Substrate processing device and substrate processing method

Abstract

The present invention provides a substrate processing device and a substrate processing method. In the substrate processing device, a substrate (9) is held in a state where a first main surface on which a pattern is formed faces downward, and a second main surface facing upward is treated with a processing liquid. When the substrate is handed over to an external transport mechanism, the outer periphery of the substrate is supported from below by a plurality of lifting support surfaces of a lifting part (22). A plurality of clamp abutting surfaces of a clamp part (23) abut against the outer peripheral end surface of the substrate supported by the lifting part, thereby holding the substrate. Thus, damage to the pattern near the outer periphery of the first main surface can be suppressed. In the clamp part, the substrate can be held in a state where a portion of the clamp abutting surface is separated from the outer peripheral end surface of the substrate, and the clamp abutting surface separated from the outer peripheral end surface is switched by a clamp switching mechanism while the processing liquid is supplied to the second main surface. Thus, the generation of processing liquid traces on the outer periphery of the substrate can be suppressed.

Description

Technical Field

[0001] The invention relates to a substrate processing device and a substrate processing method. Background Art

[0002] Conventionally, a substrate processing device that performs various processes on a semiconductor substrate (hereinafter referred to as a "substrate") has been used in the manufacture of semiconductor devices. For example, in the substrate processing device of Japanese Patent Gazette No. 2017-69531 (Document 1), the substrate is held in a state where the device forming surface, i.e., the surface, faces downward, while the device non-forming surface, i.e., the back surface, is cleaned. In addition, in the substrate processing device, it is possible to transition between a state where the substrate is supported by a first movable pin group including more than three movable pins and a state where the substrate is supported by a second movable pin group including more than three movable pins. Thus, the contact support position of the movable pins contacting the substrate can be changed during the rotation of the substrate, so that the outer periphery of the substrate can be cleaned without cleaning residues.

[0003] In addition, Japanese Patent Application Publication No. 2004-235234 discloses a substrate processing apparatus including a placement portion for placing a substrate and a plurality of clamping members for clamping an end surface of the substrate placed on the placement portion to separate the substrate from the placement portion and hold the substrate.

[0004] However, in recent years, in order to manufacture more devices on a substrate, patterns are formed on the device forming surface, i.e., the surface, to a position very close to the periphery. In the method of Document 1, although it is possible to suppress the generation of traces of the processing liquid on the periphery of the substrate, there is a concern that the pattern formed near the periphery may be damaged by the movable pins. Summary of the invention

[0005] The present invention is directed to a substrate processing device, and its purpose is to maintain a substrate in a state where a main surface with a pattern formed thereon faces downward, and when the main surface facing upward is processed with a processing liquid, to suppress damage to the pattern near the outer peripheral edge of the main surface facing downward and to suppress the generation of traces of the processing liquid on the outer peripheral edge of the substrate.

[0006] The substrate processing device of the present invention comprises: a substrate holding part, on which a pattern is formed on a first main surface of the substrate, and the substrate is held horizontally in a state where the first main surface is facing downward; a substrate rotating mechanism, which rotates the substrate held by the substrate holding part around a central axis facing in an up-down direction; and a processing liquid supply part, which supplies processing liquid to a second main surface of the substrate facing upward, the substrate holding part having: a relative plate part, having a relative surface opposite to the first main surface of the substrate; a lifting part, having a plurality of lifting pins arranged below the outer peripheral edge of the substrate on the relative plate part, the plurality of lifting pins having a plurality of lifting support surfaces, and the outer peripheral edge is supported from below by the plurality of lifting support surfaces when the substrate is handed over to an external transport mechanism; a clamp part , having a plurality of clamp pins arranged below the outer peripheral edge of the substrate on the relative plate portion, the plurality of clamp pins having a plurality of clamp abutment surfaces movable in a horizontal direction, and holding the substrate in a state where the substrate is separated upward from all of the plurality of lifting support surfaces by making the plurality of clamp abutment surfaces abut against the outer peripheral end surface of the substrate supported by the lifting portion; and a clamp switching mechanism, wherein the clamp portion can hold the substrate in a state where a portion of the clamp abutment surfaces of the plurality of clamp abutment surfaces are separated from the outer peripheral end surface of the substrate and the remaining clamp abutment surfaces are abutted against the outer peripheral end surface, and the clamp abutment surface separated from the outer peripheral end surface is switched during the period when the processing liquid supply portion supplies the processing liquid to the second main surface.

[0007] According to the present invention, when a substrate is held with a first main surface on which a pattern is formed facing downward and a second main surface facing upward is treated with a processing liquid, damage to the pattern near the outer periphery of the first main surface and traces of the processing liquid on the outer periphery of the substrate can be suppressed.

[0008] The present invention is also directed to a substrate processing method for a substrate processing device. In the substrate processing method of the present invention, the substrate processing device comprises: a substrate holding portion having a pattern formed on a first main surface of the substrate, and holding the substrate horizontally in a state where the first main surface is facing downward; a substrate rotating mechanism, which rotates the substrate held by the substrate holding portion around a central axis facing in the up-down direction; and a processing liquid supply portion, which supplies processing liquid to a second main surface of the substrate facing upward, the substrate holding portion comprises: a relative plate portion having a relative surface opposite to the first main surface of the substrate, a lifting portion having a plurality of lifting pins arranged on the relative plate portion below the outer periphery of the substrate, the plurality of lifting pins having a plurality of lifting support surfaces, and when the substrate is handed over to an external transport mechanism, the outer periphery is supported from below by the plurality of lifting support surfaces; and a clamp portion having a relative plate portion arranged on the relative plate portion below the outer periphery of the substrate. The plurality of clamp pins are provided below the outer peripheral edge of the substrate, the plurality of clamp pins having a plurality of clamp abutment surfaces that can move in the horizontal direction, and the plurality of clamp abutment surfaces are abutted against the outer peripheral end surface of the substrate supported by the lifting portion, so that the substrate is held in a state in which the substrate is separated upward from all of the plurality of lifting support surfaces, and the clamp portion can hold the substrate in a state in which a portion of the clamp abutment surfaces are separated from the outer peripheral end surface of the substrate and the remaining clamp abutment surfaces are abutted against the outer peripheral end surface. The substrate processing method comprises: a) step, in which the substrate is rotated by the substrate rotating mechanism and the processing liquid is supplied to the second main surface by the processing liquid supply portion; and b) step, in parallel with the a) step, switching the clamp abutment surface separated from the outer peripheral end surface.

[0009] The above-mentioned object and other objects, features, aspects and advantages will become more apparent from the following detailed description of the present invention with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] Figure 1 It is a diagram showing the structure of a substrate processing apparatus.

[0011] Figure 2 It is a top view showing the opposing plate portion.

[0012] Figure 3 It is a figure which shows the lift pin viewed in the circumferential direction.

[0013] Figure 4 It is a top view of the table lifting pin.

[0014] Figure 5 It is a figure which shows the lower surface of the opposing plate part.

[0015] Figure 6 It is a figure which shows the lower surface of the opposing plate part.

[0016] Figure 7 It is a figure which shows the jig pin viewed in the circumferential direction.

[0017] Figure 8 is a top view showing the fixture pin.

[0018] Fig. 9 It is a figure which shows the lower surface of the opposing plate part.

[0019] Fig.10 It is a figure which shows the lower surface of the opposing plate part.

[0020] Fig.11 is a flow chart of processing a substrate.

[0021] Fig.12 This is a diagram showing the lift pin as viewed in the circumferential direction.

