Display device

Abstract

A display device, comprising: a display module including a display area and a non-display area; a protective layer on a lower surface of the display module and including an opening area overlapping with the display area; a sensor unit overlapping with the display area, covering the opening area, and disposed on the protective layer; and an adhesive member adhering the sensor unit and the protective layer.

Description

[0001] Cross - reference to related applications

[0002] This application claims the priority and benefit of Korean Patent Application No. 10 - 2018 - 0047524, filed with the Korean Intellectual Property Office on April 24, 2018, the entire contents of which are incorporated herein by reference. Technical field

[0003] Aspects of embodiments of the present disclosure relate to a display device. Background art

[0004] Various display devices have been developed for use in multimedia devices such as televisions, mobile phones, tablet computers, navigation units, game units, etc.

[0005] Each display device includes a display panel to display an image. The display panel includes gate lines, data lines, and pixels connected to the gate lines and the data lines. In addition, the display device includes a display area through which an image is displayed and a non - display area disposed adjacent to the display area.

[0006] In recent years, various display devices have been developed to reduce the non - display area and increase the display area. In this case, since the non - display area is reduced, drive components disposed in the non - display area may partially overlap the display area. As an example, a display device including a fingerprint recognition sensor disposed to overlap the display area has been proposed.

[0007] On the other hand, drive components may be attached to the display panel using a resin. When ultraviolet rays are irradiated onto the display panel from the lower side of the display panel to cure the resin, the irradiated ultraviolet rays may reach not only the resin but also the organic light - emitting layer of the display module. Therefore, the organic light - emitting layer is deteriorated. Summary of the invention

[0008] According to aspects of embodiments of the present disclosure, a display device may prevent ultraviolet rays irradiated from the lower side of the display module from reaching a substrate after passing through a protective layer. According to aspects of embodiments, the display device includes a fingerprint recognition sensor that overlaps the display area.

[0009] According to one or more embodiments of the present disclosure, a display device includes a display module, a protective layer, a sensor unit, and an adhesive member, wherein the display module includes a display area and a non - display area; the protective layer is on a lower surface of the display module and includes an opening area that overlaps the display area; the sensor unit overlaps the display area, covers the opening area, and is disposed on the protective layer; and the adhesive member adheres the sensor unit and the protective layer.

[0010] In one or more embodiments, the sensor unit includes a sensor overlapping an opening area and an encapsulation attached to a protective layer by an adhesive member, and the sensor is mounted on the encapsulation.

[0011] In one or more embodiments, when observed in a plan view of the display module, the area of the opening area is larger than the area of the sensor and smaller than the area of the encapsulation.

[0012] In one or more embodiments, the sensor includes a fingerprint recognition sensor.

[0013] In one or more embodiments, the display area includes a sensor area, and the sensor area overlaps with the sensor.

[0014] In one or more embodiments, the protective layer includes an ultraviolet absorber for absorbing ultraviolet rays.

[0015] In one or more embodiments, the display device further includes a light blocking layer and a buffer layer, wherein the light blocking layer is on the protective layer and includes a first hole area defined through the light blocking layer and overlapping with the sensor unit; the buffer layer is on the light blocking layer and includes a second hole area defined through the buffer layer and overlapping with the first hole area, and when observed in a plan view of the display module, each of the area of the first hole area and the area of the second hole area is larger than the area of the sensor unit.

[0016] In one or more embodiments, the light blocking layer includes a double-sided tape for adhering the protective layer and the buffer layer.

[0017] In one or more embodiments, the area of the first hole area is equal to the area of the second hole area.

[0018] In one or more embodiments, the display device further includes a circuit board electrically connected to the display module and disposed under the protective layer, and a hole area is defined through the circuit board overlapping with the sensor unit.

[0019] In one or more embodiments, when observed in a plan view of the display module, the area of the hole area is larger than the area of the sensor unit.

[0020] In one or more embodiments, the display device further includes a circuit board disposed under the protective layer and including a timing controller for applying a driving signal to the display module, and the sensor unit is electrically connected to the timing controller through a through hole defined through the circuit board and overlapping with the opening area.

[0021] In one or more embodiments, the display module includes: a substrate on which a protective layer is disposed; a display element layer overlapping with the display area on the substrate; a packaging layer on the display element layer; and an input sensing unit on the packaging layer.

[0022] In one or more embodiments, the display element layer includes a plurality of organic light emitting diodes.

[0023] According to one or more embodiments of the present disclosure, a display device includes a display module, a protective layer, a light blocking layer, a sensor unit, and an adhesive member. The display module includes a substrate defining a display area and a non-display area; the protective layer is on a lower surface of the substrate and includes a first opening area overlapping with the display area; the light blocking layer is on the protective layer and includes a second opening area overlapping with the first opening area; the sensor unit overlaps with the display area, completely covers the second opening area, and is disposed on the light blocking layer; the adhesive member adheres the sensor unit and the light blocking layer.

[0024] In one or more embodiments, the sensor unit includes a sensor overlapping with the second opening area and an encapsulant attached to the light blocking layer through the adhesive member, and the sensor is mounted on the encapsulant.

[0025] In one or more embodiments, when viewed in a plan view, each of the area of the first opening area and the area of the second opening area is greater than the area of the sensor and less than the area of the encapsulant.

