Data communication device for incubator and incubator

Abstract

The present invention provides a data communication device for an incubator and an incubator, the data communication device comprising a communication device body, the placement cavity of the communication device body being provided with a microcontroller, an energy supply module, a storage module and a transmission module; a sensor probe assembly, the sensor probe assembly comprising a wearing part and a detection part; the two ends of the wearing part being detachably connected together by a connector; the detection part being provided with a vital sign sensor probe electrically connected to the microcontroller; the data communication device further comprising a mechanical transducer, the mechanical transducer sensing the vibration of the incubator and converting mechanical energy into electrical energy; the mechanical transducer being electrically connected with an energy storage device, the energy storage device being electrically connected to the energy supply module. The present invention places a vital sign sensor probe on the skin of a newborn through the wearing part, the vital sign sensor probe detects vital sign data and sends it to the microcontroller, the microcontroller stores the vital sign data and transmits it to the terminal device through the transmission module.

Description

Technical Field

[0001] The present invention relates to the fields of communication equipment and medical equipment, and in particular to a data communication device for an incubator and the incubator. Background Art

[0002] Infant radiation incubators are devices specifically designed for the care and warming of newborns, premature infants, critically ill infants, and frail infants. They provide a suitable environment for premature and sick infants and are used for infusions, emergency treatment, and hospitalization for observation. However, traditional incubators control the temperature of the light by measuring skin temperature. Their functionality is limited, and they cannot comprehensively capture the newborn's vital signs. Furthermore, they cannot store and transmit data to mobile devices for convenient observation. Furthermore, incubators cannot harvest vibration energy, preventing energy recovery and utilization. Summary of the Invention

[0003] In view of this, the present invention aims to provide a data communication device for an incubator and an incubator, which can monitor the vital sign data of newborns to solve the problem that the incubator cannot collect vital sign data and send it to a mobile terminal.

[0004] To achieve the above object, the technical solution of the present invention is achieved as follows:

[0005] A data communication device for an incubator, comprising:

[0006] A communication device body, the communication device body comprising a first shell and a second shell, the first shell and the second shell being detachably connected together; a placement cavity is provided in the first shell, and the placement cavity is provided with a microcontroller, an energy supply module electrically connected to the microcontroller, a storage module electrically connected to the microcontroller, and a transmission module electrically connected to the microcontroller;

[0007] A sensor probe assembly, comprising a wearing portion and a detection portion connected to the wearing portion; two ends of the wearing portion are detachably connected together by a connector; the detection portion is provided with a vital sign sensor probe electrically connected to the microcontroller;

[0008] The vital sign sensor probe detects the vital sign data of the infant in the incubator and transmits the data to the microcontroller, the microcontroller stores the vital sign data in the storage module, and / or the microcontroller transmits the vital sign data to the terminal device via the transmission module;

[0009] The data communication device further includes a mechanical transducer, which senses the vibration of the incubator and converts mechanical energy into electrical energy; the mechanical transducer is electrically connected to an energy storage device, and the energy storage device is electrically connected to the energy supply module.

[0010] Furthermore, the side wall of the placement cavity is provided with a card slot, and the second shell is provided with a card block that cooperates with the card slot; the card block is located in the card slot, and the second shell closes the placement cavity; the card slot is provided with a first threaded hole passing through it, and the card block is provided with a second threaded hole passing through it; the card block is located in the card slot, and the first threaded hole and the second threaded hole overlap and are connected together by screws.

[0011] Furthermore, a circuit board is provided in the placement cavity, on which the microcontroller, the storage module and the transmission module are arranged; a column with an axial hole is provided in the placement cavity, and a through hole matching the axial hole is provided on the circuit board; the circuit board is placed on the column, and the axial hole and the through hole coincide with each other.

[0012] Furthermore, the first shell is provided with a first heat dissipation hole, and the second shell is provided with a second heat dissipation hole; the first heat dissipation hole and the second heat dissipation hole form an air duct.

[0013] Furthermore, the data communication device also includes an alarm device, which is electrically connected to the microcontroller; when the microcontroller detects abnormal vital sign data, the microcontroller prompts the alarm device to sound an alarm, and the microcontroller sends an alarm message to the terminal device.

