A busbar for capacitor

Abstract

The present invention provides a busbar for a capacitor, comprising a busbar body and at least one lead-out terminal, characterized in that: the busbar body is composed of at least one metal wire layer, each metal wire layer is composed of at least two metal wires, and each metal wire is connected by a connecting wire; the lead-out terminal is connected to the metal wire layer. The present invention solves the problem that the existing busbar for capacitors is prone to skin effect under high-frequency application conditions and has a large self-inductance under high-frequency conditions.

Description

Technical Field

[0001] The invention relates to the technical field of a busbar connected inside a capacitor and a lead-out terminal lead-out structure, and in particular to a busbar for a capacitor. Background Art

[0002] The busbar and lead-out terminal lead-out structure connected inside the existing capacitor is as follows Figure 1 As shown, it is formed by integrally stamping and bending a copper plate 3 with a thickness of 1-3 mm. When used, the capacitor core is directly welded or welded to the copper busbar through a wire / copper foil. However, the existing busbar has the following disadvantages: 1) It is easy to produce skin effect under high-frequency application conditions; 2) The self-inductance is large under high-frequency conditions.

[0003] In addition, the existing busbar processing mold is complex and the cost is very high. The processing of the copper busbar requires large-tonnage stamping equipment (above 80T), which has high processing costs. Summary of the invention

[0004] The purpose of the present invention is to provide a busbar for a capacitor, which mainly solves the problem one existing in the above-mentioned prior art: the existing busbar for capacitors is prone to skin effect under high-frequency application conditions and has a large self-inductance under high-frequency conditions; the second problem is that the processing mold of the existing busbar for capacitors is complex and the cost is very high, and a busbar for capacitors is provided.

[0005] In order to achieve the above-mentioned purpose, the technical solution adopted by the present invention is: a busbar for a capacitor, comprising a busbar body and at least one lead-out terminal, characterized in that: the busbar body is composed of at least one metal wire layer, each metal wire layer is composed of at least two metal wires, and each metal wire is connected by a connecting wire; the lead-out terminal is connected to the metal wire layer.

[0006] Furthermore, at least two metal wires in each metal wire layer are arranged in parallel; and the connecting wires and the metal wires are in a perpendicular direction or at an angle to each other.

[0007] Furthermore, gaps are provided between the metal wires in each metal wire layer.

[0008] Furthermore, each metal wire layer comprises at least two metal wire groups formed by at least four metal wires, each metal wire group is formed by at least two metal wires being tightly connected, and gaps are provided between adjacent metal wire groups.

[0009] Furthermore, the cross-sectional area of ​​the metal wire ranges from 0.2 square millimeters to 20 square millimeters; the cross-sectional area of ​​the connecting wire ranges from 0.2 square millimeters to 20 square millimeters.

[0010] Furthermore, a welding foot is provided at the lower end of the lead terminal.

[0011] Furthermore, the busbar body is composed of a metal wire layer, and the lead terminal is connected to the metal wire layer.

[0012] Furthermore, the busbar body is composed of two or more layers of metal conductors which are connected in sequence in an overlapping manner, and adjacent metal conductor layers are connected by connecting conductors.

[0013] Furthermore, the metal wire layer is also provided with through holes.

[0014] In view of the above technical features, the present invention has the following beneficial effects:

[0015] 1. A busbar for a capacitor in the present invention provides a connection and terminal lead-out structure for the busbar inside the capacitor. Compared with existing products, the product of the present invention has the following advantages: 1) The terminal stamping processing mold is simple, which can achieve high-speed stamping, and the mold and processing costs are low; 2) The terminal stamping equipment is a general equipment (below 80T), and the processing cost is low; 3) The skin effect is low under high-frequency application conditions and can be ignored; 4) The self-inductance is small under high-frequency conditions, which avoids serious heating of the busbar for the capacitor of the present invention (that is, the greater the self-inductance under high-frequency conditions, the more serious the heating), which affects the use effect of the product.

[0016] 2. The busbar for capacitors of the present invention has the advantages of a metal conductor layer of a busbar body formed by a plurality of metal conductors arranged in parallel, which saves more materials, has a larger surface area and is lighter in weight than the copper busbar in the prior art. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 The utility model is a structural schematic diagram of a busbar for a capacitor in the prior art.

[0018] Figure 2 It is a structural schematic diagram of a busbar for a capacitor in Example 1.

[0019] Figure 3 It is a schematic diagram of the structure of the lead-out terminal in Example 1.

[0020] Figure 4 It is a schematic diagram of the structure of a busbar for a capacitor in Example 2.

[0021] In the figure: 1 is the busbar body; 11 is the metal wire; 12 is the connecting wire; 13 is the through hole; 2 is the lead terminal; 21 is the welding foot; 22 is the fixed installation hole; 3 is the copper plate of the busbar for the existing capacitor. DETAILED DESCRIPTION

[0022] The present invention will be further described below in conjunction with specific embodiments. It should be understood that these embodiments are only used to illustrate the present invention and are not intended to limit the scope of the present invention. In addition, it should be understood that after reading the content taught by the present invention, those skilled in the art can make various changes or modifications to the present invention, and these equivalent forms fall within the scope limited by the appended claims of the application equally.

