Solder and coaxial cable array manufacturing method with grounding strip

Abstract

The present invention provides a solder with grounding strips and a method for manufacturing a coaxial cable array in which the relative positions of two grounding strips are difficult to deviate. The solder with grounding strips has a first unit and a second unit. The first unit includes a first grounding strip and a first solder layer installed on one side of the first grounding strip. The second unit includes a second grounding strip and a second solder layer installed on one side of the second grounding strip. The first unit and the second unit are configured so that the first solder layer and the second solder layer are opposite to each other. The first solder layer and the second solder layer are partially joined.

Description

Technical Field

[0001] The present invention relates to a solder and coaxial cable array manufacturing method with a grounding strip. Background Art

[0002] Patent document 1 discloses the following technology. A plurality of coaxial cables are arranged. Each coaxial cable partially exposes an outer conductor. Two grounding strips are used to clamp the exposed outer conductor portions of the plurality of coaxial cables. Plate-shaped solder is attached to each grounding strip. The two grounding strips are attached to the plurality of coaxial cables by heating and melting the plate-shaped solder.

[0003] Prior art literature

[0004] Patent Literature

[0005] Patent Document 1: Japanese Patent Application Publication No. 2016-203217 Summary of the invention

[0006] Problems to be solved by the invention

[0007] In the technology described in Patent Document 1, the relative positions of the two grounding bars may be misaligned. One aspect of the present disclosure is to provide a method for manufacturing a solder and coaxial cable array with grounding bars in which the relative positions of the two grounding bars are unlikely to be misaligned.

[0008] Solutions to Solve Problems

[0009] One scheme of the present disclosure is a solder with a grounding strip, comprising: a first unit, which includes a first grounding strip and a first solder layer installed on a single side of the above-mentioned first grounding strip; and a second unit, which includes a second grounding strip and a second solder layer installed on a single side of the above-mentioned second grounding strip, and the above-mentioned first unit and the above-mentioned second unit are configured so that the above-mentioned first solder layer and the above-mentioned second solder layer are opposite to each other, and the above-mentioned first solder layer and the above-mentioned second solder layer are partially joined.

[0010] In the solder with a grounding strip of one embodiment of the present disclosure, the first solder layer and the second solder layer are partially joined. Therefore, when the solder with a grounding strip is used, the relative position of the first unit and the second unit is unlikely to deviate. Furthermore, when the solder with a grounding strip is used, there is no need to adjust the relative position of the first unit and the second unit.

[0011] Another embodiment of the present disclosure is a method for manufacturing a coaxial cable array by using a solder with a grounding strip to attach a grounding strip to a coaxial cable to manufacture a coaxial cable array. The solder with a grounding strip used comprises: a first unit including a first grounding strip and a first solder layer attached to one side of the first grounding strip; and a second unit including a second grounding strip and a second solder layer attached to one side of the second grounding strip, wherein the first unit and the second unit are arranged such that the first solder layer and the second solder layer are opposite to each other and the first solder layer and the second solder layer are partially joined.

[0012] In another embodiment of the coaxial cable array manufacturing method disclosed herein, a portion of the coaxial cable where the outer conductor is exposed is inserted between the first unit and the second unit, and the first solder layer and the second solder layer are heated and melted to join the outer conductor and the grounding strip.

[0013] In the coaxial cable array manufacturing method of another embodiment of the present invention, the solder with the grounding strip of one embodiment of the present invention is used. Therefore, the relative position of the first unit and the second unit is unlikely to deviate. In addition, there is no need to adjust the relative position of the first unit and the second unit. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is a top view showing the structure of the solder 1 with a grounding strip.

[0015] Figure 2 yes Figure 1 Cross-sectional view at section II-II in FIG.

[0016] Figure 3 It is an explanatory diagram showing the structure of the manufacturing apparatus 19 and the manufacturing method of the solder 1 with a grounding strip.

[0017] Figure 4 It is an explanatory diagram showing a method for manufacturing a coaxial cable array.

