Display device including a light control pattern

Abstract

A display device including a light control pattern is provided. The display device includes a substrate. The substrate includes a pixel region and a light-blocking region. Light-emitting elements are arranged in the pixel region of the substrate. An insulating layer is disposed on the substrate. The insulating layer has an opening corresponding to the light-blocking region and an insulating pattern corresponding to the pixel region. The light control pattern at least partially surrounds the insulating pattern of the insulating layer and is arranged in the opening corresponding to the light-blocking region.

Description

[0001] Cross - reference to related applications

[0002] This application claims priority to Korean Patent Application No. 10 - 2019 - 0084548, filed with the Korean Intellectual Property Office on July 12, 2019, the disclosure of which is incorporated herein by reference in its entirety. Technical field

[0003] The present disclosure relates to a display device, and more particularly, to a display device including a light control pattern and a method of manufacturing a display device. Background art

[0004] As the demand for display devices used for various purposes increases, the demand for display devices having various different sizes also increases. Along with this trend, display devices are gradually being manufactured to be larger and / or thinner. While also providing larger and / or thinner display devices, the demand for display devices that display accurate and clear colors increases. Light emitted from a light - emitting element of one pixel may be incident on a color conversion layer of an adjacent pixel, thereby degrading the resulting image quality. Summary of the invention

[0005] According to an exemplary embodiment of the present invention, a display device including a substrate is provided. The substrate includes a pixel region and a light - blocking region. Light - emitting elements are arranged in the pixel region of the substrate. An insulating layer is disposed on the substrate. The insulating layer has an opening corresponding to the light - blocking region and an insulating pattern corresponding to the pixel region. The light control pattern at least partially surrounds the insulating pattern of the insulating layer and is arranged in the opening corresponding to the light - blocking region.

[0006] According to an exemplary embodiment of the present invention, the light control pattern includes a reflection pattern and a light - blocking pattern. Both the reflection pattern and the light - blocking pattern are arranged on side edges and the bottom of the opening, and the light - blocking pattern is arranged on the reflection pattern.

[0007] According to an exemplary embodiment of the present invention, a horizontal pattern at least partially covers the light control pattern.

[0008] According to an exemplary embodiment of the present invention, the upper surface of the horizontal pattern is coplanar with the upper surface of the light control pattern.

[0009] According to an exemplary embodiment of the present invention, the light control pattern includes a reflection pattern and a light - blocking pattern. The reflection pattern is arranged on side edges and the bottom of the opening. The light - blocking pattern is arranged on the bottom of the opening, and the reflection pattern is arranged on the light - blocking pattern.

[0010] According to an exemplary embodiment of the present invention, the display device further includes a horizontal pattern that at least partially covers the light control pattern.

[0011] According to an exemplary embodiment of the present invention, the upper surface of the horizontal pattern is coplanar with the reflective pattern.

[0012] According to an exemplary embodiment of the present invention, the light control pattern includes a reflective pattern, a support pattern, and a light-blocking pattern. Both the reflective pattern and the support pattern are arranged on the side and bottom of the opening. The light-blocking pattern is arranged on the bottom of the opening. The support pattern is arranged below the reflective pattern, and the light-blocking pattern is arranged below the support pattern.

[0013] According to an exemplary embodiment of the present invention, the display device further includes a packaging layer disposed between the light control pattern and the light-emitting element.

[0014] According to an exemplary embodiment of the present invention, there is provided a display device including a substrate, wherein the substrate includes a pixel region and a light-blocking region. Light-emitting elements are arranged in the pixel region of the substrate. An insulating layer is disposed on the substrate. The insulating layer has an opening corresponding to the pixel region and an insulating pattern corresponding to the light-blocking region. The light control pattern covers the exposed surface of the insulating pattern corresponding to the light-blocking region.

[0015] According to an exemplary embodiment of the present invention, the light control pattern includes a reflective pattern and a light-blocking pattern. The reflective pattern and the light-blocking pattern are arranged on the upper surface and the side surface of the insulating pattern, and the light-blocking pattern is arranged between the reflective pattern and the insulating pattern.

[0016] According to an exemplary embodiment of the present invention, the light control pattern includes a reflective pattern and a light-blocking pattern. The reflective pattern is arranged on the upper surface and the side surface of the insulating pattern, and the light-blocking pattern is arranged between the insulating pattern and the light-emitting element.

[0017] According to an exemplary embodiment of the present invention, the display device further includes a packaging layer disposed between the light control pattern and the light-emitting element.

[0018] According to an exemplary embodiment of the present invention, the display device further includes a packaging layer disposed between the light-emitting element and the light control pattern and a color filter layer disposed between the packaging layer and the light control pattern.

[0019] According to an exemplary embodiment of the present invention, the display device further includes an insulating layer disposed on the light control pattern and a protective layer disposed on the insulating layer.

[0020] According to an exemplary embodiment of the present invention, the display device further includes an air layer disposed between multiple light control patterns and a protective layer disposed on the multiple light control patterns.

[0021] According to an exemplary embodiment of the present invention, a display device including a substrate is provided. The substrate includes a pixel region and a light-blocking region adjacent to the pixel region. Light-emitting elements are arranged in the pixel region of the substrate. A light control pattern at least partially surrounds the light-emitting elements and is arranged in the light-blocking region, wherein the light control pattern has at least one hole.

[0022] According to an exemplary embodiment of the present invention, the light control pattern includes a reflective pattern, a support pattern, and a light-blocking pattern. The support pattern is arranged below the reflective pattern, and the light-blocking pattern is arranged in an air gap defined by the support pattern and the reflective pattern.

[0023] According to an exemplary embodiment of the present invention, the display device further includes a packaging layer disposed between the light control pattern and the light-emitting elements.

[0024] According to an exemplary embodiment of the present invention, a display device including a substrate is provided. The substrate includes a pixel region and a light-blocking region adjacent to the pixel region. Light-emitting elements are arranged in the pixel region of the substrate. A pixel defining layer is arranged in the light-blocking region of the substrate, and the light control pattern is arranged on the pixel defining layer and at least partially surrounds the light-emitting elements.

[0025] According to an exemplary embodiment of the present invention, the light control pattern includes a reflective pattern and a support pattern. The support pattern is arranged below the reflective pattern, and the light-emitting elements at least partially cover the light control pattern.

[0026] According to an exemplary embodiment of the present invention, the display device further includes an insulating layer, wherein the insulating layer has an opening corresponding to the pixel region and an insulating pattern arranged on the pixel defining layer. The light control pattern includes a reflective pattern and a support pattern. The reflective pattern and the support pattern cover the insulating pattern of the insulating layer, and at least one electrode of the light-emitting elements covers the light control pattern.

[0027] According to an exemplary embodiment of the present invention, the pixel defining layer includes a pixel defining pattern. The light control pattern has a first non-inclined portion and a pair of inclined sides covering the side surfaces of the pixel defining pattern. The light control pattern further includes a reflective pattern and a first light-blocking pattern, and the first light-blocking pattern is the outermost layer of the light control pattern.

[0028] According to an exemplary embodiment of the present invention, the pixel defining layer includes a pixel defining pattern. The light control pattern has a first non-inclined portion and a pair of inclined sides covering the side surfaces of the pixel defining pattern. The light control pattern further includes a reflective pattern and a first light-blocking pattern, and the reflective pattern is the outermost layer of the light control pattern.

[0029] According to an exemplary embodiment of the present invention, a second light-blocking pattern is directly arranged on the packaging layer of the substrate in the light-blocking region, and the second light-blocking pattern is non-inclined and parallel to the first non-inclined portion of the light control pattern.

[0030] According to an exemplary embodiment of the present invention, a second light-blocking pattern is directly disposed on the encapsulation layer of the substrate in the light-blocking region, and the second light-blocking pattern is non-inclined and parallel to the first non-inclined portion of the light control pattern. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] The above and other aspects and features of the present disclosure will be more clearly understood from the following detailed description taken in conjunction with the accompanying drawings, in which:

[0032] Figure 1 is a perspective view showing a display device according to an exemplary embodiment of the present invention;

[0033] Figure 2A is a plan view showing a color control member according to an exemplary embodiment of the present invention;

[0034] Figure 2B and Figure 2C is a cross-sectional view showing the color control member taken along line II-II' according to an exemplary embodiment of the present invention; Figure 2A of the color control member;

[0035] Figure 3 is an enlarged cross-sectional view showing a first color conversion layer, a second color conversion layer, and a transmissive layer of the color control member according to an exemplary embodiment of the present invention;

[0036] Figure 4A is a plan view showing a display panel according to an exemplary embodiment of the present invention;

[0037] Figure 4B is a cross-sectional view showing the display panel taken along line III-III' according to an exemplary embodiment of the present invention; Figure 4A of the display panel;

[0038] Figure 4C and Figure 4D is a cross-sectional view showing the light control pattern according to an exemplary embodiment of the present invention;

[0039] Figure 5 is a cross-sectional view showing the display device taken along line I-I' according to an exemplary embodiment of the present invention; Figure 1 of the display device;

[0040] FIG. 6A to FIG. 6E is a cross-sectional view showing a step in the process of manufacturing the display device shown in Figure 5 according to an exemplary embodiment of the present invention;

[0041] Figure 7 is a cross-sectional view showing the Figure 1Cross-sectional view of the cross-section taken along line I-I' of the display device;

[0042] FIG. 8A to FIG. 8F is a cross-sectional view showing the steps in the process of manufacturing the display device shown in accordance with an exemplary embodiment of the present invention; Figure 7 in the cross-section taken along line I-I' of the display device shown;

[0043] Fig. 9 is a cross-sectional view showing the cross-section taken along line I-I' of the display device in accordance with an exemplary embodiment of the present invention; Figure 1 in the cross-section taken along line I-I' of the display device;

[0044] Fig.10 is a cross-sectional view showing the cross-section taken along line I-I' of the display device in accordance with an exemplary embodiment of the present invention; Figure 1 in the cross-section taken along line I-I' of the display device;

[0045] FIG. 11A to FIG. 11E is a cross-sectional view showing the steps in the process of manufacturing the display device shown in accordance with an exemplary embodiment of the present invention; Fig.10 in the cross-section taken along line I-I' of the display device shown;

[0046] Fig.12 is a cross-sectional view showing the cross-section taken along line I-I' of the display device in accordance with an exemplary embodiment of the present invention; Figure 1 in the cross-section taken along line I-I' of the display device;

[0047] FIG. 13A to FIG. 13E is a cross-sectional view showing the steps in the process of manufacturing the display device shown in accordance with an exemplary embodiment of the present invention; Fig.12 in the cross-section taken along line I-I' of the display device shown;

[0048] Fig.14 shows the cross-section taken along line I-I' of the display device in accordance with an exemplary embodiment of the present invention; Figure 1 in the cross-section taken along line I-I' of the display device;

[0049] Fig.15A shows; Fig.14 a comparative example;

[0050] Fig. 15B and Fig. 15C is a cross-sectional view showing the steps in the process of manufacturing the display device shown in accordance with an exemplary embodiment of the present invention; Fig.14 in the cross-section taken along line I-I' of the display device shown;

[0051] Fig.16 shows the cross-section taken along line I-I' of the display device in accordance with an exemplary embodiment of the present invention; Figure 1 in the cross-section taken along line I-I' of the display device;

[0052] Fig.17A and Fig. 17B is a cross-sectional view showing the steps in the process of manufacturing the display device shown in accordance with an exemplary embodiment of the present invention; Fig.16Cross-sectional views of steps in the process of the display device shown in;

[0053] Fig.18 is a cross-sectional view of a section taken along line I-I' of the display device according to an exemplary embodiment of the present invention; Figure 1 Cross-sectional views of steps in the process of the display device shown in;

[0054] Fig.19A and Fig.19B shows Fig.18 a comparative example;

[0055] FIG. 19C to FIG. 19E is a cross-sectional view of steps in the process of manufacturing the display device shown in according to an exemplary embodiment of the present invention; Fig.18 Cross-sectional views of steps in the process of the display device shown in;

[0056] Fig. 20 is a cross-sectional view of a section taken along line I-I' of the display device according to an exemplary embodiment of the present invention; Figure 1 Cross-sectional views of steps in the process of the display device shown in;

[0057] FIG. 21A to FIG. 21C is a cross-sectional view of the process of manufacturing the display device shown in according to an exemplary embodiment of the present invention; Fig. 20 Cross-sectional views of steps in the process of the display device shown in;

[0058] Fig. 22 is a cross-sectional view of a section taken along line I-I' of the display device according to an exemplary embodiment of the present invention; Figure 1 Cross-sectional views of steps in the process of the display device shown in;

[0059] FIG. 23A to FIG. 23F is a cross-sectional view of steps in the process of manufacturing the display device shown in according to an exemplary embodiment of the present invention; Fig. 22 Cross-sectional views of steps in the process of the display device shown in;

[0060] Fig.24 is a cross-sectional view of a section taken along line I-I' of the display device according to an exemplary embodiment of the present invention; Figure 1 Cross-sectional views of steps in the process of the display device shown in;

[0061] Fig.25 is a cross-sectional view of a section taken along line I-I' of the display device according to an exemplary embodiment of the present invention; Figure 1 Cross-sectional views of steps in the process of the display device shown in;

[0062] FIG. 26A to FIG. 26F is a cross-sectional view of steps in the process of manufacturing the display device shown in according to an exemplary embodiment of the present invention; Fig.25 Cross-sectional views of steps in the process of the display device shown in;

[0063] Fig. 27 is a cross-sectional view of a section taken along line I-I' of the display device according to an exemplary embodiment of the present invention; Figure 1 Cross-sectional views of steps in the process of the display device shown in;

[0064] Figures 28 to 30 is a cross-sectional view taken along line I-I' of a display device showing an exemplary embodiment according to the present invention; Figure 1 of the display device;

[0065] Fig.31 is a cross-sectional view showing a part of a display device according to an exemplary embodiment of the present invention;

[0066] FIG. 32A to FIG. 32F is a cross-sectional view showing steps in a process of manufacturing the display device shown in Fig.31 according to an exemplary embodiment of the present invention;

[0067] Fig.33 is a cross-sectional view showing a part of a display device according to an exemplary embodiment of the present invention;

[0068] FIG. 34A to FIG. 34F shows steps in a process of manufacturing the display device shown in Fig.31 according to an exemplary embodiment of the present invention;

[0069] FIG. 35A to FIG. 36F is a plan view showing the shape of a light control pattern of a display panel according to an exemplary embodiment of the present invention;

[0070] Fig.37 and Fig.39 are each a cross-sectional view showing a part of a display device according to an exemplary embodiment of the present invention;

[0071] FIG. 38A to FIG. 38E shows steps in a process of manufacturing the display device shown in Fig.37 according to an exemplary embodiment of the present invention;

[0072] Fig.40 and Fig.41 are each a cross-sectional view showing a part of a display device according to an exemplary embodiment of the present invention;

[0073] Fig.42 and Fig.43 are respectively cross-sectional views showing a part of a display device according to an exemplary embodiment of the present invention;

[0074] FIG. 44A to FIG. 44E is a cross-sectional view showing a display device according to a comparative example;

[0075] FIG. 45A to FIG. 45E is a cross-sectional view showing a display device according to an exemplary embodiment of the present invention;

[0076] Fig.46 is a view showing FIG. 44A to FIG. 44EChart of the mixed color evaluation results of the comparative example;

[0077] FIG. 47A to FIG. 47C Is a chart showing the increase in the light incident percentage when the area of the emission layer increases according to an exemplary embodiment of the present invention;

[0078] FIG. 48A to FIG. 48C Is a chart showing the mixed color evaluation percentage when the area of the emission layer increases according to an exemplary embodiment of the present invention;

[0079] Fig.49 And Fig.50 Is a chart showing the percentage of the mixed color evaluation result and the light incident efficiency when the area of the emission layer increases according to an exemplary embodiment of the present invention;

[0080] FIG. 51A to FIG. 51E Is a cross-sectional view of a display device according to a comparative example;

[0081] FIG. 52A to FIG. 52E Is a cross-sectional view of a display device according to an exemplary embodiment of the present invention; and

[0082] Fig.53 And Fig.54 Is shown according to FIG. 51A to FIG. 51E Of the comparative example and FIG. 52A to FIG. 52E The chart of the mixed color evaluation and the light incident percentage of the exemplary embodiment of the present invention shown in; Detailed Description

[0083] Hereinafter, the present invention will be described more fully with reference to the accompanying drawings showing various exemplary embodiments.

[0084] Throughout the following description and the corresponding drawings, like reference numerals indicate like elements. In the drawings, for the effective illustration of the technical content, the thickness, ratio, and dimensions of the components may be exaggerated. However, the present invention is not limited thereto.

[0085] It will be understood that when a layer, region or component is referred to as being "formed on" another layer, region or component, it may be directly or indirectly formed on the other layer, region or component. That is to say, for example, there may be an intermediate layer, region or component between two elements. It will be understood that when a layer, region or component is referred to as being "connected" to another layer, region or component or "disposed on" another layer, region or component, it may be "directly connected" to the other layer, region or component or "directly disposed on" the other layer, region or component, or in the case where another layer, region or component is interposed therebetween, it may be "indirectly connected" to the other layer, region or component or "indirectly disposed" on the other layer, region or component. For example, it will be understood that when a layer, region or component is referred to as being "electrically connected" to another layer, region or component, it may be "directly electrically connected" to the other layer, region or component, or in the case where other layers, regions or components are interposed therebetween, it may be "indirectly electrically connected" to the other layer, region or component.

[0086] When the process of manufacturing a display device according to an exemplary embodiment of the present invention can be implemented in different ways, the specific process sequence may be performed differently from the described sequence. For example, where feasible, two consecutively described process steps may be performed substantially simultaneously or in a sequence opposite to the described sequence.

[0087] Figure 1 is a perspective view of a display device 10 according to an exemplary embodiment of the present invention.

[0088] Referring to Figure 1 , the display device 10 includes a display area DA that emits light and a non-display area NDA that does not emit light. The non-display area NDA is adjacent to the display area DA. The display device 10 can display a predetermined image by using light emitted from a plurality of pixels arranged in a first direction (e.g., the x direction) and a second direction (e.g., the y direction) in the display area DA.

[0089] The display device 10 may include a display panel 400 and a color control member 100 that are sequentially stacked in a third direction (e.g., the z direction). In an exemplary embodiment of the present invention, the color control member 100 may be formed separately from the display panel 400 and then coupled to the display panel 400. According to an exemplary embodiment of the present invention, the color control member 100 may be directly formed on the display panel 400. For example, the color control member 100 may be formed after the display panel 400 is formed.

[0090] Figure 2A is a plan view of a color control member 100 according to an exemplary embodiment of the present invention, and Figure 2B and Figure 2C is a cross-sectional view of the color control member 100 taken along the line II-II' of Figure 2A .

[0091] Referring to Figure 2A and Figure 2B ,the color control member 100 may include a substrate 110, a light-blocking member 120, a color filter layer 130, a first color conversion layer 150, and a second color conversion layer 160.

[0092] The substrate 110 may include a first pixel region PA1 and a second pixel region PA2 spaced apart from each other, and a light-blocking region BA located between the first pixel region PA1 and the second pixel region PA2.

[0093] The first color conversion layer 150 is arranged in the first pixel region PA1 and converts incident light Lib into light Lr of a first color. The second color conversion layer 160 is arranged in the second pixel region PA2 and converts incident light Lib into light Lg of a second color.

[0094] The color control member 100 may further include a transmissive layer 170. The substrate 110 may further have a third pixel region PA3 spaced apart from the first pixel region PA1 and the second pixel region PA2. The transmissive layer 170 may be arranged in the third pixel region PA3 and may transmit incident light Lib.

[0095] The color control member 100 may receive incident light Lib and emit light Lr of a first color, light Lg of a second color, and light Lb of a third color.

[0096] The pixel regions PA and the light-blocking region BA are defined in the substrate 110. The pixel regions PA emit light and are surrounded by the light-blocking region BA. The pixel regions PA may be divided into a first pixel region PA1, a second pixel region PA2, and a third pixel region PA3 according to the color of the emitted light. For example, the first pixel region PA1 may be a region that emits light Lr of a first color, the second pixel region PA2 may be a region that emits light Lg of a second color, and the third pixel region PA3 may be a region that emits light Lb of a third color. For example, the first pixel region PA1, the second pixel region PA2, and the third pixel region PA3 may correspond to a red pixel R, a green pixel G, and a blue pixel B, respectively. The rows of the pixel regions PA may extend in a first direction (e.g., the x direction) in which consecutive pixels are aligned. Figure 2A The respective arrangements of the first pixel region PA1, the second pixel region PA2, and the third pixel region PA3 shown are provided as examples, and the present invention is not limited thereto. The first pixel region PA1, the second pixel region PA2, and the third pixel region PA3 may be arranged in various layouts (such as a zigzag arrangement) so as to correspond to the arrangement of the pixels of the display device 10.

[0097] The light Lr of the first color may be red light, the light Lg of the second color may be green light, and the light Lb of the third color may be blue light. The red light is light having a peak wavelength of greater than or equal to 580 nm and less than 750 nm. The green light is light having a peak wavelength of greater than or equal to 495 nm and less than 580 nm. The blue light is light having a peak wavelength of greater than or equal to 400 nm and less than 495 nm. The incident light Lib may be light of the third color.

[0098] The light-blocking region BA is a region that does not emit light and may be arranged in a mesh layout between the first pixel region PA1, the second pixel region PA2, and the third pixel region PA3.

[0099] The substrate 110 may be a transparent substrate, and in the transparent substrate, the light Lr of the first color and the light Lg of the second color may be emitted through the first pixel region PA1 and the second pixel region PA2, respectively, and the light Lr of the first color and the light Lg of the second color are emitted from the first color conversion layer 150 and the second color conversion layer 160, respectively. The light Lb of the third color may be emitted through the third pixel region PA3 of the substrate 110.

[0100] The substrate 110 is not particularly limited and may include, for example, insulating materials such as glass, plastic, and / or crystal. For example, the substrate 110 may include organic polymer materials such as polycarbonate (PC), polyethylene terephthalate (PET), polyethylene (PE), polypropylene (PP), polysulfone (PSF), polymethyl methacrylate (PMMA), triacetyl cellulose (TAC), cycloolefin polymer (COP), and / or cycloolefin copolymer (COC). The substrate 110 may be selected by considering mechanical strength, thermal stability, transparency, surface flatness, processing convenience, waterproofness, etc.

[0101] The light-blocking member 120 may be arranged in the light-blocking region BA. The light-blocking member 120 may be formed as a thin film in the light-blocking region BA. In the case where light is emitted through the light-blocking region BA, light leakage may occur in the display device 10. The light-blocking member 120 may prevent light from being emitted to the outside through the light-blocking region BA and may thus prevent the occurrence of light leakage.

[0102] The light-blocking member 120 may have various colors including black or white. In the case where the light-blocking member 120 is black, the light-blocking member 120 may include a black matrix. In the case where the light-blocking member 120 is white, the light-blocking member 120 may include an organic insulating material such as white resin. The light-blocking member 120 may include an opaque inorganic insulating material such as CrO x or MoO x and / or may include an opaque organic insulating material such as black resin.

