Display panel and display device including the same

Abstract

A display panel and a display device including the display panel are provided. The display panel includes a substrate having an opening region and a display region at least partially surrounding the opening region. Display elements are arranged in the display region. The display elements include pixel electrodes, counter electrodes, and an intermediate layer disposed between the pixel electrodes and the counter electrodes. The multilayer film includes a first insulating layer between the substrate and the pixel electrodes and a second insulating layer of a different material located on the first insulating layer. The thin film encapsulation layer covers the display elements and includes at least one organic encapsulation layer and at least one inorganic encapsulation layer. The multilayer film includes a first groove provided between the opening region and the display region. The first groove has an undercut structure in which the lower width of the first groove is greater than the upper width of the first groove.

Description

[0001] This application claims the benefit of Korean Patent Application No. 10-2018-0076085, filed on Jun. 29, 2018, in the Korean Intellectual Property Office, the disclosure of which is incorporated herein by reference in its entirety. Technical Field

[0002] The present disclosure relates to a display device, and more particularly, to a display panel and a display device including the display panel. Background Art

[0003] In recent years, display devices are being used in more types of products. In addition, display devices are becoming thinner and lighter in weight, and thus their range of use is increasing.

[0004] When increasing the display area of a display device, a wide range of sensors and other components are being integrated into the display device. Summary of the Invention

[0005] A display panel includes: a substrate having an opening region and a display region at least partially surrounding the opening region. A plurality of display elements are disposed in the display region. Each of the plurality of display elements includes a pixel electrode, a counter electrode, and an intermediate layer disposed between the pixel electrode and the counter electrode. A multilayer film includes a first insulating layer disposed between the substrate and the pixel electrode and a second insulating layer disposed on the first insulating layer and having a material different from that of the first insulating layer. A thin film encapsulation layer covers the plurality of display elements and includes at least one organic encapsulation layer and at least one inorganic encapsulation layer. The multilayer film includes a first groove provided between the opening region and the display region. The first groove has an undercut structure in which a lower width of the first groove is greater than an upper width of the first groove.

[0006] A display panel includes a substrate having an opening region. A plurality of display elements are disposed on the substrate. The plurality of display elements surround the opening region. Each of the plurality of display elements includes a pixel electrode, a counter electrode, and an intermediate layer disposed between the pixel electrode and the counter electrode. A multilayer film includes a first insulating layer disposed between the substrate and the pixel electrode and a second insulating layer provided on the first insulating layer. An encapsulation layer covers the plurality of display elements. The multilayer film includes a first groove surrounding the opening region and recessed in a depth direction of the multilayer film. The first groove has an undercut structure in which a lower width of the first groove is greater than an upper width of the first groove.

[0007] A display device includes a substrate having an opening region and a display region at least partially surrounding the opening region. A plurality of display elements are arranged in the display region. Each display element includes a pixel electrode, a counter electrode, and an intermediate layer disposed between the pixel electrode and the counter electrode. A multilayer film includes an organic insulating layer disposed between the substrate and the pixel electrode and an inorganic insulating layer disposed on the organic insulating layer. A thin film encapsulation layer covers the plurality of display elements and includes at least one organic encapsulation layer and at least one inorganic encapsulation layer. The multilayer film includes a first groove located between the opening region and the display region. The first groove has an undercut structure. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] A more complete understanding of the present disclosure and many of its attendant aspects will become better understood with reference to the following detailed description, taken in conjunction with the accompanying drawings, in which:

[0009] Figure 1 is a perspective view schematically showing a display device according to an exemplary embodiment of the present disclosure;

[0010] Figures 2A to 2D is a schematic cross-sectional view showing a display device according to an exemplary embodiment of the present disclosure;

[0011] Figure 3 is a schematic plan view showing a display panel according to an exemplary embodiment of the present disclosure;

[0012] Figure 4 is an equivalent circuit diagram schematically showing a pixel of a display panel according to an exemplary embodiment of the present disclosure;

[0013] Figure 5 is a plan view showing a part of a display panel according to an exemplary embodiment of the present disclosure and showing signal lines located in a first non-display region of the display panel;

[0014] Figure 6 is a plan view showing a part of a display panel according to an exemplary embodiment of the present disclosure and showing a groove located in a first non-display region of the display panel;

[0015] Figure 7 is a schematic cross-sectional view showing a display panel according to an exemplary embodiment of the present disclosure;

[0016] Figure 8 is showing Figure 7 an enlarged cross-sectional view of an organic light emitting device;

[0017] Figure 9A is a partial cross-sectional view showing the first groove, Figure 9B is showing Figure 9A a cross-sectional view of a stacked structure on the first groove;

[0018] Figure 10 is a schematic cross-sectional view showing a display panel according to an exemplary embodiment of the present disclosure;

[0019] Figure 11 is a schematic partial plan view showing a display panel according to an exemplary embodiment of the present disclosure;

[0020] Figure 12 is a plan view showing a peripheral region surrounding an opening region;

[0021] Figure 13 is along Figure 12 a cross-sectional view taken along line XIII-XIII';

[0022] Figure 14 is a schematic partial plan view showing a display panel according to an exemplary embodiment of the present disclosure;

[0023] Figure 15 is a plan view showing a peripheral region surrounding an opening region; and

[0024] Figure 16 is along Figure 15 a cross-sectional view taken along line XVI-XVI'. DETAILED DESCRIPTION

[0025] In describing the exemplary embodiments of the present disclosure shown in the drawings, specific terms are used for clarity. However, the present disclosure is not intended to be limited to the specific terms so selected, and it will be understood that each specific element includes all technical equivalents operating in a similar manner.

[0026] Throughout the specification and the drawings, the same elements may be denoted by the same reference numerals. To the extent that detailed descriptions of specific elements have been omitted, it may be assumed that the elements not described are at least similar to the corresponding elements described elsewhere in the specification.

