Circuit board detection system and detection method

Abstract

The present invention discloses a circuit board detection system and detection method, which include a carrier for placing a substrate, a detection light source device located above the carrier, an image processing device arranged above the detection light source device, and a controller respectively connected to the image processing device and the detection light source device. The color of the substrate is automatically identified by the substrate detection white light emitted by the detection light source device, and then the solder foot detection light of a color different from that of the substrate is emitted by the detection light source device again, so that the image processing device collects the solder foot detection image, and finally the controller constructs the surface shape of the solder foot according to the solder foot detection image, so as to distinguish the solder foot on the substrate. The circuit board detection system provided by the embodiment of the present invention is not affected by the color of the substrate, can accurately distinguish the substrate and the solder foot, and realizes the automatic and rapid detection of the structure of substrates of various colors.

Description

Technical Field

[0001] The present invention relates to the field of electronic technology, and in particular to a circuit board detection system and a detection method. Background Art

[0002] PCB (Printed Circuit Board) refers to printed circuit boards. During the production process, PCB substrates come in many colors. When testing PCB substrates, if a single or single-angle light source is used to illuminate the PCB substrate, when the color of the PCB substrate is similar to the color of the light source, the structure on the PCB substrate cannot be accurately distinguished in the obtained visual image of the PCB substrate, affecting the detection effect.

[0003] Therefore the prior art still needs to be improved and enhanced. Summary of the invention

[0004] In view of the above-mentioned deficiencies in the prior art, an object of the present invention is to provide a circuit board detection system and detection method, aiming to overcome the defect in the prior art that the structure on the PCB substrate cannot be accurately distinguished when the color of the PCB substrate is similar to the color of the detection light source.

[0005] The technical solution adopted by the present invention to solve the technical problem is as follows:

[0006] In a first aspect, an embodiment of the present invention provides a circuit board inspection system, comprising a stage for placing a substrate, wherein the system further comprises: a detection light source device located above the stage, an image processing device disposed above the detection light source device, and a controller respectively connected to the image processing device and the detection light source device;

[0007] The detection light source device emits substrate detection white light to the substrate, so that the image processing device collects a substrate detection image;

[0008] The controller acquires color information of the substrate according to the substrate detection image, and determines the light color of the solder foot detection light according to the color information;

[0009] The detection light source device emits solder fillet detection light to the substrate according to the light color, so that the image processing device collects a solder fillet detection image;

[0010] The controller constructs the shape of the solder fillet surface according to the solder fillet detection image to distinguish the solder fillet in the substrate.

[0011] As a further improved technical solution, the circuit board detection system further includes a second connecting tube, one end of the second connecting tube is connected to one end of the distributor, and the other end of the second connecting tube is connected to the electronic expansion valve.

[0012] As a further improved technical solution, in the circuit board detection system, the detection light source device includes: a detection light source for emitting substrate detection white light and solder foot detection light, and a light source controller connected to the detection light source and controller respectively.

[0013] As a further improved technical solution, in the circuit board detection system, the image processing device includes: a camera located above the detection light source, and an image processor connected to the camera and the controller respectively.

[0014] As a further improved technical solution, in the circuit board detection system, the detection light source includes a light source protection cover, a detection light group for emitting white light for substrate detection, and a plurality of judgment light groups for emitting light for solder foot detection; the inner wall of the light source protection cover is truncated cone-shaped, the detection light group is arranged on the top of the inner wall of the light source protection cover, and the plurality of judgment light groups are arranged in the area outside the top of the inner wall of the light source protection cover.

[0015] As a further improved technical solution, in the circuit board detection system, the detection light group is a white light source, the colors of the multiple judgment light groups are different from the color of the substrate, and the colors of the multiple judgment light groups are different.

[0016] As a further improved technical solution, in the circuit board detection system, the multiple judgment light groups all include red, green and blue light sources.

[0017] In a second aspect, an embodiment of the present invention provides a circuit board detection method, which includes:

[0018] The detection light source device emits substrate detection white light to the substrate, so that the image processing device collects a substrate detection image;

[0019] The controller obtains color information of the substrate according to the substrate detection image, and determines the light color of the solder foot detection light according to the color information;

[0020] The detection light source device emits solder foot detection light according to the light color to the substrate, so that the image processing device collects the solder foot detection image;

[0021] The controller constructs the shape of the solder fillet surface according to the solder fillet detection image to distinguish the solder fillet in the substrate.

