Display device

By laser thermal curing and carbonizing materials along the edge of the cell during the manufacturing process of the quantum dot display device, reliability failures and moisture and oxygen permeability caused by unevenness between the quantum dot layer and the barrier layer are solved, and the display device is improved stability.

CN111522175BActive Publication Date: 2025-01-10SAMSUNG DISPLAY CO LTD
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Patent Information

Application Number
CN202010074034.0
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Priority Date
2019-02-01
Filing Date
2020-01-22
Publication Date
2025-01-10
Estimated Expiration
2040-01-22

AI Technical Summary

Technical Problem

During the cutting process, the quantum dot display device has reliability failure due to the integration between the quantum dot layer and the barrier layer, and is susceptible to moisture and oxygen penetration, resulting in deterioration.

Method used

During the manufacturing process, laser thermal curing is performed along the edge of the cell to seal the quantum dot layer, forming laser trimming sections to prevent moisture and oxygen penetration, and enhancing the sealing effect by carbonized materials.

Benefits of technology

Effectively prevent moisture and oxygen penetration, improve the stability and reliability of the quantum dot layer, and avoid failures caused by improper cutting.

✦ Generated by Eureka AI based on patent content.

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Abstract

Provided is a method of substantially preventing moisture or oxygen (O) from being generated by scribing a display panel including quantum dots during manufacturing and then thermally curing the cell edge portions using a laser to seal the quantum dot layer. 2 ) penetrates into the quantum dot layer. The display device includes a glass plate, a first passivation layer disposed on the glass plate, a wavelength conversion layer disposed on the first passivation layer, a second passivation layer disposed on the wavelength conversion layer, an optical sheet disposed on the second passivation layer, a display panel disposed on the optical sheet, and a laser trimming portion extending along edges of the first passivation layer, the wavelength conversion layer, and the second passivation layer.
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Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims the priority of Korean Patent Application No. 10-2019-0013792 filed on February 1, 2019 in the Korean Intellectual Property Office (KIPO), the disclosure of which is incorporated herein by reference in its entirety. Technical Field

[0003] Exemplary embodiments of the present invention relate to a display device, and more particularly, to a display device capable of substantially preventing moisture or oxygen (O 2 ) penetrates into a quantum dot layer and a method for manufacturing the display device. Background Art

[0004] Generally, quantum dot (QD) display devices (which are photoelectron emitting or electron emitting) are more desirable than liquid crystal display (LCD) devices because they have better color accuracy, higher color saturation, potentially wider contrast, and higher peak brightness, making quantum dot technology ideal for producing displays capable of ultra-high definition. However, light-emitting elements including quantum dots may have the disadvantage that they may be susceptible to degradation due to external factors such as moisture and oxygen introduced from the outside.

[0005] The quantum dot display device may have a structure in which a low refractive index layer, a bottom barrier layer, a quantum dot layer, a top barrier layer, and a cladding layer are disposed on a glass plate.

[0006] In a scribing and cutting process for cutting such a structure into unit cells, if the thickness of the upper layer of the quantum dot layer and the glass plate is too thick for cutting, the unit cell edge portion may not be cut cleanly. Since the unit cell edge portion may not be cut cleanly, separation may occur between the quantum dot layer and one or both of the bottom barrier layer and the top barrier layer, thereby causing reliability failures such as discoloration of defective quantum dots on the unit cell edge portion. Summary of the invention

[0007] Exemplary embodiments of the present invention may be directed to substantially preventing moisture or oxygen (O) from entering the display panel including quantum dots by scribing and cutting the display panel during the manufacturing process and then thermally curing the cell edge portion using a laser to seal the quantum dot layer. 2 ) is infiltrated into a quantum dot layer, and relates to a method for manufacturing the display device.

[0008] According to an exemplary embodiment of the present invention, a display device includes a glass plate, a first passivation layer disposed on the glass plate, a wavelength conversion layer disposed on the first passivation layer, a second passivation layer disposed on the wavelength conversion layer, an optical sheet disposed on the second passivation layer, a display panel disposed on the optical sheet, and a laser trimming portion extending along edges of the first passivation layer, the wavelength conversion layer, and the second passivation layer.

[0009] The laser trimmed portion may include a carbonized material.

[0010] The laser trimming portion may include a first laser trimming portion extending from the first passivation layer, a second laser trimming portion extending from the second passivation layer, and a side cover layer extending from the wavelength conversion layer.

[0011] At least one of the first laser trimmed portion, the second laser trimmed portion, and the side cover layer may include a carbonized material.

[0012] The first laser trimming portion and the second laser trimming portion may not overlap the wavelength conversion layer.

[0013] The laser trimming portion may include a first laser trimming portion extending from the first passivation layer, a second laser trimming portion extending from the second passivation layer, and a side cover layer extending from the first laser trimming portion, the wavelength conversion layer, and the second laser trimming portion.

[0014] At least one of the first laser trimmed portion, the second laser trimmed portion, and the side cover layer may include a carbonized material.

[0015] The first laser trimming portion and the second laser trimming portion may overlap the wavelength conversion layer.

[0016] The first laser trimming portion and the second laser trimming portion may not overlap the wavelength conversion layer.

[0017] The first passivation layer may include a low refractive index layer disposed on the glass plate and a first barrier layer disposed on the low refractive index layer.

[0018] The second passivation layer may include a second barrier layer disposed on the wavelength conversion layer and a cladding layer disposed on the second barrier layer.

[0019] The wavelength conversion layer may include wavelength conversion particles that convert the wavelength of at least a portion of incident light.

[0020] The wavelength converting particles may include quantum dot (QD) fluorescent materials or phosphorescent materials.

[0021] According to an exemplary embodiment of the present invention, a method for manufacturing a display device is provided, the method comprising: disposing a first passivation layer on a glass plate; disposing a wavelength conversion layer on the first passivation layer; disposing a second passivation layer on the wavelength conversion layer; disposing an optical sheet on the second passivation layer; disposing a display panel on the optical sheet; and thermally curing and sealing the first passivation layer, the wavelength conversion layer, and the second passivation layer along the boundaries of the cells using a laser.

[0022] When the first passivation layer, the wavelength conversion layer, and the second passivation layer are thermally cured and sealed along the boundary of the unit cell using a laser, a laser trimming portion extending along the edges of the first passivation layer, the wavelength conversion layer, and the second passivation layer may be formed.

[0023] The laser trimmed portion may include a carbonized material.

[0024] When a laser is used to thermally cure and seal the first passivation layer, the wavelength conversion layer, and the second passivation layer along the boundaries of the unit cells, the laser trimming portion may include a first laser trimming portion extending from the first passivation layer, a second laser trimming portion extending from the second passivation layer, and a side covering layer extending from the wavelength conversion layer.

[0025] When a laser is used to thermally cure and seal the first passivation layer, the wavelength conversion layer, and the second passivation layer along the boundaries of the unit cells, the laser trimming portion may include: a first laser trimming portion extending from the first passivation layer, a second laser trimming portion extending from the second passivation layer, and a side covering layer extending from the first laser trimming portion, the wavelength conversion layer, and the second laser trimming portion.

[0026] At least one of the first laser trimmed portion, the second laser trimmed portion, and the side cover layer may include a carbonized material.

[0027] The first laser trimming portion and the second laser trimming portion may overlap the wavelength conversion layer.

[0028] The first laser trimming portion and the second laser trimming portion may not overlap the wavelength conversion layer.

[0029] When the second passivation layer is disposed on the wavelength conversion layer, the wavelength conversion layer may include wavelength conversion particles that convert the wavelength of at least a portion of incident light.

[0030] The wavelength converting particles may include quantum dot (QD) fluorescent materials or phosphorescent materials.

[0031] According to an exemplary embodiment of the present invention, a display device includes: a reflective sheet; a diffuser plate disposed on the reflective sheet; a light source unit disposed between the reflective sheet and the diffuser plate, or disposed to face a side surface of a light guide plate included in the diffuser plate; an optical sheet disposed on the diffuser plate; and a display panel disposed on the optical sheet. The diffuser plate may include: a glass plate; a low refractive index layer disposed on the glass plate; a first barrier layer disposed on the low refractive index layer; a wavelength conversion layer disposed on the first barrier layer; a second barrier layer disposed on the wavelength conversion layer; a cladding layer disposed on the second barrier layer; and a laser trimming portion extending at least along edges of the first barrier layer, the wavelength conversion layer, and the second barrier layer.