[0018] Figure 5 It is a cross-sectional view showing the structure of the coaxial cable 95 .

[0019] Figure 6 It is a perspective view showing the structure of the coaxial cable array 117 .

[0020] Figure 7 It is a cross-sectional view showing the structure of the solder 1 with a grounding strap in the second embodiment.

[0021] Figure 8 It is an explanatory diagram showing a method for manufacturing a coaxial cable array in the second embodiment.

[0022] Fig. 9It is a cross-sectional view showing the structure of the solder 1 with a grounding strap in the third embodiment.

[0023] Explanation of symbols

[0024] 1—solder with grounding strip, 3—first unit, 5—second unit, 7—first grounding strip, 9—first solder layer, 11—second grounding strip, 13—second solder layer, 19—manufacturing device, 73—holding portion, 75—laminated body, 77, 79—heating device, 81—collection box, 87, 89—fixing component, 91, 93—end, 94—interval, 95—coaxial cable, 97, 99—heater, 101—inner conductor, 103—insulating layer, 105—first sleeve, 107—outer conductor, 109—second sleeve, 111—solder, 117—coaxial cable array. DETAILED DESCRIPTION

[0025] Embodiments of examples of the present disclosure are described with reference to the accompanying drawings.

[0026] <First embodiment>

[0027] 1. Structure of solder 1 with grounding strip

[0028] based on Figure 1 and Figure 2 The structure of the solder 1 with a grounding strip is described. The basic form of the solder 1 with a grounding strip is, for example, a rectangular plate-shaped member in a plan view. Figure 2 As shown, the solder with grounding strip 1 includes a first unit 3 and a second unit 5 .

[0029] The first unit 3 includes a first grounding strip 7 and a first solder layer 9. The first grounding strip 7 is a rectangular plate-shaped member made of metal. Examples of the metal include copper and the like. The first solder layer 9 is a layer made of solder. The first solder layer 9 has the same shape as the first grounding strip 7 when viewed from above. The first solder layer 9 faces one side of the first grounding strip 7.

[0030] The first grounding strip 7 is bonded to the first solder layer 9 at the first bonding position 15 and the second bonding position 17. The first bonding position 15 and the second bonding position 17 are positions in a plan view. The center of the solder 1 with the grounding strip is located between the first bonding position 15 and the second bonding position 17 in a plan view.

[0031] The first joint position 15 and the second joint position 17 are arranged along the longitudinal direction L of the solder 1 with the grounding strip. The first joint position 15 is separated from the second joint position 17. The first grounding strip 7 and the first solder layer 9 are not joined at positions other than the first joint position 15 and the second joint position 17. The first solder layer 9 is attached to the first grounding strip 7 by being joined to the first grounding strip 7 at the first joint position 15 and the second joint position 17.

[0032] The second unit 5 includes a second grounding bar 11 and a second solder layer 13. The second grounding bar 11 is the same component as the first grounding bar 7. The second solder layer 13 is the same component as the first solder layer 9. The second solder layer 13 faces one surface of the second grounding bar 11.

[0033] The second grounding bar 11 is bonded to the second solder layer 13 at the first bonding position 15 and the second bonding position 17. The second grounding bar 11 is not bonded to the second solder layer 13 at positions other than the first bonding position 15 and the second bonding position 17. The second solder layer 13 is bonded to the second grounding bar 11 at the first bonding position 15 and the second bonding position 17, thereby being attached to the second grounding bar 11.

[0034] The first unit 3 and the second unit 5 are arranged so that the first solder layer 9 and the second solder layer 13 face each other. The first solder layer 9 and the second solder layer 13 are joined at the first joining position 15 and the second joining position 17. The first solder layer 9 and the second solder layer 13 are not joined at positions other than the first joining position 15 and the second joining position 17. That is, the first solder layer 9 and the second solder layer 13 are partially joined.

