Processing equipment

Abstract

A processing device is provided for improving productivity in a processing device having a chuck table configured to be capable of mounting a plurality of chuck tables corresponding to the size or shape of a workpiece. The processing device includes: a holding unit that holds the workpiece; a processing unit that processes the workpiece held by the holding unit; a processing feed unit that performs processing feed on the holding unit; and a control unit that controls the processing feed unit. The holding unit includes a chuck table that holds the workpiece and a base that supports the chuck table so that it can be freely loaded and unloaded. The base is configured to be capable of mounting a plurality of chuck tables corresponding to the size or shape of the workpiece. When a chuck table mounted on the base is selected, the control unit sets processing feed conditions including an acceleration of the processing feed unit corresponding to the type of chuck table mounted on the base, and controls the processing feed unit according to the processing feed conditions corresponding to the chuck table.

Description

Technical Field

[0001] The present invention relates to a processing device including: a holding unit for holding a workpiece; a processing unit for processing the workpiece held by the holding unit; and a processing feed unit for processing the holding unit. Background Art

[0002] A wafer divided by predetermined dividing lines and having a plurality of devices such as ICs and LSIs formed on the front surface is divided into individual device chips by a dicing device and used in electronic devices such as mobile phones and personal computers.

[0003] The cutting device comprises: a holding unit for holding a wafer; a cutting unit having a rotatable cutting tool for cutting the wafer held by the holding unit; and a processing feed unit for processing and feeding the holding unit so as to divide the wafer into individual device chips.

[0004] Furthermore, the holding unit has a chuck table for holding the wafer and a base for supporting the chuck table so that it can be loaded and unloaded, and is configured to prepare a plurality of chuck tables corresponding to the size of the wafer, and the base can be mounted with the plurality of chuck tables (for example, refer to Patent Document 1).

[0005] Patent Document 1: Japanese Patent Application Laid-Open No. 2015-162555

[0006] Furthermore, when a configuration is configured to accommodate multiple chuck tables, the inertial force (load) applied to the feed unit is maximized when the largest, and therefore heaviest, chuck table is selected for installation, while maintaining a constant acceleration during movement of the chuck table holding the unit. Therefore, the feed conditions (acceleration, constant speed, etc.) used to control the feed unit are set so that no excessive load is applied to the feed unit even when the heaviest chuck table is selected.

[0007] However, despite selecting a small and lightweight chuck table, as described above, when executing control based on the processing feed conditions set assuming the heaviest chuck table, the acceleration of the holding unit when moving is limited, even though the load on the processing feed unit is small, resulting in poor productivity. Because the holding unit (holding jig) that holds package substrates, including CSP (Chip Size (or Scale) Package) substrates, is replaced according to the size and shape of the package substrate, this problem can also occur in processing equipment that separates package substrates into individual chips. Summary of the Invention

[0008] The present invention has been made in view of the above circumstances, and an object thereof is to provide a processing apparatus capable of improving productivity in a processing apparatus having a chuck table configured to be able to mount a plurality of chuck tables corresponding to the size or shape of a workpiece.

[0009] According to one embodiment of the present invention, a processing device is provided, which includes: a holding unit that holds a workpiece; a processing unit that processes the workpiece held by the holding unit; a processing feed unit that performs processing feed on the holding unit; and a control unit that controls the processing feed unit, the holding unit having a chuck worktable that holds the workpiece and a base that supports the chuck worktable so that it can be loaded and unloaded, the base being configured to be able to install a variety of chuck worktables corresponding to the size or shape of the workpiece, and when a chuck worktable installed on the base is selected, the control unit sets a processing feed condition including an acceleration of the processing feed unit corresponding to the type of chuck worktable installed on the base, and controls the processing feed unit according to the processing feed condition corresponding to the chuck worktable.

[0010] In one embodiment of the present invention, the base of the holding unit preferably has a rotation drive unit that rotates the chuck worktable. When a chuck worktable installed on the base is selected, the control unit sets a rotation condition including a rotational acceleration of the rotation drive unit corresponding to the type of chuck worktable installed on the base, and controls the rotation drive unit according to the rotation condition corresponding to the chuck worktable.

