Method of manufacturing a display device
By forming a specific pattern of counter-electrode and light-transmitting portion on the substrate of the display device, the problem of infrared sensor placement in full-screen display is solved, the light transmittance of the sensor area is improved, and the user experience is enhanced.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- SAMSUNG DISPLAY CO LTD
- Filing Date
- 2020-04-08
- Publication Date
- 2026-07-10
AI Technical Summary
As the bezel size of display devices decreases, how can infrared sensors be rearranged in full-screen display technology to avoid users' eyes focusing on the image and to improve the light transmittance of the sensor area?
A counter electrode with a specific pattern is formed on the substrate of the display device, and the counter electrode is deposited in the sensor area through a mask to form a light-transmitting part, ensuring that the light transmittance of the sensor area reaches 15% or higher.
While achieving full-screen display, it also improved the light transmittance of the sensor area, ensuring that the function of the sensor area was not affected and enhancing the user experience.
Smart Images

Figure CN111834405B_ABST
Abstract
Description
[0001] Cross-references to related applications
[0002] This application claims priority and benefit to Korean Patent Application No. 10-2019-0044477, filed on April 16, 2019, with the Korean Intellectual Property Office, the disclosure of which is incorporated herein by reference in its entirety. Technical Field
[0003] One or more embodiments relate to a method, and more specifically, to a method of manufacturing a display device. Background Technology
[0004] Display devices can display images using pixels. A display device may include an infrared sensor located on the bezel (or edge portion) of the front surface of the display device (e.g., the surface on which an image is displayed), and objects can be identified by using the infrared sensor.
[0005] As the bezel size of display devices decreases, the user's eye can be pinned or focused on the image (or the display device's screen). Recently, full-screen display technology has been researched, which involves removing the bezel from the front surface of the display device, rearranging the infrared sensors arranged on the front surface (or bezel) of the display device, and displaying the image on the entire front surface of the display device. Summary of the Invention
[0006] One or more embodiments of this disclosure relate to a method of manufacturing a display device including a light-transmitting portion located within a display area. However, the foregoing aspects are exemplary and do not limit the scope of this disclosure, and other aspects not mentioned will be readily apparent to those skilled in the art from the description of this disclosure.
[0007] Additional aspects will be set forth in part in the following description and will be apparent in part from the description or may be learned by practice of the presented embodiments.
[0008] According to one or more embodiments, a method of manufacturing a display device includes: preparing a substrate including a display area and a sensor area disposed in the display area; forming a first counter electrode having a first pattern on the substrate, wherein the first counter electrodes are spaced apart from each other in the sensor area; depositing a second counter electrode in the sensor area spaced apart from each other, the second counter electrode having a second pattern different from the first pattern; and arranging components to correspond to the sensor area.
[0009] Each of the first and second counter electrodes can have a quadrilateral shape in the planar diagram.
[0010] The corner portions of the first and second counter electrodes can overlap each other.
[0011] The display area may surround at least a portion of the sensor area.
[0012] The method may further include forming a plurality of third counter electrodes spaced apart from each other in the display area while forming a first counter electrode on the substrate.
[0013] The method may further include forming a plurality of fourth counter electrodes spaced apart from each other in the display area while forming the second counter electrode on the substrate.
[0014] The method may further include: when forming a first counter electrode on a substrate, forming a plurality of third counter electrodes spaced apart from each other in a display area; and when forming a second counter electrode on a substrate, forming a plurality of fourth counter electrodes spaced apart from each other on the substrate in a display area, wherein each of the plurality of fourth counter electrodes is arranged between adjacent third counter electrodes among the plurality of third counter electrodes.
[0015] In the planar diagram, the third and fourth counter electrodes may at least partially overlap each other.
[0016] Multiple third counter electrodes can be formed in the adjacent sensor area.
[0017] Some of the multiple third counter electrodes may have a striped shape.
[0018] The method may further include: when forming a first counter electrode on a substrate, forming a plurality of third counter electrodes spaced apart from each other in a display area, wherein some of the plurality of third counter electrodes have a stripe shape; and when forming a second counter electrode on a substrate, forming a plurality of fourth counter electrodes spaced apart from each other on the substrate in a portion of the display area, wherein each of the plurality of fourth counter electrodes is arranged between adjacent third counter electrodes among the plurality of third counter electrodes.
[0019] One of the third counter electrodes and the corresponding one of the fourth counter electrodes can at least partially overlap each other in the planar diagram.
[0020] Multiple third counter electrodes may be formed adjacent to the sensor region, wherein the planar area of one side portion of one of the fourth counter electrodes in the display region and the planar area of the other side portion of said fourth counter electrode are different from each other.
[0021] According to one or more embodiments, a method of manufacturing a display device includes: forming a counter electrode on a substrate including a display area and a sensor area; forming an encapsulation portion on the counter electrode; and arranging components for applying a signal through a transmissive portion included in the sensor area, wherein forming the counter electrode on the substrate including the display area and the sensor area includes: forming a first counter electrode in the sensor area using a first mask having a plurality of first opening portions in a first shielding portion corresponding to the sensor area, the plurality of first opening portions being arranged in a first pattern; and forming a second counter electrode using a second mask having a plurality of second opening portions in a second shielding portion corresponding to the sensor area, the plurality of second opening portions being arranged in a second pattern different from the first pattern.
[0022] Each of the plurality of first opening portions and the plurality of second opening portions may have a quadrilateral shape in the plan view.
[0023] The first and second counter electrodes can be adjacent to each other and can at least partially overlap each other.
[0024] The first mask may include a plurality of third opening portions arranged to be spaced apart from each other in a third pattern to form a third counter electrode in the display area, wherein at least one of the plurality of third opening portions is divided into two parts by a first shielding portion.
[0025] The first mask may have a long side and a short side, wherein a plurality of third opening portions are formed parallel to the long side or the short side of the first mask.
[0026] The first mask may have a plurality of third opening portions arranged to be spaced apart from each other in a third pattern to form a third counter electrode in the display area, and the second mask may have a plurality of fourth opening portions arranged to be spaced apart from each other in a fourth pattern to form a fourth counter electrode in the display area, wherein the fourth counter electrode is arranged between adjacent third counter electrodes.
[0027] Each of the multiple third opening portions can be divided into two parts by the first shielding portion.
[0028] The second mask may have a plurality of fourth opening portions arranged to be spaced apart from each other to form a fourth counter electrode in the display area, wherein the area of one of the plurality of fourth opening portions is different from the area of another of the plurality of fourth opening portions, wherein the second mask includes a long side and a short side, wherein an adjacent opening portion for forming a fifth counter electrode is also provided in the portion adjacent to the long side or the short side of the second mask.
[0029] According to one or more embodiments, a method of manufacturing a display device includes: forming a first counter electrode in the display region on a substrate including an opening region and a display region surrounding the opening region using a first mask; and forming a second counter electrode in the display region using a second mask, wherein each of the first mask and the second mask includes: a mask body portion having an opening portion corresponding to the display region; a shielding portion arranged within the opening portion having a shape corresponding to the opening region and configured to shield a deposited material; a first rib connected to the shielding portion and connected to the mask body portion respectively to cross the opening portion in a first direction; and a second rib spaced apart from the first rib, connected to the shielding portion and connected to the mask body portion to cross the opening portion in a first direction.
[0030] The shielding portion of the first mask may further include: a third rib connected to the mask body portion to span the opening portion in a first direction; and a fourth rib spaced apart from the third rib, connected to the shielding portion and connected to the mask body portion to span the opening portion in a first direction.
[0031] The shielding portion of the first mask can be adjacent to the main body of the mask.
[0032] The opening portion of the first mask may have multiple openings, wherein the area of one of the multiple openings is different from the area of another of the multiple openings.
[0033] The opening portion of the second mask is adjacent to the main body of the mask, the first rib, and the second rib. Attached Figure Description
[0034] These and / or other aspects will become apparent and more readily understood from the following description of embodiments taken in conjunction with the accompanying drawings, in which:
[0035] Figure 1 This is a perspective view of a display device manufactured using a manufacturing method according to an embodiment of the present disclosure;
[0036] Figure 2 This is a cross-sectional view of a display device manufactured using a manufacturing method according to an embodiment of the present disclosure;
[0037] Figure 3 This is a plan view of a display device manufactured using a manufacturing method according to an embodiment of the present disclosure;
[0038] Figure 4 It is shown Figure 3 A plan view of a portion of the sensor area;
[0039] Figure 5 It is along Figure 3 The line I-I' and Figure 4A sectional view taken from line II-II';
[0040] Figure 6 This is a cross-sectional view of an apparatus for manufacturing a display device according to an embodiment of the present disclosure;
[0041] Figure 7A This is a plan view showing a first mask for manufacturing a display device according to an embodiment of the present disclosure;
[0042] Figure 7B This is a plan view showing a portion of a counter electrode formed on a substrate by placing a first mask on a second support portion and then depositing a deposition material in a manufacturing method according to an embodiment of the present disclosure.
[0043] Figure 7C This is a cross-sectional view showing a portion of a counter electrode formed on a substrate by placing a first mask on a second support portion and then depositing a deposition material in a manufacturing method according to an embodiment of the present disclosure.
[0044] Figure 8A This is a plan view showing a second mask for manufacturing a display device according to an embodiment of the present disclosure;
[0045] Figure 8B This is a plan view showing a counter electrode formed on a substrate by placing a second mask on a second support portion and then depositing a deposition material in a manufacturing method according to an embodiment of the present disclosure.
[0046] Figure 8C This is a cross-sectional view showing a counter electrode formed on a substrate by placing a second mask on a second support portion and then depositing a deposition material in a manufacturing method according to an embodiment of the present disclosure;
[0047] Figure 9A This is a plan view showing a first mask of an apparatus for manufacturing a display device according to another embodiment of the present disclosure;
[0048] Figure 9B This is a plan view showing a portion of a counter electrode formed on a substrate by placing a first mask on a second support portion and then depositing a deposition material in a manufacturing method according to another embodiment of the present disclosure;
[0049] Figure 10A This is a plan view showing a second mask for manufacturing a display device according to another embodiment of the present disclosure;
[0050] Figure 10BThis is a plan view showing a counter electrode formed on a substrate by placing a second mask on a second support portion and then depositing a deposition material in a manufacturing method according to another embodiment of the present disclosure;
[0051] Figure 11A This is a plan view showing a first mask of an apparatus for manufacturing a display device according to another embodiment of the present disclosure;
[0052] Figure 11B This is a plan view showing a portion of a counter electrode formed on a substrate by placing a first mask on a second support portion and then depositing a deposition material in a manufacturing method according to another embodiment of the present disclosure;
[0053] Figure 12A This is a plan view showing a second mask for manufacturing a display device according to another embodiment of the present disclosure;
[0054] Figure 12B This is a plan view showing a counter electrode formed on a substrate by placing a second mask on a second support portion and then depositing a deposition material in a manufacturing method according to another embodiment of the present disclosure;
[0055] Figure 13A This is a plan view showing a first mask of an apparatus for manufacturing a display device according to another embodiment of the present disclosure;
[0056] Figure 13B This is a plan view showing a portion of a counter electrode formed on a substrate by placing a first mask on a second support portion and then depositing a deposition material in a manufacturing method according to another embodiment of the present disclosure;
[0057] Figure 14A This is a plan view showing a second mask for manufacturing a display device according to another embodiment of the present disclosure;
[0058] Figure 14B This is a plan view showing a counter electrode formed on a substrate by placing a second mask on a second support portion and then depositing a deposition material in a manufacturing method according to another embodiment of the present disclosure;
[0059] Figure 15 This is a perspective view of a display device manufactured using a manufacturing method according to another embodiment of the present disclosure;
[0060] Figure 16 It is along Figure 15 A sectional view taken from lines B-B' and C-C';
[0061] Figure 17AThis is a plan view showing a first mask of an apparatus for manufacturing a display device according to another embodiment of the present disclosure;
[0062] Figure 17B This is a plan view showing a portion of a counter electrode formed on a substrate by placing a first mask on a second support portion and then depositing a deposition material in a manufacturing method according to another embodiment of the present disclosure;
[0063] Figure 18A This is a plan view showing a second mask for manufacturing a display device according to another embodiment of the present disclosure;
[0064] Figure 18B This is a plan view showing a counter electrode formed on a substrate by placing a second mask on a second support portion and then depositing a deposition material in a manufacturing method according to another embodiment of the present disclosure;
[0065] Figure 19A This is a plan view showing a first mask of an apparatus for manufacturing a display device according to another embodiment of the present disclosure;
[0066] Figure 19B This is a plan view showing a portion of a counter electrode formed on a substrate by placing a first mask on a second support portion and then depositing a deposition material in a manufacturing method according to another embodiment of the present disclosure;
[0067] Figure 20A This is a plan view showing a second mask for manufacturing a display device according to another embodiment of the present disclosure;
[0068] Figure 20B This is a plan view showing a counter electrode formed on a substrate by placing a second mask on a second support portion and then depositing a deposition material in a manufacturing method according to another embodiment of the present disclosure;
[0069] Figure 21A This is a plan view showing a first mask of an apparatus for manufacturing a display device according to another embodiment of the present disclosure;
[0070] Figure 21B This is a plan view showing a portion of a counter electrode formed on a substrate by placing a first mask on a second support portion and then depositing a deposition material in a manufacturing method according to another embodiment of the present disclosure;
[0071] Figure 22A This is a plan view showing a second mask for manufacturing a display device according to another embodiment of the present disclosure;
[0072] Figure 22BThis is a plan view showing a counter electrode formed on a substrate by placing a second mask on a second support portion and then depositing a deposition material in a manufacturing method according to another embodiment of the present disclosure;
[0073] Figure 23A This is a plan view showing a first mask of an apparatus for manufacturing a display device according to another embodiment of the present disclosure;
[0074] Figure 23B This is a plan view showing a portion of a counter electrode formed on a substrate by placing a first mask on a second support portion and then depositing a deposition material in a manufacturing method according to another embodiment of the present disclosure;
[0075] Figure 24A This is a plan view showing a second mask for manufacturing a display device according to another embodiment of the present disclosure; and
[0076] Figure 24B This is a plan view illustrating a counter electrode formed on a substrate by placing a second mask on a second support portion and then depositing a deposition material in a manufacturing method according to another embodiment of the present disclosure. Detailed Implementation
[0077] Reference will now be made in detail to the embodiments, examples of which are shown in the accompanying drawings, wherein the same reference numerals always denote the same elements. In this respect, the embodiments may take different forms and should not be construed as limited to the description set forth herein. Therefore, the embodiments are described below only with reference to the accompanying drawings to explain various aspects of this specification. As used herein, the term “and / or” includes any and all combinations of one or more of the associated listed items. When a statement such as “at least one of…” follows a list of elements, it modifies the entire list of elements, not any individual element in the list.