[0014] Furthermore, the vital sign sensor probe includes a skin temperature sensor probe, a pulse sensor probe and a heart rate sensor probe; the skin temperature sensor probe, the pulse sensor probe and the heart rate sensor probe are electrically connected to the microcontroller through a data transmission line.

[0015] Furthermore, one end of the mechanical transducer is arranged on the second shell, and the other end of the mechanical transducer is suspended in the air.

[0016] Furthermore, the mechanical transducer comprises:

[0017] A substrate, wherein a first groove is provided on the front side of the substrate and a second groove is provided on the back side of the substrate;

[0018] a first bonding layer, wherein the first bonding layer is located on the first groove;

[0019] a first metal layer, the first metal layer being located on the first bonding layer; the first metal layer forming interdigitated electrodes, the interdigitated electrodes being provided with wires connected to an external energy storage device;

[0020] a piezoelectric layer, the piezoelectric layer being located on the first metal layer, and one side of the piezoelectric layer being flush with the first groove;

[0021] The second slot includes a second protruding end, which is a mass block; the substrate, the first bonding layer, the first metal layer, and the piezoelectric layer excluding the mass block constitute a cantilever beam.

[0022] Furthermore, the mechanical transducer is prepared according to the following process:

[0023] A protective layer with windows is formed on the front and back surfaces of the substrate; grooves are formed on the front and back surfaces of the substrate according to the positions of the windows; a first metal layer is bonded to the grooves on the front surface of the substrate; the piezoelectric layer is bonded to the first metal layer, and the second metal layer forms interdigitated electrodes, and wires are welded to the interdigitated electrodes; the piezoelectric layer is thinned until the piezoelectric layer is flush with the grooves on the front surface of the substrate; and scribing is performed to release the cantilever arm and the mass block.

[0024] Compared with the prior art, the present invention has the following advantages:

[0025] (1) The present invention places the vital sign sensor probe on the skin of the newborn through the wearing part, and the vital sign sensor probe detects the vital sign data and sends it to the microcontroller. The microcontroller stores the vital sign data and transmits it to the terminal device through the transmission module.

[0026] (2) The present invention is provided with a mechanical transducer, which can detect the vibration of the incubator and collect the energy of the vibration.

[0027] Another object of the present invention is to provide an incubator to solve the problem that the incubator cannot collect vital sign data and send it to a mobile terminal.

[0028] To achieve the above object, the technical solution of the present invention is achieved as follows:

[0029] An incubator comprises an incubator body provided with casters, wherein the incubator body is provided with the above-mentioned data communication device.

[0030] The advantages of the incubator and the above-mentioned data communication device over the prior art are the same and will not be described in detail here. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] The accompanying drawings, which constitute a part of the present invention, are used to provide a further understanding of the present invention. The exemplary embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute improper limitations on the present invention.

[0032] Figure 1 A schematic structural diagram of an embodiment of the present invention;

[0033] Figure 2 This is an exploded diagram of the communication device itself;

[0034] Figure 3 It is a structural schematic diagram of one side of the first shell;

[0035] Figure 4 It is a structural schematic diagram of the other side of the first shell;

[0036] Figure 5 is a schematic diagram of the second shell structure;

[0037] Figure 6 Schematic diagram of the structure of an embodiment of the mechanical transducer of the present invention;

[0038] Figure 7 Schematic diagram of the first slot and the second slot;

[0039] Figure 8 Create a schematic diagram for the substrate;

[0040] Figure 9 Schematic diagram of thinning molding;

[0041] Figure 10 This is a schematic diagram of the protective glue position;

[0042] Figure 11 Schematic diagram of scratches;

[0043] Figure 12 Schematic diagram of interdigitated electrodes;

[0044] Figure 13 Schematic diagram of the incubator structure;

[0045] Description of reference numerals:

[0046] 1-incubator body, 2-mechanical transducer, 3-communication device body, 4-data transmission line, 5-sensor probe assembly;

[0047] 11-placement table, 21-substrate, 22-first metal layer, 23-second bonding layer, 24-piezoelectric layer, 25-third metal layer, 26-second metal layer, 27-interdigitated electrodes, 28-protective glue, 29-antenna device; 31-second shell, 32-circuit board, 33-first shell, 34-wire hole, 41-detection part, 42-wearing part, 43-vital sign sensor probe.

