Method for manufacturing a display device

Abstract

A method of manufacturing a display device is disclosed, the method comprising: disposing a polarization layer on one surface of a display panel including a thin film transistor and a pixel electrode; cutting the polarization layer using a first laser beam such that a step between a side surface of the polarization layer and a side surface of the display panel is less than a predetermined value; attaching a conductive film to the side surface of the display panel; and patterning the conductive film using a second laser beam.

Description

[0001] Cross - reference to related applications

[0002] This application claims priority to Korean Patent Application No. 10 - 2019 - 0031285, filed on Mar. 19, 2019, with the Korean Intellectual Property Office, the disclosure of which is incorporated herein by reference in its entirety. Technical Field

[0003] Exemplary embodiments of the inventive concept relate to a display device and a method of manufacturing the display device. Background Art

[0004] Recently, the display field has been rapidly developing in line with the information age. Accordingly, various types of flat - panel display devices that are thinner, lighter, and consume less power have been developed, including liquid crystal displays (LCDs), plasma display panels (PDPs), electroluminescent displays (ELDs), field emission displays (FEDs), and the like.

[0005] In some cases, an image may be displayed on a plurality of display panels in outdoor displays, electronic signboards, etc. In this case, the connection portion between the display panels may be visually recognized due to the bezels of the display panels, and the immersion in the displayed image may be reduced. Accordingly, it may be desirable to minimize the bezels of the display panels while displaying an ultra - high - resolution image on the plurality of display panels. Similarly, for small and medium - sized display devices (such as mobile devices) with high resolution, it may be desirable to minimize the bezels of the display panels. Summary of the Invention

[0006] According to an exemplary embodiment of the inventive concept, a method of manufacturing a display device may include: disposing a polarization layer on one surface of a display panel including a thin - film transistor and a pixel electrode; cutting the polarization layer using a first laser beam such that a step between a side surface of the polarization layer and a side surface of the display panel is less than a predetermined value; attaching a conductive film to the side surface of the display panel; and patterning the conductive film using a second laser beam.

[0007] In an exemplary embodiment of the inventive concept, attaching the conductive film may include: pressing a conductive layer and a base layer located on the conductive layer at a first temperature and a first pressure such that the conductive film contacts the side surface of the display panel, wherein the conductive layer and the base layer constitute the conductive film; removing the base layer from the conductive layer; and pressing the conductive layer at a second temperature and a second pressure to bond the conductive layer to the side surface of the display panel.

[0008] In an exemplary embodiment of the inventive concept, the second temperature may be higher than the first temperature.

[0009] In an exemplary embodiment of the inventive concept, the second pressure may be higher than the first pressure.

[0010] In an exemplary embodiment of the inventive concept, a conductive layer may be bonded to a side surface of a display panel by a bonding device including a heating unit heated to a second temperature and a pressing unit in the form of a bar for pressing a conductive film with a second pressure.

[0011] In an exemplary embodiment of the inventive concept, a pressing device in the form of a roller or a bar may press a conductive film at a first temperature with a first pressure such that the conductive film contacts a side surface of the display panel.

[0012] In an exemplary embodiment of the inventive concept, the conductive layer may include at least one selected from silver (Ag), copper (Cu), gold (Au), and aluminum (Al).

[0013] In an exemplary embodiment of the inventive concept, attaching a conductive film to a side surface of a display panel may include bonding the conductive film to the side surface of the display panel under predetermined temperature and pressure conditions.

[0014] In an exemplary embodiment of the inventive concept, the display panel may further include a common electrode disposed on a pixel electrode and a color filter disposed on the common electrode.

[0015] In an exemplary embodiment of the inventive concept, a patterned conductive film may form a plurality of side conductive patterns electrically connected to at least one of a thin film transistor, a pixel electrode, a common electrode, and a color filter.

[0016] In an exemplary embodiment of the inventive concept, a distance between the plurality of side conductive patterns may be 30 μm or less.

[0017] In an exemplary embodiment of the inventive concept, the method may further include attaching an anisotropic conductive film to the plurality of side conductive patterns such that a driving circuit and a printed circuit board are electrically connected to the plurality of side conductive patterns.

[0018] In an exemplary embodiment of the inventive concept, cutting a polarization layer may include sucking impurities generated in response to cutting the polarization layer; and cleaning a side surface of the display panel with atmospheric pressure plasma.

[0019] In an exemplary embodiment of the inventive concept, the method may further include transporting the display panel in a direction substantially parallel to one surface of the display panel along a predetermined transport line. When the display panel is transported, a polarization layer is sequentially disposed on one surface of the display panel, the polarization layer is cut, a conductive film is attached to a side surface of the display panel, and the conductive film is patterned.

[0020] According to an exemplary embodiment of the inventive concept, a method of manufacturing a display device may include: attaching a conductive film to at least one side surface of a display panel in which pixels including thin film transistors and light emitting elements are disposed; patterning the conductive film using a laser beam to form a plurality of side conductive patterns electrically connected to the pixels; and attaching an anisotropic conductive film to the plurality of side conductive patterns to electrically connect a driving circuit to the plurality of side conductive patterns.

[0021] In an exemplary embodiment of the inventive concept, attaching the conductive film may include: pressing a conductive layer and a base layer positioned on the conductive layer at a first temperature and a first pressure such that the conductive film contacts at least one side surface of the display panel, wherein the conductive layer and the base layer constitute the conductive film; removing the base layer from the conductive layer; and pressing the conductive layer at a second temperature and a second pressure to bond the conductive layer to at least one side surface of the display panel.

[0022] In an exemplary embodiment of the inventive concept, the second temperature may be higher than the first temperature, and the second pressure may be higher than the first pressure.

[0023] According to an exemplary embodiment of the inventive concept, a display device may include: a display panel including a plurality of pixels and connection lines connected to the plurality of pixels, each pixel being defined by a gate line and a data line; and a driving circuit electrically connected to the display panel through the connection lines. A plurality of side conductive patterns for electrically connecting the plurality of pixels and the driving circuit may be disposed on a bonding side corresponding to at least one side surface of the display panel, the connection lines and the plurality of side conductive patterns may be bonded at end portions corresponding to at least one side surface of the display panel, respectively, and the connection lines and the plurality of side conductive patterns may include different conductive materials.

