Combination component, display module and method for manufacturing display device

Abstract

Provided are a method for manufacturing a display device, a display module, and a bonding component. The method for manufacturing a display device comprises: a step of preparing a bonding component, the bonding component comprising a bonding layer, a first protective film disposed on the upper portion of the bonding layer and having a light absorption pattern formed thereon, and a second protective film disposed on the lower portion of the bonding layer; a step of peeling off the second protective film to attach a display panel to one side of the bonding layer; and a step of forming a through hole that penetrates the bonding layer, the first protective film, and the display panel in a region having the light absorption pattern formed thereon.

Description

Technical Field

[0001] The present invention relates to an adhesion member, a display module and a method for manufacturing a display device. Background Art

[0002] The display device is a device for displaying an image, including a display panel such as an organic light emitting display panel or a liquid crystal display panel. The display device may include a window portion for protecting the display panel from external impact. In particular, the window portion is widely used in portable electronic devices such as smart phones.

[0003] In recent years, research has been conducted on reducing the frame area by providing holes in the active area to install cameras, infrared sensors, etc. On the other hand, in the process of providing holes, if the holes are formed simultaneously in the display panel and the inter-module bonding layer attached to the display panel and the window, there is a possibility that insufficient heat energy is transferred to the inter-module bonding layer, causing poor adhesion of foreign matter. Summary of the invention

[0004] The problem to be solved by the present invention is to provide a bonding component which can prevent the occurrence of adhesion foreign matter defects in the bonding layer between modules in the hole process when applied to a display module.

[0005] Another problem to be solved by the present invention is to provide a display module which uses the above-mentioned bonding component to prevent the bonding failure of foreign matter in the bonding layer between modules.

[0006] Another problem to be solved by the present invention is to provide a method for manufacturing a display device capable of preventing adhesion failure of foreign matter in a bonding layer between modules.

[0007] The subject matter of the present invention is not limited to the above-mentioned contents, and those skilled in the art should be able to understand other technical subjects not mentioned through the following basic description.

[0008] A method for manufacturing a display device involved in one embodiment for solving the above-mentioned problem includes: a step of preparing a bonding component, the bonding component including a bonding layer, a first protective film arranged on the upper part of the bonding layer and formed with a light absorption pattern, and a second protective film arranged on the lower part of the bonding layer; a step of peeling off the second protective film to attach a display panel to one side of the bonding layer; and a step of forming a through hole that penetrates the bonding layer, the first protective film and the display panel in the area where the light absorption pattern is formed.

[0009] A size of the light absorption pattern on a plane may be equal to or greater than a size of the through hole on a plane.

[0010] The light absorption pattern may be formed on the entire surface of the first protective film.

[0011] The step of forming the through hole may be performed using an ultraviolet laser.

[0012] The light absorption pattern may include an ultraviolet absorption pattern that absorbs light in an ultraviolet band.

[0013] In the step of preparing the bonding member, the light absorption pattern may be formed on one surface of the first protective film that contacts the bonding layer or on the other surface that is opposite to the one surface.

[0014] The light absorption pattern may be directly coated on the one side or the other side of the first protective film.

[0015] The light absorption pattern may be formed inside the first protection film on a plane.

[0016] The light absorption pattern may also be formed along an edge of the first protection film.

[0017] After forming the through hole, the method may further include peeling off the first protective film and attaching a window portion to the bonding layer from which the first protective film has been peeled off.

[0018] Another embodiment for solving the above-mentioned problem involves a display module comprising: a display panel; a first inter-module bonding layer, arranged on the upper surface of the display panel; and a protective film, arranged on the upper surface of the first inter-module bonding layer, wherein a light absorption pattern is arranged on one side or the other side of the protective film, and the display panel, the first inter-module bonding layer and the protective film comprise through holes extending in the thickness direction, and the light absorption pattern is located around the through holes in a plane.

[0019] The light absorption pattern may be directly disposed on the one surface or the other surface of the protective film.

[0020] The light absorption pattern may include an ultraviolet absorption pattern that absorbs light in an ultraviolet band.

[0021] The light absorption pattern may be arranged inside the protective film in a planar manner and may have a ring shape in a planar manner.

[0022] The display panel may include: a substrate; a display component, including a light-emitting layer configured on the substrate; an optical film, configured on the upper part of the display component; and a second inter-module bonding layer, bonding the display component and the optical film, and the thickness of the first inter-module bonding layer may be greater than the thickness of the second inter-module bonding layer.

[0023] The optical film may include a polarizing film.

[0024] A bonding member according to another embodiment for solving the above-mentioned problem includes: a bonding layer; a first protective film disposed on an upper portion of the bonding layer and having a light absorption pattern; and a second protective film disposed on a lower portion of the bonding layer.

[0025] The light absorption pattern may be disposed on one surface of the first protective film that is in contact with the bonding layer or on the other surface that is opposite to the one surface.

