Display device and method for manufacturing the same

Abstract

A display device and a manufacturing method thereof are provided. The display device includes: a substrate; a display area and a peripheral area, the display area is disposed on the substrate and includes a plurality of pixels, and the peripheral area is disposed outside the display area; a dam surrounding the display area; a crack detector disposed between an end of the dam and the substrate and electrically connected to at least one of the plurality of pixels; a crack prevention dam disposed between the dam and the end of the substrate; and an encapsulation layer including a first inorganic layer, an organic layer, and a second inorganic layer, each of the first inorganic layer, the organic layer, and the second inorganic layer covers a part of the display area and the peripheral area. The first inorganic layer and the second inorganic layer in the encapsulation layer extend to the end of the substrate.

Description

[0001] This application claims the priority and benefit of Korean Patent Application No. 10-2018-0129286, filed on Oct. 26, 2018, which is incorporated herein by reference for all purposes as if fully set forth herein. Technical Field

[0002] Exemplary embodiments relate to a display device and a method of manufacturing the same, and more particularly, to a display device in which an inactive space is reduced and a high-quality image can be realized, and a method of manufacturing the display device. Background Art

[0003] A display device is a device that visually displays data. Recently, various additional uses of display devices have been started. In addition, as the thickness of the display device becomes smaller and its weight becomes lighter, the display device is used more and more widely.

[0004] The display device includes a substrate divided into a display area and a peripheral area, which is a non-display area outside the display area. The peripheral area including non-display elements such as pads, a plurality of wirings, driving circuits, etc. is an inactive space that may not display an image. Recently, the demand for reducing the inactive space of the display device has been increasing.

[0005] The display device includes a plurality of different layers on the substrate. When an external force is applied to the plurality of different layers or according to process conditions in the process of manufacturing the display device, such a plurality of different layers may be damaged or become a path through which cracks propagate. The propagation of cracks affects the durability and image quality of the display device.

[0006] The above information disclosed in the background art is only for understanding the background of the inventive concept, and thus, it may include information that does not constitute the prior art. Summary of the Invention

[0007] Exemplary embodiments of the present invention provide a display device in which an inactive space is reduced and a high-quality image is provided, and a method of manufacturing the display device.

[0008] Additional features of the inventive concept will be set forth in the description below, and in part will be apparent from the description, or may be learned by practice of the inventive concept.

[0009] Exemplary embodiments of the present invention provide a display device, the display device comprising: a substrate; a display area and a peripheral area, the display area being disposed on the substrate and including a plurality of pixels, the peripheral area being outside the display area; a dam surrounding the display area; a crack detector disposed between an end of the dam and the substrate and electrically connected to at least one of the plurality of pixels; a crack prevention dam between the dam and the end of the substrate; and an encapsulation layer including a first inorganic layer, an organic layer, and a second inorganic layer, each of the first inorganic layer, the organic layer, and the second inorganic layer covering a part of the peripheral area and the display area. The first inorganic layer and the second inorganic layer in the encapsulation layer extend to the end of the substrate.

[0010] The crack prevention dam may be disposed between the crack detector and the end of the substrate.

[0011] The crack prevention dam may be disposed to overlap with the crack detector.

[0012] The crack detector may be disposed between the crack prevention dam and the end of the substrate.

[0013] The display device may further include a first insulating layer in the display area and the peripheral area, wherein the crack detector is disposed on the first insulating layer in the peripheral area.

[0014] The crack prevention dam may include at least one slit in the first insulating layer and a cover covering the at least one slit.

[0015] The display device may further include a first barrier layer between the substrate and the first insulating layer.

[0016] The first barrier layer may extend to the end of the substrate.

[0017] The first inorganic layer in the encapsulation layer may be in direct contact with the first barrier layer between the crack detector and the end of the substrate.

[0018] The first inorganic layer in the encapsulation layer may be in direct contact with the first barrier layer between the crack prevention dam and the end of the substrate.

[0019] The display device may further include a first insulating layer in the display area and the peripheral area, wherein at least one slit is disposed in the first insulating layer in the peripheral area, and the crack detector is disposed in the at least one slit in the first insulating layer.

[0020] The substrate may include a flexible material.

[0021] The substrate may further include: a first layer including an organic material, a second layer including an organic material, and a second barrier layer between the first layer and the second layer.

[0022] The display device may further include: a thin film transistor disposed on a substrate and including an active layer, a gate electrode, a source electrode, and a drain electrode; a first electrode connected to one of the source electrode and the drain electrode; a pixel defining layer configured to define the first electrode; a second electrode facing the first electrode; and an intermediate layer disposed between the first electrode and the second electrode and including an organic light emitting layer. The display device further includes a first insulating layer in a display area and a peripheral area, and the first insulating layer includes at least one insulating layer among insulating layers disposed between the active layer, the gate electrode, the source electrode, and the drain electrode in the thin film transistor.

[0023] The display device may further include a passivation layer on the source electrode and the drain electrode, wherein the cover member includes a material same as that of the passivation layer.

[0024] The dam may include a material same as that of at least one of the passivation layer and the pixel defining layer.

[0025] The dam may include a first dam near the display area and a second dam between the first dam and the crack detector.

[0026] The display device may further include spacers on the pixel defining layer, wherein the uppermost portion of the second dam includes a material same as that of the spacers.

[0027] Another exemplary embodiment of the present invention provides a method of manufacturing a display device by performing a cutting process with reference to a cutting line on a mother substrate to divide the mother substrate into a plurality of display devices, wherein the plurality of display devices include a display area including a plurality of pixels and a peripheral area outside the display area. The method includes: forming a first insulating layer on the mother substrate; forming a dam for surrounding the display area, a crack detector electrically connected to at least one pixel among the plurality of pixels, and an anti-crack dam between the dam and the cutting line on the first insulating layer, wherein each of the dam, the crack detector, and the anti-crack dam is in a peripheral area of each of the plurality of display devices; and forming a packaging layer including a first inorganic layer, an organic layer, and a second inorganic layer in the display area and the peripheral area, wherein the first inorganic layer and the second inorganic layer are formed on the cutting line of the mother substrate to extend above the peripheral area of the display device adjacent to the first inorganic layer and the second inorganic layer, and then are cut with reference to the cutting line in the process of cutting the mother substrate.

[0028] The organic layer in the packaging layer may be formed by using a first opening mask including a plurality of first openings corresponding to a display area and a part of a peripheral area of each display device, and the first inorganic layer and the second inorganic layer in the packaging layer are formed by using a second opening mask including a second opening corresponding to the mother substrate, so as to connect the peripheral areas of each of the plurality of display devices to each other.

