Detection sensors and display devices

Abstract

A detection sensor and a display device are disclosed. The display device includes: a base substrate; a self-emissive element located on the base substrate; a thin-film encapsulation layer located on the self-emissive element; a first sensing electrode located on the thin-film encapsulation layer and including an opening; a second sensing electrode located on the thin-film encapsulation layer and spaced apart from the first sensing electrode; a conductive pattern located in the opening and spaced apart from the first sensing electrode; and a sensor controller configured to detect changes in the mutual capacitance between the first sensing electrode and the second sensing electrode in a first mode, and configured to detect changes in the mutual capacitance between the conductive pattern and the first sensing electrode in a second mode different from the first mode.

Description

[0001] Cross-references to related applications

[0002] This application claims priority and benefit to Korean Patent Application No. 10-2019-0079366, filed on July 2, 2019, with the Korean Intellectual Property Office, the disclosure of which is incorporated herein by reference in its entirety. Technical Field

[0003] Some exemplary embodiments of the present invention relate to detection sensors and display devices. Background Technology

[0004] Display devices for displaying images can be used in various electronic devices that provide images to users, such as smartphones, tablet PCs, digital cameras, laptops, navigators, and televisions. Display devices may include display panels for generating and displaying images, as well as various input devices or mechanisms.

[0005] For example, touch sensors for recognizing touch input and proximity sensors for detecting the approach of objects can be used with display devices. Additionally, display devices can include various sensors with diverse functions, and some or all of these sensor functions can be integrated into a single sensor or performed by a single sensor.

[0006] The information disclosed in this background section is only intended to enhance the understanding of the background art, and therefore, the information discussed in this background section does not necessarily constitute prior art. Summary of the Invention

[0007] Some exemplary embodiments of the present invention may include a detection sensor capable of performing proximity sensor functions.

[0008] Some exemplary embodiments of the present invention may include a detection sensor in which proximity sensor functionality and touch sensor functionality are integrated.

[0009] However, the aspects and features of the invention are not limited to those specifically set forth herein. The above and other aspects of the invention, according to embodiments thereof, will become more apparent to those skilled in the art upon which this invention pertains from the following detailed description of the invention.

[0010] According to some exemplary embodiments of the present invention, a detection sensor includes: a first electrode member located on a base layer and including a plurality of first sensing electrodes, each of the plurality of first sensing electrodes including a first opening and electrically connected to each other along a first direction; a second electrode member located on the base layer and including a plurality of second sensing electrodes, the plurality of second sensing electrodes being electrically connected to each other along a second direction intersecting the first direction; a first conductive member including a plurality of first conductive patterns electrically connected to each other along the first direction; a second conductive member including a plurality of second conductive patterns electrically connected to each other along the first direction and spaced apart from the first conductive member; and a sensor controller configured to detect a change in mutual capacitance between the first electrode member and the second electrode member in a first mode, and configured to detect a change in mutual capacitance between the first conductive member and the second conductive member in a second mode different from the first mode, wherein the plurality of first electrode members are arranged along the second direction to form an electrode row; the first conductive patterns are located in at least one electrode row of the electrode row and are located in a first opening, and the second conductive patterns are located in electrode rows other than the at least one electrode row in which the first conductive patterns are located and are located in the first opening.

[0011] According to some exemplary embodiments of the present invention, a detection sensor includes: a first electrode member located on a base layer and including a plurality of first sensing electrodes, each of the plurality of first sensing electrodes including a first opening and electrically connected to each other along a first direction; a second electrode member located on the base layer and including a plurality of second sensing electrodes, each of the plurality of second sensing electrodes including a second opening and electrically connected to each other along a second direction intersecting the first direction; a first conductive member including a plurality of first conductive patterns electrically connected to each other along the first direction; a second conductive member including a plurality of second conductive patterns electrically connected to each other along the first direction and spaced apart from the first conductive member; and a sensor controller configured to detect a change in mutual capacitance between the first electrode member and the second electrode member in a first mode, and configured to detect a change in mutual capacitance between the second conductive member and the second electrode member or a change in mutual capacitance between the second conductive member and the first electrode member in a second mode different from the first mode, wherein the first conductive patterns are located in the first openings and the second conductive patterns are located in the second openings.

[0012] According to some exemplary embodiments of the present invention, a display device includes: a base substrate; a self-emissive element located on the base substrate; a thin-film encapsulation layer located on the self-emissive element; a first sensing electrode located on the thin-film encapsulation layer and including an opening; a second sensing electrode located on the thin-film encapsulation layer and spaced apart from the first sensing electrode; a conductive pattern located in the opening and spaced apart from the first sensing electrode; and a sensor controller configured to detect a change in the mutual capacitance between the first sensing electrode and the second sensing electrode in a first mode, and configured to detect a change in the mutual capacitance between the conductive pattern and the first sensing electrode in a second mode different from the first mode. Attached Figure Description

[0013] The above and other aspects and features of the invention will become more apparent from the detailed description of some exemplary embodiments of the invention with reference to the accompanying drawings, in which:

[0014] Figure 1 This is a perspective view of a display device according to some exemplary embodiments;

[0015] Figure 2 It is along Figure 1 A sectional view taken by line X1-X1';

[0016] Figure 3 yes Figure 2 An enlarged cross-sectional view of the sensor layer shown;

[0017] Figure 4 yes Figure 2 An enlarged cross-sectional view of the upper insulating layer shown;

[0018] Figure 5 This is a schematic plan view of a display panel included in a display device according to some exemplary embodiments;

[0019] Figure 6A yes Figure 5 An exemplary equivalent circuit diagram of the pixels shown;

[0020] Figure 6B yes Figure 6A An exemplary equivalent circuit diagram of the example of pixel modification shown;

[0021] Figure 7 yes Figure 6A A schematic cross-sectional view of the pixel shown and the display device including the pixel;

[0022] Figure 8 and Figure 9 This is an exemplary block diagram of a detection sensor according to an embodiment included in a display device, according to some exemplary embodiments, wherein, Figure 8This is a block diagram illustrating the operation of the detection sensor in a first mode, and Figure 9 This is a block diagram illustrating the operation of the detection sensor in the second mode;

[0023] Figure 10 It is shown Figure 8 and Figure 9 The view shown is a plan view of the detection sensors, which is a sensor layer of each of the detection sensors and the connection relationship between the sensor layer and the sensor controller.

[0024] Figure 11 yes Figure 10 A magnified plan view of part of Qa;

[0025] Figure 12 yes Figure 11 An enlarged plan view of the first conductive pattern shown;

[0026] Figure 13 yes Figure 11 An enlarged plan view of the third conductive pattern shown;

[0027] Figure 14 yes Figure 11 A magnified planar view of part of the Qc;

[0028] Figure 15 It is along Figure 11 A cross-sectional view of the sensor layer taken by line X3-X3';

[0029] Figure 16 It is along Figure 11 A cross-sectional view of the sensor layer taken by line X5-X5';

[0030] Figure 17 yes Figure 10 A magnified plan view of part of Qb;

[0031] Figure 18 It is along Figure 17 A cross-sectional view of the sensor layer taken by line X7-X7';

[0032] Figure 19 This is a block diagram illustrating the operation of a detection sensor in a first mode and the operation of a detection sensor in a second mode according to some exemplary embodiments;

[0033] Figure 20 This is a view specifically illustrating the connection relationship between the sensor layer and the sensor controller when the detection sensor according to some exemplary embodiments is operating in a first mode;

[0034] Figure 21This is a view specifically illustrating the connection relationship between the sensor layer and the sensor controller when the detection sensor according to some exemplary embodiments is operating in a second mode;

[0035] Figure 22 It is shown Figure 10 A view of an example modification of the detection sensor shown;

[0036] Figure 23 yes Figure 22 A magnified planar view of part of Qd;

[0037] Figure 24 It is along Figure 23 A cross-sectional view of the sensor layer taken by line X9-X9';

[0038] Figure 25 It is shown Figure 10 A view of another modified example of the detection sensor shown;

[0039] Figure 26 yes Figure 25 A magnified planar view of part of Qe;

[0040] Figure 27 It is along Figure 26 A cross-sectional view of the sensor layer taken by line X11-X11';

[0041] Figure 28 It is along Figure 26 A cross-sectional view of the sensor layer taken by line X13-X13';

[0042] Figure 29 yes Figure 25 A magnified planar view of part of Qf;

[0043] Figure 30 It is along Figure 29 A cross-sectional view of the sensor layer taken by line X15-X15';

[0044] Figure 31 It is shown Figure 25 A view of an example modification of the detection sensor shown;

[0045] Figure 32 and Figure 33 This is an exemplary block diagram of a detection sensor included in a display device according to some exemplary embodiments, wherein, Figure 32 This is a block diagram illustrating the operation of the detection sensor in a first mode, and Figure 33 This is a block diagram illustrating the operation of the detection sensor in the second mode;

[0046] Figure 34This is a view showing a detection sensor, which is a plan view of the sensor layer of a detection sensor according to some exemplary embodiments and the connection relationship between the sensor layer and the sensor controller;

[0047] Figure 35 This is a block diagram illustrating the operation of a detection sensor in a first mode and the operation of a detection sensor in a second mode according to some exemplary embodiments;

[0048] Figure 36 This is a view specifically illustrating the connection relationship between the sensor layer and the sensor controller when the detection sensor is operating in a first mode, according to some exemplary embodiments;

[0049] Figure 37 This is a view specifically illustrating the connection relationship between the sensor layer and the sensor controller when the detection sensor operates in a second mode, according to some exemplary embodiments;

[0050] Figure 38 , Figure 39 , Figure 40 , Figure 41 , Figure 42 , Figure 43 and Figure 44 It shows Figure 34 A view of an example modification of the detection sensor shown;

[0051] Figure 45 and Figure 46 This is an exemplary block diagram of a detection sensor included in a display device according to some exemplary embodiments, wherein, Figure 45 This is a block diagram illustrating the operation of the detection sensor in a first mode, and Figure 46 This is a block diagram illustrating the operation of the detection sensor in the second mode;

[0052] Figure 47 This is a view showing a detection sensor, which is a plan view of the sensor layer of a detection sensor according to some exemplary embodiments and the connection relationship between the sensor layer and the sensor controller;

[0053] Figure 48 yes Figure 47 A magnified planar view of part of Qg;

[0054] Figure 49 It is along Figure 48 A cross-sectional view of the sensor layer taken by line X17-X17';

[0055] Figure 50 This is a block diagram illustrating the operation of a detection sensor in a first mode and the operation of a detection sensor in a second mode according to some exemplary embodiments;

[0056] Figure 51 This is a view specifically illustrating the connection relationship between the sensor layer and the sensor controller when the detection sensor is operating in a first mode, according to some exemplary embodiments;

[0057] Figure 52 This is a view specifically illustrating the connection relationship between the sensor layer and the sensor controller when the detection sensor operates in a second mode, according to some exemplary embodiments;

[0058] Figure 53 This is a view illustrating the proximity detection operation of a detection sensor according to some exemplary embodiments;

[0059] Figure 54 It is shown Figure 47 A view of an example modification of the detection sensor shown;

[0060] Figure 55 yes Figure 54 A magnified plan view of part of Qh;

[0061] Figure 56 It is along Figure 55 A cross-sectional view of the sensor layer taken by line X19-X19';

[0062] Figure 57 It is shown Figure 54 A view of an example modification of the detection sensor shown;

[0063] Figure 58 yes Figure 57 A magnified plan view of part of Qi;

[0064] Figure 59 It is along Figure 58 A cross-sectional view of the sensor layer taken by line X21-X21'; and

[0065] Figure 60 , Figure 61 , Figure 62 , Figure 63 and Figure 64 It is shown Figure 47 A view of a modified example of the detection sensor shown. Detailed Implementation

[0066] The invention will now be described more fully below with reference to the accompanying drawings, in which exemplary embodiments of the invention are illustrated. However, the invention may be embodied in different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art. Throughout the specification, the same reference numerals denote the same parts. In the drawings, the thickness of layers and regions is exaggerated for clarity.

[0067] It will also be understood that when a layer is referred to as being "on" another layer or substrate, the layer may be directly on that other layer or substrate, or there may be an intermediate layer. Conversely, when an element is referred to as being "directly" on another element, there is no intermediate element.

[0068] It will be understood that while the terms first, second, etc., may be used herein to describe various elements, components, regions, layers, and / or sections, these elements, components, regions, layers, and / or sections should not be limited by these terms. These terms are used only to distinguish one element, component, region, layer, or section from another region, layer, or section. Therefore, without departing from the teachings of the inventive concept, the first element, first component, first region, first layer, or first section discussed below may be referred to as a second element, second component, second region, second layer, or second section.

[0069] Embodiments are described herein with reference to plan and sectional views, which are schematic diagrams of preferred embodiments of the present disclosure. Therefore, deviations in the illustrated shapes due to, for example, manufacturing techniques and / or tolerances will be expected. Consequently, embodiments of the present disclosure should not be construed as limited to specific shapes of the regions shown herein, but should be understood to include deviations in shape due to, for example, manufacturing processes. Therefore, the regions shown in the figures are schematic in nature, and their shapes are not intended to show the actual shapes of the regions of the device, nor are they intended to limit the scope of the present disclosure.

[0070] The dimensions, number, and thickness of each component shown in the accompanying drawings are for ease of description, and the invention is not necessarily limited to the dimensions, number, and thickness of each of the components shown.

[0071] In the following description, embodiments of the invention will be illustrated with reference to the accompanying drawings.

[0072] Figure 1 This is a schematic perspective view of a display device according to some exemplary embodiments.

[0073] Reference Figure 1The display device 1 can be applied to portable terminals, etc. Portable terminals may include desktop PCs, smartphones, personal digital assistants (PDAs), portable multimedia players (PMPs), game consoles, and watch-type electronic devices. However, the present invention is not limited to a specific type of display device 1. For example, in another embodiment of the present invention, the display device 1 can be used not only in large electronic devices such as televisions and external billboards, but also in medium and small electronic devices such as personal computers, laptops, car navigation systems, smartwatches, cameras, and monitors.

[0074] Unless otherwise specified, in this specification, "upper," "above," "top," "upper side," or "upper surface" means the side pointed to by a third arrow pointing to the z direction, which intersects the first direction x and the second direction y based on the drawings, and "below," "under," "bottom," "lower side," or "lower surface" means the side opposite to the direction pointed to by the third arrow pointing to the z direction.

[0075] In some embodiments, the display device 1 may be a rigid display device or a flexible display device.

[0076] Display device 1 may include two short sides extending in a first direction x and two long sides extending in a second direction y intersecting the first direction x. In display device 1, the edges where the long sides intersect the short sides may be right angles, but are not limited to this. In another example, the edges of display device 1 may form curved surfaces. Optionally, the edges of display device 1 may be chamfered to reduce the risk of breakage. Furthermore, the planar shape of display device 1 is not limited to the shape shown in the figure and may be circular or other shapes.

[0077] When the display device 1 is divided into regions based on whether an image is displayed, the display device 1 includes a display area IDA for displaying an image and a peripheral area INDA adjacent to the display area IDA. The display area IDA is the area where the image is displayed, and the peripheral area INDA is the area where no image is displayed.

[0078] In some embodiments, the planar shape of the display area IDA may be substantially rectangular. In some embodiments, the display area IDA may be substantially flat, but is not limited thereto. In some other embodiments, the portions adjacent to the two long sides of the display area IDA may have curved surfaces, or may be curved toward the lower side of the display device 1. In some other embodiments, the portions adjacent to the two short sides of the display area IDA may have curved surfaces, or may be curved toward the lower side of the display device 1. In some other embodiments, both the portions adjacent to the two long sides and the portions adjacent to the two short sides of the display area IDA may have curved surfaces, or may be curved toward the lower side of the display device 1.

[0079] The outer area INDA can surround the display area IDA.

[0080] Display device 1 may include a detection sensor. In some embodiments, the detection sensor may serve as an input device for display device 1 and may replace a physical button. In some embodiments, the detection sensor may detect the approach of an object on display device 1.

[0081] Figure 2 It is along Figure 1 The sectional view taken by line X1-X1'. Figure 3 yes Figure 2 The enlarged cross-sectional view of the sensor layer shown, and Figure 4 yes Figure 2 The enlarged cross-sectional view of the upper insulating layer shown.

[0082] Reference Figures 2 to 4 The display device 1 includes a display panel DP and a detection sensor. The detection sensor may include a sensor layer TSL located on the display panel DP. The display panel DP generates an image. The detection sensor can acquire coordinate information related to external input (touch event) and detect the proximity of an object.

[0083] According to some exemplary embodiments, the display device 1 may further include a protective member located on the lower side of the display panel DP, an anti-reflective member located on the upper side of the sensor layer TSL, and / or a window member.

[0084] The type of display panel (DP) is not particularly limited. For example, a display panel (DP) can be a self-emissive display panel, such as an organic light-emitting display panel (OLED panel), a quantum dot light-emitting display panel (QLED panel), a micro-light-emitting diode display panel, or a nano-light-emitting diode display panel. In some embodiments, a self-emissive display panel may include a self-emissive element. According to some exemplary embodiments, the self-emissive element may include at least one of organic light-emitting diodes, quantum dot light-emitting diodes, micron-sized light-emitting diodes based on inorganic materials (e.g., micron-sized light-emitting diodes), and nano-sized light-emitting diodes based on inorganic materials (e.g., nano-light-emitting diodes). Hereinafter, for ease of description, the case where the self-emissive element is an organic light-emitting diode will be described as an example.