[0026] The light absorption pattern may be formed inside the first protection film on a plane.

[0027] The light absorption pattern may also be arranged along an edge of the first protective film.

[0028] Details of other embodiments are included in the detailed description and accompanying drawings.

[0029] (Effects of the Invention)

[0030] According to one embodiment, a light absorbing pattern is formed on a protective film disposed on one side of the inter-module bonding layer. Therefore, even if holes are formed in the display panel and the inter-module bonding layer at the same time, sufficient heat energy can be transferred to the inter-module bonding layer, thereby preventing foreign matter defects in the inter-module bonding layer from occurring.

[0031] The effects of each embodiment are not limited to the above examples, and more effects are included in this specification. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] Figure 1 is a three-dimensional diagram of a display device according to an embodiment.

[0033] Figure 2 yes Figure 1 An exploded perspective view of a display device.

[0034] Figure 3 It is along Figure 2 A cross-sectional view taken along line III-III'.

[0035] Figure 4 It is an exploded perspective view of a display module according to an embodiment.

[0036] Figure 5 It is along Figure 4 A cross-sectional view taken along the V-V' line.

[0037] Figure 6 It is a three-dimensional view of a coupling component involved in one embodiment.

[0038] Figure 7 It is along Figure 6 A cross-sectional view taken along line VII-VII'.

[0039] Figure 8 It is a sequence diagram of a method for manufacturing a display device according to an embodiment.

[0040] Figures 9 to 12 It is a cross-sectional view according to the process steps of a method for manufacturing a display device involved in an embodiment.

[0041] Fig.13 is a cross-sectional view of a display module according to another embodiment.

[0042] Fig.14 is a cross-sectional view of a coupling component according to another embodiment.

[0043] Fig.15 is a cross-sectional view of a display module according to yet another embodiment.

[0044] Fig.16 It is a perspective view of a coupling component according to still another embodiment.

[0045] Fig.17 is a cross-sectional view of a display module according to yet another embodiment.

[0046] Fig.18 It is a cross-sectional view showing a state of manufacturing a display module according to still another embodiment.

[0047]

Explanation of symbols

[0048] 1: display device; 10: display module; 100: display panel; 300: combining component; 500: window portion. DETAILED DESCRIPTION

[0049] The advantages, features and methods of achieving these advantages and features of the present invention will be apparent from the accompanying drawings. Figure 1 However, the present invention is not limited to the embodiments disclosed below, and can be implemented in many different ways. This embodiment only makes the disclosure of the present invention complete and fully conveys the scope of the invention to those skilled in the art of the present invention. The present invention is defined only by the scope of the claims.

[0050] Elements or layers being "on" other elements or layers include not only being directly above other elements, but also including the case where other layers or other elements are sandwiched between the two. The same symbols throughout the specification represent the same constituent elements.

[0051] The terms first, second, etc. are used to describe various components, but such components are certainly not limited to these terms. These terms are used only to distinguish one component from other components. Therefore, the first component mentioned below can also be the second component within the technical concept of the present invention.

[0052] Hereinafter, embodiments will be described with reference to the drawings.

[0053] Figure 1 is a three-dimensional diagram of a display device according to an embodiment, Figure 2 yes Figure 1 An exploded perspective view of a display device, Figure 3 It is along Figure 2 A cross-sectional view taken along line III-III'.

[0054] In each embodiment, the first direction DR1 and the second direction DR2 are different directions and are directions that intersect each other, for example, directions that intersect vertically in a top view. The third direction DR3 is a direction that intersects the plane where the first direction DR1 and the second direction DR2 are located, for example, a direction that intersects vertically with both the first direction DR1 and the second direction DR2. In the illustrated drawings, the first direction DR1 represents the horizontal direction of the display device 1, the second direction DR2 represents the longitudinal direction of the display device 1, and the third direction DR3 represents the thickness direction of the display device 1. In the following embodiments, one side of the first direction DR1 refers to the right direction in the top view, the other side of the first direction DR1 refers to the left direction in the top view, one side of the second direction DR2 refers to the upper direction in the top view, the other side of the second direction DR2 refers to the lower direction in the top view, one side of the third direction DR3 refers to the upper direction in the cross-sectional view, and the other side of the third direction DR3 refers to the lower direction in the cross-sectional view. However, it should be understood that the directions mentioned in the embodiments are relative directions, and the embodiments are not limited to the mentioned directions.

[0055] Reference Figures 1 to 3 The display device 1 includes a display panel 100 and a window portion 500 disposed on an upper portion of the display panel 100. The display device 1 may further include a first inter-module bonding layer 310 disposed between the display panel 100 and the window portion 500.

[0056] The display device 1 may be rectangular in plan. The display device 1 includes two long sides and two short sides. The corner where the long side and the short side of the display device 1 intersect may be a right angle, but may also be a right angle. Figure 1 The planar shape of the display device 1 is not limited to the illustrated shape, and a circular shape or other shapes may also be applied.

