Method for peeling off mother protective film, organic light emitting display device and manufacturing method thereof

Abstract

Provided are a method for stripping a mother protective film from a mother display panel, a method for manufacturing an organic light-emitting display device, and an organic light-emitting display device, the method for stripping a mother protective film from a mother display panel comprising: stacking a mother display panel and a mother protective film, the mother display panel comprising a plurality of display units and a peripheral area around the plurality of display units, each display unit comprising a display area; forming a target area and a dummy area in the mother protective film by forming a cutting line and a first additional cutting line in a first direction near the cutting line, the cutting line being in a closed loop shape, the closed loop shape surrounding a target area corresponding to each of the display units; physically stripping the dummy area from the mother display panel, comprising the following steps: stripping the portion of the dummy area of ​​the mother protective film adjacent to the first additional cutting line once; and stripping the remaining dummy area of ​​the mother protective film from the mother display panel for a second time along the cutting line.

Description

[0001] This application claims priority to and the benefit of Korean Patent Application No. 10-2018-0145652, filed on November 22, 2018, which is hereby incorporated by reference for all purposes as if fully set forth herein. Technical Field

[0002] Exemplary embodiments of the invention generally relate to a method of peeling off a mother protective film, a method of manufacturing an organic light emitting display device, and an organic light emitting display device manufactured using the method, so that process efficiency can be increased and cost can be reduced. Background Art

[0003] An organic light-emitting display device includes a substrate, an organic light-emitting device on the substrate, and an encapsulation member encapsulating the organic light-emitting device. Unlike when an encapsulation member formed of glass is used, when an encapsulation member having a thin film structure including an organic layer and an inorganic layer is used, a protective film may be temporarily or permanently arranged on the encapsulation member to protect the thin film encapsulation member and the organic light-emitting device from external impurities.

[0004] An organic light-emitting display device is manufactured by simultaneously manufacturing a plurality of display units on a mother substrate, separating the plurality of display units from each other via cutting, and performing a subsequent process such as a module attachment operation on each display unit. The cutting process is performed by forming a cutting line in a peripheral area outside a display area of ​​the display unit on the mother substrate. When a glass lower substrate and a glass upper substrate are bonded to each other, cutting may be performed using a wheel. When a flexible lower substrate and a thin film encapsulation member are bonded to each other, cutting may be performed using a laser. However, when a protective film is attached to an assembly of the glass lower substrate and the thin film encapsulation member, it is difficult to perform a cutting operation.

[0005] The above information disclosed in this Background section is only for understanding the background of the inventive concept and therefore it may contain information that does not constitute the prior art. Summary of the invention

[0006] The method according to the exemplary embodiment of the invention includes a method of stripping a mother protective film with increased process efficiency and reduced cost and a method of manufacturing an organic light-emitting display device using the method of stripping a mother protective film. The device constructed according to the exemplary embodiment of the invention includes an organic light-emitting display device manufactured using the method.

[0007] Additional features of the inventive concepts will be set forth in the description which follows, and in part will be apparent from the description, or may be learned by practice of the inventive concepts.

[0008] According to one or more embodiments of the invention, a method for peeling off a mother protective film from a mother display panel includes: stacking a mother display panel and a mother protective film, the mother display panel including a plurality of display units and a peripheral area around the plurality of display units, the plurality of display units each including a display area; forming a target area and a dummy area in the mother protective film by forming a cutting line and a first additional cutting line in a first direction near the cutting line, the cutting line being in a closed loop shape, the closed loop shape surrounding a target area corresponding to each of the display units; physically peeling off the dummy area from the mother display panel, including the following steps: peeling off the portion of the dummy area of ​​the mother protective film adjacent to the first additional cutting line once; and peeling off the remaining dummy area of ​​the mother protective film from the mother display panel for a second time along the cutting line.

[0009] The depths of the cutting lines and the first additional cutting lines may be smaller than the thickness of the mother protective film.

[0010] The cutting line and the first additional cutting line may be formed using a laser beam.

[0011] The laser beam may include CO 2 laser.

[0012] The cutting line and the first additional cutting line may be formed using a cutter.

[0013] The cutting line and the first additional cutting line may be formed using an ultrasonic cutter including a vibrator and a blade.

[0014] A first additional cutting line may be connected to the cutting line.

[0015] At least one end of the first additional cutting line may be formed within the cutting line.

[0016] The first additional cutting line may be spaced apart from the cutting line.

[0017] The method may further include forming a second additional cutting line connected to the first additional cutting line in the mother protective film.

[0018] The step of peeling the portion of the mother protective film at one time may include applying a first force between the first additional cutting line and the second additional cutting line.

[0019] The step of peeling off the portion of the mother protective film once may include applying a first force having a component in a second direction away from the first additional cutting line, and the step of peeling off the remaining dummy area of ​​the mother protective film for a second time may include applying a second force in the first direction to the mother protective film peeled off once.

[0020] The once-peeled mother protective film may include a portion of the cutting line extending in a direction intersecting the second force.

[0021] The first force may be applied using a peel pin.

[0022] The target region defined by the cut line in the closed loop shape may have an area smaller than that of the display unit.

[0023] The mother protective film may include an adhesive layer attached to the mother display panel and a base film disposed on the adhesive layer.

[0024] The method may further include, before the primary peeling, irradiating the dummy region with ultraviolet (UV) light to reduce adhesive force of a portion of the adhesive layer corresponding to the dummy region.

[0025] The method may further include irradiating the target area with ultraviolet (UV) light to increase adhesive force of a portion of the adhesive layer corresponding to the target area after the secondary peeling.

[0026] The mother display panel may include a substrate including a glass material, and the method may further include etching the substrate to reduce a thickness of the substrate before once peeling the mother protective film.

[0027] According to one or more embodiments of the invention, a method for manufacturing an organic light-emitting display device includes: forming a mother display panel on a mother substrate, the mother display panel including a display unit and a peripheral area arranged around the display unit, the display unit including a plurality of organic light-emitting devices and an encapsulation component encapsulating the plurality of organic light-emitting devices; laminating a mother protective film on the mother display panel; forming a target area and a dummy area on the mother protective film by forming a cutting line and an additional cutting line in a first direction near the cutting line, the cutting line being in a closed loop shape surrounding each target area corresponding to the display unit; physically peeling off the dummy area from the mother display panel, including the following steps: peeling off the portion of the dummy area of ​​the mother protective film adjacent to the additional cutting line once; and peeling off the remaining dummy area of ​​the mother protective film from the mother display panel for a second time along the cutting line; dividing the mother substrate into a plurality of display units by cutting the mother substrate; and processing the non-edges of the plurality of display units.

