Display device and portable device including the same

Abstract

Provided is a display device, the display device comprising: a base substrate including a display area and a non-display area adjacent to the display area; a display element layer disposed on an upper portion of the base substrate; a sensor component disposed on a lower portion of the base substrate; and a sensing circuit board disposed on the lower portion of the base substrate and generating an electric field in response to an input from the outside. The sensing circuit board includes: a main board including a first opening portion exposing the sensor component; and an auxiliary board stacked with the sensor component, disposed on a lower portion of the main board, and electrically connected to the main board.

Description

[0001] This patent application claims priority to Korean Patent Application No. 10-2018-0132295, filed on Oct. 31, 2018, the entire contents of which are incorporated herein by reference. Technical Field

[0002] The present disclosure relates herein to a display device and a portable device including the display device. Background Art

[0003] Various display devices are being developed for use in multimedia devices such as televisions, mobile phones, tablet computers, navigators, or game consoles.

[0004] A display device may include a display panel on which an image is displayed and an input sensor component that senses an external input. The display panel includes a display area on which an image is displayed and a non-display area provided around the display area. Nowadays, display devices for reducing the non-display area and expanding the display area are being developed. In this case, as the non-display area of the display device becomes smaller, driving components that were previously provided in the non-display area may be provided to overlap with the display area. For example, a display device including a fingerprint recognition sensor that overlaps with the display area is being developed.

[0005] In addition, the display device may be operated using an external stylus. The display device may include an active area corresponding to the display area, and an input signal from the stylus is sensed through the active area. Summary of the Invention

[0006] The present disclosure provides a display device and a portable device including the display device in which the sensing reliability of a stylus can be improved.

[0007] Embodiments of the inventive concept provide a display device including: a base substrate including a display area and a non-display area adjacent to the display area; a display element layer provided on an upper portion of the base substrate; a sensor component provided on a lower portion of the base substrate; and a sensing circuit board provided on the lower portion of the base substrate and generating an electric field in response to an external input, the sensing circuit board including: a main board including a first opening portion exposing the sensor component; and an auxiliary board overlapping with the sensor component, provided on a lower portion of the main board, and electrically connected to the main board.

[0008] In an embodiment, in a thickness direction of the base substrate, a distance from the base substrate to an upper surface of the main board may be shorter than a distance from the base substrate to a lower surface of the auxiliary board.

[0009] In an embodiment, the main board may include a first part, a first main pad, and a second main pad. The first main pad and the second main pad are disposed on the first part and separated from each other by a first opening part therebetween in one direction. The auxiliary board may include a board body, a first auxiliary pad, and a second auxiliary pad disposed on the board body. Among them, the first main pad is connected to the first auxiliary pad, and the second main pad is connected to the second auxiliary pad.

[0010] In an embodiment, the main board may further include a third main pad and a fourth main pad. The third main pad and the fourth main pad are disposed on the first part and separated from each other by a first opening part therebetween in another direction perpendicular to the one direction. The auxiliary board may further include a third auxiliary pad and a fourth auxiliary pad disposed on the board body. Among them, the third main pad is connected to the third auxiliary pad, and the fourth main pad is connected to the fourth auxiliary pad.

[0011] In an embodiment, the display device may further include a driving circuit board configured to provide a driving signal to the display element layer and disposed on the lower part of the main board.

[0012] In an embodiment, the display device may further include a connector disposed on the lower part of the main board and connected to the driving circuit board and the auxiliary board. Among them, the driving circuit board receives a sensing signal through the connector and transmits the sensing signal to the main board.

[0013] In an embodiment, the auxiliary board and the connector may be provided in an integral shape.

[0014] In an embodiment, the driving circuit board may include a second opening part exposing the sensor component, and in a plan view, the driving circuit board may surround the auxiliary board.

[0015] In an embodiment, the display device may further include: a first adhesive layer disposed between the substrate and the main board; and a buffer layer disposed between the main board and the driving circuit board.

[0016] In an embodiment, the buffer layer may include a third opening part exposing the first opening part, and the area of the third opening part may be larger than the area of the first opening part.

[0017] In an embodiment, the display device may further include a second adhesive layer disposed between the main board and the auxiliary board to surround the auxiliary board. Among them, in a plan view, the second adhesive layer does not overlap with the first opening part but overlaps with the second opening part.

[0018] In an embodiment, in a plan view, the area of the auxiliary board may be larger than the area of the first opening part to completely cover the first opening part.

[0019] In an embodiment, the sensor component may overlap with the display area.

[0020] In an embodiment, the sensor component may be superimposed on a boundary between a display area and a non-display area.

[0021] In an embodiment, the sensor component may be a fingerprint recognition sensor.

[0022] In an embodiment, the display device may further include a packaging layer disposed on a display element layer and an input sensor component disposed on the packaging layer.

