A TX packaging structure of an optical module

Abstract

A TX packaging structure of an optical module includes a base, a first cover, and a circuit board, characterized in that: a first through hole is provided in the middle of the circuit board, the upper end of the base passes through the first through hole of the circuit board from bottom to top and is sealed and fixed to the circuit board, an optical device is provided on the base, an electronic component is provided on the circuit board, the optical device on the base is electrically connected to the electronic component on the circuit board through a gold wire, and the first cover is sealed on the upper surface of the circuit board to seal the optical device and the electronic component in a first sealed chamber formed by the circuit board, the base, and the first cover. The TX packaging structure of the optical module does not require a silicon substrate assembly and a soft board, is simple to manufacture, and has low cost.

Description

Technical Field

[0001] The present invention relates to the field of optical communication technology, and in particular to a TX packaging structure of an optical module. Background Art

[0002] The existing TX packaging structure of optical modules, such as Figure 1 As shown, it includes a metal base cover 1a, a metal base shell 2a, a circuit board 3a, a soft board 4a, a silicon substrate assembly 5a, a metal base 6a, and an adapter 7a; the metal base cover 1a, the metal base shell 2a, the metal base 6a, and the silicon substrate assembly 5a are sealed into a cavity; optical devices are arranged on the metal base 6a, such as a light source 8a, a lens 9a, etc., and electronic components are arranged on the silicon substrate assembly 5a, such as a driving chip; the circuit board 3a and the adapter 7a are both arranged outside the cavity, and the circuit board 3a is also electrically connected to the electronic components on the silicon substrate assembly 5a through the soft board 4a.

[0003] However, the existing TX packaging structure of the optical module has the following technical problems: a silicon substrate assembly 5a needs to be manufactured, but the manufacturing of the silicon substrate assembly 5a is complex and costly; a flexible board 4a needs to be added to realize the electrical connection between the circuit board 3a and the electronic components on the silicon substrate assembly 5a, which complicates the operation and increases the cost. Summary of the invention

[0004] The technical problem to be solved by the present invention is to provide a TX packaging structure of an optical module which does not require a silicon substrate assembly and a flexible board and is simple to manufacture and low in cost.

[0005] The technical solution of the present invention is: a TX packaging structure of an optical module, including a base, a first cover body, and a circuit board, characterized in that: a first through hole is provided in the middle of the circuit board, the upper end of the base passes through the first through hole of the circuit board from bottom to top and is sealed and fixed to the circuit board, an optical device is provided on the base, and an electronic component is provided on the circuit board. The optical device on the base is electrically connected to the electronic component on the circuit board through a gold wire, and the first cover body is sealed on the upper surface of the circuit board to seal the optical device and the electronic component in a first closed chamber formed by the circuit board, the base, and the first cover body.

[0006] After adopting the above structure, the present invention has the following advantages:

[0007] The TX packaging structure of the optical module of the present invention directly assembles the base in the first through hole of the circuit board, without the need for a silicon substrate assembly and a soft board, and is simple to manufacture and low in cost. After the soft board is eliminated, the optical device on the base is connected to the electronic components on the circuit board through gold wires, and the high-speed routing is shorter and the high-speed characteristics are better.

[0008] Preferably, the device further comprises a second cover body disposed on the circuit board and located within the first cover body, wherein the second cover body is hermetically covered on the base, and is used to seal the optical device on the base within a second sealed chamber formed by the circuit board, the metal base, and the second cover body. This arrangement forms a first seal using the circuit board, the base, and the second cover body, and forms a second seal using the circuit board and the first cover body, and has good sealing performance.

[0009] Preferably, a positioning structure is provided between the first cover body and the second cover body, which can make the internal structure of the product more firmly and stably installed.

[0010] Preferably, the first cover and the base are both made of metal material. This arrangement can make the product housing more solid and have the functions of heat dissipation and shielding.

[0011] Preferably, the second cover is made of plastic. This arrangement can reasonably reduce the overall weight of the product while ensuring the firmness of the shell, and can better ensure the optical performance of the optical device.

[0012] Preferably, a first copper-exposed area is provided at a position where the circuit board is connected to the first cover, and the circuit board is sealed and welded to the first cover at the first copper-exposed area by soldering. This arrangement can reliably seal and connect the first cover to the circuit board.

[0013] Preferably, the base is narrow at the top and wide at the bottom to form a step surface that contacts the bottom surface of the circuit board. The circuit board is provided with a second copper-exposed area at a position that contacts the base. The circuit board is sealed and welded to the base at the second copper-exposed area by soldering. This arrangement can reliably connect the base and the circuit board together in a sealed manner, thereby ensuring the sealing performance of the bottom.