[0028] The mother substrate may be cut using a wheel cutting device.

[0029] The mother substrate may be cut by applying force to the wheel cutting device in a direction from the mother protective film to the mother substrate.

[0030] The step of processing the edges of the plurality of display units may include rounding corner portions of the plurality of display units.

[0031] The step of processing the edges of the plurality of display units may include polishing the edges of the plurality of display units.

[0032] The encapsulation member may include at least one organic layer and at least one inorganic layer.

[0033] The method may further include forming a touch layer on the encapsulation member before laminating the mother protective film.

[0034] The method may further include forming a polarizing film on the packaging member before laminating the mother protective film.

[0035] According to one or more embodiments of the invention, an organic light-emitting display device includes: a substrate including glass; a display area arranged on the substrate and including an organic light-emitting device; a non-display area arranged on the substrate and located around the display area; a thin film encapsulation member including an organic layer and an inorganic layer and configured to cover the display area; and an adhesive layer having an irregular width and an irregular height at a portion of a line in a virtual closed loop shape surrounding the display area.

[0036] According to one or more embodiments of the invention, a method for manufacturing an organic light-emitting display device includes: forming a display area, a non-display area and a thin film encapsulation member on a substrate, the display area including a plurality of organic light-emitting devices, the non-display area being located within the display area, the thin film encapsulation member encapsulating the display area, the thin film encapsulation member including an organic layer and an inorganic layer; stacking a protective film on the thin film encapsulation member, the protective film including an adhesive layer and a base film; forming a cutting line in the non-display area in a closed loop shape in the protective film, the cutting line having a depth less than or equal to the thickness of the protective film; and peeling the protective film from the substrate by applying a torsional force along the cutting line in the closed loop shape.

[0037] It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory and are intended to provide further explanation of the invention as claimed. BRIEF DESCRIPTION OF THE DRAWINGS

[0038] The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate exemplary embodiments of the invention and together with the description serve to explain the inventive concept.

[0039] Figure 1 is a flowchart of a method of manufacturing an organic light emitting display device according to an exemplary embodiment.

[0040] Figure 2A , Figure 2B , Figure 2C , Figure 2D , Figure 2E , Figure 2F and Figure 2G It is a schematic diagram showing the Figure 1 A plan view of a method of manufacturing an organic light emitting display device according to an exemplary embodiment of the present invention.

[0041] Figure 3 yes Figure 2BSchematic cross-sectional view of region A of FIG.

[0042] Figure 4 yes Figure 2C Schematic cross-sectional view of region B of FIG.

[0043] Figure 5A , Figure 5B , Figure 5C , Figure 5D , Figure 5E , Fig. 5F and Figure 5G is a plan view schematically illustrating a method of manufacturing an organic light emitting display device according to a comparative example.

[0044] Figure 6 , Figure 7 , Figure 8 , Fig. 9 and Fig.10 are plan views showing various examples of cutting lines and additional cutting lines.

[0045] Fig.11A , Fig. 11B , Fig. 11C and Fig.11D is a plan view schematically illustrating a method of manufacturing an organic light emitting display device according to another exemplary embodiment.

[0046] Fig. 12A , Fig. 12B , Fig. 12C and Fig.12D is a plan view schematically illustrating a method of manufacturing an organic light emitting display device according to another exemplary embodiment.

[0047] Fig.13 and Fig.14 is a diagram for schematically illustrating a method of manufacturing an organic light emitting display device according to another exemplary embodiment. DETAILED DESCRIPTION

[0048] In the following description, for the purpose of explanation, many specific details are set forth to provide a thorough understanding of various exemplary embodiments or implementations of the invention. "Embodiment" and "implementation" as used herein are interchangeable words and are non-limiting examples of devices or methods using one or more of the inventive concepts disclosed herein. However, it is apparent that various exemplary embodiments may be practiced without these specific details or with one or more equivalent arrangements. In other cases, well-known structures and devices are shown in block diagram form to avoid unnecessarily obscuring various exemplary embodiments. In addition, various exemplary embodiments may be different, but need not be exclusive. For example, without departing from the inventive concept, the specific shape, configuration and characteristics of the exemplary embodiment may be used or implemented in another exemplary embodiment.

[0049] Unless otherwise stated, the exemplary embodiments shown will be understood as providing exemplary features of the details of the changes in some ways of implementing the inventive concept in practice. Therefore, unless otherwise stated, the features, components, modules, layers, films, panels, regions and / or aspects, etc. (hereinafter, individually or collectively referred to as "elements") of various embodiments may be further combined, separated, interchanged and / or rearranged without departing from the inventive concept.

[0050] The use of cross hatching and / or shading in the drawings is generally provided to make the boundaries between adjacent elements clear. Thus, unless otherwise specified, the presence or absence of cross hatching or shading does not express or indicate any preference or requirement for a particular material, material property, size, ratio, commonality between the elements shown, and / or any other characteristics, attributes, properties, etc. of the elements. In addition, in the drawings, the size and relative size of the elements may be exaggerated for clarity and / or descriptive purposes. When the exemplary embodiments may be implemented differently, the specific process sequence may be performed differently from the described sequence. For example, two continuously described processes may be performed substantially simultaneously or in an order opposite to the described sequence. In addition, the same reference numerals represent the same elements.

[0051] When an element or layer is referred to as being "on" another element or layer, "connected to" or "bonded to" another element or layer, the element or layer may be directly on, directly connected to or directly bonded to the other element or layer, or there may be an intermediate element or intermediate layer. However, when an element or layer is referred to as being "directly on" another element or layer, "directly connected to" or "directly bonded to" another element or layer, there is no intermediate element or intermediate layer. For this reason, the term "connection" may represent a physical connection, an electrical connection and / or a fluid connection with or without an intermediate element. In addition, the X-axis, the Y-axis and the Z-axis are not limited to the three axes (such as the x-axis, the y-axis and the z-axis) of a rectangular coordinate system, and may be interpreted in a broader sense. For example, the X-axis, the Y-axis and the Z-axis may be perpendicular to each other, or may represent different directions that are not perpendicular to each other. For the purpose of this disclosure, "at least one of X, Y, and Z" and "at least one selected from the group consisting of X, Y, and Z" may be interpreted as only X, only Y, only Z, or any combination of two or more of X, Y, and Z (such as XYZ, XYY, YZ, and ZZ for example). As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items.

[0052] Although the terms "first", "second", etc. can be used here to describe various types of elements, these elements should not be limited by these terms. These terms are used to distinguish one element from another element. Therefore, the first element discussed below can be called the second element without departing from the disclosed teachings.