[0022] As a further improved technical solution, in the circuit board detection method, the detection light source device emits substrate detection white light to the substrate so that the image processing device collects the substrate detection image, which specifically includes:

[0023] The light source controller controls the detection light source to emit substrate detection white light to the substrate;

[0024] The camera collects the substrate detection white light reflected by the substrate and sends it to the image processor;

[0025] The image processor images the substrate detection white light reflected by the substrate into a substrate detection image.

[0026] As a further improved technical solution, in the circuit board detection method, the controller obtains the color information of the substrate according to the substrate detection image, and determines the light color of the solder foot detection light according to the color information, specifically including:

[0027] The controller obtains the color of the substrate according to the image with the largest color area in the substrate detection image;

[0028] The controller controls the light source controller to adjust the color of the solder foot detection light to be different from the color of the substrate according to the color of the substrate.

[0029] As a further improved technical solution, in the circuit board detection method, the detection light source device emits solder foot detection light to the substrate according to the light color, so that the image processing device collects the solder foot detection image, which specifically includes:

[0030] The light source controller controls the detection light source to emit solder foot detection light of a color different from that of the substrate;

[0031] The camera collects the welding foot detection light reflected by the welding foot and sends it to the image processor;

[0032] The image processor forms an image of the soldering foot detection image based on the soldering foot detection light reflected by the soldering foot.

[0033] Compared with the prior art, the embodiments of the present invention have the following advantages:

[0034] According to the circuit board detection system provided by the embodiment of the present invention, the color of the substrate is automatically identified by detecting the substrate detection white light emitted by the light source device, and then the solder foot detection light of a color different from the substrate is emitted by the detection light source device again, so that the image processing device collects the solder foot detection image, and finally the controller constructs the surface shape of the solder foot according to the solder foot detection image, so as to distinguish the solder foot on the substrate. The circuit board detection system provided by the embodiment of the present invention is not affected by the color of the substrate, can accurately distinguish the substrate and the solder foot, and realizes the automatic and rapid detection of the structure of a plurality of substrates of different colors. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] Figure 1 A schematic diagram of the structure of a circuit board detection system provided by the present invention;

[0036] Figure 2A first working principle diagram of a circuit board detection system provided by the present invention;

[0037] Figure 3 A second working principle diagram of a circuit board detection system provided by the present invention;

[0038] Figure 4 A flow chart of a preferred embodiment of a circuit board detection method provided by the present invention.

[0039] In the figure: 10, substrate; 20, solder foot; 100, carrier; 200, detection light source device; 300, image processing device; 400, controller; 210, detection light source; 220, light source controller; 310, camera; 320, image processor; 211, light source protection cover; 212, detection light group; 213, judgment light group. DETAILED DESCRIPTION

[0040] In order to make the purpose, technical solution and effect of the present invention clearer and more specific, the present invention is further described in detail with reference to the accompanying drawings and examples. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not used to limit the present invention.

[0041] In the embodiments and patent claims, unless otherwise specified, "a", "an" and "the" may refer to a single or a plurality of items.

[0042] In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the present invention, the descriptions of "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or suggesting their relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In addition, the technical solutions between the various embodiments can be combined with each other, but they must be based on the ability of ordinary technicians in the field to implement them. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such a combination of technical solutions does not exist and is not within the scope of protection required by the present invention.

[0043] Embodiment 1:

[0044] See also Figure 1 , Figure 1 A schematic structural diagram of a circuit board inspection system provided by the present invention; comprising a carrier 100 for placing a substrate 10, a detection light source device 200 located above the carrier 100, an image processing device 300 arranged above the detection light source device 200, and a controller 400 respectively connected to the image processing device 300 and the detection light source device 200.

[0045] In the embodiments of the present invention, please refer to Figure 2 and Figure 3 , the detection light source device 200 emits substrate detection white light to the substrate 10, so that the image processing device 300 collects the substrate detection image; the controller 400 obtains the color information of the substrate 10 according to the substrate detection image, and determines the light color of the solder foot detection light according to the color information; then, the detection light source device 200 emits solder foot detection light to the substrate 10 according to the light color, so that the image processing device 300 collects the solder foot detection image; the controller 400 constructs the shape of the solder foot 20 surface according to the solder foot detection image to distinguish the solder foot 20 from the substrate 10. The solder foot 20 is distinguished from the substrate 10 by obtaining the color of the substrate 10 and then emitting a solder foot detection light different from the color of the substrate 10; thus, solder foot detection lights of different colors can be quickly configured for substrates 10 of different colors, and automatic and rapid detection of the structures of substrates 10 of multiple colors can be achieved.