[0078] It should be understood that although the terms “first,” “second,” etc., may be used in this document to describe various elements, these elements should not be limited by these terms, and these terms are only used to distinguish one element from another.
[0079] As used in this article, the singular forms “a,” “one,” and “the” are intended to include the plural forms as well, unless the context clearly indicates otherwise.
[0080] It will be further understood that, as used herein, the terms “comprising” and / or “including” specify the presence of the stated feature or component, but do not exclude the presence or addition of one or more other features or components.
[0081] It should be understood that when a layer, region, or element is referred to as being “formed on” another layer, region, or element, it may be formed directly on the other layer, region, or element, or it may be formed indirectly on the other layer, region, or element by having an intermediate layer, region, or element between them.
[0082] For ease of explanation, the dimensions of the components may be exaggerated. In other words, this disclosure is not limited thereto because the dimensions and thicknesses of the components in the accompanying drawings are arbitrarily shown for ease of explanation.
[0083] In the following implementation, the x-axis, y-axis, and z-axis are not limited to the three axes of a Cartesian coordinate system and can be interpreted in a broader sense. For example, the x-axis, y-axis, and z-axis can be perpendicular to each other, or they can represent different directions that are not perpendicular to each other.
[0084] When a particular implementation can be carried out differently, the specific process sequence may differ from the described sequence. For example, two consecutively described processes may be performed substantially simultaneously, or in the reverse order of their description.
[0085] It should be understood that when a layer, region, or element is referred to as a "connection," the layer, region, or element can be directly connected or indirectly connected by intervening layers, regions, or elements. For example, when a layer, region, or element is electrically connected, the layer, region, or element can be directly electrically connected or indirectly electrically connected by intervening layers, regions, or elements.
[0086] When describing embodiments of the inventive concept, the word "may" means "one or more embodiments of the inventive concept".
[0087] As used in this article, the terms “use,” “using,” and “used” can be considered synonymous with the terms “utilize,” “utilizing,” and “utilized,” respectively.
[0088] Figure 1 This is a perspective view of a display device 1 manufactured using a manufacturing method according to an embodiment of the present disclosure.
[0089] Reference Figure 1 The display device 1 includes a display area DA that forms an image and a non-display area NDA that does not form an image. The display device 1 can provide a main image by using light emitted by a plurality of main pixels Pm arranged in the display area DA.
[0090] Display device 1 includes a sensor area SA. See the following reference... Figure 2As described, the sensor region SA can be a region under which components, such as sensors using infrared radiation, visible light, and / or sound, are arranged. The sensor region SA may include a transmission portion TA through which light and / or sound propagating from the component to the outside or from the outside to the component can be transmitted. In embodiments of this disclosure, when infrared radiation is transmitted through the sensor region SA, the infrared transmittance of the sensor region SA can be equal to or greater than about 15%, and more preferably, equal to or greater than 20%, equal to or greater than 25%, equal to or greater than 85%, or equal to or greater than 90%.
[0091] In the display device 1 manufactured using the manufacturing method of this embodiment, a plurality of auxiliary pixels Pa can be arranged in a sensor region SA, and a set image or a predetermined image can be provided by using light emitted by the plurality of auxiliary pixels Pa. The resolution of the image provided by the sensor region SA as an auxiliary image can be lower than the resolution of the image provided by the display region DA. That is, the sensor region SA may include a transmissive portion TA through which light and / or sound can be transmitted, and therefore, the number of auxiliary pixels Pa that can be arranged per unit area can be less than the number of main pixels Pm arranged per unit area in the display region DA.
[0092] The sensor region SA may be at least partially surrounded by the display region DA (i.e., the display region DA at least partially surrounds the sensor region SA), and the display device 1 manufactured using the manufacturing method according to the embodiment is shown. Figure 1 In the image, the sensor area SA is completely surrounded by the display area DA (i.e., the display area DA completely surrounds the sensor area SA).
[0093] Although the organic light-emitting display device is described as a display device 1 manufactured using the manufacturing method according to embodiments of the present disclosure, the display device 1 manufactured using the manufacturing method of the present disclosure is not limited thereto. In another embodiment, the display device 1 may be any of a variety of suitable display devices, such as an inorganic light-emitting display device or a quantum dot light-emitting display device.
[0094] Although the sensor area SA is arranged in Figure 1 The display area DA has a quadrilateral shape on one side (top or upper right side), but this disclosure is not limited thereto. The display area DA can be arranged to surround (i.e., enclose) at least a portion of the sensor area SA. The shape of the display area DA can be circular, elliptical, or polygonal, such as triangular or pentagonal, and the position and number of sensor areas SA can be modified in various suitable ways.
[0095] Figure 2 It is along Figure 1The cross-sectional view of the display device 1 manufactured using the manufacturing method according to this embodiment is taken by line A-A'.
[0096] Reference Figure 2 The display device 1 may include a display panel 10, which includes display elements and a component 20 corresponding to the sensor area SA.
[0097] The display panel 10 may include a substrate 100, a display element layer 200 disposed on the substrate 100, and a thin-film encapsulation layer 300, the thin-film encapsulation layer 300 being a sealing member for sealing the display element layer 200. Furthermore, the display panel 10 may also include a lower protective film 175 disposed below the substrate 100.
[0098] Substrate 100 may include glass and / or polymer resin. When substrate 100 includes polymer resin, substrate 100 may be flexible, rollable, and / or bendable. Substrate 100 may have a multilayer structure, including a layer containing polymer resin and an inorganic layer.
[0099] The display element layer 200 may include: a circuit layer including a thin film transistor (TFT) TFT and an auxiliary TFT TFT', an organic light-emitting diode (OLED) as a display element, and an insulating layer IL or IL' between the circuit layer and the OLED.
[0100] Furthermore, a transmissive portion TA, where no auxiliary TFTs TFT' and display elements are arranged, can be disposed in the sensor region SA. The transmissive portion TA can be the area through which light or signals emitted from component 20 or light and / or signals incident on component 20 are transmitted.
[0101] Component 20 may be arranged in sensor region SA. Component 20 may include electronic components that use light and / or sound. Non-limiting examples of component 20 may include sensors such as infrared sensors for receiving and using light, sensors for outputting and detecting light and / or sound to measure distance and / or identify fingerprints, a small lamp for outputting light, and a speaker for outputting sound. When component 20 is an electronic component that uses light, component 20 may use light of various wavelength bands, such as visible light, infrared light, and / or ultraviolet light. Multiple components 20 may be arranged in sensor region SA. For example, a light emitting device and a light receiving device may be arranged as components 20 in one sensor region SA. Alternatively, a light transmitting portion and a light receiving portion may be arranged in one component 20.
[0102] The lower electrode layer BSM can be arranged in the sensor region SA to correspond to the auxiliary pixel Pa. That is, the lower electrode layer BSM can be arranged below the auxiliary TFT ' to correspond to the auxiliary TFT '. In other words, the lower electrode layer BSM can prevent or protect the auxiliary pixel Pa, including the auxiliary TFT ', from external light. For example, the lower electrode layer BSM can prevent or protect light emitted from component 20 from reaching the auxiliary pixel Pa. A constant voltage or signal can be applied to the lower electrode layer BSM to prevent or protect the pixel circuit from damage by electrostatic discharge.
[0103] The thin-film encapsulation layer 300 may include at least one inorganic encapsulation layer and at least one organic encapsulation layer. In this respect, Figure 2 A first inorganic encapsulation layer 310 and a second inorganic encapsulation layer 330 are shown, along with an organic encapsulation layer 320 between the first inorganic encapsulation layer 310 and the second inorganic encapsulation layer 330.
[0104] The organic encapsulation layer 320 may include polymer-based materials. For example, the organic encapsulation layer 320 may include polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polycarbonate (PC), polyimide (PI), polyethylene sulfonate, polyoxymethylene, polyarylate, hexamethyldisiloxane (HMDSO), or acrylic resin (e.g., polymethyl methacrylate (PMMA) or polyacrylic acid), or combinations thereof.
[0105] Each of the first inorganic encapsulation layer 310 and the second inorganic encapsulation layer 330 may include at least one inorganic insulating material selected from alumina, titanium oxide, tantalum oxide, hafnium oxide, zinc oxide, silicon oxide, silicon nitride, and silicon oxynitride. The second inorganic encapsulation layer 330 may cover the organic encapsulation layer 320 and may include silicon oxide, silicon nitride, and / or silicon oxynitride. The second inorganic encapsulation layer 330 may be deposited to contact the first inorganic encapsulation layer 310 on an edge portion of the display device 1, thereby preventing or protecting the organic encapsulation layer 320 from being exposed to the outside of the display device 1.
[0106] The lower protective film 175 can be attached to the bottom of the substrate 100 and can support and protect the substrate 100. The lower protective film 175 may have an opening 175OP corresponding to the sensor region SA. Because the lower protective film 175 has an opening 175OP, the light transmittance of the sensor region SA can be improved. The lower protective film 175 may include PET or PI.
[0107] When the substrate 100 includes glass, the lower protective film 175 can be omitted.
[0108] The area of the sensor region SA can be larger than the area of the portion where the component 20 is arranged (i.e., where it is housed). Therefore, the area of the opening 175OP of the lower protective film 175 can be different from the area of the sensor region SA. For example, the area of the opening 175OP can be smaller than the area of the sensor region SA.
[0109] In one embodiment, elements such as input sensing elements for sensing touch input, anti-reflective elements such as polarizers and delayers, and / or color filters and black matrices, as well as transparent windows, may also be arranged on the display panel 10.
[0110] Although a thin-film encapsulation layer 300 is used as a sealing member for sealing the display element layer 200 in this embodiment, the present disclosure is not limited thereto. For example, a sealing substrate that is adhered to the substrate 100 by using a sealant or glass frit can be used as a member for sealing the display element layer 200.
[0111] Figure 3 This is a plan view of a display device 1 manufactured using a manufacturing method according to an embodiment of the present disclosure.