[0029] The crack prevention dam may include the same material as that of the insulating layer in the display area.

[0030] It will be understood that the foregoing general description and the following detailed description are both exemplary and explanatory and are intended to provide further explanation of the claimed invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] The drawings illustrate exemplary embodiments of the present invention and are used in conjunction with the description to explain the inventive concept. The drawings are included to provide a further understanding of the present invention and are incorporated into and constitute a part of this specification.

[0032] Figure 1 is a schematic plan view of a display device according to an exemplary embodiment.

[0033] Figure 2 is along Figure 1 a schematic cross-sectional view of a part of an organic light emitting display device taken along line IIA-IIB in

[0034] Figure 3 is a schematic cross-sectional view of an organic light emitting display device according to a comparative example.

[0035] Figure 4A , Figure 4B and Figure 4C are cross-sectional views showing various exemplary embodiments of the crack prevention dam.

[0036] Figure 5 is a schematic cross-sectional view of a display device according to an exemplary embodiment.

[0037] Figure 6 is a schematic cross-sectional view of a display device according to an exemplary embodiment.

[0038] Figure 7 is a schematic cross-sectional view of a display device according to an exemplary embodiment.

[0039] Figure 8 is a schematic cross-sectional view of a display device according to an exemplary embodiment.

[0040] Figure 9 is a schematic plan view of a mother substrate for manufacturing a display device according to an exemplary embodiment.

[0041] Figure 10 is along Figure 9 a cross-sectional view of a display device taken along line XA-XB in DETAILED DESCRIPTION

[0042] In the following description, for purposes of explanation, numerous specific details are set forth in order to provide a thorough understanding of the various exemplary embodiments of the present invention. As used herein, "embodiment" is a non - limiting example of a device or method that employs one or more of the inventive concepts disclosed herein. However, it will be apparent that the various exemplary embodiments may be practiced without these specific details or with one or more equivalent arrangements. In other instances, well - known structures and devices are shown in block diagram form to avoid unnecessarily obscuring the various exemplary embodiments. Further, the various exemplary embodiments may be different but not necessarily exclusive. For example, a particular shape, configuration, and characteristic of an exemplary embodiment may be used or implemented in another exemplary embodiment without departing from the inventive concept.

[0043] Unless otherwise stated, the exemplary embodiments shown are to be understood as providing exemplary features of variations in details that enable the inventive concepts to be implemented in practice. Thus, unless otherwise stated, the features, components, modules, layers, films, panels, regions, and / or aspects, etc. (hereinafter, individually or collectively referred to as "elements") of the various embodiments may be otherwise combined, separated, interchanged, and / or rearranged without departing from the inventive concept.

[0044] The use of cross - hatching and / or shading in the drawings is generally provided to clarify the boundaries between adjacent elements. Thus, unless otherwise stated, the presence or absence of cross - hatching or shading does not convey or indicate any preference or requirement regarding a particular material, material property, size, scale, commonality between the illustrated elements, and / or any other characteristic, attribute, property, etc. of the elements. Further, in the drawings, for clarity and / or descriptive purposes, the sizes and relative sizes of elements may be exaggerated. When the exemplary embodiments may be implemented differently, a particular process order may be performed differently than the order described. For example, two consecutively described processes may be performed substantially simultaneously or in an order opposite to the order described. Additionally, like reference numerals denote like elements.

[0045] When an element or layer is referred to as being "on", "connected to", or "coupled to" another element or layer, it can be directly on, directly connected to, or directly coupled to the other element or layer, or there can be intervening elements or intervening layers. However, when an element or layer is referred to as being "directly on", "directly connected to", or "directly coupled to" another element or layer, there are no intervening elements or intervening layers. For this reason, the term "connected" can refer to physical, electrical, and / or fluid connection with or without intervening elements. Additionally, the D1 axis, D2 axis, and D3 axis are not limited to the three axes of a rectangular coordinate system (such as the x-axis, y-axis, and z-axis), but can be interpreted in a broader sense. For example, the D1 axis, D2 axis, and D3 axis can be perpendicular to each other, or can represent different directions that are not perpendicular to each other. For the purposes of this disclosure, "at least one of X, Y, and Z" and "at least one selected from the group consisting of X, Y, and Z" can be interpreted as only X, only Y, only Z, or any combination of two or more of X, Y, and Z (such as by way of example XYZ, XYY, YZ, and ZZ). As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items.

[0046] Although terms such as "first", "second", etc. may be used herein to describe various types of elements, these elements should not be limited by these terms. These terms are used to distinguish one element from another. Thus, a first element discussed below may be referred to as a second element without departing from the teachings of this disclosure.

[0047] For descriptive purposes, spatial relative terms such as "beneath", "below", "under", "lower", "above", "upper", "on top of", "higher", "side" (e.g., as in "sidewall") may be used herein to describe the relationship of one element to another as shown in the figures. In addition to the orientation depicted in the figures, the spatial relative terms are intended to encompass different orientations of the device in use, operation, and / or manufacture. For example, if the device in the figures is turned over, an element described as "beneath" or "below" other elements or features will be oriented "above" the other elements or features. Thus, the exemplary term "beneath" can encompass both an orientation of above and below. Additionally, the device may be otherwise oriented (e.g., rotated 90 degrees or at other orientations), and as such, the spatial relative descriptors used herein are to be interpreted accordingly.

[0048] The terms used herein are for the purpose of describing particular embodiments and are not intended to be limiting. As used herein, unless the context clearly dictates otherwise, the singular forms "a", "an", and "the" are also intended to include the plural forms. Additionally, when the terms "comprising", "including", and / or their variants are used in this specification, these terms specify the presence of the stated features, integers, steps, operations, elements, components, and / or groups thereof, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups thereof. It should also be noted that as used herein, the terms "substantially", "about", and other similar terms are used as approximate terms and not as terms of degree, and thus they are used to account for the inherent deviations of measured, calculated, and / or provided values that would be recognized by a person of ordinary skill in the art.

[0049] A display device is a device that displays an image. The display device may be a liquid crystal display device, an electrophoretic display device, an organic light emitting display device, an inorganic electroluminescent (EL) display (inorganic light emitting display) device, a field emission display device, a surface conduction electron emission display device, a plasma display device, a cathode ray tube display device, etc.