[0103] The light-blocking member 120 may be located between the first color conversion layer 150, the second color conversion layer 160, and the transmissive layer 170 in a first direction (e.g., the x direction), and thus the light-blocking member 120 may function as a partition wall. The light-blocking member 120 may be in contact with the side surfaces of the first color conversion layer 150, the second color conversion layer 160, and the transmissive layer 170. The light-blocking member 120 may absorb light at the interfaces in contact with the first color conversion layer 150, the second color conversion layer 160, and the transmissive layer 170. The light-blocking member 120 may also be located between the first color filter layer 130a and the second color filter layer 130b and between the second color filter layer 130b and the third color filter layer 130c in the first direction (e.g., the x direction). For example, the light-blocking member 120 may be disposed in the space provided between adjacent color filter layers 130 and / or between the first color conversion layer 150, the second color conversion layer 160, and the transmissive layer 170, and may each have a substantially "I" shape in a cross-sectional view. The upper horizontal section of each of the light-blocking members 120 may have a width substantially the same as that of the corresponding light-blocking region BA in the first direction (e.g., the x direction). The lower horizontal section may have a width the same as that of a pair of inclined portions of the light control pattern LCP (e.g., Fig. 9 as shown).

[0104] The light-blocking member 120 may prevent the light Lr of the first color emitted from the first color conversion layer 150 from irradiating the second color conversion layer 160 or the transmissive layer 170, prevent the light Lg of the second color emitted from the second color conversion layer 160 from irradiating the first color conversion layer 150 or the transmissive layer 170, and / or prevent the light Lb of the third color emitted from the transmissive layer 170 from irradiating the first color conversion layer 150 or the second color conversion layer 160.

[0105] The light-blocking member 120 may prevent a part of the light emitted from the light-emitting element 430 (see Figure 4B ) from entering the first color conversion layer 150 or the second color conversion layer 160 or the transmissive layer 170 of an adjacent pixel region PA. Accordingly, according to an exemplary embodiment of the present invention, since color mixing between pixel regions PA is prevented, color consistency and color reproduction are increased and light efficiency is increased. Therefore, power consumption may also be reduced.

[0106] The color filter layer 130 may include an organic material pattern including dyes and / or pigments. The color filter layer 130 may include a first color filter layer 130a, a second color filter layer 130b, and a third color filter layer 130c. The first color filter layer 130a may be arranged in at least a first pixel region PA1, the second color filter layer 130b may be arranged in at least a second pixel region PA2, and the third color filter layer 130c may be arranged in at least a third pixel region PA3. The first color filter layer 130a may selectively transmit only light Lr of a first color, the second color filter layer 130b may selectively transmit only light Lg of a second color, and the third color filter layer 130c may selectively transmit only light Lb of a third color.

[0107] The first color conversion layer 150, the second color conversion layer 160, and the transmissive layer 170 may each be formed in a space defined between adjacent light-blocking members 120 by using an inkjet method. The first color conversion layer 150, the second color conversion layer 160, and the transmissive layer 170 may have a substantially "T" shape, and may each have a lower horizontal portion in contact with the planarization layer 190 and an upper horizontal portion in contact with the color filter layer 130. The lower horizontal portion may have a width smaller than the width of the upper horizontal portion in a first direction (e.g., the x direction). The upper horizontal segment of the light-blocking member 120 may have a lower surface overlapping the upper surface of the upper horizontal portion of the first color conversion layer 150, the second color conversion layer 160, and / or the transmissive layer 170.

[0108] The first color conversion layer 150 may overlap with the first color filter layer 130a in the first pixel region PA1. The first color conversion layer 150 may convert incident light Lib into light Lr of a first color and emit light Lr of the first color toward the substrate 110 in a third direction (e.g., the z direction). The first color conversion layer 150 may include first quantum dots, and the first quantum dots may be excited by incident light Lib and emit light Lr of a first color having a wavelength longer than that of incident light Lib.

[0109] The second color conversion layer 160 may overlap with the second color filter layer 130b in the second pixel region PA2, convert incident light Lib into light Lg of a second color, and emit light Lg of the second color toward the substrate 110 in a third direction (e.g., the z direction). The second color conversion layer 160 may include second quantum dots, and the second quantum dots may be excited by incident light Lib and emit light Lg of a second color having a wavelength longer than that of incident light Lib.

[0110] The transmissive layer 170 may overlap with the third color filter layer 130c in the third pixel region PA3, transmit light Lb of a third color, and emit light Lb of the third color toward the substrate 110 in a third direction (e.g., the z direction).

[0111] The color control member 100 may further include a planarization layer 190 disposed on the first color conversion layer 150, the second color conversion layer 160, and the transmissive layer 170. The planarization layer 190 may provide a flat upper surface. The planarization layer 190 may be disposed above the substrate 110 to cover the lower surfaces of the first color conversion layer 150, the second color conversion layer 160, and the transmissive layer 170. For example, the planarization layer 190 may overlap the upper surfaces of each of the first color conversion layer 150, the second color conversion layer 160, and the transmissive layer 170 in a third direction (e.g., the z direction), and may extend in a first direction (e.g., the x direction). The planarization layer 190 may be transparent so that incident light Lib irradiates the first color conversion layer 150, the second color conversion layer 160, and the transmissive layer 170. The planarization layer 190 may include a single layer or multiple layers including an inorganic material and / or an organic material. For example, the inorganic material may be silicon nitride (SiN x ) and / or silicon oxide (SiO x ). The transparent organic material may be a polyimide resin, an acrylic resin, and / or a resist material. The planarization layer 190 may be formed by a wet process such as a slit coating method and a spin coating method or a dry process such as chemical vapor deposition and vacuum deposition. The present invention is not limited to these materials and formation methods described herein. According to an exemplary embodiment of the present invention, the planarization layer 190 may be omitted.

[0112] According to an exemplary embodiment of the present invention, as Figure 2C shown, the color control member 100 may include a substrate 110, a light-blocking member 120', and a color filter layer 130. The color control member 100 may receive incident light Lir, incident light Lig, and incident light Lib, and emit light Lr of a first color, light Lg of a second color, and light Lb of a third color. The color filter layer 130 may include a first color filter layer 130a, a second color filter layer 130b, and a third color filter layer 130c. The first color filter layer 130a may be disposed in at least a first pixel region PA1, and may selectively transmit only light Lr of the first color. The second color filter layer 130b may be disposed in at least a second pixel region PA2, and may selectively transmit only light Lg of the second color. The third color filter layer 130c may be disposed in at least a third pixel region PA3, and may selectively transmit only light Lb of the third color. The light-blocking member 120' may be disposed in a light-blocking region BA between the first color filter layer 130a and the second color filter layer 130b and between the second color filter layer 130b and the third color filter layer 130c.

[0113] Figure 3It is an enlarged cross-sectional view of the first color conversion layer 150, the second color conversion layer 160, and the transmissive layer 170 of the color control member 100 according to an exemplary embodiment of the present invention.

[0114] Referring to Figure 3 , the first color conversion layer 150 can convert the blue incident light Lib into light Lr of a first color. The first color conversion layer 150 may include a first photosensitive polymer 151, first quantum dots 152, and first scattering particles 153 dispersed in the first photosensitive polymer 151.

[0115] The first quantum dots 152 can be excited by the blue incident light Lib and emit light Lr of a first color having a wavelength longer than that of blue light in an isotropic manner. The first photosensitive polymer 151 may include an organic material having light-transmitting properties. The first scattering particles 153 can scatter the blue incident light Lib not absorbed by the first quantum dots 152 and allow more first quantum dots 152 to be excited, thereby increasing the color conversion efficiency of the first color conversion layer 150. The first scattering particles 153 may include, for example, titanium oxide (TiO 2 ).) and / or metal particles. The core of the first quantum dots 152 may include II-VI group compounds, III-V group compounds, IV-VI group compounds, group IV elements, and / or group IV compounds.

[0116] The second color conversion layer 160 can convert the blue incident light Lib into light Lg of a second color. The second color conversion layer 160 may include a second photosensitive polymer 161, second quantum dots 162, and second scattering particles 163 dispersed in the second photosensitive polymer 161.

[0117] The second quantum dots 162 can be excited by the blue incident light Lib and emit light Lg of a second color having a wavelength longer than that of blue light in an isotropic manner. The second photosensitive polymer 161 may include an organic material having light-transmitting properties and may include the same material as that of the first photosensitive polymer 151. The second scattering particles 163 can scatter the blue incident light Lib not absorbed by the second quantum dots 162 and allow more second quantum dots 162 to be excited, thereby increasing the color conversion efficiency of the second color conversion layer 160. The second scattering particles 163 may include, for example, titanium oxide (TiO 2 ).) and / or metal particles and may include the same material as that of the first scattering particles 153. The core of the second quantum dots 162 may include II-VI group compounds, III-V group compounds, IV-VI group compounds, group IV elements, and / or group IV compounds. The second quantum dots 162 may include the same material as that of the first quantum dots 152. In this case, the size of the second quantum dots 162 may be smaller than the size of the first quantum dots 152.

[0118] The transmissive layer 170 can transmit the blue incident light Lib and emit the blue incident light Lib toward the substrate 110 in a third direction (e.g., the z direction). The transmissive layer 170 may include a third photosensitive polymer 171, and third scattering particles 173 are dispersed in the third photosensitive polymer 171. The third photosensitive polymer 171 may include an organic material having a light-transmitting property, e.g., silicone resin and epoxy resin, and may include the same materials as those of the first photosensitive polymer 151 and the second photosensitive polymer 161. The third scattering particles 173 can scatter the blue incident light Lib and emit the blue incident light Lib. The third scattering particles 173 may include the same materials as those of the first scattering particles 153 and / or the second scattering particles 163.

[0119] The II-VI group compounds may include binary compounds containing CdSe, CdTe, ZnS, ZnSe, ZnTe, ZnO, HgS, HgSe, HgTe, MgSe, and / or MgS, ternary compounds containing AgInS, CuInS, CdSeS, CdSeTe, CdSTe, ZnSeS, ZnSeTe, ZnSTe, HgSeS, HgSeTe, HgSTe, CdZnS, CdZnSe, CdZnTe, CdHgS, CdHgSe, CdHgTe, HgZnS, HgZnSe, HgZnTe, MgZnSe, and / or MgZnS, and / or quaternary compounds containing HgZnTeS, CdZnSeS, CdZnSeTe, CdZnSTe, CdHgSeS, CdHgSeTe, CdHgSTe, HgZnSeS, HgZnSeTe, and / or HgZnSTe.

[0120] The III-V group compounds may include binary compounds containing GaN, GaP, GaAs, GaSb, AlN, AlP, AlAs, AlSb, InN, InP, InAs, and / or InSb, ternary compounds containing GaNP, GaNAs, GaNSb, GaPAs, GaPSb, AlNP, AlNAs, AlNSb, AlPAs, AlPSb, InGaP, InNP, InNAs, InNSb, InPAs, and / or InPSb, and / or quaternary compounds containing GaAlNAs, GaAlNSb, GaAlPAs, GaAlPSb, GaInNP, GaInNAs, GaInNSb, GaInPAs, GaInPSb, InAlNP, InAlNAs, InAlNSb, InAlPAs, GaAlNP, and / or InAlPSb.

[0121] The group-IV to VI compounds may include binary compounds containing SnS, SnSe, SnTe, PbS, PbSe, and / or PbTe, ternary compounds containing SnSeS, SnSeTe, SnSTe, PbSeS, PbSeTe, PbSTe, SnPbS, SnPbSe, and / or SnPbTe, and / or quaternary compounds containing SnPbSSe, SnPbSeTe, and / or SnPbSTe. The group-IV elements may include Si and / or Ge. For example, the group-IV compounds may include binary compounds containing SiC and / or SiGe.

[0122] In this case, the binary, ternary, or quaternary compound may be present in the particles at a uniform concentration, or may be divided into a state where its concentration distribution is partially different and present inside the same particles. In addition, the quantum dots may include a core / shell structure in which one quantum dot surrounds another quantum dot. The interface between the core and the shell may have a concentration gradient in which the concentration of the elements in the shell decreases toward its center.

[0123] According to an exemplary embodiment of the present invention, the quantum dots may include a core-shell structure including a core and a shell, the core including nanocrystals, and the shell surrounding the core. The shell of the quantum dots may be used as a protective layer for maintaining semiconductor characteristics by preventing chemical denaturation of the core and / or as a charging layer for imparting electrophoretic characteristics to the quantum dots. The shell may have a single layer or multiple layers. The interface between the core and the shell may have a concentration gradient in which the concentration of the elements in the shell decreases toward its center. Examples of the shell of the quantum dots may include oxides of metals, oxides of non-metals, and / or semiconductor compounds.

[0124] For example, although the oxides of metals or non-metals may include, such as SiO 2 , Al 2 O 3 , TiO 2 , ZnO, MnO, Mn 2 O 3 , Mn 3 O 4 , CuO, FeO, Fe 2 O 3 , Fe 3 O 4 , CoO, Co 3 O 4 and NiO binary compounds and / or such as MgAl 2 O 4 , CoFe 2 O 4 , NiFe 2 O 4 and / or CoMn 2 O 4ternary compounds, but the present invention is not limited thereto.

[0125] In addition, the semiconductor compound may include, for example, CdS, CdSe, CdTe, ZnS, ZnSe, ZnTe, ZnSeS, ZnTeS, GaAs, GaP, GaSb, HgS, HgSe, HgTe, InAs, InP, InGaP, InSb, AlAs, AlP, and / or AlSb, but the present invention is not limited thereto.

[0126] The quantum dots may have a full width at half maximum (FWHM) of the emission wavelength spectrum of 45 nm or less, preferably a full width at half maximum of the emission wavelength spectrum of 40 nm or less, more preferably a full width at half maximum of the emission wavelength spectrum of 30 nm or less, and the color saturation or color reproduction can be increased within a range. In addition, since the light emitted by these quantum dots is emitted in all directions, a wide viewing angle can be increased.

[0127] The shape of the quantum dots can be variously changed. For example, spherical quantum dots, pyramid-shaped quantum dots, multi-arm-shaped quantum dots, or cubic nanoparticles, nanotube-shaped quantum dots, nanowire-shaped quantum dots, nanofiber-shaped quantum dots, and / or nanoplate-shaped particles can be used.

[0128] The quantum dots can adjust the color of the emitted light according to the size of their particles, and accordingly, the quantum dots can have various emission colors such as blue, red, and green.

[0129] Figure 4A is a plan view of a display panel 400 according to an exemplary embodiment of the present invention, and Figure 4B is a cross-sectional view of the display panel 400 taken along the Figure 4A line III-III'. Figure 4C and Figure 4D are cross-sectional views showing a light control pattern LCP according to an exemplary embodiment of the present invention.

[0130] Referring to Figure 4A and Figure 4B , the display panel 400 includes a plurality of pixels in a display area DA, and the plurality of pixels are arranged in rows extending in a first direction (e.g., the x direction) and columns extending in a second direction (e.g., the y direction). The plurality of pixels PX may include a first pixel PX1, a second pixel PX2, and a third pixel PX3. The first pixel PX1 may include a light-emitting element 430 and a first pixel circuit 420a for controlling the light-emitting element 430. The second pixel PX2 may include a light-emitting element 430 and a second pixel circuit 420b for controlling the light-emitting element 430. The third pixel PX3 may include a light-emitting element 430 and a third pixel circuit 420c for controlling the light-emitting element 430.

[0131] The light-emitting element 430 may include an organic light-emitting diode (OLED). The light-emitting element 430 may emit light Lb of a third color (e.g., blue light), and the amount of the light is controlled by the first pixel circuit 420a, the second pixel circuit 420b, and the third pixel circuit 420c. The first pixel circuit 420a, the second pixel circuit 420b, and the third pixel circuit 420c may be respectively arranged in the pixel circuit layer 420 which is a lower layer under the light-emitting element 430, and may or may not partially overlap with the light-emitting element 430. For example, the first pixel circuit 420a, the second pixel circuit 420b, and the third pixel circuit 420c may be disposed between the substrate 410 and the light-emitting element 430. According to an exemplary embodiment of the present invention, the light-emitting element 430 may emit one of the light Lr of a first color, the light Lg of a second color, and the light Lb of a third color.

[0132] The substrate 410 may include materials such as glass materials, metal materials, and / or organic materials. For example, the substrate 410 may include a glass material containing SiO 2 as a main component, or may include various flexible or bendable materials, such as a resin like reinforced plastic. According to an exemplary embodiment of the present invention, the substrate 410 may include a bent region located in a part of the non-display area (NDA), in which the substrate 410 is bent.

[0133] The respective first pixel circuits 420a, second pixel circuits 420b, and third pixel circuits 420c of the first pixel PX1, second pixel PX2, and third pixel PX3 may be arranged on the substrate 410. Each of the first pixel circuit 420a, the second pixel circuit 420b, and the third pixel circuit 420c may include a plurality of thin film transistors and at least one capacitor. In addition to the first pixel circuit 420a, the second pixel circuit 420b, and the third pixel circuit 420c, signal lines and power lines for transferring signals and driving power supply voltages applied to the first pixel PX1, second pixel PX2, and third pixel PX3 may be arranged in the pixel circuit layer 420.

[0134] Each of the thin film transistors may include a semiconductor layer, a gate electrode, a source electrode, and a drain electrode. The semiconductor layer may include amorphous silicon and / or polycrystalline silicon. The semiconductor layer may include an oxide semiconductor. The semiconductor layer may include a source region, a drain region, and a channel region therebetween.

[0135] The light-emitting element 430 may be disposed on the pixel circuit layer 420. The light-emitting elements 430 may be arranged to correspond to the pixel regions PA of the color control member 100. The light-emitting elements 430 of the first pixel PX1 may be arranged to correspond to the first pixel region PA1 of the color control member 100. The light-emitting elements 430 of the second pixel PX2 may be arranged to correspond to the second pixel region PA2 of the color control member 100. The light-emitting elements 430 of the third pixel PX3 may be arranged to correspond to the third pixel region PA3 of the color control member 100. The first pixel PX1, the second pixel PX2, and the third pixel PX3 may overlap with the first pixel region PA1, the second pixel region PA2, and the third pixel region PA3 in the third direction (e.g., the z direction), respectively, such that the openings 437OP are substantially aligned with the first pixel region PA1, the second pixel region PA2, and the third pixel region PA3. The portion of the pixel defining layer 437 surrounded by the openings 437OP may also be referred to as a pixel defining pattern. The light control pattern LCP may correspond to the pixel defining pattern of the pixel defining layer 437.

[0136] At least one insulating layer may be arranged between the first pixel circuit 420a, the second pixel circuit 420b, the third pixel circuit 420c, and the light-emitting element 430. The light-emitting element 430 may include a pixel electrode 431, an intermediate layer 433, and a counter electrode 435.

[0137] The pixel electrode 431 may be connected to the source electrode or the drain electrode of the thin-film transistor. The pixel electrode 431 may be exposed through the opening 437OP of the pixel defining layer 437, and the edge (e.g., the sidewall) of the pixel electrode 431 may be covered by the pattern of the pixel defining layer 437. The pattern of the pixel defining layer 437 may surround the pixel electrode 431 and may be arranged to correspond to the light-blocking region BA of the color control member 100.

[0138] Hereinafter, the regions of the substrate 410 corresponding to the pixel regions PA and the light-blocking regions BA of the color control member 100 may also be referred to as the pixel regions PA and the light-blocking regions BA of the substrate 410, respectively, in this document. The boundaries of the pixel regions PA and the light-blocking regions BA demarcated by dashed lines in the entire drawings may be equivalently applied to the regions of the substrate 410 and may, for example, continuously extend in the third direction (e.g., the z direction) to the assigned regions provided to the substrate 410. Accordingly, the elements of the substrate 410 and the color control member 100 arranged in the corresponding pixel regions PA and the light-blocking regions BA may overlap in the third direction (e.g., the z direction).

[0139] The intermediate layer 433 may be arranged on a portion of the pixel electrode 431 exposed by the pixel defining layer 437. The intermediate layer 433 may include an organic emission layer. The organic emission layer may include a low molecular weight organic material and / or a polymeric organic material. The intermediate layer 433 may selectively further include functional layers such as a hole transport layer (HTL), a hole injection layer (HIL), an electron transport layer (ETL), and an electron injection layer (EIL). The functional layers may be integrally formed to cover a plurality of pixels.

[0140] The counter electrode 435 may cover the intermediate layer 433 and the pixel defining layer 437. The counter electrode 435 may include a transparent or semi-transparent electrode. For example, the counter electrode 435 may include a thin metal layer having a small work function. The counter electrode 435 may include a transparent conductive oxide (TCO). The counter electrode 435 may be integrally formed in the display area DA to face a plurality of pixel electrodes 431 among the plurality of light emitting elements 430.

[0141] An encapsulation layer 440 may be arranged on the light emitting element 430. The encapsulation layer 440 may cover the counter electrode 435 and may be arranged above the entire surface of the substrate 410. For example, in a cross-sectional view, the encapsulation layer 440 may be formed in a shape complementary to the light emitting element 430. The encapsulation layer 440 may include an inorganic encapsulation layer containing an inorganic material and / or an organic encapsulation layer containing at least one organic material. In an exemplary embodiment of the present invention, the encapsulation layer 440 may have a structure in which a first inorganic encapsulation layer, an organic encapsulation layer, and a second inorganic encapsulation layer are stacked. For example, the first inorganic encapsulation layer, the organic encapsulation layer, and the second inorganic encapsulation layer may be sequentially stacked.

[0142] A light control layer 450 including a light control pattern LCP may be arranged on the encapsulation layer 440. The light control pattern LCP may be arranged to correspond to the light blocking region BA of the color control member 100 (i.e., the light blocking region BA of the substrate 410) and may overlap with the pixel defining layer 437.

[0143] As Figure 4CAs shown, the light control pattern LCP may be disposed on the insulating pattern IP. The insulating pattern IP may overlap with the light-emitting element 430 in a third direction (e.g., the z direction). The light-emitting element 430 may be disposed in the interlayer insulating layer IL. The light control pattern LCP may include a first region A1 and a pair of second regions A2 extending from both ends of the first region A1. The first region A1 may be a non-inclined portion that is substantially flat (e.g., parallel) with respect to the main surface of the substrate 410. Each of the second regions A2 may be an inclined portion that bends from the first region A1 and extends away from the substrate 410. The light control pattern LCP may further include a third region A3 that bends and extends from the second region A2. The third region A3 may be a non-inclined portion that is substantially flat (e.g., parallel) with respect to the main surface of the substrate 410. The first region A1 may be in contact with the upper surface of the interlayer insulating layer IL, and the second regions A2 may surround the sidewalls of the insulating pattern IP and extend along the side surfaces of the insulating pattern IP. The third region A3 may extend along the upper surface of the corresponding portion of the insulating pattern IP. The insulating pattern IP may overlap with the pixel region PA and may overlap with at least the emission region of the light-emitting element 430. The emission region is the region where the emission layer is arranged and may be defined by the opening 437OP of the pixel defining layer 437.

