Loading device, substrate processing device, control method of loading device, and control method of substrate processing device

Abstract

The present invention relates to a loading device, a substrate processing device, a control method for a loading device, and a control method for a substrate processing device. A first substrate conveying mechanism and a second substrate conveying mechanism respectively convey substrates for a front-opening wafer box, and the front-opening wafer box is respectively placed on two openers arranged in the up-down direction, for example, rather than two openers arranged in the lateral direction, for example. Therefore, even when an opener is added, since the substrate is conveyed by lifting and rotating instead of sliding the robot arm that can move forward and backward in the lateral direction, the substrate can be simply conveyed. Therefore, the standby time for conveying the substrate can be reduced, and the substrate conveying efficiency can be prevented from being reduced.

Description

Technical Field

[0001] The present invention relates to a loading device, a substrate processing device, a control method for the loading device, and a control method for the substrate processing device, wherein the loading device has a carrier loading portion for loading a carrier capable of accommodating a plurality of substrates, and the substrates accommodated in the carrier are transported. In addition, regarding the substrate, for example, semiconductor substrates, FPD (Flat Panel Display) substrates, photomask glass substrates, optical disk substrates, magnetic disk substrates, ceramic substrates, and solar cell substrates can be listed. Regarding FPD, for example, liquid crystal display devices, organic EL (electroluminescence) display devices, etc. can be listed. Background Art

[0002] Conventional substrate processing apparatuses include a loading block (loading device) and a processing block (see, for example, Japanese Patent Laid-Open No. 2012-209288). When the rear surface of the loading block is connected to the processing block, two openers are arranged horizontally in parallel on the outer wall of the front surface of the loading block. A substrate buffer is provided between the loading block and the processing block, and the substrate buffer can carry a plurality of substrates in the up-down direction (vertical direction).

[0003] Two substrate transport mechanisms are provided inside the loading block. The first substrate transport mechanism is configured to transport substrates between a front opening unified pod (FOUP) mounted on the first opener and a substrate buffer. In addition, the second substrate transport mechanism is configured to transport substrates between a front opening unified pod mounted on the second opener and a substrate buffer. That is, the first substrate transport mechanism transports substrates for the first opener, and the second substrate transport mechanism transports substrates for the second opener. Thus, substrates can be efficiently taken out from the front opening unified pod, and substrates can be efficiently stored in the front opening unified pod.

[0004] The substrate processing device also includes a front-opening wafer box buffer device (stacker device). The front-opening wafer box buffer device is arranged opposite to the two openers. The front-opening wafer box buffer device includes: a rack for placing the front-opening wafer box to store the front-opening wafer box; and a front-opening wafer box conveying mechanism for conveying the front-opening wafer box between the rack and the two openers (for example, refer to Japanese Patent Laid-Open No. 2012-209288, Japanese Patent Laid-Open No. 2013-157650 and Japanese Patent Laid-Open No. 2010-171314). Patent document 2 discloses a front-opening wafer box conveying mechanism having two holding parts, and a replacement action (replacement action) of the front-opening wafer box using the two holding parts.

[0005] Japanese Patent Laying-Open No. 2012-209288 and International Publication No. WO2013 / 069716 disclose a plurality of openers arranged in the up-and-down direction. Summary of the invention

[0006] [Problems to be solved by the invention]

[0007] However, the conventional device having such a structure has the following problems. As described above, the first substrate conveying mechanism conveys the substrate for the first opener, and the second substrate conveying mechanism conveys the substrate for the second opener. For example, if all substrates are taken out from the front-opening wafer box placed on the first opener, the first substrate conveying mechanism becomes a standby state in which no conveying action is performed. From the perspective of increasing the processing capacity of the substrate processing device, it is ideal to reduce this standby state. Therefore, a structure in which two openers are added and four openers are arranged horizontally in parallel is considered. However, if two substrate conveying mechanisms are respectively responsible for two openers arranged in the horizontal direction, then, for example, each substrate conveying mechanism must be moved in the left and right directions. Therefore, although the standby state can be reduced, there is a possibility that the substrate conveying efficiency (for example, the time from taking out the substrate from the front-opening wafer box to placing it on the substrate buffer) is reduced due to the movement in the left and right directions.

[0008] The present invention is completed in view of such circumstances, and aims to provide a loading device, a substrate processing device, a control method for the loading device, and a control method for the substrate processing device, which can reduce the standby state of the substrate transfer mechanism and prevent the reduction of the substrate transfer efficiency.

[0009] [Technical means to solve the problem]

[0010] In order to achieve the above object, the present invention adopts the following configuration.

[0011] That is, the loading device of the present invention is to deliver and transfer a substrate to a carrier capable of accommodating a plurality of substrates, and comprises the following elements: a first carrier loading section array having two or more carrier loading sections arranged in an up-down direction; a second carrier loading section array having two or more carrier loading sections arranged in an up-down direction and arranged in parallel with the first carrier loading section array in a horizontal direction; a substrate buffer for carrying a plurality of substrates; a first substrate transfer mechanism for transferring the carriers carried by the two or more carrier loading sections of the first carrier loading section array to the substrate buffer; The first substrate conveying mechanism and the second substrate conveying mechanism respectively comprise: a robot capable of moving forward and backward in a horizontal direction and holding a substrate; and a lifting and rotating driving unit capable of lifting and lowering the robot along a support column extending in an up-and-down direction and rotating the robot around an axis along the support column; and the horizontal position of the lifting and rotating driving unit is fixed.

[0012] According to the loading device of the present invention, the first substrate conveying mechanism and the second substrate conveying mechanism respectively convey substrates with respect to carriers, and the carriers are respectively arranged on two or more carrier loading parts arranged in the vertical direction, rather than two or more carrier loading parts arranged in the horizontal direction. Therefore, even in the case of increasing the number of carrier loading parts, since the substrate is conveyed by lifting and rotating instead of sliding the robot arm that can move forward and backward in the horizontal direction, the substrate can be simply conveyed. Therefore, the standby time for conveying the substrate can be reduced, and the reduction in the efficiency of conveying the substrate can be prevented.

[0013] In addition, in the loading device, it is preferred that the first substrate conveying mechanism conveys substrates to other carriers in the first carrier loading section row after conveying all substrates to the carriers loaded on the specified carrier loading section of the first carrier loading section row, and the second substrate conveying mechanism conveys substrates to other carriers in the second carrier loading section row after conveying all substrates to the carriers loaded on the specified carrier loading section of the second carrier loading section row.

[0014] Thus, each of the first substrate transfer mechanism and the second substrate transfer mechanism can transfer substrates to other carriers after transferring all substrates to the carriers.

[0015] In addition, the substrate processing device for processing substrates of the present invention includes the following elements: a loading block for delivering and conveying substrates to a carrier capable of accommodating a plurality of substrates; and a processing block for performing a predetermined processing on the substrate; the loading block comprises: a first carrier loading section array having two or more carrier loading sections arranged in an up-down direction; a second carrier loading section array having two or more carrier loading sections arranged in an up-down direction and arranged in parallel with the first carrier loading section array in a horizontal direction; a substrate buffer for placing a plurality of substrates between the loading block and the processing block; a first substrate conveying mechanism for placing a plurality of substrates on the first carrier loading section array; The substrate is transferred between the carriers carried by each of the more than two carrier loading sections and the substrate buffer section; and a second substrate transfer mechanism is used to transfer the substrate between the carriers carried by each of the more than two carrier loading sections of the second carrier loading section and the substrate buffer section; the first substrate transfer mechanism and the second substrate transfer mechanism are respectively provided with: a robot capable of moving forward and backward in the horizontal direction and holding the substrate; and a lifting and rotating driving section is used to lift and lower the robot along a support section extending in the up-down direction and rotate the robot around an axis along the support section; and the horizontal position of the lifting and rotating driving section is fixed.

[0016] According to the substrate processing device of the present invention, the first substrate conveying mechanism and the second substrate conveying mechanism respectively convey substrates with respect to carriers, and the carriers are respectively placed on two or more carrier placing parts arranged in the vertical direction, rather than two or more carrier placing parts arranged in the horizontal direction. Therefore, even in the case of adding carrier placing parts, since the robot arm capable of moving forward and backward does not slide in the horizontal direction, but conveys the substrate by lifting and rotating, the conveyance of the substrate can be easily performed. Therefore, the standby time for conveying the substrate can be reduced, and the reduction in the efficiency of conveying the substrate can be prevented.

[0017] In addition, in the substrate processing device, it is preferred that the first substrate conveying mechanism takes out substrates from other carriers in the first carrier loading section row after taking out all substrates from the carriers loaded on the specified carrier loading sections in the first carrier loading section row, and the second substrate conveying mechanism stores substrates in other carriers in the second carrier loading section row after storing all substrates in the carriers loaded on the specified carrier loading sections in the second carrier loading section row.

[0018] Thus, the first substrate transfer mechanism can take out substrates from other carriers after taking out all substrates from the carrier. Also, the second substrate transfer mechanism can store substrates in other carriers after storing all substrates in the carrier.

[0019] In addition, in the substrate processing device, it is preferred to further include a carrier conveying mechanism, which is arranged on the side opposite to the first substrate conveying mechanism and the second substrate conveying mechanism across the first carrier loading portion array and the second carrier loading portion array, and conveys the carrier. The carrier conveying mechanism replaces the carrier after all substrates are taken out from the carrier by the first substrate conveying mechanism with another carrier that accommodates substrates, and further replaces the carrier after all substrates are accommodated in the carrier by the second substrate conveying mechanism with another carrier that does not accommodate substrates.

[0020] If a plurality of carrier loading units are arranged in the vertical direction, it may be difficult for the operator to replace the carrier on the upper carrier loading unit because the operator cannot reach the upper carrier loading unit with his hand. However, since the carrier transport mechanism transports the carrier, the transport of the carrier becomes easy. In addition, since the carrier after all substrates are taken out of the carrier is replaced with another carrier storing substrates, more unprocessed substrates can be supplied to the substrate processing device. Furthermore, since the carrier after all substrates are stored in the carrier is replaced with another carrier without storing substrates, a plurality of processed substrates that have been processed by the processing block can be moved back to the carrier.

[0021] In addition, the substrate processing device also has an empty carrier rack capable of carrying carriers that do not contain substrates. When the carrier is not carried on any of the two or more carrier loading sections in the first carrier loading section row, when the carrier is not carried on at least any one of the two or more carrier loading sections in the second carrier loading section row, and when the empty carrier rack does not carry the carrier, the carrier conveying mechanism preferably conveys a specific carrier to any one of the carrier loading sections in the second carrier loading section row that does not carry the carrier, the second substrate conveying mechanism takes out a substrate from the specific carrier, and then stores the processed substrate processed by the processing block into the specific carrier, and the carrier conveying mechanism keeps the specific carrier at the loading position of the specific carrier from the time all substrates are taken out from the specific carrier by the second substrate conveying mechanism to the time all processed substrates are stored into the specific carrier.

[0022] Usually, the second substrate conveying mechanism is set in a manner that the substrate is stored (moved back) to the carrier of the second carrier loading section. However, when the specified conditions are met, the second substrate conveying mechanism takes out the substrate from the specific carrier, and then, the processed substrate is stored in the specific carrier. In other words, the second substrate conveying mechanism performs an action different from the usual substrate conveying action. Thus, from taking out all substrates from the specific carrier to storing all substrates, the specific carrier can be kept at the loading position. Therefore, the carrier conveying mechanism can convey carriers other than the specific carrier, so the conveying efficiency of the carrier can be improved. As a result, the carrier conveying waiting time is reduced, so the processing capacity of the substrate processing can be increased.

[0023] In addition, in the substrate processing device, it is preferred that the first substrate conveying mechanism, the second substrate conveying mechanism, and the third substrate conveying mechanism of the processing block are configured so that the respective robots simultaneously enter the substrate buffer and convey the respective substrates. In the respective substrate conveying of the first substrate conveying mechanism, the second substrate conveying mechanism, and the third substrate conveying mechanism of the processing block, the respective robots simultaneously enter to place the substrate or obtain the substrate. Thus, there is no need to wait for the time for other robots to enter the substrate buffer and retreat, so the conveying efficiency of the substrate can be improved. As a result, the processing capacity of the substrate processing can be increased.

[0024] In addition, an example of the substrate processing device is that the processing block has a plurality of processing layers arranged in the up and down directions, and the plurality of processing layers respectively have: a third substrate conveying mechanism for conveying a substrate; a conveying space extending linearly in a horizontal direction for movement of the third substrate conveying mechanism; and a plurality of liquid processing units arranged along the conveying space and in a horizontal direction relative to the conveying space for supplying processing liquid to process the substrate; and the liquid processing units are not arranged in multiple sections overlapping each other, but are arranged in one section.