[0027] Although terms such as "first", "second", etc. may be used to describe various components, such components should not be limited to the above terms. The above terms are only used to distinguish one component from another.

[0028] In the following embodiments, it will be understood that when a part such as a layer, a region, or an element is referred to as being "on" or "above" another part, the part may be directly on or above the other part, or there may also be an intermediate part.

[0029] For ease of explanation, the dimensions of the components in the drawings may be exaggerated or reduced.

[0030] As described herein, when a layer, region, or element is referred to as being "connected" to another structure, it can be interpreted not only that the layer, region, or element is directly connected, but also that the layer, region, or element is connected through other constituent elements disposed between the layer, region, or element and the other structure. For example, when a layer, region, element, etc. is described as being connected or electrically connected to another structure, the layer, region, element, etc. can be not only directly connected or directly electrically connected, but also connected through another layer, region, element, etc. disposed between the layer, region, or element and the other structure.

[0031] Figure 1 is a perspective view schematically showing a display device 1 according to an exemplary embodiment of the present disclosure.

[0032] Referring to Figure 1 , the display device 1 includes a plurality of regions. For example, a first region, a second region surrounding the first region, a third region between the first region and the second region, and a fourth region surrounding the second region. The first region may correspond to an opening region RA, the second region may correspond to a display region DA, the third region may correspond to a first non-display region NDA1, and the fourth region may correspond to a second non-display region NDA2. The display device 1 includes a display region DA that emits light therefrom and a non-display region NDA that does not emit light. The display device 1 can display an image by using light emitted from a plurality of pixels disposed in the display region DA of the display device 1.

[0033] The display device 1 includes an opening region RA at least partially surrounded by the display region DA. Figure 1 It shows that the opening region RA is completely surrounded by the display region DA. The non-display region NDA may include a first non-display region NDA1 surrounding the opening region RA (e.g., located between the opening region RA and the display region DA) and a second non-display region NDA2 at least partially surrounding the outside of the display region DA. The first non-display region NDA1 may completely surround the opening region RA, the display region DA may completely surround the first non-display region NDA1, and the second non-display region NDA2 may completely surround the display region DA.

[0034] Hereinafter, according to an exemplary embodiment of the present disclosure, an organic light-emitting display device (organic electroluminescent (EL) display) will be described as an example of the display device 1, but the display device according to the present disclosure is not limited thereto. For example, various types of display devices such as an inorganic electroluminescent (EL) display, a quantum dot light-emitting display, etc. can be used.

[0035] Figures 2A to 2D is a cross-sectional view schematically showing the display device 1 according to an exemplary embodiment of the present disclosure, and can be along Figure 1corresponds to the cross-section cut along line II-II'.

[0036] Referring to Figure 2A , the display device 1 may include a display panel 10 and electronic components 20 corresponding to the opening region RA of the display panel 10. Various elements such as an input sensing member for sensing a touch input, an antireflection member including a polarizer and a retarder or a color filter and a black matrix, and a transparent window may also be arranged on the display panel 10.

[0037] The display panel 10 may include a substrate 100, a display element layer 200 disposed on the substrate 100 and including display elements, and a thin film encapsulation layer 300 (e.g., an encapsulation member) covering the display element layer 200.

[0038] The substrate 100 may include a glass material containing SiO2 as a main component. The display element layer 200 includes display elements (such as organic light emitting diodes OLEDs) disposed in the display region DA. The display element layer 200 may include various circuits and wirings electrically connected to the organic light emitting diodes OLEDs as display elements. The thin film encapsulation layer 300 may cover the display element layer 200 to prevent the penetration of moisture or other external contaminants into the display element layer 200. The thin film encapsulation layer 300 may include at least one inorganic encapsulation layer and at least one organic encapsulation layer.

[0039] As Figure 2A shown, the display panel 10 may include an opening 10H corresponding to the opening region RA and passing through the display panel 10. The substrate 100, the display element layer 200, and the thin film encapsulation layer 300 may respectively include a first opening 100H, a second opening 200H, and a third opening 300H corresponding to the opening region RA. The first opening 100H, the second opening 200H, and the third opening 300H may together form the opening 10H of the display panel 10. The first opening 100H may pass through or penetrate from the top surface of the substrate 100 to the bottom surface of the substrate 100. The second opening 200H may pass through or penetrate from the top surface of the display element layer 200 to the bottom surface of the display element layer 200. The third opening 300H may pass through or penetrate from the top surface of the thin film encapsulation layer 300 to the bottom surface of the thin film encapsulation layer 300.

[0040] The opening region RA may correspond to the position where the electronic components 20 are arranged, and thus the electronic components 20 may be arranged to correspond to the first opening 100H of the substrate 100, the second opening 200H of the display element layer 200, and the third opening 300H of the thin film encapsulation layer 300. The first opening 100H may penetrate through the upper surface and the lower surface of the substrate 100, and the second opening 200H may penetrate through the lowermost layer to the uppermost layer of the display element layer 200. The third opening 300H may penetrate through the thin film encapsulation layer 300.

[0041] The electronic component 20 may be an electronic component that detects and / or generates light and / or sound. For example, the electronic component may include a light-receiving sensor such as an infrared sensor, a camera that receives light to capture an image, a sensor that measures distance or senses a fingerprint by outputting or sensing light or sound, a compact lamp that outputs light, a speaker that outputs sound, etc. The electronic component that detects and / or generates light may use various bands of light such as visible light, infrared light, and / or ultraviolet light. The opening area RA may be understood as a transmissive area through which light and / or sound output from the electronic component 20 to the outside or traveling from the outside to the electronic component 20 can pass through. As Figure 2A shown, when all parts of the display panel 10 corresponding to the opening area RA are removed (for example, when the opening 10H penetrates the display panel 10), the light or sound output or received by the electronic component 20 can be processed more effectively.

[0042] Although Figure 2A it is shown that the electronic component 20 is arranged below the substrate 100, the present disclosure is not limited thereto. According to an exemplary embodiment of the present disclosure, the electronic component 20 may be located within the opening 10H of the display panel 10.