[0024] In an exemplary embodiment of the inventive concept, the display device may further include an anisotropic conductive film attached to the plurality of side conductive patterns. A first portion of the anisotropic conductive film may be attached to the plurality of side conductive patterns, and the driving circuit may be connected to a second portion of the anisotropic conductive film.

[0025] In an exemplary embodiment of the inventive concept, a distance between the plurality of side conductive patterns may be 30 μm or less. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] The above and other features of the inventive concept will be more fully understood by describing in detail exemplary embodiments of the inventive concept with reference to the accompanying drawings.

[0027] Figure 1 is a flowchart illustrating a method of manufacturing a display device according to an exemplary embodiment of the inventive concept.

[0028] Figure 2It is a block diagram showing a display device according to an exemplary embodiment of the inventive concept.

[0029] Figure 3 It is a cross-sectional view schematically showing a display device according to an exemplary embodiment of the inventive concept.

[0030] Figures 4 to 7 It is a view showing a method of manufacturing a display device according to an exemplary embodiment of the inventive concept Figure 1 of.

[0031] Figure 8A , Figure 8B and Figure 8C It is a plan view showing a method of manufacturing a display device according to an exemplary embodiment of the inventive concept Figure 7 of.

[0032] Figures 9 to 13 It is a view showing a method of manufacturing a display device according to an exemplary embodiment of the inventive concept Figure 1 of.

[0033] Figure 14 It is a flowchart showing a method of manufacturing a display device according to an exemplary embodiment of the inventive concept.

[0034] Figure 15 It is a block diagram showing a display device according to an exemplary embodiment of the inventive concept.

[0035] Figure 16 It is a schematic view showing a facility for performing a method of manufacturing a display device according to an exemplary embodiment of the inventive concept Figure 1 of. Detailed Description

[0036] Exemplary embodiments of the inventive concept provide a method of manufacturing a display device, which can form an ultra-fine conductive pattern on a side surface of a display panel of the display device.

[0037] Exemplary embodiments of the inventive concept also provide a display device including a display panel having a side surface on which an ultra-fine conductive pattern is formed.

[0038] Hereinafter, exemplary embodiments of the inventive concept will be described in detail with reference to the accompanying drawings. Throughout the present application, the same reference numerals may refer to the same elements.

[0039] Figure 1 It is a flowchart showing a method of manufacturing a display device according to an exemplary embodiment of the inventive concept.

[0040] Referring to Figure 1A method of manufacturing a display device may include: an operation of disposing a polarizing layer on one surface of a display panel (S100); an operation of cutting the polarizing layer using a first laser beam (e.g., a cutting laser beam) (S200); an operation of attaching a conductive film to a side surface of the display panel (S300); an operation of patterning the conductive film using a second laser beam (e.g., a patterning laser beam) (S400); and an operation of electrically connecting a driving circuit to a side conductive pattern formed by patterning the conductive film (S500).

[0041] In an exemplary embodiment of the inventive concept, the display device may be a liquid crystal display (LCD). Hereinafter, the liquid crystal display device will be described as an example of the display device. However, the inventive concept is not limited thereto. For example, the display device may be a plasma display panel (PDP), an organic light emitting diode (OLED), a field emission display (FED), an electrophoretic display, etc.

[0042] The display device manufactured by the method may have a side surface from which a step between the polarizing layer and the display panel is eliminated. In addition, a side conductive pattern connected to an internal circuit of the display panel may be formed on the side surface from which the step has been eliminated by an ultra-precision laser technique. Accordingly, a driving circuit for driving the display device may be electrically connected to the side surface of the display panel by a side bonding method.

[0043] In a conventional display device, electrodes extend on an upper surface of a substrate on which thin film transistors are formed, an anisotropic conductive film or the like is attached to the electrodes, and a driving chip, a printed circuit board (PCB), etc. are attached to the anisotropic conductive film by a chip on film (COF) method. Accordingly, a side step may be generated between the polarizing layer and the display panel (the substrate including thin film transistors, etc.), and a bezel is formed. In addition, due to the side step between the polarizing layer and the display panel, light leakage may be visually recognized. To prevent light leakage, a chassis, a frame, a black matrix, etc. may be formed on the outside of the display panel. Accordingly, the conventional display device has reached a limit in reducing the width of the bezel on the outside.

[0044] The display device and the method of manufacturing the display device according to an exemplary embodiment of the inventive concept may eliminate a step between the polarizing layer and the display panel. Zero bezel may be achieved by connecting the display panel and the driving circuit by a side bonding method, and a large-size display having an ultra-high resolution exceeding UHD (ultra-high definition) or larger may be achieved by ultra-fine laser patterning. In addition, the adhesion strength between the side conductive pattern and the side surface of the display panel may be increased by pressing the conductive film on the side surface of the display panel, and the electrical connection between the side conductive pattern and the conductive film of the display panel may be improved.

[0045] Figure 2is a block diagram showing a display device according to an exemplary embodiment of the inventive concept.

[0046] Referring Figure 2 , the display device 1000 may include a display panel 100 and a driving circuit 200. In an exemplary embodiment of the inventive concept, the display panel 100 may be a liquid crystal panel, and the display device 1000 may further include a backlight 150.

[0047] The display panel 100 may include a plurality of gate lines GL extending in a first direction (e.g., a horizontal direction (row direction)). A plurality of data lines DL extending in a second direction intersecting the first direction (e.g., a vertical direction (column direction)) may be disposed on the display panel 100.

[0048] Each pixel PX may be defined by a gate line GLi and a data line DLj intersecting each other, where i and j are natural numbers. Each pixel PX of the display panel 100 may include a thin film transistor, a liquid crystal capacitor, and a storage capacitor. In an exemplary embodiment of the inventive concept, each pixel PX may display light of one of red, green, and blue.