[0011] Furthermore, in one embodiment of the present invention, the control unit preferably sets a frequency for controlling a drive source constituting the machining feed unit, sets a frequency corresponding to the chuck table as a permissible time for the drive source to reach the set target frequency, and generates the acceleration included in the machining feed condition. Furthermore, the control unit preferably sets a frequency for controlling a rotary drive source constituting the rotary drive unit, sets a frequency corresponding to the chuck table as a permissible time for the rotary drive source to reach the set target frequency, and generates the rotational acceleration included in the rotation condition.

[0012] A machining apparatus according to one embodiment of the present invention can control a machining feed unit according to machining feed conditions including appropriate acceleration corresponding to the size and shape of a chuck table, thereby avoiding excessive load on the machining feed unit and improving productivity. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 It is an overall three-dimensional diagram of the cutting device.

[0014] Figure 2 It is equipped with Figure 1An enlarged perspective view of the workbench mechanism of the cutting device is shown.

[0015] Figure 3 It shows the composition Figure 2 An exploded perspective view of the structure of the holding unit of the workbench mechanism shown.

[0016] Figure 4 yes Figure 3 A partial cross-sectional view of the holding unit is shown.

[0017] Figure 5 This is the front view of the display unit showing the chuck table selection screen.

[0018] Figure 6 This is a graph showing the frequency set according to the type of chuck table set in the control unit.

[0019] Description of labels

[0020] 1: Cutting device; 3: Loading and unloading unit; 4: Cassette loading area; 4A: Cassette; 5: Temporary workbench; 6: Transport unit; 10: Workbench mechanism; 12: Cutting unit; 14: Display unit; 15: Chuck workbench selection screen; 20: Holding unit; 21: X-direction movable plate; 22: Rotation drive unit; 24A: Chuck workbench (for 4 inches); 24B: Chuck workbench (for 6 inches); 241B: Peripheral frame; 242B: Suction chuck; 243B: Circular convex Part; 244B: Suction passage; 245B: Engaging protrusion; 246B: Space; 24C: Chuck worktable (for 8 inches); 25: Base; 251: Worktable holding platform; 252: Circular recess; 253: Wafer suction hole; 254: Chuck worktable adsorption hole; 255: Engaging recess; 26: Clamp mechanism; 27: Rotational drive source; 30: Processing feed unit; 31: Drive source; 32: Ball screw; 100: Control unit; 141a~141c: Selection button. DETAILED DESCRIPTION

[0021] Hereinafter, an embodiment of a processing device configured based on the present invention will be described in detail with reference to the drawings.

[0022] exist Figure 1 FIG. 1 shows an overall perspective view of a cutting device 1 as an embodiment of a processing device. Figure 1 The workpiece (wafer W) processed by the dicing apparatus 1 is divided along predetermined dividing lines to form a plurality of devices, and is supported on an annular frame F via adhesive tape T.

[0023] like Figure 1As shown, the cutting device 1 has a shell 1A that is roughly rectangular in shape, and has: a box 4A, which is placed in the box loading area 4 of the shell 1A; a carry-in and carry-out unit 3, which carries the chip W supported by the frame F from the box 4A to the temporary workbench 5; a conveying unit 6, which has a rotary arm for conveying the chip W carried out to the temporary workbench 5 to the workbench mechanism 10; a holding unit 20, which is arranged on the workbench mechanism 10 and includes a chuck workbench 24 (24A, 24B, 24C) for holding the chip W; an alignment unit 11, which is arranged on the moving path of the X direction indicated by the arrow X of the holding unit 20; a cutting unit 12, which is a processing unit configured to process the chip W held by the holding unit 20; and a display unit 14, which displays the processing status and has a touch panel function for allowing the operator to set the processing feed conditions described later, etc.