[0014] Preferably, it further comprises an optical fiber line, the first cover is provided with a first groove for the optical fiber line to pass through, the base is also provided with a second groove for the optical fiber line to pass through, one end of the optical fiber line extends into the first closed chamber through the first groove and is fixed in the second groove of the base, and the other end is located outside the first closed chamber. This arrangement can facilitate the arrangement of the optical fiber line and make the overall structure more concise.

[0015] Preferably, the inner side wall of the first groove of the first cover body is also provided with a plurality of glue dispensing grooves, and the optical fiber is fixed to the first cover body by glue dispensing grooves in the first groove. This arrangement can ensure reliable fixation and sealing performance of the optical fiber.

[0016] Preferably, the optical fiber is metallized and soldered to the outer wall of the first cover body. This arrangement can ensure reliable fixation and sealing performance of the optical fiber. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 A half-section diagram of the TX packaging structure of an existing optical module;

[0018] Figure 2 It is an exploded schematic diagram of the TX packaging structure of the optical module of the present invention;

[0019] Figure 3 A half-section diagram of the TX packaging structure of the optical module of the present invention;

[0020] Figure 4 A schematic diagram of a first copper-exposed area on the upper surface of a circuit board of the present invention;

[0021] Figure 5 A schematic diagram of the second copper exposed area on the lower surface of the circuit board of the present invention;

[0022] In the prior art figure: 1a-metal base cover, 2a-metal base housing, 3a-circuit board, 4a-flexible board, 5a-silicon substrate assembly, 6a-metal base, 7a-adapter, 8a-light source, 9a-lens;

[0023] In the figure of the present invention: 1-base, 2-first cover, 3-circuit board, 4-first through hole, 5-optical device, 6-light source, 7-lens, 9-first closed chamber, 10-second cover, 11-second closed chamber, 12-positioning structure, 13-card slot, 14-positioning block, 15-first copper exposed area, 16-step surface, 17-second copper exposed area, 18-optical fiber, 19-first groove, 22-second groove, 23-glue dispensing groove. DETAILED DESCRIPTION

[0024] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0025] Example:

[0026] like Figure 2 , Figure 3 As shown, a TX packaging structure of an optical module includes a base 1, a first cover 2, and a circuit board 3, wherein a first through hole 4 is provided in the middle of the circuit board 3, the upper end of the base 1 passes through the first through hole 4 of the circuit board 3 from bottom to top and is sealed and fixed to the circuit board 3, an optical device 5 is provided on the base 1, the optical device 5 is such as a light source 6 and a lens 7, the circuit board 3 is provided with electronic components, such as a driver chip, the optical device 5 on the base 1 is electrically connected to the electronic components on the circuit board 3 through gold wires, and the first cover 2 is sealed on the upper surface of the circuit board 3 to seal the optical device 5 and the electronic components in a first sealed chamber 9 formed by the circuit board 3, the base 1, and the first cover 2.

[0027] The TX packaging structure of the optical module of the present invention directly assembles the base 1 in the first through hole 4 of the circuit board 3, without the need for a silicon substrate assembly and a soft board, and is simple to manufacture and low in cost. After the soft board is eliminated, the optical device 5 on the base 1 is connected to the electronic components on the circuit board 3 through gold wires, so the high-speed routing is shorter and the high-speed characteristics are better.

[0028] As a preference, it further includes a second cover 10 disposed on the circuit board 3 and located inside the first cover 2, the second cover 10 being sealed on the base 1, and being used to seal the optical device 5 on the base 1 in a second sealed chamber 11 formed by the circuit board 3, the metal base 1, and the second cover 10; in this embodiment, a portion of the bottom of the second cover 10 contacts the base 1, and another portion contacts the circuit board 3, and the bottom of the second cover 10 can be sealed and connected with the base 1 and the circuit board 3 by dispensing glue; in fact, it is also possible to set the bottom of the second cover 10 to contact the base 1 entirely, or to contact the circuit board 3 entirely, but both situations are not as compact as the first situation. This setting uses the circuit board 3, the base 1, and the second cover 10 to form a first seal, and uses the circuit board 3 and the first cover 2 to form a second seal, and has better sealing performance.

[0029] Preferably, a positioning structure 12 is provided between the first cover body 2 and the second cover body 10. The positioning structure 12 is as shown in FIG. Figure 3 As shown, a structure of a card slot 13 plus a positioning block 14 can be adopted. This arrangement can make the internal structure of the product more firmly and stably installed.

[0030] Preferably, the first cover 2 and the base 1 are both made of metal material. This arrangement can make the product housing more solid and have the functions of heat dissipation and shielding.

[0031] Preferably, the second cover 10 is made of plastic. This arrangement can reasonably reduce the overall weight of the product while ensuring the firmness of the shell, and can better ensure the optical performance of the optical device 5.

[0032] Preferably, a first copper exposed area 15 is provided at a position where the circuit board 3 is connected to the first cover 2. Figure 4 As shown, the circuit board 3 is sealed and welded to the first cover body 2 by soldering at the first copper exposed area 15. This arrangement can reliably seal and connect the first cover body 2 and the circuit board 3 together.