[0032] The wavelength conversion layer may include wavelength conversion particles, and the wavelength conversion particles may include a quantum dot (QD) fluorescent material or a phosphorescent material uniformly dispersed in a resin.

[0033] The foregoing is illustrative only and is not intended to be in any way limiting. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] A more thorough understanding of the present invention will become more apparent by describing in detail exemplary embodiments of the present invention with reference to the accompanying drawings, in which:

[0035] Figure 1 is an exploded perspective view showing a display device including a diffusion plate according to an exemplary embodiment of the present invention;

[0036] Figure 2 It is shown Figure 1 A cross-sectional view of a detailed configuration of a diffuser plate shown in FIG.

[0037] Figure 3 is a cross-sectional view showing an internal structure of a diffusion plate having a first passivation layer and a second passivation layer according to an exemplary embodiment of the present invention;

[0038] Figure 4 is a cross-sectional view showing a diffusion plate according to an exemplary embodiment of the present invention;

[0039] Figure 5 is a view showing an exemplary embodiment of the present invention in which an edge type backlight unit is applied to a diffusion plate;

[0040] Figures 6 to 8 are views each showing an exemplary embodiment of the present invention in which a laser trimming portion is formed at a cell boundary after dividing a diffusion plate according to an exemplary embodiment of the present invention into unit cells;

[0041] Fig. 9 is a flowchart illustrating a method of manufacturing a display device according to an exemplary embodiment of the present invention;

[0042] Fig.10 is a view showing an exemplary embodiment of the present invention in which a diffusion plate has cell boundary lines formed by a laser scribing process;

[0043] Fig.11 is a view showing an exemplary embodiment of forming a laser trimming portion at an edge of each of a plurality of cells of the present invention;

[0044] Fig.12 It is shown Fig.11 an enlarged view of part a and part b in FIG; and

[0045] Fig.13 and Fig.14 1 is a view showing an exemplary embodiment of the present invention in which a color filter layer and an organic light emitting layer are formed between a first substrate and a second substrate of a display panel according to an exemplary embodiment of the present invention.

[0046] because Figures 1 to 14 The accompanying drawings in the drawings are intended for illustrative purposes, and therefore the elements in the drawings are not necessarily drawn to scale. For example, some of the elements may be enlarged or exaggerated for the purpose of clarity. DETAILED DESCRIPTION

[0047] Exemplary embodiments will now be described more fully below with reference to the accompanying drawings. Although the present invention can be modified in many ways and can have multiple exemplary embodiments, the exemplary embodiments are shown in the drawings and will be primarily described in the specification. However, the present invention is not limited to the disclosed exemplary embodiments, and should be interpreted as covering all changes, equivalents and substitutions included in the spirit and scope of the present invention.

[0048] When a layer, region or board is referred to as being "on" another layer, region or board, the layer, region or board may be directly on the other layer, region or board, or there may be an intervening layer, region or board. Conversely, when a layer, region or board is referred to as being "directly on" another layer, region or board, there may not be an intervening layer, region or board. Further, when a layer, region or board is referred to as being "below" another layer, region or board, the layer, region or board may be directly below another layer, region or board, or there may be an intervening layer, region or board. Conversely, when a layer, region or board is referred to as being "directly below" another layer, region or board, there may not be an intervening layer, region or board.

[0049] For ease of description, spatially relative terms "below", "below", "down", "above", "upper", etc. may be used herein to describe the relationship between one element or component and another element or component as shown in the drawings. It will be understood that in addition to the orientation shown in the drawings, the spatially relative terms are also intended to include different orientations of the device in use or operation. For example, in the case where the device shown in the drawings is turned over, a device positioned "below" or "below" another device can be placed "above" the other device. Therefore, the illustrative term "below" can include both upper and lower positions. The device may also be oriented in other directions, and therefore the spatially relative terms may be interpreted differently depending on the orientation.

[0050] Throughout the specification, when an element is referred to as being "connected" to another element, the element is "directly connected" to the other element, or "electrically connected" to the other element through one or more intervening elements interposed between the element and the other element. It will also be understood that when used in this specification, the terms "comprises", "comprising", "includes" and / or "comprising" indicate the presence of stated features, integers, steps, operations, elements, parts and / or collections, but do not exclude the presence or addition of one or more other features, integers, steps, operations, elements, parts and / or collections.

[0051] It will be understood that although the terms "first", "second", "third", etc. may be used herein to describe various elements, these elements should not be limited by these terms. These terms are only used to distinguish one element from another element. Therefore, without departing from the teachings of the present invention, the "first element" discussed below may be referred to as the "second element" or the "third element", and the "second element" and the "third element" may be named similarly.

[0052] As used herein, "about" or "approximately" includes the stated value and an average value within an acceptable deviation range of a particular value as determined by one of ordinary skill in the art taking into account the measurement in question and the errors associated with the measurement of the particular quantity (i.e., the limitations of the measurement system). For example, "about" may mean within one or more standard deviations, or within ±30%, ±20%, ±10%, ±5% of the stated value. In addition, unless otherwise specified, overlapping two constituent elements means that the two constituent elements overlap each other in a third direction (e.g., a direction perpendicular to the upper surface of the substrate).

[0053] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as those generally understood by those skilled in the art to which the present invention belongs. It should also be understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning consistent with their meaning in the context of the relevant technology, and should not be interpreted in an idealized or overly formalized meaning unless explicitly defined in this specification.

[0054] In order to clearly describe the exemplary embodiments of the present invention, some parts that are not related to the description may not be provided, and the same reference numerals denote the same elements throughout the specification.

[0055] In the following, reference will be made to Figures 1 to 14 A display device according to an exemplary embodiment of the present invention is described.

[0056] The display device according to the exemplary embodiment of the present invention may be applied to a quantum dot display device including a quantum dot layer. Such a quantum dot display device may include a diffusion plate for dispersing and diffusing light emitted from a light source to enhance light uniformity.

[0057] Figure 1 is an exploded perspective view showing a display device including a diffusion plate according to an exemplary embodiment of the present invention.

[0058] Reference Figure 1 , the display device according to the exemplary embodiment of the present invention includes the diffusion plate 100 for dispersing and diffusing the light emitted from the light source unit 500 to achieve uniform light distribution.

[0059] The diffusion plate 100 is disposed on the reflection sheet 400 , and the reflection sheet 400 is disposed on the bottom cover 300 .

[0060] The optical sheet 800 is disposed on the diffusion plate 100, and the display panel 700 is disposed on the optical sheet 800. The display panel 700 includes a first substrate 710 and a second substrate 720.

[0061] The display device according to an exemplary embodiment of the present invention includes a backlight unit that emits light to the display panel 700. Such a backlight unit may be classified into a direct type and an edge type. Figure 1 As shown in , the direct type backlight unit has a structure in which a plurality of light sources are arranged below the display panel 700. Figure 5 As shown in FIG. 8 , the edge type backlight unit has a structure in which a light source is disposed to face a side surface of a light guide plate and a plurality of optical sheets 800 are disposed between a display panel 700 and the light guide plate. The light guide plate may guide light generated by the light source unit 500 to the display panel 700.

[0062] like Figure 1As shown in , the display device according to an exemplary embodiment of the present invention may include a display panel 700 , a top cover 200 , and a backlight unit BLU.

[0063] The display panel 700 receives light from the backlight unit BLU and displays an image. The display panel 700 may be a light receiving display panel such as a liquid crystal display ("LCD") panel. Alternatively, the display panel 700 may be one of an electrophoretic display panel, a microelectromechanical system (MEMS) display panel, an electrowetting display panel, an electrochromic display panel, and an organic light emitting display panel, but the present invention is not limited thereto. Hereinafter, the display panel 700 will be described as an LCD panel by way of example.

[0064] The display panel 700 may be divided into a display area DA for displaying an image and a non-display area NDA surrounding the display area DA and not displaying an image.

[0065] The display panel 700 includes a first substrate 710 , a second substrate 720 opposite to the first substrate 710 , and a liquid crystal layer disposed between the first substrate 710 and the second substrate 720 .

[0066] The first substrate 710 may include a gate line, a data line, a thin film transistor and a pixel electrode. The gate line and the data line may be insulated from each other and intersect each other. The thin film transistor (which is a three-terminal element) is connected to one of the gate lines, one of the data lines and one of the pixel electrodes. The data voltage applied to the data line may be applied to the pixel electrode according to the signal applied to the gate line.