[0043] Figure 2A shown is a substrate 100 including a first opening 100H corresponding to the opening area RA, a display element layer 200 including a second opening 200H corresponding to the opening area RA, and a thin film encapsulation layer 300 including a third opening 300H corresponding to the opening area RA. However, in Figure 2B it, the substrate 100 may not include the first opening 100H. For example, there may be no opening corresponding to the electronic component 20 in the substrate 100.

[0044] Referring to Figure 2B , although the substrate 100 does not include the first opening, the display element layer 200 and the thin film encapsulation layer 300 may include the second opening 200H and the third opening 300H, respectively. Therefore, the transmittance of the light used by the electronic component 20 can be ensured. According to an exemplary embodiment of the present disclosure, Figure 2B the transmittance in the opening area RA of the display panel 10 shown in

[0045] Referring to Figure 2C and Figure 2D, the substrate 100 of the display panel 10 may include a polymer resin, thereby further providing flexibility as compared with a glass material substrate. For example, the substrate 100 may include a first matrix layer 101, a first inorganic layer 102, a second matrix layer 103, and a second inorganic layer 104 that are sequentially stacked.

[0046] Both the first matrix layer 101 and the second matrix layer 103 may include a transparent polymer resin. The polymer resin may be, for example, polyethersulfone (PES), polyarylate (PAR), polyetherimide (PEI), polyethylene naphthalate (PEN), polyethylene terephthalate (PET), polyphenylene sulfide (PPS), polyimide (PI), polycarbonate (PC), triacetyl cellulose (TAC), cellulose acetate propionate (CAP), etc.

[0047] The first inorganic layer 102 and the second inorganic layer 104 are barrier layers that prevent the penetration of external foreign substances, and each of these layers may be a single-layer structure or a multi-layer structure including an inorganic material such as silicon nitride (SiN x ) and / or silicon oxide (SiO x ).

[0048] The substrate 100 including a polymer resin may include a first opening 100H corresponding to the opening region RA (as Figure 2C shown), or may not include the first opening (as Figure 2D shown). Alternatively, as described above, the display element layer 200 and the thin film encapsulation layer 300 may each have only a second opening 200H and a third opening 300H, respectively.

[0049] Figure 3 is a plan view schematically showing a display panel 10 according to an exemplary embodiment of the present disclosure, Figure 4 is an equivalent circuit diagram schematically showing pixels of the display panel 10.

[0050] Referring to Figure 3 , the display panel 10 includes a plurality of pixels P arranged in a display area DA. Each pixel P may include an organic light-emitting diode OLED (see Figure 4 ). Each pixel P may emit light of red color, green color, blue color, or white color through the organic light-emitting diode OLED.

[0051] Referring to Figure 4 , each pixel P includes a pixel circuit PC and an organic light-emitting diode OLED connected to the pixel circuit PC. The pixel circuit PC may include a first thin film transistor T1, a second thin film transistor T2, and a storage capacitor Cst.

[0052] The second thin film transistor T2 is a switching thin film transistor connected to the scan line SL and the data line DL, and transmits the data voltage input via the data line DL to the first thin film transistor T1 according to the switching voltage input via the scan line SL. The storage capacitor Cst is connected to the second thin film transistor T2 and the driving voltage line PL, and stores a voltage corresponding to the difference between the voltage received from the second thin film transistor T2 and the first power supply voltage ELVDD supplied to the driving voltage line PL.

[0053] The first thin film transistor T1 is a driving thin film transistor connected to the driving voltage line PL and the storage capacitor Cst, and can control the driving current flowing through the organic light emitting diode OLED from the driving voltage line PL according to the voltage value stored in the storage capacitor Cst. The organic light emitting diode OLED can emit light with a predetermined luminance via the driving current. The counter electrode (e.g., cathode) of the organic light emitting diode OLED can receive the second power supply voltage ELVSS.

[0054] Figure 4 A pixel circuit PC including two thin film transistors and one storage capacitor is shown, but the present disclosure is not limited thereto. It will be understood that the number of thin film transistors and the number of storage capacitors can be changed according to the design of the pixel circuit PC.

[0055] Return reference Figure 3 Referring back, the first non-display area NDA1 can surround the opening area RA. The first non-display area NDA1 is an area where no display elements (such as the organic light emitting diode OLED) are arranged. Signal lines through which signals are provided to the pixel P and which are included around the opening area RA or the groove and will be described in detail below can be arranged in the first non-display area NDA1. In the second non-display area NDA2, a scan driver 1100 that provides a scan signal to each pixel P, a data driver 1200 that provides a data signal to each pixel P, a main power supply wiring through which the first power supply voltage and the second power supply voltage are provided, etc. can be arranged.

[0056] Figure 3 It can be understood as showing the substrate 100 included in the display panel 10. For example, it can be understood that the substrate 100 includes an opening area RA, a display area DA, a first non-display area NDA1, and a second non-display area NDA2.

[0057] Figure 5 is a plan view showing a part of a display panel according to an exemplary embodiment of the present disclosure, and Figure 5 shows the signal lines located in the first non-display area.

[0058] Reference Figure 5, the pixel P is arranged in the display area DA surrounding the opening area RA, and the first non-display area NDA1 may be arranged between the opening area RA and the display area DA.

[0059] The pixels P may be spaced apart from each other with respect to the opening area RA. The pixels P may be spaced apart from each other Figure 5 above and below the opening area RA with respect to the XY plane of Figure 5 . Optionally, the pixels P may be spaced apart from each other on the left side and the right side with respect to the opening area RA with respect to the XY plane of

[0060] The signal lines for supplying signals to the pixels P and adjacent to the opening area RA may bypass around the opening area RA. Some data lines DL passing through the display area DA may extend in the y direction to provide data signals to the pixels P arranged above and below the opening area RA, and may simultaneously bypass along the boundary of the opening area RA in the first non-display area NDA1. Some scan lines SL passing through the display area DA may extend in the x direction to provide scan signals to the pixels P arranged on the left side or the right side with respect to the opening area RA, and may simultaneously bypass along the boundary of the opening area RA in the first non-display area NDA1.