[0112] Reference Figure 3 The display panel 10 is arranged in the display area DA and includes a plurality of main pixels Pm. Each of the main pixels Pm may include a display element such as an OLED. Each main pixel Pm may emit, for example, red, green, blue, or white light through the OLED. The term "main pixel Pm" as used herein may refer to a pixel that emits any one of red, green, blue, and white light. The display area DA may be defined by a reference... Figure 2 The described encapsulation component covers and can be protected from external air, moisture, etc.
[0113] A sensor region SA can be arranged within a display region DA, and multiple auxiliary pixels Pa can be arranged within the sensor region SA. Each of the auxiliary pixels Pa can include a display element such as an OLED. Each auxiliary pixel Pa can emit, for example, red, green, blue, or white light through the OLED. The term "auxiliary pixel Pa" as used herein can refer to a pixel that emits any one of red, green, blue, and white light. Transmissive portions TA can be provided in the sensor region SA, arranged between the auxiliary pixels Pa.
[0114] In some implementations, a main pixel Pm and an auxiliary pixel Pa may include the same pixel circuitry. However, this disclosure is not limited thereto. The pixel circuitry included in the main pixel Pm may differ from the pixel circuitry included in the auxiliary pixel Pa.
[0115] The sensor region SA may include a transmissive portion TA, and the resolution of the sensor region SA may be less than the resolution of the display region DA. For example, the resolution of the sensor region SA may be approximately half the resolution of the display region DA. In some embodiments, the resolution of the display region DA may be equal to or greater than 400 ppi, and the resolution of the sensor region SA may be approximately 200 ppi.
[0116] Each of the main pixel Pm and the auxiliary pixel Pa can be electrically connected to a peripheral area arranged in the non-display area NDA. A first scan drive circuit 110, a second scan drive circuit 120, a terminal 140, a data drive circuit 150, a first power supply wiring 160, and a second power supply wiring 170 can be arranged in the non-display area NDA.
[0117] The first scan driving circuit 110 can apply a scan signal to each of the main pixel Pm and the auxiliary pixel Pa via the scan line SL. The first scan driving circuit 110 can also apply an emission control signal to each pixel via the emission control line EL. The second scan driving circuit 120 can be arranged parallel to the first scan driving circuit 110, with a display area DA between them. Some of the main pixels Pm and auxiliary pixels Pa arranged in the display area DA can be electrically connected to the first scan driving circuit 110, while the rest can be connected to the second scan driving circuit 120. In another embodiment, the second scan driving circuit 120 can be omitted.
[0118] Terminal 140 may be disposed on one side of substrate 100. Terminal 140 may be exposed without being covered by an insulating layer and may be electrically connected to a printed circuit board (PCB).
[0119] The PCB-P terminal of the printed circuit board (PCB) can be electrically connected to the terminal 140 of the display panel 10. The PCB applies signals and / or power from the controller to the display panel 10. Control signals generated by the controller can be transmitted through the PCB to the first scan drive circuit 110 and the second scan drive circuit 120. The controller can apply a first power supply voltage to the first power supply wiring 160 and the second power supply wiring 170 through the first connection wiring 161 and the second connection wiring 171, respectively. The first power supply voltage can be applied to each of the main pixel Pm and the auxiliary pixel Pa through the drive voltage line PL connected to the first power supply wiring 160, and the second power supply voltage can be applied to the anti-electrode of each of the main pixel Pm and the auxiliary pixel Pa connected to the second power supply wiring 170.
[0120] The data driving circuit 150 is electrically connected to the data line DL. The data signal from the data driving circuit 150 can be applied to each of the main pixel Pm and the auxiliary pixel Pa via the connection wiring 151 connected to terminal 140 and the data line DL connected to the connection wiring 151. Although in Figure 3 In this embodiment, the data driving circuit 150 is disposed on a printed circuit board (PCB), but in another embodiment, the data driving circuit 150 may be disposed on the substrate 100. For example, the data driving circuit 150 may be disposed between the terminal 140 and the first power supply wiring 160.
[0121] The first power supply cabling 160 may include a first sub-cabling 162 and a second sub-cabling 163, both extending parallel in the x-direction, with the display area DA located between them. The second power supply cabling 170 may partially surround the display area DA in a ring shape with one side open.
[0122] Figure 4 It is shown Figure 3 A plan view of a portion of the sensor area SA, and Figure 5 It is along Figure 3 The line I-I' and Figure 4 The sectional view taken from line II-II'.
[0123] Reference Figure 4 According to embodiments of this disclosure, auxiliary pixels Pa and transmissive portions TA are arranged in the sensor region SA of the display device 1. Certain auxiliary pixels Pa can be arranged consecutively to form a pixel group Pg.
[0124] Pixel group Pg may include at least one auxiliary pixel Pa. Figure 4 In this diagram, four auxiliary pixels Pa arranged in two rows are included in a pixel group Pg. However, this disclosure is not limited thereto. The number and arrangement of auxiliary pixels Pa included in a pixel group Pg can be modified in various suitable ways.
[0125] Multiple transmissive portions TA, excluding display elements and having high light transmittance, can be provided in the sensor region SA. The transmissive portions TA and pixel groups Pg can be arranged alternately in a first direction (e.g., the x-direction) and / or a second direction (e.g., the y-direction). Alternatively, the transmissive portions TA can surround the pixel groups Pg. Alternatively, auxiliary pixels Pa can surround the transmissive portions TA.
[0126] Reference Figure 5The display device 1 manufactured using the manufacturing method according to an embodiment of the present disclosure includes a display area DA and a sensor area SA. A first main pixel Pm1 and a second main pixel Pm2 are arranged in the display area DA, and a first auxiliary pixel Pa1, a second auxiliary pixel Pa2, and a transmissive portion TA are arranged in the sensor area SA.
[0127] The first main pixel Pm1 may include a first main TFT TFT1, a first main storage capacitor Cst1, and a first main OLED OLED1. The first auxiliary pixel Pa1 may include a first auxiliary TFT TFT'1, a first auxiliary storage capacitor Cst'1, and a first auxiliary OLED OLED'1.
[0128] The second main pixel Pm2 may include a second main TFT TFT2, a second main storage capacitor Cst2, and a second main OLED OLED2. The second auxiliary pixel Pa2 may include a second auxiliary TFT TFT'2, a second auxiliary storage capacitor Cst'2, and a second auxiliary OLED OLED'2.
[0129] Component 20 can be arranged below the sensor region SA. Component 20 can be an infrared (IR) sensor that emits / receives infrared radiation. A transmission portion TA can be arranged in the sensor region SA and can transmit infrared signals emitted to / received from component 20 through the transmission portion TA. For example, light emitted by component 20 can travel in the z-direction through the transmission portion TA, and light generated outside the display device 1 and incident on component 20 can travel in the opposite direction to the z-direction through the transmission portion TA.
[0130] The stacked structure of elements included in a display device 1 manufactured using a manufacturing method according to an embodiment of the present disclosure will now be described.
[0131] Substrate 100 may include glass and / or polymer resin. The polymer resin may include polyethersulfone (PES), polyacrylate (PAR), polyetherimide (PEI), PEN, PET, polyphenylene sulfide (PPS), polyarylate, PI, PC, and / or cellulose acetate propionate (CAP). Substrate 100 comprising polymer resin may be flexible, rollable, and / or bendable. Substrate 100 comprising polymer resin may have a multilayer structure comprising a layer containing polymer resin and an inorganic layer.
[0132] A buffer layer 111 may be disposed on the substrate 100 and may reduce or prevent the penetration of foreign materials, moisture, and / or external air from the bottom of the substrate 100, and may flatten the surface of the substrate 100. The buffer layer 111 may comprise inorganic materials (such as oxides or nitrides), organic materials, or organic / inorganic composite materials, and may have a single-layer or multi-layer structure comprising inorganic and organic materials. A barrier layer for preventing or reducing the penetration of external air may be further disposed between the substrate 100 and the buffer layer 111. In some embodiments, the buffer layer 111 may comprise silicon oxide (SiO2) and / or silicon nitride (SiN). x The buffer layer 111 can be configured such that the first buffer layer 111a and the second buffer layer 111b are stacked.
[0133] In the sensor region SA, a lower electrode layer (also referred to as the first lower electrode layer) BSM and a second lower electrode layer BSM' can be disposed between the first buffer layer 111a and the second buffer layer 111b. In another embodiment, the first lower electrode layer BSM and the second lower electrode layer BSM' can be disposed between the substrate 100 and the first buffer layer 111a. The first lower electrode layer BSM can be disposed below the first auxiliary TFT TFT'1, and the second lower electrode layer BSM' can be disposed below the second auxiliary TFT TFT'2, thereby preventing or protecting the characteristics of the first auxiliary TFT TFT'1 and the second auxiliary TFT TFT'2 from degradation due to light emitted from the component 20.
[0134] Furthermore, the first lower electrode layer BSM and the second lower electrode layer BSM' can receive constant voltages and / or signals from the first wiring GCL and the second wiring GCL' disposed on different layers, respectively. For example, the first lower electrode layer BSM and the second lower electrode layer BSM' can receive a drive voltage (e.g., a first power supply voltage) and / or a scan signal. When the first lower electrode layer BSM and the second lower electrode layer BSM' receive constant voltages and / or signals, the probability of electrostatic discharge can be greatly reduced. Each of the first lower electrode layer BSM and the second lower electrode layer BSM' may include aluminum (Al), platinum (Pt), palladium (Pd), silver (Ag), magnesium (Mg), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), calcium (Ca), molybdenum (Mo), titanium (Ti), tungsten (W), and / or copper (Cu). Each of the first lower electrode layer BSM and the second lower electrode layer BSM' may have a single-layer or multi-layer structure comprising the above-described materials.
[0135] The first main TFT TFT1, the second main TFT TFT2, the first auxiliary TFT TFT'1, and the second auxiliary TFT TFT'2 can be arranged on the buffer layer 111. The first main TFT TFT1 includes a first semiconductor layer A1, a first gate electrode G1, a first source electrode S1, and a first drain electrode D1, and the second main TFT TFT2 includes a second semiconductor layer A2, a second gate electrode G2, a second source electrode S2, and a second drain electrode D2. The first auxiliary TFT TFT'1 includes a third semiconductor layer A3, a third gate electrode G3, a third source electrode S3, and a third drain electrode D3, and the second auxiliary TFT TFT'2 includes a fourth semiconductor layer A4, a fourth gate electrode G4, a fourth source electrode S4, and a fourth drain electrode D4. The first main TFT TFT1 can be connected to the first main OLED OLED1 in the display area DA and can drive the first main OLED OLED1. The first auxiliary TFT TFT'1 can be connected to the first auxiliary OLED OLED'1 in the sensor area SA and can drive the first auxiliary OLED OLED'1. Similarly, the second main TFT TFT2 can be connected to the second main OLED OLED2 in the display area DA, and can drive the second main OLED OLED2. The second auxiliary TFT TFT'2 can be connected to the second auxiliary OLED OLED'2 in the sensor area SA, and can drive the second auxiliary OLED OLED'2.
[0136] At least one of the first semiconductor layers A1 to the fourth semiconductor layers A4 may be disposed on the buffer layer 111 and may include polycrystalline silicon. In another embodiment, at least one of the first semiconductor layers A1 to the fourth semiconductor layers A4 may include amorphous silicon. In another embodiment, at least one of the first semiconductor layers A1 to the fourth semiconductor layers A4 may include at least one oxide selected from combinations of indium (In), gallium (Ga), tin (Sn), zirconium (Zr), vanadium (V), hafnium (Hf), cadmium (Cd), germanium (Ge), chromium (Cr), titanium (Ti), and zinc (Zn). At least one of the first semiconductor layers A1 to the fourth semiconductor layers A4 may include a channel region and may also include source and drain regions doped with impurities.
[0137] The third semiconductor layer A3 and the fourth semiconductor layer A4 may overlap with the first lower electrode layer BSM and the second lower electrode layer BSM', respectively, and a second buffer layer 111b is provided between them. In an embodiment, the widths of the third semiconductor layer A3 and the fourth semiconductor layer A4 may be smaller than the widths of the first lower electrode layer BSM and the second lower electrode layer BSM', and when projected in a direction perpendicular to or orthogonal to the substrate 100, the third semiconductor layer A3 and the fourth semiconductor layer A4 may overlap with the first lower electrode layer BSM and the second lower electrode layer BSM', respectively.