[0022] The reference numerals are described as follows:

[0023] 1: Substrate processing equipment

[0024] 2: Substrate holding part

[0025] 3: Substrate rotation mechanism

[0026] 4: Processing liquid supply unit

[0027] 5: Inert gas supply unit

[0028] 9: Substrate

[0029] 21: Relative plate

[0030] 22: Lifting unit

[0031] 23: Fixture Department

[0032] 25: Fixture switching mechanism

[0033] 51: Gas nozzle

[0034] 91: First main surface (of substrate)

[0035] 92: Second main surface (of substrate)

[0036] 93: Outer peripheral end surface (of substrate)

[0037] 94: outer periphery (of substrate)

[0038] 211: Opposite side

[0039] 215: Annular step

[0040] 221: Lifting pin

[0041] 222: Lifting support surface

[0042] 224: Lifting guide surface

[0043] 228: Drainage tank

[0044] 231, 231a, 231b: Fixture pins

[0045] 232: Clamp contact surface

[0046] C1: Reference circle

[0047] J1: Center axis DETAILED DESCRIPTION

[0048] Figure 1 1 is a diagram showing the structure of a substrate processing apparatus 1 according to an embodiment of the present invention. The substrate processing apparatus 1 is a single-sheet type apparatus that processes disk-shaped substrates 9 one by one. The substrate 9 has a first main surface 91, which is a device forming surface, and a second main surface 92, which is a non-device forming surface. A pattern for manufacturing a device is formed on the first main surface 91. In the substrate processing apparatus 1, the second main surface 92, on which the device pattern is not formed, is oriented upward, and the second main surface 92 is processed with a processing liquid.

[0049] The substrate processing apparatus 1 includes a substrate holding portion 2, a substrate rotating mechanism 3, a processing liquid supply portion 4, and an inert gas supply portion 5. The substrate holding portion 2 and the substrate rotating mechanism 3 are accommodated in a box-shaped chamber (not shown). A liquid nozzle 41 of the processing liquid supply portion 4 and a gas nozzle 51 of the inert gas supply portion 5 described later are also accommodated in the chamber. The chamber forms a substantially closed internal space.

[0050] Figure 2 FIG. 2 is a top view showing the relative plate portion 21 of the substrate holding portion 2. Figure 1 and Figure 2 As shown, the substrate holding portion 2 includes a facing plate portion 21, a lifting portion 22, a clamp portion 23, a pin lifting mechanism 24, and a clamp switching mechanism 25. The facing plate portion 21 is in the shape of a disk centered on a central axis J1 in the vertical direction. Figure 1 In the embodiment, the substrate 9 is held above the relative plate portion 21, and the surface of the relative plate portion 21 facing upward is a relative surface 211 facing the first main surface 91 of the substrate 9 facing downward. The relative surface 211 extends in a direction perpendicular to the central axis J1. The lifting portion 22 includes a plurality of lifting pins 221 (see FIG. 2 ) arranged below the outer peripheral edge 94 of the substrate 9. Figure 2). The pin lifting mechanism 24 lifts the plurality of lifting pins 221 in the vertical direction. The clamp portion 23 includes a plurality of clamp pins 231a, 231b disposed below the outer peripheral edge 94 of the substrate 9. The clamp switching mechanism 25 rotates the plurality of clamp pins 231a, 231b around a clamp rotation axis J2 to be described later and parallel to the vertical direction. The substrate holding portion 2 will be described in detail later.

[0051] like Figure 1 As shown, the upper end of the shaft portion 31 centered on the central axis J1 is fixed at the center of the lower surface 212 of the relative plate portion 21. The substrate rotating mechanism 3 having a motor rotates the relative plate portion 21 together with the substrate 9 centered on the central axis J1 by rotating the shaft portion 31. The substrate rotating mechanism 3 can stop the relative plate portion 21 at a predetermined angular position (hereinafter referred to as the "rotation stop position") in the circumferential direction centered on the central axis J1. The relative plate portion 21 and the shaft portion 31 are provided with a hollow portion extending in the up-down direction on the central axis J1, and the gas nozzle 51 is arranged in the hollow portion. The gas nozzle 51 extends in the up-down direction, and the upper end surface of the gas nozzle 51 is arranged near the relative surface 211 of the relative plate portion 21. The gas nozzle 51 is located in the central portion of the relative plate portion 21, directly opposite to the central portion of the first main surface 91 of the substrate 9.

[0052] The processing liquid supply unit 4 includes a liquid nozzle 41 and a processing liquid supply source 42. The liquid nozzle 41 is supported by a nozzle arm 411. The nozzle arm 411 is connected to a nozzle moving mechanism (not shown). The liquid nozzle 41 is selectively arranged at a discharge position and a standby position by the nozzle moving mechanism. The discharge position is a position opposite to the central portion of the second main surface 92 of the substrate 9, and the standby position is a position away from the substrate 9 in a direction perpendicular to the up-down direction. The liquid nozzle 41 is connected to the processing liquid supply source 42 via a valve. By supplying the processing liquid from the processing liquid supply source 42 to the liquid nozzle 41, the processing liquid is sprayed from the liquid nozzle 41 to the central portion of the second main surface 92. Figure 1 The processing liquid supply source 42 can sequentially switch the processing liquid such as chemical liquid, organic solvent, pure water (deionized water (DIW)) to supply to the liquid nozzle 41. Examples of the chemical liquid include ozone-containing hydrofluoric acid solution, dilute hydrofluoric acid (DHF), buffered hydrofluoric acid (BHF), SC1 (liquid containing NH4OH and H2O2), etc. Examples of the organic solvent include isopropyl alcohol (IPA).

[0053] The inert gas supply unit 5 includes the above-mentioned gas nozzle 51 and the inert gas supply source 52. The gas nozzle 51 is connected to the inert gas supply unit 5 via a valve. By supplying the inert gas from the inert gas supply source 52 to the gas nozzle 51, the inert gas is ejected from the gas nozzle 51 to the space between the first main surface 91 and the opposing surface 211 of the opposing plate portion 21. The inert gas is typically nitrogen. The inert gas may also be argon, helium, low-humidity purified air, etc.

[0054] Next, the substrate holding portion 2 will be described in detail. Figure 2 As shown in FIG. 1 , a plurality of lifting pins 221 are arranged at equal intervals on the opposing surface 211 of the opposing plate portion 21 in the circumferential direction. In addition, a plurality of clamp pins 231a, 231b are arranged at equal intervals on the opposing surface 211 in the circumferential direction. The plurality of lifting pins 221 and the plurality of clamp pins 231a, 231b are arranged at positions of almost the same radius in the radial direction with the central axis J1 as the center. In the opposing surface 211, as shown in FIG. Figure 2 As shown by the double-dashed line in FIG. 1 , if a circle C1 (hereinafter referred to as "reference circle C1") with a radius centered on the central axis J1 is assumed, the plurality of lift pins 221 and the plurality of fixture pins 231a, 231b overlap the reference circle C1. The lift pins 221 and the fixture pins 231a, 231b are alternately arranged at equal intervals along the reference circle C1. Figure 2 In the example of FIG. 1 , six lift pins 221 are arranged at intervals of 60 degrees in the circumferential direction, and six clamp pins 231 a and 231 b are arranged at intervals of 60 degrees in the circumferential direction.

[0055] The plurality of clamp pins 231a and 231b are divided into the plurality of clamp pins 231a included in the first clamp pin group 23a and the plurality of clamp pins 231b included in the second clamp pin group 23b. Among the plurality of clamp pins 231a and 231b, every other clamp pin 231a in the circumferential direction is included in the first clamp pin group 23a, and the remaining clamp pins 231b are included in the second clamp pin group 23b. That is, in the circumferential direction, the clamp pins 231a of the first clamp pin group 23a and the clamp pins 231b of the second clamp pin group 23b are alternately arranged. Figure 2 In the example, the three clamp pins 231a included in the first clamp pin group 23a are arranged at intervals of 120 degrees in the circumferential direction, and the three clamp pins 231b included in the second clamp pin group 23b are arranged at intervals of 120 degrees in the circumferential direction.