[0024] remove Figure 1 In addition, refer to Figure 2 and Figure 3 The workbench mechanism 10 of the cutting device 1 is further described in detail. Figure 2 FIG. 1 shows an enlarged perspective view of the workbench mechanism 10 housed in the housing 1A and disposed on the stationary base 2. Figure 2 As shown, the table mechanism 10 includes: a holding unit 20 that suction-holds a wafer W as a workpiece; and a processing feed unit 30 that feeds the holding unit 20 in the X1 direction indicated by the arrow X1 when processing the wafer W.

[0025] The holding unit 20 includes a rectangular X-direction movable plate 21 mounted on the stationary base 2 so as to be movable in the X1 direction; a base 25 that supports the chuck table 24 so as to be detachable; and a rectangular cover plate 23 that covers the periphery of the base 25. The base 25 includes a rotation drive unit 22 mounted on the X-direction movable plate 21 to rotate the chuck table 24 together with the base 25; and a clamp mechanism 26 disposed between the upper surface of the base 25 and the chuck table 24 to hold the frame F supporting the wafer W in accordance with its size (see also FIG. Figure 3 A rotation drive source 27 is housed within the rotation drive unit 22. The rotation drive source 27 constitutes the rotation drive unit 22 and rotates the chuck table 24 together with the base 25. The rotation drive source 27 is composed of, for example, a pulse (stepping) motor capable of precisely controlling the rotation speed and rotation position.

[0026] The machining feed unit 30 includes a drive source 31 and a ball screw 32. The ball screw 32 converts the rotation of the drive source 31 into linear motion and transmits it to the internal thread portion (not shown) of the X-direction movable plate 21, thereby moving the X-direction movable plate 21 forward and backward in the X1 direction along the guide rails 2a, 2a on the stationary base 2. The drive source 31 is composed of, for example, a pulse (stepping) motor capable of precisely controlling the rotational speed and rotational position.

[0027] like Figure 2 As shown, the rotational drive source 27 and drive source 31 are connected to the control unit 100. The control unit 100 is composed of a computer and includes: a central processing unit (CPU) that performs calculations according to a control program; a read-only memory (ROM) that stores the control program, etc.; a readable and writable random access memory (RAM) for temporarily storing detected values, calculation results, etc.; and input and output interfaces (detailed illustration omitted). The rotational drive source 27 and drive source 31 are controlled based on the feed and rotation conditions arbitrarily set in the control unit 100. More specifically, they are controlled by the frequency of the pulse signal determined by the feed and rotation conditions. Although not shown, position detection units are installed on the X-direction movable plate 21 and the base 25 to accurately detect the X1-direction position and circumferential rotational position of the chuck table 24. The rotational drive source 27 of the base 25 and the drive source 31 of the feed unit 30 are controlled based on pulse signals received from the control unit 100. Therefore, when the chuck worktable 24 is processed and fed in the X1 direction, it can be moved to the desired position according to the acceleration and uniform speed included in the processing feed conditions. Similarly, when the chuck worktable 24 is rotated, it can be rotated to the desired rotation angle position according to the rotation acceleration and rotation speed included in the rotation conditions.

[0028] exist Figure 3 In the figure, a stereoscopic view of a plurality of chuck tables 24 that can be selected in the cutting device 1 is shown on the upper layer, a cross-sectional view of each chuck table 24 is shown on the middle layer, and a stereoscopic view of the base 25 is shown on the lower layer. The base 25 can support the chuck table 24 so that it can be loaded and unloaded, and is constructed so that a chuck table 24 selected from a plurality of chuck tables 24A, 24B, and 25C can be installed corresponding to the size of the workpiece (wafer W). The chuck table 24A is, for example, a chuck table for holding a 4-inch wafer, and its diameter is set to 100 mm, the chuck table 24B is, for example, a chuck table for holding a 6-inch wafer, and its diameter is set to 150 mm, and the chuck table 24C is, for example, a chuck table for holding an 8-inch wafer, and its diameter is set to 200 mm. Taking the chuck table 24B as a representative example, refer to Figure 3 and Figure 4The structure of the table mechanism 10 including the chuck table 24 and the base table 25 will be described in more detail.

