Ground chip device and its production method, installation method and electronic device

Abstract

The invention discloses a ground chip device and a production method, an installation method and an electronic device thereof, and belongs to the field of communication. The ground chip device comprises a first body having a positive electrode, a negative electrode, a ground electrode and a ground element on the front side, two or more gold strips are spot welded or bonded on the ground electrode, the length direction of the connection part between the gold strip and the ground electrode is parallel to the length direction of the first body, the gap between adjacent gold strips is ≤5mm, the gap between the gold strip near the edge of the first body and the edge of the first body is ≤5mm, the thickness of the gold strip is less than 50μm, the width of the gold strip bonded to the ground electrode is h1, the width of the gold strip spot welded to the ground electrode is h2, 30μm≤h1<50μm, 50μm≤h2<1500μm.

Description

Technical Field

[0001] The present invention relates to the field of microelectronics, and in particular to a grounding chip device and a production method, an installation method and an electronic device thereof. Background Art

[0002] Many microwave and communication electronic devices need to be installed with grounding chip devices made of ceramic materials, such as attenuation chips, ceramic inductors, adjustable resistors, through and absorption resistors, etc. These grounding chip devices are generally installed in the mounting slots on the electronic equipment with conductive glue, and the grounding electrode of the grounding chip device is directly connected to the grounding electrode of the electronic equipment with the conductive glue, and then the input and output ends of the grounding chip device are respectively connected to the corresponding interface ends on the electronic equipment (the input end, output end, grounding electrode and grounding element of the grounding chip device are all located on the front of the grounding chip device, and the grounding element is connected to the grounding electrode).

[0003] The thermal expansion coefficient of ceramic materials is 5-7ppm / ℃, while the expansion coefficient of the conductive glue after curing is about 31PPM / ℃, which is more than three times different. It takes time for conductive glue to cure, especially in the microelectronics industry. The conductive glue attached to the side will be subjected to gravity in the uncured state and during the curing process, which will cause only a very thin layer of conductive glue on the side wall. After curing, this part of the conductive glue is "hung" on the side wall. Due to the difference in thermal expansion coefficients, it is very easy to cause cracks in this part of the conductive glue under high and low temperature conditions, causing the grounding electrode of the grounding chip device to fail to conduct with the grounding electrode of the electronic device. At the same time, since the main component of the conductive glue is silver, due to the characteristics of silver, it will migrate over time, that is, the conductive glue on the grounding electrode may migrate, causing the hidden danger of short circuit or performance degradation of the grounding chip device. Summary of the invention

[0004] In view of the above-mentioned deficiencies in the prior art, the present invention aims to provide a ground chip device capable of improving the working stability of the ground chip device, and a production method, an installation method and an electronic device thereof.

[0005] In order to achieve the purpose of the above invention, the technical solution adopted by the present invention is:

[0006] A grounding chip device is provided, comprising a first body having a positive electrode, a negative electrode, a grounding electrode and a grounding element on the front side, wherein two or more gold strips are spot-welded or bonded to the grounding electrode, the length direction of the connecting portion between the gold strips and the grounding electrode is parallel to the length direction of the first body, the gap between adjacent gold strips is ≤5mm, the gap between the gold strip close to the edge of the first body and the edge of the first body is ≤5mm, the thickness of the gold strip is less than 50μm, the width of the gold strip bonded to the grounding electrode is h1, the width of the gold strip spot-welded to the grounding electrode is h2, 30μm≤h1<50μm, 50μm≤h2<1500μm.

[0007] Furthermore, there are two grounding elements, and the connecting parts between the two gold strips and the grounding electrode are respectively close to different grounding elements, and the connecting line between the connecting part between the gold strip and the grounding electrode and the grounding element close to it is parallel to the length direction of the first body.

[0008] Furthermore, the distance between adjacent solder joints or bonding points between the gold strip and the ground electrode is less than or equal to the minimum length of the corresponding solder joints or bonding points.

