Display device

Abstract

The present disclosure relates to a display apparatus including a substrate including a display area and a non-display area, and a pad on the non-display area, wherein the pad includes a first conductive layer including a plurality of curved portions and a plurality of connection portions connecting the plurality of curved portions to each other in a plan view, the plurality of connection portions extending in a first direction and a second direction opposite to the first direction alternately, a second conductive layer on the first conductive layer and overlapping at least a portion of the first conductive layer, and a third conductive layer on the second conductive layer and overlapping the second conductive layer.

Description

[0001] Cross Reference to Related Applications

[0002] This application claims priority to and the benefit of Korean Patent Application No. 10-2019-0074122, filed on June 21, 2019, in the Korean Intellectual Property Office, the entire contents of which are incorporated herein by reference. TECHNICAL FIELD

[0003] Aspects of one or more example embodiments of the present disclosure relate to a display apparatus. BACKGROUND

[0004] As the information society develops, the demand for display apparatuses for displaying images in various forms increases. In addition, the thickness and weight of display apparatuses decrease, and thus the range of use thereof increases.

[0005] In a display apparatus, in order to increase the size of a display area, a technology has been developed such that a lower non-display area, i.e., so-called dead space, can be gradually reduced. In order to reduce the dead space in the lower end of a display apparatus, the size of elements located in the lower end of the display apparatus can be reduced, or the elements can be moved to the edge of the display apparatus.

[0006] The above information disclosed in this Background section is only for enhancing the understanding of the background of the present disclosure, and therefore, it can not necessarily be construed as the prior art that is already known to those skilled in the art. SUMMARY

[0007] Aspects of one or more example embodiments relate to a display apparatus, and for example, to a display apparatus having relatively improved product reliability.

[0008] However, in the display apparatus according to the related art, when the elements located in the lower end of the display apparatus are moved to the edge of the display apparatus, an operation failure can occur due to static electricity.

[0009] One or more example embodiments include a display apparatus having improved product reliability and capable of preventing or reducing damage to the display apparatus. However, the above disclosure is merely an example, and the scope of the present disclosure is not limited thereto.

[0010] Additional aspects will be set forth in part in the description which follows, and in part will become apparent to those skilled in the art upon examination of the following description and / or the attached drawings. The aspects are not limited to the specific details described herein but are applicable to other manufacturing techniques and / or structures.

[0011] According to one or more example embodiments, a display apparatus includes a substrate including a display area and a non-display area, and a pad on the non-display area, wherein the pad includes a first conductive layer including, in a plan view, a plurality of curved portions and a plurality of connection portions connecting the plurality of curved portions to each other, the plurality of connection portions extending in a first direction and a second direction opposite to the first direction alternately, a second conductive layer on the first conductive layer to overlap at least a portion of the first conductive layer, and a third conductive layer on the second conductive layer to overlap the second conductive layer to prevent damage to the display apparatus due to static electricity by increasing an electrical resistance of a line, thereby improving product reliability of the display apparatus.

[0012] According to some example embodiments, the first conductive layer can have an electrical resistance of 1 mega ohm (MΩ) or more.

[0013] According to some example embodiments, a width of the first conductive layer in the first direction or the second direction can be less than a width of the second conductive layer in the same direction.

[0014] According to some example embodiments, an end portion of the first conductive layer can match an end portion of the substrate.

[0015] According to some example embodiments, the second conductive layer can have an island shape.

[0016] According to some example embodiments, the display apparatus can further include a first insulating layer between the first conductive layer and the second conductive layer, and a second insulating layer between the second conductive layer and the third conductive layer.

[0017] According to some example embodiments, the third conductive layer can be connected to the second conductive layer via a first contact hole defined in the second insulating layer.

[0018] According to some example embodiments, the third conductive layer can be connected to the first conductive layer via a second contact hole defined in the first insulating layer and the second insulating layer.

[0019] According to some example embodiments, the second contact hole can be located at an edge of the first conductive layer.

[0020] According to some example embodiments, an upper surface of the third conductive layer can be exposed.

[0021] According to some example embodiments, in a plan view, a size of the third conductive layer can be greater than a size of the second conductive layer.

[0022] According to some example embodiments, the second conductive layer can completely overlap the third conductive layer.

[0023] According to some example embodiments, the display device can further include a pixel on the display area and electrically connected to the pixel circuit, the pixel circuit including a thin film transistor and a storage capacitor, wherein the thin film transistor includes a semiconductor layer, a gate electrode at least partially overlapping the semiconductor layer, and an electrode layer connected to the semiconductor layer, and the first conductive layer can include the same material as the semiconductor layer.

[0024] According to some example embodiments, the second conductive layer can include the same material as the gate electrode.

[0025] According to some example embodiments, the third conductive layer can include the same material as the electrode layer.

[0026] According to some example embodiments, the pad can include a lighting pad for performing a lighting test.

[0027] According to one or more example embodiments, a display device includes a substrate including a display area and a non-display area, and a plurality of pads arranged in a first direction in the non-display area and having a center axis in a third direction crossing the first direction, wherein each of the plurality of pads includes a first conductive layer including a plurality of curved portions and a plurality of connection portions connecting the plurality of curved portions to each other in a plan view, a second conductive layer on the first conductive layer in at least partial overlap with the first conductive layer, and a third conductive layer on the second conductive layer in overlap with the second conductive layer, wherein the first conductive layer is symmetrical about the center axis in a region overlapping the third conductive layer, extends in the third direction from an end of the substrate on one side of the center axis of each of the plurality of pads, such that the connection portion extends in a zigzag shape in a first direction and a second direction opposite the first direction, and continuously extends in a fourth direction opposite the third direction on the other side of the center axis of each of the plurality of pads, such that the connection portion extends in a zigzag shape in the first direction and the second direction.

