Photosensitive Component, Camera Module and Mobile Terminal

Abstract

The present invention relates to a photosensitive component, a camera module and a mobile terminal. The photosensitive component includes: a circuit board including a bearing surface having a chip mounting portion and a frame portion; a photosensitive chip disposed on the chip mounting portion, the photosensitive surface including a photosensitive portion; a bracket including a support plate, the support plate being located on one side of the photosensitive chip, and the edge of the support plate being spaced from the frame portion to form a first notch in the circumferential direction; a sealing member for sealing the first notch; the photosensitive component further includes an anti-overflow glue member, when the sealing member is formed after flowing through the first notch by a material that can flow and has viscosity and curing between the support plate and the circuit board, the anti-overflow glue member is used to block the material for forming the sealing member from flowing to the photosensitive portion of the photosensitive chip. In the above photosensitive component, by providing an anti-overflow glue member between the circuit board and the support plate, it can effectively prevent the photosensitive portion of the photosensitive chip from being contaminated by the material for forming the sealing member, and avoid the situation of reduced imaging quality.

Description

[0001] This invention claims the priority of a Chinese patent application with an application date of August 28, 2018 and an application number of 201810987852.2. Technical Field

[0002] This invention relates to the field of imaging technology, and particularly to a photosensitive component, an imaging module, and a mobile terminal. Background Art

[0003] In recent years, electronic devices have increasingly shown a trend of miniaturization, which has put more stringent requirements on the size of the imaging module, one of the standard configurations of electronic devices. At the same time, the requirements for the pixel and quality of the imaging module are also getting higher and higher.

[0004] A traditional imaging module usually includes a circuit board, a photosensitive chip, electronic components, a bracket, and a lens. The photosensitive chip and electronic components are both disposed on the circuit board. The electronic components are located outside the photosensitive chip. The bracket is disposed on the circuit board. The bracket is a hollow structure with openings at both ends to accommodate the photosensitive chip and electronic components within the bracket. The lens is disposed at one end of the bracket away from the circuit board. When assembling the above imaging module, the side wall of the bracket is connected to the circuit board through glue applied to the circuit board. The side wall of the bracket needs to maintain a safety distance from the electronic components, resulting in a relatively large size of the imaging module.

[0005] To reduce the size of the imaging module, a bracket without side walls or a bracket with some side walls missing can be used to omit the side walls corresponding to the electronic components. Thus, when assembling, the safety distance between the bracket and the electronic components does not need to be reserved, and an imaging module with a smaller size can be obtained. However, a bracket without side walls or a bracket with some side walls missing will form a notch in the circumferential direction. Subsequently, a material that can flow and has viscosity can be filled in from the notch. After the material solidifies, a sealing member for closing the notch can be formed. During the process of forming the sealing member, the material for forming the sealing member may flow to the photosensitive part of the photosensitive chip, affecting the photosensitive performance of the photosensitive chip and resulting in a reduction in imaging quality. Summary of the Invention

[0006] Based on this, it is necessary to provide a photosensitive component, an imaging module, and a mobile terminal to address the problem that the material for forming the sealing member may flow to the photosensitive part of the photosensitive chip, affecting the photosensitive performance of the photosensitive chip and resulting in a reduction in imaging quality.

[0007] A photosensitive component includes:

[0008] A circuit board, including a bearing surface, the bearing surface including a chip mounting portion and a frame portion located outside the chip mounting portion;

[0009] A photosensitive chip is disposed on the chip mounting portion. The surface of the photosensitive chip away from the circuit board is a photosensitive surface, and the photosensitive surface includes a photosensitive portion.

[0010] A bracket includes a support plate. The support plate is located on the side of the photosensitive chip away from the bearing surface. The edge of the support plate is spaced from the frame portion, forming a first notch in the circumferential direction.

[0011] A sealing member is disposed in the first notch to seal the first notch.

[0012] Wherein, the photosensitive component further includes an anti-overflow glue member disposed between the circuit board and the support plate. When the sealing member is formed by curing after flowing through the first notch from a material that can flow and has viscosity between the support plate and the circuit board, the anti-overflow glue member is used to block the material forming the sealing member from flowing to the photosensitive portion of the photosensitive chip.

[0013] In the above photosensitive component, by providing an anti-overflow glue member between the circuit board and the support plate, when the sealing member is formed by curing after flowing through the first notch from a material that can flow and has viscosity between the support plate and the circuit board, the anti-overflow glue member can block the material forming the sealing member from flowing to the photosensitive portion of the photosensitive chip, thereby effectively avoiding the photosensitive portion of the photosensitive chip being contaminated by the material for forming the sealing member and avoiding the reduction of imaging quality.

[0014] In one embodiment, the support plate is provided with a light passing hole facing the photosensitive portion. The anti-overflow glue member is disposed on the surface of the support plate close to the circuit board, and the anti-overflow glue member is a closed ring structure surrounding the light passing hole for one week. Disposing the anti-overflow glue member on the support plate can avoid the anti-overflow glue member occupying the area of the circuit board for arranging electronic components, and the closed ring structure can prevent overflow glue more comprehensively.

[0015] In one embodiment, the support plate is provided with a light passing hole facing the photosensitive portion. The anti-overflow glue member is disposed on the surface of the support plate close to the circuit board, and the anti-overflow glue member includes a plurality of anti-overflow glue blocks. The plurality of anti-overflow glue blocks are spaced around the light passing hole. Disposing the anti-overflow glue member on the support plate can avoid the anti-overflow glue member occupying the area of the circuit board for arranging electronic components, and the plurality of anti-overflow glue blocks are spaced around the light passing hole, which can not only prevent overflow glue well, but also form a space for avoiding electronic components between adjacent two anti-overflow glue blocks according to actual design requirements.

[0016] In one embodiment, the support plate is provided with a light passing hole facing the photosensitive part. The anti-overflow glue member is arranged on the surface of the support plate close to the circuit board. The support plate is provided with an air escape hole penetrating through the opposite two surfaces of the support plate. The surface of the support plate close to the circuit board is provided with an air escape groove. Two ends of the air escape groove are respectively communicated with the air escape hole and the light passing hole. One end of the anti-overflow glue member is adjacent to one side of the air escape groove, and the other end extends around the light passing hole to the other side of the air escape groove and is adjacent to the other side of the air escape groove. The anti-overflow glue member is arranged on the support plate, which can avoid the anti-overflow glue member occupying the area of the circuit board for arranging electronic components. Moreover, the above structure can not only prevent overflow glue well but also facilitate the escape of gas.

[0017] In one embodiment, the photosensitive surface further includes a non-photosensitive part surrounding the photosensitive part. The non-photosensitive part includes an independent connection area and a non-connection area. The connection area is electrically connected to the circuit board through a conductive wire. The anti-overflow glue member is arranged on the surface of the support plate close to the circuit board. The anti-overflow glue member includes a first anti-overflow glue part and a second anti-overflow glue part. The height of the first anti-overflow glue part is less than that of the second anti-overflow glue part. The first anti-overflow glue part corresponds to the connection area and is arranged at an interval from the conductive wire. The second anti-overflow glue part corresponds to the non-connection area and is arranged at an interval. Using the first anti-overflow glue part with a smaller height corresponding to the connection area can avoid interference between the first anti-overflow glue part and the conductive wire on the connection area. And using the second anti-overflow glue part with a larger height corresponding to the non-connection area can make the glue passing channel smaller, thus having a better anti-overflow glue effect.