[0053] Spatially relative terms such as "under," "below," "below," "down," "above," "up," "above," "higher," "side" (e.g., as in "sidewall"), etc., may be used herein for descriptive purposes to describe the relationship between one element and another (or other) element(s) as shown in the accompanying drawings. Spatially relative terms are intended to encompass different orientations of the device in use, operation, and / or manufacture in addition to the orientations depicted in the accompanying drawings. For example, if the device in the accompanying drawings is flipped, an element described as "under" or "beneath" other elements or features will subsequently be oriented to be "above" the other elements or features. Thus, the exemplary term "under" may encompass both above and below orientations. Furthermore, the device may be otherwise oriented (e.g., rotated 90 degrees or in other orientations), and the spatially relative descriptors used herein interpreted accordingly.

[0054] The terms used herein are for the purpose of describing a particular embodiment, and are not intended to be limited. As used herein, the singular "one", "an" and "the (described)" are also intended to include plural forms, unless the context clearly indicates otherwise. In addition, when the terms "include", "comprise" and / or its variations are used in this specification, these terms illustrate the existence of stated features, integral bodies, steps, operations, elements, components and / or their groups, but do not exclude the existence or addition of one or more other features, integral bodies, steps, operations, elements, components and / or their groups. It is also noted that, as used herein, the terms "substantially", "approximately" and other similar terms are used as approximate terms and not as degree terms, and are thus used to explain the inherent deviation of measured values, calculated values ​​and / or provided values ​​that will be recognized by those of ordinary skill in the art.

[0055] Various exemplary embodiments are described herein with reference to cross-sectional views and / or exploded views of schematic diagrams of idealized exemplary embodiments and / or intermediate structures. As such, variations in the shapes of the diagrams, such as those caused by manufacturing techniques and / or tolerances, are anticipated. Therefore, the exemplary embodiments disclosed herein should not necessarily be interpreted as being limited to the specific illustrated shapes of the regions, but will include deviations in shapes caused by, for example, manufacturing. In this manner, the regions shown in the drawings may be schematic in nature, and the shapes of these regions may not reflect the actual shapes of the regions of the device, and are not necessarily intended to be limiting.

[0056] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by those of ordinary skill in the art to which this disclosure is a part. Terms (such as those defined in general dictionaries) should be interpreted as having a meaning consistent with their meaning in the context of the relevant art and should not be interpreted in an idealized or overly formal sense unless expressly so defined herein.

[0057] Figure 1 is a flowchart of a method of manufacturing an organic light emitting display device according to an exemplary embodiment.

[0058] Figure 2A , Figure 2B , Figure 2C , Figure 2D , Figure 2E , Figure 2F and Figure 2G It is a schematic diagram showing the Figure 1 A plan view of a method of manufacturing an organic light emitting display device according to an exemplary embodiment of the present invention. In detail, Figure 2A is a plan view showing a mother display panel 100 and a mother protective film 50 stacked on each other; Figure 2B is a plan view showing a mother protective film 50 including a cutting line CL1 and a first additional cutting line CL2 formed therein; Figure 2C is a plan view showing a primary peeling of the mother protective film 50; Figure 2D is a plan view showing secondary peeling of the mother protective film 50; Figure 2E is a plan view showing an operation of cutting a mother substrate; Figure 2F is a plan view showing an operation of rounding a corner portion of the display unit CE; Figure 2G is a plan view showing an operation of polishing the edge of the display unit CE.

[0059] Figure 3 yes Figure 2B A schematic cross-sectional view of region A of Figure 4 yes Figure 2C Schematic cross-sectional view of region B of FIG.

[0060] Reference Figure 1 ,according to Figure 1The method of manufacturing an organic light-emitting display device of an exemplary embodiment may include the following operations: operation S1 of laminating a mother display panel and a mother protective film, the mother display panel including a plurality of display units and a peripheral area around the display units, each display unit including a display area; operation S2 of forming a cutting line and a first additional cutting line in the mother protective film, the cutting line having a closed loop shape corresponding to the display unit, and the first additional cutting line being near the cutting line; operation S3 of once peeling off a portion of the mother protective film in which the cutting line is formed by applying a first force to the first additional cutting line; operation S4 of secondarily peeling off a dummy area other than a target area within the cutting line from the mother display panel by applying a second force to the mother protective film; operation S5 of cutting the mother display panel to divide the mother display panel into a plurality of display units; and operation S6 of processing the edges of the plurality of display units. Operations S1, S2, S3, and S4 constitute a method of separating the mother protective film. The mother protective film 50 represents a protective film in a mother state.

[0061] Reference Figure 2A , the mother protective film 50 is stacked on the mother display panel 100 .

[0062] The mother display panel 100 includes a plurality of display cells CE and a peripheral area PA located around the display cells CE.

[0063] Each display unit CE is a minimum unit that can be individually separated and allocated as a display device after a cutting process, and may include a display area DA (see Figure 3 ) and a non-display area NDA (see Figure 3 ).

[0064] The display area DA is a region where an image is displayed, and a plurality of pixels may be arranged in the display area DA, each pixel including an organic light emitting device 30 (see Figure 3 ). Each pixel may include at least two thin film transistors and at least one capacitor.

[0065] The non-display area NDA is an area where an image is not displayed, and wirings, pad units PAD, and circuit units for applying an electrical signal to the display area DA may be arranged in the non-display area NDA. Figure 2A , nine display cells CE are shown, but this is an example. Actually, the mother display panel 100 may include more display cells CE.

[0066] The peripheral area PA is an area removed after the cutting operation. Wiring or pads for detecting the performance of the display unit CE may be arranged in a portion of the peripheral area PA, and in another portion of the peripheral area PA, no functional layer may be formed, and only the mother substrate 10 may be arranged or some insulating layers may be further arranged on the mother substrate 10.

[0067] The mother substrate 10 may include a glass material. The mother substrate 10 formed of a glass material has greater rigidity than a substrate formed of a plastic material, and thus, the display unit CE may be formed on the mother substrate 10 formed of a glass material without a supporting substrate, thereby simplifying the process of attaching and detaching the supporting substrate.

[0068] The mother protective film 50 is attached to the display unit CE to protect the display unit CE. The mother protective film 50 may include an adhesive layer 51 (see Figure 3 ) and basement membrane 52 (see Figure 3 ).

[0069] The base film 52 is a plastic film supporting the adhesive layer 51 , and may include, for example, polyethylene terephthalate (PET).