[0026] In one or more embodiments, the display device further includes a buffer layer on the light blocking layer and including a first hole area overlapping with the second opening area, and when viewed in a plan view, the area of the first hole area is greater than the area of the second opening area.

[0027] In one or more embodiments, the display device further includes a circuit board electrically connected to the display module and disposed below the buffer layer, and a second hole area is defined through the circuit board, and the second hole area has the same area as the first hole area and overlaps with the second opening area.

[0028] According to one or more embodiments of the present disclosure, a display device includes a display module, a protective layer, a sensor unit, and an adhesive member. The display module defines a display area and a non-display area; the protective layer is on a lower surface of the display module and includes an opening area defined to penetrate the protective layer and overlap with each of the display area and the non-display area; the sensor unit overlaps with each of the display area and the non-display area, covers the opening area, and is disposed on the protective layer; the adhesive member adheres the sensor unit and the protective layer. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] When considered in conjunction with the accompanying drawings, the above aspects and other aspects of the present disclosure will become readily apparent by reference to the following detailed description, in which:

[0030] Figure 1is a perspective view showing a display device according to an exemplary embodiment of the present disclosure;

[0031] Figure 2 is an exploded perspective view showing a display device according to an exemplary embodiment of the present disclosure;

[0032] Figure 3 is a cross-sectional view showing a display module according to an exemplary embodiment of the present disclosure;

[0033] Figure 4 is a plan view showing a display panel according to an exemplary embodiment of the present disclosure;

[0034] Figure 5 is showing Figure 4 an equivalent circuit diagram of the pixel shown in;

[0035] Figure 6 is a cross-sectional view taken along line I-I′ of according to an exemplary embodiment of the present disclosure; Figure 2 ;

[0036] Figure 7 is a plan view showing the rear surface of a display module according to an exemplary embodiment of the present disclosure;

[0037] Figure 8 is showing Figure 6 a cross-sectional view of a part of the display device shown in;

[0038] Figure 9A is a cross-sectional view taken along a line corresponding to line I-I′ of a part of a display device according to another exemplary embodiment of the present disclosure; Figure 2 ;

[0039] Figure 9B is a cross-sectional view taken along a line corresponding to line I-I′ of a part of a display device according to another exemplary embodiment of the present disclosure; Figure 2 ;

[0040] Figure 10 is a plan view showing a display panel according to another exemplary embodiment of the present disclosure;

[0041] Figure 11 is a cross-sectional view taken along a line corresponding to line I-I′ of a part of a display device according to another exemplary embodiment of the present disclosure; and Figure 2 ;

[0042] Figure 12 is a plan view showing the rear surface of a display module according to another exemplary embodiment of the present disclosure. Detailed Description

[0043] The present disclosure may be modified and implemented in many different forms, and some exemplary embodiments will be illustrated in the drawings and described in more detail herein. However, the present disclosure is not limited to the specifically disclosed forms and should be construed as including all modifications, equivalents, or substitutions included in the spirit and scope of the present invention.

[0044] The same reference numerals throughout the specification denote the same elements. In the drawings, the thicknesses of layers, films, and regions may be exaggerated for clarity. As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items. The use of the terms "first," "second," etc. does not denote any order or importance, but rather, the terms "first," "second," etc. are used to distinguish one element from another. Thus, without departing from the teachings of the present invention, the "first" element, component, region, layer, or section discussed below may be referred to as the "second" element, component, region, layer, or section. It is to be understood that, unless the context clearly dictates otherwise, the singular forms "a," "an," and "the" include plural referents.

[0045] It is also to be understood that the terms "includes" and / or "including," when used in this specification, indicate the presence of the recited features, integers, steps, operations, elements, and / or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or combinations thereof.

[0046] Figure 1 is a perspective view showing a display device according to an exemplary embodiment of the present disclosure; Figure 2 is an exploded perspective view showing a display device according to an exemplary embodiment of the present disclosure; and Figure 3 is a cross-sectional view showing a display module according to an exemplary embodiment of the present disclosure.

[0047] Referring to Figure 1 , the display device DD displays an image IM through a display surface DD-IS. In an embodiment, the display surface DD-IS is parallel (parallel or substantially parallel) to a surface defined by a first direction DR1 and a second direction DR2. A third direction DR3 indicates a normal direction of the display surface DD-IS, that is, a thickness direction of the display device DD.

[0048] Here, a front (or upper) surface and a rear (or lower) surface of each component of the display device DD are distinguished from each other by the third direction DR3. However, the directions indicated by the first direction DR1, the second direction DR2, and the third direction DR3 are relative to each other, and thus, the directions indicated by the first direction DR1, the second direction DR2, and the third direction DR3 may be changed to other directions.

[0049] In this exemplary embodiment of the present disclosure, the display device DD includes a flat type of display surface, but it is not limited thereto or restricted thereby. For example, the display device DD may include a curved type of display surface or a three-dimensional type of display surface. The three-dimensional type of display surface may include a plurality of display regions indicating different directions from each other. As an example, the three-dimensional type of display surface may include a polygonal column type of display surface.

[0050] The display device DD according to this exemplary embodiment may be a rigid display device; however, the display device DD is not limited to a rigid display device. In other words, the display device DD may be a flexible display device. In this exemplary embodiment, the display device DD applicable to a mobile phone terminal will be described as a representative example. Although not shown in the drawings, electronic modules, camera modules, and power modules mounted on the main board may be placed in a frame / case together with the display device DD to form a mobile phone terminal. The display device DD according to the present disclosure may be applied to any large electronic products (such as televisions, monitors, etc.) as well as medium and small electronic products (such as tablet computers, vehicle navigation units, game units, smart watches, etc.).