[0061] Figure 6 is a plan view showing a part of a display panel according to an exemplary embodiment of the present disclosure, and shows a groove located in the first non-display area.

[0062] The groove is located between the opening area RA and the display area DA. In this regard, although Figure 6 shows a first groove G1 and a second groove G2 located between the opening area RA and the display area DA, but according to the exemplary embodiment of the present disclosure, one or more grooves may be included in addition to the first groove G1 and the second groove G2.

[0063] Both the first groove G1 and the second groove G2 may have an annular shape completely surrounding the opening area RA in the first non-display area NDA1. The diameter of each of the first groove G1 and the second groove G2 may be greater than the diameter of the opening area RA, and the first groove G1 and the second groove G2 may be spaced apart from each other by a predetermined distance.

[0064] Figure 7 is a cross-sectional view showing a display panel according to an exemplary embodiment of the present disclosure. Figure 7 Corresponding to the cross-section taken along the line VII-VII' of Figure 6 . Figure 8 is showing Figure 7 an enlarged cross-sectional view of the organic light emitting device of Figure 9A is a cross-sectional view showing an extracted view of the first groove G1,Figure 9B is a cross-sectional view of a stacked structure on a first groove G1 shown Figure 9A therein.

[0065] First, referring to the display area DA shown in Figure 7 , the substrate 100 may include glass as described above with reference to Figure 2A and Figure 2B , or may include an inorganic layer and a matrix layer including a polymer resin as described above with reference to Figure 2C and Figure 2D .

[0066] A buffer layer 201 may be formed on the substrate 100. The buffer layer 201 may prevent impurities from penetrating into the semiconductor layer Act of the thin film transistor TFT. The buffer layer 201 may include an inorganic insulating material such as silicon nitride or silicon oxide, and may be a single-layer structure or a multi-layer structure including the above inorganic insulating material. In some exemplary embodiments of the present disclosure, the second inorganic layer 104 described with reference to Figure 2C and Figure 2D may be understood as a sub-layer of the buffer layer 201 having a multi-layer structure.

[0067] A pixel circuit PC including a thin film transistor TFT, a storage capacitor Cst, etc. may be disposed on the buffer layer 201. The thin film transistor TFT may include a semiconductor layer Act, a gate electrode GE, a source electrode SE, and a drain electrode DE. The thin film transistor TFT shown in Figure 7 may correspond to the driving thin film transistor described with reference to Figure 4 . According to an exemplary embodiment of the present disclosure, a top-gate type thin film transistor is shown in which the gate electrode GE is disposed on the semiconductor layer Act and a gate insulating layer 203 is included between the gate electrode GE and the semiconductor layer Act. Alternatively, the thin film transistor TFT may also be a bottom-gate type.

[0068] The semiconductor layer Act may include polysilicon. Alternatively, the semiconductor layer Act may include amorphous silicon, an oxide semiconductor, an organic semiconductor, etc. The gate electrode GE may include a low-resistance metal material. The gate electrode GE may include a conductive material including molybdenum (Mo), aluminum (Al), copper (Cu), titanium (Ti), etc., and may be formed into a multi-layer structure or a single-layer structure having the above materials.

[0069] The gate insulating layer 203 may be disposed between the semiconductor layer Act and the gate electrode GE, and the gate insulating layer 203 may include silicon oxide, silicon nitride, silicon oxynitride, aluminum oxide, titanium oxide, tantalum oxide, hafnium oxide, etc.

[0070] Both the source electrode SE and the drain electrode DE may include a material having a high conductivity. Both the source electrode SE and the drain electrode DE may include a conductive material such as molybdenum (Mo), aluminum (Al), copper (Cu), titanium (Ti), etc., and may be formed into a multilayer structure or a single-layer structure of the above materials. In an exemplary embodiment of the present disclosure, both the source electrode SE and the drain electrode DE may include a multilayer structure of Ti / Al / Ti.

[0071] The storage capacitor Cst includes a lower electrode CE1 and an upper electrode CE2 stacked on each other and a first interlayer insulating layer 205 disposed between the lower electrode CE1 and the upper electrode CE2. The storage capacitor Cst may be stacked with the thin film transistor TFT. In this regard, Figure 7 It is shown that the gate electrode GE of the thin film transistor TFT is the lower electrode CE1 of the storage capacitor Cst, but the present disclosure is not limited thereto. According to an exemplary embodiment of the present disclosure, the storage capacitor Cst may not be stacked with the thin film transistor TFT. The storage capacitor Cst may be covered by a second interlayer insulating layer 207.

[0072] Both the first interlayer insulating layer 205 and the second interlayer insulating layer 207 may include an inorganic insulating material such as silicon oxide, silicon nitride, silicon oxynitride, aluminum oxide, titanium oxide, tantalum oxide, hafnium oxide, etc.

[0073] The pixel circuit PC including the thin film transistor TFT and the storage capacitor Cst is covered by a first insulating layer 209. The first insulating layer 209 is a planarizing insulating layer and may include an organic insulating material such as typical general polymers (e.g., polymethyl methacrylate (PMMA) or polystyrene (PS)), polymer derivatives having a phenolic group, acrylic polymers, imide polymers, aryl ether polymers, amide polymers, fluorine polymers, parylene polymers, vinyl alcohol-based polymers, and blends thereof. According to an exemplary embodiment of the present disclosure, the first insulating layer 209 may include polyimide. According to an exemplary embodiment of the present disclosure, the first insulating layer 209 may have a thickness of about 1.7 μm to about 2.4 μm.