[0009] Furthermore, the gold strip is spot welded to the ground electrode, and the other end of the gold strip is spot welded to the bottom metal layer of the first body. The gold strip is U-shaped and covers part of the side surface of the first body close to the ground electrode.

[0010] Furthermore, there are two grounding elements, and the number of gold strips is three. The connection parts between the three gold strips and the grounding electrodes are respectively located between the two grounding elements and on both sides of the two grounding elements.

[0011] In a second aspect, a method for producing a grounding chip device in which the other end of the gold strip is spot-welded to the bottom metal layer of the first body is provided, comprising:

[0012] S1. Determine the size and quantity of the required gold belts according to the first body, and then obtain the required gold belts;

[0013] S2. Weld one end of the gold ribbon to the ground electrode of the first body, and weld the other end of the gold ribbon to the bottom metal layer of the first body.

[0014] In a third aspect, an electronic device is provided, which includes a second body having a first mounting groove and a grounding chip device in which the other end of the gold tape provided in this solution is not spot-welded to the bottom metal layer of the first body, the bottom surface of the first body is installed in the first mounting groove by a conductive glue arranged in the first mounting groove, the other end of the gold tape is welded to the grounding electrode of the second body, the projection of the gold tape on the plane where the first body is located is parallel to the length direction of the first body, the height of the highest point of the conductive glue is less than the height of the front face of the first body, and the distance between the conductive glue and the plane where the front face of the first body is located is greater than 1 / 3 of the thickness of the first body, and the positive and negative electrodes of the first body are respectively connected to the corresponding interface ends on the second body.

[0015] In a fourth aspect, a method for installing a ground chip device in the above electronic device is provided, comprising:

[0016] S1. After applying conductive glue into the first installation groove, the bottom surface of the first body is brought into contact with the conductive glue. After the contact, the height of the highest point of the conductive glue is less than the height of the front surface of the first body, and the distance between the highest point of the conductive glue and the plane where the front surface of the first body is located is greater than 1 / 3 of the thickness of the first body.

[0017] S2. Weld the other end of the gold strip to the ground electrode of the second body, and connect the positive electrode and the negative electrode of the first body to the corresponding interface ends on the second body respectively.

[0018] In a fifth aspect, an electronic device is provided, comprising a third body having a second mounting groove and a grounding chip device spot-welded between the other end of the gold tape provided in this solution and the bottom metal layer of the first body, wherein the bottom surface of the grounding chip device is installed in the second mounting groove by means of a conductive glue arranged in the second mounting groove, the conductive glue extends to contact the grounding electrode of the third body, the height of the conductive glue close to the highest point of the first body part is less than the height of the front face of the first body, and the distance between the conductive glue and the plane where the front face of the first body is located is greater than 1 / 3 of the thickness of the first body, and the positive and negative electrodes of the first body are respectively connected to the corresponding interface ends on the third body.

[0019] In a sixth aspect, a method for installing a ground chip device in the above electronic device is provided, comprising:

[0020] S1, applying conductive glue into the second installation groove, so that the conductive glue contacts the grounding electrode of the third body;

[0021] S2, contacting the bottom surface of the first body with the conductive adhesive, after which the height of the conductive adhesive near the highest point of the first body is less than the height of the front surface of the first body, and the distance between the conductive adhesive and the plane where the front surface of the first body is located is greater than 1 / 3 of the thickness of the first body;

[0022] S3, connecting the positive electrode and the negative electrode of the first body to the corresponding interface terminals on the third body respectively.

[0023] The beneficial effects of the present invention are:

[0024] Based on the grounding chip device in which the other end of the gold belt is not spot-welded to the bottom metal layer of the first body, when used, the other end of the gold belt of the grounding chip device is spot-welded to the grounding electrode of the electronic device, so that the grounding electrode of the grounding chip device and the grounding electrode of the electronic device are connected through the gold belt. There is no need to conduct the grounding electrode of the grounding chip device and the grounding electrode of the electronic device through conductive glue, thus avoiding conduction failure caused by different expansion coefficients, and also avoiding the hidden danger of short circuit or performance degradation caused by the migration characteristics of silver in the conductive glue on the grounding electrode, thereby greatly improving the working stability of the grounding chip device.