[0028] According to some example embodiments, the first conductive layer can have a resistance of 1 mega ohm (MΩ) or more.

[0029] According to some example embodiments, some of the plurality of curved portions can be arranged to face each other about the center axis.

[0030] According to some example embodiments, the second conductive layer can have an island shape. BRIEF DESCRIPTION OF DRAWINGS

[0031] The above and other aspects, features, and characteristics of certain embodiments of the present disclosure will become more apparent from the following description taken in conjunction with the accompanying drawings, in which:

[0032] Figure 1This is a schematic perspective view of a display device according to some example embodiments;

[0033] Figure 2 This is a schematic plan view of a display panel according to some example embodiments;

[0034] Figure 3 This is a plan view of a display device according to some example embodiments;

[0035] Figure 4 It is along Figure 3 A cross-sectional view of line AA′;

[0036] Figure 5 It is along Figure 2 Line II' and Figure 3 A cross-sectional view of line AA′;

[0037] Figure 6 This is a plan view of a display device according to some example embodiments;

[0038] Figure 7 It is along Figure 6 A cross-sectional view of line BB′;

[0039] Figure 8 This is a plan view of a display device according to some example embodiments;

[0040] Figure 9 It is along Figure 8 A cross-sectional view taken from line CC′;

[0041] Figure 10 These are plan views of a display device according to some example embodiments; and

[0042] Figure 11 It is along Figure 10 The cross-sectional view of the line DD′. Specific Implementation

[0043] Reference will now be made in more detail to embodiments, examples of which are illustrated in the accompanying drawings, wherein similar reference numerals always denote similar elements. In this respect, exemplary embodiments may have different forms and should not be construed as limited to the description set forth herein. Therefore, exemplary embodiments are described below only with reference to the accompanying drawings to explain the aspects described. As used herein, the term “and / or” includes any and all combinations of one or more of the associated listed items. When an expression such as “at least one of” follows a list of elements, it modifies the entire list of elements but does not modify the individual elements in the list.

[0044] It will be further understood that the terms "comprises" and / or "comprising," when used herein, specify the presence of stated features, integers, steps, operations, elements, or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, or groups thereof. Also, it will be understood that when a layer, region, or element is referred to as being "formed on" another layer, region, or element, it can be directly or indirectly formed on the other layer, region, or element.

[0045] The sizes of components in the drawings can be exaggerated for the purpose of explanation. In other words, since the sizes and thicknesses of components in the drawings are arbitrarily shown for the purpose of explanation, the following example embodiments are not limited thereto.

[0046] In the following examples, the x-axis, y-axis, and z-axis are not limited to three axes of a rectangular coordinate system, but can be interpreted broadly. For example, the x-axis, y-axis, and z-axis can be perpendicular to each other, or can be different directions that are not perpendicular to each other.

[0047] When a certain embodiment can be implemented differently, a specific process sequence can be performed differently from the described order. For example, two consecutively described processes can be performed substantially simultaneously or in an order opposite to the described order.

[0048] Figure 1 is a schematic perspective view of a display apparatus 1 according to some example embodiments.

[0049] Referring to Figure 1 , the display apparatus 1 can include a display area DA in which an image is implemented and a non-display area NDA in which an image is not implemented. The display apparatus 1 can provide an image by using light emitted from a plurality of pixels P located in the display area DA.

[0050] Although Figure 1 The display apparatus 1 having a rectangular display area DA is illustrated, but the present disclosure is not limited thereto. The shape of the display area DA can be circular, elliptical, or polygonal such as triangular or pentagonal.

[0051] In the following description, although an organic light emitting display apparatus is described as an example of the display apparatus 1 according to some example embodiments, the display apparatus according to the present disclosure is not limited thereto. According to some example embodiments, various types of display apparatuses such as inorganic electroluminescence (EL) display apparatuses and quantum dot light emitting display apparatuses can be used as the display apparatus according to some example embodiments of the present disclosure. Also, although a flat display apparatus is illustrated as the display apparatus 1 of Figure 1 The display apparatus 1 of

[0052] Figure 2is a schematic plan view of a display panel 10 according to some example embodiments.

[0053] Referring to Figure 2 Various elements constituting the display panel 10 are located on the substrate 100. The substrate 100 can include a display area DA and a non-display area NDA surrounding the display area DA.

[0054] A plurality of pixels P can be located in the display area DA. Each pixel P can include a display component such as an organic light emitting diode (OLED). Each pixel P can emit, for example, red light, green light, blue light, or white light from the OLED. In the specification, as described above, the pixel P can be understood as a pixel that emits light of one color such as red, green, blue, and white.

[0055] The pixels P can be electrically connected to external circuits located in the non-display area NDA. A first scan driving circuit 110, a second scan driving circuit 120, a lighting test circuit, a pad portion 140, a data driving circuit 150, a first power supply line 160, and a second power supply line 170 can be located in the non-display area NDA.

[0056] The first scan driving circuit 110 can provide a scan signal to the pixels P via scan lines SL. The first scan driving circuit 110 can provide a lighting control signal to each pixel P via an emission control line EL. The second scan driving circuit 120 can be arranged in parallel with the first scan driving circuit 110, and have the display area DA therebetween. Some of the pixels P located in the display area DA can be electrically connected to the first scan driving circuit 110, and others can be electrically connected to the second scan driving circuit 120. According to some example embodiments, the second scan driving circuit 120 can be omitted.

[0057] The lighting test circuit can be connected to data lines DL of the pixels P, and can provide a lighting test signal to the data lines DL in a lighting test process. For example, when a lighting control signal DC_R of a first pixel is provided to the lighting test circuit, a data signal can be provided to a data line DL of the first pixel so that the first pixel can emit light. Also, when lighting control signals DC_G and DC_B of a second pixel or a third pixel are provided to the lighting test circuit, a data signal can be provided to data lines DL of the second pixel or the third pixel so that the second pixel or the third pixel can emit light.