[0074] The organic light emitting diode OLED is disposed on the first insulating layer 209. The pixel electrode 221 of the organic light emitting diode OLED may be disposed on the first insulating layer 209 (i.e., in contact with the upper surface of the first insulating layer 209) and may be connected to the pixel circuit PC through a contact hole of the first insulating layer 209.

[0075] The pixel electrode 221 may include a conductive oxide such as indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), indium oxide (In2O3), indium gallium oxide (IGO), or aluminum zinc oxide (AZO). According to an exemplary embodiment of the present disclosure, the pixel electrode 221 may include a reflective layer including silver (Ag), magnesium (Mg), aluminum (Al), platinum (Pt), palladium (Pd), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), or a composite thereof. According to an exemplary embodiment of the present disclosure, the pixel electrode 221 may further include a film formed of ITO, IZO, ZnO, or In2O3 on or under the reflective layer.

[0076] The second insulating layer 211 may include an opening exposing the upper surface of the pixel electrode 221 and may cover the edge of the pixel electrode 221. The second insulating layer 211 includes an inorganic insulating material. For example, the second insulating layer 211 may include silicon oxide and / or silicon nitride, and may be a single-layer structure or a multi-layer structure. The thickness of the second insulating layer 211 may be less than the thickness of the first insulating layer 209.

[0077] The intermediate layer 222 includes an emission layer 222b. The emission layer 222b may include a polymer or a low molecular weight organic material that emits light of a predetermined color. According to an exemplary embodiment of the present disclosure, the intermediate layer 222 may include a first functional layer 222a disposed under the emission layer 222b and / or a second functional layer 222c disposed on the emission layer 222b.

[0078] The first functional layer 222a may be a single-layer structure or a multi-layer structure. For example, when the first functional layer 222a is formed of a polymer material, the first functional layer 222a may be a hole transport layer (HTL) having a single-layer structure and may include poly(3,4-ethylenedioxythiophene) (PEDOT) or polyaniline (PANI). When the first functional layer 222a is formed of a low molecular weight material, the first functional layer 222a may include a hole injection layer (HIL) and a hole transport layer (HTL).

[0079] The second functional layer 222c is optional and may be omitted. For example, when the first functional layer 222a and the emission layer 222b are formed of a polymer material, the second functional layer 222c may be formed. The second functional layer 222c may be a single-layer structure or a multi-layer structure. The second functional layer 222c may include an electron transport layer (ETL) and / or an electron injection layer (EIL).

[0080] Some of the multiple layers that make up the intermediate layer 222 (e.g., the functional layer) can be arranged not only in the display area DA but also in the first non-display area NDA1, and these layers can be cut off by the first groove G1 and the second groove G2 in the first non-display area NDA1, which will be described later.

[0081] The counter electrode 223 is arranged to face the pixel electrode 221, and the intermediate layer 222 is disposed between the counter electrode 223 and the pixel electrode 221. The counter electrode 223 can include a conductive material with a low work function. For example, the counter electrode 223 can include a transparent layer or a semi-transparent layer containing Ag, Mg, Al, Pt, Pd, Au, Ni, Nd, Ir, Cr, lithium (Li), calcium (Ca), or an alloy thereof. Alternatively, the counter electrode 223 can also include a layer containing, for example, ITO, IZO, ZnO, or In2O3 on the transparent layer or the semi-transparent layer.

[0082] The organic light-emitting diode OLED is covered by the thin film encapsulation layer 300. The thin film encapsulation layer 300 can include at least one organic encapsulation layer and at least one inorganic encapsulation layer. Figure 7 It is shown that the thin film encapsulation layer 300 includes a first inorganic encapsulation layer 310, a second inorganic encapsulation layer 330, and an organic encapsulation layer 320 disposed between the first inorganic encapsulation layer 310 and the second inorganic encapsulation layer 330. Alternatively, the stacking order and the number of the encapsulation layers can be changed.

[0083] The first inorganic encapsulation layer 310 and the second inorganic encapsulation layer 330 can include inorganic insulating materials such as alumina, titanium oxide, tantalum oxide, hafnium oxide, zinc oxide, silicon oxide, silicon nitride, and / or silicon oxynitride, and can be formed by, for example, chemical vapor deposition (CVD). The organic encapsulation layer 320 can include polymer materials. Examples of polymer materials can include acrylic resins, epoxy resins, polyimides, and polyethylene.

[0084] Referring to Figure 7 the first non-display area NDA1, the first non-display area NDA1 can include a first sub-non-display area SNDA1 that is relatively far from the opening area RA and a second sub-non-display area SNDA2 that is relatively close to the opening area RA.

[0085] The first sub-non-display area SNDA1 is an area through which the signal lines pass, and Figure 7 the data line DL shown in Figure 5 corresponds to the data line DL that bypasses the opening area RA described with reference to

[0086] The data lines DL may be alternately arranged, and an insulating layer is disposed between the data lines DL. Adjacent data lines DL may be respectively disposed under and above the insulating layer (e.g., the second interlayer insulating layer 207), thereby reducing the distance (pitch) between adjacent data lines DL. When the distance (pitch) is reduced, the width of the first non-display area NDA1 can be reduced. Although only the data lines DL are shown in the first sub-non-display area SNDA1 in Figure 7 , scan lines bypassing the opening area RA described above with reference to Figure 5 may also be formed in the first sub-non-display area SNDA1.

[0087] The second sub-non-display area SNDA2 can prevent the penetration of external moisture traveling in the lateral (x-direction) of the display element layer 200 through the opening 10H, and the first groove G1 and the second groove G2 are disposed in the second sub-non-display area SNDA2.

[0088] Referring to Figure 9A , the first groove G1 is formed in the multilayer film 210. Here, the multilayer film 210 may include a first insulating layer 209 as a lower insulating layer and a second insulating layer 211 as an upper insulating layer. Other insulating layers (e.g., the buffer layer 201 to the second interlayer insulating layer 207) may be disposed under the multilayer film 210.