[0033] Preferably, the base 1 is narrow at the top and wide at the bottom to form a step surface 16 that contacts the lower surface of the circuit board 3. The circuit board 3 is provided with a second copper-exposed area 17 at a position that contacts the base 1. Figure 5As shown, the circuit board 3 is tightly welded to the base 1 by soldering at the second copper exposed area 17. This arrangement can reliably tightly connect the base 1 and the circuit board 3 together, thereby ensuring the sealing performance of the bottom.

[0034] Preferably, it also includes an optical fiber 18, the first cover 2 is provided with a first groove 19 for the optical fiber 18 to pass through, and the base 1 is also provided with a second groove 22 for the optical fiber 18 to pass through, one end of the optical fiber 18 extends into the first closed chamber 9 through the first groove 19 and is fixed in the second groove 22 of the base 1, and the other end is located outside the first closed chamber 9. This arrangement can facilitate the arrangement of the optical fiber 18 and make the overall structure more concise.

[0035] Preferably, the inner side wall of the first groove 19 of the first cover body 2 is further provided with a plurality of glue-dispensing grooves 23, and the optical fiber 18 is glue-dispensed and fixed on the first cover body 2 through the glue-dispensing grooves 23 in the first groove 19. In this embodiment, three glue-dispensing grooves 23 are provided. This arrangement can ensure reliable fixation and sealing performance of the optical fiber 18.

[0036] Preferably, the optical fiber line 18 is metallized on its surface and is soldered to the outer wall of the first cover body 2. This arrangement can ensure reliable fixation and sealing performance of the optical fiber line 18.

Claims

1. A TX packaging structure of an optical module, comprising a base (1), a first cover (2), and a circuit board (3), characterized in that: A first through hole (4) is provided in the middle of the circuit board (3); the upper end of the base (1) passes through the first through hole (4) of the circuit board (3) from bottom to top and is sealed and fixed to the circuit board (3); an optical device (5) is provided on the base (1); an electronic component is provided on the circuit board (3); the optical device (5) on the base (1) is electrically connected to the electronic component on the circuit board (3) through a gold wire; the first cover (2) is sealed on the upper surface of the circuit board (3) and is used to seal the optical device (5) and the electronic component in a first sealed chamber (9) formed by the circuit board (3), the base (1) and the first cover (2); It also includes a second cover body (10) disposed on the circuit board (3) and located inside the first cover body (2), the second cover body (10) being tightly covered on the base (1), a portion of the bottom of the second cover body (10) being in contact with the base (1), and another portion being in contact with the circuit board (3), and the bottom of the second cover body (10) being tightly connected to the base (1) and the circuit board (3) by dispensing glue, so as to seal the optical device (5) on the base (1) in a second tightly closed chamber (11) formed by the circuit board (3), the metal base (1), and the second cover body (10); A positioning structure (12) is provided between the first cover body (2) and the second cover body (10).

2. The TX packaging structure of an optical module according to claim 1, characterized in that: The first cover (2) and the base (1) are both made of metal material.

3. The TX packaging structure of an optical module according to claim 1, characterized in that: The second cover (10) is made of plastic.

4. The TX packaging structure of an optical module according to claim 1, characterized in that: A first copper-exposed area (15) is provided at a position on the circuit board (3) that is butted against the first cover body (2); the circuit board (3) is sealed and welded to the first cover body (2) at the first copper-exposed area (15) by soldering.

5. The TX packaging structure of an optical module according to claim 1, characterized in that: The base (1) is narrow at the top and wide at the bottom, and is used to form a stepped surface (16) that is in contact with the lower surface of the circuit board (3). The circuit board (3) is provided with a second copper-exposed area (17) at a position in contact with the base (1). The circuit board (3) is sealed and welded to the base (1) at the second copper-exposed area (17) by soldering.

6. The TX packaging structure of an optical module according to claim 1, characterized in that: It also includes an optical fiber line (18), the first cover body (2) is provided with a first groove (19) for allowing the optical fiber line (18) to pass through, and the base (1) is also provided with a second groove (22) for allowing the optical fiber line (18) to pass through, one end of the optical fiber line (18) extends into the first closed chamber (9) through the first groove (19) and is fixed in the second groove (22) of the base (1), and the other end is located outside the first closed chamber (9).

7. The TX packaging structure of an optical module according to claim 6, characterized in that: The inner side wall of the first groove (19) of the first cover body (2) is also provided with a plurality of glue-dispensing grooves (23), and the optical fiber line (18) is fixed to the first cover body (2) by glue-dispensing through the glue-dispensing grooves (23) in the first groove (19).

8. The TX packaging structure of an optical module according to claim 6, characterized in that: The optical fiber line (18) is subjected to metallization treatment on its surface and is welded to the outer side wall of the first cover body (2) by soldering.

Images