Display device and manufacturing method thereof

Abstract

A display device and a method of manufacturing the display device are provided. The display device includes: a substrate including a display area and a non-display area; and a touch unit located on the substrate, wherein the touch unit includes: a first inorganic insulating layer located in the display area; a first conductive layer located on the first inorganic insulating layer; a first organic layer located on the first conductive layer; a second conductive layer located on the first organic layer and electrically connected to the first conductive layer through a first contact hole in the first organic layer; and a second organic layer located on the second conductive layer to cover the side surface and top surface of the second conductive layer, and including a photosensitive material.

Description

[0001] This application claims priority and benefit to Korean Patent Application No. 10-2019-0081601, filed on July 5, 2019, with the Korean Intellectual Property Office, the entire disclosure of which is incorporated herein by reference. Technical Field

[0002] One or more example embodiments relate to a display device and a method of manufacturing the same. Background Technology

[0003] Organic light-emitting diode (OLED) displays are attracting much attention as the next generation of display devices because they not only have wide viewing angles and excellent contrast ratios, but also fast response times.

[0004] The display device can be activated by receiving electrical signals. The display device may include an input sensing unit that senses various types of input applied from the outside (e.g., an external input source). Within the input sensing unit, a touch unit may be applied to the display panel that displays images and can improve user convenience.

[0005] The information disclosed in this background section is only intended to enhance the understanding of the background art, and therefore the information discussed in this background section does not necessarily constitute prior art. Summary of the Invention

[0006] One or more example embodiments relate to a display device and a method of manufacturing the same, for example, to a display device with improved product reliability and a method of manufacturing the display device.

[0007] When a peeling process is performed on a display device during the manufacturing process of related technologies, the organic layer arranged between the conductive layers of the touch unit is damaged by the peeling agent, which degrades the performance of the touch unit.

[0008] Therefore, one or more example embodiments include a display device and a method of manufacturing the display device, which has relatively improved performance of the touch unit by preventing or reducing damage to the organic layer. However, it should be understood that the embodiments described herein should be considered in a descriptive sense only and not as a limitation of disclosure.

[0009] Additional aspects will be set forth in part in the description which follows, and will also be apparent in part from the description, or may be learned by practice of the exemplary embodiments presented herein.

[0010] According to one or more example embodiments, a display device includes: a substrate including a display area and a non-display area; and a touch unit located on the substrate, wherein the touch unit includes: a first inorganic insulating layer located in the display area; a first conductive layer located on the first inorganic insulating layer; a first organic layer located on the first conductive layer; a second conductive layer located on the first organic layer and electrically connected to the first conductive layer through a first contact hole defined in the first organic layer; and a second organic layer located on the second conductive layer to cover the side surface and top surface of the second conductive layer and including a photosensitive material.

[0011] According to some example embodiments, the non-display area may include a wiring area and a pad area both located on one side of the display area, and the display device may further include: a first layer disposed in the wiring area; a first wiring layer disposed on the first layer and comprising the same material as the first conductive layer; a first second layer disposed on the first wiring layer; a second wiring layer disposed on the first second layer to be electrically connected to the first wiring layer through a second contact hole defined in the first second layer and comprising the same material as the second conductive layer; and a third layer disposed on the second wiring layer to cover the side surface and top surface of the second wiring layer and comprising a photosensitive material.

[0012] According to some example embodiments, the display device may further include: a bottom conductive layer located in the pad region; a second first layer located on the bottom conductive layer; a second second layer located on the second first layer; and a top conductive layer electrically connected to the bottom conductive layer through a third contact hole defined in the second first layer and the second second layer, and comprising the same material as the second conductive layer.

[0013] According to some example embodiments, the refractive index of the first organic layer may be different from that of the second organic layer.

[0014] According to some example embodiments, the second organic layer may include a light-shielding material.

[0015] According to some example embodiments, the display device may further include: a light-emitting element disposed in the display area between a substrate and a touch unit, and including a pixel electrode, a counter electrode, and an intermediate layer, wherein the counter electrode is located above the pixel electrode, and the intermediate layer includes an emitting layer disposed between the pixel electrode and the counter electrode; and a thin-film encapsulation layer disposed on the light-emitting element, and including at least one inorganic encapsulation layer and at least one organic encapsulation layer.

[0016] According to some example embodiments, the touch unit can be directly arranged on the thin-film encapsulation layer.

[0017] According to one or more example embodiments, a display device includes: a substrate including a display area and a non-display area; and a touch unit disposed on the substrate, wherein the touch unit includes: a first inorganic insulating layer located in the display area; a first conductive layer located on the first inorganic insulating layer; a first organic layer located on the first conductive layer; a second conductive layer disposed on the first organic layer and electrically connected to the first conductive layer through a first contact hole defined in the first organic layer; the second organic layer disposed on the second conductive layer to cover the top surface of the second conductive layer, having side surfaces positioned coplanar with the side surfaces of the second conductive layer, and including a photosensitive material; and a third organic layer located on the second organic layer.

[0018] According to some example embodiments, the non-display area may include a wiring area and a pad area both located on one side of the display area, and the display device may further include: a first layer disposed in the wiring area; a first wiring layer disposed on the first layer and comprising the same material as the first conductive layer; a first second layer disposed on the first wiring layer; a second wiring layer disposed on the first second layer to be electrically connected to the first wiring layer through a second contact hole defined in the first second layer and comprising the same material as the second conductive layer; a third layer disposed on the second wiring layer to cover the top surface of the second wiring layer, having side surfaces positioned in the same plane as the side surfaces of the second wiring layer, and comprising a photosensitive material; and a fourth insulating layer disposed on the third layer.

[0019] According to some example embodiments, the display device may further include: a bottom conductive layer located in the pad region; a second first layer located on the bottom conductive layer; a second second layer located on the second first layer; and a top conductive layer electrically connected to the bottom conductive layer through a third contact hole defined in the second first layer and the second second layer, and comprising the same material as the second conductive layer.

[0020] According to some example embodiments, the refractive indices of the first organic layer, the second organic layer, and the third organic layer may be different from each other.

[0021] According to some example embodiments, the second organic layer may include a light-shielding material.

[0022] According to some example embodiments, the display device may further include: a light-emitting element disposed in the display area between a substrate and a touch unit, and including a pixel electrode, a counter electrode, and an intermediate layer, wherein the counter electrode is located above the pixel electrode, and the intermediate layer includes an emitting layer disposed between the pixel electrode and the counter electrode; and a thin-film encapsulation layer disposed on the light-emitting element, and including at least one inorganic encapsulation layer and at least one organic encapsulation layer.

[0023] According to some example embodiments, the touch unit can be directly arranged on the thin-film encapsulation layer.

[0024] According to one or more example embodiments, a method of manufacturing a display device includes: preparing a substrate including a display area, a wiring area, and a pad area, the wiring area and the pad area being positioned on one side of the display area; forming a bottom conductive layer in the pad area; forming a first inorganic insulating layer in the display area, forming a first first layer in the wiring area, and forming a second first layer on the bottom conductive layer; forming a first conductive layer on the first inorganic insulating layer, and forming a first wiring layer on the first first layer; forming a first organic layer on the first conductive layer, forming a first second layer on the first wiring layer, and forming a second second layer on the second first layer; forming a first organic layer on the first conductive layer, forming a first second layer on the first wiring layer, and forming a second second layer on the second second first layer; and forming a first inorganic insulating layer on the first inorganic insulating layer, forming a first conductive layer on the first inorganic insulating layer, forming a first wiring layer on the first first layer, and forming a second second layer on the second second first layer; and forming a first inorganic insulating layer on the first inorganic insulating layer, forming a first conductive layer on the first inorganic insulating layer, forming a first conductive layer on the first inorganic insulating layer, forming a first organic layer on the first conductive layer, forming a first second layer on the first wiring layer, and forming a second second layer on the second second first layer; and forming a first inorganic insulating layer on the first inorganic insulating layer, forming a first conductive ... A first conductive material layer is formed on the first organic layer, a second conductive material layer is formed on the first second layer, and a third conductive material layer is formed on the second second layer; a second organic layer including a photosensitive material is patterned on the first conductive material layer, a first third layer including a photosensitive material is patterned on the second conductive material layer, and a second third layer including a photosensitive material is patterned on the third conductive material layer; the first conductive material layer, the first third layer, and the second third layer are respectively used as photoresists to pattern the first conductive material layer, the second conductive material layer, and the third conductive material layer to form a second conductive layer, a second wiring layer, and a top conductive layer; and the second and third layers are removed.

[0025] According to some example embodiments, the method may further include: after removing the second and third layers, reflowing the second organic layer so that the second organic layer covers the side surface of the second conductive layer, and reflowing the first and third layers through a curing process so that the first and third layers cover the side surface of the second wiring layer.

[0026] According to some example embodiments, the method may further include: after removing the second and third layers, forming a third organic layer on the second organic layer, and forming a fourth insulating layer on the first and third layers.

[0027] According to some example embodiments, the refractive indices of the first organic layer, the second organic layer, and the third organic layer may be different from each other.

[0028] According to some example embodiments, the second organic layer may include a light-shielding material.