[0048] 111 - cavity, 211 - protective layer, 212 - first bonding layer, 213 - groove, 214 - first slot, 215 - second slot, 241 - seed layer, 221 - scratch; 311 - card block, 312 - second heat dissipation hole, 321 - through hole, 331 - card slot, 332 - placement cavity;

[0049] 2111-window, 2141-first horizontal end, 2142-first raised end, 2151-second horizontal end, 2152-second raised end, 3111-second threaded hole, 3311-first threaded hole, 3321-first heat dissipation hole, 3322-column, 3323-isolation groove. DETAILED DESCRIPTION

[0050] It should be noted that, in the absence of conflict, the embodiments of the present invention and the features in the embodiments may be combined with each other.

[0051] It should be noted that, in the absence of conflict, the embodiments of the present invention and the features therein may be combined with each other. In addition, the terms "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like mentioned in the embodiments of the present invention indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific position, be constructed and operate in a specific position. Therefore, they should not be understood as limiting the present invention.

[0052] The present invention will be described in detail below with reference to the accompanying drawings and in conjunction with embodiments.

[0053] Example 1

[0054] like Figure 1-5 As shown, a data communication device for an incubator includes a communication device body 3, a sensor probe assembly 5 and a mechanical transducer 2.

[0055] The communication device body 3 includes a first shell 33 and a second shell 31, which are detachably connected together, thereby facilitating the assembly and maintenance of the communication device body 3; a placement cavity 332 is provided in the first shell 33, in which the microcontroller, energy supply module, storage module and transmission module are placed, thereby facilitating the disassembly and maintenance of the four components by placing them in the placement cavity 332, and the placement cavity 332 can also protect the microcontroller, energy supply module, storage module and transmission module.

[0056] In this embodiment, the first shell 33 and the second shell 31 are detachably connected together in the following manner: a slot 331 is provided on the side wall of the placement cavity 332, and a block 311 is provided on the second shell 31 that cooperates with the slot 331; when the block 311 is located in the slot 331, the second shell 31 closes the placement cavity 332 to achieve a closing effect; in order to promote a tight connection between the two, the slot 331 is provided with a first threaded hole 3311 that passes through it, and the block 311 is provided with a second threaded hole 3111 that passes through it; when the block 311 is located in the slot 331, the first threaded hole 3311 and the second threaded hole 3111 overlap and are connected together by screws.

[0057] In this embodiment, the transmission module can adopt one of the WiFi mode, Bluetooth mode or mobile communication mode, thereby, the transmission module can perform wireless transmission with the terminal device, so that data transmission is not affected by location; in another implementation manner of the transmission module, the transmission module is connected to the terminal device by wire, that is, a method of transmitting information using tangible media such as metal wires and optical fibers, thereby, the transmission module can perform wired transmission with the terminal device, and data transmission is more stable; the wired transmission and wireless transmission of the above-mentioned transmission module can be used separately or together, depending on actual needs.

[0058] The storage module is a memory used to store the vital sign data detected by the vital sign sensor probe; the energy supply module is a rechargeable battery. When the battery power is insufficient, it can be charged through its built-in USB data interface, mainly providing power for the normal operation of the entire device.

[0059] The sensor probe assembly 5 includes a wearing portion 42 and a detecting portion 41 connected to the wearing portion 42; the two ends of the wearing portion 42 are detachably connected together by a connecting piece. Specifically, each end of the wearing portion 42 is provided with a Velcro, and the two Velcros can be adhered to each other. The wearing portion 42 can be put on the arm or leg of the newborn through the Velcro at both ends; the detecting portion 41 is provided with a vital sign sensor probe 43 electrically connected to the microcontroller; specifically, the vital sign sensor probe 43 is used to detect the body temperature, pulse and heart rate of the newborn, and transmit these vital sign data to the microcontroller.

[0060] In this embodiment, after the vital sign sensor probe 43 transmits the vital sign data to the microcontroller, the microcontroller stores the vital sign data in the storage module, and / or the microcontroller transmits the vital sign data to the terminal device through the transmission module. The terminal device can be a nurse station in a hospital or a parent's mobile phone.

