Anti-transfer chip and radio frequency tag

Abstract

The present invention discloses an anti-transfer chip and a radio frequency tag, wherein the anti-transfer chip comprises: a chip; an electrical connection bump and a support bump fixedly arranged on one side of the chip facing the tag antenna; and further comprising: an anti-transfer bump fixedly arranged near the electrical connection bump and electrically connected to the electrical connection bump; a corrosion-prone protective layer coated on the surface of the anti-transfer bump, used to isolate the anti-transfer bump from the tag antenna after the anti-transfer chip is packaged together with the tag antenna, so that the anti-transfer bump and the tag antenna are not conductive; wherein, when the anti-transfer chip is transferred, the corrosion-prone protective layer coated on the surface of the anti-transfer bump will be corroded, causing the anti-transfer chip to short-circuit and fail after the transfer. The present invention utilizes the anti-transfer bump on the surface of the chip coated with the corrosion-prone protective layer to achieve physical damage to the chip during chip transfer, thereby effectively preventing the chip from being successfully transferred.

Description

Technical Field

[0001] The present invention relates to the technical field of electronic anti-counterfeiting, and in particular to an anti-transfer chip and a radio frequency tag. Background Art

[0002] In passive RFID anti-counterfeiting applications, preventing RFID tags from being transferred and reused is an important indicator for considering the anti-counterfeiting ability of the system. Common anti-transfer solutions mostly consider antenna anti-transfer, such as using fragile materials such as fragile paper and ceramic sheets as antenna substrates. When trying to transfer the tag, the antenna is damaged and the tag becomes invalid. However, the disadvantage of this method is that the chip is intact, and counterfeiters can use reagents to remove the chip intact from the tag, and then reversely encapsulate it on a new antenna, thereby achieving chip reuse. This solution only destroys the antenna and cannot completely achieve tag anti-transfer.

[0003] Another chip anti-transfer solution sets up a memory and a comparator in the chip. When the chip is powered on for the first time, the characteristic parameters of the external antenna are measured and recorded in the memory. In the working state after initialization, the chip measures the characteristic parameters of the external antenna and compares them with the values ​​in the memory. If they are inconsistent, it marks itself as having been transferred. This solution requires the design of special functional logic for the anti-transfer function, which increases the complexity and cost of chip design. Summary of the invention

[0004] The present invention provides an anti-transfer chip and a radio frequency tag, which solve the problem of RFID tag chip being transferred and reused without adding chip anti-transfer function logic.

[0005] The present invention provides an anti-transfer chip, the anti-transfer chip comprising:

[0006] chip;

[0007] An electrical connection bump fixedly arranged on a side of the chip facing the tag antenna, used to realize signal transmission between the chip and the tag antenna by electrically connecting to the tag antenna after the anti-transfer chip and the tag antenna are packaged together;

[0008] A supporting bump fixedly arranged on the side of the chip facing the tag antenna, used to support the chip after the anti-transfer chip and the tag antenna are packaged together;

[0009] The anti-transfer chip also includes:

[0010] an anti-transfer bump, which is fixedly disposed near the electrical connection bump and electrically connected to the electrical connection bump;

[0011] An easy-to-corrode protection layer, which is coated on the surface of the anti-transfer bump, and is used to isolate the anti-transfer bump from the tag antenna after the anti-transfer chip and the tag antenna are packaged together, so that the anti-transfer bump and the tag antenna are not conductive;

[0012] When the anti-transfer chip is transferred, the corrosion-prone protective layer coated on the surface of the anti-transfer bump will be corroded, causing the anti-transfer chip to fail due to a short circuit after the transfer.

[0013] Preferably, an anti-transfer bump with a surface coated with a corrosion-prone protective layer is fixedly arranged near at least one electrical connection bump.

[0014] Preferably, the number of the electrical connection bumps is 2, the number of the anti-transfer bump is 1, and the 1 anti-transfer bump is fixedly arranged near any one of the 2 electrical connection bumps and is electrically connected to the one electrical connection bump.