[0051] As Figure 1 shown, the display surface DD-IS includes a display region DD-DA through which an image IM is displayed and a non-display region DD-NDA provided adjacent to the display region DD-DA. The image IM is not displayed through the non-display region DD-NDA. Figure 1 An image showing an icon is taken as a representative example of the image IM.

[0052] As Figure 1 shown, in the embodiment, the display region DD-DA has a quadrilateral shape, and the non-display region DD-NDA surrounds the display region DD-DA. However, the shape of the display region DD-DA and the shape of the non-display region DD-NDA may be designed differently. As an example, the non-display region DD-NDA may be provided adjacent to only one side of the display region DD-DA or may be omitted.

[0053] Referring Figure 2 , in the embodiment, the display device DD includes a window member WM, a display module DM, a circuit board PCB, and a housing member BC.

[0054] The window member WM is provided above the display module DM and transmits the image provided from the display module DM through the display region DA. As an example, the window member WM may include any one of glass, sapphire, plastic, etc. The window member WM includes a display region DA and a non-display region NDA, and the display region DA and the non-display region NDA overlap with the display region DD-DA and the non-display region DD-NDA defined in the display device DD, respectively.

[0055] In an embodiment, as Figure 2 shown, the window member WM has a single-layer structure; however, the window member WM may include multiple layers. As an example, the window member WM may include a base layer and at least one border layer disposed on the lower surface of the base layer to correspond to the non-display area DD-NDA.

[0056] According to this exemplary embodiment, the display area DA may include a sensor area FSA. The sensor area FSA may overlap with the display area DA and may be an area for fingerprint recognition in an embodiment.

[0057] In the case where the sensor area FSA overlaps with the non-display area NDA, the display area DA may be reduced due to the area of the sensor area FSA. However, since the display device DD according to the present disclosure has a structure in which the sensor area FSA overlaps with the display area DA, the display area DA may be enlarged due to the area of the sensor area FSA compared to the area of the display area DA when the sensor area FSA is defined in the non-display area NDA.

[0058] According to an exemplary embodiment of the present disclosure, a sensor unit may be disposed on the display module DM to correspond to the sensor area FSA. This will be described in more detail later.

[0059] The display module DM is disposed between the window member WM and the accommodation member BC. In an embodiment, the display module DM includes a display panel DP and an input sensing unit ISU, and the input sensing unit ISU is disposed between the window member WM and the display panel DP.

[0060] According to an exemplary embodiment of the present disclosure, the display panel DP may be an organic light emitting diode display panel, a plasma display panel, an electrophoretic display panel, a microelectromechanical system display panel, an electrowetting display panel, etc.

[0061] Herein, the organic light emitting diode display panel will be described as the display panel DP. However, the inventive concept of the present disclosure is not limited thereto or thereby restricted, and any one of various display panels may be applied according to an embodiment.

[0062] The display panel DP generates an image IM and transmits the image IM to the window member WM. The display panel DP overlaps with the display area DD-DA.

[0063] The input sensing unit ISU obtains coordinate information of an external input. In an embodiment, the input sensing unit ISU may be directly disposed on the display panel DP. In the present exemplary embodiment, the input sensing unit ISU may be manufactured through a process continuous with the display panel DP, but the embodiment is not limited thereto or thereby. For example, the input sensing unit ISU may be provided as a separate panel and attached to the display panel DP through an adhesive member.

[0064] Although not shown in the drawings, the display module DM according to an exemplary embodiment of the present disclosure may further include an anti-reflection layer. The anti-reflection layer may include a color filter, a stack structure of a conductive layer / dielectric layer / conductive layer, or an optical member. The anti-reflection layer absorbs light incident thereon from the outside, cancels out the interference with the light incident thereon from the outside, or polarizes the light incident thereon from the outside.

[0065] The accommodation member BC accommodates the display module DM and is coupled to the window member WM.

[0066] Reference Figure 3 , the display panel DP includes a display area DP-DA and a non-display area DP-NDA, and the display area DP-DA and the non-display area DP-NDA respectively overlap with the display area DA and the non-display area NDA defined in the window member WM.

[0067] In an embodiment, the display module DM includes a substrate SUB, a circuit layer CL disposed on the substrate SUB, a display element layer ED, and a packaging layer TFE. In an embodiment, the substrate SUB includes at least one plastic film. In an embodiment, the substrate SUB includes a plastic substrate, a glass substrate, a metal substrate, or an organic / inorganic composite substrate, wherein the plastic substrate is flexible.

[0068] The circuit layer CL includes a plurality of insulating layers, a plurality of conductive layers, and a semiconductor layer. The conductive layers of the circuit layer CL serve as signal lines or control circuits of pixels.

[0069] In an embodiment, the display element layer ED includes an organic light emitting diode. The display element layer ED may include a plurality of organic light emitting diodes as light emitting elements. The display element layer ED may further include organic layers, such as a pixel defining layer.