[0057] The display device 1 includes a display area DA for outputting a picture and a first non-display area NA1 located around the display area DA. The first non-display area NA1 may not output a picture. The display area DA may include a plurality of pixels. In the case where a rectangular shape having a curved corner is applicable as the planar shape of the display device 1, the first non-display area NA1 may be set along the edge of the display area DA.

[0058] The display panel 100 is a panel for displaying a screen, and may be, for example, an organic light emitting display panel. In the following embodiments, an organic light emitting display panel is used as the display panel 100, but the present invention is not limited thereto, and other types of display panels such as a liquid crystal display device and an electrophoretic device may also be used.

[0059] The display panel 100 may include a display component and an optical film 160 disposed on the upper portion of the display component. The display component may include a base substrate 110, a circuit layer 120 disposed on the base substrate 110, an organic light emitting layer 130 disposed on the circuit layer 120, and an encapsulation layer 150 disposed on the organic light emitting layer 130.

[0060] The circuit layer 120 may control the amount of light emitted by the organic light emitting layer 130. The circuit layer 120 may include display wiring, display electrodes, and at least one thin film transistor. The organic light emitting layer 130 may include an organic light emitting substance. The organic light emitting layer 130 may be sealed by the encapsulation layer 150. The encapsulation layer 150 seals the organic light emitting layer 130 to prevent moisture and the like from invading from the outside. The encapsulation layer 150 may be a single film or a multilayer film of an inorganic film, or may be composed of a laminated film in which an inorganic film and an organic film are alternately laminated.

[0061] The base substrate 110 may be a rigid substrate formed of glass or the like, or a flexible substrate formed of polyimide or the like. When a polyimide substrate is used as the substrate, the display panel 100 may be bent, folded, or rolled.

[0062] An optical film 160 may be configured on the display component of the display panel 100. The optical film 160 may include: a polarizing layer 190 for adjusting light emitted from the organic light emitting layer 130; and a second inter-module bonding layer 170 for bonding the polarizing layer 190 and the encapsulation layer 150 of the display component. The second inter-module bonding layer 170 may be formed of a pressure sensitive adhesive or an adhesive (PSA).

[0063] The planar shape of the display panel 100 may be the same as or substantially similar to the planar shape of the display device 1 described above. That is, the planar rectangular shape of the display panel 100 may be applied, and the corners may be rounded.

[0064] The window portion 500 is disposed on the upper portion of the display panel 100. The window portion 500 is disposed on the upper portion of the display panel 100 to protect the display panel 100 and to allow light emitted from the display panel 100 to pass therethrough.

[0065] The window portion 500 is configured to overlap with the display panel 100 and cover the entire surface of the display panel 100. The window portion 500 has a shape similar to the display panel 100 in a plane, but its size can be larger than the display panel 100. For example, at the two short sides of the display device 1, the window portion 500 can protrude further outward than the display panel 100. At the two long sides of the display device 1, the window portion 500 can also protrude from the display panel 100, but the protruding distance can be greater than the amount of protrusion of the two short sides. The window portion 500 can be a rectangular shape including two long sides and two short sides in the same plane shape as the display device 1.

[0066] The window portion 500 includes one surface and another surface. When the window portion 500 is mounted on the display device 1, one surface of the window portion 500 becomes a surface facing the display panel 100, and the other surface of the window portion 500 becomes a surface on which a screen is output.

[0067] The window portion 500 may include a substrate and a printed pattern. The printed pattern may be arranged on one side of the substrate. The substrate is formed of a transparent substance. The substrate may include, for example, glass or plastic. When the substrate includes plastic, the substrate may have a flexible property.

[0068] An example of plastic applicable to the substrate may be polyimide, polyacrylate, polymethylmethacrylate (PMMA), polycarbonate (PC), polyethylenenaphthalate (PEN), polyvinylidene chloride, polyvinylidene difluoride (PVDF), polystyrene, ethylene vinylalcohol copolymer, polyethersulphone (PES), polyetherimide (PEI), polyphenylenesulfide (PPS), polyallylate, triacetyl cellulose (TAC), cellulose acetate propionate (CAP), etc., but is not limited thereto. In the case where the substrate includes plastic, it may also include a coating (not shown) disposed on the upper and lower surfaces of the plastic. In one embodiment, the coating may be an organic layer including an acrylate compound and / or a hard coating including an organic-inorganic composite layer. The organic layer may include an acrylate compound. The organic-inorganic composite layer may be a layer in which inorganic substances such as silicon oxide, zirconium oxide, aluminum oxide, tantalum oxide, niobium oxide, glass beads, etc. are dispersed in an organic substance such as an acrylate compound. In other embodiments, the coating may include a metal oxide layer. The metal oxide layer may include oxides of metals such as titanium, aluminum, molybdenum, tantalum, copper, indium, tin, tungsten, etc., but is not limited thereto.

