A three-dimensional Bluetooth antenna device and Bluetooth equipment

Abstract

The present invention is applicable to the technical field of Bluetooth antennas, and provides a Bluetooth antenna device and a Bluetooth device with a three-dimensional structure. The Bluetooth antenna device comprises: a multi-layer PCB substrate, provided with a first antenna reference ground and a second antenna reference ground; a first metal edging structure; the first antenna reference ground and the second antenna reference ground are connected via the first metal edging structure; a second metal edging structure; a third metal edging structure; a first antenna structure, comprising at least two antenna segments etched on the PCB substrate; in the first antenna structure, two adjacent antenna segments are connected via the second metal edging structure and the third metal edging structure; a second antenna structure, comprising an antenna segment etched on the PCB substrate; and a via having conductor characteristics; the first antenna structure is connected to the second antenna structure via the via. The Bluetooth antenna device has the advantages of small structure volume, low cost, good parameter consistency, strong anti-electromagnetic interference capability, etc.

Description

Technical Field

[0001] The present invention belongs to the technical field of Bluetooth antennas, and in particular relates to a Bluetooth antenna device and a Bluetooth equipment with a three-dimensional structure. Background Art

[0002] Bluetooth antenna technology is a widely used, low-cost, low-power wireless communication technology that operates in the 2.4GHz frequency band.

[0003] Among them, Bluetooth headsets are a type of consumer audio product that uses Bluetooth antenna technology to wirelessly transmit voice, music, and related data to related smart devices; and the antenna is an important component in Bluetooth headsets for transmitting and receiving electromagnetic waves; from the perspective of structural type and application materials, commonly used antennas include the following types: LDS (laser) antennas, FPC antennas, ceramic antennas, and PCB board-mounted antennas; and LDS antennas, FPC antennas, and ceramic antennas require collaborative processing and production in different factories due to structural and material factors, and collaboration between different manufacturers will inevitably lead to uncertainty in quality and delivery time, and will also cause costs to rise.

[0004] Nowadays, the sales volume of Bluetooth headsets has shown explosive growth due to their portability, aesthetics and flexibility. Similarly, in order to meet the needs of market consumption, the appearance design of Bluetooth headsets is becoming more and more beautiful, smaller and more diversified in functions; and the miniaturization of the headset appearance will inevitably reduce the area of ​​PCB. The reduction of PCB area and the diversification of functions will lead to increased power consumption of related circuits due to electromagnetic interference, and noise during music playback and calls; similarly, electromagnetic interference will also change the RF parameters of Bluetooth antennas, which will affect the reduction of the communication connection distance between Bluetooth headsets and related smart devices, and the reduction of communication connection quality, thereby affecting the stability and reliability of the product.

[0005] In addition, Bluetooth headsets are constructed from different devices. According to the requirements of the usage scenarios of Bluetooth headsets, the Bluetooth antenna needs to be designed to meet the omnidirectional or multi-directional nature of the antenna. Therefore, devices with conductive properties are prohibited from being placed within a short range near the Bluetooth antenna and the RF signal loop, so as to ensure that the Bluetooth radio frequency signal can be effectively transmitted / received. This is the RF "clearance area" mentioned by some communication terminals and communication equipment. In the application of general Bluetooth products, based on the performance and parameter requirements of the Bluetooth antenna, devices with conductive properties cannot be placed within a minimum clearance area of ​​5mm around the Bluetooth antenna. The components of the Bluetooth headset, such as the battery, speaker, button, microphone, battery welding wire, and copper foil on the PCB, are all devices with conductive properties. These devices are placed in a limited structural space, which poses a harsh challenge to the design and development of the Bluetooth antenna. This is also a technical difficulty that many Bluetooth headset manufacturers need to solve urgently.

[0006] To this end, a design method that is different from the existing Bluetooth headset-related circuits and antenna structures is needed to reduce the electromagnetic interference of the related circuits while improving the antenna's radiation power, radiation efficiency, radiation directivity and consistency of related RF parameters, thereby achieving the reliability and stability of the Bluetooth headset. Summary of the invention

[0007] The purpose of the embodiments of the present invention is to provide a three-dimensional Bluetooth antenna device, aiming to solve the problems raised in the background technology.