[0070] The adhesive layer 51 includes an adhesive material. The mother protective film 50 may be removed except for the target area TA (see FIG. 1 ) before the cutting operation. Figure 2B ) outside the dummy area RA (see Figure 2B ), and the target area TA may be removed after the display unit CE is completed.

[0071] Reference Figure 2B , a cutting line CL1 and a first additional cutting line CL2 are formed on the mother protective film 50 .

[0072] Each cutting line CL1 has a closed loop shape smaller than the area of ​​the display unit CE in a region corresponding to the display unit CE, and each first additional cutting line CL2 extends along the first direction X and connects between adjacent cutting lines CL1, and each end of the first additional cutting line CL2 extends to each end of the mother protective film 50.

[0073] The mother protective film 50 includes a target area TA and a dummy area RA outside the target area TA, the target area TA being defined by cutting lines CL1 each having a closed loop shape.

[0074] Reference shows Figure 2B Part A Figure 3 , the target area TA at the inside of the cutting line CL1 may include a portion of the display area DA and the non-display area NDA.

[0075] The thin film transistor TFT and the capacitor and various wires may be disposed on the mother substrate 10 in the display area DA. The organic light emitting device 30 electrically connected to at least one thin film transistor TFT may be disposed on the mother substrate 10.

[0076] The organic light emitting device 30 may include a first electrode 31 , an intermediate layer 32 including an organic emission layer, and a second electrode 33 .

[0077] The first electrode 31 and the second electrode 33 may include a reflective layer formed of Mg, Al, Pt, Pd, Au, Ni, Nd, Ir, Cr or a mixture thereof, or may include a transparent conductive oxide layer on or below the reflective layer. Alternatively, the first electrode 31 and the second electrode 33 may be a thin film including Ag or an Ag alloy, or may include a transparent conductive oxide layer formed on the thin film. Depending on the type and thickness of the conductive material, the first electrode 31 and the second electrode 33 may be formed as a reflective electrode or a light-transmitting electrode.

[0078] The pixel defining layer 34 covering the end of the first electrode 31 may prevent or suppress electric field concentration at the end of the first electrode 31 and define a light emitting region.

[0079] The intermediate layer 32 may further include at least one of a hole injection layer, a hole transport layer, an electron transport layer, and an electron injection layer in addition to the organic emission layer.

[0080] The thin film encapsulation member 40 is arranged on the organic light emitting device 30. The thin film encapsulation member 40 may include a first inorganic layer 41, an organic layer 42, and a second inorganic layer 43. The organic layer 42 may include a polymer material such as polymethyl methacrylate (PMMA), polycarbonate (PC), polystyrene (PS), acrylic resin, epoxy resin, polyimide, and polyethylene. The first inorganic layer 41 and the second inorganic layer 43 may include aluminum nitride (AlN), aluminum oxide (Al 2 O 3 ), titanium nitride (TiN), titanium oxide (TiO 2 ), silicon oxynitride (SiON), silicon nitride (SiN x ), silicon oxide (SiO x )wait.

[0081] A mother protective film 50 including an adhesive layer 51 and a base film 52 on the thin film encapsulation member 40 is disposed in the display area DA. The mother protective film 50 is integrally attached (ie, as a single unit) over an area of ​​the dummy area RA covering the non-display area NDA and out of the target area TA.

[0082] Despite Figure 34 shows the mother protective film 50 attached to the thin film encapsulation member 40 , but a touch sensing layer may be further arranged on the thin film encapsulation member 40 , and the mother protective film 50 may be attached to the touch sensing layer.

[0083] According to another exemplary embodiment, instead of a structure in which the thin film encapsulation member 40 and the touch sensing layer are independent of each other, the touch sensing layer may be formed between the thin films of the thin film encapsulation member 40 , and the mother protective film 50 may be attached to the outermost film of the thin film encapsulation member 40 .

[0084] According to another exemplary embodiment, a polarizing film may be further included on the thin film encapsulation member 40 , and the mother protective film 50 may be attached to the polarizing film.

[0085] According to another exemplary embodiment, the mother protective film 50 may be attached to the thin film encapsulation member 40 on which both the touch sensing layer and the polarizing film are included.

[0086] In other words, the mother protective film 50 is integrally attached to the mother display panel 100 after forming all components required for each display cell CE before the cutting operation.

[0087] although Figure 3 The mother protective film 50 is shown to be directly attached to the mother substrate 10 in the non-display area NDA, but the disclosure is not limited thereto. Some insulating layers may be further disposed between the mother substrate 10 and the mother protective film 50.

[0088] The cutting line CL1 and the first additional cutting line CL2 may be formed in the mother protective film 50 using a laser beam. For example, the laser beam may be a CO 2 Laser or yttrium aluminum garnet (YAG) laser. As in the present embodiment, when the mother protective film 50 includes a non-metallic organic compound material, CO 2 laser.

[0089] Here, the mother protective film 50 is cut by adjusting the laser beam intensity and / or the laser irradiation time so that the laser beam does not reach the mother substrate 10 (this may be referred to as half-cutting hereinafter).

[0090] In detail, the cutting depth D1 of the cutting line CL1 and the first additional cutting line CL2 is set smaller than the total thickness D2 of the mother protective film 50 so that the base film 52 of the mother protective film 50 is completely cut but the adhesive layer 51 is only partially cut in the thickness direction.

[0091] When the base film 52 is not completely cut, it is difficult to peel off the mother protective film 50, and therefore, the cutting is performed at least until the thickness of the base film 52. However, since the intensity of the emitted laser beam has a process distribution within a specific range, if the laser beam intensity is too large, the cutting depth may exceed the depth of the adhesive layer 51 and may be greater than the thickness D2 of the mother protective film 50. In this case, the mother substrate 10 may be damaged, or when some insulating layers are on the mother substrate 10, the insulating layers may be damaged, and thus the organic light-emitting device 30 may be degraded. Therefore, the cutting may be performed by adjusting the intensity and / or irradiation time of the laser beam so that only the adhesive layer 51 is partially cut in the depth direction.

[0092] According to another exemplary embodiment, in the mother protective film 50, the cutting line CL1 and the first additional cutting line CL2 may be formed using an ultrasonic cutter. The ultrasonic cutter generates micro vibrations with an amplitude of about 10 to about 70 micrometers (μm) at about 20 kHz to about 40 kHz in the third direction Z by using the force generated in the piezoelectric element to resonate the vibrator and the blade, thereby cutting the mother protective film 50. Also in this case, the mother protective film 50 is half-cut so that the adhesive layer 51 is partially cut, so that the ultrasonic wave does not reach the mother substrate 10 by adjusting the amplitude and / or vibration of the ultrasonic cutter.