[0023] In an embodiment of the inventive concept, a portable device includes: a display device; and a stylus configured to select information displayed on the display device, wherein the display device includes: a display panel including a display area and a non-display area adjacent to the display area; an input sensor component disposed on an upper portion of the display panel; a sensor component disposed on a lower portion of the display panel and superimposed on the display area; and a sensing circuit board including: a main board configured to generate an electric field in response to an input through the stylus, disposed on the lower portion of the display panel, and including a first opening portion superimposed on the sensor component; and an auxiliary board superimposed on the sensor component, disposed on a lower portion of the main board, and electrically connected to the main board.

[0024] In an embodiment, in a plan view, an area of the auxiliary board may be greater than an area of the first opening portion.

[0025] In an embodiment, the sensor component may include a fingerprint recognition sensor disposed in the first opening portion and a package encapsulating the fingerprint recognition sensor.

[0026] In an embodiment, the display device may further include: an adhesive layer disposed between the display panel and the main board; and a buffer layer disposed on a lower portion of the main board and including a second opening portion exposing the sensor component, wherein an area of the auxiliary board is smaller than an area of the second opening portion. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] The drawings are included to provide a further understanding of the inventive concept and are incorporated in and constitute a part of this specification. The drawings illustrate exemplary embodiments of the inventive concept and, together with the description, serve to explain the principles of the inventive concept. In the drawings:

[0028] Figure 1 is a perspective view of a display device according to an embodiment of the inventive concept;

[0029] Figure 2 is an exploded perspective view of a portable device according to an embodiment of the inventive concept;

[0030] Figure 3A is a cross-sectional view of a display module according to an embodiment of the inventive concept;

[0031] Figure 3B is a cross-sectional view of a display module according to another embodiment of the inventive concept;

[0032] Figure 4 is an exploded perspective view of a sensing circuit board according to an embodiment of the inventive concept;

[0033] Figure 5 is an exploded perspective view showing a part of a sensing circuit board according to an embodiment of the inventive concept;

[0034] Figure 6 is according to an embodiment of the inventive concept along Figure 2 a cross-sectional view taken along line I-I' shown in;

[0035] Figure 7 is a plan view showing the rear surface of a display device according to an embodiment of the inventive concept;

[0036] Figure 8 is according to another embodiment of the inventive concept along Figure 2 a cross-sectional view taken along line I-I' shown in;

[0037] Figure 9 is a plan view showing the rear surface of a display device according to another embodiment of the inventive concept; and

[0038] Figure 10 is showing Figure 9 a cross-sectional view of a part of the display device shown in. DETAILED DESCRIPTION

[0039] It will be understood that when an element or layer is referred to as being "on", "connected to", or "coupled to" another element or layer, the element or layer can be directly on, directly connected to, or directly coupled to the other element or layer, or there can be an intervening third element or layer.

[0040] Like reference numerals in the drawings denote like elements. Additionally, in the drawings, the thickness, ratios, and dimensions of the elements are exaggerated to effectively describe the technical content.

[0041] The term "and / or" includes any combination and all combinations of one or more of the associated listed items.

[0042] Terms such as first, second, etc. may be used to describe various components, but these components should not be limited by the terms. The terms are only used for the purpose of differentiating one component from another. For example, without departing from the scope of the present invention, the first component may be referred to as the second component, or similarly, the second component may be referred to as the first component. Unless the context clearly indicates otherwise, the singular forms "a", "an", and "the" are also intended to include the plural forms.

[0043] In addition, terms such as "under", "below", "on", and "above" are used to explain the association of items shown in the drawings. It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the drawings.

[0044] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which the example embodiments belong. It will also be understood that terms, such as those defined in a general dictionary, should be interpreted as having a meaning consistent with their meaning in the context of the relevant art and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.

[0045] It will also be understood that when the terms "comprise" and / or "include" are used in this specification, they specify the presence of the stated features, integers, steps, operations, elements, components, or combinations thereof, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, or combinations thereof.

[0046] Hereinafter, embodiments of the inventive concept will be described with reference to the drawings.

[0047] Figure 1 is a perspective view of a display device according to an embodiment of the inventive concept. Figure 2 is an exploded perspective view of a portable device according to an embodiment of the inventive concept.

[0048] Regarding Figure 1 , the display device DD may display an image IM through a display area DD-DA of a display surface DD-IS. According to an embodiment of the inventive concept, the display device DD is shown as having a flat display surface DD-IS, but the inventive concept is not limited thereto. The display device DD may include a curved display surface or a stereoscopic display surface. The stereoscopic display surface may include a plurality of display areas facing different directions and may include, for example, a multi-sided columnar display surface.

[0049] The display device DD may be a flexible display device or a rigid display device. Although not shown, electronic modules, camera modules, power modules, etc. provided on the main board are provided in a housing or the like together with the display device DD, and constitute a portable device. The display device DD in the embodiments of the inventive concept can be applied not only to large electronic devices such as televisions or monitors, but also to small or medium-sized electronic devices such as tablet computers, vehicle navigators, game consoles, smart phones or smart watches.