[0050] Hereinafter, an organic light emitting display device is described as an example of a display device according to an exemplary embodiment. However, the display device of the inventive concept is not limited thereto, and various types of display devices may be used.

[0051] Figure 1 is a schematic plan view of a display device 1 according to an exemplary embodiment. Figure 2 is along Figure 1 A schematic cross-sectional view of the display device 1 as an organic light emitting display device taken along line IIA-IIB in

[0052] Referring to Figure 1 and Figure 2 , according to an exemplary embodiment, the display device 1 includes a display area DA and a peripheral area PA as a non-display area outside the display area DA, and both the display area DA and the peripheral area PA are on a substrate 110. The display area DA includes a plurality of pixels P, and the peripheral area PA outside the display area DA includes a dam 160 surrounding the display area DA. Outside the dam 160, a crack detector 170 and a crack prevention dam 190 are arranged adjacent to each other. A part of the encapsulation layer 140 covering the display area DA extends to an end CL of the substrate 110.

[0053] The substrate 110 can be formed of various materials such as glass, metal, plastic, etc. For example, the substrate 110 may include a flexible substrate, and the flexible substrate includes polymer resins such as polyethersulfone (PES), polyacrylate, polyetherimide (PEI), polyethylene naphthalate (PEN), polyethylene terephthalate (PET), polyphenylene sulfide (PPS), polyarylate (PAR), polyimide (PI), polycarbonate (PC), triacetyl cellulose (TAC), cellulose acetate propionate (CAP), etc.

[0054] The display area DA is an area for displaying an image. In the display area DA, a plurality of first thin film transistors TFT1 and a plurality of organic light emitting diodes 130 electrically connected to the plurality of first thin film transistors TFT1 can be arranged.

[0055] Between the plurality of first thin film transistors TFT1 and the substrate 110, a first barrier layer 111 can be arranged. The first barrier layer 111 includes silicon oxide, silicon nitride, and / or silicon oxynitride. The first barrier layer 111 can enhance the smoothness of the upper surface of the substrate 110, or prevent or reduce the intrusion of impurities into the semiconductor layer 122 via the substrate 110.

[0056] The semiconductor layer 122 can include amorphous silicon or polycrystalline silicon. Optionally, the semiconductor layer 122 can include an oxide of at least one material selected from the group consisting of indium (In), gallium (Ga), tin (Sn), zirconium (Zr), vanadium (V), hafnium (Hf), cadmium (Cd), germanium (Ge), chromium (Cr), titanium (Ti), and zinc (Zn). The semiconductor layer 122 can include a channel region (not shown), as well as a source region (not shown) and a drain region (not shown), where the carrier concentrations of the source region and the drain region are both higher than that of the channel region.

[0057] The gate electrode 124 is arranged above the semiconductor layer 122. According to the signal applied to the gate electrode 124, the source electrode 126s is electrically connected to the drain electrode 126d. Considering the adhesion of the gate electrode 124 to the adjacent layer, the surface smoothness of the layer where the gate electrode 124 is arranged, and the process characteristics of the gate electrode 124, the gate electrode 124 can be formed into a single-layer structure or a multi-layer structure including one or more materials among aluminum (Al), platinum (Pt), palladium (Pd), silver (Ag), magnesium (Mg), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), Cr, lithium (Li), calcium (Ca), molybdenum (Mo), Ti, tungsten (W), and copper (Cu).

[0058] To ensure the insulation between the semiconductor layer 122 and the gate electrode 124, a gate insulating layer 113 can be arranged between the semiconductor layer 122 and the gate electrode 124, where the gate insulating layer 113 includes silicon oxide, silicon nitride, and / or silicon oxynitride.

[0059] An interlayer insulating layer 115 is disposed on the gate electrode 124, where the interlayer insulating layer 115 includes silicon oxide, silicon nitride, and / or silicon oxynitride. The source electrode 126s and the drain electrode 126d may be disposed on the interlayer insulating layer 115. The source electrode 126s and the drain electrode 126d are each electrically connected to the semiconductor layer 122 through contact holes in the interlayer insulating layer 115 and the gate insulating layer 113.

[0060] In consideration of the adhesion to adjacent layers, the surface smoothness of the stacked layers, and process characteristics, the source electrode 126s and the drain electrode 126d may be formed into a single-layer structure or a multi-layer structure including one or more materials among Al, Pt, Pd, Ag, Mg, Au, Ni, Nd, Ir, Cr, Li, Ca, Mo, Ti, W, and Cu.

[0061] In the peripheral area PA of the substrate 110, a second thin film transistor TFT2 may be disposed. The second thin film transistor TFT2 may be a part of a circuit configured to control an electrical signal applied inside the display area DA.

[0062] The second thin film transistor TFT2 may be formed into a structure having the same structure as that of the above-described plurality of first thin film transistors TFT1. Optionally, the second thin film transistor TFT2 may be formed into a structure different from that of the plurality of first thin film transistors TFT1.

[0063] The second thin film transistor TFT2 may be formed of the same material as that of the plurality of first thin film transistors TFT1. For example, the second thin film transistor TFT2 may include a semiconductor layer (not shown) including amorphous silicon, polycrystalline silicon, or an organic semiconductor material. Optionally, the second thin film transistor TFT2 may be formed of a material different from that of the plurality of first thin film transistors TFT1.

[0064] The first barrier layer 111, the gate insulating layer 113, and the interlayer insulating layer 115 are formed in both the display area DA and the peripheral area PA.

[0065] On the plurality of first thin film transistors TFT1 and the second thin film transistor TFT2, a passivation layer 118 may be disposed. The passivation layer 118 eliminates the height difference caused by the plurality of first thin film transistors TFT1 and the second thin film transistor TFT2, and planarizes the upper surface of the display device 1, thereby preventing defects that may be caused by non-uniformity below the plurality of organic light-emitting diodes 130 in the plurality of organic light-emitting diodes 130.

[0066] The passivation layer 118 may be formed to have a single-layer structure or a multi-layer structure including an organic material. The organic material may include general polymers such as polymethyl methacrylate (PMMA) or polystyrene (PS), polymer derivatives containing phenolic groups, acrylic polymers, imide polymers, aryl ether polymers, amide polymers, fluorine polymers, parylene polymers, vinyl alcohol polymers, or blends thereof. Optionally, the passivation layer 118 may be formed of a composite stack including an inorganic insulating layer and an organic insulating layer.

[0067] The passivation layer 118 is formed in the display area DA and the peripheral area PA.