[0025] In each processing layer, the liquid processing units are not arranged in multiple stages overlapping each other but are arranged in one stage, so that the height of each processing layer can be suppressed, thereby suppressing the height of the processing block.

[0026] In addition, the present invention is a control method for a loading device, which has a substrate buffer section for carrying multiple substrates, a first substrate conveying mechanism and a second substrate conveying mechanism, and transfers and conveys substrates to a carrier that can accommodate multiple substrates. The control method for the loading device includes the following elements: a first substrate conveying step, in which the first substrate conveying mechanism conveys a substrate between the carrier carried by each of the two or more carrier carrying sections arranged in the vertical direction of the first carrier carrying section and the substrate buffer section; and a second substrate conveying step, in which the second substrate conveying mechanism conveys a substrate between the two or more carrier carrying sections arranged in the vertical direction of the second carrier carrying section. The substrate is transferred between the carriers carried by each of the body loading parts and the substrate buffer part; the second carrier loading part column and the first carrier loading part column are arranged side by side in the horizontal direction, and in the first substrate transfer process and the second substrate transfer process, the first substrate transfer mechanism and the second substrate transfer mechanism respectively use a robot and a lifting and rotating drive part to transfer the substrate while fixing the horizontal position of the lifting and rotating drive part, the robot can move forward and backward in the horizontal direction and hold the substrate, and the lifting and rotating drive part makes the robot rise and fall along a support part extending in the up and down direction, and rotates the robot around an axis along the support part.

[0027] According to the control method of the loading device of the present invention, the first substrate conveying mechanism and the second substrate conveying mechanism respectively convey substrates with respect to carriers, and the carriers are respectively placed on two or more carrier placing parts arranged in the vertical direction, rather than two or more carrier placing parts arranged in the horizontal direction. Therefore, even in the case of adding carrier placing parts, since the substrate is conveyed by lifting and rotating instead of sliding the robot arm capable of moving forward and backward in the horizontal direction, the substrate can be simply conveyed. Therefore, the standby time for conveying the substrate can be reduced, and the reduction in the efficiency of conveying the substrate can be prevented.

[0028] In addition, the present invention is a control method for a substrate processing device, the substrate processing device comprising: a processing block for performing a predetermined processing on a substrate; and a loading block for delivering and conveying a substrate to a carrier capable of accommodating a plurality of substrates; the loading block having a first substrate conveying mechanism, a second substrate conveying mechanism and a substrate buffer, the substrate buffer being used for conveying substrates between the loading block and the processing block and for carrying a plurality of substrates; the control method for the substrate processing device comprises the following elements: a first substrate conveying step, in which a substrate is conveyed between the substrate buffer and the carrier respectively carried by two or more carrier carrying sections arranged in the vertical direction of a first carrier carrying section array through the first substrate conveying mechanism; and a second substrate conveying step, in which a substrate is conveyed between the substrate buffer and the carrier respectively carried by the two or more carrier carrying sections arranged in the vertical direction of a first carrier carrying section array through the second substrate conveying mechanism; A bottom conveying mechanism conveys substrates between the carriers carried by the two or more carrier loading sections arranged along the vertical direction of the second carrier loading section array and the substrate buffer section; the second carrier loading section array and the first carrier loading section array are arranged side by side in the horizontal direction, and in the first substrate conveying process and the second substrate conveying process, the first substrate conveying mechanism and the second substrate conveying mechanism respectively use a robot and a lifting and rotating driving section to convey substrates while fixing the horizontal position of the lifting and rotating driving section, the robot can move forward and backward in the horizontal direction and hold the substrate, and the lifting and rotating driving section causes the robot to rise and fall along a support section extending in the vertical direction, and causes the robot to rotate around an axis along the support section.

[0029] According to the control method of the substrate processing device of the present invention, the first substrate conveying mechanism and the second substrate conveying mechanism respectively convey substrates with respect to carriers, and the carriers are respectively placed on two or more carrier placing parts arranged in the vertical direction, rather than two or more carrier placing parts arranged in the horizontal direction. Therefore, even in the case of adding carrier placing parts, since the robot arm capable of moving forward and backward does not slide in the horizontal direction, but conveys the substrate by lifting and rotating, the conveyance of the substrate can be easily performed. Therefore, the standby time for conveying the substrate can be reduced, and the reduction in the efficiency of conveying the substrate can be prevented.

[0030] [Effects of the Invention]

[0031] According to the loader, substrate processing apparatus, loader control method and substrate processing apparatus control method of the present invention, the standby state of the substrate transfer mechanism can be reduced and the substrate transfer efficiency can be prevented from being reduced. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] In order to illustrate the invention, several aspects currently considered to be preferred are shown in the drawings, but it should be understood that the invention is not limited to the structures and measures shown in the drawings.

[0033] Figure 1It is a longitudinal sectional view of the substrate processing apparatus of the embodiment.

[0034] Figure 2 is a cross-sectional view of a substrate processing apparatus according to an embodiment.

[0035] Figure 3A It is a front view showing the 4 openers of the loading block. Figure 3B This is a rear view of the four openers as viewed from the two substrate transport mechanisms.

[0036] Figure 4 It is a diagram showing a substrate transfer mechanism of a loading block.

[0037] Figure 5 It is a right side view of the processing block showing the arrangement of the coating processing section.

[0038] Figure 6 It is a left side view of a processing block showing the arrangement of a heat treatment section.

[0039] Fig. 7A 1 is a diagram showing a frame of a front-opening wafer box buffer device as viewed from a front-opening wafer box transfer mechanism. Figure 7B It is a front view showing four openers and a front-opening wafer box transport mechanism viewed from the rack.

[0040] Figures 8A to 8D This is a diagram for explaining the operation of transferring a substrate from a front-opening cassette to a transport buffer using the first substrate transfer mechanism.

[0041] FIG. 9A to FIG. 9D This is a diagram for explaining the operation of transferring a substrate from the return buffer to the front-opening cassette using the second substrate transfer mechanism.

[0042] FIG. 10A to FIG. 10D This is a diagram for explaining the replacement operation of two front-opening wafer cassettes using the front-opening wafer cassette transfer mechanism.

[0043] Fig.11 This is a flowchart for explaining the transfer operation of the front-opening wafer box from the input port to the output port and the substrate transfer operation.

[0044] Fig.12 This is a diagram showing the operation priority order of the front-opening wafer cassette buffer device.

[0045] FIG. 13A to FIG. 13D This is a diagram for explaining the transport operation of a front-opening wafer cassette.

[0046] FIG. 14A to FIG. 14D It is used to explain the Fig.13D Figure 2 shows the transport action of the front-opening wafer box.

[0047] FIG. 15A to FIG. 15DIt is used to explain the Fig.14D Figure 2 shows the transport action of the front-opening wafer box.

[0048] Fig.16 It is used to explain the Fig.15D Figure 2 shows the transport action of the front-opening wafer box.

[0049] Figures 17A to 17C This is a diagram for explaining the transport operation of another front-opening wafer cassette.

[0050] Fig.18A , Fig.18B This is a diagram for explaining the operation in which the respective robots of the first substrate transfer mechanism, the second substrate transfer mechanism, and the third substrate transfer mechanism simultaneously enter the substrate buffer.

[0051] Fig.19 It is a side view of a substrate processing apparatus according to a modified example. DETAILED DESCRIPTION

[0052] [Example]

[0053] Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. Figure 1 It is a longitudinal sectional view of the substrate processing apparatus 1 of the embodiment. Figure 2 is a cross-sectional view of a substrate processing apparatus 1 according to the embodiment. Figure 3A It is a front view showing four openers 5A to 5D of the loading block 2 . Figure 3B This is a rear view of the four openers 5A to 5D as viewed from the two substrate transfer mechanisms 6A and 6B.

[0054] Reference Figure 1 or Figure 2 The substrate processing device 1 is a coating device for coating, for example, a resist liquid. The substrate processing device 1 includes a loading block 2 (hereinafter appropriately referred to as "ID block 2"), a processing block 3, and a front-opening wafer box buffer device 4 (stacker device). The processing block 3 is connected to the rear surface of the ID block 2, and the front-opening wafer box buffer device 4 is connected to the front surface of the ID block 2.

[0055] [ID(indexer) block 2]

[0056] The ID block 2 transfers and transports the substrate W to the carrier. The ID block 2 includes four openers 5A to 5D (see Figure 3A ), two substrate transfer mechanisms 6A, 6B and a substrate buffer section 7. Four openers 5A~5D are arranged on the wall 8 on the front surface of the ID block 2.

[0057] like Figure 3AAs shown, the four openers 5A to 5D are divided into two groups, namely the first opener column 9 and the second opener column 10. The first opener column 9 has two openers 5A and 5B arranged in the vertical direction. The second opener column 10 has two openers 5C and 5D arranged in the vertical direction. In addition, the second opener column 10 and the first opener column 9 are arranged side by side in the horizontal direction (Y direction). In addition, Figure 3A In the embodiment, the first opener 5A is provided above the second opener 5B. The third opener 5C is provided above the fourth opener 5D.

[0058] The four openers 5A to 5D correspond to the carrier mounting portion of the present invention, respectively. The first opener row 9 corresponds to the first carrier mounting portion row of the present invention. The second opener row 10 corresponds to the second carrier mounting portion row of the present invention.

[0059] The four openers 5A to 5D respectively carry carriers. The carrier uses, for example, a front-opening wafer box F (FOUP). In addition, as long as it is a carrier with a cover that can be opened and closed, the carrier is not limited to the front-opening wafer box F. Below, the carrier is explained by the front-opening wafer box F. The front-opening wafer box F can accommodate multiple (for example, 25) substrates W in a horizontal posture. The front-opening wafer box F has an opening for the substrate W to enter and exit, a front-opening wafer box body for accommodating the substrate W, and a cover covering the opening.

[0060] The four openers 5A to 5D respectively open and close the lid of the front-opening wafer box F. The four openers 5A to 5D respectively include a mounting table 12, an opening 14, a baffle 16 and a baffle driving unit (not shown). The front-opening wafer box F is mounted on the mounting table 12. The opening 14 is an opening for transferring the substrate W between the interior of the front-opening wafer box F and the interior of the ID block 2. The baffle 16 is used to cover the opening 14. In addition, the baffle 16 locks the lid to the front-opening wafer box body and releases the lock. In addition, the baffle 16 is configured to hold the lid. The baffle 16 holds the lid, for example, by vacuum adsorption. The baffle 16 moves in the up and down directions and the front and back directions by a baffle driving unit having an electric motor.

[0061] like Figure 2 As shown, the first substrate conveying mechanism 6A is arranged at a position opposite to the first opener row 9 (including the opener 5A). The second substrate conveying mechanism 6B is arranged at a position opposite to the second opener row 10 (including the opener 5C). The first substrate conveying mechanism 6A conveys the substrate W between the front-opening wafer box F on which the two openers 5A and 5B of the first opener row 9 are respectively placed and the substrate buffer 7. The second substrate conveying mechanism 6B conveys the substrate W between the front-opening wafer box F on which the two openers 5C and 5D of the second opener row 10 are respectively placed and the substrate buffer 7.

[0062] like Figure 3B , Figure 4 As shown, the two substrate conveying mechanisms 6A and 6B are respectively provided with two robots 21 (21A, 21B), an advance and retreat drive unit 23, and an elevation and rotation drive unit 25. The two robots 21A and 21B respectively hold substrates W. The two robots 21A and 21B can independently advance and retreat in the horizontal direction, for example, they can take out one substrate W or two substrates W from a front-opening wafer box F. The two robots 21A and 21B are respectively configured in a shape such as a Y-shaped or U-shaped shape with the front end divided into two. In addition, the two substrate conveying mechanisms 6A and 6B are respectively provided with two robots 21A and 21B, but may also be provided with three or more robots.

[0063] The advance / retract drive unit 23 supports the two manipulators 21A and 21B so that they can move, and moves the two manipulators 21A and 21B forward and backward. In order to drive the first manipulator 21A, the advance / retract drive unit 23 includes, for example, an electric motor, a linear screw shaft, a movable part having a hole that meshes with the screw shaft, and a guide part that guides the movable part. The first manipulator 21A is supported by the movable part. Similarly, in order to drive the second manipulator 21B, the advance / retract drive unit 23 includes, for example, an electric motor, a screw shaft, a movable part, and a guide part.