[0050] The display surface DD-IS may be parallel to the surface defined by the first direction DR1 and the second direction DR2. The direction perpendicular to the display surface DD-IS, that is, the thickness direction of the display device DD is represented by the third direction DR3. In this specification, the expression "in a plan view" or "when viewed in a plan view" may mean when viewed from the third direction DR3. The front surface (or upper surface) and the rear surface (or lower surface) of each component or each unit to be described below are distinguished by the third direction DR3. However, the first direction DR1, the second direction DR2, and the third direction DR3 shown in the embodiments are merely exemplary, and the directions indicated by the first direction DR1, the second direction DR2, and the third direction DR3 may represent reversed directions.

[0051] As Figure 1 shown, the display surface DD-IS includes a display area DD-DA on which an image IM is displayed and a non-display area DD-NDA adjacent to and surrounding the display area DD-DA. The non-display area DD-NDA is an area on which no image is displayed. Figure 1 Application icons and watch widgets are shown as examples of the image IM.

[0052] In addition, the display area DD-DA has a rectangular shape and is surrounded by the non-display area DD-NDA. However, the embodiments of the inventive concept are not limited thereto, and the shape of the display area DD-DA and the shape of the non-display area DD-NDA can be designed corresponding to the configuration of the display device DD. For example, the non-display area DD-NDA may be provided adjacent to only any one side of the display area DD-DA, or may be omitted.

[0053] Referring Figure 2 , the portable device HD includes a display device DD and an input device such as an electronic module EN. The display device DD and the electronic module EN can interact and work together to generate an input signal. For example, the electronic module EN may be a stylus and is used as an input device for selecting information displayed on the display device DD. The display device DD can display the information selected by the electronic module EN.

[0054] Specifically, the display device DD includes a window WM, a display module DM, a sensing circuit board DCB, a driving circuit board PCB, and a chassis BC.

[0055] The window WM is disposed on the upper portion of the display module DM and can transmit the image provided from the display module DM through the transmissive area TA. Specifically, the window WM includes a transmissive area TA and a non-transmissive area NTA. The transmissive area TA can overlap with the display area DD-DA and has a shape corresponding to the display area DD-DA. The image IM displayed in the display area DD-DA of the display device DD can be visually recognized by the user through the transmissive area TA of the window WM.

[0056] The non-transmissive area NTA can overlap with the non-display area DD-NDA and has a shape corresponding to the non-display area DD-NDA. Compared with the transmissive area TA, the non-transmissive area NTA can have a relatively low light transmittance. However, the technical spirit of the inventive concept is not limited thereto, and the non-transmissive area NTA can be omitted.

[0057] The window WM can be formed of glass, sapphire, plastic, or the like. Although the window WM is shown as having a single layer, the window WM can include multiple layers. The window WM can include a substrate layer that overlaps with the transmissive area TA and the non-transmissive area NTA. The window WM can include at least one printed layer that is disposed on the rear surface of the substrate layer to overlap with the non-transmissive area NTA. The printed layer can have a specified color. For example, the printed layer can be set to have a black color or a color other than black.

[0058] According to an embodiment of the inventive concept, the transmissive area TA can include a sensing area FSA. The sensing area FSA can overlap with the display area DD-DA and can be an area for fingerprint recognition.

[0059] When the sensing area FSA is disposed on the non-transmissive area NTA, the area of the non-transmissive area NTA is enlarged due to the sensing area FSA. However, since the display device DD of the embodiment of the inventive concept has a structure in which the sensing area FSA overlaps with the display area DD-DA, the area of the non-transmissive area NTA can be reduced. Accordingly, the transmissive area TA can be enlarged.

[0060] On the other hand, a sensor component that overlaps with the sensing area FSA can be disposed on the rear surface of the display module DM. A description thereof will be provided later.

[0061] The electronic module EN can be in direct contact with or close to the surface of the window WM and selectively display the information on the surface of the window WM. Here, the contact can include both cases where two objects are in direct contact and close to each other. For example, the electronic module EN according to an embodiment of the inventive concept can be configured as a stylus. The electronic module EN can include a main body portion BD and a sensing portion DT connected to one end of the main body portion BD. Although not shown, the main body portion BD can include a power source and supply power to the sensing portion DT of the electronic module EN. The sensing portion DT can correspond to a typical ballpoint pen and can be provided with metal as a conductive material. The sensing portion DT can generate an electric field with the sensing circuit board DCB in response to the power supplied from the main body portion BD.

[0062] The display module DM is disposed between the window WM and the chassis BC. The display module DM includes a display panel DP and an input sensor component ISU.

[0063] The display panel DP can generate an image, and the generated image is transmitted to the outside through the window WM. According to an embodiment of the inventive concept, the display panel DP can be an organic light-emitting display panel, a liquid crystal display panel, or a quantum dot light-emitting display panel, but the display panel DP is not particularly limited. The organic light-emitting display panel includes organic light-emitting elements. The liquid crystal display panel includes liquid crystal molecules. The quantum dot light-emitting display panel includes quantum dots or quantum rods.

[0064] Hereinafter, the display panel DP according to an embodiment of the inventive concept will be described as an organic light-emitting display panel. However, the technical spirit of the inventive concept is not limited thereto, and various display panels can be applied to the inventive concept.