[0144] The second region A2 may extend in an inclined direction between a direction (z direction) perpendicular to the main surface of the substrate 410 and a direction (x direction) parallel to the main surface of the substrate 410. A first distance W1 between the second regions A2 on the side closest to the substrate 410 and a second distance W2 between the second regions A2 on the side farthest from the substrate 410 may be different from each other. For example, as Figure 4C shown, the second distance W2 may be greater than the first distance W1.

[0145] According to an exemplary embodiment of the present invention, as Figure 4D shown, the second region A2 of the light control pattern LCP may be an inclined portion extending in a direction approaching the substrate 410. For example, the second region A2 of the light control pattern LCP may extend in an inclined direction with respect to the upper surface of the substrate 410. The first region A1 of the light control pattern LCP may be in contact with the upper surface of the insulating pattern IP, and the second region A2 may extend along the side surface of the insulating pattern IP. The insulating pattern IP may have, for example, a trapezoidal shape. Therefore, the second distance W2 may be less than the first distance W1.

[0146] Each in the second region A2 may be a reflective region that prevents light emitted from the light-emitting element 430 from being incident on the color conversion layer 150 (or 160) or the transmissive layer 170 of an adjacent pixel region PA and controls the optical path such that the light is incident on the color conversion layer 150 (or 160) or the transmissive layer 170 of the corresponding pixel region PA. The first region A1 may be a light-blocking region that absorbs and / or blocks light emitted from the light-emitting element 430 and / or light emitted from the color conversion layer 150 (or 160).

[0147] The light control pattern LCP may include a single layer or multiple layers. The second region A2 of the light control pattern LCP may include at least one reflective layer, and the first region A1 may include at least one light-blocking layer. However, the present invention is not limited thereto. For example, the first region A1 may be adjacent to a separate light-blocking layer. In this case, the first region A1 may be in direct contact with the separate light-blocking layer, or the first region A1 may be spaced apart from the light-blocking layer by a predetermined distance.

[0148] According to an exemplary embodiment of the present invention, color mixing between pixel regions PA is prevented, color consistency and color reproduction are increased, and light efficiency is increased. Accordingly, power consumption is reduced.

[0149] In the following exemplary embodiments of the present invention, since the color control member 100 and the display panel 400 have been described above with reference to Figures 2A to 4B Therefore, a detailed description thereof may be omitted. In addition, a description that is the same as the description given above with reference to Figures 2A to 4B may be omitted.

[0150] Figure 5 shows a cross-section taken along line I-I' of a Figure 1 display device according to an exemplary embodiment of the present invention.

[0151] Referring to Figure 5 , a display device 10A according to an exemplary embodiment of the present invention may include a display panel 400a and a color control member 100. The first pixel circuit 420a, the second pixel circuit 420b, and the third pixel circuit 420c of the first pixel PX1, the second pixel PX2, and the third pixel PX3 may be respectively arranged in a pixel circuit layer 420 of the display panel 400a. The light-emitting elements 430 may be arranged on the pixel circuit layer 420 to correspond to the first pixel region PA1, the second pixel region PA2, and the third pixel region PA3 of the color control member 100. An encapsulation layer 440 may be arranged on the light-emitting elements 430.

[0152] A light control layer 450a may be arranged on the encapsulation layer 440. For example, the light control layer 450a may be disposed between the light-emitting element 430 and the color control member 100. The light control layer 450a may include a first insulating layer 501 and a light control pattern LCP. Among them, the first insulating layer 501 has an insulating pattern 501a in the pixel region PA of the substrate 410, and the light control pattern LCP is located in the light-blocking region BA of the substrate 410 and arranged between the insulating patterns 501a. The first insulating layer 501 may include a transparent material that transmits light. The light control layer 450a may further include a second insulating layer 510 covering the light control pattern LCP. For example, the second insulating layer 510 may have a shape complementary to the exposed surfaces of the light control pattern LCP and the insulating pattern 501a.

[0153] The insulating pattern 501a may be arranged to correspond to the first pixel region PA1, the second pixel region PA2, and the third pixel region PA3 of the color control member 100. The first insulating layer 501 may have an opening OP1 surrounding the insulating pattern 501a (for example, the sidewall) and corresponding to the light-blocking region BA, and the insulating pattern 501a may overlap with the light-emitting element 430. The first insulating layer 501 may include an organic material. The organic material may include an organic material having a low refractive index (n = 1.52) or a monomer organic material of the encapsulation layer 440. The insulating pattern 501a may have a height of about 5.0 μm. The upper surface of the encapsulation layer 440 may be exposed through the opening OP1 arranged between the insulating patterns 501a. The inclination angle (for example, the inner angle) formed between the side surface and the bottom surface of the insulating pattern 501a may be a first angle θ. The first angle θ may be an acute angle. For example, the first angle θ may be about 70 degrees. The distance (for example, the width) between the opposite sides of the insulating pattern 501a decreases as it moves away from the encapsulation layer 440. For example, the distance between the side surfaces of the insulating pattern 501a extending obliquely with respect to the upper surface of the encapsulation layer 440 in the first direction (for example, the x direction) may gradually decrease in the third direction (for example, the z direction) from the upper surface of the encapsulation layer 440 toward the planarization layer 190. Therefore, the insulating pattern 501a may have a tapered structure. The distance (for example, the width) between the opposite sides of the opening OP1 increases as it moves away from the encapsulation layer 440. For example, the opening OP1 may gradually increase in the third direction (for example, the z direction) from the upper surface of the encapsulation layer 440 toward the planarization layer 190. Therefore, the opening OP1 may have an inverted tapered structure with respect to the adjacent portion of the insulating pattern 501a.

[0154] The light control pattern LCP may be arranged to correspond to the light-blocking region BA of the color control member 100. For example, the light control pattern LCP may overlap with the light-blocking region BA in the third direction (e.g., the z direction), and may have a maximum width substantially the same as the width of the light-blocking region BA. The light control pattern LCP may be positioned in the opening OP1 to surround the insulating pattern 501a, and may completely cover the opening OP1. The light control pattern LCP may include a pair of inclined portions arranged on the side surface 51 of the opening OP1 (or the side surface of the insulating pattern 501a) and facing each other. Each of the pair of inclined portions may form a first angle θ with a surface parallel to the main surface (e.g., the upper surface) of the substrate 410 or the upper surface of the encapsulation layer 440. The pair of inclined portions extend away from the upper surface of the substrate 410 in the third direction (e.g., the z direction), and the distance between the inclined portions on the side closest to the substrate 410 is less than the distance between the inclined portions on the side away from the substrate 410. The light control pattern LCP may include a first non-inclined portion between the pair of inclined portions arranged on the bottom surface (e.g., the lower surface) of the opening OP1 (e.g., the upper surface of the encapsulation layer 440 exposed by the opening OP1). The light control pattern LCP may include a second non-inclined portion formed on the inclined portion, and the inclined portion extends to the upper surface of the insulating pattern 501a adjacent to the opening OP1. Considering the process dispersion caused by mask alignment in the manufacturing process, each of the second non-inclined portions may have a length L extending from the inclined portion of the insulating pattern 501a to the upper surface of the insulating pattern 501a. For example, the second non-inclined portion may extend oppositely in the first direction (e.g., the x direction) across the corresponding adjacent insulating pattern 501a toward the parallel boundary of the light-blocking region BA. Each inclined portion of the pair of inclined portions of the light control pattern LCP may partially overlap with different adjacent pixels. According to an exemplary embodiment of the present invention, each pixel PX may overlap with the edge portions of two light-blocking regions BA and the pixel region PA arranged between the two light-blocking regions BA in the third direction (e.g., the z direction). The length L may be greater than the process dispersion. For example, when the process dispersion by mask alignment is ±2 μm, the length L of the second non-inclined portion may be about 4 μm.

[0155] The light control pattern LCP may include a reflective pattern 502 and a light-blocking pattern 503. The light-blocking pattern 503 is arranged on the reflective pattern 502 and has the same shape as the reflective pattern 502, and thus, the ends of the reflective pattern 502 and the light-blocking pattern 503 may coincide with each other. The reflective pattern 502 and the light-blocking pattern 503 may be arranged on the side surface and the bottom surface of the opening OP1. The reflective pattern 502 may be in direct contact with the upper surface of the encapsulation layer 440 exposed by the opening OP1 and the side surface of the insulating pattern 501a. The reflective pattern 502 may have approximately a thickness, and the light-blocking pattern 503 may have approximately a thickness.

[0156] The reflective pattern 502 may include a reflective material. The reflective material may include a metal having a high light reflectivity. Examples of the metal may include silver (Ag), magnesium (Mg), aluminum (Al), platinum (Pt), palladium (Pd), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), and / or an alloy. For example, the reflective pattern 502 may include Al or super Al.

[0157] The light-blocking pattern 503 may include a light-blocking material. The light-blocking material may include a light-absorbing material. The light-absorbing material may include metal oxides such as AlO x 、CrO x 、CuO x 、MoO x 、TiO x 、AlNdO x 、CuMoO x 、MoTaO x or MoTiO x etc. For example, the light-blocking pattern 503 may include MoTaO x (MTO).

[0158] The reflective pattern 502 may reflect a part Lp of the light emitted from the light-emitting element 430 to an adjacent pixel region PA. The light Lr reflected by the light control pattern LCP may be incident on the first color conversion layer 150, the second color conversion layer 160, or the transmissive layer 170 of the pixel region PA. The light-blocking pattern 503 of the light control pattern LCP may absorb a part Lp of the light emitted from the light-emitting element 430 to an adjacent pixel region PA.

[0159] FIG. 6A to FIG. 6E illustrates Figure 5 the steps in the manufacturing process of the display device 10A shown in

[0160] As Fig. 6A shown in

[0161] The opening OP1 may expose the upper surface of the encapsulation layer 440. Adjacent openings OP1 may completely surround the opening 437OP of the pixel defining layer 437 and may be located in the light-blocking region BA of the substrate 410. The insulating pattern 501a may be located in the pixel region PA of the substrate 410. The insulating pattern 501a may overlap with the light-emitting element 430 (e.g., the pixel electrode 431). The insulating pattern 501a may overlap with the opening 437OP of the pixel defining layer 437, for example, in the third direction (e.g., the z direction). The inner width IW of the insulating pattern 501a may be equal to or greater than the width EW of the opening 437OP of the pixel defining layer 437.

[0162] As Figure 6B shown, the reflective material layer 502L and the light-blocking material layer 503L may be sequentially deposited on the substrate 410 to cover the first insulating layer 501, including the side surfaces and the bottom surface of the insulating pattern 501a and the opening OP1.

[0163] Subsequently, as Figure 6C shown, a photoresist 600 may be applied to at least partially cover the reflective material layer 502L and the light-blocking material layer 503L. For example, the photoresist 600 may be filled in the opening OP1 and may cover a portion of the edge of the insulating pattern 501a covering the light-blocking material layer 503L. The photoresist 600 may be subjected to ultraviolet (UV) exposure and development using an aligned mask M, and thus only the portion of the photoresist 600 corresponding to the light-blocking portion M1 may be retained.

[0164] The photoresist 600 may include a photosensitive organic material such as acrylic resin, benzocyclobutene (BCB), polyimide (PI), and / or novolak resin. The photosensitive organic material may be a negative photosensitive material or a positive photosensitive material. Figure 6C An example in which the photoresist 600 includes a positive photosensitive material is shown. The mask M may include a light-blocking portion M1 and a light-transmitting portion M2. The light-blocking portion M1 may correspond to the region of the photoresist 600 remaining after the UV treatment, and the light-transmitting portion M2 may correspond to the region where the photoresist 600 is removed. The light-blocking portion M1 is located at a position corresponding to the light-blocking region BA of the substrate 410, and the light-transmitting portion M2 is located at a position corresponding to the pixel region PA of the substrate 410.

[0165] Next, as Fig.6DAs shown, the reflective material layer 502L and the light-blocking material layer 503L in the area where the photoresist 600 is removed can be etched to form a light control pattern LCP including a reflective pattern 502 and a light-blocking pattern 503. The etching can be wet etching or dry etching. In the etching process of removing the reflective material layer 502L and the light-blocking material layer 503L, a part of the upper portion of the first insulating layer 501 can be removed by over-etching. The etched surfaces (e.g., side surfaces) of the reflective material layer 502L corresponding to the opening 502OP and the etched surfaces (e.g., side surfaces) of the light-blocking material layer 503L corresponding to the opening 503OP can coincide with each other (e.g., can be aligned). The opening LOP of the light control pattern LCP can include the opening 502OP of the reflective material layer 502L and the opening 503OP of the light-blocking material layer 503L. The width LW of the opening LOP of the light control pattern LCP can be equal to or greater than the width EW of the opening 437OP of the pixel defining layer 437. Thereafter, the photoresist 600 remaining on the light control pattern LCP can be removed.

[0166] Next, as Fig. 6E shown, a second insulating layer 510 covering the light control pattern LCP and the first insulating layer 501 can be arranged above the substrate 410. The second insulating layer 510 can include an organic insulating layer. The second insulating layer 510 can include the same material as that of the first insulating layer 501.

[0167] The display panel 400a and the color control member 100 can be aligned such that the pixel region PA and the light-blocking region BA of the substrate 410 respectively correspond to the pixel region PA and the light-blocking region BA of the color control member 100, and then the display panel 400a and the color control member 100 can be bonded.

[0168] For example, the display panel 400a and the color control member 100 can be aligned such that the first pixel region PA1, the second pixel region PA2, and the third pixel region PA3 (and the edge portions of the light-blocking region BA adjacent thereto) respectively overlap the corresponding first pixel PX1, second pixel PX2, and third pixel PX3 in the third direction (e.g., the z direction). Next, the display panel 400a and the color control member 100 can be bonded.

[0169] Figure 7 shows a cross-section taken along the Figure 1 line I-I' according to an exemplary embodiment of the present invention.

[0170] Referring to Figure 7, the display device 10B according to an exemplary embodiment of the present invention may include a display panel 400b and a color control member 100. The first pixel circuit 420a, the second pixel circuit 420b, and the third pixel circuit 420c of the first pixel PX1, the second pixel PX2, and the third pixel PX3 may be respectively arranged in the pixel circuit layer 420 of the display panel 400b. The light-emitting elements 430 may be arranged on the pixel circuit layer 420 corresponding to the first pixel region PA1, the second pixel region PA2, and the third pixel region PA3 of the color control member 100 (e.g., the first pixel region PA1 to the third pixel region PA3 of the substrate 410). An encapsulation layer 440 may be arranged on the light-emitting elements 430. For example, the encapsulation layer 440 may be disposed between the counter electrode 435 and the first insulating layer 501).

[0171] A light control layer 450b may be arranged on the encapsulation layer 440. For example, the light control layer 450b may be disposed between the encapsulation layer 440 and the planarization layer 190. The light control layer 450b may include an insulating pattern 501a and a light control pattern LCP, wherein the insulating pattern 501a is located in the pixel region PA of the substrate 410, and the light control pattern LCP is located in the light-blocking region BA of the substrate 410 and arranged between the insulating patterns 501a. The light control layer 450b may further include a second insulating layer 510 covering the light control pattern LCP.

[0172] The insulating pattern 501a may be arranged corresponding to the first pixel region PA1, the second pixel region PA2, and the third pixel region PA3 of the color control member 100. The first insulating layer 501 may have an opening OP2 surrounding the insulating pattern 501a and corresponding to the light-blocking region BA of the color control member 100. The insulating pattern 501a may overlap with the light-emitting elements 430. The inner angle formed between the side surface and the lower surface (or a surface parallel to the lower surface) of the insulating pattern 501a may be a first angle θ. The insulating pattern 501a may have a tapered structure. The opening OP2 may have an inverted tapered structure with respect to the tapered structure of the insulating pattern 501a.

[0173] The light control pattern LCP can be arranged to correspond to the light-blocking region BA of the color control member 100. The light control pattern LCP can be positioned in the opening OP2 to surround the adjacent side surfaces of the insulating pattern 501a and can completely cover the surface of the opening OP2. The light control pattern LCP can include a pair of inclined portions arranged on the side surface 51 of the opening OP2 (or the side surface of the insulating pattern 501a). Each of the pair of inclined portions can form a first angle θ with the upper surface of the encapsulation layer 440 (or a surface parallel to the upper surface). The pair of inclined portions extend away from the upper surface of the substrate 410 in a third direction (e.g., the z direction), and the distance between the inclined portions on the side closest to the substrate 410 is smaller than the distance between the inclined portions on the side away from the substrate 410. The light control pattern LCP can be arranged in the opening OP2 and can include a first non-inclined portion located between the pair of inclined portions. The light control pattern LCP can include a second non-inclined portion formed on the inclined portion and extending in the first direction (e.g., the x direction) oppositely to the upper surface of the insulating pattern 501a adjacent to the opening OP2. Considering the process dispersion caused by mask alignment in the manufacturing process, each of the second non-inclined portions can extend to the upper surface of the insulating pattern 501a outside the opening OP2 with a length L.

[0174] The light control pattern LCP can include a reflective pattern 502 and a light-blocking pattern 504. The reflective pattern 502 can be arranged on the side surface and the bottom surface of the opening OP2. The light-blocking pattern 504 can be arranged on the bottom surface of the opening OP2.

[0175] The reflective pattern 502 can have a thickness of approximately . The reflective pattern 502 can include a reflective material.

[0176] The light-blocking pattern 504 can include a light-blocking material. The light-blocking material can include a light-absorbing material. The light-absorbing material can include metal oxides such as AlO x 、CrO x 、CuO x 、MoO x 、TiO x 、AlNdO x 、CuMoO x 、MoTaO x or MoTiO xetc. The light-blocking pattern 504 may include an opaque inorganic insulating material or an opaque organic insulating material such as a black resin. The light-blocking pattern 504 may have various colors including black or white. In the case where the light-blocking pattern 504 is black, the light-blocking pattern 504 may include a black matrix. In the case where the light-blocking pattern 504 is white, the light-blocking pattern 504 may include an organic insulating material such as white resin. The light-blocking pattern 504 may have a thickness of approximately 1.5 μm. The light-blocking pattern 504 may be arranged between the reflective pattern 502 and the encapsulation layer 440.

[0177] The reflective pattern 502 of the light control pattern LCP may include an inclined portion and a first non-inclined portion and a second non-inclined portion. The light-blocking pattern 504 of the light control pattern LCP may be arranged below the first non-inclined portion of the reflective pattern 502. The light-blocking pattern 504 may be in direct contact with the upper surface of the encapsulation layer 440. For example, the light-blocking pattern 504 may be disposed between the encapsulation layer 440 and the reflective pattern 502. The edge of the light-blocking pattern 504 may be covered by the insulating pattern 501a. The reflective pattern 502 may be in direct contact with the upper surface of the light-blocking pattern 504 and the side surface of the insulating pattern 501a. For example, the insulating pattern 501a may have a stepped shape in which the side surface of the light-blocking pattern 504 is received therein. The light-blocking pattern 504 may be wider in the first direction (e.g., the x direction) than the bottom surface of the opening OP2 and the first non-inclined portion of the reflective pattern 502 disposed thereon.

[0178] The reflective pattern 502 may reflect a part of the light emitted from the light-emitting element 430 to an adjacent pixel region PA. The light reflected by the light control pattern LCP may be incident on the first color conversion layer 150 or the second color conversion layer 160 or the transmissive layer 170 of the corresponding pixel region PA. The light-blocking pattern 504 may absorb a part of the light emitted from the light-emitting element 430 toward an adjacent pixel region PA associated with an adjacent light-emitting element 430.

[0179] FIG. 8A to FIG. 8F shows Figure 7 steps in the manufacturing process of the display device 10B shown in

[0180] As Fig. 8A shown in, a light-blocking material layer may be formed over the substrate 410 on which the light-emitting element 430, the pixel defining layer 437 between the light-emitting elements 430, and the encapsulation layer 440 are formed. Subsequently, the light-blocking material layer may be patterned to form the light-blocking pattern 504. The light-blocking pattern 504 may be arranged to overlap with the pixel defining layer 437 in the light-blocking region BA of the substrate 410. The opening 504OP of the light-blocking pattern 504 may be formed to completely surround the opening 437OP of the pixel defining layer 437. The width BW of the opening 504OP of the light-blocking pattern 504 may be equal to or greater than the width EW of the opening 437OP of the pixel defining layer 437.

[0181] As Figure 8B shown in Figure 8B , a first insulating layer 501 may be formed on the light-blocking pattern 504, and then an opening OP2 may be formed in the first insulating layer 501, thereby forming an insulating pattern 501a. The first insulating layer 501 may include an organic insulating layer. The opening OP2 may completely surround the opening 437OP of the pixel defining layer 437, and may be located in the light-blocking region BA of the substrate 410. The opening OP2 may expose the upper surface of the light-blocking pattern 504. The insulating pattern 501a may overlap with the light-emitting element 430 (or the pixel electrode 431) in the third direction (e.g., the z direction). The insulating pattern 501a may overlap with the opening 437OP of the pixel defining layer 437, and the inner width IW of the insulating pattern 501a may be equal to or greater than the width EW of the opening 437OP of the pixel defining layer 437.

[0182] As Figure 8C shown in Figure 8C , a reflective material layer 502L may be deposited on the substrate 410 to cover the first insulating layer 501 including the insulating pattern 501a, the side surfaces and the bottom surface of the opening OP2, and the upper surface of the light-blocking pattern 504.

[0183] Subsequently, as Fig.8D shown in Fig.8D , a photoresist 600 may be applied to cover the reflective material layer 502L, and the photoresist 600 may be exposed to ultraviolet light and developed using an aligned mask M. Accordingly, the portion of the photoresist 600 corresponding to the light-transmitting portion M2 may be removed, and only the portion of the photoresist 600 corresponding to the light-blocking portion M1 may be retained.

[0184] Next, as Fig. 8E shown in Fig. 8E , the reflective material layer 502L in the region where the photoresist 600 has been removed may be etched, thereby forming a reflective pattern 502. The etching may be wet etching or dry etching. In the etching process of removing the reflective material layer 502L, a part of the upper portion of the first insulating layer 501 may be removed by over-etching. The width of the opening 502OP of the reflective material layer 502L (i.e., the width LW of the opening LOP of the light control pattern LCP) may be equal to or greater than the width EW of the opening 437OP of the pixel defining layer 437. Thereafter, the photoresist 600 remaining on the reflective pattern 502 may be removed.

[0185] Next, as Fig.8F shown in Fig.8F , a second insulating layer 510 covering the light control pattern LCP and the first insulating layer 501 may be arranged above the substrate 410. The second insulating layer 510 may include an organic insulating layer. The second insulating layer 510 may include the same material as the first insulating layer 501.

[0186] The display panel 400b and the color control member 100 may be aligned such that the pixel region PA and the light-blocking region BA of the substrate 410 respectively correspond to the pixel region PA and the light-blocking region BA of the color control member 100, and then the display panel 400b and the color control member 100 may be bonded together.