[0093] The cutting performed using the laser beam requires a device to collect gas by-products of the base film 52 and the adhesive layer 51 generated due to heat and exhaust the gas by-products, whereas when an ultrasonic cutter is used, such by-products are not generated.

[0094] According to another exemplary embodiment, in the mother protective film 50, a common cutter such as a cutter may be used to form the cutting line CL1 and the first additional cutting line CL2. Also in this case, the mother protective film 50 may be half-cut so that the adhesive layer 51 is partially cut so that the blade of the cutter does not reach the mother substrate 10 by adjusting the cutting depth of the cutter.

[0095] Reference Figure 2C and Figure 2D , the mother protective film 50 undergoes a primary peeling operation and a secondary peeling operation.

[0096] By applying a first force F1 to the first additional cutting line CL2, a portion of the mother protective film 50 in which the cutting line CL1 is formed is peeled off from the mother display panel 100 once, and by applying a second force F2 to the mother protective film 50, the dummy area RA except the target area TA defined by the cutting line CL1 is peeled off secondarily.

[0097] exist Figure 2C, the first forces F1 directed in different directions are denoted by the same reference numeral. Forces denoted by the same reference numeral are not limited to forces having the same magnitude, and may be interpreted as forces having similar magnitudes being applied.

[0098] Reference shows Figure 2C Part B Figure 4 , a first force F1 is applied to the mother protective film 50 in the second direction Y by using a peeling pin 60 . An irregular or jagged surface 61 is formed at an end of the peeling pin 60 to increase friction with the mother protective film 50 .

[0099] When a first force F1 is applied from the first additional cutting line CL2 along the second direction Y, the cutting line CL1 connected to the first additional cutting line CL2 and pointing along the second direction Y is also cut, thereby causing the mother protective film 50 adjacent to the first additional cutting line CL2 to peel off and push the mother protective film 50 along the second direction Y.

[0100] On the other hand, when a first force F1 is applied from an adjacent first additional cutting line CL2 in a direction –Y opposite to the second direction Y, the cutting line CL1 connected to the adjacent first additional cutting line CL2 and pointing in a direction –Y opposite to the second direction Y is also cut, thereby causing the mother protective film 50 to be peeled off and pushed in a direction –Y opposite to the second direction Y.

[0101] like Figure 2C As shown in FIG. 1 , a first force F1 is applied from a plurality of locations where the first additional cutting lines CL2 are formed. A portion of the mother protective film 50 is peeled off by the first force F1. In other words, the first force F1 causes the region of the mother protective film 50 where the first additional cutting lines CL2 in the first direction X are formed and the region of the mother protective film 50 where the cutting lines CL1 in the second direction Y are formed to be peeled off. Figure 2D At this time, because the cutting line CL1 and the first additional cutting line CL2 have been half-cut, tearing of the adhesive layer 51 may occur in the portion of the adhesive layer 51 that has not been completely cut.

[0102] When a portion of the mother protective film 50 has been peeled off once and the second force F2 is applied to the dummy area RA of the mother protective film 50 along the first direction X, the portion of the mother protective film 50 that has not been peeled off during the first peeling at the cutting line CL1 (i.e., Figure 2D The portions not represented by bold segments in the figure are easily peeled off because each portion extends in the first direction X which is the same as the direction of the second force F2. Such secondary peeling can be performed at several portions simultaneously during one process, or can be performed during multiple processes.

[0103] Although the direction of the second force F2 is shown two-dimensionally on the XY plane, the second force F2 may be applied as a three-dimensional vector. For example, the second force F2 may have a component along the third direction Z. The component in the third direction Z included in the second force F2 may be greater than the adhesive force between the mother protective film 50 and the mother substrate 10.

[0104] When the first force F1 is omitted and only the second force F2 is applied, the adhesive layer 51 is partially retained without being removed by the component of the second force F2 on the plane from the region that is not parallel to the first direction X but intersects the first direction X (i.e., the portion of each cutting line CL1 extending along the second direction Y), and therefore, the target area TA near the cutting line CL1 is lifted during the peeling operation. However, according to the present embodiment, before the second force F2 is applied, the first force F1 is applied to the portion of the cutting line CL1 extending along the direction intersecting the second force F2 on the plane, and thus the cutting line CL1 is pre-peeled. Therefore, according to the present embodiment, the dummy area RA can be peeled with fewer defects. At this time, because the adhesive layer 51 is not completely removed due to the half-cutting, the adhesive layer 51 can be retained with irregular width and irregular height at the portion of the line of the virtual closed loop shape surrounding the display area.

[0105] Before the primary peeling of the mother protective film 50, a process of etching the mother substrate 10 formed of a glass material to make the mother substrate 10 thinner may be further included. In this case, an acid-resistant film may be further attached to the mother protective film 50. As the mother substrate 10 becomes thinner, a thin display device may be obtained.

[0106] Reference Figure 2E , after the dummy area RA of the mother protective film 50 is peeled off and the target area TA remains, the mother substrate 10 is cut.

[0107] The cutting lines SL are formed along the edges of the plurality of display cells CE in the first direction X and the second direction Y. As shown in FIG.

[0108] The cutting operation can be performed using a laser beam or a wheel cutting device. The laser beam can be a CO 2 Alternatively, the cutting line SL may be formed by using a wheel cutting device by applying force from the mother protective film 50 toward the mother substrate 10. In other words, the cutting operation may be simplified by performing the cutting operation on the upper surface of the mother substrate 10 without turning the mother substrate 10 over.

[0109] Reference Figure 2F , showing an operation of rounding corner portions E1, E2, E3, and E4 of the display unit CE-0 separated by the cutting operation. By rounding the corner portions E1, E2, E3, and E4, the strength of the device can be enhanced.

[0110] Reference Figure 2G , showing the operation of polishing the edge of the display unit CE. Since the border of the display unit CE cut by the wheel cutting device has a rough surface, it may cause defects in the subsequent module process. Therefore, by polishing the border of the display unit CE, the defect rate of the display unit CE can be reduced.

[0111] exist Figure 2G After the operation shown in FIG. 1 , a cleaning operation or the like may be additionally performed, and when subsequent operations such as bonding the external connection terminal to the pad unit PAD while the protective film is being attached to the target area TA are completed, the protective film attached to the target area TA may be finally removed. Alternatively, when the protective film is a functional film or according to other needs, the protective film attached to the target area TA may not be removed but may be retained.