[0089] The first groove G1 may have a predetermined depth in the thickness direction of the multilayer film 210. The first groove G1 may be formed by removing a part of the second insulating layer 211 and a part of the first insulating layer 209. The part of the second insulating layer 211 and the part of the first insulating layer 209 may be removed by an etching process. According to an exemplary embodiment of the present disclosure, the operation of etching the first insulating layer 209 to form the first hole 209H and the operation of etching the second insulating layer 211 to form the second hole 211H may be performed separately.

[0090] The first width W1 of the first hole 209H of the first insulating layer 209 may be greater than the second width W2 of the second hole 211H of the second insulating layer 211, and the first groove G1 may have an undercut structure with its lower width greater than its upper width. In this regard, as Figure 9AAs shown in [figure], at the interface between the second insulating layer 211 and the first insulating layer 209, the inner side 211IE of the second insulating layer 211 facing the second hole 211H protrudes a first distance d toward the center of the first groove G1 in the lateral direction (x direction) compared to the inner side 209IE of the first insulating layer 209. The first distance d may be less than the thickness t1 of the first insulating layer 209, or may be equal to or greater than the thickness t1 of the first insulating layer 209. The first distance d may be greater than the thickness of the first inorganic encapsulation layer 310 or greater than the sum of the thicknesses of the first inorganic encapsulation layer 310 and the second inorganic encapsulation layer 330. According to an exemplary embodiment of the present disclosure, the first distance d may be about 2 μm or greater.

[0091] After the first groove G1 is formed in the multilayer film 210 (as shown in [figure]), the intermediate layer 222 and the counter electrode 223 are formed, and the intermediate layer 222 and the counter electrode 223 may be cut (e.g., separated) by the first groove G1. In this regard, Figure 9A as shown in [figure], it is shown that the first functional layer 222a and the second functional layer 222c and the counter electrode 223 are cut by the first groove G1. Figure 9B

[0092] As shown in [figure], the intermediate layer 222 and the counter electrode 223 are formed on the substrate 100 on which the first groove G1 is disposed. Each of some of the multiple layers constituting the intermediate layer 222 (e.g., the first functional layer 222a and / or the second functional layer 222c) may be integrally formed in the display area DA and the first non-display area NDA1 like the counter electrode 223. When the first groove G1 is formed in the first non-display area NDA1, the first functional layer 222a and / or the second functional layer 222c may be cut off with respect to the first groove G1. Similarly, the counter electrode 223 is cut off with respect to the first groove G1. Figure 7

[0093] The first inorganic encapsulation layer 310 among the thin film encapsulation layer 300 has better step coverage ability than the intermediate layer 222 and the counter electrode 223. Therefore, the first inorganic encapsulation layer 310 can completely cover the inner surface of the first groove G1 (as shown in [figure]). The first inorganic encapsulation layer 310 is continuously formed as a single structure without being cut off by the undercut structure of the first groove G1. For example, the first inorganic encapsulation layer 310 may cover the inner side 211IE and the bottom surface of the second insulating layer 211 and the inner side 209IE and the bottom surface of the first insulating layer 209. Here, the first inorganic encapsulation layer 310 may be in direct contact with the upper surface of the second interlayer insulating layer 207 exposed through the first groove G1. Figure 9B

[0094] ​​​Among the layers formed on the substrate 100, the layer containing an organic material can serve as a transmission path for foreign substances such as moisture or oxygen. However, when the first insulating layer 209, which is an organic insulating layer, is cut off by the first groove G1, the transmission of moisture in the lateral direction (x direction) can be prevented. In addition, when the first inorganic encapsulation layer 310 is in direct contact with the second interlayer insulating layer 207, which is an inorganic insulating layer exposed through the first groove G1, since all the layers including the organic material are covered, the transmission of moisture in the lateral direction through the layer having the organic material can be prevented. In addition, as described above, since the first functional layer 222a and / or the second functional layer 222c can be cut off with respect to the first groove G1 and the second groove G2, the transmission of moisture in the lateral direction (x direction) can be prevented.

[0095] The thickness of the first inorganic encapsulation layer 310 (for example, the thickness in the direction perpendicular to the substrate 100 (z direction)) can be smaller than the thickness t1 of the first insulating layer 209. A part of the first groove G1 can be filled with the organic encapsulation layer 320 on the first inorganic encapsulation layer 310.

[0096] Although Figure 9A and Figure 9B the structure focusing on the first groove G1 is shown, the second groove G2 can also have a structure equivalent to that of the first groove G1.

[0097] Referring to Figure 7 , the second groove G2 also has an undercut structure with a lower width greater than the upper width, and the detailed structure of the second groove G2 is the same as the structure described above with reference to Figure 9A . The intermediate layer 222 and the counter electrode 223 can be cut off not only by the first groove G1 but also by the second groove G2. As described above with reference to the first groove G1, since the inner surface of the second groove G2 is completely covered by the first inorganic encapsulation layer 310, and the first inorganic encapsulation layer 310 is in direct contact with the second interlayer insulating layer 207 exposed through the second groove G2, the transmission path through the organic material can also be effectively blocked by using the second groove G2.

[0098] Different from the upper part of the first groove G1 (where the first inorganic encapsulation layer 310 and the organic encapsulation layer 320 are, for example, in the second hole 211H of the second insulating layer 211), the organic encapsulation layer 320 can be omitted from the second groove G2.

[0099] The organic encapsulation layer 320 can be formed by depositing, for example, monomers on the substrate 100 and then hardening them. When the organic encapsulation layer 320 forms the side of the opening 10H, moisture transmission occurs through the organic encapsulation layer 320. To prevent this, a part of the organic encapsulation layer 320 (for example, the part corresponding to the region HA between the opening region RA and the first groove G1) can be removed by ashing or the like. Thus, the end 320E of the organic encapsulation layer 320 can be disposed between the first groove G1 and the second groove G2. Since the end 320E of the organic encapsulation layer 320 is disposed closer to the display area DA than the ends of the first inorganic encapsulation layer 310 and the second inorganic encapsulation layer 330, the first inorganic encapsulation layer 310 and the second inorganic encapsulation layer 330 can be in direct contact with each other in the above-mentioned region HA. For example, the first inorganic encapsulation layer 310 and the second inorganic encapsulation layer 330 can also be in contact with each other above the upper surface of the second insulating layer 211 and within the second groove G2.