[0029] According to some example embodiments, in the steps of forming a second conductive layer and a second organic layer, forming a second wiring layer and a first third layer, and forming a top conductive layer and a second third layer, the second organic layer may have a first thickness from the top surface of the second conductive layer, and the second third layer may have a second thickness from the top surface of the top conductive layer, the second thickness being less than the first thickness.

[0030] The above and other aspects, features and characteristics of certain exemplary embodiments disclosed will become more apparent from the following description, claims and drawings. Attached Figure Description

[0031] The above and other aspects, features, and characteristics of certain exemplary embodiments disclosed will become more apparent from the following description taken in conjunction with the accompanying drawings, in which:

[0032] Figure 1 This is a perspective view of a display device according to some example embodiments;

[0033] Figure 2 This is a plan view of a portion of a display device according to some example embodiments;

[0034] Figure 3 It can be an equivalent circuit diagram of pixels that can be included in a display device according to some example embodiments;

[0035] Figure 4 This is a plan view of the touch unit of a display device according to some example embodiments;

[0036] Figure 5 yes Figure 4 A magnified view of region A;

[0037] Figure 6 This is a cross-sectional view of a portion of the display area according to some example embodiments;

[0038] Figure 7 and Figure 8 This is a cross-sectional view of a portion of a display device according to some example embodiments;

[0039] Figure 9 and Figure 10 This is a cross-sectional view of a portion of a display device according to some example embodiments; and

[0040] Figures 11A to 11E These are cross-sectional views of some of the methods of manufacturing a display device according to some example embodiments. Detailed Implementation

[0041] Reference will now be made in detail to the embodiments, examples of which are illustrated in the accompanying drawings, wherein the same reference numerals always denote the same elements. In this respect, the embodiments may take different forms and should not be construed as being limited to the description set forth herein. Therefore, the embodiments are described below only with reference to the drawings to explain aspects of this description. As used herein, the term “and / or” includes any and all combinations of one or more of the associated listed items. When a statement such as “at least one of…” follows a list of elements, it modifies the entire list of elements, not any individual element in the list.

[0042] It will be understood that while the terms “first,” “second,” etc., may be used herein to describe various components, these components should not be limited by these terms. These terms are used only to distinguish one component from another. As used herein, unless the context clearly indicates otherwise, the singular forms “a,” “one,” and “the” are also intended to include the plural forms.

[0043] It will also be understood that the terms “comprising” and / or “including” as used herein indicate the presence of the stated features or components, but do not exclude the presence or addition of one or more other features or components. It will be understood that when a layer, region, or component is referred to as being “formed” “on” another layer, region, or component, that layer, region, or component may be formed directly or indirectly on said other layer, region, or component. That is, for example, intermediate layers, regions, or components may exist.

[0044] For ease of explanation, the dimensions of the elements in the accompanying drawings may be exaggerated. In other words, because the dimensions and thicknesses of the components in the drawings are arbitrarily shown for ease of explanation, the following embodiments are not limited thereto.

[0045] In the examples below, the x-axis, y-axis, and z-axis are not limited to the three axes of a Cartesian coordinate system, but can be interpreted in a broader sense. For example, the x-axis, y-axis, and z-axis can be perpendicular to each other, or they can represent different directions that are not perpendicular to each other.

[0046] When an embodiment can be implemented differently, the specific process sequence can be performed in a sequence different from that described. For example, two consecutively described processes can be performed substantially simultaneously or in the reverse order of being described.

[0047] Figure 1 This is a perspective view of a display device 1 according to some example embodiments.

[0048] Reference Figure 1 The display device 1 includes a display area DA in which an image is displayed and a non-display area NDA in which no image is displayed. The display device 1 can display an image by utilizing light emitted from a plurality of pixels P arranged in the display area DA. The non-display area NDA is the area in which no image is displayed.

[0049] Although the display device 1 according to some example embodiments is described as an organic light-emitting display device as an example, the display device 1 according to this disclosure is not limited thereto. According to some example embodiments, the display device 1 according to this disclosure can be various display devices, such as inorganic light-emitting displays and quantum dot light-emitting displays. For example, the emitting layer disposed on the display element of the display device 1 may include organic materials, inorganic materials, quantum dots, organic materials and quantum dots, or inorganic materials and quantum dots.

[0050] Although Figure 1 A display device 1 including a flat display surface is shown, but the embodiments are not limited thereto. According to some example embodiments, the display device 1 may include a three-dimensional display surface or a curved display surface.

[0051] When the display device 1 includes a three-dimensional display surface, the display device 1 may include multiple display areas indicating different directions, such as a polygonal display surface. According to some example embodiments, when the display device 1 includes a curved display surface, the display device 1 may be various display devices, such as flexible display devices, foldable display devices, and rollable display devices.

[0052] Furthermore, according to some example embodiments, such as Figure 1 As shown, the display device 1 can be used in a mobile phone terminal. According to some example embodiments, electronic modules, camera modules, power modules, etc., mounted on the motherboard can be arranged together with the display device 1 on a bracket / housing to form a mobile phone terminal. According to some example embodiments, the display device 1 can be used in various suitable large electronic devices (such as televisions and monitors) and small and medium-sized electronic devices (such as tablets, navigation devices for cars, game consoles, and smartwatches) depending on its design.

[0053] Although Figure 1 The display area DA of the display device 1 is shown to be quadrilateral, but according to some example embodiments, the shape of the display area DA may be circular, elliptical or polygonal such as triangle or pentagon.

[0054] According to some example embodiments, the display device 1 may include a display unit (i.e., a display layer) and a touch unit TU (see Figure 4 The display unit, touch unit TU, polarization unit, and window unit may be formed by a continuous process or bonded together by adhesive components.

[0055] Figure 2 This is a plan view of a portion of a display device 1 according to some example embodiments.

[0056] Reference Figure 2The display panel DP includes a plurality of pixels P arranged in the display area DA. Although only a single pixel P is shown in some figures for the convenience of illustration and description, those skilled in the art will understand that the display device 1 according to various embodiments includes a plurality of pixels P.

[0057] Multiple pixels P can each include a display element such as an organic light-emitting diode (OLED). Each pixel P can emit, for example, red, green, blue, or white light from the OLED. In this specification, pixel P can be a pixel that emits one of red, green, blue, and white light. The display area DA can be encapsulated with a thin-film encapsulation layer TFE (see...). Figure 6 It is covered, thus protecting it from external air or moisture.

[0058] Each pixel P can be electrically connected to peripheral circuitry arranged in the non-display area NDA. For example, a first scan drive circuit 110, a second scan drive circuit 120, a pad (or "soldering pad") unit 140, a data drive circuit 150, a first power line 160, and a second power line 170 can be arranged in the non-display area NDA and (directly or indirectly) connected to pixel P.

[0059] The first scan driving circuit 110 can provide a scan signal to each pixel P via a corresponding scan line SL. The first scan driving circuit 110 can also provide an emission control signal to each pixel P via a corresponding emission control line EL. The second scan driving circuit 120 can be arranged parallel to the first scan driving circuit 110, with the display area DA located between them. Some of the pixels P arranged in the display area DA can be electrically connected to the first scan driving circuit 110, and the remaining pixels of pixel P can be connected to the second scan driving circuit 120. According to some example embodiments, the second scan driving circuit 120 can be omitted.

[0060] The pad unit 140 can be disposed on one side of the substrate 100. The pad unit 140 can be exposed without being covered by an insulating layer, and therefore can be electrically connected to the printed circuit board (PCB). The pad unit PCB-P of the printed circuit board PCB can be electrically connected to the pad unit 140 of the display device 1. The printed circuit board PCB transmits signals or power from the controller to the display device 1.

[0061] The control signals generated by the controller can be transmitted via a printed circuit board (PCB) to each of the first scan drive circuit 110 and the second scan drive circuit 120. The controller can provide a first power voltage ELVDD and a second power voltage ELVSS to the first power line 160 and the second power line 170 respectively via a first connection line 161 and a second connection line 171. The first power voltage ELVDD can be provided to each pixel P via a drive voltage line PL connected to the first power line 160, and the second power voltage ELVSS can be provided to the counter electrode of each pixel P connected to the second power line 170.

[0062] The data driving circuit 150 is electrically connected to the data line DL. The data signal from the data driving circuit 150 can be provided to each pixel P via the connection line 151 connected to the pad unit 140 and the data line DL connected to the connection line 151. Although in Figure 2 The diagram shows the data driver circuit 150 arranged on a printed circuit board (PCB), but according to some example embodiments, the data driver circuit 150 may be arranged on the substrate 100. For example, the data driver circuit 150 may be arranged between the pad unit 140 and the first power line 160.

[0063] The first power line 160 may include a first sub-line 162 and a second sub-line 163, the first sub-line 162 and the second sub-line 163 extending parallel to each other in the x-direction and the display area DA located between the first sub-line 162 and the second sub-line 163. The second power line 170 has an annular shape with an open side and may partially surround the display area DA.

[0064] Figure 3 It can be an equivalent circuit diagram that can be included in a pixel P in a display device 1 according to some example embodiments.

