A copper-coated aluminum bonding pin and bonding device thereof

Abstract

The present invention relates to the technical field of wire bonding devices, and discloses a copper-clad aluminum bonding pin, including a pin, wherein the right end of the pin is provided with symmetrically distributed bosses, and the thickness of the bosses is less than the thickness of the pin. The copper-clad aluminum bonding pin and its bonding device, through the use of the boss connected to the pin, the boss passes through the placement groove, so that the pin can be stably connected to the inside of the substrate, and will not be lifted or loosened during use; and through the use of the bolt rod, the second card slot provided on the bolt rod is connected to the card block inside the substrate, and the upward elastic force generated by the spring on the bolt rod self-locks the substrate and the sealing plate, and will not be loosened. At the same time, through the coordinated use of the copper block and the cylinder, the copper block is stably connected to the pin, and the stability of the oxide generated by the copper block during the bonding process is better than that of the aluminum oxide, so that the bonding point is more stable, and the purpose of stable bonding is achieved.

Description

Technical Field

[0001] The present invention relates to the technical field of wire bonding devices, and in particular to a copper-coated aluminum bonding pin and a bonding device thereof. Background Art

[0002] Wire bonding is the most common chip bonding technology, which can meet the needs of large consumer electronic products, civilian products and military products. More than 96% of IC packaging in the world uses wire bonding. Before wire bonding, it is necessary to use adhesive materials to connect the back of the semiconductor chip to the chip carrier, and then use metal wires to connect the electrode leads on the integrated circuit (IC) chip to the external leads of the integrated circuit base with the help of special bonding devices. Therefore, the quality of the wire connection directly affects the yield rate of device manufacturing and the stability of the device. Often, a qualified chip is scrapped due to broken wires, dotted lines and short circuits.

[0003] The existing aluminum wire lead bonding process has high requirements on the overall flatness of the pins injection molded in the bonding device. The warping of the pins during use will lead to poor aluminum wire bonding. In severe cases, the aluminum wire will fall off and cause the product to fail. In addition, external vibrations during use will affect the bonding device and cause the connection part to loosen. On the other hand, metal oxides are produced during the aluminum wire bonding process, and the structure is unstable, which can easily cause the aluminum wire bonding point to fall off. Therefore, a copper-clad aluminum bonding pin and a bonding device thereof are proposed to solve the above-mentioned problems. Summary of the invention

[0004] 1. Technical issues to be solved

[0005] In view of the deficiencies in the prior art, the present invention provides a copper-clad aluminum bonding pin and a bonding device thereof, which have the advantages of stable bonding, etc., and solve the problem that the warping of the pin in the existing aluminum wire lead bonding process will lead to poor aluminum wire bonding, and in severe cases, the aluminum wire will fall off and cause the product to fail. In addition, external vibrations during use will affect the bonding device and cause the connection part to loosen. On the other hand, metal oxides are generated during the aluminum wire bonding process, the structure is unstable, and the aluminum wire bonding point is easily caused to fall off.

[0006] (II) Technical solution

[0007] In order to achieve the above-mentioned purpose of stable bonding, the present invention provides the following technical solution: a copper-coated aluminum bonding pin, comprising a pin, wherein the right end of the pin is provided with symmetrically distributed bosses, and the thickness of the bosses is less than the thickness of the pin;

[0008] The left end of the plug pin also includes a copper block, and the bottom of the copper block is connected to a plurality of cylinders for fixing the copper block on the plug pin.

[0009] A bonding device for copper-clad aluminum bonding pins including the above content, characterized in that: it includes a substrate, a self-locking component is connected to the substrate, a sealing plate is installed on the substrate through the self-locking component, and a plurality of pins are installed inside the substrate through the sealing plate;

[0010] The self-locking assembly includes a pressing part and a locking part. The pressing part is movably connected to the upper end of the locking part. The pressing part is used to press and rotate the locking part. The locking part connects the base plate and the sealing plate and performs self-locking.

[0011] The locking part includes a bolt rod with a second slot, a spring sleeved on the bolt rod, a positioning strip connected to the upper end of the bolt rod, a block inserted in the second slot, and the elastic force generated by the spring tightly connects the bolt rod with the second slot and the block.