[0056] A plurality of holes 213 are provided at equal intervals along the reference circle C1 on the opposing surface 211. The cross-sectional shape of the hole 213 perpendicular to the vertical direction is circular. The plurality of lifting pins 221 and the plurality of clamp pins 231a and 231b are substantially cylindrical and are inserted into the plurality of holes 213. Figure 2In the example of FIG. 1 , the diameter of the lift pin 221 is smaller than the diameter of the clamp pins 231 a and 231 b. The diameter of each hole 213 is a size that matches the lift pin 221 or the clamp pins 231 a and 231 b inserted into the hole 213 .

[0057] Each lift pin 221 is supported in the hole 213 so as to be movable in the up-down direction. Figure 2 An annular space centered on the central axis J1 is provided inside the opposing plate portion 21, and an annular member connecting the plurality of lift pins 221 to each other is arranged in the annular space. The annular member is formed in a shape avoiding the plurality of clamp pins 231a, 231b so as not to interfere with the plurality of clamp pins 231a, 231b.

[0058] like Figure 1 As shown in FIG. 1 , a pin lifting mechanism 24 is provided below the relative plate portion 21. The pin lifting mechanism 24 is arranged at a position opposite to the hole portion 213 in which a part of the lifting pin 221 is provided when the relative plate portion 21 is stopped at the rotation stop position. The pin lifting mechanism 24 has a cylinder, and a piston rod 241 is raised to push the lifting pin 221. Thus, a plurality of lifting pins 221 are arranged at Figure 3 When the pin lifting mechanism 24 lowers the piston rod 241, the plurality of lifting pins 221 are arranged at Figure 3 The lower position is indicated by a solid line in FIG. The lower position of the lift pin 221 is a position lower than the upper position. When the lift pin 221 is arranged at the lower position, a part of the lift pin 221 (the protrusion 220 described later) protrudes to a position higher than the opposite surface 211. In an example of the substrate holding portion 2, in a state where the piston rod 241 is not raised, in order to arrange the lift pin 221 at the lower position, the lift pin 221 is urged by an urging member such as a spring. The pin lifting mechanism 24 may also be a mechanism that pushes the lift pin 221 using a motor or the like.

[0059] Figure 4 2 shows an enlarged top view of the lifting pin 221. Figure 3 and Figure 4 As shown, the upper end of each lifting pin 221 is provided with a protrusion 220 protruding upward. For example, the protrusion 220 is provided with respect to a surface F1 ( Figure 4 The protrusion 220 has a lifting support surface 222, a lifting guide surface 224, and a lifting auxiliary guide surface 226. The lifting support surface 222 is a surface that is generally facing upward and is inclined toward the central axis J1 side ( Figure 3 and Figure 4 The lifting support surface 222 is inclined downward toward the central axis J1. In addition, the lifting support surface 222 has a direction extending from the surface F1 toward the circumferential direction ( Figure 4 The two surfaces 2221 are inclined downward on both sides of the substrate 9 (in the approximate vertical direction). The two surfaces 2221 intersect at an obtuse angle on the surface F1. That is, the lifting support surface 222 has a corner 223 where the two surfaces 2221 intersect. The corner 223 is inclined downward toward the central axis J1. As described below, when the plurality of lifting pins 221 support the substrate 9, typically, the corner 223 of each lifting pin 221 is in almost point contact with the outer peripheral edge 94 of the substrate 9.

[0060] The lifting guide surface 224 is a surface that is generally oriented toward the central axis J1 side, and is continuous with the lifting support surface 222 on the opposite side of the central axis J1. The lifting guide surface 224 is also inclined downward toward the central axis J1 side. The lifting guide surface 224 has two surfaces 2241 extending from the surface F1 toward both sides of the circumferential direction. The two surfaces 2241 intersect at an obtuse angle on the surface F1. That is, the lifting guide surface 224 has a corner 225 where the two surfaces 2241 intersect. The corner 225 is inclined downward toward the central axis J1 side. On the surface F1, the lifting guide surface 224 has an inclination angle θ2 (refer to Figure 3 The inclination angle θ1 of the lifting pin 221 (indicated by the double-dashed line) is greater than the inclination angle θ1 of the lifting support surface 222. In other words, the slope of the lifting guide surface 224 is greater than the slope of the lifting support surface 222. On the surface F1, the distance between the lower end of the lifting guide surface 224 and the central axis J1 is slightly greater than the radius of the substrate 9.

[0061] The lifting auxiliary guide surface 226 is a surface located on the side of the central axis J1 and facing upward, and is continuous with the side of the lifting auxiliary guide surface 224 opposite to the central axis J1. The lifting auxiliary guide surface 226 is also inclined downward toward the central axis J1. The lifting auxiliary guide surface 226 has two surfaces 2261 extending from the surface F1 toward both sides of the circumferential direction. The two surfaces 2261 intersect at an obtuse angle on the surface F1. That is, the lifting auxiliary guide surface 226 has a corner 227 where the two surfaces 2261 intersect. The corner 227 is inclined downward toward the central axis J1. On the surface F1, the lifting auxiliary guide surface 226 has an inclination angle θ3 (refer to Figure 3 The lifting pin 221 indicated by the double-dotted line in FIG. 2 is smaller than the inclination angle θ2 of the lifting guide surface 224, and larger than the inclination angle θ1 of the lifting support surface 222. In other words, the slope of the lifting auxiliary guide surface 226 is smaller than the slope of the lifting guide surface 224, and larger than the slope of the lifting support surface 222.

[0062] When the lifting pin 221 is arranged in the lower position, the entire area of ​​the lifting pin 221 is located at the same height as the opposite surface 211 when viewed from the side, or is located at a position slightly higher than the opposite surface 211. Therefore, when the treatment liquid described later is used for treatment, the treatment liquid will not accumulate on the lifting pin 221. In addition, two drainage grooves 228 are formed near the lifting guide surface 224 of the lifting support surface 222. The two drainage grooves 228 are arranged on both sides of the circumference relative to the corner 223 of the lifting support surface 222. Each drainage groove 228 is continuous from the vicinity of the corner 223 to the edge of the surface 2221 in the circumferential direction. The bottom surface of the drainage groove 228 tilts downward as it leaves the corner 223. When the treatment liquid is used for treatment, the treatment liquid that has entered between the substrate 9 and the lifting support surface 222 is properly discharged through the drainage groove 228.

[0063] like Figure 1 As shown, each clamp pin 231a, 231b is inserted into the hole portion 213 provided in the relative plate portion 21. The hole portion 213 is provided with a bearing 214, and the clamp pins 231a, 231b are supported rotatably with the central axis J2 of the hole portion 213 as the center. In the following description, the central axis J2 is referred to as the "clamp rotation axis J2". In an example of the substrate holding portion 2, the range in which the clamp pins 231a, 231b can rotate is limited to a specified angle range (including the angle range of the holding position and the open position described later) by a locking member not shown in the figure provided in the hole portion 213. When viewed from the side, the entire area of ​​the clamp pin 231 is located at the same height as the relative surface 211, or is located slightly above the relative surface 211. Therefore, when the processing liquid described later is used for processing, the processing liquid will not accumulate on the clamp pin 231.

[0064] Figure 5 2 is a diagram schematically showing the lower surface 212 of the relative plate portion 21. Figure 1 and Figure 5 As shown in FIG. 1 , the clamp switching mechanism 25 includes a plurality of first rotating magnets 251a, a plurality of second rotating magnets 251b, a plurality of first blocking magnets 252a, and a plurality of second blocking magnets 252b. The first rotating magnets 251a and the second rotating magnets 251b, and the first blocking magnets 252a and the second blocking magnets 252b are all permanent magnets. In fact, the first rotating magnets 251a and the second rotating magnets 251b, and the first blocking magnets 252a and the second blocking magnets 252b are contained in a dedicated holding member. Figure 1 and Figure 5 The same also applies to the first open magnet 253a and the second open magnet 253b described later.