[0065] Reference Figure 3 Each pixel P includes a pixel circuit PC and an organic light-emitting diode OLED. The pixel circuit PC is connected to the scan line SL and the data line DL, and the organic light-emitting diode OLED is connected to the pixel circuit PC.

[0066] The pixel circuit PC includes a driving thin-film transistor Td, a switching thin-film transistor Ts, and a storage capacitor Cst. The switching thin-film transistor Ts is connected to the scan line SL and the data line DL, and transmits the data signal Dm input through the data line DL to the driving thin-film transistor Td in response to the scan signal Sn input through the scan line SL.

[0067] The storage capacitor Cst is connected to the switching thin-film transistor Ts and the drive voltage line PL, and stores the voltage corresponding to the difference between the voltage transmitted from the switching thin-film transistor Ts and the first power voltage ELVDD (or drive voltage).

[0068] The driving thin-film transistor Td is connected to the driving voltage line PL and the storage capacitor Cst, and the driving current flowing from the driving voltage line PL through the organic light-emitting diode (OLED) can be controlled in response to the voltage value stored in the storage capacitor Cst. The OLED can emit light with brightness (e.g., set or predetermined brightness) by utilizing the driving current.

[0069] Although Figure 3 The diagram illustrates a pixel circuit PC comprising two thin-film transistors and a storage capacitor, but embodiments are not limited thereto. For example, a pixel circuit PC may include seven thin-film transistors and a storage capacitor. According to some example embodiments, the pixel circuit PC may include two or more storage capacitors.

[0070] Figure 4 This is a plan view of the touch unit TU of the display device 1 according to some example embodiments, and Figure 5 yes Figure 4 A magnified view of region A.

[0071] Reference Figure 4 The touch unit TU may include first sensing electrodes IE1-1 to IE1-5, first signal lines SL1-1 to SL1-5 connected to the first sensing electrodes IE1-1 to IE1-5, second sensing electrodes IE2-1 to IE2-4, and second signal lines SL2-1 to SL2-4 connected to the second sensing electrodes IE2-1 to IE2-4.

[0072] According to some example embodiments, the touch unit TU comprises a first conductive layer 420 (see...). Figure 6 The first sensing electrodes IE1-1 to IE1-5 are formed by the second conductive layer 440 (see Figure 6 The second sensing electrodes IE2-1 to IE2-4 are formed. Figure 4 The first sensing electrodes IE1-1 to IE1-5 and the second sensing electrodes IE2-1 to IE2-4, all having a grid shape, are shown as examples. According to some example embodiments, the first sensing electrodes IE1-1 to IE1-5 and the second sensing electrodes IE2-1 to IE2-4 can all have a Ti / Al / Ti three-layer structure.

[0073] According to some example embodiments, the touch unit TU may further include an optical dummy electrode disposed in the boundary region between the first sensing electrodes IE1-1 to IE1-5 and the second sensing electrodes IE2-1 to IE2-4. In this regard, the touch unit TU may also include a first dummy electrode formed by a first conductive layer 420 and a second dummy electrode formed by a second conductive layer 440.

[0074] The first dummy electrode is connected to the second sensor SP2 via a contact hole to the second sensing electrodes IE2-1 to IE2-4. The second dummy electrode is connected to the first sensor SP1 via a contact hole to the first sensing electrodes IE1-1 to IE1-5. The first and second dummy electrodes can reduce the resistance of the first sensing electrodes IE1-1 to IE1-5 and the second sensing electrodes IE2-1 to IE2-4.

[0075] Each of the first sensing electrodes IE1-1 to IE1-5 includes a first sensor SP1 and a first connector CP1. Each of the second sensing electrodes IE2-1 to IE2-4 includes a second sensor SP2 and a second connector CP2. The two first sensors SP1 located at both ends of each of the first sensing electrodes IE1-1 to IE1-5 may have a smaller size than the first sensor SP1 located at the center (e.g., half the size of the first sensor SP1 located at the center). Similarly, the two second sensors SP2 located at both ends of each of the second sensing electrodes IE2-1 to IE2-4 may have a smaller size than the second sensor SP2 located at the center (e.g., half the size of the second sensor SP2 located at the center).

[0076] Although Figure 4 The diagram shows that the first sensing electrodes IE1-1 to IE1-5 and the second sensing electrodes IE2-1 to IE2-4 all have patterns containing specific shapes, but the shape of the patterns is not limited. According to some example embodiments, although... Figure 4 A first sensor SP1 and a second sensor SP2, both having a rhomboid shape, are shown as examples; however, the embodiments are not limited to this, and the first sensor SP1 and the second sensor SP2 may have different polygonal shapes. According to some example embodiments, the first sensing electrodes IE1-1 to IE1-5 and the second sensing electrodes IE2-1 to IE2-4 may have shapes in which the sensors and connectors are not distinguished (e.g., strip shapes).

[0077] The first sensor SP1 is arranged along the x-direction inside a first sensing electrode IE1-1 to IE1-5, and the second sensor SP2 is arranged along the y-direction inside a second sensing electrode IE2-1 to IE2-4. First connectors CP1 are all connected to the adjacent first sensor SP1, and second connectors CP2 are all connected to the adjacent second sensor SP2.

[0078] First signal lines SL1-1 to SL1-5 are respectively connected to one end of the first sensing electrodes IE1-1 to IE1-5. Second signal lines SL2-1 to SL2-4 are respectively connected to both ends of the second sensing electrodes IE2-1 to IE2-4. According to some example embodiments, the first signal lines SL1-1 to SL1-5 may also be connected to both ends of the first sensing electrodes IE1-1 to IE1-5. The second signal lines SL2-1 to SL2-4 may each be connected to only one end of the second sensing electrodes IE2-1 to IE2-4.

[0079] Reference Figure 4 and Figure 5 According to some example embodiments, the first sensing electrodes IE1-1 to IE1-5 and the second sensing electrodes IE2-1 to IE2-4 can all have a grid shape. Because the first sensing electrodes IE1-1 to IE1-5 and the second sensing electrodes IE2-1 to IE2-4 all have a grid shape, the parasitic capacitance between the sensing electrodes and the electrodes (e.g., counter electrodes) of the display unit can be reduced. Furthermore, as described below, because the first sensing electrodes IE1-1 to IE1-5 and the second sensing electrodes IE2-1 to IE2-4 are not superimposed with the emission regions AA-R, AA-G, and AA-B, the first sensing electrodes IE1-1 to IE1-5 and the second sensing electrodes IE2-1 to IE2-4 are not visible to the user of the display device 1.

[0080] The first sensing electrodes IE1-1 to IE1-5 and the second sensing electrodes IE2-1 to IE2-4 may include, but are not limited to, Ag, Al, Cu, Cr, Ni, and Ti, which can be processed at low temperatures. Although the input sensing unit is formed through a continuous process, damage to the organic light-emitting diode (OLED) can be prevented or reduced.

[0081] Although Figure 5 A first sensor SP1 is shown, but a second sensor SP2 has a structure substantially identical to that of the first sensor SP1. The first sensor SP1 is not superimposed with the emitting regions AA-R, AA-G, and AA-B, but is superimposed with the non-emitting region NAA. The emitting regions AA-R, AA-G, and AA-B can all be defined as equivalent to... Figure 6 The launch area EA is shown in the diagram.

[0082] Based on the color of the light emitted from organic light-emitting diodes (OLEDs), the emission regions AA-R, AA-G, and AA-B can be classified into multiple groups. Figure 5 The diagram shows emission regions AA-R, AA-G, and AA-B, which are classified into three groups based on their emitted color. According to some example embodiments, emission regions AA-R, AA-G, and AA-B can emit red, green, and blue light, respectively.

[0083] Although the diagram shows meshes OPR, OPG, and OPB corresponding one-to-one with transmission areas AA-R, AA-G, and AA-B, the embodiments are not limited thereto. Each of meshes OPR, OPG, and OPB may correspond to two or more transmission areas AA-R, AA-G, and AA-B. Figure 5 The diagram shows that the planar shapes of the meshes OPR, OPG, and OPB are rhomboid shapes corresponding to the shapes of the emission regions AA-R, AA-G, and AA-B, but the embodiments are not limited to this. The planar shapes of the meshes OPR, OPG, and OPB can be polygonal shapes other than rhomboid shapes, for example, polygonal shapes with rounded corners.

[0084] Figure 6 This is a cross-sectional view of a portion of the display area DA according to some example embodiments.

[0085] Reference Figure 6 The diagram shows the structure of the display panel DP and the touch unit TU corresponding to the display area DA.

[0086] The substrate 100 may comprise glass or a polymer resin. The polymer resin may comprise polyethersulfone (PES), polyacrylate, polyetherimide (PEI), polyethylene naphthalate (PEN), polyethylene terephthalate (PET), polyphenylene sulfide (PPS), polyarylate, polyimide (PI), polycarbonate (PC), and cellulose acetate propionate (CAP). The substrate 100 comprising the polymer resin may be flexible, rollable, or bendable. The substrate 100 may have a multilayer structure comprising an inorganic layer and a layer containing the polymer resin.