[0069] The printed pattern is arranged on one side of the substrate. The printed pattern may be arranged along the edge of the substrate. The printed pattern is arranged to overlap with the non-display area of ​​the display panel 100, thereby preventing the non-display area of ​​the display panel 100 from being recognized.

[0070] A first inter-module bonding layer 310 for bonding the window portion 500 and the display panel 100 may be disposed between the window portion 500 and the display panel 100. The window portion 500 and the display panel 100 may be bonded to each other through the first inter-module bonding layer 310. The first inter-module bonding layer 310 may include an adhesive having a transparent property. For example, the first inter-module bonding layer 310 may include an optically clear adhesive (OCA) or an optically clear resin (OCR).

[0071] The first inter-module bonding layer 310 may be configured to overlap the display panel 100, thereby covering the entire surface of the display panel 100. The first inter-module bonding layer 310 may have a shape that is the same as or substantially similar to that of the display panel 100 in a plane.

[0072] The thickness of the first inter-module bonding layer 310 may be greater than the thickness of the second inter-module bonding layer 170. For example, the second thickness t2 of the first inter-module bonding layer 310 may be greater than the first thickness t1 of the second inter-module bonding layer 170. The second thickness t2 may have a thickness range of about 75 μm to about 200 μm, and the first thickness t1 may have a thickness range of about 10 μm to about 30 μm. As described later, the above-mentioned display panel 100 and the first inter-module bonding layer 310 are formed with holes that penetrate in the thickness direction. Since the second thickness t2 of the first inter-module bonding layer 310 is greater than the first thickness t1 of the second inter-module bonding layer 170, when forming the hole, the heat energy required to form the hole of the first inter-module bonding layer 310 may be greater than the heat energy required to form the hole of the second inter-module bonding layer 170.

[0073] On the other hand, the display device 1 according to one embodiment may further include a display panel 100 and a through hole OP penetrating the first inter-module bonding layer 310 in the thickness direction. In addition, a second non-display area NA2 located around the through hole OP may be included. The through hole OP may be located inside the display device 1 in a plane. The planar shape of the through hole OP may be circular or elliptical, but is not limited thereto, and its planar shape may also be various other shapes such as a triangle and a quadrilateral.

[0074] Figures 1 to 3 2 and 3 , the number of through-holes OP is shown to be one, but the present invention is not limited thereto, and a plurality of through-holes OP may also be applied.

[0075] A second non-display area NA2 may be provided around the through hole OP. The second non-display area NA2 may surround the through hole OP in a plane. The display area DA may surround the second non-display area NA2 in a plane. The second non-display area NA2 may be an area where no image is outputted similarly to the first non-display area NA1. For example, the second non-display area NA2 may be an area where pixels of the display panel 100 are not configured and display wiring of the circuit layer 120 connecting adjacent pixels detours around the through hole OP in a plane.

[0076] When viewed in a stacked structure, the through hole OP may penetrate the display panel 100 and the first inter-module bonding layer 310 along the third direction DR3, but does not penetrate the window portion 500. An electronic component EMD may be disposed in the through hole OP. The electronic component EMD may include electronic components such as a camera, an infrared camera, and an infrared sensor, but is not limited thereto.

[0077] A display module according to an embodiment is described below.

[0078] Figure 4 is an exploded perspective view of a display module according to an embodiment. Figure 5 It is along Figure 4 A cross-sectional view taken along the V-V' line.

[0079] Reference Figure 4 as well as Figure 5 A display module 10 according to an embodiment may include the display panel 100 described above, a first inter-module bonding layer 310 , and a first protective film 320 disposed on the first inter-module bonding layer 310 .

[0080] The first protective film 320 is disposed on one side of the first inter-module bonding layer 310, and may overlap the first inter-module bonding layer 310 in the thickness direction. The size of the first protective film 320 on the plane is the same as or substantially similar to the size of the first inter-module bonding layer 310 on the plane, so that it can cover and protect one side of the first inter-module bonding layer 310.

[0081] The first protective film 320 is attached to the display module 10. Figure 1 The window portion 500 described in the previous embodiment is attached to one side of the first inter-module bonding layer 310 for protection, but is peeled off and removed during the process of mounting the display module 10 to the window portion 500 .

[0082] The first protective film 320 may be formed of at least one of polyethylene terephthalate (PET), polyurethane (PU), polyimide (PI), polycarbonate (PC), polyethylene (PE), polypropylene (PP), polysulfone (PSF), polymethyl methacrylate (PMMA), triacetyl cellulose (TAC), cyclopentane polymer (COP), etc.

[0083] The display module 10 according to an embodiment may also be applicable to Figures 1 to 3 That is, the display module 10 may include the display panel 100, the first inter-module bonding layer 310, and the through hole OP penetrating the first protective film 320 in the thickness direction. Figure 4 The configuration of the through hole OP in Figures 1 to 3 The arrangement of the through holes OP described in is the same.

[0084] Hereinafter, a coupling member according to an embodiment will be described.