[0187] Fig. 9 A cross-section taken along line I-I' of an exemplary embodiment according to the present invention is shown. Figure 1 of the

[0188] Referring to Fig. 9 , a display device 10C according to an exemplary embodiment of the present invention may include a display panel 400c and a color control member 100. A light control layer 450c may be arranged on the encapsulation layer 440.

[0189] Fig. 9 The exemplary embodiment of the present invention shown in Figure 5 and Figure 7 differs from the exemplary embodiment of the present invention shown in Figure 5 and Figure 7 in that the light control pattern LCP of the light control layer 450c includes a reflection pattern 502, a first light-blocking pattern 503, and a second light-blocking pattern 504. Since other layouts are the same as those in Figure 5 and Figure 7 , a detailed description thereof may be omitted.

[0190] The reflection pattern 502 and the first light-blocking pattern 503 of the light control pattern LCP may be arranged on the side surface and the bottom of the opening OP3 of the first insulating layer 501, and the second light-blocking pattern 504 may be arranged on the bottom of the opening OP3.

[0191] The reflection pattern 502 and the first light-blocking pattern 503 of the light control pattern LCP may each include a pair of inclined portions, a first non-inclined portion, and a second non-inclined portion. The second light-blocking pattern 504 of the light control pattern LCP may be arranged below the first non-inclined portion of the reflection pattern 502. The first light-blocking pattern 503 may be formed on the reflection pattern 502 in a shape identical to that of the reflection pattern 502. The second light-blocking pattern 504 may be in direct contact with the upper surface of the encapsulation layer 440 and may be arranged below the reflection pattern 502. The edge of the second light-blocking pattern 504 may be covered by an insulating pattern 501a. The reflection pattern 502 may be in direct contact with the upper surface of the second light-blocking pattern 504 and the side surface of the insulating pattern 501a.

[0192] The reflective pattern 502 can reflect a part of the light emitted from the light-emitting element 430 to an adjacent pixel region PA. The light reflected by the light control pattern LCP can be incident on at least one of the first color conversion layer 150, the second color conversion layer 160, and the transmissive layer 170 of the first pixel region PA1, the second pixel region PA2, and the third pixel region PA3. The first light-blocking pattern 503 and the second light-blocking pattern 504 can absorb a part of the light emitted from the light-emitting element 430 and directed toward the adjacent pixel region PA associated with the adjacent pixel PX.

[0193] Fig.10 shows a cross-section taken along line I-I' of a Figure 1 display device according to an exemplary embodiment of the present invention.

[0194] Referring to Fig.10 , a display device 10D according to an exemplary embodiment of the present invention may include a display panel 400d and a color control member 100. The first pixel circuit 420a, the second pixel circuit 420b, and the third pixel circuit 420c of the first pixel PX1, the second pixel PX2, and the third pixel PX3 may be arranged in the pixel circuit layer 420 of the display panel 400d, respectively. The light-emitting element 430 may be arranged on the pixel circuit layer 420 to correspond to the first pixel region PA1, the second pixel region PA2, and the third pixel region PA3 of the color control member 100. An encapsulation layer 440 may be arranged on the light-emitting element 430.

[0195] A light control layer 450d may be arranged on the encapsulation layer 440. The light control layer 450d may include a first insulating layer 501' having an insulating pattern 501a' positioned to overlap with the light-blocking region BA of the color control member 100. The light control pattern LCP may be positioned to overlap with the light-blocking region BA. The light control pattern LCP may cover the insulating pattern 501a' and may be arranged on the first insulating layer 501'. The light control layer 450d may further include a second insulating layer 510 covering the light control pattern LCP.

[0196] The insulating pattern 501a' may be arranged to correspond to the light-blocking region BA of the color control member 100. The insulating pattern 501a' may have a thickness of approximately 5.0 μm. The first insulating layer 501' may have openings OP4 corresponding to the first pixel region PA1, the second pixel region PA2, and the third pixel region PA3 of the color control member 100. The insulating pattern 501a' may surround the pixel region PA and may be located in the light-blocking region BA of the color control member 100. The upper surface of the encapsulation layer 440 may be exposed through the openings OP4 between the insulating patterns 501a'. The inner angle formed between the side surface and the bottom surface of the insulating pattern 501a' may be the first angle θ. The insulating pattern 501a' may have a tapered structure. The opening OP4 may have an inverted tapered structure with respect to the insulating pattern 501a'.

[0197] The light control pattern LCP may be arranged to correspond to the light-blocking region BA of the color control member 100. The light control pattern LCP may completely cover the insulating pattern 501a'. For example, the light control pattern LCP may be arranged to cover the side surface 51 of the insulating pattern 501a' and the upper surface of the insulating pattern 501a'. The light control pattern LCP may include a pair of inclined portions arranged on the side surface 51 of the insulating pattern 501a'. Each of the pair of inclined portions may form the first angle θ with the upper surface of the encapsulation layer 440. The pair of inclined portions may extend in the inclined direction from the upper surface of the encapsulation layer 440, and the distance between the inclined portions on the side closer to the substrate 410 is greater than the distance between the inclined portions on the side farther from the substrate 410. The light control pattern LCP may include a first non-inclined portion arranged on the upper surface of the insulating pattern 501a' and extending in the first direction (e.g., the x direction). The light control pattern LCP may include a second non-inclined portion arranged on the upper surface of the encapsulation layer 440, the second non-inclined portion being connected to the inclined portion and extending into the opening OP4 in the first direction (e.g., the x direction). Considering the process dispersion caused by mask alignment in the manufacturing process, each of the second non-inclined portions may extend into the upper surface of the encapsulation layer 440 inside the opening OP4 by a length L.

[0198] The light control pattern LCP may include a reflective pattern 512 and a light-blocking pattern 513. The reflective pattern 512 and the light-blocking pattern 513 may be arranged on the side surface and the upper surface of the insulating pattern 501a'. The reflective pattern 512 may be arranged on the light-blocking pattern 513 and may have the same shape as the light-blocking pattern 513, and thus, the ends of the reflective pattern 512 and the light-blocking pattern 513 may coincide with each other. The light-blocking pattern 513 may be in direct contact with the side surface and the upper surface of the insulating pattern 501a'. The reflective pattern 512 may have approximately a thickness, and the light-blocking pattern 513 may have approximately a thickness.

[0199] The reflective pattern 512 may include a reflective material. For example, the reflective pattern 512 may include Al or super Al. The light-blocking pattern 513 may include a light-blocking material. For example, the light-blocking pattern 513 may include MoTaO x (MTO).

[0200] The reflective pattern 512 of the light control pattern LCP may reflect a part of the light emitted from the light-emitting element 430 of a pixel region PA away from an adjacent pixel region PA associated with a different light-emitting element 430. The emitted light reflected by the light control pattern LCP may be incident on the first color conversion layer 150 or the second color conversion layer 160 or the transmissive layer 170 of the corresponding pixel region PA that overlaps with the light-emitting element 430. The light-blocking pattern 513 of the light control pattern LCP may absorb a part of the light emitted from the light-emitting element 430 having a trajectory toward the adjacent pixel region PA and prevent it from reaching the adjacent pixel region PA.

[0201] FIG. 11A to FIG. 11E Shows Fig.10 Steps in the manufacturing process of the display device 10D shown in

[0202] As Fig.11A shown, a first insulating layer 501' may be formed over the substrate 410 on which the light-emitting element 430, the pixel defining layer 437 between the light-emitting elements 430, and the encapsulation layer 440 are formed, and then an opening OP4 penetrating the first insulating layer 501' may be formed to form an insulating pattern 501a'. The first insulating layer 501' may include an organic insulating layer. The opening OP4 may expose the upper surface of the encapsulation layer 440. The opening OP4 may correspond to the pixel region PA of the substrate 410, and the insulating pattern 501a' may correspond to the light-blocking region BA of the substrate 410. The insulating pattern 501a' may completely surround the opening 437OP of the pixel defining layer 437 and overlap with the pixel defining layer 437. The width IW' of the opening OP4 of the insulating pattern 501a' overlapping with the opening 437OP of the pixel defining layer 437 may be equal to or greater than the width EW of the opening 437OP of the pixel defining layer 437.

[0203] As Fig. 11B shown, a light-blocking material layer 513L and a reflective material layer 512L may be sequentially deposited on the substrate 410 while covering the first insulating layer 501'.

[0204] Subsequently, as Fig. 11CAs shown, a photoresist 601 may be applied to cover the light-blocking material layer 513L and the reflective material layer 512L, and the photoresist 601 may be exposed to ultraviolet (UV) light and developed using an aligned mask M. Thus, the portion of the photoresist 601 corresponding to the light-transmitting portion M2 may be removed, and only the portion of the photoresist 601 corresponding to the light-blocking portion M1 may be retained.

[0205] Next, as Fig.11D shown, the light-blocking material layer 513L and the reflective material layer 512L in the area where the photoresist 601 has been removed may be etched to form a light control pattern LCP including a reflective pattern 512 and a light-blocking pattern 513. The etching may be wet etching or dry etching. The etched surfaces (e.g., side surfaces) of the reflective material layer 512L corresponding to the opening 512OP and the etched surfaces (e.g., side surfaces) of the light-blocking material layer 513L corresponding to the opening 513OP may coincide with each other (e.g., may be aligned). The opening LOP of the light control pattern LCP may include the opening 512OP of the reflective material layer 512L and the opening 513OP of the light-blocking material layer 513L. The width LW of the opening LOP of the light control pattern LCP may be equal to or greater than the width EW of the opening 437OP of the pixel defining layer 437. Thereafter, the photoresist 601 remaining on the light control pattern LCP may be removed.

[0206] Next, as Fig.11E shown, a second insulating layer 510 covering the light control pattern LCP and the first insulating layer 501' may be arranged above the substrate 410. The second insulating layer 510 may include an organic layer containing an organic material. The second insulating layer 510 may include the same material as the material of the first insulating layer 501'.

[0207] The display panel 400d and the color control member 100 may be aligned such that the pixel region PA and the light-blocking region BA of the substrate 410 respectively correspond to the pixel region PA and the light-blocking region BA of the color control member 100, and then the display panel 400d and the color control member 100 may be bonded together.

[0208] Fig.12 Shows a cross-section taken along the Figure 1 line I-I' of an exemplary embodiment according to the present invention.

[0209] Referring to Fig.12, the display device 10E according to an exemplary embodiment of the present invention may include a display panel 400e and a color control member 100. The first pixel circuit 420a, the second pixel circuit 420b, and the third pixel circuit 420c of the first pixel PX1, the second pixel PX2, and the third pixel PX3 may be respectively arranged in the pixel circuit layer 420 of the display panel 400e. The light-emitting elements 430 may be arranged on the pixel circuit layer 420 corresponding to the first pixel region PA1, the second pixel region PA2, and the third pixel region PA3 of the color control member 100. An encapsulation layer 440 may be arranged on the light-emitting elements 430.

[0210] A light control layer 450e may be arranged on the encapsulation layer 440. The light control layer 450e may include a first insulating layer 501' and a light control pattern LCP. Among them, the first insulating layer 501' has an insulating pattern 501a' located in the light-blocking region BA of the substrate 410, and the light control pattern LCP is located in the light-blocking region BA of the substrate 410. The light control layer 450e may further include a second insulating layer 510 covering the light control pattern LCP.

[0211] The insulating pattern 501a' may be arranged corresponding to the light-blocking region BA of the color control member 100. The openings OP5 between the insulating patterns 501a' may be positioned corresponding to the first pixel region PA1, the second pixel region PA2, and the third pixel region PA3 of the color control member 100. The inner angle formed between the side surface and the bottom surface of the insulating pattern 501a' may be a first angle θ. The insulating pattern 501a' may have a tapered structure. The opening OP5 may have an inverted tapered structure with respect to the insulating pattern 501a'.

[0212] The light control pattern LCP can be arranged to correspond to the light-blocking region BA of the color control member 100. The light control pattern LCP can completely cover the insulating pattern 501a'. The light control pattern LCP can be arranged to cover the side surface and the upper surface of the insulating pattern 501a'. The light control pattern LCP can include a pair of inclined portions arranged on the side surface of the insulating pattern 501a'. Each of the pair of inclined portions can form a first angle θ with the upper surface of the encapsulation layer 440 (or a surface parallel to the upper surface). The pair of inclined portions extend close to the upper surface of the substrate 410 in the third direction (e.g., the z direction), and the distance between the inclined portions on the side closest to the substrate 410 is greater than the distance between the inclined portions on the side farthest from the substrate 410. The light control pattern LCP can include a first non-inclined portion arranged on the upper surface of the insulating pattern 501a'. The light control pattern LCP can include a second non-inclined portion arranged on the upper surface of the encapsulation layer 440, which is connected to the inclined portion and extends into the opening OP5 in the first direction (e.g., the x direction). Considering the process dispersion caused by mask alignment in the manufacturing process, each of the second non-inclined portions can extend with a length L to the upper surface of the encapsulation layer 440 inside the opening OP5.

[0213] The light control pattern LCP can include a reflective pattern 512 and a light-blocking pattern 514. The reflective pattern 512 can have a thickness of approximately . The reflective pattern 512 can include a reflective material. The light-blocking pattern 514 can include a light-blocking material. The light-blocking pattern 514 can include an opaque inorganic insulating material and / or an opaque organic insulating material such as a black resin. The light-blocking pattern 514 can have a thickness of approximately 1.5 μm. The light-blocking pattern 514 can be arranged between the insulating pattern 501a' and the encapsulation layer 440.

[0214] The reflective pattern 512 of the light control pattern LCP may include an inclined portion, a first non-inclined portion, and a second non-inclined portion. The reflective pattern 512 may completely cover the insulating pattern 501a'. The reflective pattern 512 may be in direct contact with the side surface and the upper surface of the insulating pattern 501a'. The light-blocking pattern 514 of the light control pattern LCP may be arranged in the space defined by the reflective pattern 512. The light-blocking pattern 514 may be arranged below the insulating pattern 501a'. The light-blocking pattern 514 may be disposed between the encapsulation layer 440 and the insulating pattern 501a'. For example, the light-blocking pattern 514 may be in direct contact with the upper surface of the encapsulation layer 440. The etched surface of the light-blocking pattern 514 may coincide (e.g., be aligned) with the etched surface of the insulating pattern 501a'. The reflective pattern 512 may be in direct contact with the side surfaces of the light-blocking pattern 514. For example, the inclined portion of the reflective pattern 512 may overlap with the opposite two side surfaces of the light-blocking pattern 514 in a first direction (e.g., the x direction), and the upper surface of the light-blocking pattern 514 may be spaced apart from and parallel to the lower surface of the first non-inclined portion of the reflective pattern 512 in a third direction (e.g., the z direction).

[0215] The reflective pattern 512 may reflect a part of the light emitted from the light-emitting element 430 toward an adjacent pixel region PA associated with another light-emitting element 430. The light reflected by the light control pattern LCP may be incident on the first color conversion layer 150, the second color conversion layer 160, or the transmissive layer 170 of the pixel region PA. The light-blocking pattern 514 may absorb a part of the light emitted from the light-emitting element 430 to the adjacent pixel region PA.

[0216] FIG. 13A to FIG. 13E is shown Fig.12 steps in the manufacturing process of the display device 10E shown in

[0217] As Fig.13A shown in

[0218] Subsequently, as Fig. 13BAs shown in [the figure], the light-blocking material layer 514L and the first insulating layer 501' can be patterned to form a light-blocking pattern 514 and an insulating pattern 501a', respectively. The light-blocking pattern 514 and the insulating pattern 501a' can be located in the light-blocking region BA of the substrate 410. The light-blocking pattern 514 and the insulating pattern 501a' can completely surround the opening 437OP of the pixel defining layer 437 and can overlap with the pixel defining layer 437. As the light-blocking material layer 514L and the first insulating layer 501' are etched simultaneously, the etched surfaces of the light-blocking pattern 514 and the insulating pattern 501a' can coincide with each other (e.g., coplanar and / or sharing the same slope). As Fig.12 shown in [the figure], the light-blocking pattern 514 and the insulating pattern 501a' can have a continuously inclined structure that gives the etched surface (e.g., the side surface) an inclination angle θ. The opening OP5 can include an opening 514OP of the light-blocking material layer 514L and an opening 501OP of the first insulating layer 501', and the opening OP5 can be located in the pixel region PA of the substrate 410. The width IW” of the opening OP5 can be equal to or greater than the width EW of the opening 437OP of the pixel defining layer 437.

[0219] As Fig. 13C shown in [the figure], while covering the light-blocking pattern 514 and the first insulating layer 501' including the insulating pattern 501a', a reflective material layer 512L can be formed over the substrate 410.

[0220] Subsequently, as Fig.13D shown in [the figure], the reflective material layer 512L can be patterned to form a reflective pattern 512. As Fig. 11C shown in [the figure], a photoresist 601 can be applied to cover the reflective material layer 512L, and the photoresist 601 can be exposed to ultraviolet light and developed using an aligned mask M. Accordingly, the portion of the photoresist 601 corresponding to the light-transmitting portion M2 can be removed, and only the portion of the photoresist 601 corresponding to the light-blocking portion M1 can be retained. The reflective material layer 512L in the area where the photoresist 601 has been removed can be etched to form the reflective pattern 512. The etching can be wet etching or dry etching. The width of the opening 512OP of the reflective material layer 512L (i.e., the width LW of the opening LOP of the light control pattern LCP) can be equal to or greater than the width EW of the opening 437OP of the pixel defining layer 437. After that, the photoresist 601 remaining on the reflective pattern 512 can be removed.

[0221] The reflective pattern 512 can be located in the light-blocking region BA of the substrate 410. The reflective pattern 512 can cover the side surfaces of the light-blocking pattern 514 and the insulating pattern 501a' and the upper surface of the insulating pattern 501a'. A part of the reflective pattern 512 can be arranged in the opening OP5.

[0222] Next, as Fig.13EAs shown, a second insulating layer 510 covering the light control pattern LCP may be arranged above the substrate 410. The second insulating layer 510 may include an organic layer containing an organic material. The second insulating layer 510 may include the same material as the first insulating layer 501' forming the insulating pattern 501a'.

[0223] The display panel 400e and the color control member 100 may be aligned such that the pixel region PA and the light-blocking region BA of the substrate 410 respectively correspond to the pixel region PA and the light-blocking region BA of the color control member 100, and then the display panel 400e and the color control member 100 may be bonded together.

[0224] Fig.14 The cross-section taken along line I-I' of a display device according to an exemplary embodiment of the present invention is shown. Figure 1 of the display device.

[0225] Referring to Fig.14 , a display device 10F according to an exemplary embodiment of the present invention may include a display panel 400f and a color control member 100. The first pixel circuit 420a, the second pixel circuit 420b, and the third pixel circuit 420c of the first pixel PX1, the second pixel PX2, and the third pixel PX3 may be respectively arranged in the pixel circuit layer 420 of the display panel 400f. The light-emitting elements 430 may be arranged on the pixel circuit layer 420 to correspond to the first pixel region PA1, the second pixel region PA2, and the third pixel region PA3 of the color control member 100. A packaging layer 440 may be arranged on the light-emitting elements 430.

[0226] A light control layer 450f may be arranged on the packaging layer 440. The light control layer 450f may include a first insulating layer 501 and a light control pattern LCP. Among them, the first insulating layer 501 has an insulating pattern 501a located in the pixel region PA of the substrate 410, and the light control pattern LCP is located in the light-blocking region BA of the substrate 410 and arranged between the insulating patterns 501a. The light control layer 450f may further include a horizontal pattern 610 located on the light control pattern LCP. The light control layer 450f may further include a second insulating layer 510 covering the light control pattern LCP. The light control pattern LCP may include a reflective pattern 502 and a light-blocking pattern 503.

[0227] Since Fig.14 the insulating pattern 501a and the light control pattern LCP shown in Figure 5 are the same as the insulating pattern 501a and the light control pattern LCP shown in

[0228] The horizontal pattern 610 may also be arranged on the light control pattern LCP. The horizontal pattern 610 may overlap with the pixel defining layer 437. The horizontal pattern 610 may include a photosensitive organic material, such as an acrylic resin, BCB, PI and / or a novolac resin. The photosensitive organic material may be a negative photosensitive material and / or a positive photosensitive material. The horizontal pattern 610 may cover a portion of the light control pattern LCP arranged in at least the opening OP1. According to an exemplary embodiment of the present invention, the horizontal pattern 610 may completely cover the light control pattern LCP. The upper surface of the horizontal pattern 610 may be at the same level as the upper surface of the light control pattern LCP. According to an exemplary embodiment of the present invention, the upper surface of the horizontal pattern 610 may be at least partially higher or lower than the upper surface of the light control pattern LCP. The upper surface of the horizontal pattern 610 may be flat or non-flat. For example, the upper surface of the horizontal pattern 610 may have a ridge shape with a valley arranged between two adjacent peaks.

[0229] Fig.15A Shows Fig.14 Comparative example. Fig.15A As shown in , since the light control pattern LCP is disposed in the opening OP1, the second insulating layer 510 on the light control pattern LCP may not be planarized. Accordingly, an air gap AG may appear between the color control member 100 and the second insulating layer 510. Light may be incident on the adjacent pixel area PA by refraction of light in the air gap AG. This may cause color mixing between the pixel areas PA. In the light blocking area BA of the color control member 100, the horizontal pattern 610 according to an exemplary embodiment of the present invention may be disposed on the light control pattern LCP before forming the second insulating layer 510, and thus the flatness of the second insulating layer 510 may be increased, thereby preventing the air gap from appearing between the color control member 100 and the second insulating layer 510. FIG. 15B to FIG. 15C Shows Fig.14 10F.

[0230] like Fig. 6A As shown in , a first insulating layer 501 may be formed over a substrate 410 on which light emitting elements 430, a pixel defining layer 437 between the light emitting elements 430, and an encapsulation layer 440 are formed, and then an opening OP1 penetrating the first insulating layer 501 may be formed, and thus an insulating pattern 501a may be formed. Figure 6B As shown in FIG. 5 , a reflective material layer 502L and a light blocking material layer 503L may be sequentially deposited on the substrate 410 while covering the insulating pattern 501a. Figure 6CAs shown, a photoresist 600 may be applied to cover the reflective material layer 502L and the light-blocking material layer 503L, and the photoresist 600 may be exposed to ultraviolet (UV) light and developed using an aligned mask M. Thus, only the portion of the photoresist 600 corresponding to the light-blocking portion M1 may be retained.

[0231] Next, as Fig. 15B shown, the reflective material layer 502L and the light-blocking material layer 503L in the area where the photoresist 600 has been removed may be etched to form a light control pattern LCP including a reflective pattern 502 and a light-blocking pattern 503. The etching may be wet etching or dry etching. In the etching process of removing the reflective material layer 502L and the light-blocking material layer 503L, a part of the upper portion of the insulating pattern 501a may be removed by over-etching. The photoresist 600 on the light control pattern LCP may be retained as a horizontal pattern 610. According to an exemplary embodiment of the present invention, the photoresist 600 on the light control pattern LCP may be removed, and an additional photoresist may be applied on the light control pattern LCP, or the photoresist may be dropped via an inkjet technique through a separate process to form a horizontal pattern 610.