[0025] Based on the spot welding between the other end of the gold belt and the bottom metal layer of the first body, when used, the grounding electrode of the grounding chip device and the grounding electrode of the electronic device are connected through the gold belt, the bottom metal layer of the grounding chip device and the conductive glue located in the second installation groove. Part of the conductive glue in the second installation groove is located at the bottom of the grounding chip device, and part of it extends to the grounding electrode of the electronic device. The remaining very small part will overflow due to the gravity of the grounding chip device and surround the bottom of the side wall of the grounding chip device. At this time, the gold belt located on the side is in contact with the overflowing conductive glue, and at the same time, the bottom metal layer of the grounding chip device and the gold belt located on the bottom metal layer of the grounding chip device are fully in contact with the conductive glue located at the bottom of the grounding chip device. Therefore, although the conductive glue may crack due to the difference in expansion coefficients, the possibility of conduction failure is greatly reduced because the bottom metal layer of the grounding chip device and the gold belt located on the bottom metal layer of the grounding chip device are fully in contact with the conductive glue located at the bottom of the grounding chip device. At the same time, the hidden danger of short circuit or performance degradation caused by the migration characteristics of silver on the conductive glue on the grounding electrode is avoided, thereby improving the working stability of the grounding chip device.

[0026] At the same time, since the gap between adjacent gold strips is ≤5mm, the gap between the gold strip close to the edge of the first body and the edge of the first body is ≤5mm, the thickness of the gold strip is less than 50μm, the width of the gold strip bonded to the ground electrode is h1, and the width of the gold strip spot-welded to the ground electrode is h2, 30μm≤h1<50μm, 50μm≤h2<1500μm, so as to ensure good conduction based on the gold strip. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 It is a front view of a ground chip device in a specific embodiment of the present invention;

[0028] Figure 2 for Figure 1 Rear view of.

[0029] Among them, 1. gold belt; 2. grounding electrode; 3. first body; 4. positive electrode; 5. grounding capacitor; 6. negative electrode; 7. bottom metal layer. DETAILED DESCRIPTION

[0030] The specific implementation of the present invention is described in detail below in conjunction with the accompanying drawings so that those skilled in the art can understand the present invention. However, it should be clear that the embodiments described below are only part of the embodiments of the present invention, not all of the embodiments. Without departing from the spirit and scope of the present invention defined and determined by the attached claims, all other embodiments obtained by those skilled in the art without any creative work belong to the protection scope of the present invention.

[0031] like Figure 1As shown, the grounding chip device includes a first body 3 with an input terminal 4, an output terminal 6, a grounding electrode 2 and a grounding element on the front side, two or more gold strips 1 are spot-welded or bonded to the grounding electrode 2, the length direction of the connecting part between the gold strips 1 and the grounding electrode 2 is parallel to the length direction of the first body 3, the gap between adjacent gold strips 1 is ≤5mm, the gap between the gold strip 1 close to the edge of the first body 3 and the edge of the first body 3 is ≤5mm, the thickness of the gold strip 1 is less than 50μm, the width of the gold strip 1 bonded to the grounding electrode 2 is h1, the width of the gold strip 1 spot-welded to the grounding electrode 2 is h2, 30μm≤h1<50μm, 50μm≤h2<1500μm.

[0032] When implementing, Figure 1 As shown, there are two grounding elements, and the connecting parts between the gold strip 1 and the grounding electrode 2 are close to different grounding elements respectively. The connecting line between the connecting part between the gold strip 1 and the grounding electrode 2 and the grounding element close to it is parallel to the length direction of the first body 3.

[0033] In one embodiment, the distance between adjacent welding points or bonding points between the gold strip 1 and the ground electrode 2 is less than or equal to the minimum length of the corresponding welding points or bonding points to achieve better spot welding or bonding effect.