[0012] Preferably, the pressing portion includes a movable bolt head and an elastic block, the elastic block is connected to the inside of the movable bolt head, and the inner wall of the movable bolt head is provided with a first clamping groove.

[0013] Preferably, the positioning bar is movably connected to the inside of the first card slot adapted thereto.

[0014] Preferably, a second circular hole is further provided on the base plate, and one end of the card block away from the second card slot is fixedly connected in the second circular hole.

[0015] Preferably, the substrate is further provided with a plurality of placement grooves, the placement grooves being used to place the plug pins, and the bosses pass through the placement grooves to fix the plug pins in the horizontal direction.

[0016] Preferably, a plurality of pressure strips are connected to the interior of the sealing plate to fix the pins in the longitudinal direction.

[0017] Preferably, a sealing strip is installed on the substrate, and a sealing groove is formed on the sealing plate. The sealing strip and the sealing groove match each other to seal the substrate and the sealing plate.

[0018] (III) Beneficial effects

[0019] Compared with the prior art, the present invention provides a copper-clad aluminum bonding pin and a bonding device thereof, which have the following beneficial effects:

[0020] 1. The copper-clad aluminum bonding pin and its bonding device use a boss connected to the pin, which penetrates the placement groove, so that the pin can be stably connected to the inside of the substrate, and will not be lifted or loosened during use; and through the use of a bolt rod, a second card slot on the bolt rod is connected to a card block inside the substrate, and the upward elastic force generated by the spring on the bolt rod self-locks the substrate and the sealing plate, and will not be loosened. Through the coordinated use of the first card slot inside the movable bolt, the positioning strip on the bolt rod and the elastic block, under normal circumstances, the elastic block separates the positioning strip and the first card slot, and the rotation of the movable bolt will not It affects the bolt rod. After pressing the movable bolt head to engage the positioning strip and the first slot, rotating the movable bolt can drive the bolt rod to rotate, thereby realizing the self-locking function of the self-locking component. Under normal circumstances, the bolt rod will not rotate, and the elastic block reduces the transmission of vibration, thereby avoiding the influence of external vibration, making it difficult for the substrate and the sealing plate to loosen, and then making it difficult for the pin to loosen; at the same time, through the coordinated use of the copper block and the cylinder, the copper block is stably connected to the pin, and the stability of the oxide generated by the copper block during the bonding process is better than that of the aluminum oxide, so that the bonding point is more stable, thereby achieving the purpose of stable bonding.

[0021] 2. The copper-clad aluminum bonding pin and its bonding device can separate the substrate and the sealing plate by pressing the movable bolt downward to connect the positioning bar and the first slot, and rotating the bolt rod to separate the second slot and the block, thereby removing the pin and facilitating the replacement of the pin. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 A three-dimensional schematic diagram of a bonding device for a copper-clad aluminum bonding pin proposed by the present invention.

[0023] Figure 2 The present invention is a schematic cross-sectional view of a bonding device for a copper-clad aluminum bonding pin.

[0024] Figure 3 For the present invention Figure 2 Enlarged schematic diagram at point A in the middle.

[0025] Figure 4 For the present invention Figure 2 Enlarged schematic diagram of point B in the middle.

[0026] Figure 5 A schematic diagram of a sealing plate in a bonding device for copper-clad aluminum bonding pins proposed in the present invention.

[0027] Figure 6 A schematic diagram of a self-locking component in a bonding device for a copper-clad aluminum bonding pin proposed in the present invention.

[0028] Figure 7A schematic cross-sectional view of a self-locking component in a bonding device for a copper-clad aluminum bonding pin proposed in the present invention.

[0029] Figure 8 A schematic diagram of a copper-clad aluminum bonding pin proposed in the present invention.

