED chips are received, they are arranged in an array on the blue film. Before die bonding, the blue film needs to be expanded, that is, the blue film is pressed together by circular upper and lower expansion rings. After the expansion is completed, it is placed on the die bonding seat of the LED die bonder. Since the die bonding seat is circular, when manually placing the expanded blue film, the expansion ring needs to be rotated and the relative position between the chips on the blue film and the blue film needs to be adjusted by the chip pattern image captured by the photosensitive lens on the LED die bonder to ensure that the electrode direction of the chips transferred to the die bonding area of the LED bracket is correct. Before the initial die bonding debugging, the LED die bonder will perform chip electrode comparison and correction. The patterns of the chips on the chip blue film ring are captured by the photosensitive lens and stored in the device computer. After replacing the expansion ring during the die bonding operation, when the LED die bonder performs chip electrode comparison, it only recognizes the pattern of the first chip. When the pattern of the first chip is similar to the chip electrode pattern stored in the computer by no less than a preset similarity, the computer determines that the chip position on the blue film is correct, otherwise an alarm will be issued and die bonding cannot be carried out.

[0004] Moreover, since not every chip surface pattern is clear when the LED chips leave the factory, there will be some unclear patterns, and there will also be cases where the chip electrode shapes are similar. When the LED die bonder performs the first electrode recognition and encounters unclear patterns and electrodes, misjudgment may occur. If die bonding continues after misjudgment, the chip positions of the entire blue film will be reversed, which will then lead to abnormal wire bonding in the subsequent process and unnecessary waste of chips.

[0005] Meanwhile, since the LED brackets are placed in different directions on the die bonding equipment, there are horizontal and vertical placements. Therefore, when bonding LED chips, there are also horizontal and vertical chip orientations. Each time an operator replaces the LED chip expander ring, they need to use a CCD photosensitive lens to check the position of the chip and make corresponding rotational adjustments. This kind of operation greatly reduces the working efficiency of the packaging industry.

[0006] In summary, factors such as manually placing the LED chip expander ring and unclear chip electrode patterns are all influencing factors for incorrect die bonding positions of LED chips. At the same time, manually adjusting the position of the expander ring when replacing the LED chip expander ring will also reduce the working efficiency. Summary of the Invention

[0007] The purpose of the present invention is to provide a die bonding anti-reversal device for LED chips and its usage method that can solve the problem of incorrect die bonding caused by placing the chip in the wrong direction or misidentifying the chip electrode pattern, aiming at the defects and deficiencies of the prior art.

[0008] To achieve the above purpose, the technical solution adopted by the present invention is: A die bonding anti-reversal device for LED chips, which includes an LED die bonding base, an LED blue film expander ring, an image sensor, a relay, a CCD photosensitive lens, a host processor, and a display device; the LED blue film expander ring is arranged on the LED die bonding base, and an image sensor is arranged at the bottom edge inside the LED die bonding base; both ends of the relay are respectively connected to the image sensor and the CCD photosensitive lens; the host processor is respectively connected to the CCD photosensitive lens and the display device.

[0009] Preferably, an identification card is attached to the LED blue film expander ring, and the identification card is attached to the blank blue film area on the positive side of the LED chip. The color of the identification card is color, and the shape is rectangular or square.

[0010] Preferably, the LED die bonding base is used to place the LED blue film expander ring, and the LED die bonding base 1 is connected with a rotating motor to drive the LED die bonding base to rotate in the horizontal position, and the rotation angle is 0° - 360°.

[0011] Preferably, the number of the image sensors is four, and they are evenly distributed in a circle at the bottom edge inside the LED die bonding base, and are used to detect whether there is a pre-attached identification card on the LED blue film expander ring.

[0012] Preferably, the relay is used to convert the image signal obtained by the image sensor into an electrical signal to control the startup of the CCD photosensitive lens.

[0013] Preferably, the CCD photosensitive lens is used to capture the pattern of the LED chip on the blue film of the LED blue film expansion ring, and transmit the information to the host processor for comparison processing.

[0014] Preferably, the host processor is used to control the debugging, operation, and alarm display output of the entire LED die bonding equipment.

[0015] Preferably, the display device is used to display the LED die bonding operation page and the image and alarm error information during the debugging process.

[0016] A method for using an LED chip bonding and anti-reverse device comprises the following steps:

[0017] 1. Pre-attach a label card to the bottom of the blue film with the LED chip, with the label card located in the positive direction of the chip.