[0008] The embodiment of the present invention is implemented as follows: a three-dimensional Bluetooth antenna device includes a PCB substrate with at least two layers of structure, wherein the top layer and the bottom layer of the PCB substrate are both provided with a first antenna reference ground and a second antenna reference ground; the Bluetooth antenna device also includes:

[0009] A first metal edging structure is provided on one side of the PCB substrate; the first antenna reference ground and the second antenna reference ground are connected via the first metal edging structure;

[0010] The second metal edging structure is arranged on the other side of the PCB substrate;

[0011] A third metal edging structure is arranged on the same side of the PCB substrate as the second metal edging structure;

[0012] A first antenna structure is arranged between the first antenna reference ground and the second antenna reference ground, and comprises at least two antenna line segments having conductor characteristics and etched on the top layer or the bottom layer of the PCB substrate; two adjacent antenna line segments etched on the top layer or the bottom layer of the PCB substrate are connected via the second metal edging structure and the third metal edging structure;

[0013] The second antenna structure is arranged between the first antenna reference ground and the second antenna reference ground, and includes an antenna line segment with conductor characteristics and etched on the bottom layer or top layer of the PCB substrate; and a via hole with conductor characteristics, which is arranged on the PCB substrate; the first antenna structure is connected to the second antenna structure through the via hole.

[0014] As a preferred solution of an embodiment of the present invention, the first antenna structure includes:

[0015] A first antenna line segment having conductor characteristics is etched on the top layer or the bottom layer of the PCB substrate and is parallel to the first antenna reference ground;

[0016] A second antenna segment with conductor characteristics is etched on the top layer or bottom layer of the PCB substrate and is an "n" type structure; one end of the second antenna segment is connected to the first antenna segment through the second metal edging structure; and a third antenna segment with conductor characteristics is etched on the top layer or bottom layer of the PCB substrate and is parallel to the second antenna reference ground; the third antenna segment is connected to the other end of the second antenna segment through the third metal edging structure.

[0017] As another preferred solution of the embodiment of the present invention, the first antenna structure further includes:

[0018] A short-circuit line segment with conductor characteristics is etched on the top layer or bottom layer of the PCB substrate and connected to the first antenna segment; and an antenna feeding end is arranged on the top layer or bottom layer of the PCB substrate and connected to the first antenna segment.

[0019] As another preferred solution of the embodiment of the present invention, the second antenna structure includes:

[0020] The fourth antenna line segment with conductor characteristics is etched on the bottom layer or top layer of the PCB substrate and has an "S"-shaped structure.

[0021] As another preferred solution of the embodiment of the present invention, the PCB substrate comprises:

[0022] A first PCB layer, a fourth PCB layer, and a first PCB inner layer and a second PCB inner layer arranged between the first PCB layer and the fourth PCB layer; a positive power supply line segment with conductor characteristics is etched on the first PCB layer, a positive signal line segment with conductor characteristics is etched on the first PCB inner layer, and a negative signal line segment with conductor characteristics is etched on the second PCB inner layer.

[0023] As another preferred solution of the embodiment of the present invention, a power negative electrode pad, a power positive electrode pad, a signal line positive electrode pad and a signal line negative electrode pad are provided on the reference ground of the second antenna.

[0024] As another preferred solution of the embodiment of the present invention, the thickness of the PCB substrate is 0.6-1 mm.

[0025] As another preferred solution of the embodiment of the present invention, the Bluetooth antenna device further includes:

[0026] A passive element with inductance or capacitance characteristics is placed between the first antenna reference ground and the first antenna structure.

[0027] As another preferred solution of the embodiment of the present invention, the passive component includes:

[0028] A first pin of a passive component having inductance or capacitance characteristics is placed on the first antenna reference ground;

[0029] The second pin of the passive component having inductance or capacitance characteristics is placed on the first antenna structure.

[0030] Another object of an embodiment of the present invention is to provide a Bluetooth device, which includes a micro control unit, a power supply device and the above-mentioned Bluetooth antenna device.

[0031] In the present invention, the "three-dimensional" in the three-dimensional structure of the Bluetooth antenna device refers to the use of X, Y, and Z coordinate axes to describe the directions of all related antenna segments set on the PCB substrate in the structure of the overall structure of the antenna, wherein the X axis refers to the antenna length in the antenna structure indicated between the first antenna reference ground and the second antenna reference ground; wherein the Y axis refers to the antenna width in the antenna structure indicated between the two sides of the PCB; and wherein the Z axis refers to the thickness of the PCB substrate, and also refers to the width of the related antenna segments in the complete antenna structure constructed on one side of the PCB substrate using the metal edging process.