[0068] In the display area DA, a plurality of organic light-emitting diodes 130 are arranged. The plurality of organic light-emitting diodes 130 include a first electrode 131, a second electrode 135, and an intermediate layer 133 disposed between the first electrode 131 and the second electrode 135 and having an organic emission layer (not shown).

[0069] The first electrode 131 may include a transparent electrode or a reflective electrode. When the first electrode 131 includes a transparent electrode, the first electrode 131 may include a transparent conductive layer.

[0070] The transparent conductive layer may be at least one selected from the group consisting of indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), indium oxide (In2O3), indium gallium oxide (IGO), and aluminum zinc oxide (AZO). In this case, in addition to the transparent conductive layer, the first electrode 131 may further include a semi-transmissive layer configured to improve light efficiency. The semi-transmissive layer may be at least one selected from the group consisting of Ag, Mg, Al, Pt, Pd, Au, Ni, Nd, Ir, Cr, Li, Ca, and ytterbium (Yb), and the semi-transmissive layer is in the form of a thin film having a thickness of about several nanometers to several tens of nanometers.

[0071] When the first electrode 131 includes a reflective electrode, the first electrode 131 may include a reflective layer and a transparent conductive layer above and / or below the reflective layer, and the reflective layer is formed of Ag, Mg, Al, Pt, Pd, Au, Ni, Nd, Ir, Cr, or a compound thereof. The transparent conductive layer may be formed of at least one selected from the group consisting of ITO, IZO, ZnO, In2O3, IGO, and AZO.

[0072] However, the inventive concept is not limited thereto. The first electrode 131 may be formed of various materials. The structure of the first electrode 131 may be variously modified, for example, to have a single layer or a multi-layer.

[0073] On the passivation layer 118, the pixel defining layer 119 may be disposed over the display area DA and the peripheral area PA.

[0074] The pixel defining layer 119 exposes the central portion of the first electrode 131 and defines pixels as light-emitting regions. Additionally, the pixel defining layer 119 can prevent arcing at the edges of the first electrode 131 by covering the edges of the first electrode 131.

[0075] The pixel defining layer 119 can be formed of an organic material such as PI, hexamethyldisiloxane (HMDSO), etc. The pixel defining layer 119 can include a material the same as or different from that of the passivation layer 118.

[0076] In a part of the display area DA or the peripheral area PA, the spacers 120 can be further disposed on the pixel defining layer 119. Figure 2 It shows the spacers 120 disposed on the pixel defining layer 119 in the peripheral area PA. However, this is just an example. The spacers 120 can be disposed on the pixel defining layer 119 in the display area DA.

[0077] The spacers 120 protrude in the direction from the pixel defining layer 119 toward the encapsulation layer 140. The spacers 120 can prevent defects that may be caused by the imprinting of a mask or the like during the process. The spacers 120 can be formed of an organic material such as PI, HMDSO, etc.

[0078] The intermediate layer 133 in the organic light-emitting diode 130 can include a low molecular weight or polymer material.

[0079] When the intermediate layer 133 includes a low molecular weight material, the intermediate layer 133 can have a single-layer structure or a multi-layer structure in which a hole injection layer (HIL), a hole transport layer (HTL), an emission layer (EML), an electron transport layer (ETL), an electron injection layer (EIL), etc. are stacked. The intermediate layer 133 can include various organic materials such as copper phthalocyanine (CuPc), N,N'-bis(naphthalen-1-yl)-N,N'-diphenylbenzidine (NPB), tris(8-hydroxyquinolinato)aluminum (Alq3), etc. The intermediate layer 133 can be formed by using various methods such as vacuum deposition method.

[0080] When the intermediate layer 133 includes a polymer material, the intermediate layer 133 generally can have a structure including an HTL and an EML. In this case, the HTL can include PEDOT, and the EML can include a polymer material such as poly(phenylene vinylene) (PPV), polyfluorene, etc. The intermediate layer 133 can be formed by using various methods such as screen printing method, inkjet printing method, laser-induced thermal imaging (LITI) method.

[0081] The intermediate layer 133 may include a layer disposed integrally on top of the plurality of first electrodes 131. Optionally, the intermediate layer 133 may include a layer patterned for each of the plurality of first electrodes 131.

[0082] The second electrode 135 is formed over the display area DA and the peripheral area PA. The second electrode 135 may be formed integrally with respect to the plurality of organic light-emitting diodes 130 to correspond to the plurality of first electrodes 131 as a common electrode.

[0083] The second electrode 135 is connected to a power supply line 150 in the peripheral area PA.

[0084] The power supply line 150 may be formed of the same material as the source electrode 126s and the drain electrode 126d. On the power supply line 150, a passivation layer 118 having a first opening and a pixel defining layer 119 having a second opening are disposed. The power supply line 150 may be electrically connected to the second electrode 135 via the first opening of the passivation layer 118 and the second opening of the pixel defining layer 119, respectively, to apply low voltage power to the plurality of organic light-emitting diodes 130. Between the second electrode 135 and the power supply line 150, a connection conductive layer 132 may be formed of the same material as the first electrode 131.

[0085] The second electrode 135 may include a transparent electrode or a reflective electrode.

[0086] When the second electrode 135 includes a transparent electrode, the second electrode 135 may include one or more materials selected from Ag, Al, Mg, Li, Ca, Cu, lithium fluoride-calcium (LiF / Ca), lithium fluoride-aluminum (LiF / Al), MgAg, and CaAg. The second electrode 135 may be formed as a thin film having a thickness of about several nanometers to several tens of nanometers.

[0087] When the second electrode 135 includes a reflective electrode, the second electrode 135 may be formed of at least one selected from the group consisting of Ag, Al, Mg, Li, Ca, Cu, LiF / Ca, LiF / Al, MgAg, and CaAg. The structure or material of the second electrode 135 is not limited thereto, and various modifications may be made.

[0088] In the peripheral area PA, a dam 160 is formed to cover at least a part of the power supply line 150 and surround the display area DA. The dam 160 may include the same material as at least one of the passivation layer 118 and the pixel defining layer 119.

[0089] When the organic layer 143 in the encapsulation layer 140 is formed such that the encapsulation layer 140 seals the display area DA and the peripheral area PA, the dam 160 may prevent the formation of side tails of the organic layer 143 by blocking the flow of the organic material in the direction of the edge toward the substrate 110.

[0090] The first dam 160a may be disposed on the power supply line 150.

[0091] The first dam 160a may have a structure in which a first layer 118a arranged as a passivation layer 118 and a second layer 119a arranged as a pixel defining layer 119 are stacked therein.