[0049] The backlight 150 may provide light to the display panel 100. The backlight 150 may include a cold cathode fluorescent lamp (CCFL), an external electrode fluorescent lamp (EEFL), a light emitting diode (LED), etc. as a light source.

[0050] The driving circuit 200 may include a timing controller 220, a gate driver 240, and a data driver 260.

[0051] The timing controller 220 may receive image data from an external graphics source such as a TV system or a video card, and receive control signals such as a vertical synchronization signal, a horizontal synchronization signal, a main clock signal, and a data enable signal. The timing controller 220 may generate a data control signal DCS for controlling the data driver 260 based on the control signals. The data control signal DCS may include a source start pulse, a source sampling clock, a source output enable signal, a polarity signal, etc. In addition, the timing controller 220 may receive the image data RGB, arrange the image data RGB, and send the image data RGB to the data driver 260.

[0052] The timing controller 220 may generate a gate control signal GCS for controlling the gate driver 240 in response to the control signals.

[0053] The data driver 260 may provide a data voltage to the data lines DL in response to the data control signal DCS and the image data RGB.

[0054] The gate driver 240 may sequentially select gate lines GL in response to a gate control signal GCS provided from the timing controller 220, and may output a turn-on voltage to the selected gate lines GL.

[0055] The thin film transistor connected to the selected gate line GL may be turned on by the turn-on voltage.

[0056] Figure 3 is a cross-sectional view schematically showing a display device according to an exemplary embodiment of the inventive concept.

[0057] Referring Figure 3 , the display device 1000 may include a display panel 100 and polarizing layers 80 and 90. Figure 3 shows a part of the cross-section of the display device 1000.

[0058] The display panel 100 may include a first substrate 10, a second substrate 70, and a liquid crystal layer 44 disposed between the first substrate 10 and the second substrate 70.

[0059] In an exemplary embodiment of the inventive concept, the display panel 100 may include a first substrate 10 for setting thin film transistors TR and pixel electrodes 42, a second substrate 70 for setting common electrodes 46 and color filters 60, and a liquid crystal layer 44 disposed between the first substrate 10 and the second substrate 70.

[0060] For example, a gate electrode 22 may be formed on the first substrate 10, and a gate insulating layer 24 may be formed on the gate electrode 22. A semiconductor layer 26 corresponding to the gate electrode 22 may be formed on the gate insulating layer 24, and source electrodes 28A and drain electrodes 28B spaced apart from each other may be formed on the semiconductor layer 26.

[0061] The gate electrode 22, the semiconductor layer 26, the source electrodes 28A, and the drain electrodes 28B may constitute a thin film transistor TR. Although Figure 3 shows a thin film transistor TR having a bottom gate structure, the inventive concept is not limited thereto. For example, the thin film transistor TR may be formed in a top gate structure.

[0062] A protective layer 30 may be formed on an upper portion of the thin film transistor TR, and a pixel electrode 42 connected to the drain electrode 28B may be formed on the protective layer 30.

[0063] A common electrode 46 may be formed on the pixel electrode 42. In an exemplary embodiment of the inventive concept, a liquid crystal layer 44 including liquid crystal molecules 45 may be disposed between the pixel electrode 42 and the common electrode 46.

[0064] The color filter 60 may be formed on the common electrode 46. In an exemplary embodiment of the inventive concept, a black matrix 62 may be disposed in a groove of the color filter 60. In an exemplary embodiment of the inventive concept, a protective layer (outer coating) may be further disposed between the common electrode 46 and the color filter 60.

[0065] When the thin film transistor TR is turned on according to a gate signal applied to the gate electrode 22, a data signal may be applied to the pixel electrode 42 through the thin film transistor TR, and an electric field may be generated between the pixel electrode 42 and the common electrode 46. The liquid crystal molecules 45 of the liquid crystal layer 44 may be reoriented according to the electric field so that the pixel PX may emit light of a gray level corresponding to the data signal.

[0066] In an exemplary embodiment of the inventive concept, the thin film transistor TR, the pixel electrode 42, and the common electrode 46 may respectively extend through a wire (or a connection line (see Figure 7 “CL” in Figure 11 ), and may be electrically connected to a side conductive pattern formed on a side surface of the display panel 100 (see

[0067] “CP” in

[0068] ).

[0069] In an exemplary embodiment of the inventive concept, the thin film transistor TR, the pixel electrode 42, and the common electrode 46 may be disposed on the first substrate 10, and the color filter 60 may be disposed on the second substrate 70. The liquid crystal layer 44 may be disposed between the first substrate 10 and the second substrate 70. In this case, the liquid crystal molecules 45 may be aligned in a horizontal direction, such as an in-plane switching (IPS) mode, a plane-to-line switching (PLS) mode, an fringe field switching (FFS) mode, etc.

[0070] However, the inventive concept is not limited thereto. The display device 1000 may have only one of the first polarizing layer 80 and the second polarizing layer 90.

[0071] In an exemplary embodiment of the inventive concept, the polarization axes of the first polarization layer 80 and the second polarization layer 90 may be orthogonal to each other.

[0072] Figures 4 to 7 is a diagram showing a Figure 1 method of manufacturing a display device according to an exemplary embodiment of the inventive concept.

[0073] Referring to Figures 1 to 7 , a method of manufacturing the display device 1000 may include: an operation of disposing a polarization layer 80A on an upper surface of the display panel 100 (S100); an operation of cutting the polarization layer 80A (S200); and an operation of cleaning a side surface of the display panel 100 with atmospheric pressure plasma.

[0074] The polarization layer 80A may be disposed on the upper surface of the display panel 100 on which thin film transistors TR, pixel electrodes 42, common electrodes 46, a liquid crystal layer 44, and color filters 60 are formed (S100). The display panel 100 may include a first substrate 10, a second substrate 70, and a liquid crystal layer 44 disposed between the first substrate 10 and the second substrate 70.