[0035] 2. Method for manufacturing solder 1 with grounding strip

[0036] based on Figure 3 A method for manufacturing the solder 1 with a grounding strip is described below. The solder 1 with a grounding strip can be used Figure 3 The structure of the manufacturing device 19 will be described. The manufacturing device 19 includes a first supply roller 21, a second supply roller 23, a third supply roller 25, and a fourth supply roller 27.

[0037] A long strip of the first grounding strip 7 is wound around the first supply roller 21. A long strip of the second grounding strip 11 is wound around the second supply roller 23. A wire solder 29 is wound around the third supply roller 25. And a wire solder 31 is wound around the fourth supply roller 27.

[0038] The manufacturing device 19 includes rollers 33, 35, and 37. The rollers 33, 35, and 37 guide the first ground strip 7 fed out from the first supply roll 21 to rollers 65 and 67 described below. The manufacturing device 19 includes rollers 39, 41, and 43. The rollers 39, 41, and 43 guide the second ground strip 11 fed out from the second supply roll 23 to rollers 65 and 67.

[0039] The manufacturing device 19 includes rollers 45, 47, 49. The rollers 45, 47, 49 guide the wire solder 29 fed from the third supply roller 25 to rollers 65, 67. The manufacturing device 19 includes rollers 51, 53, 55. The rollers 51, 53, 55 guide the wire solder 31 fed from the fourth supply roller 27 to rollers 65, 67.

[0040] The manufacturing device 19 includes rollers 57 and 59. The rollers 57 and 59 roll the wire solder 29 to form the first solder layer 9. The manufacturing device 19 includes rollers 61 and 63. The rollers 61 and 63 roll the wire solder 31 to form the second solder layer 13.

[0041] The manufacturing device 19 includes rollers 65 and 67. The rollers 65 and 67 sequentially overlap the first grounding strip 7, the first solder layer 9, the second solder layer 13, and the second grounding strip 11 to form a laminated body 75. The manufacturing device 19 includes rollers 69 and 71 and a gripper 73. The rollers 69 and 71 guide the laminated body 75 to the gripper 73. The gripper 73 grips the end of the laminated body 75.

[0042] The manufacturing device 19 includes heating devices 77 and 79. The heating devices 77 and 79 are arranged at positions on one side of the rollers 65 and 67 between the rollers 65 and 67 and the rollers 69 and 71. The heating devices 77 and 79 are arranged at intervals along the length direction of the laminate 75. The heating devices 77 and 79 heat the laminate 75 from both sides in the thickness direction of the laminate 75. The range heated by the heating devices 77 and 79 is a range smaller than the width of the laminate 75.

[0043] The manufacturing device 19 includes a collection box 81. The collection box 81 is disposed below the stacked body 75 and between the heating device 79 and the rollers 69 and 71. The collection box 81 is a box with an open top.

[0044] A method for manufacturing the solder 1 with a grounding strip using the manufacturing apparatus 19 is described. A first grounding strip 7 is drawn out from the first supply roll 21. A second grounding strip 11 is drawn out from the second supply roll 23. A wire solder 29 is drawn out from the third supply roll 25 and rolled by rollers 57 and 59 to form a first solder layer 9. A wire solder 31 is drawn out from the fourth supply roll 27 and rolled by rollers 61 and 63 to form a second solder layer 13.

[0045] The first grounding strip 7, the first solder layer 9, the second solder layer 13, and the second grounding strip 11 are sequentially stacked by rollers 65 and 67 to form a laminate 75. The laminate 75 passes through heating devices 77 and 79 and is sent to the gripping unit 73. The gripping unit 73 grips the end of the laminate 75.

[0046] Next, two locations of the laminate 75 are heated for a predetermined time by the heating devices 77 and 79, and then cooled. The two heated locations become the first bonding location 15 and the second bonding location 17. At the first bonding location 15 and the second bonding location 17, the first solder layer 9 and the second solder layer 13 are melted and then solidified.