[0061] In this embodiment, the vital sign sensor probe 43 includes a skin temperature sensor probe, a pulse sensor probe and a heart rate sensor probe; the three are electrically connected to the microcontroller through a data transmission line 4, thereby, the skin temperature sensor probe realizes body temperature detection, the pulse sensor probe realizes pulse detection, and the heart rate sensor probe realizes heart rate detection; at the same time, a wire hole 34 for the data transmission line 4 to pass through is provided on the first shell 33, thereby, the data transmission line 4 passes through the wire hole 34, which is convenient for electrically connecting the vital sign sensor probe 43 and the microcontroller.

[0062] The mechanical transducer 2 senses the vibration of the incubator and converts mechanical energy into electrical energy; the mechanical transducer 2 is electrically connected to an energy storage device, and the energy storage device is electrically connected to the energy supply module; thus, during the process of transporting the incubator, adjusting the incubator mechanism, treating newborns and shaking newborns, the incubator will vibrate, and the mechanical transducer 2 senses the vibration of the incubator and converts it into electrical energy. The energy storage device collects the converted electrical energy and transmits it to the energy supply module for auxiliary charging.

[0063] Example 2

[0064] In this embodiment, the data communication device also includes an alarm device, which is arranged in the placement cavity 332. The alarm device is a speaker or a buzzer, and the alarm device is electrically connected to the microcontroller. When the microcontroller detects that the vital sign data is abnormal, the microcontroller prompts the alarm device to alarm, and uses sound to auditorily remind the medical staff or parents. At the same time, the microcontroller sends an alarm message to the terminal device, which is the nurse station of the above-mentioned hospital or the parent's mobile phone, and visually reminds the medical staff or parents through text.

[0065] This embodiment serves the purpose of reminding from both visual and auditory aspects, which can better observe the newborn and prevent accidents.

[0066] Example 3

[0067] like Figure 2 As shown, in this embodiment, the placement cavity 332 is provided with a circuit board 32, and the circuit board 32 is provided with a microcontroller, a storage module and a transmission module. Thus, the microcontroller, the storage module and the transmission module are integrated together through the circuit board 32, which is convenient for the installation and removal of circuit components; a column 3322 with an axial hole is provided in the placement cavity 332, and a through hole 321 matching the axial hole is provided on the circuit board 32; the circuit board 32 is placed on the column 3322, and the axial hole and the through hole 321 coincide with each other. Specifically, there are four columns 3322, and the four columns 3322 are symmetrically arranged in the placement cavity 332; four through holes 321 are provided on the circuit board 32. When the circuit board 32 is set on the column 3322, the four through holes 321 coincide with one column 3322 respectively, and are connected together by pins.

[0068] Example 4

[0069] like Figure 2 As shown, in this embodiment, the first shell 33 is provided with a first heat dissipation hole 3321, and the second shell 31 is provided with a second heat dissipation hole 312; the first heat dissipation hole 3321 and the second heat dissipation hole 312 form an air duct to dissipate heat inside the placement cavity 332; because the circuit components in the placement cavity 332 generate heat when working, it will cause the temperature in the placement cavity 332 to rise and turn into hot air. If the hot air is not discharged, the life of the circuit components will be shortened over time.

[0070] In this embodiment, the first housing 33 is provided with an isolation groove 3323. Specifically, Figure 4 In the direction shown, the isolation groove 3323 is arranged on the bottom end surface of the first shell 33, and the isolation groove 3323 is provided with a notch on the side wall of the first shell 33; the first heat dissipation hole 3321 is provided with an air hole in the isolation groove 3323, so that when the first shell 33 is placed horizontally, its bottom end surface abuts against the placement plane, and the first heat dissipation hole 3321 is communicated with the outside world under the action of the isolation groove 3323, thereby not hindering the heat dissipation of the first heat dissipation hole 3321.

[0071] Example 5

[0072] like Figure 1 As shown, in this embodiment, the mechanical transducer 2 is arranged on the second shell 31. Specifically, one end of the mechanical transducer 2 is fixedly connected to the first shell 33, and the end of the mechanical transducer 2 with a mass block is suspended. Therefore, only when the end of the mechanical transducer 2 with a mass block is suspended can it sense the vibration of the incubator, thereby converting mechanical energy into electrical energy.