[0070] The packaging layer TFE packages the display element layer ED. The packaging layer TFE includes at least one insulating layer. The packaging layer TFE according to an exemplary embodiment of the present disclosure may include at least one inorganic layer (referred to herein as "packaging inorganic layer"). The packaging layer TFE according to an exemplary embodiment of the present disclosure may include at least one organic layer (referred to herein as "packaging organic layer") and at least one packaging inorganic layer.

[0071] The encapsulation inorganic layer protects the display element layer ED from moisture and oxygen, and the encapsulation organic layer protects the display element layer ED from foreign substances such as dust. In an embodiment, the encapsulation inorganic layer includes a nitride layer of silicon, a silicon oxynitride layer, an oxide layer of silicon, an oxide layer of titanium, or an oxide layer of aluminum; however, it is not limited thereto. In an embodiment, the encapsulation organic layer includes an acrylic-based organic layer, but it is not limited thereto.

[0072] In an embodiment, the display module DM may include an encapsulation substrate that encapsulates the display element layer ED, without including the encapsulation layer TFE. The encapsulation substrate may include any one of glass, sapphire, plastic, etc.

[0073] According to an exemplary embodiment of the present disclosure, the input sensing unit ISU is directly disposed on the encapsulation layer TFE. The input sensing unit ISU includes an input sensing electrode and a signal line. The input sensing electrode and the signal line may have a single-layer structure or a multi-layer structure. According to an embodiment, the input sensing unit ISU may be coupled to the encapsulation layer TFE through an adhesive member disposed on the encapsulation layer TFE.

[0074] In an embodiment, the input sensing electrode and the signal line may include indium tin oxide, indium zinc oxide, zinc oxide, indium tin zinc oxide, PEDOT, metal nanowires, or graphene. The touch sensor and the touch signal line may include a metal layer, for example, molybdenum, silver, titanium, copper, aluminum, or an alloy thereof. The touch sensor and the touch signal line may have the same layer structure or different layer structures.

[0075] Figure 4 is a plan view of a display panel according to an exemplary embodiment of the present disclosure; and Figure 5 is a diagram showing Figure 4 the equivalent circuit diagram of the pixel shown in

[0076] Referring to Figure 4 , the display panel DP includes a driving circuit GDC, a plurality of signal lines SGL, a plurality of signal pads, and a plurality of pixels PX, wherein the plurality of signal pads are arranged in the signal pad region SPD.

[0077] The pixels PX are arranged in the display region DP-DA. In an embodiment, each of the pixels PX includes an organic light-emitting diode and a pixel driving circuit connected to the organic light-emitting diode. The driving circuit GDC, the signal lines SGL, the signal pads, and the pixel driving circuit may be included in the Figure 3 circuit layer CL shown in

[0078] The driving circuit GDC includes a scan driving circuit. The scan driving circuit generates a plurality of scan signals (referred to as "scan signals" herein) and sequentially outputs the scan signals to a plurality of scan lines GL (referred to as "scan lines" herein) described below. The scan driving circuit may further output another control signal to the pixel driving circuit of the pixel PX.

[0079] The scan driving circuit may include a plurality of thin film transistors formed by the same process as the pixel driving circuit of the pixel PX, such as a low temperature polysilicon (LTPS) process or a low temperature polycrystalline oxide (LTPO) process.

[0080] The signal line SGL is disposed on the substrate SUB. The signal line SGL includes a scan line GL, a data line DL, a power line PL, and a control signal line CSL. Each of the scan lines GL is connected to a corresponding pixel PX in the pixel PX, and each of the data lines DL is connected to a corresponding pixel PX in the pixel PX. The power line PL is connected to the pixel PX. The control signal line CSL applies a control signal to the scan driving circuit.

[0081] The signal line SGL overlaps with the display area DP-DA and the non-display area DP-NDA. Each of the signal lines SGL includes a pad portion and a line portion. The line portion overlaps with the display area DP-DA and the non-display area DP-NDA. The pad portion is connected to an end of the line portion. The pad portion is disposed in the non-display area DP-NDA and corresponds to the signal pad provided in the signal pad area SPD described above.

[0082] The circuit board PCB is connected to the display panel DP and includes a plurality of connection pads provided in the connection pad area DPD. The connection pads are connected to the signal pads provided in the signal pad area SPD of the display panel DP to transmit a plurality of driving signals to the display panel DP. The circuit board PCB can be rigid or flexible. In an embodiment, the circuit board PCB is flexible, and a flexible printed circuit board can be provided as the circuit board PCB.

[0083] In Figure 4 it, the circuit board PCB is shown separated from the display panel DP, but the circuit board PCB can be disposed on a part of the non-display area DP-NDA of the display panel DP and can overlap with the display area DP-DA and the non-display area DP-NDA. For example, the circuit board PCB can be bent along the side portion of the substrate SUB and disposed on the rear surface of the display panel DP.

[0084] According to an exemplary embodiment of the present disclosure, a printed circuit board (PCB) may include a hole region OP defined to penetrate the PCB. In an embodiment, when the PCB is bent along a side portion of a substrate SUB, the hole region OP defined to penetrate the PCB overlaps with a sensor region FSA. This will be described in more detail with reference to Figure 6 which will be described in more detail.

[0085] In an embodiment, a timing control circuit may be provided on the PCB to control the operation of a display panel DP. In an embodiment, the timing control circuit may be mounted on the PCB in the form of an integrated chip. In an embodiment, although not shown in the drawings, an input sensing circuit may be provided on the PCB to control an input sensing unit ISU (refer to Figure 3 ). The input sensing circuit may be mounted on the PCB in the form of an integrated chip.