[0023] See also Figures 2 to 3 , Specific embodiment 1, a busbar for a capacitor, comprising a busbar body 1 and at least one lead terminal 2, characterized in that: the busbar body 1 is composed of at least one metal wire layer, each metal wire layer is composed of at least two metal wires 11, and each metal wire 11 is connected by a connecting wire 12; the lead terminal 2 is connected to the metal wire layer.

[0024] Each metal wire 11 is connected by a connecting wire 12, for example, the metal wire 11 and the connecting wire 12 are connected by welding, including but not limited to spot welding, soldering, resistance welding, and riveting. The connecting wire 12 is used to combine and connect the metal wires 11 together, and the connecting wire 12 and the metal wire 11 have the function of current flow.

[0025] At least two metal wires 11 of each metal wire layer are arranged in parallel, and the parallel arrangement can form a planar metal wire layer, or a three-dimensional metal wire layer, such as a metal wire layer with a U-shaped cross-section; the connecting wire 12 and the metal wire 11 are in a perpendicular direction or at an angle to each other, so that the connecting wire 12 is convenient for connecting and fixing the metal wire 11, so that each metal wire 11 can form a stable metal wire layer shape.

[0026] The lead terminal 2 can be connected to the metal wire layer by welding and / or riveting, and can be connected to the edges of the metal wire layer, to the upper side of the metal wire layer, or to the lower side of the metal wire layer.

[0027] According to the product structure and requirements of the capacitor and busbar, the lead terminals 2 can be one, two or more, and can be evenly distributed on the metal conductor layer or unevenly distributed on the metal conductor layer.

[0028] The cross section of the metal wire 11 is circular, oval or square, and the cross section of the connecting wire 12 is circular, oval or square, which can be selected and used according to actual conditions.

[0029] There is a gap between the metal wires 11 in each metal wire layer. Alternatively, there are at least two groups of metal wires formed by at least four metal wires 11 in each metal wire layer, each metal wire group is formed by at least two metal wires 11 tightly connected, and there is a gap between adjacent metal wire groups. The design of the gap can effectively reduce the skin effect of the current on the metal to wire layer, and at the same time reduce the equivalent series inductance of the product, i.e., the busbar for the capacitor. Compared with the gap between adjacent metal wire groups, the gap between the metal wires 11 and the metal wires 11 has a better effect of reducing the skin effect of the current and the equivalent series inductance of the product; compared with the gap between the metal wires 11 and the metal wires 11, the gap between the adjacent metal wire groups has a higher processing efficiency and reasonable space utilization.

[0030] Preferably, the cross-sectional area of ​​the metal wire 11 is in the range of 0.2 square millimeters to 20 square millimeters; the cross-sectional area of ​​the connecting wire 12 is in the range of 0.2 square millimeters to 20 square millimeters. The metal wire 11 and the connecting wire 12 within this cross-sectional area range can not only meet the requirements of the capacitor for current flow and current flow, but also can reduce the volume and weight of the metal wire 11 and the connecting wire 12 as much as possible, saving the material of the metal wire 11 and the connecting wire 12.

[0031] The lower end of the lead terminal 2 is provided with a welding foot 21. Figure 3 The welding foot 21 facilitates the assembly of the lead-out terminal 2 with the busbar body 1 or each metal conductor layer of the busbar body 1 by soldering / resistance welding / riveting. According to the product structure, the welding foot 21 can be set in different forms, such as a single welding foot, two welding feet or multiple welding feet, or the busbar body 1 can also be the same side or different side of each metal conductor layer of the busbar body 1, etc.

[0032] According to the product structure and requirements of the capacitor and busbar, a fixed mounting hole 22 or a mounting stud may be provided at the upper end of the lead terminal 2, and a fixing nut may also be provided on the fixed mounting hole 22, so as to indirectly fix the capacitor busbar at a specified position by connecting and fixing the lead terminal 2.

[0033] In this embodiment 1, the busbar body 1 is composed of a metal wire layer, and there are four lead terminals 2. The four lead terminals 2 are unevenly distributed and connected to the metal wire layer, that is, each lead terminal 2 is actually three weld feet through the weld feet 21, which are located on both sides of the lead terminal 2, and one side of the lead terminal is provided with a weld foot 21, and the other side is provided with two weld feet 21, forming a triangular fixation, which more firmly fixes the lead terminal 2 and the metal wire layer to the upper side of the metal wire layer, and each lead terminal 2 is provided with a fixed mounting hole 22.