[0112] As described above, in the method of peeling off the mother protective film and the method of manufacturing an organic light-emitting display device according to the disclosure, the peeling is performed by applying the first force F1 to the portions of the cutting line CL1 that extend in the direction intersecting the second force F2 on the plane before applying the second force F2, and thus, the dummy area RA can be peeled off with fewer defects. In addition, the protective film is not attached to each individual display unit, but the protective film is used and attached as a whole, and thus, the process can be simplified. In addition, even when the protective film is attached to the mother display panel of the assembly of the glass substrate and the thin film encapsulation member, the cutting operation can be performed only by using a wheel cutting device, and thus, the process can be simplified.

[0113] Will refer to Figure 5A , Figure 5B , Figure 5C , Figure 5D , Figure 5E , Fig. 5F and Figure 5G The method of manufacturing an organic light emitting display device according to a comparative example is described. Figure 2A , Figure 2B , Figure 2C , Figure 2D , Figure 2E , Figure 2F and Figure 2G The exemplary embodiments of the method of manufacturing an organic light emitting display device are described in detail. Figure 5A , Figure 5B , Figure 5C , Figure 5D , Figure 5E , Fig. 5F and Figure 5G method.

[0114] Reference Figure 5A , a mother protective film 50 is stacked on the mother display panel 100 .

[0115] The mother display panel 100 may include a plurality of display cells CE and a peripheral area PA located around the display cells CE, and the mother substrate 10 may include a glass material. The mother protective film 50 is attached to the display cells CE to protect the display cells CE.

[0116] Reference Figure 5B , a cutting line CL1 , a first additional cutting line CL2 , a second additional cutting line CL3 , and a third additional cutting line CL4 are formed on the mother protective film 50 .

[0117] Similar to Figure 1 According to the above-described embodiment, each cutting line CL1 has a closed loop shape smaller than the area of ​​each display cell CE in a region corresponding to each display cell CE.

[0118] Each first additional cutting line CL2 extends in the second direction Y but is not connected between adjacent cutting lines CL1, and an end of the first additional cutting line CL2 is connected to the second additional cutting line CL3. The second additional cutting line CL3 and the third additional cutting line CL4 surround the display unit CE and are both cut in a grid shape.

[0119] CO can be used 2 Here, the mother protective film 50 is cut by adjusting the laser beam intensity and / or laser irradiation time so that the laser beam does not reach the mother substrate 10.

[0120] Reference Figure 5C , when the mother protective film 50 has been completely attached, a first cutting operation is performed on the mother substrate 10 .

[0121] Before the first cutting operation, a process of etching the mother substrate 10 formed of a glass material so that the mother substrate 10 becomes thinner may be further included. In this case, an acid-resistant film may be further attached to the mother protective film 50.

[0122] A plurality of first cutting lines SL1 are formed along the edges of the plurality of display units CE in the first direction X and the second direction Y. In the first cutting operation, a laser beam may be used. Alternatively, in the first cutting operation, a wheel cutting device may be used.

[0123] In the comparative example, the mother protective film 50 of the dummy area RA is not removed, and therefore, no force is applied from the mother protective film 50 toward the mother substrate 10. In other words, after the mother substrate 10 has been turned over, the first cutting operation is performed on the lower surface of the mother substrate 10. Figure 2A , Figure 2B , Figure 2C , Figure 2D , Figure 2E , Figure 2F and Figure 2G Different from the above-mentioned embodiment, an operation of turning the mother substrate 10 upside down is additionally performed.

[0124] After the first cutting operation, the mother display panel 100 is divided into a plurality of cells each including the display cell CE- 1 .

[0125] Reference Figure 5D , shows an operation of peeling the dummy area RA of the mother protective film 50 - 1 obtained due to the aforementioned division from the display cell CE- 1 obtained due to the first cutting operation.

[0126] The dummy area RA of the mother protective film 50-1 is peeled off by applying a force F3 in two directions from each first additional cutting line CL2. The peeling operation needs to be performed for a plurality of display cells CE-1 obtained by the aforementioned division, so the peeling operation is repeated a number of times equal to the number of display cells CE-1. In addition, the peeling operation is performed on the upper surface of the mother protective film 50-1 by turning the display cells CE-1 upside down again.

[0127] Reference Figure 5E , when the dummy area RA has been peeled off and the target area TA remains, a second cutting operation is performed in which a second cutting line SL2 is formed to remove a boundary of the display cell CE- 1 .

[0128] Reference Fig. 5F , the corner portions E1, E2, E3, and E4 of the display unit CE-0 obtained as a result of the second cutting operation are rounded, thereby forming the display unit CE-0 having the rounded corner portions.

[0129] Reference Figure 5G , through Fig. 5F The boundary of the display unit CE-0 is polished to form the display unit CE.

[0130] Unlike the comparative example, in this embodiment, instead of removing the dummy area of ​​the protective film for each individual display unit, the dummy area can be removed at once in the mother state, thereby increasing process efficiency. In addition, the number of times the mother substrate is turned upside down can be reduced, thereby increasing process efficiency.

[0131] In the following, reference will be made to Figure 6 , Figure 7 , Figure 8 , Fig. 9 and Fig.10 Various examples of the cutting lines and the additional cutting lines formed in the mother protective film 50 according to the present embodiment will be described.

[0132] Reference Figure 6, both ends of the first additional cutting line CL2 connected between the cutting lines CL1 are formed inside the cutting line CL1. In other words, by overlapping the cutting line CL1 and the first additional cutting line CL2, the peeling operation may be easily performed.

[0133] Reference Figure 7 , the first additional cutting line CL2 may be separated from the cutting line CL1. The first end of the first additional cutting line CL2 may be separated from the cutting line CL1 by a first width Wa, and the second end of the first additional cutting line CL2 may be separated from the other cutting line CL1 by a second width Wb. Along the first width Wa and the second width Wb, the adhesive layer 51 may be retained (see Figure 3 ) part.

[0134] Reference Figure 8 , two first additional cutting lines CL2 may be formed at the corner portions of the cutting line CL1. In this case, the first peeling process may be performed by applying the first force F1 from the corner portions of the cutting line CL1 in a direction opposite to the direction of the second force F2. Even in this case, since the peeling is performed by applying the first force F1 to portions of the cutting line CL1 each extending in a direction intersecting the second force F2 on a plane before applying the second force F2, the dummy area RA may be peeled with fewer defects.

[0135] Reference Fig. 9 , two first additional cutting lines CL2 may be formed at the corner portion of the cutting line CL1, and two second additional cutting lines CL3 may be formed around the corner portion of the cutting line CL1 in parallel with the corner portion of the cutting line CL1. The two second additional cutting lines CL3 are respectively connected to both ends of the two first additional cutting lines CL2. In this case, the first stripping process may be performed by applying the first force F1 from one of the two first additional cutting lines CL2 in a direction intersecting with the direction of the second force F2. Even in this case, since the stripping is performed by applying the first force F1 to the portions of the cutting line CL1 each extending in a direction intersecting with the second force F2 on a plane before applying the second force F2, the dummy area RA may be stripped with fewer defects.