[0085] The display panel DP may include a base substrate 110, a component layer DSL on the base substrate 110, and an upper insulating layer TFL on the component layer DSL.

[0086] The base substrate 110 is the substrate supporting the element layer DSL. In some embodiments, the base substrate 110 may include an insulating material. In some embodiments, the base substrate 110 may be a flexible substrate and may include an insulating material such as a polymer resin. Examples of polymer resins include polyethersulfone (PES), polyacrylate (PA), polyarylate (PAR), polyetherimide (PEI), polyethylene naphthalate (PEN), polyethylene terephthalate (PET), polyphenylene sulfide (PPS), polyallyl ester, polyimide (PI), polycarbonate (PC), cellulose triacetate (CAT), cellulose acetate propionate (CAP), and combinations thereof. However, the invention is not limited thereto, and the base substrate 110 may be a rigid substrate.

[0087] The element layer DSL is located on the base substrate 110. In some embodiments, the element layer DSL may include a plurality of pixels and a plurality of display signal lines located on the base substrate 110. Each of the pixels may include a thin-film transistor (TFT), a capacitor, and a light-emitting element, which will be described later. The plurality of display signal lines may include scan lines that transmit scan signals to each of the pixels and data lines that transmit data signals to each of the pixels.

[0088] In some implementations, pixels included in the element layer DSL can be arranged in the display area IDA.

[0089] The component layer DSL can be located on the base substrate 110 and may further include components and wiring arranged in the peripheral region INDA. The components and wiring can generate various signals applied to the pixels and can transmit the corresponding signals to the pixels. An upper insulating layer TFL can be located on the component layer DSL. The upper insulating layer TFL protects the component layer DSL.

[0090] like Figure 4 As shown, the upper insulating layer TFL may include a thin film encapsulation layer TFE, and may also include a capping layer CPL.

[0091] The thin-film encapsulation layer TFE may include a first inorganic layer IOL1, an organic layer OL, and a second inorganic layer IOL2.

[0092] The capping layer CPL can be located on the element layer DSL, and in some embodiments, it can be located on the cathode electrode of the element layer DSL. In some embodiments, the capping layer CPL can be in contact with the cathode electrode. The capping layer CPL can include an organic material.

[0093] The first inorganic layer IOL1 is located on and in contact with the capping layer CPL. The organic layer OL is located on and in contact with the first inorganic layer IOL1. The second inorganic layer IOL2 is located on and in contact with the organic layer OL.

[0094] The capping layer CPL protects the cathode electrode from subsequent processes such as sputtering and improves the luminous efficiency of the self-emissive element. The capping layer CPL can have a higher refractive index than the first inorganic layer IOL1.

[0095] The first inorganic layer IOL1 and the second inorganic layer IOL2 protect the element layer DSL from moisture / oxygen. The organic layer OL protects the element layer DSL from foreign matter such as dust particles. The first inorganic layer IOL1 and the second inorganic layer IOL2 can be any one of a silicon nitride layer, a silicon oxide nitride layer, and a silicon oxide layer. Each of the first inorganic layer IOL1 and the second inorganic layer IOL2 can be any one of a silicon nitride layer, a silicon oxide nitride layer, and a silicon oxide layer. According to some exemplary embodiments, each of the first inorganic layer IOL1 and the second inorganic layer IOL2 may include a titanium oxide layer, an aluminum oxide layer, etc. The organic layer OL may include an acrylic organic layer, but is not limited thereto.

[0096] In embodiments of the present invention, an inorganic layer, such as a lithium fluoride (LiF) layer, may be further located between the capping layer CPL and the first inorganic layer IOL1. The lithium fluoride (LiF) layer can improve the luminous efficiency of the self-emissive element.

[0097] The sensor layer TSL can be located on the upper insulating layer TFL. In some embodiments, the sensor layer TSL can be located on the thin-film encapsulation layer TFE, and there may be no separate adhesive layer (e.g., an adhesive layer, etc.) between the thin-film encapsulation layer TFE and the sensor layer TSL. Illustratively, at least one of the electrode components, conductive components, and wiring included in the sensor layer TSL can be directly located on the thin-film encapsulation layer TFE. Optionally, when a separate buffer layer or insulating layer is located between the sensor layer TSL and the thin-film encapsulation layer TFE, at least one of the electrode components, conductive components, and wiring of the sensor layer TSL can be directly located on the insulating layer on the thin-film encapsulation layer TFE. That is, the base layer providing the base surface to the sensor layer TSL can be the thin-film encapsulation layer TFE itself, or it can include the thin-film encapsulation layer TFE.

[0098] The detection sensor, including the sensor layer TSL, can recognize the user's touch input and the location of the touch input. Here, touch input can include situations where an object, such as a finger or stylus, directly contacts the display device 1. The detection sensor, including the sensor layer TSL, can detect the user's approach or the approach of an object. Here, approach includes the concept of an approach event, such as a situation where the user or object is close to the display surface of the display device 1 but does not make physical or mechanical contact with the display device 1. Furthermore, approach can include proximity touch, such as a situation where an object is located above the display device 1 near the display surface of the display device 1 without contacting the display surface of the display device 1. Illustratively, the detection sensor, including the sensor layer TSL, can detect objects such as the user's face, the user's ears, etc., located near the display surface of the display device 1 or within a certain distance (e.g., a set distance or a preset distance) from the display surface of the display device 1.

[0099] That is, the detection sensor can be used as a proximity sensor and also as a touch sensor.

[0100] In some implementations, the detection sensor can combine touch detection and proximity detection functions and can detect multiple types of touch, such as short (click) touch, long touch, multiple touch, drag touch, tap touch, zoom in touch, zoom out touch, swipe touch, and hover touch.

[0101] In some embodiments, the detection sensor including the sensor layer TSL can detect whether a touch or proximity event has occurred capacitively. Capacitively, touch or proximity events can be detected using self-capacitance or mutual capacitance. Hereinafter, for ease of explanation, the case where the sensor layer TSL has a mutual capacitance structure will be described as an example, but the invention is not limited thereto.

[0102] In some implementations, the portion of the sensor layer TSL located in the display area IDA may include electrode components, and the portion of the sensor layer TSL located in the peripheral area INDA may include wiring for transmitting signals to and / or receiving signals from the electrode components.

[0103] The lamination structure of the sensor layer TSL is described, and in some embodiments, such as Figure 3 As shown, the sensor layer TSL may include a first conductive layer ML1, an insulating layer IL, and a second conductive layer ML2.

[0104] The first conductive layer ML1 may include an opaque conductive material. In some embodiments, the first conductive layer ML1 may include a metal or alloy thereof such as gold (Au), silver (Ag), aluminum (Al), molybdenum (Mo), chromium (Cr), titanium (Ti), nickel (Ni), neodymium (Nd), copper (Cu), or platinum (Pt). In some embodiments, the first conductive layer ML1 may have a single-layer structure or a multi-layer structure. Illustratively, the first conductive layer ML1 may have a titanium / aluminum / titanium three-layer structure.

[0105] An insulating layer IL may be located on the first conductive layer ML1. The insulating layer IL may be located between the first conductive layer ML1 and the second conductive layer ML2. The insulating layer IL may include an insulating material. In some embodiments, the insulating material may be an inorganic insulating material or an organic insulating material. Inorganic insulating materials may include at least one selected from aluminum oxide, titanium oxide, silicon oxide, silicon nitride oxide, zirconium oxide, and hafnium oxide. Organic insulating materials may include at least one selected from acrylic resin, methacrylic resin, polyisoprene, vinyl resin, epoxy resin, polyurethane resin, cellulose resin, siloxane resin, polyimide resin, polyamide resin, and naphthalene-containing resin.

[0106] The second conductive layer ML2 may be located on the insulating layer IL. In some embodiments, the second conductive layer ML2 may include a light-transmitting conductive material. Illustratively, the light-transmitting conductive material may be silver nanowires (AgNW), indium tin oxide (ITO), indium zinc oxide (IZO), zinc antimony oxide (AZO), indium tin zinc oxide (ITZO), zinc oxide (ZnO), tin oxide (SnO2), carbon nanotubes, graphene, or a conductive polymer (e.g., PEDOT). Optionally, the second conductive layer ML2 may include a conductive material such as a metal or its alloy, as long as light transmittance is ensured. The metal may be gold (Au), silver (Ag), aluminum (Al), molybdenum (Mo), chromium (Cr), titanium (Ti), nickel (Ni), neodymium (Nd), copper (Cu), or platinum (Pt). In some embodiments, when the second conductive layer ML2 is made of a metal or its alloy, the second conductive layer ML2 may have a mesh structure to prevent the user from visually identifying the second conductive layer ML2. In the following description, the case where the second conductive layer ML2 has a grid structure will be used as an example.

[0107] Figure 5 This is a schematic plan view of a display panel included in a display device according to some exemplary embodiments. Figure 6A yes Figure 5 An exemplary equivalent circuit diagram of the pixels shown. Figure 6B yes Figure 6A An exemplary equivalent circuit diagram of the pixel modification example shown, and Figure 7 yes Figure 6A The pixel shown is a schematic cross-sectional view of the display device including the pixel.

[0108] Reference Figures 5 to 7 The display panel DP or the base substrate 110 is defined with Figure 1 The display area IDA and peripheral area INDA of the display device 1 shown correspond to the display area DA and non-display area NDA. In the following text, the case of one area and another area corresponding to each other means that the two areas overlap, and is not limited to the case where the two areas have the same area.

[0109] In the display area DA, multiple signal lines SGL and multiple pixels PX can be arranged on the base substrate 110.

[0110] In the non-display area NDA, the signal pad portion DPD may be located on the base substrate 110. In some embodiments, in the non-display area NDA, the sensor pad portions TPD1 and TPD2, which are connected to wiring included in the sensor layer TSL, may also be located on the base substrate 110. In some embodiments, the signal pad portion DPD and the sensor pad portions TPD1 and TPD2 may be located on one side of the display area DA, for example, based on the figures, they may be located on the lower side of the display area DA.

[0111] In the non-display area NDA, the scan driver GDC may be located on the base substrate 110. The scan driver GDC can generate a scan signal and transmit the scan signal to the scan line GL. In some embodiments, based on the figures, the scan driver GDC may be located to the left of the display area DA. According to some exemplary embodiments, the scan driver GDC may also be located to the right of the display area DA.

[0112] The signal line SGL, pixel PX, and signal pad portion DPD can be included in the component layer DSL. In some embodiments, the component layer DSL may also include sensor pad portions TPD1 and TPD2.

[0113] The signal line SGL may include the scan line GL, the data line DL, the connection signal line CSL, and the power line PL.

[0114] The scan line GL is connected to the scan driver GDC and the corresponding pixel PX among the multiple pixels PX to transmit scan signals to that pixel PX.

[0115] The data line DL is connected to the corresponding pixel PX among multiple pixels PX to transmit data signals to that pixel PX.

[0116] The power line PL is connected to multiple pixels PX to transmit drive voltage to the pixels PX.

[0117] The signal pad portion DPD is located in the non-display area NDA and can be connected to signal lines SGL, such as data lines DL and connection signal lines CSL. The signal pad portion DPD can receive data signals from the outside and can receive scan signals from the scan driver GDC.

[0118] In some implementations, each scan line GL may extend along a first direction x, and the data line DL may extend along a second direction y. In some implementations, the power line PL may extend along the second direction y, just like the data line DL, but this is not a limitation.

[0119] Figure 6A It shows an arbitrary scan line GL, an arbitrary data line DL, a power line PL, and the pixel PX connected to them.

[0120] Pixel PX includes a self-emissive element ELD and a first transistor T1 (or switching transistor), a second transistor T2 (or driving transistor), and a storage capacitor Cst as pixel driving circuitry for driving the self-emissive element ELD. A first power supply voltage ELVDD is provided to the second transistor T2, and a second power supply voltage ELVSS is provided to the self-emissive element ELD. The second power supply voltage ELVSS may be lower than the first power supply voltage ELVDD.

[0121] The first transistor T1 outputs a data signal applied to the data line DL in response to a scan signal applied to the scan line GL. The storage capacitor Cst is charged using a voltage corresponding to the data signal received from the first transistor T1. The second transistor T2 is connected to a self-emissive element ELD. The second transistor T2 controls the drive current flowing through the self-emissive element ELD in response to the amount of charge stored in the storage capacitor Cst.

[0122] This equivalent circuit is merely one implementation and is not limited thereto. Pixel PX may also include multiple transistors and a greater number of capacitors. The second transistor T2 may be connected between the power line PL and the self-emissive element ELD.

[0123] In some embodiments, as described above, the self-emissive element ELD can be an organic light-emitting diode. However, the present invention is not limited thereto, and the self-emissive element ELD can be any one of quantum dot light-emitting diodes, inorganic material-based light-emitting diodes, inorganic material-based micron-sized light-emitting diodes, and inorganic material-based nano-sized light-emitting diodes.

[0124] However, the circuit structure of the pixel PX is not limited to Figure 6A The circuit structure shown can be modified in various ways.

[0125] Figure 6B yes Figure 6A An exemplary equivalent circuit diagram of the pixel modification example shown. For ease of description, Figure 6B The scan line GL, power line PL, and data line DL are omitted. Figure 6B The signal applied to the circuit is shown in the figure.

[0126] Apart from Figure 6A In addition, refer to Figure 6B The circuitry of the pixel in the modified example includes a self-emissive element ELD, multiple transistors T1 to T7, and a storage capacitor Cst. Data signal DATA, first scan signal Gw-p, second scan signal Gw-n, third scan signal GI, light emission control signal EM, first power supply voltage ELVDD, second power supply voltage ELVSS, and initialization voltage VINT are applied. Figure 6B The circuitry of pixels.

[0127] The self-emissive light-emitting element (ELD) includes an anode electrode and a cathode electrode. The storage capacitor (Cst) includes a first electrode and a second electrode.

[0128] The plurality of transistors may include first transistor T1 through seventh transistor T7. Each of transistors T1 through T7 includes a gate electrode, a first electrode, and a second electrode. One of the first electrode and the second electrode of each of transistors T1 through T7 is a source electrode, and the other of the first electrode and the second electrode of each of transistors T1 through T7 is a drain electrode.

[0129] Each of transistors T1 through T7 can be a thin-film transistor. Each of transistors T1 through T7 can be either a PMOS transistor or an NMOS transistor. In some embodiments, the first transistor T1 as a driving transistor, the second transistor T2 as a data transmission transistor, the fifth transistor T5 as a first light-emitting control transistor, and the sixth transistor T6 as a second light-emitting control transistor are PMOS transistors. Conversely, the third transistor T3 as a compensation transistor, the fourth transistor T4 as a first initialization transistor, and the seventh transistor T7 as a second initialization transistor are NMOS transistors. PMOS transistors and NMOS transistors have different characteristics. The third transistor T3, the fourth transistor T4, and the seventh transistor T7 can be configured as NMOS transistors with relatively high cutoff characteristics, thereby reducing leakage of drive current during the light-emitting period of the self-emissive element ELD.

[0130] However, the present invention is not limited thereto, and all of transistors T1 to T7 may be PMOS transistors. In the following description, for ease of description, the case in which the first transistor T1, the second transistor T2, the fifth transistor T5, and the sixth transistor T6 are PMOS transistors and the third transistor T3, the fourth transistor T4, and the seventh transistor T7 are NMOS transistors will be described as an example.

[0131] Each configuration will be described in detail below.

[0132] The gate electrode of the first transistor T1 is connected to the first electrode of the storage capacitor Cst. The first electrode of the first transistor T1 is connected to the first power supply voltage ELVDD terminal via the fifth transistor T5. The second electrode of the first transistor T1 is connected to the anode electrode of the self-emissive element ELD via the sixth transistor T6. The first transistor T1 receives the data signal DATA according to the switching operation of the second transistor T2 and provides drive current to the self-emissive element ELD.

[0133] The gate electrode of the second transistor T2 is connected to the first scan signal Gw-p terminal. The first electrode of the second transistor T2 is connected to the data signal DATA terminal. The second electrode of the second transistor T2 is connected to the first power supply voltage ELVDD terminal via the fifth transistor T5, and is also connected to the first electrode of the first transistor T1. The second transistor T2 is turned on according to the first scan signal Gw-p to perform a switching operation that transmits the data signal DATA to the first electrode of the first transistor T1.

[0134] The gate electrode of the third transistor T3 is connected to the second scan signal Gw-n terminal. The first electrode of the third transistor T3 is connected to the anode electrode of the self-emissive element ELD via the sixth transistor T6, and is also connected to the second electrode of the first transistor T1. The second electrode of the third transistor T3 is connected to the first electrode of the storage capacitor Cst, the first electrode of the fourth transistor T4, and the gate electrode of the first transistor T1. The third transistor T3 is turned on according to the second scan signal Gw-n to connect the gate electrode and the second electrode of the first transistor T1 to each other, thereby connecting the first transistor T1 diode. Therefore, a voltage difference can be generated between the first electrode and the gate electrode of the first transistor T1 by the threshold voltage of the first transistor T1, and a data signal DATA to compensate for the threshold voltage can be supplied to the gate electrode of the first transistor T1, thereby compensating for the threshold voltage deviation of the first transistor T1.

