A low-frequency semi-in-ear headphone with an air duct

Abstract

The present invention relates to the technical field of earphones, and particularly relates to a low-frequency semi-in-ear earphone with an air duct; it includes an air duct, a front housing, a rear housing connected to the front housing, a speaker located in the front housing and the rear housing, and a PCB board located between the speaker and the rear housing; a front cavity is formed between the speaker and the front housing; a first rear cavity is formed between the speaker and the PCB board; a second rear cavity is formed between the PCB board and the rear housing; the speaker is hermetically connected to the front housing; the PCB board is hermetically connected to the rear housing; the front housing is hermetically connected to the rear housing; a first air vent is provided on the PCB board; a second air vent is provided on the rear housing; both ends of the air duct are respectively connected to the first air vent and the second air vent. The present invention can hear low-frequency bass without external sealing.

Description

Technical Field

[0001] The present invention relates to the technical field of earphones, and more particularly to a low-frequency semi-in-ear earphone with an air duct. Background Art

[0002] As an indispensable accessory of electronic devices in modern life, earphones are widely used in various fields. Due to the popularity of electronic products such as mobile phones or video players, earphones, as their supporting products, can be seen everywhere in daily life. While bringing many conveniences to people, they also add endless fun to life.

[0003] The common portable earphones on the market are mainly divided into in-ear earphones and semi-in-ear earphones. Since the semi-in-ear earphones do not have the earplug design that penetrates deep into the ear canal like in-ear earphones, a sealed listening environment will not be formed naturally. Therefore, compared with full-in-ear earphones, the current semi-in-ear earphones have the problem of poor low-frequency bass performance: when the user closes the space near the ears, such as covering the ears with hands, can they obtain delicate low-frequency bass sound effects, which is very inconvenient. Summary of the Invention

[0004] The purpose of the present invention is to overcome the above-mentioned disadvantages and provide a low-frequency semi-in-ear earphone with an air duct, which can hear low-frequency bass without external sealing.

[0005] To achieve the above purpose, the specific solution of the present invention is as follows: A low-frequency semi-in-ear earphone with an air duct, comprising an air duct, a front housing, a rear housing fastened to the front housing, a speaker located inside the front housing and the rear housing, and a PCB board located between the speaker and the rear housing; a front cavity is formed between the speaker and the front housing; a first rear cavity is formed between the speaker and the PCB board; a second rear cavity is formed between the PCB board and the rear housing; the speaker is hermetically connected to the front housing; the PCB board is hermetically connected to the rear housing; the front housing is hermetically connected to the rear housing; a first air vent is opened on the PCB board; a second air vent is provided on the rear housing; an air duct is connected between the first air vent and the second air vent, and the air duct is located in the second rear cavity.

[0006] The present invention is further configured such that the front housing includes a first front housing and a second front housing disposed within the first front housing; at least one first sound outlet hole is provided on the first front housing; at least one second sound outlet hole is provided on the second front housing at a position corresponding to the first sound outlet hole; the front cavity includes a first front cavity and a second front cavity; the second front housing and the speaker form the second front cavity; the second front housing and the first front cavity form the first front cavity; the second front housing is hermetically connected to the speaker; the first front housing is hermetically connected to the rear housing; the first rear cavity is communicatively connected to the first front cavity.

[0007] The present invention is further configured such that one end of the second front housing is snap-connected to the first front housing; at least one communication groove is provided at the other end of the second front housing; the first rear cavity is communicatively connected to the first front cavity through the communication groove.

[0008] The present invention is further configured such that the low-frequency semi-in-ear earphone further includes a sensor for sensing whether a human ear is approaching; a sensing hole is provided on the first front housing; a groove for placing the sensor is provided on the second front housing at a position corresponding to the sensing hole; the sensor is electrically connected to the PCB board; after receiving the signal sent by the sensor, the PCB board controls the working state of the speaker.

[0009] The present invention is further configured such that the air duct includes a first air guiding section and a second air guiding section that are communicatively connected; one end of the first air guiding section is connected to the first air guiding hole; one end of the second air guiding section is connected to the second air guiding hole; the included angle between the longitudinal axis of the first air guiding section and the longitudinal axis of the second air guiding section is a right angle.

[0010] The present invention is further configured such that an elastic sealing ring is provided between the first air guiding section and the first air guiding hole; a tuning net is provided between the second air guiding section and the second air guiding hole.

[0011] The present invention is further configured such that a battery for powering the PCB board and an antenna for receiving wireless audio signals are further provided within the second rear cavity; both the battery and the antenna are electrically connected to the PCB board; after receiving the data sent by the antenna, the PCB board drives the speaker to emit sound.

[0012] The present invention is further configured such that the speaker and the front housing, the PCB board and the rear housing, and the front housing and the rear housing are all hermetically connected by glue.