[0058] The pad portion 140 can be located at one side of the substrate 100. The pad portion 140 can include a lighting pad 141, a driving pad 142, power supply pads 143a and 143b, and a data pad 144. The pad portion 140 can be exposed without being covered by an insulating layer, and electrically connected to a printed circuit board PCB.

[0059] Although Figure 3 Although a case in which one lighting pad is provided as the lighting pad 141 is shown, embodiments are not limited thereto, and the lighting pad 141 can include a plurality of lighting pads.

[0060] The port PCB-P of the printed circuit board PCB can be electrically connected to the pad portion 140 of the display panel 10. The printed circuit board PCB can transmit a signal or a power of a controller to the display panel 10 via the driving pad 142 or the power pads 143a and 143b. A control signal generated by the controller can be transmitted to each of the first and second scan driving circuits 110 and 120 via the driving pad 142. The controller can supply a first power voltage ELVDD and a second power voltage ELVSS to the first and second power supply lines 160 and 170, respectively, via the power pads 143a and 143b connected to the first and second connection lines 161 and 171. The first power voltage ELVDD can be supplied to the pixels P through a driving voltage line PL connected to the first power supply line 160, and the second power voltage ELVSS can be supplied to the counter electrode of the pixels P connected to the second power supply line 170.

[0061] The data driving circuit 150 can be electrically connected to the data lines DL. A data signal of the data driving circuit 150 can be supplied to the pixels P via the connection lines 151 connected to the data pads 144 and the data lines DL connected to the connection lines 151. Although Figure 2 Although the data driving circuit 150 is shown to be located on the printed circuit board PCB, according to some example embodiments, the data driving circuit 150 can be located on the substrate 100. For example, the data driving circuit 150 can be located between the pad portion 140 and the first power supply line 160.

[0062] The first power supply line 160 can include a first sub-line 162 and a second sub-line 163 extending in parallel to the x-direction, and the display area DA is between the first and second sub-lines 162 and 163. The second power supply line 170 can have a ring shape with one open side, and can partially surround the display area DA.

[0063] Figure 3 is a plan view of the display apparatus 1 according to some example embodiments, and Figure 4 is a cross-sectional view taken along the line A-A' of Figure 3 .

[0064] Referring to Figure 3 and Figure 4According to the display apparatus 1 of the embodiment, the display apparatus 1 can include a substrate 100 including a display area DA and a non-display area NDA, and a light-up pad 141 located in the non-display area NDA, and the light-up pad 141 can include a buffer layer 210, a first conductive layer 220, a first insulating layer 230, a second conductive layer 240, a second insulating layer 250, and a third conductive layer 260.

[0065] The substrate 100 can include glass or a polymer resin. The polymer resin can include polyether sulfone (PES), polyacrylate, polyetherimide (PEI), polyethylene naphthalate (PEN), polyethylene terephthalate (PET), polyphenylene sulfide (PPS), polyarylate (PAR), polyimide (PI), polycarbonate (PC), or cellulose acetate propionate (CAP). The substrate 100 including the polymer resin can be flexible, rollable, or bendable. The substrate 100 can have a multi-layer structure including the above-described layers including the polymer resin and inorganic layers.

[0066] The buffer layer 210 can be located on the substrate 100, and can reduce or prevent foreign substances, moisture, or external air from invading from the lower side of the substrate 100, and can provide a planarized surface on the substrate 100. The buffer layer 210 can include an inorganic material such as an oxide or a nitride, an organic material, or an organic / inorganic composite, and can have a single layer or a multi-layer structure of inorganic materials and organic materials. A barrier layer for blocking invasion of external air can be further provided between the substrate 100 and the buffer layer 210.

[0067] The first conductive layer 220 can be located on the buffer layer 210. For example, in a plane or in a plan view, the first conductive layer 220 can include a plurality of curved portions and a plurality of connection portions connecting the curved portions, and the connection portions can be located on the buffer layer 210 by alternately extending in a first direction (+x) and a second direction (-x) opposite the first direction (+x).

[0068] In addition, the end portion of the first conductive layer 220 can match the end portion of the substrate 100. For example, as shown in FIG. 1B, the end portion 220E of the first conductive layer 220 can match the end portion 100E of one side of the substrate 100. Figure 3 In addition, the end portion of the first conductive layer 220 can match the end portion of the substrate 100. For example, as shown in FIG. 1B, the end portion 220E of the first conductive layer 220 can match the end portion 100E of one side of the substrate 100.

[0069] In a display apparatus, in order to increase the size of a display area, a technology has been developed such that a lower non-display area or a so-called dead space is gradually reduced. In order to reduce the dead space at the lower end of the display apparatus, the size of elements located at the lower end of the display apparatus is reduced, and the elements are located at the edge of the display apparatus. However, after the elements located at the lower end of the display apparatus are located at the edge of the display apparatus, when an electrostatic test is performed, abnormal driving can occur due to static electricity generated at the lower end of the display apparatus.

[0070] Therefore, to solve the above-described problems, the invasion of static electricity into the display apparatus 1 can be prevented or reduced by increasing the electrical resistance of the first conductive layer 220, and thus abnormal driving of the display apparatus 1 due to static electricity can be prevented or reduced.

[0071] Electrical resistance is a physical quantity indicating the degree of resistance to the flow of current in a conductor, and is abbreviated as resistance. In general, the electrical resistance of an object increases as the electrical resistivity increases, the length of the object increases, and the cross-section of the object decreases. When the electrical resistivity, length, and cross-section of a certain material are ρ, L, and A, respectively, the magnitude of the resistance R can be defined by Equation 1 below:

[0072]

[0073] In an electronic circuit, a resistance resists the flow of current, thereby causing a voltage drop.