[0067] The second substrate 720 may be arranged to face the first substrate 710, and a liquid crystal layer is interposed between the second substrate 720 and the first substrate 710. The second substrate 720 may include a color filter and a common electrode. However, the present invention is not limited thereto. For example, in an exemplary embodiment of the present invention, at least one of the color filter and the common electrode may be formed at the first substrate 710. In an exemplary embodiment of the present invention, the second substrate 720 may be omitted, and a liquid crystal layer sealed by a color filter, a common electrode, and an insulating layer may be provided on the first substrate 710.

[0068] In a plan view, the second substrate 720 may have a size smaller than that of the first substrate 710. A portion of the first substrate 710 may be exposed by the second substrate 720. The exposed portion of the first substrate 710 may provide a space for mounting a driving chip or an external circuit board.

[0069] The liquid crystal layer may include a plurality of liquid crystal molecules that change their arrangement states according to an electric field formed between the first substrate 710 and the second substrate 720 .

[0070] exist Figure 1 , the display panel 700 is depicted as having a quadrilateral shape in a plan view. The long side of the display panel 700 may extend in a first direction DR1, and the short side of the display panel 700 may extend in a second direction DR2. The thickness direction of the display panel 700 may be defined as a third direction DR3. Although the display panel 700 approximately has a quadrilateral shape, the present invention is not limited thereto. For example, in various exemplary embodiments of the present invention, the display panel 700 may be configured to have a polygonal shape, a circular shape, an elliptical shape, or a shape corresponding to a portion of these shapes.

[0071] The display device according to the exemplary embodiment of the present invention may further include a flexible printed circuit board (“FPCB”) 780 and a printed circuit board (“PCB”) 770 .

[0072] The FPCB 780 is bent and electrically connects the display panel 700 and the PCB 770. One end portion of the FPCB 780 may be connected to one surface of the first substrate 710 exposed by the second substrate 720, and the other end portion of the FPCB 780 may be connected to the PCB 770. The FPCB 780 may include a plurality of FPCBs 780. The plurality of FPCBs 780 may be spaced apart from each other in the first direction DR1. Figure 1 In the embodiment, two FPCBs 780 are exemplarily provided.

[0073] The PCB 770 may be coupled to the backlight unit BLU. The PCB 770 may output a signal to the display panel 700 or receive a signal from the display panel 700 through the FPCB 780.

[0074] In an exemplary embodiment of the present invention, an integrated circuit ("IC") chip may be mounted at the FPCB 780. A data driver chip may be provided at the IC chip. The data driver chip may send a variety of signals to display an image in the display area DA of the display panel 700. The FPCB 780 may send a variety of signals to the data driver chip. The FPCB 780 may be a tape carrier package ("TCP") or a chip on film ("COF"). However, the present invention is not limited thereto. For example, the IC chip may be directly mounted on one surface of the first substrate 710.

[0075] The top cover 200 is spaced apart from the display panel 700 by the spacer SP, covers the edge of the display panel 700, and is coupled to the display panel 700 and the backlight unit BLU. The top cover 200 has an opening exposing the display area DA of the display panel 700.

[0076] The top cover 200 may include a front cover 210 and a side cover 220. The front cover 210 may cover the edge of the upper surface of the display panel 700. The side cover 220 may cover the side surfaces of the display panel 700 and the backlight unit BLU. For example, the front cover 210 may include an opening corresponding to the display area DA of the display panel 700, and may be arranged to overlap with the non-display area NDA of the display panel 700. Therefore, the display area DA of the display panel 700 may be exposed through the opening. The top cover 200 may include a front cover 210 parallel to the plane of the display panel 700, and one or more side walls of the side cover 220 extending from the rear surface of the front cover 210.

[0077] The backlight unit BLU is disposed under the display panel 700 to generate and provide light to the display panel 700 .

[0078] The backlight unit BLU may include a bottom cover 300 , a reflective sheet 400 , a light source unit 500 , a middle frame 600 , a diffusion plate 100 , and an optical sheet 800 .

[0079] The bottom cover 300 may include a bottom portion 310 and a sidewall 320 .

[0080] The bottom portion 310 may be flat and may be provided in a quadrangular shape in a plan view.

[0081] The sidewall 320 may protrude from the edge of the bottom portion 310 to extend, and may include a first sidewall 321, a second sidewall 322, a third sidewall 323, and a fourth sidewall 324. The first sidewall 321, the second sidewall 322, the third sidewall 323, and the fourth sidewall 324 may be connected to four sides of the bottom portion 310, respectively.

[0082] The first side wall 321 may be parallel to and most adjacent to one side of the display panel 700 to which the FPCB 780 is attached. A portion of the first side wall 321 may be inclined relative to the bottom portion 310. An angle formed between the portion of the first side wall 321 and the bottom portion 310 may be an obtuse angle. The second side wall 322, the third side wall 323, and the fourth side wall 324 may extend from the bottom portion 310 in the third direction DR3.

[0083] The reflective sheet 400 is disposed on the bottom portion 310 of the bottom cover 300 and below the light source unit 500 to guide light emitted from the light source unit 500 toward the top surface and may be formed of a reflective material such as metal. The reflective sheet 400 reflects most of light incident thereon.

[0084] The backlight unit BLU may further include a driving substrate. The driving substrate may be disposed between the bottom portion 310 and the reflective sheet 400. The driving substrate may be electrically connected to the light source unit 500 to provide a driving signal to the light source unit 500. There may be more than one driving substrate, for example, a plurality of driving substrates may be disposed under the reflective sheet 400.

[0085] The light source unit 500 is received in the bottom cover 300. The light source unit 500 includes a plurality of light sources and is disposed on the reflective sheet 400. The light source unit 500 is provided as a direct type, and light emitted from each light source is directly incident on the diffusion plate 100 without passing through a separate light guide plate.

[0086] Each of the light sources of the light source unit 500 may be a cold cathode fluorescent lamp (CCFL), a flat fluorescent lamp (FFL), or a light emitting diode (LED). Hereinafter, an exemplary description is made that each of the light sources of the light source unit 500 is an LED.

[0087] The light source of the light source unit 500 may include a white light source emitting white light. However, the present invention is not limited thereto. In an exemplary embodiment of the present invention, the light source may include a red light source emitting red light, a green light source emitting green light, and a blue light source emitting blue light.

[0088] The middle frame 600 includes an inclined portion 610, a base portion 620, and an elastic portion 630. In an exemplary embodiment of the present invention, the middle frame 600 is coupled with the bottom cover 300 to fix the reflective sheet 400, the light source unit 500, the diffusion plate 100, and the optical sheet 800 in place.

[0089] The inclined portion 610 and the base portion 620 may include materials different from each other. The inclined portion 610 and the base portion 620 may include metal or plastic materials. In addition, the elastic portion 630 includes a silicone rubber compound (e.g., including silane) or a rubber material having elasticity. The inclined portion 610 extends from the end portion of the base portion 620 toward the reflective sheet 400 and the light source unit 500. The inclined portion 610 is at an obtuse angle to the base portion 620.

[0090] The base portion 620 of the middle frame 600 may be parallel to the bottom portion 310 of the bottom cover 300. The elastic portion 630 is installed at an upper surface of the base portion 620, and the base portion 620 supports the elastic portion 630.

[0091] The elastic portion 630 may be attached to the base portion 620 by the adhesive force of the elastic portion 630 itself. The elastic portion 630 may include a coupling protrusion that may be engaged in an interlocking manner with a coupling recess 621 of the base portion 620. The base portion 620 has a coupling recess 621 that may accommodate a portion of the elastic portion 630 (i.e., the coupling protrusion).

[0092] The elastic portion 630 may extend in at least one of the first direction DR1 and the second direction DR2, and may support edges of four sides of the diffusion plate 100 and four sides of the optical sheet 800. In addition, the elastic portion 630 extends from the base portion 620 in the third direction DR3. The elastic portion 630 allows the diffusion plate 100 and the optical sheet 800 to be spaced apart from the display panel 700 by a distance D1 in the third direction DR3. Therefore, the thickness of the elastic portion 630 in the third direction DR3 is greater than the sum of the thickness of the diffusion plate 100 and the thickness of the optical sheet 800.