[0013] The present invention is further configured such that the first air guiding hole is provided in the middle of the PCB board.

[0014] The beneficial effects of the present invention are as follows: By sealing the connection between the speaker and the second front shell and the connection between the PCB board and the rear shell, it can effectively prevent a large amount of air from leaking at the connection between the second front shell and the speaker, the connection between the rear housing and the PCB board, and the connection between the front housing and the rear housing, thereby effectively improving the intensity of low frequencies; without the need for external sealing, low-frequency bass can be heard, effectively solving the problem that semi-in-ear headphones cannot obtain better low-frequency bass. In addition, the present invention makes full use of the space inside the earphone, without increasing the volume of the earphone, and the weight of the earphone remains almost unchanged, making it more comfortable to wear. Description of the Drawings

[0015] The invention will be further described with reference to the accompanying drawings. However, the embodiments in the drawings do not constitute any limitation to the present invention. For those of ordinary skill in the art, other drawings can be obtained based on the following drawings without creative efforts.

[0016] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0017] Figure 2 It is a top view of the present invention;

[0018] Figure 3 is Figure 2 the sectional view taken along A-A' in

[0019] Figure 4 It is an exploded view of the present invention;

[0020] Figure 5 It is an exploded view of the present invention from another perspective;

[0021] Figure 6 It is an exploded view of the first front shell and the second front shell;

[0022] Figure 7 It is an exploded view of the first front shell, the second front shell and the speaker;

[0023] Wherein: 1 - front housing; 11 - first front shell; 110 - first sound outlet hole; 111 - induction hole; 12 - second front shell; 120 - second sound outlet hole; 121 - communication groove; 122 - groove; 13 - first front cavity; 14 - second front cavity; 2 - rear housing; 21 - first rear cavity; 22 - second rear cavity; 23 - antenna; 24 - battery; 31 - speaker; 32 - PCB board; 4 - air duct; 41 - first air guiding section; 42 - second air guiding section; 43 - first air guiding hole; 44 - second air guiding hole; 45 - elastic sealing ring; 46 - tuning net. Detailed Embodiments

[0024] The present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments, but the scope of implementation of the present invention is not limited thereto.

[0025] As Figures 1-7 shown, a low-frequency semi-in-ear headphone with an air duct in this embodiment includes an air duct 4, a front housing 1, a rear housing 2 fastened to the front housing 1, a speaker 31 located inside the front housing 1 and the rear housing 2, and a PCB board 32 located between the speaker 31 and the rear housing 2; a front cavity (not shown in the figure) is formed between the speaker 31 and the front housing 1; a first rear cavity 21 is formed between the speaker 31 and the PCB board 32; a second rear cavity 22 is formed between the PCB board 32 and the rear housing 2; the speaker 31 is hermetically connected to the front housing 1; the PCB board 32 is hermetically connected to the rear housing 2; the front housing 1 is hermetically connected to the rear housing 2; a first air vent 43 is provided on the PCB board 32; a second air vent 44 is provided on the rear housing 2; an air duct 4 is connected between the first air vent 43 and the second air vent 44, and this air duct 4 is located in the second rear cavity 22.

[0026] Specifically, in ordinary semi-in-ear headphones, usually only the front housing 1 and the rear housing 2 are hermetically arranged. Therefore, the low-frequency bass effect of ordinary semi-in-ear headphones is poor and sound leakage is serious. The speaker 31 is not hermetically connected to the front housing 1, the PCB board 32 is not hermetically connected to the rear housing 2, and the front housing 1 is not hermetically connected to the rear housing 2. Therefore, air will still leak out from their gaps, and delicate low-frequency bass cannot be obtained. Tests show that even if the air duct 4 is provided, if complete sealing treatment is not carried out, the effect of improving low-frequency bass cannot be achieved or the effect of improving low-frequency bass is not obvious.

[0027] By hermetically connecting the speaker 31 to the front housing 1, hermetically connecting the PCB board 32 to the rear housing 2, and hermetically connecting the front housing 1 to the rear housing 2, the present invention can effectively prevent a large amount of air from leaking from the connection between the front housing 1 and the speaker 31, the connection between the rear housing 2 and the PCB board 32, and the connection between the front housing 1 and the rear housing 2, thereby effectively improving the intensity of high frequencies and low frequencies; by providing the air duct 4, when the speaker 31 works, the sound waves radiated by the first rear cavity 21 can resonate and superimpose with the sound waves in the front cavity, and the sound waves in the first rear cavity 21 can be conducted to the outside through the air duct 4, and the low-frequency bass is led out through the air duct 4. Therefore, without external sealing, low-frequency bass can be heard, effectively solving the problem that semi-in-ear headphones cannot obtain better low-frequency bass. In addition, the present invention makes full use of the space inside the headphone. It only needs to hermetically connect between the speaker 31 and the front housing 1 and between the speaker 31 and the PCB board 32, without increasing the volume of the headphone, and the weight of the headphone remains almost unchanged, making it more comfortable to wear.