[0136] Reference Fig.10 , when the interval W between the adjacent cutting lines CL1 is wide, peeling by using only the first additional cutting line CL2 may be difficult. A second additional cutting line CL3 is formed parallel to the cutting line CL1 and connected to the first additional cutting line CL2, and a first force F1 is applied from the first additional cutting line CL2 in the second direction Y. Even in this case, since the second force F2 (see FIG. 1 ) is applied, the second additional cutting line CL3 is formed parallel to the cutting line CL1 and connected to the first additional cutting line CL2. Figure 2D) before peeling is performed by applying the first force F1 to the portions of the cutting line CL1 extending in the direction intersecting the second force F2 on the plane, so the dummy area RA can also be peeled with fewer defects.

[0137] Now refer to Fig.11A , Fig. 11B , Fig. 11C and Fig.11D A method for manufacturing an organic light emitting display device according to another exemplary embodiment will be described. Figure 1 The present embodiment is described with reference to the differences between the exemplary embodiments of the present invention.

[0138] Fig.11A Shown with Figure 1 Example embodiments of Figure 2B In other words, when the mother display panel 100 (see Figure 2B ) and the mother protective film 50 are stacked, the cutting line CL1 and the first additional cutting line CL2 are formed in the mother protective film 50. In this case, the adhesive layer 51 (see Figure 3 ) has relatively high adhesion.

[0139] Reference Fig. 11B , an area other than the target area TA of the mother protective film 50 (ie, the dummy area RA) is irradiated with ultraviolet (UV) rays to reduce the adhesiveness of the adhesive layer 51 .

[0140] Reference Fig. 11C and Fig.11D , a portion of the mother protective film 50 in which the cutting line CL1 is formed is peeled off from the mother display panel 100 once by applying a first force F1 to the first additional cutting line CL2, and a dummy area RA other than the target area TA defined by the cutting line CL1 is peeled off for a second time by applying a second force F2 to the mother protective film 50. Fig. 11C and Fig.11D An exemplary embodiment of Figure 2C and Figure 2D The difference is that UV is further irradiated to the dummy area RA of the mother protective film 50 .

[0141] By using the mother protective film 50 but irradiating UV only to the dummy area RA, the adhesiveness of the dummy area RA can be reduced, thereby facilitating the peeling operation. In addition, in the target area TA, the adhesiveness of the mother protective film 50 is strong, so this embodiment can be applied to operations requiring strong adhesiveness, for example, when the mother protective film 50 is attached to a polarizing film and used.

[0142] Now refer to Fig. 12A , Fig. 12B , Fig. 12C and Fig.12D A method for manufacturing an organic light emitting display device according to another exemplary embodiment will be described. Fig.11A , Fig. 11B , Fig. 11C and Fig.11D The present embodiment is described with reference to the differences between the exemplary embodiments of the present invention.

[0143] In addition to the adhesiveness of the mother protective film 50, Fig. 12A and Fig.11A In other words, when the mother display panel 100 (see Figure 2B ) and the mother protective film 50 are stacked, a cutting line CL1 and a first additional cutting line CL2 are formed in the mother protective film 50. In this case, a low-viscosity adhesive layer 51 (see Figure 3 ) is used as a mother protective film 50.

[0144] Reference Fig. 12C and Fig.12D , a portion of the mother protective film 50 in which the cutting line CL1 is formed is peeled off from the mother display panel 100 once by applying a first force F1 to the first additional cutting line CL2, and a dummy area RA other than the target area TA defined by the cutting line CL1 is peeled off for a second time by applying a second force F2 to the mother protective film 50.

[0145] Reference Fig.12D , only the target area TA of the mother protective film 50 is irradiated with UV by using a mask, so that the adhesion of the adhesive layer 51 is enhanced.

[0146] and Fig.11A , Fig. 11B , Fig. 11C and Fig.11D Compared with the exemplary embodiment of the present embodiment, the present embodiment is different in that: although an adhesive layer with low adhesiveness is used, UV is irradiated to the target area after the peeling operation, thereby enhancing the adhesiveness of the adhesive layer. However, also in the present embodiment, the adhesiveness of the mother protective film 50 in the target area TA is strong, so the present embodiment can be applied to operations requiring strong adhesiveness, for example, in the case where the mother protective film 50 is attached to a polarizing film and used.

[0147] Now refer to Fig.13 and Fig.14 A method of manufacturing an organic light emitting display device according to another exemplary embodiment will be described.

[0148] Reference Fig.13 and Fig.14 The display unit CE+1 includes a display area DA and a non-display area NDA, and the non-display area NDA includes a circular hole or an irregular hole formed in the display area DA.

[0149] The stacking structure of the display area DA is based on Figure 1 Therefore, the plurality of organic light emitting devices 30 (see Figure 3 ) is arranged on the substrate 10, and the thin film encapsulation member 40 (see Figure 3 ) encapsulates the organic light emitting device 30. Figure 1 The difference of the aforementioned embodiment is that the non-display area NDA is located within the display area DA.

[0150] In this case, the protective film 50' may be disposed on the thin film encapsulation member 40 in the display area DA and on the substrate 10 in the non-display area NDA. As described above, in the display area DA, a touch sensing layer and / or a polarizing film may be further disposed between the thin film encapsulation member 40 and the protective film 50'.

[0151] The protective film 50' includes an adhesive layer 51' and a base film 52', and a closed loop shaped cutting line CL1 is formed in the protective film 50' around a hole corresponding to the non-display area NDA. The depth of the cutting line CL1 may be less than or equal to the thickness of the protective film 50'.

[0152] The hole obtained by peeling the protective film 50' from the substrate 10 by applying the torsion force F4 to the closed loop-shaped cutting line CL1 can be subjected to subsequent processes. According to the foregoing present embodiment, even when the dummy area of ​​the protective film 50' is very narrow, the protective film 50' can be peeled from the substrate 10 by using the foregoing cutting process and torsion.

[0153] According to the present embodiment described above, since the first force F1 is applied to portions of the cutting line CL1 each extending in a direction intersecting the second force F2 on a plane for peeling before the second force F2 is applied, the dummy area RA can be peeled with fewer defects.

[0154] In addition, the protective film is not attached to each individual display unit CE, but the protective film is integrally used and attached, and thus, the process can be simplified.