[0065] The lower ends of the plurality of clamp pins 231a and 231b protrude downward from the lower surface 212 of the relative plate portion 21, and the first rotating magnet 251a and the second rotating magnet 251b are respectively mounted on the lower ends of the plurality of clamp pins 231a and 231b. In detail, the first rotating magnet 251a is mounted on the lower end of the clamp pin 231a of the first clamp pin group 23a, and the second rotating magnet 251b is mounted on the lower end of the clamp pin 231b of the second clamp pin group 23b. The orientation (magnetization direction) of the magnetic poles of the first rotating magnet 251a and the second rotating magnet 251b is, for example, perpendicular to the central axis J1 and the clamp rotating axis J2.

[0066] On the lower surface 212 of the relative plate portion 21, a plurality of first blocking magnets 252a are respectively fixed near a plurality of first rotating magnets 251a. In a state where the first open magnet 253a described later is not arranged near the first rotating magnet 251a, the magnetic attraction between the first rotating magnet 251a and the first blocking magnet 252a is used, for example, to arrange the N pole of the first rotating magnet 251a on the opposite side of the central axis J1 and the S pole on the central axis J1 side. As a result, the angular position of the clamp pin 231a, i.e., the clamp pin 231a of the first clamp pin group 23a, to which the first rotating magnet 251a is attached, with the clamp rotating axis J2 as the center becomes Figure 5 Hold position as shown. Figure 5 In the figure, the N-pole side of each magnet is shaded (described later). Figure 6 , Fig. 9 and Fig.10 In this embodiment, the magnetic attraction between the magnets is used, but of course, the magnetic repulsion may also be used. Figure 5 In the example of FIG. 2 , when the clamp pin 231 a is in the holding position, the direction of the magnetic pole of the first rotating magnet 251 a is inclined relative to the radial direction centered on the central axis J1 (the same is true for the second rotating magnet 251 b ).

[0067] In addition, in the lower surface 212, a plurality of second blocking magnets 252b are respectively fixed near a plurality of second rotating magnets 251b. In a state where the second open magnet 253b described later is not arranged near the second rotating magnet 251b, the magnetic attraction between the second rotating magnet 251b and the second blocking magnet 252b can, for example, cause the S pole of the second rotating magnet 251b to be arranged on the opposite side of the central axis J1 and the N pole to be arranged on the central axis J1 side. As a result, the angular position of the clamp pin 231b to which the second rotating magnet 251b is attached, i.e., the clamp pin 231b of the second clamp pin group 23b, centered on the clamp rotating axis J2 becomes Figure 5 Holding position shown.

[0068] The fixture switching mechanism 25 also includes a plurality of first open magnets 253a, a plurality of second open magnets 253b, a first magnet lifting mechanism 254a, and a second magnet lifting mechanism 254b. The first open magnets 253a and the second open magnets 253b are both permanent magnets. The first open magnets 253a and the second open magnets 253b are independently provided below the relative plate portion 21 and relative to the plate portion 21. Figure 5 As shown, when viewed in the up-down direction, a plurality of open magnets 253a, 253b are arranged on the same circumference centered on the central axis J1. Each open magnet 253a, 253b has a shape extending along the circumference. The first open magnet 253a and the second open magnet 253b are alternately arranged on the circumference with a constant gap therebetween.

[0069] The orientation (magnetization direction) of the magnetic poles of each open magnet 253a, 253b is along the radial direction centered on the central axis J1. For example, the N pole of the first open magnet 253a is arranged on the central axis J1 side, and the S pole is arranged on the opposite side of the central axis J1 (see the following description). Figure 6 ). In addition, the S pole of the second open magnet 253b is arranged on the central axis J1 side, and the N pole is arranged on the opposite side of the central axis J1. The plurality of first open magnets 253a are connected to each other by an annular member not shown in the figure, and the plurality of second open magnets 253b are also connected to each other by an annular member not shown in the figure.

[0070] When the opposing plate portion 21 stopped at the rotation stop position is viewed in the up-down direction (see Figure 5 ), the plurality of first open magnets 253a are arranged near the central axis J1 side of the plurality of first rotating magnets 251a, and the plurality of second open magnets 253b are arranged near the central axis J1 side of the plurality of second rotating magnets 251b. Figure 1 In the state, the plurality of first open magnets 253a and the plurality of second open magnets 253b are arranged at a position sufficiently far away from the lower surface 212 of the relative plate portion 21 (hereinafter referred to as a "separated position"). The first open magnets 253a and the second open magnets 253b arranged at the separated position do not provide magnetic influence on the first rotating magnets 251a and the second rotating magnets 251b.

[0071] The first magnet lifting mechanism 254a and the second magnet lifting mechanism 254b are disposed below the opposing plate portion 21. The first magnet lifting mechanism 254a has a cylinder, and a plurality of first open magnets 253a are mounted on the top of the piston rod of the cylinder. The piston rod is raised by the first magnet lifting mechanism 254a. Figure 1As shown by the double-dashed line in FIG. 1 , the plurality of first open magnets 253a are arranged at a position close to the lower surface 212 of the relative plate portion 21 (hereinafter referred to as a "close position"). Thus, when the relative plate portion 21 stops at the rotation stop position, as shown in FIG. Figure 6 As shown, the plurality of first open magnets 253a are arranged near the central axis J1 side of the plurality of first rotating magnets 251a.

[0072] exist Figure 6 In the state, the magnetic attraction between the first rotating magnet 251a and the first opening magnet 253a becomes greater than the magnetic attraction between the first rotating magnet 251a and the first closing magnet 252a, and the N pole of the first rotating magnet 251a is arranged on the central axis J1 side, and the S pole is arranged on the opposite side of the central axis J1. As a result, the angular position of the clamp pin 231a, i.e., the clamp pin 231a of the first clamp pin group 23a, which is mounted with the first rotating magnet 251a, with the clamp rotating axis J2 as the center becomes Figure 6 Open position shown. Figure 6 In the example of , when the clamp pin 231a is in the open position, the direction of the magnetic pole of the first rotating magnet 251a is inclined relative to the radial direction centered on the central axis J1 (the same applies to the second rotating magnet 251b). If the first magnet lifting mechanism 254a lowers the piston rod, the first opening magnet 253a separates downward from the first rotating magnet 251a, and the angular position of the clamp pin 231a returns to the holding position. In addition, the first magnet lifting mechanism 254a can also be a mechanism that uses a motor or the like to lift the first rotating magnet 251a (the same applies to the second magnet lifting mechanism 254b).

[0073] Similarly, the second magnet lifting mechanism 254b has a cylinder, and a plurality of second open magnets 253b are installed at the top of the piston rod of the cylinder. The piston rod is raised by the second magnet lifting mechanism 254b, such as Figure 1 As shown by the double-dashed line in FIG. 1 , the plurality of second open magnets 253b are arranged at a position close to the lower surface 212 of the relative plate portion 21. Thus, when the relative plate portion 21 stops at the rotation stop position, as shown in FIG. Figure 6 As shown, the plurality of second open magnets 253b are arranged near the central axis J1 side of the plurality of second rotating magnets 251b.

[0074] exist Figure 6In the state, the magnetic attraction between the second rotating magnet 251b and the second open magnet 253b becomes greater than the magnetic attraction between the second rotating magnet 251b and the second closed magnet 252b, so that the S pole of the second rotating magnet 251b is arranged on the side of the central axis J1, and the N pole is arranged on the opposite side of the central axis J1. As a result, the angular position of the clamp pin 231b with the second rotating magnet 251b installed, that is, the clamp pin 231b of the second clamp pin group 23b, centered on the clamp rotating axis J2 becomes Figure 6 When the second magnet lifting mechanism 254b lowers the piston rod, the second opening magnet 253b separates downward from the second rotating magnet 251b, and the angular position of the clamp pin 231b returns to the holding position.