[0032] A three-dimensional Bluetooth antenna device provided by an embodiment of the present invention has the advantages of small structure volume, low cost, good parameter consistency, strong anti-electromagnetic interference capability, etc. Specifically, the embodiment of the present invention can connect the first antenna reference ground and the second antenna reference ground by setting a first metal edging structure on one side of the PCB substrate, thereby increasing the antenna reference ground area of ​​the entire Bluetooth antenna device, so that it can be used as an electromagnetic shielding ground wire while serving as a negative power supply, so as to enhance the electromagnetic anti-interference capability of the circuit in the Bluetooth antenna device. In addition, the embodiment of the present invention can connect multiple antenna segments in the first antenna structure by setting a second metal edging structure and a third metal edging structure on the other side of the PCB substrate, thereby increasing the resonance length of the antenna in a limited structural space, and further reducing the overall size of the Bluetooth antenna device. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] Figure 1 This is a schematic diagram of the overall structure of a three-dimensional Bluetooth antenna device provided by an embodiment of the present invention.

[0034] Figure 2 A schematic structural diagram of a first layer of a PCB of a three-dimensional Bluetooth antenna device provided by an embodiment of the present invention.

[0035] Figure 3 A schematic structural diagram of the fourth layer of a PCB of a three-dimensional Bluetooth antenna device provided by an embodiment of the present invention.

[0036] Figure 4 A schematic structural diagram of one side surface of a three-dimensional Bluetooth antenna device provided by an embodiment of the present invention.

[0037] Figure 5 A schematic structural diagram of another side surface of a three-dimensional Bluetooth antenna device provided by an embodiment of the present invention.

[0038] Figure 6 A schematic diagram of the structural dimensions of the first layer of a PCB of a three-dimensional Bluetooth antenna device provided by an embodiment of the present invention.

[0039] Figure 7 A schematic diagram of the structural dimensions of the fourth layer of a PCB of a three-dimensional Bluetooth antenna device provided by an embodiment of the present invention.

[0040] Figure 8 A schematic diagram of a four-layer PCB structure of a three-dimensional Bluetooth antenna device provided by an embodiment of the present invention;

[0041] In the figure: 1-first antenna reference ground, 2-passive component, 3-antenna feeding end, 4-via, 5-first metal edging line segment, 6-second metal edging line segment, 7-third metal edging line segment, 8-positive power line segment, 11-first layer of PCB, 12-inner layer one of PCB, 13-inner layer two of PCB, 14-fourth layer of PCB, 20-first pin of passive component, 21-second pin of passive component, 101-second antenna reference ground, 102-negative power pad, 103-positive power pad, 104-positive signal line pad, 105-negative signal line pad, 201-short circuit segment, 202-first antenna line segment, 203-second antenna line segment, 204-third antenna line segment, 205-fourth antenna line segment, 801-positive signal line segment, 802-negative signal line segment. DETAILED DESCRIPTION

[0042] In order to make the purpose, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0043] In addition, in the description of this application, the terms used should be understood in a broad sense, and for those skilled in the art, the specific meanings of the terms can be understood according to the actual specific circumstances. For example, the terms "set" and "provided with" used in this application can be defined as contact setting or non-contact setting, etc.; the terms "connect" and "connected" used can be defined as mechanical connection or electrical connection; the directional terms used are all based on the drawings as a reference or the directions defined according to the actual situation and common knowledge.

[0044] As attached Figure 1 As shown, an embodiment of the present invention provides a three-dimensional Bluetooth antenna device, which includes a PCB substrate with at least two layers of structure, wherein the top layer and the bottom layer of the PCB substrate are both provided with a first antenna reference ground 1 and a second antenna reference ground 101; the Bluetooth antenna device also includes:

[0045] A first metal edging structure is provided on one side of the PCB substrate; the first antenna reference ground 1 and the second antenna reference ground 101 are connected via the first metal edging structure;

[0046] A second metal edging structure is arranged on the other side of the PCB substrate;

[0047] A third metal edging structure is arranged on the same side of the PCB substrate as the second metal edging structure;

[0048] A first antenna structure is arranged between the first antenna reference ground 1 and the second antenna reference ground 101, and comprises at least two antenna line segments having conductor characteristics and etched on the top layer or the bottom layer of the PCB substrate; two adjacent antenna line segments etched on the top layer or the bottom layer of the PCB substrate are connected via the second metal edging structure and the third metal edging structure;

[0049] A second antenna structure, disposed between the first antenna reference ground 1 and the second antenna reference ground 101, comprising an antenna line segment having conductor characteristics and etched on the bottom layer or the top layer of the PCB substrate; and

[0050] A via hole 4 having conductor characteristics is arranged on the PCB substrate; the first antenna structure is connected to the second antenna structure through the via hole 4.