[0093] The elastic portion 630 has a recessed portion 632 that receives an edge portion of the diffusion plate 100. The recessed portion 632 of the elastic portion 630 extends around the middle frame 600 and receives an end portion of the diffusion plate 100. The elastic portion 630 may be spaced apart from each end portion of the diffusion plate 100 and the optical sheet 800 by a distance D2 in the first direction DR1 and the second direction DR2. That is, the elastic portion 630 has a width greater than a width of the diffusion plate 100 to be inserted. For example, the distance D2 may be measured within the recessed portion 632 of the elastic portion 630 in the first direction DR1 and the second direction DR2, and may be less than a depth of the recessed portion 632 of the elastic portion 630 in the first direction DR1 and the second direction DR2.

[0094] In the exemplary embodiment of the present invention, the distance D2 between the elastic portion 630 and the diffusion plate 100 is substantially equal to the distance between the elastic portion 630 and the optical sheet 800. However, the present invention is not limited thereto. For example, the distances may be different from each other.

[0095] Since the distances D1 and D2 are ensured for the elastic portion 630 and the diffusion plate 100 and the optical sheet 800 , a difference in thermal expansion coefficient between the diffusion plate 100 and the elastic portion 630 may be compensated in the first, second, and third directions DR1 , DR2 , and DR3 .

[0096] The elastic portion 630 includes an opaque material and thus substantially prevents light leakage that may be caused by light passing through the diffusion plate 100. For example, the side end portion of the elastic portion 630 surrounds three surfaces, such as the side surface, the upper surface, and the lower surface, of the end portion (e.g., the edge) of the diffusion plate 100. Therefore, the elastic portion 630 substantially prevents light leakage by blocking light incident between the diffusion plate 100 and the base portion 620 and blocking light emitted toward the end portion of the diffusion plate 100 among the light that has passed through the diffusion plate 100.

[0097] At least a portion of the diffusion plate 100 may be inserted into the concave portion 632 of the elastic portion 630. The diffusion plate 100 is used to uniformly diffuse the light emitted from the light source unit 500. That is, the diffusion plate 100 may disperse the light incident from the light source unit 500, thereby substantially preventing the light from being locally concentrated. For example, the diffusion plate 100 may diffuse the light emitted from the light source unit 500 to supply the light to the display panel 700 disposed above the optical sheet 800.

[0098] Figure 2 It is shown Figure 1 A cross-sectional view of a detailed configuration of the diffuser plate shown in FIG. Figure 3 is a cross-sectional view showing an internal structure of a diffusion plate having a first passivation layer and a second passivation layer.

[0099] Reference Figures 1 to 3 , the diffusion plate 100 according to the exemplary embodiment of the present invention includes a glass plate 110 , a first passivation layer 120 , a wavelength conversion layer 130 , a second passivation layer 140 , and a laser trimming portion 150 .

[0100] The diffuser plate 100 is used to disperse and diffuse the light emitted from the light source unit 500 to enhance light uniformity. For example, the diffuser plate 100 may have good diffusivity (haze) and good light transmittance, thereby achieving uniform brightness for the light emitted from the light source unit 500 and passing through the diffuser plate 100.

[0101] At the glass plate 110, one or more cells may be defined, and a scribe line may be marked at the boundary of each of the cells. The glass plate 110 may have a haze property. The haze value of the glass plate 110 may be in a range from about 30% to about 90%, and preferably in a range from about 50% to about 70%. If the haze value is greater than about 30%, the light diffusion rate may be sufficient to ensure light uniformity. Specifically, when the haze value is greater than about 50%, the light diffusion rate may be sufficient, and thus the difference in light and dark recognized on one side of the display screen may be significantly reduced. If the haze value is too large, the light transmittance is reduced and the brightness is reduced. From this point of view, the haze value may be about 90% or less, and more specifically, about 70% or less. The light transmittance of the glass plate 110 may be about 50% or more.

[0102] The first passivation layer 120 is disposed on the glass plate 110. In this exemplary embodiment, Figure 3 As shown in , the first passivation layer 120 may include a low refractive index layer 122 disposed on the glass plate 110 and a first barrier layer 124 disposed on the low refractive index layer 122 .

[0103] The low refractive index layer 122 can diffuse light and disperse light substantially uniformly. That is, the low refractive index layer 122 can refract the propagation direction of light emitted from the light source unit 500 in any direction and can have an overall uniform light distribution regardless of the arrangement of the light source unit 500. The low refractive index layer 122 can have a refractive index of about 1.0 or more and about 1.5 or less. The low refractive index layer 122 may include silicon oxide (SiO 2 ) and magnesium fluoride (MgF 3 ) at least one of the following. The low refractive index layer 122 may be formed to have a thickness of about 1000 angstroms. or larger and about 6000 angstroms or less thickness.

[0104] Since the first barrier layer 124 contacts the bottom portion of the wavelength conversion layer 130 , it may also be referred to as a bottom barrier layer.

[0105] The first barrier layer 124 is used to substantially prevent the penetration of moisture and / or oxygen (hereinafter, "moisture / oxygen"). The first barrier layer 124 may include an inorganic material. For example, the first barrier layer 124 may include, for example, silicon nitride (Si 3 N 4 ), aluminum nitride (AlN), zirconium nitride (ZrN), titanium nitride (TiN), hafnium nitride (HfN), tantalum nitride (TaN), silicon oxide (SiO 2 ), aluminum oxide (Al 2 O 3 ), titanium oxide (TiO 2 ), tin oxide (SnO 2 ), cerium oxide (CeO 2 ) and silicon oxynitride (SiON), or may include a metal thin film that ensures light transmittance. The first barrier layer 124 may include a material substantially the same as the material included in the low refractive index layer 122, but the present invention is not limited thereto. The first barrier layer 124 may be formed by a method such as chemical vapor deposition (CVD).

[0106] The wavelength conversion layer 130 is disposed on the first passivation layer 120. That is, the wavelength conversion layer 130 is formed to contact the upper surface of the first barrier layer 124. For example, the first barrier layer 124 may be disposed on the bottom surface of the wavelength conversion layer 130 to prevent moisture / oxygen from penetrating into the wavelength conversion layer 130, thereby preventing the wavelength conversion layer 130 from being deteriorated.

[0107] The wavelength conversion layer 130 converts the wavelength of at least a portion of the incident light and may include wavelength conversion particles 132 .

[0108] In an exemplary embodiment of the present invention, the wavelength conversion layer 130 may include wavelength conversion particles 132 uniformly dispersed in a resin. The resin may be formed of, for example, at least one of epoxy resin, silicone resin, polystyrene, acrylate, or a combination thereof. However, the present invention is not limited thereto. For example, the resin may include any transparent medium that does not affect the wavelength conversion performance of the wavelength conversion particles 132.

[0109] The wavelength conversion particles 132 are particles for converting the wavelength of light incident thereon, and may be, for example, quantum dots (QD) fluorescent materials or phosphorescent materials. Hereinafter, quantum dots as examples of wavelength conversion particles 132 will be described in detail. When used in a display device, quantum dots (QD) fluorescent materials or phosphorescent materials can produce pure monochromatic red, green, and blue light. Quantum dots are such a material: it has a crystal structure of several nanometers in size, includes hundreds to thousands of atoms, and exhibits a quantum confinement effect (with an increased band gap due to the small size of the quantum dots). In the case where light having a wavelength with an energy higher than the band gap is incident on the quantum dots, the quantum dots are excited by absorbing the light and fall to the ground state when emitting light of a specific wavelength. The emitted light of a specific wavelength has an energy value corresponding to the band gap. With such quantum dots, the luminescence characteristics can be controlled based on the quantum confinement effect by adjusting the size and composition of the quantum dots. Since the emitted light of a specific wavelength has an energy value corresponding to the band gap, the incident light on the quantum dots is converted into different wavelengths by selecting materials having quantum dots with different band gaps. For example, light of a desired wavelength range can be obtained by controlling the composition of quantum dots. On the other hand, even quantum dots comprising the same material can have different wavelengths depending on their particle size. Since the smaller the quantum dot, the shorter the wavelength of light emitted from the quantum dot, light of a desired wavelength range can be obtained by controlling the size of the quantum dot.

[0110] The quantum dots may include, for example, at least one of a II-VI compound, a II-V compound, a III-VI compound, a III-V compound, a IV-VI compound, a I-III-VI compound, a II-IV-VI compound, and a II-IV-V compound.