[0015] Preferably, the anti-transfer bump is a bump that is processed near an electrical connection bump on the chip during chip processing and has the same shape and size as the electrical connection bump.

[0016] Preferably, the corrosion-prone protective layer is a protective layer made of acid-soluble material.

[0017] Preferably, the anti-transfer bumps and the electrical connection bumps are both bumps made of gold material or copper material.

[0018] Preferably, the corrosion-prone protective layer coated on the surface of the anti-transfer bump will be corroded, causing the anti-transfer chip to short-circuit and fail after the transfer. Specifically, the corrosion-prone protective layer is corroded during the transfer of the anti-transfer chip, so that after the anti-transfer chip is packaged together with the new tag antenna, the anti-transfer bump and the electrical connection bump are simultaneously connected to the tag antenna, causing the chip to short-circuit and fail.

[0019] The present invention provides a radio frequency tag, the radio frequency tag comprising:

[0020] A tag antenna, comprising an antenna substrate and an antenna coil fixedly mounted on the antenna substrate;

[0021] The radio frequency tag also includes the anti-transfer chip mentioned above;

[0022] Among them, after the anti-transfer chip and the tag antenna are packaged together with conductive glue, the electrical connection bumps on the anti-transfer chip are connected to the antenna coil to realize signal transmission between the chip and the tag antenna; the anti-transfer bumps on the anti-transfer chip are isolated by the corrosion-prone protective layer coated on its surface and are not conductive to the antenna coil. When the anti-transfer chip is transferred, the corrosion-prone protective layer coated on the surface of the anti-transfer bumps will be corroded, causing the anti-transfer chip to short-circuit and fail after the transfer.

[0023] Preferably, the conductive adhesive is an anisotropic conductive adhesive.

[0024] Preferably, the corrosion-prone protective layer can be cleaned or corroded by a conductive glue cleaning solution when the anti-transfer chip is transferred.

[0025] The present invention realizes chip anti-transfer through the anti-transfer bumps with an easily corroded protective layer on the chip. Specifically, a layer of easily corroded protective layer is covered on the top surface of the anti-transfer bumps. When the chip is removed from the antenna, the protective layer will be corroded away. Therefore, after the chip is bound to a new antenna, the anti-transfer bumps without the protective layer are connected to the new antenna at the same time as the electrical connection bumps, causing the chip to short-circuit and fail, thereby achieving the purpose of chip anti-transfer. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] The present invention will be further described below in conjunction with the accompanying drawings and embodiments.

[0027] Figure 1 It is a schematic diagram of a chip anti-transfer process provided by an embodiment of the present invention;

[0028] Figure 2a and Figure 2b 1. The left side view and top view of the chip and bumps provided by the embodiment of the present invention;

[0029] Figure 3a and Figure 3b It is a left view and a top view of the binding position relationship between the chip and the tag antenna provided by the embodiment of the present invention;

[0030] Figure 4 It is a diagram of the implementation process of chip anti-transfer provided by an embodiment of the present invention. DETAILED DESCRIPTION

[0031] The preferred embodiments of the present invention are described in detail below in conjunction with the accompanying drawings. It should be understood that the preferred embodiments described below are only used to illustrate and explain the present invention, and are not used to limit the present invention.

[0032] An anti-transfer chip provided by an embodiment of the present invention includes: a chip; an electrical connection bump fixedly arranged on a side of the chip facing the tag antenna, used to realize signal transmission between the chip and the tag antenna by electrically connecting to the tag antenna after the anti-transfer chip and the tag antenna are packaged together; a supporting bump fixedly arranged on the side of the chip facing the tag antenna, used to support the chip after the anti-transfer chip and the tag antenna are packaged together; and an anti-transfer bump fixedly arranged near the electrical connection bump and electrically connected to the electrical connection bump; an easily corrosive protective layer coated on the surface of the anti-transfer bump, used to isolate the anti-transfer bump from the tag antenna after the anti-transfer chip and the tag antenna are packaged together so that the anti-transfer bump and the tag antenna are not conductive (or disconnected). Among them, when transferring the anti-transfer chip, the corrosion-prone protective layer coated on the surface of the anti-transfer bump will be corroded, causing the anti-transfer chip to short-circuit and fail after the transfer, that is, the corrosion-prone protective layer is corroded during the transfer of the anti-transfer chip, so that after the anti-transfer chip is packaged together with the new tag antenna, the anti-transfer bump and the electrical connection bump are simultaneously connected to the tag antenna, causing the chip to short-circuit and fail.