[0034] In some application scenarios, due to the position and size of the mounting slot on the electronic device and the size of the leather knife of the existing spot welding equipment, it is difficult to use the existing belt to weld the other end of the gold belt 1 to the ground electrode of the electronic device. Therefore, in order to expand the application scope of the ground chip device, such as Figure 1 and Figure 2 As shown, in another embodiment, the gold ribbon 1 is spot welded to the ground electrode 2, and the other end of the gold ribbon 1 is spot welded to the bottom metal layer 7 of the first body 3. The gold ribbon 1 is U-shaped, and the gold ribbon 1 covers part of the side surface of the first body 3 close to the ground electrode 2. Therefore, during the installation of the ground chip device, it is not necessary to weld the other end of the gold ribbon 1 to the ground electrode of the electronic device, which greatly reduces the difficulty of installing the ground chip device and greatly expands the application range of the ground chip device.

[0035] like Figure 1 As shown, taking the attenuation chip as an example, the grounding elements are two grounding capacitors 5, the number of gold strips 1 is three, and the connection parts between the three gold strips 1 and the grounding electrodes 2 are respectively located between the two grounding capacitors 5 and on both sides of the two grounding capacitors 5.

[0036] In a second aspect, a method for producing a grounding chip device in which the other end of the gold strip 1 is spot-welded to the bottom metal layer 7 of the first body 3 is provided, comprising:

[0037] S1. Determine the size and quantity of the required gold strips 1 according to the first body 3, and then obtain the required gold strips 1; specifically, when implementing, the size and quantity of the gold strips 1 need to be determined according to the width of the first body 3, the position of the grounding element on the first body 3 connected to the grounding electrode 2, and the gap between adjacent gold strips 1 is ≤5mm, the gap between the gold strip 1 close to the edge of the first body 3 and the edge of the first body 3 is ≤5mm, the thickness of the gold strip 1 is less than 50μm, the width of the gold strip 1 bonded to the grounding electrode 2 is h1, the width of the gold strip 1 spot-welded to the grounding electrode 2 is h2, 30μm≤h1<50μm, 50μm≤h2<1500μm.

[0038] S2 , welding one end of the gold ribbon 1 to the ground electrode 2 of the first body 3 , and welding the other end of the gold ribbon 1 to the bottom metal layer 7 of the first body 3 .

[0039] During implementation, the minimum distance between the welding point and the side surface of the gold strip 1, the bottom metal layer 7 and the ground electrode 2 in this solution is a, 0.1mm≤a≤0.2mm. The thickness of the gold strip 1 is 8μm-12.7μm, so as to avoid the gold strip 1 being too thick, which may cause the first body 3 to be uneven during installation, the wrapping and forming to be difficult during spot welding, the spot welding parameters to be difficult to achieve the low welding strength, etc., and also avoid the gold strip 1 being too thin, which may cause the gold strip 1 to break at the welding edge, melt at the welding surface, and fail easily.

[0040] Specifically, when the thickness of the gold strip 1 is 12.7 μm and the spot welding machine model is SW-P300 / SW-P600, the spot welding parameters are as follows:

[0041] Pressure 9g~11g (too much pressure will fracture the first body 3, make the root of the gold ribbon 1 fragile or break the gold ribbon 1; too little pressure will cause poor pressing and affect the performance of the grounding chip device); (time 6.5ms~9ms. Too short a time will affect the spot welding strength. Too long a time will cause the root of the spot-welded gold ribbon 1 to be fragile and unable to withstand stress, making installation difficult); voltage 6.5V~7.4V (too little voltage will cause insufficient spot welding strength. Too much voltage will easily cause the grounding electrode 2 and the bottom gold layer of the gold ribbon 1 or the first body 3 to be melted, affecting the performance of the grounding chip device).