[0155] In addition, even when the protective film is attached to the mother display panel of the assembly of the glass substrate and the thin film encapsulation member, a cutting operation can be performed only by using a wheel cutting device, and thus, the process can be simplified.

[0156] In addition, the cutting operation may be simplified by performing the cutting operation on the upper surface of the mother substrate 10 without turning over the mother substrate 10 .

[0157] Although certain exemplary embodiments and implementations have been described herein, other embodiments and modifications will be apparent from this description. Therefore, the inventive concept is not limited to such embodiments, but is limited to the broader scope of the appended claims and various obvious modifications and equivalent arrangements that will be apparent to those of ordinary skill in the art.

Claims

1. A method for peeling a mother protective film from a mother display panel, the method comprising: stacking the mother display panel and the mother protective film, the mother display panel comprising a plurality of display units and a peripheral area around the plurality of display units, the plurality of display units each comprising a display area; forming a target area and a dummy area in the mother protective film by forming a cutting line and a first additional cutting line adjacent to a side of the cutting line and extending in a first direction intersecting the side, the cutting line being in a closed loop shape surrounding the target area corresponding to each of the plurality of display units; Physically peeling the dummy area from the mother display panel comprises the following steps: peeling off the portion of the dummy area of ​​the mother protective film adjacent to the first additional cutting line once; and peeling off the remaining dummy area of ​​the mother protective film from the mother display panel twice along the cutting line. Wherein, the first additional cutting line is in a straight line shape.

2. A method for peeling a mother protective film from a mother display panel, the method comprising: stacking the mother display panel and the mother protective film, the mother display panel comprising a plurality of display units and a peripheral area around the plurality of display units, the plurality of display units each comprising a display area; forming a target area and a dummy area in the mother protective film by forming a cutting line and a first additional cutting line at a corner portion of the cutting line, the cutting line being in a closed loop shape surrounding the target area corresponding to each of the plurality of display units; Physically peeling the dummy area from the mother display panel comprises the following steps: peeling off the portion of the dummy area of ​​the mother protective film adjacent to the first additional cutting line once; and peeling off the remaining dummy area of ​​the mother protective film from the mother display panel twice along the cutting line. Wherein, the first additional cutting line is in a straight line shape.

3. The method according to claim 1 or 2, wherein: The depths of the cutting line and the first additional cutting line are smaller than the thickness of the mother protective film.

4. The method according to claim 1 or 2, wherein: The cutting line and the first additional cutting line are formed using a laser beam.

5. The method of claim 4, wherein: The laser beam comprises a CO2 laser.

6. The method according to claim 1 or 2, wherein: The cutting line and the first additional cutting line are formed using a cutter.

7. The method according to claim 1 or 2, wherein: The cutting line and the first additional cutting line are formed using an ultrasonic cutter including a vibrator and a blade.

8. The method according to claim 1 or 2, wherein: The first additional cutting line is connected to the cutting line.

9. The method of claim 1, wherein: The first additional cutting line is connected to the cutting line, and at least one end of the first additional cutting line is formed within the cutting line.

10. The method of claim 1, wherein: The first additional cutting line is spaced apart from the cutting line.

11. The method of claim 2, further comprising: A second additional cutting line connected to the first additional cutting line is formed in the mother protective film.

12. The method of claim 11, wherein: The step of peeling the portion of the mother protective film at one time includes applying a first force between the first additional cutting line and the second additional cutting line.

13. The method of claim 1, wherein: The step of peeling off the portion of the mother protective film at one time includes applying a first force having a component away from the first additional cutting line in a second direction, the second direction intersecting the first direction, and The step of secondarily peeling off the remaining dummy area of ​​the mother protective film includes applying a second force in the first direction to the first peeled off mother protective film.

14. The method of claim 13, wherein: The primary peeled mother protective film includes a portion of the cut line extending in a direction intersecting the second force.

15. The method of claim 13, wherein: The first force is applied using a peel pin.

16. The method according to claim 1 or 2, wherein: The target region defined by the cutting line in the closed loop shape has an area smaller than that of the display unit.

17. The method of claim 1 or 2, wherein: The mother protective film includes an adhesive layer attached to the mother display panel and a base film disposed on the adhesive layer.

18. The method of claim 17, further comprising: Before the primary peeling, the dummy region is irradiated with ultraviolet rays to reduce the adhesive force of a portion of the adhesive layer corresponding to the dummy region.

19. The method of claim 17, further comprising: After the secondary peeling, the target area is irradiated with ultraviolet rays to increase the adhesive force of a portion of the adhesive layer corresponding to the target area.

20. The method of claim 1 or 2, wherein: The mother display panel includes a substrate including a glass material, and The method further includes: before the primary stripping of the mother protective film, etching the substrate to reduce the thickness of the substrate.

21. A method for manufacturing an organic light emitting display device, the method comprising: forming a mother display panel on a mother substrate, the mother display panel comprising: a display unit including a plurality of organic light emitting devices and an encapsulation member encapsulating the plurality of organic light emitting devices; and a peripheral region arranged around the display unit; laminating a mother protective film on the mother display panel; forming a target area and a dummy area on the mother protective film by forming a cutting line and an additional cutting line, the cutting line being in a closed loop shape surrounding the target area corresponding to each of the display units, the additional cutting line being adjacent to a side of the cutting line and extending in a first direction intersecting the side, or at a corner portion of the cutting line; Physically peeling the dummy area from the mother display panel, comprising the steps of: peeling off the portion of the dummy area of ​​the mother protective film adjacent to the additional cutting line once; and peeling off the remaining dummy area of ​​the mother protective film from the mother display panel twice along the cutting line; dividing the mother substrate into a plurality of display units by cutting the mother substrate; and processing edges of the plurality of display units, Wherein, the additional cutting line is in a straight line shape.

22. The method of claim 21, wherein: The mother substrate was cut using a wheel cutting device.

23. The method of claim 22, wherein: The mother substrate is cut by applying a force to the wheel cutting device in a direction from the mother protective film to the mother substrate.

24. The method of claim 21, wherein: The step of processing the edges of the plurality of display units includes rounding corner portions of the plurality of display units.

25. The method of claim 21, wherein: The step of processing the edges of the plurality of display units includes polishing the edges of the plurality of display units.

26. The method of claim 21, wherein: The encapsulation member includes at least one organic layer and at least one inorganic layer.

27. The method of claim 21, further comprising: Before laminating the mother protective film, a touch layer is formed on the packaging member.

28. The method of claim 21, further comprising: Before laminating the mother protective film, a polarizing layer is formed on the packaging member.

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