[0086] In an embodiment, the timing control circuit and the input sensing circuit are mounted on the PCB; however, according to another embodiment, the timing control circuit and the input sensing circuit may be directly mounted on a non-display area DP-NDA of the display panel DP. In an embodiment, the timing control circuit and the input sensing circuit may be mounted on the PCB or the non-display area DP-NDA of the display panel DP in the form of a single integrated chip.

[0087] Figure 5 A scan line GL, a data line DL, a power line PL, and a pixel PX connected to the scan line GL, the data line DL, and the power line PL are shown. However, the configuration of the pixel PX is not limited to Figure 5 that shown in

[0088] The organic light-emitting diode (OLED) may be a front-surface emitting diode or a back-surface emitting diode. The pixel PX includes a first transistor T1 (referred to as a "switching transistor"), a second transistor T2 (referred to as a "driving transistor"), and a capacitor Cst as a pixel driving circuit to drive the OLED. A first power supply voltage ELVDD is applied to the second transistor T2, and a second power supply voltage ELVSS is applied to the OLED. The second power supply voltage ELVSS may be lower than the first power supply voltage ELVDD.

[0089] The first transistor T1 outputs a data signal applied to the data line DL in response to a scan signal applied to the scan line GL. The capacitor Cst is charged with a voltage corresponding to the data signal provided from the first transistor T1. The second transistor T2 is connected to the OLED. The second transistor T2 controls a driving current flowing through the OLED according to the amount of charge stored in the capacitor Cst.

[0090] Note that Figure 5 the equivalent circuit shown is merely an embodiment of the present disclosure, and thus, the configuration of the pixel PX is not limited to Figure 5 . The pixel PX may include a plurality of transistors and a large number of capacitors. The organic light-emitting diode OLED may be connected between the power line PL and the second transistor T2.

[0091] Figure 6 is a cross-sectional view taken along line I-I′ according to an exemplary embodiment of the present disclosure; Figure 2 is a plan view showing the back surface of the display module according to an exemplary embodiment of the present disclosure; and Figure 7 is a cross-sectional view showing a part of the display device shown in Figure 8 is shown Figure 6 .

[0092] Referring to Figure 6 and Figure 7 , in addition to the window member WM and the display module DM described above, the display device DD according to an embodiment further includes a sensor unit SU, a protection member PM, and an adhesive member RS. In an embodiment, in addition to the substrate SUB and the encapsulation layer TFE described above, the display module DM further includes a polarization layer POL and an adhesive layer OA disposed between the window member WM and the encapsulation layer TFE.

[0093] In an embodiment Figure 3 the input sensing unit ISU shown in is described as being omitted, but the input sensing unit ISU may be disposed between the polarization layer POL and the encapsulation layer TFE. In an embodiment, although not shown in the drawings, Figure 3 the circuit layer CL and the display element layer ED shown in are disposed on the substrate SUB, and the display element layer ED is encapsulated by the encapsulation layer TFE.

[0094] The polarization layer POL may transmit light that is substantially parallel to the polarization axis in one direction among the light emitted from the display element layer ED. In an embodiment, the polarization layer POL may be a coating-type polarization layer or a polarization layer formed by a deposition process. The polarization layer POL may be formed by coating a material including a dichroic dye and a liquid crystal compound. The adhesive layer OA may adhere the window member WM and the display module DM.

[0095] In an embodiment, the protection member PM includes a protection layer PY, a light blocking layer LBY, and a buffer layer CY. The protection layer PY overlaps with the display area DA and the non-display area NDA. The protection layer PY is attached to the lower surface of the substrate SUB and protects the substrate SUB from external influences. As an example, the protection layer PY absorbs physical impacts from the outside, or prevents or substantially prevents foreign substances or moisture from entering the display module DM. In an embodiment, the protection layer PY may be coated on the lower surface of the substrate SUB in the form of a film or attached to the lower surface of the substrate SUB.

[0096] According to an exemplary embodiment of the present disclosure, the protection layer PY may include a material that blocks ultraviolet rays. For example, the protection layer PY may include a base resin, an ultraviolet absorber, and inorganic particles. The ultraviolet absorber and the inorganic particles may be distributed in the base resin. The base resin may be an acrylic-based resin, for example, a polyurethane acrylate resin, but is not limited thereto or thereby. In other words, the base resin may be used in the protection layer PY without being limited to any specific base resin that makes the base resin optically transparent and capable of dispersing the ultraviolet absorber and inorganic particles thereon.

[0097] As an example, the ultraviolet absorber may include at least one of a benzotriazole-based compound, a benzophenone-based compound, a salicylic acid-based compound, a salicylate-based compound, a cyanoacrylate-based compound, a cinnamate-based compound, an oxanilide-based compound, a polystyrene-based compound, a methineimine-based compound, and a triazine-based compound.

[0098] In addition, according to an exemplary embodiment of the present disclosure, the protection layer PY may include an opening area SOP that overlaps with the sensor area FSA when viewed in a plan view. The opening area SOP allows light leaving the sensor unit SU to transmit through the window member WM. Herein, as Figure 6 shown, the opening area SOP will be described as having a first area and a first length D1 in a cross section.