[0051] In practical applications, the PCB substrate can be formed by stacking multiple layers of dielectric materials. After the multiple layers of dielectric materials are stacked, the two sides can be packaged by a metal edging process to form a first metal edging structure and a second metal edging structure. Specifically, the PCB substrate can be made of FR4. In addition, in the present invention, all types of line segments mentioned (including the following embodiments) refer to copper foils etched on the PCB substrate with conductor characteristics and different lengths and widths. The top and bottom layers of the PCB substrate are both provided with a first antenna reference ground 1 and a second antenna reference ground 101 with the same structure. The first antenna reference ground 1 and the second antenna reference ground 101 are respectively arranged at the two ends of the top or bottom layer of the PCB substrate, and the middle part of the top or bottom layer of the PCB substrate is used to set the first antenna structure or the second antenna structure. The via 4 runs through the PCB substrate, and its hole wall is metallized to facilitate the connection of the first antenna structure and the second antenna structure of the upper and lower layers. Specifically, it can be processed by the copper plating process of the prior art.

[0052] Specifically, as attached Figure 5 As shown, the first metal-metal edging structure includes a first metal-edging line segment 5, which is arranged on one of the side surfaces of the PCB substrate; the first antenna reference ground 1 and the second antenna reference ground 101 at both ends of the top layer and the bottom layer of the PCB substrate are connected through the first metal-edging line segment 5, so as to increase the overall antenna reference ground area of ​​the Bluetooth antenna device and enhance the electromagnetic anti-interference capability of the circuit of the Bluetooth antenna device.

[0053] The embodiment of the present invention can connect the first antenna reference ground 1 and the second antenna reference ground 101 by setting a first metal edging structure on one side of the PCB substrate, thereby increasing the antenna reference ground area of ​​the entire Bluetooth antenna device, so that it can be used as an electromagnetic shielding ground wire while serving as a negative power supply, so as to enhance the electromagnetic anti-interference capability of the circuit in the Bluetooth antenna device. In addition, the embodiment of the present invention can connect multiple antenna line segments in the first antenna structure by setting a second metal edging structure on the other side of the PCB substrate, thereby increasing the resonant length of the antenna in a limited structural space, thereby reducing the overall size of the Bluetooth antenna device.

[0054] As shown in the attached picture Figure 1 , Figure 2 and Figure 4 As shown, in a preferred embodiment of the present invention, the second metal edging structure includes a second metal edging line segment 6 arranged on one side of the PCB substrate, the third metal edging structure includes a third metal edging line segment 7 arranged on one side of the PCB substrate, and the second metal edging line segment 6 and the third metal edging line segment 7 are located on the same side; the first antenna structure includes:

[0055] A first antenna line segment 202 having conductor characteristics, etched on the top layer or bottom layer of the PCB substrate, and parallel to the first antenna reference ground 1;

[0056] A second antenna segment 203 with conductor characteristics is etched on the top layer or bottom layer of the PCB substrate and is an "n" type structure; one end of the second antenna segment 203 is connected to the first antenna segment 202 through the second metal cladding segment 6; and a third antenna segment 204 with conductor characteristics is etched on the top layer or bottom layer of the PCB substrate and is parallel to the second antenna reference ground 101; the third antenna segment 204 is connected to the other end of the second antenna segment 203 through the third metal cladding segment 7.

[0057] Specifically, the first antenna segment 202, the second antenna segment 203 and the third antenna segment 204 can all be etched on the top layer of the PCB substrate, and are all located between the first antenna reference ground 1 and the second antenna reference ground 101 on the top layer of the PCB substrate; by providing the first antenna segment 202, the second antenna segment 203 and the third antenna segment 204, and connecting these antenna segments by using the second metal cladding segment 6 and the third metal cladding segment 7 provided on the side of the PCB substrate, the resonant length of the antenna can be increased to a large extent within a limited structural space, so that the overall structural size of the Bluetooth antenna device can be designed to be smaller while ensuring that the resonant length of the antenna is long enough (that is, the requirements of the antenna's radio frequency parameters, etc. can be met), so as to reduce the space occupied by the Bluetooth antenna device in the Bluetooth device.