[0046] As a further solution, the detection light source device 200 includes: a detection light source 210 for emitting substrate detection white light and solder foot detection light, and a light source controller 220 connected to the detection light source 210 and the controller 400 respectively; wherein the light source controller 220 is used to control the detection light source 210 to emit substrate detection white light to the substrate 10 or to emit solder foot detection light of a color different from that of the substrate 10 according to the color of the substrate 10. The detection light source 210 is located above the stage 100. When the substrate 10 is placed on the stage 100, the controller 400 enables the detection light source 210 to emit substrate detection white light and solder foot detection light through the light source controller 220.

[0047] As a further solution, the image processing device 300 includes: a camera 310 located above the detection light source 210, and an image processor 320 connected to the camera 310 and the controller 400 respectively; specifically, the camera 310 is used to collect the substrate detection white light reflected by the substrate 10 and send it to the image processor 320, or to collect the weld foot detection light reflected by the weld foot 20 and send it to the image processor 320; further, the image processor 320 is used to image the substrate detection white light reflected by the substrate 10 into a substrate detection image, or to image the weld foot detection light reflected by the weld foot 20 into a weld foot detection image.

[0048] Among them, the carrier 100 is movably arranged relative to the detection light source device 200 and the image processing device 300. When detecting the color of the substrate 10, since the substrate 10 is the background color, there is no need to move the carrier 100; when detecting the solder foot 20, the carrier 100 can be moved to under the camera 310 in the image processor 320 so that the solder foot 20 on the substrate 10 is within the shooting range of the camera 310.

[0049] For further solutions, please refer to Figure 1 The detection light source 210 includes a light source protection cover 211, a detection light group 212 for emitting white light for substrate detection, and a plurality of judgment light groups 213 for emitting light for solder foot detection; the inner wall of the light source protection cover 211 is truncated cone-shaped, the detection light group 212 is arranged on the top of the inner wall of the light source protection cover 211, and the plurality of judgment light groups 213 are arranged in the area outside the top of the inner wall of the light source protection cover 211.

[0050] Optional, please continue to Figure 2 and Figure 3 The detection lamp group 212 arranged on the top of the light source protection cover 211 emits substrate detection white light that is vertically irradiated onto the substrate 10, and multiple judgment lamp groups 213 are arranged on the inclined surface of the inner wall of the protection cover (the inner wall of the cone is inclined). For example, multiple judgment lamp groups 213 can be arranged on the upper part, middle part, or bottom part of the inner wall of the light source protection cover 211. The present invention does not limit the specific position of the judgment lamp group 213, as long as it does not overlap with the position of the detection light source 210.

[0051] The detection light group 212 is a white light source, the color of the plurality of judgment light groups 213 is different from the color of the substrate 10, and the colors of the plurality of judgment light groups 213 are different from each other. And the plurality of judgment light groups 213 all include red, green and blue light sources.

[0052] Specifically, to determine the color of the substrate 10, a white light source is used to illuminate the surface of the substrate 10, thereby obtaining the color of the substrate 10 from the light reflected by the substrate 10. Furthermore, the surface of the solder foot 20 has different inclination angles relative to the substrate 10. The inclination angle of the bottom of the solder foot 20 where the solder foot 20 and the substrate 10 are connected is a small inclination angle, while the inclination angle of the top of the solder foot 20 relative to the substrate 10 is a large inclination angle.

[0053] Please continue reading Figure 3 In order to identify the weld foot 20 at different inclination angles, the judgment light groups 213 at different positions can be used for different inclination angles. For example, for a small inclination angle, the judgment light group 213 set on the upper part of the inner wall of the light source protection cover 211 can be used for illumination, and for a large inclination angle, the judgment light group 213 set at the bottom of the inner wall of the light source protection cover 211 can be used for illumination. Of course, the color of the judgment light group 213 when irradiating a small inclination angle and a large inclination angle is also different, and the color of the light reflected by the small inclination angle and the large inclination angle is also different. Finally, the weld foot detection image imaged by the image processor 320 has different color areas, and different color areas represent surfaces with different inclination angles.