[0074] Therefore, the electrical resistance of the first conductive layer 220 can be increased by increasing the length of the first conductive layer 220 and by decreasing the width of the first conductive layer 220 to decrease the cross-section thereof, and thus the first conductive layer 220 can delay the invasion of static electricity into the display apparatus 1, and thus abnormal driving of the display apparatus 1 or damage to the display apparatus 1 due to static electricity can be prevented or reduced.

[0075] To increase the electrical resistance of the first conductive layer 220, the width d of the first conductive layer 220 can be decreased, and the total length of the first conductive layer 220 can be increased.

[0076] However, the infinite decrease of the width d of the first conductive layer 220 and the infinite increase of the total length of the first conductive layer 220 can be limited due to the size of the area occupied by the first conductive layer 220.

[0077] Therefore, the width d of the first conductive layer 220 can be equal to or less than 2 μm, and since the connection portions included in the first conductive layer 220 can extend in the first direction (+x) and the second direction (-x) alternately in the area where the first conductive layer 220 is located, the first conductive layer 220 can have an electrical resistance of 1 mega ohm (MΩ) or more.

[0078] Therefore, since the first conductive layer 220 can have an electrical resistance of 1 mega ohm (MΩ) or more, the invasion of static electricity into the display apparatus 1 can be delayed, and thus abnormal driving of the display apparatus 1 due to static electricity can be prevented or reduced.

[0079] The total width of the first conductive layer 220, in which the connecting portion is alternately extended in the first direction (+x) and the second direction (-x), may be less than the width of the second conductive layer 240 as described below, and at least a portion of the first conductive layer 220 may be arranged to overlap with the second conductive layer 240, or the first conductive layer 220 may be arranged to completely overlap with the second conductive layer 240.

[0080] Display device 1 according to some example embodiments may include: a substrate 100 including a display area DA and a non-display area NDA, and a plurality of pads (e.g., lighting pad 141, driving pad 142, power pads 143a and 143b, and data pad 144) located in the non-display area NDA in a first direction (+x), the pads having a central axis CA in a third direction (+y) intersecting the first direction (+x), and each pad may include: a first conductive layer 220 having a plurality of curved portions in a plane (or in a plan view) and connecting portions connecting the plurality of curved portions to each other; a second conductive layer 240 located above the first conductive layer 220 to at least partially overlap the first conductive layer 220; and a third conductive layer 260 located above the second conductive layer 240 to overlap the second conductive layer 240.

[0081] According to some example embodiments, the illuminated pad 141 may have a central axis CA extending in a third direction (+y) that intersects a first direction (+x) or a second direction (-x) opposite to the first direction (+x).

[0082] like Figure 3 As shown, in a plane (or in a plan view), the first conductive layer 220 may include a plurality of curved portions and connecting portions that connect the plurality of curved portions to each other, forming symmetry about a central axis CA in the region overlapping with the third conductive layer 260, extending from the end 100E of the substrate 100 in a third direction (+y) on one side of the central axis CA of the illuminated pad 141, such that the connecting portions extend in a zigzag pattern in a first direction (+x) and a second direction (-x), and on the other side of the central axis CA of the illuminated pad 141 in a fourth direction (-y) opposite to the third direction (+y), such that the connecting portions extend in a zigzag pattern in the first direction (+x) and the second direction (-x).

[0083] The first conductive layer 220 may comprise an oxide semiconductor and / or a silicon semiconductor. When the first conductive layer 220 is formed of an oxide semiconductor, it may comprise an oxide of at least one material selected from the group consisting of indium (In), gallium (Ga), tin (Sn), zirconium (Zr), vanadium (V), hafnium (Hf), cadmium (Cd), germanium (Ge), chromium (Cr), titanium (Ti), and zinc (Zn). For example, the first conductive layer 220 may be ITZO (InSnZnO) or IGZO (InGaZnO). When the first conductive layer 220 is formed of a silicon semiconductor, it may comprise, for example, amorphous silicon (a-Si) or low-temperature polycrystalline silicon (LTPS) obtained by crystallizing amorphous silicon (a-Si).

[0084] The second conductive layer 240 may be located above the first conductive layer 220, and the first insulating layer 230 may be located therebetween. The first insulating layer 230 may comprise silicon oxide (SiO2) or silicon nitride (SiN). x The first insulating layer 230 may comprise at least one inorganic insulating material selected from the group consisting of silicon oxynitride (SiON), aluminum oxide (Al2O3), titanium oxide (TiO2), tantalum oxide (Ta2O5), hafnium oxide (HfO2), and zinc oxide (ZnO2).

[0085] like Figure 3 As shown, the second conductive layer 240 may be located on the first insulating layer 230 in the shape of an island electrode or a floating electrode. For example, the second conductive layer 240 may be located between the first insulating layer 230 and the second insulating layer 250 in the shape of an island electrode or a floating electrode, without being connected to any layer other than the third conductive layer 260 through the first contact hole CNT1 as described below.

[0086] The second conductive layer 240 may include a gate electrode G as described below (see below) Figure 5 The same material.

[0087] The second insulating layer 250 may be located on the second conductive layer 240. The second insulating layer 250 may be provided to cover the second conductive layer 240 and the first insulating layer 230.

[0088] The second insulating layer 250 may include silicon oxide (SiO2) or silicon nitride (SiN). x ), silicon oxynitride (SiON), aluminum oxide (Al2O3), titanium oxide (TiO2), tantalum oxide (Ta2O5), hafnium oxide (HfO2) or zinc oxide (ZnO2).