[0232] As Fig. 15C shown, a second insulating layer 510 covering the light control pattern LCP, the horizontal pattern 610, and the first insulating layer 501 including the insulating pattern 501a may be arranged above the substrate 410. The second insulating layer 510 may include an organic insulating layer. The second insulating layer 510 may include the same material as the material of the first insulating layer 501.

[0233] The display panel 400f and the color control member 100 may be aligned such that the pixel region PA and the light-blocking region BA of the substrate 410 respectively correspond to the pixel region PA and the light-blocking region BA of the color control member 100, and then the display panel 400f and the color control member 100 may be bonded.

[0234] Fig.16 A cross-section taken along the Figure 1 line I-I' according to an exemplary embodiment of the present invention is shown.

[0235] Referring to Fig.16, the display device 10G according to an exemplary embodiment of the present invention may include a display panel 400g and a color control member 100. The first pixel circuit 420a, the second pixel circuit 420b, and the third pixel circuit 420c of the first pixel PX1, the second pixel PX2, and the third pixel PX3 may be respectively arranged in the pixel circuit layer 420 of the display panel 400g. The light-emitting elements 430 may be arranged on the pixel circuit layer 420 corresponding to the first pixel region PA1, the second pixel region PA2, and the third pixel region PA3 of the color control member 100. An encapsulation layer 440 may be arranged on the light-emitting elements 430.

[0236] A light control layer 450g may be arranged on the encapsulation layer 440. The light control layer 450g may include a first insulating layer 501 and a light control pattern LCP. Among them, the first insulating layer 501 has an insulating pattern 501a located in the pixel region PA of the substrate 410, and the light control pattern LCP is located in the light-blocking region BA of the substrate 410 and arranged between the insulating patterns 501a. The light control layer 450g may further include a horizontal pattern 610 located on the light control pattern LCP. The light control layer 450g may further include a second insulating layer 510 covering the light control pattern LCP. The light control pattern LCP may include a reflective pattern 502 and a light-blocking pattern 504.

[0237] Since Fig.16 the insulating pattern 501a and the light control pattern LCP shown in Figure 7 are the same as the insulating pattern 501a and the light control pattern LCP shown in

[0238] their detailed description may be omitted. The horizontal pattern 610 may also be arranged on the light control pattern LCP. The horizontal pattern 610 may overlap with the pixel defining layer 437 in the third direction (e.g., the z direction), for example. The horizontal pattern 610 may include a photosensitive organic material such as acrylic resin, BCB, PI, and / or novolak resin. The photosensitive organic material may be a negative photosensitive material or a positive photosensitive material.

[0239] Fig.17A and Fig. 17B show the steps in the manufacturing process of the display device 10G shown in Fig.16 .

[0240] As Fig. 8A shown, a light-blocking material layer may be formed above the substrate 410 on which the light-emitting elements 430, the pixel defining layer 437 between the light-emitting elements 430, and the encapsulation layer 440 are formed, and then the light-blocking material layer may be patterned to form a light-blocking pattern 504 in the light-blocking region BA of the substrate 410. As Figure 8BAs shown, a first insulating layer 501 may be formed on the light-blocking pattern 504, and then an opening OP2 may be formed in the first insulating layer 501, thereby forming an insulating pattern 501a. As Figure 8C As shown, a reflective material layer 502L may be deposited over the substrate 410 while covering the first insulating layer 501 and the light-blocking pattern 504. Subsequently, as Fig.8D As shown, a photoresist 600 may be applied to cover the reflective material layer 502L, and the photoresist 600 may be UV-exposed and developed using an aligned mask M, and thus, only the portion of the photoresist 600 corresponding to the light-blocking portion M1 may be retained.

[0241] Next, as Fig.17A As shown, the reflective material layer 502L in the area where the photoresist 600 has been removed may be etched to form a reflective pattern 502. The etching may be wet etching or dry etching. In the etching process of removing the reflective material layer 502L, a portion of the upper part of the first insulating layer 501 may be removed by over-etching. The photoresist 600 on the light control pattern LCP may be retained as a horizontal pattern 610. In an exemplary embodiment of the present invention, the photoresist 600 on the light control pattern LCP may be removed, and an additional photoresist may be applied on the light control pattern LCP, or the photoresist may be dropped via an inkjet technique through a separate process to form a horizontal pattern 610.

[0242] As Fig. 17B As shown, a second insulating layer 510 may be arranged over the substrate 410 to cover the light control pattern LCP, the horizontal pattern 610, and the first insulating layer 501 including the insulating pattern 501a. The second insulating layer 510 may include an organic layer containing an organic material. The second insulating layer 510 may include the same material as the first insulating layer 501.

[0243] The display panel 400g and the color control member 100 may be aligned such that the pixel region PA and the light-blocking region BA of the substrate 410 respectively correspond to the pixel region PA and the light-blocking region BA of the color control member 100, and then the display panel 400g and the color control member 100 may be bonded.

[0244] Fig.18 A cross-section taken along line I-I' according to an exemplary embodiment of the present invention is shown. Figure 1 of the

[0245] Referring to Fig.18, the display device 10H according to the exemplary embodiment of the present invention may include a display panel 400h and a color control member 100. The first pixel circuit 420a, the second pixel circuit 420b, and the third pixel circuit 420c of the first pixel PX1, the second pixel PX2, and the third pixel PX3 may be arranged in the pixel circuit layer 420 of the display panel 400h, respectively. The light emitting element 430 may be arranged on the pixel circuit layer 420 to correspond to the first pixel area PA1, the second pixel area PA2, and the third pixel area PA3 of the color control member 100. An encapsulation layer 440 may be arranged on the light emitting element 430.

[0246] A light control layer 450h may be arranged on the encapsulation layer 440. The light control layer 450h may include a first insulating layer 501 and a light control pattern LCP, wherein the first insulating layer 501 has an insulating pattern 501a located in the pixel area PA of the substrate 410, and the light control pattern LCP is located in the light blocking area BA of the substrate 410 and arranged between the insulating patterns 501a. The light control layer 450h may also include a horizontal pattern 610' located on the light control pattern LCP. The light control layer 450h may also include a second insulating layer 510 covering the light control pattern LCP. The light control pattern LCP may include a reflective pattern 502' and a light blocking pattern 503'.

[0247] because Fig.18 The insulating pattern 501a shown in FIG. Figure 5 The insulating pattern 501a shown in FIG. 5 is the same as that in FIG. 5 , and thus a detailed description thereof may be omitted.

[0248] Fig.18 The light control pattern LCP shown in Figure 5 The light control pattern LCP shown in FIG. Fig.18 The light-controlling pattern LCP shown in includes the horizontal pattern 610' and does not include the second non-inclined portion arranged on the upper surface of the insulating pattern 501a. The following description will focus on the difference.

[0249] The light-controlling pattern LCP may be arranged to correspond to the light-blocking area BA of the color control member 100. The light-controlling pattern LCP may include an inclined portion arranged on the side surface 51 of the opening OP1 (or the side surface of the insulating pattern 501a). The inner angle of the insulating pattern 501a and the angle formed by the inclined portion of the light-controlling pattern LCP and the upper surface of the encapsulation layer 440 may be referred to as a first angle θ. The light-controlling pattern LCP may include a first non-inclined portion arranged on the bottom surface of the opening OP1 (i.e., the upper surface of the encapsulation layer 440 exposed by the opening OP1).

[0250] The horizontal pattern 610' may also be arranged on the light control pattern LCP. The horizontal pattern 610' may include a photosensitive organic material such as acrylic resin, BCB, PI, and / or novolak resin. The photosensitive organic material may be a negative photosensitive material or a positive photosensitive material.

[0251] The upper surface of the insulating pattern 501a, the upper surface of the light control pattern LCP, and the upper surface of the horizontal pattern 610' may be on the same plane IP and may be flat upper surfaces.

[0252] Fig.19A and Fig.19B illustrates Fig.18 a comparative example of

[0253] Referring to Fig.19A , when the light control pattern LCP or the insulating pattern 501a is shifted left or right by a predetermined distance due to process dispersion caused by mask alignment in the manufacturing process, an area without the light control pattern LCP such as area X1 may be generated. Accordingly, a part L1 of the light emitted from the light emitting element 430 may be incident on an adjacent pixel region PA associated with a different light emitting element 430, and thus color mixing may occur between the pixel regions PA.

[0254] Referring to Fig.19B , considering the process dispersion caused by mask alignment, when a portion corresponding to the second non-inclined portion of the light control pattern LCP having a length L is added to area X2, even if the light control pattern LCP is shifted left or right by a predetermined distance through the second non-inclined portion, an area without the light control pattern LCP may not appear. However, in this case, a part L2 and L3 of the light emitted from the light emitting element 430 may be blocked by the second non-inclined portion, and thus a loss of the light component contributing to the brightness of the pixel PX may occur.

[0255] According to Fig.18 the exemplary embodiment of the present invention shown in Fig.18 , by using a manufacturing process not limited by process dispersion, the second non-inclined portion may not be required, and the light control pattern LCP may be formed in the opening OP1 without an area without the light control pattern LCP. In addition, according to

[0256] FIG. 19C to FIG. 19E illustrates Fig.18 the steps in the manufacturing process of the display device 10H shown in

[0257] As Fig. 6A As shown in Fig. 6A , a first insulating layer 501 may be formed over a substrate 410 on which a light-emitting element 430, a pixel defining layer 437 between the light-emitting elements 430, and a encapsulation layer 440 are formed, and then an opening OP1 penetrating the first insulating layer 501 may be formed, and thus an insulating pattern 501a may be formed. As Figure 6B As shown in Figure 6B , a reflective material layer 502L and a light-blocking material layer 503L may be sequentially deposited on the substrate 410 while covering the first insulating layer 501.

[0258] Subsequently, as Fig.19C As shown in Fig.19C , a photoresist 600' may be arranged in the opening OP1 by a spin coating method or an inkjet method. The photoresist 600' may include a low-viscosity photosensitive material.

[0259] Next, as Fig.19D As shown in Fig.19D , the reflective material layer 502L and the light-blocking material layer 503L may be etched such that the upper surface of the first insulating layer 501, the upper surface of the light control pattern LCP, and the upper surface of the photoresist 600' are located on the same plane IP. The etching may be wet etching or dry etching. After the etching, the photoresist 600' in the opening OP1 may remain as a horizontal pattern 610'. The etched surface of the first insulating layer 501, the etched surface of the light control pattern LCP, and the etched surface of the horizontal pattern 610' may coincide with each other (e.g., may be aligned). Fig.19D The height H2 of the first insulating layer 501 after the etching shown in Fig.19D may be equal to or less than Fig.19C the height H1 of the first insulating layer 501 before the etching shown in Fig.19C .

[0260] As Fig.19E As shown in Fig.19E , a second insulating layer 510 covering the light control pattern LCP, the horizontal pattern 610', and the first insulating layer 501 may be arranged over the substrate 410. The second insulating layer 510 may include an organic insulating layer. The second insulating layer 510 may include the same material as the material of the first insulating layer 501.

[0261] The display panel 400h and the color control member 100 may be aligned such that the pixel region PA and the light-blocking region BA of the substrate 410 respectively correspond to the pixel region PA and the light-blocking region BA of the color control member 100, and then the display panel 400h and the color control member 100 may be bonded.

[0262] According to the exemplary embodiment of the present invention, by using a spin coating method or an inkjet method, it is not necessary to use Figure 6CThe photolithography process using a mask as shown, and thus there is no limitation on the process dispersion caused by mask alignment errors. Therefore, the area of the intermediate layer 433 (or the area of the organic emission layer) can be expanded by the area corresponding to the second non-inclined portion, thereby increasing the aperture ratio. As the resolution of the display device increases, the effect of the increased aperture ratio also increases.

[0263] Fig. 20 The cross-section taken along line I-I' of a display device according to an exemplary embodiment of the present invention is shown. Figure 1 of the display device.

[0264] Referring to Fig. 20 , the display device 10I according to an exemplary embodiment of the present invention may include a display panel 400i and a color control member 100. The first pixel circuit 420a, the second pixel circuit 420b, and the third pixel circuit 420c of the first pixel PX1, the second pixel PX2, and the third pixel PX3 may be arranged in the pixel circuit layer 420 of the display panel 400i, respectively. The light-emitting elements 430 may be arranged on the pixel circuit layer 420 corresponding to the first pixel region PA1, the second pixel region PA2, and the third pixel region PA3 of the color control member 100. A packaging layer 440 may be arranged on the light-emitting elements 430.

[0265] A light control layer 450i may be arranged on the packaging layer 440. The light control layer 450i may include a first insulating layer 501 and a light control pattern LCP. Among them, the first insulating layer 501 has an insulating pattern 501a located in the pixel region PA of the substrate 410, and the light control pattern LCP is located in the light-blocking region BA of the substrate 410 and arranged between the insulating patterns 501a. The light control layer 450i may further include a horizontal pattern 610' located on the light control pattern LCP. The light control layer 450i may further include a second insulating layer 510 covering the light control pattern LCP. The light control pattern LCP may include a reflective pattern 502' and a light-blocking pattern 504.

[0266] Since Fig. 20 the insulating pattern 501a shown in Figure 7 is the same as the insulating pattern 501a shown in

[0267] Fig. 20 , its detailed description may be omitted. Figure 7 The difference between the light control pattern LCP shown in Fig. 20 and the light control pattern LCP shown in

[0268] The light control pattern LCP may be arranged to correspond to the light-blocking region BA of the color control member 100. The light control pattern LCP may include an inclined portion arranged on the side surface 51 of the opening OP2 (or the side surface of the insulating pattern 501a). The inner angle of the insulating pattern 501a and the angle formed by the inclined portion of the light control pattern LCP and an axis parallel to the upper surface of the encapsulation layer 440 may be referred to as the first angle θ. The light control pattern LCP may include a first non-inclined portion arranged on the bottom surface of the opening OP2.

[0269] The horizontal pattern 610' may also be arranged on the light control pattern LCP. For example, the horizontal pattern 610' may fill the opening OP2. The horizontal pattern 610' may include a photosensitive organic material, such as an acrylic resin, BCB, PI, and / or novolak resin. The photosensitive organic material may be a negative photosensitive material or a positive photosensitive material.

[0270] The upper surface of the insulating pattern 501a, the upper surface of the light control pattern LCP, and the upper surface of the horizontal pattern 610' may be on the same plane IP and may be a planarized upper surface.

[0271] FIG. 21A to FIG. 21C is shown Fig. 20 the steps in the manufacturing process of the display device 10I shown in

[0272] As Fig. 8A shown in, a light-blocking material layer may be formed above the substrate 410 on which the light-emitting element 430, the pixel defining layer 437 between the light-emitting elements 430, and the encapsulation layer 440 are formed, and then a light-blocking pattern 504 may be formed in the light-blocking region BA of the substrate 410 by patterning the light-blocking material layer. As Figure 8B shown in, the insulating pattern 501a may be formed by forming a first insulating layer 501 on the light-blocking pattern 504 and then forming an opening OP2 in the first insulating layer 501. As Figure 8C shown in, a reflective material layer 502L may be deposited above the substrate 410 while covering the first insulating layer 501 and the light-blocking pattern 504.

[0273] Subsequently, as Fig.21A shown in, a photoresist 600' may be arranged in the opening OP2 in which the reflective material layer 502L is arranged by spin coating or inkjet dropping. The photoresist 600' may include a low-viscosity photosensitive material.

[0274] Then, as Fig. 21BAs shown, the reflective material layer 502L can be etched so that the upper surface of the first insulating layer 501, the upper surface of the light control pattern LCP (e.g., the reflective pattern 502'), and the upper surface of the photoresist 600' are located on the same plane IP. The etching can be wet etching or dry etching. After the etching, the photoresist 600' in the opening OP2 can be provided as a horizontal pattern 610'. The etched surfaces of the insulating pattern 501a, the light control pattern LCP, and the horizontal pattern 610' can coincide with each other (e.g., can be aligned). Fig. 21B The height H2 of the first insulating layer 501 after the etching shown in Fig.21A can be equal to or less than the height H1 of the first insulating layer 501 before the etching shown in

[0275] As Fig. 21C shown, a second insulating layer 510 covering the light control pattern LCP, the horizontal pattern 610', and the first insulating layer 501 can be arranged above the substrate 410. The second insulating layer 510 can include an organic insulating layer. The second insulating layer 510 can include the same material as the material of the first insulating layer 501.

[0276] The display panel 400i and the color control member 100 can be aligned so that the pixel region PA and the light-blocking region BA of the substrate 410 respectively correspond to the pixel region PA and the light-blocking region BA of the color control member 100, and then the display panel 400i and the color control member 100 can be bonded together.

[0277] Fig. 22 shows a cross-section taken along line I-I' of a display device according to an exemplary embodiment of the present invention Figure 1 of.

[0278] Referring to Fig. 22 , a display device 10J according to an exemplary embodiment of the present invention can include a display panel 400j and a color control member 100. The first pixel circuits 420a, 420b, and 420c of the first pixel PX1, the second pixel PX2, and the third pixel PX3 can be respectively arranged in the pixel circuit layer 420 of the display panel 400j. The light-emitting elements 430 can be arranged on the pixel circuit layer 420 to correspond to the first pixel region PA1, the second pixel region PA2, and the third pixel region PA3 of the color control member 100. A packaging layer 440 can be arranged on the light-emitting elements 430.

[0279] A light control layer 450j may be arranged on the encapsulation layer 440. The light control layer 450j may include a first insulating layer 501 and a light control pattern LCP. Among them, the first insulating layer 501 has an insulating pattern 501a in the pixel region PA of the substrate 410, and the light control pattern LCP is located in the light-blocking region BA of the substrate 410 and arranged between the insulating patterns 501a. The light control layer 450j may further include a second insulating layer 510 covering the light control pattern LCP.

[0280] The insulating pattern 501a may be arranged to correspond to the first pixel region PA1, the second pixel region PA2, and the third pixel region PA3 of the color control member 100. The first insulating layer 501 may have an opening OP6 surrounding the insulating pattern 501a and corresponding to the light-blocking region BA of the color control member 100. The insulating pattern 501a may overlap with the light-emitting element 430. The inner angle formed between the side surface and the lower surface (or a surface parallel to the lower surface) of the insulating pattern 501a may be a first angle θ. The insulating pattern 501a may have a tapered structure. The opening OP6 may have an inverted tapered structure with respect to the tapered structure of the insulating pattern 501a.

[0281] The light control pattern LCP may be arranged to correspond to the light-blocking region BA of the color control member 100. The light control pattern LCP may at least partially surround the insulating pattern 501a and may be located in the opening OP6. The light control pattern LCP may include a pair of inclined portions arranged on the side surface 53 (or the side surface of the insulating pattern 501a) of the opening OP6. Each of the pair of inclined portions may form a first angle θ with the upper surface of the encapsulation layer 440 (or the upper surface of the light-blocking pattern 524). The pair of inclined portions extend in a direction away from the upper surface of the substrate 410, and the distance between the inclined portions on the side closest to the substrate 410 is less than the distance between the inclined portions on the side away from the substrate 410. The light control pattern LCP may include a first non-inclined portion located between the pair of inclined portions arranged in the opening OP6. The light control pattern LCP may include a second non-inclined portion formed as the inclined portion extends to the upper surface of the insulating pattern 501a adjacent to the opening OP6. Considering the process dispersion caused by mask alignment in the manufacturing process, each of the second non-inclined portions may extend to the upper surface of the insulating pattern 501a outside the opening OP6 with a length L.

[0282] The light control pattern LCP may include a reflective pattern 522, a light-blocking pattern 524, and a support pattern 525. The reflective pattern 522 and the support pattern 525 may be arranged on the side surface and the bottom surface of the opening OP6. The light-blocking pattern 524 may be arranged on the bottom surface of the opening OP6.

[0283] The support pattern 525 may be in direct contact with the upper surface of the light-blocking pattern 524 exposed by the opening OP6 and the side surface of the insulating pattern 501a. The reflective pattern 522 may include a reflective material. The light-blocking pattern 524 may include a light-blocking material. The light-blocking material may include a light-absorbing material. The light-absorbing material may include a metal oxide, such as AlO x , CrO x , CuO x , MoO x , TiO x , AlNdO x , CuMoO x , MoTaO x , MoTiO x or the like. The light-blocking pattern 524 may include an opaque inorganic insulating material or an opaque organic insulating material such as a black resin. The light-blocking pattern 524 may have various colors including black or white. In the case where the light-blocking pattern 524 is black, the light-blocking pattern 524 may include a black matrix. In the case where the light-blocking pattern 524 is white, the light-blocking pattern 524 may include an organic insulating material such as white resin.

[0284] The support pattern 525 may include an inorganic material such as silicon nitride (SiN x ). The support pattern 525 may be arranged below the reflective pattern 522. For example, the support pattern 525 may be arranged between the reflective pattern 522 and the light-blocking pattern 524.

[0285] The first pattern including the reflective pattern 522 and the support pattern 525 including the light control pattern LCP may include an inclined portion and a first non-inclined portion and a second non-inclined portion. The light-blocking pattern 524 of the light control pattern LCP may be arranged below the first non-inclined portion of the reflective pattern 522 of the first pattern. The light-blocking pattern 524 may be in direct contact with the upper surface of the encapsulation layer 440. The edge of the light-blocking pattern 524 may be covered by the insulating pattern 501a. The support pattern 525 of the first pattern may be in direct contact with the upper surface of the light-blocking pattern 524 and the side surface of the insulating pattern 501a. The support pattern 525 may serve as a support member for supporting the shape of the reflective pattern 522. For example, the support pattern 525 may be arranged between the inclined portion of the insulating pattern 501a and the inclined portion of the reflective pattern 522, and at the bottom of the opening OP6 between the non-inclined light-blocking pattern 524 and the first non-inclined portion of the reflective pattern 522.

[0286] The reflective pattern 522 may reflect a part of the light emitted from the light-emitting element 430 to an adjacent pixel region PA. The light reflected by the reflective pattern 522 may be incident on the first color conversion layer 150 or the second color conversion layer 160 or the transmissive layer 170 of the pixel region PA. The light-blocking pattern 524 may absorb a part of the light emitted from the light-emitting element 430 to an adjacent pixel region PA.

[0287] FIG. 23A to FIG. 23F shows the Fig. 22 steps in the manufacturing process of the display device 10J shown in

[0288] As Fig.23A shown in , an opaque material layer can be formed above the substrate 410 on which the light-emitting element 430, the pixel defining layer 437 between the light-emitting elements 430, and the encapsulation layer 440 are formed, and then the opaque material layer can be patterned to form an opaque pattern 524. The opaque pattern 524 can overlap with the pixel defining layer 437 and can be arranged in the light-blocking region BA of the substrate 410. The opening 524OP of the opaque pattern 524 can be formed to completely surround the opening 437OP of the pixel defining layer 437. The width BW of the opening 524OP of the opaque pattern 524 can be equal to or greater than the width EW of the opening 437OP of the pixel defining layer 437.