[0064] The lifting and rotating driving unit 25 lifts and rotates the two manipulators 21A and 21B by lifting and rotating the advancing and retreating driving unit 23. The lifting and rotating driving unit 25 includes a support portion 25A and a rotating portion 25B. The support portion 25A is provided in a manner extending in the up-down direction. The support portion 25A is fixed to the bottom of the ID block 2. Therefore, the support portion 25A, that is, the horizontal direction (especially the Y direction) of the lifting and rotating driving unit 25 does not move and is fixed.

[0065] The rotating part 25B is raised and lowered along the support part 25A. The support part 25A includes, for example, an electric motor (not shown), two pulleys 27, and a belt 28. The belt 28 is mounted on the two pulleys 27. The rotating part 25B is mounted on the belt 28. The rotation of the electric motor is transmitted to one of the two pulleys 27, so that the belt 28 moves. The rotating part 25B moves together with the movement of the belt 28.

[0066] The rotating unit 25B rotates the forward / backward driving unit 23 about the vertical axis AX1a or the vertical axis AX1b along the support 25A. This changes the orientation of the two manipulators 21A and 21B. The rotating unit 25B includes, for example, an electric motor, two pulleys, and a belt.

[0067] As described above, the horizontal position of the support portion 25A, i.e., the lifting and rotating driving portion 25, does not move but is fixed. Therefore, the horizontal position of the vertical axes AX1a, AX1b, i.e., the rotation center of the advance and retreat driving portion 23, is also fixed. In this way, the horizontal position of the lifting and rotating driving portion 25 is fixed. Thus, the first substrate conveying mechanism 6A can convey the substrate W between each front-opening wafer box F of the two openers 5A, 5B and the substrate buffer 7, but cannot convey the substrate between each front-opening wafer box F of the two openers 5C, 5D and the substrate buffer 7. Similarly, the second substrate conveying mechanism 6B can convey the substrate W between each front-opening wafer box F of the two openers 5C, 5D and the substrate buffer 7, but cannot convey the substrate W between each front-opening wafer box F of the two openers 5A, 5B and the substrate buffer 7.

[0068] Return to Figure 1 , Figure 2 The substrate buffer 7 can hold a plurality of (for example, 32) substrates W. In the substrate buffer 7, each substrate W is supported in a horizontal position, and the plurality of substrates W are arranged in the vertical direction. Figure 2 As shown, the substrate buffer 7 includes a support 29A, a plurality of mounting plates 29B, and three support pins 29C. The support 29A extends in the vertical direction (Z direction). The plurality of mounting plates 29B are supported on the support 29A in a manner that they extend horizontally in the +X direction from the ID block 2 toward the processing block 3. The three support pins 29C are supported on the upper surface of the mounting plates 29B. The substrate W is supported on the support pins 29C. Figure 2 As shown, the substrate buffer section 7 is disposed between the ID block 2 and the processing block 3 or in the vicinity thereof.

[0069] [Processing Block 3]

[0070] The processing block 3 performs coating processing on the substrate W. Figure 1 As shown, the processing block 3 includes four (plural) coating processing layers 31A to 31D arranged in the vertical direction.

[0071] In addition, the substrate buffer 7 includes transport buffers SBF1 to SBF4 and return buffers RBF1 to RBF4. The transport buffers SBF1 to SBF4 and the return buffers RBF1 to RBF4 each have four mounting plates 29B, which can mount four substrates W. For example, the transport buffer SBF1 and the return buffer RBF1 are used for the first coating treatment layer 31A, and the transport buffer SBF4 and the return buffer RBF4 are used for the fourth coating treatment layer 31D. In addition, the two substrate transport mechanisms 6A and 6B can transport substrates W to all the transport buffers SBF1 to SBF4 and the return buffers RBF1 to RBF4, respectively.

[0072] like Figure 1, Figure 2 As shown, the four coating treatment layers 31A to 31D are respectively provided with a third substrate transfer mechanism 33, a transfer space 34, a coating treatment unit SC and a heat treatment unit 37. The four coating treatment layers 31A to 31D are respectively equivalent to the treatment layers of the present invention. The coating treatment unit SC is equivalent to the liquid treatment unit of the present invention.

[0073] The third substrate transfer mechanism 33 is for transferring the substrate W between the four coating treatment layers 31A to 31D. The third substrate transfer mechanism 33 includes two robot arms 41 , an advance / retract drive unit 42 , a rotation drive unit 43 , a first moving mechanism 44 , and a second moving mechanism 45 .

[0074] The two manipulators 41 are each configured in a Y-shaped or U-shaped shape with the front end being split into two. The two manipulators 41 each hold a substrate W. The advance / retract drive unit 42 enables the two manipulators 41 to advance / retract respectively. The rotation drive unit 43 enables the advance / retract drive unit 42 to rotate around the vertical axis AX2. Thus, the orientation of the two manipulators 41 can be changed. The first moving mechanism 44 enables the rotation drive unit 43 to move in the direction of the substrate W. Figure 1 The second moving mechanism 45 moves the first moving mechanism 44 in the vertical direction (Z direction). Thus, the advance / retract drive unit 42 can be moved in the X direction. The second moving mechanism 45 moves the first moving mechanism 44 in the vertical direction (Z direction). Thus, the advance / retract drive unit 42 can be moved in the Z direction.

[0075] Furthermore, the forward / backward drive unit 42 , the rotation drive unit 43 , the first moving mechanism 44 , and the second moving mechanism 45 each include an electric motor.

[0076] like Figure 2 As shown in FIG. 1 , the third substrate transfer mechanism 33 is disposed in a transfer space 34. The transfer space 34 is configured to extend linearly in the horizontal direction (X direction). Figure 2 As shown, the transfer space 34 is a rectangular space when viewed from above the substrate processing apparatus 1. The coating processing section SC and the heat treatment section 37 are arranged so as to sandwich the transfer space 34 therebetween.

[0077] The coating processing section SC is provided along the conveying space 34 and is provided in a horizontal direction with respect to the conveying space 34. The coating processing section SC supplies a coating liquid onto the substrate W to form a coating film. Figure 5The right side of the processing block 3 shows the arrangement of the coating processing section SC. The four coating processing layers 31A to 31D are respectively provided with four coating processing sections SC. In each coating processing layer 31A to 31D, the coating processing sections SC are not arranged in overlapping, for example, two stages, but in one stage. In each of the four coating processing layers 31A to 31D, the liquid processing units are not arranged in overlapping multiple stages, but in one stage, so that the height of each coating processing layer 31A to 31D is suppressed, thereby suppressing the height of the processing block 3.

[0078] In addition, in each coating process layer 31A to 31D, the coating process section SC is arranged in 4 rows by 1 stage, that is, 4 rows in the horizontal direction and 1 stage in the vertical direction. The substrate W is processed synchronously in the four coating process layers 31A to 31D. Therefore, the processing throughput of the substrate processing can be increased by suppressing the height of the processing block 3 and increasing the number of synchronous processing.

[0079] exist Figure 5 In the embodiment, for example, the four coating processing sections SC arranged in parallel in the horizontal direction include a unit represented by symbol 35A and a unit represented by symbol 35B. The two coating processing sections SC on the left side represented by symbol 35A are units for forming an anti-reflection film on the substrate W (hereinafter, appropriately referred to as "BARC units"). In addition, the two coating processing sections SC on the right side represented by symbol 35B are units for forming a resist film on the substrate W (hereinafter, appropriately referred to as "RESIST units").

[0080] like Figure 2 As shown in FIG. 1 , the coating processing section SC includes a holding rotating section 51, a plurality of nozzles 52, and a nozzle moving mechanism 53. The holding rotating section 51 holds the substrate W, for example, by vacuum adsorption, and rotates the held substrate W around a vertical axis (Z direction). The plurality of nozzles 52 supply a coating liquid (for example, an anti-reflection film forming liquid or a photoresist liquid) to the substrate W. The nozzle moving mechanism 53 holds one nozzle 52 from the plurality of nozzles 52, and moves the held nozzle 52 in the vertical direction (Z direction) and the horizontal direction (XY direction) between the standby position of each nozzle 52 and the supply position above the center of the substrate W.

[0081] The heat treatment unit 37 is provided along the transfer space 34 and is provided horizontally with respect to the transfer space 34. The heat treatment unit 37 includes a plate 55 for performing heat treatment on the substrate W. Figure 6 The left side of the processing block 3 shows the arrangement of the heat treatment unit 37. The four coating treatment layers 31A to 31D each include four adhesion strengthening treatment units PAHP, two cooling units CP, and six heating and cooling units PHP. That is, each layer 31A to 31D includes 12 heat treatment units 37.

[0082] The adhesion enhancement treatment section PAHP improves the adhesion between the substrate W and the anti-reflection film by applying an adhesion enhancement agent such as hexamethyldisilazane (HMDS) to the substrate W and heating it. The adhesion enhancement treatment section PAHP also has the function of cooling the substrate W after heating. The cooling section CP cools the substrate W. The heating and cooling section PHP performs heating and cooling treatments in sequence. In addition, Figure 6 As shown, the heat treatment parts 37 are arranged in 5 rows×3 stages in each of the layers 31A to 31D, that is, 5 rows in the horizontal direction and 3 stages in the vertical direction.

[0083] Here, the operation of the processing block 3 is described by taking the coating processing layer 31A as an example. Figure 1 and Figure 2 As shown, the third substrate transfer mechanism 33 for applying the treated layer 31A uses two robots 41 to obtain one substrate W from the transport buffer SBF1. The third substrate transfer mechanism 33 sequentially transfers the obtained substrates W to the Figure 5 , Figure 6 The third substrate transport mechanism 33 uses two robots 41 to transport the substrate W with the anti-reflection film formed in the BARC unit to the heating and cooling unit PHP, the cooling unit CP, the RESIST unit (SC), and the heating and cooling unit PHP in sequence. The third substrate transport mechanism 33 uses two robots 41 to transport a substrate W processed in these units to the return buffer RBF1.

[0084] Furthermore, the third substrate transport mechanism 33 moves the advance / retract drive unit 42 to the vicinity of a target unit (e.g., cooling unit CP) that performs at least one of taking in a substrate W and transferring a substrate W. Thereafter, the advance / retract drive unit 42 advances / retracts, for example, the first robot 41 that does not hold a substrate W to take in a substrate W placed in the target unit, and then advances / retracts the second robot 41 that holds the substrate W to transfer (place) the substrate W in the target unit.

[0085] [Front-opening wafer box buffer device 4]

[0086] like Figure 1 , Figure 2 As shown, the front opening pod buffer device 4 includes a plurality of (eg, twelve) racks 61 and a front opening pod transfer mechanism 62 for transferring the front opening pod F.

[0087] Multiple racks 61 and two opener rows 9, 10 (e.g. Figure 1The two openers 5C and 5D shown in the figure are arranged opposite to each other. The front-opening wafer box conveying mechanism 62 is arranged between the two opener rows 9 and 10 and the plurality of racks 61. In addition, the front-opening wafer box conveying mechanism 62 is arranged on the side opposite to the two substrate conveying mechanisms 6A and 6B across the two opener rows 9 and 10.

[0088] also, Fig. 7A 1 is a diagram showing the rack 61 of the front-opening pod buffer device 4 as viewed from the front-opening pod transfer mechanism 62 . Figure 7B It is a front view showing the four openers 5A to 5D and the front-opening cassette transfer mechanism 62 as viewed from the rack 61 .

[0089] The rack 61 is used to carry the front-opening wafer box F. The rack 61 is arranged at Figure 1 The wall portion 64 on the left side (front side) of the front-opening wafer box buffer device 4 is shown. Fig. 7A As shown, the rack 61 includes, for example, two input ports IP1 and IP2 (also referred to as input load ports), two output ports OP1 and OP2 (also referred to as output load ports), two unprocessed substrate front-opening cassette racks IB1 and IB2, two processed substrate front-opening cassette racks OB1 and OB2, and four empty front-opening cassette racks EB1 to EB4. In addition, the number and function of the rack 61 are set as needed.

[0090] The two input ports IP1 and IP2 are used to obtain the front-opening wafer box F from the external transport mechanism OHT (Overhead Hoist Transport) that transports the front-opening wafer box F in the factory. The two output ports OP1 and OP2 are used to transfer the front-opening wafer box F containing the processed substrate W to the external transport mechanism OHT. The two input ports IP1 and IP2 and the two output ports OP1 and OP2 are set at the uppermost section of the rack 61. In order to carry out the handover between the external transport mechanism OHT and the front-opening wafer box F, the top wall of the front-opening wafer box buffer device 4 is partially opened.