[0030] In the figure: 1 sealing plate, 2 pressure strip, 3 base plate, 4 pin, 5 self-locking component, 6 boss, 7 sealing groove, 8 sealing strip, 9 clamping block, 10 bolt rod, 11 second circular hole, 12 positioning strip, 13 elastic block, 14 movable bolt head, 15 first clamping slot, 16 second clamping slot, 17 spring, 18 copper block, 19 cylinder. DETAILED DESCRIPTION

[0031] The following will be combined with the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0032] See also Figure 1-8 ,in Figure 8 It is a copper-clad aluminum bonding pin, including a pin 4. The right end of the pin 4 is provided with symmetrically distributed bosses 6, and the thickness of the bosses 6 is less than the thickness of the pin 4; the left end of the pin 4 also includes a copper block 18, and the bottom of the copper block 18 is connected to a plurality of cylinders 19 for fixing the copper block 18 on the pin 4. The copper block 18 generates oxides during the bonding process. The stability of copper oxides is better than that of aluminum oxides, thereby increasing the stability of the bonding point.

[0033] Figure 1-7 A bonding device for copper-coated aluminum bonding pins, characterized in that: comprising a substrate 3, a self-locking component 5 is connected to the substrate 3, a sealing plate 1 is installed on the substrate 3 through the self-locking component 5, and a plurality of pins 4 are installed inside the substrate 3 through the sealing plate 1;

[0034] The self-locking assembly 5 includes a pressing part and a locking part, the pressing part is movably connected to the upper end of the locking part, the pressing part is used to press and rotate the locking part, the locking part connects the base plate 3 and the sealing plate 1 and performs self-locking; the pressing part includes a movable bolt head 14 and an elastic block 13, the elastic block 13 is connected to the inside of the movable bolt head 14, the elastic force of the elastic block 13 makes the first clamping groove 15 in the movable bolt head 14 separate from the positioning strip 12 under normal conditions, and at the same time reduces the influence of vibration on the bolt rod 10, and the inner wall of the movable bolt head 14 is provided with a first clamping groove 15;

[0035] The locking part includes a bolt rod 10 provided with a second slot 16, a spring 17 is sleeved on the bolt rod 10, a positioning strip 12 is connected to the upper end of the bolt rod 10, and the positioning strip 12 is movably connected to the inside of the first slot 15 adapted thereto, so that the movable bolt head 14 can move up and down, and a clamping block 9 is inserted into the second slot 16. The elastic force generated by the spring 17 makes the bolt rod 10 provided with the second slot 16 and the clamping block 9 tightly connected, so that the bolt rod 10 is difficult to rotate;

[0036] A second circular hole 11 is also provided on the base plate 3, and one end of the card block 9 away from the second card slot 16 is fixedly connected to the second circular hole 11; a plurality of placement grooves are also provided on the base plate 3, and the placement grooves are used to place the pins 4, and the bosses 6 pass through the placement grooves to fix the pins 4 in the horizontal direction; a plurality of pressure strips 2 are connected to the inside of the sealing plate 1 to fix the pins 4 in the longitudinal direction, so that the pins 4 are stably placed in the inside of the substrate 3 and will not loosen; the sealing plate 1 is also provided with a sealing groove 7, and a sealing strip 8 is also installed on the base plate 3, and the sealing strip 8 matches the sealing groove 7 to seal the base plate 3 and the sealing plate 1 to prevent external water and dust from entering the inside.

[0037] The beneficial effects of the present invention are as follows: by using the boss 6 connected to the plug pin 4, the boss 6 passes through the placement groove, so that the plug pin 4 can be stably connected to the inside of the substrate 3, and will not tilt or loosen during use; and by using the bolt rod 10, the second card slot 16 opened on the bolt rod 10 is connected to the card block 9 inside the substrate 3, and the upward elastic force generated by the spring 17 on the bolt rod 10 self-locks the substrate 3 and the sealing plate 1, and will not loosen. By using the first card slot 15 inside the movable bolt 14, the positioning strip 12 on the bolt rod 10 and the elastic block 13, under normal circumstances, the elastic block 13 separates the positioning strip 12 and the first card slot 15, and the rotation of the movable bolt 14 is not It will have an impact on the bolt rod. After pressing the movable bolt head 14 to engage the positioning strip 12 and the first slot 15, rotating the movable bolt 14 can drive the bolt rod 10 to rotate, thereby realizing the self-locking function of the self-locking component 5. Under normal circumstances, the bolt rod 10 will not rotate, and the elastic block 13 reduces the transmission of vibration, avoids the influence of external vibration, and makes it difficult for the substrate 3 and the sealing plate 1 to loosen, and then makes it difficult for the pin to loosen; at the same time, through the coordinated use of the copper block 18 and the cylinder 19, the copper block 18 is stably connected to the pin 4, and the stability of the oxide generated by the copper block 18 during the bonding process is better than that of the aluminum oxide, so that the bonding point is more stable, and the purpose of stable bonding is achieved.