[0065] The input sensor component ISU can be disposed between the window WM and the display panel DP. The input sensor component ISU senses an input from the outside of the display device DD. The input can have various types. For example, the input can include various types of external inputs such as those from a user's body, light, heat, or pressure. In addition, not only the input generated by the contact of a part of the body (such as a user's finger), but also the input of a touch (e.g., hovering) from a neighboring space or an adjacent space can be a type of input.

[0066] The input sensor component ISU can be directly disposed on the display panel DP. The input sensor component ISU in this embodiment can be manufactured together with the display panel DP through the same process as the display panel DP. However, the technical spirit of the inventive concept is not limited thereto, and the input sensor component ISU can be prepared as a separate panel and combined with the display panel DP through an adhesive layer.

[0067] The sensing circuit board DCB may be disposed on the lower portion of the display module DM. The sensing circuit board DCB may sense an input applied from the electronic module EN. For example, the sensing circuit board DCB may receive position information selected by the electronic module EN or recognize the movement of the electronic module EN. The sensing circuit board DCB may convert the information received from the electronic module EN into a digital signal and transmit the digital signal to the display panel DP. For example, the sensing circuit board DCB may be a digitizer.

[0068] The chassis BC may be combined with the window WM. The chassis BC provides the rear surface of the display device DD and is combined with the window WM to define an internal space. The chassis BC may include a material having relatively strong hardness. For example, the chassis BC may include a plurality of frames and / or plates, which include glass, plastic, or metal. The chassis BC may stably protect the components of the display device DD contained in the internal space from the influence of external shocks.

[0069] In addition, although the chassis BC is described as including a material having strong hardness, embodiments of the inventive concept are not limited thereto. The chassis BC may include a flexible material. Although not shown, when the display device DD according to an embodiment of the inventive concept is a flexible display device, the components included in the display device DD may also have a flexible property.

[0070] Figure 3A is a cross-sectional view of a display module according to an embodiment of the inventive concept. Figure 3B is a cross-sectional view of a display module according to another embodiment of the inventive concept.

[0071] Referring to Figure 3A , a display module DM according to an embodiment of the inventive concept will be described. The display module DM may include the display panel DP and the input sensor unit ISU described with reference to Figure 2 .

[0072] The display panel DP includes a substrate base SUB, a circuit element layer COL, a display element layer ED, and an insulating layer ECL. The display panel DP includes a display area DP-DA and a non-display area DP-NDA. The display area DP-DA and the non-display area DP-NDA of the display panel DP may overlap with the display area DD-DA and the non-display area DD-NDA of the display device DD described above with reference to Figure 1 . The non-display area DP-NDA may be disposed to be adjacent to only one side of the display area DP-DA or may be omitted.

[0073] The substrate base SUB can generally support components of the display panel DP and the input sensor unit ISU, and includes a flexible material. For example, the substrate base SUB can include a plastic substrate, a glass substrate, an organic / inorganic composite substrate, etc. Optionally, the substrate base SUB can have a stacked structure including a plurality of insulating layers. The plastic substrate can include at least one of an acrylic resin, a methacrylic resin, polyisoprene, a vinyl resin, an epoxy resin, a urethane resin, a cellulose resin, a silicone resin, a polyimide resin, a polyamide resin, and a parylene resin.

[0074] The circuit element layer COL can include a plurality of insulating layers, a plurality of conductive layers, and a semiconductor layer. The plurality of conductive layers of the circuit element layer COL can be control lines or signal wirings of pixels.

[0075] The display element layer ED is stacked with the display area DP-DA and is disposed on the circuit element layer COL. The display element layer ED includes display elements such as organic light-emitting diodes. However, embodiments of the inventive concept are not limited thereto, and depending on the type of the display panel DP, the display element layer ED can include a liquid crystal device, an inorganic light-emitting diode, or an organic-inorganic hybrid light-emitting diode.

[0076] The insulating layer ECL encapsulates the display element layer ED. For example, the insulating layer ECL can be stacked with each of the display area DP-DA and the non-display area DP-NDA. However, the insulating layer ECL may not be stacked with the non-display area DP-NDA.

[0077] According to Figure 3A , the insulating layer ECL can be a packaging substrate. The insulating layer ECL protects the display element layer ED from foreign substances such as moisture, oxygen, and dust particles. The insulating layer ECL can be combined with the substrate base SUB through a sealant SLP. The sealant SLP can include a frit. However, this is merely exemplary, and the material forming the sealant SLP is not limited thereto.

[0078] The input sensor unit ISU can be stacked with the display area DP-DA and is disposed on the insulating layer ECL. On the other hand, as an example, Figure 3A it is shown that the input sensor unit ISU is directly disposed on the insulating layer ECL through a continuous process, but embodiments of the inventive concept are not limited thereto. For example, an adhesive layer (not shown) can be disposed between the input sensor unit ISU and the insulating layer ECL, and the input sensor unit ISU and the insulating layer ECL can be adhesively attached to each other through the adhesive layer.