[0029] like Figure 3 and Figure 4 As shown, the chuck workbench 24B has an adsorption chuck 242B constituting the upper surface and an outer frame 241B surrounding the adsorption chuck 242B. The adsorption chuck 242B is made of porous ceramic with air permeability, and its upper surface height is configured to be the same as the upper surface height of the outer frame 241B made of ceramic that does not have air permeability. A circular convex portion 243B is formed in the center of the lower surface side of the outer frame 241B, and a cylindrical engaging convex portion 245B is formed on the lower surface of the outer frame 241B and near the circular convex portion 243B. A space 246B that acts as a suction negative pressure is formed between the lower surface of the adsorption chuck 242B and the outer frame 241B, and the space 246B is connected to the suction passage 244B formed in the center of the circular convex portion 243B.

[0030] The base 25 includes a table holding base 251 disposed on the base 25 for holding the chuck table 24B, and two clamping mechanisms 26 disposed in an outer peripheral region surrounding the table holding base 251. The clamping mechanisms 26 are configured to be able to change the position of a gripping member 26A that grips the frame F supporting the wafer W in accordance with the size of the frame F.

[0031] The table holding base 251 is generally cylindrical in shape and is smaller than the diameter of the base 25 (for example, about 1 / 2 the size). A circular recess 252 is formed in the center of the table holding base 251 for the circular protrusion 243B to be inserted, and the circular recess 252 is slightly larger than the outer diameter of the circular protrusion 243B of the chuck table 24B. Figure 4 It can also be understood that a chip suction hole 253 is formed in the center of the bottom of the circular recess 252. The chip suction hole 253 is connected to a suction source not shown in the figure, and is used to apply negative pressure Vm to attract the chip W through the adsorption chuck 242B when the circular protrusion 243B of the chuck worktable 24B is inserted into the circular recess 252 of the base 25.

[0032] And, as Figure 4As shown, a chuck table adsorption hole 254 is formed on the upper surface of the table holding base 251, surrounding the upper surface of the circular recess 252. The chuck table adsorption hole 254 abuts against the bottom surface of the circular protrusion 243B formed on the lower surface of the chuck table 24B, and is used to apply a negative pressure Vm to attract the chuck table 24B to the base 25. Furthermore, an engaging recess 255 is formed on the upper surface of the table holding base 251, which engages with an engaging protrusion 245B formed on the lower surface of the outer frame 241B. By inserting the circular protrusion 243B relative to the above-mentioned circular recess 252, and engaging the engaging protrusion 245B with the engaging recess 255 of the worktable holding platform 251, the circumferential position of the chuck worktable 24B when it is adsorbed and fixed to the base 25 is uniquely determined, and thus, the relative movement of the chuck worktable 24B in the rotation direction relative to the base 25 is restricted, and the rotation of the base 25 is reliably transmitted to the chuck worktable 24B.

[0033] In the above description, the structure of the chuck worktable 24 and the base 25 is described using the chuck worktable 24B with a diameter of 150 mm corresponding to a 6-inch chip W as a representative example. However, compared with the chuck worktable 24B, the chuck worktable 24A corresponding to the 4-inch chip W and the chuck worktable 24C corresponding to the 8-inch chip W have the same structure except for the different diameters of the outer peripheral frame 241A and 241C and the adsorption chucks 242A and 242C, so the detailed description is omitted.

[0034] The cutting apparatus 1 has a structure roughly as described above, and performs the following alignment process: the wafer W that has been unloaded from the cassette 4A and transported to the holding unit 20 is placed on the chuck table 24 and held by suction, and the wafer W is moved in the X direction and moved directly below the alignment unit 11 having an imaging unit, and the cutting tool of the cutting unit 12 provided as a processing unit is aligned with the predetermined dividing line of the wafer W. After the alignment process is performed, the holding unit 20 is processed and fed to the cutting area of ​​the cutting unit 12, and the wafer W is cut according to the control unit 100 (see FIG. 1 ) of the cutting apparatus 1. Figure 2) is used to cut the predetermined dividing lines formed along the predetermined direction of the wafer W by the cutting unit 12. After cutting the predetermined dividing lines formed along the predetermined direction, the cutting unit 12 is indexed and fed in the Y direction indicated by the arrow Y, and cutting is performed along all the predetermined dividing lines formed along the predetermined direction of the wafer W. Next, the chuck table 24 is rotated 90° by the action of the rotary drive source 27 of the rotary drive unit 22, and cutting is performed along all the predetermined dividing lines formed in a direction perpendicular to the predetermined direction, thereby dividing the wafer W into individual chips. The wafer W that has been cut and divided into individual chips undergoes an intermediate cleaning process and is then transported by the transport unit 13, the transport unit 6, the loading and unloading unit 3, etc. and stored again in the box 4A. Here, the functions and effects achieved by this embodiment are further described in detail.

