An ultraviolet LED packaging structure and a packaging method

Abstract

This application relates to the technical field of ultraviolet devices, and discloses an ultraviolet LED packaging structure and a packaging method. The packaging structure includes: a substrate, an LED chip, and a glass cover plate. The LED chip is placed on the plane of the substrate. A groove is provided on the plane of the substrate. The groove encloses the LED chip in a closed manner and is not lower than the plane of the substrate. The glass cover plate is provided with a frame, and the frame matches the groove. By the above method, the production cost can be effectively reduced, the light-emitting area of the ultraviolet LED can be increased, and the light-emitting power can be effectively improved.

Description

Technical Field

[0001] This application relates to the technical field of ultraviolet devices, and particularly to an ultraviolet LED packaging structure and a packaging method. Background Art

[0002] With the development of industrial technology, ultraviolet LEDs are widely used in many fields such as biomedicine, anti-counterfeiting identification, and purification. However, the packaging technology of ultraviolet LEDs has always restricted the development of ultraviolet LEDs.

[0003] The ultraviolet LED packaging structures currently applied in the market have deficiencies such as high production costs, low production efficiency, low light extraction efficiency, and fast aging of organic materials.

[0004] Therefore, there is room for further optimization of the packaging structure of ultraviolet LEDs. Summary of the Invention

[0005] In view of the above problems, this application provides an ultraviolet LED packaging structure and a packaging method, aiming to effectively reduce production costs, increase the light-emitting area of ultraviolet LEDs, and effectively improve the light-emitting power.

[0006] To solve the above technical problems, a technical solution adopted by this application is to provide an ultraviolet LED packaging structure, which includes: a substrate, an LED chip, and a glass cover plate. The LED chip is placed on the plane of the substrate. A groove is provided on the plane of the substrate. The groove encloses the LED chip in a closed manner and is not lower than the plane of the substrate. The glass cover plate is provided with a frame, and the frame matches the groove.

[0007] Wherein, an adhesive is dotted in the groove to strengthen the matching between the groove and the frame.

[0008] Wherein, the substrate is a ceramic substrate with a planar metal plating layer.

[0009] Wherein, a thickened metal plating layer is provided in the area of the substrate where the LED chip is placed.

[0010] Wherein, the LED chip adopts flip-chip LED chip technology for eutectic inorganic welding.

[0011] Further, a metal plating layer is provided on the surface of the groove.

[0012] Further, the height of the thickened metal plating layer in the area where the LED chip is placed is not lower than the height of the groove.

[0013] Wherein, the material of the glass cover plate is quartz or sapphire.

[0014] Another technical solution adopted by this application is to provide a packaging method for ultraviolet LEDs.

[0015] The method comprises the following steps: preparing a metal-plated substrate with a groove higher than the plane and capable of enclosing an LED chip; and providing a thickened electroplated metal layer in the area where the LED chip is placed on the substrate;

[0016] A thickened electroplated metal layer is provided on the surface of the groove; a glass cover plate with a frame that matches the groove is manufactured; an LED chip is soldered to the substrate using flip-chip technology; an adhesive is placed in the groove; and the frame of the glass cover plate is placed in the groove.

[0017] Finally, a baking process is used to cure the adhesive to achieve the bonding of the glass cover plate and the substrate.

[0018] The matching process between the frame of the glass cover plate and the groove is performed by using an automatic die-bonding device capable of automatically sucking and placing.

[0019] The beneficial effects of this application are as follows: Different from the prior art, the present application provides a UV LED packaging structure comprising: a substrate, an LED chip, and a glass cover plate. The LED chip is placed on the flat surface of the substrate, the flat surface of the substrate is provided with a groove, the groove enclosing the LED chip and not lower than the flat surface of the substrate, and the glass cover plate is provided with a frame, the frame matching the groove. Through the above technical solution, the production cost can be effectively reduced, the light output area of the UV LED is increased, and the light output power can be effectively improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying any creative work.