[0135] The gate electrode of the fourth transistor T4 is connected to the third scan signal GI terminal. The second electrode of the fourth transistor T4 is connected to the initialization voltage VINT terminal. The first electrode of the fourth transistor T4 is connected to the first electrode of the storage capacitor Cst, the second electrode of the third transistor T3, and the gate electrode of the first transistor T1. The fourth transistor T4 is turned on according to the third scan signal GI to transmit the initialization voltage VINT to the gate electrode of the first transistor T1, thereby performing the operation of initializing the voltage of the gate electrode of the first transistor T1.

[0136] The gate electrode of the fifth transistor T5 is connected to the EM terminal for the light emission control signal. The first electrode of the fifth transistor T5 is connected to the ELVDD terminal for the first power supply voltage. The second electrode of the fifth transistor T5 is connected to the first electrode of the first transistor T1 and the second electrode of the second transistor T2.

[0137] The gate electrode of the sixth transistor T6 is connected to the light-emitting control signal EM terminal. The first electrode of the sixth transistor T6 is connected to the second electrode of the first transistor T1 and the first electrode of the third transistor T3. The second electrode of the sixth transistor T6 is connected to the anode electrode of the self-emissive element ELD.

[0138] The fifth transistor T5 and the sixth transistor T6 are simultaneously turned on according to the light emission control signal EM, so that the driving current flows through the self-emissive element ELD.

[0139] The gate electrode of the seventh transistor T7 is connected to the light emission control signal EM terminal. The first electrode of the seventh transistor T7 is connected to the anode electrode of the self-emissive element ELD. The second electrode of the seventh transistor T7 is connected to the initialization voltage VINT terminal. The seventh transistor T7 is turned on according to the light emission control signal EM to initialize the anode electrode of the self-emissive element ELD.

[0140] Although the seventh transistor T7 receives the same light-emitting control signal EM as the fifth transistor T5 and the sixth transistor T6, because the seventh transistor T7 is an NMOS transistor while the fifth transistor T5 and the sixth transistor T6 are PMOS transistors, the seventh transistor T7, the fifth transistor T5, and the sixth transistor T6 can be turned on at different times. That is, when the light-emitting control signal EM is high, the seventh transistor T7 is turned on and the fifth transistor T5 and the sixth transistor T6 are turned off. When the light-emitting control signal EM is low, the seventh transistor T7 is turned off and the fifth transistor T5 and the sixth transistor T6 are turned on. Therefore, the initialization operation of the seventh transistor T7 can be performed outside the light-emitting time when the fifth transistor T5 and the sixth transistor T6 are on, and can be performed outside the light-emitting time when the fifth transistor T5 and the sixth transistor T6 are off.

[0141] Although this embodiment describes the gate electrode of the seventh transistor T7 receiving the light emission control signal EM, according to some exemplary embodiments, the pixel circuit may be configured such that the gate electrode of the seventh transistor T7 receives the third scan signal GI.

[0142] The second electrode of the storage capacitor Cst is connected to the first power supply voltage ELVDD terminal. The first electrode of the storage capacitor Cst is connected to the gate electrode of the first transistor T1, the second electrode of the third transistor T3, and the first electrode of the fourth transistor T4. The cathode electrode of the self-emissive element ELD is connected to the second power supply voltage ELVSS terminal. The self-emissive element ELD receives drive current from the first transistor T1 and emits light to display an image.

[0143] The pixel circuit according to some exemplary embodiments may also include parasitic capacitors Cp-gate and Cn-gate, which affect the recoil voltage on the gate electrode of the first transistor T1. The parasitic capacitors Cp-gate and Cn-gate may include a first parasitic capacitor Cp-gate located between the gate electrode of the first transistor T1 and the gate electrode of the second transistor T2, and a second parasitic capacitor Cn-gate located between the gate electrode of the first transistor T1 and the gate electrode of the third transistor T3. However, the invention is not limited thereto, and the first parasitic capacitor Cp-gate and the second parasitic capacitor Cn-gate may be omitted.

[0144] Furthermore, the circuit structure of the pixel can be modified in various ways. Illustratively, the circuit structure of the pixel can be modified in different ways: including a structure with three transistors and two capacitors other than the parasitic capacitor (e.g., a storage capacitor and a brightness compensation capacitor); including a structure with three transistors and one capacitor other than the parasitic capacitor (e.g., a storage capacitor); including a structure with eight transistors and one capacitor other than the parasitic capacitor (e.g., a storage capacitor), etc.

[0145] Figure 7 It shows the relationship with Figure 6A The equivalent circuit shown is a partial cross-section of the display panel DP, and the sensor layer TSL is also shown.

[0146] An exemplary laminated structure for a display panel (DP) will be described below.

[0147] The buffer layer BFL can be located on the base substrate 110.

[0148] The semiconductor pattern OSP1 of the first transistor T1 (hereinafter referred to as the first semiconductor pattern) and the semiconductor pattern OSP2 of the second transistor T2 (hereinafter referred to as the second semiconductor pattern) may be located on the buffer layer BFL. The first semiconductor pattern OSP1 and the second semiconductor pattern OSP2 may be selected from amorphous silicon, polycrystalline silicon, and metal oxide semiconductor. In some embodiments, either the first semiconductor pattern OSP1 or the second semiconductor pattern OSP2 may be made of polycrystalline silicon, and the other of the first semiconductor pattern OSP1 and the second semiconductor pattern OSP2 may be made of metal oxide semiconductor.

[0149] The first insulating layer 111 is located on the first semiconductor pattern OSP1 and the second semiconductor pattern OSP2.

[0150] The control electrode GE1 of the first transistor T1 (hereinafter referred to as the first control electrode) and the control electrode GE2 of the second transistor T2 (hereinafter referred to as the second control electrode) are located on the first insulating layer 111. When the first control electrode GE1 and the second control electrode GE2 are located on the same layer, they can be used according to the scan line GL (refer to the first insulating layer 111). Figure 5 The first control electrode GE1 and the second control electrode GE2 are fabricated using the same photolithography process. However, the present invention is not limited thereto, and the first control electrode GE1 and the second control electrode GE2 may be located on different layers. In this case, the first control electrode GE1 and the second control electrode GE2 may be fabricated according to the same photolithography process as the scan line GL (refer to...). Figure 5 The same photolithography process is used to fabricate only one of the first control electrode GE1 and the second control electrode GE2.

[0151] A second insulating layer 112 covering the first control electrode GE1 and the second control electrode GE2 is located on the first insulating layer 111. The input electrode SE1 (hereinafter referred to as the first input electrode) and the output electrode DE1 (hereinafter referred to as the first output electrode) of the first transistor T1, and the input electrode SE2 (hereinafter referred to as the second input electrode) and the output electrode DE2 (hereinafter referred to as the second output electrode) of the second transistor T2 are located on the second insulating layer 112.

[0152] In some embodiments, the first insulating layer 111 and the second insulating layer 112 may include inorganic or organic materials.

[0153] The first input electrode SE1 and the first output electrode DE1 are connected to the first semiconductor pattern OSP1 through a first via CHa and a second via CHb penetrating the first insulating layer 111 and the second insulating layer 112, respectively. The second input electrode SE2 and the second output electrode DE2 are connected to the second semiconductor pattern OSP2 through a third via CHc and a fourth via CHd penetrating the first insulating layer 111 and the second insulating layer 112, respectively. Furthermore, according to some exemplary embodiments of the present invention, at least one of the first transistor T1 and the second transistor T2 may be modified to have a bottom-gate structure.

[0154] An organic layer 113 is located on the second insulating layer 112 to cover the first input electrode SE1, the second input electrode SE2, the first output electrode DE1, and the second output electrode DE2. The organic layer 113 can provide a flat surface.

[0155] The pixel-defining layer (PDL) and the self-emissive element (ELD) can be located on the organic layer 113. The pixel-defining layer (PDL) may include organic materials.

[0156] The anode electrode AE ​​is located on the organic layer 113. The anode electrode AE ​​is connected to the second output electrode DE2 through a fifth via CHe penetrating the organic layer 113. The pixel defining layer PDL may define an opening OPN that exposes at least a portion of the anode electrode AE.

[0157] Pixel PX can be located within display area DA. Display area DA may include a light-emitting area PXA and a non-light-emitting area NPXA adjacent to the light-emitting area PXA. The non-light-emitting area NPXA may surround the light-emitting area PXA. According to some exemplary embodiments, the light-emitting area PXA is defined to correspond to the portion of the anode electrode AE ​​exposed by the opening OPN.

[0158] According to some exemplary embodiments, the light-emitting region PXA may overlap with at least one of the first transistor T1 and the second transistor T2. Therefore, the opening OPN can be enlarged, and the anode electrode AE ​​and the light-emitting layer EML (described later) can also be enlarged.

[0159] The hole control layer HCL can be commonly located in the emitting region PXA and the non-emitting region NPXA. Although not shown separately, it can be found in pixel PX (see [link to relevant documentation]). Figure 5 In the common layer, such as the hole control layer HCL is formed.

[0160] The emissive layer EML is located on the hole control layer HCL. The emissive layer EML can generate light with color (e.g., a set color or a preset color). The emissive layer EML can be located in the region corresponding to the opening OPN. In some embodiments, the emissive layer EML can be formed separately from each of the pixels PX, but is not limited thereto. In another example, at least a portion of the emissive layer EML can be positioned over two or more pixels PX.

[0161] When the self-emissive element ELD is an organic light-emitting diode, the emissive layer EML may include organic materials. That is, in some embodiments, the emissive layer EML may be an organic emissive layer.

[0162] When the self-emissive element (ELD) is a quantum dot light-emitting diode, the emissive layer (EML) may include quantum dot material. That is, in some embodiments, the emissive layer (EML) may be a quantum dot emissive layer.

[0163] Quantum dots can adjust the color of the emitted light according to their particle size, and therefore quantum dots can have a variety of emission colors, such as blue, red, and green.

[0164] The electronic control layer (ECL) is located on the light-emitting layer (EML). The cathode electrode (CE) is located in the pixel (PX).

[0165] The upper insulating layer TFL can be located on the cathode electrode CE, and the sensor layer TSL can be located on the upper insulating layer TFL or the thin film encapsulation layer TFE.

[0166] The anode electrode AE, hole control layer HCL, light-emitting layer EML, electron control layer ECL, and cathode electrode CE located in the light-emitting region PXA can form a self-luminous element ELD.

[0167] That is, the self-emissive element ELD can be defined as all of the portions of the anode electrode AE, hole control layer HCL, light-emitting layer EML, electron control layer ECL, and cathode electrode CE located in the light-emitting region PXA.

[0168] Figure 8 and Figure 9 This is an exemplary block diagram of a detection sensor included in a display device according to some exemplary embodiments, wherein, Figure 8 This is a block diagram illustrating the operation of the detection sensor in a first mode, and Figure 9 This is a block diagram illustrating the operation of the detection sensor in the second mode.

[0169] Reference Figure 8 and Figure 9 The detection sensor TSM can operate in both a first mode and a second mode. In some implementations, such as Figure 8As shown, the TSM sensor can perform touch location detection in the first mode. Furthermore, as... Figure 9 As shown, the detection sensor TSM can perform proximity detection in a second mode. That is, the first mode can be touch mode (or touch detection mode), and the second mode can be proximity mode (or proximity detection mode). Hereinafter, the first mode is also referred to as touch mode, and the second mode as proximity mode. In some embodiments, the detection sensor TSM can operate independently in the first mode (or touch mode) and the second mode (or proximity mode), and can switch between the two modes upon user manual input or when specific conditions occur.

[0170] The detection sensor TSM consists of the sensor layer TSL and the sensor controller TSC.

[0171] The sensor layer TSL may include a plurality of first electrode components 120 and a plurality of second electrode components 130.

[0172] In some implementations, such as Figure 8 As shown, in the first mode, the second electrode component 130 can be electrically connected to the touch driver 210 of the sensor controller TSC and receive a touch drive signal Ts1 for touch detection from the touch driver 210. In the first mode, the first electrode component 120 can be electrically connected to the touch detector 270 of the sensor controller TSC and output a touch detection signal Rs for touch detection to the touch detector 270. That is, in the first mode, the second electrode component 130 can be used as a touch drive electrode component, and the first electrode component 120 can be used as a touch detection electrode component. However, the invention is not limited thereto, and according to some exemplary embodiments, the first electrode component 120 can be a touch drive electrode component that receives the touch drive signal Ts1, and the second electrode component 130 can be a touch detection electrode component that outputs the touch detection signal Rs. Hereinafter, it will be described that when the detection sensor TSM operates in the first mode, the first electrode component 120 is used as a touch detection electrode component, and the second electrode component 130 is used as a touch drive electrode component. However, the invention is not limited thereto.

[0173] In some implementations, such as Figure 9As shown, in the second mode, the second electrode member 130, as described later as the second conductive member 170, can receive a proximity drive signal Ts2 for detecting the approach of an object. Furthermore, in the second mode, the first electrode member 120 can output a proximity detection signal Ps to the proximity detector 290 of the sensor controller TSC for detecting the approach of an object. That is, in the second mode, the second electrode member 130 can be used together with the second conductive member 170 as a proximity drive electrode member, and the first electrode member 120 can be used as a proximity detection electrode member.

[0174] The first electrode component 120 and the second electrode component 130 may overlap with at least one electrode disposed in the display panel DP. For example, when the display panel DP includes a self-emissive element ELD, the first electrode component 120 and the second electrode component 130 may overlap with... Figure 7 The cathode electrode CE of the display panel DP shown overlaps.

[0175] The sensor layer TSL may also include a first conductive member 150 and a second conductive member 170, and may also include a third conductive member 190.

[0176] like Figure 8 and Figure 9 As shown, the first conductive member 150 can be electrically connected to the sensor controller TSC in both a first and a second mode. More specifically, as... Figure 8 As shown, the first conductive member 150 can be electrically connected to the touch detector 270 in a first mode. The first conductive member 150 can detect noise generated in the sensor layer TSL and provide this noise as a noise detection signal Ns to the touch detector 270. Furthermore, as... Figure 9 As shown, the first conductive member 150 can be electrically connected to the proximity detector 290 in the second mode, and can provide the noise detection signal Ns to the proximity detector 290.

[0177] like Figure 8 As shown, the second conductive member 170 may not be connected to the sensor controller TSC in the first mode. In some embodiments, in the first mode, the second conductive member 170 may be in a floating state or may receive a reference voltage such as ground voltage. Figure 9 As shown, the second conductive member 170 can be electrically connected to the touch driver 210 to receive a proximity drive signal Ts2 for detecting the approach of an object.

[0178] like Figure 8 and Figure 9As shown, the third conductive member 190 may not be connected to the sensor controller TSC in the first and second modes. In some embodiments, the third conductive member 190 may be in a floating state in the first and second modes.

[0179] The sensor controller (TSC) can be electrically connected to the sensor layer (TSL). In the first mode (or touch mode), the sensor controller (TSC) can supply a touch drive signal (Ts1) to the sensor layer (TSL) and receive a touch detection signal (Rs) corresponding to the touch drive signal (Ts1) from the sensor layer (TSL) to detect the touch position. Furthermore, in the second mode (or proximity mode), the sensor controller (TSC) can supply a proximity drive signal (Ts2) to the sensor layer (TSL) and receive a proximity detection signal (Ps) corresponding to the proximity drive signal (Ts2) from the sensor layer (TSL) to detect the touch position.

[0180] In some implementations, the sensor controller (TSC) may include a touch driver 210, a touch detector 270, and a proximity detector 290. The sensor controller (TSC) may also include an amplifier circuit 230.

[0181] like Figure 8 As shown, the touch driver 210 can provide a touch drive signal Ts1 for detecting touch input to the second electrode member 130 in a first mode. Furthermore, as... Figure 9 As shown, in the second mode, the touch driver 210 can provide a proximity drive signal Ts2 for proximity detection to the second conductive member 170. In some embodiments, the touch driver 210 can provide the proximity drive signal Ts2 to both the second electrode member 130 and the second conductive member 170 in the second mode.

[0182] like Figure 8 As shown, the touch detector 270 can receive a touch detection signal Rs corresponding to the touch drive signal Ts1 from the first electrode member 120 in a first mode to detect the presence and / or location of a touch input. In some embodiments, the touch detection signal Rs can be the amount of change in mutual capacitance generated between the first electrode member 120 and the second electrode member 130. More specifically, when a touch input occurs, the mutual capacitance changes at the point providing the touch input or at a portion surrounding that point. The touch detector 270 can receive the amount of change in mutual capacitance between the first electrode member 120 and the second electrode member 130 as the touch detection signal Rs, and can detect the presence and / or location of the touch input based on the amount of change in mutual capacitance.

[0183] Furthermore, the touch detector 270 can receive a noise detection signal Ns from the first conductive member 150, and can remove or reduce the noise included in the touch detection signal Rs by using the noise detection signal Ns.

[0184] In some embodiments, the touch detector 270 may include at least one amplifier for amplifying the received touch detection signal Rs, an analog-to-digital converter connected to the output of the amplifier, and a processor. Details will be described later.

[0185] like Figure 9 As shown, the proximity detector 290 can be electrically connected to the first electrode member 120 in a second mode and receive a proximity detection signal Ps from the first electrode member 120 to detect the approach of an object. In some embodiments, the proximity detection signal Ps may include information relating to the amount of change in mutual capacitance between the first electrode member 120 and other components due to the approach of the object. Illustratively, when a proximity drive signal Ts2 is provided to the second conductive member 170 in the second mode, the proximity detection signal Ps may include information relating to the amount of change in mutual capacitance between the second conductive member 170 and the first electrode member 120 due to the approach of the object. Furthermore, when the proximity drive signal Ts2 is further provided not only to the second conductive member 170 but also to the second electrode member 130 in the second mode, the proximity detection signal Ps may include information relating to the amount of change in mutual capacitance between the second conductive member 170 and the first electrode member 120 in the second mode, as well as information relating to the amount of change in mutual capacitance between the second electrode member 130 and the first electrode member 120.