[0289] As Fig. 23B shown in , a first insulating layer 501 can be formed on the opaque pattern 524, and then an opening OP6 penetrating the first insulating layer 501 can be formed to form an insulating pattern 501a. The first insulating layer 501 can include an organic insulating layer. The opening OP6 can completely surround the opening 437OP of the pixel defining layer 437 and can be located in the light-blocking region BA of the substrate 410. The opening OP6 can expose the upper surface of the opaque pattern 524. The insulating pattern 501a can overlap with the light-emitting element 430 (e.g., the pixel electrode 431). The insulating pattern 501a can overlap with the opening 437OP of the pixel defining layer 437, and the inner width IW of the insulating pattern 501a can be equal to or greater than the width EW of the opening 437OP of the pixel defining layer 437.

[0290] As Fig.23C shown in , an inorganic material layer 525L and a reflective material layer 522L can be sequentially deposited on the first insulating layer 501 including the insulating pattern 501a.

[0291] Subsequently, as Fig.23D shown in , a photoresist 600 can be applied to cover the inorganic material layer 525L and the reflective material layer 522L, and the photoresist 600 can be UV-exposed and developed using an aligned mask M, and thus, the portion of the photoresist 600 corresponding to the light-transmitting portion M2 can be removed, and only the portion of the photoresist 600 corresponding to the light-blocking portion M1 can be retained.

[0292] Next, as Fig.23EAs shown, the inorganic material layer 525L and the reflective material layer 522L in the area where the photoresist 600 is removed can be etched to form the support pattern 525 and the reflective pattern 522. The etching can be wet etching or dry etching. In the etching process of removing a part of the inorganic material layer 525L and the reflective material layer 522L, a part of the upper portion of the first insulating layer 501 can be removed by over-etching. The etched surfaces (e.g., side surfaces) of the reflective material layer 522L corresponding to the opening 522OP and the etched surfaces (e.g., side surfaces) of the inorganic material layer 525L corresponding to the opening 525OP can coincide with each other (e.g., can be aligned). The opening LOP of the light control pattern LCP can include the opening 522OP of the reflective material layer 522L and the opening 525OP of the inorganic material layer 525L. The width of the opening 522OP of the reflective material layer 522L (i.e., the width LW of the opening LOP of the light control pattern LCP) can be equal to or greater than the width EW of the opening 437OP of the pixel defining layer 437. Thereafter, the photoresist 600 remaining on the light control pattern LCP can be removed.

[0293] Next, as Fig.23F shown, a second insulating layer 510 covering the light control pattern LCP and the first insulating layer 501 including the insulating pattern 501a can be arranged above the substrate 410. The second insulating layer 510 can include an organic insulating layer. The second insulating layer 510 can include the same material as that of the first insulating layer 501.

[0294] The display panel 400j and the color control member 100 can be aligned such that the pixel region PA and the light-blocking region BA of the substrate 410 respectively correspond to the pixel region PA and the light-blocking region BA of the color control member 100, and then the display panel 400j and the color control member 100 can be bonded.

[0295] Fig.24 shows a cross-section taken along line I-I' of a display device according to an exemplary embodiment of the present invention. Figure 1

[0296] Referring to Fig.24 , a display device 10K according to an exemplary embodiment of the present invention can include a display panel 400k and a color control member 100. A light control layer 450k can be arranged on the encapsulation layer 440.

[0297] Fig.24 The exemplary embodiment of the present invention shown in Fig. 22The exemplary embodiment of the present invention shown in FIG. is different in that the light control pattern LCP of the light control layer 450k does not include a support pattern 525, but only includes a reflection pattern 522 and a light blocking pattern 524. For example, the inner surface of the opening OP6 may be filled only with the reflection pattern 522, and the light blocking pattern 524 may be a flat portion at the bottom of the opening OP6 disposed between the encapsulation layer 440 and the portion of the reflection pattern 522 covering the bottom of the opening OP6. Since other layouts are the same as those of the embodiments of Fig. 22 and Figure 7 , the detailed description thereof may be omitted.

[0298] Fig.25 FIG. shows a cross-section taken along line I-I' of a Figure 1 display device according to an exemplary embodiment of the present invention.

[0299] Referring to Fig.25 , a display device 10L according to an exemplary embodiment of the present invention may include a display panel 400l and a color control member 100. First pixel circuits 420a, second pixel circuits 420b, and third pixel circuits 420c of a first pixel PX1, a second pixel PX2, and a third pixel PX3 may be arranged in a pixel circuit layer 420 of the display panel 400l, respectively. Light emitting elements 430 may be arranged on the pixel circuit layer 420 corresponding to a first pixel region PA1, a second pixel region PA2, and a third pixel region PA3 of the color control member 100. An encapsulation layer 440 may be arranged on the light emitting elements 430.

[0300] A light control layer 450l may be arranged on the encapsulation layer 440. The light control layer 450l may include a light control pattern LCP located in a light blocking region BA of the substrate 410. The light control layer 450l may further include a second insulating layer 510, wherein the second insulating layer 510 covers the interior of a space (e.g., hole OP7) defined between inclined portions of the light control pattern LCP and the outer surface of the light control pattern LCP.

[0301] The light control pattern LCP can be arranged to correspond to the light-blocking region BA of the color control member 100. The light control pattern LCP can include a pair of inclined portions. Each of the pair of inclined portions can form a first angle θ with the upper surface of the encapsulation layer 440 (or a surface parallel to the upper surface). The pair of inclined portions extend in an inclined direction converging from the upper surface of the encapsulation layer 440 toward the planarization layer 190. For example, the distance between the inclined portions on the side closest to the substrate 410 is greater than the distance between the inclined portions on the side away from the substrate 410. The light control pattern LCP can include a first non-inclined portion located between the pair of inclined portions. The first non-inclined portion can have a hole OP7. The light control pattern LCP can include a second non-inclined portion, where the second non-inclined portion is formed on the encapsulation layer 440, connected to the inclined portion, and extends toward the opening OP8 in a first direction (e.g., the x direction). Considering process dispersion due to mask alignment in the manufacturing process, each of the second non-inclined portions can extend across the upper surface of the encapsulation layer 440 toward the opening OP8 with a length L. The opening OP8 can represent the opening between the second non-inclined portions of adjacent light control patterns LCP. In this case, although the hole and the opening are named separately, the hole and the opening correspond to through holes formed to penetrate the upper and lower surfaces of the component in different sizes.

[0302] The light control pattern LCP can include a first pattern and a light-blocking pattern 524. The first pattern can include a reflective pattern 522 and a support pattern 525. The first pattern of the light control pattern LCP can include an inclined portion and a first non-inclined portion and a second non-inclined portion. The first pattern can have at least one hole OP7 in its central portion. The first pattern can have a tapered structure. The light-blocking pattern 524 of the light control pattern LCP can be arranged in the space defined by the first pattern. The light-blocking pattern 524 can be in direct contact with the upper surface of the encapsulation layer 440. The side surface of the light-blocking pattern 524 can be in direct contact with the inner surface of the first pattern (e.g., the support pattern 525).

[0303] The reflective pattern 522 can include a reflective material. The light-blocking pattern 524 can include a light-blocking material. The light-blocking pattern 524 can include an opaque inorganic insulating material and / or an opaque organic insulating material such as a black resin. The support pattern 525 can include an inorganic material such as silicon nitride (SiN x )). The support pattern 525 can be arranged below the reflective pattern 522. The support pattern 525 can be used as a support member for supporting the shape of the reflective pattern 522.

[0304] FIG. 26A to FIG. 26F Shows Fig.25 Steps in the manufacturing process of the display device 10L shown in

[0305] As Fig.26AAs shown, a first insulating layer may be formed over a substrate 410 on which a light-emitting element 430, a pixel defining layer 437 between the light-emitting elements 430, and a encapsulation layer 440 are formed, and then an opening OP8 penetrating the first insulating layer may be formed, thereby forming an insulating pattern 511. The first insulating layer may include an organic insulating layer. The opening OP8 may expose the upper surface of the encapsulation layer 440 and the side surface of the insulating pattern 511. The opening OP8 may be located in a pixel region PA of the substrate 410. The insulating pattern 511 may be located in a light-blocking region BA of the substrate 410, may completely surround an opening 437OP of the pixel defining layer 437, and may overlap with the pixel defining layer 437 (e.g., a pixel defining pattern of the pixel defining layer). An inner angle of the insulating pattern 511 may be a first angle θ. The opening OP8 of the first insulating layer may overlap with the opening 437OP of the pixel defining layer 437. A width IW' of the opening OP8 of the first insulating layer may be equal to or greater than a width EW of the opening 437OP of the pixel defining layer 437. The insulating pattern 511 may have a tapered structure in which a distance (width) between opposite sides of the insulating pattern 511 gradually decreases as it moves away from the encapsulation layer 440. A cross-section of the insulating pattern 511 may have a substantially trapezoidal shape. The opening OP8 may have an inverted tapered structure with respect to the insulating pattern 511.

[0306] As Fig.26B shown, an inorganic material layer 525L and a reflective material layer 522L may be sequentially deposited on the first insulating layer including the insulating pattern 511.

[0307] Subsequently, as Fig.26C shown, a photoresist 620 may be applied to cover the inorganic material layer 525L and the reflective material layer 522L, and the photoresist 620 may be UV-exposed and developed using an aligned mask M, and thus, portions of the photoresist 620 corresponding to light-transmitting portions M21 and M22 may be removed, and only portions of the photoresist 620 corresponding to a light-blocking portion M1 may be retained.

[0308] Next, as Fig.26DAs shown in the figure, the inorganic material layer 525L and the reflective material layer 522L in the area where the photoresist 620 is removed can be etched to form a first pattern with holes OP7. The etching can be wet etching or dry etching. The photoresist 620 remaining on the first pattern can be removed. The insulating pattern 511 covered by the first pattern in the first pattern can be removed through the holes OP7 of the first pattern. The insulating pattern 511 can be removed by a developing process, and an air gap AG can be formed in the space where the insulating pattern 511 exists. The internal space (e.g., air gap AG) of the first pattern can have the shape of the insulating pattern 511. The etched surfaces (e.g., side surfaces) of the reflective material layer 522L corresponding to the openings 522OP and the etched surfaces (e.g., side surfaces) of the inorganic material layer 525L corresponding to the openings 525OP can coincide with each other (e.g., can be aligned). The openings LOP of the light control pattern LCP can include the openings 522OP of the reflective material layer 522L and the openings 525OP of the inorganic material layer 525L. The width LW of the openings LOP of the light control pattern LCP can be equal to or greater than the width EW of the openings 437OP of the pixel defining layer 437. The width OW of the holes OP7 can be about 1 μm to 3 μm.

[0309] Next, a light-blocking material can be applied over the entire surface of the substrate 410. In this case, the light-blocking material can be injected into the air gap AG of the first pattern through the holes OP7 of the first pattern. Thereafter, as Fig.26E shown in the figure, only a part of the light-blocking material can be retained in the air gap AG of the first pattern, and the other parts of the light-blocking material can be removed, and thus a light-blocking pattern 524 can be provided in the air gap AG of the first pattern.

[0310] Next, as Fig.26F shown in the figure, a second insulating layer 510 that fills the air gap AG of the first pattern while covering the light control pattern LCP can be arranged on the substrate 410. The second insulating layer 510 can include an organic insulating layer. The second insulating layer 510 can include the same material as the material of the first insulating layer that forms the insulating pattern 511.

[0311] The display panel 400l and the color control member 100 can be aligned such that the pixel regions PA and the light-blocking regions BA of the substrate 410 respectively correspond to the pixel regions PA and the light-blocking regions BA of the color control member 100, and then the display panel 400l and the color control member 100 can be bonded together.

[0312] Figure 27 The cross-section taken along line I-I' of a display device according to an exemplary embodiment of the present invention is shown. Figure 1

[0313] Referring to Figure 27, the display device 10M according to an exemplary embodiment of the present invention may include a display panel 400m and a color control member 100. A light control layer 450m may be arranged on the encapsulation layer 440.

[0314] Figure 27 The exemplary embodiment of Figure 25 The exemplary embodiment of is different in that the light control pattern LCP of the light control layer 450m has an inverted conical "z" - shaped structure in which the width in the first direction (e.g., the x - direction) between each of a pair of inclined portions gradually increases in the third direction (e.g., the z - direction) from the encapsulation layer 440 toward the planarization layer 190. The light control pattern LCP may include a first pattern, where the first pattern includes a reflection pattern 522', a support pattern 525', and a light - blocking pattern 524'. The first pattern may include inclined portions and a first non - inclined portion and a second non - inclined portion. A hole OP7' may be provided on the first pattern. The support pattern 525' may be arranged below the reflection pattern 522'. The light - blocking pattern 524' may be arranged in the space defined by the first pattern (e.g., between the inclined portions of a pair of inclined portions) and may be in direct contact with the upper surface of the encapsulation layer 440.

[0315] Figure 27 The exemplary embodiment of is different in that after forming the first insulating layer in the Figure 26A process, the first insulating layer is patterned such that the inner angle of the insulating pattern 511 is an obtuse angle. For example, contrary to the Figure 26A exemplary embodiment of, the distance in the first direction (e.g., the width in the x - direction) between opposite sides of the insulating pattern 511 may gradually increase in the direction away from the encapsulation layer 440 toward the planarization layer 190. The opening OP9 of the first insulating layer may overlap with the opening 437OP of the pixel - defining layer 437. The width IW' of the opening OP9 of the first insulating layer may be equal to or greater than the width EW of the opening 437OP of the pixel - defining layer 437. The width IW' of the opening OP9 may be defined as the width of the upper surface of the opening OP9 in the first direction (e.g., the x - direction), and the upper surface has the smallest area in the opening OP9. The distance (or width) in the first direction (e.g., the x - direction) between opposite sides of the opening OP9 may gradually decrease in the third direction (e.g., the z - direction) away from the encapsulation layer 440 toward the planarization layer 190. Other layouts are the same as those in the Figure 25 embodiment of, and thus their detailed descriptions may be omitted.

[0316] The above exemplary embodiment of the present invention is an example in which one light control pattern LCP is provided in the light-blocking region BA of the substrate 410. In another exemplary embodiment of the present invention, one or more light control patterns LCP may be provided in the light-blocking region BA of the substrate 410. In this case, each of the light control patterns LCP may correspond to Figures 5 to 27 any one of the light control patterns LCP of the embodiment shown in

[0317] Figures 28 to 30 FIG. shows a cross-section taken along line I-I' of a display device according to an exemplary embodiment of the present invention Figure 1 .

[0318] Figure 28 The display device 10N shown in the exemplary embodiment of Figure 28 may include a display panel 400n and a color control member 100. A light control layer 450n may be arranged on the encapsulation layer 440. Figure 28 The exemplary embodiment of Figure 5 is different from the exemplary embodiment of Figure 5 in that four light control patterns LCP are provided in each light-blocking region BA of the substrate 410 between the light-emitting elements 430 (e.g., pixel electrodes 431). The cross-sectional width of the light control pattern LCP in the first direction (e.g., x direction), the distance between the light control patterns LCP in the first direction (e.g., x direction), and the number of the light control patterns LCP may vary according to the size of the light-blocking region BA. Other layouts are the same as those shown and described in the exemplary embodiment of Figure 5 , and thus their detailed descriptions may be omitted.

[0319] Figure 29 The display device 10P shown in Figure 29 may include a display panel 400p and a color control member 100. A light control layer 450p may be arranged on the encapsulation layer 440. Figure 29 The exemplary embodiment of Figure 22 is different from the exemplary embodiment of Figure 22 in that four light control patterns LCP are provided in the light-blocking region BA of the substrate 410 between the light-emitting elements 430 or pixel electrodes 431. Other layouts are the same as those in the exemplary embodiment of Figure 22 , and thus their detailed descriptions may be omitted.

[0320] Figure 30 The display device 10Q shown in Figure 30 may include a display panel 400q and a color control member 100. A light control layer 450q may be arranged on the encapsulation layer 440. Figure 30 The exemplary embodiment of Figure 25The exemplary embodiment is different in that three light control patterns LCP are provided in the light-blocking region BA of the substrate 410 between the light-emitting elements 430 (e.g., pixel electrodes 431). The cross-sectional width of the light control pattern LCP in the first direction (e.g., the x direction), the distance between the light control patterns LCP in the first direction (e.g., the x direction), and the number of the light control patterns LCP may vary according to the size of the light-blocking region BA. For example, two light control patterns LCP overlapping with the opposite edges of the pixel defining pattern may jointly have the same width as the width of the light-blocking member 120. However, the central light control pattern LCP arranged between the outermost light control patterns LCP may have a greater width in the first direction (e.g., the x direction) than any one of the outermost light control patterns LCP. Other layouts are the same as those in the Figure 25 exemplary embodiment, and thus their detailed descriptions may be omitted.

[0321] Figure 31 FIG. 6 is a cross-sectional view of a part of a display device 10R according to an exemplary embodiment of the present invention.

[0322] Referring to Figure 31 , a display device 10R according to an exemplary embodiment of the present invention may include a display panel 400r and a color control member 100'.

[0323] The color control member 100' may include a light-blocking member 120', a color filter layer 130', a first color conversion layer 150', and a second color conversion layer 160'. After the process of forming the display panel 400r, the color control member 100' may be directly formed on the display panel 400r. Hereinafter, descriptions that are the same as those of the color control member 100 described with reference to Figure 2A , Figure 2B and Figure 3 may be omitted.

[0324] The color control member 100' may include a first pixel region PA1, a second pixel region PA2, and a third pixel region PA3 that are spaced apart from each other, and a light-blocking region BA located between the first pixel region PA1, the second pixel region PA2, and the third pixel region PA3. A first color conversion layer 150' is arranged in the first pixel region PA1 and converts incident light Lib into light Lr of a first color. A second color conversion layer 160' is arranged in the second pixel region PA2 and converts incident light Lib into light Lg of a second color. The first color conversion layer 150' and the second color conversion layer 160' may have edge portions that overlap with the light-blocking member 120' in a third direction (e.g., the z direction). For example, the color filter layer 130' may be disposed in a layer different from the light-blocking member 120'. The light-blocking member 120' may have a substantially rectangular shape each having an upper surface coplanar with the upper surfaces of the first color conversion layer 150' and the second color conversion layer 160'.

[0325] The color control member 100' may further include a transmissive layer 170'. The color control member 100' may further have a third pixel region PA3 spaced apart from the first pixel region PA1 and the second pixel region PA2. The transmissive layer 170' may be arranged in the third pixel region PA3 and may transmit incident light Lib.

[0326] The color control member 100' may receive incident light Lib and emit light Lr of a first color, light Lg of a second color, and light Lb of a third color.

[0327] The pixel regions PA emit light and are surrounded by the light-blocking region BA. The pixel regions PA may be divided into a first pixel region PA1, a second pixel region PA2, and a third pixel region PA3 according to the color of the emitted light. The light-blocking region BA is a region that does not emit light and may be arranged in a mesh layout between the first pixel region PA1, the second pixel region PA2, and the third pixel region PA3.

[0328] The light-blocking member 120' may be arranged in the light-blocking region BA. The light-blocking member 120' may be located between the first color conversion layer 150', the second color conversion layer 160', and the transmissive layer 170' in the horizontal direction and may thus serve as a partition wall.

[0329] The color filter layer 130' may include an organic material pattern containing dyes and / or pigments. The color filter layer 130' may include a first color filter layer 130a', a second color filter layer 130b', and a third color filter layer 130c'. The first color filter layer 130a' may be arranged in at least a first pixel region PA1, the second color filter layer 130b' may be arranged in at least a second pixel region PA2, and the third color filter layer 130c' may be arranged in at least a third pixel region PA3. In an exemplary embodiment of the present invention, the light-blocking member 120' may also be provided between the first color filter layer 130a', the second color filter layer 130b', and the third color filter layer 130c'.

[0330] The first color conversion layer 150', the second color conversion layer 160', and the transmissive layer 170' may each be formed in the space defined by the light-blocking member 120' by using an inkjet method.

[0331] The color control member 100' may further include an inorganic layer 112 and a protective layer 114 on the color filter layer 130'. The inorganic layer 112 may include a single layer or multiple layers containing inorganic materials such as SiN x and / or SiO x The inorganic layer 112 may be omitted. The protective layer 114 may include a transparent organic material such as a polyimide resin, an acrylic resin, and / or a resist material. In an exemplary embodiment of the present invention, the protective layer 114 may include a single layer or multiple layers containing the same inorganic material as the inorganic layer 112.

[0332] A planarization layer may also be included between the color control member 100' and the display panel 400r.

[0333] The display panel 400r includes a plurality of pixels PX arranged in a predetermined pattern in a first direction (e.g., the x direction or the row direction) and a second direction (e.g., the y direction or the column direction) in a display area DA. The plurality of pixels may include a first pixel PX1, a second pixel PX2, and a third pixel PX3. The first pixel PX1 may include a light-emitting element 430 and a first pixel circuit 420a for controlling the light-emitting element 430, the second pixel PX2 may include a light-emitting element 430 and a second pixel circuit 420b for controlling the light-emitting element 430, and the third pixel PX3 may include a light-emitting element 430 and a third pixel circuit 420c for controlling the light-emitting element 430. Hereinafter, descriptions identical to those of the display panel 400 described with reference to Figure 4A and Figure 4B may be omitted.

[0334] The first pixel circuit 420a, the second pixel circuit 420b, and the third pixel circuit 420c of the first pixel PX1, the second pixel PX2, and the third pixel PX3 may be respectively arranged in the pixel circuit layer 420 of the display panel 400r. The light-emitting elements 430 may be arranged on the pixel circuit layer 420 corresponding to the first pixel region PA1, the second pixel region PA2, and the third pixel region PA3 of the color control member 100' (e.g., the first pixel region PA1, the second pixel region PA2, and the third pixel region PA3 of the substrate 410).

[0335] Each of the light-emitting elements 430 may include a pixel electrode 431, an intermediate layer 433, and a counter electrode 435. The edge of the pixel electrode 431 may be covered by a pixel defining layer 437 (e.g., a pixel defining pattern). The pixel defining layer 437 may be arranged corresponding to the light-blocking region BA of the color control member 100'.

[0336] A light control pattern LCP may be arranged between the light-emitting elements 430 (i.e., in a region corresponding to the light-blocking region BA of the color control member 100'). The light control pattern LCP may surround the light-emitting elements 430 and be directly arranged on the pixel defining layer 437 to overlap with the pixel defining layer 437. The light control pattern LCP may be covered by the counter electrode 435 of the light-emitting element 430. For example, the exposed surfaces of the light control pattern LCP and the pixel defining pattern may be covered by the counter electrode 435 conforming to their collective shape. An encapsulation layer 440' may be arranged on the counter electrode 435.

[0337] The light control pattern LCP may include a reflection pattern 532 and a support pattern 535. The light control pattern LCP may include a first non-inclined portion in contact with the upper surface of the pixel defining layer 437 (e.g., the pixel defining pattern), an inclined portion having an inclined surface away from the pixel defining layer 437, and a second non-inclined portion extending from the inclined portion to the pixel region PA.

[0338] The reflection pattern 532 may include a reflective material. The reflective material may include a metal having a high light reflectivity. The support pattern 535 may include an inorganic material such as SiN x . The support pattern 535 may be arranged below the reflection pattern 532.