[0018] In one embodiment, the anti-overflow glue member is arranged on the surface of the support plate close to the circuit board, and the anti-overflow glue member is located on the outer periphery of the photosensitive chip. A bonding layer is arranged between one end of the anti-overflow glue member far from the support plate and the circuit board. In this way, the anti-overflow glue member not only has the function of preventing overflow glue but also has the function of pre-fixing the support plate on the circuit board.

[0019] In one embodiment, the photosensitive component further includes an electronic component. The electronic component is arranged in the frame part. The electronic component is adjacent to the first notch. The opening width of the first notch in the arrangement direction from the circuit board to the photosensitive chip is greater than the distance between the end face of the electronic component far from the circuit board and the bearing surface to avoid the electronic component. The first notch can avoid the electronic component. Thus, when assembling the above photosensitive component, the safety distance between the bracket and the electronic component does not need to be reserved, and then a photosensitive component with a smaller size can be obtained.

[0020] In one embodiment, the bracket further includes a first protrusion disposed on the support plate. One end of the first protrusion away from the support plate is connected to the blank area of the frame portion, thereby pre-fixing the support plate to the circuit board. Thus, it is very convenient to pre-fix the support plate to the circuit board.

[0021] In one embodiment, the bracket further includes a second protrusion. The second protrusion is disposed on the surface of the support plate close to the circuit board and is spaced from the frame portion. The outer side surface of the second protrusion is flush with the outer side surface of the support plate, thereby forming a second notch in the circumferential direction. The second notch is away from the electronic components, and the closing member is disposed in the second notch to close the second notch. When there are multiple first notches, some of the first notches are near the electronic components and some are not. By providing the second protrusion, the first notch with a larger height can be changed into a second notch with a smaller height, thereby reducing the amount of the closing member and decreasing the filling height of the closing member.

[0022] In one embodiment, the photosensitive component further includes a conductive wire. The frame portion is provided with a first pad, and the photosensitive surface is provided with a second pad. The conductive wire connects the first pad and the second pad. The second notch is disposed adjacent to the conductive wire to avoid the conductive wire. Since the height of the conductive wire is usually less than the height of the electronic components, the conductive wire can be avoided by the second notch with a smaller height. Thus, during assembly, a safety distance between the bracket and the conductive wire does not need to be reserved, and further, a photosensitive component with a smaller size can be obtained.

[0023] An imaging module, comprising:

[0024] The above-mentioned photosensitive component; and

[0025] A lens assembly disposed on the surface of the support plate away from the circuit board.

[0026] The above imaging module uses a photosensitive component with a smaller size, so that an imaging module with a smaller size can be obtained.

[0027] A mobile terminal includes the above imaging module. The above mobile terminal uses an imaging module with a smaller size, so that a mobile terminal with a smaller size can be obtained. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 A schematic cross-sectional view of an imaging module provided by an embodiment of the present invention;

[0029] Figure 2 An exploded view of a circuit board and a bracket provided by an embodiment of the present invention;

[0030] Figure 3 ForFigure 2 Schematic plan view of the circuit board in

[0031] Figure 4 is Figure 2 Schematic perspective view of the bracket in

[0032] Figure 5 is Figure 4 Schematic plan view of the first surface of the bracket in

[0033] Figure 6 is Figure 4 Schematic plan view of the second surface of the bracket in

[0034] Figure 7 is Figure 1 Schematic comparison view of the photosensitive component shown and the traditional photosensitive component;

[0035] Figure 8 is Figure 1 Schematic cross-sectional view of the camera module shown after removing the enclosure;

[0036] Figure 9 Schematic plan view of the bracket with a missing border part provided by an embodiment of the present invention;

[0037] Figure 10 Schematic plan view of the bracket with a missing border part provided by another embodiment of the present invention;

[0038] Figure 11 Schematic plan view of the bracket with a completely missing border provided by another embodiment of the present invention;

[0039] Figure 12 Schematic cross-sectional view of the camera module provided by another embodiment of the present invention;

[0040] Figure 13 Schematic cross-sectional view of the camera module provided by another embodiment of the present invention;

[0041] Figure 14 Schematic perspective view of the camera module provided by another embodiment of the present invention after removing the enclosure;

[0042] Figure 15 is Figure 14 Schematic plan view of the camera module shown;

[0043] Figure 16 is the cross-sectional view along Figure 15 Line A-A in

[0044] Figure 17 is the cross-sectional view along Figure 15 Line B-B in

[0045] Figure 18 isFigure 14 Exploded perspective view of the circuit board and the bracket shown

[0046] Figure 19 is Figure 18 perspective schematic view of the bracket in

[0047] Figure 20 The up-mounted zoom camera module provided by an embodiment of the present invention

[0048] Figure 21 The down-mounted zoom camera module provided by an embodiment of the present invention

[0049] Figure 22 Cross-sectional schematic view of the up-mounted fixed-focus camera module provided by an embodiment of the present invention

[0050] Figure 23 Cross-sectional schematic view of the photosensitive component provided by another embodiment of the present invention

[0051] Figure 24 is Figure 23 Local enlarged view at position C in Detailed implementation manners

[0052] In order to make the above objects, features and advantages of the present invention more obvious and understandable, the following detailed description of the specific implementation manners of the present invention will be given with reference to the accompanying drawings. Many specific details are set forth in the following description in order to fully understand the present invention. However, the present invention can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without departing from the connotation of the present invention. Therefore, the present invention is not limited by the specific implementations disclosed below.

[0053] It should be noted that when an element is referred to as being "fixed to" another element, it can be directly on the other element or there can also be an intermediate element. When an element is considered to be "connected" to another element, it can be directly connected to the other element or there may be an intermediate element at the same time.

[0054] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the art belonging to the technical field of the present invention. The terms used in the specification of the present invention herein are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used herein includes any and all combinations of one or more of the related listed items.

[0055] As Figure 1As shown in the figure, the imaging module 10 provided by an embodiment of the present invention includes a photosensitive component 10a and a lens component 10b disposed on the photosensitive component 10a. The lens component 10b is disposed on the light-sensitive path of the photosensitive component 10a. Light reaches the photosensitive component 10a after passing through the lens component 10b, thereby realizing imaging.

[0056] In this embodiment, the imaging module 10 is applied to a mobile terminal. Specifically, in this embodiment, the mobile terminal includes a terminal body (not shown in the figure) and the imaging module 10 disposed on the terminal body. More specifically, in this embodiment, the mobile terminal is a portable mobile terminal such as a smart phone or a tablet computer.

[0057] As Figure 1 shown, the photosensitive component 10a includes a circuit board 100, a photosensitive chip 200, electronic components 300, conductive wires 400, a bracket 500, a sealing member 600, and a filter 700.

[0058] The circuit board 100 is used to carry components such as the photosensitive chip 200. As Figure 2 and Figure 3 shown, the circuit board 100 includes a carrying surface 110, and the carrying surface 110 includes a chip mounting portion 112 and a frame portion 114 located on the outer periphery of the chip mounting portion 112. In some embodiments, the frame portion 114 is a closed-loop structure. In this embodiment, the frame portion 114 is square. The frame portion 114 includes a component mounting area 1142 and a blank area 1144. The component mounting area 1142 is used to set the first pads 120 and mount electronic components 300 such as capacitors and resistors.