[0033] In this embodiment, there can be multiple electrical connection bumps, and there can also be multiple supporting bumps, and the multiple electrical connection bumps and the multiple supporting bumps are evenly distributed on the edge of the chip. For example, the number of the electrical connection bumps is 2, the number of the supporting bumps is 2, and the 2 electrical connection bumps and the 2 supporting bumps are evenly distributed on the edge of the chip. If the chip is rectangular, the 2 electrical connection bumps and the 2 supporting bumps can be arranged at the four corners of the chip respectively.

[0034] In this embodiment, the number of anti-transfer bumps may be less than or equal to the number of electrical connection bumps, and an anti-transfer bump with a corrosion-prone protective layer coated on the surface may be fixedly arranged near at least one electrical connection bump. For example, the number of the electrical connection bumps is 2 or more, and the number of the anti-transfer bumps is 1. In this case, one anti-transfer bump is fixedly arranged near any one of the multiple electrical connection bumps (for example, 2) and is electrically connected to the one electrical connection bump.

[0035] In this embodiment, the anti-transfer bump can be processed in the same manner as the electrical connection bump on the chip. In other words, the anti-transfer bump of the present invention is still essentially an electrical connection bump. Both the anti-transfer bump and the electrical connection bump can be bumps made of gold or copper. During the chip processing, a bump having the same shape and size as the electrical connection bump can be processed near an electrical connection bump on the chip as the anti-transfer bump.

[0036] In addition, since the anti-transfer chip and the tag antenna are usually connected by anisotropic conductive adhesive, the corrosion-prone protective layer can be coated only on the top surface of the anti-transfer bump. In other words, the corrosion-prone protective layer is coated at least on the top surface of the anti-transfer bump, thereby avoiding the anti-transfer bump and the electrical connection bump being connected to the antenna coil of the tag antenna at the same time after the anti-transfer chip is packaged together with the tag antenna, thereby preventing the chip from short-circuiting and failing.

[0037] The corrosion-prone protective layer may be a protective layer made of an acid-soluble material.

[0038] Based on the above anti-transfer chip, an embodiment of the present invention further provides a radio frequency tag, which includes the above anti-transfer chip and a tag antenna, and the anti-transfer chip and the tag antenna are packaged together by conductive adhesive.

[0039] In an embodiment of the present invention, the tag antenna may include an antenna substrate and an antenna coil fixedly mounted on the antenna substrate. The antenna substrate may be made of fragile materials such as fragile paper and ceramic sheets; and the number of the antenna coils may be one group.

[0040] After the anti-transfer chip and the tag antenna are packaged together by conductive glue, the electrical connection bumps on the anti-transfer chip are connected to the antenna coil to realize signal transmission between the chip and the tag antenna; the anti-transfer bumps on the anti-transfer chip are isolated by the corrosion-prone protective layer coated on its surface, and are not conductive (or disconnected) from the antenna coil, and when the anti-transfer chip is transferred, the corrosion-prone protective layer coated on the surface of the anti-transfer bumps will be corroded, causing the anti-transfer chip to short-circuit and fail after the transfer, that is, the corrosion-prone protective layer is corroded during the transfer of the anti-transfer chip, so that after the anti-transfer chip is packaged with the new tag antenna, the anti-transfer bumps and the electrical connection bumps are simultaneously connected to the tag antenna, causing the chip to short-circuit and fail.