[0087] A buffer layer 101 may be positioned on the substrate 100 to reduce or prevent the infiltration of foreign matter, moisture, or outside air from below the substrate 100, and may provide a flat surface on the substrate 100. The buffer layer 101 may comprise inorganic or organic materials, such as oxides or nitrides, or organic / inorganic composite materials, and may include a single-layer or multi-layer structure of inorganic and organic materials. A barrier layer may also be provided between the substrate 100 and the buffer layer 101 to block the infiltration of outside air.

[0088] A thin-film transistor (TFT), a storage capacitor (Cst) (not shown), and an organic light-emitting diode (OLED) as a light-emitting element can be arranged in a display area DA on a substrate 100. The OLED is electrically connected to the TFT and the storage capacitor (Cst).

[0089] Figure 6 Thin-film transistors (TFTs) can be set to a reference. Figure 3The pixel circuit PC described corresponds to one of the thin-film transistors (e.g., the driving thin-film transistor Td).

[0090] The thin-film transistor (TFT) includes a semiconductor layer 134 and a gate electrode 136. The semiconductor layer 134 may include, for example, polysilicon. The semiconductor layer 134 may include a channel region 131, a source region 132, and a drain region 133. The channel region 131 is stacked with the gate electrode 136. The source region 132 and the drain region 133 are disposed on two opposite sides of the channel region 131 and include impurities with a higher concentration than that in the channel region 131. Here, the impurities may include N-type impurities or P-type impurities. It is understood that the source region 132 and the drain region 133 are the source electrode and drain electrode of the thin-film transistor TFT, respectively.

[0091] Semiconductor layer 134 may comprise oxide semiconductors and / or silicon semiconductors. When semiconductor layer 134 comprises an oxide semiconductor, it may comprise an oxide of at least one of, for example, In, Ga, Sn, Zr, V, Hf, Cd, Ge, Cr, Ti, and Zn. For example, semiconductor layer 134 may be ITZO (InSnZnO) or IGZO (InGaZnO). When semiconductor layer 134 comprises a silicon semiconductor, it may comprise, for example, amorphous silicon (a-Si) or low-temperature polycrystalline silicon (LTPS) obtained by crystallizing amorphous silicon.

[0092] The gate electrode 136 may comprise a single layer or multiple layers, wherein the single layer or multiple layers comprise at least one metal selected from Al, Pt, Pd, Ag, Mg, Au, Ni, Nd, Ir, Cr, Li, Ca, Mo, Ti, W, and Cu. The gate electrode 136 may be connected to a gate line to which an electrical signal is applied.

[0093] The gate insulating layer 103 may be disposed between the semiconductor layer 134 and the gate electrode 136. The gate insulating layer 103 may include SiO2 or SiN. x The gate insulating layer 103 may comprise a single layer or multiple layers containing the above inorganic insulating materials, including SiON, Al2O3, TiO2, Ta2O5, HfO2, and ZnO2.

[0094] An interlayer insulating layer 107 may be disposed on the gate electrode 136. The interlayer insulating layer 107 may include SiO2 or SiN. x The components include SiON, Al2O3, TiO2, Ta2O5, HfO2, or ZnO2, and may be single-layered or multi-layered.

[0095] The thin-film transistor (TFT) may include a source electrode 138S and a drain electrode 138D, respectively connected to the source region 132 and the drain region 133 of the semiconductor layer 134. The source electrode 138S and the drain electrode 138D are electrically connected to the source region 132 and the drain region 133 of the semiconductor layer 134 through contact holes passing through the gate insulating layer 103 and the interlayer insulating layer 107.

[0096] The source electrode 138S and drain electrode 138D may include at least one of Al, Cu, and Ti and may comprise a single layer or multiple layers. According to some example embodiments, the source electrode 138S and drain electrode 138D may have a Ti / Al / Ti or TiN / Al / Ti multilayer structure.

[0097] According to some example embodiments, the data line DL (see...) Figure 3 ) and drive voltage line PL (see Figure 3 It may include the same material as the source electrode 138S and the drain electrode 138D, and is disposed on the same layer as the layer on which the source electrode 138S and the drain electrode 138D are disposed.

[0098] The thin-film transistor (TFT) can be covered by a protective layer 109. The protective layer 109 can prevent wiring, including metals such as Al, from being exposed to the etching environment, where the metals are damaged by etchants during the manufacturing process of the display device 1.

[0099] The planarization layer 113 can be disposed on the protective layer 109. The planarization layer 113 can planarize the surface on which the organic light-emitting diode (OLED) will be disposed by planarizing the top surface of the pixel circuit PC.

[0100] Planarization layer 113 may include general-purpose polymers (such as benzocyclobutene (BCB), polyimide, hexamethyldisiloxane (HMDSO), polymethyl methacrylate (PMMA), or polystyrene (PS)), polymer derivatives having phenolic groups, acrylic polymers, imide polymers, aryl ether polymers, amide polymers, fluorinated polymers, p-xylene polymers, vinyl alcohol polymers, and blends thereof. Planarization layer 113 may include inorganic materials. Planarization layer 113 may include SiO2, SiN... x The materials used are SiON, Al2O3, TiO2, Ta2O5, HfO2, or ZnO2. When the planarization layer 113 includes inorganic materials, chemical planarization polishing can be performed as appropriate. The planarization layer 113 can include both organic and inorganic materials.

[0101] In the display area DA of the substrate 100, light-emitting elements (i.e., organic light-emitting diodes OLEDs) can be arranged on the planarization layer 113. The organic light-emitting diode OLED includes a pixel electrode 210, an intermediate layer 220 and a counter electrode 230 facing the pixel electrode 210, and the intermediate layer 220 is located between the pixel electrode 210 and the counter electrode 230.

[0102] Pixel electrode 210 may be disposed on planarization layer 113. Pixel electrode 210 may include a (semi-)transparent electrode or a reflective electrode. According to some example embodiments, pixel electrode 210 may include a reflective layer and a transparent or semi-transparent electrode layer, wherein the reflective layer includes at least one of Ag, Mg, Al, Pt, Pd, Au, Ni, Nd, Ir, Cr, and mixtures thereof. The transparent or semi-transparent electrode layer may include at least one of indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), indium oxide (In2O3), indium gallium oxide (IGO), and zinc aluminum oxide (AZO). According to some example embodiments, pixel electrode 210 may have an ITO / Ag / ITO stacked structure.

[0103] A pixel defining layer 180 may be disposed on a planarization layer 113. The pixel defining layer 180 may define the emission region EA of pixel P by including an opening that exposes the central portion of pixel electrode 210. Furthermore, the pixel defining layer 180 may prevent arcing or the like at the edges of pixel electrode 210 by increasing the distance between the edge of pixel electrode 210 and the counter electrode 230 above pixel electrode 210. The pixel defining layer 180 may comprise, for example, organic insulating materials such as polyimide, polyamide, acrylic resin, BCB, HMDSO, and phenolic resin. The pixel defining layer 180 may be formed by a method such as spin coating.

[0104] Spacers can be disposed on the pixel defining layer 180. The spacers prevent damage to the organic light-emitting diode (OLED) during mask manufacturing processes due to mask recesses. The spacers can include, for example, organic insulating materials such as polyimide, polyamide, acrylic resin, BCB, HMDSO, and phenolic resin. The spacers can be formed by methods such as spin coating and can comprise a single layer or multiple layers.

[0105] Intermediate layer 220 may be disposed on pixel electrode 210 exposed by pixel defining layer 180. Intermediate layer 220 may include an emitter layer and may also optionally include functional layers located below and above the emitter layer, including hole transport layer (HTL), hole injection layer (HIL), electron transport layer (ETL), and electron injection layer (EIL).

[0106] The emitting layer may include organic materials, such as fluorescent or phosphorescent materials that emit red, green, blue, or white light. The emitting layer may also include low-molecular-weight organic materials or polymeric organic materials.

[0107] When the emitter layer comprises a low molecular weight material, the intermediate layer 220 has a structure in which HIL, HTL, emitter layer (EML), ETL, EIL, etc., are stacked individually or in combination. The intermediate layer 220 may comprise various organic materials as low molecular weight materials, such as copper phthalocyanine (CuPc), N,N'-bis(naphthyl-1-yl)-N,N'-diphenyl-benzidine (NPB), and tris(8-hydroxyquinoline)aluminum (Alq3). These layers can be formed by vacuum deposition.

[0108] When the emitter layer comprises a polymer material, the intermediate layer 220 may have a structure that typically includes an HTL and an EML. In this case, the HTL may include PEDOT, and the EML may include polymer materials such as polyphenylene oxide (PPV) and polyfluorene. The emitter layer can be formed by screen printing, inkjet printing, laser-induced thermal imaging (LITI), etc.

[0109] Pixel electrodes 210 can be configured as multiple pixel electrodes, and intermediate layers 220 can be arranged to correspond to each of the multiple pixel electrodes 210. However, embodiments are not limited to this. Intermediate layers 220 may include a single layer distributed throughout the multiple pixel electrodes 210. Various modifications can be made. According to some example embodiments, emission layers may be arranged to correspond to each of the multiple pixel electrodes 210, and functional layers other than emission layers may be configured as a single layer distributed throughout the multiple pixel electrodes 210.