[0075] In an exemplary embodiment of the inventive concept, the thin film transistors TR and the pixel electrodes 42 may be disposed on the first substrate 10, and the common electrodes 46 and the color filters 60 may be disposed on the second substrate 70.

[0076] In an exemplary embodiment of the inventive concept, the thin film transistors TR, the pixel electrodes 42, and the common electrodes 46 may be disposed on the first substrate 10, and the color filters 60 may be disposed on the second substrate 70.

[0077] In an exemplary embodiment of the inventive concept, the thin film transistors TR, the pixel electrodes 42, the common electrodes 46, and the color filters 60 may be disposed on the first substrate 10.

[0078] Hereinafter, for convenience, in the description with reference to Figures 4 to 13 , components included in the display panel 100 are divided into a liquid crystal panel 50 and color filters 60. For example, the liquid crystal panel 50 may include the first substrate 10, thin film transistors TR, pixel electrodes 42, common electrodes 46, and a liquid crystal layer 44. In addition, the color filters 60 may further include the second substrate 70 disposed on the color filters 60.

[0079] By scribing the original substrate with a diamond cutter or a laser cutter, the display panel 100 may be in a cut state. Accordingly, the flatness of the side surface of the display panel 100 is low, and impurities may exist in the side surface of the display panel 100.

[0080] The polarization layer 80A may be attached to the color filters 60. InFigure 4 In [description], the polarizing layer 80A is disposed on the color filter 60, but the inventive concept is not limited thereto. For example, the polarizing layer 80A may be disposed on the upper and lower surfaces of the display panel 100 such that their polarization axes are orthogonal to each other at 90 degrees.

[0081] In an exemplary embodiment of the inventive concept, the operation of disposing the polarizing layer 80A may include: a cleaning process of removing foreign substances from the display panel 100; a process of aligning the polarizing layer 80A with the display panel 100 and then attaching the polarizing layer 80A while peeling off the protective film; and an autoclave process for removing bubbles between the polarizing layer 80A and the display panel 100 and for enhancing the adhesion strength.

[0082] The cross-sectional area of the polarizing layer 80A may be larger than the cross-sectional area of the display panel 100 to enhance the adhesion strength between the polarizing layer 80A and the display panel 100.

[0083] Thereafter, the polarizing layer 80A may be cut (S200) such that the side surfaces of the polarizing layer 80A and the display panel 100 are aligned.

[0084] In an exemplary embodiment of the inventive concept, as Figure 5 shown, the side surface of the display panel 100 may be polished substantially simultaneously with cutting the polarizing layer 80A by a cutting laser beam (or a first laser beam). Substantially simultaneously, residues and impurities generated by the cutting and polishing processes may be aspirated.

[0085] The cutting laser beam may be output from a predetermined laser cutting device 300. For example, the cutting laser beam may be a femtosecond laser beam and may be implemented at an infrared wavelength using a gas laser such as a helium-neon (He-Ne) laser or a carbon dioxide (CO2) laser.

[0086] The cutting laser beam may be precisely irradiated onto the corresponding side surfaces of the polarizing layer 80A and the display panel 100. The side surfaces of the polarizing layer 80A cut by the cutting laser beam and the side surface of the display panel 100 may be flattened. In other words, the step between the side surface of the polarizing layer 80A and the side surface of the display panel 100 may be eliminated. For example, the step between the side surface of the polarizing layer 80A and the side surface of the display panel 100 may be 100 μm or less. Ideally, the step between the side surface of the polarizing layer 80A and the side surface of the display panel 100 may be zero.

[0087] Conventionally, an edge grinding method has been used as a cutting method for flattening the side surface of a substrate. The edge grinding method is expensive in terms of facility cost, difficult to form a step within 200 μm, and has a relatively high damage rate of the display panel due to physical impact.

[0088] However, in the cutting and polishing process (S200) using a cutting laser beam according to an exemplary embodiment of the inventive concept, the step between the side surface of the polarization layer 80A and the side surface of the display panel 100 can be reduced to 100 μm or less at low cost, and the strength of the edge portion can be increased. For example, the step between the side surface of the polarization layer 80A and the side surface of the display panel 100 can be 50 μm or less.

[0089] By cutting the polarization layer 80A and polishing the display panel 100, impurities such as residues and fumes may be generated and the side surface of the display panel 100 may be contaminated. Accordingly, a suction device may be provided and the fumes may be suctioned to prevent contamination.

[0090] In Figure 5 , the laser cutting process is performed only on one side surface of the display panel 100, but the inventive concept is not limited thereto. The cutting and polishing process may be performed on other side surfaces of the display panel 100.

[0091] As Figure 6 shown, the side surface of the display panel 100 may be cleaned by atmospheric pressure plasma using a plasma cleaning device 500. Contaminants such as organic substances remaining on the side surface of the display panel 100 may be removed again through the plasma cleaning process. In addition, the side surface of the display panel 100 may be provided with a hydrophilic function to reduce the contact angle. Accordingly, the adhesion strength between the conductive paste and the side surface of the display panel 100 may be increased. After the cutting and polishing process is performed, the polarization layer 80A may become the first polarization layer 80.

[0092] As Figure 7 shown, a conductive film CDF may be attached to at least one side surface of the display panel 100. For example, a conductive film CDF in the form of a film or a thin film may be attached (adhered) to the side surface of the display panel 100 on which the plasma cleaning process has been performed using a thermocompression bonding facility or the like.

[0093] A first conductive film CDF1 may be provided on the first side surface of the display panel 100 (see Figure 8A "SSF1" in Figure 8A ), and a second conductive film CDF2 may be provided on the second side surface of the display panel 100 (see

[0094] The attachment area to which the conductive film CDF is attached may include a portion of one side surface of the display panel 100. For example, the attachment area may be an area including a portion of the liquid crystal panel 50 and a portion of the color filter 60. The attachment area may correspond to only a portion of the liquid crystal panel 50.