[0041] Wherein, the above conductive adhesive is anisotropic conductive adhesive.

[0042] The corrosion-prone protective layer can be cleaned or corroded by a conductive glue cleaning solution used to clean the conductive glue when transferring the anti-transfer chip.

[0043] When implementing chip anti-transfer, the specific process of chip anti-transfer is as follows: Figure 1 As shown, the following steps are included:

[0044] Step S101: anti-transfer bumps with a surface coated with a corrosion-prone protective layer are arranged near the electrical connection bumps on the chip.

[0045] The anti-transfer bump and the electrical connection bump are both electrically connectable. To avoid introducing the anti-transfer bump into a loop formed by the electrical connection bump and the tag antenna and causing a short circuit, the present embodiment coats a protective layer on the surface of the anti-transfer bump, such as a corrosion-prone protective layer.

[0046] The step S101 may be specifically as follows: an anti-transfer bump with a surface coated with a corrosion-prone protective layer is provided near at least one electrical connection bump on the chip, for example, an anti-transfer bump with a surface coated with a corrosion-prone protective layer is provided near each electrical connection bump, or an anti-transfer bump with a surface coated with a corrosion-prone protective layer is provided near an electrical connection bump on the chip. Taking the provision of an anti-transfer bump with a surface coated with a corrosion-prone protective layer near an electrical connection bump on the chip as an example, during chip processing, for example, in the "long bump" step of chip processing, a bump with the same shape and size as the electrical connection bump is processed near an electrical connection bump on the chip as an anti-transfer bump, and a layer of corrosion-prone protective layer is covered (for example, sprayed) on the top surface of the anti-transfer bump to obtain the anti-transfer bump with a surface coated with a corrosion-prone protective layer.

[0047] Step S102: connecting the anti-transfer bumps coated with the corrosion-prone protective layer on the surface to the electrical connection bumps.

[0048] The step S102 may specifically be to connect the anti-transfer bumps coated with the corrosion-prone protective layer on the surface with the electrical connection bumps located near the anti-transfer bumps coated with the corrosion-prone protective layer on the surface inside the chip.

[0049] Step S103: After the chip and the tag antenna are packaged together, the electrical connection bumps are connected to the tag antenna, and the anti-transfer bumps coated with the corrosion-prone protective layer are not connected to the tag antenna (or are disconnected).

[0050] Assume that there are two electrical connection bumps on the chip, and an anti-transfer bump is set near one of the electrical connection bumps. The tag antenna includes a set of induction coils (or antenna coils), and the two electrical connection bumps are respectively connected to the antenna coils, so that the circuit on the chip is connected to the antenna coil through the two electrical connection bumps to achieve signal transmission. The anti-transfer bump has electrical connectivity like the electrical connection bump, and because the surface (e.g., top surface) of the anti-transfer bump is coated with a corrosion-prone protective layer, under the isolation of the corrosion-prone protective layer, the anti-transfer bump cannot be connected to the antenna coil, and a short circuit will not occur.

[0051] When transferring the chip, first, the chip and the tag antenna that have been packaged together need to be separated; secondly, the separated chip is immersed in a conductive glue cleaning solution to clean the conductive glue attached to the chip. While the conductive glue attached to the chip is cleaned with the conductive glue cleaning solution, the easily corroded protective layer is corroded by the conductive glue cleaning solution to obtain the anti-transfer bump that has lost the easily corroded protective layer; then the chip is packaged together with a new tag antenna, at which time the electrical connection bump is connected to the new tag antenna, and the anti-transfer bump that has lost the easily corroded protective layer is connected to the new tag antenna, so that the chip is short-circuited.

[0052] After the chip is bound to the new tag antenna, the corrosion-prone protective layer coated on the surface of the anti-transfer bumps has been corroded by the conductive glue cleaning solution. At this time, the electrical connection bumps are electrically connected to the anti-transfer bumps, the electrical connection bumps are electrically connected to the antenna coil of the new tag antenna, and the anti-transfer bumps are electrically connected to the antenna coil of the new tag antenna, resulting in a short circuit in the circuit, chip failure, and failure of chip transfer and reuse.