[0091] For example, when the two openers 5A and 5B are set to be used for taking out (transporting) the substrate W, the two unprocessed substrate front-opening cassette racks IB1 and IB2 are used to store the front-opening cassette F that cannot be transferred to the two openers 5A and 5B. In addition, for example, when the two openers 5C and 5D are set to be used for storing (returning) the substrate W, the processed substrate front-opening cassette racks OB1 and OB2 are used to store the front-opening cassette F that cannot be transferred from the two openers 5C and 5D to the output ports OP1 and OP2. The four empty front-opening cassette racks EB1 to EB4 are used to store the empty front-opening cassette F after the substrate W is taken out.

[0092] like Figure 7BAs shown, the front-opening wafer box conveying mechanism 62 includes two holding parts 65A, 65B, two multi-joint arms 66A, 66B, a lifting drive part 67 and a horizontal drive part 68. The two holding parts 65A, 65B are respectively configured to hold the front-opening wafer box F. Specifically, the two holding parts 65A, 65B are respectively configured to hold the protrusion 69 provided on the upper part of the front-opening wafer box F. The first holding part 65A is mounted on the first end of the first multi-joint arm 66A in a manner that allows rotation around the vertical axis AX3a. In addition, the second holding part 65B is mounted on the first end of the second multi-joint arm 66B in a manner that allows rotation around the vertical axis AX4a.

[0093] The two multi-joint arms 66A and 66B are respectively configured in a scalar type, for example. The first multi-joint arm 66A moves the holding portion 65A to a specified position in the horizontal direction by rotating the support components connected to each of the two vertical axes AX3b and AX3c. In addition, the first multi-joint arm 66A adjusts the orientation of the front-opening wafer box F by rotating the first holding portion 65A around the vertical axis AX3a. Similarly, the second multi-joint arm 66B moves the holding portion 65B to a specified position in the horizontal direction by rotating the support components connected to each of the two vertical axes AX4b and AX4c. In addition, the second multi-joint arm 66B adjusts the orientation of the front-opening wafer box F by rotating the second holding portion 65B around the vertical axis AX4a. The two multi-joint arms 66A and 66B are respectively mounted on the lifting drive unit 67.

[0094] like Figure 1 As shown, the lifting drive unit 67 includes two drive units 67A and 67B. The first drive unit 67A lifts the first multi-joint arm 66A in the vertical direction, and the second drive unit 67B lifts the second multi-joint arm 66B in the vertical direction. In other words, the two holding parts 65A and 65B are lifted and lowered independently of each other. The two drive units 67A and 67B are arranged side by side in the horizontal direction (for example, the X direction).

[0095] The first holding portion 65A and the first multi-joint arm 66A are arranged above the second holding portion 65B and the second multi-joint arm 66B. In other words, the first holding portion 65A and the first multi-joint arm 66A are configured so as not to be able to move below the second holding portion 65B and the second multi-joint arm 66B in order to prevent collision. In addition, in this regard, the lifting drive portion 67 may also be configured so as to enable the holding portion 65A to move above and below the holding portion 65B.

[0096] The horizontal drive unit 68 moves the lifting drive unit 67 in the horizontal direction (Y direction). As a result, the two holding units 65A and 65B can approach the front-opening wafer box F that cannot be reached within the horizontal movable range of the two multi-jointed arms 66A and 66B. Figure 7B In the embodiment, the two holding parts 65A and 65B can respectively transport the front-opening wafer cassettes F to all the racks 61 and the four openers 5A to 5D.

[0097] In addition, the two holding parts 65A, 65B, the two multi-joint arms 66A, 66B, the lifting drive part 67 (two drive parts 67A, 67B) and the horizontal drive part 68 are respectively equipped with electric motors. In addition, the two drive parts 67A, 67B may also be equipped with, for example, two pulleys and belts. In addition, the holding parts and multi-joint arms may be other than two groups as needed.

[0098] like Figure 1 As shown, the substrate processing device 1 includes one or more control units 71 and an operation unit 73. The control unit 71 includes, for example, a central processing unit (CPU). The control unit 71 controls each component of the substrate processing device 1. The operation unit 73 includes a display unit (for example, a liquid crystal monitor), a storage unit, and an input unit. The storage unit includes, for example, at least one of a ROM (Read-Only Memory), a RAM (Random-Access Memory), and a hard disk. The input unit includes at least one of a keyboard, a mouse, a touch panel, and various buttons. The storage unit stores various conditions for substrate processing and the action program required for controlling the substrate processing device 1.

[0099] <Operation of Substrate Processing Apparatus 1>

[0100] Next, the operation of the substrate processing apparatus 1 will be described. First, the operation of the two substrate transfer mechanisms 6A and 6B of the substrate processing apparatus 1 will be described.

[0101] exist Figure 2 In the embodiment, the front-opening wafer box transfer mechanism 62 transfers the front-opening wafer box F to the opener 5A. The shutter 16 of the opener 5A releases the lock of the cover of the front-opening wafer box F placed on the mounting table 12 of the opener 5A while holding the cover. Thereafter, the cover is removed from the front-opening wafer box F while sliding downward, thereby opening the opening 14 (see FIG. Figure 3B ) open. Two openers 5A, 5B (refer to Figure 3B ) and the first substrate transfer mechanism 6A are pre-set to be used for taking out (delivering out) the substrate W as a normal operation. Therefore, the first substrate transfer mechanism 6A starts taking out the substrate W from, for example, the front-opening wafer box F placed on the opener 5A. The substrate W taken out from the front-opening wafer box F is transferred to the substrate buffer 7.

[0102] [Operation of Removing Substrate W by First Substrate Transport Mechanism 6A]

[0103] exist Fig. 8AIn the embodiment, the advance and retreat drive unit 23 of the first substrate transfer mechanism 6A advances the two robots 21 (21A, 21B) so that the two robots 21 enter the front-opening wafer box F. After entering, the lifting and rotating drive unit 25 (see Figure 4 ) The two robots 21 are slightly raised. Thus, the two substrates W are lifted up and held by the two robots 21. After the two substrates W are lifted up, the advance / retract drive unit 23 moves the two robots 21 backward while holding the two substrates W.

[0104] After taking out two substrates W from the front-opening wafer box F, the taken out two substrates W are transported to the transport buffer SBF1 of the substrate buffer 7. The specific operations are described in sequence. The lifting and rotating drive unit 25 causes the two manipulators 21 and the forward and backward drive unit 23 to rise and fall along the vertical axis AX1a ( Figure 8B The two robots 21 and the advance / retreat drive unit 23 are rotated about the vertical axis AX1a. Thus, the two robots 21 are moved to a predetermined height position of the transport buffer SBF1 where the two substrates W are placed and held, and the two robots 21 are directed toward the transport buffer SBF1.

[0105] exist Figure 8C In the embodiment, the advance / retreat drive unit 23 advances the two robots 21 holding the two substrates W, and causes the two robots 21 to enter the area of ​​the transport buffer SBF1. After entering, the lifting and rotating drive unit 25 slightly lowers the two robots 21. Thus, the two robots 21 place the two substrates W on the support pins 29C. After placing the two substrates W, the advance / retreat drive unit 23 retreats the two robots 21 that are not holding the substrates W.

[0106] After the two substrates W are transferred to the transport buffer SBF1, one or two substrates W are taken out from the front-opening cassette F again. Fig.8D In the embodiment, the lifting and rotating driving unit 25 causes the two manipulators 21 and the advancing and retreating driving unit 23 to be lifted and lowered along the vertical axis AX1a ( Fig.8D The two robots 21 and the advance / retract drive unit 23 are rotated around the vertical axis AX1a. Thus, the two robots 21 are moved to a position opposite to the next one or two substrates W to be taken out, and the two robots 21 are directed toward the one or two substrates W. Then, one or two substrates W are taken out from the front-opening wafer box F.

[0107] In addition, repeat Figures 8A to 8D The operation is continued until all substrates W are taken out from the front-opening wafer box F. At this time, Figure 1The four coating processing layers 31A to 31d of the processing block 3 shown are processed synchronously. Therefore, when two substrates W taken out from the front-opening wafer box F are transported to the transport buffer SBF1, the next two substrates W taken out are transported to the transport buffer SBF2. The next two substrates W taken out are transported to the transport buffer SBF3. The next two substrates W taken out are transported to the transport buffer SBF4. The next two substrates W taken out are transported to the transport buffer SBF1 again.

[0108] In this way, the substrates W are evenly distributed in the order of "transport buffer SBF1", "transport buffer SBF2", "transport buffer SBF3", and "transport buffer SBF4". Figure 8A to Figure 8C As shown, the first substrate transfer mechanism 6A sequentially takes out substrates W from the lower stage 86 of the front-opening cassette F and sequentially places them on the mounting plate 29B of the transport buffer SBF1 from below.

[0109] In addition, Fig.8D In the process, the third substrate transfer mechanism 33 of the first coating treatment layer 31A takes in one substrate W placed on the placement plate 29B of the transport buffer SBF1. The taken-in substrate W is subjected to a predetermined process in the first coating treatment layer 31A.

[0110] [Accommodation (Return) Operation of Substrate W by Second Substrate Transport Mechanism 6B]

[0111] exist Fig.9A In the figure, three substrates W are placed on the placing plates 29B at the first to third stages from the bottom of the return buffer RBF1. The three substrates W are substrates W conveyed by the third substrate conveying mechanism 33 and are substrates W that have been subjected to a predetermined process by the first coating treatment layer 31A. The advance and retreat drive unit 23 of the second substrate conveying mechanism 6B advances the two robots 21 so that the two robots 21 enter the area of ​​the return buffer RBF1. After entering, the two robots 21 pick up and hold the two substrates W. After picking up the two substrates W, the advance and retreat drive unit 23 moves the two robots 21 backward while holding the two substrates W.

[0112] After the two substrates W are obtained from the return buffer RBF1, for example, the two substrates W are stored in the front-opening wafer box F placed on the opener 5C. The specific operations are described in sequence. The lifting and rotating drive unit 25 causes the two manipulators 21 and the forward and backward drive unit 23 to rise and fall along the vertical axis AX1b ( Fig. 9BThe two robots 21 and the advance / retract drive unit 23 are rotated around the vertical axis AX1b, thereby moving the two robots 21 to a position opposite to the third and fourth storage spaces from below the front-opening wafer box F of the transfer target, and directing the two robots 21 toward the storage spaces.

[0113] exist Fig. 9C In the embodiment, the advance / retreat driving unit 23 advances the two robots 21 holding the two substrates, thereby causing the two robots 21 to enter the front-opening cassette F. After entering, the two robots 21 place the two substrates W at the third and fourth stages from the bottom in the front-opening cassette F. After placing the two substrates W, the advance / retreat driving unit 23 causes the two robots 21 not holding the substrates W to retreat.

[0114] After the two processed substrates W are stored in the front-opening wafer box F, one or two substrates W are taken out again from the return buffer RBF2 other than the return buffer RBF1. That is, the two robots 21 are moved to a position opposite to the one or two substrates W to be taken out next, and the two robots 21 are directed toward the one or two substrates W. Then, one or two substrates W are taken out.

[0115] By repeating the FIG. 9A to FIG. 9D The substrate W is stored in the front-opening wafer box F. Figure 1 The four coating processing layers 31A to 31D of the processing block 3 shown in the figure are processed synchronously. Therefore, after two substrates W are transferred from the return buffer RBF1 to the front open wafer box F, two substrates W are transferred from the return buffer RBF2 to the front open wafer box F. After that, two substrates W are transferred from the return buffer RBF3 to the front open wafer box F. After that, two substrates W are transferred from the return buffer RBF4 to the front open wafer box F. After that, two substrates W are transferred from the return buffer RBF1 to the front open wafer box F again.

[0116] In this way, the substrates W are evenly moved back to the front-opening wafer box F in the order of "return buffer RBF1", "return buffer RBF2", "return buffer RBF3", and "return buffer RBF4". Figures 9A to 9C As shown, the second substrate transfer mechanism 6B sequentially takes in substrates W from below the return buffer SFB1 and sequentially stores them in the lower stage 86 of the front-opening cassette F.

[0117] When all the substrates W are stored in the front-opening cassette F, the shutter 16 of the opener 5C attaches the cover to the front-opening cassette body and closes the opening 14. Then, the shutter 16 of the opener 5C locks the cover of the front-opening cassette F placed on the mounting table 12 of the opener 5C and releases the cover. Then, the front-opening cassette transport mechanism 62 transports the front-opening cassette F from the opener 5C. In addition, the phrase "all the substrates W are stored in the front-opening cassette F" means that, when 24 substrates W are stored in the front-opening cassette F, 24 substrates W are stored.