[0075] Figure 7 2 is a diagram showing the fixture pin 231 viewed in the circumferential direction. Figure 8 FIG. 2 is an enlarged top view showing the fixture pin 231. Figure 7 and Figure 8 , the fixture pin 231 is shown configured in the holding position. Figure 7 and Figure 8 In the description, since the clamp pins 231a of the first clamp pin group 23a and the clamp pins 231b of the second clamp pin group 23b are not distinguished, the clamp pins 231a and 231b are collectively referred to as "clamp pins 231".

[0076] like Figure 7 and Figure 8 As shown, two protrusions 230 protruding upward are provided at the upper end of each fixture pin 231. The two protrusions 230 are arranged at positions offset from the fixture rotation axis J2 in the circumferential direction. In addition, the two protrusions 230 are separated from each other in the circumferential direction. In this way, by providing a gap between the two protrusions 230, when processing the substrate 9 described later, the processing liquid supplied to the second main surface 92 is discharged from the second main surface 92 through the gap. When viewed in the circumferential direction, the two protrusions 230 have the same shape.

[0077] Each protrusion 230 includes a clamp abutting surface 232. The clamp abutting surface 232 is a side of the protrusion 230 that faces the central axis J1 ( Figure 7 and Figure 8 As described above, the protrusion 230 is arranged at a position offset from the clamp rotation axis J2 in the circumferential direction, and the clamp abutment surface 232 can move in the horizontal direction perpendicular to the up-down direction by the rotation of the clamp pin 231. Figure 7As shown, the clamp abutment surface 232 includes an upper abutment surface 233, a curved abutment surface 234, and a lower abutment surface 235. In the clamp pin 231 configured in the holding position, the upper abutment surface 233 is a plane located on the central axis J1 side and facing downward, and approaches the central axis J1 as it moves upward. That is, the upper abutment surface 233 tilts upward as it moves toward the central axis J1 side. For example, the upper abutment surface 233 is aligned with the radial surface F2 ( Figure 8 The upper abutment surface 233 is continuous to the upper end surface of the protrusion 230. Figure 8 In FIG. 1 , the surface F2 is shown only for one protrusion 230 , but the same surface may be set for the other protrusion 230 .

[0078] The lower side abutting surface 235 is a plane located on the central axis J1 side and facing upward, and is arranged at a position lower than the upper side abutting surface 233. The lower side abutting surface 235 is inclined downward toward the central axis J1 side. For example, the lower side abutting surface 235 is orthogonal to the above-mentioned surface F2. On the surface F2, the lower side abutting surface 235 has an inclination angle θ4 (refer to Figure 7 ) is almost the same as the angle between the upper abutting surface 233 and the opposite surface 211. In addition, the inclination angle θ4 of the lower abutting surface 235 is greater than the inclination angle θ1 of the lifting support surface 222 (see Figure 3 That is, the slope of the lower abutting surface 235 is greater than the slope of the lifting support surface 222 .

[0079] The curved abutting surface 234 is a curved surface facing the central axis J1 side, and is arranged between the upper abutting surface 233 and the lower abutting surface 235. The curved abutting surface 234 is directly continuous between the upper abutting surface 233 and the lower abutting surface 235. For example, the curved abutting surface 234 is orthogonal to the above-mentioned surface F2. The shape of the curved abutting surface 234 on the surface F2 is almost consistent with the shape of the outer peripheral end surface 93 of the substrate 9. In the clamp abutting surface 232, the center of the curved abutting surface 234 in the up and down directions becomes the position farthest from the central axis J1. In the clamp pin 231 arranged in the holding position, the distance between the center of the curved abutting surface 234 and the central axis J1 is almost consistent with the radius of the substrate 9. Therefore, as Figure 5 As shown in the figure, when the plurality of clamp pins 231 are arranged at the holding position, the curved contact surfaces 234 of the plurality of clamp pins 231 contact the outer peripheral end surface 93 of the substrate 9. In fact, the upper and lower vicinities of the outer peripheral end surface 93 of the substrate 9 (the upper connecting portion and the lower connecting portion described later) also contact the clamp contact surface 232, and the outer peripheral edge 94 of the substrate 9 is pushed toward the central axis J1, and is also pushed upward and downward. Thus, the substrate 9 can be firmly held in the clamp portion 23.

[0080] Here, the outer peripheral edge 94 of the substrate 9 is a sloped portion including an upper connecting portion connecting the outer peripheral end surface 93 and the second main surface 92, a lower connecting portion connecting the outer peripheral end surface 93 and the first main surface 91, and the outer peripheral end surface 93. When the diameter of the substrate 9 is 300 mm, the outer peripheral edge 94 of the substrate 9 includes, for example, an annular region with a width of 2 mm from the outer peripheral end surface 93 to the central axis J1 side.

[0081] As described above, each clamp abutment surface 232 is disposed at a position offset from the clamp rotation axis J2. Figure 8 As shown by the double-dashed line in FIG. 1 , in each protrusion 230 of the clamp pin 231 configured in the open position, the distance between the clamp contact surface 232 and the central axis J1 becomes larger than the distance in the state configured in the holding position. That is, in the clamp pin 231 configured in the open position, the distance between the center of the curved contact surface 234 and the central axis J1 becomes larger than the radius of the substrate 9. Therefore, as Figure 6 As shown, in a state where the plurality of clamp pins 231 are arranged at the open position, the curved contact surfaces 234 of the plurality of clamp pins 231 are separated from the outer peripheral end surface 93 of the substrate 9 , and the substrate 9 is released from being held.

[0082] Fig. 9 2 is a diagram schematically showing the lower surface 212 of the relative plate portion 21, showing a state in which the plurality of first open magnets 253a are arranged at close positions and the plurality of second open magnets 253b are arranged at separate positions. Fig. 9 In the illustrated state, the plurality of clamp pins 231 a of the first clamp pin group 23 a are arranged at the open position, and the plurality of clamp pins 231 b of the second clamp pin group 23 b are arranged at the holding position.

[0083] When the relative plate portion 21 is rotated around the central axis J1 by the substrate rotating mechanism 3, the first rotating magnet 251a, the second rotating magnet 251b, the first blocking magnet 252a, and the second blocking magnet 252b rotate together with the relative plate portion 21, but the first open magnet 253a and the second open magnet 253b do not rotate. At this time, by the rotation of the relative plate portion 21 at the liquid processing rotation speed described later, the plurality of first open magnets 253a arranged circumferentially at the close position substantially cause the magnetic attraction to act on the first rotating magnet 251a, regardless of the angular position of each first rotating magnet 251a centered on the central axis J1. Therefore, the plurality of clamp pins 231a of the first clamp pin group 23a maintain the open position during the rotation of the relative plate portion 21. In addition, the plurality of clamp pins 231b of the second clamp pin group 23b maintain the holding position, and the substrate 9 is held by these clamp pins 231b.

[0084] Fig.102 is a diagram schematically showing the lower surface 212 of the relative plate portion 21, showing a state in which the plurality of second open magnets 253b are arranged at close positions and the plurality of first open magnets 253a are arranged at separate positions. Fig.10 In the illustrated state, the plurality of clamp pins 231 b of the second clamp pin group 23 b are arranged at the open position, and the plurality of clamp pins 231 a of the first clamp pin group 23 a are arranged at the holding position.

[0085] Furthermore, when the relative plate portion 21 is rotated at the liquid processing rotation speed by the substrate rotating mechanism 3, the plurality of second open magnets 253b arranged in the circumferential direction at the close position substantially cause the magnetic attraction to act on the second rotating magnets 251b, regardless of the angular position of each second rotating magnet 251b centered on the central axis J1. Therefore, the plurality of clamp pins 231b of the second clamp pin group 23b maintain the open position during the rotation of the relative plate portion 21. In addition, the plurality of clamp pins 231a of the first clamp pin group 23a maintain the holding position, and the substrate 9 is held by these clamp pins 231a.