[0053] It should be noted that the number of bumps on the chip is large, the size is small and the appearance is basically the same. The absolute thickness of the corrosion-prone protective layer is extremely small relative to the thickness of the bumps and can be basically ignored. Therefore, before and after the corrosion-prone protective layer is corroded by the conductive glue cleaning solution, the anti-transfer bumps coated with the corrosion-prone protective layer and the anti-transfer bumps that have lost the corrosion-prone protective layer are basically the same as other bumps on the chip in appearance. Therefore, it is extremely difficult to distinguish the anti-transfer bumps of this embodiment from the multiple bumps of the chip during the transfer and then transfer the chip by re-adding the protective layer.

[0054] The embodiments of the present invention can effectively prevent chip transfer and reuse, and are suitable for chip anti-transfer scenarios such as identity chip anti-transfer scenarios based on RFID tags, commodity anti-counterfeiting chip anti-transfer scenarios, and ticket chip anti-transfer scenarios.

[0055] The present invention takes the destruction of the chip as a starting point, and effectively realizes the anti-transfer of the tag by physically destroying the chip. Specifically, the chip of the present invention is electrically connected to the antenna through bumps, and there are anti-transfer bumps on the chip. The anti-transfer bumps cannot be connected to the antenna when the chip is in use. The present invention covers the surface of the anti-transfer bumps with a protective layer that is easily cleaned or corroded by a conductive adhesive cleaning solution. When the chip is removed from the antenna, this protective layer will be cleaned or corroded. When bound again, the anti-transfer bumps will be connected to the antenna, causing the chip to fail, thereby achieving the purpose of anti-transfer. The present invention relates to passive RFID chip processing and packaging technology, which can be applied to the field of chip anti-transfer based on RFID tags. To further illustrate the technical principles and implementation process of the present invention, the following is combined with Figures 2a to 4 Provide detailed explanation.

[0056] Figure 2aand Figure 2b 1 is a left view and a top view of a chip and a bump provided by an embodiment of the present invention, such as Figure 2a and Figure 2b As shown, the chip 9 is rectangular, and its four corners are respectively provided with electrical connection bumps 1 and 2, and support bumps 4 and 5. An anti-transfer bump 3 is arranged between the electrical connection bump 2 and the support bump 5, close to the electrical connection bump 2. The outer surface (e.g., the top surface) of the anti-transfer bump 3 is covered with a corrosion-prone protective layer 3', such as a protective layer that is easily corroded by strong acids, to form an anti-transfer bump 3 with a surface coated with a corrosion-prone protective layer 3'.

[0057] The electrical connection bumps 1 and 2 have electrical connectivity and can be connected to the tag antenna to form a loop;

[0058] The anti-transfer bump 3 has electrical connectivity and can be connected to the tag antenna to form a loop. However, due to the corrosion-prone protective layer 3' on its surface, the anti-transfer bump 3 cannot be connected to the tag antenna to form a loop.

[0059] The supporting bumps 4 and 5 do not have electrical connectivity, and they support the chip 9 when the chip 9 is packaged together with the tag antenna.

[0060] Figure 3a and Figure 3b 1 is a left view and a top view of the binding position relationship between the chip and the tag antenna provided by the embodiment of the present invention, such as Figure 3a and Figure 3b As shown, the tag antenna includes an antenna substrate 6 (the material is generally PET, coated paper, fragile paper, etc.) and a group of antenna coils 8 fixedly mounted on the antenna substrate 6.

[0061] A chip 9 with electrical connection bumps 1 and 2, supporting bumps 4 and 5, and anti-transfer bumps 3 coated with a corrosion-prone protective layer 3' is invertedly packaged on the tag antenna, so that the electrical connection bumps 1 are connected and conducted to the antenna coil 8 through the anisotropic conductive adhesive 7, the electrical connection bumps 2 are connected and conducted to the antenna coil 8 through the anisotropic conductive adhesive 7, and the anti-transfer bumps 3 are not connected and conducted to the antenna coil 8 due to the isolation of the corrosion-prone protective layer 3' coated on the top surface.