[0047] Next, by moving the holding portion 73 to Figure 3 The stack 75 is moved to the right side of the stack 75, so that the portion where the first joint position 15 and the second joint position 17 are formed in the stack 75 is moved to the collection box 81. Next, the stack 75 is cut at the cutting positions 83 and 85. The stack 75 after being cut is the solder 1 with the grounding strip. The solder 1 with the grounding strip falls into the collection box 81.

[0048] Next, the gripping portion 73 grips the end of the stacked body 75 at the cutting position 83. In addition, the gripping portion 73 is returned to the position of Figure 3 As a result, the new stacked body 75 moves to the position corresponding to the heating devices 77 and 79.

[0049] In the above description, the solder with ground strip 1 is manufactured by cutting out the portion having the first joint position 15 and the second joint position 17 in the laminate 75, but the solder with ground strip in the form of a strip may be manufactured without cutting the laminate 75. The solder with ground strip in the form of a strip has a plurality of solder strips connected to each other. Figure 1 The solder with ground strip 1 shown in the figure. The coaxial cable array 117 may be manufactured by using a long solder with ground strip and by the same method as the coaxial cable array manufacturing method of each embodiment described below.

[0050] 3. Coaxial cable array manufacturing method

[0051] based on Figures 4 to 6 The manufacturing method of the coaxial cable array is described. Figure 4 As shown in S1, fixing components 87 and 89 are installed relative to the solder 1 with a grounding strip. The fixing component 87 is installed near the end 91 of the solder 1 with a grounding strip. The end 91 is one end in the length direction L. The fixing component 87 clamps the solder 1 with a grounding strip from both sides in the plate thickness direction. The relative position of the fixing component 87 with respect to the solder 1 with a grounding strip is constant.

[0052] The fixing member 89 is mounted near the end 93 of the solder with grounding strip 1. The end 93 is the end on the opposite side to the end 91. The fixing member 89 holds the solder with grounding strip 1 from both sides in the plate thickness direction. The relative position of the fixing member 89 to the solder with grounding strip 1 is constant.

[0053] While the position of the fixing member 87 is kept constant, the fixing member 89 is moved in the direction A. At this time, a force in the direction of compressing the solder 1 with the grounding strip in the longitudinal direction L is applied. As a result, Figure 4 As shown in S2 , between the first engaging position 15 and the second engaging position 17 , the interval 94 between the first unit 3 and the second unit 5 is expanded.

[0054] Next, if Figure 4 As shown in S3, a plurality of coaxial cables 95 are inserted into the gap 94. The multi-core cable includes a plurality of coaxial cables 95. The positions of the plurality of coaxial cables 95 in the length direction L are between the first joint position 15 and the second joint position 17. The plurality of coaxial cables 95 are arranged in a row along the length direction L. The axial direction of the plurality of coaxial cables 95 is a direction orthogonal to the length direction L and to the plate thickness direction of the solder 1 with the grounding strip.

[0055] like Figure 5 As shown, the plurality of coaxial cables 95 are respectively provided with an inner conductor 101, an insulating layer 103, a first sleeve 105, an outer conductor 107, and a second sleeve 109. The diameter of the coaxial cable 95 is, for example, 0.1 mm to 1 mm. In the portion of the plurality of coaxial cables 95 inserted between the first unit 3 and the second unit 5, the second sleeve 109 is removed, thereby exposing the outer conductor 107.