[0058] As shown in the attached picture Figure 1 , Figure 2 and Figure 4 As shown, in another preferred embodiment of the present invention, the first antenna structure further includes:

[0059] A short-circuit line segment 201 with conductor characteristics is etched on the top layer or bottom layer of the PCB substrate and connected to the first antenna segment 202; and an antenna feeding terminal 3 is arranged on the top layer or bottom layer of the PCB substrate and connected to the first antenna segment 202.

[0060] Specifically, the short-circuit line segment 201 can be etched on the top layer of the PCB substrate, and is perpendicular to the first antenna line segment 202; the antenna feed end 3 can also be etched on the top layer of the PCB substrate, and is also perpendicular to the first antenna line segment 202, and is arranged on the same PCB layer as the short-circuit line segment 201 and the first antenna line segment 202. The antenna feed end 3, the short-circuit line segment 201, the first antenna line segment 202, the second metal-clad line segment 6, the second antenna line segment 203, the third metal-clad line segment 7 and the third antenna line segment 204 form a complete first antenna structure. In addition, the characteristic impedance of the antenna feed end 3 can be designed to be 50 ohms.

[0061] As attached Figure 3 As shown, in another preferred embodiment of the present invention, the second antenna structure includes:

[0062] The fourth antenna line segment 205 having conductor characteristics is etched on the bottom layer or top layer of the PCB substrate and has an "S"-shaped structure.

[0063] Specifically, the fourth antenna segment 205 can be etched on the bottom layer of the PCB substrate, and is located between the first antenna reference ground 1 and the second antenna reference ground 101 on the bottom layer of the PCB substrate, and one end of the fourth antenna segment 205 is connected to one end of the third antenna segment 204 on the top layer of the PCB substrate through a via 04, so as to connect the first antenna structure with the second antenna structure to form a complete antenna resonance length.

[0064] As attached Figure 3 As shown, in another preferred embodiment of the present invention, the PCB substrate comprises:

[0065] A PCB first layer 11, a PCB fourth layer 14, and a PCB inner layer one 12 and a PCB inner layer two 13 arranged between the PCB first layer 11 and the PCB fourth layer 14; a power positive electrode line segment 8 with conductor characteristics is etched on the PCB first layer 11, a signal line positive electrode 801 with conductor characteristics is etched on the PCB inner layer one 12, and a signal line negative electrode 802 with conductor characteristics is etched on the PCB inner layer two 13.

[0066] Specifically, the first PCB layer 11 is the top layer of the PCB substrate described in the above embodiment; the first PCB layer 12 and the second PCB layer 13 are the inner layers of the PCB substrate described in the above embodiment; the fourth PCB layer 14 is the bottom layer of the PCB substrate described in the above embodiment; in this embodiment, the first PCB layer 12 and the second PCB layer 13 are respectively arranged between the first PCB layer 11 and the fourth PCB layer 14; in addition, the positive power line segment 8 can be etched on the first PCB layer 11 and located on one side of the first antenna structure; the positive signal line segment 801 and the negative signal line segment 802 are respectively etched on the first PCB layer 12 (second layer) and the second PCB layer 13 (third layer), which can be used as connecting line segments for signal lines such as microphones to increase the function of the Bluetooth antenna device circuit. In addition, the second antenna reference ground 101 on the first PCB layer 11 (top layer) is also provided with a negative power pad 102, a positive power pad 102, a positive signal pad 104 and a negative signal pad 105 in sequence.

[0067] As shown in the attached picture Figure 4 , Figure 5 , Figure 8 As shown, in another preferred embodiment of the present invention, the total thickness of the PCB substrate (i.e. Figure 4 , Figure 5 , Figure 8 PCB_H) is 0.6-1 mm, preferably 0.8 mm, but not limited thereto.

[0068] in addition, Figure 6 , Figure 7 ANT_L refers to the length of the space occupied by the first antenna structure and the second antenna structure, which can be designed to be 5 mm, but not limited to this; ANT_W refers to the width of the space occupied by the first antenna structure and the second antenna structure, which can be designed to be 4.9 mm, but not limited to this; ANT_FB refers to the length of the antenna feed terminal 3, which can be designed to be 1.2-1.3 mm, but not limited to this; ANT_S refers to the distance between the antenna feed terminal 3 and the second pin 21, which can be designed to be 1.7-1.9 mm, but not limited to this; ANT_L0 refers to the length of the third antenna segment 204, which can be designed to be 3.0-3.5 mm, but not limited to this; ANT_LS0 refers to the length of the second metal edging segment 6, which can be designed to be 1.5-1.7 mm, but not limited to this; ANT_LS1 refers to the length of the third metal edging segment 7, which can be designed to be 1.5-1.7 mm, but not limited to this.