[0073] In another installation method of the mechanical transducer 2, the mechanical transducer 2 is separated from the communication device body 3, and the mechanical transducer 2 is arranged on the incubator. In order to better sense the vibration of the incubator, the mechanical transducer 2 is arranged on the placement table 11 of the incubator. It can be built into the placement table 11 or externally connected to the placement table 11. It only requires that one end of the mechanical transducer with a mass block be suspended in the air so that it can sense external vibration.

[0074] In this embodiment, Figure 6 、 7 As shown, the mechanical transducer 2 includes a substrate 21 , a first bonding layer 212 , a first metal layer 22 , a second metal layer 26 , a third metal layer 25 and a piezoelectric layer 24 .

[0075] The substrate 21 is made of silicon, that is, a silicon substrate. A first groove 214 is provided on the front side of the substrate 21, and a second groove 215 is provided on the back side of the substrate 21. The cross-sections of the first groove 214 and the second groove 215 are L-shaped. The first groove 214 includes a first horizontal end 2141 and a first protruding end 2142. Thus, the first horizontal end 2141 connects to the piezoelectric layer 24 to enable the first metal layer 22 to form an interdigitated electrode 27. The first protruding end 2142 serves as a reference standard for the height of the piezoelectric layer 24; the second groove 215 includes a second horizontal end 2151 and a second protruding end 2152. Thus, the second protruding end 2152 forms a mass block of the entire device, which is used to sense environmental vibrations and thus vibrate up and down.

[0076] The first horizontal end 2141 is provided with a first metal layer 22, the first metal layer 22 forms an interdigitated electrode 27, and the interdigitated electrode 27 is connected to an external energy storage device through a wire. The energy storage device is a battery, thereby realizing the output of charge. The first metal layer 22 is Au (gold), and the thickness of the Au layer is generally But it should not be lower than Because in The following Au layer cannot be realized because Au is difficult to grow directly on the silicon substrate 21.

[0077] The first bonding layer 212 is a conductive adhesive, which is located between the first horizontal end 2141 and the first metal layer 22. The thickness is generally preferably 1um to 7um, but should not exceed 7um. Since the conductive adhesive is an epoxy resin conductive adhesive, it is doped with silver debris and has both adhesive and conductive properties. Therefore, it can well bond the substrate 21 and the first metal layer 22.

[0078] The thickness of the first bonding layer 212 is directly related to the thickness of the piezoelectric layer 24 , and the two are inversely proportional. When the thickness of the conductive adhesive is large, the thickness of the piezoelectric layer 24 is small; when the thickness of the conductive adhesive is small, the thickness of the piezoelectric layer 24 is large.

[0079] The piezoelectric layer 24 is a PZT sheet, and a second metal layer 26 is provided on the lower surface of the PZT sheet. The second metal layer 26 is Au (gold), and the thickness of the gold layer is But it should not be lower than used for collecting charge; the upper surface of the piezoelectric layer 24 is flush with the upper surface of the first groove 214, that is, the piezoelectric layer 24 is flush with the second protruding end 2152, thereby limiting the position of the upper surface of the piezoelectric layer 24.

[0080] Cr (chromium) is also provided between the second metal layer 26 and the PZT sheet as a seed layer 241 for the growth of the second metal layer 26. The thickness of chromium is generally But it should not be lower than The second metal layer 26 and the first metal layer 22 are connected via the second bonding layer 23. The first bonding layer 212 is a conductive adhesive, and the thickness is generally preferably 1um to 7um, but should not exceed 7um. Since the conductive adhesive is an epoxy resin conductive adhesive, it is doped with silver debris and has both adhesive and conductive properties. Therefore, the piezoelectric layer 24 and the substrate 21 can be well bonded.

[0081] The entire device, except for the mass block, constitutes a cantilever beam. During operation, the mass block receives vibrations from the environment, driving the cantilever beam to vibrate. The PZT sheet deforms to generate charges on the upper and lower surfaces, which are eventually conducted away through the interdigital electrodes 27.