[0059] The photosensitive chip 200 is disposed on the chip mounting portion 112. In some embodiments, a bonding layer is provided between the photosensitive chip 200 and the chip mounting portion 112. The photosensitive chip 200 includes a photosensitive surface 210, and the photosensitive surface 210 includes a photosensitive portion 212 and a non-photosensitive portion 214 surrounding the photosensitive portion 212. The non-photosensitive portion 214 includes independent connection areas 2142 and non-connection areas 2144. The connection areas 2142 are used for electrical connection with the circuit board 100. In some embodiments, second pads 220 are provided on the connection areas 2142, and the second pads 220 are connected to the first pads 120 through the conductive wires 400. In some embodiments, the conductive wires 400 are gold wires.

[0060] The bracket 500 includes a support plate 510 and a first protrusion 520. The support plate 510 includes opposite first and second surfaces 512 and 514, that is, the support plate 510 has a flat structure. The second surface 514 is used to connect to the lens assembly 10b. The support plate 510 is provided with a light passing hole 530 penetrating through the first surface 512 and the second surface 514. The first protrusion 520 is disposed on the first surface 512. The number of the first protrusions 520 is multiple, and the multiple first protrusions 520 are arranged at intervals for connecting to the multiple blank areas 1144 respectively.

[0061] When manufacturing the above photosensitive component 10a, first provide a circuit board 100 having multiple blank areas 1144; then provide a bracket 500 having multiple first protrusions 520, the number of the first protrusions 520 being less than or equal to the number of the blank areas 1144, and each first protrusion 520 corresponding to a blank area 1144; apply glue to the blank areas 1144, and place the first protrusions 520 on the blank areas 1144 after applying glue; after the glue between the blank areas 1144 and the first protrusions 520 cures to form an adhesive layer, the pre-fixation between the bracket 500 and the circuit board 100 is achieved.

[0062] As Figure 7 shown, the traditional bracket 500a is a hollow structure with openings at both ends. The side wall 502 of the bracket 500a is connected to the circuit board 100a through the adhesive applied to the circuit board 100a, and the side wall 502 of the bracket 500a provides a supporting force for the lens assembly. The side wall 502 of the traditional bracket 500a is a complete closed-loop structure, which needs to occupy a relatively large space on the circuit board 100a. Moreover, when assembling the bracket 500a, a safety distance between the bracket 500a and the electronic component 300a needs to be reserved, which is not conducive to reducing the size of the XY plane of the camera module.

[0063] In the above camera module 10, as Figure 7 and Figure 8 shown, the first protrusion 520 provides a supporting force for the lens assembly 10b. The bracket 500 is connected to the circuit board 100 through multiple discrete first protrusions 520, so that at least part of the edge of the support plate 510 forms a first notch 10c in the circumferential direction due to the lack of a side wall between the edge of the support plate 510 and the circuit board 100. That is, the bracket 500 in the above camera module 10 omits at least part of the side wall compared with the traditional bracket 500a, which is conducive to reducing the size of the XY plane of the camera module 10. Moreover, the multi-point contact is easier to control the assembly flatness of the bracket 500 than the surface contact.

[0064] In some embodiments, the formed first notch 10c can avoid the electronic component 300, so that when assembling the above-mentioned bracket 500, there is no need to reserve a safety distance between the bracket 500 and the electronic component 300, reducing the size of the bracket 500 in the XY plane, and thus a camera module 10 with a smaller size can be obtained.

[0065] As Figure 8 shown, when manufacturing the above-mentioned photosensitive component 10a, after the bracket 500 and the circuit board 100 are pre-fixed, there is a first notch 10c between the circuit board 100 and the support plate 510. The first notch 10c can be filled with a filler to form a seal 600 at the first notch 10c (as Figure 1 shown), so as to enclose the photosensitive chip 200 in the circumferential direction of the photosensitive chip 200, that is, use the seal 600 to replace the missing frame (side wall) of the bracket 500. Setting the seal 600 can prevent the photosensitive chip 200 from contacting the external air, better protect the photosensitive chip 200, and the seal 600 can increase the connection strength between the support plate 510 and the circuit board 100, making the structure of the entire photosensitive component 10a more stable. In some other embodiments, the seal 600 can also be omitted. For example, when the camera module 10 including the above-mentioned photosensitive component 10a is applied to a mobile terminal, the photosensitive chip 200 can be isolated from the outside atmosphere by the housing of the mobile terminal, or the stability of the entire photosensitive component 10a can be improved by the limiting structure in the mobile terminal.

[0066] In some embodiments, the filler is a material that can flow and has viscosity. The seal 600 can be formed by flowing a material that can flow and has viscosity through the first notch 10c between the support plate 510 and the circuit board 100 and then through a curing process. In this way, the seal 600 can not only seal the first notch 10c, but also increase the connection firmness between the support plate 510 and the circuit board 100. Specifically, in some embodiments, the filler is an adhesive. In some other embodiments, a semi-cured and viscous rubber strip can also be made first, and then the rubber strip is pressed into the first notch 10c by an interference fit method, and finally the rubber strip is cured to obtain the seal 600.

[0067] In some other embodiments, when the first protrusion 520 is omitted, an auxiliary tool such as a manipulator can be used to suspend the support plate 510 above the circuit board 100, and then glue is applied between the support plate 510 and the circuit board 100. After the glue is cured, fixing points are formed. The fixing points are similar in function to the first protrusion 520, mainly to realize the pre-fixation between the support plate 510 and the circuit board 100. Finally, the first notch 10c between the fixing points is filled with a filler.

[0068] In some embodiments, please refer to the attached Figure 8, the circuit board 100 and the photosensitive chip 200 are arranged along the Z direction (i.e., the height direction). The distance between the end face of the electronic component 300 away from the circuit board 100 and the bearing surface 110 is H1, and the opening width of the first notch 10c in the Z-axis direction is H2. H2 is greater than H1. Thus, when the first notch 10c is arranged adjacent to the electronic component 300, the first notch 10c can well avoid the electronic component 300. Furthermore, during assembly, the safety distance between the bracket 500 and the electronic component 300 does not need to be reserved, reducing the size of the XY plane of the photosensitive component 10a. Consequently, a photosensitive component 10a with a smaller size can be obtained. Moreover, since H2 is greater than H1, it is very convenient for the filler to flow inward between the support plate 510 and the circuit board 100.

[0069] In some embodiments, the support plate 510 is a flat plate structure with a uniform thickness everywhere, that is, the distance between the first surface 512 and the second surface 514 is equal everywhere. In some other embodiments, the support plate 510 can also be a non-flat plate structure with a smaller thickness in the middle and a larger thickness at the edges, as long as it can ensure that H2 is greater than H1.

[0070] Generally, the height H1 of the electronic component 300 is greater than the height of the photosensitive chip 200 and also greater than the height of the conductive wire 400. In some embodiments, the number of the electronic components 300 is usually multiple, and the specifications of each electronic component 300 are different. Some electronic components 300 have a larger height, and some electronic components 300 have a smaller height. In some embodiments, controlling the opening width of the first notch 10c in the Z-axis direction to be H2 greater than the height H1 of the electronic component 300 with the largest height can make the support plate 510 hang above the photosensitive chip 200, the conductive wire 400, and all the electronic components 300. In some embodiments, H2 is 200 - 500 microns.