[0028] As Figures 3-7 shown, a low-frequency semi-in-ear headphone with an air duct in this embodiment, the front housing 1 includes a first front shell 11 and a second front shell 12 disposed within the first front shell 11; at least one first sound outlet hole 110 is provided on the first front shell 11; at least one second sound outlet hole 120 is provided on the second front shell 12 corresponding to the position of the first sound outlet hole 110; the front cavity includes a first front cavity 13 and a second front cavity 14; the second front shell 12 and the speaker 31 form the second front cavity 14; the first front cavity 13 is formed between the second front shell 12 and the first front cavity 13; the second front shell 12 is hermetically connected to the speaker 31; the first front shell 11 is hermetically connected to the rear housing 2; the first rear cavity 21 is communicated with the first front cavity 13.

[0029] The front housing 1 is hermetically connected to the speaker 31. Specifically, the second front shell 12 is hermetically connected to the speaker 31. The second front shell 12 and the speaker 31 ensure a hermetic connection to ensure a better bass sound effect; by providing the first rear cavity 21 to communicate with the first front cavity 13; a small speaker structure is formed between the first rear cavity 21 and the first front cavity 13, enhancing the intensity of the low-frequency bass while having a better uniformity of the low frequency.

[0030] As Figures 4-7 shown, a low-frequency semi-in-ear headphone with an air duct in this embodiment, one end of the second front shell 12 is snap-connected to the first front shell 11; at least one communication groove 121 is provided at the other end of the second front shell 12; the first rear cavity 21 communicates with the first front cavity 13 through the communication groove 121. Preferably, the communication groove 121 is provided at the other end of the second front shell 12, which is beneficial to balancing the sound effect.

[0031] As Figures 3-4 shown, a low-frequency semi-in-ear headphone with an air duct in this embodiment, the low-frequency semi-in-ear headphone further includes a sensor (not shown in the figure) for sensing whether the human ear is approaching; a sensing hole 111 is provided on the first front shell 11; a groove 122 for placing the sensor is provided on the second front shell 12 corresponding to the position of the sensing hole 111; the sensor is electrically connected to the PCB board 32; after receiving the signal sent by the sensor, the PCB board 32 controls the working state of the speaker 31.

[0032] Specifically, the sensor can be an infrared sensor, a light sensor or a thermal sensor. When the present invention is away from the human ear, it can send a signal to the PCB board 32, and the PCB board 32 promptly pauses the operation of the speaker 31 to save power. When the present invention is put back into the human ear again, the sensor sends a signal to the PCB board 32, and the PCB board 32 restarts the operation of the speaker 31.

[0033] As Figure 3 shown, a low-frequency semi-in-ear headphone with an air duct according to this embodiment, the air duct 4 includes a first air duct section 41 and a second air duct section 42 that communicate with each other; one end of the first air duct section 41 is connected to the first air hole 43; one end of the second air duct section 42 is connected to the second air hole 44; the included angle between the longitudinal axis of the first air duct section 41 and the longitudinal axis of the second air duct section 42 is a right angle.

[0034] Specifically, the second air hole 44 is provided at the top of the rear housing 2. Through the above setting, low-frequency sound waves can first pass through the first air duct section 41 and the second air duct section 42 in sequence and then be transmitted out from the second air hole 44. Due to the sequential propagation of sound waves, by bending the first air duct section 41 and the second air duct section 42, the intensity of the low-frequency output of the present invention can be increased; on the other hand, the occupied space of the air duct 4 can be reduced, and the volume of the headphone can be decreased.

[0035] As Figure 3 shown, a low-frequency semi-in-ear headphone with an air duct according to this embodiment, an elastic sealing ring 45 is provided between the first air duct section 41 and the first air hole 43; a tuning net 46 is provided between the second air duct section 42 and the second air hole 44.

[0036] Specifically, the material of the elastic sealing ring 45 can be EVA. By providing the elastic sealing ring 45 and the tuning net 46, the sealing performance of the connection between the air duct 4 and the PCB board 32 and between the air duct 4 and the rear housing 2 can be further improved, ensuring that sound waves can be completely transmitted out from the air duct 4 without leakage at the connection.

[0037] As Figures 3-5 shown, a low-frequency semi-in-ear headphone with an air duct according to this embodiment, a battery 24 for supplying power to the PCB board 32 and an antenna 23 for receiving wireless audio signals are further provided in the second rear cavity 22; the battery 24 and the antenna 23 are both electrically connected to the PCB board 32; after receiving the data sent by the antenna 23, the PCB board 32 drives the speaker 31 to emit sound.