[0079] Referring to Figure 3B , the display module DMa can include a display panel DPa and an input sensor unit ISUa. As with Figure 3ACompared with the display module DM shown in Figure 3B The display module DMa shown in

[0080] differs only in the structure of the insulating layer ECLa, and the other structures can be substantially the same. The display panel DPa includes a substrate base SUB, a circuit element layer COL, a display element layer ED, and an insulating layer ECLa.

[0081] The insulating layer ECLa can completely encapsulate the display element layer ED. The insulating layer ECLa can cover the top surface and the side surface of the display element layer ED, so as not to expose the display element layer ED to the outside. For example, the insulating layer ECLa can be stacked with each of the display area DP-DA and the non-display area DP-NDA. However, according to another embodiment of the inventive concept, the insulating layer ECLa may not be stacked with the non-display area DP-NDA. The insulating layer ECLa according to the embodiment of the inventive concept may include at least one encapsulating organic layer and at least one encapsulating inorganic layer.

[0082] The encapsulating inorganic layer protects the display element layer ED from moisture and oxygen, and the encapsulating organic layer protects the display element layer ED from foreign substances such as dust particles. The encapsulating inorganic layer may include a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, an aluminum oxide layer, etc., but the material forming the encapsulating inorganic layer is not specifically limited. The encapsulating organic layer may include an acrylic organic layer, but the material forming the encapsulating organic layer is not limited thereto.

[0083] The input sensor component ISUa can be directly disposed on the insulating layer ECLa through a continuous process. However, the embodiment of the inventive concept is not limited thereto, and the input sensor component ISUa can be adhesively attached to the insulating layer ECLa through an adhesive layer. In this case, the input sensor component ISUa may include a base layer and a sensing circuit element layer. The sensing circuit element layer may include a plurality of insulating layers and a plurality of conductive layers.

[0084] Figure 4 is an exploded perspective view of a sensing circuit board according to an embodiment of the inventive concept. Figure 5 is an exploded perspective view showing a part of a sensing circuit board according to an embodiment of the inventive concept.

[0085] Referring to Figure 4 , the sensing circuit board DCB includes a main board MC and an auxiliary board SC. According to the inventive concept, each of the main board MC and the auxiliary board SC can generate an electric field with the electronic module EN.

[0086] Specifically, the main board MC may include an effective area AA and a non-effective area NAA. The effective area AA of the main board MC may correspond to Figure 1 the display area DD-DA of the display device DD shown inFigure 2 The transmissive area TA of the window WM shown in []. The non-active area NAA of the main board MC may correspond to Figure 1 the non-display area DD-NDA of the display device DD shown in [[]] and Figure 2 the non-transmissive area NTA of the window WM shown in [].

[0087] According to an embodiment of the inventive concept, the main board MC may include an opening part OP superposed with the Figure 2 sensing area FSA shown in []. As described above, since the sensor component for fingerprint recognition is superposed with the sensing area FSA and disposed on the rear surface of the display panel DP, the opening part OP may be disposed in the main board MC to provide a space for arranging the sensor component.

[0088] On the other hand, in the area superposed with the opening part OP, no electric field is provided between the sensing circuit board DCB and the electronic module EN because the main board MC is not disposed in the opening part OP. However, according to an embodiment of the inventive concept, the auxiliary board SC may be superposed with the opening part OP to completely cover the opening part OP in a plan view and may be electrically connected to the main board MC. In other words, in the plan view, the area of the auxiliary board SC is set to be larger than the area of the opening part OP, and a part of the auxiliary board SC may be coupled to a part of the main board MC surrounding the opening part OP. Accordingly, an electric field may be generated in the entire active area AA between the sensing circuit board DCB including the auxiliary board SC and the electronic module EN.

[0089] Specifically, referring to Figure 5 , the main board MC includes: a first part S1 surrounding the opening part OP; a plurality of main pads PD1, PD2, PD3, and PD4; and a plurality of main signal lines (not shown) respectively connected to the corresponding plurality of main pads PD1, PD2, PD3, and PD4.

[0090] The first main pad PD1 and the second main pad PD2 are disposed on the first part S1 and may be separated from each other by the opening part OP disposed therebetween in one direction. Here, the one direction may be the second direction DR2. Each of the first main pad PD1 and the second main pad PD2 may be arranged along the first direction DR1. For example, the first main pad PD1 may extend along the second direction DR2 and may be respectively electrically connected to a plurality of first main signal lines disposed in the main board MC and extending along the second direction DR2. The second main pad PD2 may extend along the second direction DR2 and may be respectively electrically connected to a plurality of second main signal lines disposed in the main board MC and extending along the second direction DR2.

[0091] The third main pad PD3 and the fourth main pad PD4 may be disposed on the first part S1 and may be separated from each other in another direction perpendicular to the one direction by an opening part OP therebetween. Here, the another direction may be the first direction DR1. The third main pad PD3 and the fourth main pad PD4 may be arranged along the second direction DR2. For example, the third main pad PD3 may extend along the first direction DR1 and may be electrically connected to a plurality of third main signal lines respectively, and the plurality of third main signal lines are disposed in the main board MC and extend along the first direction DR1. The fourth main pad PD4 may extend along the first direction DR1 and may be electrically connected to a plurality of fourth main signal lines respectively, and the plurality of fourth main signal lines are disposed in the main board MC and extend along the first direction DR1.