[0042] In the third aspect, the present scheme provides an electronic device, which includes a second body having a first mounting groove and a grounding chip device provided by the present scheme, wherein the other end of the gold tape 1 is not spot-welded to the bottom metal layer 7 of the first body 3, the bottom surface of the first body 3 is installed in the first mounting groove through the conductive glue arranged in the first mounting groove, the other end of the gold tape 1 is welded to the grounding electrode of the second body, the projection of the gold tape 1 on the plane where the first body 3 is located is parallel to the length direction of the first body 3, the height of the highest point of the conductive glue is less than the height of the front face of the first body 3, and the distance between the conductive glue and the plane where the front face of the first body 3 is located is greater than 1 / 3 of the thickness of the first body 3, and the input end 4 and the output end 6 of the first body 3 are respectively connected to the corresponding interface ends of the second body.

[0043] Among them, the height of the highest point of the conductive glue is less than the height of the front face of the first body 3, and the distance between the highest point of the conductive glue and the plane where the front face of the first body 3 is located is greater than 1 / 3 of the thickness of the first body 3, thereby reducing the hidden danger of short circuit or performance degradation of the grounding chip device due to the migration of the conductive glue silver around the bottom of the side wall of the grounding chip device due to the overflow of the grounding chip device due to gravity.

[0044] In a fourth aspect, the present solution further provides a method for installing a ground chip device in the above electronic device, comprising:

[0045] S1. After applying conductive glue into the first installation groove, the bottom surface of the first body 3 is brought into contact with the conductive glue. After contact, the height of the highest point of the conductive glue is less than the height of the front surface of the first body 3, and the distance between the highest point of the conductive glue and the plane where the front surface of the first body 3 is located is greater than 1 / 3 of the thickness of the first body 3.

[0046] S2. Weld the other end of the gold strip 1 to the ground electrode of the second body, and connect the input end 4 and the output end 6 of the first body 3 to the corresponding interface ends of the second body respectively.

[0047] In the fifth aspect, the present scheme provides an electronic device, which includes a third body having a second mounting groove, and a grounding chip device spot-welded between the other end of the gold tape 1 provided in the present scheme and the bottom metal layer 7 of the first body 3, the bottom surface of the grounding chip device is installed in the second mounting groove by a conductive glue arranged in the second mounting groove, the conductive glue extends to contact the grounding electrode of the third body, the height of the highest point of the conductive glue close to the first body 3 is less than the height of the front face of the first body 3, and the distance between the conductive glue and the plane where the front face of the first body 3 is located is greater than 1 / 3 of the thickness of the first body 3, and the input terminal 4 and the output terminal 6 of the first body 3 are respectively connected to the corresponding interface terminals of the third body.

[0048] In a sixth aspect, the present solution further provides a method for installing a ground chip device in the above electronic device, comprising:

[0049] S1, applying conductive glue into the second installation groove, so that the conductive glue contacts the grounding electrode of the third body;

[0050] S2, the bottom surface of the first body 3 is brought into contact with the conductive adhesive. After the contact, the height of the highest point of the conductive adhesive close to the first body 3 is less than the height of the front surface of the first body 3, and the distance between the conductive adhesive and the plane where the front surface of the first body 3 is located is greater than 1 / 3 of the thickness of the first body 3;

[0051] S3, connecting the input end 4 and the output end 6 of the first body 3 to the input end 4 and the output end 6 of the third body respectively.