[0099] The light blocking layer LBY may be disposed on the lower surface of the protection layer PY, and the buffer layer CY may be disposed on the lower surface of the light blocking layer LBY. In an embodiment, the light blocking layer LBY may be a double-sided adhesive disposed between the protection layer PY and the buffer layer CY. In addition, the light blocking layer LBY may absorb external light from the outside. As an example, the light blocking layer LBY may be a black layer for absorbing external light; however, it is not limited thereto or thereby. In other words, the light blocking layer LBY may include any kind of material that absorbs external light.

[0100] The buffer layer CY is disposed on the lower surface of the light blocking layer LBY and protects the display module DM from external influences. The buffer layer CY may include an elastic material such as sponge or rubber.

[0101] The circuit board PCB is disposed on the substrate SUB overlapping the non-display area NDA and is bent along one side portion of the substrate SUB to the lower surface of the substrate SUB. Accordingly, a part of the circuit board PCB overlaps with the non-display area NDA, and another part of the circuit board PCB overlaps with the display area DA. The connection pad PD1 included in the circuit board PCB is connected to the signal pad PD2 disposed on the substrate SUB overlapping the non-display area NDA.

[0102] The light blocking layer LBY includes a first hole area overlapping the display area DA, and the buffer layer CY includes a second hole area overlapping the first hole area. In an embodiment, the first hole area of the light blocking layer LBY and the second hole area of the buffer layer CY are defined to have the same area.

[0103] In an embodiment, as Figure 6 shown, the first hole area of the light blocking layer LBY and the second hole area of the buffer layer CY may overlap with the hole area OP of the circuit board PCB. Further, as an example, when observed in a plan view, the first hole area of the light blocking layer LBY, the second hole area of the buffer layer CY, and the hole area OP of the circuit board PCB may be defined to have the same area (the same or substantially the same area).

[0104] The sensor unit SU may be disposed on the protection layer PY overlapping the sensor area FSA included in the display area DA. In particular, the sensor unit SU according to an exemplary embodiment of the present disclosure may be disposed on the protection layer PY to completely cover the opening area SOP defined to penetrate the protection layer PY.

[0105] More specifically, the sensor unit SU may include a sensor SS and an encapsulant SP. According to an exemplary embodiment, the sensor SS may be implemented by a fingerprint recognition sensor and may operate in an optical scheme, an ultraviolet scheme, or a capacitance scheme. However, the sensor SS is not limited to a fingerprint recognition sensor. In other words, the sensor SS may be implemented by a camera, a pressure sensor, a proximity sensor, an illuminance sensor, a temperature sensor, etc. disposed under the display module DM.

[0106] The sensor SS overlaps with the opening area SOP, where the opening area SOP overlaps with the sensor area FSA. When a user's finger touches the sensor area FSA, the sensor SS senses the user's fingerprint and transmits the sensed signal to the control circuit included in the encapsulant SP.

[0107] The encapsulation SP includes a sensor SS mounted thereon to face the substrate SUB, and transmits a signal sensed by the sensor SS to the circuit board PCB. The encapsulation SP includes a control circuit electrically connected to each of the circuit board PCB and the sensor SS. The control circuit applies the sensed signal to the circuit board PCB, and the circuit board PCB applies the sensed signal to the signal pad PD2 through the connection pad PD1.

[0108] An adhesive member RS fixes the encapsulation SP to the protective layer PY. According to an exemplary embodiment of the present disclosure, the adhesive member RS includes a resin. In the embodiment, the resin is placed in contact with each of the encapsulation SP and the protective layer PY, and then a curing process is performed on the resin. In this case, in order to cure the resin, ultraviolet rays are irradiated from the lower side of the protective member PM toward the window member WM.

[0109] However, the ultraviolet rays may be irradiated entirely between the encapsulation SP and the light blocking layer LBY without being concentrated on the adhesive member RS. In this case, if the protective layer PY does not block the ultraviolet rays, the ultraviolet rays may transmit through the substrate SUB, and the circuit layer CL (refer to Figure 3 ) or the display element layer ED (refer to Figure 3 ) provided on the substrate SUB may deteriorate.

[0110] According to an exemplary embodiment of the present disclosure, the encapsulation SP completely covers the opening area SOP and is provided on the protective layer PY. Therefore, in the case where ultraviolet rays are irradiated between the encapsulation SP and the light blocking layer LBY, the ultraviolet rays can transmit to the adhesive member RS and the protective layer PY. Since the protective layer PY absorbs the ultraviolet rays, the transmission of the ultraviolet rays to the substrate SUB can be prevented or substantially prevented.

[0111] As Figure 8 shown, the protective layer PY may include an ultraviolet absorber that absorbs ultraviolet rays. Therefore, when the ultraviolet rays irradiated to cure the adhesive member RS transmit to the protective layer PY, the protective layer PY can absorb the ultraviolet rays. In addition, since the encapsulation SP is provided on the protective layer PY and covers the opening area SOP of the protective layer PY, the ultraviolet rays do not transmit through the encapsulation SP to the substrate SUB. In other words, the encapsulation SP can block the ultraviolet rays.

[0112] Referring again to Figure 6 and Figure 7 , the sensor SS has a second area when viewed in a plan view and a second length D2 in a cross section. In the Figure 7 shown plan view, the second area of the sensor SS may be smaller than the first area of the opening area SOP. In the Figure 6 shown cross-sectional view, the second length D2 of the sensor SS may be shorter than the first length D1 of the opening area SOP.