[0138] The first gate insulating layer 112 may be configured to cover the first semiconductor layers A1 to the fourth semiconductor layers A4. The first gate insulating layer 112 may include an inorganic insulating material, such as silicon oxide (SiO2) or silicon nitride (SiN). x The inorganic materials used include silicon oxynitride (SiON), aluminum oxide (Al2O3), titanium oxide (TiO2), tantalum oxide (Ta2O5), hafnium oxide (HfO2), and / or zinc oxide (ZnO2). The first gate insulating layer 112 may have a single-layer or multi-layer structure comprising the aforementioned inorganic materials.
[0139] The first gate electrode G1 to the fourth gate electrode G4 are arranged on the first gate insulating layer 112 to overlap with the first semiconductor layer A1 to the fourth semiconductor layer A4, respectively. Each of the first gate electrode G1 to the fourth gate electrode G4 may include Mo, Al, Cu and / or Ti, and may have a single-layer or multi-layer structure. For example, each of the first gate electrode G1 to the fourth gate electrode G4 may have a single-layer structure including Mo.
[0140] The second gate insulating layer 113 may be configured to cover the first gate electrode G1 to the fourth gate electrode G4. x The inorganic insulating layer 113 may contain SiON, Al2O3, TiO2, Ta2O5, HfO2, and / or ZnO2. The second gate insulating layer 113 may have a single-layer or multi-layer structure comprising the aforementioned inorganic insulating materials.
[0141] The first upper electrode CE2 of the first main storage capacitor Cst1, the second upper electrode CE4 of the second main storage capacitor Cst2, the third upper electrode CE2' of the first auxiliary storage capacitor Cst'1, and the fourth upper electrode CE4' of the second auxiliary storage capacitor Cst'2 can be arranged on the second gate insulating layer 113.
[0142] In the display area DA, the first upper electrode CE2 and the second upper electrode CE4 can overlap with the first gate electrode G1 and the second gate electrode G2 disposed below the first upper electrode CE2 and the second upper electrode CE4, respectively. The first gate electrode G1 and the first upper electrode CE2, which overlap each other and have a second gate insulating layer 113 therebetween, can constitute a first main storage capacitor Cst1. The first gate electrode G1 can be the first lower electrode CE1 of the first main storage capacitor Cst1. Furthermore, the second gate electrode G2 and the second upper electrode CE4, which overlap each other and have a second gate insulating layer 113 therebetween, can constitute a second main storage capacitor Cst2. The second gate electrode G2 can be the second lower electrode CE3 of the second main storage capacitor Cst2.
[0143] In the sensor region SA, the third upper electrode CE2' may overlap with the third gate electrode G3 disposed below the third upper electrode CE2'. The third gate electrode G3 and the third upper electrode CE2', which overlap each other and have a second gate insulating layer 113 therebetween, can constitute a first auxiliary storage capacitor Cst'1. The third gate electrode G3 may be the third lower electrode CE1' of the first auxiliary storage capacitor Cst'1. Furthermore, the fourth gate electrode G4 and the fourth upper electrode CE4', which overlap each other and have a second gate insulating layer 113 therebetween, can constitute a second auxiliary storage capacitor Cst'2. The fourth gate electrode G4 may be the fourth lower electrode CE3' of the second auxiliary storage capacitor Cst'2.
[0144] Each of the first upper electrode CE2 to the fourth upper electrode CE4' may include Al, Pt, Pd, Ag, Mg, Au, Nd, Ir, Cr, Ni, Ca, Mo, Ti, W and / or Cu, and may have a single-layer or multi-layer structure including the above materials.
[0145] The interlayer insulating layer 115 can be formed to cover the first upper electrode CE2 to the fourth upper electrode CE4'. The interlayer insulating layer 115 may include SiO2, SiN x SiON, Al2O3, TiO2, Ta2O5, HfO2 and / or ZnO2.
[0146] The first source electrode S1, the second source electrode S2, the third source electrode S3, and the fourth source electrode S4, as well as the first drain electrode D1, the second drain electrode D2, the third drain electrode D3, and the fourth drain electrode D4, are disposed on the interlayer insulating layer 115. Each of the source electrodes S1, S2, S3, and S4, and the drain electrodes D1, D2, D3, and D4 may include a conductive material, including Mo, Al, Cu, and / or Ti, and may have a single-layer or multi-layer structure including the aforementioned materials. For example, each of the source electrodes S1, S2, S3, and S4, and the drain electrodes D1, D2, D3, and D4 may have a multi-layer structure formed of Ti / Al / Ti.
[0147] The planarization layer 117 can be disposed on the interlayer insulating layer 115. The planarization layer 117 can have a flat top surface, such that the first pixel electrode 221 and the second pixel electrode 221' disposed on the planarization layer 117 are flat.
[0148] The planarization layer 117 may have a single-layer or multi-layer structure formed of organic and / or inorganic materials. The planarization layer 117 may include general-purpose polymers (e.g., benzocyclobutene (BCB), PI, HMDSO, PMMA, and / or polystyrene (PS)), polymer derivatives having phenol-based groups, acryloyl-based polymers, imide-based polymers, aryl ether-based polymers, amide-based polymers, fluorine-based polymers, p-xylene-based polymers, vinyl alcohol-based polymers, or mixtures thereof. The planarization layer 117 may include SiO2, SiN... x The materials used are SiON, Al2O3, TiO2, Ta2O5, HfO2, and / or ZnO2. After the planarization layer 117 is formed, chemical mechanical polishing can be performed to provide a flat top surface.
[0149] An opening portion can be formed in the planarization layer 117 to expose the first main TFT TFT1 and the second main TFT TFT2, and the first pixel electrode 221 can be electrically connected to the first main TFT TFT1 and the second main TFT TFT2 through the opening portion.
[0150] Furthermore, an opening portion can be formed in the planarization layer 117 to expose the first auxiliary TFT TFT'1 and the second auxiliary TFT TFT'2, and the second pixel electrode 221' can be electrically connected to the first auxiliary TFT TFT'1 and the second auxiliary TFT TFT'2 through the opening portion.
[0151] Each of the first pixel electrode 221 and the second pixel electrode 221' may include a conductive oxide, such as indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), indium oxide (In2O3), indium gallium oxide (IGO), and / or zinc aluminum oxide (AZO). In another embodiment, each of the first pixel electrode 221 and the second pixel electrode 221' may include a reflective film comprising Ag, Mg, Al, Pt, Pd, Au, Ni, Nd, Ir, Cr, or alloys or compounds thereof. In another embodiment, each of the first pixel electrode 221 and the second pixel electrode 221' may further include a film formed above / below the reflective film by ITO, IZO, ZnO, and / or In2O3. In some embodiments, each of the first pixel electrode 221 and the second pixel electrode 221' may have a stacked structure formed of ITO / Ag / ITO.
[0152] The pixel defining film 119 may cover the edge of each of the first pixel electrode 221 and the second pixel electrode 221'. The pixel defining film 119 overlaps with each of the first pixel electrode 221 and the second pixel electrode 221'. The pixel defining film 119 may increase the distance between the anti-electrode 223 disposed above the first pixel electrode 221 and the edges of the first pixel electrode 221 and the second pixel electrode 221', thereby preventing or protecting against the occurrence of arcing or the like at the edges of the first pixel electrode 221 and the second pixel electrode 221'. The pixel defining film 119 may be formed by using an organic insulating material such as PI, polyamide, acrylic resin, BCB, HMDSO and / or phenolic resin using spin coating or the like.
[0153] The first functional layer 222a is arranged to cover the pixel defining film 119. The first functional layer 222a may have a single-layer or multi-layer structure. The first functional layer 222a may be a hole transport layer (HTL) with a single-layer structure. In addition, the first functional layer 222a may include a hole injection layer (HIL) and / or an HTL. The first functional layer 222a may be integrally formed to correspond to the first main pixel Pm1 and the second main pixel Pm2, as well as the first auxiliary pixel Pa1 and the second auxiliary pixel Pa2 included in the display area DA and the sensor area SA.
[0154] A first emitting layer 222b and a second emitting layer 222b', corresponding to the first pixel electrode 221 and the second pixel electrode 221' respectively, are arranged on the first functional layer 222a. Each of the first emitting layer 222b and the second emitting layer 222b' may include a high molecular weight material or a low molecular weight material, and may emit red light, green light, blue light or white light.
[0155] The second functional layer 222c can be formed on the first emission layer 222b and the second emission layer 222b'. The second functional layer 222c can have a single-layer or multi-layer structure. The second functional layer 222c may include an electron transport layer (ETL) and / or an electron injection layer (EIL). The second functional layer 222c can be integrally formed as a main pixel Pm and an auxiliary pixel Pa corresponding to the display area DA and the sensor area SA. The first functional layer 222a and / or the second functional layer 222c can be omitted.
[0156] The counter electrode 223 is disposed on the second functional layer 222c. The counter electrode 223 may comprise a conductive material having a low work function. For example, the counter electrode 223 may comprise a (semi-)transparent layer comprising Ag, Mg, Al, Pt, Pd, Au, Ni, Nd, Ir, Cr, lithium (Li) or Ca, or alloys or compounds thereof. Alternatively, the counter electrode 223 may also comprise a layer formed of ITO, IZO, ZnO and / or In2O3 on a (semi-)transparent layer comprising the above-described materials.
[0157] The anti-electrode 223 may include a first main anti-electrode 223a corresponding to the first main pixel Pm1 of the display area DA and a second main anti-electrode 223b corresponding to the second main pixel Pm2 of the display area DA. Furthermore, the anti-electrode 223 may include a second auxiliary anti-electrode 223d corresponding to the first auxiliary pixel Pa1 of the sensor area SA and a first auxiliary anti-electrode 223c corresponding to the second auxiliary pixel Pa2 of the sensor area SA.
[0158] The layer formed in the display area DA, from the first pixel electrode 221 to the anti-electrode 223, can constitute a first main OLED OLED1 and a second main OLED OLED2. The layer formed in the sensor area SA, from the second pixel electrode 221' to the anti-electrode 223, can constitute a first auxiliary OLED OLED'1 and a second auxiliary OLED OLED'2.
[0159] An opening 224 defined by and corresponding to the counter electrode 223 can be formed in the transmission portion TA of the sensor region SA to improve the transmittance of the signal emitted by the component 20.
[0160] A thin-film encapsulation layer 300 is disposed on the counter electrode 223 and the opening 224. The thin-film encapsulation layer 300 may comprise at least one inorganic encapsulation layer and / or at least one organic encapsulation layer, and at this point, Figure 5 The structure of a thin-film encapsulation layer 300 in which a first inorganic encapsulation layer 310, an organic encapsulation layer 320, and a second inorganic encapsulation layer 330 are stacked is shown. The number of organic encapsulation layers, the number of inorganic encapsulation layers, and the order in which the organic and inorganic encapsulation layers are stacked can be appropriately changed.
[0161] Each of the first inorganic encapsulation layer 310 and the second inorganic encapsulation layer 330 may include at least one inorganic insulating material (such as alumina, titanium oxide, tantalum oxide, hafnium oxide, zinc oxide, silicon oxide, silicon nitride, and / or silicon oxynitride) and may be formed using chemical vapor deposition (CVD). The organic encapsulation layer 320 may include polymer-based materials. Examples of polymer-based materials may include silicone resins, acrylic resins, epoxy resins, PI, and polyethylene.
[0162] The first inorganic encapsulation layer 310, the organic encapsulation layer 320, and the second inorganic encapsulation layer 330 can be integrally formed to cover the display area DA and the sensor area SA.
[0163] As described above, the display device 1 can improve the transmittance of the signal emitted from the component 20 by forming an opening 224 in the transmissive portion TA corresponding to the counter electrode 223. The method of manufacturing the display device 1 having the opening 224 formed in the transmissive portion TA to correspond to (and be defined by) the counter electrode 223 will be described in detail below.
[0164] Figure 6 This is a cross-sectional view of an apparatus 400 for manufacturing a display device 1 according to an embodiment of the present disclosure.
[0165] Reference Figure 6 The apparatus 400 for manufacturing the display device 1 may include a chamber 410, a first support portion 420, a second support portion 430, a vision unit 440, a mask 500, a deposition source 460, and a pressure regulator 470.
[0166] An internal space can be formed within the chamber 410, allowing a portion of the chamber 410 to be open. A gate valve 410A can be located at the opening of the chamber 410 and can selectively open / close the opening of the chamber 410.