[0085] Figure 6 is a three-dimensional diagram of a combination component according to an embodiment. Figure 7 It is along Figure 6 A cross-sectional view taken along line VII-VII'.

[0086] Reference Figure 6 as well as Figure 7 , the bonding component 300 involved in one embodiment may include the above-mentioned first inter-module bonding layer 310, a first protective film 320 arranged on the upper part of the above-mentioned first inter-module bonding layer 310, and a second protective film 330 arranged on the lower part of the first inter-module bonding layer 310. The bonding component 300 may also include a light absorption pattern arranged on at least one side of the first protective film 320. The light absorption pattern may include a hole region light absorption pattern 325 arranged inside the first protective film 320 on a plane and an edge light absorption pattern 327 arranged along the edge of the first protective film 320 (hereinafter, both may also be referred to as light absorption patterns 325, 327).

[0087] The bonding member 300 according to one embodiment may be a first inter-module bonding layer 310 and a first protective film 320 applicable to the display module 10 that are not rectangular with rounded corners but rectangular with angular corners because the edge shape processing described later is not performed. Similarly, the second protective film 330 may also be a rectangular with angular corners.

[0088] The second protective film 330 may be disposed on the other side of the first inter-module bonding layer 310 and may be configured to overlap the first inter-module bonding layer 310 in the thickness direction. The size of the second protective film 330 on the plane may be the same as or substantially similar to the size of the first inter-module bonding layer 310 on the plane, and may play a role in covering and protecting the other side of the first inter-module bonding layer 310.

[0089] The second protective film 330 is attached to the other surface of the first inter-module bonding layer 310 to protect the bonding member 300 before the bonding member 300 is attached to the display panel 100 , but is peeled off and removed during the process of attaching the bonding member 300 to the display panel 100 .

[0090] The second protective film 330 may be formed by including at least one of polyethylene terephthalate (PET), polyurethane (PU), polyimide (PI), polycarbonate (PC), polyethylene (PE), polypropylene (PP), polysulfone (PSF), polymethyl methacrylate (PMMA), triacetyl cellulose (TAC), cyclopentane polymer (COP), etc.

[0091] The light absorption pattern plays the role of absorbing light of a specific wavelength to be used during the hole forming process and / or edge forming process of the display module as described below, thereby facilitating penetration of the first inter-module bonding layers 310 adjacent to each other in the thickness direction.

[0092] The light absorption pattern may be determined according to the wavelength range of light used in the hole forming process and / or edge forming process of the display module. For example, the light absorption pattern may be formed to include an ultraviolet wavelength absorber that absorbs light in the ultraviolet wavelength range and transmits light in the remaining wavelength range.

[0093] The hole region light absorption pattern 325 and the edge light absorption pattern 327 may be formed to include the same material and may be formed simultaneously in the same process. The hole region light absorption pattern 325 and the edge light absorption pattern 327 may have the same thickness as each other.

[0094] like Figure 7 As shown, the hole region light absorption pattern 325 can be configured with Figure 5 The hole region light absorption pattern 325 may be the same size as the preliminary through hole region OPa on the plane of the through hole OP. That is, the hole region light absorption pattern 325 may be configured to completely overlap with the preliminary through hole region OPa. The hole region light absorption pattern 325 may be located inside the first protective film 320 on the plane.

[0095] The edge light absorption pattern 327 may extend along the edge of the first protection film 320. The edge light absorption pattern 327 may be continuously disposed along a short side of the first protection film 320 in the first direction DR1 and a long side of the first protection film 320 in the second direction DR2.

[0096] In each embodiment, when the wavelength ranges of light used in the hole forming process and / or the edge forming process of the display module are different from each other, the hole region light absorption pattern 325 and the edge light absorption pattern 327 may be formed to include different substances. In this case, the hole region light absorption pattern 325 and the edge light absorption pattern 327 may be formed in different processes. The thicknesses of the hole region light absorption pattern 325 and the edge light absorption pattern 327 may be the same as each other, but may also be different.

[0097] Hereinafter, a method for manufacturing a display device using the bonding member 300 and the display module 10 according to an embodiment will be described.

[0098] Figure 8 is a sequence diagram of a method for manufacturing a display device according to an embodiment. Figures 9 to 12 It is a cross-sectional view according to the process steps of a method for manufacturing a display device involved in an embodiment.

[0099] Reference Figure 8 A method for manufacturing a display device according to an embodiment of the present invention is provided Figure 6 The combining component 300 (S10) described in the above. The combining component 300 may include a first inter-module combining layer 310, a first protective film 320 disposed on the upper portion of the first inter-module combining layer 310, and a second protective film 330 disposed on the lower portion of the first inter-module combining layer 310. The first protective film 320 is disposed on one side of the first inter-module combining layer 310, and the second protective film 330 is disposed on the other side of the first inter-module combining layer 310. In addition, the combining component 300 may further include light absorption patterns 325, 327 formed on one side of the first protective film 320.