[0111] The quantum dot may include a core and a shell covering the core. The core may be or include, for example, at least one of the following: cadmium sulfide (CdS), cadmium selenide (CdSe), cadmium telluride (CdTe), zinc sulfide (ZnS), zinc selenide (ZnSe), zinc telluride (ZnTe), gallium nitride (GaN), gallium phosphide (GaP), gallium arsenide (GaAs), gallium antimonide (GaSb), aluminum nitride (AlN), aluminum phosphide (AlP), aluminum arsenide (AlAs), aluminum antimonide (AlSb), indium phosphide (InP), indium arsenide (InAs), indium antimonide (InSb), silicon carbide (SiC), calcium (Ca), selenium (Se), indium (In), phosphorus (P), iron (Fe), platinum (Pt), nickel (Ni), cobalt (Co), aluminum (Al), silver (Ag), gold (Au), copper (Cu), iron platinum (FePt), ferrous oxide (Fe 2 O 3 ), iron (II, III) oxide (Fe 3 O 4 ), silicon (Si) and germanium (Ge), but the present invention is not limited thereto. The shell may be or include, for example, at least one of the following items: zinc sulfide (ZnS), zinc selenide (ZnSe), zinc telluride (ZnTe), cadmium sulfide (CdS), cadmium selenide (CdSe), cadmium telluride (CdTe), mercury sulfide (HgS), mercury selenide (HgSe), mercury telluride (HgTe), aluminum nitride (AlN), aluminum phosphide (AlP), aluminum arsenide (AlAs), aluminum antimonide (AlSb), gallium nitride (GaN), Gallium phosphide (GaP), gallium arsenide (GaAs), gallium antimonide (GaSb), cadmium selenide (GaSe), indium nitride (InN), indium phosphide (InP), indium arsenide (InAs), indium antimonide (InSb), thallium nitride (TlN), thallium phosphide (TlP), thallium arsenide (TlAs), thallium antimonide (TlSb), lead sulfide (PbS), lead selenide (PbSe) and lead telluride (PbTe), but the present invention is not limited thereto.

[0112] The wavelength conversion particles 132 may include a plurality of wavelength conversion particles that may convert the wavelength of light incident thereon into a different wavelength. For example, the wavelength conversion particles 132 may include: a first wavelength conversion particle that converts incident light having a specific wavelength into light having a first wavelength and emits the light; and a second wavelength conversion particle that converts incident light having a specific wavelength into light having a second wavelength and emits the light. In an exemplary embodiment of the present invention, light emitted from the light source unit 500 and incident on the wavelength conversion particles 132 may be light having a blue wavelength, the first wavelength may be a green wavelength, and the second wavelength may be a red wavelength. For example, the blue wavelength may be a wavelength having a peak in the range from about 420 nm to about 470 nm, the green wavelength may be a wavelength having a peak in the range from about 520 nm to about 570 nm, and the red wavelength may be a wavelength having a peak in the range from about 620 nm to about 670 nm. However, it should be understood that the blue wavelength, the green wavelength, and the red wavelength are not limited to the above examples, and may include all wavelength ranges that can be identified as blue, green, and red in the art.

[0113] In an exemplary embodiment of the present invention, when the blue light incident on the wavelength conversion layer 130 passes through the wavelength conversion layer 130, a portion of the blue light may be incident on the first wavelength conversion particles, thereby being converted into a green wavelength in terms of its wavelength, and then emitted; another portion of the blue light may be incident on the second wavelength conversion particles, thereby being converted into a red wavelength in terms of its wavelength, and then emitted; and the remaining portion of the blue light may not be incident on the first wavelength conversion particles and the second wavelength conversion particles, and is emitted as is without conversion in terms of its wavelength. Therefore, the light passing through the wavelength conversion layer 130 may include light having a blue wavelength, light having a green wavelength, and light having a red wavelength. If the ratio of the emitted light having different wavelengths is appropriately adjusted, the emitted light may display white or other colors. The light converted by the wavelength conversion layer 130 is concentrated to a predetermined narrow wavelength range and has a sharp spectrum (which has a narrow half width). Therefore, when color is achieved by filtering light having such a spectrum using a color filter, color reproducibility can be enhanced.

[0114] Unlike the above exemplary embodiments, white light can be generated when light having a short wavelength (e.g., ultraviolet light) is incident and three types of wavelength conversion particles are provided in the wavelength conversion layer 130, wherein the three types of wavelength conversion particles convert the incident light into blue, green, and red wavelengths in terms of its wavelength.

[0115] The wavelength conversion layer 130 may also include scattering particles. The scattering particles may be non-quantum dot particles that may not be used for the wavelength conversion function. The scattering particles scatter the incident light so that more incident light can be incident toward the wavelength conversion particles 132. In addition, the scattering particles can be used to control the emission angle of light with different wavelengths. For example, when a portion of the incident light is incident on the wavelength conversion particles 132 and then its wavelength is converted and emitted, the scattering characteristics indicate that the emission direction is random. If there are no scattering particles in the wavelength conversion layer 130, the light of the green wavelength or red wavelength emitted after colliding with the wavelength conversion particles 132 has a random scattering emission characteristic, while the light of the blue wavelength emitted without experiencing a collision with the wavelength conversion particles 132 does not have a random scattering emission characteristic, and therefore, the corresponding emission amounts of light with blue wavelengths, green wavelengths, and red wavelengths may be different from each other according to the emission angle. Since the scattering particles give scattering characteristics to light of different wavelengths including light of blue wavelength (which is emitted without experiencing a collision with the wavelength conversion particles 132), the emission angles of light of different wavelengths can be adjusted accordingly. The scattering particles may include, for example, titanium oxide (TiO 2 ) or silicon oxide (SiO 2 ).

[0116] The thickness of the wavelength conversion layer 130 may be in the range from about 10 μm to about 50 μm. In an exemplary embodiment of the present invention, the thickness of the wavelength conversion layer 130 may be about 15 μm.

[0117] The wavelength conversion layer 130 may cover most of the upper surface of the first barrier layer 124 while exposing a portion of the edge of the first barrier layer 124. In other words, the side surface of the first barrier layer 124 may protrude relative to the side surface of the wavelength conversion layer 130. The upper surface of the first barrier layer 124 exposed by the wavelength conversion layer 130 provides a space in which the side surface of the wavelength conversion layer 130 may be stably covered by the laser trimming portion 150.

[0118] The wavelength conversion layer 130 may be formed by a method such as coating. For example, the wavelength conversion layer 130 may be formed by slit coating a wavelength conversion component on the diffuser plate 100 and then drying and curing the wavelength conversion component. However, the present invention is not limited thereto. For example, various other lamination methods may be applied.

[0119] The second passivation layer 140 is disposed on the wavelength conversion layer 130. Figure 3 As shown in , the second passivation layer 140 may include a second barrier layer 142 disposed on the wavelength conversion layer 130 and a cladding layer 144 disposed on the second barrier layer 142 .

[0120] The second barrier layer 142 is used to substantially prevent the penetration of moisture and / or oxygen. For example, the second barrier layer 142 may be disposed on the top surface of the wavelength conversion layer 130 to prevent moisture / oxygen from penetrating into the wavelength conversion layer 130, thereby preventing the degradation of the wavelength conversion layer 130. The second barrier layer 142 may include a material substantially the same as that included in the first barrier layer 124, for example, an inorganic material. For example, the second barrier layer 142 may include, for example, silicon nitride (Si 3 N 4 ), aluminum nitride (AlN), zirconium nitride (ZrN), titanium nitride (TiN), hafnium nitride (HfN), tantalum nitride (TaN), silicon oxide (SiO 2 ), aluminum oxide (Al 2 O 3 ), titanium oxide (TiO 2 ), tin oxide (SnO 2 ), cerium oxide (CeO 2 ) and silicon oxynitride (SiON), or may include a metal thin film that ensures light transmittance. The second barrier layer 142 may include a material substantially the same as that included in the first barrier layer 124, but the present invention is not limited thereto. The second barrier layer 142 may be formed by a method such as chemical vapor deposition (CVD).