[0186] Furthermore, the proximity detector 290 can be electrically connected to the first conductive member 150 to receive the noise detection signal Ns from the first conductive member 150, and the noise included in the proximity detection signal Ps can be removed or reduced by using the noise detection signal Ns.

[0187] Amplifier circuit 230 can be like Figure 8 As shown, in the first mode, it is electrically connected to the first conductive member 150 and the touch detector 270, and can be as follows: Figure 9 The circuit shown in the second mode is electrically connected to the first conductive member 150 and the proximity detector 290. The amplifier circuit 230 can amplify the noise detection signal Ns received from the first conductive member 150 or adjust its gain value.

[0188] As described above, the sensor controller (TSC) can switch between a first mode (touch mode) and a second mode (proximity mode), and the timing of the operations in the first and second modes can be different from each other. In some embodiments, the switching operation of the sensor controller (TSC) can be implemented by software, firmware, hardware, etc.

[0189] In some embodiments, the touch driver 210, touch detector 270, proximity detector 290, and amplifier circuit 230 may be integrated into a single driver chip (e.g., an IC chip). However, the invention is not limited thereto, and in some embodiments, some of the touch driver 210, touch detector 270, proximity detector 290, and amplifier circuit 230 may be located in a location outside the interior of the driver chip.

[0190] In the following text, reference will be made to Figures 10 to 18 A more detailed description of the detection sensor TSM.

[0191] Figure 10 It is shown Figure 8 and Figure 9 The view shown is a plan view of the detection sensors, specifically the sensor layer of each sensor and the connection relationship between the sensor layer and the sensor controller. Figure 11 yes Figure 10 A magnified plan view of part of Qa. Figure 12 yes Figure 11 An enlarged plan view of the first conductive pattern shown. Figure 13 yes Figure 11 An enlarged plan view of the third conductive pattern shown. Figure 14 yes Figure 11 A magnified plan view of part of Qc. Figure 15 It is along Figure 11 A cross-sectional view of the sensor layer taken by line X3-X3'. Figure 16 It is along Figure 11 A cross-sectional view of the sensor layer taken by line X5-X5'. Figure 17 yes Figure 10 A magnified plan view of part of Qb, and Figure 18 It is along Figure 17 A cross-sectional view of the sensor layer taken by line X7-X7'.

[0192] Reference Figures 10 to 18 ,like Figure 10 As shown, the sensor layer TSL defines a sensing area SA and a non-sensing area NSA. The sensing area SA of the sensor layer TSL can be an area used to sense touch input and the proximity of objects, and the non-sensing area NSA can be an area not used to sense touch input and the proximity of objects.

[0193] The sensing area SA can correspond to Figure 1 The display area IDA of the display device 1 shown is... Figure 5 The display area DA of the display panel DP shown is illustrated. The non-sensing area NSA can correspond to... Figure 1 The peripheral area INDA of the display device 1 shown in the figure Figure 5 The non-display area NDA of the display panel DP is shown in the diagram. In some embodiments, the sensing area SA can be... Figure 5 The display area DA of the display panel DP shown is essentially the same, and the non-sensing area NSA can be the same as... Figure 5 The non-display area NDA of the display panel DP shown is essentially the same.

[0194] A portion of the display panel (DP) may be the base layer (BSL) of the sensor layer (TSL). Illustratively, the thin-film encapsulation layer (TFE) may be the base layer (BSL) of the sensor layer (TSL). In the following text, the terms "base layer (BSL)" and "thin-film encapsulation layer (TFE)" are used interchangeably.

[0195] The sensor layer TSL may be located in the sensing region SA and may include a first electrode component 120, a second electrode component 130, a first conductive component 150, and a second conductive component 170 located on the base layer BSL. The sensor layer TSL may also include a third conductive component 190.

[0196] The first electrode members 120 may extend in a first direction x and may be spaced apart from each other along a second direction y. The first electrode members 120 spaced apart from each other along the second direction y may form an electrode row. Figure 10 The diagram shows four first electrode components 120 arranged sequentially from bottom to top along a second direction y to form a first electrode row RE1, a second electrode row RE2, a third electrode row RE3, and a fourth electrode row RE4. However, the invention is not limited thereto, and the number of first electrode components 120 can be varied.

[0197] The first electrode component 120 may include a plurality of first sensing electrodes 121 arranged along a first direction x and a first connection portion 123 for electrically connecting adjacent first sensing electrodes 121 along the first direction x to each other. In the following description of embodiments, "connection" may specifically mean "connection" in a physical and / or electrical sense. Furthermore, in the following text, "contact" may mean a state in which two or more components are in physical contact with each other.

[0198] In some embodiments, the first sensing electrode 121 may have a rhomboid or square shape, but its shape is not limited to these, and the first sensing electrode 121 may have a variety of shapes such as triangle, rectangle other than rhombus, rectangle other than square, pentagon, circle and bar.

[0199] In some embodiments, the first sensing electrode 121 can be as follows: Figure 14 The second sensing electrode 131 shown has a grid structure to prevent visual recognition by the user. When the first sensing electrode 121 has a grid structure, the first sensing electrode 121 can be arranged so as not to overlap with the light-emitting area PXA of the display panel DP. In other words, the first sensing electrode 121 with a grid structure can be arranged to overlap with the non-light-emitting area NPXA of the display panel DP.

[0200] The first sensing electrode 121 may include a conductive material. The first sensing electrode 121 may be made of the material described above. Figure 3 The second conductive layer ML2 is formed as described above. Specific examples of conductive materials are the same as those described above in the description of the second conductive layer ML2, and therefore will be omitted.

[0201] Since the first sensing electrode 121 is formed by the second conductive layer ML2, the first sensing electrode 121 can be as follows: Figure 16 It is located on the insulating layer IL as shown in the diagram.

[0202] In some embodiments, the first sensing electrodes 121 spaced apart along the second direction y can form an electrode array.

[0203] exist Figure 10 The diagram illustratively illustrates that the first sensing electrode 121 sequentially forms a first electrode array CE1, a second electrode array CE2, a third electrode array CE3, and a fourth electrode array CE4 along a first direction x. However, the invention is not limited thereto, and the number of electrode arrays formed by the first sensing electrode 121 can be varied.

[0204] The first sensing electrode 121 may include an opening. Illustratively, each of the first sensing electrodes 121 located in the first electrode row RE1 and the second electrode row RE2 may include a first opening OP1, and each of the first sensing electrodes 121 located in the third electrode row RE3 and the fourth electrode row RE4 may include a third opening OP3. The first opening OP1 and the third opening OP3 may expose a layer located beneath the first sensing electrode 121. Illustratively, as... Figure 16 and Figure 18 As shown, the first opening OP1 and the third opening OP3 can expose the insulating layer IL located below the first sensing electrode 121.

[0205] The first connection portion 123 can be electrically connected to the first sensing electrode 121 adjacent along the first direction x, and can be in contact with the first sensing electrode 121.

[0206] In some embodiments, the first connection portion 123 may be located on the same layer as the first sensing electrode 121. In some embodiments, the first connection portion 123 may be based on the above-mentioned reference. Figure 3 The second conductive layer ML2 is formed and can be made of the same material as the first sensing electrode 121.

[0207] Since the first connection portion 123 is formed by the second conductive layer ML2, the first connection portion 123 can be as follows: Figure 15 , Figure 16 and Figure 18 It is located on the insulating layer IL as shown in the diagram.

[0208] Although Figure 10 and Figure 17 The diagram shows a first connection portion 123 located between adjacent first sensing electrodes 121 along the first direction x, but the number of first connection portions 123 can vary. For example, two or more first connection portions 123 may also be located between two adjacent first sensing electrodes 121 along the first direction x.

[0209] like Figure 10 As shown, the second electrode members 130 may extend in a second direction y and may be spaced apart from each other in a first direction x. The second electrode members 130 spaced apart from each other along the first direction x may form a row. Figure 10 The diagram illustratively illustrates three second electrode components 130 arranged sequentially along a first direction x, thereby forming a first column CO1, a second column CO2, and a third column CO3. However, the invention is not limited thereto, and the number of second electrode components 130 can be varied.

[0210] The second electrode component 130 may include a plurality of second sensing electrodes 131 arranged along the second direction y and a second connection portion 133 for electrically connecting adjacent second sensing electrodes 131 along the second direction y to each other.

[0211] Multiple second sensing electrodes 131 can be electrically connected to each other along a second direction y. Second sensing electrodes 131 located in different columns can be spaced apart from each other.

[0212] In some embodiments, the second sensing electrodes 131 spaced apart along the first direction x can form a row. Figure 10The example shows that the second sensing electrode 131 is arranged in a first row RO1, a second row RO2, a third row RO3, a fourth row RO4 and a fifth row RO5 along the second direction y from the bottom to the top.

[0213] In some embodiments, some of the rows formed by the second sensing electrodes 131 may be located between two electrode rows formed by the first electrode members 120. Illustratively, the second row RO2 may be located between the first electrode row RE1 and the second electrode row RE2, the third row RO3 may be located between the second electrode row RE2 and the third electrode row RE3, and the fourth row RO4 may be located between the third electrode row RE3 and the fourth electrode row RE4. The first row RO1 may be positioned opposite the second row RO2 and the first electrode row RE1 may be inserted between the first row RO1 and the second row RO2, and the fifth row RO5 may be positioned opposite the fourth row RO4 and the fourth electrode row RE4 may be inserted between the fifth row RO5 and the fourth row RO4. That is, the rows formed by the second sensing electrodes 131 and the electrode rows formed by the first electrode members 120 may be arranged repeatedly along the second direction y.

[0214] The second sensing electrode 131 may include a second opening OP2. For example, at least the center of each of the second sensing electrodes 131 may be open to expose a layer located beneath the second sensing electrode 131. Illustratively, as Figure 15 As shown, the second opening OP2 can expose the insulating layer IL located below the second sensing electrode 131.

[0215] In some embodiments, the area of ​​the second opening OP2 may differ from the areas of the first opening OP1 and the third opening OP3. Illustratively, the area of ​​the second opening OP2 may be larger than the areas of the first opening OP1 and the third opening OP3.

[0216] In some embodiments, the second sensing electrode 131 may have a rhomboid shape in a plan view, but its shape is not limited to this, and the second sensing electrode 131 may have a variety of shapes such as triangle, rectangle, pentagon, circle and bar.

[0217] The second sensing electrode 131 may include a conductive material. The second sensing electrode 131 may be made of the material described above. Figure 3 The second conductive layer ML2 is formed and can be made of the same material as the first sensing electrode 121. In some embodiments, the second sensing electrode 131 can have a mesh structure like the first sensing electrode 121.

[0218] The second connection portion 133 can electrically connect adjacent second sensing electrodes 131 along the second direction y to each other, and can contact the second sensing electrodes 131. In some embodiments, the second connection portion 133 can be formed as a bridge-shaped connection pattern. In some embodiments, the second connection portion 133 can be formed of a different layer than the first sensing electrode 121 and the second sensing electrode 131. Illustratively, the second connection portion 133 can be formed by referring to the above... Figure 3 A first conductive layer ML1 is formed, and may include the conductive material described above in the description of the first conductive layer ML1. Since the second connection portion 133 is formed of the first conductive layer ML1, an insulating layer IL may be located between the second connection portion 133 and the second sensing electrode 131. In some embodiments, such as Figure 11 and Figure 15 As shown, the second sensing electrode 131 can be connected to the second connection portion 133 through the first contact hole CH1 formed in the insulating layer IL.

[0219] In some embodiments, the second sensing electrode 131 may be a touch drive signal Ts1 for detecting the touch position (see reference). Figure 8 The touch driving electrode is a first sensing electrode 121, which can output a touch detection signal Rs for detecting the touch position (see [reference]). Figure 8 The touch sensing electrodes.

[0220] The first conductive member 150 may be located in an electrode row formed by the first electrode member 120. In some embodiments, the first conductive member 150 may be located in an electrode row relatively adjacent to the sensor pad portions TPD1 and TPD2 within the electrode row formed by the first electrode member 120. Illustratively, as Figure 10 As shown, the first conductive member 150 may be located in the first electrode row RE1 and the second electrode row RE2 among the first electrode row RE1, the second electrode row RE2, the third electrode row RE3, and the fourth electrode row RE4. As described above, the first conductive member 150 can output a noise detection signal Ns according to the operation of the detection sensor TSM.

[0221] The first conductive member 150 may include a first conductive pattern 151 and a first connecting line 153. The first conductive pattern 151 may be located in the first opening OP1 of the first sensing electrode 121 and may be spaced apart from the first sensing electrode 121.

[0222] In some embodiments, the first conductive pattern 151 may have the same shape as the first opening OP1. Illustratively, when the first opening OP1 has a rhomboid shape, the first conductive pattern 151 may also have a rhomboid shape.

[0223] The first conductive pattern 151 may include a conductive material. In some embodiments, the first conductive pattern 151 may be derived from the above-mentioned reference. Figure 3 The described second conductive layer ML2 is formed and can be made of the same material as the first sensing electrode 121. In some embodiments, such as Figure 12 As shown, the first conductive pattern 151 may have a grid structure, similar to the first sensing electrode 121.

[0224] The first connecting lines 153 may be located in the same electrode row and may electrically connect adjacent first conductive patterns 151 along the first direction x. In some embodiments, the first connecting lines 153 may be as described above. Figure 3 The first conductive layer ML1 is formed as described. The first connection line 153 may be located below the insulating layer IL, and as... Figure 11 and Figure 16 As shown, the first conductive pattern 151 and the first connecting line 153 can be connected and contact each other through the second contact hole CH2 formed in the insulating layer IL.

[0225] The second conductive member 170 may be located in the electrode row formed by the first electrode member 120, but may be located in a different electrode row than the first conductive member 150. In some embodiments, the second conductive member 170 may be positioned further away from the sensor pad portions TPD1 and TPD2 along the second direction y than the first conductive member 150. Illustratively, as Figure 10 As shown, the second conductive member 170 may be located in the third electrode row RE3 and the fourth electrode row RE4 among the first electrode row RE1, the second electrode row RE2, the third electrode row RE3, and the fourth electrode row RE4. As described above, when the detection sensor TSM operates in the second mode (proximity mode), the second conductive member 170 may receive the proximity drive signal Ts2.

[0226] The second conductive member 170 may include a second conductive pattern 171 and a second connecting line 173.

[0227] The second conductive pattern 171 may be located in the third opening OP3 of the first sensing electrode 121 and may be spaced apart from the first sensing electrode 121.

[0228] The second conductive pattern 171 may include a conductive material. In some embodiments, the second conductive pattern 171 may be derived from the above-mentioned reference. Figure 3 The second conductive layer ML2 is formed and can be made of the same material as the first sensing electrode 121. In some embodiments, the second conductive pattern 171 may have the same structure as the first conductive pattern 151, for example, a mesh structure.

[0229] The second connecting line 173 may be located in the same electrode row and may electrically connect adjacent second conductive patterns 171 along the first direction x. In some embodiments, the second connecting line 173 may be as described above. Figure 3 A first conductive layer ML1 is formed. A second connecting line 173 may be located beneath the insulating layer IL. (As described) Figure 17 and Figure 18 As shown, the second conductive pattern 171 and the second connecting line 173 can be connected to and contact each other through the third contact hole CH3 formed in the insulating layer IL.

[0230] The third conductive member 190 may be located in the row formed by the second sensing electrode 131. Illustratively, the third conductive member 190 may be located in the first row RO1, the second row RO2, the third row RO3, the fourth row RO4, and the fifth row RO5 formed by the second sensing electrode 131, respectively.

[0231] The third conductive member 190 may include a third conductive pattern 191. The third conductive pattern 191 may be located in the second opening OP2 of the second sensing electrode 131. When the second opening OP2 is formed in the second sensing electrode 131, a difference in external light reflectivity may occur, and therefore the pattern spot may be visually identifiable from the outside. The third conductive pattern 191 can reduce the difference in external light reflectivity, thereby reducing the possibility of visually identifying the pattern spot from the outside.

[0232] The third conductive pattern 191 may be located in the second opening OP2, but may be spaced apart from the second sensing electrode 131.

[0233] The third conductive pattern 191 may include a conductive material. In some embodiments, the third conductive pattern 191 may be derived from the above-mentioned reference. Figure 3 The second conductive layer ML2 is formed as described, and may be made of the same material as the second sensing electrode 131. In some embodiments, the third conductive pattern 191 may have, for example, […]. Figure 13 The grid structure shown.

[0234] In some implementations, two adjacent third conductive patterns 191 along the first direction x may not be connected to each other, and each of the third conductive patterns 191 may be in a floating state.

[0235] In some embodiments, the third conductive pattern 191 may have the same shape as the second opening OP2. Illustratively, when the second opening OP2 has a rhomboid shape, the third conductive pattern 191 may also have a rhomboid shape.

[0236] The size of the second opening OP2 can be larger than the size of the first opening OP1 or the size of the third opening OP3. Therefore, in some embodiments, the size of the third conductive pattern 191 can be larger than the size of the first conductive pattern 151 or the size of the second conductive pattern 171.