[0167] The first support portion 420 may support the substrate 100. In this case, the first support portion 420 may support the substrate 100 in various suitable ways. For example, the first support portion 420 may include an electrostatic chuck or an adhesive chuck. In another embodiment, the first support portion 420 may include a frame on which a portion of the substrate 100 is placed and supports the substrate 100, and a chuck for holding and securing a portion of the substrate 100. The first support portion 420 is not limited thereto and may include any device for supporting the substrate 100. However, for ease of explanation, a more detailed description will be given below based on the assumption that the first support portion 420 includes an electrostatic chuck or an adhesive chuck.
[0168] In this configuration, the first support portion 420 may include at least one of a permanent magnet and an electromagnet to securely attach the mask 500 to the substrate 100. In another embodiment, when the first support portion 420 includes a frame or chuck, it may be further configured to resemble... Figure 6 The first support portion 420 contains at least one of a magnet and an electromagnet to tightly attach the substrate 100 to the mask 500.
[0169] The mask 500 can be placed and supported on the second support portion 430. In this case, the mask 500 on the second support portion 430 can be finely adjusted in at least two different directions.
[0170] The vision unit 440 can capture images of the positions of the substrate 100 and the mask 500. In this case, the substrate 100 and the mask 500 can be aligned by moving at least one of the substrate 100 and the mask 500 based on the image captured by the vision unit 440.
[0171] The mask 500 may include multiple openings. The multiple openings may define areas through which the deposited material passes.
[0172] The mask 500 may include a first mask 500a and a second mask 500b that are interchangeable with each other. The first mask 500a may shield a portion of the display area DA of the substrate 100. Furthermore, the second mask 500b may shield a portion of the display area DA of the substrate 100 that is different from the portion of the display area DA shielded by the first mask 500a. In this case, a method for depositing deposition material in the display area DA of the substrate 100 using the first mask 500a and the second mask 500b will be described in more detail below.
[0173] The deposited material can be supplied to the deposition source 460 and can evaporate in the deposition source 460. In this case, the deposition source 460 may include a heater 460A, and the deposited material can evaporate due to the heat applied by the heater 460A. The deposited material may be a material used to form the counter electrode 223 on the substrate 100, and may be a material used to form the first functional layer 222a or the second functional layer 222c. However, for ease of explanation, the following description will be based on the assumption that the deposited material is a material used to form the counter electrode 223 on the substrate 100.
[0174] The deposition source 460 can be formed in various suitable ways. For example, the deposition source 460 can be a point deposition source, wherein the inlet portion through which the deposited material is ejected has a circular shape. Furthermore, the deposition source 460 can be a long linear deposition source, wherein multiple inlet portions are formed, or the inlet portions have an elongated orifice shape. For ease of illustration, the following description will be based on the assumption that the deposition source 460 faces a point on the mask 500 and that the deposition source 460 is a point deposition source.
[0175] The pressure regulator 470 can be connected to the chamber 410 and can regulate the pressure inside the chamber 410 to a level similar to atmospheric pressure or vacuum. In this case, the pressure regulator 470 may include a connecting pipe 471 connected to the chamber 410 and a pressure regulating pump 472 disposed in the connecting pipe 471.
[0176] Referring to the method of manufacturing display device 1 using apparatus 400, a substrate 100 including display area DA and sensor area SA can be manufactured and prepared.
[0177] Furthermore, a mask 500 can be fabricated and prepared. The mask 500 may include a first mask 500a and a second mask 500b. After the first mask 500a is placed on the second support portion 430, the substrate 100 and the first mask 500a can be aligned with each other. Deposition material can be supplied to the deposition source 460, the deposition material can evaporate, and it can be deposited on the substrate 100 through the openings in the first mask 500a.
[0178] After the deposition material is deposited on the substrate 100, the first mask 500a can be replaced with a second mask 500b. After the second mask 500b is placed on the second support portion 430, the substrate 100 and the second mask 500b can be aligned with each other. Deposition material can be supplied to the deposition source 460, the deposition material can evaporate, and it can be deposited on the substrate 100 through the openings in the second mask 500b.
[0179] However, the second mask 500b can be placed on the second support portion 430 first, and then the deposition material can be deposited on the substrate 100. Alternatively, the second mask 500b can be replaced with the first mask 500a, and the deposition material can be deposited on the substrate 100. However, for ease of explanation, the following description will be based on the assumption that the first mask 500a is placed on the second support portion 430, the deposition material is deposited on the substrate 100, and the first mask 500a is replaced with the second mask 500b.
[0180] Furthermore, a thin-film encapsulation layer 300 can be formed, and components for applying signals through the transmission portion TA included in the sensor region SA can be arranged.
[0181] Figure 7A This is a plan view showing the first mask 500a of an apparatus 400 for manufacturing a display device 1 according to an embodiment of the present disclosure. Figure 7B This is a plan view showing a portion of the counter electrode 223 formed on the substrate 100 by placing a first mask 500a on a second support portion 430 and then depositing a deposition material in a manufacturing method according to an embodiment of the present disclosure. Figure 7C This is a cross-sectional view showing a portion of a counter electrode 223 formed on a substrate 100 by placing a first mask 500a on a second support portion 430 and then depositing a deposition material in a manufacturing method according to an embodiment of the present disclosure. Figure 7C In, with Figure 5The same components can be represented by the same reference numerals, and for the sake of brevity, repeated descriptions will not be provided.
[0182] Reference Figures 7A to 7C The first mask 500a may include a first mask body portion 501a, a first rib portion 510a, a first rib connector 511a, a second rib connector 512a, a first mask opening portion 520a, and a first shielding portion 540a.
[0183] The first mask body portion 501a can have a quadrilateral shape in a plan view. In this case, the first mask body portion 501a can have a long side and a short side. For example, the long side of the first mask body portion 501a can be... Figure 7A Extending in the y-direction, and the short side of the first mask body portion 501a can be... Figure 7A It extends in the x-direction. For ease of explanation, the following description will be based on the assumption that the first mask body portion 501a has a quadrilateral shape in the plan view.
[0184] The first rib portion 510a may include a plurality of first ribs arranged spaced apart from each other within the first mask 500a. For example, the first ribs may be arranged in... Figure 7A They are spaced apart from each other in the y-direction. In this case, each first rib can be connected to the first mask body portion 501a. For example, each first rib can be integrally formed with the first mask body portion 501a, or it can be manufactured separately from the first mask body portion 501a and then fixed to the first mask body portion 501a by means of welding or the like.
[0185] The first mask 500a may include a plurality of first mask opening portions 520a arranged spaced apart from each other. For example, the first mask opening portions 520a may be arranged in... Figure 7A The first mask openings 520a are spaced apart from each other in the y-direction. That is, the first mask openings 520a can be formed parallel to the short side of the first mask 500a. Each of the first mask openings 520a can have a rectangular or square shape. However, this disclosure is not limited thereto. Various suitable modifications can be made, including cases where the corner portions of each first mask opening 520a have curvature. The first mask openings 520a can be arranged between adjacent first ribs.
[0186] The first shielding portion 540a can be configured within the first mask 500a to correspond to the sensor region SA. The first shielding portion 540a shields the deposited material. Furthermore, the edge portion of the first shielding portion 540a has any of a variety of suitable shapes, such as polygonal shapes (e.g., triangular or rectangular shapes) or circular shapes. However, for ease of explanation, the following description will be based on the assumption that the edge portion of the first shielding portion 540a has a circular shape.
[0187] The first shielding portion 540a may include a first opening portion 541a formed in the transmissive portion TA with a pattern corresponding to the second auxiliary pixel Pa2. Furthermore, the first opening portions 541a may be spaced apart from each other to have a set or predetermined pattern. Various suitable modifications can be made, including cases where each first opening portion 541a has a polygonal or circular shape in a plan view. However, for ease of explanation, the following description will be based on the assumption that the first opening portions 541a have a quadrilateral shape in a plan view.
[0188] The first shielding portion 540a can be secured in various suitable ways. For example, the first shielding portion 540a can be connected to and supported on a first rib. In another embodiment, the first shielding portion 540a can be connected to and supported on at least two first ribs. For example, the first shielding portion 540a can be connected to the first mask body portion 501a across the x-direction via a first rib connector 511a and a second rib connector 512a.
[0189] One of the first mask opening portions 520a can be divided into two portions by the first shielding portion 540a. For example, based on the first shielding portion 540a, the first mask opening portion 520a disposed between the first rib connector 511a and the second rib connector 512a can be divided into two portions.
[0190] The deposited material can evaporate in the deposition source 460 and can pass through the first opening portion 541a of the first mask 500a. The first auxiliary counter electrode 223c can be formed on the substrate 100 as a second auxiliary pixel Pa2 corresponding to the sensor region SA.
[0191] The first auxiliary counter electrodes 223c can be formed spaced apart from each other in the sensor region SA. For example, each of the first auxiliary counter electrodes 223c can have a quadrilateral shape in a plan view. However, this disclosure is not limited thereto. Various suitable modifications can be made, including cases where the first auxiliary counter electrodes 223c have a circular shape in a plan view. However, for ease of explanation, the following description will be based on the assumption that the first auxiliary counter electrodes 223c have a quadrilateral shape in a plan view. Specifically, the shape of the first auxiliary counter electrodes 223c in a plan view can be the same as or similar to the shape of the first opening portion 541a of the first shielding portion 540a.
[0192] When the first auxiliary counter electrode 223c is formed on the substrate 100, a plurality of first main counter electrodes 223a can be formed in the display area DA spaced apart from each other (see [reference]). Figure 7C For example, the first main reverse electrode 223a may be spaced apart from each other in a pattern corresponding to the first mask opening portion 520a of the first mask 500a.
[0193] Some portions of the first main reverse electrode 223a corresponding to the first shielding portion 540a can be divided into a side portion (i.e., the left side portion) 531c and a side portion (i.e., the right side portion) 532c. In other words, the first main reverse electrode 223a can be divided into two parts based on the sensor region SA.
[0194] Some of the first main counter electrodes 223a may have a striped shape. For example, the first main counter electrodes 223a may be arranged in... Figure 7B They are spaced apart from each other in the y-direction.
[0195] Figure 8A This is a plan view showing the second mask 500b of an apparatus 400 for manufacturing a display device 1 according to an embodiment of the present disclosure. Figure 8B This is a plan view showing the formation of a counter electrode 223 on a substrate 100 by placing a second mask 500b on a second support portion 430 and then depositing a deposition material in a manufacturing method according to an embodiment of the present disclosure. Figure 8C This is a cross-sectional view showing a counter electrode 223 formed on a substrate 100 by placing a second mask 500b on a second support portion 430 and then depositing a deposition material in a manufacturing method according to an embodiment of the present disclosure. Figure 8C In, with Figure 5 The same components can be represented by the same reference numerals, and for the sake of brevity, their descriptions will not be repeated.
[0196] Reference Figures 8A to 8CThe second mask 500b may include a second mask body portion 501b, a second rib portion 510b, a third rib connector 511b, a fourth rib connector 512b, a second mask opening portion 520b, and a second shielding portion 540b.
[0197] The second mask body portion 501b can have a quadrilateral shape in a plan view. In this case, the second mask body portion 501b can have a long side and a short side. For example, the long side of the second mask body portion 501b can be... Figure 8A Extending in the y-direction, and the short side of the second mask body portion 501b can be... Figure 8A It extends in the x-direction. However, for ease of explanation, the following description will be based on the assumption that the second mask body portion 501b has a quadrilateral shape in the plan view.
[0198] The second rib portion 510b may include a plurality of second ribs arranged spaced apart from each other within the second mask 500b. For example, the second ribs may be arranged in... Figure 8A The first ribs are spaced apart from each other in the y-direction. The second ribs can contact the interior of the second mask 500b (i.e., the interior of the second mask body portion 501b). Furthermore, the second ribs can be arranged between the first ribs when projected perpendicularly or orthogonally by matching the two vertices of the first mask body portion 501a of the first mask 500a and the second mask body portion 501b of the second mask 500b. In this case, the first and second ribs can be arranged alternately.
[0199] The second mask 500b may include a plurality of second mask opening portions 520b arranged spaced apart from each other. For example, the second mask opening portions 520b may be arranged in... Figure 8A The second mask openings 520b are spaced apart from each other in the y-direction. That is, the second mask openings 520b can be formed parallel to the short side of the second mask 500b. Each of the second mask openings 520b can have a rectangular or square shape. However, this disclosure is not limited thereto. Various suitable modifications can be made, including cases where the corner portions of each second mask opening 520b have curvature. The second mask openings 520b can be arranged between the first mask openings 520a when projected vertically or orthogonally by matching the two vertices of the first mask body portion 501a of the first mask 500a and the second mask body portion 501b of the second mask 500b.