[0071] The bracket 500 can be a bracket with all the borders missing, that is, a borderless bracket (a bracket without side walls), or the bracket 500 can also be a bracket with some borders missing (a bracket with some side walls missing). Figure 4 As shown, the bracket 500 is a bracket with some borders missing. Hereinafter, several specific embodiments will be used to elaborate in detail on the borderless bracket and the bracket with some borders missing.

[0072] In some embodiments, such as Figure 9 and Figure 10As shown, the edge of the end face of at least one first protrusion 520 coincides with the edge of the first surface 512 of the support plate 510, that is, there is a first protrusion 520 whose outer side is flush with the outer side of the support plate 510, that is, at least one first protrusion 520 is located at the edge of the support plate 510. This first protrusion 520 can be regarded as a partial frame (partial side wall) of the bracket 500. At this time, the bracket 500 is a bracket with a missing frame part.

[0073] In some embodiments, as Figure 11 shown, the edges of the end faces of all the first protrusions 520 are spaced from the edge of the first surface 512 of the support plate 510, that is, all the first protrusions 520 are located inside the outer side of the support plate 510, that is, all the first protrusions 520 are located in the middle of the support plate 510. At this time, the bracket 500 is a bracket with a completely missing frame.

[0074] As Figure 9 shown, Figure 9 illustrates a bracket with a missing frame part provided by an embodiment of the present invention. The bracket 500 includes four first protrusions 520 with the same size and shape. The four first protrusions 520 are respectively located at the four corners of the support plate 510 and are all located at the edge of the support plate 510. These four first protrusions 520 can all be regarded as partial frames of the bracket 500. After the bracket 500 is pre-fixed to the circuit board 100, there are four first notches 10c between the circuit board 100 and the support plate 510. During the formation of the enclosure 600, glue can be applied around the four sides of the bracket 500 to seal all the four first notches 10c.

[0075] After applying the glue, the filler will flow inward (toward the photosensitive chip 200) to cover the electronic components 300, the first pads 120, and the end of the conductive wire 400 connected to the first pad 120. The filler will also flow outward. As Figure 12 shown, the flexible circuit board 20 corresponds to one first notch 10c. After the filler flows outward onto the flexible circuit board 20, it can serve as the reinforcing glue 22 of the flexible circuit board 20 to increase the strength of the flexible circuit board 20, that is, a part of the same enclosure 600 is located inside the first notch 10c, and another part is located at the connection between the circuit board 100 and the flexible circuit board 20. The other end of the flexible circuit board 20 is provided with a connector 30.

[0076] It should be noted that the situation of the filler covering the components can be determined by controlling the amount of the filler. Taking Figure 2Taking the shown perspective as an example, the photosensitive chip 200 is square, and multiple electronic components 300 are arranged in two rows. The two rows of electronic components 300 are distributed on the opposite left and right sides of the photosensitive chip 200. Multiple conductive wires 400 are arranged in three rows. The three rows of conductive wires 400 are distributed on the upper side, lower side, and right side of the photosensitive chip 200. The row of conductive wires 400 on the right side is arranged in parallel and spaced apart from the row of electronic components 300 on the right side. When scribing glue (filling), if the amount of glue is extremely small, in the radial direction, the filler may not wrap the electronic components 300, the first pad 120, and the end of the conductive wire 400 connected to the first pad 120. If the amount of glue is relatively small, in the radial direction, the filler can only cover a part of the electronic components 300 on the left side and cannot completely cover the electronic components 300 on the left side. The filler can only cover the first pads 120 on the upper and lower sides and the end of the conductive wire 400 connected to the first pad 120, and cannot completely cover the conductive wire 400 and the second pad 220. The filler can only cover a part or all of the electronic components 300 on the right side, but cannot cover the conductive wire 400 on the right side.

[0077] The greater the amount of filler used, the easier it is to seal the first notch 10c, and the higher the connection firmness between the support plate 510 and the circuit board 100. However, the greater the amount of filler used, the correspondingly higher the probability that the filler overflows to the photosensitive part 212 of the photosensitive chip 200, which affects the photosensitive performance of the photosensitive chip 200 and results in a reduction in imaging quality. In some embodiments, considering the above factors comprehensively, by controlling the amount of filler used, in the radial direction, the closure 600 at least covers part of the electronic components 300, and the closure 600 at least covers the first pad 120 and the end of the conductive wire 400 connected to the first pad 120.

[0078] As Figure 10 shown, Figure 10 illustrates a bracket with a missing border portion provided in another embodiment of the present invention. The bracket 500 includes four first protrusions 520, and the four first protrusions 520 can all be regarded as part of the border of the bracket 500. In this embodiment, the first protrusion 520 at the top is strip-shaped, that is, the first protrusion 520 at the top extends from one side surface of the support plate 510 to the opposite side surface, that is, one side of the bracket 500 has a complete side wall. The shapes and sizes of the other three first protrusions 520 are the same and are square-shaped. That is, the bracket 500 has a continuous border and three discrete border portions. After the bracket 500 is pre-fixed to the circuit board 100, there are three first notches 10c between the circuit board 100 and the support plate 510. During the formation of the closure 600, glue can be scribed on three sides of the bracket 500 to seal all three first notches 10c. As Figure 13As shown, the elongated first protrusion 520 is located on the side of the bracket 500 close to the flexible circuit board 20 and is the bearing and stress position of the bracket 500. Thus, in a predetermined step, glue can be applied only at the blank area 1144 corresponding to the elongated first protrusion 520, rather than at other blank areas 1144, making the pre-curing step simpler.

[0079] In Figure 13 In the illustrated embodiment, the flexible circuit board 20 faces the elongated first protrusion 520, so there is no need to apply glue on the side of the bracket 500 corresponding to the flexible circuit board 20 to fill the gap, which can avoid affecting the electrical connection of the flexible circuit board 20 due to the glue covering the interface on the circuit board 100 for electrical connection with the flexible circuit board 20. Moreover, the gap can be filled with glue first, and then the flexible circuit board 20 can be assembled on the circuit board 100, or the flexible circuit board 20 can be assembled on the circuit board 100 first, and then the gap can be filled with glue.

[0080] As Figure 11 shown, Figure 11 illustrates a bracket with all its frames missing provided by an embodiment of the present invention. The bracket 500 includes four first protrusions 520, and all four first protrusions 520 are located in the middle of the support plate 510 and cannot form the frame of the bracket 500. After the bracket 500 is pre-fixed to the circuit board 100, there are four first gaps 10c between the circuit board 100 and the support plate 510. During the formation of the closure 600, glue can be applied on the four sides of the bracket 500 to close all four first gaps 10c. The frames of the bracket 500 are all formed by the closure 600.

[0081] It should be noted that although Figures 9 - 11 the illustrated first protrusions 520 are all square, the shape of the first protrusion 520 is not limited to square and can be any regular shape (such as cylindrical, frustum-shaped, prismatic) or irregular shape as long as it can support the support plate 510.

[0082] In some embodiments, the closure 600 is connected to the first protrusion 520. Among them, when the bracket 500 is a bracket with some frames missing, the closure 600 needs to be connected to the first protrusion 520 to form a closed structure to enclose the photosensitive chip 200. In some embodiments, when the bracket 500 is a bracket with all its frames missing, the closure 600 may not be connected to the first protrusion 520 as long as it can close the first gap 10c between the circuit board 100 and the support plate 510. Of course, in some embodiments, when the bracket 500 is a bracket with all its frames missing, the closure 600 may also be connected to the first protrusion 520.