[0092] By forming the first layer 118a of an organic material having an adhesion to metal that is more excellent than that of an inorganic material to metal, where the first layer 118a is in direct contact with the upper surface of the power supply line 150, the first dam 160a may be stably disposed on the power supply line 150. However, the inventive concept is not limited thereto. The first dam 160a may be formed to include another material or have a height different from the sum of the height of the first layer 118a and the height of the second layer 119a.

[0093] Outside the first dam 160a, a second dam 160b may be disposed to cover the end portion of the power supply line 150.

[0094] The second dam 160b may have a structure in which a first layer 118b, a second layer 119b, and a third layer 120b are stacked therein. The first layer 118b is formed as the passivation layer 118, the second layer 119b is formed as the pixel defining layer 119, and the third layer 120b is formed as the spacer 120. The second dam 160b may be higher than the first dam 160a.

[0095] The first layer 118b in the second dam 160b may cover the end portion of the power supply line 150, thereby preventing the power supply line 150 from deteriorating in a process of manufacturing a backplane by using heat or chemicals.

[0096] The second dam 160b may prevent the organic layer 143 from leaking into the peripheral area PA and is formed to be higher than the first dam 160a. Thus, although a metal mask (not shown) is used in a process of forming the encapsulation layer 140, a phenomenon in which the metal mask is imprinted on the surface of the second electrode 135 can be prevented.

[0097] Figure 2 Two dams, that is, the first dam 160a and the second dam 160b, are shown. However, the inventive concept is not limited thereto. The number, height, material, etc. of the dams may be variously modified.

[0098] A crack detector 170 configured to detect cracks is disposed outside and adjacent to the dam 160.

[0099] The display device 1 includes a plurality of layers on the substrate 110. For example, inorganic layers such as a gate insulating layer 113 and an interlayer insulating layer 115 are disposed on the substrate 110.

[0100] When an external force is applied to the display device 1, inorganic layers such as the gate insulating layer 113 and the interlayer insulating layer 115 become paths through which cracks propagate. For example, in a scribing process of dividing a mother substrate MSU (refer to Figure 9 ) into a plurality of display devices, when a crack occurs while cutting the mother substrate MSU along a cutting line CL (refer to Figure 9 ) that is an end CL of the substrate 110, the crack propagates along one side of the inorganic layer to the display area DA.

[0101] The crack detector 170 includes at least one of a first crack detection wiring to a third crack detection wiring 172, 173, and 174 on the interlayer insulating layer 115. The crack detector 170 can be electrically connected to a pixel P in the display area DA via a connection line 171 (refer to Figure 1 ).

[0102] As an example, the crack detector 170 can be connected to a gate line (not shown) or a data line (not shown) connected to the pixel P. As an example, when a crack occurs, therefore, at least one of the first crack detection wiring to the third crack detection wiring 172, 173, and 174 is damaged, and the resistance in the gate line or the data line connected to at least one of the first crack detection wiring to the third crack detection wiring 172, 173, and 174 increases. Since an abnormal signal in which a voltage difference appears compared to a normal signal is input to the pixel P connected to at least one of the first crack detection wiring 172 to the third crack detection wiring 174, light having a color different from a reference color is emitted. Therefore, the occurrence of a crack on the substrate 110 can be checked.

[0103] In this way, by using the crack detector 170, a crack that has already occurred in the display device 1 can be detected in advance, thereby preventing the release of defective products.

[0104] The crack dam 190 is disposed outside the crack detector 170 and adjacent to the crack detector 170.

[0105] As described above, since a crack that occurs in the display device may cause a defect in a pixel, it is necessary to reduce the propagation of the crack in the substrate 110 to the display area DA in order to improve the yield.

[0106] The crack dam 190 includes at least one slit SL in at least one of the gate insulating layer 113 and the interlayer insulating layer 115, and a covering member 118c covering the at least one slit SL. The at least one slit SL can be formed in a direction intersecting the upper surface of the substrate 110. As an example, the covering member 118c can be formed as a part of the passivation layer 118. However, this is only an example.

[0107] Figures 4A to 4C Shows various structures of the substrate 110, the inorganic layer, and the crack dam 190.

[0108] Referring to Figure 4A , two slits SL are formed in the direction toward the substrate 110 through the first barrier layer 111, the gate insulating layer 113, and the interlayer insulating layer 115 over the substrate 110, and the cover member 118c is formed to cover the two slits SL.

[0109] Referring to Figure 4B , compared with Figure 4A , the substrate 110 has a multi-layer structure. The substrate 110 may include a first layer 110a containing an organic material, a second layer 110c containing an organic material, and a second barrier layer 110b between the first layer 110a and the second layer 110c. By forming the substrate 110 having a multi-layer structure, external impurities can be prevented from invading the display area DA from the lower surface of the substrate 110.

[0110] Referring to Figure 4C , compared with Figure 4A , more slits SL are arranged. The number of the slits SL can be variously modified.

[0111] In addition, the depth of the slit SL can be modified. For example, as shown in Figures 4A to 4C , the slit SL does not need to extend through the entire depth of the first barrier layer 111, the gate insulating layer 113, and the interlayer insulating layer 115. For example, part or all of the first barrier layer 111 may not be opened. Additionally, part or all of the gate insulating layer 113 may not be opened. Only some of the above insulating layers may be arranged between the substrate 110 and the crack dam 190.

[0112] By constructing the crack dam 190 as described above, the propagation of cracks occurring in the substrate 110 toward the display area DA can be reduced.

[0113] The encapsulation layer 140 may cover the display area DA and extend to the peripheral area PA. As shown in Figure 2 , the encapsulation layer 140 may include a first inorganic layer 141, an organic layer 143, and a second inorganic layer 145.

[0114] The first inorganic layer 141 may completely cover the first electrode 131 and include silicon oxide, silicon nitride, and / or silicon oxynitride.

[0115] As needed, other layers, such as a cladding layer (not shown) configured to improve light efficiency and protect the light-emitting diode, may be arranged between the first inorganic layer 141 and the second electrode 135.

[0116] For example, the encapsulation layer (not shown) may include one or more organic materials or inorganic materials such as silicon dioxide (SiO2), silicon nitride (SiNx), zinc peroxide (ZnO2), titanium dioxide (TiO2), zirconium dioxide (ZrO2), ITO, IZO, Alq3, CuPc, 4'-bis(N-carbazolyl)-1,1'-biphenyl (CBP), and N,N'-di(naphthalen-1-yl)-N,N'-diphenylbenzidine (α-NPB). In another exemplary embodiment, the encapsulation layer (not shown) may generate a surface plasmon resonance phenomenon with respect to the light generated by the plurality of organic light emitting diodes 130. For example, the encapsulation layer (not shown) may include nanoparticles.