[0121] The first barrier layer 124 or the second barrier layer 142 may include an inorganic material. Such an inorganic material may include, for example, silicon nitride (Si 3 N 4 ), aluminum nitride (AlN), zirconium nitride (ZrN), titanium nitride (TiN), hafnium nitride (HfN), tantalum nitride (TaN), silicon oxide (SiO 2 ), aluminum oxide (Al 2 O 3 ), titanium oxide (TiO 2 ), tin oxide (SnO 2 ), cerium oxide (CeO 2 ) and silicon oxynitride (SiON), or may include a metal film that ensures light transmittance.

[0122] The diffusion plate 100 according to the exemplary embodiment of the present invention may include a laser trimming portion 150 extending along the respective edge portions of the first passivation layer 120, the wavelength conversion layer 130, and the second passivation layer 140. That is, the laser trimming portion 150 is a sealing portion formed when the respective edge portions of the first passivation layer 120, the wavelength conversion layer 130, and the second passivation layer 140 are melted along the cell boundary by thermal curing using a laser. Therefore, the laser trimming portion 150 may partially include a carbonized material. Therefore, the wavelength conversion layer 130 may be surrounded or sealed by the first passivation layer 120, the second passivation layer 140, and the laser trimming portion 150. For example, the combination of the first barrier layer 124, the second barrier layer 142, and the laser trimming portion 150 may surround or seal the wavelength conversion layer 130, and may prevent moisture / oxygen from penetrating into the wavelength conversion layer 130, thereby preventing the degradation of the wavelength conversion layer 130. Figure 3 The case where the laser trimming portion 150 extends along the edges of the low refractive index layer 122, the first barrier layer 124, the wavelength conversion layer 130, the second barrier layer 142, and the cladding layer 144 is illustrated. However, as long as the laser trimming portion 150 extends along the edges of the first barrier layer 124, the wavelength conversion layer 130, and the second barrier layer 142, it may be sufficient to prevent moisture / oxygen from penetrating into the wavelength conversion layer 130. For example, in an exemplary embodiment of the present invention, the laser trimming portion 150 may extend at least along the edges of the first barrier layer 124, the wavelength conversion layer 130, and the second barrier layer 142.

[0123] The laser trimmed portion 150 may have a width greater than 0 and less than about 60 mm.

[0124] like Figure 2 As shown in , the laser trimming portion 150 may include a first laser trimming portion 151 extending from the first passivation layer 120 , a second laser trimming portion 152 extending from the second passivation layer 140 , and a side cover layer 153 extending from the wavelength conversion layer 130 .

[0125] The edge portions of the first and second passivation layers 120 and 140 are melted by thermal curing using a laser, and thus the first and second laser trimmed portions 151 and 152 are formed. During the thermal curing process using a laser, carbonization may occur on one or more materials at the edge portions of the first and second passivation layers 120 and 140. Therefore, the first and second laser trimmed portions 151 and 152 may include carbonized materials.

[0126] The first laser trimming portion 151 and the second laser trimming portion 152 do not overlap the wavelength conversion layer 130 .

[0127] The side cover layer 153 may be formed when the edge portion of the wavelength conversion layer 130 is melted by thermal curing using a laser. Therefore, the side cover layer 153 may partially include a carbonized material. In the present exemplary embodiment, the side cover layer 153 is applied to a portion of the side surface of the wavelength conversion layer 130. That is, since the side cover layer 153 covers and seals the wavelength conversion layer 130, it can substantially prevent moisture or oxygen from penetrating into the wavelength conversion layer 130.

[0128] At least one of the first laser trimming portion 151 and the second laser trimming portion 152 may include at least one or more mixed materials. During the thermal curing process using the laser, the mixing of materials may occur in the edge portions of the first passivation layer 120 and the second passivation layer 140 due to the melting of these materials during the laser processing. That is, since the edge portions of the first passivation layer 120, the wavelength conversion layer 130, and the second passivation layer 140 are melted along the cell boundary by thermal curing using the laser, in the first laser trimming portion 151 and the second laser trimming portion 152, the material included in the edge portion of the first passivation layer 120 and the material included in the edge portion of the wavelength conversion layer 130 may be mixed, the material included in the edge portion of the wavelength conversion layer 130 and the material included in the edge portion of the second passivation layer 140 may be mixed, and / or the material included in the edge portion of the first passivation layer 120 and the material included in the edge portion of the second passivation layer 140 may be mixed. In the present exemplary embodiment, the material included in the edge portion of the wavelength conversion layer 130 may be different from the material included in the wavelength conversion layer 130.

[0129] At least one of the first laser trimming portion 151 , the second laser trimming portion 152 , and the side cover layer 153 may include a carbonized material.

[0130] The laser trimming portion 150 may be formed by thermally curing the cladding layer 144 , wherein the cladding layer 144 is at an uppermost portion of the second passivation layer 140 .

[0131] In an exemplary embodiment of the present invention, the coating layer 144 may include an organic material. For example, the coating layer 144 may include a polymer material.

[0132] Figure 4 is a cross-sectional view showing a display device including a middle frame according to an exemplary embodiment of the present invention.

[0133] Reference Figure 4, the diffusion plate 100 according to the exemplary embodiment of the present invention may include a first laser trimming portion 151, a second laser trimming portion 152, and a side cover layer 153, wherein the first laser trimming portion 151 extends from the first passivation layer 120, the second laser trimming portion 152 extends from the second passivation layer 140, and the side cover layer 153 extends from the first laser trimming portion 151, the wavelength conversion layer 130, and the second laser trimming portion 152.

[0134] The side cover layer 153 may be formed when edge portions of the first passivation layer 120 and the second passivation layer 140 are melted by thermal curing using laser. That is, the side cover layer 153 may be formed in a shape that covers and seals the wavelength conversion layer 130 when the first passivation layer 120 and the second passivation layer 140 are melted by thermal curing using laser. Therefore, at least one of the first laser trimming portion 151, the second laser trimming portion 152, and the side cover layer 153 may include a carbonized material. In an exemplary embodiment of the present invention, thermal curing using laser may be performed on edge portions of the first passivation layer 120 and the second passivation layer 140 to melt the edge portions to form the first laser trimming portion 151, the second laser trimming portion 152, and the side cover layer 153, wherein at least a portion of the edge portions processed by laser overlaps the wavelength conversion layer 130.

[0135] The side cover layer 153 may include a material mixed with at least one of a material included in the first laser trimming portion 151 and a material included in the second laser trimming portion 152. That is, since the side cover layer 153 is formed when the first laser trimming portion 151 and the second laser trimming portion 152 are melted by thermal curing using laser, the side cover layer 153 may include a material mixed with at least one of a material included in the first laser trimming portion 151 and a material included in the second laser trimming portion 152.

[0136] like Figure 4 As shown in FIG. 1 , the first laser trimming portion 151 and the second laser trimming portion 152 may overlap the wavelength conversion layer 130 .

[0137] In an exemplary embodiment of the present invention, the first laser trimming portion 151 and the second laser trimming portion 152 may not overlap with the wavelength conversion layer 130. That is, when the edge portions of the first passivation layer 120 and the second passivation layer 140 are melted by thermal curing using laser, the first laser trimming portion 151 and the second laser trimming portion 152 may be formed not to overlap with the edge portion of the wavelength conversion layer 130.

[0138] Figure 5 is a view showing an exemplary embodiment of the present invention in which an edge type backlight unit is applied to a diffusion plate.

[0139] Reference Figure 5 In the case where the edge type backlight unit BLU is applied to the diffusion plate 100 according to the exemplary embodiment of the present invention, the light source unit 500 is disposed facing the side surface of the diffusion plate 100, and a plurality of optical sheets 800 are disposed between the display panel 700 and the light guide plate. The reflective sheet 400 is disposed under the light guide plate to reflect light from the light source unit 500.

[0140] The diffusion plate 100 receives light emitted from the light source unit 500 and guides the light to the wavelength conversion layer 130 through the glass plate 110 , the low refractive index layer 122 , and the first barrier layer 124 .

[0141] The wavelength conversion layer 130 converts incident light in terms of its wavelength using the wavelength conversion particles 132 , and emits the converted light toward the display panel 700 through the second barrier layer 142 and the cladding layer 144 .

[0142] In this exemplary embodiment, the wavelength conversion layer 130 may use wavelength conversion particles 132 to convert incident blue light into green light and emit the converted light, may use wavelength conversion particles 132 to convert incident blue light into red light and emit the converted light, and / or may emit the incident blue light as is without conversion through the wavelength conversion particles 132.