Claims

1. An electronic device comprising a second body having a first mounting groove, characterized in that: The grounding chip device comprises a first body (3) having an input terminal (4), an output terminal (6), a grounding electrode (2) and a grounding element on the front side, wherein two or more gold strips (1) are spot welded or bonded to the grounding electrode (2), the length direction of the connection portion between the gold strips (1) and the grounding electrode (2) is parallel to the length direction of the first body (3), the gap between adjacent gold strips (1) is ≤5 mm, the gap between the gold strip (1) close to the edge of the first body (3) and the edge of the first body (3) is ≤5 mm, the thickness of the gold strip (1) is less than 50 μm, the width of the gold strip (1) bonded to the grounding electrode (2) is h1, the width of the gold strip (1) spot welded to the grounding electrode (2) is h2, 30 μm ≤ h1 < 50 μm, 50 μm ≤ h2 < 1500 μm; The bottom surface of the first body (3) is installed in the first installation groove by means of a conductive adhesive arranged in the first installation groove, the other end of the gold strip (1) is welded to the ground electrode of the second body, the projection of the gold strip (1) on the plane where the first body (3) is located is parallel to the length direction of the first body (3), the height of the highest point of the conductive adhesive is less than the height of the front face of the first body (3), and the distance between the conductive adhesive and the plane where the front face of the first body (3) is located is greater than 1 / 3 of the thickness of the first body (3), and the input end (4) and the output end (6) of the first body (3) are respectively connected to the corresponding interface ends on the second body; There are two grounding elements, and there are three gold strips (1). The connection parts between the three gold strips (1) and the grounding electrodes (2) are respectively located between the two grounding elements and on both sides of the two grounding elements.

2. A method for installing a ground chip device in an electronic device according to claim 1, characterized in that: include: S1, after applying conductive glue into the first installation groove, the bottom surface of the first body (3) is brought into contact with the conductive glue, wherein after the contact, the height of the highest point of the conductive glue is less than the height of the front surface of the first body (3), and the distance between the highest point of the conductive glue and the plane where the front surface of the first body (3) is located is greater than 1 / 3 of the thickness of the first body (3); S2. Weld the other end of the gold strip (1) to the ground electrode of the second body, and connect the input end (4) and the output end (6) of the first body (3) to the corresponding interface ends on the second body respectively.

3. An electronic device comprising a third body having a second mounting slot, characterized in that: The grounding chip device comprises a first body (3) having an input terminal (4), an output terminal (6), a grounding electrode (2) and a grounding element on the front side, wherein two or more gold strips (1) are spot welded or bonded to the grounding electrode (2), the length direction of the connection portion between the gold strips (1) and the grounding electrode (2) is parallel to the length direction of the first body (3), the gap between adjacent gold strips (1) is ≤5 mm, the gap between the gold strip (1) close to the edge of the first body (3) and the edge of the first body (3) is ≤5 mm, the thickness of the gold strip (1) is less than 50 μm, the width of the gold strip (1) bonded to the grounding electrode (2) is h1, the width of the gold strip (1) spot welded to the grounding electrode (2) is h2, 30 μm ≤ h1 < 50 μm, 50 μm ≤ h2 < 1500 μm; The bottom surface of the grounding chip device is installed in the second installation groove by means of a conductive glue arranged in the second installation groove, the conductive glue extends to contact the grounding electrode of the third body, the height of the highest point of the conductive glue close to the first body (3) is less than the height of the front face of the first body (3), and the distance between the conductive glue and the plane where the front face of the first body (3) is located is greater than 1 / 3 of the thickness of the first body (3), and the input end (4) and the output end (6) of the first body (3) are respectively connected to the corresponding interface ends on the third body; The gold belt (1) is U-shaped, the gold belt (1) is spot welded to the ground electrode (2), the other end of the gold belt (1) is spot welded to the bottom metal layer (7) of the first body (3), and the gold belt (1) covers a portion of the side surface of the first body (3) close to the ground electrode (2); The grounding elements are two grounding capacitors, the number of the gold strips (1) is three, and the connection parts between the three gold strips (1) and the grounding electrodes (2) are respectively located between the two grounding elements and on both sides of the two grounding elements.

4. A method for installing a ground chip device in an electronic device according to claim 3, characterized in that: include: S1, applying conductive glue into the second installation groove, wherein the conductive glue is in contact with the grounding electrode of the third body; S2, bringing the bottom surface of the first body (3) into contact with the conductive adhesive, wherein after the contact, the height of the highest point of the conductive adhesive close to the first body (3) is less than the height of the front surface of the first body (3), and the distance between the conductive adhesive and the plane where the front surface of the first body (3) is located is greater than 1 / 3 of the thickness of the first body (3); S3, connecting the input end (4) and the output end (6) of the first body (3) to corresponding interface ends on the third body respectively.

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