[0095] The attachment region may be formed to contact a plurality of connection lines CL formed on the liquid crystal panel 50. Each of the connection lines CL may be connected to at least one of the thin film transistor TR, the pixel electrode 42, the common electrode 46, and the color filter 60. In addition, each of the connection lines CL may extend from at least one of the thin film transistor TR, the pixel electrode 42, the common electrode 46, and the color filter 60 to an end portion corresponding to one side surface of the liquid crystal panel 50 or the display panel 100. Therefore, the first conductive film CDF1 and the second conductive film CDF2 and the connection lines CL may contact each other. The connection lines CL may include at least one selected from the group consisting of copper (Cu), titanium (Ti), and aluminum (Al).

[0096] The first and second conductive films CDF1 and CDF2 may include a metal material having high conductivity. In an exemplary embodiment of the present inventive concept, the first and second conductive films CDF1 and CDF2 may include at least one of silver (Ag), copper (Cu), gold (Au), and aluminum (Al).

[0097] The materials included in the connection line CL and the first and second conductive films CDF1 and CDF2 are not limited thereto.

[0098] Figure 8A , Figure 8B and Figure 8C is a diagram showing the manufacturing process of an exemplary embodiment according to the present inventive concept Figure 7 A plan view of an example of a method of displaying a device.

[0099] refer to Figure 7 , Figure 8A , Figure 8B and Figure 8C , the conductive film CDF may be attached to at least one side surface of the display panel 100 .

[0100] In an exemplary embodiment of the present inventive concept, the conductive film CDF may be heated at a first temperature and pressed at a second pressure to be attached to the side surface of the display panel 100 .

[0101] like Figure 8AAs shown in the figure, in an exemplary embodiment of the inventive concept, at a first temperature, pressing devices 601 and 602 in the form of rods may press a first conductive film CDF1 and a second conductive film CDF2 against a first side surface SSF1 and a second side surface SSF2 of a display panel 100, respectively.

[0102] The first conductive film CDF1 may be wound around a first reel REEL1 in the form of a roll. The first conductive film CDF1 may be connected between the first reel REEL1 and the second reel REEL2 and aligned with the first side surface SSF1 of the display panel 100 corresponding to the rotation of the first reel REEL1 and the second reel REEL2.

[0103] When the first pressing device 601 presses the first conductive film CDF1 against the first side surface SSF1 of the display panel 100 at the first temperature with a first pressure, the first conductive film CDF1 may adhere to the first side surface SSF1 with a weak adhesion. The first pressing device 601 may include a pressing unit having a rod shape and a heating unit for providing a predetermined temperature to the pressing unit in contact with the first conductive film CDF1. Accordingly, the first conductive film CDF1 may be attached to the first side surface SSF1 of the display panel 100 at the first temperature and the first pressure. For example, the first temperature may be about 70 °C, and the first pressure may be about 1 Mpa. In other words, the first temperature and the first pressure may be relatively low temperature and relatively low pressure.

[0104] In an exemplary embodiment of the inventive concept, as Figure 8B shown in the figure, the conductive film CDF (e.g., the first conductive film CDF1) may include a conductive layer CDL (or a metal film) that directly contacts a side surface (e.g., the first side surface SSF1) of the display panel 100 and a base layer BL (or a base film) for protecting the conductive layer CDL. The conductive layer CDL may include at least one selected from silver (Ag), copper (Cu), gold (Au), and aluminum (Al). The base layer BL may include an elastic polymeric organic material. For example, the base layer BL may be a PET film or the like. The base layer BL may protect the conductive layer CDL wound around a reel (e.g., the first reel REEL1).

[0105] The process of weakly adhering the first conductive film CDF1 to the first side surface SSF1 of the display panel 100 using the first pressing device 601 may include a process of aligning the first conductive film CDF1 with the first side surface SSF1 of the display panel 100. Accordingly, the first conductive film CDF1 may be attached to the first side surface SSF1 of the display panel 100 within a predetermined edge range. The first conductive film CDF1 may contact one end of each of the connection lines CL.

[0106] The second pressing device 602 and the process of attaching the second conductive film CDF2 to the second side surface SSF2 of the display panel 100 may be substantially the same as the first pressing device 601 and the process of attaching the first conductive film CDF1. Therefore, redundant descriptions will be omitted.

[0107] In an exemplary embodiment of the inventive concept, as Figure 8C shown, at a first temperature, pressing devices 603 and 604 in the form of rollers may press the first conductive film CDF1 and the second conductive film CDF2 against the first side surface SSF1 and the second side surface SSF2 of the display panel 100 with a first pressure, respectively. Each of the pressing devices 603 and 604 may include at least one roller RL for pressing the first conductive film CDF1 and the second conductive film CDF2. The first conductive film CDF1 and the second conductive film CDF2 may contact (be pre-attached to) the first side surface SSF1 and the second side surface SSF2 of the display panel 100 through the reciprocating movement of the roller RL.

[0108] Figures 9 to 13 is a diagram showing a method of manufacturing a display device according to an exemplary embodiment of the inventive concept Figure 1 of.

[0109] Referring to Figures 9 to 13 , the method of manufacturing a display device may further include: an operation of removing the base layer BL from the conductive layer CDL; and an operation of pressing the conductive layer CDL against the display panel 100 at a second temperature with a second pressure to bond the conductive layer CDL and the display panel 100.

[0110] As Figure 9 shown, the base layer BL attached to one side surface of the display panel 100 may be separated from the conductive layer CDL. The base layer BL joined to the conductive layer CDL through an adhesive having a weak bonding strength or the like may be removed from the conductive layer CDL.

[0111] In an exemplary embodiment of the inventive concept, the base layer BL may be physically peeled off from the conductive layer CDL by a peeling device. In addition, the base layer BL may be removed by a chemical method to completely remove the portion of the base layer BL remaining on the display panel 100.

[0112] As Figure 10A and Figure 10BAs shown, at the second temperature, the first conductive layer CDL1 may be pressed at the second pressure and bonded to the display panel 100. In an exemplary embodiment of the inventive concept, the first conductive layer CDL1 may be bonded to the display panel 100 with a strong bonding strength by a bonding device 700 including a pressing unit PP having a rod shape. Here, the first conductive layer CDL1 may be a conductive layer included in the first conductive film CDF1.