[0100] The light absorption patterns 325 and 327 can be determined according to the wavelength range of light used in the hole forming process and / or edge forming process of the display module. For example, the light absorption patterns 325 and 327 can be formed to include an ultraviolet wavelength absorber that absorbs light in the ultraviolet wavelength range and transmits light in the remaining wavelength range.

[0101] The hole region light absorption pattern 325 and the edge light absorption pattern 327 may be formed to include the same material and may be formed simultaneously in the same process. The hole region light absorption pattern 325 and the edge light absorption pattern 327 may have the same thickness.

[0102] The hole region light absorption pattern 325 and the edge light absorption pattern 327 may be directly formed on one side of the first protection film 320 , respectively. The hole region light absorption pattern 325 and the edge light absorption pattern 327 may be directly coated or applied to one side of the first protection film 320 , respectively.

[0103] The hole region light absorption pattern 325 can be arranged at Figure 5 The hole region light absorption pattern 325 may be the same size as the preliminary through hole region OPa on the plane of the through hole OP. That is, the hole region light absorption pattern 325 may be configured to completely overlap with the preliminary through hole region OPa. The hole region light absorption pattern 325 may be located inside the first protective film 320 on the plane.

[0104] The edge light absorption pattern 327 may extend along the edge of the first protection film 320. The edge light absorption pattern 327 may be continuously disposed along a short side of the first protection film 320 in the first direction DR1 and a long side of the first protection film 320 in the second direction DR2.

[0105] Reference Figure 8 as well as Fig. 9, then, the second protective film 330 is peeled off from the other side of the first inter-module bonding layer 310 (S20). Although not shown in the figure, the step of peeling off the second protective film 330 from the other side of the first inter-module bonding layer 310 (S20) can be performed by at least one claw (pull tap) of the second protective film 330 protruding to the outside of the first inter-module bonding layer 310. The second protective film 330 includes at least one claw protruding to the outside of the first inter-module bonding layer 310, so that the peeling process of the second protective film 330 can be easily performed.

[0106] Reference Figure 8 as well as Fig.10 Then, the display panel 100 is attached to the other side of the first inter-module bonding layer 310 from which the second protective film 330 is peeled off (S30). The optical film 160 of the display panel 100 may be attached to the other side of the first inter-module bonding layer 310. Since the display panel 100 has been described in detail above, a repeated description is omitted here.

[0107] Reference Figure 8 as well as Fig.11 Then, a through hole OP is formed in the display panel 100, the first inter-module bonding layer 310 and the first protective film 320 (S40). The step of forming the through hole OP in the display panel 100, the first inter-module bonding layer 310 and the first protective film 320 (S40) includes the step of simultaneously forming the through hole OP in the display panel 100, the first inter-module bonding layer 310 and the first protective film 320. The step of forming the through hole OP (S40) can be performed using a laser device 700. The laser device 700 serves to irradiate the light LS in the ultraviolet band to the light absorption patterns 325 and 327 formed on one side of the first protective film 320.

[0108] The step of forming the through hole OP may further include causing the laser device 700 to Fig.11 The step of irradiating light from the upper direction or irradiating light from the lower direction is applicable. Even if light is irradiated from the upper direction or from the lower direction, it is possible that the through hole OP cannot be formed based on sufficient heat energy in a short time due to insufficient heat energy based on light not being transmitted to the first inter-module bonding layer 310, but a viscous substance is generated due to the material of the first inter-module bonding layer 310 being melted by a part of the heat energy. The generated viscous substance will not only adhere to the surface or side of the adjacent display panel 100 or the window portion 500 to be installed in the subsequent process, but also foreign matter and the like will adhere to the generated viscous substance and the like, which may cause foreign matter defects.

[0109] In a manufacturing method of a display device involved in one embodiment, when forming a through hole OP, the light absorption patterns 325 and 327 formed on one side of the first protective film 320 can better absorb the light emitted from the laser device 700, thereby transferring sufficient heat energy to the first inter-module bonding layer 310. Therefore, no viscous substance will be generated due to partial melting of the first inter-module bonding layer 310, and the through hole OP can be formed in a short time.

[0110] This makes it possible to prevent the module failure or foreign matter failure described above from occurring.

[0111] Reference Figure 8 as well as Fig.12 , then, the first protective film 320 is peeled off from one side of the first inter-module bonding layer 310 (S50). Although not shown in the figure, the step of peeling off the first protective film 320 from one side of the first inter-module bonding layer 310 (S50) can be performed by at least one claw protruding to the outside of the first inter-module bonding layer 310 of the first protective film 320. The first protective film 320 includes at least one claw protruding to the outside of the first inter-module bonding layer 310, so that the peeling process of the first protective film 320 can be easily performed.

[0112] Reference Figure 8 as well as Figure 3 Next, the window portion 500 is attached to the surface of the first inter-module bonding layer 310 from which the first protective film 320 is peeled off ( S60 ).