[0089] The third conductive layer 260 can be located on the second insulating layer 250. The third conductive layer 260 can be connected to the second conductive layer 240 via the first contact hole CNT1 defined in the second insulating layer 250, and connected to the first conductive layer 220 via the second contact hole CNT2 defined in the first insulating layer 230 and the second insulating layer 250. In this state, since the second contact hole CNT2 can be located at the edge of the first conductive layer 220, even when static electricity intrudes into the first conductive layer 220, the path to the second contact hole CNT2 is long, and thus it is possible to prevent or reduce abnormal driving or damage of the display apparatus 1 due to static electricity being transferred to the elements constituting the display apparatus 1.

[0090] The position of the third conductive layer 260 is not covered by the insulating layer, and thus the upper surface of the third conductive layer 260 can be exposed to the outside. After the display apparatus 1 is manufactured, a light-up test is performed through the upper surface of the third conductive layer 260 exposed to the outside, and thus it is possible to check the driving of the display area DA included in the display apparatus 1. For example, a test signal is applied to the third conductive layer 260 by using a probe, and the third conductive layer 260 can transmit the applied test signal to a light-up test circuit connected to the third conductive layer 260, and thus the driving (emission) of the pixels P of the display area DA is tested.

[0091] As shown in FIG. 1B, in a plan view (or in a plan), the width of the third conductive layer 260 can be greater than the width of the second conductive layer 240. In this case, the second conductive layer 240 can be arranged to be completely overlapped with the third conductive layer 260. Figure 3

[0092] Further, in the area in which the first conductive layer 220 overlaps the second conductive layer 240 or the third conductive layer 260, the first conductive layer 220 can be symmetrically arranged about the central axis CA of the light-up pad 141. The curved portions included in the first conductive layer 220 can be partially arranged to face each other about the central axis CA.

[0093] Figure 5 is a cross-sectional view taken along the line I-I' of Figure 2 and the line A-A' of Figure 3 .

[0094] Referring to Figure 5 the stack structure of the display apparatus 1 in the display area DA according to some example embodiments will be described in more detail.

[0095] The buffer layer 210 can be located on the substrate 100, and a thin film transistor (TFT) can be located on the buffer layer 210. The TFT can include a semiconductor layer A, a gate electrode G, and an electrode layer.

[0096] Although Figure 5 ​A case in which the TFT is a top gate type is shown, but embodiments are not limited thereto, and various types of thin film transistor TFTs such as a bottom gate type can be employed.

[0097] Further, although Figure 5 A case in which the TFT includes one TFT is shown, but the present disclosure is not limited thereto. In embodiments, the display device 1 can include two or more TFTs for one pixel P. In some embodiments, seven thin film transistors TFTs can be used for one pixel P.

[0098] The semiconductor layer A can include, for example, amorphous silicon (a-Si) or low-temperature polysilicon (LTPS) obtained by crystallizing amorphous silicon (a-Si). Further, the semiconductor layer A can include an oxide of at least one material selected from the group consisting of indium (In), gallium (Ga), tin (Sn), zirconium (Zr), vanadium (V), hafnium (Hf), cadmium (Cd), germanium (Ge), chromium (Cr), titanium (Ti), and zinc (Zn). For example, the semiconductor layer A can include ITZO (InSnZnO) and IGZO (InGaZnO).

[0099] According to some example embodiments, the semiconductor layer A of the display area DA can include the same material as the first conductive layer 220 described above.

[0100] The gate electrode G can be located on the semiconductor layer A with the gate insulating layer 231 therebetween. The gate electrode G can include a single layer or multiple layers of at least one metal material selected from aluminum (Al), platinum (Pt), palladium (Pd), silver (Ag), magnesium (Mg), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), lithium (Li), calcium (Ca), molybdenum (Mo), titanium (Ti), tungsten (W), or copper (Cu). The gate electrode G can be connected to a gate line for applying an electrical signal to the gate electrode G.

[0101] According to some example embodiments, the gate electrode G can include the same material as the second conductive layer 240 described above.

[0102] The gate insulating layer 231 as a layer for insulating the semiconductor layer A from the gate electrode G can include at least one inorganic insulating material selected from the group consisting of silicon oxide (SiO2), silicon nitride (SiN x ), silicon oxynitride (SiON), aluminum oxide (Al2O3), titanium oxide (TiO2), tantalum oxide (Ta2O5), hafnium oxide (HfO2), and zinc oxide (ZnO2). The gate insulating layer 231 can include a single layer or multiple layers containing the inorganic insulating material described above.

[0103] According to some example embodiments, the gate insulating layer 231 of the display area DA can include the same material as the first insulating layer 230 described above.

[0104] An electrode layer can be located on the gate electrode G, with an interlayer insulating layer 251 therebetween. The electrode layer can include a source electrode S and / or a drain electrode D. The source electrode S and / or the drain electrode D can be electrically connected to the semiconductor layer A via a contact hole formed in the interlayer insulating layer 251 and the gate insulating layer 231.

[0105] The electrode layer including the source electrode S and / or the drain electrode D can include a single layer or multiple layers of at least one metal material selected from aluminum (Al), platinum (Pt), palladium (Pd), silver (Ag), magnesium (Mg), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), lithium (Li), calcium (Ca), molybdenum (Mo), titanium (Ti), tungsten (W), or copper (Cu). According to some example embodiments, the electrode layer can have a multi-layer structure of Ti / Al / Ti.

[0106] According to some example embodiments, when the electrode layer including the source electrode S and / or the drain electrode D of the display area DA is formed, the third conductive layer 260 described above can be simultaneously formed of the same material.

[0107] The interlayer insulating layer 251 can include at least one inorganic insulating material selected from the group consisting of silicon oxide (SiO2), silicon nitride (SiN x ), silicon oxynitride (SiON), aluminum oxide (Al2O3), titanium oxide (TiO2), tantalum oxide (Ta2O5), hafnium oxide (HfO2), and zinc oxide (ZnO2).