[0083] In some embodiments, as Figure 1As shown, the enclosure 600 covers the electronic component 300, the first pad 120, and one end of the conductive wire 400 connected to the first pad 120. In this way, the enclosure 600 can well protect the electronic component 300, the first pad 120, and one end of the conductive wire 400 connected to the first pad 120.

[0084] As Figure 1 shown, in some embodiments, the first protrusion 520 is located between the electronic component 300 and the photosensitive chip 200. In some embodiments, the electronic component 300 can also be located between the first protrusion 520 and the photosensitive chip 200.

[0085] In some embodiments, as Figure 12 and Figure 13 shown, the bracket 500 further includes a second protrusion 540. The second protrusion 540 is provided on the first surface 512 and corresponds to the border portion 114 of the bearing surface 110. The height of the second protrusion 540 is less than the height of the first protrusion 520. A seal 600 is provided between the second protrusion 540 and the border portion 114. By providing the second protrusion 540 and making its height less than that of the first protrusion 520, the amount of the seal 600 can be reduced when forming the seal 600, so as to reduce the filling height of the seal 600. The number of the second protrusions 540 can be one or more. When the number of the second protrusions 540 is multiple, the multiple second protrusions 540 are arranged at intervals.

[0086] When the outer side surface of the second protrusion 540 is flush with the outer side surface of the support plate 510, the second protrusion 540 can serve as the border of the bracket 500. When the outer side surface of the second protrusion 540 is located inside the outer side surface of the support plate 510, the second protrusion 540 does not serve as the border of the bracket 500. As Figure 12 and Figure 13 shown, the outer side surface of the second protrusion 540 is flush with the outer side surface of the support plate 510, and the second protrusion 540 serves as the border of the bracket 500.

[0087] The second protrusion 540 can be connected to the first protrusion 520 or can be arranged at intervals from the second protrusion 540. As Figure 14 shown, the second protrusion 540 is connected to the first protrusion 520.

[0088] In Figures 14 - 19 the shown embodiment, both the first protrusion 520 and the second protrusion 540 serve as the border of the bracket 500, and the second protrusion 540 is connected to the first protrusion 520.

[0089] When the outer side surface of the second protrusion 540 is flush with the outer side surface of the support plate 510 and the height of the second protrusion 540 is less than the height of the first protrusion 520, after the bracket 500 and the circuit board 100 are pre-cured, the second protrusion 540 and the circuit board 100 are arranged at intervals, and a second notch 10f located in the circumferential direction is formed. As Figures 17 - 19 shown, the second notch 10f is far from the electronic component 300. When there are multiple first notches 10c, some electronic components 300 are near some of the first notches 10c, and there are no electronic components 300 near some of the first notches 10c. By setting the second protrusion 540, the first notch 10c with a larger height can be changed into the second notch 10f with a smaller height, so that the amount of the seal 600 can be reduced and the filling height of the seal 600 can be decreased.

[0090] In some embodiments, as Figures 17 - 19 shown, the second notch 10f is arranged adjacent to the conductive wire 400 to avoid the conductive wire 400. Since the height of the conductive wire 400 is usually less than the height of the electronic component 300, the second notch 10f with a smaller height can avoid the conductive wire 400. Thus, when assembling, a safety distance between the bracket 500 and the conductive wire 400 does not need to be reserved, and further, a photosensitive component 10a with a smaller size can be obtained.

[0091] The opening width H3 of the second notch 10f in the first direction 12 is too small and the resistance is large, which is not conducive to the filler flowing into the space between the circuit board 100 and the support plate 510. In some embodiments, the opening width H3 of the second notch 10f in the first direction 12 is greater than 100 microns, so that a flowing and viscous filler can flow through the second notch 10f to seal the second notch 10f. Specifically, H3 is 100 - 200 microns.

[0092] In some embodiments, as Figure 18 and Figure 19 shown, the photosensitive chip 200 is square. Two rows of electronic components 300 correspond to opposite sides of the photosensitive chip 200. Each row of electronic components 300 includes a plurality of spaced-apart electronic components 300. Two rows of conductive wires 400 correspond to the other two sides of the photosensitive chip 200 respectively. Each row of conductive wires 400 includes a plurality of spaced-apart conductive wires 400. There are two first notches 10c, and the two first notches 10c correspond to the two rows of electronic components 300 respectively. There are two second notches 10f, and the two second notches 10f correspond to the two rows of conductive wires 400 respectively.

[0093] In some embodiments, as Figures 15 - 19As shown, the bracket 500 further includes a stopper 550. The stopper 550 is disposed on the first surface 512, adjacent to the edge of the light-transmitting hole 530, and corresponding to the frame portion 114 of the bearing surface 110. Thus, when forming the closure 600, it is possible to prevent the filler from flowing into the chip mounting portion 112 and avoid contaminating the photosensitive chip 200 with the filler.

[0094] In some embodiments, the stopper 550 corresponds to the boundary line between the frame portion 114 and the chip mounting portion 112.

[0095] In some embodiments, the height of the stopper 550 is the same as the height of the first protrusion 520. Wherein, when the height of the stopper 550 is the same as the height of the first protrusion 520, the stopper 550 not only has the function of the first protrusion 520, that is, to realize the pre-fixation of the bracket 500 and the circuit board 100, but also has the function of preventing the filler from contaminating the photosensitive chip 200. That is, when the first protrusion 520 is located between the electronic component 300 and the photosensitive chip 200, the first protrusion 520 can be used to realize the pre-fixation of the bracket 500 and the circuit board 100 and prevent the filler from contaminating the photosensitive chip 200.

[0096] In some embodiments, the stopper 550 is connected to the first protrusion 520, and the stopper 550 and the second protrusion 540 are independent of each other, that is, the stopper 550 is not connected to the second protrusion 540.

[0097] In Figure 18 and Figure 19 the illustrated embodiment, the number of the first protrusions 520 is three, and the three first protrusions 520 are distributed at three corners of the support plate 510. The number of the second protrusions 540 is two, and the two second protrusions 540 are oppositely arranged. One of the second protrusions 540 connects two adjacent first protrusions 520, and the other second protrusion 540 connects one first protrusion 520. The number of the stoppers 550 is two, and the two stoppers 550 are oppositely arranged and located between the two second protrusions 540. The height of the stopper 550 is the same as the height of the first protrusion 520, and the stopper 550 is connected to the first protrusion 520 and is in an L shape. The overall L shape formed by the stopper 550 and the first protrusion 520 can be regarded as an L-shaped first protrusion 520. The electronic component 300 is located between the stopper 550 and the edge of the support plate 510, that is, the electronic component 300 is adjacent to the first notch 10c. The conductive wire 400 is located between the second protrusion 540 and the light-transmitting hole 530, that is, the conductive wire 400 is adjacent to the second notch 10f.

[0098] In some embodiments, such as Figure 1 and Figure 18As shown, a filter mounting groove 516 is recessed in the second surface 514 to surround the light passing hole 530. A filter 700 is disposed in the mounting groove 516, and an adhesive layer 810 is provided between the filter 700 and the bottom of the mounting groove 516. At this time, the photosensitive component 10a is an upper-mounted photosensitive component.