[0113] Other embodiments are described below.

[0114] Fig.13 is a cross-sectional view of a display module according to another embodiment, Fig.14 It is a cross-sectional view of a coupling component according to another embodiment.

[0115] Reference Fig.13 as well as Fig.14 The display module 10_1 of this embodiment is different from the display module 10 of the first embodiment in that a light absorption pattern 325 r is further disposed on one surface of the first protective film 320 .

[0116] More specifically, the light absorption pattern 325r may be disposed around the through hole OP. The light absorption pattern 325r may be disposed in the second non-display area NA2. Fig.14 The combined components involved are formed. That is, Fig.14 As shown, the joining member may include a Figure 7The light absorption pattern 325a has a larger size on the plane than the size on the plane of the preliminary through hole region OPa, and can completely cover the preliminary through hole region OPa.

[0117] The light absorption pattern 325a involved in this embodiment has a planar size larger than the planar size of the prepared through hole area OPa, so that when forming the through hole OP, even if the light emitted by the laser device 700 cannot be accurately aligned with the boundary of the prepared through hole area OPa but is aligned toward the outside, the through hole OP can be easily formed.

[0118] Although the planar shape of the light absorption pattern 325a involved in this embodiment is not shown in the figure, it can have a circular or elliptical shape according to the shape of the prepared through hole area OPa on the plane, but is not limited to this. As long as it is larger than the size of the prepared through hole area OPa on the plane, other polygonal shapes such as triangles and quadrilaterals can be applied.

[0119] The planar shape of the light absorption pattern 325 r according to the present embodiment may be a ring shape surrounding the through-hole OP in a plane, but it is obvious that the planar shape may be different according to the planar shape of the light absorption pattern 325 a .

[0120] Fig.15 is a cross-sectional view of a display module according to another embodiment, Fig.16 It is a perspective view of a coupling component according to still another embodiment.

[0121] Reference Fig.15 as well as Fig.16 The display module 10_2 of this embodiment is different from the display module 10 of the first embodiment in that the display module 10_2 is further provided with a light absorption pattern 325 r 2 on one surface of the first protective film 320 .

[0122] The size of the light absorption pattern 325r2 in the present embodiment on the plane is larger than Fig.13 The light absorption pattern 325r may cover the entire surface of the lower first protection film 320 .

[0123] The light absorption pattern 325r2 may be disposed around the through hole OP. The light absorption pattern 325r2 may be disposed in the second non-display area NA2 and the display area DA. The light absorption pattern 325r2 may be used Fig.16 The combined components involved are formed. That is, Fig.16 As shown, the joining member may include a Figure 7The light absorption pattern 325a1 has a larger size on the plane than the size on the plane of the preliminary through hole area OPa, so that the preliminary through hole area OPa can be completely covered. The light absorption pattern 325a1 can be arranged on the entire surface of the first protective film 320.

[0124] The light absorption pattern 325a1 involved in this embodiment has a planar size larger than the planar size of the preliminary through hole area OPa, so that when forming the through hole OP, even if the light emitted by the laser device 700 cannot be accurately aligned with the boundary of the preliminary through hole area OPa but is aligned toward the outside, the through hole OP can be easily formed.

[0125] The light absorption pattern 325r2 according to the present embodiment may surround the through hole OP in a plane.

[0126] Fig.17 is a cross-sectional view of a display module according to another embodiment, Fig.18 is a cross-sectional view showing the manufacturing process of a display module according to still another embodiment.

[0127] Reference Fig.17 as well as Fig.18 In this embodiment, the display module 10_3 is different from the display module 10 according to an embodiment in that a light absorption pattern 325r3 is further disposed on the other surface of the first protective film 320 .

[0128] More specifically, the light absorption pattern 325 r 3 may be disposed around the through hole OP, the light absorption pattern 325 r 3 may be disposed in the second non-display area NA 2 , and the light absorption pattern 325 r 3 may be disposed on the other surface of the first protection film 320 so as to be directly connected to the first inter-module bonding layer 310 .

[0129] The light absorption pattern 325r3 can be used Fig.18 The combined components involved are formed. That is, Fig.18 As shown, the joining member may include a Figure 7 The light absorption pattern 325a2 is larger than the size of the preliminary through hole region OPa. The light absorption pattern 325a2 has a larger size on the plane than the size of the preliminary through hole region OPa, and thus can completely cover the preliminary through hole region OPa.

[0130] The light absorption pattern 325 a 2 may be directly disposed on the other surface of the first protection film 320 so as to directly contact the first inter-module bonding layer 310 .

[0131] In various embodiments, the light absorption pattern 325 a 2 may be disposed on the entire surface of the first protection film 320 .

[0132] The light absorption pattern 325a2 involved in this embodiment has a planar size larger than the planar size of the preliminary through hole area OPa, so that when forming the through hole OP, even if the light emitted by the laser device 700 cannot be accurately aligned with the boundary of the preliminary through hole area OPa but is aligned toward its outside, the through hole OP can be easily formed.