[0108] According to some example embodiments, when the interlayer insulating layer 251 is formed, the second insulating layer 250 described above can be simultaneously formed of the same material.

[0109] The first and second electrodes CE1 and CE2 of the storage capacitor Cst can be arranged to overlap each other, with the interlayer insulating layer 251 therebetween. According to some example embodiments, the second electrode CE2 can be located on the same layer as the gate electrode G.

[0110] Although Figure 5 It is shown that the storage capacitor Cst does not overlap the TFT, but the present disclosure is not limited thereto. For example, the storage capacitor Cst can be arranged to overlap the TFT. In some embodiments, the second electrode CE2 of the storage capacitor Cst can be integrally formed with the gate electrode G. In other words, the gate electrode G of the TFT can perform the function of the second electrode CE2 of the storage capacitor Cst.

[0111] Referring back Figure 5A planarization layer 270 can be located on the interlayer insulating layer 251. Although Figure 5 The planarization layer 270 is shown as a single layer, but the planarization layer 270 can include multiple layers. The planarization layer 270 can planarize the upper surface of the pixel circuit (PC), and can planarize the surface on which the OLED is to be located.

[0112] The planarization layer 270 can include general-purpose polymers such as benzocyclobutene (BCB), polyimide, hexamethyldisiloxane (HMDSO), polymethyl methacrylate (PMMA), and polystyrene (PS), polymer derivatives having a phenol group, an acrylic-based polymer, an imide-based polymer, an aryl ether-based polymer, an amide-based polymer, a fluorine-based polymer, a p-xylene-based polymer, a vinyl alcohol-based polymer, and mixtures thereof. The planarization layer 270 can include inorganic materials. The planarization layer 270 can include silicon oxide (SiO2), silicon nitride (SiN x ), silicon oxynitride (SiON), aluminum oxide (Al2O3), titanium oxide (TiO2), tantalum oxide (Ta2O5), hafnium oxide (HfO2), or zinc oxide (ZnO2). When the planarization layer 270 includes inorganic materials, chemical planarization polishing can be performed as needed according to circumstances. The planarization layer 270 can include both organic materials and inorganic materials.

[0113] In the display area DA of the substrate 100, an OLED can be located on the planarization layer 270, the OLED including a pixel electrode 310, an intermediate layer 320 between the pixel electrode 310 and a counter electrode 330 located opposite the pixel electrode 310, and the counter electrode 330.

[0114] The pixel electrode 310 can be located on the planarization layer 270. The pixel electrode 310 can include a (semi-)transmissive electrode or a reflective electrode. In some example embodiments, the pixel electrode 310 can include a reflective film formed of Ag, Mg, Al, Pt, Pd, Au, Ni, Nd, Ir, Cr, or a compound thereof, and a transparent or semi-transparent electrode layer formed on the reflective film. The transparent or semi-transparent electrode layer can include at least one selected from the group consisting of indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), indium oxide (In2O3), indium gallium oxide (IGO), and aluminum zinc oxide (AZO). In some embodiments, the pixel electrode 310 can have a stack structure of ITO / Ag / ITO.

[0115] The pixel-defining layer 280 can be located on the planarization layer 270, and the pixel-defining layer 280 has an opening so that a central portion of the pixel electrode 310 is exposed, thereby defining a light emitting area of a pixel. Also, the pixel-defining layer 280 can prevent or reduce the generation of an electric arc at the edge of the pixel electrode 310 by increasing the distance between the edge of the pixel electrode 310 and the counter electrode 330 above the pixel electrode 310. The pixel-defining layer 280 can be formed by a method such as spin coating from an organic insulating material such as polyimide, polyamide, acrylic resin, benzocyclobutene, HMDSO, and phenol resin.

[0116] The intermediate layer 320 can be located on the pixel electrode 310 exposed by the pixel-defining layer 280. The intermediate layer 320 can include an emission layer, and can optionally further include functional layers below and above the emission layer, for example, a hole transport layer (HTL), a hole injection layer (HIL), an electron transport layer (ETL), and an electron injection layer (EIL).

[0117] The emission layer can include an organic material including a fluorescent or phosphorescent material that emits red, green, blue, or white light. The emission layer can include a low molecular organic material or a polymeric organic material.

[0118] When the emission layer includes a low molecular organic material, the intermediate layer 320 can have a stacked structure of a single or a complex structure of a hole injection layer (HIL), a hole transport layer (HTL), an emission layer (EML), an electron transport layer (ETL), and an electron injection layer (EIL), and the low molecular organic material can include various organic materials such as copper phthalocyanine (CuPc), N,N'-di(naphthalen-1-yl)-N,N'-diphenylbenzidine (NPB), or tris-8-hydroxyquinolinate aluminum (Alq3). These layers can be formed by a method such as vacuum deposition.

[0119] When the emission layer includes a polymeric material, the intermediate layer 320 can generally have a structure including an HTL and an emission layer (EML). In this state, the HTL can include PEDOT, and the emission layer can include a polymeric material based on polyphenylenevinylene (PPV) or based on polyfluorene. The emission layer can be formed by a screen printing or inkjet printing method or a laser-induced thermal imaging (LITI) method.

[0120] The pixel electrode 310 can include a plurality of pixel electrodes, and the intermediate layer 320 can be arranged corresponding to each of the pixel electrodes 310. However, the disclosure is not limited thereto. For example, the intermediate layer 320 can be variously modified by including an integrated layer above the pixel electrode 310. According to some example embodiments, the intermediate layer 320 can be arranged corresponding to each of the pixel electrodes 310, and a functional layer other than the intermediate layer 320 can be integrally formed above the pixel electrode 310.