[0117] The encapsulation layer (not shown) can prevent the organic light emitting diode 130 from being damaged by heat, plasma, etc. generated in the chemical vapor deposition process or sputtering process used to form the encapsulation layer 140. For example, the encapsulation layer (not shown) may include an epoxy resin-based material formed of at least one of bisphenol-type epoxy resin, epoxy butadiene resin, fluorine-type epoxy resin, and novolac epoxy resin.

[0118] In addition, a layer (not shown) including lithium fluoride (LiF) or the like may be disposed between the first inorganic layer 141 and the encapsulation layer (not shown) as needed.

[0119] As Figure 2 shown, since the first inorganic layer 141 is arranged along the structure below it, the upper surface of the first inorganic layer 141 may be uneven. The organic layer 143 may cover the uneven upper surface of the first inorganic layer 141, and the upper surface of the organic layer 143 may be substantially flat.

[0120] The organic layer 143 may include one or more materials selected from the group consisting of PET, PEN, PC, PI, polyvinyl sulfonate, polyoxymethylene, polyarylate, polyacrylate, and HMDSO.

[0121] The second inorganic layer 145 covers the organic layer 143 and may include silicon oxide, silicon nitride, and / or silicon oxynitride. The second inorganic layer 145 is deposited to directly contact the first inorganic layer 141 in the edge region of the display device 1 so that the organic layer 143 is not exposed to the outside of the display device 1.

[0122] Thus, since the encapsulation layer 140 includes the first inorganic layer 141, the organic layer 143, and the second inorganic layer 145, even when cracks occur in the encapsulation layer 140 due to the multi-layer structure of the encapsulation layer 140, the cracks do not connect to each other between the first inorganic layer 141 and the organic layer 143 or between the organic layer 143 and the second inorganic layer 145. Therefore, it is possible to prevent or reduce the formation of paths through which external moisture, oxygen, etc. penetrate into the display area DA.

[0123] In the current exemplary embodiment, the first inorganic layer 141 and the second inorganic layer 145 in the encapsulation layer 140 are not deposited on a part of the display device 1, but are deposited until the end CL of the substrate 110. Regarding the process, the first inorganic layer 141 and the second inorganic layer 145 in the encapsulation layer 140 are arranged until the end CL of the substrate 110 and the display area DA by continuously extending the area until the end CL of the substrate 110 instead of blocking a part of the end CL of the substrate 110.

[0124] In Figure 3 In the display device 1R in the comparative example of [], the following items form a part of the dead space: the area L1 where the crack detector 170 is arranged, the inorganic layer arrangement area L2 covering the crack detector 170, the shadow area L3, the crack prevention dam 190, the area L4 where the crack prevention dam 190 is arranged, and the area L5 where the inorganic layer is removed from the end CL of the substrate 110.

[0125] Compared with the display device 1R according to the comparative example, in Figure 2 the display device 1 in the current exemplary embodiment of [], the inorganic layer arrangement area L2 (refer to Figure 3 ) and the shadow area L3 (refer to Figure 3 ) are not arranged between the crack detector 170 and the crack prevention dam 190, and the first inorganic layer 141 and the second inorganic layer 145 in the encapsulation layer 140 extend until the end CL of the substrate 110. As a result, compared with the entire width of the dead space of the display device 1R in Figure 3 the comparative example of [], in Figure 2 the display device 1 in the current exemplary embodiment of [], the entire width of the dead space is smaller.

[0126] Referring to Figure 5 , according to the exemplary embodiment, the display device 2 includes a display area DA and a peripheral area PA as a non-display area outside the display area DA. Both the display area DA and the peripheral area PA are on the substrate 110. The display area DA includes a plurality of pixels P, and the peripheral area PA outside the display area DA includes a dam 160 surrounding the display area DA. The crack prevention dam 190 and the crack detector 170 are arranged outside the dam 160 and adjacent to the dam 160. A part of the encapsulation layer 140 covering the display area DA extends to the end CL of the substrate 110.

[0127] Compared with the display device 1R according to Figure 3 the comparative example, in the display device 2 in the current exemplary embodiment, the inorganic layer arrangement area L2 (refer to Figure 3 ) and the shadow area L3 (refer to Figure 3) is not disposed between the crack detector 170 and the crack prevention dam 190, and the first inorganic layer 141 and the second inorganic layer 145 in the encapsulation layer 140 extend to the end CL of the substrate 110. As a result, Figure 3 Compared with the entire width of the invalid space of the display device 1R in the comparative example of FIG. 1 , the entire width of the invalid space is smaller in the display device 2 in the present exemplary embodiment.

[0128] Compared with the above-described display device 1, the display device 2 in the present exemplary embodiment is the same as the display device 1 in that the crack prevention dam 190 is arranged adjacent to the crack detector 170, and the first inorganic layer 141 and the second inorganic layer 145 in the encapsulation layer 140 extend to the end CL of the substrate 110. However, Figure 5 The display apparatus 2 in the current exemplary embodiment is different from the display apparatus 1 in that the crack prevention dam 190 is arranged closer to the display area DA than the crack detector 170 .

[0129] Reference Figure 6 According to an exemplary embodiment, the display device 3 includes a display area DA and a peripheral area PA as a non-display area outside the display area DA, both of which are on a substrate 110. The display area DA includes a plurality of pixels P, and the peripheral area PA outside the display area DA includes a dam 160 surrounding the display area DA. Outside the dam 160, a crack detector 170 is arranged to overlap the crack prevention dam 190. A portion of the encapsulation layer 140 covering the display area DA extends to an end CL of the substrate 110.

[0130] According to Figure 3 Compared with the display device 1R of the comparative example, in the display device 3 in the present exemplary embodiment, the inorganic layer arrangement region L2 (refer to Figure 3 ) and the shaded area L3 (refer to Figure 3 ) is not disposed between the crack detector 170 and the crack prevention dam 190, and the first inorganic layer 141 and the second inorganic layer 145 in the encapsulation layer 140 extend to the end CL of the substrate 110. As a result, in the display device 3 in the current exemplary embodiment, the entire width of the invalid space is smaller than that of the display device 1R in the comparative example.