[0099] In some embodiments, a filter mounting groove 516 is recessed in the first surface 512 to surround the light passing hole 530. The filter 700 is disposed in the mounting groove 516. At this time, the photosensitive component 10a is a lower-mounted photosensitive component.

[0100] As Figure 4 、 Figure 5 and Figure 6 shown, the support plate 510 is provided with an air escape hole groove 560. The air escape hole groove 560 includes an air escape hole 562 penetrating through the first surface 512 and the second surface 514, and an air escape groove 564 opened on the first surface 512. The air escape hole 562 is independent of the mounting groove 516. Both ends of the air escape groove 564 are respectively communicated with the air escape hole 562 and the light passing hole 530, and the air escape groove 564 is located between the air escape hole 562 and the light passing hole 530. When the closure 600 is formed and the filter 700 is fixed on the mounting groove 516, after baking to cure the glue for both the closure 600 and the bonding of the filter 700, the gas that expands due to heat can be discharged through the air escape groove 564 and the air escape hole 562.

[0101] In some embodiments, the filter 700 may not be disposed on the bracket 500. At this time, the filter 700 can be received within a pattern formed by enclosing multiple first protrusions 520 and is directly disposed on the photosensitive surface 210 of the photosensitive chip 200.

[0102] In some embodiments, the photosensitive component 10a may not include the filter 700. At this time, the filter 700 can be disposed within the lens assembly 10b. The lens assembly 10b can be a fixed-focus lens assembly or a zoom lens assembly.

[0103] As Figure 1 shown, the lens assembly 10b is fixed on the second surface 514 of the support plate 510 through an adhesive layer 820. As Figure 1 and Figure 17 shown, Figure 1 and Figure 17 shown, the imaging module 10 is a fixed-focus imaging module, and its lens assembly 10b is an integrated lens assembly. The integrated lens assembly includes a lens barrel and lenses disposed within the lens barrel. Figure 1 and Figure 17 shown, the imaging module 10 is an upper-mounted fixed-focus imaging module.

[0104] As Figure 20 shown, Figure 20The illustrated camera module 10 is a zoom camera module. Its lens assembly 10b includes a voice coil motor 910, a lens barrel 920 disposed within the voice coil motor 910, and lenses disposed within the lens barrel 920. The voice coil motor 910 is connected to the circuit board 100 through pins 930. The voice coil motor 910 drives the lens barrel 920 to drive the lenses to move, thereby achieving autofocus. Figure 20 The illustrated camera module 10 is an upper-mounted zoom camera module. Figure 21 The illustrated camera module 10 is a lower-mounted zoom camera module.

[0105] In some embodiments, as Figure 20 shown, the pins 930 are located on the outer periphery of the support plate 510, and the pins 930 are aligned with the elongated first protrusion 520. Among them, the elongated first protrusion 520 extends from one side surface of the support plate 510 to the other side surface. The pins 930 are aligned with the elongated first protrusion 520, so that it is not necessary to apply glue on the side of the bracket 500 corresponding to the pins 930 to fill the gap, and it is possible to avoid the influence on the electrical connection of the pins 930 due to the glue covering the pads on the circuit board 100 for electrically connecting with the pins 930. Moreover, the pins 930 do not interfere with the glue application. The gap can be filled with glue first, and then the lens assembly 10b can be assembled on the support plate 510, or the lens assembly 10b can be assembled on the support plate 510 first, and then the gap can be filled with glue.

[0106] In some embodiments, as Figure 22 shown, the camera module 10 further includes a protective member 10d, and the protective member 10d covers the conductive wire 400. In some embodiments, while the protective member 10d covers the conductive wire 400, both ends of the protective member 10d are respectively connected to the circuit board 100 and the non-photosensitive portion 214 of the photosensitive chip 200 to cover the second pad 220 and the first pad 120. In some embodiments, the protective member 10d is a cured adhesive. The material of the protective member 10d and the closing member 600 may be the same or different. When manufacturing the camera module 10, the protective member 10d is formed first, then the bracket 500 is fixed to the circuit board 100, and then the closing member 600 is formed.

[0107] During the formation of the encapsulant 600, the first pad 120 located on the circuit board 100 and connected to the conductive wire 400, the end of the conductive wire 400 close to the circuit board 100, and even the second pad 220 located on the photosensitive chip 200 and connected to the conductive wire 400 may be wrapped by the filler. That is, the first pad 120, the conductive wire 400, and the second pad 220 may all be wrapped by the filler. During the process of the fluid filler curing to form the encapsulant 600, due to the shrinkage rate of the filler, the conductive wire 400 may be strained, resulting in the disconnection of the conductive wire 400 from the first pad 120 and the second pad 220, or the conductive wire 400 may even break, causing electrical performance problems. Moreover, once the encapsulant 600 is formed, when electrical performance problems occur, it is very inconvenient to disassemble, making it difficult to repair the electrical performance problems.

[0108] In some embodiments, before forming the encapsulant 600, a protective member 10d is first provided. The protective member 10d at least covers the first pad 120 and the end of the conductive wire 400 close to the circuit board 100, so that when the flowable and viscous material flows into the space between the support plate 510 and the circuit board 100 through the first notch 10c or the second notch 10f to cure and form the encapsulant 600, the protective member 10d can prevent the material for forming the encapsulant 600 from directly contacting the first pad 120 and the end of the conductive wire 400 close to the circuit board 100. At this time, by controlling the amount of the material, it is possible to prevent the material from directly contacting the end of the conductive wire 400 close to the second pad 220 and the second pad 220. In some embodiments, the protective member 10d covers the first pad 120, the conductive wire 400, and the second pad 220.

[0109] By providing the protective member 10d, it is possible to prevent the material for forming the encapsulant 600 from directly covering the first pad 120, the conductive wire 400, and the second pad 220, thereby avoiding electrical performance problems caused by the shrinkage rate of the material during the curing of the material for forming the encapsulant 600. Moreover, since the step of forming the protective member 10d can precede the step of pre-fixing the bracket 500 to the circuit board 100 and the step of forming the encapsulant 600, even if electrical performance problems occur due to other reasons, it is convenient to disassemble, enabling the repair of electrical performance problems.

[0110] In some embodiments, the protective member 10d is made of the same material as the encapsulant 600. At this time, since the amount of the material of the protective member 10d is much smaller than the amount of the material of the encapsulant 600, the effect of the shrinkage rate of the material of the protective member 10d is relatively small, and electrical performance problems can be avoided.

[0111] In some embodiments, the material of the protection member 10d is different from that of the sealing member 600. Among them, the shrinkage rate of the material forming the protection member 10d is less than that of the material forming the sealing member 600, the fluidity of the material forming the protection member 10d is greater than that of the material forming the sealing member 600, the hardness of the protection member 10d is less than that of the sealing member 600, and the elasticity of the protection member 10d is greater than that of the sealing member 600.

[0112] In some embodiments, the second pad 220 is disposed on the non-photosensitive portion 214 of the photosensitive chip 200, and the protection member 10d surrounds the photosensitive portion 212 for one week to block the material forming the sealing member 600 from flowing to the photosensitive portion 212 of the photosensitive chip 200. At this time, the protection member 10d not only has the function of preventing electrical defects but also has the function of preventing glue overflow.