[0237] The non-sensing area (NSA) will be described below.

[0238] In some implementations, such as Figure 10 As shown, in the non-sensing area NSA, wiring 901, 903, 905, 907 and 909 can be arranged on the base layer BSL.

[0239] Schematic, wirings 901, 903, 905, 907, and 909 may include a first wiring 901 connected to one end of each of the second electrode members 130, a second wiring 903 connected to the other end of each of the second electrode members 130, a third wiring 905 connected to each of the first electrode members 120, a fourth wiring 907 connected to all of the first conductive members 150, and a fifth wiring 909 connected to all of the second conductive members 170. Here, the other end of the second electrode member 130 refers to the side of the second electrode member 130 opposite to the end connected to the first wiring 901. That is, the wiring connected to the second electrode member 130 may have a dual-route structure, thereby improving the RC delay caused by the resistance of the second electrode member 130. However, the invention is not limited thereto, and wirings such as... Figure 10 Either the first wiring 901 or the second wiring 903 shown. That is, according to some exemplary embodiments, the wiring connected to the second electrode member 130 may have a single-route structure.

[0240] Multiple first wirings 901 and multiple second wirings 903 can be provided, and each of the first wirings 901 and each of the second wirings 903 can be connected to each of the second electrode members 130. In addition, multiple third wirings 905 can be connected to the first electrode members 120 respectively.

[0241] In some embodiments, unlike the first wiring 901, second wiring 903, and third wiring 905, only one fourth wiring 907 may be provided. The fourth wiring 907 may connect to all of the plurality of first conductive members 150. Therefore, the number of channels or pads allocated to the first conductive members 150 can be reduced, and the area occupied by the fourth wiring 907 in the non-sensing area (NSA) can be reduced. However, the invention is not limited thereto, and two or more fourth wirings 907 may be provided.

[0242] Similar to the fourth wiring 907, only one fifth wiring 909 may be provided. The fifth wiring 909 may connect to all of the plurality of second conductive members 170. Therefore, the number of channels or pads allocated to the second conductive members 170 can be reduced. However, the invention is not limited thereto, and two or more fifth wirings 909 may be provided.

[0243] The first wiring 901, the second wiring 903, the third wiring 905, the fourth wiring 907, and the fifth wiring 909 can be electrically connected to the sensor pad portions TPD1 and TPD2. The sensor pad portions TPD1 and TPD2 can be electrically connected to the sensor controller TSC.

[0244] In some embodiments, sensor pad portions TPD1 and TPD2 may include a first sensor pad portion TPD1 and a second sensor pad portion TPD2 spaced apart from each other along a first direction x. Illustratively, the first sensor pad portion TPD1 may be connected to a first wiring 901, a second wiring 903, a fourth wiring 907, and a fifth wiring 909, and the second sensor pad portion TPD2 may be connected to a third wiring 905. However, the invention is not limited thereto. For example, the first sensor pad portion TPD1 and the second sensor pad portion TPD2 may form a single pad portion without being spaced apart from each other. The wiring connected to the first sensor pad portion TPD1 and the second sensor pad portion TPD2, respectively, may be varied in different ways.

[0245] In the detection sensor TSM according to some exemplary embodiments, since the first sensing electrode 121, the second sensing electrode 131, the first conductive pattern 151, the second conductive pattern 171, and the third conductive pattern 191 are formed on the same layer, they are characterized by being formed simultaneously during the same process, thus simplifying the manufacturing process. Furthermore, since the first sensing electrode 121, the second sensing electrode 131, and the second conductive pattern 171 are located on the same layer, the detection sensor TSM can be implemented in a thin form while simultaneously possessing touch sensing and proximity sensing functions. Moreover, since the detection sensor TSM itself functions as a proximity sensor, it is characterized by the elimination of the need to form a hole for a separate proximity sensor in the display device 1.

[0246] Furthermore, when the detection sensor TSM performs touch sensing and proximity sensing operations, the first conductive member 150 can output a noise detection signal Ns, thereby improving the sensitivity of the detection sensor TSM.

[0247] In the following text, reference will be made to Figure 19 , Figure 20 and Figure 21 The operation of the TSM sensor is described in more detail.

[0248] Figure 19 This is a block diagram illustrating the operation of a detection sensor in a first mode and the operation of a detection sensor in a second mode according to some exemplary embodiments. Figure 20 This is a view specifically illustrating the connection relationship between the sensor layer and the sensor controller when the detection sensor according to some exemplary embodiments is operating in a first mode, and Figure 21 This is a view specifically illustrating the connection relationship between the sensor layer and the sensor controller when the detection sensor according to some exemplary embodiments is operating in a second mode.

[0249] Apart from Figure 10 In addition, refer to Figure 19 , Figure 20 and Figure 21 In some embodiments, the sensor controller (TSC) can perform different operations in a first mode (MD1) and a second mode (MD2). Illustratively, the TSC can perform a touch sensing operation based on the change in mutual capacitance between the first electrode member 120 and the second electrode member 130 during operation in the first mode (MD1), and can perform a proximity sensing operation based on the change in mutual capacitance between the first electrode member 120 and the second conductive member 170 and the change in mutual capacitance between the first electrode member 120 and the second electrode member 130 during operation in the second mode (MD2).

[0250] The sensor controller TSC can switch between the first mode MD1 and the second mode MD2 in response to a control signal (e.g., a set control signal or a preset control signal).

[0251] Schematic, when the sensor controller TSC operates in the first mode MD1, the sensor controller TSC can switch from the first mode MD1 to the second mode MD2 when a specific function or application is executed on the display device 1, a call reception event occurs on the display device 1, a call transmission event occurs on the display device 1, the time during which no touch is detected in the first mode MD1 exceeds a preset value, or a user's mode switching input is provided. Furthermore, illustratively, when the sensor controller TSC operates in the second mode MD2, the sensor controller TSC can switch from the second mode MD2 to the first mode MD1 when a call termination event occurs on the display device 1, a specific function or application is executed on the display device 1, a user's mode switching input is provided, or the time during which no proximity is detected in the second mode MD2 exceeds a preset value.

[0252] However, the foregoing is an example, and in addition, the sensor controller TSC can switch between the first mode MD1 and the second mode MD2 in response to different situations.

[0253] The operation of each component of the sensor controller (TSC) will be described in more detail below.

[0254] In the first mode MD1, the touch driver 210 can provide a touch drive signal Ts1 to the second electrode member 130 via the first wiring 901 and the second wiring 903. In some embodiments, the touch drive signal Ts1 can be provided sequentially to each of the second electrode members 130.

[0255] In the second mode MD2, the touch driver 210 can provide a proximity drive signal Ts2 to the second conductive member 170 via the fifth wiring 909. In some embodiments, in the second mode MD2, the touch driver 210 can provide a proximity drive signal Ts2 to the second electrode member 130 via the first wiring 901 and the second wiring 903. When providing the proximity drive signal Ts2 to the second electrode member 130, the proximity drive signal Ts2 can be provided sequentially to each of the second electrode members 130, or the proximity drive signal Ts2 can be provided to each of the second electrode members 130 simultaneously.

[0256] When a proximity drive signal Ts2 is provided to both the second electrode member 130 and the second conductive member 170, the mutual capacitance used to detect the proximity of an object can be increased. Therefore, it features the ability to drive the detection sensor TSM with relatively low power consumption, the ability to reduce the time spent forming the mutual capacitance and thus reducing the time spent driving the detection sensor TSM, and the ability to improve the signal-to-noise ratio. When the proximity drive signal Ts2 is simultaneously provided to each of the second electrode members 130, it further reduces the time spent driving the detection sensor TSM.

[0257] In the first mode MD1, the touch detector 270 can receive a touch detection signal Rs from the first electrode member 120 via the first wiring 901. In some embodiments, as described above, the touch detection signal Rs may include information related to the mutual capacitance generated between the first electrode member 120 and the second electrode member 130. When a touch drive signal Ts1 is provided to the second electrode member 130, a mutual capacitance Cm is formed between the second electrode member 130 and the first electrode member 120. Furthermore, the mutual capacitance Cm may change when a touch event, such as a touch input, occurs. The first electrode member 120 may output a touch detection signal Rs corresponding to the touch drive signal Ts1, and the touch detection signal Rs output by the first electrode member 120 may be input to the touch detector 270. The touch detector 270 may detect the amount of change in mutual capacitance Cm based on each touch detection signal Rs, and may detect a touch event based on the detected amount of change in mutual capacitance Cm. Illustratively, when the amount of change in mutual capacitance Cm detected based on the touch detection signal Rs exceeds a preset reference value, the touch detector 270 may determine that a touch event has occurred.

[0258] In some embodiments, the touch detector 270 may include a plurality of sensing channels SC electrically connected to the respective first electrode member 120 in a first mode MD1. The touch detector 270 may include at least one analog-to-digital converter (ADC) 273 connected to the sensing channels SC and a processor 275. In the following, although the sensing channels SC and the ADC 273 are described as separate components, according to some exemplary embodiments, the ADC 273 may be provided in each sensing channel SC.

[0259] The sensing channel SC can receive touch detection signals Rs from each of the first electrode members 120, and amplify and output the received touch detection signals Rs. In some embodiments, the sensing channel SC may include an analog front end, which includes at least one amplifier 271 such as an operational amplifier (OP amplifier).

[0260] Amplifier 271 may include a first input terminal 2711, a second input terminal 2713, and an output terminal 2715. According to some exemplary embodiments, the first input terminal 2711 of amplifier 271 (e.g., the inverting input terminal of an OP amplifier) ​​may be electrically connected to the first electrode member 120 via a third wiring 905, and a touch detection signal Rs may be input to the first input terminal 2711.

[0261] In some embodiments, the second input terminal 2713 of amplifier 271 (e.g., the non-inverting input terminal of an operational amplifier) ​​can be electrically connected to the first conductive member 150 or the amplifier circuit 230 via a fourth wiring 907, and a noise detection signal Ns can be provided to the second input terminal 2713 of amplifier 271. Therefore, the reference voltage of amplifier 271 can be changed along with the voltage change of each of the first conductive members 150. That is, the reference potential of amplifier 271 can be changed according to the potential (voltage level) of the first conductive members 150.

[0262] In the first mode MD1, where touch is detected based on changes in mutual capacitance, the potential of the first conductive member 150 can be changed according to noise signals flowing into the sensor layer TSL from the display panel DP, etc. For example, when operating in the first mode MD1, the potential of the first conductive member 150 can be changed in response to common-mode noise flowing into the sensor layer TSL from the display panel DP, etc.

[0263] Therefore, when the first conductive member 150 is further located in the sensing region SA and the reference potential of the amplifier 271 is changed using the noise detection signal Ns detected by the first conductive member 150 when operating in the first mode MD1, the common-mode noise flowing into the sensor layer TSL can be eliminated (or removed). For example, the first electrode member 120 and the first conductive member 150 have corresponding ripples in response to common-mode noise. For example, since the first electrode member 120 and the first conductive member 150 extend in the same direction in the sensing region SA and are arranged at corresponding positions, the first electrode member 120 and the first conductive member 150 receive noise signals of the same or similar shape and / or size. The first electrode member 120 is electrically connected to the first input terminal 2711 of the amplifier 271 via a third wiring 905, and the first conductive member 150 is electrically connected to the second input terminal 2713 of the amplifier 271 via a fourth wiring 907 different from the third wiring 905. Therefore, the noise component (ripples) included in the touch detection signal Rs received from the first electrode member 120 can be effectively eliminated. Therefore, the signal output from the output terminal 2715 of amplifier 271 can be a noise-removed touch detection signal Rs.

[0264] In some embodiments, the sensing channel SC may also include a capacitor C and a reset switch SW connected in parallel between the first input terminal 2711 and the output terminal 2715 of the amplifier 271.

[0265] Meanwhile, according to some exemplary embodiments, amplifier 271 may be implemented as a non-inverting amplifier, but the implementation is not limited thereto. According to some exemplary embodiments, amplifier 271 may be implemented as an inverting amplifier.

[0266] The output terminal 2715 of amplifier 271 can be electrically connected to analog-to-digital converter 273.

[0267] The analog-to-digital converter 273 can convert the input analog signal into a digital signal. According to some exemplary embodiments, the analog-to-digital converter 273 can be configured to be as numerous as the number of first electrode members 120, corresponding to each of the first electrode members 120 in a 1:1 ratio. Alternatively, according to some exemplary embodiments, each of the first electrode members 120 can be configured to share a single analog-to-digital converter 273, and in this case, a separate switching circuit for selecting the sensing channel SC can be further provided.

[0268] Processor 275 processes the converted signal (digital signal) from analog-to-digital converter 273 and detects touch input based on the signal processing result. For example, processor 275 can comprehensively analyze the first detection signal amplified by amplifier 271 and converted by analog-to-digital converter 273 to detect the occurrence and location of touch input. According to some exemplary embodiments, processor 275 can be implemented as a microprocessor (MPU). In this case, the memory required to drive processor 275 can be additionally provided inside touch detector 270. However, the configuration of processor 275 is not limited to this. As another example, processor 275 can be implemented as a microcontroller (MCU), etc.

[0269] The sensor controller TSC may also include an amplifier circuit 230 connected to the first conductive member 150. The amplifier circuit 230 may be connected to the sensing channel SC of the touch detector 270 in a first mode MD1, and may be connected to the sensing channel SCp of the proximity detector 290 in a second mode MD2.

[0270] According to some exemplary embodiments, the amplifier circuit 230 may include at least one amplifier 231. According to some exemplary embodiments, the amplifier 231 may include a first input terminal 2311 connected to the first conductive member 150 via a fourth wiring 907 and a second input terminal 2313 connected to an output terminal 2315 via at least one resistor Ra. According to some exemplary embodiments, the first input terminal 2311 and the second input terminal 2313 may be inverting input terminals and non-inverting input terminals, respectively, but are not limited thereto. For reference, Figure 20 and Figure 21 The resistors Ra and Rb exemplarily illustrate the input and output impedances of amplifier 231.

[0271] The amplifier circuit 230 can receive the noise detection signal Ns from the first conductive member 150 via the fourth wiring 907, and can amplify the noise detection signal Ns to a level corresponding to the gain value of the amplifier 231, and output the amplified noise detection signal Ns. At this time, by adjusting the gain value of the amplifier circuit 230, the magnitude of the noise detection signal Ns provided to the sensing channel SC of the touch detector 270 and the sensing channel SCp of the proximity detector 290 can be easily adjusted. In some embodiments, the gain value of the amplifier circuit 230 can be adjusted such that noise components included in the touch detection signal Rs and proximity detection signal Ps output from the first electrode member 120 can be effectively eliminated in the sensing channel SC.

[0272] According to some exemplary embodiments, the amplifier circuit 230 may include a plurality of variable resistors VR1, VR2, VR3, and VR4 connected in parallel between the output terminal 2315 of the amplifier 231 and a reference power supply (e.g., a predetermined reference power supply), such as ground power supply GND. For example, the amplifier circuit 230 may include variable resistors VR1, VR2, VR3, and VR4 corresponding to the number of sensing channels SC of the touch detector 270 or the sensing channels SCp of the proximity detector 290.

[0273] According to some exemplary embodiments, in the first mode MD1, each of the sensing channels SC of the touch detector 270 can be connected to a different variable resistor among the variable resistors VR1, VR2, VR3, and VR4 provided to the amplifier circuit 230. Illustratively, located in... Figure 20 The second input terminal 2713 of the first sensing channel SC at the top is connected to the first variable resistor VR1, and the second input terminal 2713 of the second sensing channel SC can be connected to the second variable resistor VR2. Furthermore, the second input terminal 2713 of the third sensing channel SC can be connected to the third variable resistor VR3, and the second input terminal 2713 of the fourth sensing channel SC can be connected to the fourth variable resistor VR4. Similar to the first mode MD1, in the second mode MD2, each of the sensing channels SCp of the proximity detector 290 can be connected to a different variable resistor among the variable resistors VR1, VR2, VR3, and VR4 provided to the amplifier circuit 230.

[0274] According to some exemplary embodiments, the gain value of the noise detection signal Ns can be independently adjusted based on the intensity of the noise component in each of the sensing channels SC flowing into the touch detector 270 and each of the sensing channels SCp near the detector 290. Taking the first mode MD1 as an example, for each position of the first electrode member 120, the gain value of the noise detection signal Ns input to the sensing channel SC connected to the first electrode member 120 can be applied differently. For example, in the electrode row formed by the first electrode member 120, when the position is located in Figure 20 The bottommost electrode row is called the first electrode row and will be located at Figure 20 When the uppermost electrode row is referred to as the last electrode row, the intensity of the noise detection signal Ns flowing into the sensor layer TSL can vary from the first electrode row to the last electrode row in the sensing region SA. Illustratively, the intensity of the noise detection signal Ns flowing into the sensor layer TSL can gradually increase from the first electrode row to the last electrode row in the sensing region SA. In this case, the gain value of the noise detection signal Ns can gradually change from the first sensing channel SC connected to the first electrode member 120 of the first electrode row to the last sensing channel SC connected to the first electrode member 120 of the last electrode row. Therefore, the gain value of the noise detection signal Ns can be adjusted independently, so that for each vertical position (e.g., Y coordinate) of the first electrode member 120 in the sensor layer TSL, the noise component included in the touch detection signal Rs or proximity detection signal Ps can be more effectively eliminated.