[0035] In the cutting apparatus 1, before performing cutting processing, the operator selects a chuck table 24C having a diameter of 200 mm corresponding to the size of an 8-inch wafer W from among a plurality of chuck tables 24 prepared, based on the size and shape of the workpiece to be cut (for example, an 8-inch wafer W), and places the chuck table 24C on the base 25. After the chuck table 24C is placed on the base 25, a suction unit (not shown) is activated to suction and secure the chuck table 24C to the base 25.

[0036] After the chuck table 24C is placed and fixed on the base 25, Figure 5 As shown, the operator causes the display unit 14 to display the chuck table selection screen 15. The chuck table selection screen 15 displays a selection button 141a corresponding to the chuck table 24A, a selection button 141b corresponding to the chuck table 24B, and a selection button 141c corresponding to the chuck table 24C. In addition, a part of the processing feed conditions when each selection button is selected, namely, the acceleration of the holding unit 20 and the uniform speed of the holding unit 20 maintained when processing the wafer W are displayed. The operator touches and selects the selection button 141c (φ200mm) corresponding to the chuck table 24C from the chuck table selection screen 15 displayed on the display unit 14. By this selection, the processing feed conditions (acceleration = 25mm / s 2 , uniform speed 100mm / s, etc.).

[0037] As described above, the driving source 31 constituting the processing feed unit 30 of this embodiment is constituted by a pulse motor. Therefore, the acceleration and uniform speed when the chuck table 24C of the holding unit 20 is moved by the processing feed unit 30 are realized by the frequency of the pulse signal driving the driving source 31. Figure 3 、 Figure 5 In addition, refer to Figure 6 The setting of the machining feed conditions will be described in more detail.

[0038] If based on Figure 3 As described above, the chuck tables 24A to 24C have the same basic structure except for their diameters of 100 mm, 150 mm, and 200 mm, respectively. Therefore, if the upper portion, excluding the identically shaped engaging protrusions 245A, 245B, and 245C and the circular protrusions 243A, 243B, and 243C, is substantially cylindrical, its weight is roughly proportional to the square of the radius. For example, if the weight of the upper portion of the chuck table 24A is S, the weight of the upper portion of the chuck table 24B is approximately 2.25S, and the weight of the upper portion of the chuck table 24C is approximately 4S.

[0039] In this embodiment, in order not to apply an excessive load to the processing feed unit 30, the processing feed conditions are set according to the type of the chuck table 24, and the frequencies Ha to Hc for controlling the driving source 31 are appropriately selected to achieve the processing feed conditions. Figure 6 In the graph shown, the vertical axis represents the frequency (Hz) of the pulse signal driving the driving source 31 , and the horizontal axis represents the elapsed time (sec). The slope of the graph of frequencies Ha to Hc corresponds to the acceleration when the holding unit 20 is moved.

[0040] When the heaviest chuck table 24C, for example, is selected based on the size of the wafer W to be processed by the cutting device 1, the frequency Hc corresponding to the chuck table 24C is selected as the allowable time T1, which is the time from the start of movement of the holding unit 20 to the time when a uniform speed (100 mm / s) suitable for cutting processing is reached (i.e., the time when the frequency of the pulse signal driving the drive source 31 reaches the target frequency H), to generate the acceleration included in the processing feed conditions.