[0113] Figure 10A Only the bonding device 700 for bonding the first conductive layer CDL1 to the display panel 100 is shown. In an exemplary embodiment of the inventive concept, the second conductive layer CDL2 may be bonded to the other surface of the display panel 100 by the bonding device 700 or another bonding device.

[0114] Hereinafter, when it is necessary to describe the first conductive layer CDL1 and the second conductive layer CDL2 as a single entity, the term "conductive layer CDL" will be used.

[0115] The bonding device 700 may include a pressing unit PP having a rod shape and a heating unit HP for heating the pressing unit PP. The heating unit HP may heat the pressing unit PP at the second temperature, and the pressing unit PP may press the first conductive layer CDL1 at the second pressure for a predetermined time. In an exemplary embodiment of the inventive concept, the second temperature may be higher than the first temperature, and the second pressure may be higher than the first pressure. For example, the second temperature may be at least about 180 °C, and the second pressure may be at least about 4 Mpa. In other words, the bonding device 700 may bond the first conductive layer CDL1 to the display panel 100 at high temperature and high pressure. Therefore, the bonding strength between the first conductive layer CDL1 and the connection line CL in contact with the first conductive layer CDL1 may be greatly improved, and the flatness of the first conductive layer CDL1 may be improved.

[0116] In an exemplary embodiment of the inventive concept, the bonding device 700 may further include a bonding sheet BS for improving the flatness of the first conductive layer CDL1. The bonding sheet BS may include a material having elasticity and heat resistance. For example, the bonding sheet BS may include silicon, polytetrafluoroethylene (PTFE), etc.

[0117] The bonding sheet BS may be completely adhered to the first conductive layer CDL1, and the pressure applied to the first conductive layer CDL1 may be evenly dispersed. Therefore, the flatness of the first conductive layer CDL1 may be improved, and the thickness of the first conductive layer CDL1 may be made uniform. In addition, the contact between the bonding sheet BS and the pressing unit PP may prevent at least a part of the first conductive layer CDL1 from being separated from the display panel 100.

[0118] AlthoughFigure 10A and 10B FIG. 10B shows the bonding tab BS surrounding the pressing unit PP of the bonding device 700, but the bonding tab BS may be separately provided from the pressing unit PP. In this case, only when the pressing unit PP presses the first conductive layer CDL1, one surface of the bonding tab BS may contact the first conductive layer CDL1, and the other surface of the bonding tab BS may contact the pressing unit PP.

[0119] The second conductive layer CDL2 of the second conductive film CDF2 may be formed in substantially the same manner as the first conductive layer CDL1. Thus, repeated descriptions will be omitted.

[0120] In an exemplary embodiment of the inventive concept, in the operation of attaching the conductive film CDF to the side surface of the display panel 100, the operation of Figures 7 to 9 may be omitted. For example, the conductive layer CDL may be bonded to the side surface of the display panel 100 only at a second temperature and a second pressure. Thus, the manufacturing process may be simplified.

[0121] As described above, in the method of manufacturing a display device according to an exemplary embodiment of the inventive concept, a conductive film CDF (e.g., the conductive layer CDL) having a uniform thickness may be bonded to the side surface of the display panel 100 at a high temperature and a high pressure. The bonding strength and adhesion between the conductive layer CDL and the connection line CL of the display panel 100 may be increased, and the flatness of the conductive layer CDL may be increased. Thus, in the display device 1000 to which the side bonding method is applied, the electrical connection between the display panel 100 and the driving circuit 200 may be improved, and the process reliability may be improved.

[0122] In addition, in the method of manufacturing a display device according to an exemplary embodiment of the inventive concept, a conductive film CDF having a uniform thickness and area may be formed on the side surface of the display panel 100 by pressing, thereby increasing the processing speed and productivity.

[0123] As Figure 11 and Figure 12 shown in Figure 12 in detail in the region A of Figure 11 FIG. Figure 12 , the conductive film CDF (hereinafter referred to as the conductive layer CDL) may be patterned by a patterned laser beam (or a second laser beam) (S400). In an exemplary embodiment of the inventive concept, the patterned laser beam may have a wavelength in the infrared region to etch the conductive layer CDL. The conductive layer CDL may be patterned using the patterned laser beam such that the distance between the side conductive patterns CP is about 20 μm or less.

[0124] The side conductive pattern CP can be formed by laser patterning. Each of the side conductive patterns CP can be electrically connected to one of the connection lines CL. As Figure 12 shown, one side of each of the connection lines CL is connected to one side of one of the side conductive patterns CP, such that the connection lines CL and the side conductive patterns CP can be electrically coupled to each other.

[0125] In an exemplary embodiment of the inventive concept, the connection lines CL and the side conductive patterns CP may include different conductive materials. For example, the connection lines CL may include copper or aluminum alloy, and the side conductive patterns CP may include silver.

[0126] In an exemplary embodiment of the inventive concept, the distance D1 between the side conductive patterns CP may be set to about 30 μm or less. For example, in the laser patterning process, the distance D1 between the side conductive patterns CP may be patterned to about 150 μm corresponding to full HD resolution, and the distance D1 between the side conductive patterns CP may be patterned to about 50 μm corresponding to UHD and 4K UHD resolutions. In addition, in the laser patterning process, the distance D1 between the side conductive patterns CP may be patterned to about 25 μm corresponding to 8K UHD or higher resolution. In other words, the distance D1 between the side conductive patterns CP can be relatively easily controlled corresponding to the interval between the pixels PX (or the connection lines CL) formed in the display panel 100, the number of pixels PX, etc.

[0127] In an exemplary embodiment of the inventive concept, the width D2 of each of the side conductive patterns CP may be in the range of about 2 μm to about 4 μm. In an exemplary embodiment of the inventive concept, the length L1 (in the longitudinal direction) of each of the side conductive patterns CP may be in the range of about 500 μm to about 900 μm. This is merely an example, and the length L1 of each of the side conductive patterns CP may be any length smaller than the length of the display panel 100.