[0275] Furthermore, according to some exemplary embodiments, during the time period in which the second electrode members 130 are sequentially driven, the resistance values ​​of the variable resistors VR1, VR2, VR3, and VR4 can be adjusted in units of sub-time periods in which each of the second electrode members 130 is driven, thereby independently adjusting the gain value of the noise detection signal Ns in units of sub-time periods. Therefore, the intensity deviation of noise that may also occur for each of the left and right positions (e.g., X-coordinate) of the sensor layer TSL can be compensated for.

[0276] In the second mode MD2, the proximity detector 290 can be electrically connected to the first electrode member 120. When the detection sensor TSM operates in the second mode MD2, the proximity detector 290 can receive a proximity detection signal Ps from the first electrode member 120, and the proximity detector 290 can detect the proximity of an object based on the proximity detection signal Ps.

[0277] As described above, the proximity detection signal Ps may include information related to the mutual capacitance generated between the first electrode member 120 and the second conductive member 170, and may also include information related to the mutual capacitance generated between the first electrode member 120 and the second electrode member 130. When the proximity drive signal Ts2 is provided to the second conductive member 170 and the second electrode member 130, mutual capacitance Cmp is formed between the second electrode member 130 and the first electrode member 120, and between the second conductive member 170 and the first electrode member 120. Furthermore, the mutual capacitance Cmp may change when a proximity event occurs (such as the approach of an object). The first electrode member 120 may output a proximity detection signal Ps corresponding to the proximity drive signal Ts2, and the proximity detection signal Ps output by the first electrode member 120 may be input to the proximity detector 290. Furthermore, the proximity detector 290 may detect the amount of change in mutual capacitance Cmp based on the received proximity detection signal Ps, and may detect the approach of an object based on the detected amount of change in mutual capacitance Cmp. Illustratively, when the change in mutual capacitance Cmp detected based on the received proximity detection signal Ps exceeds a pre-stored reference value, the proximity detector 290 can determine that a proximity event has occurred.

[0278] In some embodiments, proximity detector 290 may have a structure substantially the same as or similar to that of touch detector 270. Illustratively, proximity detector 290 may include a plurality of sensing channels SCp electrically connected to each of the first electrode members 120 in the second mode MD2, and may also include processor 295 and at least one analog-to-digital converter 293 connected to each of the sensing channels SCp.

[0279] The sensing channel SCp may include an amplifier that receives proximity detection signals Ps from each of the first electrode members 120, amplifies and outputs the received proximity detection signals Ps.

[0280] The sensing channel SCp of proximity detector 290 may have substantially the same structure as the sensing channel SC of touch detector 270. Illustratively, the sensing channel SCp of proximity detector 290 may include amplifier 291, which receives and amplifies the received proximity detection signal Ps and outputs it. Amplifier 291 may include a first input terminal 2911, a second input terminal 2913, and an output terminal 2915. The first input terminal 2911 may be electrically connected to the first electrode member 120 via a third wiring 905 to receive the proximity detection signal Ps. The second input terminal 2913 may be electrically connected to the first conductive member 150 or the amplifier circuit 230 via a fourth wiring 907 to receive the noise detection signal Ns. The output terminal 2915 may be electrically connected to analog-to-digital converter 293 to output the proximity detection signal Ps, from which noise has been removed or reduced, to analog-to-digital converter 293.

[0281] In some implementations, the sensing channel SCp may further include a capacitor Cp and a reset switch SWp connected in parallel between the first input terminal 2911 and the output terminal 2915.

[0282] The analog-to-digital converter 293 can convert the input analog signal into a digital signal. According to some exemplary embodiments, the analog-to-digital converter 293 can be configured to be as numerous as the first electrode members 120, thereby corresponding to the first electrode members 120 in a 1:1 ratio.

[0283] Processor 295 processes the signal received from analog-to-digital converter 293 and detects the approach of an object based on the signal processing result. According to some exemplary embodiments, processor 295 may be implemented as a microprocessor (MPU), but the invention is not limited thereto. However, the structure of the proximity detector 290 described above is an example, but not a limitation. Furthermore, the configuration of proximity detector 290 can be varied. Optionally, in some other embodiments, proximity detector 290 is not provided separately, and touch detector 270 can perform proximity detection operations in second mode MD2.

[0284] The detection sensor TSM according to the above embodiment can effectively eliminate noise signals flowing from the display panel DP, etc., and can improve the signal-to-noise ratio. Therefore, the touch sensing sensitivity and proximity sensing sensitivity of the detection sensor TSM based on noise signals can be improved.

[0285] Since the detection sensor TSM according to the above embodiment can detect the approach of an object, it has the characteristics of simplifying the structure of the display device 1 and can omit the feature of separate optical proximity, and therefore, it is not necessary to form an additional hole. In some embodiments, pre-programmed operations of the display device 1 can be output based on the approach of an object. For example, pre-programmed functions include screen lock operation, screen off operation, stopping touch detection of the touch sensor, application invocation, and call reception.

[0286] Figure 22 It is shown Figure 10 A view of an example modification of the detection sensor shown. Figure 23 yes Figure 22 A magnified planar view of part of Qd, and Figure 24 It is along Figure 23 A cross-sectional view of the sensor layer taken by line X9-X9'.

[0287] Reference Figures 22 to 24 According to some exemplary embodiments, the detection sensor TSMa and Figures 10 to 18 The difference between the detection sensor TSM and the implementation of the above method is that the sensor layer TSLa also includes a first connection pattern 175. Other configurations of the detection sensor TSMa are the same as... Figures 10 to 18 The implementation methods are substantially the same or similar. Therefore, the differences will be mainly described below.

[0288] The first connecting pattern 175 can electrically connect adjacent second conductive patterns 171 to each other in the second direction y.

[0289] In some embodiments, the first connection pattern 175 may be formed of a layer different from the second conductive pattern 171. Illustratively, the first connection pattern 175 may be formed of a layer as described above. Figure 3 A first conductive layer ML1 is formed, and may include the conductive material described above in the description of the first conductive layer ML1. Since the first connection pattern 175 is formed by the first conductive layer ML1, an insulating layer IL may be located between the first connection pattern 175 and the second conductive pattern 171. In some embodiments, such as Figure 24 As shown, the first connection pattern 175 and the second conductive pattern 171 can be connected to each other and make direct contact through the fourth contact hole CH4 formed in the insulating layer IL.

[0290] In the detection sensor TSMa, the second conductive members 170 that are adjacent to each other along the second direction y are electrically connected to each other by the first connection pattern 175, and thus it is possible to prevent or reduce signal delay (or RC delay) between the second conductive members 170 located in different electrode rows.

[0291] Figure 25 It is shown Figure 10 A view of another modified example of the detection sensor shown. Figure 26 yes Figure 25 A magnified plan view of part of Qe. Figure 27 It is along Figure 26 A cross-sectional view of the sensor layer taken by line X11-X11'. Figure 28 It is along Figure 26 A cross-sectional view of the sensor layer taken by line X13-X13'. Figure 29 yes Figure 25 A magnified planar view of part of Qf, and Figure 30 It is along Figure 29 A cross-sectional view of the sensor layer taken by line X15-X15'.

[0292] Reference Figures 25 to 29 According to this embodiment, the detection sensor TSMb and Figures 10 to 18 The detection sensor TSM differs from the implementation in that the sensor layer TSLb includes a first conductive member 150-1, a second conductive member 170-1, a third conductive member 190-1, a first auxiliary pattern 181, a second auxiliary pattern 183, and a third auxiliary pattern 185. Other configurations of the detection sensor TSMb are similar to... Figures 10 to 18 The implementation methods are substantially the same or similar. Therefore, the differences will be mainly described below.

[0293] The first conductive pattern 151-1 of the first conductive member 150-1 may include a first auxiliary opening OPa, and the insulating layer IL may be exposed through the first auxiliary opening OPa.

[0294] The first auxiliary pattern 181 may be located in the first auxiliary opening OPa. In some embodiments, the first auxiliary pattern 181 may be spaced apart from the first conductive pattern 151-1 and may be completely surrounded by the first conductive pattern 151-1.

[0295] The second conductive pattern 171-1 of the second conductive member 170-1 may include a second auxiliary opening OPb, and the insulating layer IL may be exposed through the second auxiliary opening OPb.

[0296] A second auxiliary pattern 183, spaced apart from the second conductive pattern 171-1, may be located within the second auxiliary opening OPb. In some embodiments, the second auxiliary pattern 183 may be completely surrounded by the second conductive pattern 171-1.

[0297] The third conductive pattern 191-1 of the third conductive member 190-1 may include a third auxiliary opening OPc, and the insulating layer IL may be exposed through the third auxiliary opening OPc.

[0298] A third auxiliary pattern 185, spaced apart from the third conductive pattern 191-1, can be located within the third auxiliary opening OPc. The third auxiliary pattern 185 can be completely surrounded by the third conductive pattern 191-1.

[0299] In some embodiments, the first auxiliary pattern 181, the second auxiliary pattern 183, and the third auxiliary pattern 185 can be derived from the above references. Figure 3 The second conductive layer ML2 is formed as described, and each of the first auxiliary pattern 181, the second auxiliary pattern 183 and the third auxiliary pattern 185 may be a floating pattern.

[0300] According to some exemplary embodiments, since the first conductive pattern 151-1 of the first conductive member 150-1, the second conductive pattern 171-1 of the second conductive member 170-1, and the third conductive pattern 191-1 of the third conductive member 190-1 can each be provided with auxiliary openings, the default value of the mutual capacitance formed in the touch detection operation or proximity detection operation can be increased, and therefore the driving frequency can be increased.

[0301] Since the first auxiliary pattern 181, the second auxiliary pattern 183 and the third auxiliary pattern 185 are located in the corresponding auxiliary openings, the auxiliary openings can be prevented from being visually identified due to the difference in reflectivity between the auxiliary openings and the surrounding conductive patterns.

[0302] Figure 31 It is shown Figure 25 A view of a modified example of the detection sensor shown.

[0303] Reference Figure 31 According to this embodiment, the detection sensor TSMc and Figures 25 to 30 The difference between the detection sensor TSMb and the implementation of the above method is that the sensor layer TSLc further includes a first connection pattern 175. Other configurations of the detection sensor TSMc are similar to... Figures 25 to 30 The implementation methods are substantially the same as or similar to those described above. Furthermore, the detailed description of the first connection pattern 175 is consistent with the above description. Figures 22 to 24 The same applies to the embodiments described herein, and therefore a detailed description of the first connection pattern 175 will be omitted.

[0304] Figure 32 and Figure 33 This is an exemplary block diagram of a detection sensor included in a display device according to some exemplary embodiments, wherein, Figure 32 This is a block diagram illustrating the operation of the detection sensor in a first mode, and Figure 33 This is a block diagram illustrating the operation of the detection sensor in the second mode. Figure 34This is a view showing a detection sensor, which is a plan view of the sensor layer of a detection sensor according to some exemplary embodiments and the connection relationship between the sensor layer and the sensor controller. Figure 35 This is a block diagram illustrating the operation of a detection sensor in a first mode and the operation of a detection sensor in a second mode according to some exemplary embodiments. Figure 36 This is a view specifically illustrating the connection relationship between the sensor layer and the sensor controller when the detection sensor is operating in a first mode, according to some exemplary embodiments. Figure 37 This is a view specifically illustrating the connection relationship between the sensor layer and the sensor controller when the detection sensor is operating in a second mode, according to some exemplary embodiments.

[0305] Reference Figures 32 to 37 According to the present invention, the detection sensor TSM1 and the above-mentioned Figures 8 to 22 The difference between the detection sensor TSM described in the implementation method and the one described above is that the configuration and operation of the sensor controller TSC1 are the same as those described above. Figures 8 to 22 The configuration and operation of the sensor controller TSC described in the implementation differ from those in the previous one. Other configurations of the detection sensor TSM1 are also different. Figures 8 to 22 The implementation methods are essentially the same or similar. Therefore, the differences will be mainly described below.

[0306] The sensor controller TSC1 of the detection sensor TSM1 may include a proximity detector 290a and an amplifier circuit 230a, which are connected to... Figures 8 to 22 The proximity detector 290 and amplifier circuit 230 described in the implementation are different.

[0307] The proximity detector 290a may include a sensing channel SCp corresponding to the second conductive member 170. The sensing channel SCp may include an amplifier 291, a capacitor Cp, and a reset switch SWp. A description of each configuration of the sensing channel SCp is provided above. Figures 8 to 22 The same as those described in the implementation methods.

[0308] In some implementations, the number of sensing channels SCp included in the proximity detector 290a may differ from the number of sensing channels SCp included in the proximity detector 290a. Figures 8 to 22 The number of implementations. Illustratively, as... Figure 37 As shown, proximity detector 290a may include a sensing channel SCp, and the sensing channel SCp may be electrically connected to all of the plurality of second conductive members 170. However, the invention is not limited thereto, and according to some exemplary embodiments, the sensing channel SCp of proximity detector 290a may be provided to correspond to the second conductive members 170.

[0309] like Figure 36 and Figure 37 As shown, amplifier circuit 230a can be different. Figure 20 and Figure 21 The amplifier circuit 230 is shown in the diagram. More specifically, the amplifier circuit 230a may also include a fifth variable resistor VR5. The fifth variable resistor VR5 may be connected in parallel with the first variable resistor VR1, the second variable resistor VR2, the third variable resistor VR3, and the fourth variable resistor VR4 between the output terminal 2315 of the amplifier 231 and the ground power supply GND. In a first mode, the first variable resistor VR1, the second variable resistor VR2, the third variable resistor VR3, and the fourth variable resistor VR4 of the amplifier circuit 230a may be connected to each sensing channel SC of the touch detector 270, and in a second mode, the fifth variable resistor VR5 may be connected to the sensing channel SCp of the proximity detector 290a.

[0310] The operation of the TSM1 sensor in the first mode can be the same as described above. Figures 8 to 22 The operations described in the implementation are the same. For example, as Figure 32 , Figure 35 and Figure 36 As shown, in the first mode MD1, the touch driver 210 of the sensor controller TSC1 can provide a touch drive signal Ts1 to the second electrode member 130 via the first wiring 901 and the second wiring 903. The touch detector 270 can receive a touch detection signal Rs corresponding to the touch drive signal Ts1 from the first electrode member 120 via the third wiring 905 to detect the presence and / or location of touch input. The touch detection signal Rs may include information related to the mutual capacitance Cm between the first electrode member 120 and the second electrode member 130.

[0311] The operation of the TSM1 sensor in the second mode can be the same as described above. Figures 8 to 22 The operations described in the implementation methods differ somewhat. More specifically, such as Figure 33 , Figure 35 and Figure 37As shown, in the second mode MD2, the touch driver 210 can provide a proximity drive signal Ts2 to the first electrode member 120 via the third wiring 905. The proximity drive signal Ts2 can be provided sequentially to each of the first electrode members 120, or simultaneously to all of them. In the second mode MD2, the proximity detector 290a can be electrically connected to the second conductive member 170 via the fifth wiring 909, and can receive a proximity detection signal Ps corresponding to the proximity drive signal Ts2 from the second conductive member 170 to detect the approach of an object. The proximity detection signal Ps output by the second conductive member 170 may include information related to the mutual capacitance Cmp between the first electrode member 120 and the second conductive member 170.

[0312] Amplifier circuit 230a can be used as follows Figure 32 , Figure 35 and Figure 36 As shown, in the first mode MD1, it is electrically connected to the first conductive member 150 and the touch detector 270, and can be as shown Figure 33 , Figure 35 and Figure 37 As shown, in the second mode MD2, the first conductive member 150 and the proximity detector 290a are electrically connected. As described above, the first conductive member 150 and the amplifier circuit 230a can be electrically connected to each other via the fourth wiring 907.

[0313] in addition, Figures 32 to 34 The sensor layer TSL shown can be compared with the above reference. Figures 8 to 22 The sensor layer TSL described is essentially the same. Therefore, its detailed description will be omitted.

[0314] Figure 38 , Figure 39 , Figure 40 , Figure 41 , Figure 42 , Figure 43 and Figure 44 They are shown separately. Figure 34 A view of a modified example of the detection sensor shown.

[0315] Reference Figure 38 According to this modified example, the detection sensor TSM1a and the reference Figure 34 The difference in the described embodiment of the detection sensor TSM1 is that the sensor layer TSLa includes a first connection pattern 175, and the first connection pattern 175 electrically connects adjacent second conductive patterns 171 along the second direction y. The description of the sensor layer TSLa is consistent with the above description of... Figures 22 to 24 The descriptions are the same as those described in the previous description, and therefore the description of the sensor layer TSLa will be omitted.

[0316] Reference Figure 39 According to this modified example, the detection sensor TSM1b and the reference Figure 34 The difference in the described embodiment of the detection sensor TSM1 is that the sensor layer TSLb includes a first conductive member 150-1, a second conductive member 170-1, a third conductive member 190-1, a first auxiliary pattern 181, a second auxiliary pattern 183, and a third auxiliary pattern 185. Other configurations of the detection sensor TSM1b are referenced. Figure 34 Those described in the embodiments are substantially the same or similar. A more detailed description of the sensor layer TSLb is provided above in the section on... Figures 25 to 29 The descriptions are the same as those described in the previous one, and therefore a more detailed description of the sensor layer TSLb will be omitted.