[0118] exist Fig.9D In the process, the third substrate transfer mechanism 33 of the first coating treatment layer 31A places one processed substrate W on the placing plate 29B of the return buffer RBF1.

[0119] [Substrate Transfer Operation to Two Openers 5A and 5B]

[0120] Next, the operation of the first substrate transfer mechanism 6A with respect to the two front-opening cassettes FA and FB placed on the two openers 5A and 5B will be described.

[0121] The two openers 5A and 5B and the first substrate transfer mechanism 6A are preset to perform an operation of taking out (carrying out) a substrate W from the front-opening cassette F as a normal operation. Figure 3B The first substrate transfer mechanism 6A takes out the substrate W from the front-opening wafer box FA placed on the opener 5A. The taken-out substrate W is transferred to the substrate buffer 7. Then, the first substrate transfer mechanism 6A takes out all the substrates W from the front-opening wafer box FA. Here, it is assumed that no Figure 3B In this case, the first substrate transfer mechanism 6A is in a standby state until the empty front opening cassette FA of the opener 5A is replaced with another front opening cassette F by the front opening cassette transfer mechanism 62. Therefore, the substrate W cannot be supplied to the processing block 3.

[0122] However, the front-opening wafer box buffer device 4 is also equipped with an opener 5B in addition to the opener 5A. Therefore, the first substrate conveying mechanism 6A can start to take out the substrates W from the front-opening wafer box FB of the opener 5B after taking out all the substrates W from the front-opening wafer box FA of the opener 5A. Thus, the standby time of the first substrate conveying mechanism 6A can be reduced. In addition, the two openers 5A and 5B are arranged in the up-down direction along the lifting path of the two manipulators 21 and the advance-retract drive unit 23 of the first substrate conveying mechanism 6A. Therefore, it is also possible not to move the two manipulators 21 and the advance-retract drive unit 23 in the Y direction, so that the conveying efficiency of the substrate W can be prevented from being reduced, and the two manipulators 21 of the first substrate conveying mechanism 6A can be moved.

[0123] Furthermore, after all the substrates W are taken out from the front-opening cassette FB of the opener 5B, the first substrate transport mechanism 6A starts taking out the substrates W from the third front-opening cassette F mounted on the opener 5A instead of the front-opening cassette FA. That is, the first substrate transport mechanism 6A is configured to alternately take out the substrates W in front-opening cassette units with respect to the front-opening cassette F mounted on the opener 5A and the front-opening cassette F mounted on the opener 5B.

[0124] [Substrate Transfer Operation to Two Openers 5C and 5D]

[0125] Next, the operation of the second substrate transfer mechanism 6B with respect to the two front-opening cassettes FC and FD placed on the two openers 5C and 5D will be described.

[0126] The two openers 5C and 5D and the second substrate transfer mechanism 6B are preset to perform an operation of storing (returning) the substrate W to the front-opening cassette F as a normal operation. Figure 3B The second substrate transfer mechanism 6B stores all the substrates W received from the substrate buffer 7 in the front-opening cassette FC placed on the opener 5C. Figure 3B In this case, the second substrate transfer mechanism 6B is in a standby state before the front-opening cassette FC (containing all processed substrates W) placed on the opener 5C is replaced with another front-opening cassette F by the front-opening cassette transfer mechanism 62. Therefore, the substrates W processed in the processing block 3 cannot be stored in the front-opening cassette F.

[0127] However, the front-opening wafer box buffer device 4 is also equipped with an opener 5D in addition to the opener 5C. Therefore, the second substrate conveying mechanism 6B can start to store the substrates W in the front-opening wafer box FD of the opener 5D after all the processed substrates W are stored in the front-opening wafer box FC of the opener 5C. In this way, the standby time of the second substrate conveying mechanism 6B can be reduced. In addition, the two openers 5C and 5D are arranged in the up and down direction along the lifting path of the two manipulators 21 and the advance and retreat drive unit 23 of the second substrate conveying mechanism 6B. Therefore, it is also possible not to move the two manipulators 21 and the advance and retreat drive unit 23 in the Y direction, so it is possible to prevent the conveying efficiency of the substrate W from being reduced, and move the two manipulators 21 of the second substrate conveying mechanism 6B.

[0128] Furthermore, after all the substrates W are stored in the front-opening cassette FD of the opener 5D, the second substrate transfer mechanism 6B starts storing the substrates W in the third front-opening cassette F placed on the opener 5C. That is, the second substrate transfer mechanism 6B is configured to store the substrates W alternately in front-opening cassette units with respect to the front-opening cassette F placed on the opener 5C and the front-opening cassette F placed on the opener 5D.

[0129] [Operation of Exchanging Two Front-Opening Pods F by Front-Opening Pod Transfer Mechanism 62]

[0130] Next, the replacement action of the two front-opening wafer boxes F performed by the two holding parts 65A and 65B of the front-opening wafer box conveying mechanism 62 is described. The front-opening wafer boxes F respectively placed on the four openers 5A to 5D are replaced with other front-opening wafer boxes F. In this case, in order to achieve efficiency in the conveying of the front-opening wafer boxes, the two holding parts 65A and 65B of the front-opening wafer box conveying mechanism 62 are used to perform the replacement action. In addition, conveying other than the four openers 5A to 5D, for example, conveying of the front-opening wafer box from the input port IP1 to the unprocessed substrate front-opening wafer box rack IB1 is performed using one of the two holding parts 65A and 65B.

[0131] exist Fig. 10A In the figure, the front-opening wafer box conveying mechanism 62 holds the unprocessed front-opening wafer box F6 (indicated by oblique lines) placed on the unprocessed substrate front-opening wafer box rack IB2 through the upper holding portion 65A. Then, the front-opening wafer box conveying mechanism 62 moves the held unprocessed front-opening wafer box F6 to the conveying space between the unprocessed substrate front-opening wafer box rack IB2 (rack 61) and the four openers 5A to 5D through the multi-jointed arm 66A and the driving portion 67A.

[0132] exist Fig. 10B In the embodiment, the front-opening cassette transfer mechanism 62 holds the empty front-opening cassette F4 placed on the opener 5B by the lower holding portion 65B. Then, the front-opening cassette transfer mechanism 62 moves the held empty front-opening cassette F4 from the opener 5B to the transfer space by the multi-jointed arm 66B and the driving portion 67B. In addition, the upper holding portion 65A moves to a position where the unprocessed front-opening cassette F6 does not collide with the lower holding portion 65B and the like.

[0133] exist Fig. 10CIn the embodiment, the front-opening wafer box conveying mechanism 62 places the unprocessed front-opening wafer box F6 held by the upper holding part 65A on the opener 5B instead of the empty front-opening wafer box F4. Then, the front-opening wafer box conveying mechanism 62 releases the holding by the upper holding part 65A. The upper holding part 65A moves to the conveying space. In addition, the lower holding part 65B moves to a position that does not collide with the front-opening wafer box F6 held by the upper holding part 65A.

[0134] exist Fig. 10D In the embodiment, the front-opening wafer box conveying mechanism 62 places the empty front-opening wafer box F4 held by the holding part 65B on the lower side on, for example, an empty front-opening wafer box rack EB2. Then, the front-opening wafer box conveying mechanism 62 releases the holding by the holding part 65B on the lower side. In this way, by performing the replacement action, the front-opening wafer box F can be efficiently conveyed. In addition, in this description, the unprocessed front-opening wafer box F6 is held by the holding part 65A on the upper side, and the empty front-opening wafer box F4 is held by the holding part 65B on the lower side, but the holding can also be reversed. In other words, the unprocessed front-opening wafer box F6 can also be held by the holding part 65B on the lower side, and the empty front-opening wafer box F4 can be held by the holding part 65A on the upper side.

[0135] [Operation Example 1 of the Front-Opening Pod Buffer Device 4]

[0136] Next, according to Fig.11 The flowchart shown in the figure explains the operation of the front-opening cassette buffer device 4 . Fig.11 This is a flowchart for explaining the conveying action of the front-opening wafer box F1 from the input port to the output port and the substrate conveying action. The so-called "front-opening wafer box F1" refers to a specified front-opening wafer box F. In other words, focusing on the "front-opening wafer box F1", the "front-opening wafer box F1" is used as an example to explain the conveying of the front-opening wafer box. When the front-opening wafer box is not limited to the specified front-opening wafer box F1, it is expressed as "front-opening wafer box F". Fig.12 1 is a diagram showing the operation priority order of the front-opening pod buffer device 4 .

[0137] In addition, in this description, an opener for taking out the substrate W is referred to as a "transport opener", and an opener for storing the substrate W is referred to as a "return opener".

[0138] The front opening pod F1 is transported to, for example, the input port IP1 by the external transport mechanism OHT (step S01 ). The substrate processing apparatus 1 receives an instruction and processes the substrate W received in the front opening pod F1 from the host computer of the factory (step S02 ).

[0139] The control unit 71 of the substrate processing device 1 determines whether to transport the front-opening wafer box F1 of the input port IP1 to one of the two conveying openers 5A and 5B (step S03). In this determination, whether the front-opening wafer box F is placed on each opener 5A and 5B is based on the current position of the front-opening wafer box F managed by the scheduler management software (scheduler), or based on information such as an optical sensor provided on the mounting table 12 of each of the conveying openers 5A and 5B. This determination method is also the same in the case of the two return openers 5C and 5D and the rack 61. The scheduler management software is executed by the control unit 71 of the substrate processing device 1.

[0140] If the result of determination is that the material can be conveyed to any one of the two conveying openers 5A and 5B, the process proceeds to step S04 . If the material cannot be conveyed, the process proceeds to step S05 .

[0141] In step S04, the control unit 71 further determines whether all of the following conditions are satisfied: no front-opening cassette F is configured in both the transport openers 5A and 5B, no front-opening cassette F is configured in at least one of the return openers 5C and 5D, and no front-opening cassette F (including an empty front-opening cassette) is placed in any of the four empty front-opening cassette racks EB1 to EB4. When the determination result is that all of the above conditions are satisfied (for example, refer to the following Fig.13A , Fig. 13B and Fig. 17C ), the front-opening pod transfer mechanism 62 transfers the front-opening pod F1 from the input port IP1 to a return opener (e.g., 5C) that is not loaded with the front-opening pod F, instead of the transport openers 5A and 5B (step S06). In addition, the scheduler of the substrate processing apparatus 1 and the action priority of the front-opening pod buffer device 4 are determined by the following steps (see step S07). Fig.12 ) is pre-set to transport the front-opening wafer box F1 to the transfer opener 5A (5B), and after taking out all the substrates W, transport them to the return opener 5C (5D).

[0142] When the result of determination in step S04 is that at least one condition is not satisfied, the front opening pod transfer mechanism 62 transfers the front opening pod F1 from the input port IP1 to one of the transport openers 5A and 5B that can transfer the front opening pod F1 (step S07 ).

[0143] On the other hand, in step S03, when other front-opening wafer boxes F are placed on both the transport openers 5A and 5B and the front-opening wafer box F1 cannot be transported, the control unit 71 determines whether to transport the front-opening wafer box F1 to one of the two unprocessed substrate front-opening wafer box racks IB1 and IB2, and whether to transport the front-opening wafer box F1 (step S05). When other front-opening wafer boxes F are placed on both the two unprocessed substrate front-opening wafer box racks IB1 and IB2, so the front-opening wafer box F1 cannot be transported to any of the racks IB1 and IB2, the front-opening wafer box F1 is placed on standby at the input port IP1. In addition, when the control unit 71 determines that the transport is not to be performed, the front-opening wafer box F1 is also placed on standby at the input port IP1. If the transfer is possible and the control unit 71 determines to carry out the transfer, the front opening pod transfer mechanism 62 transfers the front opening pod F1 to one of the two unprocessed substrate front opening pod racks IB1 and IB2 (step S08 ).

[0144] When the front-opening wafer box F1 is placed on one of the return openers 5C and 5D, in step S09A, the substrate W is taken out from the front-opening wafer box F1 and the taken-out substrate W is transferred to the substrate buffer 7. Usually, the two return openers 5C and 5D are used to store the substrate W in the front-opening wafer box F. However, when the substrate W can be transferred without stopping (when the condition of the step S04 is satisfied), the substrate W before processing is taken out from the unprocessed substrate front-opening wafer box F placed on one of the return openers 5C and 5D. Thus, during the period until all the processed substrates W are stored, for example, the front-opening wafer box F1 placed on the opener 5C can be placed directly without moving (step S10). Therefore, the front-opening wafer box transfer mechanism 62 can transfer other front-opening wafer boxes F, so the transfer efficiency of the front-opening wafer box F can be improved.