[0041] The above-mentioned allowable time T1 is a time set in advance through experiments, etc., based on the time when the target frequency H is reached in a shorter time (i.e., when the acceleration is further increased) and the processing feed unit 30 is reached in a shorter time, which may cause an excessive load to the processing feed unit 30 and cause a malfunction. In this embodiment, within the allowable time T1, the holding unit 20 is accelerated in such a manner as to reach the target frequency H so as to move at a uniform speed of 100 mm / s, and then the holding unit 20 is moved at a uniform speed of 100 mm / s until it reaches a specified position. In addition, although not shown in the figure, when the holding unit 20 decelerates after reaching the specified position, in order not to apply an excessive load to the processing feed unit 30, the holding unit 20 is also decelerated at a specified deceleration and stopped at a specified stop position. In this way, when the chuck worktable 24C is selected, the driving source 31 is driven at a frequency Hc according to the time taken to reach the target frequency H as the allowable time T1, and the acceleration (25 mm / s) included in the processing feed condition is generated. 2 ) and reaches a predetermined uniform speed (100 mm / s), thereby performing processing feed on the holding unit 20, thereby avoiding applying an excessive load to the processing feed unit 30.

[0042] Furthermore, when the chuck table 24B, which is lighter than the chuck table 24C, is selected and mounted on the base 25 according to the size of the wafer W to be processed by the dicing apparatus 1, the operator selects the chuck table from the chuck table selection screen 15 (see FIG. Figure 5 ) touches and selects the selection button 141b of "φ150mm" corresponding to the chuck table 24B. Thus, the time from the start of movement of the holding unit 20 to the reaching of a uniform speed (100mm / s) suitable for cutting (i.e., the time for the frequency of the pulse signal to reach the target frequency H) is set to a frequency Hb of the allowable time T2 shorter than the above-mentioned allowable time T1. During the period before reaching the allowable time T2, the acceleration (38mm / s) included in the machining feed condition is generated. 2 ).

[0043] The allowable time T2 is a time set in advance through experiments, etc., based on the time required to achieve the target frequency H for the pulse signal driving the drive source 31 in a shorter time when the chuck table 24B is selected. Although not shown in the figure, after the holding unit 20 reaches a predetermined position, the holding unit 20 is decelerated at a predetermined deceleration rate and brought to a stop at a predetermined stop position to avoid excessive load on the holding unit 20. This allows for a greater acceleration than when the chuck table 24C is selected, enabling wafer W to be cut in a shorter time while avoiding excessive load on the holding unit 30.

[0044] Furthermore, when the chuck table 24A, which is lighter than the chuck table 24B, is selected and mounted on the base 25 according to the size of the wafer W to be processed by the dicing apparatus 1, the operator selects the chuck table 24A from the chuck table selection screen 15 (see FIG. Figure 5 ) touches and selects the selection button 141a of "φ100mm" corresponding to the chuck table 24A. Thus, the time from the start of movement of the holding unit 20 to the reaching of a uniform speed (100mm / s) suitable for cutting (i.e., the time for the frequency of the pulse signal to reach the target frequency H) is set to a frequency Ha of an allowable time T3 shorter than the above-mentioned time T2. During the period before reaching the allowable time T3, the acceleration (50mm / s) included in the processing feed condition is generated. 2 ).

[0045] The allowable time T3 is a time set in advance through experiments, etc., based on the time required to achieve the target frequency H in a shorter time when the chuck table 24A is selected. Although not shown in the figure, after the holding unit 20 reaches the specified position, the holding unit 20 is decelerated at a specified deceleration rate and stopped at a specified stop position to avoid excessive load on the feeding unit 30. This allows for a further increase in acceleration compared to when the chuck table 24B is selected, enabling the wafer W to be cut in a shorter time while avoiding excessive load on the feeding unit 30.

[0046] According to the above embodiment, the feed unit 30 can be controlled according to the feed conditions including appropriate acceleration corresponding to the type of the chuck table 24 , thereby avoiding excessive load on the feed unit 30 and improving productivity.