[0086] In the treatment of the substrate 9 with the treatment liquid described later, the clamp switching mechanism 25 is switched between a state in which the plurality of first open magnets 253a are arranged at the close position and the plurality of second open magnets 253b are arranged at the separated position, and a state in which the plurality of second open magnets 253b are arranged at the close position and the plurality of first open magnets 253a are arranged at the separated position, by the control of the control unit (not shown). Thus, the state in which the substrate 9 is held by the plurality of clamp pins 231b of the second clamp pin group 23b and the state in which the substrate 9 is held by the plurality of clamp pins 231a of the first clamp pin group 23a is switched.

[0087] like Figure 2 As shown, an annular step portion 215 is formed along the reference circle C1 on the opposing surface 211 of the opposing plate portion 21. The annular step portion 215 is arranged at a position further inward (toward the central axis J1) than the outer peripheral edge 94 of the substrate 9, and along the outer peripheral edge 94. Figure 1 As shown, the distance between the inner side opposing surface 211 of the annular step portion 215 and the first main surface 91 of the substrate 9 is greater than the distance between the outer side opposing surface 211 of the annular step portion 215 (opposite to the central axis J1) and the first main surface 91. Figure 4 and Figure 8 As shown, at the position where the plurality of lift pins 221 and the plurality of jig pins 231a, 231b (jig pins 231) overlap with the reference circle C1, the annular step portion 215 is provided closer to the central axis J1 than the plurality of lift pins 221 and the plurality of jig pins 231a, 231b.

[0088] As described above, the gas from the gas nozzle 51 to Figure 1Inert gas is ejected from the space between the substrate 9 and the opposite surface 211 shown in the figure. The inert gas supplied to the space is discharged to the outside from the gap between the outer peripheral edge 94 of the substrate 9 and the opposite surface 211. At this time, by narrowing the width of the gap between the substrate 9 and the opposite surface 211 in the up and down directions at the outer peripheral edge 94, the inert gas flows out to the outside at a certain flow rate in the gap between the entire circumference of the outer peripheral edge 94 and the opposite surface 211. Thereby, when the treatment with the treatment liquid described later is performed, the treatment liquid supplied to the second main surface 92 facing upward can be suppressed from spreading to the side of the first main surface 91 facing downward. In addition, the mist of the treatment liquid can also be suppressed from spreading to the side of the first main surface 91.

[0089] Fig.11 1 is a flow chart of the substrate processing apparatus 1 processing a substrate 9. When the processing of the substrate 9 is started, the substrate 9 to be processed is carried into the substrate processing apparatus 1. Specifically, first, the plurality of lifting pins 221 are raised by the pin lifting mechanism 24 and arranged at Figure 3 In the upper position shown by the double-dotted line in FIG. 2 . In addition, in the clamp switching mechanism 25, the plurality of first open magnets 253a and the plurality of second open magnets 253b are arranged in the close position, and the plurality of clamp pins 231a and 231b are arranged in the open position. In the external conveying mechanism, the substrate 9 is placed on the hand with the first main surface 91 facing downward and the second main surface 92 facing upward, and the substrate 9 is arranged above the relative plate portion 21 by the conveying mechanism. Then, the hand is lowered by the conveying mechanism, as shown in FIG. Figure 3 As shown by the double-dashed line in FIG. 1 , the substrate 9 is transferred from the hand to the plurality of lift pins 221 (step S11). Thus, the outer periphery 94 of the substrate 9 is supported from below by the plurality of lift support surfaces 222. Typically, the plurality of lift pins 221 only contact the outer periphery 94 of the substrate 9. Preferably, the corners 223 of each lift support surface 222 are in almost point contact with the outer periphery 94.

[0090] When the substrate 9 is transferred from the hand to the lifting part 22, even if the center of the substrate 9 on the hand is offset from the central axis J1, the center of the substrate 9 can be brought closer to the central axis J1 by making the outer peripheral end surface 93 of the substrate 9 contact the lifting guide surface 224. In other words, the eccentricity of the substrate 9 is adjusted. At this time, the outer peripheral end surface 93, for example, contacts the corner 225 of the lifting guide surface 224. Figure 2 In the example of FIG. 1 , even if the center of the substrate 9 is offset relative to the central axis J1 in any direction perpendicular to the central axis J1, the center of the substrate 9 can be brought close to the central axis J1 with high accuracy by the six lift pins 221 arranged at equal intervals in the circumferential direction. In the substrate holding portion 2, after the hand retreats from above the opposing plate portion 21, the plurality of lift pins 221 are lowered by the pin lift mechanism 24 and arranged at Figure 3 The lower position is shown by the solid line.

[0091] Next, the plurality of first open magnets 253a and the plurality of second open magnets 253b are arranged at the separated positions by the clamp switching mechanism 25, so that the plurality of clamp pins 231a and 231b are moved (rotated) from the open position to the holding position. In the movement from the open position to the holding position of each clamp pin 231a and 231b, first, the outer peripheral edge 94 of the substrate 9 supported by the plurality of lifting support surfaces 222 is moved to the holding position. Figure 7 The substrate 9 is then slightly moved upwards by the lower abutment surface 235 directed toward the center axis J1. The outer peripheral end surface 93 of the substrate 9 is then abutted against the curved abutment surface 234 located above the lifting support surface 222. Fig.12 As shown, the substrate 9 is held horizontally by the plurality of clamp pins 231a and 231b while the substrate 9 is separated upward from the plurality of lifting support surfaces 222 as a whole (step S12). Typically, the plurality of clamp pins 231a and 231b only contact the outer peripheral edge 94 of the substrate 9.

[0092] When the substrate 9 is held on the substrate holding portion 2 with the first main surface 91 facing downward and the second main surface 92 facing upward, the substrate 9 is Figure 1 The inert gas supply unit 5 shown starts to supply inert gas to the space between the substrate 9 and the opposite surface 211 (step S13). In addition, the substrate 9 starts to rotate at the liquid processing rotation speed (rotation speed) through the substrate rotating mechanism 3 (step S14). The substrate 9 rotates together with the opposite plate portion 21 in a horizontal state. The liquid processing rotation speed is, for example, 300 to 1500 rpm.

[0093] Next, the processing liquid starts to be supplied to the second main surface 92 of the substrate 9 through the processing liquid supply unit 4 (step S15). On the second main surface 92, the processing liquid is diffused toward the outer peripheral edge 94 of the substrate 9 by the centrifugal force generated by the rotation of the substrate 9, and the processing liquid is supplied to the entire second main surface 92. While the processing liquid is supplied to the substrate 9, the inert gas is also continuously supplied to the first main surface 91 side. The processing liquid supply unit 4 supplies, for example, a prescribed chemical liquid to the second main surface 92, and then supplies pure water. In step S15, in addition to the processing liquid, processing can also be performed with a brush or the like. In addition, in the processing liquid supply unit 4, the chemical liquid and pure water can also be sprayed from different liquid nozzles.

[0094] On the other hand, in the fixture switching mechanism 25, in parallel with supplying the processing liquid by the processing liquid supply unit 4, the plurality of first open magnets 253a are arranged at the close position and the plurality of second open magnets 253b are arranged at the separated position. Fig. 9 The state shown in FIG. 1 and the state in which the plurality of second open magnets 253b are arranged at the close position and the plurality of first open magnets 253a are arranged at the separated position. Fig.10toggles between the states shown.

[0095] Specifically, the state where the plurality of first open magnets 253a and the plurality of second open magnets 253b are arranged at the separated position is switched to the state where only the plurality of first open magnets 253a are arranged at the close position. Thus, the substrate 9 is held by the plurality of clamp pins 231a of the first clamp pin group 23a, and the substrate 9 is held only by the plurality of clamp pins 231b of the second clamp pin group 23b. Next, by moving the plurality of first open magnets 253a to the separated position, the state where the plurality of first open magnets 253a and the plurality of second open magnets 253b are arranged at the separated position is formed. In this state, the substrate 9 is held by the plurality of clamp pins 231a of the first clamp pin group 23a and the plurality of clamp pins 231b of the second clamp pin group 23b. Then, only the plurality of second open magnets 253b are arranged at the close position. Thus, the substrate 9 is held by the plurality of clamp pins 231b of the second clamp pin group 23b, and the substrate 9 is held only by the plurality of clamp pins 231a of the first clamp pin group 23a.