[0092] The auxiliary board SC includes a second board S2 (i.e., a board body), a plurality of auxiliary pads disposed on the second board S2, and a plurality of auxiliary signal lines. The auxiliary pads disposed on the second board S2 may face the main pads PD1, PD2, PD3, and PD4 disposed on the first part S1.

[0093] Although not shown separately, the plurality of auxiliary pads respectively include a plurality of first auxiliary pads, a plurality of second auxiliary pads, a plurality of third auxiliary pads, and a plurality of fourth auxiliary pads that are respectively connected to the first main pad PD1, the second main pad PD2, the third main pad PD3, and the fourth main pad PD4.

[0094] The first main pad PD1 is electrically connected to the first auxiliary pad, and the second main pad PD2 is electrically connected to the second auxiliary pad. Specifically, the first auxiliary pad and the second auxiliary pad may be electrically connected to each other through a first auxiliary signal line respectively. One end of the first auxiliary signal line is electrically connected to the corresponding first auxiliary pad, and the other end of the first auxiliary signal line is electrically coupled to the corresponding second auxiliary pad.

[0095] Accordingly, the sensing signal transmitted from the first main pad PD1 may be transmitted to the second main pad PD2 through the first auxiliary pad, the first auxiliary signal line, and the second auxiliary pad. Hereinafter, the sensing signal according to an embodiment of the inventive concept may be a signal provided to the sensing circuit board DCB to generate an electric field with an external electronic module EN.

[0096] In addition, the third main pad PD3 is electrically connected to the third auxiliary pad, and the fourth main pad PD4 is electrically connected to the fourth auxiliary pad. Specifically, the third auxiliary pad and the fourth auxiliary pad may be electrically connected to each other through a second auxiliary signal line insulated from the first auxiliary signal line. One end of the second auxiliary signal line is electrically connected to the corresponding third auxiliary pad, and the other end of the second auxiliary signal line is electrically connected to the corresponding fourth auxiliary pad.

[0097] Accordingly, the sensing signal transmitted from the third main pad PD3 may be transmitted to the fourth main pad PD4 through the third auxiliary pad, the second auxiliary signal line, and the fourth auxiliary pad.

[0098] As described above, according to an embodiment of the inventive concept, an opening part OP is provided in a main board MC of a sensing circuit board DCB to provide a space for accommodating a fingerprint recognition sensor, but an auxiliary board SC overlapping the opening part OP can be electrically connected to the main board MC. Accordingly, a plurality of main signal lines (not shown) can be uninterrupted in the opening part OP, and thus, the reliability of touching of the sensing electronic module EN can be improved overall.

[0099] Figure 6 is a cross-sectional view taken along line I-I' shown in Figure 2 the embodiment according to the inventive concept. Figure 7 is a plan view showing a rear surface of a display device according to an embodiment of the inventive concept.

[0100] Compared with the display device DD shown in Figure 2 the display device DD shown in Figure 6 also includes a polarization layer POL, a window adhesive layer WAY, a sensor component SU, a buffer layer CY, a first adhesive layer AY1, and a second adhesive layer AY2. Additionally, according to an embodiment of the inventive concept, the sensor component SU can entirely overlap the display area DP-DA.

[0101] The polarization layer POL is disposed between the display module DM and the window WM. The polarization layer POL can prevent circuit elements included in the display module DM from being visually recognized from the outside by polarizing external light incident through the window WM. According to an embodiment, the polarization layer POL can be omitted. The window adhesive layer WAY is disposed between the polarization layer POL and the window WM to attach the polarization layer POL and the window WM to each other. For example, the window adhesive layer WAY can be provided as an optically clear adhesive film, an optically clear resin, or a pressure-sensitive adhesive film.

[0102] On the other hand, as described with reference to Figure 2 a sensing area FSA configured to recognize an external fingerprint can overlap the display area DP-DA. However, the technical spirit of the inventive concept is not limited thereto, and the sensing area FSA can overlap a part of the non-display area DP-NDA. A detailed description thereof will be provided with reference to Figure 8

[0103] The sensor component SU can overlap the sensing area FSA and be disposed on a rear surface of a substrate base SUB. The sensor component SU can include a sensor SS, a package SP encapsulating the sensor SS, and an adhesive RS configured to attach the package SP to the substrate base SUB.

[0104] ​According to an embodiment of the inventive concept, the sensor SS may be provided as a fingerprint recognition sensor, and the fingerprint recognition sensor may operate based on an optical method, an ultrasonic method, or a capacitive method. However, although the sensor SS is described as a fingerprint recognition sensor, embodiments of the inventive concept are not limited thereto. In other words, the sensor SS may be provided in various ways, including a camera, a pressure sensor, a proximity sensor, a brightness sensor, a temperature sensor, etc. disposed on a lower portion of the substrate SUB.