[0131] Refer to above Figure 2 Compared to the exemplary embodiments described, Figure 6 The current exemplary embodiment and reference Figure 2 The described exemplary embodiments are the same in that the first inorganic layer 141 and the second inorganic layer 145 extend to the end CL of the substrate 110. However, the current exemplary embodiment is different from the reference Figure 2The exemplary embodiment described is different in that the crack prevention dam 190 is arranged to overlap with the crack detector 170.

[0132] Referring to Figure 7 , according to an exemplary embodiment, the display device 4 includes a display area DA and a peripheral area PA as a non-display area outside the display area DA. Both the display area DA and the peripheral area PA are on the substrate 110. The display area DA includes a plurality of pixels P, and the peripheral area PA outside the display area DA includes a dam 160 surrounding the display area DA. The crack detector 170 is arranged outside the dam 160, and a part of the encapsulation layer 140 covering the display area DA extends to the end CL of the substrate 110.

[0133] Compared with the display device 1R of the comparative example according to Figure 3 , in the display device 4 of the current exemplary embodiment of Figure 7 , there is no area L4 where the crack prevention dam 190 is arranged, the inorganic layer arrangement area L2 (refer to Figure 3 ), and the shadow area L3 (refer to Figure 3 ), and the first inorganic layer 141 and the second inorganic layer 145 in the encapsulation layer 140 extend to the end CL of the substrate 110. As a result, compared with the entire width of the invalid space of the display device 1R in the comparative example of Figure 3 , in the display device 4 of the current exemplary embodiment, the entire width of the invalid space is smaller.

[0134] Compared with the exemplary embodiment described above with reference to Figure 2 , the current exemplary embodiment is the same as the exemplary embodiment described with reference to Figure 2 in that the first inorganic layer 141 and the second inorganic layer 145 in the encapsulation layer 140 extend to the end CL of the substrate 110. However, the current exemplary embodiment is different from the exemplary embodiment described with reference to Figure 2 in that there is no crack prevention dam 190 and only the crack detector 170 exists.

[0135] Referring to Figure 8 , according to an exemplary embodiment, the display device 5 includes a display area DA and a peripheral area PA as a non-display area outside the display area DA. Both the display area DA and the peripheral area PA are on the substrate 110. The display area DA includes a plurality of pixels P, and the peripheral area PA outside the display area DA includes a dam 160 surrounding the display area DA. Outside the dam 160, the crack detector 170 is arranged, and a part of the encapsulation layer 140 covering the display area DA extends to the end CL of the substrate 110.

[0136] Compared with the Figure 3Compared with the display device 1R in the comparative example, in the display device 5 in the current exemplary embodiment, there is no region L4 where the crack prevention dam 190 is arranged, the inorganic layer arrangement region L2 (refer to Figure 3 ), and the shadow region L3 (refer to Figure 3 ), and the first inorganic layer 141 and the second inorganic layer 145 in the encapsulation layer 140 extend to the end CL of the substrate 110. As a result, compared with the entire width of the ineffective space of the display device 1R in the comparative example of Figure 3 , in the display device 5 in the current exemplary embodiment, the entire width of the ineffective space is smaller.

[0137] Compared with the exemplary embodiment described above with reference to Figure 2 , the current exemplary embodiment is the same as the exemplary embodiment described with reference to Figure 2 in that the first inorganic layer 141 and the second inorganic layer 145 in the encapsulation layer 140 extend to the end CL of the substrate 110. However, the current exemplary embodiment is different from the exemplary embodiment described with reference to Figure 2 in that there is no crack prevention dam 190 and only the crack detector 170 exists.

[0138] Compared with the exemplary embodiment described above with reference to Figure 6 , the current exemplary embodiment is different from the exemplary embodiment described with reference to Figure 6 in that the crack detector 170 is formed in the slit SL, and at least one of the first crack detection wiring 172 to the third crack detection wiring 174 is arranged in the slit SL.

[0139] Figure 9 is a plan view of a mother substrate MSU for manufacturing a display device according to an exemplary embodiment. Figure 10 is a cross-sectional view of a display device taken along line XA-XB according to the exemplary embodiment of Figure 9 . Figure 10 shows a peripheral region where the crack prevention dam 190 is arranged.

[0140] Referring to Figure 9 and Figure 10 , according to an exemplary embodiment, a method of manufacturing a display device involves a method of manufacturing a display device by performing a process of cutting a mother substrate MSU along a reference cutting line CL (the cutting line CL becomes the end CL of the substrate 110 after performing this process), and then dividing the mother substrate MSU into a plurality of display devices, each display device including a plurality of pixels P (refer to Figure 1) a display area DA and a peripheral area PA outside the display area DA. A method of manufacturing a display device includes: forming a first barrier layer 111, a gate insulating layer 113, and an interlayer insulating layer 115 as insulating layers over a mother substrate MSU; and forming a dam 160 (refer to Figure 1 ) that surrounds the display area DA, a crack detector 170 (refer to Figure 1 ) electrically connected to at least one of a plurality of pixels P (see Figure 1 ), and an anti-crack dam 190 between the dam 160 and a cutting line CL, wherein each of the dam 160, the crack detector 170, and the anti-crack dam 190 is located on the first barrier layer 111, the gate insulating layer 113, and the interlayer insulating layer 115 in the peripheral area PA of the display device.

[0141] According to an exemplary embodiment, a method of manufacturing a display device includes: forming a packaging layer 140 (refer to Figure 2 ) including a first inorganic layer 141, an organic layer 143 (refer to Figure 2 ), and a second inorganic layer 145, wherein each of the first inorganic layer 141, the organic layer 143, and the second inorganic layer 145 is in the display area DA and the peripheral area PA. Then, the first inorganic layer 141 and the second inorganic layer 145 are disposed on the cutting line CL of the mother substrate MSU and extend to the peripheral area PA of another display device adjacent to the first inorganic layer 141 and the second inorganic layer 145, and then are cut with reference to the cutting line CL in a process of cutting the mother substrate MSU.

[0142] The organic layer 143 in the packaging layer 140 is formed by using a first opening mask (not shown), and the first opening mask includes a plurality of first openings (not shown) corresponding to a part of the display area DA and the peripheral area PA of each display device. The first inorganic layer 141 and the second inorganic layer 145 in the packaging layer 140 can be formed by using a second opening mask (not shown) including a second opening (not shown) corresponding to the mother substrate MSU to connect the peripheral areas PA of the respective display devices to each other. The size of the second opening of the second opening mask is larger than the size of the plurality of first openings of the first opening mask.