[0128] Through laser patterning, the portion of the conductive film CDF in the region where the conductive film CDF other than the side conductive pattern CP is attached can be removed, and the boundaries of the side conductive patterns CP close to each other can be clearly distinguished. According to the above laser patterning for forming the side conductive pattern CP, fixture costs can be eliminated, the side conductive pattern can be precisely processed, and production costs can be greatly reduced. In addition, the inventive concept can be effectively used for manufacturing various high-resolution display devices, such as FHD, UHD, 4K UHD, 8K UHD, etc.

[0129] On the other hand, color differences that may exist between the portion where the conductive film CDF is removed by laser patterning and the portion where the conductive film CDF is not attached can be eliminated. In addition, the portion where the conductive film CDF is removed can be insulated from the portion where the conductive film CDF is not removed.

[0130] As Figure 13 shown, the anisotropic conductive film ACF can be attached to the side conductive pattern CP, and the driving circuit 200 and the printed circuit board (PCB) can be electrically connected to the side conductive pattern CP (e.g., via an outer lead bonding (OLB) process) (S500).

[0131] In an exemplary embodiment of the inventive concept, a plurality of anisotropic conductive films ACF can be attached to one side surface of the display panel 100 at a predetermined interval. The display panel 100 can be electrically connected to the driving circuit 200 by a side bonding method. In other words, the anisotropic conductive film ACF, the printed circuit board, etc. are not disposed (or bonded) on the upper surface of the display panel 100.

[0132] The side conductive pattern CP can be attached to a first portion of each anisotropic conductive film ACF. The driving circuit 200 and the conductive film CDF including wires can be attached to a second portion of each anisotropic conductive film ACF. The driving circuit 200 can include at least one of a timing controller 220, a gate driver 240, and a data driver 260. The timing controller 220, the gate driver 240, and the data driver 260 can be implemented as a driving IC (integrated circuit) chip, an integrated circuit, etc.

[0133] However, this is merely an example, and the form and configuration of the driving circuit 200 are not limited thereto. For example, at least one of the timing controller 220, the gate driver 240, and the data driver 260 can be integrated in the display panel 100.

[0134] The driving circuit 200 can be electrically connected to an external control device, a processor, etc. through a PCB or the like.

[0135] As described above, the display device 1000 and the method of manufacturing the display device 1000 according to the exemplary embodiment of the inventive concept can significantly reduce the width of the border for the OLB process by eliminating the step between the display panel 100 and the polarizing layer (e.g., the first polarizing layer 80) through a laser cutting and polishing process. In addition, since the side conductive pattern CP is precisely formed by ultra-fine laser patterning, a UHD or higher ultra-high resolution large display can be achieved.

[0136] A conductive film CDF (e.g., a conductive layer CDL) having a uniform thickness and area is bonded to a side surface of a display panel 100 at high temperature and high pressure, thereby improving the adhesion strength and adhesiveness between the conductive layer CDL and a connection line CL of the display panel 100 and improving the flatness of the conductive layer CDL. Accordingly, in a display device 1000 to which a side bonding method is applied, the electrical connection between the display panel 100 and the driving circuit 200 can be improved, and process reliability can be improved.

[0137] In addition, due to the method of manufacturing a display device in which a conductive film CDF (e.g., a conductive layer CDL) having a uniform thickness and area is bonded to a side surface of a display panel 100 at high temperature and high pressure, the processing speed and productivity can be increased.

[0138] Figure 14 is a flowchart showing a method of manufacturing a display device according to an exemplary embodiment of the inventive concept. Figure 15 is a block diagram showing a display device according to an exemplary embodiment of the inventive concept.

[0139] In the description of Figure 14 and Figure 15 the same reference numerals denote the same elements as those described with reference to Figure 1 and Figure 2 and repeated description of the same elements will be omitted. In addition, except that the display device 1001 of Figure 15 is not a liquid crystal display device, the display device 1001 may have substantially the same or similar configuration as the display device 1000 of Figure 2 .

[0140] Referring to Figure 14 and 15 , the display device 1001 may include a display panel 100 and a driving circuit 201.

[0141] As Figure 15 shown, the display device 1001 may include a plurality of gate lines GL and a plurality of emission control lines EL extending in a first direction. A plurality of data lines DL extending in a second direction intersecting the first direction may be disposed on the display panel 100.

[0142] Each pixel PX of the display panel 100 may include at least one thin film transistor, a storage capacitor, and a self-luminous element. In an exemplary embodiment of the inventive concept, the self-luminous element may be an organic light emitting diode or an inorganic light emitting device.

[0143] The driving circuit 201 may include a timing controller 220, a gate driver 240, a data driver 260, and an emission driver 280.

[0144] The timing controller 220 may generate an emission driving control signal ECS for controlling the emission driver 280 in response to a control signal.

[0145] The emission driver 280 may sequentially select emission control lines EL in response to the emission driving control signal ECS provided from the timing controller 220, and may output a turn-on voltage to the selected emission control line EL.

[0146] The pixel PX connected to the selected emission control line EL may emit light in response to the turn-on voltage.

[0147] In an exemplary embodiment of the inventive concept, the display device 1001 may not include a polarization layer, a backlight, etc.

[0148] As Figure 14 shown, a method of manufacturing a display device may include: operations (S320, S340, and S360) of attaching a conductive film to at least one side surface of a display panel, where pixels PX including thin film transistors and self-emitting elements are disposed on the display panel; an operation (S400) of patterning the conductive film using a laser beam to form a plurality of side conductive patterns electrically connected to the pixels PX; and an operation (S500) of attaching an anisotropic conductive film to the side conductive patterns to electrically connect a driving circuit to the side conductive patterns.