[0339] According to this exemplary embodiment of the present invention, the light control pattern LCP is arranged on the pixel defining layer 437 (e.g., the pixel defining pattern), thereby eliminating the need for a separate light-blocking pattern on the display panel. By reducing the light path along the third direction (e.g., the z direction) while reducing the absorbance at the light-blocking component 120' of the color control member 100', the amount of light incident on the first color conversion layer 150' or the second color conversion layer 160' and the color filter layer 130' can be increased.

[0340] Figures 32A to 32F shows the Figure 31 steps in the manufacturing process of the display device 10R shown in an exemplary embodiment of

[0341] The pixel circuit layer 420 may be formed on the substrate 410, and the pixel electrodes 431 may be arranged on the pixel circuit layer 420 corresponding to the pixel regions PA of the color control member 100'. The pixel electrodes 431 may be exposed through the openings 437OP of the pixel defining layer 437, and the edges of the pixel electrodes 431 may be covered by the pixel defining layer 437. The pixel defining layer 437 may be arranged corresponding to the light-blocking regions BA of the color control member 100'.

[0342] As Figure 32A shown, a first insulating layer 521 may be formed over the substrate 410 on which the pixel electrodes 431 and the pixel defining layer 437 are formed, and then an opening OP10 may be formed in the first insulating layer 521 to form an insulating pattern 521a. The first insulating layer 521 may include an organic insulating layer. The opening OP10 may surround the insulating pattern 521a and may be located in the light-blocking region BA of the substrate 410. The opening OP10 may completely surround the opening 437OP of the pixel defining layer 437 and may expose the upper surface of the pixel defining layer 437. The insulating pattern 521a may be located in the pixel region PA of the substrate 410 and may overlap with the opening 437OP of the pixel defining layer 437 and cover the edges of the pixel electrodes 431 and the pixel defining layer 437. The inner width IW” of the insulating pattern 521a may be equal to or greater than the width EW of the opening 437OP of the pixel defining layer 437.

[0343] As Figure 32B shown, an inorganic material layer 535L and a reflective material layer 532L may be sequentially deposited over the substrate 410 while covering the opening OP10 and the first insulating layer 521 including the insulating pattern 521a.

[0344] Subsequently, as Figure 32C shown, a photoresist 630 may be applied to cover the inorganic material layer 535L and the reflective material layer 532L, and the photoresist 630 may be UV-exposed and developed using an aligned mask M. Accordingly, the portion of the photoresist 630 corresponding to the light-transmitting portion M2 may be removed, and only the portion of the photoresist 630 corresponding to the light-blocking portion M1 may be retained.

[0345] Next, as Figure 32DAs shown in [reference], the inorganic material layer 535L and the reflective material layer 532L in the area where the photoresist 630 has been removed can be etched to form the support pattern 535 and the reflective pattern 532. The etching can be wet etching or dry etching. The etched surfaces (e.g., side surfaces) of the reflective material layer 532L corresponding to the opening 532OP and the etched surfaces (e.g., side surfaces) of the inorganic material layer 535L corresponding to the opening 535OP can coincide with each other (e.g., be aligned). The opening LOP of the light control pattern LCP can include the opening 532OP of the reflective material layer 532L and the opening 535OP of the inorganic material layer 535L. The width LW of the opening LOP of the light control pattern LCP can be equal to or greater than the width EW of the opening 437OP of the pixel defining layer 437. Thereafter, the photoresist 630 and the insulating pattern 521a remaining on the light control pattern LCP can be removed.

[0346] Next, as Figure 32E shown in [reference], the intermediate layer 433 can be arranged on the pixel electrode 431, and the counter electrode 435 can be formed above the substrate 410 to cover the intermediate layer 433 and the light control pattern LCP.

[0347] As Figure 32F shown in [reference], the encapsulation layer 440' can be arranged above the substrate 410 while covering the counter electrode 435. For example, the encapsulation layer 440' can have a lower surface formed in a shape complementary to the counter electrode 435 and a flattened upper surface. Subsequently, as Figure 31 shown in [reference], the light-blocking member 120', the first color conversion layer 150', the second color conversion layer 160', the transmissive layer 170', the color filter layer 130', the inorganic layer 112, and the protective layer 114 can be formed to form the color control member 100' on the display panel 400r.

[0348] Figure 33 is a cross-sectional view of a part of the display device 10S according to an exemplary embodiment of the present invention.

[0349] Referring to Figure 33 , the display device 10S according to an exemplary embodiment of the present invention can include a display panel 400s and a color control member 100'.

[0350] The color control member 100' can include a light-blocking member 120', a color filter layer 130', a first color conversion layer 150', and a second color conversion layer 160'. The color control member 100' can be directly formed on the display panel 400s. Since the color control member 100' has been described with reference to Figure 31 , its detailed description can be omitted.

[0351] The display panel 400s includes a plurality of pixels PX arranged in a predetermined pattern in a first direction (e.g., the x direction or row direction) and a second direction (e.g., the y direction or column direction) in the display area DA. The plurality of pixels PX may include a first pixel PX1, a second pixel PX2, and a third pixel PX3. The first pixel PX1 may include a light-emitting element 430 and a first pixel circuit 420a for controlling the light-emitting element 430, the second pixel PX2 may include a light-emitting element 430 and a second pixel circuit 420b for controlling the light-emitting element 430, and the third pixel PX3 may include a light-emitting element 430 and a third pixel circuit 420c for controlling the light-emitting element 430. Hereinafter, the description identical to that of the display panel 400 described with reference to Figure 4A and Figure 4B may be omitted.

[0352] The first pixel circuit 420a, the second pixel circuit 420b, and the third pixel circuit 420c of the first pixel PX1, the second pixel PX2, and the third pixel PX3 may be respectively arranged in the pixel circuit layer 420 of the display panel 400s. The light-emitting elements 430 may be arranged on the pixel circuit layer 420 to correspond to a first pixel region PA1, a second pixel region PA2, and a third pixel region PA3 of the color control member 100' (e.g., the first pixel region PA1, the second pixel region PA2, and the third pixel region PA3 of the substrate 410).

[0353] Each of the light-emitting elements 430 may include a pixel electrode 431, an intermediate layer 433, and a counter electrode 435. The edge of the pixel electrode 431 may be covered by a pixel defining layer 437. The pixel defining layer 437 may be arranged to correspond to the light-blocking region BA of the color control member 100'.

[0354] A light control pattern LCP may be arranged between the light-emitting elements 430 (e.g., in a region corresponding to the light-blocking region BA of the color control member 100'). The light control pattern LCP may be arranged on the pixel defining layer 437 to overlap with the pixel defining layer 437 (e.g., the pixel defining pattern). The light control pattern LCP may be covered by the counter electrode 435 of the light-emitting element 430. A packaging layer 440' may be arranged on the counter electrode 435. An insulating pattern 521' may be arranged between the light control pattern LCP and the pixel defining layer 437. The insulating pattern 521' may be in contact with the upper surface of the pixel defining layer 437 and may have a width narrower than that of the pixel defining layer 437 in a first direction (e.g., the x direction). The insulating pattern 521' may have a width that becomes narrower in a direction away from the pixel defining layer 437 toward the color control member 100' (e.g., the z direction).

[0355] The light control pattern LCP can be arranged on the insulating pattern 521' while covering the insulating pattern 521'. The light control pattern LCP can include a reflective pattern 532' and a support pattern 535'. The light control pattern LCP can include a first non-inclined portion in contact with the upper surface of the insulating pattern 521' and an inclined portion in contact with the side surface of the insulating pattern 521'. The light control pattern LCP can be in contact with a part of the pixel defining layer 437 (e.g., pixel defining pattern). The light control pattern LCP may not completely cover the side surface of the pixel defining layer 437 and may not be in contact with the pixel electrode 431.

[0356] The reflective pattern 532' can include a reflective material. The reflective material can include a metal having a high light reflectivity. The support pattern 535' can include an inorganic material such as SiN x . The support pattern 535' can be arranged below the reflective pattern 532'.

[0357] According to this exemplary embodiment of the present invention, the light control pattern LCP is arranged on the pixel defining layer 437, thereby eliminating the need for a separate light blocking pattern on the display panel 400s, and by reducing the optical path along the third direction (e.g., z direction) and reducing the absorbance of the light blocking member of the color control member, the incident light amount can be increased.

[0358] Figures 34A to 34F is shown Figure 33 steps in the manufacturing process of the display device 10S shown in the exemplary embodiment of.

[0359] The pixel circuit layer 420 can be formed on the substrate 410, and the pixel electrode 431 can be arranged on the pixel circuit layer 420 corresponding to the pixel region PA of the color control member 100'. The pixel electrode 431 can be exposed through the opening 437OP of the pixel defining layer 437, and the edge of the pixel electrode 431 can be covered by the pixel defining layer 437. The pixel defining layer 437 can be arranged corresponding to the light blocking region BA of the color control member 100'.

[0360] such as Figure 34AAs shown in [the figure], a first insulating layer may be formed over a substrate 410 on which a pixel electrode 431 and a pixel defining layer 437 are formed, and then an opening OP11a may be formed in the first insulating layer, thereby forming an insulating pattern 521'. The first insulating layer may include an organic insulating layer. The opening OP11a may be located in a pixel region PA of the substrate 410. A width IW''' of the opening OP11a of the first insulating layer may be greater than a width EW of an opening 437OP of the pixel defining layer 437 that exposes an upper surface of the pixel electrode 431. The opening OP11 may include the opening OP11a of the first insulating layer and the opening 437OP of the pixel defining layer 437, and the opening OP11 may have a step due to the pixel defining layer 437 and the insulating pattern 521'. The insulating pattern 521' may be located on the pixel defining layer 437 (e.g., a pixel defining pattern).

[0361] In an exemplary embodiment of the present invention, layers forming the pixel defining layer 437 and the first insulating layer may be sequentially formed on the substrate 410 on which the pixel electrode 431 is formed, and the pixel defining layer 437 and the insulating pattern 521' may be formed using a halftone mask.

[0362] As Figure 34B shown in [the figure], an inorganic material layer 535L and a reflective material layer 532L may be sequentially deposited over the substrate 410 while covering the opening OP11 and the first insulating layer including the insulating pattern 521'.

[0363] Subsequently, as Figure 34C shown in [the figure], a photoresist 630' may be applied to cover the inorganic material layer 535L and the reflective material layer 532L, and the photoresist 630' may be UV-exposed and developed using an aligned mask M. Accordingly, a portion of the photoresist 630' corresponding to a light-transmitting portion M2 may be removed, and only a portion of the photoresist 630' corresponding to a light-blocking portion M1 may be retained.

[0364] Next, as Figure 34D shown in [the figure], the inorganic material layer 535L and the reflective material layer 532L in a region where the photoresist 630' has been removed may be etched, thereby forming a support pattern 535' and a reflective pattern 532'. The etching may be wet etching or dry etching. An etched surface (e.g., a side surface) of the reflective material layer 532L corresponding to an opening 532OP and an etched surface (e.g., a side surface) of the inorganic material layer 535L corresponding to an opening 535OP may coincide with each other (e.g., may be aligned). An opening LOP of a light control pattern LCP may include the opening 532OP of the reflective material layer 532L and the opening 535OP of the inorganic material layer 535L. A width LW of the opening LOP of the light control pattern LCP may be equal to or greater than the width EW of the opening 437OP of the pixel defining layer 437. Thereafter, the photoresist 630' remaining on the light control pattern LCP may be removed.

[0365] Next, as shown in Figure 34E , an intermediate layer 433 may be arranged on the pixel electrode 431, and a counter electrode 435 may be formed above the substrate 410 to cover the intermediate layer 433 and the light control pattern LCP.

[0366] As shown in Figure 34F , a packaging layer 440' may be arranged above the substrate 410 while covering the counter electrode 435. As shown in Figure 33 , a light-blocking member 120', a first color conversion layer 150', a second color conversion layer 160', a transmissive layer 170', a color filter layer 130', an inorganic layer 112, and a protective layer 114 may be formed to form a color control member 100' on the display panel 400s.

[0367] In the exemplary embodiments of Figure 31 and Figure 33 , the color control member 100' may include a first color conversion layer 150', a second color conversion layer 160', and a transmissive layer 170' and may emit light Lr of a first color, light Lg of a second color, and light Lb of a third color that are different with respect to a single incident light Lib. In an exemplary embodiment of the present invention, as shown in Figure 2C , the color control member 100' may not include a first color conversion layer 150', a second color conversion layer 160', and a transmissive layer 170' and may emit light Lr of a first color, light Lg of a second color, and light Lb of a third color that are different through the color filter layer 130 with respect to different incident lights Lir, Lig, and Lib.

[0368] Figures 35A to 36F Schematically shows the shape of the light control pattern LCP of the display panel 400 according to an exemplary embodiment of the present invention.

[0369] Referring to Figure 35A , the light control pattern LCP may be formed in a closed-loop shape around a light-emitting element 430 (e.g., a pixel electrode) in the light-blocking region BA of the substrate 410. For example, the light control pattern LCP may surround an emission region EA corresponding to the opening 437OP of the pixel defining layer 437.

[0370] In an exemplary embodiment of the present invention, the light control pattern LCP may be located on an insulating pattern IP (see Figure 4C) and in the opening of the insulating layer that corresponds to (e.g., overlaps) the pixel defining layer 437 and surrounds the opening of the insulating pattern IP. In an exemplary embodiment of the present invention, the light control pattern LCP may be located in an opening of an insulating layer having an opening corresponding to (e.g., overlapping) the light emitting element 430 and an insulating pattern IP corresponding to (e.g., overlapping) the pixel defining layer 437 and surrounding the opening (see Figure 4D ) on the insulating pattern IP of the insulating layer.

[0371] The light control pattern LCP may be provided in pixel units. In an exemplary embodiment of the present invention, as Figure 35B shown, the light control pattern LCP may be shared between adjacent pixels R, G, and B.

[0372] Referring to Figure 35C , in the light blocking region BA of the substrate 410, a plurality of linear light control patterns LCP may be spaced apart from each other and may be arranged along the edge of the emission region EA and surround the emission region EA.

[0373] In an exemplary embodiment of the present invention, the light control pattern LCP may be located in an opening of an insulating layer having an insulating pattern IP corresponding to (e.g., overlapping) the light emitting element 430 (see Figure 4C ) and an opening of the insulating layer corresponding to (e.g., overlapping) the pixel defining layer 437 and surrounding the insulating pattern IP and spaced apart from each other. In an exemplary embodiment of the present invention, the light control pattern LCP may be located on the insulating pattern IP of an insulating layer having an opening corresponding to (e.g., overlapping) the light emitting element 430 and an insulating pattern IP corresponding to (e.g., overlapping) the pixel defining layer 437 and surrounding the opening and spaced apart from each other (see Figure 4D ). The insulating pattern IP may have a linear shape.

[0374] The light control pattern LCP may be provided in pixel units. In an exemplary embodiment of the present invention, as Figure 35D shown, the light control pattern LCP may be shared between adjacent pixels R, G, and B.

[0375] Referring to Figure 35E , in the light blocking region BA of the substrate 410, a plurality of island-shaped light control patterns LCP may be spaced apart from each other and may surround the emission region EA.

[0376] In an exemplary embodiment of the present invention, the light control pattern LCP may be located in an insulating pattern IP corresponding to (e.g., overlapping) the light emitting element 430 (see Figure 4C) and in the openings of the insulating layer that correspond to (e.g., overlap with) the pixel defining layer 437 and surround the insulating pattern IP and are spaced apart from each other. In an exemplary embodiment of the present invention, the light control pattern LCP may be located on the insulating pattern IP of the insulating layer having an opening corresponding to (e.g., overlapping with) the light emitting element 430 and an insulating pattern IP corresponding to (e.g., overlapping with) the pixel defining layer 437 and surrounding the opening and spaced apart from each other (see Figure 4D ). The insulating pattern IP may have an island shape.

[0377] The light control pattern LCP may be provided in pixel units. In an exemplary embodiment of the present invention, as Figure 35F shown, the light control pattern LCP may be shared between adjacent pixels R, G, and B.

[0378] In an exemplary embodiment of the present invention, the light control pattern LCP may have at least one hole LCP_OP (see Figure 36A ).

[0379] As Figure 36A and Figure 36B shown, the light control pattern LCP may have a closed-loop shape surrounding the emission region EA corresponding to the opening 437OP of the pixel defining layer 437. As Figure 36A shown, the light control pattern LCP may have a structure in which one hole LCP_OP completely surrounds the emission region EA. For example, referring to Figure 36A , the inner light control pattern LCP may be disposed between the opening 437OP and the outer light control pattern LCP. The inner light control pattern LCP may be spaced apart from the emission region EA (e.g., the opening 437) by a first distance and may be spaced apart from the outer light control pattern LCP at the opposite side by a second distance.

[0380] And, as Figure 36B shown, the light control pattern LCP may have a structure in which a plurality of slit-shaped holes LCP_OP are spaced apart from each other and arranged along the edge of the emission region EA. And as Figure 36C shown, the light control pattern LCP may have a structure in which a plurality of holes LCP_OP are spaced apart from each other and surround the emission region EA along the edge of the emission region EA. For example, the plurality of slit-shaped holes may have a rectangular shape.

[0381] As Figure 36D shown, a plurality of linear-shaped light control patterns LCP may be spaced apart from each other and arranged along the edge of the emission region EA. For example, referring to Figure 36C , the slit-shaped holes may be substantially circular and may be arranged at a predetermined interval within the closed-line-shaped light control pattern LCP. As Figure 36DAs shown, the light control pattern LCP may include discrete closed-line rectangular rings corresponding to the side surfaces of the openings 437OP. A slit-shaped hole LCP_OP may be arranged in each of the plurality of light control patterns LCP.

[0382] As Figure 36E shown, the light control pattern LCP may include discrete solid rectangular shapes corresponding to the side surfaces of the openings 437OP. A plurality of holes LCP_OP may be spaced apart from each other and drilled in each of the plurality of light control patterns LCP.

[0383] Referring Figure 36F , a plurality of island-shaped light control patterns LCP may be spaced apart from each other in a first direction (e.g., the x direction) and may surround the emission region EA, and a hole LCP_OP may be formed in each of the plurality of light control patterns LCP.

[0384] Figure 37 and Figure 39 are cross-sectional views of a part of a display device 10T according to an exemplary embodiment of the present invention. According to the exemplary embodiment depicted in Figure 37 , the first color conversion layer 150' and the second color conversion layer 160' may be omitted. Additionally, the color filter layer 130' may be in the same layer as the light blocking member 120' and may be alternately arranged therewith. The layer including both the color filter layer 130' and the light blocking member 120' may be arranged in a third direction (e.g., the z direction) between the second non-inclined portion of the light control pattern LCP and the light emitting element 430. Except that the light blocking member 120' is omitted, the exemplary embodiment of the present invention depicted in Figure 39 may be substantially similar to Figure 37 .

[0385] Referring Figure 37 , a display device 10T according to an exemplary embodiment of the present invention may include a display panel 400t and a color control member 100a. After the process of forming the display panel 400t, the color control member 100a may be directly formed on the display panel 400t.

[0386] The color control member 100a may include a first pixel region PA1, a second pixel region PA2, and a third pixel region PA3 spaced apart from each other and a light blocking region BA located between the first pixel region PA1, the second pixel region PA2, and the third pixel region PA3.

[0387] The color control member 100a may include a light-blocking member 120' and a color filter layer 130'. The color filter layer 130' may include a first color filter layer 130a', a second color filter layer 130b', and a third color filter layer 130c'. The first color filter layer 130a' may be arranged in at least a first pixel region PA1, the second color filter layer 130b' may be arranged in at least a second pixel region PA2, and the third color filter layer 130c' may be arranged in at least a third pixel region PA3. The color filter layer 130' may emit light Lr of a first color, light Lg of a second color, and light Lb of a third color with respect to different incident lights Lir, Lig, and Lib, respectively. The color control member 100a may further include an inorganic layer 112 and a protective layer 114 located on the color filter layer 130'. The light-blocking member 120' may be located between the first color filter layer 130a', the second color filter layer 130b', and the third color filter layer 130c'.

[0388] The color control member 100a may further include a light control layer 540a. The light control layer 540a may be located between the color filter layer 130' and the inorganic layer 112. The light control layer 540a may include a first insulating layer including an insulating pattern 531 and a light control pattern LCP arranged on the first insulating layer. The insulating pattern 531 and the light control pattern LCP may be positioned to correspond to a light-blocking region BA of the color control member 100a. The insulating pattern 531 and the light control pattern LCP may overlap with the light-blocking member 120'. The light control layer 540a may further include a second insulating layer 111 covering the light control pattern LCP on the light control pattern LCP.

[0389] The light control pattern LCP may include a pair of inclined portions. Each of the pair of inclined portions may form a first angle θ with the upper surface (or a surface parallel to the upper surface) of the color filter layer 130'. The pair of inclined portions may extend in a direction approaching the upper surface of the color filter layer 130', and the distance between the inclined portions on the side closest to the upper surface of the color filter layer 130' is greater than the distance between the inclined portions on the side farther from the upper surface of the color filter layer 130'. The light control pattern LCP may include a first non-inclined portion located between the pair of inclined portions. The light control pattern LCP may include a second non-inclined portion extending from the inclined portion and contacting the upper surface of the color filter layer 130'.

[0390] The light control pattern LCP may include a reflection pattern 542 and a support pattern 545. The support pattern 545 may be in direct contact with the upper surface and the side surface of the insulating pattern 531. The reflection pattern 542 may include a reflective material. The support pattern 545 may include an inorganic material such as SiN x .

[0391] The display panel 400t includes a plurality of pixels PX arranged in a predetermined pattern in a first direction (e.g., the x-direction or row direction) and a second direction (e.g., the y-direction or column direction) in the display area DA. The plurality of pixels PX may include a first pixel PX1, a second pixel PX2, and a third pixel PX3. The first pixel circuit 420a, the second pixel circuit 420b, and the third pixel circuit 420c of the first pixel PX1, the second pixel PX2, and the third pixel PX3 may be respectively arranged in the pixel circuit layer 420 of the display panel 400t. The light-emitting elements 430 may be arranged on the pixel circuit layer 420 corresponding to the first pixel region PA1, the second pixel region PA2, and the third pixel region PA3 of the color control member 100a (e.g., the first pixel region PA1, the second pixel region PA2, and the third pixel region PA3 of the substrate 410).

[0392] Each of the light-emitting elements 430 may include a pixel electrode 431, an intermediate layer 433, and a counter electrode 435. The edge of the pixel electrode 431 may be covered by a pixel defining layer 437. The pixel defining layer 437 may be arranged corresponding to the light-blocking region BA of the color control member 100a.

[0393] Figures 38A to 38E Illustrated is Figure 37 the steps in the manufacturing process of the display device 10T shown in

[0394] The color filter layer 130' may be formed on the substrate 410 on which the light-emitting elements 430, the pixel defining layer 437 located between the light-emitting elements 430, and the encapsulation layer 440 are formed.