[0018] 2. Preset the LED chip bonding position in the bracket, and determine the placement position of the LED chip expansion ring in the LED bonding seat by placing the bracket in the bonding area of the bonding equipment. The preset LED chip bonding position in the bracket can be divided into two types, one is horizontal placement and the other is vertical placement.

[0019] 3. Place the LED chip expansion ring with the identification card on the LED solid crystal seat, and randomly align the position of the identification card with one of the image sensors.

[0020] 4. After the identification card is detected by the image sensor, the signal is transmitted to the relay, and the relay controls the CCD photosensitive lens to open.

[0021] 5. The CCD photosensitive lens collects the LED chip pattern and transmits the pattern information to the host controller, which is then displayed on the screen by the display device.

[0022] 6. The host processor will perform PR recognition based on the preset LED chip placement position, that is, by identifying the texture on the surface of the LED chip to determine whether the positive and negative positions of the LED chip match the LED bracket solid crystal position.

[0023] 7. If the chip texture captured by the CCD photosensitive lens is consistent with the PR recognition preset in the host processor, and the chip placement direction is consistent, the host processor determines that the chip blue film ring is placed correctly, and the die bonding operation is performed.

[0024] 8. If the PR recognition result shows that the placement direction of the chip is inconsistent with the preset direction, the rotation motor under the LED die bonding seat will be activated to rotate the LED die bonding seat together with the LED chip expansion ring counterclockwise or clockwise by a certain angle, which is fixed at 90° and 180°. Then, after the identification card is detected by the image sensor at the corresponding angular position, the CCD photosensitive lens is activated to collect the chip pattern and compare it with the preset PR recognition position. If they are the same, the host processor determines that the chip expansion ring is placed correctly, and then the die bonding operation is carried out.

[0025] After adopting the above structure and usage method, the beneficial effects of the present invention are as follows: The positive side of the chip is pre-identified on the LED chip expansion blue film with an identification card. Compared with the prior art, this improvement determines the positive direction of the chip. One of the image sensors on the die bonding seat is used to identify the identification card to activate the CCD photosensitive lens to collect the chip pattern, and then determine whether the positive and negative directions of the chip on the blue film are consistent with the preset PR direction. If they are consistent, the die bonding operation is carried out; if not, the host processor issues an alarm and calculates the angle required for the LED chip to reach the PR direction. At the same time, the motor under the die bonding seat is driven to rotate, and the LED chip expansion ring is rotated clockwise or counterclockwise by 90° or 180°. Then, the second image sensor is used to identify the identification card to activate the CCD photosensitive lens to collect the chip pattern on the blue film and make a judgment until the positive and negative directions of the chip on the blue film are consistent with the preset PR direction, and then the die bonding operation is carried out. Such a device and its usage method can realize automatic PR recognition during the die bonding placement of LED chips, take the positive direction of the chip as the target reference, automatically adjust the position of the chip expansion ring on the die bonding seat, make the chip electrode direction consistent with the direction required for die bonding on the bracket, avoid the risk of reverse die bonding, and at the same time solve the trouble of manual debugging for manually placing the chip expansion ring, improving the operation efficiency. Description of the Drawings

[0026] Figure 1 is the structure diagram of the present invention;

[0027] Figure 2 is the structure diagram of the LED blue film expansion ring of the present invention.

[0028] Description of the Reference Numerals in the Drawings:

[0029] LED die bonding seat 1, LED blue film expansion ring 2, image sensor 3, relay 4, CCD photosensitive lens 5, host processor 6, display device 7, identification card 8, rotation motor 9, LED chip 10. Detailed Embodiments

[0030] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for the description of the embodiments or the prior art. Obviously, the drawings in the following description are only some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0031] See, for example, Figure 1 —— Figure 2 As shown, the following technical solutions are adopted in this specific embodiment: A device for preventing reverse mounting of LED chips during die bonding includes an LED die bonding base 1, an LED blue film expanding ring 2, an image sensor 3, a relay 4, a CCD photosensitive lens 5, a host processor 6, and a display device 7. An LED blue film expanding ring 2 is provided on the LED die bonding base 1, and an image sensor 3 is provided at the bottom edge inside the LED die bonding base 1. Both ends of the relay 4 are respectively connected to the image sensor 3 and the CCD photosensitive lens 5. The host processor 6 is respectively connected to the CCD photosensitive lens 5 and the display device 7.

[0032] Preferably, an identification card 8 is mounted on the LED blue film expanding ring 2. The identification card 8 is mounted on the blank blue film area on the positive electrode side of the LED chip 10. The color of the identification card is colored, and the shape is rectangular or square.