[0096] In this way, the state in which the substrate 9 is held by the plurality of clamp pins 231a of the first clamp pin group 23a and the state in which the substrate 9 is held by the plurality of clamp pins 231b of the second clamp pin group 23b are repeatedly switched (step S16). The switching action can be regarded as an action of alternately separating the clamp contact surface 232 of the first clamp pin group 23a and the clamp contact surface 232 of the second clamp pin group 23b from the outer peripheral end surface 93 of the substrate 9. The switching action is preferably performed at least once during the supply of the same type of processing liquid to the second main surface 92.

[0097] If the supply of the processing liquid is stopped (step S17), the rotation speed of the substrate 9 is set to be higher than the liquid processing rotation speed by the substrate rotating mechanism 3, and the substrate 9 is dried (spin drying) (step S18). At this time, the plurality of first open magnets 253a and the plurality of second open magnets 253b are maintained in a state of being arranged at the separated positions, and the substrate 9 is firmly held by the plurality of clamp pins 231a of the first clamp pin group 23a and the plurality of clamp pins 231b of the second clamp pin group 23b.

[0098] When the drying process is completed, the rotation of the substrate 9 is stopped (step S19). In addition, the supply of the inert gas between the substrate 9 and the opposing surface 211 is stopped (step S20). Next, the plurality of first open magnets 253a and the plurality of second open magnets 253b are arranged at the close position by the fixture switching mechanism 25, and the plurality of fixture pins 231a and 231b are moved from the holding position to the opening position. Figure 7The clamp abutting surface 232 shown is oriented toward the opposite side of the central axis J1, and the substrate 9 is slightly moved downward while the outer peripheral edge 94 of the substrate 9 is abutting against the lower abutting surface 235. Then, the outer peripheral edge 94 of the substrate 9 abuts against the plurality of lifting support surfaces 222. In this way, in the substrate holding portion 2, the substrate 9 is released from being held by the clamp portion 23, and the substrate 9 is supported from below by the lifting portion 22 (step S21).

[0099] Then, the plurality of lift pins 221 are raised by the pin lift mechanism 24 and arranged at Figure 3 The upper position indicated by the double-dotted dashed line in FIG. 1 is shown. The external transport mechanism causes the hand to enter between the first main surface 91 of the substrate 9 and the relative plate portion 21, and then raises the hand to transfer the substrate 9 from the plurality of lifting pins 221 to the hand (step S22). The substrate 9 on the hand is carried out to the outside. In this way, the processing of the substrate 9 by the substrate processing device 1 is completed.

[0100] As described above, in the substrate processing device 1, the substrate 9 is held in a state where the first main surface 91 on which the pattern is formed faces downward, and the second main surface 92 facing upward is processed with a processing liquid. In this case, when the substrate 9 is handed over to the external transport mechanism, the outer peripheral edge 94 of the substrate 9 is supported from below by the multiple lifting support surfaces 222 of the lifting part 22. In addition, the multiple clamp abutting surfaces 232 of the clamp part 23 abut against the outer peripheral end surface 93 of the substrate 9 supported by the lifting part 22 to hold the substrate 9. Thus, damage to the pattern near the outer peripheral edge 94 of the first main surface 91 can be suppressed. In addition, since the substrate 9 is held by the clamp part 23 in a state where the substrate 9 is separated upward from the entire multiple lifting support surfaces 222, it is possible to suppress the accumulation of processing liquid between the lifting support surface 222 and the first main surface 91.

[0101] The clamp portion 23 can hold the substrate 9 in a state where a portion of the clamp abutting surfaces 232 among the plurality of clamp abutting surfaces 232 are separated from the outer peripheral end surface 93 of the substrate 9 and the remaining clamp abutting surfaces 232 are abutted against the outer peripheral end surface 93, and the clamp abutting surface 232 separated from the outer peripheral end surface 93 is switched by the clamp switching mechanism 25 during the supply of the processing liquid to the second main surface 92. Thus, it is possible to suppress the generation of traces of the processing liquid on the outer peripheral edge 94 of the substrate 9 (to be precise, the difference in processing results between the position where the clamp pins 231a and 231b abut and other positions, also referred to as a pin pattern).

[0102] In the substrate holding portion 2, when the clamp portion 23 holds the substrate 9, the portion ( Figure 7The slope of the lower side abutting surface 235 is greater than the slope of the plurality of lifting support surfaces 222. As a result, it is possible to suppress the accumulation of processing liquid in the gap between the clamp pins 231a, 231b and the first main surface 91. In addition, even if processing liquid accumulates in the gap, the processing liquid in the gap can be discharged by switching the clamp abutting surface 232 separated from the outer peripheral end surface 93 of the substrate 9. As a result, it is possible to more reliably suppress the generation of processing liquid traces on the outer peripheral edge 94 of the substrate 9.

[0103] However, it is conceivable that the lifting pins 221 are lowered in the hole 213 to a position lower than the opposite surface 211, thereby preventing the processing liquid from accumulating in the gap between the first main surface 91 and the lifting pins 221. However, in this case, the processing liquid accumulates in the hole 213, and there is a possibility that the processing liquid adheres to the first main surface 91 during the drying process. In response to this, in the substrate processing device 1, in a state where the clamp portion 23 holds the substrate 9, since a plurality of lifting pins 221 protrude from the opposite surface 211, it is possible to prevent the processing liquid from accumulating in the hole 213. In addition, each lifting support surface 222 is formed with a drainage groove 228 extending in the circumferential direction from the vicinity of the position where it abuts against the outer peripheral edge 94 when supporting the substrate 9. As a result, even in a state where the lifting pins 221 protrude from the opposite surface 211, it is possible to more reliably prevent the processing liquid from accumulating between the lifting support surface 222 and the substrate 9.

[0104] In addition, each of the plurality of lift pins 221 has a plurality of lift guide surfaces 224, and the plurality of lift guide surfaces 224 are continuous with the opposite side of the plurality of lift support surfaces 222 from the central axis J1, and have a greater slope than the slope of the plurality of lift support surfaces 222. Thus, when the substrate 9 is delivered to the external transport mechanism, the plurality of lift guide surfaces 224 abut against the outer peripheral end surface 93 of the substrate 9, so that the center of the substrate 9 is brought close to the central axis J1. In this way, by adjusting the position of the substrate 9 by the plurality of lift pins 221, the amount of movement of the clamp abutting surface 232 when holding the substrate 9 can be reduced, and the clamp portion 23 can more reliably hold the substrate 9.

[0105] An inert gas supply unit 5 for supplying an inert gas between the first main surface 91 of the substrate 9 and the opposing plate portion 21 is provided in the substrate processing apparatus 1. Thus, when the processing liquid is supplied to the second main surface 92, it is possible to suppress the processing liquid from spreading toward the first main surface 91. In addition, the opposing surface 211 has an annular step portion 215 formed along the outer peripheral edge 94 of the substrate 9, and the distance between the opposing surface 211 on the outer side of the annular step portion 215 and the substrate 9 is smaller than the distance between the opposing surface 211 on the inner side of the annular step portion 215 and the substrate 9. In this way, since the gap between the outer peripheral edge 94 of the substrate 9 and the opposing surface 211 is narrow, the flow rate of the inert gas near the outer peripheral edge 94 of the substrate 9 can be increased, thereby more reliably suppressing the processing liquid from spreading toward the first main surface 91.