[0054] In the embodiment of the present invention, when the substrate 10 enters the detection range of the light source protection cover 211, the light source controller 220 controls the detection light group 212 in the detection light source 210 to emit white light to illuminate the surface of the substrate 10, and the camera 310 collects the light reflected by the substrate 10 and sends it to the image processor 320. The imaged substrate detection image is transmitted to the controller 400 through the image processor 320 to analyze the color information of the substrate. The controller 400 uses the area with the largest number of pixels of the same color or gray level in the substrate detection image as the basis for determining the color of the substrate 10, thereby determining the color of the substrate 10. Further, the controller 400 adjusts the detection light source 210 through the light source controller 220 according to the determined color of the substrate 10, so that the determination light group 213 in the detection light source 210 emits a plurality of solder foot detection lights of a color different from that of the substrate 10, wherein the colors of the solder foot detection lights are different, so in the collected solder foot detection image, the different color areas present represent the detection surfaces of different inclinations on the solder foot 20. Finally, the controller 400 constructs the shape of the surface of the weld foot 20 according to the weld foot detection image, thereby obtaining the weld foot detection image on the substrate 10 by irradiating the substrate 10, and then confirms the shape of the weld foot 20 from the weld foot detection image, and finally distinguishes the weld foot 20 from the substrate 10.

[0055] Embodiment 2:

[0056] Based on the above circuit board detection system, the present invention further discloses a circuit board detection method, which includes:

[0057] S100, the detection light source device emits a substrate detection white light to the substrate, so that the image processing device collects a substrate detection image;

[0058] Specifically, the detection light source device emits substrate detection white light to the substrate so that the image processing device collects the substrate detection image, which specifically includes:

[0059] S110, the light source controller controls the detection light source to emit substrate detection white light to the substrate;

[0060] S120, the camera collects the substrate detection white light reflected by the substrate and sends it to the image processor;

[0061] S130 . An image processor forms a substrate detection image according to the substrate detection white light reflected by the substrate.

[0062] In an embodiment of the present invention, when the substrate 10 enters the detection range of the light source protection cover 211, the light source controller 220 controls the detection light group 212 in the detection light source 210 to emit substrate detection white light to illuminate the surface of the substrate 10, and the camera 310 collects the substrate detection white light reflected by the substrate 10 and sends it to the image processor 320, and the imaged substrate detection image is transmitted to the controller 400 for analysis through the image processor 320.

[0063] S200, the controller obtains color information of the substrate according to the substrate detection image, and determines the light color of the solder foot detection light according to the color information;

[0064] Specifically, the controller acquires the color information of the substrate according to the substrate detection image, and determines the light color of the solder foot detection light according to the color information, specifically including:

[0065] S210, the controller obtains the color of the substrate according to the image with a large color area in the substrate detection image;

[0066] S220, the controller controls the light source controller to adjust the color of the solder foot detection light to be different from the color of the substrate according to the color of the substrate.

[0067] S300, the detection light source device emits solder fillet detection light according to the light color to the substrate, so that the image processing device collects the solder fillet detection image;

[0068] Specifically, the detection light source device emits solder fillet detection light to the substrate according to the light color so that the image processing device collects the solder fillet detection image, which specifically includes:

[0069] S310, the light source controller controls the detection light source to emit solder foot detection light of a color different from that of the substrate;

[0070] S320, the camera collects the welding foot detection light reflected by the welding foot and sends it to the image processor;

[0071] S330, the image processor images the weld foot detection light reflected by the weld foot into a weld foot detection image.

[0072] In the embodiment of the present invention, the controller 400 uses the area with the largest number of the same color or grayscale levels among the pixels constituting the image in the substrate detection image as the basis for determining the color of the substrate 10, thereby determining the color of the substrate 10. Further, the controller 400 adjusts the detection light source 210 through the light source controller 220 according to the determined color of the substrate 10, so that the determination light group 213 in the detection light source 210 emits a plurality of solder foot detection lights of a color different from that of the substrate 10, wherein the colors of the solder foot detection lights are all different, so in the collected solder foot detection image, the different color areas present represent detection surfaces of different inclination angles on the solder foot 20.

[0073] S400: The controller constructs the shape of the solder fillet surface according to the solder fillet detection image to distinguish the solder fillet in the substrate.

[0074] In an embodiment of the present invention, the controller 400 constructs the shape of the surface of the weld foot 20 based on the weld foot detection image, thereby obtaining the weld foot detection image on the substrate 10 by irradiating the substrate 10, and then confirms the shape of the weld foot 20 from the weld foot detection image, and finally distinguishes the weld foot 20 from the substrate 10.