[0033] Preferably, the LED die bonding base 1 is used to place the LED blue film expanding ring 2. The LED die bonding base 1 is connected to a rotating motor 9, which drives the LED die bonding base 1 to rotate in the horizontal position, and the rotation angle is 0° - 360°.

[0034] Preferably, the number of the image sensors 3 is four, and they are evenly distributed in a circle at the bottom edge inside the LED die bonding base 1, and are used to detect whether there is a pre-mounted identification card 8 on the LED blue film expanding ring 2.

[0035] Preferably, the relay 4 is used to convert the image signal obtained by the image sensor into an electrical signal to control the startup of the CCD photosensitive lens 5.

[0036] Preferably, the CCD photosensitive lens 5 is used to capture the pattern of the LED chip 10 on the blue film of the LED blue film expanding ring 2, and transmit the information to the host processor 6 for comparison and processing.

[0037] Preferably, the host processor 6 is used to control the debugging, operation, and alarm display output of the entire LED die bonding device.

[0038] Preferably, the display device 7 is a display, which is used to display the LED die bonding operation page, the image during the debugging process, and the alarm error information.

[0039] A method for using an LED chip bonding and anti-reverse device comprises the following steps:

[0040] 1. Pre-attach a label card to the bottom of the blue film with the LED chip, with the label card located in the positive direction of the chip.

[0041] 2. Preset the LED chip bonding position in the bracket, and determine the placement position of the LED chip expansion ring in the LED bonding seat by placing the bracket in the bonding area of the bonding equipment. The preset LED chip bonding position in the bracket can be divided into two types, one is horizontal placement and the other is vertical placement.

[0042] 3. Place the LED chip expansion ring with the identification card on the LED solid crystal seat, and randomly align the position of the identification card with one of the image sensors.

[0043] 4. After the identification card is detected by the image sensor, the signal is transmitted to the relay, and the relay controls the CCD photosensitive lens to open.

[0044] 5. The CCD photosensitive lens collects the LED chip pattern and transmits the pattern information to the host controller, which is then displayed on the screen by the display device.

[0045] 6. The host processor will perform PR recognition based on the preset LED chip placement position, that is, by identifying the texture on the surface of the LED chip to determine whether the positive and negative positions of the LED chip match the LED bracket solid crystal position.

[0046] 7. If the chip texture captured by the CCD photosensitive lens is consistent with the PR recognition preset in the host processor, and the chip placement direction is consistent, the host processor determines that the chip blue film ring is placed correctly, and the die bonding operation is performed.

[0047] 8. If the PR recognition result shows that the chip placement direction is inconsistent with the preset direction, the rotating motor under the LED solid crystal seat is started to rotate the LED solid crystal seat together with the LED chip expansion ring counterclockwise or clockwise for a certain angle, which is fixed at 90° and 180°. After the image sensor at the corresponding angle position detects the identification card, the CCD photosensitive lens is started to collect the chip pattern and compare it with the preset PR recognition position. If they are the same, the host processor determines that the chip expansion ring is placed correctly, and the solid crystal operation is performed.

[0048] After adopting the above structure and usage method, the beneficial effects of this specific embodiment are as follows: The positive electrode side of the chip is pre-identified by an identification card on the LED chip expansion blue film. Compared with the prior art, this improvement determines the positive electrode direction of the chip. One of the image sensors on the die bonding base identifies the identification card to activate the CCD photosensitive lens to collect the chip pattern, and judges whether the positive and negative electrode directions of the chip on the blue film are consistent with the preset PR direction. If they are consistent, die bonding operation is carried out. If they are not consistent, the host processor issues an alarm and calculates the angle required for the LED chip to rotate to the PR direction. At the same time, the motor under the die bonding base is driven to rotate, and the LED chip expansion ring is rotated clockwise or counterclockwise by 90° or 180°. Then, the second image sensor identifies the identification card to activate the CCD photosensitive lens to collect the chip pattern on the blue film and make a judgment until the positive and negative electrode directions of the chip on the blue film are consistent with the preset PR direction, and then die bonding operation is carried out. Such a device and its usage method can realize automatic PR identification during the die bonding placement of LED chips. Taking the positive electrode direction of the chip as the target reference, the position of the chip expansion ring on the die bonding base is automatically adjusted to make the electrode direction of the chip consistent with the direction required for die bonding of the bracket, avoiding the risk of incorrect die bonding and solving the trouble of manual debugging of the chip expansion ring placed manually, thus improving the operation efficiency.