[0038] Specifically, through the above settings, wireless communication connection of the earphone can be achieved; the antenna 23 sends the received wireless audio signal to the PCB board 32, and then the PCB board 32 drives the speaker 31 to emit sound according to the wireless audio signal.

[0039] As Figures 1-7 shown, in a low-frequency semi-in-ear earphone with an air duct according to this embodiment, the speaker 31 and the front housing 1, the PCB board 32 and the rear housing 2, and the front housing 1 and the rear housing 2 are all sealed and connected by glue.

[0040] Specifically, the use of glue for sealing connection has good sealing performance, convenient assembly, high connection strength, low production cost, simple structure, and does not increase the weight of the earphone.

[0041] As Figure 3 shown, in a low-frequency semi-in-ear earphone with an air duct according to this embodiment, the first air vent 43 is provided in the middle of the PCB board 32.

[0042] Through the above settings, sound waves can be evenly led out from the first air vent 43 to the air duct 4.

[0043] The above is only a preferred embodiment of the present invention. Therefore, any equivalent changes or modifications made according to the structures, features, and principles described in the scope of this invention patent application are included in the protection scope of this invention patent application.

Claims

1. A low-frequency semi-in-ear headphone with an air duct, characterized in that: It includes an air duct (4), a front housing (1), a rear housing (2) fastened to the front housing (1), a speaker (31) located within the front housing (1) and the rear housing (2), and a PCB board (32) located between the speaker (31) and the rear housing (2); A front cavity is formed between the speaker (31) and the front housing (1); a first rear cavity (21) is formed between the speaker (31) and the PCB board (32); a second rear cavity (22) is formed between the PCB board (32) and the rear housing (2); The speaker (31) is sealingly connected to the front housing (1); The PCB board (32) is sealingly connected to the rear housing (2); The front housing (1) is sealingly connected to the rear housing (2); A first air vent hole (43) is formed on the PCB board (32); a second air vent hole (44) is provided on the rear housing (2); an air duct (4) is connected between the first air vent hole (43) and the second air vent hole (44), and this air duct (4) is located within the second rear cavity (22); The front housing (1) includes a first front shell (11) and a second front shell (12) provided within the first front shell (11); at least one first sound outlet hole (110) is provided on the first front shell (11); at least one second sound outlet hole (120) is provided on the second front shell (12) at a position corresponding to the first sound outlet hole (110); The front cavity includes a first front cavity (13) and a second front cavity (14); The second front shell (12) and the speaker (31) form the second front cavity (14); the second front shell (12) and the first front cavity (13) form the first front cavity (13); The second front shell (12) is sealingly connected to the speaker (31); the first front shell (11) is sealingly connected to the rear housing (2); The first rear cavity (21) is communicated with the first front cavity (13); One end of the second front shell (12) is snap - connected to the first front shell (11); at least one communication groove (121) is provided at the other end of the second front shell (12); the first rear cavity (21) is communicated with the first front cavity (13) through the communication groove (121); The air duct (4) includes a first air - guiding section (41) and a second air - guiding section (42) that are interconnected; One end of the first air - guiding section (41) is connected to the first air vent hole (43), and an elastic sealing ring (45) is provided between the first air - guiding section (41) and the first air vent hole (43); One end of the second air - guiding section (42) is connected to the second air vent hole (44), and a tuning net (46) is provided between the second air - guiding section (42) and the second air vent hole (44).

2. The low-frequency semi-in-ear earphone with an air duct according to claim 1, characterized in that: The low-frequency semi-in-ear headphone further includes a sensor for sensing whether the human ear is approaching; an induction hole (111) is formed in the first front shell (11); a groove (122) for placing the sensor is provided at a position corresponding to the induction hole (111) on the second front shell (12); the sensor is electrically connected to the PCB board (32); after receiving the signal sent by the sensor, the PCB board (32) controls the working state of the speaker (31).

3. The low-frequency semi-in-ear headphone with an air duct according to claim 1, characterized in that: The included angle between the longitudinal axis of the first air guide section (41) and the longitudinal axis of the second air guide section (42) is a right angle.

4. A low-frequency semi-in-ear headphone with an air duct according to claim 1, characterized in that: A battery (24) for supplying power to the PCB board (32) and an antenna (23) for receiving wireless audio signals are further provided in the second rear cavity (22); both the battery (24) and the antenna (23) are electrically connected to the PCB board (32); after receiving the data sent by the antenna (23), the PCB board (32) drives the speaker (31) to emit sound.

5. The low-frequency semi-in-ear earphone with an air duct according to claim 1, characterized in that: The speaker (31) and the front housing (1), the PCB board (32) and the rear housing (2), and the front housing (1) and the rear housing (2) are all hermetically connected by glue.

6. The low-frequency semi-in-ear earphone with an air duct according to claim 1, characterized in that: The first air guide hole (43) is provided in the middle of the PCB board (32).

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