[0143] Figures 6 to 8 1 and 2 are views each showing an exemplary embodiment of the present invention in which a laser trimming portion is formed at a cell boundary after dividing a diffusion plate according to an exemplary embodiment of the present invention into unit cells.

[0144] Figure 6 An example is shown in which the diffusion plate 100 according to the exemplary embodiment of the present invention is divided into cells in a 1×3 arrangement, and the laser trimming portion 150 is formed at the boundary of each cell by laser thermal curing. That is, the diffusion plate 100 is divided into three cells A, B, and C of one row and three columns, thereby defining three cells of 65 inches, and the boundary of each cell is thermally cured by a laser beam to form the laser trimming portion 150.

[0145] like Figure 2 As shown in FIG, the diffusion plate 100 has a structure in which a glass plate 110, a first passivation layer 120, a wavelength conversion layer 130, and a second passivation layer 140 are stacked.

[0146] In the diffusion plate 100 having such a structure, a boundary line of each cell is defined at the glass plate 110 by laser scribing, a laser beam is emitted onto the glass plate 110 along the boundary line of each cell to perform thermal curing, and thus a laser trimming portion 150 surrounding each of the cells A, B, and C is formed. For example, when the laser beam is emitted along the boundary line of the cell A, four sides of the cell A are melted by the heating temperature of the laser beam, and then cured, thereby forming the laser trimming portion 150. In the present exemplary embodiment, when the laser beam is emitted along the boundary line of the cell A, the laser beam is emitted to a portion of each of the second passivation layer 140, the wavelength conversion layer 130, and the first passivation layer 120 corresponding to the four sides of the cell A, and the second passivation layer 140, the wavelength conversion layer 130, and the first passivation layer 120 are melted along the four sides of the cell A to form the laser trimming portion 150. Therefore, the wavelength conversion layer 130 of the cell A may be sealed by the first passivation layer 120, the second passivation layer 140, and the laser trimming portion 150, and the penetration of moisture or oxygen may be substantially prevented.

[0147] Figure 7 An example is shown in which the diffusion plate 100 according to the exemplary embodiment of the present invention is divided into cells in a 3×2 arrangement, and the laser trimming portion 150 is formed at the boundary of each cell by laser thermal curing. That is, the diffusion plate 100 is divided into six cells A, B, C, D, E, and F of three rows and two columns, thereby defining six cells of 55 inches, and the boundary of each cell is thermally cured by a laser beam to form the laser trimming portion 150. For example, when a laser beam is emitted along the boundary line of the cell F, the second passivation layer 140, the wavelength conversion layer 130, and the first passivation layer 120 are melted along the boundary lines of the four sides of the cell F by laser heating, and then cured to form the laser trimming portion 150.

[0148] In the present exemplary embodiment, the laser trimming portion 150 may be formed along the boundary line of each cell and may have a uniform width. The laser trimming portion 150 may have a depth from the second passivation layer 140 (which corresponds to the surface of each cell) through the wavelength conversion layer 130 to the first passivation layer 120. The laser trimming portion 150 may include a material that is carbonized after thermal curing, and may include a material mixed with at least one of the corresponding materials included in the first passivation layer 120, the wavelength conversion layer 130, and the second passivation layer 140.

[0149] Figure 8An example is shown in which the diffusion plate 100 according to the exemplary embodiment of the present invention is divided into cells in a 6×4 arrangement, and the laser trimming portion 150 is formed at the boundary of each cell by laser thermal curing. That is, the diffusion plate 100 is divided into 24 cells A, B, C, D, E, F, G, H…S…, and X of six rows and four columns, thereby defining 24 cells of 27 inches, and the boundary of each cell is thermally cured by a laser beam to form the laser trimming portion 150. For example, when a laser beam is emitted along the boundary line of the cell X, the edge portions of the second passivation layer 140, the wavelength conversion layer 130, and the first passivation layer 120 are melted along the boundary lines of the four sides of the cell X by laser heating, and then cured to form the laser trimming portion 150.

[0150] The materials included in the edge portion of the second passivation layer 140, the wavelength conversion layer 130, and the first passivation layer 120 may be mixed in the laser trimming portion 150 due to thermal curing. In addition, the laser trimming portion 150 may partially include a carbonized material.

[0151] Fig. 9 is a flow chart showing a method of manufacturing a display device according to an exemplary embodiment of the present invention. The order of the steps as shown in the flow chart may be preferred. However, the present invention is not limited to performing the steps in the order or sequence presented in the flow chart. Many steps may also be applied to the glass sheet before, between, or after the steps shown in the flow chart.

[0152] Reference Figures 1 to 9 In the method of manufacturing a display device according to an exemplary embodiment of the present invention, first, a glass plate 110 is provided (S910), or the glass plate 110 is disposed on the light source unit 500 ( Figure 1 ) or reflective sheet 400( Figure 5 ), and then, the first passivation layer 120 is disposed on the glass plate 110 (S920).

[0153] In this exemplary embodiment, Figure 3 As shown in , the first passivation layer 120 includes a low refractive index layer 122 and a first barrier layer 124 .

[0154] Next, the wavelength conversion layer 130 is disposed on the first passivation layer 120 (S930).

[0155] In the present exemplary embodiment, the wavelength conversion layer 130 may include wavelength conversion particles 132 for converting the wavelength of at least a portion of light incident thereon. The wavelength conversion particles 132 may include, for example, a quantum dot (QD) fluorescent material or a phosphorescent material.

[0156] Next, the second passivation layer 140 is disposed on the wavelength conversion layer 130 (S940).

[0157] In this exemplary embodiment, Figure 3 As shown in FIG. 1 , the second passivation layer 140 includes a second barrier layer 142 and a capping layer 144 .

[0158] Next, the optical sheet 800 is disposed on the second passivation layer 140 (S950)

[0159] Next, the display panel 700 is disposed on the optical sheet 800 (S960).

[0160] Next, the first passivation layer 120 , the wavelength conversion layer 130 , and the second passivation layer 140 are sealed along the boundary of each unit cell by thermal curing using laser ( S970 ).

[0161] In an exemplary embodiment of the present invention, the first passivation layer 120, the wavelength conversion layer 130, and the second passivation layer 140 may be sealed along the boundary of each unit cell by thermal curing using a laser before the optical sheet 800 is disposed on the second passivation layer 140 (S950) (S970). In other words, step S970 may be performed after step S940 and before step S950.

[0162] like Figure 2 As shown in FIG. 1 , at the diffusion plate 100 according to the exemplary embodiment of the present invention, the laser trimming portion 150 is formed by laser thermal curing along the boundary of each unit cell. Therefore, the laser trimming portion 150 may include a carbonized material.

[0163] At least one of the first passivation layer 120 , the wavelength conversion layer 130 , and the second passivation layer 140 may include a laser trimming portion 150 extending along an edge thereof.

[0164] like Figure 2 As shown in , the laser trimming portion 150 according to an exemplary embodiment of the present invention may include a first laser trimming portion 151 extending from the first passivation layer 120 , a second laser trimming portion 152 extending from the second passivation layer 140 , and a side cover layer 153 extending from the wavelength conversion layer 130 .

[0165] like Figure 4As shown in the figure, the laser trimming portion 150 according to an exemplary embodiment of the present invention may include a first laser trimming portion 151, a second laser trimming portion 152 and a side covering layer 153, wherein the first laser trimming portion 151 extends from the first passivation layer 120, the second laser trimming portion 152 extends from the second passivation layer 140, and the side covering layer 153 extends from the first laser trimming portion 151, the wavelength conversion layer 130 and the second laser trimming portion 152.

[0166] The laser trimming portion 150 may include a material mixed with at least one of a material included in an edge portion of the first laser trimming portion 151 , a material included in an edge portion of the wavelength conversion layer 130 , and a material included in an edge portion of the second laser trimming portion 152 .

[0167] At least one of the first laser trimming portion 151 , the second laser trimming portion 152 , and the side cover layer 153 may include a carbonized material.

[0168] Fig.10 2 is a view showing an exemplary embodiment in which a diffusion plate of the present invention has a cell boundary line formed by a laser scribing process, Fig.11 is a view showing an exemplary embodiment of forming a laser trimming portion at an edge of each of a plurality of cells of the present invention, and Fig.12 It is shown Fig.11 Enlarged view of part a and part b.