[0145] On the other hand, when the front-opening wafer box F1 is placed on one of the transport openers 5A and 5B, in step S09B, the substrate W is taken out from the front-opening wafer box F1 and the taken-out substrate W is transferred to the substrate buffer 7. After the first substrate transfer mechanism 6A takes out all the substrates W from the front-opening wafer box F1, the empty front-opening wafer box F1 is transferred from the transport opener 5A to any one of the four empty front-opening wafer box racks EB1 to EB4 (step S11). For example, at the moment when the first substrate W processed by the processing block 3 is returned to the substrate buffer 7, the front-opening wafer box F1 is transferred from any one of the four empty front-opening wafer box racks EB1 to EB4 to one of the two return openers 5C and 5D that can be transferred (step S12). Furthermore, the front opening pod F1 that has become empty in step S09B may be directly transferred to one of the return openers 5C and 5D without passing through the four empty front opening pod shelves EB1 to EB4.

[0146] In step S13, the second substrate transfer mechanism 6B stores the processed substrates W in, for example, an empty front-opening cassette F1 placed on the return opener 5C. That is, the processed substrates W returned to the substrate buffer 7 are transferred to the empty front-opening cassette F1. When all the substrates W are stored in the empty front-opening cassette F1, in the case where an output instruction is received in advance from the host computer (in the case where the FIFO (first-in first-out) action priority order is changed), the front-opening cassette F1 storing the processed substrates W is transferred to one of the two output ports OP1 and OP2 (steps S14 and S15).

[0147] In the case where no output instruction is received from the host computer, the control unit 71 determines whether the front-opening wafer box F1 can be transported to one of the two front-opening wafer box racks OB1 and OB2 for processed substrates, and whether the front-opening wafer box F1 is transported (step S16). When it is impossible to transport, or when the control unit 71 determines that it is not to be transported, the front-opening wafer box F1 is made to wait in the return opener 5C. When it is possible to transport and the control unit 71 determines that it is to be transported, the front-opening wafer box transport mechanism 62 transports the front-opening wafer box F1 from the return opener 5C to one of the two front-opening wafer box racks OB1 and OB2 for processed substrates (step S17).

[0148] The front-opening wafer cassette F1 transported to the processed substrate front-opening wafer cassette rack OB1 (OB2) is transported to one of the two output ports OP1 and OP2 according to the action priority of FIFO (step S15). The front-opening wafer cassette F1 transported to the output port OP1 (OP2) is transported from the output port OP1 (OP2) to the next device through the external transport mechanism OHT.

[0149] Fig.12 4 is a diagram showing the operation priority of the front-opening wafer box buffer device 4. Fig.12 As shown, the return action on the downstream side takes precedence over the delivery action on the upstream side. Fig.11 The symbols P1 to P6 shown are Fig.12 Priority 1 to priority 6 are shown as corresponding. The order (priority) of starting the processing of the front-opening wafer box F and the output order from the device 1 are carried out according to the instructions of the host computer, basically according to FIFO (first-in first-out). Fig.12The action priority order shown is applicable to the case where the front-opening wafer box transfer mechanism 62 has only a single holding part, or the case where the front-opening wafer box transfer mechanism 62 has multiple holding parts but does not perform the replacement action using the two holding parts 65A and 65B and only uses one holding part to transfer the front-opening wafer box F. Therefore, in the case of the replacement action of the four openers 5A to 5D shown in this embodiment, for example, the priority order is reversed and does not apply. Fig.12 The actions are prioritized as shown.

[0150] [Operation Example 2 of the Front-Opening Pod Buffer Device 4]

[0151] Next, an example of the operation when a plurality of front-opening wafer boxes F are transported will be described. Fig.11 The actions of the flowchart shown in FIG. Fig.12 The actions are prioritized as shown.

[0152] The external transport mechanism OHT supplies multiple front-opening wafer boxes F in sequence. The external transport mechanism OHT transports the front-opening wafer boxes F to one of the two input ports IP1 and IP2, except when it cannot transport the wafers to either of the two input ports IP1 and IP2. In addition, the order in which the front-opening wafer boxes F are transported from the external transport mechanism OHT to one of the input ports IP1 and IP2 is numbered. For example, the second front-opening wafer box F is represented as "F2", and the fifth front-opening wafer box F is represented as "F5". Figures 13A to 13D In the figures, for convenience of illustration, for example, the front-opening wafer box F1 is represented as "1".

[0153] exist Fig.13A In the process, the front opening pod F1 is transferred to the input port IP1, and the front opening pod F2 is transferred to the input port IP2. The front opening pod transfer mechanism 62 transfers the front opening pod F1 from the input port IP1 to the return opener 5C (priority 5).

[0154] exist Fig. 13B , the front-opening wafer box transport mechanism 62 transports the front-opening wafer box F2 (priority 5) from the input port IP2 to the return opener 5D. The input port IP1 obtains the front-opening wafer box F3 from the external transport mechanism OHT. The second substrate transport mechanism 6B starts to take out the substrate W from the front-opening wafer box F1 placed on the return opener 5C. The transport of the substrate W is synchronized with the transport of the front-opening wafer box F.

[0155] exist Fig. 13C, the front-opening wafer box transport mechanism 62 transports the front-opening wafer box F3 (priority 5) from the input port IP1 to the transport opener 5A. The input port IP2 obtains the front-opening wafer box F4 from the external transport mechanism OHT. The second substrate transport mechanism 6B continues to take out the substrate W from the front-opening wafer box F1 placed on the return opener 5C. In addition, because the second substrate transport mechanism 6B is in the middle of taking out the substrate W from the front-opening wafer box F1, the front-opening wafer box F2 is in the take-out waiting state.

[0156] exist Fig.13D , the front-opening wafer box transport mechanism 62 transports the front-opening wafer box F4 (priority 5) from the input port IP2 to the conveying opener 5B. The input port IP1 obtains the front-opening wafer box F5 from the external transport mechanism OHT. The second substrate transport mechanism 6B completes the removal of all substrates W from the front-opening wafer box F1 mounted on the return opener 5C. After that, the second substrate transport mechanism 6B starts the removal of substrates W from the front-opening wafer box F2 mounted on the return opener 5D. The substrates W stored in the front-opening wafer box F1 mounted on the return opener 5C are first moved back to the substrate buffer 7 after being processed by the processing block 3, which can be known (calculated) by the scheduling program management software executed by the control unit 71. Therefore, the empty front-opening wafer box F1 after all the substrates W are taken out is directly placed on the return opener 5C.

[0157] Furthermore, the processing using the processing block 3 is scheduled to be performed in the order of "front-opening wafer box F1", "front-opening wafer box F2", "front-opening wafer box F3", and "front-opening wafer box F4", and the second substrate transfer mechanism 6B is in the process of taking out the substrate W from the front-opening wafer box F2. Therefore, the front-opening wafer box F3 is in the take-out waiting state.

[0158] exist Fig.14A In the embodiment, because the four openers 5A to 5D are covered by the four front-opening wafer boxes F1 to F4, the front-opening wafer box conveying mechanism 62 conveys the front-opening wafer box F5 from the input port IP1 to the unprocessed substrate front-opening wafer box rack IB1 (priority 6). For the same reason, after the input port IP2 obtains the front-opening wafer box F6 from the external conveying mechanism OHT, the front-opening wafer box conveying mechanism 62 conveys the front-opening wafer box F6 from the input port IP2 to the unprocessed substrate front-opening wafer box rack IB2 (priority 6).

[0159] exist Fig. 14BIn the embodiment, the two input ports IP1 and IP2 obtain the front-opening wafer boxes F7 and F8 from the external transport mechanism OHT. The four openers 5A to 5D and the two unprocessed substrate front-opening wafer box racks IB1 and IB2 are blocked by the six front-opening wafer boxes F1 to F6. Therefore, the front-opening wafer box buffer device 4 cannot receive other front-opening wafer boxes F. As a result, the external transport mechanism OHT stops the supply of the front-opening wafer boxes F until one of the two input ports IP1 and IP2 becomes capable of transporting.

[0160] The second substrate transfer mechanism 6B completes the removal of all substrates W from the front-opening cassette F2 placed on the return opener 5D. After that, the first substrate transfer mechanism 6A starts the removal of substrates W from the front-opening cassette F3 placed on the transport opener 5A. The substrates W stored in the front-opening cassette F2 placed on the return opener 5D are returned to the substrate buffer 7 secondly through the front-opening cassette unit after being processed in the processing block 3, which can be known by the scheduler management software executed by the control unit 71. Therefore, the empty front-opening cassette F2 after all the substrates W are taken out is directly placed on the return opener 5D.

[0161] exist Fig. 14C In the process, the first substrate transport mechanism 6A completes the removal of all substrates W from the front-opening wafer box F3 placed on the transport opener 5A. After that, the first substrate transport mechanism 6A starts to remove the substrate W from the front-opening wafer box F4 placed on the transport opener 5B. In order to continue the processing, the substrate processing apparatus 1 transports the empty front-opening wafer box F3 from the transport opener 5A to the empty front-opening wafer box shelf EB1, and transports the front-opening wafer box F5 placed on the unprocessed substrate front-opening wafer box shelf IB1 to the transport opener 5A.

[0162] The front-opening wafer box conveying mechanism 62 first holds the front-opening wafer box F5 of the front-opening wafer box rack IB1 of the unprocessed substrate through the upper holding portion 65A, and moves the front-opening wafer box F5 from the front-opening wafer box rack IB1 of the unprocessed substrate. The holding portion 65B on the lower side is in a state of not holding the front-opening wafer box F. Afterwards, the front-opening wafer box conveying mechanism 62 replaces the empty front-opening wafer box F3 with the front-opening wafer box F5 in the conveying opener 5A. Specifically, the front-opening wafer box conveying mechanism 62 holds the empty front-opening wafer box F3 of the conveying opener 5A through the holding portion 65B on the lower side, and moves the front-opening wafer box F3 from the conveying opener 5A. Afterwards, the front-opening wafer box conveying mechanism 62 places the front-opening wafer box F5 on the conveying opener 5A through the holding portion 65A on the upper side. After the front opening pod F5 is placed, the front opening pod transfer mechanism 62 places the empty front opening pod F3 on the empty front opening pod shelf EB1 through the lower holding portion 65B.

[0163] exist Fig.14D In the example, since the two transport openers 5A and 5B are blocked by the two front opening pods F5 and F4, the front opening pod transfer mechanism 62 transfers the front opening pod F7 from the input port IP1 to the unprocessed substrate front opening pod rack IB1 (priority 6).

[0164] exist Fig.15A In the process, the first substrate transport mechanism 6A completes the removal of all substrates W from the front-opening wafer box F4 placed on the transport opener 5B. After that, the first substrate transport mechanism 6A starts to remove the substrate W from the front-opening wafer box F5 placed on the transport opener 5A. In order to continue the processing, the substrate processing apparatus 1 transports the empty front-opening wafer box F4 from the transport opener 5B to the empty front-opening wafer box rack EB2, and transports the front-opening wafer box F6 placed on the unprocessed substrate front-opening wafer box rack IB2 to the opener 5B.

[0165] The front-opening wafer box conveying mechanism 62 first holds the front-opening wafer box F6 of the front-opening wafer box rack IB2 of the unprocessed substrate through the upper holding portion 65A, and moves the front-opening wafer box F6 from the front-opening wafer box rack IB2 of the unprocessed substrate. The holding portion 65B on the lower side is in a state where no front-opening wafer box F is held. Afterwards, the front-opening wafer box conveying mechanism 62 replaces the empty front-opening wafer box F4 with the front-opening wafer box F6 in the conveying opener 5B. Specifically, the front-opening wafer box conveying mechanism 62 holds the empty front-opening wafer box F4 of the conveying opener 5B through the holding portion 65B on the lower side, and moves the front-opening wafer box F4 from the conveying opener 5B. Afterwards, the front-opening wafer box conveying mechanism 62 places the front-opening wafer box F6 on the conveying opener 5B through the holding portion 65A on the upper side. After the front opening pod F6 is placed, the front opening pod transfer mechanism 62 places the empty front opening pod F4 on the empty front opening pod shelf EB2 via the lower holding portion 65B.

[0166] exist Fig. 15B In the figure, because the two transport openers 5A and 5B are blocked by the two front-opening cassettes F5 and F6, the front-opening cassette transfer mechanism 62 transfers the front-opening cassette F8 from the input port IP2 to the unprocessed substrate front-opening cassette rack IB2 (priority 6).