[0105] Hereinafter, the sensor component SU according to the Figure 6 embodiment shown in will be described as a fingerprint recognition sensor operating based on an optical method. The fingerprint recognition sensor operating based on an optical method may operate based on the following technique: after light is irradiated onto a fingerprint, the light reflected by the fingerprint is sensed to recognize the fingerprint.

[0106] The package SP may encapsulate the sensor SS facing the substrate SUB, mount it therein, and transmit a signal sensed from the sensor SS to the driving circuit board PCB. Although not shown, the package SP may include a control circuit electrically connected to the driving circuit board PCB and the sensor SS.

[0107] The adhesive RS may attach the sensor component SU to the substrate SUB. For example, the adhesive RS may be disposed on a rear surface of the substrate SUB to surround the sensor SS in a plan view.

[0108] The sensing circuit board DCB may include an auxiliary board SC and a main board MC. The main board MC may include an opening portion OP. The auxiliary board SC may be stacked with the opening portion OP and disposed on the main board MC. According to an embodiment of the inventive concept, the sensor component SU may be disposed in an internal space defined by the opening portion OP. Here, the internal space may be a space defined by the main board MC, the auxiliary board SC, and the substrate SUB.

[0109] Specifically, a distance from the substrate SUB to an upper surface of the main board MC in a third direction DR3, which is a thickness direction, may be shorter than a distance from the substrate SUB to a lower surface of the auxiliary board SC (e.g., when viewed from a flipped Figure 6 view). In other words, the main board MC and the auxiliary board SC may be disposed on different layers.

[0110] According to Figure 6 , a first main pad PD1 and a second main pad PD2 disposed on the main board MC may be electrically connected to a first auxiliary pad SPD1 and a second auxiliary pad SPD2 disposed on the auxiliary board SC.

[0111] As described above, due to the auxiliary board SC that overlaps with the opening portion OP and is electrically connected to the main board MC, an electric field can be generated even in the opening portion OP.

[0112] The first adhesive layer AY1 can be disposed between the base substrate SUB and the main board MC. The first adhesive layer AY1 can also include an opening portion corresponding to the opening portion OP in the main board MC. The shape of the opening portion included in the first adhesive layer AY1 can be substantially the same as the shape of the opening portion OP in the main board MC. The first adhesive layer AY1 can be provided as an optically transparent adhesive film, an optically transparent resin, or a pressure-sensitive adhesive film.

[0113] The second adhesive layer AY2 can attach the main board MC and the auxiliary board SC to each other. For example, in a plan view, the second adhesive layer AY2 can surround the auxiliary board SC to attach the main board MC and the auxiliary board SC to each other. The second adhesive layer AY2 may not overlap with the opening portion OP of the main board MC, but may overlap with the opening portion included in the buffer layer CY provided on the main board MC.

[0114] The buffer layer CY can include an opening portion that overlaps with the sensor component SU and can be provided on the main board MC. Specifically, in a plan view, the area of the opening portion in the buffer layer CY can be larger than the area of the opening portion OP in the main board MC and the area of the auxiliary board SC. In addition, in a plan view, the buffer layer CY can provide an accommodation space for the auxiliary board SC and can surround the auxiliary board SC, and the second adhesive layer AY2 can be provided between the buffer layer CY and the auxiliary board SC.

[0115] The driving circuit board PCB can be provided on the buffer layer CY. In other words, the buffer layer CY can be provided between the main board MC and the driving circuit board PCB. For example, in a plan view, the driving circuit board PCB may not completely surround the auxiliary board SC and is provided adjacent to one side of the auxiliary board SC. The driving circuit board PCB can supply a driving signal to the display element layer ED.

[0116] In addition, although not shown, an input sensor component ISU (see Figure 3A ) can be provided between the insulating layer ECL and the polarization layer POL.

[0117] Figure 7 The rear surface of the display device DD is shown, and the display device DD can also include a connector NPC electrically connected to the driving circuit board PCB.

[0118] The connector NPC can be disposed on the buffer layer CY and connected to the driving circuit board PCB and the auxiliary board SC. Specifically, the connector NPC can be electrically connected to the driving circuit board PCB to provide the sensed signal transmitted externally to the driving circuit board PCB. Although not shown, the driving circuit board PCB can receive the sensed signal through the connector NPC and transmit the sensed signal to the main board MC.

[0119] According to an embodiment of the inventive concept, the connector NPC and the auxiliary board SC can be provided in an integral shape. In other words, the connector NPC and the auxiliary board SC can be provided in an integral shape and disposed on the rear surface of the substrate base SUB. However, the embodiments of the inventive concept are not limited thereto, and the connector NPC can be provided separately without being connected to the auxiliary board SC. In this case, the connector NPC can be electrically connected to the driving circuit board PCB through additional wiring.

[0120] Figure 8 is a cross-sectional view taken along the line I-I' shown in Figure 2 according to another embodiment of the inventive concept.