[0100] During the operation of forming the organic encapsulation layer 320, when the organic material in the region HA is removed, the organic material present in the second groove G2 is also removed in the ashing process. However, the organic residue 325 may remain under the eaves (for example, the overhang) of the second insulating layer 211 in the undercut structure of the second groove G2. According to an exemplary embodiment of the present disclosure, depending on the conditions of the ashing process or the like, as Figure 10 shown, no organic residue may be left in the second groove G2.

[0101] Although Figures 7 to 10 the structure of forming an opening in the substrate 100 is shown, the present disclosure is not limited to the structure described above. Referring to Figures 7 to 10 the structure described above and the structure to be referred to Figures 11 to 16 below can also be applied to an exemplary embodiment in which no opening is formed in the substrate 100. For example, it can be applied to Figure 2B and Figure 2D the display panel 10 shown therein and the embodiments derived therefrom.

[0102] Figure 11 is a schematic partial plan view showing a display panel 10' according to an exemplary embodiment of the present disclosure. Figure 12 is a plan view showing the peripheral region of the opening region RA surrounding Figure 11 . Figure 13 is a cross-sectional view showing the peripheral region of the opening region taken along the line XIII-XIII' of Figure 12 . To the extent that the detailed description of the elements and structures of the display panel 10' of this embodiment is omitted, it can be assumed that the omitted details are at least similar to the details of the display panel 10 described above with respect to Figure 3 .

[0103] Reference Figure 11 and Figure 12 , the opening region RA of the display panel 10' can be partially surrounded by the display region DA. The pixels P can be spaced apart from each other on the left and right sides relative to the opening region RA. The scan lines SL for transmitting scan signals to the pixels P on the left side of the opening region RA and the pixels P on the right side of the opening region RA can detour around the opening region RA in the first non-display region NDA1.

[0104] The opening region RA can be surrounded (at least partially) by the first groove G1 and the second groove G2. According to an exemplary embodiment of the present disclosure, Figure 12 it is shown that the first groove G1 surrounds a part of the opening region RA, and the second groove G2 completely surrounds the opening region RA. The first groove G1 can surround a part of the opening region RA, and the two ends of the first groove G1 can be connected to the third groove G3 included in the second non-display region NDA2. The second groove G2 can completely surround the opening region RA and can be connected to the fourth groove G4 included in the second non-display region NDA2. The third groove G3 and the fourth groove G4 can extend along the boundary of the substrate 100.

[0105] Figure 13 The scan lines SL of the first sub-non-display region SNDA1 shown in Figure 12 correspond to the scan lines bypassing the opening region RA described above with reference to

[0106] Figure 14 is a schematic partial plan view showing a display panel 10'' according to an exemplary embodiment of the present disclosure. Figure 15 is a plan view showing the peripheral region of the opening region RA surrounding Figure 14 . Figure 16 is a cross-sectional view of the peripheral region surrounding the opening region taken along the line XVI-XVI' of Figure 15 . To the extent that the detailed description of the specific elements and structures of the display panel 10'' is omitted, it can be assumed that the elements and structures not described are at least similar to the corresponding elements and structures of the display panel 10 described elsewhere in the specification with reference to Figures 3 to 10 .

[0107] Reference Figure 14 and Figure 15 , the opening region RA of the display panel 10'' can be partially surrounded by the display region DA. The pixels P can be relative toFigure 14 and Figure 15 The XY planes of Figure 14 and Figure 15 are spaced apart from each other above and below the opening region RA. The data line DL through which the data signal is transmitted to the pixel P above the opening region RA and the pixel P below the opening region RA can bypass the opening region RA in the first non-display region NDA1.

[0108] The opening region RA can be at least partially surrounded by the first groove G1 and the second groove G2. According to an exemplary embodiment of the present disclosure, Figure 15 It is shown that the first groove G1 surrounds a part of the opening region RA, and the second groove G2 completely surrounds the opening region RA. The first groove G1 can surround a part of the opening region RA, and the two ends of the first groove G1 can be connected to the third groove G3 included in the second non-display region NDA2. The second groove G2 can completely surround the opening region RA and can be connected to the fourth groove G4 included in the second non-display region NDA2. The third groove G3 and the fourth groove G4 can extend along the boundary of the substrate 100.

[0109] Figure 16 The data line DL in the first sub-non-display region SNDA1 shown in Figure 15 corresponds to the data line bypassing the opening region RA described above with reference to Figure 15 . The first groove G1 and the second groove G2 are included between the data line DL and the opening region RA. The structures of the first groove G1 and the second groove G2 and the elements surrounding the first groove G1 and the second groove G2 are at least similar to the structures of the first groove G1 and the second groove G2 and the elements surrounding the first groove G1 and the second groove G2 described above.

[0110] According to an exemplary embodiment of the present disclosure, moisture transmission in the lateral direction toward the display elements in the display region can be effectively blocked and prevented by grooves formed in the multilayer film surrounding the opening region and having an undercut structure, and moisture transmission prevention can be achieved regardless of the substrate type.