[0069] Figure 7ANT_BL refers to the length of the fourth antenna segment 205, which can be designed to be 3.0 to 3.1 mm, but not limited thereto; ANT_BH refers to the width of the fourth antenna segment 205, which can be designed to be 2.9 to 3.0 mm, but not limited thereto; ANT_VIA refers to the diameter of the via 4, which can be designed to be 0.2 to 0.35 mm, but not limited thereto.

[0070] According to the attached Figure 4 , Figure 6 and Figure 7 It can be seen from the size design that the total size of the first antenna structure and the second antenna structure of the Bluetooth antenna device provided by the embodiment of the present invention can be designed to be 5mm×4.9mm×0.8mm, but is not limited thereto;

[0071] The structural size of the three-dimensional Bluetooth PCB antenna is only one-fourth of the space occupied by the PCB board-mounted antenna in the prior art (for example, the invention patent on Bluetooth headset antenna disclosed in application number: CN201610540958).

[0072] As attached Figure 1 and Figure 4 As shown, in another preferred embodiment of the present invention, the Bluetooth antenna device further includes:

[0073] A passive element 2 having inductance or capacitance characteristics is arranged between the first antenna reference ground 1 and the first antenna structure.

[0074] Specifically, the passive component 2 includes:

[0075] A first pin 20 of a passive component having inductance or capacitance characteristics is disposed on the first antenna reference ground 1;

[0076] The second pin 21 of a passive component having inductance or capacitance characteristics is disposed on the first antenna structure.

[0077] Specifically, the passive component first pin 20 and the passive component second pin 21 can be arranged on the top layer of the PCB substrate. By arranging the passive component 2 with the first pin 20 and the second pin 21 between the first antenna reference ground 1 and the first antenna structure, the L / C (inductance / capacitance) parameter can be adjusted for the change of antenna characteristic parameters caused by the plate material and process differences of the PCB to meet the radiation efficiency and directivity of the antenna, and the passive component 2 can also be used to optimize the parameters to further reduce the area occupied by the antenna structure.

[0078] In another embodiment of the present invention, a Bluetooth device is provided, which includes a micro control unit, a power supply device and the above-mentioned Bluetooth antenna device.

[0079] Specifically, the Bluetooth device can be a Bluetooth headset or a Bluetooth speaker, etc., which may also include circuit structures such as an antenna impedance matching circuit, an RF signal loop, an audio loop, and components such as a speaker, a button, and a microphone, but is not limited thereto.

[0080] In summary, the Bluetooth antenna device provided in the embodiment of the present invention can be applied to Bluetooth headsets. It has an ultra-small PCB-mounted monopole Bluetooth antenna with three-dimensional structural characteristics. Compared with PCB-mounted antennas with the same structural characteristics on the current market, it has the advantages of small structure volume, low cost, good parameter consistency, and strong anti-electromagnetic interference capability.

[0081] According to electromagnetic field theory and actual application experience, in Bluetooth devices, only when the length of the antenna is equal to 1 / 4 wavelength, the radiation intensity and radiation efficiency of the antenna are in the optimal state, which can effectively achieve the reliability, stability and consistency of Bluetooth headset products. In the actual production and assembly process of Bluetooth headsets, it is found that any component with conductive characteristics near the effective no-go zone of the PCB antenna onboard antenna will seriously affect the characteristic impedance of the antenna, thereby affecting the radiation directivity and radiation efficiency of the antenna, thus leading to the production yield of Bluetooth headsets and affecting the reliability and stability of Bluetooth headsets.

[0082] With regard to the above technical problems, the present invention creatively performs metallization edging process on line segments of different lengths and widths at relevant positions on both sides of the PCB substrate to form antenna line segments with conductor characteristics in which a portion of the overall antenna length is included; at the same time, according to the design rules of the antenna structure, the antenna conductors are respectively etched on the copper foils of the top layer and the bottom layer of the PCB substrate; after completing the production and processing of the above two steps, the antenna conductors of the top layer and the bottom layer and the related conductors of the edging metallization process on both sides of the PCB substrate are completely connected through metallized vias to construct a Bluetooth PCB onboard antenna that fully meets the antenna design parameters; at the same time, without affecting the relevant parameters of the Bluetooth antenna, four line segments with the same width and different lengths can be placed on each layer of the multi-layer PCB substrate to serve as power lines, microphone and other signal lines of the circuit, thereby increasing the functionality of the circuit.