[0110] The counter electrode 230 can be disposed on the intermediate layer 220. The counter electrode 230 can be disposed on the intermediate layer 220 and can completely cover the intermediate layer 220.

[0111] The counter electrode 230 can be arranged in the display area DA and on the entire surface of the display area DA. That is, the counter electrode 230 can be configured as a single unit to cover multiple pixels P.

[0112] The counter electrode 230 can be a transparent electrode or a reflective electrode. According to some example embodiments, the counter electrode 230 can be a transparent or translucent electrode and can include a thin metal layer having a small work function and comprising at least one of Li, Ca, LiF / Ca, LiF / Al, Al, Ag, Mg, and mixtures thereof. Furthermore, a transparent conductive oxide (TCO) layer can be further disposed on the thin metal layer, the TCO layer comprising ITO, IZO, ZnO, or In2O3.

[0113] When the pixel electrode 210 includes a reflective electrode and the counter electrode 230 includes a transparent electrode, the light emitted from the intermediate layer 220 is emitted toward the counter electrode 230, so the display device 1 can be a top-emission type display device.

[0114] According to some example embodiments, when the pixel electrode 210 includes a transparent or semi-transparent electrode and the counter electrode 230 includes a reflective electrode, light emitted from the intermediate layer 220 is emitted toward the substrate 100, thus the display device 1 can be a bottom-emitting type display device. However, embodiments according to this disclosure are not limited thereto, and the display device 1 according to some example embodiments can be a dual-emitting type display device that emits light in two directions, including the top side and the bottom side.

[0115] The thin-film encapsulation layer TFE can be disposed on the counter electrode 230 to protect the organic light-emitting diode (OLED) from external moisture and oxygen. The thin-film encapsulation layer TFE may include at least one organic encapsulation layer and at least one inorganic encapsulation layer.

[0116] The thin-film encapsulation layer TFE may include a first inorganic encapsulation layer 310, a second inorganic encapsulation layer 330, and an organic encapsulation layer 320. The second inorganic encapsulation layer 330 is located above the first inorganic encapsulation layer 310, and the organic encapsulation layer 320 is located between the first inorganic encapsulation layer 310 and the second inorganic encapsulation layer 330.

[0117] Both the first inorganic encapsulation layer 310 and the second inorganic encapsulation layer 330 may comprise at least one inorganic material selected from aluminum oxide, titanium oxide, tantalum oxide, hafnium oxide, zinc oxide, silicon oxide, silicon nitride, and silicon oxynitride. The first inorganic encapsulation layer 310 and the second inorganic encapsulation layer 330 may comprise a single layer or multiple layers containing the above materials. The first inorganic encapsulation layer 310 and the second inorganic encapsulation layer 330 may comprise the same material or different materials.

[0118] The organic encapsulation layer 320 may include monomeric or polymeric materials. The organic encapsulation layer 320 may include polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polycarbonate (PC), polyimide (PI), polyethylene sulfonate, polyoxymethylene, polyarylate, hexamethyldisiloxane (HMDSO), acrylic resins (e.g., polymethyl methacrylate (PMMA), polyacrylic acid, etc.), or any combination thereof.

[0119] The touch unit TU can be disposed on the thin-film encapsulation layer TFE. The touch unit TU can also be directly disposed on the thin-film encapsulation layer TFE. See below for reference. Figure 7 Detailed description of the touch unit TU.

[0120] Figure 7 and Figure 8This is a cross-sectional view of a portion of a display device 1 according to some example embodiments.

[0121] Although Figure 7 and Figure 8 The diagram shows a thin-film encapsulation layer TFE and a bottom conductive layer 422 disposed on a substrate 100, but as... Figure 6 As shown, the thin-film transistor (TFT), storage capacitor (Cst), and organic light-emitting diode (OLED) disposed in the display area DA can be arranged on the substrate 100, and the OLED is electrically connected to the TFT and the storage capacitor (Cst). For ease of description, Figure 7 and Figure 8 The components are briefly shown.

[0122] Reference Figure 7 According to some example embodiments, the display panel DP1 of the display device 1 includes a substrate 100 and a touch unit TU. The substrate 100 includes a display area DA and a non-display area NDA, and the touch unit TU is disposed on the substrate 100.

[0123] The first inorganic insulating layer 410, the first conductive layer 420, the first organic layer 430, the second conductive layer 440, and the second organic layer 450 can be arranged on the thin film encapsulation layer TFE in the display area DA.

[0124] The first inorganic insulating layer 410 may have a single-layer or multi-layer structure. According to some example embodiments, the first inorganic insulating layer 410 may include SiO2, SiN, etc. x The first inorganic insulating layer 410 is substantially the same as the first insulating layer 411 and the first layer 412 described below, and may include the same material as the first insulating layer 411 and the first layer 412.

[0125] The first inorganic insulating layer 410 can be disposed on the thin film encapsulation layer TFE to prevent the thin film encapsulation layer TFE from being damaged during the process of arranging the touch unit TU.

[0126] The first conductive layer 420 may be disposed on the first inorganic insulating layer 410, and the second conductive layer 440 may be disposed on the first conductive layer 420. The first conductive layer 420 and the second conductive layer 440 may include one of the first sensing electrodes IE1-1 to IE1-5 and the second sensing electrodes IE2-1 to IE2-4.

[0127] The first conductive layer 420 and the second conductive layer 440 can have a single-layer structure or a stacked multilayer structure. The first conductive layer 420 and the second conductive layer 440 having a single-layer structure can include a metal layer or a transparent conductive layer. The metal layer can include at least one of Mo, Ag, Ti, Cu, Al and alloys thereof. The transparent conductive layer can include a transparent conductive oxide such as ITO, IZO, ZnO and ITZO.

[0128] Additionally, the transparent conductive layer may include conductive polymers such as PEDOT, metal nanowires, and graphene. The first conductive layer 420 and the second conductive layer 440, having a multilayer structure, may include multiple metal layers. The first conductive layer 420 and the second conductive layer 440 may include, for example, a three-layer structure of Ti / Al / Ti. The first conductive layer 420 and the second conductive layer 440, having a multilayer structure, may include at least one metal layer and at least one transparent conductive layer. The first conductive layer 420 may include the same material as the first wiring layer 421 described below, and the second conductive layer 440 may include the same material as the second wiring layer 441 and the top conductive layer 442 described below.

[0129] like Figure 6 As shown, because the first conductive layer 420 and the second conductive layer 440 are not superimposed on the emission region EA, the first conductive layer 420 and the second conductive layer 440 may not be seen by the user of the display device 1. The first conductive layer 420 can be electrically connected to the second conductive layer 440 through the first contact hole CNT1 defined in the first organic layer 430 as described below.

[0130] In display devices of related technologies, the touch unit TU can be constructed by arranging an inorganic layer between the first conductive layer 420 and the second conductive layer 440. When the inorganic layer is arranged between the first conductive layer 420 and the second conductive layer 440, the touch performance is degraded because the panel has a small ultimate curvature and the inorganic layer is thin.

[0131] To avoid such degradation, the method of constructing the touch unit TU may include disposing a first organic layer 430 between the first conductive layer 420 and the second conductive layer 440. However, for the reliability of the emitter layer, a process with a temperature below 100°C can be used during the process of disposing the touch unit TU on the thin-film encapsulation layer TFE. Therefore, the temperature of the process for curing the organic layer is limited. When the photosensitive material is peeled off after an optical process in which the second conductive layer 440 is disposed on the first organic layer 430 using a photosensitive material, the first organic layer 430, which has insufficient hardness due to low-temperature curing, is susceptible to the weak chemical resistance to the release agent. Therefore, the exposed portion of the first organic layer 430 is lifted by the release agent, and thus the first organic layer 430 is damaged.

[0132] Conversely, in the display device 1 according to some example embodiments, since the second conductive layer 440 is patterned using a second organic layer 450 disposed on the second conductive layer 440 and comprising a photosensitive material as a photoresist, a separate process for stripping the photosensitive material is not required. Therefore, damage to the first organic layer 430 disposed between the first conductive layer 420 and the second conductive layer 440 can be prevented or reduced. That is, according to some example embodiments, by avoiding the process of stripping the photosensitive material, damage to the underlying layers can be avoided or reduced.

[0133] Furthermore, after the process of depositing the second conductive layer 440 on the first organic layer 430, the process of depositing the second organic layer 450 on the second conductive layer 440 is not performed separately. Instead, because the second conductive layer 440 and the second organic layer 450 are deposited simultaneously in one process, the manufacturing process can be relatively simplified and fewer masks can be used compared to the manufacturing process of related technologies, thus improving manufacturing efficiency.

[0134] The first organic layer 430 may be disposed on the first conductive layer 420. The first organic layer 430 may include at least one selected from acrylic resin, methacrylate resin, polyisoprene, ethylene resin, epoxy resin, urethane resin, cellulose resin, siloxane resin, polyimide resin, polyamide resin, and perylene resin.