[0047] As described above, the dicing apparatus 1 of this embodiment includes the rotational drive unit 22 that rotates the chuck table 24 when performing cutting along the planned dividing line formed on the wafer W. Therefore, in this embodiment, when the chuck table 24 corresponding to the size of the workpiece (wafer W) is selected, the rotational drive unit 22 is controlled by setting a rotation condition including a rotational acceleration corresponding to the size of the chuck table 24.

[0048] More specifically, when the control unit 100 controls the rotational drive source 27 that constitutes the rotational drive unit 22, it sets the frequency for achieving the rotational condition set corresponding to the size of the chuck worktable 24 according to the chuck worktable 24, sets the frequency of the allowable time for the rotational drive source 27 to reach the target frequency as the target rotational speed to the frequency corresponding to the chuck worktable 24, and generates the rotational acceleration included in the rotational condition.

[0049] Similar to the processing feed conditions set when controlling the driving source 31 that drives the processing feed unit 30 as mentioned above, the allowable time mentioned here is the time set based on the time when the target frequency is reached in a time shorter than the allowable time (i.e., when the acceleration is further increased) when the chuck worktable 24 is selected according to the size of the chip W, and the time may be set based on the time when an excessive load may be applied to the rotation drive part 22 to cause a malfunction, etc., and is the time set in advance through experiments, etc.

[0050] The frequency of controlling the rotation drive source 27 may be set based on Figure 6 The frequency curve shown in FIG. 1 is used to set the frequency. If the weight of the selected chuck table 24 is large, the time (allowed time) required to reach the target frequency corresponding to the specified target rotational speed is increased, thereby reducing the rotational acceleration. If the weight of the selected chuck table 24 is small, the time (allowed time) required to reach the target frequency corresponding to the specified target rotational speed is shortened, that is, the rotational acceleration is increased. This prevents excessive load on the rotation drive unit 22 and further improves productivity.

[0051] The present invention is not limited to the above-described embodiment, and various variations are provided. For example, in the above-described embodiment, the operator touches the selection buttons 141a to 141c on the chuck table selection screen 15 displayed on the display unit 14 to select which chuck table 24 is mounted on the base 25 (24A, 24B, 24C), thereby setting the processing feed conditions corresponding to the type of chuck table 24 and controlling the processing feed unit 30. However, the present invention is not limited to this, and a self-setting function implemented by a control program stored in the control unit 100 of the cutting device 1 can also be used to set the processing feed conditions, including the acceleration of the processing feed unit 30. The following is a brief description of this self-setting function.

[0052] This self-setting function is executed after the operator places the chuck table 24 corresponding to the wafer W to be processed on the base 25 and before the wafer W stored in the cassette 4A is cut. When executing this self-setting function, first, after the chuck table 24 selected by the operator is placed on the base 25, the processing feed unit 30 is operated without placing the wafer W on the chuck table 24, and the holding unit 20 is moved from the wafer carrying area (at the time of the chuck table 24 being placed on the holding unit 20) to the wafer carrying area. Figure 1 The idle processing feed is a process of moving the holding unit 20 (the area where the holding unit 20 is located) toward the cutting area where the cutting process is performed by the cutting unit 12. The target frequency for driving the drive source 31 at this time can be set to a prescribed frequency that causes the holding unit 20 to move at a uniform speed of 100 mm / s, for example. When the idle processing feed is implemented, the holding unit 20 does not immediately reach the prescribed frequency when it starts to move from the wafer carrying in and out area, but reaches the prescribed frequency with 100 mm / s as a uniform speed after gradually accelerating. Here, the control unit 100 measures the arrival time from the start of the movement of the holding unit 20 to the arrival at the prescribed frequency. The arrival time is extended when the weight of the chuck worktable 24 is large, and is shortened when the weight is small, and thus becomes a time corresponding to the type (weight) of the chuck worktable 24. Therefore, the control unit 100 adds a predetermined time to the arrival time measured during the idle feed, sets an allowable time to prevent excessive load from being applied to the feed unit 30, and sets the acceleration of the feed unit according to the type of chuck table 24 mounted on the base 25 based on this allowable time. This allows the operator to use the control unit 100 of the cutting device 1 to customize the feed conditions, including the acceleration of the feed unit 30, corresponding to the chuck table 24 mounted on the base 25, without having to select from the selection buttons 141a to 141c on the chuck table selection screen 15. This customizable function eliminates the need to register the acceleration included in the feed conditions in the control unit 100 for each type of chuck table 24 used, allowing appropriate feed conditions to be set even for an unknown chuck table 24.