[0113] In an embodiment, when viewed in a plan view, the encapsulant SP may have an area wider than the first area of the opening region SOP. In this case, the area of each of the first hole region of the light blocking layer LBY and the second hole region of the buffer layer CY may be larger than the area of the encapsulant SP. Accordingly, when viewed in a plan view, the encapsulant SP may be disposed in the first hole region of the light blocking layer LBY and the second hole region of the buffer layer CY.

[0114] As described above, the sensor unit SU according to the present disclosure may be disposed on the protective layer PY to cover the opening region SOP. Accordingly, although ultraviolet rays are irradiated from the lower side of the protective member PM toward the window member WM to cure the adhesive member RS, the ultraviolet rays do not pass through the substrate SUB. Accordingly, deterioration of the circuit layer CL and the display element layer ED due to the ultraviolet rays can be prevented.

[0115] Figure 9A is a cross-sectional view taken along a line corresponding to line I-I′ of a part of a display device according to another exemplary embodiment of the present disclosure. Figure 2 of Figure 9B is a cross-sectional view taken along a line corresponding to line I-I′ of a part of a display device according to another exemplary embodiment of the present disclosure. Figure 2 of

[0116] In an embodiment, when compared with the display device DD Figure 6 shown in Figure 9A the display device DD2 shown in may have substantially the same structure and function except for the protective member PMa. Accordingly, the protective member PMa will be mainly described with reference to Figure 9A and further details of other components will be omitted.

[0117] Referring to Figure 9A , the protective layer PY is attached to the lower surface of the substrate SUB, and the light blocking layer LBa is attached to the lower surface of the protective layer PY.

[0118] According to an exemplary embodiment of the present disclosure, the protective layer PY includes a first opening region overlapping with the display region DA. The light blocking layer LBa includes a second opening region overlapping with the first opening region. When viewed in a plan view, the first opening region and the second opening region may have the same (same or substantially the same) opening region SOP. In other words, the area of the first opening region may be the same as (same or substantially the same as) the area of the second opening region. Herein, according to the description, the first opening region and the second opening region will be described as Figure 9A the opening region SOP shown in

[0119] According to an exemplary embodiment of the present disclosure, the area of the opening region SOP is larger than the area of the sensor SS and smaller than the area of the encapsulation SP. Accordingly, the encapsulation SP is disposed on the light blocking layer LBa to cover the opening region SOP.

[0120] The buffer layer CY is disposed on the light blocking layer LBa and includes a first hole region overlapping with the second opening region. When observed in a plan view, the area of the first hole region may be larger than the area of the second opening region. The circuit board PCB is disposed below the buffer layer CY and includes a second hole region having the same area as the area of the first hole region and overlapping with the second opening region.

[0121] When observed in a plan view, the first hole region of the buffer layer CY and the second hole region of the circuit board PCB overlap with each other and have the same (identical or substantially identical) area. Herein, according to the description, the first hole region and the second hole region will be described as Figure 9A the hole region OP shown in

[0122] In an embodiment, an adhesive member RSa may be provided to each of the encapsulation SP and the light blocking layer LBa to fix the encapsulation SP of the sensor unit SU to the light blocking layer LBa. The adhesive member RSa may be a resin. Accordingly, in order to cure the resin, ultraviolet rays may be irradiated from the lower side of the protective layer PY toward the window member WM.

[0123] According to an exemplary embodiment, the ultraviolet rays passing through the hole region OP between the encapsulation SP and the circuit board PCB may be transmitted to each of the adhesive member RSa and the light blocking layer LBa. In this case, the ultraviolet rays transmitted to the light blocking layer LBa may be absorbed or reflected by the light blocking layer LBa. Accordingly, the ultraviolet rays may not be transmitted to the substrate SUB. In addition, the encapsulation SP may block the ultraviolet rays. In an embodiment, since the encapsulation SP completely covers the second opening region and is disposed on the light blocking layer LBa, the ultraviolet rays may not be transmitted to the substrate SUB.

[0124] Referring to Figure 9B , except for the position of the sensor unit SU, the display device DD2a according to an embodiment may have the same structure and function as the Figure 9A display device DD2 shown in

[0125] According to an exemplary embodiment of the present disclosure, Figure 9B the opening region SOP shown in Figure 9B may overlap with each of the display region DA and the non-display region NDA. Accordingly, in order to cover the opening region SOP,

[0126] Figure 10 is a plan view showing a display panel according to another exemplary embodiment of the present disclosure; Figure 11 is a cross-sectional view taken along a line corresponding to line I-I′ of a part of a display device according to another exemplary embodiment of the present disclosure; and Figure 2 is a plan view showing the rear surface of a display module according to another exemplary embodiment of the present disclosure. Figure 12 Except for the structure of the circuit board PCBa,

[0127] the display panel DPa shown in Figure 10 may have the same structure and function as the structure and function of the display panel DP shown in Figure 4 and thus, further details of other components except for the circuit board PCBa will be omitted.

[0128] Referring to Figure 11 , the circuit board PCBa may be disposed below the protection member PM. In an embodiment, when compared to the circuit board PCB shown in Figure 4 , the circuit board PCBa may not include a hole region.

[0129] In an embodiment, the timing controller TC may be disposed on the circuit board PCBa. As an example, the timing controller TC may be disposed on the upper surface of the circuit board PCBa. The lower surface of the circuit board PCBa may face the encapsulant SP.