[0106] In the substrate processing device 1, an annular step portion 215 is formed on the opposite surface 211 along a reference circle C1 centered on the central axis J1. Since the reference circle C1 overlaps with the plurality of fixture pins 231a, 231b and the plurality of lift pins 221, it is conceivable that the side surfaces of the fixture pins 231a, 231b and the lift pins 221 are part of the annular step portion 215. However, in this case, the gap between the side surfaces of the fixture pins 231a, 231b that form a part of the annular step portion 215 and the inner peripheral surface of the hole portion 213 opens toward the inside of the annular step portion 215. The same is true for the lift pins 221. As a result, the flow of the inactive gas near the outer peripheral edge 94 of the substrate 9 is greatly disturbed, and as a result, the processing liquid may spread to the first main surface 91 side.

[0107] In view of this, in the substrate processing device 1, at a position where the reference circle C1 overlaps with the fixture pins 231a, 231b and the lifting pins 221, the annular step portion 215 is disposed at a position closer to the central axis J1 than the fixture pins 231a, 231b and the lifting pins 221. Thus, the turbulence of the flow of the inert gas as described above can be prevented, thereby more reliably suppressing the spread of the processing liquid to the first main surface 91 side. In addition, it is also conceivable that the plurality of lifting pins 221 that move only in the up-down direction are further miniaturized, and the plurality of lifting pins 221 are disposed at a position closer to the outside than the reference circle C1. In this case, only the plurality of fixture pins 231a, 231b overlap with the reference circle C1. Therefore, in the substrate processing device 1, when at least a plurality of fixture pins overlap with the reference circle C1, it is preferred that the annular step portion 215 is disposed at a position closer to the central axis J1 than the plurality of fixture pins 231a, 231b.

[0108] The above-mentioned substrate processing apparatus 1 can be modified in various ways.

[0109] In the above embodiment, six lift pins 221 are provided, but from the viewpoint of supporting the outer periphery of the substrate 9 from below, the number of lift pins 221 may be three or more. In addition, as described above, the lift guide surfaces 224 of the plurality of lift pins 221 allow the center of the substrate 9 to approach the central axis J1 when the substrate 9 is delivered to the external transport mechanism. In this case, from the viewpoint of bringing the center of the substrate 9 close to the central axis J1 with high accuracy in various directions perpendicular to the central axis J1, it is preferred that the lift unit 22 includes four or more lift pins 221 arranged at equal intervals in the circumferential direction.

[0110] The clamp switching mechanism 25 for switching between a state where the substrate 9 is held by the first clamp pin group 23a and a state where the substrate 9 is held by the second clamp pin group 23b can also be implemented by other structures. In addition, for the clamp abutment surfaces 232 of multiple (for example, more than five) clamp pins arranged in the circumferential direction, the substrate 9 can also be held in a state where one clamp abutment surface 232 is separated from the outer peripheral end surface 93 of the substrate 9 and the remaining clamp abutment surfaces 232 are abutted against the outer peripheral end surface 93. In this case, by sequentially switching the one clamp abutment surface 232 separated from the outer peripheral end surface 93, it is possible to suppress the generation of traces of the processing liquid on the outer peripheral edge 94 of the substrate 9. For example, by providing a motor for each clamp pin inside the relative plate portion 21, such an action can be made possible. In this case, a battery can also be provided inside the relative plate portion 21.

[0111] Figure 3 and Figure 4 The shapes of the lifting support surface 222 and the lifting guide surface 224 shown, and Figure 7 and Figure 8 The shape of the clamp contact surface 232 shown is only an example and may be modified as appropriate. In addition, the annular step portion 215 of the facing surface 211 may be omitted depending on the design of the substrate processing apparatus 1 .

[0112] The substrate processed in the substrate processing apparatus 1 is not limited to a semiconductor substrate, and may be a glass substrate or other substrates. In addition, the substrate processing apparatus 1 may also be used to process substrates having shapes other than a disk shape.

[0113] The configurations of the above-described embodiment and each modified example may be combined as appropriate unless they are in conflict with each other.

[0114] Although described and explained in detail, the above description is only illustrative and not restrictive. Therefore, many modifications and aspects are possible without departing from the scope of the present invention.

Claims

1. A substrate processing device, wherein: include: A substrate holding portion having a pattern formed on a first main surface of the substrate and holding the substrate horizontally with the first main surface facing downward; a substrate rotating mechanism that rotates the substrate held by the substrate holding portion about a central axis extending in a vertical direction; and a processing liquid supplying unit for supplying the processing liquid to the second main surface of the substrate facing upward, The substrate holding portion comprises: an opposing plate portion having an opposing surface opposing the first main surface of the substrate; A lifting part, comprising a plurality of lifting pins arranged below the outer periphery of the substrate on the relative plate part, wherein the plurality of lifting pins have a plurality of lifting support surfaces, and when the substrate is transferred to an external transport mechanism, the plurality of lifting support surfaces support the outer periphery from below; a clamp portion having a plurality of clamp pins disposed below the outer peripheral edge of the substrate on the opposing plate portion, the plurality of clamp pins respectively having a plurality of clamp abutment surfaces movable in the horizontal direction, and holding the substrate in a state where the substrate is separated upward from all of the plurality of lifting support surfaces by bringing the plurality of clamp abutment surfaces into abutment with the outer peripheral end surface of the substrate supported by the lifting portion; and The clamp switching mechanism is configured such that the clamp portion can hold the substrate in a state where a portion of the clamp abutting surfaces among the plurality of clamp abutting surfaces are separated from the outer peripheral end surface of the substrate and the remaining clamp abutting surfaces are abutted against the outer peripheral end surface, and the clamp abutting surface separated from the outer peripheral end surface is switched while the processing liquid supply portion supplies the processing liquid to the second main surface. In a state where the clamp portion holds the substrate, the plurality of lift pins protrude from the opposing surface, The plurality of lifting support surfaces are formed with drainage grooves extending in a circumferential direction from the vicinity of positions abutting against the outer peripheral edge of the substrate when supporting the substrate.

2. The substrate processing apparatus according to claim 1, wherein: The plurality of lifting support surfaces are inclined downward toward the central axis.

3. The substrate processing apparatus according to claim 1, wherein: In a state where the clamp portion holds the substrate, a slope of a portion of the plurality of clamp abutting surfaces below the substrate is greater than a slope of the plurality of lifting support surfaces.

4. The substrate processing apparatus according to claim 1, wherein: The system further includes an inert gas supply unit configured to supply an inert gas between the first main surface of the substrate and the opposing plate portion.

5. The substrate processing apparatus according to claim 4, wherein: The inert gas supply unit includes a gas nozzle, and the gas nozzle is arranged at the center of the opposing plate portion. The opposing surface has an annular step portion, and the annular step portion is formed along the outer peripheral edge of the substrate. A distance between the opposing surface on the inner side of the annular step portion and the substrate is greater than a distance between the opposing surface on the outer side of the annular step portion and the substrate.

6. The substrate processing apparatus according to claim 5, wherein: On the opposing surface, the annular step portion is formed along a predetermined reference circle centered on the central axis. At least the plurality of fixture pins overlap with the reference circle, The annular step portion is provided at a position closer to the central axis than the plurality of jig pins at a position where the reference circle and the plurality of jig pins overlap.

7. The substrate processing apparatus according to any one of claims 1 to 6, wherein: The plurality of lifting pins respectively have a plurality of lifting guide surfaces, the plurality of lifting guide surfaces are continuous with a side of the plurality of lifting support surfaces opposite to the central axis, and have a slope greater than a slope of the plurality of lifting support surfaces, When the substrate is delivered to the external conveying mechanism, the plurality of lifting guide surfaces abut against the outer peripheral end surface of the substrate, so that the center of the substrate is brought close to the central axis.

8. The substrate processing apparatus according to claim 7, wherein: The plurality of lift pins include four or more lift pins, and the four or more lift pins are arranged at equal intervals in the circumferential direction.

9. The substrate processing apparatus according to any one of claims 1 to 6, wherein: The outer peripheral edge of the substrate is a sloped portion of the substrate.

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