[0135] Because an organic layer (i.e., the first organic layer 430) is disposed on the first conductive layer 420 instead of an inorganic layer, the limiting curvature of the panel is increased and the folding characteristics are improved. Furthermore, because the thickness between the first conductive layer 420 and the second conductive layer 440 is increased and the parasitic capacitance is reduced, the touch sensitivity of the touch unit TU is improved and the touch performance is enhanced.

[0136] The first contact hole CNT1 may be defined in the first organic layer 430, and the first conductive layer 420 may be electrically connected to the second conductive layer 440 through the first contact hole CNT1. The first organic layer 430 may include the same material as the second insulating layer 431 and the second layer 432 described below.

[0137] The second conductive layer 440 and the second organic layer 450 may be disposed on the first organic layer 430. The second organic layer 450 may include at least one selected from acrylic resins, methacrylate resins, polyisoprene, ethylene resins, epoxy resins, urethane resins, cellulose resins, siloxane resins, polyimide resins, polyamide resins, and perylene resins. For example, the second organic layer 450 may include a photosensitive material.

[0138] In order to improve the transmittance of the display device 1, the first organic layer 430 and the second organic layer 450 may include different materials, and the refractive index of the first organic layer 430 may be different from the refractive index of the second organic layer 450.

[0139] like Figure 7 As shown, the second organic layer 450 can be disposed on the second conductive layer 440. During the process of disposing of the second conductive layer 440 on the first organic layer 430, the second conductive layer 440 can be patterned by using the second organic layer 450, which includes a photosensitive material, as a photoresist.

[0140] After the second conductive layer 440 is patterned, a portion of the second organic layer 450 can be reflowed through a curing process to cover the side surfaces of the second conductive layer 440. Thus, the second organic layer 450 can be disposed on the second conductive layer 440 to cover both the side and top surfaces of the second conductive layer 440.

[0141] Reference Figure 8 According to some example embodiments, the second organic layer 453 of the display panel DP2 may include a light-shielding material, and the light-shielding material may be a black matrix. The black matrix may include various materials, such as black pigments, Cr, or CrO. x Mixed organic materials. The black matrix includes Cr or CrO. x In this case, the black matrix may include Cr or CrO. x It can be a single layer or multiple layers. When the display device 1 includes a black matrix, external light reflection can be sufficiently prevented or reduced.

[0142] According to some example embodiments, the non-display area NDA of the display device 1 may include a wiring area TR and a pad area PAD located on one side of the display area DA. The touch unit TU in the wiring area TR may include a first insulating layer 411, a first wiring layer 421, a second insulating layer 431, a second wiring layer 441, and a third insulating layer 451.

[0143] The first insulating layer 411 can be disposed on the thin-film encapsulation layer TFE. Because the first insulating layer 411 is disposed on the thin-film encapsulation layer TFE, the first insulating layer 411 can prevent the thin-film encapsulation layer TFE from being damaged during the process of forming the touch unit TU.

[0144] The first insulating layer 411 may include the same material as the first inorganic insulating layer 410 and the first layer 412 described below.

[0145] The first wiring layer 421 may be disposed on the first insulating layer 411, and the second wiring layer 441 may be disposed on the first wiring layer 421. The first wiring layer 421 and the second wiring layer 441 may include one of the first signal lines SL1-1 to SL1-5 and the second signal lines SL2-1 to SL2-4.

[0146] like Figure 7 As shown, the first wiring layer 421 and the second wiring layer 441 can be arranged more densely than the first conductive layer 420 and the second conductive layer 440 arranged in the display area DA.

[0147] The first wiring layer 421 may include the same material as the first conductive layer 420, and the second wiring layer 441 may include the same material as the second conductive layer 440 and the top conductive layer 442 described below.

[0148] The second insulating layer 431 may be disposed between the first wiring layer 421 and the second wiring layer 441. The second insulating layer 431 may comprise the same material as the first organic layer 430 and the second layer 432 described below.

[0149] Because an organic layer (i.e., for example, the second insulating layer 431) is arranged on the first wiring layer 421 instead of an inorganic layer, the maximum curvature of the panel is increased and the folding characteristics can be improved.

[0150] The second contact hole CNT2 may be defined within the second insulating layer 431. The first wiring layer 421 may be electrically connected to the second wiring layer 441 through the second contact hole CNT2. The second insulating layer 431 may comprise the same material as the first organic layer 430.

[0151] The second wiring layer 441 and the third insulating layer 451 may be disposed on the second insulating layer 431. The third insulating layer 451 may include at least one selected from acrylic resins, methacrylate resins, polyisoprene, ethylene resins, epoxy resins, urethane resins, cellulose resins, siloxane resins, polyimide resins, polyamide resins, and perylene resins. For example, the third insulating layer 451 may include a photosensitive material.

[0152] like Figure 7 As shown, the third insulating layer 451 can be disposed on the second wiring layer 441. During the process of disposing of the second wiring layer 441 on the second insulating layer 431, the second wiring layer 441 can be patterned by using the third insulating layer 451, which includes a photosensitive material, as a photoresist.

[0153] After the second wiring layer 441 is patterned, a portion of the third insulating layer 451 can be reflowed through a curing process to cover the side surfaces of the second wiring layer 441. Thus, the third insulating layer 451 can be disposed on the second wiring layer 441 to cover both the side and top surfaces of the second wiring layer 441. The third insulating layer 451 may comprise the same material as the second organic layer 450.

[0154] Reference Figure 8 According to some example embodiments, the third layer 454 of the display panel DP2 may include a light-shielding material, and the light-shielding material may be a black matrix. The black matrix may include various materials, such as black pigment, Cr, or CrO. x Mixed organic materials. The black matrix includes Cr or CrO. x In this case, the black matrix may include Cr or CrO. x It can be a single layer or multiple layers. When the display device 1 includes a black matrix, external light reflection can be sufficiently prevented.

[0155] The bottom conductive layer 422 can be disposed in the pad region PAD of the non-display region NDA. When forming the source electrode 138S and drain electrode 138D in the display region DA, the bottom conductive layer 422 can be formed simultaneously with the drain electrode 138D in the display region DA, and can include the same material as the source electrode 138S and drain electrode 138D in the display region DA.

[0156] The first layer 412 may be disposed on the bottom conductive layer 422. The first layer 412 may include the same material as the first inorganic insulating layer 410 and the first insulating layer 411.

[0157] The second layer 432 may be disposed on the first layer 412. The second layer 432 may include the same material as the first organic layer 430 and the second insulating layer 431.

[0158] The third contact hole CNT3 can be defined within the first layer 412 and the second layer 432. The bottom conductive layer 422 can be electrically connected to the top conductive layer 442, which is described below, through the third contact hole CNT3.

[0159] The top conductive layer 442 can be disposed on the second layer 432. The top conductive layer 442 can form one of the first signal lines SL1-1 to SL1-5, the second signal lines SL2-1 to SL2-4, and the pad unit 140.

[0160] The top surface of the top conductive layer 442 is not covered by an insulating layer and can be exposed to the outside. The top conductive layer 442 may comprise the same material as the second conductive layer 440 and the second wiring layer 441.

[0161] Figure 9 and Figure 10 This is a cross-sectional view of a portion of a display device 1 according to some example embodiments.

[0162] In the following text, refer to Figure 9 and Figure 10 The description pertains to display panels DP3 and DP4 according to some example embodiments. Descriptions will not be repeated. Figure 7 The same element described in [the document].

[0163] Reference Figure 9 According to some example embodiments, the display panel DP3 of the display device 1 may include a substrate 100 and a touch unit TU disposed on the substrate 100. The substrate 100 includes a display area DA and a non-display area NDA. The touch unit TU may include: a first inorganic insulating layer 410 disposed in the display area DA; a first conductive layer 420 disposed on the first inorganic insulating layer 410; a first organic layer 430 disposed on the first conductive layer 420; a second conductive layer 440 disposed on the first organic layer 430 and electrically connected to the first conductive layer 420 through a first contact hole CNT1 defined in the first organic layer 430; a second organic layer 450 disposed on the second conductive layer 440 to cover the top surface of the second conductive layer 440, the second organic layer 450 including a side surface positioned on the same plane as the side surface of the second conductive layer 440 and including a photosensitive material; and a third organic layer 460 disposed on the second organic layer 450.

[0164] The non-display area NDA may include a wiring area TR and a pad area PAD located on one side of the display area DA, and may further include: a first insulating layer 411 disposed in the wiring area TR; a first wiring layer 421 disposed on the first insulating layer 411; a second insulating layer 431 disposed on the first wiring layer 421; a second wiring layer 441 disposed on the second insulating layer 431 to be electrically connected to the first wiring layer 421 through a second contact hole CNT2 defined in the second insulating layer 431, the second wiring layer 441 comprising the same material as the second conductive layer 440; a third insulating layer 451 disposed on the second wiring layer 441 to cover the top surface of the second wiring layer 441, the third insulating layer 451 having a side surface positioned in the same plane as the side surface of the second wiring layer 441 and comprising a photosensitive material; and a fourth insulating layer 461 disposed on the third insulating layer 451.