[0056] In addition, the solder 1 with the grounding strip is heated by the heaters 97 and 99 and then cooled. The heaters 97 and 99 are arranged to sandwich the solder 1 with the grounding strip from both sides in the plate thickness direction. The heaters 97 and 99 pressurize the first unit 3 and the second unit 5 toward the coaxial cable 95 while heating the solder 1 with the grounding strip. When the heaters 97 and 99 heat the solder 1 with the grounding strip, as shown in FIG. Figure 4As shown in S4 of FIG. 1 , the first solder layer 9 and the second solder layer 13 melt to form solder 111. The melted solder 111 is pressurized by the heaters 97 and 99 and spreads between the first grounding strip 7 and the second grounding strip 11. The melted solder 111 contacts the outer peripheral surface of the outer conductor 107 of the plurality of coaxial cables 95. When the solder 1 with the grounding strip is cooled, the solder 111 solidifies. The solder 111 joins the first grounding strip 7, the second grounding strip 11, and the outer conductor 107 to each other. The first grounding strip 7, the second grounding strip 11, and the outer conductor 107 are electrically connected. In addition, before the solder 1 with the grounding strip is heated by the heaters 97 and 99, the fixing of the solder 1 with the grounding strip by the fixing members 87 and 89 may be released. Furthermore, before the solder 1 with the grounding strip is heated by the heaters 97 and 99, the application of the force in the direction of compression in the longitudinal direction L may be released.

[0057] In addition, if Figure 4 As shown in S4, the first grounding strip 7, the second grounding strip 11, and the solder 111 are cut at the cutting positions 113 and 115. Through the above steps, the coaxial cable array 117 is obtained. In addition, if there is enough wiring space, the step of cutting at the cutting positions 113 and 115 can be omitted.

[0058] like Figure 4 S4 and Figure 6 As shown, the coaxial cable array 117 includes a plurality of coaxial cables 95, a first ground bar 7, and a second ground bar 11. The first ground bar 7 and the second ground bar 11 are joined to the plurality of coaxial cables 95 by solder 111.

[0059] The outer conductor 107 is exposed in a portion of the plurality of coaxial cables 95 located between the first ground bar 7 and the second ground bar 11. The outer conductor 107 is electrically connected to the first ground bar 7 and the second ground bar 11 via solder 111.

[0060] like Figure 6 As shown, at the front end side of the plurality of coaxial cables 95, there are portions where the first sleeve 105 is exposed and portions where the inner conductor 101 is exposed. In the other portions of the coaxial cables 95, the second sleeve 109 constitutes the outer peripheral surface of the coaxial cables 95.

[0061] 4. Effects of solder 1 with grounding strip and coaxial cable array manufacturing method

[0062] (1A) In the solder 1 with a grounding strip, the first solder layer 9 and the second solder layer 13 are partially bonded. Therefore, when the coaxial cable array manufacturing method is implemented, the relative position of the first unit 3 and the second unit 5 is unlikely to deviate. In addition, when the coaxial cable array manufacturing method is implemented, it is not necessary to adjust the relative position of the first unit 3 and the second unit 5. As a result, the coaxial cable array 117 can be easily manufactured in a short time.

[0063] (1B) The first solder layer 9 and the second solder layer 13 are bonded to each other at the first bonding position 15 and the second bonding position 17 arranged in the longitudinal direction L. Therefore, the relative positions of the first unit 3 and the second unit 5 are less likely to deviate.

[0064] (1C) In the coaxial cable array manufacturing method, before inserting the plurality of coaxial cables 95 into the gap 94, the gap 94 is expanded by applying a force in a direction of compressing the solder 1 with the grounding strip in the longitudinal direction L. Therefore, the operation of inserting the plurality of coaxial cables 95 into the gap 94 is further facilitated.

[0065] <Second embodiment>

[0066] 1. Differences from the first embodiment

[0067] The basic structure of the second embodiment is the same as that of the first embodiment, so the following describes the differences. In addition, the same reference numerals as those of the first embodiment indicate the same structure, and the above description is referred to.

[0068] In the first embodiment described above, the first solder layer 9 and the second solder layer 13 are joined at the first joining position 15 and the second joining position 17. Furthermore, the first grounding bar 7 and the first solder layer 9 are joined at the first joining position 15 and the second joining position 17. Furthermore, the second grounding bar 11 and the second solder layer 13 are joined at the first joining position 15 and the second joining position 17.