[0200] The second shielding portion 540b can be configured within the second mask 500b to correspond to the sensor region SA. The second shielding portion 540b can shield the deposited material and can divide at least one of the second mask opening portions 520b into two parts. Furthermore, the second shielding portion 540b can have any of a variety of suitable shapes to correspond to the first shielding portion 540a. However, for ease of explanation, a more detailed description will be provided below based on the assumption that the second shielding portion 540b has a circular shape.
[0201] The second shielding portion 540b may include a second opening portion 541b disposed in the transmissive portion TA with a pattern corresponding to the first auxiliary pixel Pa1. Furthermore, the second opening portions 541b may be spaced apart from each other to have patterns. The pattern of the second opening portion 541b may differ from the pattern of the first opening portion 541a. For example, the center of the second opening portion 541b may not overlap with the center of the first opening portion 541a. Various suitable modifications can be made, including cases where the second opening portion 541b has a quadrilateral shape or a circular shape in the plan view. However, for ease of explanation, a more detailed description will be given below based on the assumption that the second opening portion 541b has a quadrilateral shape in the plan view.
[0202] The second shielding portion 540b may be connected to and supported on at least one second rib. For example, in one embodiment, the second shielding portion 540b may be connected to and supported on one second rib. In another embodiment, the second shielding portion 540b may be connected to at least two second ribs. More specifically, the second shielding portion 540b may be connected to the second mask body portion 501b across the x-direction due to the third rib connector 511b and the fourth rib connector 512b. The third rib connector 511b and the fourth rib connector 512b may be spaced apart from the short side of the second mask body portion 501b by the same distance. The second shielding portion 540b may be supported by the third rib connector 511b and the fourth rib connector 512b. In this case, the second shielding portion 540b may divide the second opening portion 541b located between two adjacent second ribs. In other words, the second shielding portion 540b can divide the second opening portion 541b into a portion located between the third rib connector 511b and the fifth rib connector 513b, and a portion located between the fourth rib connector 512b and the sixth rib connector 514b.
[0203] The second mask 500b may further include a fifth rib connector 513b and a sixth rib connector 514b. Due to the fifth rib connector 513b and the sixth rib connector 514b, the second shielding portion 540b can be connected to the second mask body portion 501b to span across the x-direction. The fifth rib connector 513b and the sixth rib connector 514b can be spaced equidistant from the short side of the second mask body portion 501b.
[0204] The second shielding portion 540b can be supported by the third rib connector 511b and the fourth rib connector 512b, and can also be supported by the fifth rib connector 513b and the sixth rib connector 514b.
[0205] Therefore, deformation of at least one of the third rib connectors 511b to the sixth rib connector 514b connected to the second shielding portion 540b can be reduced or prevented. Furthermore, the initial or substantially initial shape of the second mask 500b can be maintained.
[0206] like Figure 8B and Figure 8C As shown, deposition material can be deposited in the display area DA and the sensor area SA. A first mask 500a can be removed from the chamber 410, a second mask 500b can be inserted into the chamber 410, and deposition material can be supplied from the deposition source 460 to be deposited in the sensor area SA and the display area DA of the substrate 100 through the second opening portion 541b and the second mask opening portion 520b of the second mask 500b. In this case, a second auxiliary anti-electrode 223d can be formed on the substrate 100 as a first auxiliary pixel Pa1 corresponding to the sensor area SA.
[0207] The second auxiliary counter electrode 223d can be spaced apart from each other in the sensor region SA to have a pattern different from that of the first auxiliary counter electrode 223c. For example, the second auxiliary counter electrode 223d and the first auxiliary counter electrode 223c can be arranged alternately. In this case, in an embodiment, the second auxiliary counter electrode 223d may not overlap with the first auxiliary counter electrode 223c. In another embodiment, the first auxiliary counter electrode 223c and the second auxiliary counter electrode 223d that are adjacent to each other can at least partially overlap each other. In this case, the first auxiliary counter electrode 223c and the second auxiliary counter electrode 223d (each having a quadrilateral shape in the plan view) can overlap at the corner portions. Therefore, a uniform voltage can be formed in the first auxiliary counter electrode 223c and the second auxiliary counter electrode 223d. For ease of explanation, the following description will be based on the assumption that the first auxiliary counter electrode 223c and the second auxiliary counter electrode 223d partially overlap each other.
[0208] When the second auxiliary counter electrode 223d is formed on the substrate 100, a plurality of second main counter electrodes 223b can be formed in the display area DA spaced apart from each other (see [reference]). Figure 8C For example, the second main counter electrode 223b can be spaced apart from each other in a pattern corresponding to the second mask opening portion 520b of the second mask 500b.
[0209] The second main counter electrode 223b can be arranged between adjacent first main counter electrodes 223a. In this case, the first main counter electrodes 223a and the second main counter electrode 223b can at least partially overlap each other in a plan view.
[0210] Some of the second main counter electrodes 223b may have a striped shape. For example, the second main counter electrodes 223b may be arranged in... Figure 8B They are spaced apart from each other in the y-direction.
[0211] The first auxiliary counter electrode 223c and the second auxiliary counter electrode 223d can be spaced apart from each other, and the opening 224 corresponding to the counter electrode 223 can be formed in the transmission portion TA of the sensor region SA. Therefore, the transmittance in the transmission portion TA of the sensor region SA can be improved.
[0212] Figure 9A This is a plan view showing a first mask 500a of an apparatus 400 for manufacturing a display device 1 according to another embodiment of the present disclosure.
[0213] The first mask 500a may include a first mask body portion 501a, a first rib portion 510a, a first rib connector 511a, a second rib connector 512a, a first mask opening portion 520a, and a first shielding portion 540a. In this case, the first mask body portion 501a, the first rib portion 510a, the first rib connector 511a, the second rib connector 512a, the first mask opening portion 520a, and the first shielding portion 540a are connected to... Figure 7A Those that are the same or similar, and therefore will not be provided in detail. The following will focus on those related to the references. Figure 7A The differences are in the content described.
[0214] The first rib portion 510a can be arranged in... Figure 9A They are spaced apart from each other in the x-direction. Furthermore, the first mask opening portion 520a can be arranged in... Figure 9A They are spaced apart from each other in the x-direction. That is, each first mask opening portion 520a can be formed as a long side parallel to the first mask body portion 501a.
[0215] Figure 9BThis is a plan view showing a portion of a counter electrode 223 formed on a substrate 100 by placing a first mask 500a on a second support portion 430 and then depositing a deposition material in a manufacturing method according to another embodiment of the present disclosure.
[0216] Reference Figure 9B The first auxiliary counter electrode 223c and the first main counter electrode 223a are with Figure 7B Those that are the same or similar, and therefore will not be described in detail. Furthermore, the cross-sectional views of the first auxiliary counter electrode 223c and the first main counter electrode 223a formed on the substrate 100 are similar to those of the others. Figure 7C Those that are the same or similar in the text, and therefore will not be described.
[0217] The first main counter electrode 223a can be arranged in... Figure 9B They are spaced apart from each other in the x-direction.
[0218] Figure 10A This is a plan view showing a second mask 500b of an apparatus 400 for manufacturing a display device 1 according to another embodiment of the present disclosure.
[0219] Reference Figure 10A The second mask 500b may include a second mask body portion 501b, a second rib portion 510b, a third rib connector 511b, a fourth rib connector 512b, a second mask opening portion 520b, and a second shielding portion 540b. However, the second mask body portion 501b, the second rib portion 510b, the third rib connector 511b, the fourth rib connector 512b, the second mask opening portion 520b, and the second shielding portion 540b are related to... Figure 8A Those that are the same or similar in the text, and therefore will not be given a detailed description.
[0220] The second rib portion 510b can be arranged in... Figure 10A They are spaced apart from each other in the x-direction. Furthermore, the second mask opening portion 520b can be arranged in... Figure 10A They are spaced apart from each other in the x-direction. That is, each second mask opening portion 520b can be formed as a long side parallel to the second mask body portion 501b.
[0221] The second shielding portion 540b can be connected to the second mask body portion 501b across the y-direction due to the third rib connector 511b and the fourth rib connector 512b. Furthermore, the second mask 500b may also include a fifth rib connector 513b and a sixth rib connector 514b. Due to the fifth rib connector 513b and the sixth rib connector 514b, the second shielding portion 540b can be further connected to the second mask body portion 501b across the y-direction.
[0222] Figure 10B This is a plan view showing a counter electrode 223 formed on a substrate 100 by placing a second mask 500b on a second support portion 430 and then depositing a deposition material in a manufacturing method according to another embodiment of the present disclosure.
[0223] The second auxiliary counter electrode 223d and the second main counter electrode 223b and Figure 8B Those that are the same or similar, and therefore will not be described in detail. Furthermore, the cross-sectional view of the second auxiliary counter electrode 223d and the second main counter electrode 223b formed on the substrate 100 is similar to... Figure 8C Those that are the same or similar in the text, and therefore will not be described.
[0224] The first main counter electrode 223a and the second main counter electrode 223b can be arranged in such a way that... Figure 10B They are spaced apart from each other in the x-direction.
[0225] Figure 11A This is a plan view showing a first mask 500a of an apparatus 400 for manufacturing a display device 1 according to another embodiment of the present disclosure. Figure 7A Components that are identical are indicated by the same reference numerals, and for the sake of brevity, their descriptions will not be repeated.
[0226] Reference Figure 11A The first mask 500a may further include a third rib portion 513a. The third rib portion 513a may be connected to the long side of the first mask body portion 501a. Furthermore, the third rib portion 513a may be connected to both the first shielding portion 540a and the short side of the first mask body portion 501a. Therefore, the third rib portion 513a may be formed on the substantial (large) portion of the first mask opening portion 520a. For example, the first mask opening portion 520a may be arranged only adjacent to the first shielding portion 540a.
[0227] The third rib portion 513a can prevent or reduce deformation of the first rib connector 511a or the second rib connector 512a connected to the first shielding portion 540a. In addition, the initial or substantially initial shape of the first mask 500a can be maintained.
[0228] Figure 11B This is a plan view showing a portion of a counter electrode 223 formed on a substrate 100 by placing a first mask 500a on a second support portion 430 and then depositing a deposition material in a manufacturing method according to another embodiment of this disclosure. Figure 7B The same components may be represented by the same reference numerals, and for the sake of brevity, their descriptions will not be repeated.
[0229] The first main counter electrode 223a can be formed adjacent to the sensor region SA. In addition, some of the plurality of first main counter electrodes 223a can have a striped shape.
[0230] The planar area of one side portion (i.e., the left side portion) 531c of the first main counter electrode 223a may be different from the planar area of the other side portion (i.e., the right side portion) 532c of the first main counter electrode 223a. However, this disclosure is not limited thereto. Various suitable modifications can be made, including cases where the planar areas of both sides of the first main counter electrode 223a are the same. However, for ease of explanation, the following description will be based on the assumption that the planar areas of one side portion 531c and the other side portion 532c of the first main counter electrode 223a are different from each other.
[0231] Figure 12A This is a plan view showing a second mask 500b of an apparatus 400 for manufacturing a display device 1 according to another embodiment of the present disclosure. Figure 8A Components that are identical are indicated by the same reference numerals, and for the sake of brevity, their descriptions will not be repeated.
[0232] Reference Figure 12A The area of one of the plurality of second mask opening portions 520b may differ from the area of another of the plurality of second mask opening portions 520b. For example, the second mask opening portion 520b may further include an adjacent opening portion 530b, the area of which differs from the areas of the other second mask opening portions 520b. In this case, apart from the adjacent opening portion 530b, the second mask opening portion 520b and Figure 8A The second mask opening portion 520b is the same as or similar to that in the previous one, and therefore its detailed description will not be given.
[0233] The adjacent opening portion 530b may be arranged adjacent to the short side of the second mask body portion 501b and may be adjacent to at least a portion of the long side of the second mask body portion 501b. In addition, the adjacent opening portion 530b may be arranged adjacent to the fifth rib connector 513b or the sixth rib connector 514b.
[0234] The adjacent opening portion 530b can have a quadrilateral shape in the plan view and can be formed on the substantial (large) portion of the second mask 500b.
[0235] Figure 12B This is a plan view illustrating a counter electrode 223 formed on a substrate 100 by placing a second mask 500b on a second support portion 430 and then depositing a deposition material in a manufacturing method according to another embodiment of this disclosure. Figure 8BComponents that are identical are indicated by the same reference numerals, and for the sake of brevity, their descriptions will not be repeated.