[0062] Figure 4 FIG. 1 is a diagram of the implementation process of chip anti-transfer provided by an embodiment of the present invention, such as Figure 4 As shown, the following steps are included:

[0063] Step S201, chip processing (or chip bump processing).

[0064] The chip is provided with electrical connection bumps 1 and 2, anti-transfer bumps 3, and support bumps (or mechanical support bumps) 4 and 5 through chip bump processing.

[0065] Among them, the electrical connection bumps 1 and 2 form a loop between the chip and the antenna through the conductive glue; the supporting bumps 4 and 5 only play a supporting role and have no electrical connectivity.

[0066] The present invention adds a protective layer 3' which is easily corroded by acid on the anti-transfer bump 3. After the protective layer 3' is formed on the surface of the anti-transfer bump 3, the anti-transfer bump 3 cannot be connected to the antenna.

[0067] The protective layer 3' may be made of acid-soluble material.

[0068] Step S202: Label packaging, using a common inverted packaging method.

[0069] Flip packaging refers to a packaging form in which the chip bumps downward and is connected to the tag antenna. The specific process is to first apply anisotropic conductive glue at the antenna connection, then press the chip bumps downward onto the conductive glue, and then use a hot press head (with a certain temperature and pressure) to press it onto the chip surface to solidify the conductive glue to achieve conduction between the chip and the antenna.

[0070] At present, all common RFID tags are in the form of inverted packaging. According to needs, there are also coils with winding technology that use chips in module form, and their packaging form is gold wire bonding (Bonding).

[0071] Step S203: label cutting.

[0072] Step S204: Get the chip.

[0073] First remove the chip from the label, which now has conductive glue on it.

[0074] Specifically, since the main material of anisotropic conductive adhesive is epoxy resin, the conductive adhesive can be dissolved by strong acid solution. Therefore, the label is generally immersed in the strong acid solution for a period of time. After the conductive adhesive is dissolved, the chip and the antenna are separated. At this time, there may be residual conductive adhesive on the surface of the chip and the antenna.

[0075] The chip is then cleaned.

[0076] Specifically, the chip is cleaned using a conductive adhesive cleaning solution, which will wash away the protective layer on the surface of the anti-transfer bumps and expose the anti-transfer bumps.

[0077] Step S205: Rebind the chip to the new tag antenna.

[0078] The anti-transfer bumps and the electrical connection bumps are both connected to the new tag antenna, which will cause the chip to short-circuit and fail.

[0079] The anti-transfer bumps and electrical connection bumps of the present invention cannot be connected to the antenna at the same time. Specifically, before the present invention, the chip does not grow anti-transfer bumps, that is, there are no anti-transfer bumps on the chip, and this position is completely covered by the protective layer on the surface of the chip. The present invention provides an anti-transfer bump with a surface coated with a corrosion-prone protective layer connected to the electrical connection node near the electrical connection node on the chip, thereby ensuring that the chip can work normally after being bound to the tag antenna. After the protective layer on the surface of the anti-transfer bump is destroyed during chip transfer, the anti-transfer bump and the electrical connection bump are connected to the new tag antenna at the same time, causing the chip to short-circuit and fail, ensuring that the chip cannot be successfully transferred and reused.

[0080] In summary, the present invention has the following technical effects:

[0081] 1. In the process of cleaning the conductive adhesive, the present invention destroys the protective layer on the surface of the anti-transfer bumps, so that when the chip is bound to a new tag antenna and works, the anti-transfer bumps and the electrical connection bumps are simultaneously connected and conducted with the tag antenna, causing the chip to short-circuit and fail, thereby effectively preventing the transfer and reuse of the RFID chip.