[0169] The diffusion plate 100 according to the exemplary embodiment of the present invention has a structure in which a glass plate 110, a first passivation layer 120, a wavelength conversion layer 130, and a second passivation layer 140 are stacked. Fig.10 As shown in FIG. 1 , the cell boundaries are defined at the diffuser plate 100 by a laser scribing process.

[0170] exist Fig.10 In the method, the scribing line of each unit cell is a cutting line for cutting each unit cell, and the non-light-transmissive material is patterned at the area between the scribing lines. This material is a laser shielding pattern, and even when the substrate is irradiated with a laser beam, the patterned area is not affected by the light. Therefore, the area between the scribing lines remains attached to the supporting substrate during light irradiation, and in the process of separating the supporting substrate from the mother substrate, the area between the scribing lines is separated from the mother substrate together with the supporting substrate. The patterned area is formed at a surface of the supporting substrate (the surface where the supporting substrate and the mother substrate are attached to each other). In this exemplary embodiment, the mother substrate can be coated on the patterned surface of the supporting substrate in the form of a film.

[0171] exist Fig.11In the embodiment, the mother substrate 1000 is a plate for forming a unit structure (unit panel) of a unit cell of a display device. In the case of a flexible display device, the mother substrate 1000 may be formed using a plastic film material (eg, polyimide) having excellent ductility. Fig.11 1 shows a mother substrate 1000 in which a plurality of cells (ie, unit display devices or diffusion plates 100) may be formed at one time. Fig.13 As shown in , in the case where the mother substrate 1000 is the second substrate 720, the upper panel of the display device can be formed by stacking the color filter layer 730 on the second substrate 720. On the other hand, in the case where the mother substrate 1000 is the first substrate 710, the lower panel of the display device can be formed by stacking the organic light-emitting layer 740 on the first substrate 710.

[0172] like Fig.11 and Fig.12 As shown in , a scribing line is defined along the boundary of each cell by a laser beam, and a region outside the boundary is patterned using a laser shielding pattern. The scribing line may be defined with a depth corresponding to the depth of the mother substrate 1000. After the scribing process, a laser trimming portion 150 surrounding each cell is formed at the mother substrate 1000 by performing laser thermal curing along the boundary line of each cell. Fig.12 It is shown Fig.11 1 and 2 are enlarged views of the portion a and the portion b in FIG. The laser trimming portion 150 may be formed as a straight line along the sides of the quadrilateral shape defining the boundary of each cell, but the present invention is not limited thereto. A portion of the laser trimming portion 150 may be formed in a specific shape.

[0173] Fig.13 and Fig.14 1 is a view showing an exemplary embodiment of the present invention in which a color filter layer and an organic light emitting layer are formed between a first substrate and a second substrate of a display panel according to an exemplary embodiment of the present invention.

[0174] like Fig.13 As shown in FIG. 8 , in the upper panel of the display device according to the exemplary embodiment of the present invention, the second substrate 720 is attached to the glass substrate 900 , and the color filter layer 730 is disposed on the second substrate 720 .

[0175] In the lower panel of the display device according to the exemplary embodiment of the present invention, the first substrate 710 is attached to the glass substrate 900 , and the organic light emitting layer 740 is disposed on the first substrate 710 .

[0176] The color filter layer 730 expresses color using light emitted from the organic light emitting layer 740 .

[0177] The organic light emitting layer 740 may include a thin film transistor (TFT) layer and an electroluminescent layer. The thin film transistor layer is formed on the first substrate 710 and is a layer in which a switching element for supplying a data voltage to a pixel electrode is arranged.

[0178] The color filter layer 730 is formed on one surface of the second substrate 720 as an upper substrate, and the second substrate 720 is attached to the glass substrate 900. The first substrate 710 having the organic light emitting layer 740 formed on one surface thereof is attached to the second substrate 720.

[0179] After attaching the first substrate 710 and the second substrate 720 to each other, the glass substrate 900 as a supporting substrate of the second substrate 720 is removed. Fig.14 As shown in FIG. 8 , the glass substrate 900 attached to the second substrate 720 is removed by a laser beam.

[0180] The removal of the support substrate can be performed by irradiating the entire area of ​​the support substrate with a laser beam. In the present exemplary embodiment, the interface between the support substrate and the mother substrate undergoes contraction / expansion due to the influence of the laser beam, and the attachment is released. For example, a laser beam can be irradiated onto the upper surface of the support substrate (e.g., the glass substrate 900). The laser can be ultraviolet (UV) rays or any other suitable rays having a suitable wavelength. The laser beam can be provided to the mother substrate (e.g., the second substrate 720) through the support substrate (e.g., the glass substrate 900). Therefore, the bonding force at the interface portion between the glass substrate 900 and the second substrate 720, such as the bonding force between the glass substrate 900 and the second substrate 720, can be weakened by the laser beam, so that it can be as shown. Fig.14 The separation between the glass substrate 900 and the second substrate 720 is achieved as shown in FIG.

[0181] The area between the boundary lines of the corresponding cells in the second substrate 720 as the upper substrate may be removed by manually applying a physical force. Then, the second substrate 720 is cut into individual cells, and post-processing is performed on the individual cells.

[0182] In the case of the first substrate 710 as a lower substrate, after the glass substrate 900 as a supporting substrate is removed by a laser beam and the first substrate 710 is cut into individual cells, post-processing is also performed on the individual cells.

[0183] According to an exemplary embodiment of the present invention, a display panel including quantum dots may be scribed into unit cells and an edge portion of each unit cell may be thermally cured to seal the quantum dot layer during the process of manufacturing the quantum dot display device to provide a display panel that can substantially prevent moisture or oxygen (O 2 ) penetrates into the quantum dot layer and a method for manufacturing a quantum dot display device.

[0184] As explained above, in the process of manufacturing the display device according to the present invention, the cell edge portion is thermally cured using laser after scribing and is sealed, and thus it is possible to substantially prevent moisture or oxygen from penetrating into the quantum dot layer.

[0185] Since a laser trimming process is added after the scribing process at the area between the unit cells where the quantum dot glass does not guide light, the quantum dot layer can be integrated with the upper and lower barrier layers. Therefore, reliability problems such as quenching discoloration can be substantially prevented.

[0186] While the present invention has been shown and described with reference to exemplary embodiments thereof, it will be apparent to those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the following claims.

Claims

1. A display device, comprising: glass plate; A first passivation layer is disposed on the glass plate; A wavelength conversion layer, disposed on the first passivation layer; A second passivation layer is disposed on the wavelength conversion layer; an optical sheet, disposed on the second passivation layer; A display panel, disposed on the optical sheet; as well as The laser trimming portion is formed by thermally curing edges of the first passivation layer, the wavelength conversion layer, and the second passivation layer using a laser, and extends along the edges of the first passivation layer, the wavelength conversion layer, and the second passivation layer.

2. The display device according to claim 1, wherein: The laser trimmed portion includes a carbonized material.

3. The display device according to claim 1, wherein: The laser trimming part comprises: a first laser trimmed portion extending from the first passivation layer; a second laser trimmed portion extending from the second passivation layer; and A side cover layer extends from the wavelength conversion layer.

4. The display device according to claim 3, wherein: At least one of the first laser-trimmed portion, the second laser-trimmed portion, and the side cover layer includes a carbonized material.

5. The display device according to claim 3, wherein: The first laser trimming portion and the second laser trimming portion do not overlap the wavelength conversion layer.

6. The display device according to claim 1, wherein: The laser trimming part comprises: a first laser trimmed portion extending from the first passivation layer; a second laser trimmed portion extending from the second passivation layer; and A side cover layer extends from the first laser trimming portion, the wavelength conversion layer and the second laser trimming portion.

7. The display device according to claim 1, wherein: The first passivation layer comprises: a low refractive index layer disposed on the glass plate; and The first barrier layer is disposed on the low refractive index layer.

8. The display device according to claim 1, wherein: The second passivation layer comprises: A second blocking layer is disposed on the wavelength conversion layer; and The coating layer is disposed on the second barrier layer.

9. The display device according to claim 1, wherein: The wavelength conversion layer includes wavelength conversion particles that convert a wavelength of at least a portion of incident light.

10. The display device according to claim 9, wherein: The wavelength conversion particles include quantum dot fluorescent materials or phosphorescent materials.

Citation Information

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