[0133] Although the planar shape of the absorption pattern 325a2 involved in this embodiment is not shown in the figure, it can be formed into a circular or elliptical shape according to the shape of the prepared through hole area OPa on the plane, but is not limited to this. As long as it is larger than the size of the prepared through hole area OPa on the plane, other polygonal shapes such as triangles and quadrilaterals can be applied.

[0134] The planar shape of the light absorption pattern 325r3 according to the present embodiment may have a ring shape surrounding the through-hole OP in a plane, but it is apparent that the planar shape may be different depending on the planar shape of the light absorption pattern 325a2.

[0135] The embodiments of the present invention are described above with reference to the accompanying drawings, but those skilled in the art should be able to understand that the present invention can be implemented in other specific forms without changing the technical concept or essential features of the present invention. Therefore, it should be understood that the embodiments described above are merely illustrative in all aspects and are not restrictive.

Claims

1. A method for manufacturing a display device, include: A step of preparing a bonding component, the bonding component comprising a bonding layer, a first protective film disposed on the upper portion of the bonding layer and having a light absorption pattern formed thereon and capable of being peeled off, and a second protective film disposed on the lower portion of the bonding layer; The step of peeling off the second protective film to attach a display panel to one side of the bonding layer; as well as forming a through hole penetrating the bonding layer, the first protective film and the display panel in the region where the light absorption pattern is formed, The light absorption pattern absorbs light of a specific wavelength, thereby facilitating penetration of the bonding layers adjacent to each other in the thickness direction.

2. The method for manufacturing a display device according to claim 1, in, The size of the light absorption pattern on a plane is the same as or larger than the size of the through hole on a plane.

3. The method for manufacturing a display device according to claim 2, in, The light absorption pattern is formed on the entire surface of the first protection film.

4. The method for manufacturing a display device according to claim 1, in, The step of forming the through hole is performed using an ultraviolet laser.

5. The method for manufacturing a display device according to claim 4, in, The light absorption pattern includes an ultraviolet absorption pattern that absorbs light in an ultraviolet band.

6. The method for manufacturing a display device according to claim 1, in, In the step of preparing the bonding member, the light absorption pattern is formed on one surface of the first protective film that is in contact with the bonding layer or on the other surface that is opposite to the one surface.

7. The method for manufacturing a display device according to claim 6, in, The light absorption pattern is directly coated on the one side or the other side of the first protective film.

8. The method for manufacturing a display device according to claim 7, in, The light absorption pattern is formed inside the first protection film on a plane.

9. The method for manufacturing a display device according to claim 8, in, The light absorption pattern is also formed along the edge of the first protection film.

10. The method for manufacturing a display device according to claim 1, in, After forming the through hole, the method further includes peeling off the first protective film and attaching a window portion to the bonding layer from which the first protective film has been peeled off.

11. A display module, include: Display panel; A first inter-module bonding layer, disposed on the upper surface of the display panel; as well as A protective film is disposed on the upper surface of the first inter-module bonding layer, has a light absorption pattern on one side or the other side and can be peeled off, The display panel, the first inter-module bonding layer, and the protective film include through holes penetrating in the thickness direction. The light absorption pattern is located at the periphery of the through hole in a plane, The light absorption pattern absorbs light of a specific wavelength, thereby facilitating penetration of the first inter-module bonding layers adjacent to each other in the thickness direction.

12. The display module according to claim 11, in, The light absorption pattern is directly disposed on the one surface or the other surface of the protective film.

13. The display module according to claim 11, in, The light absorption pattern includes an ultraviolet absorption pattern that absorbs light in an ultraviolet band.

14. The display module according to claim 11, in, The light absorption pattern is arranged inside the protective film in a two-dimensional manner and has a ring shape in a two-dimensional manner.

15. The display module according to claim 11, in, The display panel comprises: a substrate; a display component including a light-emitting layer disposed on the substrate; an optical film disposed on the upper portion of the display component; and a second inter-module bonding layer bonding the display component and the optical film. The thickness of the first inter-module bonding layer is greater than the thickness of the second inter-module bonding layer.

16. The display module according to claim 15, in, The optical film includes a polarizing film.

17. A combination component, include: Bonding layer; A first protective film is disposed on the upper portion of the bonding layer, and a light absorption pattern is disposed on the first protective film and can be peeled off; as well as A second protective film is disposed at the lower part of the bonding layer, The light absorption pattern is formed inside the first protective film on a plane, The light absorption pattern absorbs light of a specific wavelength, thereby facilitating penetration of the bonding layers adjacent to each other in the thickness direction.

18. The bonding member according to claim 17, in, The light absorption pattern is disposed on one surface of the first protective film that is in contact with the bonding layer or on the other surface that is opposite to the one surface.

19. The bonding member according to claim 17, in, The light absorption pattern is further arranged along the edge of the first protection film.

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