[0165] The second organic layer 450 may be disposed on the second conductive layer 440. The second organic layer 450 may be positioned on the second conductive layer 440 to cover it, and the side surface of the second organic layer 450 may be positioned on the same plane as the side surface of the second conductive layer 440. The third insulating layer 451 may be disposed on the second wiring layer 441. The third insulating layer 451 may be disposed on the second wiring layer 441 to cover its top surface, and the side surface of the third insulating layer 451 may be positioned on the same plane as the side surface of the second wiring layer 441. For example, the second organic layer 450 and the third insulating layer 451 may comprise a photosensitive material.

[0166] The third organic layer 460 can be disposed on the first organic layer 430 and the second organic layer 450 to completely cover the first organic layer 430 and the second organic layer 450, thereby improving the passivation effect through the organic layer. Furthermore, the fourth insulating layer 461 can be disposed on the second insulating layer 431 and the third insulating layer 451 to completely cover the second insulating layer 431 and the third insulating layer 451, thereby improving the passivation effect through the organic layer.

[0167] In order to improve the transmittance of the display device 1, the first organic layer 430, the second organic layer 450 and the third organic layer 460 are made of different materials, and the refractive index of the first organic layer 430, the refractive index of the second organic layer 450 and the refractive index of the third organic layer 460 can be different from each other.

[0168] Reference Figure 10 According to some example embodiments, the second organic layer 453 and the third layer 454 of the display panel DP4 may include a light-shielding material, and the light-shielding material may be a black matrix. The black matrix may include various materials, such as black pigments, Cr, or CrO. x Mixed organic materials. The black matrix includes Cr or CrO. x In this case, the black matrix may include Cr or CrO. x It can be a single layer or multiple layers. When the display device 1 includes a black matrix, external light reflection can be sufficiently prevented.

[0169] The second organic layer 453 and the third layer 454 may include a light-shielding material. The third organic layer 470 and the fourth insulating layer 471 may be disposed on the second organic layer 453 and the third layer 454, respectively, which include the light-shielding material. Because the second organic layer 453 and the third layer 454 include a black matrix, reflectivity can be improved. Because the third organic layer 470 and the fourth insulating layer 471 are disposed on the second organic layer 453 and the third layer 454, respectively, the passivation effect can be improved.

[0170] Figures 11A to 11EThese are cross-sectional views of some of the methods for manufacturing display device 1 according to some example embodiments.

[0171] Although Figures 11A to 11E The diagram shows a thin-film encapsulation layer TFE and a bottom conductive layer 422 disposed on a substrate 100, but as... Figure 6 As shown, a thin-film transistor (TFT), a storage capacitor (Cst), and an organic light-emitting diode (OLED) can be arranged in the display area DA of the substrate 100, with the OLED electrically connected to the TFT and the storage capacitor (Cst). For ease of description, Figures 11A to 11E The components are briefly shown.

[0172] In the following text, refer to Figures 11A to 11E The method of manufacturing the display device 1 is described sequentially.

[0173] A method for manufacturing a display device 1 includes the following steps: preparing a substrate 100 including a display area DA, a wiring area TR, and a pad area PAD, wherein the wiring area TR and the pad area PAD are positioned on one side of the display area DA; forming a bottom conductive layer 422 in the pad area PAD; forming a first inorganic insulating layer 410 in the display area DA, forming a first insulating layer 411 in the wiring area TR, and forming a first layer 412 on the bottom conductive layer 422; forming a first conductive layer 420 on the first inorganic insulating layer 410, and forming a first wiring layer 421 on the first insulating layer 411; forming a first organic layer 430 on the first conductive layer 420, forming a second insulating layer 431 on the first wiring layer 421, and forming a second layer 432 on the first layer 412; and in the... A first conductive material layer is formed on an organic layer 430, a second conductive material layer is formed on a second insulating layer 431, and a third conductive material layer is formed on a second layer 432; a second organic layer 450 including a photosensitive material is patterned on the first conductive material layer, a third insulating layer 451 including a photosensitive material is patterned on the second conductive material layer, and a third layer 452 including a photosensitive material is patterned on the third conductive material layer; the first conductive material layer is patterned, the second conductive material layer is patterned, and the third conductive material layer is patterned by using the second organic layer 450, the third insulating layer 451, and the third layer 452 as photoresists respectively to form a second conductive layer 440, a second wiring layer 441, and a top conductive layer 442 respectively; and the third layer 452 is removed.

[0174] During the preparation of substrate 100, a substrate composition material is coated onto a carrier substrate, and then substrate 100 can be formed by curing the substrate composition material. For example, a polyimide (PI) substrate can be formed by curing a polyamic acid composition solution.

[0175] After preparing the substrate 100, the step of forming a bottom conductive layer 422 in the pad region PAD can be performed.

[0176] Then, as Figure 11A As shown, after forming the bottom conductive layer 422, the steps of forming a first inorganic insulating layer 410 in the display area DA, forming a first insulating layer 411 in the wiring area TR, and forming a first layer 412 on the bottom conductive layer 422 can be performed.

[0177] Then, as Figure 11B As shown, the steps of forming a first conductive layer 420 on the first inorganic insulating layer 410 and forming a first wiring layer 421 on the first insulating layer 411 can be performed. The first conductive layer 420 can be patterned on the first inorganic insulating layer 410 so as not to overlap with the emission region. The first conductive layer 420 may include one of the first sensing electrodes IE1-1 to IE1-5 and the second sensing electrodes IE2-1 to IE2-4.

[0178] Then, as Figure 11C As shown, the steps of forming a first organic layer 430 on the first conductive layer 420, forming a second insulating layer 431 on the first wiring layer 421, and forming a second layer 432 on the first layer 412 can be performed. According to some example embodiments, the display device 1 can improve folding and touch performance by arranging the first conductive layer 420, the second conductive layer 440, and the first organic layer 430.

[0179] Then, as Figure 11D As shown, the steps of forming a first conductive material layer on a first organic layer 430, forming a second conductive material layer on a second insulating layer 431, and forming a third conductive material layer on a second layer 432 can be performed sequentially; the steps of patterning a second organic layer 450 including a photosensitive material on the first conductive material layer, patterning a third insulating layer 451 including a photosensitive material on the second conductive material layer, and patterning a third layer 452 including a photosensitive material on the third conductive material layer; and the steps of patterning the first conductive material layer, the second conductive material layer, and the third conductive material layer using the second organic layer 450, the third insulating layer 451, and the third layer 452 as photoresists to form a second conductive layer 440, a second wiring layer 441, and a top conductive layer 442, respectively.

[0180] In the method of manufacturing the display device 1 according to some example embodiments, since the second conductive layer 440, the second wiring layer 441, and the top conductive layer 442 are formed by patterning the first conductive material layer, the second conductive material layer, and the third conductive material layer respectively using a second organic layer 450, a third insulating layer 451, and a third layer 452, all of which include photosensitive materials, as photoresists, a separate process for stripping the photosensitive material is not required. Therefore, damage to the first organic layer 430, the second insulating layer 431, and the second layer 432 can be prevented. The first organic layer 430 is disposed between the first conductive layer 420 and the second conductive layer 440, the second insulating layer 431 is disposed between the first wiring layer 421 and the second wiring layer 441, and the second layer 432 is disposed between the bottom conductive layer 422 and the top conductive layer 442.

[0181] Furthermore, after the process of patterning the second conductive layer on the first organic layer 430, the process of patterning the second organic layer 450 on the second conductive layer 440 may not be performed. Alternatively, the second conductive layer 440 and the second organic layer 450 may be patterned simultaneously during a single process (or processing operation or stage). Therefore, compared to prior art manufacturing processes, the manufacturing process can be relatively simplified, and fewer masks can be used, thus improving manufacturing efficiency.

[0182] According to some example embodiments, an insulating layer may not be formed on the top conductive layer 442, but may be formed on the top conductive layer 442 to simultaneously form the second conductive layer 440 and the second organic layer 450.

[0183] In the operations of forming the second conductive layer 440 and the second organic layer 450 on the first organic layer 430, forming the second wiring layer 441 and the third insulating layer 451 on the second insulating layer 431, and forming the top conductive layer 442 and the third layer 452 on the second layer 432, the third layer 452 with a thin thickness can be formed on the top conductive layer 442 by using a halftone mask. For example, the second organic layer 450 may have a first thickness t1 from the top surface of the second conductive layer 440, and the third layer 452 may have a second thickness t2 from the top surface of the top conductive layer 442, the second thickness t2 being less than the first thickness t1.

[0184] Then, as Figure 11E As shown, the step of removing the third layer 452 can be performed. Because the top conductive layer 442 in the pad region PAD can be exposed without being covered by the insulating layer, the third layer 452 formed on the top conductive layer 442 can be removed by a process of removing the insulating layer. When removing the third layer 452 formed on the top conductive layer 442, portions of the second organic layer 450 formed on the second conductive layer 440 and portions of the third insulating layer 451 formed on the second wiring layer 441 can be removed together.

[0185] Then, return to the reference. Figure 7 After removing the third layer 452, a curing process can be performed to reflow the second organic layer 450 so that it covers the side surface of the second conductive layer 440, and to reflow the third insulating layer 451 so that it covers the side surface of the second wiring layer 441. Through this process, the second organic layer 450 can be disposed on the second conductive layer 440, covering its side and top surfaces, and the third insulating layer 451 can be disposed on the second wiring layer 441, covering its side and top surfaces.