[0167] exist Fig. 15C , the first substrate transport mechanism 6A completes the removal of all substrates W from the front-opening cassette F5 placed on the transport opener 5A. Thereafter, the first substrate transport mechanism 6A starts the removal of substrates W from the front-opening cassette F6 placed on the transport opener 5B. In addition, the front-opening cassette transport mechanism 62 transports the empty front-opening cassette F5 to the empty front-opening cassette shelf EB3.

[0168] The front-opening wafer box conveying mechanism 62 first holds the front-opening wafer box F7 of the front-opening wafer box rack IB1 of the unprocessed substrate through the upper holding portion 65A, and moves the front-opening wafer box F7 from the front-opening wafer box rack IB1 of the unprocessed substrate. The holding portion 65B on the lower side is in a state where no front-opening wafer box F is held. Afterwards, the front-opening wafer box conveying mechanism 62 replaces the empty front-opening wafer box F5 with the front-opening wafer box F7 in the conveying opener 5A. Specifically, the front-opening wafer box conveying mechanism 62 holds the empty front-opening wafer box F5 of the conveying opener 5A through the holding portion 65B on the lower side, and moves the front-opening wafer box F5 from the conveying opener 5A. Afterwards, the front-opening wafer box conveying mechanism 62 places the front-opening wafer box F7 on the conveying opener 5A through the holding portion 65A on the upper side. After placing the front opening pod F7, the front opening pod transfer mechanism 62 places the empty front opening pod F5 on the empty front opening pod shelf EB3 through the lower holding portion 65B. The input port IP2 obtains the front opening pod F10 from the external transfer mechanism OHT.

[0169] In addition, Fig.13D In the process, all substrates W are taken out from the front-opening wafer box F1. The taken-out substrates W are sent to the processing block 3 via the substrate buffer 7. The processing block 3 performs a predetermined process on the substrate W. The processed substrates W that have been subjected to the predetermined process in the processing block 3 are moved back to the substrate buffer 7 by the third substrate transfer mechanism 33. The second substrate transfer mechanism 6B stores the substrates W that have been moved back to the substrate buffer 7 in the front-opening wafer box F1.

[0170] exist Fig.15D In the embodiment, the second substrate transport mechanism 6B stores all processed substrates W in the front-opening cassette F1 mounted on the return opener 5C. Thereafter, the second substrate transport mechanism 6B starts storing substrates W in the front-opening cassette F2 mounted on the return opener 5D. Thereafter, assuming that all processed substrates W are stored in the front-opening cassette F2 mounted on the return opener 5D, the second substrate transport mechanism 6B starts storing processed substrates W in the front-opening cassette F3 mounted on the return opener 5C.

[0171] The front-opening wafer box conveying mechanism 62 conveys the processed front-opening wafer box F1 to the output port OP1. The front-opening wafer box conveying mechanism 62 first holds the empty front-opening wafer box F3 placed on the empty front-opening wafer box rack EB1 through the upper holding portion 65A, and moves the empty front-opening wafer box F3 from the empty front-opening wafer box rack EB1. The lower holding portion 65B is in a state where no front-opening wafer box F is held. Afterwards, the front-opening wafer box conveying mechanism 62 replaces the front-opening wafer box F1 containing the processed substrate W with the empty front-opening wafer box F3 in the return opener 5C. Specifically, the front-opening wafer box conveying mechanism 62 holds the front-opening wafer box F1 of the return opener 5C through the lower holding portion 65B, and moves the front-opening wafer box F1 from the return opener 5C. Afterwards, the front-opening cassette transfer mechanism 62 places the empty front-opening cassette F3 on the return opener 5C through the upper holding portion 65A. After placing the empty front-opening cassette F3, the front-opening cassette transfer mechanism 62 places the processed front-opening cassette F1 on the output port OP1 through the lower holding portion 65B.

[0172] Furthermore, since the two transport openers 5A and 5B are blocked by the two front opening pods F7 and F6, the front opening pod transfer mechanism 62 transfers the front opening pod F9 from the input port IP1 to the unprocessed substrate front opening pod shelf IB1 (priority 6).

[0173] exist Fig.16 In the embodiment, the front opening cassette F1 placed on the output port OP1 is transferred from the output port OP1 by the external transfer mechanism OHT.

[0174] In addition, Fig.16 After the status shown Fig.17A In the embodiment, when the front-opening wafer box F4 containing the processed substrate W cannot be transferred to any one of the two output ports OP1 and OP2, the front-opening wafer box transfer mechanism 62 transfers the front-opening wafer box F4 from the return opener 5D to one of the two front-opening wafer box racks OB1 and OB2 for processed substrates (for example, symbol OB1). In addition, in order to improve the efficiency of the front-opening wafer box transfer at this time, the front-opening wafer box transfer mechanism 62 replaces the front-opening wafer box F4 with an empty front-opening wafer box F6 using two holding parts 65A and 65B in the return opener 5D.

[0175] Moreover, in Fig.17A After the status shown Fig. 17BIn the process, when the front opening cassette F6 storing the processed substrate W cannot be transported to any of the two output ports OP1, OP2 and the two processed substrate front opening cassette racks OB1, OB2, it cannot be transported any more. Therefore, the front opening cassette F6 waits in the return opener 5D until one of the two processed substrate front opening cassette racks OB1, OB2 becomes empty or one of the two output ports OP1, OP2 becomes empty and takes precedence over the front opening cassettes F4, F5.

[0176] Moreover, from Fig. 17B As time passes, when the input port IP1 acquires the front opening cassette F16, if the front opening cassette F16 is transferred to the return opener 5D instead of the transport openers 5A and 5B, the front opening cassette transfer efficiency is improved. Fig. 17C As shown, when all the conditions are satisfied that the front-opening wafer box F is not placed on both of the two transport openers 5A and 5B, the front-opening wafer box F is not placed on any of the two return openers 5C and 5D, and the front-opening wafer box F is not placed on any of the four empty front-opening wafer box racks EB1 to EB4, the front-opening wafer box transfer mechanism 62 moves to one of the two return openers 5C and 5D on which the front-opening wafer box F is not placed ( Fig. 17C In this case, for example, after all processed substrates W are stored in the front-opening cassette F15 placed on the return opener 5C, the substrates W are taken out from the return opener 5D.

[0177] According to the present embodiment, the first substrate conveying mechanism 6A and the second substrate conveying mechanism 6B respectively convey substrates W of the front-opening wafer box F, which are respectively placed on two openers 5A and 5B arranged in the vertical direction, rather than two openers 5A and 5C arranged in the horizontal direction. Therefore, even when the openers are added, since the substrate W is conveyed by lifting and rotating instead of sliding the robot 21 that can move forward and backward in the horizontal direction, the substrate W can be simply conveyed. Therefore, the standby time for substrate conveying can be reduced, and the substrate conveying efficiency can be prevented from being reduced. As a result, the processing throughput of substrate processing can be increased.

[0178] In addition, after taking out all substrates from the front-opening cassettes F of, for example, the opener 5A mounted on the first opener row 9, the first substrate transport mechanism 6A takes out substrates W from other front-opening cassettes F mounted on the opener 5B of the first opener row 9. After storing all substrates in the front-opening cassettes F of the opener 5C mounted on the second opener row 10, the second substrate transport mechanism 6B stores F substrates W in other front-opening cassettes mounted on the opener 5D of the second opener row 10.

[0179] Thus, the first substrate transfer mechanism 6A can take out substrates W from other front-loading pods F after taking out all substrates W from the front-loading pods F. Also, the second substrate transfer mechanism 6B can store substrates W in other front-loading pods F after storing all substrates W in the front-loading pods F.

[0180] In addition, the substrate processing apparatus 1 includes a front-opening wafer box conveying mechanism 62, which is provided on the side opposite to the first substrate conveying mechanism 6A and the second substrate conveying mechanism 6B across the first opener row 9 and the second opener row 10, and conveys the front-opening wafer box F. The front-opening wafer box conveying mechanism 62 replaces the front-opening wafer box F after all the substrates W are taken out from the front-opening wafer box F by the first substrate conveying mechanism 6A with another front-opening wafer box F containing the substrates W. In addition, the front-opening wafer box conveying mechanism 62 replaces the front-opening wafer box F after all the substrates W are contained in the front-opening wafer box F by the second substrate conveying mechanism 6B with another front-opening wafer box F that does not contain the substrates W (empty front-opening wafer box).

[0181] For example, if the two openers 5C and 5D are arranged in the vertical direction, it may be difficult for the operator to replace the upper opener 5C because the operator's hand cannot reach the upper opener 5C. However, since the front-opening cassette transport mechanism 62 transports the front-opening cassette F, the transport of the front-opening cassette F becomes easy. In addition, since the front-opening cassette F after all the substrates W are taken out of the front-opening cassette F is replaced with another front-opening cassette F storing the substrates W, more unprocessed substrates W can be supplied to the substrate processing apparatus 1. Moreover, since the front-opening cassette F after all the substrates W are stored in the front-opening cassette F is replaced with another front-opening cassette F (empty front-opening cassette F) that does not store the substrates W, a plurality of processed substrates W that have been processed by the processing block 3 can be moved back to the front-opening cassette F.

[0182] In addition, the front-opening cassette buffer device 4 includes four empty front-opening cassette racks EB1 to EB4 capable of loading empty front-opening cassettes F. When all the conditions are satisfied that the front-opening cassette F is not loaded on the two openers 5A and 5B of the first opener row 9, the front-opening cassette F is not loaded on at least one of the two openers 5C and 5D of the second opener row 10, and the front-opening cassette F is not loaded on the four empty front-opening cassette racks EB1 to EB4, the front-opening cassette transfer mechanism 62 transfers a specific front-opening cassette F to the opener 5C in the second opener row 10 where the front-opening cassette F is not loaded. The second substrate transfer mechanism 6B takes out the substrate W from the specific front-opening cassette F, and then stores the processed substrate W after being processed in the processing block 3 in the specific front-opening cassette F. The front-opening wafer box transport mechanism 62 keeps the specific front-opening wafer box F at the loading position (opener 5C) of the specific front-opening wafer box F from the time when all the substrates W are taken out from the specific front-opening wafer box F by the second substrate transport mechanism 6B until all the processed substrates W are stored in the specific front-opening wafer box F.

[0183] Normally, the second substrate transport mechanism 6B is set to store the substrate W in a front-opening wafer box F, such as an opener 5C, which is placed in the second opener row 10. However, when the specified conditions are met, the second substrate transport mechanism 6B takes out the substrate W from the specific front-opening wafer box F, and then stores the processed substrate W in the specific front-opening wafer box F. That is, the second substrate transport mechanism 6B performs an action different from the usual substrate transport action. Thus, after all the substrates W are taken out from the specific front-opening wafer box F until all the substrates W are stored, the specific front-opening wafer box F can be kept at the loading position (for example, returned to the opener 5C). Therefore, the front-opening wafer box transport mechanism 62 can transport front-opening wafer boxes F other than the specific front-opening wafer box F, so the transport efficiency of the front-opening wafer box F can be improved. As a result, the transport waiting time of the front-opening wafer box F is reduced, so the processing capacity of the substrate processing can be increased.

[0184] The present invention is not limited to the above-described embodiment, and can be modified as described below.

[0185] (1) In the above-described embodiment, the first substrate transfer mechanism 6A, the second substrate transfer mechanism 6B, and the third substrate transfer mechanism 33 of the processing block 3 are configured to transfer respective substrates while allowing the respective robots to enter the substrate buffer 7 at the same time. During the respective substrate transfers by the first substrate transfer mechanism 6A, the second substrate transfer mechanism 6B, and the third substrate transfer mechanism 33 of the processing block 3, the respective robots 21 and 41 enter at the same time to place the substrate W or take the substrate W. Thus, there is no need to wait for the time for other robots to enter the substrate buffer 7 and retreat, thereby improving the transfer efficiency of the substrate W. As a result, the processing throughput of the substrate processing can be improved.

[0186] That is, during the process of the first substrate transfer mechanism 6A, the second substrate transfer mechanism 6B, and the third substrate transfer mechanism 33 performing their respective substrate transfers, there may be a situation where the two robots 21 of the first substrate transfer mechanism 6A, the two robots 21 of the second substrate transfer mechanism 6B, and the one robot 41 of the third substrate transfer mechanism 33 simultaneously enter the substrate buffer 7. In addition, these robots 21 and 41 do not always enter simultaneously.

[0187] exist Fig.18A For example, in order to transfer two substrates W to the transfer buffer SBF1, the two robots 21A and 21B of the first substrate transfer mechanism 6A enter the substrate buffer 7. At the same time, in order to transfer two substrates W from the return buffer RBF1, the two robots 21A and 21B of the second substrate transfer mechanism 6B may also enter the substrate buffer 7. In addition, in order to transfer (obtain) one substrate W from the transfer buffer SBF1, one robot 41 of the third substrate transfer mechanism 33 may also enter the substrate buffer 7.