[0130] According to an exemplary embodiment of the present disclosure, the circuit board PCBa may include a through hole VI overlapping with the opening region SOP. The timing controller TC may be electrically connected to a control circuit included in the encapsulant SP through the through hole VI.

[0131] In other words, a signal sensed by the sensor SS may be transmitted to the control circuit of the encapsulant SP. Here, the sensor SS may sense a user's fingerprint through the sensor region FSA. The sensed signal transmitted from the sensor SS to the control circuit may be transmitted to the timing controller TC through the through hole VI. Accordingly, the timing controller TC may transmit a driving signal to the signal pad PD2 through the connection pad PD1 in response to the sensed signal.

[0132] In an embodiment, as shown in Figure 12 , since the circuit board PCBa does not include a separate hole region, the sensor unit SU may be completely covered by the circuit board PCBa.

[0133] According to one or more embodiments, an encapsulant of the sensor unit completely covers an opening region defined to penetrate a protection layer and is disposed on the protection layer.

[0134] According to one or more embodiments, the protective layer includes an ultraviolet absorber for absorbing ultraviolet rays, and thus, ultraviolet rays irradiated from the lower side of the display module can be prevented from reaching the substrate after passing through the protective layer. Accordingly, the driving reliability of the display device can be improved.

[0135] As described above, some embodiments have been disclosed in the drawings and the specification. Although specific terms are used herein, these terms are intended to describe the current embodiments and are not intended to limit the meaning of the terms or the scope of the appended claims. Accordingly, those skilled in the art will understand that various modifications and other equivalent embodiments are possible in accordance with the above embodiments. Therefore, the scope of the claims should be defined by the technical gist of the specification.

Claims

1. A display device, comprising: a display module including a display area and a non-display area; a protective layer on a lower surface of the display module and including an opening area overlapping with the display area, and including an ultraviolet absorber for absorbing ultraviolet rays; a sensor unit overlapping with the display area, covering the opening area, and disposed on the protective layer; an adhesive member adhering the sensor unit and the protective layer, and including a resin configured to be cured under irradiation of ultraviolet rays; a light-blocking layer on a lower surface of the protective layer and including a first hole area overlapping with the sensor unit, and when observed in a plan view of the display module, an area of the first hole area is larger than an area of the sensor unit; and a circuit board electrically connected to the display module and disposed below the protective layer, the circuit board including a hole area overlapping with the sensor unit; wherein the first hole area is configured such that ultraviolet rays irradiated from a lower side of the protective layer toward the display module irradiate the adhesive member, and when observed in a plan view of the display module, the hole area is larger than the area of the sensor unit.

2. The display device according to claim 1, wherein, the sensor unit includes: a sensor overlapping with the opening area; and an encapsulation attached to the protective layer through the adhesive member, and the sensor is mounted on the encapsulation.

3. The display device according to claim 2, wherein, when observed in a plan view of the display module, an area of the opening area is larger than an area of the sensor and smaller than an area of the encapsulation.

4. The display device according to claim 1, further comprising: a buffer layer on the light-blocking layer and including a second hole area overlapping with the first hole area, wherein when observed in a plan view of the display module, an area of the second hole area is larger than an area of the sensor unit.

5. The display device according to claim 1, wherein, the circuit board is disposed below the protective layer and includes a timing controller for applying a driving signal to the display module, and wherein the sensor unit is electrically connected to the timing controller through a through hole defined to penetrate the circuit board and overlapping with the opening area.

6. A display device, comprising: a display module including a substrate in which a display area and a non-display area are defined; a protective layer on a lower surface of the substrate and including a first opening area overlapping with the display area; a light-blocking layer on a lower surface of the protective layer and including a second opening area overlapping with the first opening area; a sensor unit overlapping with the display area, completely covering the second opening area, and disposed on a lower surface of the light-blocking layer; an adhesive member adhering the sensor unit and the light-blocking layer, and including a resin configured to be cured under irradiation of ultraviolet rays; and A buffer layer, on the lower surface of the light-blocking layer and including a second hole region overlapping with the second opening region, and when observed in a plan view of the display module, an area of the second hole region is larger than an area of the sensor unit; wherein, the second hole region is configured such that ultraviolet rays irradiated from a lower side of the light-blocking layer toward the display module irradiate the adhesive member.

7. The display device according to claim 6, wherein, the sensor unit includes: a sensor overlapping with the second opening region; and an encapsulation attached to the light-blocking layer through the adhesive member, and the sensor is mounted on the encapsulation.

8. A display device, including: a display module including a display region and a non-display region; a protective layer on the lower surface of the display module and including an opening region overlapping with each of the display region and the non-display region, and including an ultraviolet absorber for absorbing ultraviolet rays; a sensor unit overlapping with each of the display region and the non-display region, covering the opening region, and disposed on the protective layer; an adhesive member adhering the sensor unit and the protective layer, and including a resin configured to be cured under irradiation of ultraviolet rays; and a light-blocking layer on the lower surface of the protective layer and including a first hole region overlapping with the sensor unit, and when observed in a plan view of the display module, an area of the first hole region is larger than an area of the sensor unit; wherein, the first hole region is configured such that ultraviolet rays irradiated from a lower side of the protective layer toward the display module irradiate the adhesive member.

Images