[0069] In contrast, in the second embodiment, as Figure 7 As shown in FIG. 1 , the first solder layer 9 and the second solder layer 13 are joined only at the first joining position 15, which is different from the first embodiment. Also, the first grounding strip 7 and the first solder layer 9 are joined only at the first joining position 15, which is different from the first embodiment. Furthermore, the second grounding strip 11 and the second solder layer 13 are joined only at the first joining position 15, which is different from the first embodiment. The first joining position 15 is located on the side closer to the end portion 91 than the center in the length direction L.

[0070] In the second embodiment, the solder with a grounding strip 1 can be manufactured by the same method as in the first embodiment. However, when manufacturing the solder with a grounding strip 1, the heating device 79 provided in the manufacturing device 19 is not used, but only the heating device 77 is used. The position heated by the heating device 77 becomes the first bonding position 15.

[0071] In a second embodiment, if Figure 8 As shown, the coaxial cable array 117 can be manufactured using the same method as the first embodiment. Figure 8 As shown in S12 and S13 , even if the second bonding position 17 does not exist, if a force in a direction of compressing the solder 1 with the grounding strip is applied in the longitudinal direction L, the gap 94 is expanded.

[0072] 2. Effects of solder 1 with grounding strip and coaxial cable array manufacturing method

[0073] According to the second embodiment described in detail above, the effects (1A) and (1C) of the above-mentioned first embodiment are achieved.

[0074] <Third Embodiment>

[0075] 1. Differences from the first embodiment

[0076] The basic structure of the third embodiment is the same as that of the first embodiment, so the differences will be described below. In addition, the same reference numerals as those of the first embodiment indicate the same structure, and the above description is referred to.

[0077] In the first embodiment described above, the first grounding bar 7 and the first solder layer 9 are bonded at the first bonding position 15 and the second bonding position 17 , and the second grounding bar 11 and the second solder layer 13 are bonded at the first bonding position 15 and the second bonding position 17 .

[0078] In contrast, in the third embodiment, Fig. 9 As shown, the first solder layer 9 is bonded to the first grounding bar 7 over its entire surface. Also, the second solder layer 13 is bonded to the second grounding bar 11 over its entire surface.

[0079] In the first embodiment described above, the first solder layer 9 and the second solder layer 13 are formed by rolling a wire solder. In contrast, in the third embodiment, the first solder layer 9 and the second solder layer 13 are formed by a solder plating method.

[0080] In the third embodiment, the solder 1 with the grounding strip can be manufactured by the following method. The first unit 3 is manufactured by forming the first solder layer 9 on one side of the first grounding strip 7 by the solder plating method. Furthermore, the second unit 5 is manufactured by forming the second solder layer 13 on one side of the second grounding strip 11 by the solder plating method. In addition, a plate with a solder layer can be manufactured by forming a solder layer on a large-area plate by the solder plating method, and then the first unit 3 and the second unit 5 are cut out from the plate with the solder layer.

[0081] Next, the first unit 3 and the second unit 5 are stacked in such a manner that the first solder layer 9 and the second solder layer 13 face each other. Next, the first bonding position 15 and the second bonding position 17 are heated and then cooled. At this time, the first solder layer 9 and the second solder layer 13 are bonded at the first bonding position 15 and the second bonding position 17, thereby completing the solder 1 with the grounding strip. Alternatively, the first solder layer 9 and the second solder layer 13 may be bonded only at the first bonding position 15.

[0082] 2. Effects of solder 1 with grounding strip and coaxial cable array manufacturing method

[0083] According to the third embodiment described in detail above, the effects of the first embodiment described above are achieved, and the following effects are also achieved.

[0084] (3A) In the third embodiment, the first solder layer 9 is connected to the first ground bar 7 over its entire surface. Therefore, it is possible to suppress the first solder layer 9 from separating from the first ground bar 7 and moving in the direction of the second solder layer 13. In addition, in the third embodiment, the second solder layer 13 is connected to the second ground bar 11 over its entire surface. Therefore, it is possible to suppress the second solder layer 13 from separating from the second ground bar 11 and moving in the direction of the first solder layer 9. Thus, it is possible to suppress the gap 94 from becoming narrower. As a result, the operation of inserting the plurality of coaxial cables 95 into the gap 94 is further facilitated.