[0188] Similarly, in Fig.18B For example, in order to transfer two substrates W to the transport buffer SBF1, the two robots 21A and 21B of the first substrate transport mechanism 6A enter the substrate buffer 7. At the same time, in order to transfer two substrates W from the return buffer RBF1, the two robots 21A and 21B of the second substrate transport mechanism 6B may also enter the substrate buffer 7. In addition, in order to transfer (hand over) one substrate W to the return buffer RBF1, one robot 41 of the third substrate transport mechanism 33 may also enter the substrate buffer 7.

[0189] In addition, Figure 1 In addition to the two robots 21 of the first substrate transfer mechanism 6A (see Figure 2), and the two robots 21 of the second substrate transfer mechanism 6B, the four robots 41 of the four third substrate transfer mechanisms (i.e., a total of eight robots) can also simultaneously enter the substrate buffer 7. In addition, for example, the control unit 71 controls the robots 21 and 41 based on the position information of the respective advance and retreat drive units 23 and 42 so that the robots 21 and 41 do not interfere with each other.

[0190] (2) In the above-described embodiment and variation (1), the processing block 3 includes four coating processing layers 31A to 31D, but may include two or more coating processing layers. In addition, the processing block 3 may include four developing processing layers for supplying a developer to the substrate W for developing processing instead of the four coating processing layers 31A to 31D.

[0191] (3) In the above-described embodiment and each variation, the substrate processing apparatus 1 includes a processing block 3 having four coating processing layers 31A to 31D. In this regard, for example Fig.19 As shown, the substrate processing apparatus 1 may also include a coating block 91 , a developing block 92 , and an interface block 93 .

[0192] The coating block 91 includes two coating treatment layers 91A and 91B. The two coating treatment layers 91A and 91B each include one third substrate conveying device, a coating treatment unit SC of 2 rows and 2 sections, and a heat treatment unit of 3 rows and 5 sections. The developing block 92 includes two developing treatment layers 92A and 92B. The two developing treatment layers 92A and 92B each include one third substrate conveying device, a developing treatment unit SC of 2 rows and 2 sections, and a heat treatment unit of 3 rows and 5 sections. The interface block 93 includes two substrate conveying mechanisms, a plurality of heat treatment units, and a plurality of cleaning treatment units. In addition, the interface block 93 transfers the substrate W to the external exposure device EXP. In addition, the configuration of the coating block 91 and the developing block 92 may also be reversed.

[0193] (4) In the embodiment and each variation, the first opener row 9 includes two openers 5A and 5B, and the second opener row 10 includes two openers 5C and 5D. In this regard, the first opener row 9 and the second opener row 10 may each include three or more openers. In this case, the baffle 16 may be moved in the left-right direction (Y direction) instead of in the up-down direction. Thus, even if three or more openers are arranged in the up-down direction, the height of the loading block can be suppressed.

[0194] For example, the first opener row 9 includes three openers 5A, 5B, and 5E. In this case, the first substrate transport mechanism 6A may take out substrates W in front-opening cassette units by cycling through the order of “opener 5A,” “opener 5B,” and “opener 5E.”

[0195] (5) In the above-described embodiment and various variations, two openers 5A and 5B are used as transport openers, and two openers 5C and 5D are used as return openers, but the functions may be reversed. In other words, two openers 5C and 5D may be used as transport openers, and two openers 5A and 5B may be used as return openers. In this case, Fig.13A , Fig. 13B In the process, the front opening cassettes F1 and F2 are respectively transported to the return openers 5A and 5B, and the substrates W are taken out in sequence.

[0196] (6) In the above-described embodiment and each variation, two openers 5A and 5B are used as transport openers, and two openers 5C and 5D are used as return openers. In this respect, the four openers 5A to 5D may also be used as transport openers and return openers.

[0197] Even in this case, after the first substrate transport mechanism 6A has transported all substrates W to the front-opening cassettes F mounted on the first opener row 9, for example, the opener 5A, it transports substrates W to other front-opening cassettes F mounted on the opener 5B of the first opener row 9. After the second substrate transport mechanism 6B has transported all substrates W to the front-opening cassettes F mounted on the opener 5C of the second opener row 10, it transports substrates W to the front-opening cassettes F mounted on the opener 5D of the second opener row 10.

[0198] Thus, each of the first substrate transfer mechanism 6A and the second substrate transfer mechanism 6B can transfer substrates W to other front opening pods F after transferring all the substrates W to the front opening pods F.

[0199] (7) In the above-described embodiment and various variations, Fig.11 In the process, after the determination of step S03, the determination of step S04 is performed. In this respect, the determination of step S03 may be performed after the determination of step S04. At this time, if all the conditions are satisfied in the determination of step S04 (yes (YES)), the process proceeds to step S06, and if not all the conditions are satisfied (no (NO)), the process proceeds to step S03. Then, if it is determined in the determination of step S03 that it can be transported (yes), the process proceeds to step S07, and if it is determined that it cannot be transported (no), the process proceeds to step S05. In addition, in the case of this variation, in order to determine the order of steps S04 and S03, the arrow returning from step S08 may also return to the state before step S04.

[0200] (8) In each of the above embodiments and variations, the action can be replaced as follows: Fig.11In step S04, when the front-opening cassette F is not mounted on any of the four openers 5A to 5D and the empty front-opening cassette racks EB1 to EB4 (see Fig.13A ), the front-opening wafer box transport mechanism 62 transports the front-opening wafer box F to both of the two return openers 5C and 5D, and then transports the front-opening wafer box F to either of the two transport openers 5A and 5B (refer to Figures 13A to 13C ).

[0201] The present invention can be implemented in other specific forms without departing from the spirit or essence of the present invention. Therefore, the scope of the invention should be determined not by the above description but by reference to the appended claims.

Claims

1. A substrate processing device for processing a substrate, characterized in that Contains the following elements: A loading block for delivering and transporting substrates to a carrier capable of accommodating a plurality of substrates; and a processing block for performing prescribed processing on the substrate; The loading block has: The first carrier loading section array has two or more carrier loading sections arranged in the up-down direction; A second carrier loading section array having two or more carrier loading sections arranged in the up-down direction and arranged in parallel with the first carrier loading section array in the horizontal direction; A substrate buffer section for placing a plurality of substrates between the loading block and the processing block; a first substrate transfer mechanism for transferring a substrate between the carriers placed on each of the two or more carrier placement sections of the first carrier placement section row and the substrate buffer section; and a second substrate transfer mechanism for transferring a substrate between the carriers placed on each of the two or more carrier placement sections of the second carrier placement section row and the substrate buffer section; The first substrate transfer mechanism and the second substrate transfer mechanism each include: a robot capable of moving forward and backward in a horizontal direction and holding a substrate; and a lifting and rotating driving unit for lifting the robot along a support portion extending in a vertical direction and rotating the robot around an axis along the support portion; and The horizontal position of the lifting and rotating driving unit is fixed; The substrate processing apparatus further comprises: a carrier transport mechanism, the carrier transport mechanism being provided on the opposite side of the first substrate transport mechanism and the second substrate transport mechanism across the first carrier placement section array and the second carrier placement section array, and transporting the carrier; and an empty carrier rack capable of holding a carrier without accommodating a substrate; and The first substrate transfer mechanism takes out substrates from other carriers in the first carrier placement section array after taking out all substrates from the carriers placed on a predetermined carrier placement section in the first carrier placement section array. The second substrate transfer mechanism stores substrates in other carriers of the second carrier placement section array after all substrates are stored in the carriers placed in the specified carrier placement section of the second carrier placement section array; and The carrier transfer mechanism replaces the carrier after all substrates are taken out from the carrier by the first substrate transfer mechanism with another carrier storing substrates, and replaces the carrier after all substrates are stored in the carrier by the second substrate transfer mechanism with another carrier not storing substrates; and In a case where the carrier is not loaded on any of the two or more carrier loading sections in the first carrier loading section row, in a case where the carrier is not loaded on at least one of the two or more carrier loading sections in the second carrier loading section row, and in a case where the carrier is not loaded on the empty carrier rack, the carrier transport mechanism transports a specific carrier to any one of the carrier loading sections in the second carrier loading section row that does not load the carrier. The second substrate transfer mechanism takes out the substrate from the specific carrier, and then stores the processed substrate processed by the processing block into the specific carrier. The carrier transfer mechanism keeps the specific carrier at the specific carrier placement position during a period from when all substrates are taken out from the specific carrier by the second substrate transfer mechanism to when all processed substrates are stored in the specific carrier.

2. The substrate processing apparatus according to claim 1, wherein The processing block has a plurality of processing layers arranged in a vertical direction. The plurality of processing layers are respectively provided with a third substrate transport mechanism for transporting the substrate; and The first substrate transfer mechanism, the second substrate transfer mechanism, and the third substrate transfer mechanism are incorporated so that the robots included in the respective mechanisms simultaneously enter the substrate buffer portion to transfer the respective substrates.

3. The substrate processing apparatus according to claim 1, wherein The processing block has a plurality of processing layers arranged in a vertical direction. The plurality of processing layers are respectively provided with a third substrate transport mechanism for transporting the substrate; A transport space extending linearly in the horizontal direction for movement of the third substrate transport mechanism; and A plurality of liquid processing units are arranged along the transfer space and in a horizontal direction relative to the transfer space, and supply a processing liquid to process the substrate; The liquid processing units are not arranged in multiple stages overlapping each other, but are arranged in one stage.

4. A control method for a substrate processing apparatus, the substrate processing apparatus comprising: a processing block for performing a predetermined process on a substrate; and The loading block is used to transfer and convey substrates to a carrier capable of accommodating a plurality of substrates, and has a first substrate conveying mechanism, a second substrate conveying mechanism, and a substrate buffer, wherein the substrate buffer is used to convey substrates between the loading block and the processing block and to carry a plurality of substrates; the control method of the substrate processing device includes the following elements: a first substrate transfer step of transferring a substrate between the carriers carried by each of two or more carrier loading sections arranged in the vertical direction in the first carrier loading section array and the substrate buffer section by the first substrate transfer mechanism; and A second substrate transfer step of transferring a substrate between the carriers carried by two or more carrier carrying sections arranged in the up-down direction and the substrate buffer section by the second substrate transfer mechanism; The second carrier loading section row and the first carrier loading section row are arranged in parallel in the horizontal direction; and In the first substrate transfer step and the second substrate transfer step, the first substrate transfer mechanism and the second substrate transfer mechanism respectively use a robot and a lifting and rotating driving unit, and transfer the substrate in a state where the horizontal position of the lifting and rotating driving unit is fixed, the robot can move forward and backward in the horizontal direction and hold the substrate, and the lifting and rotating driving unit makes the robot move up and down along a support portion extending in the up-down direction, and rotates the robot around an axis along the support portion; The substrate processing apparatus further comprises: a carrier transport mechanism, the carrier transport mechanism being provided on the opposite side of the first substrate transport mechanism and the second substrate transport mechanism across the first carrier placement section array and the second carrier placement section array, and transporting the carrier; and an empty carrier rack capable of holding a carrier without accommodating a substrate; and The control method of the substrate processing device further comprises the following steps: After all substrates are taken out from the carriers placed on the specified carrier placement sections of the first carrier placement section array by the first substrate transfer mechanism, substrates are taken out from other carriers of the first carrier placement section array, After all substrates are stored in the carriers placed on the specified carrier placement sections of the second carrier placement section array by the second substrate transfer mechanism, substrates are stored in other carriers of the second carrier placement section array; The carrier conveying mechanism replaces the carrier after all substrates are taken out from the carrier by the first substrate conveying mechanism with another carrier containing substrates, and the carrier conveying mechanism replaces the carrier after all substrates are contained in the carrier by the second substrate conveying mechanism with another carrier not containing substrates; In a case where the carrier is not loaded on any of the two or more carrier loading sections in the first carrier loading section row, in a case where the carrier is not loaded on at least one of the two or more carrier loading sections in the second carrier loading section row, and in a case where the carrier is not loaded on the empty carrier rack, a specific carrier is transported to any one of the carrier loading sections in the second carrier loading section row that does not load the carrier by the carrier transport mechanism. The second substrate transfer mechanism takes out the substrate from the specific carrier, and then stores the processed substrate processed in the processing block in the specific carrier. The carrier transfer mechanism allows the specific carrier to stay at the specific carrier placement position during a period from when all substrates are taken out from the specific carrier by the second substrate transfer mechanism until all processed substrates are stored in the specific carrier.

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