[0143] In addition, as described above with reference to Figure 2 , Figure 5 , Figure 7 and Figure 8 regarding the exemplary embodiment, the anti-crack dam 190 can be formed of the same material as that of an insulating layer such as the first barrier layer 111, the gate insulating layer 113, and the interlayer insulating layer 115.

[0144] According to one or more exemplary embodiments, the ineffective space of the display device can be reduced by reducing the distance between the crack detector and the anti-crack dam.

[0145] In addition, the durability of the display device can be enhanced by preventing crack propagation into the display area, and the defect rate can be reduced by detecting cracks that have already occurred in advance using a crack detector.

[0146] Furthermore, the inorganic layer can be deposited up to one end of the substrate of the cutting line that serves as the mother substrate, thereby preventing deterioration of the display device by reducing the intrusion of external impurities (such as moisture, etc.) into one side of the substrate.

[0147] Unless otherwise defined, all terms used herein (including technical and scientific terms) have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure pertains. Terms (such as those defined in a general dictionary) should be interpreted as having a meaning consistent with their meaning in the context of the relevant art, and should not be interpreted in an idealized or overly formal sense unless clearly defined herein.

[0148] Although certain exemplary embodiments and implementations have been described herein, other embodiments and modifications will be apparent from this description. Accordingly, the inventive concept is not limited to such embodiments, but rather to the broader scope of the appended claims and various obvious modifications and equivalent arrangements that are apparent to one of ordinary skill in the art.

Claims

1. A display device, the display device comprising: A substrate; A display area and a peripheral area, the display area being disposed on the substrate and including a plurality of pixels, the peripheral area being disposed outside the display area; A dam surrounding the display area; A crack detector disposed between an end of the dam and the substrate and electrically connected to at least one of the plurality of pixels; A crack prevention dam disposed between the dam and the end of the substrate; And An encapsulation layer including a first inorganic layer, an organic layer, and a second inorganic layer, each of the first inorganic layer, the organic layer, and the second inorganic layer covering a part of the peripheral area and the display area, Wherein the first inorganic layer and the second inorganic layer in the encapsulation layer extend to the end of the substrate.

2. The display device according to claim 1, wherein, The crack prevention dam is disposed between the crack detector and the end of the substrate.

3. The display device according to claim 1, wherein The crack prevention dam is disposed to overlap with the crack detector.

4. The display device according to claim 1, wherein, The crack detector is disposed between the crack prevention dam and the end of the substrate.

5. The display device according to claim 1, wherein the display device further comprises: A first insulating layer in the display area and the peripheral area, Wherein the crack detector is disposed above the first insulating layer in the peripheral area.

6. The display device according to claim 5, wherein, The crack prevention dam includes at least one slit in the first insulating layer and a covering member covering the at least one slit.

7. The display device according to claim 5, wherein the display device further comprises: A first barrier layer disposed between the substrate and the first insulating layer.

8. The display device according to claim 7, wherein, The first barrier layer extends to the end of the substrate.

9. The display device according to claim 8, wherein, The first inorganic layer in the encapsulation layer is in direct contact with the first barrier layer between the crack detector and the end of the substrate.

10. The display device according to claim 8, wherein, The first inorganic layer in the encapsulation layer is in direct contact with the first barrier layer between the crack prevention dam and the end of the substrate.

11. The display device according to claim 1, wherein the display device further comprises: A first insulating layer in the display area and the peripheral area, Wherein: At least one slit is disposed in the first insulating layer in the peripheral area; and The crack detector is disposed in the at least one slit in the first insulating layer.

12. The display device according to claim 1, wherein, The substrate includes a flexible material.

13. The display device according to claim 12, wherein, The substrate further includes: a first layer including an organic material, a second layer including an organic material, and a second barrier layer disposed between the first layer and the second layer.

14. The display device according to claim 6, the display device further comprising: A thin film transistor disposed on the substrate and including an active layer, a gate electrode, a source electrode, and a drain electrode; A first electrode connected to one of the source electrode and the drain electrode; A pixel defining layer defining the first electrode; A second electrode facing the first electrode; And An intermediate layer disposed between the first electrode and the second electrode and including an organic light emitting layer, wherein: The first insulating layer includes at least one of the insulating layers disposed between the active layer, the gate electrode, the source electrode, and the drain electrode in the thin film transistor.

15. The display device according to claim 14, wherein the display device further comprises: A passivation layer on the source electrode and the drain electrode, Wherein the covering member includes a material the same as that of the passivation layer.

16. The display device according to claim 15, wherein, The dam includes a material the same as that of at least one of the passivation layer and the pixel defining layer.

17. The display device according to claim 16, wherein, The dam includes a first dam disposed near the display region and a second dam disposed between the first dam and the crack detector.

18. The display device according to claim 17, further comprising spacers on the pixel defining layer, Among them, The uppermost portion of the second dam includes a material identical to the material of the spacers.

19. A method of manufacturing a display device by performing a cutting process with reference to a cutting line on a mother substrate to divide the mother substrate into a plurality of display devices, the plurality of display devices including a display region including a plurality of pixels and a peripheral region outside the display region, the method comprising: Forming a first insulating layer on the mother substrate; Forming a dam for surrounding the display region, a crack detector electrically connected to at least one of the plurality of pixels, and a crack prevention dam disposed between the dam and the cutting line on the first insulating layer, each of the dam, the crack detector, and the crack prevention dam being in the peripheral region of each of the plurality of display devices; And Forming a encapsulation layer including a first inorganic layer, an organic layer, and a second inorganic layer in the display region and the peripheral region, wherein the first inorganic layer and the second inorganic layer are formed on the cutting line of the mother substrate to extend over the peripheral regions of the display devices adjacent to the first inorganic layer and the second inorganic layer, and then the first inorganic layer and the second inorganic layer are cut with reference to the cutting line in the process of cutting the mother substrate, and wherein the crack detector is disposed between the dam and an end of the substrate.

20. The method according to claim 19, wherein: The organic layer in the encapsulation layer is formed by using a first opening mask, the first opening mask including a plurality of first openings corresponding to the display region and a part of the peripheral region of each of the plurality of display devices; And The first inorganic layer and the second inorganic layer in the encapsulation layer are formed by using a second opening mask including a second opening corresponding to the mother substrate, so as to connect the peripheral regions of each of the plurality of display devices to each other.

21. The method according to claim 19, wherein, The crack prevention dam includes a material identical to the material of the insulating layer in the display region.

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