[0049] The above shows and describes the basic principles, main features and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited by the above embodiments. What is described in the above embodiments and the specification only illustrates the principles of the present invention. Without departing from the spirit and scope of the present invention, the present invention will have various changes and improvements, and these changes and improvements all fall within the scope of the present invention claimed. The scope of protection claimed by the present invention is defined by the appended claims and their equivalents.

Claims

1. A device for preventing reverse placement of LED chips during die bonding, characterized in that: It comprises an LED solid crystal seat, an LED blue film crystal expansion ring, an image sensor, a relay, a CCD photosensitive lens, a host processor, and a display device; the LED solid crystal seat is provided with an LED blue film crystal expansion ring, and an image sensor is provided at the bottom edge of the LED solid crystal seat; the two ends of the relay are respectively connected to the image sensor and the CCD photosensitive lens; the host processor is respectively connected to the CCD photosensitive lens and the display device; an identification card is attached to the LED blue film crystal expansion ring, and the identification card is attached to the blank blue film area on the positive side of the LED chip; the LED solid crystal seat is used to place the LED blue film crystal expansion ring, and the LED solid crystal seat 1 is connected to The rotating motor drives the LED crystal holder to rotate in a horizontal position; the image sensors are evenly distributed in a circle on the bottom edge of the LED crystal holder to detect whether there is a pre-mounted identification card on the LED blue film crystal expansion ring; the relay is used to convert the image signal obtained by the image sensor into an electrical signal to control the start of the CCD photosensitive lens; the CCD photosensitive lens is used to capture the pattern of the LED chip on the blue film of the LED blue film crystal expansion ring, and transmit the information to the host processor for comparison processing; the host processor determines whether the positive and negative pole positions of the LED chip match the LED bracket crystal fixing position by identifying the texture on the surface of the LED chip.

2. A method for using an LED chip bonding anti-reverse device, comprising the following steps: (1) Pre-attach an identification card to the bottom of the blue film with the LED chip, with the identification card located in the positive direction of the chip; (2) Presetting the bonding position of the LED chip in the bracket, and determining the placement position of the LED chip expansion ring in the LED bonding seat by placing the bracket in the bonding area of the bonding device; the preset bonding position of the LED chip in the bracket is divided into two types, one is horizontal placement and the other is vertical placement; (3) Place the LED chip expansion ring with the identification card on the LED solid crystal seat, and randomly align the position of the identification card with one of the image sensors; (4) After the identification card is detected by the image sensor, the signal is transmitted to the relay, and the relay controls the CCD photosensitive lens to open; (5) The CCD photosensitive lens collects the LED chip pattern and transmits the pattern information to the host controller, which is then displayed on the screen by the display device; (6) The host processor will perform PR recognition based on the preset LED chip placement position, that is, by identifying the texture on the surface of the LED chip to determine whether the positive and negative positions of the LED chip match the LED bracket die-bonding position; (7) If the chip texture captured by the CCD photosensitive lens is consistent with the PR recognition preset in the host processor, and the chip placement direction is consistent, the host processor determines that the chip blue film ring is placed correctly, and the die bonding operation is performed; (8) If the PR recognition result shows that the placement direction of the chip is inconsistent with the preset direction, the rotation motor under the LED die bonding seat is activated to rotate the LED die bonding seat together with the LED chip expansion ring counterclockwise or clockwise by a certain angle, and these angles are fixed at 90° and 180°; after detecting the identification card by the image sensor at the corresponding angular position, the CCD photosensitive lens is activated to collect the chip pattern and compare it with the preset PR recognition position. If they are the same, the host processor determines that the chip expansion ring is placed correctly, and then the die bonding operation is performed.

3. A die bonding anti-reverse device for an LED chip according to claim 1, characterized in that: The color of the identification card is color, and the shape is rectangular or square.

4. A die bonding anti-reverse device for an LED chip according to claim 1, characterized in that: The rotation angle of the LED die bonding seat in the horizontal position is 0° - 360°.

5. A die bonding anti-reverse device for an LED chip according to claim 1, characterized in that: The number of the image sensors is four.

6. The one kind of LED chip die bonding anti-reverse device according to claim 1, characterized in that: The host processor is used to control the debugging, operation, and alarm display output of the entire LED die bonding equipment.

7. A die bonding anti-reverse device for an LED chip according to claim 1, characterized in that: The display device is used to display the LED die bonding operation page, the image during debugging, and the alarm error information.

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