[0034] During the production of the busbar, the metal wire 11 and the connecting wire 12 can be pre-cut according to the required length, and then welded together by soldering or resistance welding to form the busbar body 1; several metal wires 11 are parallel to each other, and there is a small gap between every two wires, or several wires form a group, and there is a small gap between each adjacent group, and the connecting wire 12 and the metal wire 11 are perpendicular to each other or at an angle. Then, the lead terminal 2 is assembled to the busbar body 1 by soldering / resistance welding / riveting according to specific requirements to form a busbar for capacitors.

[0035] See also Figure 4 , Specific embodiment 2, the content of this embodiment 2 is basically the same as that of embodiment 1, except that: the metal wire layer is further provided with a through hole 13.

[0036] When the lead-out terminal 2 is connected to the downward side of the metal conductor layer, a through hole 13 is provided at a corresponding position of the metal conductor layer of the busbar body 1 to facilitate leading out or passing through the lead-out terminal 2 to meet various requirements of different capacitors for busbar products.

[0037] When the busbars are used in pairs and the lead-out terminal 2 of one busbar interferes with the busbar body 1 of another busbar, corresponding through holes 13 can be provided on the busbar body 1 of the interfering busbar to facilitate the stacking of the busbar bodies 1 and meet the various requirements of different capacitors for busbar products.

[0038] A through hole 13 for passing the lead-out terminal of other busbars can be selectively provided between adjacent lead-out terminals 2. When the lead-out terminal of other busbars is passed through, that is, when two busbars are combined, the through hole 13 facilitates the lead-out terminal of other busbars. There is a gap between the inner wall of the through hole 13 and the lead-out terminal of other busbars. The gap facilitates the penetration of potting material, generally insulating material, when producing capacitors, to prevent the through hole 13 from being connected to the lead-out terminal of other busbars.

[0039] In addition, a design in which the lead-out terminal 2 is directly fixedly connected to the upward side of the metal wire layer may also be selected.

[0040] Specific implementation 3, specific embodiment 3, the content of this embodiment 3 is basically the same as that of embodiment 1, except that: the busbar body 1 is composed of two or more layers of metal wire layers connected in sequence in an overlapping manner, the adjacent metal wire layers are connected by connecting wires, and the uppermost metal wire layer is provided with a lead terminal 2. The connecting wires between adjacent metal wire layers can be connected and fixed or combined together by soldering / resistance welding / riveting, etc., and the areas between adjacent metal wire layers that are not soldered / resistance welded / riveted, etc. can also be provided with insulating materials to partially isolate the upper and lower adjacent metal wire layers to effectively reduce the skin effect and equivalent series inductance of the current. In this embodiment 3, two or three layers can be selected as an example.

[0041] The three schemes can be selected and designed according to the actual capacitor's requirements for the busbar structure and current flow rate. The design of multiple layers of metal conductors can increase the current flow of the busbar body 1 as required, and at the same time can more reasonably arrange the spatial layout of the metal conductor layers to better utilize the limited space in the capacitor.

[0042] The above description is only a preferred embodiment of the present invention, and does not limit the patent scope of the present invention. Any equivalent structure or equivalent process transformation made by using the contents of the present invention specification and drawings, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present invention.

Claims

1. A busbar for a capacitor, comprising a busbar body (1) and at least one lead terminal (2), characterized in that: The busbar body (1) is composed of at least one metal wire layer, each metal wire layer is composed of at least two metal wires (11) arranged in an arranged manner, and the metal wires (11) are connected to each other via connecting wires (12); the lead-out terminal (2) is connected to the metal wire layer.

2. A busbar for a capacitor according to claim 1, characterized in that: At least two metal wires (11) of each metal wire layer are arranged in parallel; the connecting wire (12) and the metal wire (11) are in a perpendicular direction or at an angle to each other.

3. A busbar for a capacitor according to claim 2, characterized in that: A gap is provided between the metal wires (11) and the metal wires (11) in each metal wire layer.

4. A busbar for a capacitor according to claim 2, characterized in that: At least two metal wire groups are formed by at least four metal wires (11) in each metal wire layer, each metal wire group is formed by at least two metal wires (11) being tightly connected, and gaps are provided between adjacent metal wire groups.

5. A busbar for a capacitor according to claim 3 or 4, characterized in that: The cross-sectional area of ​​the metal wire (11) ranges from 0.2 square millimeters to 20 square millimeters; the cross-sectional area of ​​the connecting wire (12) ranges from 0.2 square millimeters to 20 square millimeters.

6. A busbar for a capacitor according to claim 5, characterized in that: A welding foot (21) is provided at the lower end of the lead terminal (2).

7. A busbar for a capacitor according to claim 6, characterized in that: The busbar body (1) is composed of a metal conductor layer, and the lead terminal (2) is connected to the metal conductor layer.

8. A busbar for a capacitor according to claim 6, characterized in that: The busbar body (1) is composed of two or more layers of metal conductors which are connected in sequence in an overlapping manner, and adjacent metal conductor layers are connected by connecting conductors.

9. A busbar for a capacitor according to claim 7 or 8, characterized in that: The metal conductor layer is also provided with a through hole (13).

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