[0113] In some embodiments, the distance between the protection member 10d and the photosensitive portion 212 of the photosensitive chip 200 is greater than or equal to 300 microns. In this way, even if the material forming the sealing member 600 crosses the protection member 10d and flows toward the photosensitive portion 212, due to the large distance between the protection member 10d and the photosensitive portion 212, the material forming the sealing member 600 is difficult to reach the photosensitive portion 212, so as to better avoid the material forming the sealing member 600 from flowing to the photosensitive portion 212 of the photosensitive chip 200.

[0114] In some embodiments, the protection member 10d has an asymmetric structure, and the width of the protection member 10d located on the connection area 2142 of the photosensitive chip 200 is greater than the width of the protection member 10d located on the non-connection area 2144. Since the second pad 220 is provided on the connection area 2142 and the second pad 220 is connected to the conductive wire 400, and the second pad 220 is not provided on the non-connection area 2144, the larger width of the protection member 10d located on the connection area 2142 of the photosensitive chip 200 can better cover the second pad 220 and the conductive wire 400, while the smaller width of the protection member 10d located on the non-connection area 2144 can save the amount of the protection member 10d.

[0115] In some embodiments, as Figure 23 and Figure 24 shown, the imaging module 10 further includes an anti-glue overflow member 10e. The anti-glue overflow member 10e is disposed on the first surface 512 of the support plate 510, and the anti-glue overflow protrusion 10e is closer to the photosensitive chip 200 than the first protrusion 520, and is used to block the filler forming the sealing member 600 from flowing to the photosensitive portion 212 of the photosensitive chip 200. The anti-glue overflow member 10e is disposed on the support plate 510, which can avoid the anti-glue overflow member 10e occupying the area of the circuit board 100 for arranging the electronic components 300.

[0116] In some embodiments, the anti-overflow glue member 10e is disposed adjacent to the light passing hole 530. By disposing the anti-overflow glue member 10e adjacent to the light passing hole 530, interference between the anti-overflow glue member 10e and the electronic components 300 on the circuit board 100 can be avoided.

[0117] In some embodiments, the anti-overflow glue member 10e is a closed annular structure surrounding the light passing hole 530 for one week. In this way, overflow glue can be prevented more comprehensively. In some embodiments, the anti-overflow glue member 10e includes a plurality of anti-overflow glue blocks which are disposed at intervals around the light passing hole 530. In this way, overflow glue can be prevented well, and a space for avoiding the electronic components 300 can be formed between two adjacent anti-overflow glue blocks according to actual design requirements. In some embodiments, as Figure 4 shown, the support plate 510 is provided with an air escape hole 562 penetrating through the opposite two surfaces of the support plate 510, and an air escape groove 564 is provided on the surface of the support plate 510 close to the circuit board 100. Two ends of the air escape groove 564 are respectively communicated with the air escape hole 562 and the light passing hole 530. One end of the anti-overflow glue member 10e is adjacent to one side of the air escape groove 564, and the other end extends around the light passing hole 530 to the other side of the air escape groove 564 and is adjacent to the other side of the air escape groove 564. In this way, overflow glue can be prevented well and it is also beneficial for gas to escape.

[0118] In some embodiments, as Figure 23 and Figure 24 shown, the anti-overflow glue member 10e1 is directly opposite to the non-photosensitive part 214 of the photosensitive chip 200, that is, the orthographic projection of the anti-overflow glue member 10e1 on the photosensitive surface 210 is located on the photosensitive surface 210. In some embodiments, as Figure 23 and Figure 24 shown, a part of the anti-overflow glue member 10e2 is directly opposite to the non-photosensitive part 214, and another part is directly opposite to the frame part 114 of the circuit board 100. In some embodiments, the anti-overflow glue member 10e2 may also not be directly opposite to the non-photosensitive part 214 at all. At this time, the anti-overflow glue member 10e2 is completely directly opposite to the frame part 114 of the circuit board 100.

[0119] In some embodiments, as Figure 23 and Figure 24 shown, the anti-overflow glue member 10e is disposed at an interval from the non-photosensitive part 214 to avoid the conductive wire 400. In other embodiments, the anti-overflow glue member 10e may also be in direct contact with the non-photosensitive part 214.

[0120] In some embodiments, one end of the anti-overflow glue member 10e away from the support plate 510 is spaced apart from the plane where the surface of the photosensitive chip 200 away from the circuit board 100 is located. In this way, interference between the anti-overflow glue member 10e and the conductive wire 400 on the photosensitive chip 200 can be avoided. In some embodiments, the distance between the anti-overflow glue member 10e and the non-connection area 2144 is less than or equal to 150 micrometers, and the distance between the anti-overflow glue member 10e and the conductive wire 400 is less than or equal to 150 micrometers. The distance being less than or equal to 150 micrometers means that the glue passage is relatively small, thus having a good anti-overflow glue effect.

[0121] In some embodiments, in the radial direction of the light-passing hole 530, at least a part of the anti-overflow glue member 10e is disposed opposite to the connection area 2142, and at least a part of the anti-overflow glue member 10e is disposed opposite to the non-connection area 2144. In this way, interference between the anti-overflow glue member 10e and the electronic component 300 on the circuit board 100 can be avoided.

[0122] As Figure 23 and Figure 24 shown, in some embodiments, the anti-overflow glue member 10e includes a first anti-overflow glue part 10e1 and a second anti-overflow glue part 10e2. The first anti-overflow glue part 10e1 and the second anti-overflow glue part 10e2 correspond to the connection area 2142 and the non-connection area 2144 respectively, and the height of the first anti-overflow glue part 10e1 is less than the height of the second anti-overflow glue part 10e2. By using the first anti-overflow glue part 10e1 with a smaller height corresponding to the connection area 2142, interference between the first anti-overflow glue part 10e1 and the conductive wire 400 on the connection area 2142 can be avoided. And by using the second anti-overflow glue part 10e2 with a larger height corresponding to the non-connection area 2144, the glue passage can be made smaller, thus having a good anti-overflow glue effect.

[0123] In some embodiments, the first anti-overflow glue part 10e1 is disposed opposite to the connection area 2142. The second anti-overflow glue part 10e2 can be disposed opposite to the non-connection area 2144, or can be disposed opposite to the frame part 114 of the circuit board 100, or can be partially disposed opposite to the non-connection area 2144 and partially disposed opposite to the frame part 114 of the circuit board 100. That is to say, in the radial direction of the light-passing hole 530, at least a part of the first anti-overflow glue part 10e1 is disposed opposite to the connection area 2142, and at least a part of the second anti-overflow glue part 10e2 is disposed opposite to the non-connection area 2144.

[0124] In some embodiments, the anti-overflow glue member 10e can be an annular structure surrounding the light-passing hole 530 for one circle. At this time, the first anti-overflow glue part 10e1 and the second anti-overflow glue part 10e2 are connected.

[0125] In some embodiments, as Figure 16 and Figure 19As shown, the anti-overflow glue member 10e can also be the stopper 550. At this time, the anti-overflow glue member 10e faces the border portion 114 of the circuit board 100, that is, the orthographic projection of the anti-overflow glue member 10e on the circuit board 100 is located on the circuit board 100.