[0236] When the second mask 500b is aligned on the substrate 100, some of the second main counter electrodes 223b can be formed to correspond to adjacent openings 530b. Because the deposited material passes through the adjacent openings 530b and is deposited on the substrate 100, some of the second main counter electrodes 223b can be formed uniformly. Therefore, the number of times the first main counter electrode 223a and the second main counter electrode 223b overlap each other can be reduced, and thus the thickness of the counter electrodes 223 can be substantially uniform.
[0237] Figure 13A This is a plan view showing a first mask 500a of an apparatus 400 for manufacturing a display device 1 according to another embodiment of the present disclosure. Figure 11A Components that are identical are indicated by the same reference numerals, and for the sake of brevity, their descriptions will not be repeated.
[0238] The first rib portion (i.e., the first rib) 510a can be arranged in Figure 13A It is spaced apart from the first mask body portion 501a in the x-direction. Furthermore, the first mask opening portion 520a can be arranged in... Figure 13A They are spaced apart from each other in the x-direction. That is, each first mask opening portion 520a can be formed as a long side parallel to the first mask body portion 501a.
[0239] Figure 13B This is a plan view showing a portion of a counter electrode 223 formed on a substrate 100 by placing a first mask 500a on a second support portion 430 and then depositing a deposition material in a manufacturing method according to another embodiment of the present disclosure.
[0240] The first auxiliary counter electrode 223c and the first main counter electrode 223a and Figure 11B Those that are the same or similar, and therefore will not be given a detailed description.
[0241] The first main counter electrode 223a can be arranged in... Figure 13B They are spaced apart from each other in the x-direction.
[0242] Figure 14A This is a plan view showing a second mask 500b of an apparatus 400 for manufacturing a display device 1 according to another embodiment of the present disclosure. Figure 12A Components that are identical are indicated by the same reference numerals, and for the sake of brevity, their descriptions will not be repeated.
[0243] The second rib portion 510b can be arranged in... Figure 14AIt is spaced apart from the fourth rib connector 512b in the x-direction. Furthermore, the second mask opening portion 520b can be arranged in... Figure 14A It is spaced apart from the adjacent opening portion 530b in the x direction. That is, the second mask opening portion 520b can be formed as parallel to the long side of the second mask body portion 501b.
[0244] Figure 14B This is a plan view illustrating a counter electrode 223 formed on a substrate 100 by placing a second mask 500b on a second support portion 430 and then depositing a deposition material in a manufacturing method according to another embodiment of this disclosure. Figure 12B Components that are identical are indicated by the same reference numerals, and for the sake of brevity, their descriptions will not be repeated.
[0245] The first main counter electrode 223a and the second main counter electrode 223b can be arranged in such a way that... Figure 14B They are spaced apart from each other in the x-direction.
[0246] Figure 15 This is a perspective view of a display device 1 manufactured using a manufacturing method according to another embodiment of this disclosure. Figure 1 Components that are identical in the figure are indicated by the same reference numerals, and for the sake of brevity, their descriptions will not be repeated.
[0247] The display device 1 may include a through portion OA. The through portion OA may have a component 30 arranged below it (see...). Figure 16 The through-section OA can be a transmissive region, through which light and / or sound propagating from component 30 to the outside or from the outside toward component 30 can be transmitted. In the display device 1 manufactured using the manufacturing method according to an embodiment of the present disclosure, when light is transmitted through the through-section OA, the transmittance can be equal to or greater than about 50%, and more preferably, equal to or greater than 70%, equal to or greater than 75%, equal to or greater than 80%, equal to or greater than 85%, or equal to or greater than 90%. The through-section OA can be an area where no display element is disposed and no image is provided. In this embodiment, the through-section OA can be disposed within the display area DA, and the main pixels can be arranged around the through-section OA.
[0248] Figure 16 It is along Figure 15 A sectional view taken by lines B-B' and C-C'. Figure 16 In, with Figure 5 Components that are identical to those in the drawings are indicated by the same reference numerals, and their descriptions will not be repeated.
[0249] Reference Figure 16The display device 1 may include a through portion OA. The through portion OA may have an opening OAH corresponding to the through portion OA.
[0250] The through-portion OA may have a substrate aperture 100H that passes through the substrate 100. Because the through-portion OA has a substrate aperture 100H, the light transmittance of the through-portion OA can be increased. Therefore, the component 30 that requires high light transmittance can be arranged under the through-portion OA.
[0251] When the first gate insulating layer 112, the second gate insulating layer 113, and the interlayer insulating layer 115 are collectively referred to as the inorganic insulating layer IL, the inorganic insulating layer IL may have a first hole H1 corresponding to the transmission portion TA. The first hole H1 may be formed to expose the top surface of the buffer layer 111 or the substrate 100. The first hole H1 may be formed by overlapping with a first opening of the first gate insulating layer 112, a second opening of the second gate insulating layer 113, and a third opening of the interlayer insulating layer 115, wherein the first, second, and third openings are formed to correspond to the through portion OA. The first to third openings may be formed separately using separate processes, or simultaneously using the same process. Alternatively, various suitable modifications may be made, including cases where the first and second openings are formed in parallel or simultaneously, and the third opening is formed separately. When the first to third openings are formed using separate processes, a stepped portion may be formed at the side surface of the first hole H1.
[0252] The planarization layer 117 may have a second hole H2 corresponding to the through portion OA. The second hole H2 may overlap with the first hole H1.
[0253] The pixel defining film 119 may have a third hole H3 formed in the through portion OA. The third hole H3 may overlap with the first hole H1 and the second hole H2. The counter electrode 223 may be disposed on the inner sidewall defining the first hole H1, the second hole H2 and the third hole H3. In some embodiments, the first functional layer 222a, the second functional layer 222c and the counter electrode 223 may be disposed on the sidewall defining the first hole H1, the second hole H2 and the third hole H3.
[0254] By forming the first hole H1, the second hole H2, and the third hole H3, the light transmittance of the penetrating portion OA can be increased.
[0255] Figure 17A This is a plan view showing a first mask 500a of an apparatus 400 for manufacturing a display device 1 according to another embodiment of the present disclosure.
[0256] The first mask 500a may include a first mask body portion 501a, a first rib portion 510a, a first rib connector 511a, a second rib connector 512a, a first mask opening portion 520a, and a first shielding portion 540a. In this case, the first mask body portion 501a, the first rib portion 510a, the first rib connector 511a, the second rib connector 512a, and the first mask opening portion 520a are connected to... Figure 7A Those are the same as those in the text, and therefore will not be given a detailed description.
[0257] The first shielding portion 540a can be configured on the first mask 500a to correspond to the through portion OA. The first shielding portion 540a shields the deposited material. Furthermore, various suitable embodiments can be implemented, including cases where the first shielding portion 540a has a rectangular or circular shape.
[0258] Figure 17B This is a plan view showing a portion of a counter electrode 223 formed on a substrate 100 by placing a first mask 500a on a second support portion 430 and then depositing a deposition material in a manufacturing method according to another embodiment of the present disclosure.
[0259] The counter electrode 223 may include a first main counter electrode 223a. In this case, the first main counter electrode 223a and... Figure 7B The first main counter electrode 223a is the same, and therefore no detailed description of it will be given.
[0260] Figure 18A This is a plan view showing a second mask 500b of an apparatus 400 for manufacturing a display device 1 according to another embodiment of the present disclosure.
[0261] The second mask 500b may include a second mask body portion 501b, a second rib portion 510b, a third rib connector 511b, a fourth rib connector 512b, a second mask opening portion 520b, and a second shielding portion 540b. In this case, the second mask body portion 501b, the second rib portion 510b, the third rib connector 511b, the fourth rib connector 512b, and the second mask opening portion 520b are connected to... Figure 8A Those are the same as those in the text, and therefore will not be given a detailed description.
[0262] The second shielding portion 540b can be configured on the second mask 500b to correspond to the through portion OA. The second shielding portion 540b shields the deposited material. Furthermore, various suitable modifications can be made, including cases where the second shielding portion 540b has a rectangular or circular shape.
[0263] The second shielding portion 540b can be connected to and supported on at least four ribs. Therefore, the second mask 500b may also include a fifth rib connector 513b and a sixth rib connector 514b. Due to the fifth rib connector 513b and the sixth rib connector 514b, the second shielding portion 540b can be connected to the second mask body portion 501b to span across in the x-direction. The fifth rib connector 513b and the sixth rib connector 514b can be spaced equidistant from the short sides of the second mask body portion 501b. The fifth rib connector 513b and the sixth rib connector 514b can divide the second mask opening portion 520b arranged between adjacent second rib portions 510b.
[0264] Therefore, deformation of the third rib connector 511b or the fourth rib connector 512b connected to the second shielding portion 540b can be reduced or prevented. Furthermore, the initial or substantially initial shape of the second mask 500b can be maintained.
[0265] Figure 18B This is a plan view showing a counter electrode 223 formed on a substrate 100 by placing a second mask 500b on a second support portion 430 and then depositing a deposition material in a manufacturing method according to another embodiment of the present disclosure.
[0266] The counter electrode 223 may include a first main counter electrode 223a and a second main counter electrode 223b. In this case, the first main counter electrode 223a and the second main counter electrode 223b are... Figure 8B Those that are the same or similar, and therefore will not be given a detailed description.
[0267] Figure 19A This is a plan view showing a first mask 500a of an apparatus 400 for manufacturing a display device 1 according to another embodiment of the present disclosure.
[0268] The first mask 500a may include a first mask body portion 501a, a first rib portion 510a, a first rib connector 511a, a second rib connector 512a, a first mask opening portion 520a, and a first shielding portion 540a. In this case, the first mask body portion 501a, the first rib portion 510a, the first rib connector 511a, the second rib connector 512a, the first mask opening portion 520a, and the first shielding portion 540a are connected to... Figure 17A Those that are the same or similar, and therefore will not be given a detailed description.
[0269] The first rib portion 510a can be arranged in... Figure 19A They are spaced apart from each other in the x-direction. Furthermore, the first mask opening portion 520a can be arranged in... Figure 19AThey are spaced apart from each other in the x-direction. That is, each first mask opening portion 520a can be formed as a long side parallel to the first mask body portion 501a.
[0270] Figure 19B This is a plan view showing a portion of a counter electrode 223 formed on a substrate 100 by placing a first mask 500a on a second support portion 430 and then depositing a deposition material in a manufacturing method according to another embodiment of the present disclosure.
[0271] The first main counter electrode 223a and Figure 17B The first main counter electrode 223a is the same as that in the previous one, and therefore its detailed description will not be given.
[0272] The first main counter electrode 223a can be arranged in... Figure 19B They are spaced apart from each other in the x-direction.
[0273] Figure 20A This is a plan view showing a second mask 500b of an apparatus 400 for manufacturing a display device 1 according to another embodiment of the present disclosure.
[0274] Reference Figure 20A The second mask 500b may include a second mask body portion 501b, a second rib portion 510b, a third rib connector 511b, a fourth rib connector 512b, a second mask opening portion 520b, and a second shielding portion 540b. However, the second mask body portion 501b, the second rib portion 510b, the third rib connector 511b, the fourth rib connector 512b, the second mask opening portion 520b, and the second shielding portion 540b are related to... Figure 18A Those that are the same or similar to those in the text, and therefore will not be given a detailed description.
[0275] The second rib portion 510b can be arranged in... Figure 20A They are spaced apart from each other in the x-direction. Furthermore, the second mask opening portion 520b can be arranged in... Figure 20A They are spaced apart from each other in the x-direction. That is, each second mask opening portion 520b can be formed as a long side parallel to the second mask body portion 501b.
[0276] The second shielding portion 540b can be connected to the second mask body portion 501b across the y-direction due to the third rib connector 511b and the fourth rib connector 512b. Furthermore, the second mask 500b may also include a fifth rib connector 513b and a sixth rib connector 514b. Due to the fifth rib connector 513b and the sixth rib connector 514b, the second shielding portion 540b can be further connected to the second mask body portion 501b across the y-direction.
[0277] Figure 20B This is a plan view showing a counter electrode 223 formed on a substrate 100 by placing a second mask 500b on a second support portion 430 and then depositing a deposition material in a manufacturing method according to another embodiment of the present disclosure.
[0278] Reference Figure 20B The first main counter electrode 223a and the second main counter electrode 223b are with Figure 19B Those that are the same or similar, and therefore will not be given a detailed description.