[0111] Although various exemplary embodiments of the present disclosure have been described herein with reference to the figures, those of ordinary skill in the art will understand that various changes in form and detail can be made therein without departing from the spirit and scope of the present disclosure.​​

Claims

1. A display panel, the display panel comprising: a substrate having an opening region and a display region at least partially surrounding the opening region; a plurality of display elements arranged in the display region, each of the plurality of display elements including a pixel electrode, a counter electrode, and an intermediate layer disposed between the pixel electrode and the counter electrode; a multilayer film including a first insulating layer disposed between the substrate and the pixel electrode and a second insulating layer disposed on the first insulating layer and having a material different from that of the first insulating layer; and a thin film encapsulation layer covering the plurality of display elements and including at least one organic encapsulation layer and at least one inorganic encapsulation layer, wherein the multilayer film includes a first groove provided between the opening region and the display region, wherein the first groove has an undercut structure in which a lower width of the first groove is greater than an upper width of the first groove, and wherein the first groove is defined by a first hole of the first insulating layer and a second hole of the second insulating layer, and each of inner sides of the second insulating layer facing the second hole protrudes toward a center of the first groove more than each of inner sides of the first insulating layer facing the first hole.

2. The display panel according to claim 1, wherein The first insulating layer is an organic insulating layer, and the second insulating layer is an inorganic insulating layer.

3. The display panel according to claim 1, wherein, The pixel electrode contacts an upper surface of the first insulating layer, and an end portion of the pixel electrode is covered by the second insulating layer.

4. The display panel according to claim 1, wherein, In the thin film encapsulation layer, the at least one inorganic encapsulation layer includes a first inorganic encapsulation layer and a second inorganic encapsulation layer, wherein the at least one organic encapsulation layer includes one organic encapsulation layer, and wherein the organic encapsulation layer is disposed between the first inorganic encapsulation layer and the second inorganic encapsulation layer.

5. The display panel according to claim 1, wherein, The at least one inorganic encapsulation layer covers an inner surface of the first groove.

6. The display panel according to claim 1, the display panel further comprising a third insulating layer disposed under the multilayer film, Among them, wherein the at least one inorganic encapsulation layer is in direct contact with the third insulating layer through the first groove.

7. The display panel according to claim 6, wherein, The third insulating layer is an inorganic insulating layer.

8. The display panel according to claim 1, wherein, The at least one organic encapsulation layer at least partially fills the first groove.

9. The display panel according to claim 1, wherein, The multilayer film further includes a second groove adjacent to the first groove, and the second groove is closer to the opening region than the first groove.

10. The display panel according to claim 9, wherein, An end portion of the at least one organic encapsulation layer is located between the first groove and the second groove.

11. The display panel according to claim 1, wherein, Both the substrate and the thin film encapsulation layer have openings corresponding to the opening region.

12. A display panel, the display panel comprising: a substrate having an opening region; a plurality of display elements arranged on the substrate, the plurality of display elements surrounding the opening region, and each of the plurality of display elements including a pixel electrode, a counter electrode, and an intermediate layer disposed between the pixel electrode and the counter electrode; a multilayer film including a first insulating layer disposed between the substrate and the pixel electrode and a second insulating layer provided on the first insulating layer; and an encapsulation layer covering the plurality of display elements, Wherein, the multi-layer film includes a first groove that surrounds the opening region and is recessed with respect to the depth direction of the multi-layer film. Wherein, the first groove has an undercut structure, in which the lower width of the first groove is greater than the upper width of the first groove, and Wherein, the first groove is defined by a first hole of the first insulating layer and a second hole of the second insulating layer, the upper width of the first groove corresponds to the width of the second hole, and the lower width of the first groove corresponds to the width of the first hole.

13. The display panel according to claim 12, wherein, The first insulating layer is in direct contact with the pixel electrode, and the second insulating layer covers the edge of the pixel electrode.

14. The display panel according to claim 12, wherein The first insulating layer is an organic insulating layer, and the second insulating layer is an inorganic insulating layer.

15. The display panel according to claim 12, wherein, The encapsulation layer includes at least one inorganic encapsulation layer and at least one organic encapsulation layer.

16. The display panel according to claim 15, wherein, The at least one inorganic encapsulation layer covers the entire inner surface of the first groove and is in direct contact with the inorganic insulating layer provided below the first insulating layer.

17. The display panel according to claim 12, wherein, At least one organic material layer in the intermediate layer and the counter electrode are both cut off with respect to the first groove.

18. The display panel according to claim 12, wherein, The inner side of the second insulating layer facing the second hole protrudes toward the center of the first groove more than the inner side of the first insulating layer facing the first hole.

19. The display panel according to claim 18, wherein The inner side of the second insulating layer protrudes toward the center of the first groove by at least 2 μm more than the inner side of the first insulating layer.

20. The display panel according to claim 12, wherein, Each of the plurality of display elements includes an organic light-emitting diode.

21. A display device, the display device comprising: A substrate having an opening region and a display region at least partially surrounding the opening region; A plurality of display elements arranged in the display region, each display element including a pixel electrode, a counter electrode, and an intermediate layer disposed between the pixel electrode and the counter electrode; A multi-layer film including an organic insulating layer disposed between the substrate and the pixel electrode and an inorganic insulating layer disposed on the organic insulating layer; And A thin-film encapsulation layer covering the plurality of display elements and including at least one organic encapsulation layer and at least one inorganic encapsulation layer, Wherein, the multi-layer film includes a first groove located between the opening region and the display region, Wherein, the first groove has an undercut structure, and Wherein, the first groove is defined by a first hole of the organic insulating layer and a second hole of the inorganic insulating layer, and each of the inner sides of the inorganic insulating layer facing the second hole protrudes toward the center of the first groove more than each of the inner sides of the organic insulating layer facing the first hole.

22. The display device according to claim 21, the display device further comprising an electronic component corresponding to the opening region.

23. The display device according to claim 22, wherein, The electronic component detects and / or generates light and / or sound.

24. The display device according to claim 21, wherein, Through the first groove, the at least one inorganic encapsulation layer is in direct contact with the insulating layer provided under the organic insulating layer.

25. The display device according to claim 24, wherein, The multi-layer film further includes a second groove located between the opening region and the first groove, and an end of the at least one organic encapsulation layer is located between the first groove and the second groove.

26. The display device according to claim 21, wherein, The substrate has an opening that passes from the top surface of the substrate to the bottom surface of the substrate.

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