[0053] Furthermore, the self-setting function described above is not limited to setting processing feed conditions that include the acceleration of the processing feed unit 30; it can also be applied to setting rotation conditions that include the rotational acceleration of the rotation drive unit 22. More specifically, after the chuck table 24 selected by the operator is placed on the base 25, the rotation drive source 27 of the rotation drive unit 22 is activated, without a wafer W being placed on the chuck table 24, to perform an idle rotation, causing the chuck table 24 to perform a predetermined rotation (e.g., a 90° rotation). The target frequency used to drive the rotation drive source 27 in this case can be, for example, a predetermined frequency that causes the chuck table 24 to move at a predetermined target rotational speed. During this idle rotation, the chuck table 24 does not immediately reach the predetermined target frequency, but rather gradually accelerates to reach the predetermined target frequency. The control unit 100 measures the time it takes for the chuck table 24 to reach the predetermined target frequency from the start of rotation. This arrival time is extended when the chuck table 24 is heavy and shortened when it is light, thus becoming a time corresponding to the type (weight) of the chuck table 24. Therefore, the control unit 100 adds a predetermined time to the arrival time measured during the idle rotation to set an allowable time for not applying an excessive load to the rotation drive unit 22. Based on this allowable time, the control unit 100 sets the rotation acceleration of the rotation drive unit 22 corresponding to the type of chuck table 24 mounted on the base 25. Thus, the operator can set the rotation conditions, including the rotation acceleration of the rotation drive unit 22 corresponding to the type of chuck table 24 mounted on the base 25, through the control unit 100 of the cutting device 1, without having to select from the selection buttons 141a to 141c on the chuck table selection screen 15.

[0054] While the above embodiment describes a case where the workpiece is a circular wafer W, the present invention is also applicable when the chuck table 24 is a chuck table (holding jig) that holds, for example, a rectangular CSP. Even if the weight of the chuck table varies depending on the size or shape of the CSP being processed, as in the above embodiment, the feed and rotation conditions corresponding to the chuck table selected for the workpiece are set, and the drive source constituting the feed unit and the rotation drive source constituting the rotation drive unit are controlled.

Claims

1. A processing device comprising: A holding unit that holds the workpiece; a processing unit for processing the workpiece held by the holding unit; a processing feed unit that performs processing feed on the holding unit; and A control unit that controls the processing feed unit, The holding unit includes a chuck table for holding a workpiece and a base for detachably supporting the chuck table. The base is configured to be able to mount various chuck tables corresponding to the size or shape of the workpiece. When a chuck worktable mounted on the base is selected from a variety of chuck worktables according to the size or shape of the workpiece, the control unit sets the processing feed conditions including the acceleration of the processing feed unit corresponding to the type of the chuck worktable selected and mounted on the base, and controls the processing feed unit according to the processing feed conditions corresponding to the selected chuck worktable.

2. The processing device according to claim 1, wherein The base of the holding unit has a rotation drive unit that rotates the chuck worktable. When a chuck worktable installed on the base is selected, the control unit sets a rotation condition including a rotation acceleration of the rotation drive unit corresponding to the type of chuck worktable installed on the base, and controls the rotation drive unit according to the rotation condition corresponding to the chuck worktable.

3. The processing device according to claim 1, wherein The control unit sets a frequency for controlling a driving source constituting the machining feed unit, sets a frequency corresponding to the chuck table as an allowable time for the driving source to reach the set target frequency, and generates an acceleration included in the machining feed condition.

4. The processing device according to claim 2, wherein: The control unit sets a frequency for controlling a rotational drive source constituting the rotational drive unit, sets a frequency corresponding to the chuck table such that a time for the rotational drive source to reach the set target frequency is an allowable time, and generates a rotational acceleration included in the rotation condition.

Images