[0121] The counter electrode 330 can be located on the intermediate layer 320. The counter electrode 330 can be located on the intermediate layer 320 in a form of completely covering the intermediate layer 320.

[0122] The counter electrode 330 can include a transmissive electrode or a reflective electrode. In some embodiments, the counter electrode 330 can include a transparent or semi-transparent electrode, and can be formed of a metal thin film having a small work function and containing Li, Ca, LiF / Ca, LiF / Al, Al, Ag, magnesium, or a compound thereof. In addition, a transparent conductive oxide (TCO) film such as ITO, IZO, ZnO, or In2O3 can be further located on the metal thin film.

[0123] When the pixel electrode 310 is provided as a reflective electrode and the counter electrode 330 is provided as a transmissive electrode, light emitted from the intermediate layer 320 can be emitted toward the counter electrode 330, and thus the display apparatus 1 is a top emission type.

[0124] According to some example embodiments, when the pixel electrode 310 includes a transparent or semi-transparent electrode and the counter electrode 330 includes a reflective electrode, light emitted from the intermediate layer 320 can be emitted toward the substrate 100, and thus the display apparatus 1 can be a bottom emission type. However, the present disclosure is not limited thereto, and the display apparatus 1 according to some example embodiments can be a dual emission type in which light is emitted in a dual direction from a top surface and a bottom surface.

[0125] A thin film encapsulation layer is located on the counter electrode 330 to protect the OLED from external moisture and oxygen. The thin film encapsulation layer can include at least one organic encapsulation layer and at least one inorganic encapsulation layer.

[0126] The inorganic encapsulation layer can include silicon oxide, silicon nitride, and / or silicon oxynitride. The organic encapsulation layer can include polyethylene terephthalate, polyethylene naphthalate, polycarbonate, polyimide, polyethylenesulfonate, polyformaldehyde, polyarylate, hexamethyldisiloxane, an acrylic-based resin (e.g., polymethyl methacrylate, polyacrylic acid, etc.), or a combination thereof.

[0127] Figure 6 is a plan view of the display apparatus 1 according to some example embodiments, and Figure 7 is a cross-sectional view taken along Figure 6 line B-B' of

[0128] The lighting pad 141 according to some example embodiments can have a center axis CA extending in a third direction (+y) intersecting with a first direction (+x) or a second direction (-x) opposite to the first direction (+x).

[0129] Referring to Figure 6 andFigure 7 In the plane (or in the plan view), the first conductive layer 220 of the lighting pad 141 of the display apparatus 1 according to some example embodiments can include a plurality of curved portions and a plurality of connection portions connecting the curved portions to each other, can extend from the end portion 100E of the substrate 100, and can be arranged in the third direction (+y) such that the connection portions extend in the first direction (+x) and the second direction (-x) alternately with respect to the center axis CA of the lighting pad 141.

[0130] As shown in FIG. 11B, the second conductive layer 240 and the third conductive layer 260 can be located on the first conductive layer 220. The third conductive layer 260 can be connected to the second conductive layer 240 via the first contact hole CNT1 defined in the second insulating layer 250, and connected to the first conductive layer 220 via the second contact hole CNT2 defined in the first insulating layer 230 and the second insulating layer 250. In this state, the second contact hole CNT2 can be located at the edge of the first conductive layer 220 that is farthest separated from the end portion 100E of the substrate 100 in the first conductive layer 220. Figure 7

[0131] Figure 8 is a plan view of the display apparatus 1 according to some example embodiments, and Figure 9 is a cross-sectional view taken along the line C-C' of Figure 8

[0132] The lighting pad 141 according to some example embodiments can have a center axis CA extending in a third direction (+y) crossing the first direction (+x) or the second direction (-x) opposite to the first direction (+x).

[0133] Referring to Figure 8 and Figure 9 In the plane (or in the plan view), the first conductive layer 220 of the lighting pad 141 of the display apparatus 1 according to some example embodiments can include a plurality of curved portions and a plurality of connection portions connecting the curved portions to each other, can extend from the end portion 100E of the substrate 100, and can be arranged in the second direction (-x) such that the connection portions extend in the third direction (+y) and the fourth direction (-y) alternately with respect to the center axis CA of the lighting pad 141.

[0134] As shown in FIG. 11B, the second conductive layer 240 and the third conductive layer 260 can be located on the first conductive layer 220. The third conductive layer 260 can be connected to the second conductive layer 240 via the first contact hole CNT1 defined in the second insulating layer 250, and connected to the first conductive layer 220 via the second contact hole CNT2 defined in the first insulating layer 230 and the second insulating layer 250. In this state, the second contact hole CNT2 can be located at the edge of the first conductive layer 220 that is farthest separated from the end portion 100E of the substrate 100 in the first conductive layer 220. Figure 9 ​​As shown, the second conductive layer 240 and the third conductive layer 260 may be located on the first conductive layer 220. The third conductive layer 260 may be connected to the second conductive layer 240 via a first contact hole CNT1 defined in the second insulating layer 250, and connected to the first conductive layer 220 via a second contact hole CNT2 defined in the first insulating layer 230 and the second insulating layer 250. In this state, the second contact hole CNT2 may be located at the edge of the first conductive layer 220, which is furthest from the end 100E of the substrate 100 in the first conductive layer 220.

[0135] Figure 10 This is a plan view of display device 1 according to some example embodiments, and Figure 11 It is along Figure 10 The cross-sectional view of the line DD′.

[0136] According to some example embodiments, the illuminated pad 141 may have a central axis CA extending in a third direction (+y) that intersects a first direction (+x) or a second direction (-x) opposite to the first direction (+x).