[0186] According to some example embodiments, such as Figure 9 As shown, after removing the third layer 452, it is also possible to form a third organic layer 460 on the second organic layer 450 and a fourth insulating layer 461 on the third insulating layer 451. The third organic layer 460 can be disposed on the first organic layer 430 and the second organic layer 450 to completely cover the first organic layer 430 and the second organic layer 450, thereby improving the passivation effect through the organic layers. Furthermore, the fourth insulating layer 461 can be disposed on the second insulating layer 431 and the third insulating layer 451 to completely cover the second insulating layer 431 and the third insulating layer 451, thereby improving the passivation effect through the organic layers.

[0187] In order to improve the transmittance of the display device 1, the first organic layer 430, the second organic layer 450 and the third organic layer 460 are made of different materials, and the refractive index of the first organic layer 430, the refractive index of the second organic layer 450 and the refractive index of the third organic layer 460 can be different from each other.

[0188] Both the second organic layer 453 and the third layer 454 may include a light-shielding material, and the light-shielding material may be a black matrix. The black matrix may include various materials, such as black pigments, Cr, or CrO. x Mixed organic materials. The black matrix includes Cr or CrO. x In this case, the black matrix may include Cr or CrO. x It can be a single layer or multiple layers. When the display device 1 includes a black matrix, external light reflection can be sufficiently prevented.

[0189] In related display devices, during the stripping process, the organic layer disposed between the conductive layers of the touch unit is damaged by the stripping agent, which degrades the performance of the touch unit. To solve this problem, a display device and its manufacturing method can be provided, which prevents or reduces damage to the organic layer by using an organic layer including a photosensitive material as a photoresist to pattern the conductive layer, while also improving reliability.

[0190] According to some example embodiments, a display device and a method of manufacturing the same can be implemented that prevents or reduces damage to the organic layer by using an organic layer comprising a photosensitive material as a photoresist to pattern the conductive layer, while simultaneously achieving improved reliability. However, the scope of this disclosure is not limited to these effects.

[0191] It should be understood that the embodiments described herein are to be considered in a descriptive sense only and not for limiting purposes. The description of features or aspects within each embodiment should generally be considered applicable to other similar features or aspects in other embodiments. Although one or more embodiments have been described with reference to figures, it will be understood by those skilled in the art that various changes in form and detail may be made therein without departing from the spirit and scope defined by the claims and their equivalents.

Claims

1. A display device, the display device comprising: The substrate includes both the display area and the non-display area; as well as The touch unit is located on the substrate. The touch unit includes: A first inorganic insulating layer is located in the display area; The first conductive layer is located on the first inorganic insulating layer; A first organic layer is located on the first conductive layer; A second conductive layer is located on the first organic layer and is electrically connected to the first conductive layer through a first contact hole in the first organic layer; and A second organic layer, located on the second conductive layer, covers the side and top surfaces of the second conductive layer and includes a photosensitive material. The refractive index of the first organic layer is different from that of the second organic layer.

2. The display device according to claim 1, wherein, The non-display area includes a wiring area and a pad area, both located on one side of the display area, and The display device further includes: A first insulating layer is located in the wiring area; A first wiring layer is located on the first insulating layer and comprises the same material as the first conductive layer; The second insulating layer is located on the first wiring layer; A second wiring layer, located on the second insulating layer, is electrically connected to the first wiring layer through a second contact hole defined in the second insulating layer, and comprises the same material as the second conductive layer; and A third insulating layer is located on the second wiring layer to cover the side and top surfaces of the second wiring layer and includes a photosensitive material.

3. The display device according to claim 2, further comprising: A bottom conductive layer is located in the pad region; The first layer is located on the bottom conductive layer; The second layer is located above the first layer; as well as The top conductive layer is electrically connected to the bottom conductive layer through a third contact hole located in the first and second layers, and comprises the same material as the second conductive layer.

4. The display device according to claim 1, wherein, The second organic layer includes a light-shielding material.

5. The display device according to claim 1, further comprising: A light-emitting element is located in the display area between the substrate and the touch unit, and includes a pixel electrode, a counter electrode, and an intermediate layer, wherein the counter electrode is located above the pixel electrode, and the intermediate layer includes an emitting layer located between the pixel electrode and the counter electrode; as well as A thin-film encapsulation layer is located on the light-emitting element and includes at least one inorganic encapsulation layer and at least one organic encapsulation layer.

6. The display device according to claim 5, wherein, The touch unit is located directly on the thin-film encapsulation layer.

7. A display device, the display device comprising: The substrate includes both the display area and the non-display area; as well as The touch unit is located on the substrate, wherein, The touch unit includes: A first inorganic insulating layer is located in the display area; The first conductive layer is located on the first inorganic insulating layer; A first organic layer is located on the first conductive layer; A second conductive layer is located on the first organic layer and is electrically connected to the first conductive layer through a first contact hole defined in the first organic layer. A second organic layer, located on the second conductive layer to cover the top surface of the second conductive layer, the second organic layer having side surfaces positioned coplanar with the side surfaces of the second conductive layer, and comprising a photosensitive material; and The third organic layer is located on top of the second organic layer.

8. The display device according to claim 7, wherein, The non-display area includes a wiring area and a pad area, both located on one side of the display area. The display device further includes: A first insulating layer is located in the wiring area; A first wiring layer is located on the first insulating layer and comprises the same material as the first conductive layer; The second insulating layer is located on the first wiring layer; A second wiring layer, located on the second insulating layer, is electrically connected to the first wiring layer through a second contact hole defined in the second insulating layer, and comprises the same material as the second conductive layer; A third insulating layer, located on the second wiring layer to cover the top surface of the second wiring layer, the third insulating layer having side surfaces positioned coplanar with the side surfaces of the second wiring layer, and comprising a photosensitive material; and The fourth insulating layer is located on the third insulating layer.

9. The display device according to claim 8, further comprising: A bottom conductive layer is located in the pad region; The first layer is located on the bottom conductive layer; The second layer is located above the first layer; as well as The top conductive layer is electrically connected to the bottom conductive layer through a third contact hole defined in the first and second layers, and comprises the same material as the second conductive layer.

10. The display device according to claim 7, wherein, The refractive indices of the first organic layer, the second organic layer, and the third organic layer are different from each other.

11. The display device according to claim 7, wherein, The second organic layer includes a light-shielding material.

12. The display device according to claim 7, further comprising: A light-emitting element is located in the display area between the substrate and the touch unit, and includes a pixel electrode, a counter electrode, and an intermediate layer, wherein the counter electrode is located on the pixel electrode, and the intermediate layer includes an emitting layer located between the pixel electrode and the counter electrode; as well as A thin-film encapsulation layer is located on the light-emitting element and includes at least one inorganic encapsulation layer and at least one organic encapsulation layer.

13. The display device according to claim 12, wherein, The touch unit is located directly on the thin-film encapsulation layer.

14. A method of manufacturing a display device, the method comprising: Prepare a substrate, the substrate including a display area, a wiring area and a pad area, the wiring area and the pad area being positioned on one side of the display area; A bottom conductive layer is formed in the pad region; A first inorganic insulating layer is formed in the display area, a first insulating layer is formed in the wiring area, and a first layer is formed on the bottom conductive layer; A first conductive layer is formed on the first inorganic insulating layer, and a first wiring layer is formed on the first insulating layer; A first organic layer is formed on the first conductive layer, a second insulating layer is formed on the first wiring layer, and a second layer is formed on the first layer; A first conductive material layer is formed on the first organic layer, a second conductive material layer is formed on the second insulating layer, and a third conductive material layer is formed on the second layer; A second organic layer including a photosensitive material is patterned on the first conductive material layer, a third insulating layer including a photosensitive material is patterned on the second conductive material layer, and a third layer including a photosensitive material is patterned on the third conductive material layer. The first conductive material layer, the second conductive material layer, and the third conductive material layer are patterned using the second organic layer, the third insulating layer, and the third layer as photoresists, respectively, to form a second conductive layer, a second wiring layer, and a top conductive layer; as well as Remove the third layer.

15. The method according to claim 14, further comprising: After removing the third layer, the second organic layer is reflowed so that it covers the side surface of the second conductive layer, and the third insulating layer is reflowed through a curing process so that it covers the side surface of the second wiring layer.

16. The method of claim 14, further comprising: After the third layer is removed, a third organic layer is formed on the second organic layer, and a fourth insulating layer is formed on the third insulating layer.

17. The method according to claim 16, wherein, The refractive indices of the first organic layer, the second organic layer, and the third organic layer are different from each other.

18. The method according to claim 14, wherein, The second organic layer includes a light-shielding material.

19. The method of claim 14, wherein, In the steps of forming the second conductive layer and the second organic layer, forming the second wiring layer and the third insulating layer, and forming the top conductive layer and the third layer... The second organic layer has a first thickness from the top surface of the second conductive layer, and the third layer has a second thickness from the top surface of the top conductive layer, the second thickness being less than the first thickness.

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