[0317] Reference Figure 40 According to this modified example, the detection sensor TSM1c and the reference Figure 39 The difference in the described embodiment of the detection sensor TSM1b is that the sensor layer TSLc further includes a first connection pattern 175, and the first connection pattern 175 electrically connects adjacent second conductive patterns 171-1 to each other along the second direction y. Other configurations of the detection sensor TSM1c are referenced. Figure 39 Those described in the embodiments are substantially the same or similar.

[0318] Reference Figure 41 According to this modified example, the detection sensor TSM1d and the reference Figure 34 The difference in the described embodiment of the detection sensor TSM1 is that the sensor layer TSLd further includes a second conductive member 170-2 and an edge conductive pattern 177. Other configurations of the detection sensor TSM1d are referenced. Figure 34 The implementation methods described are essentially the same.

[0319] The second conductive member 170-2 includes a second conductive pattern 171 and a second connecting line 173. In some embodiments, the second conductive pattern 171 may be located in the third opening OP3, but may not be located at either end of the electrode row, for example, not in the first electrode column CE1 and the fourth electrode column CE4.

[0320] In some embodiments, the edge conductive pattern 177 spaced apart from the first sensing electrode 121 may be located in the third opening OP3 positioned in the first electrode column CE1 and the fourth electrode column CE4, and the edge conductive pattern 177 may not be connected to the second conductive member 170-2.

[0321] When a user grips the display device 1, the electrode rows at both ends of the sensor layer TSLd are likely to be pressed by the user's fingers or may be positioned adjacent to the user's fingers. According to this modified example, the second conductive member 170-2 that outputs the proximity detection signal Ps is not located in the electrode rows at both ends of the sensor layer TSLd. Therefore, in the second mode of performing proximity sensing operation, the proximity detection signal Ps can be prevented from being affected by the user's grip, or the effect of the user's grip on the proximity detection signal Ps can be minimized.

[0322] Reference Figure 42 According to this modified example, the detection sensor TSM1e and the reference Figure 41 The difference in the described embodiment of the detection sensor TSM1d is that the sensor layer TSM1e includes a first connection pattern 175, and the first connection pattern 175 electrically connects the second conductive patterns 171 of adjacent second conductive members 170-2 along the second direction y to each other. Due to the other configurations of the detection sensor TSM1e, as referenced... Figure 41 Those implementations described are substantially the same, and therefore their detailed descriptions will be omitted.

[0323] Reference Figure 43 According to this modified example, the detection sensor TSM1f and the reference Figure 42 The difference in the described embodiment of the detection sensor TSM1e lies in that the sensor layer TSLf includes a first conductive member 150-1, a second conductive member 170-3, a third conductive member 190-1, an edge conductive pattern 177-1, a first auxiliary pattern 181, a second auxiliary pattern 183, a third auxiliary pattern 185, and an edge auxiliary pattern 187. Other configurations of the detection sensor TSM1f are referenced. Figure 42 The embodiments described are substantially the same. Furthermore, the descriptions of the first conductive member 150-1, the second conductive member 170-3, the third conductive member 190-1, the first auxiliary pattern 181, the second auxiliary pattern 183, and the third auxiliary pattern 185 can be consistent with those described above. Figures 25 to 29 The first conductive member 150-1, the second conductive member 170-1, the third conductive member 190-1, the first auxiliary pattern 181, the second auxiliary pattern 183, and the third auxiliary pattern 185 described in the embodiments are substantially the same or similar.

[0324] The first conductive pattern 151-1 of the first conductive member 150-1 may include, as referred to above, the first conductive pattern 151-1 of the first conductive member 150-1. Figures 25 to 29 The first auxiliary opening is described, and the first auxiliary pattern 181 may be located in the first auxiliary opening.

[0325] The second conductive pattern 171-1 of the second conductive component 170-3 may include, as described above. Figures 25 to 29 The second auxiliary opening is described, and the second auxiliary pattern 183 may be located in the second auxiliary opening.

[0326] The third conductive pattern 191-1 of the third conductive component 190-1 may include, as referred to above. Figures 25 to 29 The third auxiliary opening is described, and the third auxiliary pattern 185, spaced apart from the third conductive pattern 191-1, can be located within the third auxiliary opening. In addition to the edge conductive pattern 177-1, the edge conductive pattern 177-1 also includes an edge auxiliary opening. Figure 41 The edge conductive pattern 177 shown is substantially the same, and the edge auxiliary pattern 187 may be located in the edge auxiliary opening.

[0327] Reference Figure 44 According to this modified example, the detection sensor TSM1g and the reference Figure 43 The difference in the described embodiment of the detection sensor TSM1f is that the sensor layer TSLg includes a first connection pattern 175, and the first connection pattern 175 electrically connects the second conductive patterns 171-1 of adjacent second conductive members 170-3 along the second direction y to each other. Due to the other configurations of the detection sensor TSM1g and the reference... Figure 43 Those implementations described are substantially the same, and therefore their detailed descriptions will be omitted.

[0328] Figure 45 and Figure 46 This is an exemplary block diagram of a detection sensor included in a display device according to some exemplary embodiments, wherein, Figure 45 This is a block diagram illustrating the operation of the detection sensor in a first mode, and Figure 46 This is a block diagram illustrating the operation of the detection sensor in the second mode.

[0329] Reference Figure 45 and Figure 46 The detection sensor TSM2 may include a sensor controller TSC2 and a sensor layer TSL1. The sensor controller TSC2 may include a touch driver 210, an amplifier circuit 230a, a touch detector 270, and a proximity detector 290b.

[0330] The sensor layer TSL1 may include a first electrode component 120 and a second electrode component 130, and may also include a first conductive component 150, a second conductive component 170 and a third conductive component 190-2.

[0331] like Figure 45As shown, in the first mode in which touch sensing operation is performed, the touch driver 210 can provide a touch drive signal Ts1 to the second electrode member 130. The first electrode member 120 can provide a touch detection signal Rs generated in response to the touch drive signal Ts1 to the touch detector 270.

[0332] like Figure 45 As shown, in the first mode, the first conductive member 150 and the second conductive member 170 can provide the noise detection signal Ns to the amplification circuit 230a. The amplification circuit 230a can amplify the noise detection signal Ns and provide the amplified noise detection signal Ns to the touch detector 270.

[0333] like Figure 46 As shown, in the second mode in which proximity sensing operation is performed, the touch driver 210 can provide a proximity drive signal Ts2 to the third conductive member 190-2. The second electrode member 130 can provide a proximity detection signal Ps generated in response to the proximity drive signal Ts2 to the proximity detector 290b. In the second mode, the first conductive member 150 and the second conductive member 170 can provide a noise detection signal Ns to the amplification circuit 230a. The amplification circuit 230a can amplify the noise detection signal Ns and provide the amplified noise detection signal Ns to the proximity detector 290b.

[0334] Figure 47 This is a view illustrating a detection sensor according to some exemplary embodiments, a plan view of the sensor layer of the detection sensor and the connection relationship between the sensor layer and the sensor controller. Figure 48 yes Figure 47 A magnified planar view of part of Qg, and Figure 49 It is along Figure 48 A cross-sectional view of the sensor layer taken by line X17-X17'.

[0335] Reference Figures 47 to 49 According to the detection sensor TSM2 of this embodiment and the above reference Figures 10 to 18 The difference between the described detection sensor TSM and the TSM2 is that the third conductive member 190-2 of the sensor layer TSL1 of the detection sensor TSM2 also includes a third connecting line 193 and a third conductive pattern 191; the fifth wiring 909 is omitted (see Figure 10 The first conductive member 150 and the second conductive member 170 are both connected to the fourth wiring 907; and a sixth wiring 911 is also provided to connect to the third conductive member 190-2. Other configurations of the detection sensor TSM2 are the same as described above. Figures 10 to 18 The descriptions are essentially the same or similar. Therefore, the differences will be described primarily below.

[0336] The third conductive member 190-2 may include a third conductive pattern 191 and a third connecting line 193. The third connecting line 193 may be located in the same row and may electrically connect adjacent third conductive patterns 191 along the first direction x. In some embodiments, the third connecting line 193 may be as described above. Figure 3 The first conductive layer ML1 is formed as described. The third connecting line 193 may be located below the insulating layer IL. (As...) Figure 49 As shown, the third conductive pattern 191 and the third connecting line 193 can be connected to and in contact with each other through the fifth contact hole CH5 formed in the insulating layer IL.

[0337] In the sensing region SA, the structure of the sensor layer TSL1 can be related to... Figures 10 to 18 The structure of the sensor layer TSL in the implementation method is basically the same.

[0338] In the non-sensing area (NSA), the first wiring 901, the second wiring 903, the third wiring 905, the fourth wiring 907, and the sixth wiring 911 can be located on the base layer (BSL).

[0339] The fourth wiring 907 can be connected to the second conductive member 170 and the first conductive member 150. The noise detection signal Ns output from the first conductive member 150 and the second conductive member 170 can be transmitted to the sensor controller TSC2 through the fourth wiring 907 and the first sensor pad portion TPD1.

[0340] The sixth wiring 911 can be connected to the third conductive member 190-2. In some embodiments, multiple third conductive members 190-2 can be connected to a single sixth wiring 911. In some embodiments, only one sixth wiring 911 can be provided and can be connected to all of the third conductive members 190-2.

[0341] In some implementations, one end of the sixth wiring 911 may be connected to the second sensor pad portion TPD2.

[0342] Figure 50 This is a block diagram illustrating the operation of a detection sensor in a first mode and the operation of a detection sensor in a second mode according to some exemplary embodiments. Figure 51 This is a view specifically illustrating the connection relationship between the sensor layer and the sensor controller when the detection sensor operates in a first mode, according to some exemplary embodiments. Figure 52 This is a view specifically illustrating the connection relationship between the sensor layer and the sensor controller when the detection sensor is operating in a second mode, according to some exemplary embodiments.

[0343] Reference Figures 50 to 52 ,like Figure 50and Figure 51 As shown, when the detection sensor TSM2 operates in the first mode MD1, the touch driver 210 can provide a touch drive signal Ts1 to the second electrode member 130 via the first wiring 901 and the second wiring 903. The first electrode member 120 can form a mutual capacitance Cm between the first electrode member 120 and the second electrode member 130 in response to the touch drive signal Ts1, and can provide a touch detection signal Rs including information related to the mutual capacitance Cm to the touch detector 270 via the third wiring 905.

[0344] A detailed description of the configuration and operation of the touch detector 270 is provided in the above reference. Figures 19 to 22 The descriptions are the same, and therefore a detailed description of the configuration and operation of the touch detector 270 will be omitted.

[0345] The first conductive member 150 and the second conductive member 170 can provide the noise detection signal Ns to the amplifier circuit 230a via the fourth wiring 907, and the amplifier circuit 230a can provide the noise detection signal Ns with an adjusted gain value to the sensing channel SC of each touch detector 270. The description of the amplifier circuit 230a is consistent with the above reference. Figure 36 and Figure 37 The amplifier circuit 230a described is essentially the same, and therefore the description of amplifier circuit 230a will be omitted.

[0346] like Figure 50 and Figure 52 As shown, when the detection sensor TSM2 operates in the second mode MD2, the touch driver 210 can provide a proximity drive signal Ts2 to the third conductive member 190-2 via the sixth wiring 911. In response to the proximity drive signal Ts2, a mutual capacitance Cmp can be formed between the third conductive member 190-2 and the second electrode member 130, and the second electrode member 130 can provide a proximity detection signal Ps, including information related to the mutual capacitance Cmp, to the proximity detector 290b via the first wiring 901 and the second wiring 903.

[0347] The proximity detector 290b may include multiple sensing channels SCp. In some embodiments, the number of sensing channels SCp may be substantially the same as the number of second electrode components 130. The description of the configuration and operation of the proximity detector 290b is consistent with the above reference. Figures 19 to 22 The proximity detector 290 is described in a substantially similar manner, and therefore the description of the configuration and operation of the proximity detector 290b will be omitted.

[0348] The first conductive member 150 and the second conductive member 170 can provide the noise detection signal Ns to the amplifier circuit 230a via the fourth wiring 907. The amplifier circuit 230a may also include a fifth variable resistor VR5 connected to the proximity detector 290b, and can provide the noise detection signal Ns with an adjusted gain value to the proximity detector 290b.

[0349] According to some exemplary embodiments, since the approach of an object can be detected essentially over the entire sensing area SA of the sensor layer TSL1, thus... Figure 20 and Figure 21 Compared to other implementation methods, this method has the feature of expanding the proximity sensing area.

[0350] The operation of the TSM2 sensor in the second mode MD2 can be modified.

[0351] Figure 53 This is a view illustrating another example of proximity detection operation of a detection sensor according to some exemplary embodiments.

[0352] Reference Figure 53 ,and Figure 45 , Figure 46 , Figure 50 and Figure 52 Unlike the one shown, the sensor controller TSC2' of the detection sensor TSM2' may include an amplifier circuit 230 and a proximity detector 290. The descriptions of the amplifier circuit 230 and the proximity detector 290 are the same as those described above in the description of the detection sensor TSM, and therefore the descriptions of the amplifier circuit 230 and the proximity detector 290 will be omitted.

[0353] The operation of the detection sensor TSM2' in the first mode is substantially the same as that of the aforementioned detection sensor TSM2 in the first mode.

[0354] In the second mode, the touch driver 210 of the detection sensor TSM2' can provide a proximity drive signal Ts2 to the third conductive member 190-2 via the sixth wiring 911. Mutual capacitance can be generated between the first electrode member 120 and the third conductive member 190-2 in response to the proximity drive signal Ts2. The first electrode member 120 can provide a proximity detection signal Ps to the proximity detector 290 via the third wiring 905, including information related to the mutual capacitance generated between the first electrode member 120 and the third conductive member 190-2.

[0355] In some implementations, different Figure 52 As shown in the diagram, in the second mode, the first wiring 901 and the second wiring 903 can be connected to a reference power supply (e.g., ground power supply GND).

[0356] The first conductive member 150 and the second conductive member 170 can provide the noise detection signal Ns to the amplifier circuit 230 through the fourth wiring 907, and the amplifier circuit 230 can provide the noise detection signal Ns with an adjusted gain value to each sensing channel SCp of the proximity detector 290.

[0357] The descriptions of the amplifier circuit 230 and the proximity detector 290 are the same as those described above in the description of the detection sensor TSM, and therefore the descriptions of the amplifier circuit 230 and the proximity detector 290 will be omitted.

[0358] The detection sensor, including the sensor controller TSC2, will be described below, but the invention is not limited thereto. The sensor controller TSC2 of the detection sensor can be modified as described above. Figure 53 The sensor controller TSC2' is described.

[0359] Figure 54 It is shown Figure 47 A view of an example modification of the detection sensor shown. Figure 55 yes Figure 54 A magnified plan view of part of Qh, and Figure 56 It is along Figure 55 A cross-sectional view of the sensor layer taken by line X19-X19'.

[0360] Reference Figures 54 to 56 According to this embodiment, the detection sensor TSM2a and Figure 47 The difference between the detection sensor TSM2 shown is that: Figure 47 The sensor layer TSL1a shown differs from the one described above; it also includes a second connection pattern 195. The other configurations of the detection sensor TSM2a are the same as those described above. Figure 47 The descriptions are essentially the same or similar. Therefore, the differences will be described primarily below.

[0361] The second connecting pattern 195 can electrically connect the adjacent third conductive patterns 191 along the second direction y to each other.

[0362] In some embodiments, the second connection pattern 195 may be formed of a different layer than the third conductive pattern 191 and the third connection line 193. In some embodiments, an upper insulating layer UIL may be further positioned on the third conductive pattern 191, and the second connection pattern 195 may be located on the upper insulating layer UIL.

[0363] The upper insulating layer UIL can be made of an insulating material and can include inorganic or organic insulating materials. In some embodiments, the upper insulating layer UIL can include the above-mentioned components. Figure 3Any of the exemplary insulating materials described in the description.

[0364] The second connection pattern 195 may include a conductive material, such as gold (Au), silver (Ag), aluminum (Al), molybdenum (Mo), chromium (Cr), titanium (Ti), nickel (Ni), neodymium (Nd), copper (Cu), platinum (Pt), or alloys thereof. The second connection pattern 195 may have a single-layer structure or a multi-layer structure.

[0365] In some implementations, such as Figure 56 As shown, the second connection pattern 195 and the third conductive pattern 191 can be connected to each other and in direct contact with each other through the sixth contact hole CH6 formed in the upper insulating layer UIL.

[0366] Since the adjacent third conductive members 190-2 along the second direction y are electrically connected to each other through the second connection pattern 195, signal delay (or RC delay) between the third conductive members 190-2 located in different rows can be prevented or reduced when the detection sensor TSM2a operates in the second mode (proximity detection mode).

[0367] Figure 57 It is shown Figure 54 A view of an example modification of the detection sensor shown. Figure 58 yes Figure 57 A magnified plan view of part of Qi, and Figure 59 It is along Figure 58 A cross-sectional view of the sensor layer taken by line X21-X21'.

[0368] Reference Figures 57 to 59 According to this embodiment, the detection sensor TSM2b and Figure 47 The difference between the detection sensor TSM2 shown is that: Figure 47 Unlike the sensor layer TSL1 shown, sensor layer TSL1b also includes a first connection pattern 175a. The other configurations of the detection sensor TSM2b are the same as those described above. Figure 47 The descriptions are essentially the same or similar. Therefore, the differences will be described primarily below.