[0126] In some embodiments, such as Figure 16 and Figure 19 As shown, the anti-overflow glue member 10e is located on the outer periphery of the photosensitive chip 200, and the anti-overflow glue member 10e is in direct contact with the circuit board 100. In other embodiments, the anti-overflow glue member 10e is located on the outer periphery of the photosensitive chip 200, and the anti-overflow glue member 10e can also be spaced from the circuit board 100. The space between the anti-overflow glue member 10e and the circuit board 100 can be filled with the bonding glue of the pre-cured first protrusion 520, can be filled with the filler of the closure member 600, or can not be filled.

[0127] During the formation of the closure member 600, if the amount of the material for forming the closure member 600 is not properly controlled, the material for forming the closure member 600 will flow to the photosensitive portion 212 of the photosensitive chip 200, affecting the photosensitive performance of the photosensitive chip 200 and resulting in a reduction in imaging quality. By providing the anti-overflow glue member 10e between the circuit board 100 and the support plate 510, when the closure member 600 is formed by curing after flowing into the space between the support plate 510 and the circuit board 100 through the first notch 10c or the second notch 10f from a material that can flow and has viscosity, the anti-overflow glue member 10e is used to block the material for forming the closure member 600 from flowing to the photosensitive portion 212 of the photosensitive chip 200. The anti-overflow glue member 10e can be Figure 19 the stopper 550 shown in Figure 19 , the stopper 550 connects the circuit board 100 and the support plate 510, and the anti-overflow glue member 10e can also be Figure 22 the protection member 10d that surrounds the photosensitive portion 212 for one week shown in Figure 22 , and the anti-overflow glue member 10e can also be Figure 23 and Figure 24 the anti-overflow glue member 10e shown in Figure 24 .

[0128] An embodiment of the present invention further provides a method for manufacturing a photosensitive component, including the following steps:

[0129] Step S1: Provide a packaging substrate, the packaging substrate includes a circuit board, a photosensitive chip and electronic components. The circuit board includes a bearing surface, the bearing surface includes a chip installation portion and a border portion located on the outer periphery of the chip installation portion. The photosensitive chip is arranged on the chip installation portion, and the electronic components are arranged on the border portion.

[0130] Step S2: Place the support plate on the side of the photosensitive chip and the electronic components away from the bearing surface. The light passing hole is aligned with the photosensitive chip, and the edge of the support plate is spaced from the border portion, thereby forming a first notch located in the circumferential direction and adjacent to the electronic components.

[0131] Step S3, close the first gap and form a sealant located between the support plate and the circuit board, and the sealant connects the support plate and the circuit board.

[0132] In some embodiments, in step S2, the first protrusion provided on the surface of the support plate close to the circuit board is fixed to the blank area of the circuit board.

[0133] In some embodiments, in step S3, a flowable and viscous material flows into the support plate and the circuit board from the first gap and then solidifies to obtain the sealant.

[0134] In some embodiments, before performing step S2, it further includes the step of setting a protective member.

[0135] The technical features of the above-described embodiments can be combined arbitrarily. For the sake of brevity of description, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, it should be considered as the scope described in this specification.

[0136] The above-described embodiments only represent several implementation manners of the present invention. The description is relatively specific and detailed, but it cannot be construed as a limitation on the scope of the invention patent. It should be noted that for those of ordinary skill in the art, without departing from the concept of the present invention, several modifications and improvements can still be made, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the present invention patent shall be subject to the appended claims.

Claims

1. A photosensitive component, characterized in that, it includes: A circuit board, including a bearing surface, the bearing surface includes a chip mounting portion and a frame portion located on the outer periphery of the chip mounting portion; A photosensitive chip, disposed on the chip mounting portion, the surface of the photosensitive chip away from the circuit board is a photosensitive surface, and the photosensitive surface includes a photosensitive portion; A bracket, including a support plate, the support plate is located on the side of the photosensitive chip away from the bearing surface, and the edge of the support plate is spaced from the frame portion to form a first notch in the circumferential direction; A closure, disposed in the first notch to close the first notch; Wherein, the photosensitive component further includes an anti-overflow glue member disposed between the circuit board and the support plate. When the closure is formed by curing after flowing through the first notch from a material that can flow and has viscosity into the space between the support plate and the circuit board, the anti-overflow glue member is used to block the material forming the closure from flowing to the photosensitive portion of the photosensitive chip; The photosensitive component further includes electronic components, the electronic components are disposed on the frame portion, the electronic components are disposed adjacent to the first notch, and the opening width of the first notch in the arrangement direction from the circuit board to the photosensitive chip is greater than the distance between the end surface of the electronic component away from the circuit board and the bearing surface to avoid the electronic component; The bracket further includes a first protrusion disposed on the support plate, and the end of the first protrusion away from the support plate is connected to the blank area of the frame portion, thereby pre-fixing the support plate to the circuit board; The first protrusion is located between the electronic component and the photosensitive chip.

2. The photosensitive component according to claim 1, characterized in that, The support plate is provided with a light through hole facing the photosensitive portion, and the anti-overflow glue member is disposed on the surface of the support plate close to the circuit board; Wherein, the anti-overflow glue member is a closed ring structure surrounding the light through hole for one week; Or, the anti-overflow glue member includes a plurality of anti-overflow glue blocks, and the plurality of anti-overflow glue blocks are spaced around the light through hole; Or, the support plate is provided with an air escape hole penetrating through the opposite two surfaces of the support plate, and an air escape groove is provided on the surface of the support plate close to the circuit board. The two ends of the air escape groove are respectively communicated with the air escape hole and the light through hole, and one end of the anti-overflow glue member is adjacent to one side of the air escape groove, and the other end extends around the light through hole to the other side of the air escape groove and is adjacent to the other side of the air escape groove.

3. The photosensitive component according to claim 1, characterized in that, The photosensitive surface further includes a non-photosensitive portion surrounding the photosensitive portion, the non-photosensitive portion includes an independent connection area and a non-connection area, and the connection area is electrically connected to the circuit board through a conductive wire; The anti-overflow glue member is disposed on the surface of the support plate close to the circuit board. The anti-overflow glue member includes a first anti-overflow glue portion and a second anti-overflow glue portion. The height of the first anti-overflow glue portion is less than that of the second anti-overflow glue portion. The first anti-overflow glue portion corresponds to the connection area and is arranged at an interval from the conductive wire. The second anti-overflow glue portion corresponds to the non-connection area and is arranged at an interval.

4. The photosensitive component according to claim 2, wherein, the anti-overflow glue member is disposed on the surface of the support plate close to the circuit board, and the anti-overflow glue member is located on the outer periphery of the photosensitive chip. A bonding layer is provided between one end of the anti-overflow glue member away from the support plate and the circuit board.

5. The photosensitive component according to claim 1, wherein, the bracket further includes a second protrusion. The second protrusion is disposed on the surface of the support plate close to the circuit board and is spaced from the frame portion. The outer side surface of the second protrusion is flush with the outer side surface of the support plate, thereby forming a second notch in the circumferential direction. The second notch is away from the electronic components. The closing member is disposed in the second notch to close the second notch.

6. The photosensitive component according to claim 5, wherein, the photosensitive component further includes a conductive wire. The frame portion is provided with a first pad, and the photosensitive surface is provided with a second pad. The conductive wire connects the first pad and the second pad. The second notch is disposed adjacent to the conductive wire to avoid the conductive wire.

7. An imaging module, wherein, comprising: the photosensitive component according to any one of claims 1-6; and a lens module, disposed on the surface of the support plate away from the circuit board.

8. A mobile terminal, wherein, comprising the imaging module according to claim 7.

Images