[0038] And by pressing the movable bolt 14 downward to connect the positioning strip 12 and the first slot 15, and rotating the bolt rod 10 to separate the second slot 16 and the block 19, the substrate 3 and the sealing plate 1 can be separated, and then the pin 4 can be taken out, thereby achieving the purpose of facilitating the replacement of the pin 4 and solving the problem that the pin warping in the existing aluminum wire lead bonding process will lead to poor aluminum wire bonding, and in severe cases, the aluminum wire will fall off and cause the product to fail, and the external vibration during use will affect the bonding device and cause the connection part to loosen. On the other hand, metal oxides are produced during the aluminum wire bonding process, the structure is unstable, and it is easy to cause the aluminum wire bonding point to fall off.

[0039] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A copper-coated aluminum bonding pin, characterized in that : comprising an insertion pin (4), wherein the right end of the insertion pin (4) is provided with symmetrically distributed bosses (6), and the thickness of the bosses (6) is less than the thickness of the insertion pin (4); The left end of the plug pin (4) also includes a copper block (18), and the bottom of the copper block (18) is connected to a plurality of cylinders (19) for fixing the copper block (18) on the plug pin (4).

2. A bonding device comprising the copper-clad aluminum bonding pin according to claim 1, characterized in that: It comprises a base plate (3), a self-locking component (5) is connected to the base plate (3), a sealing plate (1) is installed on the base plate (3) through the self-locking component (5), and a plurality of pins (4) are installed inside the base plate (3) through the sealing plate (1); The self-locking assembly (5) comprises a pressing part and a locking part, wherein the pressing part is movably connected to the upper end of the locking part, and the pressing part is used to press and rotate the locking part, and the locking part connects the base plate (3) and the sealing plate (1) and performs self-locking.

3. The bonding device of the copper-clad aluminum bonding pin according to claim 2, characterized in that: The locking portion comprises a bolt rod (10) provided with a second clamping groove (16), a spring (17) is sleeved on the bolt rod (10), a positioning strip (12) is connected to the upper end of the bolt rod (10), a clamping block (9) is inserted into the second clamping groove (16), and the elastic force generated by the spring (17) tightly connects the bolt rod (10) provided with the second clamping groove (16) and the clamping block (9).

4. The bonding device of the copper-clad aluminum bonding pin according to claim 3, characterized in that: The pressing part comprises a movable bolt head (14) and an elastic block (13); the elastic block (13) is connected to the inside of the movable bolt head (14); and a first clamping groove (15) is provided on the inner wall of the movable bolt head (14).

5. A bonding device for copper-clad aluminum bonding pins according to claim 3 or 4, characterized in that: The positioning strip (12) is movably connected inside a first card slot (15) adapted thereto.

6. The bonding device of the copper-clad aluminum bonding pin according to claim 3, characterized in that: A second circular hole (11) is also provided on the base plate (3), and one end of the clamping block (9) away from the second clamping groove (16) is fixedly connected in the second circular hole (11).

7. The bonding device of the copper-clad aluminum bonding pin according to claim 2, characterized in that: The base plate (3) is also provided with a plurality of placement grooves, the placement grooves being used to place the insertion pins (4), and the bosses (6) passing through the placement grooves to fix the insertion pins (4) in the horizontal direction.

8. The bonding device of copper-clad aluminum bonding pin according to claim 2, characterized in that: The sealing plate (1) is internally connected with a plurality of pressure strips (2) for fixing the insertion pins (4) in the longitudinal direction.

9. The bonding device of copper-clad aluminum bonding pin according to claim 2, characterized in that: A sealing strip (8) is also installed on the substrate (3), and a sealing groove (7) is also provided on the sealing plate (1). The sealing strip (8) and the sealing groove (7) match each other to seal the substrate (3) and the sealing plate (1).

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