[0021] Figure 1 A cross-sectional view of a UV LED packaging structure provided in this application;

[0022] Figure 2 This is a flow chart of a UV LED packaging method provided in this application.

[0023] Description of Figure Numbers:

[0024] Label Name Label Name 10 Substrate 40 Adhesive 20 Glass cover plate 110 Thickened metal coating in the LED chip area 30 LED chip 120 Groove 122 Metal coating on the groove surface

[0025] The purpose, features and advantages of this application will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed implementation manners

[0026] Next, the technical solutions in the embodiments of the present application will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present application.

[0027] It should be noted that all directional indications such as up, down, left, right, front, back... in the embodiments of the present application are only used to explain the relative positional relationship and movement conditions between components in a specific posture as shown in the accompanying drawings. If the specific posture changes, the directional indications will also change accordingly.

[0028] In addition, the descriptions involving "first", "second", etc. in the present application are only for descriptive purposes, and cannot be understood as indicating or implying their relative importance or implicitly indicating the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include at least one such feature. In addition, the technical solutions between various embodiments can be combined with each other, but it must be based on the ability of those of ordinary skill in the art to implement. When the combination of technical solutions appears to be contradictory or unable to be implemented, it should be considered that such a combination of technical solutions does not exist and is not within the protection scope required by the present application.

[0029] Please refer to Figure 1 , Figure 1 which is a schematic diagram of an ultraviolet LED packaging structure provided by the present application.

[0030] The ultraviolet LED packaging structure includes: a substrate 10, an LED chip 30, and a glass cover plate 20. The LED chip 30 is placed on the plane of the substrate. A groove 120 is provided on the plane of the substrate 10. The groove 120 encloses the LED chip 30 in a closed manner and is not lower than the plane of the substrate 10. The glass cover plate 20 is provided with a frame, and the frame matches the groove 120.

[0031] Wherein, an adhesive 40 is dotted in the groove 120 for strengthening the matching between the groove 120 and the frame.

[0032] Wherein, the substrate 10 is a ceramic substrate with a planar metal plating layer.

[0033] Wherein, a thickened metal plating layer 110 is provided in the area of the substrate 10 where the LED chip 30 is placed.

[0034] Wherein, the LED chip 30 adopts flip-chip LED chip technology for eutectic inorganic welding.

[0035] Furthermore, a metal coating 122 is provided on the surface of the groove 120.

[0036] Furthermore, the height of the thickened metal coating 110 in the area for placing the LED chip 30 is not lower than the height of the groove 120.

[0037] It can be understood that in some embodiments, increasing the thickness of the metal plating on the area of the substrate 10 where the LED chip 30 is placed and on the surface of the groove 120 can increase the light-emitting angle of the ultraviolet LED device; the optical power can be effectively increased.

[0038] Among them, the metal coating of the substrate functions as heat dissipation and electrical conduction.

[0039] Among them, in some embodiments, the main component of the metal coating is copper.

[0040] It can be understood that the glass cover plate 20 with a border facilitates the placement of the glass cover plate 20, and the protruding part can match the groove 120 of the substrate 10. At the same time, without a dam, the assembly process is simpler, effectively improving the production efficiency.

[0041] In some embodiments, the adhesive 40 applied in the groove 120 is glue.

[0042] In some embodiments, the material of the glass cover plate 20 is quartz or sapphire.

[0043] Please refer to Figure 2 , Figure 2 which is a flowchart of an ultraviolet LED packaging method provided by this application.