[0082] Example 6

[0083] like Figure 8-12 As shown, the processing method of the mechanical transducer 2 in this embodiment includes:

[0084] A protective layer 211 with windows 2111 is formed on the front and back surfaces of the substrate 21;

[0085] Specifically, first prepare a substrate 21, the substrate 21 material includes silicon, germanium, silicon germanium, silicon carbide, etc., and preferably <110> Silicon, a double-sided polishing (such as CMP) flattening process is used to reduce surface defects and reduce roughness; then silicon oxide is deposited on the front and back sides of the substrate 21 (preferably a low-temperature CVD process) to form a protective layer 211. The thickness of the protective layer 211 of the substrate 1 is No less than The deposition temperature is 600-900°C, and preferably 780°C.

[0086] The front and back sides of the protective layer 211 are coated with resist and photolithography to form a photoresist window 2111 pattern, where the size of the window 2111 is, for example, 18 mm in length and 1.7 mm in width; the front and back protective layers 211 are anisotropically etched using reactive ion etching (RIE) technology to transfer the photoresist pattern to the front and back protective layers 211, thereby forming the window 2111; finally, the photoresist on the silicon wafer surface is removed using a combination of sulfuric acid / hydrogen peroxide wet stripping and oxygen plasma dry stripping.

[0087] According to the position of the window 2111, grooves 213 are formed on the front and back surfaces of the substrate 21;

[0088] Specifically, the silicon wafer obtained above is immersed in an etching solution, or sprayed with an etching solution, so that the etching solution acts on the substrate 21 from the window 2111 on the front or back side. The etching solution uses 30% KOH at a temperature of about 70°C, an etching rate of 1 μm / min, and an etching time of 500 min; KOH can <110> The silicon is etched to form a groove 13 .

[0089] Bonding the first metal layer 22 into the groove 213 on the front surface of the substrate 21;

[0090] Specifically, the first metal layer 22 is bonded to the front of the substrate 21 through the first bonding layer 212. In this step, the first bonding layer 212 is a conductive glue, and the conductive glue is usually prepared by spinning. The substrate 21 is placed on a spinning machine, and the conductive glue is evenly prepared on the silicon wafer by high-speed rotation. After the preparation of the glue layer is completed, the glue layer needs to be semi-cured so that the conductive glue has a certain hardness and a certain plasticity, otherwise there is no way to continue to prepare the first metal layer 22 on the conductive glue.

[0091] After the first bonding layer 212 is prepared, the first metal layer 22 is evaporated on the first bonding layer 212. After the first metal layer 22 is prepared, the first metal layer 22 is scratched 221 with low power by a laser cutting machine.

[0092] The piezoelectric layer 24 is bonded to the first metal layer 22, the first metal layer 22 forms interdigital electrodes 27, and wires are welded to the interdigital electrodes 27;

[0093] Specifically, a piezoelectric layer 24 is prepared. The piezoelectric layer 24 is a PZT sheet. A Cr layer is sputtered on the lower surface of the PZT sheet as a seed layer 241 , and an Au layer is evaporated on the seed layer 241 as a second metal layer 26 . A conductive glue is applied on the second metal layer 26 as a second bonding layer 23 .

[0094] The side of the PZT sheet coated with conductive glue is placed in the groove 213 on the front side of the substrate 21, and bonded together under high temperature and high pressure. As a result, the first metal layer 22 is sandwiched between the first bonding layer 212 and the second bonding layer 23. Bonding requires pressure and heating. Under such conditions, the first metal layer 22 produces appropriate extension and breaks away from each other along the position of the laser scratch 221 to form interdigital electrodes 27. Wires are welded to the interdigital electrodes 27 to conduct electrical energy. Specifically, the interdigital electrodes 27 are connected to an energy storage device through a wire. The energy storage device is a battery. The electrical energy converted by the mechanical transducer 2 flows into the battery via the interdigital electrodes 27.

[0095] Since the first bonding layer 212 and the second bonding layer 23 are conductive adhesives, after heating and pressurizing, the conductive adhesive is compressed. The thickness of the conductive adhesive after bonding is usually between 700nm and 5um, forming a relatively tight connection between the PZT piece and the substrate 21. Some of the conductive adhesive will squeeze into the gap between the PZT piece and the groove 213. If there is too much conductive adhesive, it will break away from the groove 213 and squeeze onto the top of the substrate 21.