[0149] In an exemplary embodiment of the inventive concept, the operation of attaching the conductive film to the side surface of the display panel may include: an operation (S320) of pressing the conductive film having a conductive layer and a base layer on the conductive layer at a first temperature and a first pressure such that the conductive film contacts the side surface of the display panel; an operation (S340) of removing the base layer from the conductive layer; and an operation (S360) of pressing the conductive layer at a second temperature and a second pressure to bond the conductive layer to the side surface of the display panel. Since operations S320 to S360 have been described with reference to Figures 7 to 10B description, a repeated description will be omitted.

[0150] As described above with reference to Figures 11 to 13 description, operations of forming the side conductive patterns (S400) and electrically connecting the driving circuit to the side conductive patterns (S500) have been described, and thus a repeated description will be omitted.

[0151] As described above, the method of manufacturing a display device according to an exemplary embodiment of the inventive concept may be applied to various display devices, such as an organic light emitting display device and a liquid crystal display device.

[0152] Figure 16 is a schematic diagram of a facility for performing a method of manufacturing a display device according to an exemplary embodiment of the inventive concept Figure 1 of.

[0153] Reference Figures 1 to 2 and Figure 16 , a method of manufacturing a display device can be performed through online processing. In other words, the processes of loading the display panel 100, patterning the side conductive pattern CP, the OLB process, and the unloading process can be automatically and jointly performed.

[0154] In an exemplary embodiment of the inventive concept, a facility for manufacturing the display device 1000 may include a laser cutting unit and a suction unit 300 (e.g., the laser cutting device 300 described above), a plasma cleaning unit 500 (e.g., the plasma cleaning apparatus 500 described above), a first attaching unit 600 (e.g., the pressing unit or pressing device described above), a second attaching unit 700 (e.g., the pressing unit or bonding device 700 described above), and a laser patterning unit 800. The facility may further include an autoclave unit for attaching a polarization layer (e.g., the first polarization layer 80) and the display panel 100.

[0155] The display panel 100 may be transported along a transport line (e.g., a conveyor) in a direction (or moving direction) substantially parallel to the upper surface of the display panel 100. When the display panel 100 is transported, an operation of attaching the polarization layer 80A (S100), an operation of cutting the polarization layer 80A (S200), an operation of cleaning the side surface of the display panel 100, an operation of bonding a conductive film CDF to the side surface of the display panel 100 (S300), and an operation of patterning the conductive film CDF to form the side conductive pattern CP (S400) may be sequentially performed.

[0156] As described above, according to an exemplary embodiment of the inventive concept, a display device and a method of manufacturing the display device can greatly reduce the width of a border for a side OLB process (zero border implementation) by eliminating a step between the display panel and the polarization layer through laser cutting and polishing. In addition, since the side conductive pattern is precisely formed through ultra-fine laser patterning, an ultra-high resolution large display with a UHD resolution or higher can be realized.

[0157] Furthermore, since a conductive film (e.g., a conductive layer) having a uniform thickness and area is bonded to the side surface of the display panel under high temperature and high pressure, the bonding strength and adhesion between the connection lines of the display panel and the side conductive pattern can be improved, and the flatness of the side conductive pattern can be increased. Accordingly, the electrical connection between the display panel of the display device to which the side bonding method is applied and the driving circuit is improved, and the process reliability can be improved.

[0158] In addition, the processing speed and yield can be increased by a method of manufacturing a display device that bonds a conductive film (e.g., a conductive layer) having a uniform thickness and area to a side surface of a display panel under high temperature and high pressure.

[0159] Although the inventive concept has been shown and described with reference to exemplary embodiments thereof, it will be apparent to those of ordinary skill in the art that various changes in form and detail may be made therein without departing from the spirit and scope of the inventive concept as set forth by the appended claims.

Claims

1. A method of manufacturing a display device, the method comprising: Providing a polarization layer on one surface of a display panel including thin film transistors and pixel electrodes; Cutting the polarization layer using a first laser beam such that a step between a side surface of the polarization layer and a side surface of the display panel is less than a predetermined value; Attaching a conductive film to the side surface of the display panel; And Patterning the conductive film using a second laser beam, Wherein attaching the conductive film includes: Pressing a conductive layer and a base layer located on the conductive layer at a first temperature and a first pressure such that the conductive film contacts the side surface of the display panel, wherein the conductive layer and the base layer constitute the conductive film; Removing the base layer from the conductive layer; and Pressing the conductive layer at a second temperature and a second pressure to bond the conductive layer to the side surface of the display panel.

2. The method according to claim 1, wherein The second temperature is higher than the first temperature, Wherein the second pressure is higher than the first pressure, and Wherein the conductive layer includes at least one selected from silver, copper, gold, and aluminum.

3. The method according to claim 1, wherein The conductive layer is bonded to the side surface of the display panel by a bonding device including a heating unit heated to the second temperature and a pressing unit in the form of a rod for pressing the conductive film at the second pressure.

4. The method according to claim 1, wherein A pressing device in the form of a roller or a rod presses the conductive film at the first temperature and the first pressure such that the conductive film contacts the side surface of the display panel.

5. The method according to claim 1, wherein, The display panel further includes: A common electrode provided on the pixel electrode; and A color filter provided on the common electrode, Wherein patterning the conductive film forms a plurality of side conductive patterns electrically connected to at least one of the thin film transistors, the pixel electrodes, the common electrode, and the color filter, and Wherein a distance between the plurality of side conductive patterns is 30 μm or less.

6. The method according to claim 5, further comprising: Attaching an anisotropic conductive film to the plurality of side conductive patterns such that a driving circuit and a printed circuit board are electrically connected to the plurality of side conductive patterns.

7. The method according to claim 1, wherein Cutting the polarization layer includes: Suctioning impurities generated in response to cutting the polarization layer; and Cleaning the side surface of the display panel with atmospheric pressure plasma.

8. The method according to claim 1, further comprising: Conveying the display panel in a direction parallel to the one surface of the display panel along a predetermined conveying line, Wherein when the display panel is conveyed, the polarization layer is provided on the one surface of the display panel, the polarization layer is cut, the conductive film is attached to the side surface of the display panel, and the conductive film is patterned in a successive order.

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