[0085] <Other embodiments>

[0086] As mentioned above, although embodiment of this disclosure was described, this disclosure is not limited to the said embodiment, Various deformation|transformation is possible and it can be implemented.

[0087] (1) In the solder with ground bar 1, the number of locations where the first solder layer 9 and the second solder layer 13 are joined may be three or more.

[0088] (2) In the solder 1 with a ground bar, part or all of the jointed portion between the first solder layer 9 and the second solder layer 13 may be arranged in a direction intersecting the longitudinal direction L.

[0089] (3) The method of expanding the interval 94 may also be the following method. First, insert the interval expansion unit into the interval 94. The interval expansion unit is composed of two separable parts. The interval expansion unit is, for example, two overlapping plate-like parts. Furthermore, the interval expansion unit is composed of, for example, a part having one or more convex parts on one side and a part having one or more concave parts on one side. When inserted into the interval 94, the convex part of one part meshes with the concave part of another part. When the convex part of one part meshes with the concave part of another part, the shape of the interval expansion unit is, for example, a plate shape.

[0090] Next, the two components constituting the gap extending unit are separated. One of the two components presses the first solder layer 9 in a direction away from the second solder layer 13. And the other of the two components presses the second solder layer 13 in a direction away from the first solder layer 9. As a result, the gap 94 is extended.

[0091] (4) The function of one component in each of the above embodiments may be shared among multiple components, or one component may perform the functions of multiple components. In addition, a portion of the structure of each of the above embodiments may be omitted. Furthermore, at least a portion of the structure of each of the above embodiments may be added to the structure of another embodiment, or replaced with the structure of another embodiment, etc.

[0092] (5) In addition to the above-mentioned solder with a grounding strip, the present disclosure can also be implemented in various forms such as a system using the solder with a grounding strip as a component, a method for manufacturing the solder with a grounding strip, etc.

Claims

1. A solder with a grounding strip, characterized in that: have: A first unit comprising a first grounding bar and a first solder layer mounted on one side of the first grounding bar; and The second unit comprises a second grounding strip and a second solder layer mounted on one side of the second grounding strip, The first unit and the second unit are configured such that the first solder layer and the second solder layer are opposite to each other. wherein a portion of the first solder layer is bonded to a portion of the second solder layer, and another portion of the first solder layer is not bonded to another portion of the second solder layer, and The portion of the first solder layer that is not joined together is directly opposed to the portion of the second solder layer.

2. The solder with grounding strip according to claim 1, characterized in that: The first solder layer and the second solder layer are bonded to each other at one location or at a plurality of locations arranged along the length direction of the solder with ground strip.

3. A method for manufacturing a coaxial cable array, which is a method for manufacturing a coaxial cable array by using solder with a grounding strip to attach a grounding strip to a coaxial cable, characterized in that: The above solder with grounding strip has: A first unit comprising a first grounding bar and a first solder layer mounted on one side of the first grounding bar; and The second unit comprises a second grounding strip and a second solder layer mounted on one side of the second grounding strip, The first unit and the second unit are arranged so that the first solder layer and the second solder layer face each other. A portion of the first solder layer is bonded to a portion of the second solder layer, and another portion of the first solder layer is not bonded to another portion of the second solder layer. A portion of the coaxial cable where the outer conductor is exposed is inserted between the portion of the first solder layer and the portion of the second solder layer that are not joined together, The first solder layer and the second solder layer are heated and melted to bond the outer conductor and the ground bar.

4. The method for manufacturing a coaxial cable array according to claim 3, characterized in that: Before inserting the coaxial cable between the portion of the first solder layer and the portion of the second solder layer that are not joined together, By applying a force in a direction of compressing the solder with the ground strip in a longitudinal direction of the solder with the ground strip, a gap between a portion of the first solder layer and a portion of the second solder layer that are not joined together is widened.

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