[0044] The ultraviolet LED packaging method includes the following steps:

[0045] First step, fabricate a metal-plated substrate with a groove higher than the plane on the plane and the groove can enclose the LED chip in a closed manner;

[0046] Second step, set a thickened electroplated metal layer in the area of the substrate for placing the LED chip;

[0047] Third step, set an electroplated metal layer on the surface of the groove;

[0048] Fourth step, fabricate a glass cover plate with a border that can match the groove;

[0049] Fifth step, solder the LED chip on the substrate by using flip-chip technology;

[0050] Sixth step, dispense an adhesive in the groove;

[0051] Step 7: Place the frame of the glass cover plate into the groove;

[0052] Step 8: Cure the adhesive by baking process to achieve the reinforced bonding between the glass cover plate and the substrate.

[0053] Furthermore, during the matching process between the frame of the glass cover plate and the groove, an automatic die bonding equipment capable of automatic suction and placement is used for suction and placement operations.

[0054] It can be understood that, compared with the traditional manual covering of the glass cover plate, in some embodiments, the incoming glass cover plates are placed on the film, and the spacing and direction errors of the glass cover plates are at the micron level, which greatly improves the accuracy compared with the manual placement of the glass cover plates. And it is combined with the die fixing method for suction, with the efficiency increased by more than 5 times and the labor reduced by more than 3 times. At the same time, compared with the traditional inorganic packaging, the heat sealing and welding process is saved, and the substrate is prevented from warping and other bad phenomena due to heat, effectively reducing the product defect rate.

[0055] In the embodiments provided in the present application, it should be understood that the disclosed method and structure can be implemented in other ways. For example, the structural embodiments described above are only illustrative. In actual implementation, there can be other partitioning methods, such as multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed.

[0056] The above are only the embodiments of the present application, and do not limit the patent scope of the present application. All equivalent structural transformations made under the inventive concept of the present application, using the content of the specification and drawings of the present application, or directly or indirectly applied in other related technical fields are included in the patent protection scope of the present application.

Claims

1. An ultraviolet LED packaging structure, characterized in that, Comprising: A substrate, an LED chip, and a glass cover plate. The LED chip is placed on the plane of the substrate. A groove is provided on the plane of the substrate. The groove encloses the LED chip in a closed manner and is not lower than the plane of the substrate. The glass cover plate is provided with a frame, and the frame matches the groove. An adhesive is dotted in the groove for strengthening the matching between the groove and the frame. The substrate is a ceramic substrate with a planar metal plating layer. A thickened metal plating layer is provided in the area of the substrate where the LED chip is placed. The LED chip is eutectically and inorganically welded using flip-chip LED chip technology. A metal plating layer is provided on the surface of the groove. The metal plating thickness in the area where the LED chip is placed on the substrate and the surface of the groove is increased to increase the light-emitting angle of the ultraviolet LED device and effectively increase the optical power. Wherein, the metal plating layer of the substrate has the functions of heat dissipation and electrical conduction. The groove is composed of an adhesive and the metal plating layer, and the adhesive bonds the frame of the glass cover plate and the metal plating layer.

2. The ultraviolet LED packaging structure according to claim 1, wherein The height of the thickened metal plating layer in the area where the LED chip is placed is not lower than the height of the groove.

3. The ultraviolet LED packaging structure according to claim 2, wherein, The material of the glass cover plate is quartz or sapphire.

4. A method for manufacturing an ultraviolet LED package structure as described in any one of claims 1-3, characterized in that, Comprising: Manufacturing a metal-plated substrate with a groove higher than the plane on the plane and the groove can enclose the LED chip in a closed manner; Setting a thickened electroplated metal layer in the area of the substrate where the LED chip is placed; Setting an electroplated metal layer on the surface of the groove; Manufacturing a glass cover plate with a frame that can match the groove; Welding the LED chip on the substrate using flip-chip LED chip technology; Dropping an adhesive in the groove; Placing the frame of the glass cover plate in the groove; Using a baking process to cure the adhesive to achieve the strengthened combination of the glass cover plate and the substrate.

5. The ultraviolet LED packaging method according to claim 4, wherein The matching process between the frame of the glass cover plate and the groove is carried out by an automatic die bonding equipment capable of automatically sucking and placing for sucking and placing operations.

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