[0395] As Figure 38A shown in, a first insulating layer may be formed above the color filter layer 130', and then an opening OP12 penetrating the first insulating layer may be formed, thereby forming an insulating pattern 531. The first insulating layer may include an organic insulating layer. The opening OP12 of the first insulating layer may expose the upper surface of the color filter layer 130'. The opening OP12 of the first insulating layer may be located in the pixel region PA, and the insulating pattern 531 may be located in the light-blocking region BA. The insulating pattern 531 may completely surround each of the first color filter layer 130a', the second color filter layer 130b', and the third color filter layer 130c', and overlap with the light-blocking member 120'. For example, the insulating pattern 531 may surround the light-emitting elements 430 and overlap with the pixel defining layer 437. The width OW of the opening OP12 of the first insulating layer may be equal to or greater than the distance BD between the light-blocking members 120'.

[0396] As Figure 38B shown in, an inorganic material layer 545L and a reflective material layer 542L may be sequentially deposited above the color filter layer 130' while covering the first insulating layer including the insulating pattern 531.

[0397] Subsequently, as Figure 38C shown in Figure 38C , a photoresist 601 may be applied to cover the reflective material layer 542L and the inorganic material layer 545L, and the photoresist 601 may be UV-exposed and developed using an aligned mask M. Accordingly, a portion of the photoresist 601 corresponding to the light-transmitting portion M2 may be removed, and only a portion of the photoresist 601 corresponding to the light-blocking portion M1 may be retained.

[0398] Next, as Figure 38D shown in Figure 38D , the reflective material layer 542L and the inorganic material layer 545L in the region where the photoresist 601 has been removed may be etched to form a support pattern 545 and a reflective pattern 542 of the light control pattern LCP. The etching may be wet etching or dry etching. The etched surfaces (e.g., side surfaces) of the reflective material layer 542L corresponding to the openings 542OP and the etched surfaces (e.g., side surfaces) of the inorganic material layer 545L corresponding to the openings 545OP may coincide with each other (e.g., may be aligned). The opening LOP of the light control pattern LCP may include the opening 542OP of the reflective material layer 542L and the opening 545OP of the inorganic material layer 545L. The width LW of the opening LOP of the light control pattern LCP may be equal to or greater than the width EW of the opening 437OP of the pixel defining layer 437. Thereafter, the photoresist 601 remaining on the light control pattern LCP may be removed.

[0399] Next, as Figure 38E shown in Figure 38E , a second insulating layer 111 covering the light control pattern LCP and the color filter layer 130' may be arranged on the color filter layer 130'. The second insulating layer 111 may include a planarization layer containing an organic material. The second insulating layer 111 may include the same material as that of the first insulating layer.

[0400] As Figure 37 shown in Figure 37 , an inorganic layer 112 and a protective layer 114 may be sequentially arranged on the second insulating layer 111.

[0401] Although the light-blocking member 120' is shown as being disposed between the first color filter layer 130a', the second color filter layer 130b', and the third color filter layer 130c' in Figure 37 , the present invention is not limited thereto. For example, as Figure 37 shown in Figure 39 , the light-blocking member 120' may not be disposed in the color filter layer 130'. In this case, the insulating pattern 531' disposed in the light control layer 540a' and located in the light-blocking region BA may include a light-blocking material. Figure 39 shown in Figure 39 , the light-blocking member 120' may not be disposed in the color filter layer 130'. In this case, the insulating pattern 531' disposed in the light control layer 540a' and located in the light-blocking region BA may include a light-blocking material.

[0402] Figure 40 and Figure 41 are cross-sectional views of a part of the display device 10U according to an exemplary embodiment of the present invention.

[0403] Figure 40 The exemplary embodiment of Figure 37 differs from the exemplary embodiment of Figure 40 in that the color control member 100b of the display device 10U shown in Figure 37 includes an air layer AL in the light control layer 540b disposed between the light control patterns LCP, and the lower surface of the inorganic layer 112 is (e.g., directly) disposed on the upper surface of the reflection pattern 542. Figure 40 Other layouts of the exemplary embodiment of Figure 37 may be the same as those of the exemplary embodiment of Figure 37 Although Figure 40 includes the second insulating layer 111, as shown in Figure 37 the second insulating layer 111 may not be disposed on the color filter layer 130'. Additionally, although in Figure 41 the light-blocking member 120' is shown disposed in the same layer as the color filter layer 130', as shown in

[0404] Figure 42 and Figure 43 are cross-sectional views of a part of the display device 10V and the display device 10W according to an exemplary embodiment of the present invention.

[0405] Figure 42 The display device 10V shown in Figure 37 differs from the display device 10T shown in Figure 42 in that the color control member 100c of the display device 10V further includes a first color conversion layer 150', a second color conversion layer 160', and a transmissive layer 170'. Figure 37 Other layouts of the exemplary embodiment of Figure 42 are the same as those of the exemplary embodiment of

[0406] Figure 43 The display device 10W shown in the exemplary embodiment of Figure 40The difference between the display device 10U shown in the exemplary embodiment is that the color control member 100d of the display device 10W further includes a first color conversion layer 150', a second color conversion layer 160', and a transmissive layer 170'. Figure 43 Other layouts of the exemplary embodiments may be the same as Figure 40 those of the exemplary embodiments. In Figure 43 this case, a light-blocking member 120' is provided between the first color conversion layer 150', the second color conversion layer 160', and the transmissive layer 170'. In the exemplary embodiment of the present invention, the light-blocking member 120' may be disposed between the first color filter layer 130a', the second color filter layer 130b', and the third color filter layer 130c'.

[0407] As Figures 37 to 43 shown in the exemplary embodiment, the light control pattern LCP may be around each of the first color filter layer 130a', the second color filter layer 130b', and the third color filter layer 130c' as Figures 35A to 35F shown, and may be formed in various shapes. Figures 44A to 44E is a cross-sectional view of a display device according to a comparative example, and Figures 45A to 45E is a cross-sectional view of a display device according to an exemplary embodiment of the present invention.

[0408] Figures 44A to 44E shows a comparative example in which a light-blocking member SM1 is provided on the encapsulation layer. For convenience of description, only the emission layer EL of the light-emitting element, the pixel defining layer PXL, the light-blocking member SM1 on the encapsulation layer, the light-blocking member SM2 of the color control member, and the color conversion layer QD are briefly shown. According to Figure 44A Comparative Examples 1 to Figure 44E Comparative Example 5 of this, the area of the emission layer EL is increased by reducing the width of the light-blocking member SM1 and increasing the width of the emission layer EL.

[0409] Figures 45A to 45E shows an exemplary embodiment of the present invention in which a light control pattern LCP is provided on the encapsulation layer. For convenience of description, only the emission layer EL of the light-emitting element, the pixel defining layer PXL, the light control pattern LCP on the encapsulation layer, the light-blocking member SM3 of the color control member, and the color conversion layer QD are briefly shown. According to Figure 45A Exemplary Embodiments 1 to Figure 45E Exemplary Embodiment 5 of this, the area of the emission layer EL is increased by reducing the width of the light control pattern LCP and increasing the width of the emission layer EL.

[0410] Figure 46 is a chart showing Figures 44A to 44E a comparison of the mixed color percentages in the comparative examples. Referring to Figure 46 this, when in Figure 44AWhen the amount of light incident on the color conversion layer or color control member layer of a predetermined pixel evaluated in Comparative Example 1 is 100%, Figure 44C Comparative Examples 3 to Figure 44E The color mixing percentage increases significantly in Comparative Example 5. For example, further expanding the area (eg, width) of the emission layer EL is difficult because it results in a consequent decrease in the width of the light blocking member SM1 and a corresponding increase in the percentage of mixed colors.

[0411] Figures 47A to 47C It is shown in the application Figure 5 , Figure 7 , Figure 9 , Figure 10 and Figure 12 In the exemplary embodiment shown in FIG. 1 , when the area of ​​the emission layer EL is Figures 45A to 45E A graph showing the increase in light incident percentage as the order of increases. Figure 47A is a graph showing an increase in the percentage of incident light with an increase in the area of ​​the light emitting layer EL when the insulating pattern is aligned in a correct position, when the insulating pattern is shifted 2 μm to the left, and when the insulating pattern is shifted 2 μm to the left and 2 μm upward. Figure 47B is a graph showing an increase in light incident percentage as the area of ​​the emission layer EL increases when the light-controlling pattern LCP is aligned in the correct position, when the light-controlling pattern LCP is shifted 2 μm to the right, and when the light-controlling pattern LCP is shifted 2 μm to the right and 2 μm downward. Figure 47C : is a graph showing an increase in the amount of light incident with an increase in the area of ​​the emission layer EL when the inner angle of the insulation pattern or the light-controlling pattern LCP is 70 degrees, 65 degrees, and 75 degrees.

[0412] from Figures 47A to 47C It can be seen that, as in Embodiments 3 to 5, even if process dispersion occurs in the insulating pattern, the light-controlling pattern, and the inner corner, and even if the width of the light-controlling pattern LCP is reduced and the width of the emission layer EL is increased, the light incident amount increases.

[0413] Figures 48A to 48C It is shown in the application Figure 5 , Figure 7 , Figure 9 , Figure 10 and Figure 12 In the exemplary embodiment shown in FIG. 1 , when the area of ​​the emission layer EL is Figures 45A to 45E A chart showing relative comparison of the mixed color evaluation percentages in increasing order. Figure 48AIt is a graph showing the relative comparison of the percentage of mixed colors increasing with the area of the emission layer EL when the insulating pattern is aligned in the correct position, when the insulating pattern is shifted 2 μm to the left, and when the insulating pattern is shifted 2 μm to the left and 2 μm upward. Figure 48B It is a graph showing the relative comparison of the percentage of mixed colors increasing with the area of the emission layer EL when the light control pattern is aligned in the correct position, when the light control pattern is shifted 2 μm to the right, and when the light control pattern is shifted 2 μm to the right and 2 μm downward. Figure 48C It is a graph showing the relative comparison of the percentage of mixed colors increasing with the area of the emission layer EL when the inner angles of the insulating pattern or the light control pattern are 70 degrees, 65 degrees, and 75 degrees.

[0414] From Figures 48A to 48C It can be seen that, as in Embodiment 3 to Embodiment 5, even when there are process variations in the insulating pattern, the light control pattern LCP, and the inner angle, and even when the width of the light control pattern LCP decreases and the width of the emission layer EL increases, the amount of mixed color is significantly reduced compared to Comparative Example 1.

[0415] Figure 49 and Figure 50 It is a graph showing the percentage of mixed colors and the percentage of light incidence when the area of the emission layer EL increases in the order of Figure 22 , Figure 24 , Figure 25 and Figure 27 while applying the exemplary embodiments shown in Figures 45A to 45E .

[0416] Referring to Figure 49 , in Comparative Example 1 to Comparative Example 3 and Exemplary Embodiment 1 to Exemplary Embodiment 3, the percentage of color mixing increases as the area of the emission layer EL increases. However, the percentage of color mixing in Exemplary Embodiment 1 to Exemplary Embodiment 3 is significantly lower than that in Comparative Example 1 to Comparative Example 3. Referring to Figure 50 , in Comparative Example 1 to Comparative Example 3 and Embodiment 1 to Embodiment 3, the percentage of light incidence increases as the area of the emission layer EL increases. Figures 45A to 45C The percentage of light incidence in Exemplary Embodiment 1 to Exemplary Embodiment 3 of Figure 49As shown, Comparative Examples 1 to 3 have a very high color mixing percentage. The color mixing percentages of Exemplary Embodiments 1 to 3 are significantly lower than those of Comparative Examples 1 to 3. For example, in Comparative Examples 1 to 3, the increase in the area of the emission layer EL is limited due to the high color mixing percentage. The display device according to Exemplary Embodiments 1 to 3 may have a light incident percentage similar to that of the display devices of Comparative Examples 1 to 3, but the color mixing percentage is significantly lower than that of the display devices of Comparative Examples 1 to 3. Therefore, Exemplary Embodiments 1 to 3 may, for example, allow an increase in the area of the emission layer EL without compromising light incidence and without causing color mixing.

[0417] Figures 51A to 51E is a cross-sectional view of a display device according to Comparative Examples 6 to 10, and Figures 52A to 52E is a cross-sectional view of a display device according to Embodiments 6 to 10.

[0418] Figures 51A to 51E Shows a comparative example in which a color pattern is directly formed on a display panel without a separate substrate. For convenience of description, only the emission layer EL of the light-emitting element, the pixel defining layer PXL, the light-blocking member SM2 of the color control member, and the color conversion layer QD are briefly shown. According to Figure 51A Comparative Example 6 to Figure 51E Comparative Example 10, the area of the emission layer EL is increased by increasing the width of the emission layer EL.

[0419] Figures 52A to 52E Shows an exemplary embodiment of the present invention in which a light control pattern LCP is provided on the pixel defining layer PXL. For convenience of description, only the emission layer EL of the light-emitting element, the pixel defining layer PXL, the light control pattern LCP on the pixel defining layer PXL, the light-blocking member SM3 of the color control member, and the color conversion layer QD are briefly shown. According to Figure 52A Exemplary Embodiment 6 to Figure 52E Exemplary Embodiment 10, the area of the emission layer EL is increased by reducing the width of the light control pattern LCP and increasing the width of the emission layer EL.

[0420] Figure 53 and 54 are diagrams showing a relative comparison of the mixed color percentage and the light incident percentage in Figure 31 , Figure 33 and Comparative Examples, Figures 51A to 51E Comparative Examples of Figures 52A to 52E Exemplary Embodiments.

[0421] Referring to Figure 53 InFigures 51A to 51E In Comparative Examples 6 to 10, even if the area of the emission layer EL increases, the color mixing percentage does not increase significantly, and in Figures 52A to 52E in Exemplary Embodiments 6 to 10, when the width of the emission layer EL increases to about 8 to 16 μm or more on either side, a mixed color defect appears. Considering Figure 53 , in Figure 31 in the embodiment, compared with the width of Exemplary Embodiment 6 depicted in Figure 52A , the width of the emission layer EL can increase to about 8 μm on either side without causing defects, and in Figure 33 in the embodiment, compared with the width of Exemplary Embodiment 6 depicted in Figure 52A , the width of the emission layer EL can increase to about 10 μm on either side without causing defects.

[0422] Referring to Figure 54 , when Figure 44A the light incidence of Comparative Example 1 is 100%, Figures 51A to 51E the light incidence of Comparative Examples 6 to 10 increases to 138.9%, and Figures 52A to 52E the light incidence of Exemplary Embodiments 6 to 10 increases to 180% or more. When applying Figure 31 the embodiment and the width of the emission layer EL increases, the light incidence increases to 182.33% compared with 138.9% exhibited by Comparative Example 1. When applying Figure 33 the embodiment and the width of the emission layer EL increases, the light incidence increases to 185.6% compared with 138.9% exhibited by Comparative Example 1.

[0423] From Figure 53 and Figure 54 it can be seen that, compared with a display device to which a light control pattern LCP is not applied, in a display device to which a light control pattern LCP according to an embodiment is applied, considering the light incidence percentage amount and the color mixing percentage rate, it is easier to increase the area of the emission layer EL.

[0424] Each of the display devices according to the exemplary embodiments of the present invention described herein includes a light control pattern corresponding to a light-blocking region between a color conversion layer and a transmissive layer of a color control member, and thus can block light introduced from a light-emitting element in an adjacent pixel region, thereby preventing color mixing between adjacent pixel regions. The light control pattern can be provided on the encapsulation layer, and can be provided on a pixel definition layer below the encapsulation layer, or can be provided on a color filter layer. By adjusting the size of the light control pattern, the color matching rate, color reproducibility, and light efficiency of light emitted through the display device can be controlled.

[0425] Although the quantum dot light-emitting display device including the color conversion layer has been described as an example in the above exemplary embodiments of the present invention, the light control pattern LCP of the embodiments can be applied to a display device using a color filter, for example, various types of display devices such as an organic light-emitting display device, an inorganic electroluminescent (EL) display device, and a liquid crystal display device, even without the color conversion layer.

[0426] According to the various exemplary embodiments of the present invention described above, color mixing between adjacent pixels can be prevented by the light control pattern of the display panel, thereby providing a display device having a simple structure and increased color reproducibility.

[0427] Although the exemplary embodiments of the present invention have been described above, those skilled in the art will understand that various changes in form and detail can be made therein without departing from the spirit and scope of the present invention as recited in the appended claims.

Claims

1. A display device, comprising: a substrate including a display area and a non-display area, the display area including a pixel area and a light-blocking area adjacent to the pixel area; light-emitting elements arranged in the pixel area of the substrate; an insulating layer disposed on the substrate, wherein the insulating layer has an opening corresponding to the light-blocking area and an insulating pattern corresponding to the pixel area; a light control pattern at least partially surrounding the insulating pattern of the insulating layer and arranged in the opening corresponding to the light-blocking area; and a color conversion layer arranged in the pixel area of the substrate, wherein the light control pattern is in a layer between the light-emitting element and the color conversion layer.

2. The display device according to claim 1, wherein, the light control pattern includes a reflection pattern and a light-blocking pattern, wherein both the reflection pattern and the light-blocking pattern are arranged on side edges and the bottom of the opening, and wherein the light-blocking pattern is arranged on the reflection pattern.

3. The display device according to claim 2, further comprising: a horizontal pattern at least partially covering the light control pattern.

4. The display device according to claim 3, wherein, an upper surface of the horizontal pattern is coplanar with an upper surface of the light control pattern.

5. The display device according to claim 1, wherein, the light control pattern includes a reflection pattern and a light-blocking pattern, wherein the reflection pattern is arranged on side edges and the bottom of the opening, wherein the light-blocking pattern is arranged on the bottom of the opening, and wherein the reflection pattern is arranged on the light-blocking pattern.

6. The display device according to claim 5, further comprising: a horizontal pattern at least partially covering the light control pattern.

7. The display device according to claim 6, wherein, an upper surface of the horizontal pattern is coplanar with the reflection pattern.

8. The display device according to claim 1, wherein, the light control pattern includes a reflection pattern, a support pattern, and a light-blocking pattern, wherein both the reflection pattern and the support pattern are arranged on side edges and the bottom of the opening, wherein the light-blocking pattern is arranged on the bottom of the opening, wherein the support pattern is arranged below the reflection pattern, and wherein the light-blocking pattern is arranged below the support pattern.

9. The display device according to claim 1, further comprising: a packaging layer disposed between the light control pattern and the light-emitting element.

10. A display device, comprising: a substrate including a display area and a non-display area, the display area including a pixel area and a light-blocking area adjacent to the pixel area; light-emitting elements arranged in the pixel area of the substrate; an insulating layer disposed on the substrate, the insulating layer having an opening corresponding to the pixel area and an insulating pattern corresponding to the light-blocking area; A light control pattern that covers the surface of the insulating pattern corresponding to the light-blocking region, and the light control pattern has a multilayer structure including a reflective pattern and a light-blocking pattern; and A color conversion layer arranged in the pixel region of the substrate, wherein the light control pattern is in a layer between the light-emitting element and the color conversion layer or the light control pattern is in a layer on the color conversion layer.

11. The display device according to claim 10, wherein, The reflective pattern and the light-blocking pattern are arranged on the upper surface and the side surface of the insulating pattern, and wherein the light-blocking pattern is arranged between the reflective pattern and the insulating pattern.

12. The display device according to claim 10, wherein, The light-blocking pattern is arranged below the insulating pattern, wherein the reflective pattern is arranged on the upper surface and the side surface of the insulating pattern, and wherein the insulating pattern is on the upper surface of the light-blocking pattern.

13. The display device according to claim 10, further comprising: A encapsulation layer arranged between the light control pattern and the light-emitting element.

14. The display device according to claim 10, wherein, For the display device in which the light control pattern is in a layer on the color conversion layer, it further comprises: A encapsulation layer arranged between the light-emitting element and the light control pattern; and A color filter layer arranged between the encapsulation layer and the light control pattern.

15. The display device according to claim 14, further comprising: A second insulating layer arranged on the light control pattern; and A protective layer arranged on the second insulating layer.

16. The display device according to claim 14, further comprising: An air layer arranged between a plurality of the light control patterns; and A protective layer arranged on the plurality of the light control patterns.

17. A display device, comprising: A substrate including a display region and a non-display region, the display region including a pixel region and a light-blocking region adjacent to the pixel region; A light-emitting element arranged in the pixel region of the substrate; and A light control pattern arranged in the light-blocking region, wherein the light control pattern has a multilayer structure including a reflective pattern, a support pattern and a light-blocking pattern and has at least one hole.

18. The display device according to claim 17, wherein, The support pattern is arranged below the reflective pattern, and wherein the light-blocking pattern is arranged in a space defined by the support pattern and the reflective pattern.

19. The display device according to claim 17, further comprising: A encapsulation layer arranged between the light control pattern and the light-emitting element.

20. A display device, comprising: A substrate including a display region and a non-display region, the display region including a pixel region and a light-blocking region adjacent to the pixel region; A light-emitting element arranged in the pixel region of the substrate; A pixel defining layer disposed in the light-blocking region of the substrate; And A light control pattern disposed on the pixel defining layer and in the light-blocking region, wherein the light control pattern has a multi-layer structure including a reflective pattern and a support pattern.

21. The display device according to claim 20, Wherein, The support pattern is disposed below the reflective pattern, and Wherein at least one electrode of the light-emitting element at least partially covers the light control pattern.

22. The display device according to claim 20, further Comprising: An insulating layer having an opening corresponding to the pixel region and an insulating pattern disposed on the pixel defining layer, Wherein the reflective pattern and the support pattern cover the insulating pattern of the insulating layer, and Wherein at least one electrode of the light-emitting element at least partially covers the light control pattern.

23. The display device according to claim 20, Wherein, The pixel defining layer includes a pixel defining pattern, Wherein the light control pattern has a first non-inclined portion and a pair of inclined sides corresponding to the side surfaces of the pixel defining pattern, and Wherein the reflective pattern is the outermost layer of the light control pattern.

24. The display device according to claim 23, Wherein, A light-blocking pattern is directly disposed on the encapsulation layer of the substrate in the light-blocking region, and Wherein the light-blocking pattern is non-inclined and parallel to the first non-inclined portion of the light control pattern.

25. A display device, Comprising: A substrate including a display region and a non-display region, the display region including a pixel region and a light-blocking region adjacent to the pixel region; A light-emitting element disposed in the pixel region of the substrate; A pixel defining layer disposed in the light-blocking region of the substrate; And A light control pattern disposed on the pixel defining layer and in the light-blocking region, wherein the light control pattern has a multi-layer structure including a reflective pattern and a first light-blocking pattern.

26. The display device according to claim 25, Wherein, The pixel defining layer includes a pixel defining pattern, Wherein the light control pattern has a first non-inclined portion and a pair of inclined sides corresponding to the side surfaces of the pixel defining pattern, and Wherein the first light-blocking pattern is the outermost layer of the light control pattern.

27. The display device according to claim 26, Wherein, A second light-blocking pattern is directly disposed on the encapsulation layer of the substrate in the light-blocking region, and Wherein the second light-blocking pattern is non-inclined and parallel to the first non-inclined portion of the light control pattern.

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