[0137] Reference Figure 10 and Figure 11 In a planar (or planar) view, the first conductive layer 220 of the illuminated pad 141 of the display device 1 according to some example embodiments may include a plurality of curved portions and a plurality of connecting portions connecting the curved portions to each other, extending from an end 100E of the substrate 100, and may be arranged in a seventh direction (+m) such that the connecting portions extend alternately in a fifth direction (+n) and a sixth direction (-n) about the central axis CA of the illuminated pad 141.

[0138] like Figure 11 As shown, the second conductive layer 240 and the third conductive layer 260 may be located on the first conductive layer 220. The third conductive layer 260 may be connected to the second conductive layer 240 via a first contact hole CNT1 defined in the second insulating layer 250, and connected to the first conductive layer 220 via a second contact hole CNT2 defined in the first insulating layer 230 and the second insulating layer 250. In this state, the second contact hole CNT2 may be located at the edge of the first conductive layer 220, which is furthest from the end 100E of the substrate 100 in the first conductive layer 220.

[0139] According to some example embodiments, in order to solve the problem in display devices according to the related art, namely, the driving defect caused by static electricity when the element located at the lower end of the display device moves to the edge of the display device, the length of the conductive layer is increased and its width is reduced to have a small cross-section, thereby providing a display device with relatively improved product reliability and preventing or reducing damage to the display device.

[0140] Although the above mainly describes a display apparatus, the present disclosure is not limited thereto. For example, a display apparatus manufacturing method of manufacturing the above-described display apparatus can belong to the scope of the present disclosure.

[0141] According to the above-described embodiments, by increasing the resistance of the wire, damage to the display apparatus due to static electricity can be prevented or reduced, and a display apparatus having relatively improved product reliability can be implemented. The scope of the present disclosure is not limited by the above-described effects.

[0142] It is to be understood that the embodiments described herein are to be considered in a descriptive sense only and not for purposes of limitation. Descriptions of features or aspects within each embodiment should typically be considered as being applicable to other similar features or aspects in other embodiments. While one or more embodiments have been described with reference to the figures, it will be understood by those of ordinary skill in the art that various changes in form and details can be made therein without departing from the spirit and scope as defined by the following claims and their equivalents.

Claims

1. A display device, wherein, The display device includes: The substrate includes the display area and the non-display area; and Pads, on the non-display area, The pads include: In a plan view, the first conductive layer includes a plurality of curved portions and a plurality of connecting portions that connect the plurality of curved portions to each other, the plurality of connecting portions extending alternately in a first direction and a second direction opposite to the first direction; A second conductive layer, which is on the first conductive layer and at least partially overlaps with the first conductive layer; and A third conductive layer is placed on top of and overlaps with the second conductive layer.

2. The display device according to claim 1, wherein, The first conductive layer has a resistance of 1 megohm or greater.

3. The display device according to claim 1, wherein, The width of the first conductive layer in the first direction or the second direction is smaller than the width of the second conductive layer in the same direction.

4. The display device according to claim 1, wherein, The end of the first conductive layer matches the end of the substrate.

5. The display device according to claim 1, wherein, The second conductive layer has an island-like shape.

6. The display device according to claim 1, wherein, The display device further includes: A first insulating layer is disposed between the first conductive layer and the second conductive layer; and A second insulating layer is located between the second conductive layer and the third conductive layer.

7. The display device according to claim 6, wherein, The third conductive layer is connected to the second conductive layer via a first contact hole in the second insulating layer.

8. The display device according to claim 6, wherein, The third conductive layer is connected to the first conductive layer via a second contact hole in the first insulating layer and the second insulating layer.

9. The display device according to claim 8, wherein, The second contact hole is located at the edge of the first conductive layer.

10. The display device according to claim 1, wherein, The upper surface of the third conductive layer is exposed.

11. The display device according to claim 1, wherein, In the plan view, the size of the third conductive layer is larger than the size of the second conductive layer.

12. The display device according to claim 11, wherein, The second conductive layer completely overlaps with the third conductive layer.

13. The display device according to claim 1, wherein, The display device further includes: A pixel is located on the display area and electrically connected to a pixel circuit, the pixel circuit including a thin-film transistor and a storage capacitor. The thin-film transistor includes a semiconductor layer, a gate electrode that at least partially overlaps with the semiconductor layer, and an electrode layer connected to the semiconductor layer. The first conductive layer comprises the same material as the semiconductor layer.

14. The display device according to claim 13, wherein, The second conductive layer comprises the same material as the gate electrode.

15. The display device according to claim 13, wherein, The third conductive layer comprises the same material as the electrode layer.

16. The display device according to claim 1, wherein, The pads include lighting pads for performing lighting tests.

17. A display device, wherein, The display device includes: The substrate includes the display area and the non-display area; and Multiple pads are arranged in the non-display area along a first direction, and the multiple pads have a central axis extending upward in a third direction intersecting the first direction. Each of the plurality of pads includes: In a plan view, the first conductive layer includes a plurality of curved portions and a plurality of connecting portions that connect the plurality of curved portions to each other. A second conductive layer, which is on the first conductive layer and at least partially overlaps with the first conductive layer; and A third conductive layer is placed on top of and overlaps with the second conductive layer. The first conductive layer is symmetrical about the central axis in the region overlapping with the third conductive layer. The first conductive layer extends upward from the end of the substrate on one side of the central axis about each of the plurality of pads in the third direction, such that the connection portion extends in a zigzag pattern in the first direction and a second direction opposite to the first direction, and extends continuously on the other side of the central axis about each of the plurality of pads in a fourth direction opposite to the third direction, such that the connection portion extends in a zigzag pattern in the first direction and the second direction.

18. The display device according to claim 17, wherein, The first conductive layer has a resistance of 1 megohm or greater.

19. The display device according to claim 17, wherein, Some of the multiple curved sections are arranged to face each other about the central axis.

20. The display device according to claim 17, wherein, The second conductive layer has an island-like shape.

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