[0096] What needs to be noted in this process is that the size of the PZT piece should be slightly smaller than the groove 213 on the substrate 21, otherwise the piezoelectric material cannot be placed in. However, during the bonding process, the position near the tail end (the end that does not form the mass block) should be tightly combined, and it is best not to leave any gaps to prevent short circuits.

[0097] Thinning the piezoelectric layer 24 until the piezoelectric layer 24 is flush with the groove 213 on the front surface of the substrate 21;

[0098] Specifically, the PZT sheet is thinned by CMP (chemical mechanical polishing) and / or wet etching until it is flush with the groove 213 on the front surface of the substrate 21 to obtain a desired thickness.

[0099] In this process, the thickness of the PZT sheet is controlled by the thickness of the electrical adhesive layer and the depth of the groove 213 .

[0100] Perform scribing to release the cantilever arm and mass block;

[0101] Specifically, a dicing instrument is used, a dicing path is reserved with a depth of 100 μm, and the dicing path is diced through to release the mass block.

[0102] In this embodiment, before scribing and releasing the cantilever arm and the mass block, the back side of the substrate 21 is further corroded. Specifically, a third metal layer 25 is provided on the piezoelectric layer 24, and then a protective glue 28 is applied on the third metal layer 25. Thus, the protective glue 28 can prevent KOH from corroding the third metal layer 25. Then, the device is immersed in a KOH solution, and KOH further corrodes the back side of the substrate 21 until the required thickness of the substrate 21 is obtained. The thickness of the substrate 21 should usually be corroded to a thickness similar to that of the conductive glue 28. This structure has good conductivity. Finally, the device is removed from the KOH solution, and the protective glue 28 is removed using acetone or other organic solvents with strong polarity. Thus, the mass block is further released, making it easier to sense vibrations in the environment.

[0103] Example 7

[0104] like Figure 13 As shown, an incubator comprises an incubator body 1 provided with casters, and the incubator body 1 comprises the data communication device of any of the above embodiments.

[0105] In this embodiment, the incubator body 1 is provided with casters, and the incubator body 1 can be moved by the casters. The placement table 11 of the incubator body 1 is provided with a cavity 111 .

[0106] When the mechanical transducer 2 is arranged in the second shell 31, the communication device body 3 and the mechanical transducer 2 are arranged in the cavity 111. Thus, the vital sign sensor probe 43 is placed on the skin of the newborn through the wearing part 42. The vital sign sensor probe 43 detects the vital sign data and sends it to the microcontroller. The microcontroller stores the vital sign data and transmits it to the mobile terminal through the transmission module.

[0107] When the mechanical transducer 2 is separated from the communication device body 3, the communication device body 3 is set in the cavity 111. The mechanical transducer 2 can be set in the cavity 111 or placed externally on the placement table 11. The mechanical transducer 2 can sense the vibration of the incubator during the process of transporting the incubator, adjusting the incubator mechanism, treating newborns and shaking the newborns, thereby collecting the vibration energy and transmitting it to the energy storage device through the wire.