[0279] The first main counter electrode 223a and the second main counter electrode 223b can be arranged in such a way that... Figure 20B They are spaced apart from each other in the x-direction.
[0280] Figure 21A This is a plan view showing a first mask 500a of an apparatus 400 for manufacturing a display device 1 according to another embodiment of the present disclosure. Figure 11A Components that are identical are indicated by the same reference numerals, and for the sake of brevity, their descriptions will not be repeated.
[0281] Reference Figure 21A The first shielding portion 540a can be configured on the first mask 500a to correspond to the through portion OA. The first shielding portion 540a shields the deposited material. Furthermore, various suitable modifications can be made, including cases where the first shielding portion 540a has a rectangular shape or a circular shape.
[0282] Therefore, deformation of the first mask 500a, including the first shielding portion 540a, can be reduced or prevented, and the initial or basic initial shape of the first mask 500a can be maintained.
[0283] Figure 21B This is a plan view showing a portion of a counter electrode 223 formed on a substrate 100 by placing a first mask 500a on a second support portion 430 and then depositing a deposition material in a manufacturing method according to another embodiment of this disclosure. Figure 11B Components that are identical are indicated by the same reference numerals, and for the sake of brevity, their descriptions will not be repeated.
[0284] Reference Figure 21B The first main counter electrode 223a may be formed adjacent to the through portion OA. Furthermore, some of the plurality of first main counter electrodes 223a may have a striped shape.
[0285] Figure 22A This is a plan view showing a second mask 500b of an apparatus 400 for manufacturing a display device 1 according to another embodiment of the present disclosure. Figure 12AComponents that are identical are indicated by the same reference numerals, and for the sake of brevity, their descriptions will not be repeated.
[0286] Reference Figure 22A The second shielding portion 540b can be connected to and supported on at least four ribs or rib connectors. For example, the second shielding portion 540b can be connected to the second mask body portion 501b across the x-direction due to the third rib connector 511b and the fourth rib connector 512b. Furthermore, the second shielding portion 540b can be connected to the second mask body portion 501b across the x-direction due to the fifth rib connector 513b and the sixth rib connector 514b.
[0287] The second shielding portion 540b can be supported by the third rib connector 511b to the sixth rib connector 514b. Therefore, deformation of at least one of the third rib connector 511b to the sixth rib connector 514b connected to the second shielding portion 540b can be reduced or prevented. Furthermore, the initial or substantially initial shape of the second mask 500b can be maintained.
[0288] Figure 22B This is a plan view illustrating a counter electrode 223 formed on a substrate 100 by placing a second mask 500b on a second support portion 430 and then depositing a deposition material in a manufacturing method according to another embodiment of this disclosure. Figure 12B Components that are identical are indicated by the same reference numerals, and for the sake of brevity, their descriptions will not be repeated.
[0289] refer to Figure 22B When the second mask 500b is aligned on the substrate 100, some of the second main counter electrodes 223b can be formed to correspond to adjacent openings 530b. Because the deposited material passes through the adjacent openings 530b and is deposited on the substrate 100, some of the second main counter electrodes 223b can be formed uniformly. Therefore, the number of times the first main counter electrode 223a and the second main counter electrode 223b overlap each other can be reduced, and thus the thickness of the counter electrodes 223 can be substantially uniform.
[0290] Figure 23A This is a plan view showing a first mask 500a of an apparatus 400 for manufacturing a display device 1 according to another embodiment of the present disclosure. Figure 21A Components that are identical are indicated by the same reference numerals, and for the sake of brevity, their descriptions will not be repeated.
[0291] Reference Figure 23A The first rib portion 510a can be arranged in Figure 23AIt is spaced apart from the third rib portion 513a in the x-direction. Furthermore, the first mask opening portion 520a can be arranged in... Figure 23A They are spaced apart from each other in the x-direction. That is, each first mask opening portion 520a can be formed as a long side parallel to the first mask body portion 501a.
[0292] Figure 23B This is a plan view showing a portion of a counter electrode 223 formed on a substrate 100 by placing a first mask 500a on a second support portion 430 and then depositing a deposition material in a manufacturing method according to another embodiment of the present disclosure.
[0293] Reference Figure 23B This can form the first main counter electrode 223a. The first main counter electrode 223a and... Figure 21B The first main counter electrode 223a is the same as or similar to that in the previous one, and therefore its detailed description will not be given.
[0294] The first main counter electrode 223a can be arranged in... Figure 23B They are spaced apart from each other in the x-direction.
[0295] Figure 24A This is a plan view showing a second mask 500b of an apparatus 400 for manufacturing a display device 1 according to another embodiment of the present disclosure. Figure 22A Components that are identical are indicated by the same reference numerals, and for the sake of brevity, their descriptions will not be repeated.
[0296] Reference Figure 24A The second rib portion 510b can be arranged in... Figure 24A They are spaced apart from each other in the x-direction. Furthermore, the second mask opening portion 520b can be arranged in... Figure 24A They are spaced apart from each other in the x-direction. That is, each second mask opening portion 520b can be formed as a long side parallel to the second mask body portion 501b.
[0297] Figure 24B This is a plan view showing a counter electrode 223 formed on a substrate 100 by placing a second mask 500b on a second support portion 430 and then depositing a deposition material in a manufacturing method according to another embodiment of the present disclosure.
[0298] Reference Figure 24B The first main counter electrode 223a and the second main counter electrode 223b are with Figure 22B Those that are the same or similar, and therefore will not be given a detailed description.
[0299] The first main counter electrode 223a and the second main counter electrode 223b can be arranged in such a way that... Figure 24BThey are spaced apart from each other in the x-direction.
[0300] Based on a method for manufacturing a display device according to one or more embodiments of the present disclosure, a display device comprising a pixel portion and a transmissive portion may be manufactured, wherein the transmissive portion has improved light transmittance in a sensor region corresponding to a component such as a sensor, and therefore the component may be operated and an image may be formed in the region overlapping with the component.
[0301] Therefore, a method for manufacturing a display device with various suitable functions and improved quality can be provided. However, the above effects are merely examples, and the effects according to the embodiments are described in more detail throughout the specification.
[0302] It should be understood that the embodiments described herein should be considered merely descriptive and not for limiting purposes. Descriptions of features or aspects within each embodiment should generally be considered applicable to other similar features or aspects in other embodiments. While one or more embodiments have been described with reference to the accompanying drawings, those skilled in the art will understand that various changes in form and detail may be made herein without departing from the spirit and scope as defined by the appended claims and their equivalents.
Claims
1. A method for manufacturing a display device, the method comprising: Prepare a substrate, the substrate including a display area and a sensor area disposed in the display area; A plurality of first counter electrodes are formed on the substrate in the sensor region, wherein the plurality of first counter electrodes are spaced apart from each other and arranged in a first pattern; In the sensor region, a plurality of second counter electrodes are formed in a second pattern that is spaced apart from each other and arranged in a pattern different from the first pattern; as well as The first component of the display device is arranged to correspond to the sensor area.
2. The method according to claim 1, wherein: Each of the first counter electrode and the second counter electrode has a quadrilateral shape in the plan view.
3. The method according to claim 2, wherein: The corner portions of the first counter electrode and the second counter electrode overlap each other.
4. The method according to claim 1, wherein: The display area surrounds at least a portion of the sensor area.
5. The method according to claim 1, further comprising: When the first counter electrode is formed on the substrate, a plurality of third counter electrodes spaced apart from each other are formed in the display area.
6. The method according to claim 1, further comprising: When the second counter electrode is formed on the substrate, a plurality of fourth counter electrodes spaced apart from each other are formed in the display area.
7. The method according to claim 1, further comprising: When the first counter electrode is formed on the substrate, a plurality of third counter electrodes spaced apart from each other are formed in the display area; as well as When the second counter electrode is formed on the substrate, a plurality of fourth counter electrodes spaced apart from each other are formed on the substrate in the display area. Each of the plurality of fourth counter electrodes is arranged between adjacent third counter electrodes among the plurality of third counter electrodes.
8. The method according to claim 7, wherein: One of the third counter electrodes and the corresponding one of the fourth counter electrodes overlap at least partially with each other in the plan view.
9. The method according to claim 5, wherein: The plurality of third counter electrodes are formed adjacent to the sensor region.
10. The method according to claim 9, wherein: Some of the plurality of third counter electrodes have a striped shape.
11. The method according to claim 1, further comprising: When the first counter electrode is formed on the substrate, a plurality of third counter electrodes spaced apart from each other are formed in the display area, some of which have a stripe shape; as well as When the second counter electrode is formed on the substrate, a plurality of fourth counter electrodes spaced apart from each other are formed on the substrate in a portion of the display area. Each of the plurality of fourth counter electrodes is arranged between adjacent third counter electrodes among the plurality of third counter electrodes.
12. The method according to claim 11, wherein: One of the third counter electrodes and the corresponding one of the fourth counter electrodes overlap at least partially with each other in the plan view.
13. The method according to claim 11, wherein: The plurality of third counter electrodes are formed adjacent to the sensor region. In the display area, the planar area of one side portion of one of the fourth counter electrodes and the planar area of the other side portion of one of the fourth counter electrodes are different from each other.
14. A method of manufacturing a display device, the method comprising: An anti-electrode is formed on a substrate including the display area and the sensor area; An encapsulation portion is formed on the counter electrode; as well as A component is arranged for applying a signal through a transmission portion included in the sensor region. The formation of the counter electrode on the substrate including the display area and the sensor area includes: A first counter electrode is formed in the sensor region by using a first mask having a plurality of first openings in a first shielding portion corresponding to the sensor region, the plurality of first openings being arranged in a first pattern; and A second reverse electrode is formed by using a second mask having a plurality of second openings in a second shielding portion corresponding to the sensor region, the plurality of second openings being arranged in a second pattern different from the first pattern.
15. The method of claim 14, wherein: Each of the plurality of first opening portions and the plurality of second opening portions has a quadrilateral shape in the plan view.
16. The method of claim 14, wherein: The first counter electrode and the second counter electrode are adjacent to each other and at least partially overlap each other.
17. The method of claim 14, wherein: The first mask has a plurality of third opening portions spaced apart from each other in a third pattern to form a third counter electrode in the display area. At least one of the plurality of third opening portions is divided into two side portions by the first shielding portion.
18. The method of claim 17, wherein: The first mask has a long side and a short side. The plurality of third openings are formed parallel to the long side or the short side of the first mask.
19. The method of claim 14, wherein: The first mask has a plurality of third opening portions spaced apart from each other in a third pattern to form a plurality of third counter electrodes in the display area, and The second mask has a plurality of fourth opening portions spaced apart from each other in a fourth pattern to form a fourth counter electrode in the display area. The fourth counter electrode is arranged between adjacent third counter electrodes among the plurality of third counter electrodes.
20. The method of claim 17, wherein: Each of the plurality of third opening portions is divided into two parts by the first shielding portion.
21. The method of claim 14, wherein: The second mask has a plurality of fourth opening portions spaced apart from each other to form a fourth counter electrode in the display area. Wherein, the area of one of the plurality of fourth opening portions is different from the area of another of the plurality of fourth opening portions. The second mask includes a long side and a short side. Furthermore, an adjacent opening portion for forming a fifth counter electrode is provided in the portion adjacent to the long side or the short side of the second mask.
22. A method of manufacturing a display device, the method comprising: On a substrate including an opening region and a display region surrounding the opening region, a first counter electrode is formed in the display region by using a first mask; as well as A second counter electrode is formed in the display area by using a second mask; Each of the first mask and the second mask includes: The main body of the mask has an opening corresponding to the display area; The shielding portion is arranged within the opening portion to have a shape corresponding to the opening area and is configured to shield the deposited material; A first rib, connected to the shielding portion and the mask body portion, to span the opening portion in a first direction; and The second rib, spaced apart from the first rib, is connected to the shielding portion and to the mask body portion to span the opening portion in the first direction.
23. The method according to claim 22, wherein: The shielding portion of the first mask further includes: A third rib connects to the mask body portion to span the opening portion in the first direction; and A fourth rib, spaced apart from the third rib, is connected to the shielding portion and to the mask body portion to span the opening portion in the first direction.
24. The method of claim 22, wherein: The shielding portion of the first mask is adjacent to the main body portion of the mask.
25. The method according to claim 22, wherein: The opening portion of the first mask has multiple openings. The area of one of the plurality of openings is different from the area of another of the plurality of openings.
26. The method according to claim 22, wherein: The opening portion of the second mask is adjacent to the mask body portion, the first rib, and the second rib.