[0121] Compared with the display device DD shown in Figure 6 , the display device DD2 shown in Figure 8 is different only in the position of the sensor component SU, and the remaining configurations and structures can be substantially the same.

[0122] According to an embodiment of the inventive concept, Figure 8 the sensor component SU shown in

[0123] Figure 9 can be disposed in a region overlapping with the display area DP-DA and the non-display area DP-NDA. In other words, the sensor SS included in the sensor component SU can overlap with each of the display area DP-DA and the non-display area DP-NDA adjacent to the display area DP-DA. Accordingly, the opening portion OP included in the main board MC can also overlap with the boundary between the display area DP-DA and the non-display area DP-NDA. Figure 10 is a plan view showing the rear surface of a display device according to another embodiment of the inventive concept. Figure 9 is a cross-sectional view showing a part of the display device shown in

[0124] Compared with the display device DD shown in Figure 6 , the display devices DD3 shown in Figure 9 and Figure 10 are different only in the structures of the driving circuit board PCBa and the connector NPCa, and the remaining configurations and structures can be substantially the same. Therefore, for ease of explanation, the description of the remaining configurations can be omitted.

[0125] Reference Figure 9 and Figure 10 Figure 10

[0126] The connector NPCa may be connected to the driving circuit board PCBa. In other words, the connector NPCa may be separately provided and is not connected to the auxiliary board SC. In this case, an externally received sensing signal may be transmitted to the driving circuit board PCBa. The auxiliary board SC may receive the sensing signal through the driving circuit board PCBa and the main board MC.

[0127] According to an embodiment of the inventive concept, a sensor component overlapping a display area and a sensing circuit board configured to sense an external electronic module may be disposed on a rear surface of the display panel. Specifically, the sensing circuit board includes a main board and an auxiliary board. The main board includes an opening portion, and the sensor component will be disposed through the opening portion. The auxiliary board covers the sensor component and is electrically connected to the main board.

[0128] Accordingly, the sensing circuit board may generate an electric field with the external electronic module, even in the opening portion. Accordingly, the reliability of sensing an input applied from the external electronic module may be improved.

[0129] As described above, embodiments have been disclosed in the drawings and the specification. Here, specific terms have been used, but only for the purpose of describing the inventive concept and not for limiting the meaning or the scope of the inventive concept disclosed in the claims. Accordingly, those skilled in the art will understand that various modifications and other equivalent embodiments may be made. Accordingly, the true technical scope of the inventive concept should be defined by the technical spirit of the claims.

Claims

1. A display device, the display device comprising: A substrate base, including a display area and a non-display area adjacent to the display area; A display element layer, disposed on an upper portion of the substrate base; A sensor component, disposed on a lower portion of the substrate base; And A sensing circuit board, disposed on the lower portion of the substrate base and generating an electric field in response to an input from the outside, the sensing circuit board including: A main board, including a first opening portion exposing the sensor component; and An auxiliary board, stacked with the first opening portion exposing the sensor component to completely cover the first opening portion in a plan view, disposed on a lower portion of the main board, and fixedly coupled to a portion of the main board surrounding the first opening portion to be electrically connected to the main board, Wherein, the sensor component is disposed in the first opening portion.

2. The display device according to claim 1, Among them, In a thickness direction of the substrate base, a distance from the substrate base to an upper surface of the main board is shorter than a distance from the substrate base to a lower surface of the auxiliary board.

3. The display device according to claim 1, Among them, The main board includes a first portion and a first main pad and a second main pad, the first main pad and the second main pad are disposed on the first portion and separated by the first opening portion disposed therebetween in one direction, and The auxiliary board includes a board body and a first auxiliary pad and a second auxiliary pad disposed on the board body, Wherein, the first main pad is connected to the first auxiliary pad, and the second main pad is connected to the second auxiliary pad.

4. The display device according to claim 3, Among them, The main board further includes a third main pad and a fourth main pad, the third main pad and the fourth main pad are disposed on the first portion and separated by the first opening portion disposed therebetween in another direction, the another direction is perpendicular to the one direction, and The auxiliary board further includes a third auxiliary pad and a fourth auxiliary pad disposed on the board body, Wherein, the third main pad is connected to the third auxiliary pad, and the fourth main pad is connected to the fourth auxiliary pad.

5. The display device according to claim 1, the display device further comprising: A driving circuit board, configured to provide a driving signal to the display element layer and disposed on a lower portion of the main board.

6. The display device according to claim 5, the display device further comprising: A connector, disposed on a lower portion of the main board and connected to the driving circuit board and the auxiliary board, Wherein, the driving circuit board receives a sensing signal through the connector and transmits the sensing signal to the main board.

7. The display device according to claim 5, wherein, The driving circuit board includes a second opening portion exposing the sensor component, and In a plan view, the driving circuit board surrounds the auxiliary board.

8. A portable device, the portable device comprising: The display device according to any one of claims 1-7; And A stylus, configured to select information displayed on the display device.

9. The portable device according to claim 8, wherein, The sensor component includes: a fingerprint recognition sensor; and a package encapsulating the fingerprint recognition sensor.

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