[0108] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A data communication device for an incubator, characterized in that: include: A communication device body (3), the communication device body (3) comprising a first shell (33) and a second shell (31), the first shell (33) and the second shell (31) being detachably connected together; a placement cavity (332) is provided in the first shell (33), the placement cavity (332) being provided with a microcontroller, an energy supply module electrically connected to the microcontroller, a storage module electrically connected to the microcontroller, and a transmission module electrically connected to the microcontroller; A sensor probe assembly (5), the sensor probe assembly (5) comprising a wearing portion (42) and a detection portion (41) connected to the wearing portion (42); two ends of the wearing portion (42) are detachably connected together via a connecting piece; the detection portion (41) is provided with a vital sign sensor probe (43) electrically connected to the microcontroller; The vital sign sensor probe (43) detects the vital sign data of the baby in the incubator and transmits it to the microcontroller, the microcontroller stores the vital sign data in a storage module, and / or the microcontroller transmits the vital sign data to a terminal device via the transmission module; The data communication device further comprises a mechanical transducer (2), wherein the mechanical transducer (2) senses the vibration of the incubator and converts mechanical energy into electrical energy; the mechanical transducer (2) is electrically connected to an energy storage device, and the energy storage device is electrically connected to the energy supply module; the mechanical transducer (2) comprises: a substrate (21), a first bonding layer (212), a first metal layer (22) and a piezoelectric layer (24); a first slot (214) is provided on the front side of the substrate (21), and a second slot (215) is provided on the back side of the substrate (21); the cross-sections of the first slot (214) and the second slot (215) are L-shaped; the first bonding layer (212) is located between the first metal layer (22) and the piezoelectric layer (24); The invention relates to a method for manufacturing a cantilever beam comprising: a first metal layer (215) and a second metal layer (22) disposed on the first bonding layer (212); the first metal layer (22) forms an interdigitated electrode (27), the interdigitated electrode (27) being provided with a wire connected to the energy storage device; the piezoelectric layer (24) being disposed on the first metal layer (22), one surface of the piezoelectric layer (24) being flush with the first groove (214); the second groove (215) comprising a second protruding end (2152), the second protruding end (2152) being a mass block; and the substrate (21) excluding the mass block, the first bonding layer (212), the first metal layer (22) and the piezoelectric layer (24) forming a cantilever beam.

2. The data communication device according to claim 1, characterized in that: The side wall of the placement cavity (332) is provided with a slot (331), and the second shell (31) is provided with a block (311) that cooperates with the slot (331); the block (311) is located in the slot (331), and the second shell (31) closes the placement cavity (332); the slot (331) is provided with a first threaded hole (3311) that penetrates therethrough, and the block (311) is provided with a second threaded hole (3111) that penetrates therethrough; the block (311) is located in the slot (331), and the first threaded hole (3311) and the second threaded hole (3111) overlap and are connected together by screws.

3. The data communication device according to claim 2, characterized in that: A circuit board (32) is arranged in the placement cavity (332), and the microcontroller, the storage module and the transmission module are arranged on the circuit board (32); a column (3322) with an axial hole is arranged in the placement cavity (332), and a through hole (321) matching the axial hole is arranged on the circuit board (32); the circuit board (32) is placed on the column (3322), and the axial hole and the through hole (321) overlap.

4. The data communication device according to claim 2, characterized in that: The first shell (33) is provided with a first heat dissipation hole (3321), and the second shell (31) is provided with a second heat dissipation hole (312); the first heat dissipation hole (3321) and the second heat dissipation hole (312) form an air duct.

5. The data communication device according to claim 1, characterized in that: The data communication device also includes an alarm device, which is electrically connected to the microcontroller; when the microcontroller detects abnormal vital sign data, the microcontroller prompts the alarm device to sound an alarm, and the microcontroller sends an alarm message to the terminal device.

6. The data communication device according to claim 1, characterized in that: The vital sign sensor probe (43) comprises a skin temperature sensor probe, a pulse sensor probe and a heart rate sensor probe; the skin temperature sensor probe, the pulse sensor probe and the heart rate sensor probe are electrically connected to the microcontroller via a data transmission line (4).

7. The data communication device according to claim 1, characterized in that: One end of the mechanical transducer (2) is arranged on the second housing (31), and the other end of the mechanical transducer (2) is suspended in the air.

8. The data communication device according to claim 1, characterized in that: The mechanical transducer (2) is a mechanical transducer prepared according to the following process: A protective layer (211) with windows (2111) is formed on the front and back surfaces of a substrate (21); grooves (213) are formed on the front and back surfaces of the substrate (21) according to the positions of the windows (2111); a first metal layer (22) is bonded to the groove (213) on the front surface of the substrate (21); the piezoelectric layer (24) is bonded to the first metal layer (22), the first metal layer (22) forms interdigitated electrodes (27), and wires are welded to the interdigitated electrodes; the piezoelectric layer (24) is thinned until the piezoelectric layer (24) is flush with the groove (213) on the front surface of the substrate (21); and slicing is performed to release the cantilever arm and the mass block.

9. An incubator, characterized in that: It comprises an incubator body (1) provided with casters, wherein the incubator body (1) is provided with a data communication device as described in any one of claims 1 to 8.

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