[0075] In summary, the present invention provides a circuit board detection system and detection method, which include a carrier for placing a substrate, a detection light source device located above the carrier, an image processing device arranged above the detection light source device, and a controller respectively connected to the image processing device and the detection light source device. The color of the substrate is automatically identified by the substrate detection white light emitted by the detection light source device, and then the solder foot detection light of a color different from that of the substrate is emitted by the detection light source device again, so that the image processing device can collect the solder foot detection image, and finally the controller constructs the surface shape of the solder foot according to the solder foot detection image, so as to distinguish the solder foot on the substrate. The circuit board detection system provided by the embodiment of the present invention is not affected by the color of the substrate, can accurately distinguish the substrate and the solder foot, and realizes the automatic and rapid detection of the structure of substrates of various colors.

[0076] Those skilled in the art will readily appreciate other embodiments of the present invention after considering the specification and practicing the invention disclosed herein. The present invention is intended to cover any variations, uses or adaptations of the present invention that follow the general principles of the present invention and include common knowledge or customary techniques in the art that are not disclosed in the present disclosure. The specification and examples are to be considered exemplary only, and the true scope and spirit of the present invention are indicated by the claims.

Claims

1. A circuit board inspection system, comprising a stage for placing a substrate, characterized in that: Also includes: A detection light source device located above the carrier, an image processing device arranged above the detection light source device, and a controller connected to the image processing device and the detection light source device, respectively, wherein the carrier is movably arranged relative to the detection light source device and the image processing device; The detection light source device emits substrate detection white light to the substrate, so that the image processing device collects a substrate detection image; The controller acquires color information of the substrate according to the substrate detection image, and determines the light color of the solder foot detection light according to the color information; The detection light source device emits solder fillet detection light to the substrate according to the light color, so that the image processing device collects a solder fillet detection image; The controller constructs the shape of the solder foot surface according to the solder foot detection image to distinguish the solder foot in the substrate; The detection light source device comprises: a detection light source for emitting white light for substrate detection and light for solder foot detection, and a light source controller connected to the detection light source and the controller respectively; The detection light source includes a light source protection cover, a detection light group for emitting white light for substrate detection, and a plurality of judgment light groups for emitting light for solder foot detection; the inner wall of the light source protection cover is in a truncated cone shape, the detection light group is arranged on the top of the inner wall of the light source protection cover, and the plurality of judgment light groups are arranged in an area outside the top of the inner wall of the light source protection cover; The surface of the solder foot has different inclination angles relative to the substrate. The determination light groups at different positions are used for different inclination angles, and the colors illuminated by the determination light groups at different positions are also different.

2. The circuit board detection system according to claim 1, characterized in that: The image processing device comprises: a camera located above the detection light source, and an image processor connected to the camera and a controller respectively.

3. The circuit board detection system according to claim 1, characterized in that: The detection light group is a white light source, the colors of the multiple judgment light groups are different from the color of the substrate, and the colors of the multiple judgment light groups are different from each other.

4. The circuit board detection system according to claim 3, characterized in that: The multiple judgment light groups all include red, green and blue light sources.

5. A circuit board detection method applicable to the circuit board inspection system according to any one of claims 1 to 4, characterized in that: include: The detection light source device emits substrate detection white light to the substrate, so that the image processing device collects a substrate detection image; The controller obtains color information of the substrate according to the substrate detection image, and determines the light color of the solder foot detection light according to the color information; The detection light source device emits solder foot detection light according to the light color to the substrate, so that the image processing device collects the solder foot detection image; The controller constructs the shape of the solder fillet surface according to the solder fillet detection image to distinguish the solder fillet in the substrate.

6. The circuit board detection method according to claim 5, characterized in that: The detection light source device emits substrate detection white light to the substrate so that the image processing device collects the substrate detection image, which specifically includes: The light source controller controls the detection light source to emit substrate detection white light to the substrate; The camera collects the substrate detection white light reflected by the substrate and sends it to the image processor; The image processor images the substrate detection white light reflected by the substrate into a substrate detection image.

7. The circuit board detection method according to claim 6, characterized in that: The controller acquires color information of the substrate according to the substrate detection image, and determines the light color of the solder foot detection light according to the color information, specifically including: The controller obtains the color of the substrate according to the image with the largest color area in the substrate detection image; The controller controls the light source controller to adjust the color of the solder foot detection light to be different from the color of the substrate according to the color of the substrate.

8. The circuit board detection method according to claim 7, characterized in that: The detection light source device emits solder fillet detection light to the substrate according to the light color, so that the image processing device collects the solder fillet detection image, which specifically includes: The light source controller controls the detection light source to emit solder foot detection light of a color different from that of the substrate; The camera collects the welding foot detection light reflected by the welding foot and sends it to the image processor; The image processor forms an image of the soldering foot detection image based on the soldering foot detection light reflected by the soldering foot.

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