[0082] 2. The present invention achieves chip anti-transfer by destroying the physical structure of the chip, without the need to design anti-transfer function logic specifically for the chip, thus avoiding increasing chip design complexity and design cost.

[0083] Although the present invention is described in detail above, the present invention is not limited thereto, and those skilled in the art can make various modifications based on the principles of the present invention. Therefore, all modifications made based on the principles of the present invention should be understood to fall within the protection scope of the present invention.

Claims

1. An anti-transfer chip, comprising: chip; An electrical connection bump fixedly arranged on a side of the chip facing the tag antenna, used to realize signal transmission between the chip and the tag antenna by electrically connecting to the tag antenna after the anti-transfer chip and the tag antenna are packaged together; A supporting bump fixedly arranged on the side of the chip facing the tag antenna, used to support the chip after the anti-transfer chip and the tag antenna are packaged together; Characterized in that the anti-transfer chip also includes: an anti-transfer bump, which is fixedly disposed near the electrical connection bump and electrically connected to the electrical connection bump; An easy-to-corrode protection layer, which is coated on the surface of the anti-transfer bump, and is used to isolate the anti-transfer bump from the tag antenna after the anti-transfer chip and the tag antenna are packaged together, so that the anti-transfer bump and the tag antenna are not conductive; Wherein, when the anti-transfer chip is transferred, the corrosion-prone protective layer coated on the surface of the anti-transfer bump will be corroded, causing the anti-transfer chip to short-circuit and fail after the transfer; The anti-transfer bumps and the electrical connection bumps are both bumps made of gold material or copper material.

2. The anti-transfer chip according to claim 1, characterized in that: An anti-transfer bump with a corrosion-prone protective layer on its surface is fixedly arranged near at least one electrical connection bump.

3. The anti-transfer chip according to claim 2, characterized in that: The number of the electrical connection bumps is 2, the number of the anti-transfer bump is 1, and the 1 anti-transfer bump is fixedly arranged near any one of the 2 electrical connection bumps and is electrically connected to the one electrical connection bump.

4. The anti-transfer chip according to claim 3, characterized in that: The anti-transfer bump is a bump that is processed near an electrical connection bump on the chip during chip processing and has the same shape and size as the electrical connection bump.

5. The anti-transfer chip according to any one of claims 1 to 4, characterized in that: The corrosion-prone protective layer is a protective layer made of acid-soluble material.

6. The anti-transfer chip according to any one of claims 1 to 4, characterized in that: The corrosion-prone protective layer coated on the surface of the anti-transfer bump will be corroded, causing the anti-transfer chip to short-circuit and fail after the transfer. Specifically, the corrosion-prone protective layer is corroded during the transfer of the anti-transfer chip, so that after the anti-transfer chip is packaged together with the new tag antenna, the anti-transfer bump and the electrical connection bump are simultaneously connected to the tag antenna, causing the chip to short-circuit and fail.

7. A radio frequency tag, comprising: A tag antenna, comprising an antenna substrate and an antenna coil fixedly mounted on the antenna substrate; It is characterized in that the radio frequency tag also includes the anti-transfer chip according to any one of claims 1 to 6; Among them, after the anti-transfer chip and the tag antenna are packaged together with conductive glue, the electrical connection bumps on the anti-transfer chip are connected to the antenna coil to realize signal transmission between the chip and the tag antenna; the anti-transfer bumps on the anti-transfer chip are isolated by the corrosion-prone protective layer coated on its surface and are not conductive to the antenna coil. When the anti-transfer chip is transferred, the corrosion-prone protective layer coated on the surface of the anti-transfer bumps will be corroded, causing the anti-transfer chip to short-circuit and fail after the transfer.

8. The radio frequency tag according to claim 7, characterized in that: The conductive adhesive is anisotropic conductive adhesive.

9. The radio frequency tag according to claim 7, characterized in that: The corrosion-prone protective layer can be cleaned or corroded by a conductive glue cleaning solution used to clean the conductive glue when transferring the anti-transfer chip.

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