[0083] The above-mentioned embodiments only express several implementation methods of the present invention, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the patent of the present invention. It should be pointed out that, for ordinary technicians in this field, several variations and improvements can be made without departing from the concept of the present invention, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the patent of the present invention shall be subject to the attached claims.

Claims

1. A three-dimensional Bluetooth antenna device, comprising a PCB substrate having at least two layers, characterized in that: The top layer and the bottom layer of the PCB substrate are both provided with a first antenna reference ground and a second antenna reference ground; the Bluetooth antenna device further comprises: A first metal edging structure is provided on one side of the PCB substrate; the first antenna reference ground and the second antenna reference ground are connected via the first metal edging structure; A second metal edging structure is arranged on the other side of the PCB substrate; A third metal edging structure is arranged on the same side of the PCB substrate as the second metal edging structure; A first antenna structure is arranged between the first antenna reference ground and the second antenna reference ground, and comprises at least two antenna line segments having conductor characteristics and etched on the top layer or the bottom layer of the PCB substrate; two adjacent antenna line segments etched on the top layer or the bottom layer of the PCB substrate are connected through the second metal edging structure and the third metal edging structure; a second antenna structure, disposed between the first antenna reference ground and the second antenna reference ground, comprising an antenna line segment having conductor characteristics and etched on a bottom layer or a top layer of the PCB substrate; and A via having conductor characteristics is provided on the PCB substrate; the first antenna structure is connected to the second antenna structure through the via; The first antenna structure comprises: A first antenna line segment having conductor characteristics, etched on the top layer or the bottom layer of the PCB substrate, and parallel to the first antenna reference ground; a second antenna segment with conductor characteristics, etched on the top layer or bottom layer of the PCB substrate and having an "n" type structure; one end of the second antenna segment is connected to the first antenna segment via a second metal edging structure; and a third antenna segment with conductor characteristics, etched on the top layer or bottom layer of the PCB substrate and parallel to the second antenna reference ground; the other end of the third antenna segment is connected to the second antenna segment via the third metal edging structure; a short-circuit line segment with conductor characteristics, etched on the top layer or the bottom layer of the PCB substrate and connected to the first antenna segment; and an antenna feed end, arranged on the top layer or the bottom layer of the PCB substrate and connected to the first antenna segment; The second antenna structure comprises: The fourth antenna line segment with conductor characteristics is etched on the bottom layer or top layer of the PCB substrate and has an "S"-shaped structure.

2. The three-dimensional Bluetooth antenna device according to claim 1, characterized in that: The PCB substrate comprises: The first layer of PCB, the fourth layer of PCB, and the first inner layer of PCB and the second inner layer of PCB arranged between the first layer of PCB and the fourth layer of PCB; the first layer of PCB is etched with a positive power supply line segment with conductor characteristics, the first inner layer of PCB is etched with a positive signal line with conductor characteristics, and the second inner layer of PCB is etched with a negative signal line with conductor characteristics.

3. The three-dimensional Bluetooth antenna device according to claim 1, characterized in that: The second antenna reference ground is provided with a power supply negative electrode pad, a power supply positive electrode pad, a signal line positive electrode pad and a signal line negative electrode pad.

4. The three-dimensional Bluetooth antenna device according to claim 1, characterized in that: The thickness of the PCB substrate is 0.6-1 mm.

5. A three-dimensional Bluetooth antenna device according to any one of claims 1 to 4, characterized in that: The Bluetooth antenna device also includes: A passive element with inductance or capacitance characteristics is placed between the first antenna reference ground and the first antenna structure.

6. The three-dimensional Bluetooth antenna device according to claim 5, characterized in that: The passive components include: A first pin of a passive component having inductance or capacitance characteristics is placed on the first antenna reference ground; The second pin of the passive component having inductance or capacitance characteristics is placed on the first antenna structure.

7. A Bluetooth device, comprising a micro control unit and a power supply device, characterized in that: It also includes the Bluetooth antenna device according to any one of claims 1 to 6.

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