[0369] The first connection pattern 175a can electrically connect adjacent second conductive patterns 171 along the second direction y to each other. Furthermore, the first connection pattern 175a can electrically connect adjacent first conductive patterns 151 along the second direction y to each other. Additionally, the first connection pattern 175a can electrically connect the adjacent second conductive patterns 171 and the first conductive patterns 151 along the second direction y to each other.

[0370] The first connection pattern 175a may include a conductive material. The conductive material included in the first connection pattern 175a may include, as referenced above... Figures 54 to 56 The second connecting pattern 195 described (see Figure 54 Examples of materials listed are at least one of the exemplary conductive materials.

[0371] In some embodiments, an upper insulating layer UIL may be further positioned on the third conductive pattern 191, and the first connecting pattern 175a may be located on the upper insulating layer UIL. For example... Figure 59 As shown, the first connection pattern 175a can be connected to and in contact with the second conductive pattern 171 through the seventh contact hole CH7 formed in the upper insulating layer UIL.

[0372] Furthermore, as described above, the first connection pattern 175a connected to the second conductive pattern 171 can also be connected to and in contact with the first conductive pattern 151 through a contact hole formed in the upper insulating layer UIL.

[0373] According to some exemplary embodiments, it is possible to further prevent deviations in the noise detection signals used for each electrode row.

[0374] Figure 60 , Figure 61 , Figure 62 , Figure 63 and Figure 64 It is shown Figure 47 A view of a modified example of the detection sensor shown.

[0375] Reference Figure 60 According to this embodiment, the detection sensor TSM2c and Figure 47 The difference between the detection sensor TSM2 shown is that: Figure 47 Unlike the sensor layer TSL1 shown, sensor layer TSL1c also includes a first connection pattern 175a and a second connection pattern 195. The other configurations of the detection sensor TSM2c are the same as those described above. Figure 47 The descriptions are essentially the same or similar.

[0376] A detailed description of the first connecting pattern 175a is provided above. Figures 57 to 59 The descriptions are the same, and the detailed description of the second connecting pattern 195 is consistent with the above references. Figures 54 to 56 The descriptions are the same. Therefore, their detailed descriptions will be omitted.

[0377] Reference Figure 61 According to this embodiment, the detection sensor TSM2d and Figure 47 The difference between the detection sensor TSM2 shown is that: Figure 47 The sensor layer TSL1d shown is different from the one described above. Sensor layer TSL1d includes a first conductive member 150-1, a second conductive member 170-1, a third conductive member 190-3, a first auxiliary pattern 181, a second auxiliary pattern 183, and a third auxiliary pattern 185. The other configurations of the detection sensor TSM2d are the same as those described above. Figure 47 The descriptions are essentially the same or similar.

[0378] The descriptions of the first conductive member 150-1, the second conductive member 170-1, the first auxiliary pattern 181, the second auxiliary pattern 183, and the third auxiliary pattern 185 are consistent with the above references. Figures 25 to 29 The descriptions are essentially the same. Furthermore, as in... Figures 25 to 29 As described in the embodiments, the third conductive pattern 191-1 of the third conductive member 190-3 may include a third auxiliary opening, and the third auxiliary pattern 185 may be located in the third auxiliary opening. Therefore, its details will be omitted.

[0379] Reference Figure 62 According to this embodiment, the detection sensor TSM2e and Figure 61 The difference between the detection sensor TSM2d shown is that: Figure 61 Unlike the sensor layer TSL1d shown, the sensor layer TSL1e also includes a second connection pattern 195, and the second connection pattern 195 electrically connects adjacent third conductive patterns 191-1 along the second direction y. Other configurations of the detection sensor TSM2e are the same as those described above. Figure 61 The descriptions are substantially the same or similar. A more detailed description of the second connecting pattern 195 is provided with reference to the above. Figures 54 to 56 The descriptions are substantially the same or similar, and therefore a more detailed description of the second connecting pattern 195 will be omitted.

[0380] Reference Figure 63 According to this embodiment, the detection sensor TSM2f and Figure 61 The difference between the detection sensor TSM2d shown is that, and Figure 61 Unlike the sensor layer TSL1d shown, sensor layer TSL1f also includes a first connection pattern 175a. The other configurations of the detection sensor TSM2f are the same as those described above. Figure 61 The descriptions are substantially the same or similar. A more detailed description of the first connecting pattern 175a is provided with reference to the above. Figures 57 to 59 Those described are substantially the same or similar, and therefore a more detailed description of the first connecting pattern 175a will be omitted.

[0381] Reference Figure 64 According to this embodiment, the detection sensor TSM2g and Figure 61 The difference between the detection sensor TSM2d shown is that: Figure 61 Unlike the sensor layer TSL1d shown, the sensor layer TSL1g also includes a first connection pattern 175a and a second connection pattern 195. The other configurations of the detection sensor TSM2g are the same as those described above. Figure 61 The descriptions are substantially the same or similar. A more detailed description of the first connecting pattern 175a is provided with reference to the above. Figures 57 to 59 The descriptions are substantially the same or similar, and a more detailed description of the second connecting pattern 195 is consistent with the above reference. Figures 54 to 56 The descriptions are essentially the same or similar.

[0382] Therefore, its description will be omitted.

[0383] In the detection sensor and display device including the detection sensor according to the foregoing embodiments, since the detection sensor can detect the approach of an object and touch, it has the feature that an additional proximity sensor can be omitted. Furthermore, since the conductive component is formed together with the electrode component and the connecting portion during manufacturing, it has the feature that the thickness of the touch sensor is not increased.

[0384] Furthermore, since the detection sensor can eliminate or reduce noise transmitted from the display panel, it features improved touch sensitivity and proximity sensitivity.

[0385] According to embodiments of the present invention, a detection sensor for sensing the proximity of an object and a display device including the detection sensor can be provided.

[0386] Furthermore, according to embodiments of the present invention, a detection sensor for sensing both the proximity of an object and touch input, as well as a display device including the detection sensor, can be provided.

[0387] The effects of this invention are not limited to the foregoing, and many other effects are anticipated herein.

[0388] While exemplary embodiments of the invention have been disclosed for illustrative purposes, those skilled in the art will understand that various modifications, additions, and substitutions are possible without departing from the scope and spirit of the invention as disclosed in the appended claims and their equivalents.

Claims

1. Detection sensors, including: A first electrode component is located on a base layer and includes a plurality of first sensing electrodes, each of the plurality of first sensing electrodes including a first opening and electrically connected to each other along a first direction; A second electrode component is located on the base layer and includes a plurality of second sensing electrodes, the plurality of second sensing electrodes being electrically connected to each other along a second direction intersecting the first direction; The first conductive component includes a plurality of first conductive patterns electrically connected to each other along the first direction; The second conductive member includes a plurality of second conductive patterns electrically connected to each other along the first direction and spaced apart from the first conductive member; as well as A sensor controller is configured to detect changes in the mutual capacitance between the first electrode component and the second electrode component in a first mode, and is configured to detect changes in the mutual capacitance between the first electrode component and the second conductive component in a second mode different from the first mode. The plurality of first sensing electrodes are arranged along the second direction to form a plurality of electrode rows; The first conductive pattern is located in at least one of the plurality of electrode rows and is located in the first opening, and The second conductive pattern is located in an electrode row other than the at least one electrode row in which the first conductive pattern is located, and is located in the first opening.

2. The detection sensor according to claim 1, in, The sensor controller is configured to detect a touch in the first mode based on the change in the mutual capacitance between the first electrode component and the second electrode component, and The sensor controller is configured to detect the approach of an object in the second mode based on the change in the mutual capacitance between the first electrode component and the second conductive component.

3. The detection sensor according to claim 1, in, The sensor controller includes: A touch driver, configured to be electrically connected to the second electrode member in the first mode, and configured to provide a touch driving signal to the second electrode member; and A touch detector is configured to be electrically connected to the first electrode component in the first mode, configured to receive a touch detection signal generated in response to the touch driving signal from the first electrode component, and configured to detect a touch. The touch detector is configured to receive a noise detection signal from the first conductive member in the first mode, and to eliminate noise from the touch detection signal based on the noise detection signal.

4. The detection sensor according to claim 3, in, The sensor controller also includes a proximity detector electrically connected to the first electrode component in the second mode. The touch driver is configured to be electrically connected to the second conductive member in the second mode, and is configured to provide a proximity drive signal to the second conductive member. The proximity detector is configured to receive a proximity detection signal generated in response to the proximity drive signal from the first electrode member, and is configured to detect the approach of an object.

5. The detection sensor according to claim 4, in, The proximity detector is configured to receive the noise detection signal from the first conductive member in the second mode, and is configured to eliminate noise from the proximity detection signal based on the noise detection signal.

6. The detection sensor according to claim 4, in, The touch driver is configured to be electrically connected to the second electrode member in the second mode, and is configured to provide the proximity drive signal to the second electrode member.

7. The detection sensor according to claim 4, in, The sensor controller further includes an amplification circuit, which is electrically connected to the first conductive member and the touch detector in a first mode, and electrically connected to the first conductive member and the proximity detector in a second mode. The amplifier circuit includes an amplifier electrically connected to the first conductive member and a plurality of variable resistors connected in parallel to the output terminal of the amplifier.

8. The detection sensor according to claim 3, in, The sensor controller also includes a proximity detector electrically connected to the second conductive member in the second mode. The touch driver is configured to be electrically connected to the first electrode member in the second mode, and is configured to provide a proximity drive signal to the first electrode member. The proximity detector is configured to receive a proximity detection signal generated in response to the proximity drive signal from the second conductive member, and is configured to detect the approach of an object.

9. The detection sensor according to claim 1, in, The first electrode component further includes a first connection portion, which electrically connects two adjacent first sensing electrodes among the plurality of first sensing electrodes along the first direction. The second electrode component further includes a second connection portion, which electrically connects two adjacent second sensing electrodes along the second direction among the plurality of second sensing electrodes, and is insulated from the first connection portion. The first conductive component further includes a first connecting line, which connects two adjacent first conductive patterns along the first direction among the plurality of first conductive patterns. The second conductive component further includes a second connecting line, which connects two adjacent second conductive patterns along the first direction among the plurality of second conductive patterns. The first connecting line and the second connecting line are formed of a first conductive layer. The first sensing electrode, the second sensing electrode, the first conductive pattern, and the second conductive pattern are formed by a second conductive layer different from the first conductive layer. Either the first connection portion or the second connection portion is formed by the first conductive layer, and the other of the first connection portion or the second connection portion is formed by the second conductive layer.

10. The detection sensor according to claim 9, further comprising: An insulating layer, located on the base layer, The first conductive layer is located on the base layer. The insulating layer is located on the first conductive layer and between the first conductive layer and the second conductive layer, and The second conductive layer is located on the insulating layer.

11. The detection sensor according to claim 9, further comprising: An edge conductive pattern, located in the first opening and spaced apart from the second conductive member, is situated in the same electrode row as the second conductive member. The edge conductive pattern is formed by the second conductive layer.

12. The detection sensor according to claim 9, further comprising: The auxiliary pattern is formed by the second conductive layer. The second conductive pattern further includes an auxiliary opening, and the auxiliary pattern is located in the auxiliary opening and spaced apart from the second conductive pattern.

13. The detection sensor according to claim 9, in, The second sensing electrode is arranged along the second direction, and further includes a connection pattern that electrically connects two adjacent second conductive patterns along the second direction, and The connection pattern is formed by the first conductive layer.

14. The detection sensor according to claim 1, in, Each of the second sensing electrodes includes a second opening. The detection sensor further includes a third conductive pattern located in the second opening and spaced apart from the second sensing electrode. The third conductive pattern is made of the same material as the first conductive pattern and the second conductive pattern, and is located on the same layer as the first conductive pattern and the second conductive pattern.

15. Detection sensors, including: A first electrode component is located on a base layer and includes a plurality of first sensing electrodes, each of the plurality of first sensing electrodes including a first opening and electrically connected to each other along a first direction; A second electrode component is located on the base layer and includes a plurality of second sensing electrodes, each of the plurality of second sensing electrodes including a second opening and electrically connected to each other along a second direction intersecting the first direction; The first conductive component includes a plurality of first conductive patterns electrically connected to each other along the first direction; The second conductive member includes a plurality of second conductive patterns electrically connected to each other along the first direction and spaced apart from the first conductive member; as well as The sensor controller is configured to detect changes in the mutual capacitance between the first electrode component and the second electrode component in a first mode, and is configured to detect changes in the mutual capacitance between the second conductive component and the second electrode component or changes in the mutual capacitance between the second conductive component and the first electrode component in a second mode different from the first mode. The first conductive pattern is located in the first opening, and the second conductive pattern is located in the second opening.

16. The detection sensor according to claim 15, in, The sensor controller includes: A touch driver is configured to be electrically connected to the second electrode member and provide a touch driving signal to the second electrode member in the first mode, and is configured to be electrically connected to the second conductive member and provide a proximity driving signal to the second conductive member in the second mode; A touch detector, configured to be electrically connected to the first electrode member in the first mode, receive a touch detection signal generated in response to the touch driving signal from the first electrode member, and detect a touch; and A proximity detector is configured to be electrically connected to the second electrode member in the second mode, receive a proximity detection signal generated in response to the proximity drive signal from the second electrode member, and detect the approach of an object.

17. The detection sensor according to claim 16, in, The touch detector is configured to be electrically connected to the first conductive member in the first mode, receive a noise detection signal from the first conductive member, and eliminate noise from the touch detection signal based on the noise detection signal. The proximity detector is configured to be electrically connected to the first conductive member in the second mode, receive a noise detection signal from the first conductive member, and eliminate noise from the proximity detection signal based on the noise detection signal.

18. The detection sensor according to claim 15, in, The sensor controller includes: A touch driver is configured to be electrically connected to the second electrode member and provide a touch driving signal to the second electrode member in the first mode, and is configured to be electrically connected to the second conductive member and provide a proximity driving signal to the second conductive member in the second mode; A touch detector, configured to be electrically connected to the first electrode member in the first mode, receive a touch detection signal generated in response to the touch driving signal from the first electrode member, and detect a touch; and A proximity detector is configured to be electrically connected to the first electrode member in the second mode, receive a proximity detection signal generated in response to the proximity drive signal from the first electrode member, and detect the approach of an object.

19. The detection sensor according to claim 15, in, The first electrode component further includes a first connection portion, which electrically connects two adjacent first sensing electrodes among the plurality of first sensing electrodes along the first direction. The second electrode component further includes a second connection portion, which electrically connects two adjacent second sensing electrodes along the second direction among the plurality of second sensing electrodes, and is insulated from the first connection portion. The first conductive component further includes a first connecting line, which connects two adjacent first conductive patterns along the first direction among the plurality of first conductive patterns. The second conductive component further includes a second connecting line, which connects two adjacent second conductive patterns along the first direction among the plurality of second conductive patterns. The first connecting line and the second connecting line are formed of a first conductive layer. The first sensing electrode, the second sensing electrode, the first conductive pattern, and the second conductive pattern are formed from a second conductive layer different from the first conductive layer. Either the first connection portion or the second connection portion is formed by the first conductive layer, and the other of the first connection portion or the second connection portion is formed by the second conductive layer.

20. The detection sensor according to claim 19, further comprising: An edge conductive pattern is located in the second opening and spaced apart from the second conductive pattern. The edge conductive pattern is formed by the second conductive layer.

21. The detection sensor according to claim 19, further comprising: The auxiliary pattern includes the same material as the second conductive pattern. The second conductive pattern further includes auxiliary openings, and The auxiliary pattern is located in the auxiliary opening and is spaced apart from the second conductive pattern.

22. The detection sensor according to claim 19, in, The second sensing electrode is arranged along the second direction, and further includes a connection pattern that electrically connects two adjacent second conductive patterns along the second direction, and The connection pattern is formed by a third conductive layer that is different from the first conductive layer and the second conductive layer.

23. The detection sensor according to claim 22, further comprising: An insulating layer is located on the base layer and between the first conductive layer and the second conductive layer; as well as An upper insulating layer is located on top of the insulating layer and between the second conductive layer and the third conductive layer. The second conductive layer is located between the first conductive layer and the third conductive layer.

24. The detection sensor according to claim 19, in, The first sensing electrode is arranged along the second direction, and further includes a connection pattern that electrically connects two adjacent first conductive patterns along the second direction, and The connection pattern is formed by a third conductive layer that is different from the first conductive layer and the second conductive layer.

25. A display device, comprising: Basic substrate; A self-emissive element is located on the base substrate; A thin-film encapsulation layer is located on the self-emissive element; A first sensing electrode is located on the thin-film encapsulation layer and includes an opening; The second sensing electrode is located on the thin film encapsulation layer and spaced apart from the first sensing electrode; A conductive pattern is located in the opening and spaced apart from the first sensing electrode; as well as A sensor controller is configured to detect changes in the mutual capacitance between the first sensing electrode and the second sensing electrode in a first mode, and is configured to detect changes in the mutual capacitance between the conductive pattern and the first sensing electrode in a second mode different from the first mode.

26. The display device according to claim 25, in, The sensor controller is configured to detect a touch in the first mode based on the change in the mutual capacitance between the first sensing electrode and the second sensing electrode, and is configured to detect the approach of an object in the second mode based on the change in the mutual capacitance between the conductive pattern and the first sensing electrode.

27. The display device according to claim 25, in, The thin-film encapsulation layer includes a first inorganic layer, an organic layer located on the first inorganic layer, and a second inorganic layer located on the organic layer. The first sensing electrode, the second sensing electrode, and the conductive pattern are located on the second inorganic layer.

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